WO2022124242A1 - Procédé de mesure/ajustement de quantité d'éjection d'encre, dispositif de mesure/ajustement de quantité d'éjection d'encre, système de fabrication de panneau pour panneau d'affichage électroluminescent organique, procédé de fabrication de panneau d'affichage électroluminescent organique, encre, et panneau d'affichage électroluminescent organique fabriqué utilisant de l'encre - Google Patents

Procédé de mesure/ajustement de quantité d'éjection d'encre, dispositif de mesure/ajustement de quantité d'éjection d'encre, système de fabrication de panneau pour panneau d'affichage électroluminescent organique, procédé de fabrication de panneau d'affichage électroluminescent organique, encre, et panneau d'affichage électroluminescent organique fabriqué utilisant de l'encre Download PDF

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Publication number
WO2022124242A1
WO2022124242A1 PCT/JP2021/044590 JP2021044590W WO2022124242A1 WO 2022124242 A1 WO2022124242 A1 WO 2022124242A1 JP 2021044590 W JP2021044590 W JP 2021044590W WO 2022124242 A1 WO2022124242 A1 WO 2022124242A1
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WIPO (PCT)
Prior art keywords
ink
amount
organic
measurement
display panel
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Application number
PCT/JP2021/044590
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English (en)
Japanese (ja)
Inventor
敏生 福田
Original Assignee
三菱ケミカル株式会社
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Publication date
Application filed by 三菱ケミカル株式会社 filed Critical 三菱ケミカル株式会社
Priority to JP2022568251A priority Critical patent/JPWO2022124242A1/ja
Priority to CN202180081773.5A priority patent/CN116615289A/zh
Priority to KR1020237018687A priority patent/KR20230117124A/ko
Publication of WO2022124242A1 publication Critical patent/WO2022124242A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0456—Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • B41J29/393—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
    • B41J2029/3935—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns by means of printed test patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]

Definitions

  • the present invention uses an ink ejection head to measure and adjust an ink ejection amount, an ink ejection amount measuring and adjusting device, an organic EL display panel panel manufacturing system, an organic EL display panel manufacturing method, ink, and ink. Regarding the organic EL display panel to be printed.
  • an inkjet device that ejects ink as droplets is known as a device that forms a desired pattern on a substrate using ink in which a functional material is dispersed or dissolved.
  • the inkjet device forms a pattern by arranging droplets of ink ejected from the ink ejection head at an arbitrary position on the substrate while relatively moving the substrate and the ink ejection head.
  • inkjet devices have been used in the manufacture of large screen color filters and organic EL display panels.
  • One of the manufacturing processes of the organic EL display panel is a film forming process of an organic EL film, and an inkjet printing technique is used in this process.
  • an inkjet printing technique is used in this process.
  • the formed film thickness varies, which causes uneven light emission in the organic EL display panel. It is known. Therefore, in order to manufacture the organic EL display panel with high accuracy, it is necessary to control the ink ejection amount for each nozzle.
  • Patent Document 1 droplets are ejected to a weight measuring balance to measure the ejection weight of each ink ejection head, and based on the measurement result, control is performed so that the ejection weight of each ink ejection head becomes uniform. ing.
  • the ejection weight is adjusted by measuring the film thickness of the ejected droplet and changing the ejection pattern based on the measured film thickness.
  • Patent Document 3 a ring-shaped illuminator irradiates a droplet with light in a state where the optical axis of the observation optical system and the center of the ring-shaped illuminator are aligned with each other, and the ring-shaped illuminator generated from the droplet by the irradiation of light.
  • the height of the droplets is measured based on the image taken by the observation optical system.
  • Patent Document 4 discloses a technique for measuring the landing diameter of a droplet of each nozzle based on image data of the droplet by evaporation of a solvent. Further, in Patent Document 4, a cover for preventing evaporation is used in order to prevent the volume from changing due to evaporation of droplets from landing to measurement.
  • the measurement method of Patent Document 1 requires a large amount of ink and requires a large amount of time for the measurement, which causes a significant decrease in the operating rate of the inkjet device.
  • the method of Patent Document 2 does not provide a means for calculating the ejection weight of the droplet ejected for each nozzle, and there is a possibility that the ejection weight of each ink ejection head is not uniform. Further, it cannot be said that simply combining only the technique described in Patent Document 3 with, for example, an inkjet device is sufficient to accurately measure finer droplets as the definition becomes higher.
  • the method for measuring the amount of droplets described in Patent Document 4 uses a cover and an arrangement mechanism thereof in order to prevent evaporation. Such a mechanism has a large-scale configuration as a whole device.
  • the present invention has been made to solve the above-mentioned problems, and for the problem that the amount of droplets is likely to change due to evaporation of a solvent, the amount of droplets discharged is measured without the need for an evaporation prevention mechanism.
  • the purpose is to do exactly.
  • the present invention has the following configurations. That is, it is a measurement adjustment method including at least a measurement method for measuring the amount of ink ejected from the ink ejection head.
  • the measurement method is The ejection process of ejecting ink onto the base material from the ink ejection head, The acquisition step of acquiring an image of the ink ejected on the substrate, and It has a derivation step of deriving the amount of ink ejected from the ink ejection head based on the information obtained from the image.
  • the amount of ink ejected onto the substrate is maintained at a constant ratio with respect to the amount of ink ejected from the ink ejection head after a predetermined time has elapsed since the ink was ejected from the ink ejection head.
  • the measurement adjustment method further includes a drying step of drying the ink ejected to the substrate for the predetermined time. After the drying step, the acquisition step is performed.
  • the ink contains a solvent and a functional material.
  • the solvent contains an organic solvent having a boiling point of 250 ° C. or higher.
  • another embodiment of the present invention has the following configuration. That is, it is a measurement adjustment method including at least a measurement method for measuring the amount of ink ejected from the ink ejection head.
  • the measurement method is The ejection process of ejecting ink onto the base material from the ink ejection head, The acquisition step of acquiring an image of the ink ejected on the substrate, and It has a derivation step of deriving the amount of ink ejected from the ink ejection head based on the information obtained from the image.
  • the ink contains a solvent and a functional material.
  • the solvent contains an organic solvent having a boiling point of 250 ° C. or higher.
  • the measurement adjustment step further includes a drying step of drying the ink ejected to the substrate for a predetermined time. After the drying step, the acquisition step is performed.
  • the predetermined time is 5 minutes or more.
  • the ink contains a solvent and a functional material.
  • the solvent contains an organic solvent having a boiling point of 300 ° C. or higher.
  • the organic solvent is contained in an amount of 20% by weight or more with respect to the ink.
  • the base material is coated with a liquid-repellent coating material having a liquid-repellent property against the ink.
  • the derivation step is The diameter of the ink droplet is extracted from the image, Using at least the extracted diameter, the volume of ink on the substrate is derived. The amount of ink ejected from the ink ejection head is derived from the volume of the derived ink on the substrate.
  • the measurement adjustment method further includes an adjustment step of adjusting the ejection amount from the ink ejection head based on the ink ejection amount derived by the derivation step.
  • the measurement adjustment method is used when forming at least one of a light emitting layer, a hole injection layer, and a hole transport layer among the functional layers constituting the organic EL display panel. Used for.
  • another embodiment of the present invention has the following configuration. That is, it is an ink ejection amount measurement adjustment device, and the measurement adjustment method is used.
  • another embodiment of the present invention has the following configuration. That is, it is a panel manufacturing system for an organic EL display panel, and has the ink ejection amount measuring and adjusting device.
  • another embodiment of the present invention has the following configuration. That is, it is a method for manufacturing an organic EL display panel, and the measurement adjustment method is used.
  • another embodiment of the present invention has the following configuration. That is, the panel manufacturing system is used as the method for manufacturing the organic EL display panel.
  • another embodiment of the present invention has the following configuration. That is, the ink used in the measurement adjustment method. Contains the solvent and the functional material corresponding to the functional layer, The solvent contains an organic solvent having a boiling point of 250 ° C. or higher.
  • another embodiment of the present invention has the following configuration. That is, the ink used in the ink ejection amount measuring and adjusting device. Contains the solvent and the functional material corresponding to the functional layer, The solvent contains an organic solvent having a boiling point of 250 ° C. or higher.
  • another embodiment of the present invention has the following configuration. That is, the ink used in the panel manufacturing system of the organic EL display panel. Contains the solvent and the functional material corresponding to the functional layer, The solvent contains an organic solvent having a boiling point of 250 ° C. or higher.
  • the organic solvent is contained in an amount of 20% by weight or more with respect to the ink.
  • the ink maintains a constant ratio with respect to the volume before the drying is performed after the drying for a predetermined time.
  • another embodiment of the present invention has the following configuration. That is, it is an organic EL display panel, and a functional layer is formed by using the ink.
  • the figure for demonstrating the ink droplet acquisition process which concerns on one Embodiment of this invention The figure for demonstrating the ink ejection state which concerns on one Embodiment of this invention.
  • the figure for demonstrating the ink ejection state which concerns on one Embodiment of this invention.
  • the plan view which shows the structural example of the display panel which concerns on one Embodiment of this invention.
  • the plan view which shows the structural example of the display panel which concerns on one Embodiment of this invention.
  • the cross-sectional view which shows the structural example of the display panel which concerns on one Embodiment of this invention.
  • the table diagram for demonstrating the test result by the method which concerns on one Embodiment of this invention The table diagram for demonstrating the test result by the method which concerns on one Embodiment of this invention.
  • FIGS. 1 and 2 show an ink ejection amount measuring and adjusting device from an ink ejection head, which can carry out a step of measuring and adjusting an ink ejection amount from an ink ejection head, which will be described later, in the inkjet apparatus according to the present embodiment. show.
  • FIG. 1 is a side view schematically showing an outline of the configuration of the inkjet device 1 according to the present embodiment.
  • FIG. 2 is a plan view schematically showing an outline of the configuration of the inkjet device 1 according to the present embodiment.
  • the main scanning direction of the stage 40 (that is, the transport direction of the substrate) is the X-axis direction
  • the sub-scanning direction orthogonal to the main scanning direction is the Y-axis direction
  • the direction is the Z-axis direction.
  • the rotation direction around the Z-axis direction is set to the ⁇ direction. In each figure, it is assumed that each axial direction corresponds to each other.
  • the inkjet device 1 spans an X-axis table 10 extending in the main scanning direction (X-axis direction) and a pair of Ys extending in the sub-scanning direction (Y-axis direction) so as to straddle the X-axis table 10. It has an axis table 11.
  • a pair of X-axis guide rails 12 are provided on the upper surface of the X-axis table 10 so as to extend in the X-axis direction, and an X-axis linear motor (not shown) is provided on the X-axis guide rail 12.
  • a Y-axis guide rail 13 is provided on the upper surface of the Y-axis table 11 so as to extend in the Y-axis direction, and a Y-axis linear motor (not shown) is provided on the Y-axis guide rail 13.
  • a carriage unit 20 and a camera unit 30 are provided on the pair of Y-axis tables 11.
  • the carriage unit 20 includes a carriage support portion 21, a carriage 22, and an ink ejection head 23.
  • the lower surface of the carriage unit 20 is provided with one or more carriages 22 and one or more ink ejection heads 23, depending on the type of ink ejected.
  • a plurality of ink ejection heads 23 having a line head system configuration corresponding to the substrate width in the Y-axis direction are provided.
  • a plurality of nozzles are formed on the lower surface of the ink ejection head 23, that is, the ink ejection surface, and ink droplets are ejected from the nozzles.
  • three rows of ink ejection heads 23 are provided.
  • the number of types of ink that the inkjet device 1 can handle is not particularly limited, and may be increased or decreased depending on the configuration of the product.
  • a supply unit (not shown) for supplying ink is connected to the carriage unit 20, and ink is supplied in a timely manner.
  • the carriage support portion 21 is attached to the Y-axis guide rail 13 and is configured to be movable in the Y-axis direction by a Y-axis linear motor (not shown) provided on the Y-axis guide rail 13.
  • the carriage unit 20 moves so as to be located on the X-axis table 10 as shown in FIG. 2 when the ink is ejected, and moves to the retracted position along the Y-axis guide rail 13 when the ink ejection head 23 is cleaned.
  • It may be configured to perform a cleaning operation. Examples of the cleaning operation include preliminary ejection of ink and wiping of the ejection surface of the ink ejection head 23.
  • FIG. 3 is a diagram schematically showing a situation in which ink droplets 202 are ejected from the ink ejection head 23.
  • the ink ejection head 23 according to the present embodiment shows an example using the piezo method.
  • a drive voltage is applied to a piezoelectric element (not shown) inside the ink ejection head 23 to expand and contract the piezoelectric element, and a predetermined amount of ink droplet 202 is ejected from a pore called a nozzle hole 201.
  • a nozzle hole 201 Let me.
  • the ejected ink droplet 202 lands on the base material B arranged on the stage 40.
  • the arrangement and number of the nozzle holes 201 are not particularly limited, and are not limited to the example shown in FIG.
  • the camera unit 30 takes an image of the base material B installed on the stage 40, and acquires an image including the base material B and the ink droplet 202 ejected on the base material B.
  • the camera unit 30 includes a camera 31 as a shooting unit.
  • the camera 31 is provided with a Y-axis table 11 on one side of a pair of Y-axis tables 11, and is supported by a camera support portion 32.
  • the camera 31 is installed on the downstream side of the ink ejection head 23 in the transport direction (X-axis direction) of the base material B.
  • the camera support portion 32 is provided with a moving mechanism (not shown) for moving the camera 31, and the camera 31 is movable in the Y-axis direction.
  • the camera 31 is provided corresponding to the carriage unit 20 (carriage 22), and a plurality of cameras 31 may be provided along the Y-axis direction. Therefore, a plurality of cameras 31 may be installed in order to shorten the shooting operation time.
  • the camera 31 has a function of being able to capture an image having a resolution capable of reproducing each of the ink droplets 202 ejected on the base material B.
  • the base material B may be irradiated with the illumination light from the illuminator (not shown).
  • a light source of the illuminator for example, an LED (Light Emitting Diode) or the like can be used.
  • the stage 40 is, for example, a vacuum suction stage, and can suck and fix the base material B.
  • the base material B corresponds to a base material for measuring the amount of ink ejected or a base material for forming a pixel pattern.
  • a base material B1 for measuring the ink ejection amount and a base material B2 for forming a display panel it is shown as the base material B.
  • a liquid-repellent coating material is applied to the surface on which the ink is ejected, and the base material B1 has liquid-repellent properties against the ink.
  • the composition of the liquid-repellent coating material here is defined according to the composition of the ink.
  • the stage 40 is rotatably supported in the ⁇ direction around the Z axis by the stage rotation mechanism 41 provided on the lower surface side of the stage 40.
  • the stage rotation mechanism 41 is supported by an X-axis slider 42 provided on the lower surface side of the stage rotation mechanism 41.
  • the X-axis slider 42 is attached to the X-axis guide rail 12, and is configured to be movable in the X-axis direction by an X-axis linear motor (not shown) provided on the X-axis guide rail 12.
  • the display panel that can be manufactured by using the inkjet device 1 according to the present embodiment is composed of a plurality of layers. These layers include one or more layers that can be formed by an inkjet method. Therefore, when forming each of these layers, a plurality of configurations shown in FIGS. 1 and 2 can be provided and applied. Since the type of ink used in each layer is different, a mechanism required for measurement and formation such as a carriage unit 20 and a base material B1 for measuring the amount of ink ejected may be provided according to the function of each layer.
  • the inkjet device 1 includes a control device 50.
  • the control device 50 may be realized by, for example, an information processing device including a control unit, a storage unit, and an output unit (not shown).
  • the control unit may be composed of a CPU (Central Processing Unit), an MPU (Micro Processing Unit), a DSP (Digital Single Processor), a dedicated circuit, or the like.
  • the storage unit is composed of volatile and non-volatile storage media such as HDD (Hard Disk Drive), ROM (Read Only Memory) and RAM (Random Access Memory), and various information can be input and output according to instructions from the control unit. It is possible. Further, the storage unit stores a program for realizing the process according to the present embodiment.
  • the output unit is composed of a speaker, a light, a display device such as a liquid crystal display, or the like, and performs various outputs according to instructions from the control unit.
  • the output method by the output device is not particularly limited, but may be, for example, a visual output by screen output.
  • the output unit may be a network interface having a communication function, and may perform an output operation by transmitting data to an external device (not shown) via a network (not shown).
  • the control device 50 comprehensively controls, for example, the positions of the stage 40 and the carriage unit 20 described above, and the ink ejection control by the ink ejection head 23.
  • the control device 50 outputs the control signal to the ink ejection head 23 according to the image pattern to be formed. Further, the control device 50 controls the shooting operation by the camera unit 30 in order to measure the amount of ink ejected.
  • the control device 50 performs various controls for generating the display panel D. In the present embodiment, an organic EL display panel will be described as an example of the display panel D.
  • the ink used when manufacturing the organic EL display panel will be described as an example, but the ink used when manufacturing the product to which the above-mentioned inkjet device 1 can be applied will be described. If so, it is not limited to this.
  • it is required to adjust the ink ejection amount with high accuracy. When making such an adjustment, it is necessary to measure the ink ejection amount for each nozzle, but it is difficult to accurately measure the ejection amount due to the change in volume due to the drying of the ink.
  • an ink having a composition characterized by a tendency of volume change due to drying is used.
  • Ink is composed of a solute containing a functional material and a solvent containing an organic solvent.
  • the functional material is for realizing the function of the layer formed by the inkjet method in the layer constituting the organic EL display panel.
  • the organic solvent needs to be an organic solvent in which a solute containing a functional material can be dissolved or dispersed.
  • FIG 4 and 5 are diagrams for explaining the characteristics of the ink according to the present embodiment.
  • an explanation will be given using the ink according to the present embodiment (Example) and the ink for comparison (Comparative Example).
  • the ink according to the present embodiment has a characteristic that the volume due to drying becomes stable after a certain period of time, as compared with the conventional ink.
  • FIG. 4 is a graph showing changes in the volume of droplets with the passage of time between the ink according to the present embodiment and the comparative example.
  • the horizontal axis represents the time [min] left after ejecting the ink droplets
  • the vertical axis represents the volume [pl] of the ink droplets. It is assumed that the volumes of the ink droplets of the initial example and the comparative example are the same.
  • FIG. 4 shows the volume value for each elapsed time (leaving time) corresponding to FIG. 4. In both the examples and the comparative examples, the volume decreases with almost the same tendency until a certain leaving time elapses.
  • the ink according to the present embodiment has the property that after a certain standing time (that is, drying time) has elapsed, the evaporation of the solvent is almost eliminated, the change in the volume of the ink is suppressed, and the ink is stabilized. .. Suppressing and stabilizing the change in the volume of the ink means that the change in the volume of the ink is almost eliminated by almost eliminating the evaporation of the solvent from the ink, and a constant ratio of the amount is maintained.
  • the state in which the amount is maintained at a constant rate may be, for example, a state in which the volume reduction rate is 0.01 pl / min or less.
  • the volume of the ink stabilized by suppressing the volume change is 1.00 pl.
  • the time from the ink ejection process to the acquisition process may be shaken for some reason.
  • the volume change is 1% or less (*), and such characteristics are preferable in manufacturing an organic EL panel.
  • it is more preferably 0.005 pl / min or less, and particularly preferably 0.001 pl / min or less. ((*) When the volume of 1.00 pl of ink decreases at 0.01 pl / min, the amount of volume decrease per minute is 0.01 pl. This is 1% of 1.00 pl.)
  • the composition of the ink according to this embodiment is determined.
  • the ink is composed of a solvent and a solute.
  • the organic solvent that can be used in the present embodiment include aliphatic hydrocarbon compounds, aliphatic alcohol compounds, aliphatic ether compounds, aliphatic glycol compounds, aliphatic ester compounds, aliphatic aldehyde compounds, and fats.
  • examples of the aliphatic hydrocarbon compound include n-octane, nonane, n-decane, and n-undecane.
  • examples of the aliphatic alcohol compound include 1-butanol, 1-pentanol, 2-pentanol, 1-hexanol, 2-hexanol, 1-heptanol, 2-heptanol, 1-octanol, 2-octanol, 2-nonanol, Examples thereof include n-dodecane, n-tridecane, n-tetradecane, 1-nonanol, n-decanol, 2-decanol, n-undecanol, and isodecanol.
  • Examples of the aliphatic ether compound include dibutyl ether (boiling point 137 to 143 ° C.).
  • Examples of the aliphatic glycol-based compound include ethylene glycol, ethylene glycol monoethyl ether, ethylene glycol diethyl ether, ethylene glycol monomethyl ether, propylene glycol, propylene glycol monoethyl ether, propylene glycol monomethyl ether, hexylene glycol, diethylene glycol, and triethylene glycol.
  • Dimethyl ether ethylene glycol mono-2-ethylhexyl ether, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monobenzyl ether, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, Examples thereof include 1,5-pentanediol.
  • Examples of the aliphatic ester compound include n-butyl formate, allyl acetate, n-butyl acetate, dimethyl succinate, diethyl oxalate, dimethyl oxalate, methyl lactate, ethyl lactate, methyl pyruvate, ethyl pyruvate, and dimethyl malonate. , Diethyl malonate and the like.
  • Examples of the aliphatic ester compound include n-octyl acetate and diethyl succinate.
  • Examples of the aliphatic aldehyde compound include furfural.
  • Examples of the aliphatic ketone compound include methyl isobutyl ketone, diisopropyl ketone, and diisobutyl ketone.
  • Examples of the aliphatic carboxyl compound include formic acid, acetic acid, propionic acid and the like.
  • Examples of the aliphatic compound containing a nitrogen atom include N, N-dimethylacetamide, N, N-dimethylformamide, N, N-diisopropylethylamine, acetamide and the like.
  • Examples of the aliphatic compound containing a sulfur atom include dimethyl sulfoxide.
  • Examples of the alicyclic hydrocarbon compound include methylcyclohexane, dimethylcyclohexane, ethylcyclohexane, cycloheptane, decalin, cyclopentanol, cyclohexanol, methylcyclohexanol, dimethylcyclohexanol, cyclohexenol, cyclohexylmethanol, tetrahydrofurfuryl alcohol, and the like.
  • Examples include furfuryl alcohol, cyclopentanone, cyclohexanone, dioxane, methylcyclohexanone, and bicyclohexyl.
  • Examples of the alicyclic ketone compound include isophorone.
  • Examples of the alicyclic lactone compound include ⁇ -butyrolactone and ⁇ -valerolactone.
  • Examples of the aliphatic carbonate compound include propylene carbonate.
  • Examples of the alicyclic compound containing a nitrogen atom include N-methylpyrrolidone, 2-pyrrolidone, 1,3-dimethylimidazolidinone and the like.
  • Examples of the alicyclic compound containing a sulfur atom include sulfolane.
  • aromatic hydrocarbon compound examples include toluene, o-xylene, p-xylene, m-xylene, mecitylene, 1,2,4-trimethylbenzene, ethylbenzene, o-diethylbenzene, m-diethylbenzene, p-diethylbenzene and o-ethyl.
  • aromatic alcohol compounds examples include phenol, o-cresol, o-ethylphenol, m-cresol, p-cresol, p-ethylphenol, 4-methoxyphenol, on-propylphenol, o-isopropylphenol, and o.
  • -S-Butylphenol, ot-butylphenol, mt-butylphenol, pt-butylphenol, benzyl alcohol and the like can be mentioned.
  • aromatic ester compound examples include methyl benzoate, ethyl benzoate, n-butyl benzoate and the like.
  • aromatic aldehyde compounds examples include benzaldehyde.
  • aromatic carboxyl compounds examples include benzoic acid.
  • an organic solvent having a boiling point of 250 ° C. or higher is used as the organic solvent contained in the ink according to this embodiment.
  • the organic solvent having such properties include aliphatic hydrocarbon compounds, aliphatic alcohol compounds, aliphatic ether compounds, aliphatic glycol compounds, aliphatic ester compounds, aliphatic aldehyde compounds, and aliphatic ketone compounds.
  • Compounds, aliphatic carboxyl compounds, aliphatic compounds containing nitrogen atoms, aliphatic compounds containing sulfur atoms, alicyclic compounds, alicyclic compounds having heteroatoms, aromatic hydrocarbon compounds, aromatic alcohol compounds Examples thereof include aromatic ester compounds, aromatic ether compounds, aromatic aldehyde compounds, and aromatic carboxyl compounds.
  • Benzene ether (boiling point 256 ° C), tripropylene glycol (boiling point 268 ° C), 1,6-hexanediol (boiling point 250 ° C), thiodiglycol (boiling point 283 ° C), 2- (1-cyclohexenyl) cyclohexanone (boiling point 265 ° C) ° C.), Sulfolane (boiling point 285 ° C.), n-octylbenzene (boiling point 261 to 263 ° C.), n-nonalbenzene (boiling point 282 ° C.), n-decylbenzene (boiling point 293 ° C.), biphenyl (boiling point 255 ° C.), Examples thereof include dimethylnaphthalene (boiling point 261 to 287 ° C.), n-butyl benzoate (b
  • organic solvent contained in the ink according to the present embodiment an organic solvent having a boiling point of 300 ° C. or higher can be used.
  • Organic solvents with such characteristics include dodecylbenzenebenzene (boiling point 331 ° C), diphenyl carbonate (boiling point 302 ° C), benzyl benzoate (boiling point 324 ° C), dioctyl sevacinate (boiling point 312 ° C), and dibutyl sevacinate (boiling point 312 ° C).
  • the ink composition according to the present embodiment may contain one or more organic solvents having a boiling point of 250 ° C. or higher, and a plurality of organic solvents may be mixed and used in consideration of adjusting the physical property values of the ink. It is preferable to do so.
  • the content of the organic solvent having a boiling point of 250 ° C. or higher contained in the ink composition according to the present embodiment is determined from the viewpoint of calculating the ejection amount from the image taken by the camera 31 and from the viewpoint of film forming property. It is preferably 20% by weight or more based on the weight of the composition. This is because when the content of the organic solvent having the above characteristics is small, an error in shooting when measuring the ink ejection amount is likely to occur.
  • the ink composition appropriately contains additives such as a surfactant for surface adjustment and an ultraviolet absorber, a light stabilizer, and an antioxidant for stabilizing the storage of the ink composition. You may.
  • the organic solvent contained in the ink composition according to the present embodiment has a boiling point of 250 ° C. or higher, preferably 280 ° C. or higher, and more preferably 300 ° C. or higher.
  • the upper limit is preferably 400 ° C. or lower, more preferably 380 ° C. or lower, and particularly preferably 350 ° C. or lower.
  • This is a boiling point assuming an environment in which the display panel D is manufactured by the inkjet device 1 according to the present embodiment. That is, the drying conditions of the ink are assumed. Therefore, the type and boiling point temperature of the high boiling point organic solvent used may be changed or adjusted according to the usage environment (measurement environment) of the inkjet device 1.
  • the ink composition according to the present embodiment containing an organic solvent having a boiling point of 250 ° C. or higher is preferably used for producing the display panel D by itself. That is, the display panel D is displayed as it is using the ink used for adjusting the ink ejection amount from the ink ejection head 23 of the inkjet device 1 to an appropriate ejection amount through the ejection step, the acquisition step, and the derivation step.
  • the display panel D is displayed as it is using the ink used for adjusting the ink ejection amount from the ink ejection head 23 of the inkjet device 1 to an appropriate ejection amount through the ejection step, the acquisition step, and the derivation step.
  • the acquisition process, and the derivation process is different from the ink used for panel manufacturing.
  • a cleaning process and an ink replacement process are required. Therefore, there is a problem that it takes time, the panel manufacturing cost becomes high, the nozzle of the inkjet device 1 is loaded by the cleaning process and the replacement process, and the ink ejection amount may deviate from the adjusted ejection amount. there were.
  • the ejection amount measurement adjustment step is performed by an ink ejection amount measurement adjustment device having an inkjet device 1.
  • the discharge amount measurement adjustment step has the measurement adjustment method shown below.
  • the measurement adjustment method includes the measurement method described below for measuring the amount of ink droplets ejected from the ink ejection head 23. If the amount of ink droplets measured by the measuring method deviates from the appropriate value, an adjustment method for adjusting to the appropriate value is required. Therefore, the measurement adjustment method according to the present embodiment may include a measurement step of measuring the amount of ink ejected, and may include an adjustment step of making adjustments based on the results measured in the measurement step.
  • the measurement method according to the present embodiment is at least a necessary method for adjusting the amount of ink ejected by the inkjet device 1 according to the present embodiment.
  • the measuring method according to the present embodiment is a method of measuring the amount of ink ejected from the ink ejection head 23, and here, the amount of ink droplets ejected from the ink ejection head 23 is not directly measured. , Indirectly measured by the flow of each of the following series of steps S602 to S605.
  • FIG. 6 is a flow chart of the discharge amount measurement adjustment process according to the present embodiment, and is a flowchart showing an example of the flow of the discharge amount measurement step and the discharge amount adjustment process according to the present embodiment described below.
  • the discharge amount measurement adjustment step is composed of a plurality of steps as shown in FIG. Each step shown in FIG. 6 may be started based on a user's instruction or may be started based on a predetermined operating condition. For the sake of simplicity, the flow of each of the following steps will be described as being comprehensively controlled by the control device 50.
  • the substrate B1 When measuring the amount of ink ejected from the ink ejection head 23, first, as an insertion step of the substrate B1, the substrate B1 is inserted into a predetermined start position. In S601, the control device 50 controls the position of each portion to the start position of the main measurement step described below, and then inserts the base material B1 for measuring the discharge amount.
  • the starting position of the measurement process according to the present embodiment is assumed to be the position of the stage 40 shown in FIG. At this position, the base material B1 can be inserted onto the stage 40. Further, it is assumed that the ink ejection head 23 is also located on the transport path of the base material B1 as shown in FIG. The base material B1 may be inserted into the stage 40 by using an insertion device (not shown) provided separately.
  • the ejection step is a step of ejecting ink from the ink ejection head 23 onto the substrate B1 and landing the ink on the substrate B1.
  • the control device 50 moves the base material B1 directly under the ink ejection head 23 and ejects ink onto the base material B1.
  • the ink ejection here may be performed simultaneously by the plurality of ink ejection heads 23, or may be sequentially performed in a predetermined order. Further, at the time of ejection, an ejection pattern in which all nozzles are ejected at the same time may be used, or a predetermined ejection pattern in which each nozzle is sequentially ejected may be used.
  • the ejected ink droplet 202 has a dome-shaped shape as shown in FIG. 9A.
  • the ink droplet after landing on the base material B1 is shown as K.
  • the drying step is a step of stabilizing over a certain period of time so that the volume change due to drying of the organic solvent contained in the ink landed on the base material B1 in the ejection step is almost eliminated.
  • the control device 50 causes the ink droplet K on the base material B1 to be dried as shown in FIG. 9A.
  • the ink according to the present embodiment is configured to contain an organic solvent (high boiling point solvent) that is difficult to evaporate. Therefore, by providing a drying step for a certain period of time after landing on the base material B1, the volume of the ink droplet K is stabilized after the ink evaporates to some extent. In the stabilized state, there is almost no change in the diameter of the ink droplet K.
  • the time required for this drying step is determined according to the characteristics of the ink. For example, in the case of having the characteristics shown in FIGS. 4 and 5, the time required for the drying step is preferably 5 minutes or more as a predetermined time, and more preferably 10 minutes or more. Further, as shown in FIG. 1, when a plurality of ink ejection heads 23 are provided and each of them corresponds to inks having different compositions, the drying time in the drying step in S603 also corresponds to the composition of each ink. It will be adjusted.
  • the form of the drying process is not particularly limited as long as a predetermined time can be set before the shooting process in the subsequent stage.
  • the base material B1 may be dried while being stopped directly under the ink ejection head 23, or may be configured such that a predetermined time elapses while moving to the shooting position by the camera 31. .. Alternatively, drying may be performed at the shooting position by the camera 31. In this embodiment, it is assumed that the drying is natural drying, and the temperature and humidity are not particularly adjusted, but at least the drying time is measured during the drying.
  • the acquisition step is a step of acquiring an image of the ink ejected on the base material B1.
  • the control device 50 moves the base material B1 directly under the camera 31 as shown in FIG. 8, takes a picture of the base material B1, and acquires an image containing the ink ejected on the base material B1.
  • FIG. 8 is a schematic view showing a state of the base material B1 at the time of photographing.
  • FIG. 9A is a view of the periphery of the camera 31 at the time of shooting as viewed from the side surface side along the X-axis direction
  • FIG. 9B is a view of the base material B1 to be photographed as viewed from the top surface side along the Z-axis direction.
  • FIGS. 8, 9A, and 9B show an example in which the ink droplet K is photographed for each line in the sub-scanning direction, but the present invention is not limited to this.
  • Ink droplets K of a plurality of lines may be collectively photographed according to the angle of view, the resolution, and the like of the camera 31. From the viewpoint of shortening the time, it is preferable to shoot a plurality of ink droplets K at once by using a high angle of view and high resolution camera, and the ink droplets K ejected onto the base material B1 are taken together. Most preferably, you can shoot everything at once.
  • the derivation step is a step of deriving the ejection amount of each nozzle of the ink ejected from the nozzles of the ink ejection head 23 based on the information obtained in the acquisition step of S604.
  • the control device 50 calculates the amount of ink ejected from each nozzle based on the image taken in S604. Specifically, the control device 50 identifies the range of the ink droplet K ejected from each nozzle from the image, and derives the diameter of the ink droplet K. Further, the control device 50 derives the ink ejection amount from the diameter of the derived ink droplet K.
  • the ink ejection amount is derived based on the diameter of the ink droplet K. Since the base material B1 is coated with the liquid-repellent coating material, the ink does not penetrate into the base material B1. On the other hand, by the drying step of S603, the ink is dried and its volume is changed by a certain amount. As shown in FIG. 4, the volume of the ink according to the present embodiment is stable after a certain degree of drying. Therefore, the amount of ink ejected from the nozzle can be derived based on the volume of the ink after stabilization and the rate of change in the volume of the ink according to the composition of the ink.
  • the time until the volume of the ink stabilizes due to drying varies depending on the composition of the ink and the surrounding environment, and is not limited to the above. In the present embodiment, it is preferable that the surrounding environment (temperature and humidity) when manufacturing the organic EL display panel is constant.
  • a table (not shown) for deriving the volume of the ink droplet K from the diameter of the ink droplet K on the base material B1 is used.
  • the diameter of the ink droplet K on the base material B1 coated with the liquid-repellent coating material varies depending on the amount of ink, the surface tension defined by the composition of the ink, and the contact angle. Therefore, a table that defines the relationship between the diameter and the volume on the base material B1 is used according to the ink to be used.
  • the method for deriving the volume of the ink droplet K from the diameter of the ink droplet K is not limited to this. For example, a mathematical formula corresponding to the composition of the ink may be specified, and the volume may be calculated from the diameter of the ink droplet K using the mathematical formula.
  • the control device 50 derives the ink ejection amount for all the nozzles included in the ink ejection head 23.
  • the control device 50 may be configured to perform image processing on the image taken by the camera 31. For example, in order to detect the diameter of the ink droplet K with higher accuracy, edge processing, filter processing, or the like may be performed.
  • edge processing, filter processing, or the like may be performed.
  • the measurement adjustment method according to the present embodiment has an adjustment method having the adjustment steps described below after carrying out the measurement method including the above measurement steps.
  • the ink ejection amount is out of the appropriate value as a result of measuring the ink ejection amount performed by the inkjet device 1 by the measuring method having the above measuring step.
  • An adjustment step to adjust to the value is required.
  • the adjustment step is unnecessary.
  • the adjustment step is a step of adjusting the amount of ink ejected from the ink ejection head 23 derived by the measurement steps (S602 to S605) to an appropriate amount.
  • the control device 50 adjusts the amount of ink ejected from the corresponding nozzle to an appropriate amount based on the amount of ink ejected derived in S605.
  • the adjustment here may include an increase / decrease in the amount of ink ejected, as well as detection of a nozzle in which ink is not ejected.
  • the control device 50 discharges the base material B1.
  • the discharge position of the base material B1 may be the same as the insertion position of the base material B1 or may be on the downstream side in the transport direction of the base material B1.
  • the base material B1 may be discharged from the stage 40 by using a separately provided discharge device (not shown) or the like.
  • this discharge step is performed after the final step of the measuring step or the adjusting step, that is, the measuring step and the adjusting step are successfully completed. Then, the flow of the main discharge amount measurement adjustment process is completed.
  • the configuration in which the ink ejection amount is measured and the ejection amount is adjusted by one ejection at each nozzle of the ink ejection head 23 is shown.
  • the measurement adjustment method according to the present embodiment is not limited to this configuration, and may be configured to improve the adjustment accuracy by repeating the steps S602 to S606 a plurality of times. Further, if a nozzle that discharges ink is generated as a result of the adjustment, the configuration may be such that information about the nozzle is notified.
  • the steps S602 to S606 are repeated a plurality of times, it is preferable to complete the process in a short time, and it is preferable that the number of times the steps S602 to S606 are repeated is small.
  • the number of repetitions is usually 10 times or less, preferably 5 times or less, more preferably 3 times or less, particularly preferably 2 times or less, and most preferably once from the viewpoint of a short time.
  • the steps S602 to S606 are performed once to adjust the amount of ink ejected from the ink ejection head 23, it is preferably performed once again and twice. When the ink is ejected twice or more, the next step of S606 may not be performed as long as the ejected amount of the derived ink is an appropriate value in the second and subsequent measurement steps.
  • the series of measurement steps and adjustment steps of S602 to S606 are performed. It may be only once, and from the viewpoint of confirming the amount of ink ejected from the ink ejection head 23 after the adjustment step, the measurement step is further performed once after the series of measurement steps and adjustment steps of S602 to S606. Is preferable. If the amount of ink ejected from the ink ejection head 23 derived in the measurement step is an appropriate amount, the adjustment step is unnecessary. In this case, the process may be continued to move to the next ejection step of the base material B1, or the measurement step may be performed again to reconfirm that the amount of ink ejected from the ink ejection head 23 is an appropriate amount. You may.
  • the measurement step is not performed again and the process proceeds to the next ejection step (S607) of the base material B1.
  • the measurement step is performed again and the amount of ink ejected from the ink ejection head 23 is appropriate. It is preferable to reconfirm that the amount is the same from the viewpoint that it can be confirmed that there is no fluctuation or error in the discharge amount due to an unexpected disturbance factor and the production with a higher yield can be performed.
  • the drying step it is necessary to allow a certain period of time to elapse in the drying step (S603). Therefore, when the measurement step is repeated a plurality of times, a long time elapses, which is not preferable in terms of manufacturing. Therefore, in the above measurement step, it is preferable to perform the measurement step by ejecting a plurality of ink droplets from one nozzle to different positions on the base material B1. This method is preferable because even if a plurality of discharges are performed, the influence of fluctuations in the discharge amount and errors due to unexpected disturbance factors can be reduced in one measurement step. Further, when the measurement step for confirmation is carried out again after the adjustment step (S606) to be carried out continuously, similarly, a plurality of ink droplets may be ejected from one nozzle to different positions on the base material B1. preferable.
  • the ink according to this embodiment contains a high boiling point solvent. Since the high boiling point solvent does not evaporate at room temperature (that is, under the manufacturing environment of the display panel D), there is almost no change in the diameter of the ink droplet K after the solvent becomes only the high boiling point solvent. Therefore, the diameter of the ink droplet K of the high boiling point solvent can be accurately measured from the captured image. If the content of the high boiling point solvent in the ink is accurately measured in advance, the ink ejection droplet amount can be accurately converted from the diameter of the ink droplet K. As a result, the ejection amount of each nozzle of the ink ejection head 23 can be appropriately measured.
  • the ejection amount of the nozzle in the ink ejection head 23 can be appropriately adjusted, and natural drying is suppressed due to the influence of the high boiling point solvent even when the ink is ejected to the base material B2 when the display panel D is manufactured. It becomes possible to do. As a result, when the display panel D is manufactured, it is possible to appropriately perform the drawing process on the base material B2 without unevenness in the film thickness.
  • the panel manufacturing system for the organic EL display panel has the discharge amount measurement and adjustment device, and also has an organic EL display panel manufacturing device using the ink discharge head 23 of the discharge amount measurement and adjustment device. After the discharge amount measurement adjustment step shown in FIG. 6 is completed, the organic EL display panel is manufactured. In this case, the base material B2 is inserted into the stage 40 instead of the base material B1, and panel manufacturing is performed. Since the ink ejection amount varies depending on, for example, the lot of the ink ejection head 23, it is necessary to use the ink ejection head 23 that has completed the ejection amount measurement adjustment step shown in FIG. 6 in the manufacture of the organic EL display panel.
  • the timing at which the adjustment operation shown in FIG. 6 is executed may be arbitrary. For example, it may be performed before manufacturing the first base material B2 in lot units when manufacturing an organic EL display panel. Alternatively, it may be performed for each base material B2 when manufacturing the organic EL display panel. Further, when a plurality of ink ejection heads 23 are provided corresponding to each of the plurality of layers constituting the organic EL display panel, the ejection amount measurement adjustment step of FIG. 6 is individually performed for each of the ink ejection heads 23 corresponding to each layer. This may be performed, or the ejection amount measurement adjustment step of FIG. 6 may be collectively performed on the ink ejection heads 23 corresponding to each layer.
  • the ink ejection head 23 even after the ink ejection head 23 is replaced or washed, it is necessary to perform the ejection amount measurement adjustment step of FIG. The reason is that when the ink ejection head 23 is replaced, it is necessary to make initial adjustments for all the nozzles of the ink ejection head 23. When washed, it may affect the fluctuation of the ink ejection amount due to unexpected, below the detection limit, and / or minute deformation of undetectable parts, minute deviation of parts, etc. Is. Furthermore, even if the same type of ink is used, even if the ink is replaced by some method, it is necessary to perform the ejection amount measurement adjustment step of FIG. The reason is that even if the same type of ink is used, slight fluctuations in the liquid properties of the ink, for example, when the lots are different, may affect the fluctuation of the ejection amount from the ink ejection head 23. be.
  • the amount of ink ejected may differ depending on the lot of ink and the replacement of ink. Therefore, in the manufacture of the organic EL display panel, the ink that has completed the ejection amount measurement adjustment step shown in FIG. 6 is used as it is. It is preferable to use it. It should be noted that using the ink that has completed the ejection amount measurement adjustment step shown in FIG. 6 as it is represents the following state. That is, the ink ejected from the plurality of nozzles provided in the ink ejection head 23 is usually an ink connected to the ink ejection head 23 by an ink storage unit (not shown) mounted on the ink ejection head 23 or a pipe.
  • the ink is continuously supplied to the ink ejection head 23 from the storage unit (not shown).
  • Using the ink that has completed the ejection amount measurement adjustment process shown in FIG. 6 means that after the ejection amount measurement adjustment process shown in FIG. 6 is completed, the ink is not newly supplied or replaced in the ink storage unit, and the panel is manufactured as it is. It is to be used in the process. By doing so, after the ejection amount measurement adjustment step shown in FIG. 6 is completed, it is possible to move to the panel manufacturing process without slight fluctuations in the physical characteristics of the ink. Therefore, the ink ejection head adjusted to an appropriate ejection amount. It is preferable that the panel can be stably manufactured at 23.
  • the discharge amount measurement adjustment process shown in FIG. 6 this is just the name of the process and does not express the content of the process in its wording. That is, even if the above adjustment step (S606) is not performed when it is confirmed by the above measurement steps (S602 to S605) that the discharge amount is appropriate, the “discharge amount measurement adjustment step shown in FIG. 6" is applied. It is included.
  • FIG. 10 is a schematic plan view showing a configuration example of the display panel D according to the present embodiment. Note that FIG. 10 is a schematic diagram, and the scale thereof may differ from the actual scale.
  • the display panel D is an organic EL display panel that utilizes the electroluminescence phenomenon of an organic compound.
  • a plurality of organic EL display elements each of which constitutes a pixel, are arranged in a matrix on a substrate (hereinafter referred to as "TFT substrate") on which a thin film transistor (TFT: Thin Film Transistor) is formed, and the upper surface thereof is formed.
  • TFT substrate a substrate on which a thin film transistor (TFT: Thin Film Transistor) is formed, and the upper surface thereof is formed.
  • TFT substrate a substrate
  • TFT Thin Film Transistor
  • It has a top-emission type configuration that emits light from (color filter substrate 131 side).
  • the X direction, the Y direction, and the Z direction in FIG. 10 are also referred to as a row direction, a column direction, and a thickness direction in the display panel D, respectively.
  • the display panel D includes a compartmentalized area 10a and a non-partitioned region 10b located around the compartmentalized area 10a.
  • the partition area 10a is partitioned on the substrate 100 in a matrix by banks 122 that regulate the emission units of each color (here, three colors of RGB).
  • the bank 122 along the Y-axis direction will be referred to as a column bank 122Y, and the bank along the X-axis direction will be referred to as a row bank 122X.
  • the partition area 10a is composed of a display pixel arrangement area 10e including the center of the substrate 100 and a non-light emitting area 10ne located around the display pixel arrangement area 10e.
  • the display pixel arrangement area 10e is an area in which an organic EL display element is formed in each section regulated by the column bank 122Y and the row bank 122X.
  • the non-light emitting region 10ne is a region in which the organic EL display element is not formed.
  • FIG. 11 is an enlarged plan view of a part of the display pixel arrangement area 10e shown in FIG. 10 and a part of the area 10c.
  • unit elements 100e corresponding to the organic EL display elements are arranged on a matrix.
  • the unit element 100e is a region that emits light due to an organic compound.
  • the unit element 100e includes a self-luminous region 100aR that emits light in red (R), a self-luminous region 100aG that emits light in green, and a self-luminous region 100a corresponding to three colors of self-luminous region 100aB in blue. Will be done.
  • a plurality of pixel electrodes 119 are arranged on the substrate 100 in a row direction and a column direction, respectively, in a state of being separated by a predetermined distance.
  • the pixel electrodes 119 arranged in a matrix correspond to the self-luminous regions 100aR, 100aG, and 100aB arranged in order in the row direction.
  • the region other than the self-luminous region 100a is the non-self-luminous region 100b.
  • the non-self-luminous region 100b is provided with a contact hole 119c for connecting the pixel electrode 119 and the source of the TFT.
  • the non-self-luminous region 100b is provided with a contact region 119b for electrically connecting to the pixel electrode 119.
  • FIG. 12 is a schematic cross-sectional view of the position cut by X1-X1 shown in FIG.
  • the display panel D includes a substrate 100 (TFT substrate) in which a thin film transistor is formed downward in the Z-axis direction, and an organic EL element portion as a light emitting element portion is formed on the substrate 100 (TFT substrate). It is configured.
  • the organic EL element unit is composed of a plurality of layers, and the above-mentioned inkjet device 1 can be applied when forming a part of the layers.
  • a pixel electrode 119 As a plurality of layers constituting the organic EL element portion, a pixel electrode 119, a hole injection layer 120, a hole transport layer 121, a bank 122, a light emitting layer 123, an electron transport layer 124, a counter electrode 125, a sealing layer 126, and a junction are used. Layer 127 and a color filter substrate 131 are included. Further, the color filter substrate 131 includes a color filter layer 128 and an upper substrate 130.
  • the parts constituting the display panel D will be described.
  • the substrate 100 is a support member for the display panel D, and is a base material (not shown), a thin film transistor (TFT) layer (not shown) formed on the base material, and layers formed on the base material and the TFT layer. It has an insulating layer (not shown).
  • the base material (not shown) constituting the substrate 100 is a support member for the display panel D and has a flat plate shape.
  • a material having an electrically insulating property for example, a glass material, a resin material, a semiconductor material, a metal material coated with an insulating layer, or the like can be used.
  • glass substrates, quartz substrates, silicon substrates, molybdenum sulfide, copper, zinc, aluminum, stainless steel, magnesium, iron, nickel, gold, silver and other metal substrates, gallium arsenic groups and other semiconductor substrates, plastic substrates, etc. Can be adopted as.
  • the TFT layer (not shown) constituting the substrate 100 is composed of a plurality of TFTs formed on the upper surface of the substrate and wiring.
  • the TFT electrically connects the pixel electrode 119 corresponding to itself and the external power supply (not shown) in response to a drive signal from the external circuit of the display panel D, and includes electrodes, semiconductor layers, insulating layers, and the like. It consists of a multi-layer structure.
  • the wiring (not shown) electrically connects a TFT, a pixel electrode 119, an external power supply, an external circuit, and the like.
  • the interlayer insulating layer located on the upper surface of the substrate 100 flattens at least a part of the upper surface of the substrate 100 having irregularities due to the TFT layer. Further, the interlayer insulating layer fills the space between the wiring and the TFT, and electrically insulates the space between the wiring and the TFT.
  • the interlayer insulating layer for example, silicon oxide (SiO2), silicon nitride (SiN), silicon oxynitride (SiON), silicon oxide (SiO), and silicon oxynitride (SiON) can be used.
  • As the connection electrode layer of the TFT for example, a laminate of molybdenum (Mo), copper (Cu), and copper manganese (CuMn) can be adopted.
  • the interlayer insulating layer is formed by using an organic compound such as a polyimide resin, an acrylic resin, a siloxane resin, or a novolak type phenol resin, and the layer thickness may be, for example, in the range of 2000 nm to 8000 nm. can.
  • a pixel electrode 119 is provided on an interlayer insulating layer (not shown) located on the upper surface of the substrate 100.
  • the pixel electrode 119 is for supplying carriers to the light emitting layer 123, and for example, when functioning as an anode, supplies holes to the light emitting layer 123.
  • the pixel electrode 119 has a rectangular flat plate shape. Further, through the contact hole formed on the upper surface of the substrate 100, the connection recess of the pixel electrode 119 in which a part of the pixel electrode 119 is recessed in the direction of the substrate 100 and the source of the TFT are connected.
  • the pixel electrode 119 is made of a metal material.
  • the chromaticity of the emitted light is adjusted and the brightness is increased by optimally setting the layer thickness and adopting the optical resonator structure. Therefore, the surface portion of the pixel electrode 119 has high reflectivity.
  • the pixel electrode 119 may have a structure in which a plurality of films selected from a metal layer, an alloy layer, and a transparent conductive film are laminated.
  • the metal layer can be made of, for example, a metal material containing silver (Ag) or aluminum (Al).
  • alloy layer for example, APC (alloy of silver, palladium, copper), ARA (alloy of silver, rubidium, gold), MoCr (alloy of molybdenum and chromium), NiCr (alloy of nickel and chromium), etc. are used. Can be done.
  • constituent material of the transparent conductive layer for example, indium tin oxide (ITO), indium zinc oxide (IZO), or the like can be used.
  • the hole injection layer 120 and the hole transport layer 121 are laminated in this order on the pixel electrode 119, and the hole transport layer 121 is in contact with the hole injection layer 120.
  • the hole injection layer 120 and the hole transport layer 121 have a function of transporting the holes injected from the pixel electrode 119 to the light emitting layer 123.
  • the hole injection layer 120 is formed by, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or A layer made of a conductive polymer material.
  • an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or A layer made of a conductive polymer material.
  • Examples of the conductive polymer material that can be used as the hole injection layer 120 and the hole transport layer 121 include polyvinylcarbazole or a derivative thereof, polysilane or a derivative thereof, a polysiloxane derivative having an aromatic amine in the side chain or the main chain, and a pyrazoline derivative.
  • Arylamine derivative, Stilben derivative, Triphenyldiamine derivative, Polyaniline or its derivative, Polythiophene or its derivative, Polypyrrole or its derivative, Poly (p-phenylenebinylene) or its derivative, or Poly (2,5-thienylenevinylene) or Derivatives thereof and the like are exemplified.
  • JP-A-63-70527, JP-A-63-175860, JP-A-2-135359, JP-A-2-135361, JP-A-2-209888 examples thereof include those described in Japanese Patent Application Laid-Open No. 3-37992, Japanese Patent Application Laid-Open No. 3-152184, and the like.
  • the hole transport material used for the hole transport layer 121 polyvinylcarbazole or a derivative thereof, polysilane or a derivative thereof, a polysiloxane derivative having an aromatic amine compound group in the side chain or the main chain, polyaniline or a derivative thereof.
  • Polyvinylcarbazole or a derivative thereof can be obtained from, for example, a vinyl monomer by cationic polymerization or radical polymerization.
  • a vinyl monomer by cationic polymerization or radical polymerization.
  • the polysiloxane or its derivative those having the structure of the hole transport material in the side chain or the main chain in the siloxane skeleton structure are preferably used.
  • those having a hole-transporting aromatic amine in the side chain or the main chain are exemplified.
  • the hole injection layer 120 and the hole transport layer 121 can be formed by using the inkjet device 1 shown in FIG.
  • the organic solvent used as the ink for forming the hole injection layer 120 and the hole transport layer 121 is not particularly limited as long as it dissolves the hole injection material and the hole transport material.
  • bank A bank 122 made of an insulator is formed so as to cover the edges of the pixel electrode 119, the hole injection layer 120, and the hole transport layer 121.
  • the bank 122 has an insulating property having a volume resistivity of 1 ⁇ 106 ⁇ cm or more. It is desirable to have it.
  • the bank 122 is formed by using an organic material such as resin and has an insulating property.
  • the organic material used for forming the bank 122 include an acrylic resin, a polyimide resin, a novolak type phenol resin, and the like.
  • the bank 122 is preferably resistant to organic solvents. More preferably, it is desirable to use an acrylic resin. This is because the acrylic resin has a low refractive index and is suitable as a reflector.
  • the bank 122 When an inorganic material is used for the bank 122, for example, silicon oxide (SiO) is preferably used from the viewpoint of the refractive index.
  • the bank 122 is formed by using an inorganic material such as silicon nitride (SiN) or silicon oxynitride (SiON).
  • the bank 122 since the bank 122 may be subjected to etching treatment, baking treatment, etc. during the panel manufacturing process, the bank 122 is formed of a material having high resistance to such treatments so as not to be excessively deformed or deteriorated. Is preferable. Further, in order to give the surface liquid repellency, the surface of the bank 122 may be treated with fluorine by CVD (Chemical Vapor Deposition) or the like.
  • CVD Chemical Vapor Deposition
  • a light emitting layer 123 that emits light in each color is formed on the display panel D. Specific examples of the colors here include three colors, R (Red), G (Green), and B (Blue).
  • the light emitting layer 123 is a layer made of an organic compound, and has a function of emitting light by recombining holes and electrons inside. In the light emitting layer 123, only the portion to which the carrier is supplied from the pixel electrode 119 emits light.
  • the light emitting layer 123 can be formed by using the inkjet device 1 shown in FIG.
  • the light emitting layer 123 may be a layer made of a known material that can be used for the light emitting layer (layer having a light emitting function) of the organic EL element portion, and the material or the like is not particularly limited, but the light emitting layer made of an organic material. Is preferable. For example, it is preferable to use a layer formed of an organic substance (low molecular weight compound and high molecular weight compound) that emits fluorescence or phosphorescence as a luminescent material and a dopant that assists the organic substance (low molecular weight compound and high molecular weight compound).
  • an organic substance low molecular weight compound and high molecular weight compound
  • luminescent materials include dye-based materials, metal complex-based materials, and polymer-based materials.
  • pigment-based materials include cyclopendamine derivatives, tetraphenylbutadiene derivative compounds, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, and pyrrole derivatives.
  • examples thereof include a thiophene ring compound, a pyridine ring compound, a perinone derivative, a perylene derivative, an oligothiophene derivative, an oxadiazole dimer, and a pyrazoline dimer.
  • the metal complex-based material examples include aluminum (Al) as a central metal such as an aluminum quinolinol complex, a benzoquinolinol beryllium complex, a benzoxazolyl zinc complex, a benzothiazole zinc complex, an azomethyl zinc complex, a porphyrin zinc complex, and a europium complex. ), Zinc (Zn), berylium (Be), etc. or rare earth metals such as terbium (Tb), europium (Eu), disprosium (Dy), and ligands such as oxadiazole, thiadiazol, phenylpyridine, and phenylbenzo. Examples thereof include imidazoles and metal complexes having a quinoline structure.
  • a polyparaphenylene vinylene derivative, a polythiophene derivative, a polyparaphenylene derivative, a polysilane derivative, a polyacetylene derivative, a polyfluorene derivative, a polyvinylcarbazole derivative, and the above-mentioned dye or metal complex-based luminescent material are polymerized. Examples include those that have been transformed.
  • examples of the material that emits blue light include distyrylarylene derivatives, oxadiazole derivatives, and polymers thereof, polyvinylcarbazole derivatives, polyparaphenylene derivatives, polyfluorene derivatives, and the like. Of these, polyvinylcarbazole derivatives, polyparaphenylene derivatives, polyfluorene derivatives and the like, which are polymer-based materials, are preferable.
  • Examples of the luminescent material that emits green light include quinacridone derivatives, coumarin derivatives, polymers thereof, polyparaphenylene vinylene derivatives, and polyfluorene derivatives. Of these, polyparaphenylene vinylene derivatives and polyfluorene derivatives, which are polymer-based materials, are preferable.
  • Examples of the luminescent material that emits red light include coumarin derivatives, thiophene ring compounds, and polymers thereof, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyfluorene derivatives, and the like. Of these, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyfluorene derivatives and the like, which are polymer-based materials, are preferable.
  • the method for producing such a luminescent material is not particularly limited, and a known method can be appropriately adopted.
  • a known method can be appropriately adopted.
  • the method described in Japanese Patent Application Laid-Open No. 2012-144722 may be adopted.
  • a dopant to the ink used when forming the light emitting layer 123 for the purpose of improving the light emitting efficiency and changing the light emitting wavelength.
  • dopants include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazolone derivatives, decacyclene, phenoxazone and the like.
  • the thickness of such a light emitting layer 123 is usually preferably about 20 to 2000 ⁇ .
  • the film shape of the light emitting layer 123 formed by using an ink containing an organic solvent having a high boiling point of 250 ° C. or higher, preferably 300 ° C. or higher, has a film thickness at the peripheral portion and the central portion of the film forming area. It becomes an equivalent shape. That is, the ink according to the present embodiment can suppress the fluctuation in film thickness due to the imbalance of the solvent evaporation rate due to the vapor concentration distribution of the ink solvent between the central portion and the peripheral portion of the substrate.
  • An electron transport layer 124 is formed on the light emitting layer 123 on the bank 122 and in the opening defined by the bank 122.
  • the electron transport layer 124 has a function of transporting electrons injected from the counter electrode 125 to the light emitting layer 123.
  • the electron transport layer 124 is formed by using, for example, an oxadiazole derivative (OXD), a triazole derivative (TAZ), a phenanthroline derivative (BCP, Bphen), or the like.
  • the counter electrode 125 is laminated and formed so as to cover the electron transport layer 124.
  • the counter electrode 125 may be formed in a continuous state over the entire display panel D and may be connected to the bus bar wiring in pixel units or several pixel units (not shown).
  • the counter electrode 125 is paired with the pixel electrode 119 to sandwich the light emitting layer 123 to form an energization path, and supplies carriers to the light emitting layer 123.
  • the counter electrode 125 functions as a cathode, for example, it supplies electrons to the light emitting layer 123.
  • the counter electrode 125 is formed along the surface of the electron transport layer 124, and is a common electrode for each of the light emitting layers 123 formed between the banks 122.
  • a conductive material having light transmittance is used for the counter electrode 125.
  • the counter electrode 125 is formed by using indium tin oxide (ITO), zinc oxide (IZO), or the like. Further, an electrode obtained by thinning silver (Ag), aluminum (Al), or the like may be used as the counter electrode 125.
  • the sealing layer 126 is laminated so as to cover the counter electrode 125.
  • the sealing layer 126 is formed to prevent the light emitting layer 123 from deteriorating due to contact with moisture, air, or the like.
  • the sealing layer 126 is provided over the entire surface of the display panel D so as to cover the upper surface of the counter electrode 125.
  • the sealing layer 126 is formed by using a translucent material such as silicon nitride (SiN) or silicon oxynitride (SiON).
  • a sealing resin layer made of a resin material such as an acrylic resin or a silicone resin may be provided on a layer formed by using a material such as silicon nitride (SiN) or silicon oxynitride (SiON).
  • a color filter substrate 131 composed of an upper substrate 130 and a color filter layer 128 is arranged above the sealing layer 126 in the Z-axis direction, and the sealing layer 126 and the color filter substrate 131 are bonded by a bonding layer 127. ..
  • the bonding layer 127 has a function of bonding the back panel composed of each layer from the substrate 100 to the sealing layer 126 and the color filter substrate 131, and preventing each layer from being exposed to moisture or air.
  • a translucent material resin material such as an acrylic resin, a silicone resin, or an epoxy resin can be adopted.
  • the display panel D is a top emission type for the upper substrate 130 constituting the color filter substrate 131, for example, a light transmissive material such as a cover glass or a transparent resin film is used. Further, the display panel D can improve the rigidity and prevent the intrusion of moisture, air, etc. by the upper substrate 130.
  • a translucent material for example, a glass substrate, a quartz substrate, a plastic substrate, or the like can be adopted.
  • a color filter layer 128 corresponding to each color is formed on the color filter substrate 131 at a position corresponding to a light emitting region of a pixel.
  • the light emitting region corresponds to the position of the light emitting layer 123 formed between the banks 122.
  • the color filter layer 128 is a transparent layer provided for transmitting visible light having a wavelength corresponding to each color (for example, R, G, B), and transmits light emitted from each color pixel to transmit the chromaticity. Has the function of correcting.
  • the color filter layer 128 is formed by applying an ink containing a color filter material and a solvent to an upper substrate 130 made of a cover glass for forming a color filter in which a plurality of openings are formed in a matrix in pixel units. It is formed by the step of applying.
  • the panel manufacturing process of the display panel D will be described with specific examples.
  • the light emitting layer 123, the hole injection layer 120, and the hole transport layer 121 can be formed by an inkjet method. Therefore, in the present embodiment, the method for measuring the ink ejection amount described with reference to FIG. 6 or the method for adjusting the ink ejection amount will be described as being used when forming these three layers. Therefore, the panel manufacturing system of the display panel D according to the present embodiment is preferably a panel manufacturing system having the above-mentioned ink ejection amount measurement adjustment device in addition to the display panel manufacturing device that manufactures the display panel D itself. ..
  • FIG. 13 is a flowchart showing a panel manufacturing process of the display panel D.
  • the ink ejection head 23 corresponding to each layer is provided. That is, the configuration shown in FIG. 1 is prepared for forming the light emitting layer 123, the hole injection layer 120, and the hole transport layer 121, respectively. Further, for the sake of simplicity, the process for manufacturing the display panel D will be described as being comprehensively controlled by the control device 50.
  • the substrate 100 composed of the base material, the TFT layer, and the interlayer insulating layer is prepared.
  • the control device 50 forms the pixel electrode 119 on the substrate 100. Specifically, a contact hole (not shown) is provided in the interlayer insulating layer of the substrate 100 to form the pixel electrode 119.
  • the pixel electrode 119 is formed by forming a metal film by a sputtering method, a vacuum vapor deposition method, or the like, and then patterning by a photolithography method and an etching method.
  • the pixel electrode 119 is electrically connected to the electrodes of the TFTs constituting the substrate 100.
  • the control device 50 forms the bank 122.
  • the bank 122 is formed along the predetermined direction, and then the bank in the direction orthogonal to the predetermined direction is formed.
  • the formation of the bank 122 is performed by laminating a film made of a constituent material of the bank 122 (for example, a photosensitive resin material). Then, the resin film is patterned to sequentially form banks.
  • the patterning of the bank may be performed by exposing the resin film on the surface using a photomask and performing a developing step and a firing step (for example, about 230 ° C. for about 60 minutes).
  • a spin coating method or the like is used to form a photosensitive resin film made of an organic photosensitive resin material, for example, an acrylic resin, a polyimide resin, a novolak type phenol resin, or the like. Then, after drying to volatilize the solvent to some extent, a photomask having a predetermined opening is layered. Further, ultraviolet irradiation is performed from above to expose a photoresist made of a photosensitive resin or the like, and the pattern of the photomask is transferred to the photoresist. Subsequently, the photosensitive resin is developed to form an insulating layer in which the bank 122 is patterned. Generally, a photoresist called a positive type is used. In the positive type, the exposed part is removed by development. The portion of the mask pattern that is not exposed is not developed and the bank 122 remains with a certain thickness.
  • an organic photosensitive resin material for example, an acrylic resin, a polyimide resin, a novolak type phenol resin, or the like.
  • the control device 50 laminates and forms the hole injection layer 120 on the pixel electrode 119.
  • the hole injection layer 120 can be formed by an inkjet method using an ink in which a conductive polymer material is dissolved in an organic solvent.
  • the ink ejection amount measuring and adjusting device described above adjusts the ejection amount of each nozzle of the ink ejection head 23 by the method shown in FIG. ..
  • the base material B1 inserted in the insertion step (S601) of FIG. 6 is coated with a liquid-repellent coating material having a liquid-repellent property against the ink used for forming the hole injection layer 120.
  • the base material used is used.
  • the hole injection layer 120 is formed at a predetermined position defined by the bank 122 with the ink containing the conductive polymer material by using the inkjet method.
  • the control device 50 laminates and forms the hole transport layer 121 on the hole injection layer 120.
  • the hole transport layer 121 can be formed by an inkjet method using an ink in which a conductive polymer material is dissolved in an organic solvent.
  • the ink ejection amount measuring and adjusting device adjusts the ejection amount of each nozzle of the ink ejection head 23 by the method shown in FIG. ..
  • the base material B1 inserted in S601 of FIG. 6 is a base material coated with a liquid-repellent coating material having a liquid-repellent property against the ink used for forming the hole transport layer 121. Used.
  • the hole transport layer 121 is formed at a predetermined position defined by the bank 122 with the ink containing the conductive polymer material by using the inkjet method.
  • the control device 50 laminates and forms the light emitting layer 123 on the hole transport layer 121 at a predetermined position defined by the bank 122.
  • the ink ejection amount measuring device adjusts the ejection amount of each nozzle of the ink ejection head 23 by the method shown in FIG.
  • the base material B1 inserted in the insertion step (S601) of FIG. 6 is a group coated with a liquid-repellent coating material having a liquid-repellent property against the ink used for forming the light emitting layer 123. The material is used.
  • the light emitting layer 123 is formed by using the inkjet method. As described above, the light emitting layer 123 is formed corresponding to each of a plurality of colors (for example, three colors R, G, and B) reproduced by the organic EL light emitting panel.
  • the arrangement of the light emitting layer 123 corresponding to each color on the substrate 100 is defined in advance, and the formation is performed according to the arrangement.
  • the formation order and arrangement of the light emitting layer 123 corresponding to each color are not particularly limited, and any setting may be used.
  • the control device 50 laminates and forms the electron transport layer 124 on the light emitting layer 123.
  • the electron transport layer 124 can be formed by using a vacuum vapor deposition method or the like.
  • the ink ejection amount measuring and adjusting device described above ejects each nozzle of the ink ejection head 23 by the method shown in FIG. 6 in the same manner as in each step of S1303 to S1305. It is preferable to carry out the amount adjusting step (S606).
  • control device 50 laminates and forms the counter electrode 125 so as to cover the electron transport layer 124 as a solid film.
  • the counter electrode 125 can be formed by using a CVD method, a sputtering method, or the like.
  • control device 50 laminates and forms the sealing layer 126 so as to cover the counter electrode 125 as a solid film.
  • the sealing layer 126 can be formed by using a CVD method, a sputtering method, or the like.
  • the control device 50 forms the color filter substrate 131.
  • a transparent upper substrate 130 is prepared.
  • the material of the color filter layer 128 (for example, G) containing the ultraviolet curable resin component as a main component is dispersed in a solvent, a paste is applied, the solvent is removed to a certain extent, and then a predetermined pattern is obtained. Place the mask and irradiate with ultraviolet rays. Then, curing is performed to remove the pattern mask and the uncured paste and developed to form a color filter layer (G).
  • the color filter layers (R) and (B) are formed.
  • a commercially available color filter product may be used.
  • the color filter substrate 131 may be formed in advance, and the formed color filter substrate 131 may only be installed in this step.
  • the control device 50 attaches the color filter substrate 131 and the back panel to each other.
  • the material of the bonding layer 127 containing an ultraviolet curable resin such as an acrylic resin, a silicone resin, and an epoxy resin as a main component is applied to a back panel composed of each layer from the substrate 100 to the sealing layer 126.
  • the applied material is irradiated with ultraviolet rays, and both substrates are bonded together in a state where the relative positional relationship between the back panel and the color filter substrate 131 is matched.
  • the bonding is performed so that gas does not enter between the two.
  • both substrates are fired to complete the sealing step, thereby completing the display panel D.
  • the panel manufacturing process is completed.
  • the inkjet method is used when forming the three layers of the light emitting layer 123, the hole injection layer 120, and the hole transport layer 121, and the ink ejection amount measurement adjusting device described above is used at that time.
  • the ink ejection amount according to the present embodiment is measured and adjusted by the method shown in FIG.
  • the configuration is not limited to these layers, and may be applied to at least one layer constituting the display panel D. Therefore, when the inkjet method can be used when forming other layers, the method for measuring and adjusting the ink ejection amount according to the present embodiment may be applied when forming those layers.
  • FIG. 14A is a table diagram summarizing the composition of each composition.
  • these functional materials are dissolved in an organic solvent so that the organic solvent having a boiling point of 250 ° C. or higher (here, diethylhexyl benzoate) is 2.0% by weight based on the entire composition 2.
  • organic solvent having a boiling point of 250 ° C. or higher here, diethylhexyl benzoate
  • composition 4 of the ink the functional polymer compound having the repeating structure of the above chemical formula P1 and the electron-accepting compound 4-isopropyl-4'-methyldiphenyliodonium tetrakis are used as the charge transporting material which is the functional material.
  • a mixture of (pentafluorophenyl) borate and a 5: 1 ratio is used.
  • these functional materials (solutes) are dissolved in an organic solvent so that the organic solvent having a boiling point of 250 ° C. or higher (here, benzyl benzoate) is 2.0% by weight based on the entire composition 4.
  • evaluation 1 First, as evaluation 1 in this verification, changes in the diameter and volume of the ink droplets are observed.
  • the base material B1 used at the time of measurement a base material obtained by uniformly applying a general polyimide-based photoresist as a liquid-repellent coating material on a glass substrate is used. Further, the surface of the polyimide cured film of this base material was surface-treated by the CVD method using CF4 gas so that the contact angle with the anisole was 50 degrees.
  • evaluation 1 the measurement was performed according to the following flow. Ink droplets of each composition are ejected onto the base material B1. Then, the ink droplet K is photographed at each of the natural drying (10 minutes) and the natural drying (30 minutes). Then, the diameter of the ink droplet K is derived from the captured image, and the remaining volume of the ink droplet K is derived from the diameter. The values obtained as a result of this measurement are shown in FIG. 14B.
  • FIG. 14B shows the volume of the residual ink droplets derived from the diameter of the ink droplet K derived from the image of each composition and the rate of change thereof. From the results shown in FIG. 14B, a predetermined time (here, 10 minutes) has elapsed for the inks (compositions 1 to 3) having an organic solvent having a boiling point of 250 ° C. or higher in an amount of 20% by weight or more based on the whole ink. After that, it was found that the rate of change in volume was small and the liquid volume was stable. On the other hand, the ink used as a comparative example (comparative composition 1) was solidified by natural drying for 10 minutes.
  • a predetermined time here, 10 minutes
  • evaluation 2 in this verification will be described. Based on the result of evaluation 1, the ejection amount of the ink ejection head 23 was adjusted, the ink was applied in a predetermined coating region, and the ink was dried under reduced pressure, and then the film thickness of the dried coating film of the functional layer was measured. ..
  • the base material B2 used here is the polyimide-based photoresist used in Evaluation 1 on the glass substrate, and after patterning so that the film thickness is 2 ⁇ m, the pixel width is 90 ⁇ m, and the bank width is 10 ⁇ m, the liquid repellent on the bank surface is subjected to the CVD method. The preparation was performed by adjusting the sex with anisole so that the contact angle was 50 degrees.
  • FIG. 15 is a schematic view showing a position where the film thickness is measured on the base material B2 in the evaluation 2.
  • evaluation 2 as shown by the arrow in FIG. 15, at the center position in the X direction in the ink application region (corresponding to the self-luminous region 100a in FIG. 11) of the base material B2, the end along the Y axis.
  • the film thickness from the part to the end was measured.
  • the measured length from one end to the other was set to 20 cm.
  • the target value of the film thickness of the functional layer after drying was set to 60 nm.
  • FIG. 16 shows the measurement result of evaluation 2 in this verification.
  • the comparative composition 1 since the droplet diameter could not be measured in the evaluation 1 as shown in FIG. 14B, the discharge amount could not be adjusted and the evaluation 2 was not carried out.
  • the vertical axis indicates the film thickness [nm] of the formed layer
  • the horizontal axis indicates the position [cm] of the formed layer.
  • the measurement position of the film thickness is in the range of 20 cm from the end to the end.
  • the film thickness variation of the formed functional layer was small, and the level was suitable for the production of the display panel D. ..
  • the discharge amount of the comparative composition 2 cannot be adjusted well, and that a uniform film thickness cannot be formed due to the variation in the film thickness at the coated end due to drying and the lack of fluidity. did it.
  • FIG. 17 shows the change in the diameter of the ink droplet K derived from the image of the composition 4. From the results shown in FIG. 17, even if an organic solvent having a boiling point of 250 ° C. or higher is used in an organic solvent having a boiling point of 20% by weight or more with respect to the entire ink and a solvent having a boiling point of less than 250 ° C. is used as the boiling point of 238.9 ° C. or lower.
  • the rate of change in the droplet diameter is small after 5 minutes, and then the rate of change in the droplet diameter is small and stable until 30 minutes after natural drying. Since the droplet K is small after being air-dried for 30 minutes and then heat-dried to remove the organic solvent, the organic solvent having a boiling point of 250 ° C. or higher is stably present in the air-dried 30 minutes. I understand.
  • the organic solvent having a boiling point of 250 ° C. or higher does not evaporate and dry in an environment at room temperature, there is almost no change in the amount, and the droplet diameter can be measured without requiring a special device. .. Further, by containing an organic solvent having a boiling point of 250 ° C. or higher, the fluidity of the ink can be ensured in the organic EL display panel having a row-shaped bank, and the film thickness variation can be suppressed.
  • the ejection amount of the ink droplets can be derived in a short time without the need for a step of measuring the ink droplets that change with the passage of time each time. Then, based on the derived ejection amount, the droplet ejection amount for each ink ejection head nozzle can be easily made uniform. Therefore, it is possible to suppress a decrease in the production efficiency of the inkjet device due to the measurement of the ejection amount of the droplets. Further, in the present embodiment, since a large-scale equipment is not required for the droplet observation, the equipment cost can be reduced.
  • nozzle ejection defects such as nozzle omission of droplets and flight bending.
  • the ink according to the present invention can also reduce coating unevenness due to natural drying or the like when forming a pixel pattern on the substrate after adjusting the ejection amount.
  • one or more programs or applications for realizing the functions of one or more embodiments described above are supplied to a system or device using a network or a storage medium, and the system or device is used in a computer. It can also be realized by the process of reading and executing the program by the processor of.
  • circuit for example, ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array) that realizes one or more functions.
  • ASIC Application Specific Integrated Circuit
  • FPGA Field Programmable Gate Array
  • the present invention is not limited to the above-described embodiment, and can be modified or applied by those skilled in the art based on the mutual combination of the configurations of the embodiments, the description of the specification, and the well-known technique. It is also a matter of the present invention to do so, and it is included in the scope of seeking protection.
  • the method for measuring the amount of ink ejected according to the present invention, the organic EL display panel manufacturing apparatus, the ink, and the organic EL display panel manufactured using the ink are devices such as television sets, personal computers, mobile phones, and displays. It can be widely used for manufacturing display panels and the like in various electronic devices having panels. Further, it can be widely used for manufacturing electronic devices including a step of forming a functional layer by using an ink coating step.
  • Ink-axis device 10 ... X-axis table 11 ... Y-axis table 12 ... X-axis guide rail 13 ... Y-axis guide rail 20 ... Carriage unit 21 ... Carriage support 22 ... Carriage 23 ... Ink ejection head 30 ... Camera unit 31 ... Camera 32 ... Camera support 40 ... Stage 41 ... Stage rotation mechanism 42 ... X-axis slider 50 ... Control device 100 ... Substrate 119 ... Pixel electrode 120 ... Hole injection layer 121 ... Hole transport layer 122 ... Bank 123 ... Light emitting layer 124 ... Electron transport layer 125 ... Opposite electrode 126 ... Sealing layer 127 ... Bonding layer 128 ...
  • Color filter layer 130 ... Upper substrate 131 ... Color filter substrate 201 ... Nozzle hole 202 ... Ink droplet B ... Base material B1 ... Base material (discharge) For measuring quantity) B2 ... Substrate (for pattern formation) K ... Ink droplets

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Abstract

L'invention concerne un procédé de mesure/ajustement comprenant au moins un procédé de mesure pour mesurer la quantité d'encre éjectée à partir d'une tête d'éjection d'encre, où, dans ledit procédé de mesure, l'encre est éjectée à partir de la tête d'éjection d'encre sur un substrat, une image de l'encre qui a été éjectée sur le substrat est acquise, la quantité d'encre éjectée par la tête d'éjection d'encre est déduite sur la base d'informations obtenues à partir de l'image et l'encre qui a été éjectée sur le substrat est maintenue, après l'écoulement d'une période de temps prescrite depuis l'éjection à partir de la tête d'éjection d'encre, en une quantité qui est une proportion constante de la quantité d'encre qui a été éjectée à partir de la tête d'éjection d'encre.
PCT/JP2021/044590 2020-12-07 2021-12-03 Procédé de mesure/ajustement de quantité d'éjection d'encre, dispositif de mesure/ajustement de quantité d'éjection d'encre, système de fabrication de panneau pour panneau d'affichage électroluminescent organique, procédé de fabrication de panneau d'affichage électroluminescent organique, encre, et panneau d'affichage électroluminescent organique fabriqué utilisant de l'encre WO2022124242A1 (fr)

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JP2022568251A JPWO2022124242A1 (fr) 2020-12-07 2021-12-03
CN202180081773.5A CN116615289A (zh) 2020-12-07 2021-12-03 油墨的喷出量的测定调整方法、油墨喷出量测定调整装置、有机el显示面板的面板制造系统、有机el显示面板的制造方法、油墨和使用油墨而制造的有机el显示面板
KR1020237018687A KR20230117124A (ko) 2020-12-07 2021-12-03 잉크의 토출량의 측정 조정 방법, 잉크 토출량 측정 조정 장치, 유기 el 표시 패널의 패널 제조 시스템, 유기 el 표시 패널의 제조 방법, 잉크, 및 잉크를 사용하여 제조되는 유기 el 표시 패널

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