WO2022121428A1 - 一种抛光装置 - Google Patents

一种抛光装置 Download PDF

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Publication number
WO2022121428A1
WO2022121428A1 PCT/CN2021/118652 CN2021118652W WO2022121428A1 WO 2022121428 A1 WO2022121428 A1 WO 2022121428A1 CN 2021118652 W CN2021118652 W CN 2021118652W WO 2022121428 A1 WO2022121428 A1 WO 2022121428A1
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WO
WIPO (PCT)
Prior art keywords
polishing
curved
base
slide rail
polishing head
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PCT/CN2021/118652
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English (en)
French (fr)
Inventor
杨渊思
徐枭宇
周智鹏
Original Assignee
杭州众硅电子科技有限公司
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Application filed by 杭州众硅电子科技有限公司 filed Critical 杭州众硅电子科技有限公司
Publication of WO2022121428A1 publication Critical patent/WO2022121428A1/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories

Definitions

  • the present invention relates to the technical field of semiconductor processing equipment, in particular to a polishing device.
  • polishing pad, polishing head, polishing liquid, polishing pad conditioner, motion trajectory, and force all affect the final flatness and smoothness of the wafer. How to ensure the quality and yield of polished wafers at the same time is one of the main research directions in the field of wafer processing.
  • the existing mainstream wafer polishing device includes a polishing table and a corresponding polishing head.
  • the polishing table has one degree of freedom for rotation, the polishing head has two degrees of freedom (rotation and sweeping and swinging on the polishing head table), and three degrees of freedom. At the same time, it can realize polishing operation.
  • the sweeping and swinging action of the polishing head on the polishing head can fully and uniformly consume the polishing pad on the surface of the polishing head; at the same time, the sweeping and swinging action of the polishing head can transfer the wafer from the polishing head to other transfer platforms such as the wafer stage.
  • one polishing head corresponds to two polishing heads can improve the polishing efficiency, it is difficult to ensure the consistency of the polishing process of two or more wafers. Generally, it can only be applied to different polishing accuracy requirements. high industry.
  • the purpose of the present invention is to provide a polishing device, which drives two polishing heads to move symmetrically through a linear drive assembly, so that the consistency of the wafers on the two polishing heads is significantly improved.
  • the present invention provides a polishing device, including a base, the base is provided with two polishing head seats, the polishing head seats are provided with a polishing head for fixing a wafer and a polishing head for driving the polishing
  • the linear drive mechanism for the linear movement of the head further comprises a bottom plate, the bottom plate is provided with a curved sliding rail, and the base is provided with a sliding block connected with the curved sliding rail.
  • the base is provided with a linear slide rail for restricting the moving path of the polishing head base
  • the linear drive mechanism drives the polishing head base to move linearly along the linear slide rail
  • each polishing head base moves linearly along the linear slide rail.
  • Each of the polishing heads is provided with one of the polishing heads, the moving trajectories of the two polishing head seats are symmetrically distributed, and the axis of symmetry is the mid-perpendicular line of the line segment formed by the midpoints of the two polishing heads.
  • the linear drive mechanism includes a lead screw connected to the polishing head and a driving part for driving the lead screw to rotate.
  • the two linear slide rails corresponding to the single polishing head base are arranged in parallel.
  • a curved drive mechanism for driving the base to move on the curved slide rail is further provided between the base and the bottom plate.
  • it also includes a polishing table located under the base, the polishing table is provided with a liquid supply arm for outputting polishing liquid between the polishing head and the polishing table, and the layout of the liquid supply arm The positions are center-symmetric about the center point of the polishing table.
  • the curved drive mechanism comprises a curved magnetic rail arranged on the base plate and concentric with the curved sliding rail, and a curved direct drive motor arranged in the base and matched with the curved magnetic rail .
  • the curved slide rail is in a circular arc or ring shape, and at least one of the polishing table and the wafer carrier for carrying the finished wafer is arranged below the curved slide rail.
  • the polishing table and the The slide tables are all located within the range covered by the projection of the curved slide rail on the horizontal plane.
  • the curved slide rail is in the shape of a circular arc or a ring shape, and only at least two polishing tables are arranged below the curved slide rail, and all the polishing tables are located on the horizontal plane of the curved slide rail.
  • the slide stage is located outside the range covered by the projection of the curved slide rail on the horizontal plane.
  • At least two of the bases are connected to the curved slide rail.
  • Wafer polishing requires extremely high precision, and factors such as the movement trajectory of the polishing process and the flow direction of the polishing liquid will affect the polishing results.
  • the polishing device provided by the present invention includes a base, the base is provided with a polishing head seat, and the polishing head seat is provided with two polishing heads for fixing the wafer and a polishing head located between the two polishing heads for driving the two polishing heads to move.
  • the linear drive mechanism also includes a base plate, the base plate is provided with a curved slide rail, a base There are sliders attached to the curved rails.
  • the base is located above the polishing table, the polishing head drives the wafer to rotate, and the linear drive mechanism simultaneously drives the two wafers to linearly translate and scan, and the polished wafer is moved along the curved slide rail. Scanning in a straight line results in a more uniform slurry distribution and more uniform pad wear, resulting in significantly improved polishing consistency between the two wafers. Wafers in the same batch are polished the same, which ensures stable product quality and simplifies the steps to check product quality in subsequent processing.
  • FIG. 1 is a schematic structural diagram of a polishing device provided by the present invention.
  • Fig. 2 is a side view of the polishing device in Fig. 1;
  • FIG. 3 is a schematic structural diagram of the cooperation between a curved slide rail and a curved drive mechanism
  • FIG. 4 is a schematic structural diagram of a polishing device located at a first station in a specific embodiment
  • FIG. 5 is a schematic structural diagram of a polishing device located at a second station in a specific embodiment
  • FIG. 6 is a schematic structural diagram of a polishing apparatus according to another specific embodiment.
  • Polishing assembly 100 base 101, curved rail 102, slider 103, polishing head seat 104, linear rail 105, polishing head 200, polishing table 201, curved magnetic rail 202, curved direct drive motor 203, lead screw 204, Bottom plate 300 , dresser 301 , dresser disc 302 , liquid supply arm 303 , and wafer stage 304 .
  • FIG. 1 is a schematic structural diagram of the polishing device provided by the present invention
  • FIG. 2 is a side view of the polishing device in FIG. 1
  • FIG. 4 is a schematic structural diagram of a polishing device in a specific embodiment at a first station
  • FIG. 5 is a schematic structural diagram of a polishing device in a specific embodiment in a second station
  • FIG. 6 is another specific embodiment of the polishing device. Schematic diagram of the structure.
  • the polishing apparatus provided by the present invention has a structure as shown in FIG. 1 , including a base 101 and a polishing assembly 100 .
  • the base 101 is located above the polishing table 201, the polishing pad is provided on the upper end surface of the polishing table 201, the lower end surface of the base 101 faces the polishing table 201, and the polishing assembly 100 is provided on the lower end surface of the base 101.
  • the polishing assembly 100 includes Two polishing head seats 104 , a linear driving mechanism and two polishing heads 200 are provided on the lower end surface of the base.
  • the two polishing head bases 104 are movably connected to the base 101 , and the linear driving mechanism is connected to the two polishing head bases 104 , and the polishing head base 104 is driven by the linear driving mechanism to move in a straight line.
  • Each of the two polishing heads 200 fixes a wafer, and the two polishing head bases 104 are connected to the two polishing heads 200 respectively.
  • the polishing head base 104 drives the polishing heads 200 to move synchronously during the linear movement.
  • the polishing head seat 104 is located above the polishing table 201 .
  • the polishing head 200 can rotate and drive the wafer to rotate.
  • the wafer fixed by the polishing head 200 is attached to the polishing pad, and is rotated under the driving of the polishing head 200, and at the same time rubs against the polishing pad to realize wafer polishing.
  • the linear drive mechanism drives the two polishing heads 200 to move linearly through the polishing head seat 104 .
  • the moving trajectories of the two polishing heads 200 are symmetrically distributed, and the axis of symmetry is the mid-perpendicular line of the line segment formed by connecting the midpoints of the two polishing heads 200 in the same polishing assembly 100 .
  • the polishing head 200 rotates relative to the polishing pad and simultaneously translates, thereby improving the polishing effect.
  • the polishing head 200 and the linear drive mechanism are both connected with a control device mechanism, and the control mechanism can control the wafers fixed by the two polishing heads 200 to be polished along a symmetrical trajectory, from And make the two wafers have higher consistency.
  • the specific structure of the polishing head 200 may refer to the prior art, and one or more bases 101 may be provided in the polishing apparatus.
  • One or two sets of polishing assemblies 100 may be provided on the lower end surface of each base 101 .
  • the linear drive mechanism may specifically be an air cylinder, an oil cylinder, a connecting rod slider or a lead screw, etc., which is not limited herein.
  • control mechanism reference may be made to the controller of the polishing equipment in the prior art, which will not be repeated here.
  • the polishing device drives the two polishing heads 200 to translate along a straight line through a linear drive mechanism, and at the same time, the two polishing heads 200 respectively drive a wafer to rotate.
  • the wafer polishing tracks in the two polishing heads 200 are symmetrical, so that the polishing effects of the two wafers are almost the same, thereby improving the consistency of the wafers.
  • the polishing head seat 104 is provided with a linear slide rail 105
  • the upper end surface of the polishing head 200 is provided with a chute matching the linear slide rail 105
  • the chute slides along the linear slide rail 105 to realize the connection between the polishing head 200 and the base. 101's removable connection.
  • the two bases 101 move along the linear slide rail 105 under the driving of the linear drive mechanism, and the movement trajectories of the two bases are symmetrical with respect to the preset vertical line of the linear slide rail.
  • the preset vertical line is usually the vertical line of the linear slide rail.
  • the user can also select other vertical lines other than the vertical line as required, which is not limited here.
  • the driving mechanism includes a lead screw 204 and a driving part.
  • both ends of the lead screw 204 are respectively connected with the two polishing head bases 104 , and both ends of the lead screw 204 are provided with spirals, and the spiral directions of the two ends are opposite.
  • the driving part is connected to the middle of the lead screw 204 in a driving manner, and drives the lead screw 204 to rotate.
  • the drive part selects a drive motor, and the drive motor and the lead screw 204 are driven by gears or timing belts.
  • the lead screw 204 rotates, an axial force is applied to the two polishing heads 200 to drive the two polishing heads 200 to move symmetrically.
  • the polishing head seat 104 is located above the polishing table 201 , the midpoint of the lead screw 204 coincides with the projection of the midpoint of the polishing table 201 in the horizontal direction.
  • the lead screw 204 is parallel to the linear slide rail 105 , and the polishing head 200 is driven by the lead screw 204 to move along the linear slide rail 105 .
  • the driving part is arranged between the two polishing head bases 104. To facilitate the installation of the driving part, the middle of the two linear guide rails 105 is provided with a vacant gap, and the two polishing head bases 104 are set in the vacated position. both sides of the notch.
  • the user can also set a linear slide on the base 100 as required.
  • two linear guide rails 105 may also be provided on the lower end surface of the base 100 for each polishing head base 104, which is not limited herein.
  • the polishing table 201 is provided with a liquid supply arm 303, and the liquid supply arm 303 is used for outputting the polishing liquid between the wafer and the polishing pad.
  • the liquid supply arm 303 is used for outputting the polishing liquid between the wafer and the polishing pad.
  • there are two liquid supply arms 303 which are symmetrical with respect to the midpoint of the polishing table 201 . That is to say, during polishing, the two liquid supply arms 303 are symmetrical about the center of the midpoint of the lead screw 204, and the outlets of the two liquid supply arms 303 are respectively directed toward one polishing head 200, and the polishing liquid is directly sprayed between the wafer and the polishing pad. The role of heat dissipation and flushing.
  • the outlets of the two liquid supply arms 303 may be located on a normal line passing through the midpoint of the lead screw 204 .
  • the polishing table 201 is further provided with two groups of polishing conditioners 301 , and the two groups of polishing conditioners 301 are also symmetrical about the center of the midpoint of the polishing table 201 .
  • the polishing dresser 301 is in the shape of a rod, one end of which is fixedly arranged, and the other end is rotatably connected to the dressing disc through the main shaft, so as to dress the polishing layer on the upper surface of the polishing head 200 along the arc track.
  • the bottom plate 300 is provided with a curved slide rail 102
  • the base 101 is provided with a slider 103 connected with the curved slide rail 102
  • a curved drive mechanism is further provided between the base 101 and the bottom plate 300, and the base 101 is in the curved drive mechanism. It moves along the curved slide rail 102 under the driving force.
  • the curved slide rail 102 is located above the polishing table 201
  • the base moves the polishing head 200 above the polishing table 201
  • the polishing head 200 cooperates with the polishing table 201 to perform polishing operations.
  • the quantity of the base 101 and the polishing table 201 can be set according to the needs of the user.
  • the polishing apparatus can be provided with one base 101, which cooperates with one or more polishing tables 201 to perform the polishing operation.
  • the polishing device can also be provided with more than two bases 101 , each base 101 corresponds to one polishing table 201 , and the wafers fixed on the base 101 are polished on the corresponding polishing table 201 .
  • the polishing device can also be provided with more than two bases 101, and the polishing table 201 can be divided into multiple groups according to different polishing precisions. All polishing tables 201 required to complete the polishing of a wafer are one group, and the polishing device can be provided with one or more groups.
  • the number of groups of the polishing table 201 is usually not more than the number of the bases 101 .
  • a wafer stage 304 can be further arranged under the curved slide rail 102.
  • the curved drive mechanism drives the base 101 to move above the wafer stage 304, and the polishing head 200 places the wafer on the wafer stage. 304 on.
  • the susceptor 101 moves above the slide table 304, the two polishing heads 200 are just aligned with the two slide tables 304, so the slide table 304 should be The throw located on the curved rail 102 in shadow.
  • a wafer carrier may not be provided below the user's curved slide rail 102, but the wafer may be moved onto the wafer carrier by a mechanism such as a robot arm.
  • the number of curved slide rails 102 may be two, the two curved slide rails 102 are two concentric arcs or two concentric circles, and two sliders 103 are respectively provided on the inside and outside of the base 101 for They are matched with the two curved slide rails 102 respectively.
  • the two curved sliding rails 102 can make the force on the inner and outer sides of the base 101 more uniform, and the user can also use one curved sliding rail 102 as required, which is not limited herein.
  • the curved drive mechanism includes a curved magnetic track 202 and a curved direct drive motor 203 .
  • the curved magnetic rail 202 is arranged on the base plate 300 and is concentric with the curved sliding rail 102
  • the curved direct drive motor 203 is arranged in the base 101 .
  • the curved direct drive motor 203 cooperates with the curved magnetic rail 202 to generate power, so that the base 101 can move along the curved sliding rail 102 .
  • the curved slide rail 102 is semicircular, a base 101 is provided in the curved slide rail 102 , and one end of the curved slide rail 102 is located above the slide table 304 , and the other end is above the polishing table 201 .
  • the susceptor 101 first moves to the top of the polishing table 201 to polish the wafer.
  • the position of the susceptor 101 above the polishing table 201 is the first station. After polishing, the susceptor 101 is moved to the top of the wafer stage 304, the wafer is placed on the wafer stage 304 and a new wafer is taken. As shown in FIG.
  • the position of the susceptor 101 above the wafer stage 304 is the first Second station.
  • the liquid supply arm 303 and the dresser 301 are rotated and moved out of the top of the polishing table 201 to avoid the curved movement of the polishing device.
  • the user can also adopt other distribution modes of the base 101 and the polishing table 201 , for example, two polishing tables 201 can be arranged under the curved slide rail 102 , and the polishing precision of the two is different.
  • the susceptor 101 moves between the two polishing tables 201 , and the polished wafer is moved to the wafer stage by the robot arm.
  • the curved slide rail 102 is annular, and at least two bases 101 are provided in the curved slide rail 102 .
  • each of the three polishing tables 201A, 201B and 201C is provided with a set of dressers 301A, 301B and 301C and a liquid supply arm 303A, 303B, 303C.
  • the curved slide rail 102 is provided with four bases 101 , and the four bases 101 correspond to the three polishing tables 201A, 201B, 201C and a set of slide tables 304304 respectively.
  • Each base 101 is provided with a set of polishing assemblies 100A, 100B, 100C, 100D, all bases 101 rotate clockwise or counterclockwise along the curved slide rail 102, and the polishing pads on the three polishing tables 201A, 201B, 201C rotate along the base
  • the accuracy of the rotation direction of the seat 101 is gradually improved. Therefore, finer grinding is performed after the susceptor 101 is transferred to the polishing station, and the polished wafer is finally moved to the two wafer stages 304304 .
  • the three susceptors 101 perform wafer polishing on the three polishing tables 201A, 201B, and 201C respectively, and the other susceptor 101 moves the polished wafer to the wafer stage 304304, and acquires a new wafer. round.
  • the user can also set the number of polishing tables 201 , slide tables 304 and susceptors 101 as required, for example, a combination of multiple polishing tables 201 such as 2, 4, 6, etc., 2, 4, 6, etc.
  • Various combinations of wafer stages 304 can meet the requirements of different yields and process flows, which are not limited herein.
  • the polishing apparatus of this specific embodiment is provided with a plurality of polishing tables 201 and a base 101, and the polishing process is divided into a plurality of steps. Several polishing steps are performed at the same time, which improves polishing efficiency, thereby increasing wafer yield.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polarising Elements (AREA)

Abstract

一种抛光装置,包括基座(101),基座(101)设有抛光头座(104),抛光头座(104)设有两个用以固定晶圆的抛光头(200)和位于两抛光头(200)之间用以带动两抛光头(200)移动的直线驱动机构,抛光工艺过程中,基座(101)位于抛光台(201)的上方,抛光头(200)带动晶圆自转,抛光完成后的晶圆沿曲线滑轨(102)移送走。

Description

一种抛光装置 技术领域
本发明涉及半导体加工设备技术领域,特别涉及一种抛光装置。
背景技术
晶圆生产过程中需要进行化学平坦化抛光处理,使晶圆表面达到合格的平坦度和光洁度。化学平坦化抛光过程中,抛光垫、抛光头、抛光液、抛光垫修整器、运动轨迹、作用力等均影响晶圆最终的平坦度、光洁度。如何同时确保抛光晶圆质量和产量,是晶元加工领域的主要研究方向之一。
现存主流的抛光晶圆装置包括抛光台和与之对应的抛光头,抛光台具备自转一个自由度,抛光头具备两个自由度(自转和在抛头台上扫掠摆动),三个自由度同时作用实现抛光作业。抛光头在抛光头上扫掠摆动的动作能充分均匀消耗抛光头表面的抛光垫;同时,抛光头的扫掠摆动动作可将晶圆从抛光头传输至载片台等其他中转平台。
但现有的抛光晶圆装置中,虽然一个抛光头对应两个抛光头能够提高抛光效率,但难以确保两片或多片晶圆抛光工艺过程的一致性,一般仅能应用于抛光精度要求不高的行业。
因此,如何在保证抛光效率的同时提高抛光的一致性是本领域技术人员急需解决的技术问题。
发明内容
本发明的目的是提供一种抛光装置,其通过直线驱动组件带动两抛光头对称移动,使两抛光头上晶圆的一致性得到显著提高。
为实现上述目的,本发明提供一种抛光装置,包括基座,所述基座设有两个抛光头座,所述抛光头座设有用以固定晶圆的抛光头和用以带动所述抛光头直线移动的直线驱动机构,还包括底板,所述底板设有曲线滑轨,所述基座设有与所述曲线滑轨相连的滑块。
优选地,所述基座设有用以限制所述抛光头座移动路径的直线滑轨,所述直线驱动机构带动所述抛光头座沿所述直线滑轨直线移动,每个所述抛光头座均设有一个所述抛光头,两所述抛光头座的移动轨迹对称分布,对称轴为两所述抛光头中点所形成的线段的中垂线。
优选地,所述直线驱动机构包括所述抛光头相连的丝杠和用以带动所述丝杠转动的驱动部。
优选地,所述单个抛光头座对应的所述直线滑轨为两条,且对应同一抛光头座的两条所述直线导轨平行设置。
优选地,所述基座与所述底板间还设有用以带动所述基座在曲线滑轨上移动的曲线驱动机构。
优选地,还包括位于所述基座下方的抛光台,所述抛光台上设有用以向所述抛光头和所述抛光台之间输出抛光液的供液臂,所述供液臂的布局位置关于所述抛光台中点中心对称。
优选地,所述曲线驱动机构包括设置在所述底板上并与所述曲线滑轨同心的曲线磁轨,以及设置在所述基座中并与所述曲线磁轨相配合的曲线直驱电机。
优选地,所述曲线滑轨呈圆弧形或环状,所述曲线滑轨的下方设有至少一个所述抛光台和用以承载成品晶圆的载片台,所述抛光台和所述载片台均位于所述曲线滑轨在水平面的投影覆盖的范围内。
优选地,所述曲线滑轨呈圆弧形或环状,所述曲线滑轨下方仅设置所述抛光台至少两个所述抛光台,全部所述抛光台均位于所述曲线滑轨在水平面的投影覆盖的范围内,所述载片台位于所述曲线滑轨在水平面的投影覆盖的范围外。
优选地,所述曲线滑轨连接有至少2个所述基座。
晶圆抛光的精度要求极高,抛光过程的运动轨迹以及抛光液的流向等因素都会对抛光结果产生影响。
本发明所提供的抛光装置,包括基座,基座设有抛光头座,抛光头座设有两个用以固定晶圆的抛光头和位于两抛光头之间用以带动两抛光头移动的直线驱动机构,还包括底板,底板设有曲线滑轨,基座 设有与曲线滑轨相连的滑块。
抛光工艺过程中,基座位于抛光台的上方,抛光头带动晶圆自转,同时直线驱动机构同时带动两片晶圆直线平移扫略,抛光完成后的晶圆沿曲线滑轨移送走。沿直线扫略会使抛光液分布更加均匀,同时抛光垫磨损也更加均匀因而两片晶圆的抛光一致性能够显著提高。同一批次的晶圆抛光相同,保证了产品的质量稳定,简化了后续处理过程中检测产品质量的步骤。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。
图1为本发明所提供的抛光装置中的结构示意图;
图2为图1中抛光装置的侧视图;
图3为曲线滑轨与曲线驱动机构配合的结构示意图;
图4为一种具体实施方式的抛光装置位于第一工位结构示意图;
图5为一种具体实施方式的抛光装置位于第二工位结构示意图;
图6为另一种具体实施方式的抛光装置的结构示意图。
其中,图1至图6中的附图标记为:
抛光组件100、基座101、曲线滑轨102、滑块103、抛光头座104、直线滑轨105、抛光头200、抛光台201、曲线磁轨202、曲线直驱电机203、丝杠204、底板300、修整器301、修整盘302、供液臂303、载片台304。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部 分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
为了使本技术领域的技术人员更好地理解本发明方案,下面结合附图和具体实施方式对本发明作进一步的详细说明。
请参考图1至图6,图1为本发明所提供的抛光装置中的结构示意图;图2为图1中抛光装置的侧视图;图3为曲线滑轨与曲线驱动机构配合的结构示意图;图4为一种具体实施方式的抛光装置位于第一工位结构示意图;图5为一种具体实施方式的抛光装置位于第二工位结构示意图;图6为另一种具体实施方式的抛光装置的结构示意图。
本发明所提供的抛光装置,结构如图1所示,包括基座101和抛光组件100。其中,基座101位于抛光台201的上方,抛光台201的上端面设有抛光垫,基座101的下端面朝向抛光台201,基座101的下端面设有抛光组件100,抛光组件100包括两个抛光头座104、直线驱动机构和两个抛光头200,直线驱动机构和两个抛光头座104均设置在基座的下端面。两抛光头座104均与基座101可移动地连接,同时直线驱动机构与两抛光头座104相连,抛光头座104在直线驱动机构的带动下沿直线移动。两抛光头200各固定一片晶圆,且两抛光头座104分别与两抛光头200相连,抛光头座104直线移动的过程中带动抛光头200同步移动。
抛光过程中,抛光头座104位于抛光台201的上方。抛光头200能够自转,并带动晶圆转动。抛光头200所固定的晶圆与抛光垫贴合,并在抛光头200的带动下转动,同时与抛光垫摩擦,实现晶圆抛光。直线驱动机构通过抛光头座104带动两抛光头200直线移动。
可选的,两抛光头200的移动轨迹轴对称分布,对称轴为同一抛光组件100中的两个抛光头200中点相连所形成的线段的中垂线。晶圆在抛光头200的带动下,相对抛光垫转动的同时进行平动,提高抛光效果。另外,抛光头200和直线驱动机构均与控制装置机构,控制机构能够控制两抛光头200所固定的晶圆沿对称的轨迹进行抛光,从 而使两片晶圆具有更高的一致性。抛光头200的具体结构可参考现有技术,抛光装置中可设置一个或多个基座101。每个基座101的下端面可设置一套或两套抛光组件100。直线驱动机构可具体为气缸、油缸、连杆滑块或丝杠等,在此不做限定。控制机构可参考现有技术中抛光设备的控制器,在此不做赘述。
本实施例中,抛光装置通过直线驱动机构带动两抛光头200沿直线进行平动,同时两抛光头200分别带动一片晶圆进行转动。两抛光头200中的晶圆抛光轨迹对称,因而使两片晶圆的抛光效果几乎相同,进而提高了晶圆的一致性。
可选的,抛光头座104设有直线滑轨105,抛光头200的上端面设有与直线滑轨105相配合的滑槽,滑槽沿直线滑轨105滑动,实现抛光头200与基座101的可移动连接。两个基座101在直线驱动机构的带动下沿直线滑轨105移动,两个基座的移动轨迹关于直线滑轨的预设垂线对称。预设垂线通常为直线滑轨的中垂线,当然用户也可根据需要选择除中垂线外的其他垂线,在此不做限定。
可选的,驱动机构包括丝杠204和驱动部。其中,丝杠204的两端分别与两抛光头座104相连,丝杠204两端部均设有螺旋,且两端部的螺旋方向相反。驱动部与丝杠204的中部传动连接,并带动丝杠204转动。具体的,驱动部选用驱动电机,驱动电机与丝杠204之间通过齿轮或同步带等进行传动。丝杠204转动的同时对两抛光头200施加轴向力作用,带动两抛光头200对称移动。当抛光头座104位于抛光台201的上方时,丝杠204的中点与抛光台201的中点在水平方向上的投影重合。
另外,丝杠204与直线滑轨105平行,抛光头200在丝杠204的带动下沿直线滑轨105移动。抛光头座104上的直线滑轨105为两条。两直线滑轨105的端部平齐,同时二者相互平行。本申请的一种具体实施方式中,驱动部设置在两抛光头座104之间,为方便安装驱动部,两条直线导轨105的中部设有让位缺口,两抛光头座104设置在让位缺口的两侧。当然,用户也可根据需要在基座100上设置一条直线滑 轨105,也可在基座100的下端面针对每个抛光头座104设置两条直线导轨105,在此不做限定。
可选的,抛光台201上设有供液臂303,供液臂303用于向晶圆与抛光垫之间输出抛光液。如图4所示,供液臂303为两条,且关于抛光台201的中点中心对称。也即抛光时,两供液臂303关于丝杠204的中点中心对称,两供液臂303的出口分别朝向一个抛光头200,将抛光液直接喷向晶圆和抛光垫之间,起到散热和冲洗的作用。另外,两供液臂303的出口均可设置在位于经过丝杠204中点的法线上。
可选的,抛光台201上还设有两组抛光修整器301,两组抛光修整器301也关于抛光台201的中点中心对称。抛光修整器301呈杆状,其一端固定设置,另一端通过主轴与修整盘可转动地连接,从而沿圆弧轨迹修整抛光头200上表面的抛光层。
可选的,底板300设有曲线滑轨102,基座101设有与曲线滑轨102相连的滑块103,基座101与底板300间还设有曲线驱动机构,基座101在曲线驱动机构的带动下沿曲线滑轨102移动。曲线滑轨102位于抛光台201的上方,基座将抛光头200移动至抛光台201上方,抛光头200与抛光台201配合进行抛光操作。基座101和抛光台201的数量可根据用户的需要进行设定,例如,抛光装置可设置1个基座101,其与1个或多个抛光台201配合进行抛光作业。抛光装置还可设置2个以上的基座101,每个基座101与1个抛光台201对应,基座101上固定的晶圆在对应的抛光台201上进行抛光作业。抛光装置还可设置2个以上的基座101,抛光台201依抛光精度不同分为多个,完成一片晶圆抛光所需的全部抛光台201为一组,抛光装置可设置1组或多组抛光台201,通常抛光台201的组数不多于基座101的数量。
可选的,曲线滑轨102下方还可设置载片台304,当晶圆完成抛光时,曲线驱动机构带动基座101移动至载片台304上方,抛光头200将晶圆放置在载片台304上。载片台304通常为两个,且分布方式与抛光头200相同,当基座101移动至载片台304上方时两抛光头200刚好与两载片台304对正,因而载片台304应位于曲线滑轨102的投 影中。当然,用户曲线滑轨102下方也可不设置载片台,而是通过机械手等机构将晶圆移动至载片台上。
可选的,曲线滑轨102可具体为两条,两曲线滑轨102为同心的两段圆弧或两个同心圆,基座101的内侧和外侧分别设有两个滑块103,用于分别与两曲线滑轨102相配合。两条曲线滑轨102可使基座101内外两侧受力更加均匀,用户也可根据需要采用一条曲线滑轨102,在此不做限定。
可选的,曲线驱动机构包括曲线磁轨202和曲线直驱电机203。曲线磁轨202设置在底板300上,并与曲线滑轨102同心,曲线直驱电机203设置在基座101中。曲线直驱电机203与曲线磁轨202配合产生动力,使基座101能够沿曲线滑轨102移动。
本申请的一种具体实施方式中,如图4所示,曲线滑轨102呈半圆形,曲线滑轨102中设有一个基座101,曲线滑轨102的一端位于载片台304的上方,另一端位于抛光台201上方。抛光过程中,基座101首先移动至抛光台201上方对晶圆进行抛光,如图4所示,基座101位于抛光台201上方的位置为第一工位。完成抛光后基座101移动至载片台304上方,将晶圆放置在载片台304上并拿取新晶圆,如图5所示,基座101位于载片台304上方的位置为第二工位。基座101由第一工位移动至第二工位的过程中,供液臂303及修整器301旋转移出抛光台201上方,避让抛光装置的曲线运动。当然,用户也可采用其他基座101和抛光台201的分布方式,例如,曲线滑轨102下方可设置两个抛光台201,二者抛光精度不同。基座101在两抛光台201之间移动,完成抛光的晶圆由机械手移动至载片台上。
本申请的另一种具体实施方式中,曲线滑轨102呈环形,曲线滑轨102中设有至少两个基座101。图6中的具体实施方式中曲线滑轨102下方设有3个抛光台201A、201B、201C和两个载片台304304,两载片台304304作为一组与3个抛光台201A、201B、201C沿周向均匀分布,分布位置大致呈正方形。相应的,3个抛光台201A、201B、201C上各设有1套修整器301A、301B、301C和一条供液臂303A、 303B、303C。曲线滑轨102中设有4个基座101,4个基座101分别与3个抛光台201A、201B、201C以及一组载片台304304相对应。每个基座101设有一套抛光组件100A、100B、100C、100D,全部基座101沿曲线滑轨102顺时针或逆时针转动,3个抛光台201A、201B、201C上的抛光垫沿着基座101的转动方向精度逐渐提高。因而基座101转移抛光工位后进行更精细的研磨,最终完成抛光的晶圆移动至两载片台304304上。抛光过程中,3个基座101分别在3个抛光台201A、201B、201C上进行晶圆抛光,另外一个基座101将抛光好的晶圆移动至载片台304304上,并获取新的晶圆。当然,用户也可根据需要设置抛光台201、载片台304和基座101的数量,例如2个、4个、6个等多个抛光台201的组合,2个、4个、6个等多种载片台304组合满足不同产量和工艺流程的需求,在此不做限定。
本具体实施方式抛光装置设置多个抛光台201和基座101,将抛光过程分为多个工序。几个抛光工序同时进行,提高了抛光效率,进而提高晶圆产量。
需要说明的是,在本说明书中,诸如第一和第二之类的关系术语仅仅用来将一个实体与另外几个实体区分开来,而不一定要求或者暗示这些实体之间存在任何这种实际的关系或者顺序。
以上对本发明所提供的抛光装置进行了详细介绍。本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明权利要求的保护范围内。

Claims (3)

  1. 一种抛光装置,其特征在于,包括基座(101),所述基座(101)设有两个抛光头座(104),所述抛光头座(104)设有用以固定晶圆的抛光头(200)和用以带动所述抛光头(200)直线移动的直线驱动机构,还包括底板(300),所述底板(300)设有曲线滑轨(102),所述基座(101)设有与所述曲线滑轨(102)相连的滑块(103)。
  2. 根据权利要求1所述的抛光装置,其特征在于,所述基座(101)设有用以限制所述抛光头座(104)移动路径的直线滑轨(105),所述直线驱动机构带动所述抛光头座(104)沿所述直线滑轨(105)直线移动,每个所述抛光头座(104)均设有一个所述抛光头(200),两所述抛光头座(104)的移动轨迹对称分布,对称轴为两所述抛光头(200)中点所形成的线段的中垂线。
    3、根据权利要求1或2任意一项所述的抛光装置,其特征在于,所述直线驱动机构包括所述抛光头(200)相连的丝杠(204)和用以带动所述丝杠(204)转动的驱动部。
    4、根据权利要求2所述的抛光装置,其特征在于,所述单个抛光头座(104)对应的所述直线滑轨(105)为两条,且对应同一抛光头座(104)的两条所述直线导轨(105)平行设置。
    5、根据权利要求3所述的抛光装置,其特征在于,所述基座(101)与所述底板(300)间还设有用以带动所述基座(101)在曲线滑轨(102)上移动的曲线驱动机构。
    6、根据权利要求5所述的抛光装置,其特征在于,还包括位于所述基座(101)下方的抛光台(201),所述抛光台(201)上设有用以向所述抛光头(200)和所述抛光台(201)之间输出抛光液的供液臂(303),所述供液臂(303)的布局位置关于所述抛光台(201)中点中心对称。
    7、根据权利要求5所述的抛光装置,其特征在于,所述曲线驱动机构包括设置在所述底板(300)上并与所述曲线滑轨(102)同心的曲线磁轨(202),以及设置在所述基座(101)中并与所述曲线磁轨(202)相配合的曲线直驱电机(203)。
  3. 根据权利要求4所述的抛光装置,其特征在于,所述曲线滑轨(102)呈圆弧形或环状,所述曲线滑轨(102)的下方设有至少一个所述抛光台(201)和用以承载成品晶圆的载片台(304),所述抛光台(201)和所述载片台(304)均位于所述曲线滑轨(102)在水平面的投影覆盖的范围内。
    9、根据权利要求4所述的抛光装置,其特征在于,所述曲线滑轨(102)呈圆弧形或环状,所述曲线滑轨(102)下方仅设置所述抛光台(201)至少两个所述抛光台(201),全部所述抛光台(201)均位于所述曲线滑轨(102)在水平面的投影覆盖的范围内,载片台(304)位于所述曲线滑轨(102)在水平面的投影覆盖的范围外。
    10、根据权利要求4所述的抛光装置,其特征在于,所述曲线滑轨(102)连接有至少2个所述基座(101)。
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