WO2022105268A1 - 一种电连接插座、光电模块、笼子及电子设备 - Google Patents

一种电连接插座、光电模块、笼子及电子设备 Download PDF

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Publication number
WO2022105268A1
WO2022105268A1 PCT/CN2021/106234 CN2021106234W WO2022105268A1 WO 2022105268 A1 WO2022105268 A1 WO 2022105268A1 CN 2021106234 W CN2021106234 W CN 2021106234W WO 2022105268 A1 WO2022105268 A1 WO 2022105268A1
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WO
WIPO (PCT)
Prior art keywords
insulating base
electrical connection
connection socket
electrical
module
Prior art date
Application number
PCT/CN2021/106234
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English (en)
French (fr)
Inventor
葛崇俊
颜波
葛金鑫
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202180077917.XA priority Critical patent/CN116918191A/zh
Priority to CA3202857A priority patent/CA3202857A1/en
Priority to JP2023530737A priority patent/JP2023550624A/ja
Priority to EP21893420.6A priority patent/EP4231461A1/en
Priority to KR1020237020477A priority patent/KR20230107863A/ko
Publication of WO2022105268A1 publication Critical patent/WO2022105268A1/zh
Priority to US18/320,372 priority patent/US20230288654A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485—Electrostatic discharge protection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7088—Arrangements for power supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727—Coupling devices presenting arrays of contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/659—Shield structure with plural ports for distinct connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present application relates to the field of communication technologies, and in particular, to an electrical connection socket, an optoelectronic module, a cage and an electronic device.
  • the electronic device When using Ethernet to power an electronic device, the electronic device needs to set an additional power over ethernet (POE) interface, and the POE interface will increase the structural complexity of the electronic device and increase the volume of the electronic device.
  • POE ethernet
  • the electronic device 100 includes an electrical connection socket 10 and an optical module 20 .
  • the electrical connection socket 10 includes an insulating base 101 , a power supply terminal 102 , an upper row of signal terminals 103 and a lower row of signal terminals 104 , wherein the upper row of signal terminals 103 and the lower row of signal terminals 104 are arranged in the insertion slot A ;
  • the optical module 20 includes a metal casing 201 and a power connection terminal 202 and a signal connection terminal 203 provided in the casing 201 .
  • the structure shown in FIG. 2 is formed after the power connection terminals 202 and the signal connection terminals 203 of the optical module 20 are mated with the electrical connection socket 10 in the mating direction (arrow direction) in FIG. 1 .
  • the minimum distance a1 between the power supply terminals 102 and the upper row signal terminals 103 in the electrical connection socket 10 is relatively small, only 0.47 mm, and at the same time, when the optical module 20 in the structure shown in FIG. 3 is an ordinary module with only a signal transmission function in FIG.
  • the minimum distance a2 between the power terminals 102 is also very small, which does not meet the safety standards.
  • the present application provides an electrical connection socket, an optoelectronic module, a cage and an electronic device, which can increase the distance between a power supply terminal and an electrical signal slot in the electrical connection socket, and increase the distance between the power supply terminal and the module when the electrical connection socket is interconnected with modules.
  • the present application provides an electrical connection socket including an insulating base.
  • the insulating base has an upper surface, a lower surface and a side surface for interfitting with a module to be plugged in; and the insulating base includes at least one plug portion.
  • each of the at least one plug-in portion can be connected to a module to be plugged in.
  • each plug-in portion has an electrical connection area for connecting with the power terminal of the module to be plugged in and a signal connection area for connecting with the signal terminal of the module to be plugged in.
  • At least two power terminals are arranged in the electrical connection area, and one end of each power terminal of the at least two power terminals is built into the insulating base, and the other end extends to the lower surface of the insulating base through the insulating base.
  • the power terminal has a connection section for connecting with the power terminal of the module to be plugged in, and the connection port of the connection section is located on the side of the insulating base.
  • the signal connection area the signal connection area is provided with an electrical signal slot, and the opening of the electrical signal slot is also arranged on the side surface of the insulating base.
  • connection ports are all located on the side of the insulating base. It should be understood that since there is a distance difference between the connection section of the power terminal and the electrical signal slot in the direction perpendicular to the lower surface of the insulating base, the connection section of the power terminal and the electrical signal slot are equivalent to a vertical arrangement. Based on this, the distance between the connection segment and the electrical signal slot can be increased by adjusting the position of the connection segment in the power terminal, so as to improve the electromagnetic compatibility (EMC) capability of the electrical connection socket provided by the embodiment of the present application, Make it meet EMC certification standards.
  • EMC electromagnetic compatibility
  • connection section since the electrical signal slot in the electrical connection socket provided by the present application extends beyond the connection section on the mating interface, there is a distance difference between the connection section and the electrical signal slot in the direction perpendicular to the side surface of the insulating base. Based on this, in the mutual direction, the distance between the metal shell of the module to be plugged and the power terminal can be increased to meet the safety standards.
  • the insulating base body has a concave portion whose opening is located on the side surface, and the connection port of the connecting segment is located at the bottom of the concave portion.
  • the recessed portion can further assist in adjusting the distance between the metal shell of the module to be inserted and the power terminal.
  • the electrical connection socket includes a first inner surface and a second inner surface arranged oppositely; along the direction from the upper surface to the lower surface of the insulating base, the electrical connection socket further includes:
  • At least one upper row of signal pins one end of at least one upper row of signal pins is located on the first inner surface, and the other end extends from the interior of the insulating base to the lower surface of the insulating base through metal leads;
  • At least one lower row of signal pins one end of the at least one lower row of signal pins is located on the second inner surface, and the other end extends from the inside of the insulating base to the lower surface of the insulating base through metal leads.
  • the extension direction of the connection section of the power terminal is parallel to the extension direction of the electrical signal slot, and along the arrangement direction of the connection section and the electrical signal slot, the connection section of the power terminal and the upper row of signal pins The distance between them is greater than 1.4mm. It can solve the problem that the distance between the connection section of the power terminal and the upper row of signal pins is too close, and while supporting the transmission rate of 10G/25/56Gbps, it can be compatible with standard optical modules downward to meet the requirements of equipment-related access standards, and can achieve 1U/ 48-port switch optoelectronic integrated plug-in application.
  • the insulating base includes a connecting portion.
  • the electrical connection socket provided by the present application is a single-layer structure.
  • the insulating base may include a first insulating base and a second insulating base, wherein the power terminals are provided on the first insulating base, and the electrical signal sockets are provided on the second insulating base.
  • the first insulating base body and the second insulating base body may be of separate type, which is convenient for disassembly and assembly, or may be integrated.
  • the insulating base body has a center plane, and the center plane is located between the upper surface and the lower surface and is parallel to the lower surface; the insulating base body includes two plug-in parts, and the two plug-in parts face each other with respect to the center called settings.
  • the electrical connection socket provided by the present application has a double-layer structure, so that the density of the connector is higher.
  • the present application provides an optoelectronic module comprising: a casing; a circuit board arranged in the casing, and an electrical signal terminal is provided on the circuit board, and the electrical signal terminal is used for electrical connection with any of the above-mentioned sockets.
  • the signal slot is plug-in connection for signal transmission between the optoelectronic module and the electrical connection socket.
  • the optoelectronic module further includes at least two power terminals, which are insulated from the casing, and one end of the at least two power terminals protrudes from the front end of the casing, and the other end is connected to the circuit board in the casing; at least The two power terminals are electrically connected with the at least two power terminals of the electrical connection socket in a one-to-one correspondence to couple the supply voltage to the electronic device.
  • the optoelectronic module is adapted to the electrical connection socket structure provided by the present application.
  • the connection section of each power supply terminal of the at least two power supply terminals on the electrical connection socket corresponds to the power supply terminal of the optoelectronic module. Therefore, power transmission can be performed between the module to be plugged and the electrical connection socket. Meanwhile, the electrical signal terminal of the optoelectronic module can be plugged into the electrical signal slot of the electrical connection socket provided by the present application to realize signal transmission.
  • the front end of the casing is provided with an insulating base, at least two power terminals are retractably built into the insulating base, and one end of the at least two power terminals passes through the insulating base and protrudes from the casing, The other end is connected to the circuit board in the housing through the insulating base.
  • the electrical signal terminal is a multi-source protocol MSA gold finger terminal.
  • the optoelectronic module is a small form-factor pluggable package SFP module.
  • the present application provides a cage, comprising: a cage shell and a cavity enclosed by the cage shell; the cavity is used to accommodate any of the above-mentioned electrical connection sockets and any of the above-mentioned optoelectronic modules.
  • the present application provides an electronic device, including any of the above-mentioned electrical connection sockets, any of the above-mentioned optoelectronic modules, and any of the above-mentioned cages. It can realize photoelectric integrated transmission and integrated plugging and unplugging.
  • FIG. 1 is a structural diagram of an electronic device in the prior art
  • Fig. 2 is another structural diagram of electronic equipment in the prior art
  • FIG. 4 is a structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 5 is the cross-sectional structure schematic diagram of M place in Fig. 4;
  • Fig. 6 is the structure diagram of the partial structure in Fig. 4.
  • Fig. 7 is the assembly schematic diagram of the structure in Fig. 6;
  • FIG. 8 is a schematic structural diagram of the electrical connection socket shown in FIG. 5;
  • Figure 9 is a schematic cross-sectional view at plane N in Figure 8.
  • FIG. 10 is a structural diagram of the interconnection between the electrical connection socket and the common module in FIG. 8;
  • FIG. 11 is another structural diagram of the interconnection between an electrical connection socket and a common module provided by an embodiment of the application.
  • FIG. 13 is another schematic structural diagram of an electrical connection socket provided by an embodiment of the present application.
  • Figure 15 is a schematic cross-sectional structure diagram at N in Figure 14;
  • 16 is another schematic structural diagram of an electrical connection socket provided by an embodiment of the application.
  • Figure 17 is an exploded view of the optoelectronic module shown in Figure 5;
  • FIG. 18 is a schematic structural diagram of the optoelectronic module shown in FIG. 17;
  • Fig. 19 is another structural schematic diagram of the optoelectronic module shown in Fig. 17;
  • 20 is a schematic structural diagram of a common electrical connection socket for interconnecting a photoelectric module provided by an embodiment of the application;
  • FIG. 21 is another schematic structural diagram of a common electrical connection socket for interconnecting an optoelectronic module provided by an embodiment of the present application.
  • wireless access point devices APs
  • network cameras APs
  • other electronic devices are usually installed in areas such as enterprise campuses, indoor ceilings, or building walls. Since these devices are distributed in a distributed layout, the use of nearby power supply will increase user costs. Therefore, the power supply of these electronic devices is generally realized by power over ethernet (POE).
  • POE power over ethernet
  • the electronic device When using power over Ethernet, the electronic device needs to set an additional POE interface to connect to the Ethernet connector in addition to the conventional optical module to connect with the optical fiber connector.
  • additional POE interfaces in the electronic device will increase the structural complexity of the electronic device and increase the volume of the electronic device.
  • the present application provides an electronic device, which can make each structural component in the entire electronic device meet safety regulations and electromagnetic compatibility (electromagnetic compatibility, EMC) standards.
  • EMC electromagnetic compatibility
  • references in this specification to "one embodiment” or “some embodiments” and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their variants mean “including but not limited to” unless specifically emphasized otherwise.
  • FIG. 4 The structure shown in FIG. 4 is the electronic device 01 provided by the embodiment of the present application
  • FIG. 5 is a schematic cross-sectional structure diagram at the plane M in FIG. 4 . 4 and 5, it can be known that the electronic device 01 includes an electrical connection socket 1, an optoelectronic module 2 and a cage 3, and the electrical connection socket 1 and the optoelectronic module 2 are placed in the cavity B of the cage 3, where the optoelectronic One end of the module 2 is connected to the electrical connection socket 1, and the electrical connection socket 1 and the optoelectronic module can perform power transmission and electrical signal transmission.
  • the other end of the optoelectronic module 2 is provided with an optical fiber interface and a power interface (not shown in the figure).
  • the cavity B is adapted to the structure of the electrical connection socket 1 , and the cavity B can be a double-layer structure as shown in FIG. 4 , or a single-layer structure.
  • the number of cavities B in FIG. 4 is large, so it is only schematically marked, and each cavity B is not marked. It is worth noting that the number of cavities B is not limited to the 6 shown in FIG. 4 , and other numbers can also be set according to requirements, which will not be repeated here.
  • one end of the cage 3 is provided with an opening, so that the optoelectronic module 2 can be inserted into the cavity B from the opening along the first direction and electrically connected to the socket built in the cavity B of the cage 3 1 for inter-matching. It is worth noting that the depth of the cavity B in the first direction in which the optoelectronic module 2 and the electrical connection socket 1 are inserted matches the length of the optoelectronic module 2 and the electrical connection socket 1 after being connected.
  • FIG. 6 shows the structure in FIG. 6 after removing the cage 3 of the connector module 01 shown in FIG. 4 .
  • FIG. 7 shows the fitting process of the electrical connection socket 1 and the optoelectronic module 2 .
  • the optoelectronic module 2 is interfitted with the electrical connection socket 1 , the optoelectronic module 2 is plugged in the first direction in FIG. 7 .
  • FIG. 8 is a schematic structural diagram of the electrical connection socket 1 shown in FIG. 5 .
  • the electrical connection socket 1 includes an insulating base 11.
  • the insulating base 11 can be made of rubber, resin or one or more materials with insulating properties.
  • the insulating base 11 has an upper surface S1 , a lower surface S2 and a side surface for interfitting with the module to be inserted.
  • the upper surface S1 and the lower surface S2 of the insulating base 11 may be arranged parallel to each other.
  • the plane N in FIG. 8 is perpendicular to the upper surface S1 and the lower surface S2 of the insulating base 11
  • the plane O is parallel to the upper surface S1 and the lower surface S2 of the insulating base 11 .
  • FIG. 9 is a schematic cross-sectional view at plane N in FIG. 8 .
  • the electrical connection socket 1 includes a plug-in part Q1 and a plug-in part Q2, the plane O is the central plane of the electrical connection socket 1, and the plug-in part Q1 and the plug-in part Q2 are about the center plane O Symmetrical setting.
  • the structure of the plug-in part Q1 will be introduced in detail. Please continue to refer to the structure shown in FIG. 9 in conjunction with FIG. 8 .
  • the plug-in part Q1 includes two power supply terminals 111 and an electrical signal slot 112 , where the connection port of the power supply terminal 111 is located in an insulating On the side surface P1 of the base body 11 , the opening of the electrical signal socket 112 is located on the side surface P2 of the insulating base body 11 . It should be understood that in the electrical connection socket 1 provided in the present application, the mating connection ports of the power terminals 111 and the electrical signal sockets 112 are all facing the same side of the insulating base 11 .
  • the number of power terminals 111 on the plug-in portion Q1 is not limited to the two shown in FIG. 4 , and the two shown here are only the minimum set number, and the specific number of power terminals 111 can be determined according to needs to be designed, and will not be repeated here.
  • the power terminal 111 in the plug-in portion Q1 can be exemplarily designed as a vertical sheet-like structure.
  • the power terminal 111 has a connection section L, and the connection port of the connection section L is located on the side surface P1 of the insulating base 11 .
  • the extension direction of the connection segment L is parallel to the extension direction of the electrical signal slot 112
  • the arrangement direction of the connection segment L and the electrical signal slot 112 is perpendicular to the lower surface S1 of the insulating base 11 . Therefore, the connection segment L of the power terminal 111 and the electrical signal slot 112 are arranged vertically.
  • the distance between the connection segment and the electrical signal socket 112 can be increased by adjusting the position of the connection segment L in the power terminal 111 , so as to improve the EMC capability of the electrical connection socket 1 provided by the embodiment of the present application, so that it satisfies the EMC-related requirements. Certification standards.
  • the electrical signal slot 112 in the plug-in portion Q1 includes a first inner surface 1121 and a second inner surface 1122 disposed opposite to each other, and the first inner surface 1121 and the second inner surface 1122 are opposite to each other.
  • the first inner surface 1121 and the second inner surface 1122 are oppositely arranged up and down
  • the first inner surface 1121 is provided with an upper row of signal pins 1123
  • the second inner surface 1122 is provided with a lower row of signal pins 1124 .
  • the number of the upper row of signal pins 1123 disposed on the first inner surface 1121 can be set to one or more according to requirements.
  • the number of the lower row of signal pins 1124 of the second inner surface 1122 can be set to one according to requirements. or more than one, which will not be repeated here.
  • each upper row of signal pins 1123 is located on the first inner surface 1121 , and the other end extends through the interior of the insulating base 11 to the lower surface S2 of the insulating base 11 ; one end of each lower row of signal pins 1124 is located on the first inner surface S2 ; Two inner surfaces 1122 , and the other end extends through the interior of the insulating base 11 to the lower surface S2 of the insulating base 11 .
  • the minimum distance between the connection segment L and the upper row of signal pins 1123 is H, and the spacing H can be increased by design to avoid power pulse interference on the power supply terminals 111 when the upper row of signal pins 1123 transmits high-speed signals of more than 10 Gbps. Therefore, the EMC capability of the electrical connection socket 1 provided in the embodiment of the present application can be improved, so that it meets the relevant EMC certification standards. Exemplarily, H may be set to be greater than 1.4 mm. It should be noted that when the electrical connection socket 1 provided in the embodiment of the present application is mated with the optoelectronic module 2, the upper row of signal pins 1123 in the electrical signal slot 112 will bounce for a certain distance in the direction close to the upper surface S1.
  • the minimum distance between the connection segment L and the upper row of signal pins 1123 refers to the minimum distance between the bounced connection segment L and the upper row of signal pins 1123 .
  • connection segment L on the power supply terminal 111 is not limited to the structure in FIG. 9 , which is only schematically divided here to illustrate the minimum distance H between the power supply terminal 111 and the upper row of signal pins 1123 .
  • the optoelectronic module 2 is adapted to the structure of the electrical connection socket 1, power transmission can be performed between the optoelectronic module 2 and the electrical connection socket 1 and electrical signal transmission.
  • the specific structure of the optoelectronic module 2 provided in this application will be described in detail later.
  • the electrical connection socket 1 provided in this application can be applied to various types of packaged interface modules in addition to being connected to the optoelectronic modules 2 provided in this application, such as small form-factor pluggable (SFP) packaged optical modules. modules, electrical port modules and quad Small Form-factor Pluggable (QSFP) packaged optical modules, etc.
  • SFP small form-factor pluggable
  • QSFP quad Small Form-factor Pluggable
  • the electrical signal slot 112 in the electrical connection socket 1 provided by the present application can be adapted to various styles of modules to be inserted.
  • the electrical signal terminal 21 ′ of the module to be inserted is inserted into the electrical signal slot 112 of the electrical connection socket 1 for Signal transmission. Since the common module 2' is not provided with a power supply connection structure, it will not be connected to the power supply terminal 111 of the electrical connection socket 1.
  • the power terminals 111 in the electrical connection socket 1 provided in this application are placed in the insulating base 11, and the connection port of the connecting segment L is located on the side P1 of the insulating base 11, therefore, in the mutual direction, the common module 2'
  • the distance d between the metal shell 22' and the connection segment L can be increased, so as to meet the minimum safety isolation distance requirement of 1.4mm between the 48V power supply terminal 111 and the bottom line ground terminal, and to meet the EMC standard.
  • the insulating base body 11 can also be provided with a recessed portion G whose opening is located on the side surface P1 , and the connecting port of the connecting segment L can be provided at the bottom of the recessed portion G. It should be understood that when the electrical connection socket 1 and the common module 2' are mutually matched, as shown in FIG. 11, the distance between the metal shell 22' of the common module 2' and the connecting segment L not only includes the distance d, but also includes The depth d' of the recessed portion G.
  • the distance between the metal shell 22' of the common module 2' and the power terminal 111 can be further increased, which can better meet the minimum distance of 1.4mm between the 48V power terminal 111 and the bottom line ground terminal.
  • Safety isolation distance requirements, as well as EMC standards can be met.
  • the plug-in portion Q1 and the plug-in portion Q2 are symmetrically arranged with respect to the central plane O, the structure in the plug-in portion Q2 and the structure in the plug-in portion Q1 are in a “mirror” state. The structure is further explained.
  • the electrical connection socket 1 provided by the present application may also include only the plug-in portion Q1, and the specific structure is shown in FIG. Then, it is fixed to the circuit board 4 by welding or crimping, etc., to form an electrical connection. It should be understood that when the electrical connection socket 1 provided by the present application only includes the plug-in portion Q1, the cage 3 shown in FIG. 4 is a single-layer structure at this time.
  • both the upper row of signal pins 1123 and the lower row of signal pins 1124 are led out from the rear end of the lower surface S2 through metal leads.
  • the lower row of signal pins 1124 can also be led out from the front end of the lower surface S2 as shown in FIG. 13 . It should be understood that the lead-out positions of the upper row of signal pins 1123 and the lower row of signal pins 1124 can be set according to requirements, which will not be repeated here.
  • front end and rear end are relative concepts, “front end” refers to the position where the lower surface S2 is closer to the side, and correspondingly, the “rear end” is the position where the lower surface S2 is far from the side.
  • FIG. 14 can also be configured to set an included angle between the extending direction of the electrical signal slot 122 and the lower surface S2 of the insulating base 11 .
  • FIG. 15 is a cross-sectional view of N in FIG. 14 . From the structure shown in FIG. 15 , it can be clearly seen that the extension direction of the connection segment L is parallel to the extension direction of the electrical signal slot 112 , and neither of them is parallel to the extension direction of the electrical signal slot 112 .
  • the lower surface S2 of the insulating base 11 It should be understood that the angle between the extension direction of the electrical signal slot 112 and the lower surface S2 of the insulating base 11 in FIG. 15 can be designed according to requirements, and details are not repeated here.
  • the insulating base 11 may also be provided as two independent parts. Specifically, as shown in FIG. 16 , the power terminals 111 are provided on the first insulating base 11a, and the electrical signal sockets 112 are provided on the second insulating base 11b. During assembly, the power terminals 111 and the electrical signal sockets 112 in the electrical connection socket 1 can be provided as required. It should be understood that in the electrical connection socket 1 shown in FIG.
  • the insulating base 11 can also be set into two independent parts, that is, the power terminals 111 in the plug-in part Q1 and the plug-in part Q2 are both arranged on one insulating base, The electrical signal sockets 112 in the plug-in portion Q1 and the plug-in portion Q2 are arranged on another insulating base body, and the specific structural settings will not be repeated here.
  • FIG. 17 is an exploded view of the photovoltaic module 2 shown in FIG. 5 .
  • the optoelectronic module 2 includes a casing 21, a circuit board 22, two power terminals 23 and a flexible circuit board 24, wherein one end of each power terminal 23 protrudes from the front end of the casing 21, and the other end is connected to the flexible circuit board 24, And each power terminal 23 is insulated from the housing 21 ; one end of the circuit board 22 is provided with an electrical signal terminal 221 . It should be understood that the number of power terminals 23 on the optoelectronic module 2 can be set according to requirements, and details are not repeated here.
  • the components shown in FIG. 17 are assembled to form the structure shown in FIG. 18 .
  • FIG. 18 more clearly illustrates the state in which each power supply terminal 23 protrudes from the housing 21 .
  • the optoelectronic module 2 provided by the embodiment of the present application is used for inter-matching with the electrical connection socket 1
  • the electrical connection socket 1 is the electrical connection socket 1 provided by the present application as shown in FIG. 9
  • the power terminals on the optoelectronic module 2 23 corresponds to the power supply terminals 111 in the electrical connection socket 1 as shown in FIG.
  • the preparation material of the casing 21 is generally metal, when the insulating structure between the power terminals 23 and the casing 21 is used, as shown in FIG. It is separated from the housing 21 by an insulating base 25 .
  • the insulating base 25 may be made of one or more materials with insulating properties, such as rubber, resin, or other materials.
  • the optoelectronic module 2 provided by the embodiment of the present application can not only be interfitted with the electrical connection socket 1 provided by the embodiment of the present application, but also can be compatible with the common electrical connection socket 1 ′ shown in FIG.
  • a socket connected to socket 1 is defined as a common electrical connection socket 1') connection.
  • the electrical signal terminal 221 of the optoelectronic module 2 is electrically connected to the common electrical connection socket 1 ′ for electrical signal transmission;
  • the power supply terminal 23 of the optoelectronic module 2 is electrically connected to the power supply of the common electrical connection socket 1 ′.
  • Terminal 11' is not matched and no power transfer occurs.
  • the insulating base 25 of the optoelectronic module 2 covers the exposed portion of the power terminal 11' to isolate the exposed portion from the housing 21 of the optoelectronic module 2.
  • the power supply terminal 23 shown in FIG. 20 can be arranged in a retractable structure.
  • the common electrical connection socket 1' is not limited to the structure shown in Fig. 20, and is only schematically illustrated here.
  • the optoelectronic module 2 provided in the present application can also be inter-matched with the common electrical connection socket 1' shown in FIG. 21 .
  • the common electrical connection socket 1' in Fig. 21 only has a signal connection function.
  • the electrical connection socket 1 may have different electrical signal slots 112 according to different models of the electrical signal terminals 221 of the optoelectronic module 2 .
  • the electrical signal slot 112 of the electrical connection socket 1 can be an MSA gold finger slot.
  • the optoelectronic module 2 provided by the present application can be prepared by adding at least a pair of retractable elastic power terminals 23 on the basis of the current standard small pluggable SFP package module.

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  • Photovoltaic Devices (AREA)
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Abstract

一种电连接插座、光电模块、笼子及电子设备，该电连接插座包括绝缘基体，该绝缘基体具有上表面、下表面和侧面；绝缘基体包括至少一个插接部，每个插接部包括电连接区和信号连接区；电连接区设有至少两个电源端子，每个电源端子一端内置于绝缘基体，另一端通过绝缘基体延伸至绝缘基体的下表面；每个电源端子具有连接段，连接段的连接口位于绝缘基体的侧面；信号连接区设有电信号插槽，电信号插槽的开口位于绝缘基体的侧面，且电信号插槽超出连接段；沿垂直下表面方向，电信号插槽与连接段具有高度差。该电连接插座可以增大电连接插座中电源端子与电信号插槽间距离，并在电连接插座互配模块时增大电源端子与模块金属壳在互配方向上的距离。

Description

一种电连接插座、光电模块、笼子及电子设备
相关申请的交叉引用
本申请要求在2020年11月23日提交中国专利局、申请号为202011323961.8、申请名称为“一种电连接插座、光电模块、笼子及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中；本申请要求在2020年12月11日提交中国专利局、申请号为202011457092.8、申请名称为“一种电连接插座、光电模块、笼子及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，尤其涉及一种电连接插座、光电模块、笼子及电子设备。
背景技术
使用以太网对电子设备进行供电时，电子设备出需要设置额外的以太网供电(power over ethernet，POE)接口，而POE接口会增加电子设备的结构复杂程度，增大电子设备的体积。为了解决此问题，现有技术中将光与电结合形成一体连接方案。如图1所示的结构中，电子设备100包括电连接插座10和光模块20。具体来说，该电连接插座10包括绝缘基体101、电源端子102、上排信号端子103以及下排信号端子104，其中，上排信号端子103以及下排信号端子104设于插接槽A内；光模块20包括金属的壳体201以及设于壳体201的电源连接端子202和信号连接端子203。在光模块20的电源连接端子202以及信号连接端子203如图1中互配方向(箭头方向)与电连接插座10互配后形成图2中所示出结构。
但是，在如图2所示出电连接插座10与光模块20互配后，电连接插座10中电源端子102与上排信号端子103之间最小的间距a1比较小，仅有0.47mm，且耦合路径长无法增加屏蔽；同时，如图3所示出的结构当光模块20为图3仅具有信号传输功能的普通模块时，普通模块的金属壳体201’与电连接插座10中裸露的电源端子102之间的最小间距a2也很小，不满足安规标准。
发明内容
本申请提供一种电连接插座、光电模块、笼子及电子设备，可以增大电连接插座中电源端子与电信号插槽间距离，以及，在电连接插座互配模块时增大电源端子与模块金属壳在互配方向上的距离。
第一方面，本申请提供一种电连接插座，该电连接插座包括绝缘基体。具体来说，该绝缘基体具有上表面、下表面以及用于与待插模块互配的侧面；且该绝缘基体包括至少一个插接部。应理解，至少一个插接部中的每个插接部可以连接一个待插模块。具体来说，每个插接部具有用于与待插模块的电源端子连接的电连接区和用于与待插模块的信号端子进行连接的信号连接区。电连接区内设有至少两个电源端子，而至少两个电源端子中每个电源端子一端内置于绝缘基体，另一端通过绝缘基体延伸至绝缘基体的下表面。值得注 意的是，电源端子具有用于与待插模块的电源端子连接的连接段，该连接段的连接口位于绝缘基体的侧面。至于信号连接区，该信号连接区内设有电信号插槽，而电信号插槽的开口也设于绝缘基体的侧面，因此本申请提供的电连接插座中电源端子与电信号插槽的配合连接口均位于绝缘基体的侧面。应理解，由于电源端子的连接段与电信号插槽在垂直绝缘基体下表面方向存在距离差，因此电源端子的连接段与电信号插槽之间相当于竖直排列。基于此，可通过调整电源端子中连接段的位置增大连接段与电信号插槽之间距离，以提升本申请实施例提供的电连接插座的电磁兼容性(electro magnetic compatibility，EMC)能力，使其满足EMC认证标准。同时，由于本申请提供的电连接插座内电信号插槽在互配界面上超出连接段，因此，在垂直绝缘基体侧面方向上连接段与电信号插槽间存在距离差。基于此，在互配方向上，待插模块的金属壳与电源端子间的距离可以拉大，从而满足安规标准。
在一个具体的可实施方式中，绝缘基体具有开口位于侧面的凹陷部，且连接段的连接口位于凹陷部的底部。该凹陷部可进一步辅助调整待插模块的金属壳与电源端子间的距离。
在一个具体的可实施方式中，电连接插槽包括相对设置的第一内表面和第二内表面；沿绝缘基体的上表面至下表面方向，电连接插座还包括：
至少一个上排信号针脚；至少一个上排信号针脚的一端位于第一内表面，另一端通过金属引线从绝缘基体内部延伸至绝缘基体的下表面；
至少一个下排信号针脚；至少一个下排信号针脚的一端位于第二内表面，另一端通过金属引线从绝缘基体内部延伸至绝缘基体的下表面。
在一个具体的可实施方式中，电源端子的连接段的延伸方向与电信号插槽的延伸方向平行，且沿连接段与电信号插槽的排列方向，电源端子的连接段与上排信号针脚间的距离大于1.4mm。可以解决电源端子的连接段与上排信号针脚间距离过近问题，并且支持10G/25/56Gbps传输速率的同时，可以往下兼容标准光模块，达到设备相关准入标准要求，可以实现1U/48口交换机光电一体插拔应用。
在一个具体的可实施方式中，绝缘基体包括一个连接部。具体来说，本申请提供的电连接插座为单层结构。当本申请提供的电连接插座为单层结构时，绝缘基体可以包括第一绝缘基体和第二绝缘基体，其中，电源端子设于第一绝缘基体，电信号插槽设于第二绝缘基体。当然，第一绝缘基体和第二绝缘基体可以分体式、便于拆装，也可以为一体式。
在一个具体的可实施方式中，绝缘基体具有中心面，中心面位于上表面与下表面之间、且平行于下表面；绝缘基体包括两个插接部，两个插接部关于中心面对称设置。具体来说，本申请提供的电连接插座为双层结构，使得连接器的密度更大。
第二方面，本申请提供一种光电模块包括:壳体；设于壳体内的电路板，该电路板上设置有电信号端子，该电信号端子用于与上述任一种电连接插座的电信号插槽插装连接，以在光电模块与电连接插座间进行信号传输。该光电模块还包括至少两个电源端子，至少两个电源端子与壳体间绝缘设置，且至少两个电源端子的一端伸出于壳体的前端，另一端与壳体内的电路板连接；至少两个电源端子与电连接插座的至少两个电源端子一一对应电连接，以将供电电压耦合至电子设备。
该光电模块适配本申请提供的电连接插座结构，当该光电模块作为待插模块时，电连接插座上的至少两个电源端子中每个电源端子的连接段与该光电模块的电源端子对应连接，从而可以在待插模块与电连接插座间进行电源传输，同时，该光电模块的电信号端子 可插接于本申请提供的电连接插座的电信号插槽，以实现信号传输。
在一个具体的可实施方式中，壳体的前端设有绝缘基体，至少两个电源端子可伸缩地内置于绝缘基体，且至少两个电源端子的一端穿过绝缘基体、伸出于壳体，另一端穿过绝缘基体与壳体内的电路板连接。
在一个具体的可实施方式中，电信号端子为多源协议MSA金手指端子。
在一个具体的可实施方式中，光电模块为小型可插拔封装SFP模块。
第三方面，本申请提供一种笼子，包括：笼子外壳以及由笼子外壳围成的腔体；腔体用于容纳上述任一种电连接插座和上述任一种光电模块。
第四方面，本申请提供一种电子设备，包括上述任一种电连接插座、上述任一种光电模块和上述任一种笼子。可以实现光电一体传输、一体插拔。
附图说明
图1为现有技术中电子设备的结构图；
图2为现有技术中电子设备的又一结构图；
图3为现有技术中电子设备的又一结构图；
图4为本申请实施方式提供的电子设备的结构图；
图5为图4中M处的剖面结构示意图；
图6为图4中部分结构的结构图；
图7为图6中结构的组装示意图；
图8为图5中所示出的电连接插座的结构示意图；
图9为图8中平面N处的剖面示意图；
图10为图8中电连接插座与普通模块互配结构图；
图11为本申请实施方式提供的又一电连接插座与普通模块互配结构图；
图12为本申请实施方式提供的电连接插座的又一结构示意图；
图13为本申请实施方式提供的电连接插座的又一结构示意图；
图14为本申请实施方式提供的电连接插座的又一结构示意图；
图15为图14中N处的剖面结构示意图；
图16为本申请实施方式提供的电连接插座的又一结构示意图；
图17为图5中所示出的光电模块的爆炸图；
图18为图17中所示出的光电模块的结构示意图；
图19为图17中所示出的光电模块的又一结构示意图；
图20为本申请实施方式提供的光电模块互配普通电连接插座的结构示意图；
图21为本申请实施方式提供的光电模块互配普通电连接插座的又一结构示意图。
具体实施方式
首先介绍一下本申请的应用场景：无线接入点设备(access point，AP)、网络摄像头等电子设备通常安装在企业园区、室内天花板或者建筑墙面等区域。由于这些设备均属于分散式布局，采用就近取电的方式会额外增加用户成本，因此，这些电子设备的供电一般通过以太网供电(power over ethernet，POE)方式实现。
使用以太网供电时，电子设备除了设置常规的光模块以对接光纤连接器以外，还需要设置额外的POE接口以对接以太网连接器。然而，在电子设备设置额外的POE接口会增加电子设备的结构复杂程度，增大电子设备的体积。
为了解决此问题，现有技术中将光与电结合形成一体连接方案。但是如图1和图2所示出的电连接插座10与光模块20一体连接方案中：电连接插座10内上排信号端子103容易受到电源端子102上的电源脉冲干扰；且如图3所示出的方案中，在电连接插座10与仅具信号传输功能的普通模块互配时，电连接插座10中裸露的电源端子102与普通模块的金属壳体201’在互配方向上的最小间距a2也很小，电连接插座10不满足安规要求。
基于上述应用场景，本申请提供了一种电子设备，可以使得整个电子设备内各结构件满足安规及电磁兼容性(electro magnetic compatibility，EMC)标准。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。
图4中所示出的结构为本申请实施例提供的电子设备01，图5为图4中平面M处的剖面结构示意图。结合图4和图5所示出的结构可知，该电子设备01包括电连接插座1、光电模块2和笼子3，电连接插座1与光电模块2置于笼子3的腔体B内，这里光电模块2一端与电连接插座1连接，电连接插座1与光电模块间可进行电源传输和电信号传输。应理解，光电模块2的另一端设有光纤接口和电源接口(图中未示出)。腔体B适配电连接插座1的结构，该腔体B可以为如图4中所示出的双层结构，还可以为单层结构。此处图4中腔体B数目较多，故仅做示意性标识，而未对每一个腔体B进行标注。值得注意的是，腔体B的数目并不限于图4中所示出的6个，还可以根据需求设置其他数目，在此不再赘述。
如图4中所示出的结构，笼子3的一端设置有开孔，以便于光电模块2从开孔沿第一方向插入腔体B内、与内置于笼子3腔体B内的电连接插座1进行互配。值得注意的是，腔体B在光电模块2和电连接插座1插入第一方向上的深度与光电模块2和电连接插座1连接后的长度相匹配。
为了更清晰、直观的表示电连接插座1和光电模块2的连接关系，去除图4中所示出的连接器模块01的笼子3后得到图6中结构。图7则示出了电连接插座1与光电模块2适配过程，在光电模块2相对连接电连接插座1进行互配操作时，光电模块2沿图7中第一方向进行插接操作。
图8为图5中所示出的电连接插座1的结构示意图。如图8示出的结构，该电连接插 座1包括绝缘基体11，示例性的，绝缘基体11可以选用橡胶、树脂或者其他具有绝缘特性的一种或者多种材料制备。且如图8所示，该绝缘基体11具有上表面S1、下表面S2以及用于与待插模块互配的侧面。此处，为了便于图5中光电模块2与电连接插座1之间进行插拔操作，绝缘基体11的上表面S1与下表面S2之间可以相互平行设置。且图8中的平面N垂直于绝缘基体11的上表面S1与下表面S2，平面O平行于绝缘基体11的上表面S1与下表面S2。
图9为图8中平面N处的剖面示意图。结合图8看图9所示出的结构，电连接插座1包括插接部Q1和插接部Q2，平面O为电连接插座1的中心面，插接部Q1和插接部Q2关于中心面O对称设置。
具体介绍一下插接部Q1的结构，请继续结合图8看图9所示出的结构，插接部Q1包括两个电源端子111和电信号插槽112，这里电源端子111的连接口位于绝缘基体11的侧面P1，电信号插槽112的开口位于绝缘基体11的侧面P2。应理解，本申请提供的电连接插座1中电源端子111与电信号插槽112的配合连接口均朝向绝缘基体11的同一侧。
应理解，插接部Q1上的电源端子111的数目并不限于图4中所示出的两个，此处所示出的两个仅为最小设置数目，具体的电源端子111的数目可以根据需求进行设计，在此不再赘述。
图9中插接部Q1内电源端子111示例性的可以设计为立式片状结构，具体来说，电源端子111具有连接段L，该连接段L的连接口位于绝缘基体11的侧面P1。值得注意的是，连接段L的延伸方向与电信号插槽112的延伸方向平行，且连接段L与电信号插槽112排列方向垂直绝缘基体11的下表面S1。因此，电源端子111的连接段L与电信号插槽112之间相当于竖直排列。基于此，可通过调整电源端子111中连接段L的位置增大连接段与电信号插槽112之间距离，以提升本申请实施例提供的电连接插座1的EMC能力，使其满足EMC相关认证标准。
请继续参考图9中所示出的结构，插接部Q1中电信号插槽112包括相对设置的第一内表面1121和第二内表面1122，第一内表面1121和第二内表面1122相对设置(在图9中第一内表面1121和第二内表面1122相当于上下相对设置)，且第一内表面1121设有上排信号针脚1123，第二内表面1122设有下排信号针脚1124。应理解，设置于第一内表面1121的上排信号针脚1123数目可以根据需求设置为1个或者多个，同样的，第二内表面1122的下排信号针脚1124数目可以根据需求设置为1个或者多个，在此不再赘述。
具体如图9所示，每个上排信号针脚1123一端位于第一内表面1121，另一端穿过绝缘基体11内部延伸至绝缘基体11的下表面S2；每个下排信号针脚1124一端位于第二内表面1122，另一端穿过绝缘基体11内部延伸至绝缘基体11的下表面S2。
应理解，连接段L与上排信号针脚1123间的最小距离为H，可以通过设计增大间距H，以避免上排信号针脚1123传输10Gbps以上高速信号时，电源端子111上的电源脉冲干扰，从而可以提升本申请实施例提供的电连接插座1的EMC能力，使其满足EMC相关认证标准。示例性的，可以设置H大于1.4mm。需要注意的是，当本申请实施例提供的电连接插座1与光电模块2互配时，电信号插槽112内上排信号针脚1123会向靠近上表面S1方向弹起一定距离。这里连接段L与上排信号针脚1123间的最小距离是指弹起后的连接段L与上排信号针脚1123间的最小距离。
当然，电源端子111上连接段L的结构并不限于图9中的结构，此处仅是为了示意出 电源端子111与上排信号针脚1123之间的最小距离H进行示意性划分。
在进行本申请提供的电连接插座1与本申请提供的光电模块2的互配操作时，由于光电模块2适配电连接插座1结构，因此光电模块2与电连接插座1间可以进行电源传输和电信号传输。至于本申请提供的光电模块2的具体结构会在后续进行详细介绍。
当然，本申请提供的电连接插座1除了可以连接本申请的提供的光电模块2，还可以应用于各类封装接口模块，例如：小型可插拔(small form-factor pluggable，SFP)封装的光模块、电口模块以及四通道小型可热插拔(quad Small Form-factor Pluggable，QSFP)封装光模块等。具体来说，本申请提供的电连接插座1内的电信号插槽112可以适配各样式待插模块。
当待插模块为如图10所示的普通模块2’(非本申请提供的光电模块2)时，待插模块的电信号端子21’插接于电连接插座1的电信号插槽112进行信号传输。由于普通模块2’上未设置电源连接结构，则不会与电连接插座1的电源端子111连接。应理解，由于本申请提供的电连接插座1内电源端子111置于绝缘基体11内、且连接段L的连接口位于绝缘基体11的侧面P1，因此，在互配方向上，普通模块2’的金属壳体22’与连接段L间的距离d可以拉大，从而可以满足48V电源端子111与底线接地端间距1.4mm最小的安规隔离距离要求，以及，可以满足EMC标准。
当然，还可以如图11所示出的结构，在绝缘基体11设置开口位于侧面P1的凹陷部G，且将连接段L的连接口设于凹陷部G的底部。应理解，电连接插座1与普通模块2’互配时，如图11中所示出的结构，普通模块2’的金属壳体22’与连接段L间的距离不仅包括距离d，还包括凹陷部G的深度d’。换句话说，在互配方向上，普通模块2’的金属壳体22’与电源端子111间的距离可以被进一步拉大，可以更好地满足48V电源端子111与底线接地端间距1.4mm最小的安规隔离距离要求，以及，可以满足EMC标准。
由于插接部Q1和插接部Q2关于中心面O对称设置，则插接部Q2内的结构与插接部Q1内的结构为“镜像”状态，因此，此处未对插接部Q2内的结构进行进一步展开说明。
此外，本申请提供的电连接插座1还可以仅包含插接部Q1，具体如图12所示出的结构，这里电源端子111、上排信号针脚1123和下排信号针脚1124从绝缘基体11引出后通过焊接或者压接等方式与电路板4固定，并形成电气连接。应理解，当本申请提供的电连接插座1仅包含插接部Q1时，此时图4中所示出的笼子3为单层结构。
值得注意的是，图12所示出的结构中上排信号针脚1123和下排信号针脚1124均通过金属引线从下表面S2的后端引出。当然为了方便焊接，还可以如图13中所示出的结构，将下排信号针脚1124从下表面S2的前端引出。应理解，上排信号针脚1123和下排信号针脚1124的引出位置可以根据需求进行设置，在此不再赘述。需要说明的是，这里的“前端”与“后端”是相对概念，“前端”指下表面S2更靠近侧面的位置，相应的，“后端”下表面S2远离侧面的位置。
当然，还可以如图14所示出的结构设置电信号插槽122的延伸方向与绝缘基体11的下表面S2存在夹角。图15为图14中N处的剖视图，由图15中所示出的结构可以清晰的看出，连接段L的延伸方向与电信号插槽112的延伸方向平行，且二者均不平行于绝缘基体11的下表面S2。应理解，图15中电信号插槽112的延伸方向与绝缘基体11的下表面S2间夹角的角度可依据需求进行设计，在此不再赘述。
此外，还可以绝缘基体11设置成独立的两部分。具体来说，如图16所示出的结构， 将电源端子111设置在第一绝缘基体11a上，将电信号插槽112设置在第二绝缘基体11b上。在组装时，可根据需求设置电连接插座1内的电源端子111和电信号插槽112。应理解，图10中所示出的电连接插座1也可以将绝缘基体11设置成独立的两部分，即将插接部Q1和插接部Q2内的电源端子111均设置在一个绝缘基体上，将插接部Q1和插接部Q2内的电信号插槽112设置在另一个绝缘基体上，具体结构设置，在此不再赘述。
图17为图5中所示出的光电模块2的爆炸图。该光电模块2包括壳体21、电路板22、两个电源端子23以及柔性电路板24，其中，每个电源端子23的一端伸出壳体21的前端，另一端与柔性电路板24连接，且每个电源端子23与壳体21之间绝缘设置；电路板22的一端设有电信号端子221。应理解，此处光电模块2上的电源端子23设置数目可以根据需求进行设置，在此不再赘述。图17中各器件组装后形成图18中结构，图18中更清晰地示意出每个电源端子23伸出壳体21的状态。
在应用本申请实施例提供的光电模块2与电连接插座1进行互配时，当电连接插座1为如图9中所示出本申请提供的电连接插座1，光电模块2上的电源端子23与如图9中所示出的电连接插座1内电源端子111一一对应，每个光电模块2的电源端子23伸入与之一一对应的电连接插座1的连接段L内，以在光电模块2与电连接插座1间进行电源传输；同时，该光电模块2的电信号端子221与电连接插座1的电信号插槽112连接，以实现信号传输。
在具体设置，由于壳体21的制备材料一般为金属，因此电源端子23与壳体21之间的绝缘结构时，可以如图19所示，单独设置一个绝缘基体25，使得每个电源端子23与壳体21间被绝缘基体25隔开。此处，绝缘基体25可以选用橡胶、树脂或者其他具有绝缘特性的一种或者多种材料制备。
本申请实施例提供的光电模块2不仅可以与本申请实施例提供的电连接插座1互配，还可与如图20所出的普通电连接插座1’(不同于本申请实施例提供的电连接插座1的插座被定义为普通电连接插座1’)连接。具体如图20所示出的结构，光电模块2的电信号端子221与普通电连接插座1’的电连接以进行电信号传输；光电模块2的电源端子23与普通电连接插座1’的电源端子11’不匹配，不进行电源传输。应理解，此时光电模块2的绝缘基体25覆盖电源端子11’的暴露处，以隔离暴露处与光电模块2的壳体21。
当本申请实施例提供的光电模块2与普通电连接插座1’互配时，还可能存在光电模块2的电源端子23抵接于普通电连接插座1’侧面的情况。基于此，可以将图20中所示出的电源端子23设置成可伸缩结构。
当然，普通电连接插座1’并不限于图20中的结构，此处仅做示意性说明。示例性的，本申请提供的光电模块2还可以与图21中所示出的普通电连接插座1’互配。图21中的普通电连接插座1’仅具有信号连接功能。
应理解，当本申请提供的光电模块2与本申请提供的电连接插座1互配时，根据光电模块2的电信号端子221的型号不同，电连接插座1可以具备不同的电信号插槽112，例如：当光电模块2的电信号端子221是多源协议(multi-source agreement，MSA)金手指端子时，电连接插座1的电信号插槽112可以是MSA金手指插槽。
需要说明的是，本申请提供的光电模块2可以在当前标准小型可插拔SFP封装模块的基础上，增加至少一对可伸缩弹性电源端子23制备形成。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本 技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种电连接插座，其特征在于，包括：绝缘基体，所述绝缘基体具有上表面、下表面和用于与待插模块互配的侧面；所述绝缘基体包括至少一个插接部，每个所述插接部包括用于与待插模块的电源端子进行连接的电连接区和用于与所述待插模块的信号端子进行连接的信号连接区，其中：
    所述电连接区设有至少两个电源端子，所述至少两个电源端子中每个电源端子一端内置于所述绝缘基体，另一端通过所述绝缘基体延伸至所述绝缘基体的下表面；所述至少两个电源端子中每个电源端子具有用于与所述待插模块的电源端子连接的连接段，所述连接段的连接口位于所述绝缘基体的侧面；
    所述信号连接区设有电信号插槽，所述电信号插槽的开口位于所述绝缘基体的侧面，且所述电信号插槽超出所述连接段；沿垂直所述下表面方向，所述电信号插槽与所述连接段具有高度差。
  2. 如权利要求1所述的电连接插座，其特征在于，所述绝缘基体具有开口位于所述侧面的凹陷部，且所述连接段的连接口位于所述凹陷部的底部。
  3. 如权利要求1或2所述的电连接插座，其特征在于，所述电连接插槽包括相对设置的第一内表面和第二内表面；沿所述绝缘基体的上表面至下表面方向，所述电连接插座还包括：
    至少一个上排信号针脚；所述至少一个上排信号针脚的一端位于所述第一内表面，另一端通过金属引线从所述绝缘基体内部延伸至所述绝缘基体的下表面；
    至少一个下排信号针脚；所述至少一个下排信号针脚的一端位于所述第二内表面，另一端通过金属引线从所述绝缘基体内部延伸至所述绝缘基体的下表面。
  4. 如权利要求3所述的电连接插座，其特征在于，所述电源端子的连接段的延伸方向与所述电信号插槽的延伸方向平行；沿所述连接段与所述电信号插槽的排列方向，所述电源端子的连接段与所述上排信号针脚间的距离大于1.4mm。
  5. 如权利要求1-4任一项所述的电连接插座，其特征在于，所述电连接插座包括一个插接部，所述绝缘基体包括第一绝缘基体与第二绝缘基体，所述电源端子设于所述第一绝缘基体，所述电信号插槽设于所述第二绝缘基体，其中：
    所述第一绝缘基体与所述第二绝缘基体具有一体式结构；或者，
    所述第一绝缘基体与所述第二绝缘基体为分体式结构。
  6. 如权利要求1-4任一项所述的电连接插座，其特征在于，所述绝缘基体具有中心面，所述中心面位于所述上表面与所述下表面之间、且平行于所述下表面；所述绝缘基体包括两个插接部，两个所述插接部关于所述中心面对称设置。
  7. 一种光电模块，其特征在于，包括:
    壳体；
    设于所述壳体内的电路板、所述电路板设置有电信号端子，所述电信号端子用于与权利要求1-6任一项所述的电连接插座的电信号插槽插装连接；
    至少两个电源端子，所述至少两个电源端子与所述壳体间绝缘设置，且所述至少两个电源端子的一端伸出于所述壳体的前端，另一端与所述壳体内的柔性电路板连接；所述至少两个电源端子与电连接插座的至少两个电源端子一一对应电连接，以将供电电压耦合至 电子设备。
  8. 如权利要求7所述的光电模块，其特征在于，所述壳体的前端设有绝缘基体，所述至少两个电源端子可伸缩地内置于所述绝缘基体，且所述至少两个电源端子的一端穿过所述绝缘基体、伸出于所述壳体，另一端穿过所述绝缘基体与所述壳体内的柔性电路板连接。
  9. 如权利要求7或8所述的光电模块，其特征在于，所述电信号端子为多源协议MSA金手指端子。
  10. 如权利要求9所述的光电模块，其特征在于，所述光电模块为小型可插拔封装SFP模块。
  11. 一种笼子，其特征在于，包括：笼子外壳以及由笼子外壳围成的腔体；所述腔体用于容纳如权利要求1-6任一项所述的电连接插座和如权利要求7-10任一项所述的光电模块。
  12. 一种电子设备，其特征在于，包括如权利要求1-6任一项所述的电连接插座、如权利要求7-10任一项所述的光电模块和如权利要求11所述的笼子。
PCT/CN2021/106234 2020-11-23 2021-07-14 一种电连接插座、光电模块、笼子及电子设备 WO2022105268A1 (zh)

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