WO2022123936A1 - バイポーラ電極、及びバイポーラ型蓄電池 - Google Patents

バイポーラ電極、及びバイポーラ型蓄電池 Download PDF

Info

Publication number
WO2022123936A1
WO2022123936A1 PCT/JP2021/039487 JP2021039487W WO2022123936A1 WO 2022123936 A1 WO2022123936 A1 WO 2022123936A1 JP 2021039487 W JP2021039487 W JP 2021039487W WO 2022123936 A1 WO2022123936 A1 WO 2022123936A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
bipolar
adhesive
electrode according
bipolar electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/039487
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
康雄 中島
広樹 田中
健一 須山
彰 田中
芳延 平
憲治 廣田
智史 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Furukawa Battery Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Furukawa Battery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Furukawa Battery Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2022568094A priority Critical patent/JPWO2022123936A1/ja
Publication of WO2022123936A1 publication Critical patent/WO2022123936A1/ja
Priority to US18/330,681 priority patent/US20230317921A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/14—Electrodes for lead-acid accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/06—Lead-acid accumulators
    • H01M10/12—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/06—Lead-acid accumulators
    • H01M10/18—Lead-acid accumulators with bipolar electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/528—Fixed electrical connections, i.e. not intended for disconnection
    • H01M50/529—Intercell connections through partitions, e.g. in a battery casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
    • H01M2004/029—Bipolar electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention is a technique relating to a bipolar storage battery.
  • bipolar lead-acid battery a plurality of bipolar electrodes having a positive electrode formed on one surface of a substrate (bipolar plate) and a negative electrode formed on the other surface are laminated via an electrolytic layer.
  • the patent document 1 has a double-sided adhesive member arranged so as to surround the periphery of a single battery layer including an adjacent positive electrode active material layer, a gel electrolyte layer, and a negative electrode active material layer, and has double-sided adhesiveness.
  • the member is composed of an insulating material that acts as a base material and an adhesive provided on both sides of the insulating material, and is sandwiched between two current collectors together with the unit cell layer and the two adhesives.
  • a substrate (bipolar plate) made of resin is attached to the inside of a frame (rim) made of resin forming a frame shape.
  • a lead layer for a positive electrode and a lead layer for a negative electrode are arranged on one surface and the other surface of the substrate.
  • the lead layer for the positive electrode and the lead layer for the negative electrode are directly bonded inside a plurality of through holes formed in the substrate. That is, Patent Document 2 describes a bipolar lead storage battery in which a plurality of substrates (bipolar plates) having through holes for communicating one side and the other side and cell members are alternately laminated, and the cell member is a cell member.
  • It has a positive electrode in which a positive electrode active material layer is provided in a positive electrode lead layer, a negative electrode in which a negative electrode active material layer is provided in a negative electrode lead layer, and an electrolytic layer interposed between the positive electrode and the negative electrode.
  • the positive electrode lead layer of one cell member and the negative electrode lead layer of the other cell member are immersed in the through holes (communication holes) of the substrate and joined to each other, so that the cell members are connected in series. Things are listed.
  • a lead layer (lead foil) constituting a positive electrode and a negative electrode is bonded to one surface and the other surface of a substrate, respectively, with a liquid adhesive to cure the liquid adhesive.
  • the lead layer is completely fixed to the surface of the substrate by the adhesive layer.
  • the adhesive applied to the surface of the substrate when the lead layers are bonded is applied to the surface of the substrate.
  • the through hole may be invaded and the through hole may be contaminated with the adhesive by spreading along the above.
  • the more the adhesive area and the adhesive strength are to be obtained between the substrate and the lead foil, the easier it is for the adhesive to flow into the through holes.
  • the adhesive in the vicinity of the through hole becomes fluid due to the heat during resistance welding for conducting the positive electrode and the negative electrode, and the adhesive layer becomes fluid.
  • the fluidized adhesive may also penetrate the through holes.
  • the present invention has been made by paying attention to the above points, and by suppressing the intrusion of the adhesive into the through hole (conduction region) for conduction formed in the substrate (bipolar plate), the lead for the positive electrode is used.
  • the purpose is to improve the reliability of bonding between the layer and the lead layer for the negative electrode.
  • the bipolar electrode of one aspect of the present invention includes a bipolar plate having a through hole for conduction, a positive electrode bonded to one surface of the bipolar plate by an adhesive layer, and the bipolar plate.
  • a bipolar electrode for a bipolar storage battery comprising a negative electrode bonded to the other surface by an adhesive layer, wherein the bipolar plate has a fluid to the through hole on one surface and the other surface. It has an intrusion avoidance structure including at least one of a concave structure and a convex structure that prevents intrusion.
  • the aspect of the present invention is a bipolar storage battery provided with the bipolar electrode of the above aspect.
  • the adhesive constituting the adhesive layer is prevented from flowing (invading) into the through hole for conduction by the intrusion avoidance structure formed on the outer periphery of the through hole.
  • the aspect of the present invention for example, an increase in electrical resistance between the lead layer for the positive electrode and the lead layer for the negative electrode due to the intrusion of the adhesive into the through hole is prevented, and the positive electrode is prevented from increasing through the through hole. It is possible to improve the reliability of the bonding between the lead layer for the lead layer and the lead layer for the negative electrode.
  • the liquid adhesive is cured in the adhesive layer.
  • the adhesive easily penetrates into the through hole for conduction, but the intrusion of the adhesive into the through hole can be prevented by the intrusion avoidance structure.
  • the adhesive may interfere with the welding of the conductive portion and increase the electric resistance between the lead layers.
  • the conductive portion formed in the through hole is not contaminated, so that the reliability when welding the conductive portion is improved. As a result, it is possible to achieve both long-term reliability and high energy density for the bipolar storage battery provided with the bipolar electrode according to the embodiment of the present invention.
  • the intrusion avoidance structure includes, for example, an overhanging portion (convex structure) surrounding the outer periphery of the through hole.
  • an overhanging portion convex structure
  • the intrusion avoidance structure includes, for example, an overhanging portion (convex structure) surrounding the outer periphery of the through hole.
  • the region forming the overhanging portion is defined as a region within 10 mm from the through hole surrounding the outer periphery of the overhanging portion. According to this configuration, the region forming the overhanging portion can be limited. As a result, a sufficient fixed area between the bipolar plate and the lead layer can be secured.
  • the height of the overhanging portion is equal to or higher than the thickness of the adhesive layer. According to this configuration, the height of the overhanging portion becomes equal to or larger than the thickness of the adhesive layer, and it is possible to more reliably prevent the adhesive from entering the through hole.
  • the height of the overhanging portion is 20 ⁇ m or more and 500 ⁇ m or less. According to this configuration, it is possible to suppress the amount of protrusion of the overhanging portion to the lead layer side with respect to the adhesive layer while preventing the adhesive from entering the through hole by the overhanging portion. As a result, it is possible to suppress the load on the lead layer due to the overhanging portion.
  • the overhanging portion is integrally formed with the bipolar plate. According to this configuration, the overhanging portion can be formed when the bipolar plate is manufactured. The overhanging portion is a separate part from the bipolar plate, and is adhered to the surface of the bipolar plate. According to this configuration, the overhanging portion is positioned only by being adhered, and the overhanging portion can be easily formed.
  • the overhanging portion is an adhesive seal having an adhesive layer on at least the surface on the bipolar plate side. According to this configuration, the overhanging portion is positioned only by being adhered with the adhesive layer, and the overhanging portion can be easily formed.
  • the overhanging portion is made of a liquid gasket. According to this configuration, the overhanging portion is positioned only by applying the liquid gasket, and the overhanging portion can be easily formed.
  • the intrusion avoidance structure includes, for example, a groove portion (concave structure) formed on the outer periphery of the through hole.
  • the adhesive constituting the adhesive layer is prevented from flowing (invading) into the through hole for conduction by the groove formed in the bipolar plate.
  • an increase in electrical resistance between the lead layer for the positive electrode and the lead layer for the negative electrode due to the intrusion of the adhesive into the through hole is prevented, and lead for the positive electrode through the through hole is prevented. It is possible to improve the reliability of the bonding between the layer and the lead layer for the negative electrode.
  • the applied adhesive is formed in the groove before flowing into the through hole. It flows in.
  • the applied adhesive prevents the through holes from being contaminated.
  • the adhesive layer in the vicinity of the through hole flows by resistance welding for joining the lead layer for the positive electrode and the lead layer for the negative electrode through the through hole.
  • the groove portion has a groove portion continuously formed so as to surround the outer periphery of the through hole. According to this configuration, the adhesive from the entire circumference into the through hole first flows into the groove portion, so that the adhesive can be more reliably prevented from entering the through hole from the entire circumference.
  • As the groove portion there is a groove portion intermittently formed so as to surround the circumference of the through hole. According to this configuration, by having a portion that does not form a groove between the grooves, the rigidity of the bipolar plate of the portion where the groove is provided can be set to be higher by that amount. Therefore, the groove can be formed deeply. As a result, it becomes possible to arrange the groove portion on the entire circumference in the circumferential direction of the through hole while increasing the capacity of the groove portion.
  • the intermittently formed groove penetrates the bipolar plate.
  • the groove portion can be formed deeply, and as a result, the capacity of the groove portion becomes large. Therefore, it is possible to set a large amount of the adhesive that can flow into the groove portion.
  • the groove portion has a depth of 0.3 mm or more and a width of 1 mm or more and 10 mm or less along the direction away from the through hole.
  • the region where the groove is formed is a limited range of 10 mm or less from the through hole.
  • it is possible to sufficiently secure a fixed area by the adhesive layer between the bipolar plate and the lead layer.
  • it has an overhang on the surface of the bipolar plate in the region. According to this configuration, by forming the overhanging portion together with the groove portion, it is possible to prevent the adhesive from moving to the through hole even by the overhanging portion.
  • the intrusion avoidance structure includes, for example, a bank component (convex structure) formed on the outer periphery of the through hole.
  • the adhesive constituting the adhesive layer is prevented from flowing (invading) into the through hole for conduction by the embankment component surrounding the through hole.
  • an increase in electrical resistance between the lead layer for the positive electrode and the lead layer for the negative electrode due to the intrusion of the adhesive into the through hole is prevented, and lead for the positive electrode through the through hole is prevented. It is possible to improve the reliability of the bonding between the layer and the lead layer for the negative electrode.
  • the through hole is contaminated with the applied adhesive. To prevent. Further, even after the lead layer is attached to the surface of the bipolar plate by the adhesive layer, the adhesive layer near the through hole flows by resistance welding for joining the lead layer for the positive electrode and the lead layer for the negative electrode through the through hole. Although there is a risk of contaminating the through hole, heat transfer to the adhesive layer near the through hole is relaxed by the bank parts protruding from the surface of the substrate, and the adhesive layer in a fluid state becomes the through hole. It is avoided to flow in and contaminate.
  • a recess for positioning the embankment component is formed on the surface of the bipolar plate on which the embankment component is placed.
  • the position of the placed embankment part is restricted by describing the movement of the embankment part in the left-right direction by the concave portion.
  • the embankment parts are composed of elastic bodies such as rubber materials. According to this configuration, when a load from the bonded lead layer (lead foil) is applied to the embankment part, the elastic body is deformed to reduce the load applied to the lead layer from the embankment part. The lead layer is less likely to be damaged.
  • the area on which the embankment parts are placed shall be an area within 10 mm from the through hole surrounding the outer periphery of the embankment parts. According to this configuration, the area for forming the embankment component can be limited. As a result, a sufficient fixed area between the bipolar plate and the lead layer can be secured. Further, the liquid adhesive is cured in the adhesive layer. According to this configuration, when the lead layer is attached to the bipolar plate, the adhesive easily penetrates into the through hole for conduction, but the intrusion of the adhesive into the through hole can be prevented by the bank component.
  • the height of the bank component is equal to or greater than the thickness of the adhesive layer. According to this configuration, the height of the bank component becomes equal to or larger than the thickness of the adhesive layer, and it is possible to more reliably prevent the adhesive from entering the through hole.
  • the height of the embankment parts is 20 ⁇ m or more and 500 ⁇ m or less. According to this configuration, it is possible to prevent the adhesive from entering the through hole by the embankment part, and to suppress the overhanging height of the embankment part on the lead layer side with respect to the adhesive layer. As a result, it is possible to suppress the load on the lead layer due to the embankment parts.
  • the bipolar electrode of the present disclosure is suitable as a bipolar electrode for a bipolar lead-acid battery. It is a bipolar type storage battery provided with the above-mentioned bipolar electrode. According to this configuration, it is possible to provide a bipolar storage battery capable of achieving both long-term reliability and high energy density due to the above-mentioned effects.
  • FIG. 9 is a cross-sectional view taken along the line XX'in FIG. 9 for explaining an example of a joint structure of a lead layer for a positive electrode and a lead layer for a negative electrode through a through hole. It is sectional drawing explaining another example of a groove part. It is sectional drawing explaining another example of a groove part. It is sectional drawing explaining another example of a groove part. It is sectional drawing explaining another example of a groove part. It is sectional drawing explaining another example of a groove part. It is sectional drawing explaining another example of a groove part. It is a top view explaining the substrate (bipolar plate) which concerns on embodiment based on this invention.
  • FIG. 16 is a cross-sectional view taken along the line XX'in FIG. 16 for explaining an example of a joint structure of a lead layer for a positive electrode and a lead layer for a negative electrode through a through hole. It is sectional drawing explaining another example of the bonding structure of the lead layer for a positive electrode and the lead layer for a negative electrode through a through hole. It is sectional drawing explaining another example of the bonding structure of the lead layer for a positive electrode and the lead layer for a negative electrode through a through hole. It is sectional drawing explaining another example of the bonding structure of the lead layer for a positive electrode and the lead layer for a negative electrode through a through hole. It is sectional drawing explaining another example of a bank part.
  • the present invention is not limited to the following embodiment as it is, and can be embodied by an appropriate combination or modification as long as it does not deviate from the gist thereof, and a form to which such a change or improvement is added is also the present invention. Can be included in.
  • a bipolar lead-acid battery will be described as an example of the bipolar lead-acid battery, but the present disclosure is applicable to a bipolar storage battery other than the bipolar lead-acid battery.
  • the first embodiment is an example in which the intrusion avoidance structure is composed of an overhanging portion (convex structure).
  • the structure of the bipolar lead-acid battery 1 of the present embodiment will be described with reference to FIG.
  • the bipolar lead-acid battery 1 shown in FIG. 1 is configured by stacking a plurality of bipolar electrodes 130 in the thickness direction via an electrolytic layer 20. Electrolyte layers 20 are separately laminated on both ends of the laminated bipolar electrode group in the stacking direction. Then, the electrolytic layer 20 arranged at the left end in FIG. 1 is electrically connected to the negative electrode terminal 107 via the negative electrode 110, and the electrolytic layer 20 arranged at the right end in FIG. 1 is connected via the positive electrode 120.
  • Reference numeral 31 is an adhesive layer for attaching the negative electrode 110 and the positive electrode 120 on the end side in the stacking direction to the main body portion (end plate) 11A of the outer frame 11.
  • the outer frame 11 includes a plate-shaped main body portion 11A and a rising portion (rim) 11B rising from the entire outer peripheral portion of the main body portion 11A.
  • one cell member is composed of the electrolytic layer 20 and the positive electrode 120 and the negative electrode 110 facing each other with the electrolytic layer 20 interposed therebetween.
  • a bipolar lead-acid battery having two bipolar electrodes 130 and three cell members is shown. The number of cell members and the number of stacks of the number of bipolar electrodes 130 are set according to the required storage capacity of the bipolar lead-acid battery 1.
  • the bipolar electrode 130 shown in FIG. 1 includes an internal frame 12, a positive electrode 120, and a negative electrode 110.
  • the internal frame 12 of the present embodiment is integrally connected to a flat plate-shaped substrate (bipolar plate) 12A having electrodes on both sides thereof, and the entire circumference of the outer peripheral portion of the substrate 12A. It is composed of a frame member (rim) 12B.
  • the frame member 12B rises from both sides of the substrate 12A in the thickness direction of the substrate 12A, respectively.
  • the inner frame 12 and the outer frame 11 are made of, for example, a thermoplastic resin.
  • thermoplastic resin examples include acrylonitrile-butadiene-styrene copolymer (ABS resin) and polypropylene. These thermoplastic resins have excellent moldability and sulfuric acid resistance. Therefore, even if the electrolytic solution comes into contact with the substrate 12A, decomposition, deterioration, corrosion, etc. are unlikely to occur on the substrate 12A.
  • each frame member 12B of the inner frame 12 together with a pair of outer frames 11 arranged on both ends in the stacking direction constitutes a skeleton of a battery 1 accommodating a plurality of bipolar electrodes 130 and the like. Then, the space formed between the adjacent inner frames 12 and the space formed between the adjacent inner frames 12 and the outer frame 11 each form a chamber (cell) for accommodating the cell member.
  • a positive electrode 120 is bonded to one surface 12Aa of the substrate 12A by an adhesive layer 30.
  • the positive electrode 120 includes a lead layer 101 for a positive electrode and an active material layer 103 for a positive electrode arranged on the lead layer 101 for a positive electrode.
  • the lead layer 101 for the positive electrode is made of lead or a lead alloy, and has, for example, a foil shape (lead foil).
  • the lead layer 101 for the positive electrode is adhered to one surface 12Aa of the substrate 12A with an adhesive.
  • a negative electrode 110 is bonded to the other surface 12Ab of the substrate 12A by an adhesive layer 30.
  • the negative electrode 110 includes a lead layer 102 for a negative electrode and an active material layer 104 for a negative electrode arranged on the lead layer 102 for a negative electrode.
  • the lead layer 102 for the negative electrode is made of lead or a lead alloy, and has, for example, a foil shape (lead foil).
  • the lead layer 102 for the negative electrode is adhered to the other surface 12Ab of the substrate 12A with an adhesive.
  • a plurality of through holes 12a for conduction are formed in the substrate 12A in order to conduct (electrically join) the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode.
  • FIG. 2 illustrates a case where the cross-sectional shape of the through hole 12a is circular, but the cross-sectional shape of the through hole 12a is not particularly limited, such as a polygonal shape.
  • ⁇ Overhanging part 12C> an endless annular tension that continuously surrounds the outer periphery of the opening of each through hole 12a as shown in FIGS. 2 and 3, respectively, on one surface 12Aa and the other surface 12Ab of the substrate 12A.
  • the protrusion 12C is formed.
  • the overhanging portion 12C constitutes an intrusion avoidance structure for preventing the intrusion of fluid from the outer periphery into the through hole.
  • the shape of the endless annular overhanging portion 12C does not have to be concentric with the through hole 12a.
  • the shape of the endless annular overhanging portion 12C in a plan view may be rectangular or the like.
  • the shape of the overhanging portion 12C is preferably a continuous arc shape such as a circle or an ellipse in a plan view.
  • the adhesive layer 30 is not formed on the overhanging portion 12C. In the present embodiment, it is assumed that the adhesive layer 30 is formed by applying a liquid adhesive to the surface of the substrate 12A excluding the overhanging portion 12C. Then, the liquid adhesive is cured to form the adhesive layer 30.
  • the overhanging portion 12C is a through hole surrounding the outer periphery as shown in FIG. 2 in a plan view. It is preferable that the area D from the open end of 12a is formed in the region ARA within 10 mm.
  • the region ARA is more preferably a region ARA within 5 mm from the end of the opening.
  • the liquid adhesive applied to the surface of the substrate 12A may flow along the surface of the substrate 12A and invade the through hole 12a when the lead layers 101 and 102 are bonded together.
  • the more the adhesive area and the adhesive strength between the surface of the substrate 12A and each lead layer are to be obtained the larger the amount of the adhesive to be applied and the easier it is for the adhesive to penetrate into the through hole 12a.
  • an endless annular overhanging portion 12C is formed around each through hole 12a. Therefore, the adhesive that has flowed toward the through hole 12a is less likely to flow toward the through hole 12a due to the step caused by the overhanging portion 12C, and easily flows in the other direction. This makes it possible to reduce the amount of adhesive that penetrates into the through hole 12a.
  • the height H of the overhanging portion 12C is preferably equal to or greater than the thickness of the adhesive layer 30.
  • the height H of the overhanging portion 12C is set to a range of 20 ⁇ m or more and 500 ⁇ m or less. This is because the thickness of the adhesive layer 30 is, for example, about 20 ⁇ m to 30 ⁇ m.
  • the height H of the overhanging portion 12C is equal to or greater than the thickness of the adhesive layer 30, the adhesive flowing toward the through hole 12a is prevented from flowing to the through hole 12a side by the overhanging portion 12C. It is possible to prevent the adhesive from entering the through hole 12a.
  • the conduction between the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode is executed by, for example, resistance welding.
  • the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode are connected to each other through the through hole 12a. It is electrically joined.
  • reference numeral W indicates a welded portion thereof.
  • the vicinity of the through hole 12a is also heated by the welding heat, but the overhanging portion 12C relaxes the heating to the adhesive layer 30 near the through hole 12a, and the heat causes the vicinity of the through hole 12a to be heated.
  • the endless annular overhanging portion 12C can prevent the adhesive having fluidity from flowing into the through hole 12a.
  • the height H of the overhanging portion 12C is preferably, for example, 500 ⁇ m or less. More preferably, the height H of the overhanging portion 12C has a difference of 50 ⁇ m or less from the height of the adhesive layer 30 and further 20 ⁇ m or less.
  • the thickness of the lead layer is 70 ⁇ m or more, and the difference between the height H of the overhanging portion 12C and the height of the adhesive layer 30 is preferably less than the thickness of the lead layer.
  • the width D0 of the overhanging portion 12C is, for example, in the range of 1 mm or more and 10 mm or less. Considering that the overhanging portion 12C is integrally formed with the substrate 12A by injection molding, it is estimated that the lower limit is 1 mm in width. Further, since the overhanging portion 12C is formed within the range of 10 mm, the maximum value of the width D0 of the overhanging portion 12C is 10 mm. In FIG. 3, the surface of the through hole 12a and the inner peripheral surface of the overhanging portion 12C are formed flush with each other, but the present invention is not limited to this.
  • the position of the inner peripheral surface of the overhanging portion 12C may be arranged at a position distant from the opening end of the through hole 12a in the outer diameter direction. Further, the position of the inner peripheral surface of the overhanging portion 12C may be arranged so as to be located inside the opening end of the through hole 12a.
  • the adhesive layer 30 is formed between the substrate 12A and the lead layers 101 and 102.
  • the adhesive used for the adhesive layers 30 and 31 preferably has sulfuric acid resistance.
  • an epoxy-based adhesive can be exemplified.
  • the epoxy adhesive uses an epoxy resin as a main component, and an acid or a basic curing agent can be used as the curing agent.
  • the epoxy resin contained in the main agent include, but are not limited to, bisphenol A type epoxy resin and bisphenol F type epoxy resin.
  • the electrolytic layer 20 is composed of, for example, a glass fiber mat impregnated with an electrolytic solution containing sulfuric acid.
  • the overhanging portion 40 is formed separately from the substrate 12A, and covers the entire outer circumference of the through hole 12a before attaching the lead layers 101 and 102 to the substrate 12A with an adhesive.
  • the overhanging portion 40 may be adhered to the surface of the substrate 12A.
  • the overhanging portion 40 is composed of an adhesive seal having an adhesive layer on at least one side. Then, the adhesive seal is adhered to the substrate 12A by adhesion to form an overhanging portion 40.
  • the adhesive seal may have adhesive layers on both sides. In this case, the adhesive seal also adheres to the surfaces of the lead layers 101 and 102, and the adhesive seal also has a role of fixing the lead layer to the substrate 12A.
  • the adhesive seal is composed of a base material and an adhesive layer.
  • the base material include, but are not limited to, polyester, polyolefin, polyimide film, and fluororesin (Teflon (registered trademark)) film.
  • the material of the adhesive layer for example, a rubber-based, acrylic-based, or silicone-based adhesive can be used.
  • the adhesive seal is not limited to this, and other known adhesive seals may be adopted.
  • the adhesive seal may be attached to the substrate 12A, for example, after the adhesive seal is attached so as to cover the through hole 12a, the portion overlapping the through hole 12a may be hollowed out to form the overhanging portion 40. Further, as shown in FIG.
  • the overhanging portion 41 may be configured by covering the outer periphery of the through hole 12a with a liquid gasket. It is preferable to form a recess on the surface of the substrate 12A on which the liquid gasket is formed so that the liquid gasket can be easily arranged.
  • the corner portion 12Ca of the overhanging portion 12C may be rounded into an arc shape so as to give a curvature, or as shown in FIG. 7, the side surface 12Cb of the overhanging portion 12C may be inclined. It may be attached so that the angle of the corner portion is obtuse.
  • the top of the overhanging portion 12C itself may have an arcuate cross section (see FIG. 8).
  • the cross-sectional shape of the overhanging portion 12C is not particularly limited. In the case of this modification, it is possible to reduce the load on the lead layer to be attached by the overhanging portion 12C.
  • FIG. 8 illustrates a case where two overhanging portions 12C are formed.
  • the adhesive may flow to the through hole 12a side beyond the overhanging portion 12C on the outer peripheral side, it is trapped in the recess 12d between the two overhanging portions 12C and moves to the through hole 12a side. Prevents the adhesive from flowing in.
  • the plurality of overhanging portions 12C do not have to have similar shapes in a plan view, and the centers of the overhanging portions 12C do not have to coincide.
  • a case where the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode are directly joined via the through hole 12a for conduction is taken as an example.
  • a columnar conductor (not shown) may be arranged in the through hole 12a, and the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode may be electrically bonded via the conductor.
  • ⁇ Groove 212C> an endless annular groove portion that continuously surrounds the outer periphery of the opening of each through hole 12a on one surface 12Aa and the other surface 12Ab of the substrate 12A, respectively, as shown in FIGS. 9 and 10, respectively. 212C is formed.
  • the shape of the endless annular groove portion 212C does not have to be concentric with the through hole 12a.
  • the shape of the endless annular groove portion 212C in a plan view may be rectangular or the like. However, from the viewpoint of not forming the corners, the shape of the groove 212C is preferably a continuous arc such as a circle or an ellipse in a plan view.
  • the groove portion 212C has a through hole 12a surrounding the outer periphery as shown in FIG. 9 in a plan view. It is preferable to form the region ARA in which the distance D from the opening end is within 10 mm.
  • the region ARA is more preferably a region ARA within 5 mm from the end of the opening.
  • the liquid adhesive applied to the surface of the substrate 12A may flow along the surface of the substrate 12A and invade the through hole 12a when the lead layers 101 and 102 are bonded together.
  • the more the adhesive area and the adhesive strength between the surface of the substrate 12A and each lead layer are to be obtained the larger the amount of the adhesive to be applied and the easier it is for the adhesive to penetrate into the through hole 12a.
  • an endless annular groove portion 212C is formed around each through hole 12a. Therefore, the adhesive that has flowed toward the through hole 12a flows into the groove portion 212C and is captured, so that it becomes difficult for the adhesive to flow toward the through hole 12a. This makes it possible to reduce the amount of adhesive that penetrates into the through hole 12a.
  • the conduction between the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode is executed by, for example, resistance welding.
  • the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode are connected to each other through the through hole 12a. It is electrically joined.
  • reference numeral W indicates a welded portion thereof.
  • the welding heat also heats the vicinity of the through hole 12a, but the groove 212C alleviates the heating to the adhesive layer 30 near the through hole 12a, and the heat also heats the adhesive layer near the through hole 12a. Even if 30 is melted and has fluidity, in the present embodiment, the endless annular groove portion 212C can prevent the adhesive having fluidity from flowing into the through hole 12a.
  • the depth H (overhang amount) of the groove portion 212C is preferably 0.3 mm or more. From the viewpoint of preventing the adhesive from flowing into the through hole side, it is preferable that the groove 212C is deep. However, if it is made too deep, the thickness of the substrate is reduced and the substrate is easily bent. Therefore, it is preferable to secure the thickness of the substrate at the position where the groove 212C is formed to be 1 mm or more. For example, in the case where the thickness of the substrate 12A is t [mm] and the groove 212C is formed at the same position on both the upper and lower sides in a plan view as shown in FIG. 10, the upper limit of the depth of the groove 212C is set. , "(T-1) / 2" is preferable.
  • the upper limit of the depth of the groove portions 212C is, for example, "t-1". In some cases it can be done.
  • the width D0 in the direction (for example, the radial direction) along the direction away from the through hole of the groove portion 212C is, for example, in the range of 1 mm or more and 10 mm or less.
  • the groove portion 212C is integrally formed with the substrate 12A by injection molding, it is estimated that the lower limit is 1 mm in width.
  • the maximum value of the width D0 of the groove portion 212C is 10 mm. From the viewpoint of preventing the adhesive from flowing into the through hole, it is preferable that the width D0 of the groove portion 212C is wide.
  • the width D0 of the groove portion 212C is too wide, the laminated lead layers 101 and 102 may enter the groove and give a load due to unnecessary deformation to the lead layers 101 and 102. From this point of view, the maximum value of the width D0 of the groove portion 212C is 10 mm.
  • FIG. 11 illustrates a case where the groove portion 212C having two rows is formed.
  • the plurality of groove portions 212C do not have to have similar shapes in a plan view, and the centers of the respective groove portions 212C do not have to coincide with each other.
  • each groove portion 212C can be relatively narrowed. As a result, the amount of deformation of the attached lead layer in the groove portion 212C becomes small, and the load on the lead layer by the groove portion 212C becomes small.
  • the groove portion 212C is a groove portion 212C formed in an endless annular shape that continuously surrounds the outer periphery of the through hole without interruption
  • the structure of the groove portion is such that it surrounds the outer periphery of the through hole. It suffices if it is configured in, and is not limited to this.
  • the shape may be partially interrupted in a C-shape of the alphabet, or as shown in FIG. 12, the groove portions 212C formed at intervals so as to intermittently surround the through hole may be used.
  • the width in the direction away from the through hole can be set relatively wider than that of the continuously formed groove portion 212C.
  • the groove portion 212C formed intermittently may be formed so as to penetrate the substrate 12A.
  • the distance between the groove portions 212C adjacent to each other along the circumferential direction is preferably 1 mm or more in consideration of the rigidity of the substrate 12A.
  • the continuously formed groove portion 212C and the intermittently formed groove portion 212C may be used in combination.
  • the angle of the groove portion 212C is formed into an arc shape so as to give a curvature or the angle is obtuse, so that the degree of sharpness of the angle of the groove portion 212C is relaxed. Is preferable. This can reduce the load on the lead layer.
  • an overhanging portion 212E may be formed in the region ARA on the surface of the substrate together with the groove portion 212C.
  • the overhanging portion 212E it is possible to prevent the adhesive from moving to the through hole 12a side.
  • FIG. 14 is an example in which the overhanging portion 212E is formed between the groove portions 212C.
  • FIG. 15 is an example in which the overhanging portion 212E is formed on the through hole 12a side.
  • the relationship between the position of the overhanging portion 212E and the position of the groove portion 212C is not limited to FIGS. 14 and 15.
  • the overhanging portion 212E may be formed so as to continuously surround the outer periphery of the through hole 12a, or may be formed intermittently along the circumferential direction.
  • a case where the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode are directly joined via the through hole 12a for conduction is taken as an example.
  • a columnar conductor (not shown) may be arranged in the through hole 12a, and the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode may be electrically bonded via the conductor.
  • ⁇ Bank parts 340> an endless annular bank that continuously surrounds the outer periphery of the opening of each through hole 12a on one surface 12Aa and the other surface 12Ab of the substrate 12A, respectively, as shown in FIGS. 16 and 18, respectively.
  • the component 340 is placed and projects from the surface of the substrate 12A in the thickness direction of the substrate 12A.
  • the shape of the endless annular bank component 340 does not have to be concentric with the through hole 12a.
  • the shape of the endless annular bank component 340 in a plan view may be rectangular or the like. However, from the viewpoint of not forming the corners, the shape of the bank component 340 is preferably a continuous arc such as a circle or an ellipse in a plan view.
  • the adhesive layer 30 is not formed on the bank component 340.
  • recesses 312C are formed in one surface 12Aa and the other surface 12Ab of the substrate 12A along the mounting position of the embankment component 340, respectively. It is formed. Then, the embankment component 340 is positioned on the recess 312C by placing the embankment component 340 on the recess 312C.
  • the recess 312C preferably has a concave shape into which the bank component 340 can be fitted, from the viewpoint of suppressing the movement of the bank component 340 in the direction along the surface of the substrate 12A.
  • the depth of the recess 312C is, for example, 5% or 100 ⁇ m of the thickness of the substrate 12A.
  • FIG. 18 illustrates a case where the recess 312C is formed deeper, the depth of the recess 312C may be shallow.
  • FIG. 18 shows an example in which the lower portion of the bank component 340 is placed so as to be fitted into the recess 312C.
  • the depth of the recess 312C may be set so that the amount of protrusion (overhang height H) of the embankment component 340 placed on the recess 312C from the surface of the substrate 12A is the desired height.
  • the shape of the recess 312C in the plan view is a ring shape that matches the shape of the bank component 340, but the shape of the recess 312C in the plan view is the bank.
  • a plurality of legs may be projected downward from the lower part of the bank component 340, and the recesses 312C may be formed in a portion corresponding to the lower part of the legs so that the legs can be inserted into the recesses 312C.
  • the embankment part 340 is preferably made of an elastic body, but may be made of plastic, metal, or the like.
  • the embankment component 340 may have enough rigidity to prevent the moving of the flowing adhesive.
  • the embankment part 340 may be made of a rubber material.
  • it is preferable to have sulfuric acid resistance.
  • the rubber material to be the bank component 340 include natural rubber, styrene rubber, butyl rubber, nitrile rubber, ethylene / propylene rubber, chloroprene rubber, chlorosulfonated polyethylene, silicone rubber, and fluororubber.
  • foam rubber may be used as the rubber material.
  • the foamed rubber include foamed rubber obtained by foaming ethylene / propylene rubber.
  • the cross-sectional shape of the bank part 340 is rectangular is illustrated, but the cross-sectional shape of the bank part 340 may be another shape.
  • the cross-sectional shape of the bank component 340 may be, for example, a circular shape as shown in FIG. 19 or a semi-circular shape as shown in FIG. 20.
  • the width of the recess 312C may be slightly smaller than the width of the embankment part 340, and the embankment part 340 may be shrunk and fitted.
  • a cavity 340a may be formed inside the bank component 340 to adjust the elastic force of the bank component 340.
  • the embankment part 340 does not have an acute-angled corner portion such as an arc shape in cross section.
  • the corner portion is deformed by pressing, so that an excessive load load due to the tip of the corner portion is suppressed. Be done.
  • the adhesive layer 30 is formed by applying a liquid adhesive to the surface of the substrate 12A, excluding the bank component 340. Then, the liquid adhesive is cured to form the adhesive layer 30.
  • the bank component 340 has a through hole 12a surrounding the outer periphery as shown in FIG. 16 in a plan view. It is preferable that the product is placed in the region ARA where the distance D from the open end of the is within 10 mm.
  • the region ARA is more preferably a region ARA within 5 mm from the open end of the through hole 12a.
  • the liquid adhesive applied to the surface of the substrate 12A may flow along the surface of the substrate 12A and invade the through hole 12a when the lead layers 101 and 102 are bonded together.
  • the more the adhesive area and the adhesive strength between the surface of the substrate 12A and each lead layer are to be obtained the larger the amount of the adhesive to be applied and the easier it is for the adhesive to penetrate into the through hole 12a.
  • an endless annular bank component 340 is placed around each through hole 12a. Therefore, the adhesive that has flowed toward the through hole 12a is difficult to flow toward the through hole 12a due to the step (overhang) due to the bank component 340, and easily flows in the other direction. This makes it possible to reduce the amount of adhesive that penetrates into the through hole 12a.
  • the overhang height H of the bank component 340 from the surface of the substrate 12A is equal to or larger than the thickness of the adhesive layer 30.
  • the overhang height H of the embankment component 340 is set in the range of 20 ⁇ m or more and 500 ⁇ m or less.
  • the thickness of the adhesive layer 30 is, for example, about 20 ⁇ m to 30 ⁇ m.
  • the conduction between the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode is executed by, for example, resistance welding.
  • the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode are connected to each other through the through hole 12a. It is electrically joined.
  • reference numeral W indicates a welded portion thereof.
  • the vicinity of the through hole 12a is also heated by the welding heat, but the heating to the adhesive layer 30 near the through hole 12a is alleviated by the bank component 340, and the adhesion near the through hole 12a is caused by the heat.
  • the endless annular bank component 340 can prevent the adhesive having fluidity from flowing into the through hole 12a.
  • the overhang height H of the embankment part 340 is preferably, for example, 500 ⁇ m or less. More preferably, the overhang height H of the embankment component 340 has a difference of 50 ⁇ m or less from the height of the adhesive layer 30 and further 20 ⁇ m or less.
  • the thickness of the lead layer is 70 ⁇ m or more, and the difference between the overhang height H of the bank component 340 and the height of the adhesive layer 30 is preferably less than the thickness of the lead layer.
  • the width D0 of the bank component 340 is, for example, in the range of 1 mm or more and 10 mm or less.
  • FIG. 16 a case where one embankment part 340 is placed so as to surround the through hole 12a is illustrated, but a plurality of embankment parts 340 are placed concentrically around the through hole 12a. You may. In this case, even if the adhesive may flow to the through hole 12a side beyond the bank component 340 on the outer peripheral side, it is trapped in the concave portion between the two bank parts 340 and the adhesive is applied to the through hole 12a side. Prevents the inflow.
  • the plurality of embankment parts 340 do not have to have similar shapes in a plan view, and the centers of the embankment parts 340 do not have to match.
  • a case where the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode are directly joined via the through hole 12a for conduction is taken as an example.
  • a columnar conductor (not shown) may be arranged in the through hole 12a, and the lead layer 101 for the positive electrode and the lead layer 102 for the negative electrode may be electrically bonded via the conductor.
  • the recess 312C for positioning the bank component 340 the recess 312C on which the bank component 340 is not placed may be formed on the surface of the substrate 12A.
  • two or more intrusion avoidance structures described in the first to third embodiments may be used in combination as appropriate.
  • the present disclosure may also have the following structure.
  • a bipolar plate having through holes for conduction, a positive electrode bonded to one surface of the bipolar plate by an adhesive layer, and a negative electrode bonded to the other surface of the bipolar plate by an adhesive layer.
  • a bipolar electrode for a bipolar storage battery comprising, wherein the bipolar plate has at least one of a concave structure and a convex structure that prevents fluid from entering the through hole on one surface and the other surface.
  • a bipolar electrode having an intrusion avoidance structure consisting of the above structure.
  • the lead layer (lead foil) is fixed to the surface of the substrate by the adhesive layer made of an adhesive
  • the applied adhesive penetrates. Prevents the holes from being contaminated.
  • the adhesive layer in the vicinity of the through hole is fluidized by resistance welding for joining the lead layer for the positive electrode and the lead layer for the negative electrode through the through hole.
  • the intrusion avoidance structure relaxes heat transfer to the adhesive layer near the through hole, and the fluidized adhesive layer flows into the through hole to contaminate it. Is avoided.
  • the adhesive may interfere with the welding of the conductive portion and increase the electric resistance between the lead layers.
  • the conductive portion formed in the through hole is not contaminated, so that the reliability when welding the conductive portion is improved.
  • the region forming the intrusion avoidance structure is set to a region within 10 mm from the through hole surrounding the outer periphery of the intrusion avoidance structure, a sufficient fixed area between the substrate and the lead layer can be sufficiently secured.
  • a bipolar comprising a substrate having a through hole for conduction, a positive electrode bonded to one surface of the substrate by an adhesive layer, and a negative electrode bonded to the other surface of the substrate by an adhesive layer.
  • a bipolar electrode for a type storage battery the substrate has an overhanging portion on one surface and the other surface that continuously surrounds the outer periphery of the through hole without interruption.
  • the overhanging portion is formed, for example, in a region within 10 mm from the through hole surrounding the outer periphery of the overhanging portion in a plan view.
  • the applied adhesive penetrates the lead layer. Prevents the holes from being contaminated. Further, even after the lead layer is attached to the surface of the substrate by the adhesive layer, the adhesive layer near the through hole is fluidized by the resistance welding for joining the lead layer for the positive electrode and the lead layer for the negative electrode through the through hole. However, the overhanging portion relaxes heat transfer to the adhesive layer near the through hole, and the fluidized adhesive layer flows into the through hole 12a to contaminate the through hole. Is avoided. Further, by setting the region forming the overhanging portion to a region within 10 mm from the through hole a surrounding the outer periphery of the overhanging portion, it is possible to sufficiently secure a fixed area between the substrate and the lead layer.
  • the height of the overhanging portion is equal to or higher than the thickness of the adhesive layer. According to this configuration, it is possible to more reliably prevent the adhesive from entering the through hole.
  • the height of the overhanging portion is 20 ⁇ m or more and 500 ⁇ m or less. According to this configuration, it is possible to suppress the load on the lead layer by the overhanging portion while preventing the adhesive from entering the through hole.
  • the overhanging portion is integrally formed with the substrate. According to this configuration, it is possible to form an overhanging portion when the substrate is manufactured.
  • the overhanging portion is a component separate from the substrate and adheres to the surface of the substrate. According to this configuration, the overhanging portion is positioned only by being adhered, and the overhanging portion can be easily formed.
  • the overhanging portion is an adhesive seal having an adhesive layer on at least the surface on the substrate side. According to this configuration, the overhanging portion is positioned only by being adhered with the adhesive layer, and the overhanging portion can be easily formed.
  • the overhanging portion is made of a liquid gasket. According to this configuration, the overhanging portion is positioned only by applying the liquid gasket, and the overhanging portion can be easily formed.
  • a bipolar comprising a substrate on which a through hole for conduction is formed, a positive electrode bonded to one surface of the substrate by an adhesive layer, and a negative electrode bonded to the other surface of the substrate by an adhesive layer.
  • a bipolar electrode for a type storage battery the substrate has grooves formed on the outer periphery of the through hole on one surface and the other surface, and the groove has a groove in a plan view. It is formed in a region within 10 mm from the opening end of the through hole formed on the outer periphery.
  • the through hole is formed by the applied adhesive. Prevents contamination. Further, even after the lead layer is attached to the surface of the substrate 12A by the adhesive layer, the adhesive layer in the vicinity of the through hole flows by resistance welding for joining the lead layer for the positive electrode and the lead layer for the negative electrode through the through hole. Although there is a risk of contaminating the through hole, it is possible to prevent the adhesive layer in a fluid state from flowing into the through hole and contaminating it.
  • the adhesive may interfere with the welding of the conductive portion and increase the electric resistance between the lead layers.
  • the conductive portion formed in the through hole is not contaminated, so that the reliability when welding the conductive portion is improved.
  • the region forming the groove portion is set to a region within 10 mm from the through hole surrounding the outer periphery of the groove portion, a sufficient fixed area between the substrate and the lead layer can be sufficiently secured.
  • the groove portion has a groove portion continuously formed so as to surround the outer periphery of the through hole. According to this configuration, it is possible to more reliably prevent the adhesive from entering the through hole from the entire circumference. (12)
  • the groove portion has a groove portion intermittently formed so as to surround the circumference of the through hole. According to this configuration, it is possible to arrange the groove portion on the entire circumference in the circumferential direction of the through hole while increasing the capacity of the groove portion.
  • the intermittently formed groove portion penetrates the substrate. According to this configuration, it is possible to set a large amount of adhesive that can flow into the groove portion.
  • the groove portion has a depth of 0.3 mm or more and a width of 1 mm or more and 10 mm or less along the direction away from the through hole. According to this configuration, it is possible to secure a predetermined amount of the capacity of the groove portion while ensuring the rigidity of the substrate. (15) Further, it has an overhanging portion on the surface of the substrate in the region. According to this configuration, by forming the overhanging portion together with the groove portion, it is possible to prevent the adhesive from moving to the through hole. (16) The overhanging portion continuously surrounds the outer periphery of the through hole. According to this configuration, the overhanging portion makes it possible to suppress the inflow of the adhesive from the entire circumference of the through hole into the through hole.
  • the bipolar electrode is a bipolar electrode for a bipolar storage battery, wherein the bipolar plate is mounted on one surface and the other surface and has a bank component that surrounds the outer periphery of the through hole. According to this configuration, for example, by providing a bank component on the outer periphery of the through hole, when the lead layer (lead foil) is fixed to the surface of the substrate by the adhesive layer made of an adhesive, the through hole is applied with the adhesive. Prevents contamination.
  • the adhesive layer near the through hole is fluidized by the resistance welding for joining the lead layer for the positive electrode and the lead layer for the negative electrode through the through hole.
  • the bank parts may reduce heat transfer to the adhesive layer near the through hole, and the fluidized adhesive layer may flow into the through hole and contaminate it. Be avoided.
  • the adhesive invades the through hole, it may interfere with the welding of the conductive part and increase the electrical resistance between the lead layers.
  • the conductive portion formed in the through hole is not contaminated, so that the reliability when welding the conductive portion is improved. As a result, it is possible to achieve both long-term reliability and high energy density for the bipolar storage battery provided with the bipolar electrode of the present embodiment.
  • the embankment component is formed, for example, in a region within 10 mm from a through hole surrounding the outer periphery of the embankment component in a plan view.
  • a sufficient fixed area between the substrate and the lead layer can be sufficiently secured.
  • a recess for positioning the bank component is formed on the surface of the bipolar plate on which the bank component is placed. According to this configuration, the movement of the embankment component in the direction along the surface of the substrate is restricted only by placing the embankment component in the recess. As a result, the inflow of the adhesive into the through hole can be more reliably suppressed by the embankment component only by placing the embankment component.
  • the embankment parts are preferably made of an elastic body.
  • the embankment parts are made of, for example, a rubber material.
  • the embankment parts are elastically deformed with respect to the load in the thickness direction of the substrate, so that the load load from the embankment parts to the lead layer can be reduced, and the lead layer is less likely to be damaged by the embankment parts.
  • the liquid adhesive is cured in the adhesive layer. According to this configuration, when the lead layer is attached to the substrate, the adhesive easily penetrates into the through hole for conduction, but the intrusion of the adhesive into the through hole can be prevented by the bank component.
  • the overhang height H of the bank component is equal to or larger than the thickness of the adhesive layer. According to this configuration, it is possible to more reliably prevent the adhesive from entering the through hole.
  • the overhang height H of the embankment parts is 20 ⁇ m or more and 500 ⁇ m or less. According to this configuration, it is possible to suppress the load on the lead layer by the embankment parts while preventing the adhesive from entering the through holes.
  • a bipolar lead-acid battery having a plurality of layers of the above-mentioned bipolar electrodes. It is possible to provide a bipolar lead-acid battery capable of achieving both long-term reliability and high energy density.
  • Bipolar lead acid battery 11 External frame 11A Main body (end plate) 11B Rising part (rim) 12 Internal frame 12A Substrate (bipolar plate) 12B frame member (rim) 12C overhang (intrusion avoidance structure) 12a Through hole 20 Electrolytic layer 30 Adhesive layer 40 Overhanging part (intrusion avoidance structure) 41 Overhanging part (intrusion avoidance structure) 101 Lead layer for positive electrode 102 Lead layer for negative electrode 103 Active material layer for positive electrode 104 Active material layer for negative electrode 110 Negative electrode 120 Positive electrode 130 Bipolar electrode 212C Groove (intrusion avoidance structure) 212E Overhanging part (intrusion avoidance structure) 312C Recess 340 Bank parts (intrusion avoidance structure)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Secondary Cells (AREA)
  • Connection Of Batteries Or Terminals (AREA)
PCT/JP2021/039487 2020-12-10 2021-10-26 バイポーラ電極、及びバイポーラ型蓄電池 Ceased WO2022123936A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022568094A JPWO2022123936A1 (https=) 2020-12-10 2021-10-26
US18/330,681 US20230317921A1 (en) 2020-12-10 2023-06-07 Bipolar Electrode and Bipolar Storage Battery

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-204828 2020-12-10
JP2020-204829 2020-12-10
JP2020204828 2020-12-10
JP2020204829 2020-12-10
JP2021019936 2021-02-10
JP2021-019936 2021-02-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/330,681 Continuation US20230317921A1 (en) 2020-12-10 2023-06-07 Bipolar Electrode and Bipolar Storage Battery

Publications (1)

Publication Number Publication Date
WO2022123936A1 true WO2022123936A1 (ja) 2022-06-16

Family

ID=81972896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/039487 Ceased WO2022123936A1 (ja) 2020-12-10 2021-10-26 バイポーラ電極、及びバイポーラ型蓄電池

Country Status (3)

Country Link
US (1) US20230317921A1 (https=)
JP (1) JPWO2022123936A1 (https=)
WO (1) WO2022123936A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4714623U (https=) * 1971-03-18 1972-10-20
JP2585847B2 (ja) * 1990-07-27 1997-02-26 新神戸電機株式会社 薄形密閉形蓄電池
JP2010277862A (ja) * 2009-05-28 2010-12-09 Nissan Motor Co Ltd 双極型電池用集電体
JP2014530450A (ja) * 2011-09-09 2014-11-17 イースト ペン マニュファクチャリング カンパニー インコーポレーテッドＥａｓｔ Ｐｅｎｎ Ｍａｎｕｆａｃｔｕｒｉｎｇ Ｃｏ．，Ｉｎｃ． 二極式電池およびプレート
JP2014534582A (ja) * 2011-10-24 2014-12-18 アドバンスト バッテリー コンセプツ エルエルシー バイポーラバッテリ組立体
JP2018073508A (ja) * 2016-10-25 2018-05-10 株式会社豊田自動織機 蓄電装置、及び蓄電装置の製造方法
CN208444893U (zh) * 2018-03-28 2019-01-29 天能电池集团有限公司 一种双极性极板板栅、双极性极板和蓄电池极群

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4714623U (https=) * 1971-03-18 1972-10-20
JP2585847B2 (ja) * 1990-07-27 1997-02-26 新神戸電機株式会社 薄形密閉形蓄電池
JP2010277862A (ja) * 2009-05-28 2010-12-09 Nissan Motor Co Ltd 双極型電池用集電体
JP2014530450A (ja) * 2011-09-09 2014-11-17 イースト ペン マニュファクチャリング カンパニー インコーポレーテッドＥａｓｔ Ｐｅｎｎ Ｍａｎｕｆａｃｔｕｒｉｎｇ Ｃｏ．，Ｉｎｃ． 二極式電池およびプレート
JP2014534582A (ja) * 2011-10-24 2014-12-18 アドバンスト バッテリー コンセプツ エルエルシー バイポーラバッテリ組立体
JP2018073508A (ja) * 2016-10-25 2018-05-10 株式会社豊田自動織機 蓄電装置、及び蓄電装置の製造方法
CN208444893U (zh) * 2018-03-28 2019-01-29 天能电池集团有限公司 一种双极性极板板栅、双极性极板和蓄电池极群

Also Published As

Publication number Publication date
JPWO2022123936A1 (https=) 2022-06-16
US20230317921A1 (en) 2023-10-05

Similar Documents

Publication Publication Date Title
JP7728032B2 (ja) 電池ケースおよび電池
JP7727332B2 (ja) 電池ケースおよび電池
KR101729213B1 (ko) 진동 특성이 향상된 배터리 모듈 및 이에 적용되는 프레임 카트리지 조립체
JP6315572B2 (ja) 電気化学セル
WO2019021980A1 (ja) 電池モジュール
KR102809615B1 (ko) 원통형 이차 전지
US20140255768A1 (en) Ultrasonic horn and secondary battery manufactured using the same
KR20110128086A (ko) 이차 전지 및 전지 모듈
CN112310431A (zh) 用于燃料电池的弹性体电池框架及其制造方法和单元电池
WO2020129338A1 (ja) シール機構付接続端子及び電気機器
JP2008541373A (ja) 高分子フィルムに対するタブの接合性を向上させたリチウム二次電池
WO2022123936A1 (ja) バイポーラ電極、及びバイポーラ型蓄電池
JP5533828B2 (ja) 電池
KR20160002176A (ko) 이차전지
JP2021118076A (ja) 蓄電装置
CN113611961A (zh) 电池壳和电池
WO2022123937A1 (ja) バイポーラ電極、及びバイポーラ型蓄電池
CN215578756U (zh) 电池壳和电池
CN215527815U (zh) 电池壳和电池
KR101769106B1 (ko) 파우치형 이차전지 및 이에 적용되는 전극 리드 어셈블리
CN216311912U (zh) 电池壳和电池
KR20150064335A (ko) 전극리드를 포함하고 있는 이차전지
JP2015035313A (ja) フレーム付き膜電極接合体、燃料電池用単セル及び燃料電池スタック
KR20230033500A (ko) 파우치형 이차전지용 실링장치
CN113131048A (zh) 电池壳和电池

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21903040

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022568094

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21903040

Country of ref document: EP

Kind code of ref document: A1