WO2022113523A1 - Composition de résine époxyde, produit durci et complexe - Google Patents

Composition de résine époxyde, produit durci et complexe Download PDF

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Publication number
WO2022113523A1
WO2022113523A1 PCT/JP2021/036599 JP2021036599W WO2022113523A1 WO 2022113523 A1 WO2022113523 A1 WO 2022113523A1 JP 2021036599 W JP2021036599 W JP 2021036599W WO 2022113523 A1 WO2022113523 A1 WO 2022113523A1
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Prior art keywords
epoxy resin
resin composition
component
elastic modulus
storage elastic
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PCT/JP2021/036599
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English (en)
Japanese (ja)
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侑紀 佐藤
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株式会社スリーボンド
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Priority to JP2022565094A priority Critical patent/JPWO2022113523A1/ja
Publication of WO2022113523A1 publication Critical patent/WO2022113523A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used

Definitions

  • the present invention relates to epoxy resin compositions, cured products and composites.
  • epoxy resin compositions have excellent adhesive strength, sealing properties, high strength, heat resistance, electrical properties, and chemical resistance, and therefore have been excellent in adhesives, sealing agents, potting agents, coating agents, conductive pastes, etc. It has been used for various purposes. However, it is known that many of the above characteristics have temperature dependence, and the characteristics generally deteriorate significantly above the glass transition temperature.
  • Japanese Patent Application Laid-Open No. 2006-63154 contains a cured product containing an epoxy compound and an anionic polymerization initiator such as potassium acetate, which can suppress deterioration of characteristics due to heating.
  • the resulting epoxy resin composition is disclosed.
  • Composition [2] The epoxy resin composition according to [1], wherein the tan ⁇ peak value (25 to 350 ° C.) of the cured product cured by heating in an atmosphere of 120 ° C. for 120 minutes is 0.19 or less.
  • the storage elastic modulus maintenance rate 250 ° C storage elastic modulus (GPa) / 25 ° C.
  • the compound of the general formula (1) of the component (B) is contained in a ratio of 0.001 to 5.0 mol with respect to 1 mol (total amount) of the epoxy group of the component (A) [5]. ]
  • the epoxy resin composition according to. [7] The epoxy resin composition according to [5] or [6], wherein M of the general formula (1) of the component (B) is potassium.
  • the epoxy resin composition according to any one of [1] to [7] which does not contain a curing agent for epoxy resin or a curing accelerator for epoxy resin.
  • the epoxy resin composition according to any one of [1] to [8] which does not contain a monofunctional epoxy resin.
  • the tan ⁇ peak value (25 to 350 ° C.) of the cured product cured by heating for 120 minutes in an atmosphere of 120 ° C. is 0.19 or less, and the storage elastic modulus maintenance rate (storage elastic modulus at 250 ° C. (250 ° C.)
  • the present invention comprises an epoxy resin having a glycidyl group bifunctional or higher in one molecule as a component (A), and a polymerization initiator having a butoxy group and an alkali metal in one molecule as a component (B).
  • X to Y is used in the meaning which includes the numerical values (X and Y) described before and after it as the lower limit value and the upper limit value, and means "X or more and Y or less”.
  • any epoxy resin having two or more functional glycidyl groups in one molecule can be used without particular limitation.
  • the component (A) can be used as a liquid or a solid at 25 ° C., but a liquid component (A) is preferably liquid at 25 ° C. from the viewpoint of obtaining handleability.
  • the handling property means that the epoxy resin composition has a low viscosity and is easy to apply.
  • the component (A) may have two or more glycidyl groups in one molecule, but preferably has two glycidyl groups in one molecule (two glycidyl groups in one molecule). The group is present) is preferred.
  • the content (A) is not particularly limited, but for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type, bisphenol AD type epoxy resin and other bisphenol type epoxy resin, hydrided bisphenol type epoxy resin, and the like.
  • the commercially available product of the component (A) is not particularly limited, but for example, jER (registered trademark) 828, 1001, 801, 806, 807, 152, 604, 630, 871, YX8000, YX8034, YX4000 (Mitsubishi Chemical Co., Ltd.).
  • jER registered trademark
  • Epicron registered trademarks 830, 850, 830LVP, 850CRP, 835LV, HP4032D, 703, 720, 726, 820 (manufactured by DIC Corporation)
  • EP4920 (manufactured by ADEKA CORPORATION); TEPIC (registered trademark) series (manufactured by Nissan Chemical Industry Co., Ltd.); KF-101, KF-1001, KF-105, X-22-163B, X-22-9002 (Shinetsu Chemical Co., Ltd.) (Manufactured by Kogyo Co., Ltd.); Denacol EX411, 314, 201, 212, 252 (manufactured by Nagase ChemteX Corporation); DER-331, 332, 334, 431, 542 (manufactured by Dow Chemical Co., Ltd.); YH-434, YH-434L (Manufactured by Nippon Steel Sumitomo Chemical Co., Ltd.), etc., but are not limited to these.
  • the component (B) according to the present invention is not particularly limited as long as it is a polymerization initiator having a butoxy group and an alkali metal in one molecule.
  • it is intended to provide an epoxy resin composition capable of obtaining a cured product having low temperature curability and suppressing deterioration of characteristics due to heating by selecting the component (B) of the present invention among the polymerization initiators.
  • the butoxy groups include an n-butoxy group (CH 3 CH 2 CH 2 CH 2 -O-), an isobutoxy group ((CH 3 ) 2 CHCH 2 -O-), and a sec-butoxy group (CH 3 CH 2 ).
  • the tert-butoxy group is preferable from the viewpoint of low-temperature curability and further improvement of the effect of suppressing deterioration of characteristics due to heating.
  • examples of the component (B) include the polymerization initiator of the general formula (1).
  • M represents an alkali metal.
  • the alkali metal include lithium, sodium, potassium, rubidium and the like, preferably sodium and potassium, and particularly preferably potassium.
  • the component (A) is three-dimensionally crosslinked at the time of curing (for example, by a curing catalyst), but this reaction leaves many uncrosslinked portions. There is a problem that this uncrosslinked portion contributes to a sharp decrease in the storage elastic modulus and leads to a change in the characteristics of the epoxy resin composition due to a temperature change.
  • the present invention has found an epoxy resin composition that can obtain a cured product that is less affected by the glass transition point by using the component (B) according to the present invention among the polymerization initiators. The reason why the cured product of the epoxy resin composition is less affected by the glass transition point by the component (B) according to the present invention is not clear, but the component (B) according to the present invention is the component (A) according to the present invention.
  • an epoxy resin composition having an extremely small tan ⁇ peak value can be obtained by controlling the polymerization reaction of the above and suppressing or eliminating the rapid decrease in the storage elastic coefficient by reducing the number of uncrosslinked portions.
  • the technical scope of the present invention is not limited by the above reasoning.
  • the component (B) can further improve low temperature curability, it is preferable to dilute it with an organic solvent having a boiling point of 50 to 150 ° C., and more preferably, an organic substance having a boiling point of 55 to 100 ° C. It is a solvent.
  • the organic solvent is not particularly limited, and examples thereof include THF (tetrahydrofuran, boiling point 66 ° C.), n-hexane (boiling point 69 ° C.), 2-methyl-2-propanol (boiling point 83 ° C.), and the like.
  • the concentration is not particularly specified, but for example, the component (B) is 1 to 99% by mass, more preferably 5 to 50% by mass.
  • component (B) examples include lithium tert-butoxide, sodium tert-butoxide, potassium tert-butoxide, rubidium tert-butoxide and the like, with sodium tert-butoxide and potassium tert-butoxide being particularly preferable. Further, it is potassium tert-butoxide because it is possible to provide an epoxy resin composition capable of obtaining a cured product having low temperature curability and suppressing deterioration of characteristics due to heating. These may be used alone or in combination of two or more.
  • the amount of the component (B) added is not particularly limited, but is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass with respect to 100 parts by mass of the component (A). More preferably, it is 0.5 to 5 parts by mass.
  • the amount of the component (B) added is 0.7 with respect to 100 parts by mass of the component (A). It is preferably about 2.8 parts by mass, and particularly preferably more than 0.7 parts by mass and less than 2.8 parts by mass.
  • the above-mentioned addition amount means the amount of the active ingredient.
  • the compound of the general formula (1) of the component (B) is contained in 0.001 to 5.0 mol. , More preferably 0.003 to 1.0 mol, and particularly preferably 0.003 to 0.5 mol.
  • an epoxy resin composition capable of further obtaining a cured product having low temperature curability and capable of suppressing deterioration of characteristics due to heating.
  • the addition amount of the compound of the general formula (1) of the component (B) is the amount of the component (A).
  • the total amount of the epoxy group (or glycidyl group) is 1 mol, it is preferably 0.01 to 0.05 mol, and more preferably more than 0.01 mol and less than 0.05 mol.
  • any additive component can be further contained as long as the characteristics of the epoxy resin composition are not impaired.
  • the component include an adhesive improving component such as a filler, a plasticizer, a solvent, a monofunctional epoxy resin, a curing agent for an epoxy resin, a curing accelerator for an epoxy resin, a photoinitiator, and a silane coupling agent, and a dispersant.
  • an adhesive improving component such as a filler, a plasticizer, a solvent, a monofunctional epoxy resin, a curing agent for an epoxy resin, a curing accelerator for an epoxy resin, a photoinitiator, and a silane coupling agent, and a dispersant.
  • Leveling agents, wetting agents, surfactants such as defoaming agents, antistatic agents, surface lubricants, rust preventives, preservatives, storage stabilizers such as borate esters, leology adjusters, colorants, UV absorbers , Antioxidant and the like may be contained.
  • the epoxy resin composition of the present invention does not contain a curing agent for epoxy resin, a curing accelerator for epoxy resin, and a monofunctional epoxy resin.
  • the epoxy resin composition does not contain a curing agent for epoxy resin or a curing accelerator for epoxy resin. In a preferred embodiment of the present invention, the epoxy resin composition does not contain a curing agent for epoxy resin and a curing accelerator for epoxy resin.
  • the epoxy resin composition does not contain a monofunctional epoxy resin (an epoxy resin in which one glycidyl group is present in one molecule).
  • Examples of the filler include organic powder, inorganic powder, metallic powder and the like.
  • Examples of the filler of the inorganic powder include silica, glass, alumina, mica, ceramics, silicone rubber powder, calcium carbonate, aluminum nitride, carbon powder, kaolin clay, clay minerals, diatomaceous earth and the like.
  • the addition of the inorganic powder is not particularly limited, but is preferably 0.01 to 500 parts by mass, more preferably 0.1 to 300 parts by mass, and particularly preferably 0.1 to 300 parts by mass with respect to 100 parts by mass of the component (A). 3 to 150 parts by mass. These may be used alone or in combination of two or more.
  • the silica can be blended for the purpose of adjusting the viscosity of the epoxy resin composition or improving the mechanical strength of the cured product.
  • those hydrophobized with organochlorosilanes, polyorganosiloxane, hexamethyldisilazane and the like can be used.
  • Specific examples of silica include, for example, trade names Aerosil (registered trademark) R974, R972, R972V, R972CF, R805, R812, R812S, R816, R8200, RY200, RX200, RY200S, R202 and the like (manufactured by Nippon Aerosil Co., Ltd.). Commercially available products can be mentioned. These may be used alone or in combination of two or more.
  • Examples of the organic powder include polyethylene, polypropylene, nylon, crosslinked acrylic, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate.
  • the amount of the organic powder added is preferably 0.01 to 500 parts by mass, more preferably 0.1 to 300 parts by mass, and particularly preferably 3 to 3 parts by mass with respect to 100 parts by mass of the component (A). It is 150 parts by mass. These may be used alone or in combination of two or more.
  • the metallic powder is not particularly limited, and examples thereof include gold powder, silver powder, copper powder, nickel powder, palladium powder, tungsten powder, plating powder, and alumina powder.
  • the amount of the metallic powder added is preferably 0.01 to 500 parts by mass, more preferably 0.1 to 300 parts by mass, and particularly preferably 3 with respect to 100 parts by mass of the component (A). ⁇ 150 parts by mass. These may be used alone or in combination of two or more.
  • the epoxy resin composition of the present invention can be produced by a conventionally known method. For example, a predetermined amount of the component (A), the component (B), and other optional components are blended, and a mixing means such as a mixer such as a planetary mixer is used, preferably at a temperature of 10 to 70 ° C., more preferably. It can be produced by mixing at 20 to 50 ° C., particularly preferably at room temperature (25 ° C.), preferably for 0.1 to 5 hours, more preferably for 30 minutes to 3 hours, and particularly preferably for about 60 minutes.
  • a mixing means such as a mixer such as a planetary mixer is used, preferably at a temperature of 10 to 70 ° C., more preferably. It can be produced by mixing at 20 to 50 ° C., particularly preferably at room temperature (25 ° C.), preferably for 0.1 to 5 hours, more preferably for 30 minutes to 3 hours, and particularly preferably for about 60 minutes.
  • the epoxy resin composition of the present invention can be suitably used as an adhesive. That is, a complex adhered using the epoxy resin composition of the present invention is also an embodiment of the present invention.
  • ⁇ Applying method> As a method for applying the epoxy resin composition of the present invention to a substrate, a known adhesive method is used. For example, methods such as dispensing, spraying, inkjet printing, screen printing, gravure printing, dipping, and spin coating using an automatic coating machine can be used.
  • a cured product obtained by curing the epoxy resin composition of the present invention is also an embodiment of the present invention.
  • a cured product obtained by heat-curing the epoxy resin composition of the present invention is also a form of the present invention.
  • the temperature and time for heating may be as long as they can be sufficiently cured, but for example, at 75 to 160 ° C., for example, 10 seconds to 300 minutes, preferably 20 seconds to 180 minutes, and more preferably 30 seconds to 150 minutes. It is appropriate to heat under the condition of minutes. Preferably, the conditions of 75 to 160 ° C. for 20 seconds to 180 minutes are suitable.
  • the main curing may be carried out after preheating at a temperature of 40 to 75 ° C. for 30 to 90 minutes.
  • the epoxy resin composition contains an organic solvent (for example, ethanol), the preheating is preferable because the organic solvent can be volatilized.
  • the epoxy resin composition of the present invention preferably has a storage elastic modulus of 5% or more, more preferably 5 to 99%, and even more preferably 5 to 99%, from the viewpoint of less deterioration of characteristics due to heating. It is 7 to 95%, particularly preferably 10 to 80%. That is, in a preferred embodiment of the present invention, the epoxy resin composition has a storage elastic modulus retention rate (250 ° C. storage elastic modulus (GPa) / 25 ° C.) of the cured product cured by heating in an atmosphere of 120 ° C. for 120 minutes.
  • the storage elastic modulus (GPa) ⁇ 100) is 5% or more (more preferably 5 to 99%, still more preferably 7 to 95%, particularly preferably 10 to 80%).
  • the storage elastic modulus retention rate of the epoxy resin composition adopts the value measured according to the following method. Specifically, the test method is as follows.
  • the epoxy resin composition of the present invention was preheated in an atmosphere of 70 ° C. for 60 minutes and then heated in an atmosphere of 120 ° C. for 120 minutes to be cured to obtain a strip-shaped test piece of 10 mm ⁇ 50 mm ⁇ 0.5 mm. rice field.
  • This test piece was measured using a dynamic viscoelasticity measuring device DMS6100 (manufactured by Hitachi High-Tech Science Co., Ltd.) in a tensile mode with a temperature range of 25 to 350 ° C., a heating rate of 5 ° C./min, and a frequency of 1 Hz.
  • the storage elastic modulus E'(GPa) at 25 ° C. and the storage elastic modulus E'(GPa) at 250 ° C. were measured, and the storage elastic modulus maintenance rate (%) was determined by the following formula.
  • Storage elastic modulus maintenance rate (%) (Storage modulus E'at 250 ° C / storage elastic modulus E'at 25 ° C) x 100
  • the epoxy resin composition of the present invention preferably has a tan ⁇ peak value of 0.19 or less, more preferably 0.18 or less, and particularly preferably 0.14, from the viewpoint of less deterioration of characteristics due to heating. It is as follows. That is, in a preferred embodiment of the present invention, the epoxy resin composition has a tan ⁇ peak value (25 to 350 ° C.) of 0.19 or less (more preferably) of the cured product cured by heating in an atmosphere of 120 ° C. for 120 minutes. Is 0.18 or less, particularly preferably 0.14 or less). Since the lower the tan ⁇ peak value is, the more preferable it is, the lower limit is not particularly limited, and it is usually more than 0, but for example, it is more than 0.02, preferably 0.05 or more.
  • the tan ⁇ peak value of the epoxy resin composition adopts the value measured according to the following method. Specifically, the test method is as follows.
  • the epoxy resin composition of the present invention was preheated in an atmosphere of 70 ° C. for 60 minutes and then heated in an atmosphere of 120 ° C. for 120 minutes to be cured to obtain a strip-shaped test piece of 10 mm ⁇ 50 mm ⁇ 0.5 mm. rice field.
  • This test piece was measured using a dynamic viscoelasticity measuring device DMS6100 (manufactured by Hitachi High-Tech Science Co., Ltd.) in a tensile mode with a temperature range of 25 to 350 ° C., a heating rate of 5 ° C./min, and a frequency of 1 Hz.
  • the tan ⁇ peak value in the temperature range of 25 to 350 ° C. was calculated.
  • a cured product that is less affected by the glass transition point means that the tan ⁇ peak value is 0.19 or less. Further, the smaller the tan ⁇ peak value, the less the deterioration of physical properties due to heating. Specifically, the tan ⁇ peak value is preferably 0.18 or less, and more preferably 0.14 or less.
  • the tan ⁇ peak value (25 to 350 ° C.) of the cured product cured by heating in an atmosphere of 120 ° C. for 120 minutes is 0.19 or less, and the storage elastic modulus maintenance rate (250 ° C.) is maintained.
  • the present invention relates to a cured product obtained by curing the epoxy resin composition of the present invention, which has a storage elastic modulus (GPa) / 25 ° C. storage elastic modulus (GPa) ⁇ 100) of 5% or more.
  • reaction start temperature by differential scanning calorimetry is preferably 75 to 160 ° C., more preferably.
  • the temperature is 80 to 140 ° C, particularly preferably 85 to 120 ° C.
  • the value measured according to the following method is adopted as the reaction start temperature by the differential scanning calorimetry of the epoxy resin composition.
  • the test method is as follows.
  • the reaction start temperature was measured using differential scanning calorimetry (DSC).
  • DSC differential scanning calorimetry
  • a DSC110 manufactured by Seiko Instruments Inc. was used for the DSC measurement, and the temperature was raised from 30 to 200 ° C. at a heating rate of 10 ° C./min under a nitrogen atmosphere.
  • the reaction start temperature was defined as the temperature at the intersection of the baseline of the graph of the DSC measurement result and the tangent at the inflection of the peak.
  • the epoxy resin composition of the present invention can be used in various fields (for example, as an adhesive) such as an automobile field, a railroad vehicle field, an aerospace field, an electric / electronic component field, a construction field, and a civil engineering field, but is preferable. , In the automotive field.
  • Adhesive applications in the automobile field are not particularly limited, but may include caulking (hemming) adhesion for fixing the outer panel and the inner panel, and more specifically, panels constituting automobile doors, pillars, and roofs. Adhesion, adhesion between the body and the roof, etc.
  • ⁇ Ingredient (A)> a1 Bisphenol A type diglycidyl ether having an epoxy equivalent of 189 (jER (registered trademark) 828 manufactured by Mitsubishi Chemical Corporation, liquid at 25 ° C., having bifunctional glycidyl group in one molecule)
  • a'1 Monoglycidyl phenyl ether (molecular weight 150) (reagent) (having one functional glycidyl group in one molecule)
  • b1 Potassium tert-butoxide (molecular weight 112) (solution consisting of 12% by mass of active ingredient and 88% by mass of THF) (reagent)
  • b'2 Aluminum secondary butoxide (molecular weight 246) (Organix AL-3001 manufactured by Matsumoto Fine Chemical Co., Ltd.)
  • b'3 Epoxy adduct-type latent curing agent obtained using an imidazole compound (Ajinomoto Fine-Techno Co., Ltd. Amicure PN-23)
  • b'4 Potassium acetate (molecular weight 98) (reagent)
  • the epoxy resin composition obtained above was evaluated for low temperature curability, reaction start temperature (° C.), storage elastic modulus maintenance rate (%), and tan ⁇ peak value according to the following method.
  • the test methods of the tests (1) to (4) used in the examples and comparative examples in Table 1 are as follows. The results are shown in Table 1. In addition, "-" in the table means not evaluated.
  • reaction start temperature was measured using differential scanning calorimetry (DSC), and the results are shown in Table 1.
  • DSC110 manufactured by Seiko Instruments Inc. was used for the DSC measurement, and the temperature was raised from 30 to 200 ° C. at a heating rate of 10 ° C./min under a nitrogen atmosphere.
  • the reaction start temperature was defined as the temperature at the intersection of the baseline of the graph of the DSC measurement result and the tangent at the inflection of the peak. Further, "-" in the table means unevaluated, and Comparative Examples 1, 2, 4, and 5 are unevaluated.
  • the reaction starting temperature is preferably 75 to 160 ° C., more preferably 75 to 160 ° C., using differential scanning calorimetry (DSC) from the viewpoint that it can be applied to applications requiring low temperature curability.
  • the temperature is 80 to 140 ° C, particularly preferably 85 to 120 ° C.
  • Storage elastic modulus maintenance rate (%) (Storage modulus E'at 250 ° C / storage elastic modulus E'at 25 ° C) x 100
  • "-" in the table means not evaluated.
  • the storage elastic modulus maintenance rate is preferably 5 to 99%, more preferably 7 to 95%, and particularly preferably 10 to 80% from the viewpoint of less deterioration of characteristics due to heating. be.
  • the tan ⁇ peak value is preferably 0.19 or less, more preferably 0.18 or less, and particularly preferably 0.14 or less, from the viewpoint that the characteristic deterioration due to heating is small.
  • Comparative Examples 1 and 2 in Table 1 are compositions using the b'1 component or the b'2 component instead of the component (B) of the present invention, but the result was that the low temperature curability was inferior. ..
  • Comparative Example 3 is a composition using the b'3 component instead of the component (B) of the present invention, but the storage elastic modulus retention rate is due to the tan ⁇ peak value of 0.20. Was an inferior result.
  • Comparative Example 5 was a composition in which the a'1 component was used instead of the component (A) of the present invention, but the result was that the low temperature curability was inferior.
  • Example 1 The epoxy resin composition of Example 1 was placed in a metal container (diameter 5 cm) and placed in a hot air drying oven set at 70 ° C. for 60 minutes to volatilize the THF in the epoxy resin composition. Then, the epoxy resin composition is applied to a test piece made of SPCC-SD having a width of 25 mm, a length of 100 mm, and a thickness of 1 mm. Then, another SPCC-SD test piece was attached and fixed with a clip so that the overlapping surface was 25 mm ⁇ 10 mm. Then, it was cured in a hot air drying oven set at 120 ° C. for 120 minutes to obtain a test piece.
  • the shear adhesion strength (unit: MPa) was measured at 25 ° C. with a universal tensile tester (tensile speed 10 mm / min.) According to JIS K6850: 1999. The result of Example 1 was 6.9 MPa.
  • the tensile shear adhesive strength is preferably 4 MPa or more, more preferably 5 MPa or more.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

L'objectif de la présente invention est de fournir une composition de résine époxyde qui a une aptitude au durcissement à basse température (75-160 °C), et à partir de laquelle un produit durci qui peut supprimer la détérioration des caractéristiques due au chauffage peut être obtenu. Une composition de résine époxyde selon la présente invention comprend : en tant que composant (A), une résine époxyde ayant au moins deux groupes glycidyle fonctionnels dans une molécule ; et en tant que composant (B), un initiateur de polymérisation ayant un groupe butoxy et un métal alcalin dans une molécule.
PCT/JP2021/036599 2020-11-24 2021-10-04 Composition de résine époxyde, produit durci et complexe WO2022113523A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000053760A (ja) * 1998-08-10 2000-02-22 Toagosei Co Ltd オキセタニル基を有する高分子量重合体の製造方法
WO2012070387A1 (fr) * 2010-11-25 2012-05-31 旭化成イーマテリアルズ株式会社 Résine époxy et composition de résine
JP2014034680A (ja) * 2012-08-10 2014-02-24 Asahi Kasei E-Materials Corp エポキシ樹脂組成物、硬化物及び電子部材
JP2019151682A (ja) * 2018-02-28 2019-09-12 株式会社Adeka アニオン重合開始剤及び該アニオン重合開始剤を含有する重合性組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000053760A (ja) * 1998-08-10 2000-02-22 Toagosei Co Ltd オキセタニル基を有する高分子量重合体の製造方法
WO2012070387A1 (fr) * 2010-11-25 2012-05-31 旭化成イーマテリアルズ株式会社 Résine époxy et composition de résine
JP2014034680A (ja) * 2012-08-10 2014-02-24 Asahi Kasei E-Materials Corp エポキシ樹脂組成物、硬化物及び電子部材
JP2019151682A (ja) * 2018-02-28 2019-09-12 株式会社Adeka アニオン重合開始剤及び該アニオン重合開始剤を含有する重合性組成物

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