WO2022104864A1 - 一种mems麦克风 - Google Patents
一种mems麦克风 Download PDFInfo
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- WO2022104864A1 WO2022104864A1 PCT/CN2020/131708 CN2020131708W WO2022104864A1 WO 2022104864 A1 WO2022104864 A1 WO 2022104864A1 CN 2020131708 W CN2020131708 W CN 2020131708W WO 2022104864 A1 WO2022104864 A1 WO 2022104864A1
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- wall
- circuit board
- hole
- frame
- mems microphone
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- 239000002184 metal Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the utility model relates to the technical field of micro-electromechanical systems, in particular to a MEMS microphone.
- Microphone scientific name is microphone, translated from English microphone (microphone), also known as microphone or microphone, which is an energy conversion device that converts sound signals into electrical signals.
- MEMS microphones based on MEMS (Micro Electro-Mechanical Systems) technology have demonstrated many advantages in a variety of applications due to their improved noise cancellation performance and good RF (Radio Frequency) and EMI (Electromagnetic Interference) suppression performance , especially in mid- to high-end mobile phone applications.
- the existing MEMS microphone generally includes a casing and a microphone device disposed in the casing, and a shielding layer is provided on the inner surface of the casing to ensure that the microphone device and wiring located in the casing are free from external electromagnetic interference.
- the two traces of VDD PAD and OUT PAD located in the side wall of the casing are not shielded and are exposed to the electromagnetic environment, resulting in a weak overall anti-electromagnetic interference capability of the MEMS microphone.
- the purpose of the utility model is to provide a MEMS microphone, which aims to solve the problem that the overall anti-electromagnetic interference capability of the MEMS microphone in the prior art is weak.
- An embodiment of the present invention provides a MEMS microphone, comprising a first circuit board, a frame disposed on the first circuit board, a second circuit board disposed on the frame, the first circuit board, the frame and the The second circuit board is enclosed to form a cavity, the frame is formed with a through hole along the direction from the first circuit board to the second circuit board, and the through hole is provided with a connection between the first circuit board and the second circuit
- the wiring of the board, a shielding portion is formed on the outer wall of the frame near the through hole, and also includes a MEMS chip and an ASIC chip located in the cavity and inside the first circuit board, the MEMS chip With a back cavity, the MEMS chip is electrically connected to the ASIC chip.
- a notch is formed on the outer wall of the frame near the through hole, an inner wall of the notch is provided with a metal shielding layer, and the notch and the metal shielding layer constitute the shielding portion .
- the outer wall of the frame includes two oppositely arranged first outer walls and two oppositely arranged second outer walls and connected to the two first outer walls respectively, the first outer walls are along the length direction of the frame extending, the second outer wall extends along the width direction of the frame, and the through hole is arranged at a position close to the connection between the first outer wall and the second outer wall.
- the first outer wall is formed with a first shielding groove extending toward the through hole at a position close to the through hole
- the second outer wall is formed with a position close to the through hole toward the through hole.
- a second shielding slot extending in the direction of the through hole and connected to the first shielding slot, the first shielding slot, the second shielding slot and the connection between the first shielding slot and the second shielding slot constitute the notch.
- the first shielding groove includes a first inner sidewall perpendicular to the first outer wall and a first bottom wall parallel to the first outer wall and connected to the first inner sidewall
- the first Two shielding grooves include a second inner side wall perpendicular to the second outer wall and a second bottom wall parallel to the second outer wall and connected to the second inner side wall, the first bottom wall and the second bottom
- the first bottom wall, the second bottom wall and the connection between the first bottom wall and the second bottom wall are provided with the metal shielding layer.
- the metal shielding layer is disposed on the first inner sidewall and the second inner sidewall.
- the first circuit board is provided with an acoustic hole at a position corresponding to the back cavity of the MEMS chip.
- the inner wall of the frame is provided with a metal shielding layer.
- a shielding portion is arranged on the outer wall of the frame near the through hole, so as to isolate the traces located in the through hole from the external environment, free from external electromagnetic interference, and improve the overall anti-electromagnetic interference capability of the MEMS microphone.
- FIG. 1 is a schematic structural diagram of a MEMS microphone provided by an embodiment of the present invention.
- FIG. 2 is an exploded schematic diagram of a MEMS microphone provided by an embodiment of the present invention.
- FIG. 3 is a cross-sectional view of the MEMS microphone provided by the embodiment of the present invention along the direction A-A in FIG. 1 .
- FIG. 1 is a schematic structural diagram of a MEMS microphone provided by an embodiment of the present invention
- FIG. 2 is an exploded schematic view of the MEMS microphone provided by an embodiment of the present invention
- FIG. 3 is an implementation of the present invention.
- the example provides a cross-sectional view of the MEMS microphone along the direction A-A in FIG. 1 .
- an embodiment of the present invention provides a MEMS microphone, comprising a first circuit board 1 , a frame 2 disposed on the first circuit board 1 , and a frame 2 disposed on the frame 2
- the first circuit board 1, the frame 2 and the second circuit board 3 are enclosed to form a cavity 4, and the frame 2 is formed along the first circuit board 1 to the second circuit board.
- 3-direction through holes 21, the through holes 21 are provided with traces 5 connecting the first circuit board 1 and the second circuit board 3, and the outer wall of the frame 2 is formed with a position close to the through holes 21.
- Shield portion 22 is provided.
- the MEMS microphone further includes a MEMS chip 6 and an ASIC chip 7 located in the cavity 4 and disposed inside the first circuit board 1 , the MEMS chip 6 has a back cavity 61 , and the MEMS chip 6 is electrically connected to the ASIC chip 7 . It should be noted that, in order to ensure the normal use of the MEMS microphone, the sound hole 11 needs to be opened at the position of the first circuit board 1 corresponding to the back cavity 61 of the MEMS chip 6 .
- the number of the through holes 21 is not limited to one, and the number of traces 5 in the through hole 21 is not limited to one.
- a plurality of the wires 5 may also be provided with a plurality of the through holes 21 , and one or more of the wires 5 are placed in each of the through holes 21 .
- the trace 5 may include an OUT PAD trace 52 and a VDD PAD trace 51
- the through hole 21 may include a first through hole 212 for accommodating the OUT PAD trace 52 , and a first through hole 212 for accommodating the OUT PAD trace 52
- the second through hole 211 of the VDD PAD trace 51 The number of the through holes 21 and the number of the wires 5 in the through holes 21 are determined according to actual application scenarios, which are not limited in the embodiment of the present invention.
- a shielding portion 22 is provided on the outer wall of the frame 2 near the through hole 21, so as to isolate the wiring 5 located in the through hole 21 from the external environment, and is protected from the external environment. Electromagnetic interference, improve the overall anti-electromagnetic interference capability of MEMS microphones.
- the shielding portion 22 may be a notch 221 formed on the outer wall of the frame 2 at a position close to the through hole 21, and the inner wall of the notch 221 may be provided with a metal shielding layer 222, At this time, the notch 221 and the metal shielding layer 222 isolate the traces 5 located in the through hole 21 from the external environment.
- a metal shielding layer 8 may be provided on the inner wall of the frame 2 .
- the shielding portion 22 is constituted by the notch 221 and the metal shielding layer 222 disposed on the inner wall of the notch 221, which can ensure that when the module including a plurality of the MEMS microphones is cut, no The metal shielding layer 222 located on the inner wall of the notch 221 will be damaged, so as not to affect the overall anti-electromagnetic interference capability of the MEMS microphone.
- the outer wall of the frame 2 may include two first outer walls 23 arranged opposite to each other and two second outer walls 24 arranged oppositely and connected to the two first outer walls 23 respectively.
- the outer wall 23 extends along the length direction of the frame 2
- the second outer wall 24 extends along the width direction of the frame 2
- the through hole 21 can be disposed near the first outer wall 23 and the second outer wall 24 the location of the connection.
- a first shielding groove 231 extending toward the through hole 21 may be formed near the first outer wall 23 of the through hole 21 near the through hole 21 , and close to the second outer wall of the through hole 21 .
- a second shielding groove 241 extending toward the through-hole 21 and connected to the first shielding groove 231 may be formed at a position of 24 near the through hole 21 .
- the first shielding groove 231 , the second shielding groove 241 and the connection between the first shielding groove 231 and the second shielding groove 241 together form the notch 221 .
- the first shielding groove 231 may include a first inner side wall 2311 perpendicular to the first outer wall 23 and a first bottom wall parallel to the first outer wall 23 and connected to the first inner side wall 2311 2312
- the second shielding groove 241 may include a second inner side wall 2411 perpendicular to the second outer wall 24 and a second bottom wall 2412 parallel to the second outer wall 24 and connected to the second inner side wall 2411
- the first bottom wall 2312 is connected with the second bottom wall 2412
- the first bottom wall 2312, the second bottom wall 2412 and the connection between the first bottom wall 2312 and the second bottom wall 2412 are provided with The metal shielding layer 222 .
- the first inner side wall 2311 , the first bottom wall 2312 , the second inner side wall 2411 , the second bottom wall 2412 and the metal shielding layer 222 together constitute the shielding portion 22 .
- the metal shielding layer 222 is not limited to be provided only at the first bottom wall 2312, the second bottom wall 2412 and the connection between the first bottom wall 2312 and the second bottom wall 2412, A metal shielding layer 222 may also be provided on the first inner side wall 2311 and the second inner side wall 2411 at the same time, which is determined according to an actual application scenario, which is not limited in this embodiment of the present invention.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
本实用新型提供一种MEMS麦克风，包括第一线路板，设于所述第一线路板上的框架，设于所述框架上的第二线路板，所述第一线路板、框架及第二线路板围合形成腔体，所述框架形成有沿所述第一线路板至第二线路板方向的通孔，所述通孔内设有连接所述第一线路板及第二线路板的走线，所述框架的外壁靠近所述通孔的位置形成有屏蔽部，还包括位于所述腔体内且设于所述第一线路板内侧的MEMS芯片及ASIC芯片，所述MEMS芯片具有背腔，所述MEMS芯片电连接于ASIC芯片。本实用新型使得位于通孔内的走线不受外部电磁干扰，能够提升MEMS麦克风的整体抗电磁干扰能力。
Description
本实用新型涉及微机电系统技术领域，尤其涉及一种MEMS麦克风。
麦克风，学名为传声器，由英语microphone（送话器）翻译而来，也称话筒或微音器，其是将声音信号转换为电信号的能量转换器件。近些年来，基于MEMS（微型机电系统）技术制造的MEMS麦克风，凭借改进的噪声消除性能与良好的 RF（射频） 及 EMI（电磁干扰） 抑制性能，已在多种应用中体现出了诸多优势，特别是在中高端手机应用中。
现有的MEMS麦克风一般包括壳体及设置在壳体内的麦克风器件，壳体内表面设置屏蔽层，以确保位于壳体内的麦克风器件及布线不受外部电磁干扰。但是，位于壳体侧壁内的VDD PAD及OUT PAD两根走线却没有得到屏蔽，暴露于电磁环境，导致MEMS麦克风的整体抗电磁干扰能力较弱。
因此，有必要对上述MEMS麦克风的结构进行改进。
本实用新型的目的在于提供一种MEMS麦克风，旨在解决现有技术中MEMS麦克风的整体抗电磁干扰能力较弱的问题。
本实用新型的技术方案如下：
本实用新型实施例提供一种MEMS麦克风，包括第一线路板，设于所述第一线路板上的框架，设于所述框架上的第二线路板，所述第一线路板、框架及第二线路板围合形成腔体，所述框架形成有沿所述第一线路板至第二线路板方向的通孔，所述通孔内设有连接所述第一线路板及第二线路板的走线，所述框架的外壁靠近所述通孔的位置形成有屏蔽部，还包括位于所述腔体内且设于所述第一线路板内侧的MEMS芯片及ASIC芯片，所述MEMS芯片具有背腔，所述MEMS芯片电连接于ASIC芯片。
在一些实施例中，所述框架的外壁靠近所述通孔的位置形成有凹口，所述凹口的内壁设有金属屏蔽层，所述凹口及所述金属屏蔽层构成所述屏蔽部。
在一些实施例中，所述框架的外壁包括两相对设置的第一外壁及两相对设置且分别与两所述第一外壁连接的第二外壁，所述第一外壁沿所述框架的长度方向延伸，所述第二外壁沿所述框架的宽度方向延伸，所述通孔设置在靠近所述第一外壁与所述第二外壁的连接处的位置。
在一些实施例中，所述第一外壁靠近所述通孔的位置形成有向所述通孔方向延伸的第一屏蔽槽，所述第二外壁靠近所述通孔的位置形成有向所述通孔方向延伸且与所述第一屏蔽槽连接的第二屏蔽槽，所述第一屏蔽槽、第二屏蔽槽及第一屏蔽槽与第二屏蔽槽的连接处构成所述凹口。
在一些实施例中，所述第一屏蔽槽包括垂直于所述第一外壁的第一内侧壁及平行于所述第一外壁且连接所述第一内侧壁的第一底壁，所述第二屏蔽槽包括垂直于所述第二外壁的第二内侧壁及平行于所述第二外壁且连接所述第二内侧壁的第二底壁，所述第一底壁与所述第二底壁连接，所述第一底壁、第二底壁及第一底壁与第二底壁的连接处设有所述金属屏蔽层。
在一些实施例中，所述第一内侧壁及第二内侧壁上设有所述金属屏蔽层。
在一些实施例中，所述第一线路板对应所述MEMS芯片的背腔的位置开设有声孔。
在一些实施例中，所述框架的内壁设有金属屏蔽层。
从上述描述可知，与现有技术相比，本实用新型的有益效果在于：
在框架的外壁靠近通孔的位置设置屏蔽部，将位于通孔内的走线与外部环境隔离，不受外部电磁干扰，提升MEMS麦克风的整体抗电磁干扰能力。
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，而不是全部实施例。对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1为本实用新型实施例提供的MEMS麦克风的结构示意图；
图2为本实用新型实施例提供的MEMS麦克风的分解示意图；
图3为本实用新型实施例提供的MEMS麦克风沿图1中A-A方向的剖视图。
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。此外，下面所描述的本实用新型的各个实施方式中所涉及到的技术特征只要彼此之间未构成冲突就可以相互组合。
请参阅图1、图2以及图3，图1为本实用新型实施例提供的MEMS麦克风的结构示意图，图2为本实用新型实施例提供的MEMS麦克风的分解示意图，图3为本实用新型实施例提供的MEMS麦克风沿图1中A-A方向的剖视图。
如图1、图2以及图3所示，本实用新型实施例提供一种MEMS麦克风，包括第一线路板1，设于所述第一线路板1上的框架2，设于所述框架2上的第二线路板3，所述第一线路板1、框架2及第二线路板3围合形成腔体4，所述框架2形成有沿所述第一线路板1至第二线路板3方向的通孔21，所述通孔21内设有连接所述第一线路板1及第二线路板3的走线5，所述框架2的外壁靠近所述通孔21的位置形成有屏蔽部22。
具体的，所述MEMS麦克风还包括位于所述腔体4内且设于所述第一线路板1内侧的MEMS芯片6及ASIC芯片7，所述MEMS芯片6具有背腔61，所述MEMS芯片6电连接于ASIC芯片7。应当说明的是，为了保证MEMS麦克风的正常使用，需要在所述第一线路板1对应所述MEMS芯片6的背腔61的位置开设声孔11。
可以理解，所述通孔21的数量不限于一个，所述通孔21内走线5的数量也不限于一个，可以设置一个所述通孔21，并在所述通孔21内放置一个/多个所述走线5，也可以设置多个所述通孔21，并在每一所述通孔21内放置一个/多个所述走线5。作为一种示例，所述走线5可以包括OUT PAD走线52及VDD PAD走线51，所述通孔21可以包括容置所述OUT PAD走线52的第一通孔212，及容置所述VDD PAD走线51的第二通孔211。所述通孔21的数量及所述通孔21内走线5的数量均是根据实际应用场景确定的，本实用新型实施例对此不做限定。
本实用新型实施例提供的MEMS麦克风，在所述框架2的外壁靠近所述通孔21的位置设置屏蔽部22，将位于所述通孔21内的走线5与外部环境隔离，不受外部电磁干扰，提升MEMS麦克风的整体抗电磁干扰能力。
作为一种可行的实施方式，所述屏蔽部22可以为形成于所述框架2外壁靠近所述通孔21的位置的凹口221，所述凹口221的内壁可以设有金属屏蔽层222，此时，所述凹口221及金属屏蔽层222将位于所述通孔21内的走线5与外部环境隔离。同理，为了保证所述腔体4内的麦克风器件不受外部电磁干扰，可以在所述框架2的内壁设置金属屏蔽层8。
应当说明的是，在所述MEMS麦克风的批量生产中，需要将包括多个所述MEMS麦克风的模组进行切分，以得到单一的产品，即单一的所述MEMS麦克风。因此，以所述凹口221及设于所述凹口221的内壁的金属屏蔽层222构成所述屏蔽部22，能够保证在对包括多个所述MEMS麦克风的模组进行切分时，不会破坏位于所述凹口221的内壁的金属屏蔽层222，以免影响所述MEMS麦克风的整体抗电磁干扰能力。
作为另一种可行的实施方式，所述框架2的外壁可以包括两相对设置的第一外壁23及两相对设置且分别与两所述第一外壁23连接的第二外壁24，所述第一外壁23沿所述框架2的长度方向延伸，所述第二外壁24沿所述框架2的宽度方向延伸，所述通孔21可以设置在靠近所述第一外壁23与所述第二外壁24的连接处的位置。
进一步的，靠近所述通孔21的第一外壁23靠近所述通孔21的位置可以形成有向所述通孔21方向延伸的第一屏蔽槽231，靠近所述通孔21的第二外壁24靠近所述通孔21的位置可以形成有向所述通孔21方向延伸且与所述第一屏蔽槽231连接的第二屏蔽槽241。此时，所述第一屏蔽槽231、第二屏蔽槽241及第一屏蔽槽231与第二屏蔽槽241之间的连接处共同构成所述凹口221。
更进一步的，所述第一屏蔽槽231可以包括垂直于所述第一外壁23的第一内侧壁2311及平行于所述第一外壁23且连接所述第一内侧壁2311的第一底壁2312，所述第二屏蔽槽241可以包括垂直于所述第二外壁24的第二内侧壁2411及平行于所述第二外壁24且连接所述第二内侧壁2411的第二底壁2412，所述第一底壁2312与所述第二底壁2412连接，且所述第一底壁2312、第二底壁2412及第一底壁2312与第二底壁2412之间的连接处设有所述金属屏蔽层222。此时，所述第一内侧壁2311、第一底壁2312、第二内侧壁2411、第二底壁2412及金属屏蔽层222共同构成所述屏蔽部22。
当然，在某些实施方式中，并不限于仅在所述第一底壁2312、第二底壁2412及第一底壁2312与第二底壁2412之间的连接处设置金属屏蔽层222，还可以同时在所述第一内侧壁2311及第二内侧壁2411上设置金属屏蔽层222，这是根据实际应用场景确定的，本实用新型实施例对此不做限定。
需要说明的是，本实用新型内容中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
还需要说明的是，在本实用新型内容中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本实用新型内容。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本实用新型内容中所定义的一般原理可以在不脱离本实用新型内容的精神或范围的情况下，在其它实施例中实现。因此，本实用新型内容将不会被限制于本实用新型内容所示的这些实施例，而是要符合与本实用新型内容所公开的原理和新颖特点相一致的最宽的范围。
Claims (8)
- 一种MEMS麦克风，包括第一线路板，设于所述第一线路板上的框架，设于所述框架上的第二线路板，所述第一线路板、框架及第二线路板围合形成腔体，所述框架形成有沿所述第一线路板至第二线路板方向的通孔，所述通孔内设有连接所述第一线路板及第二线路板的走线，还包括位于所述腔体内且设于所述第一线路板内侧的MEMS芯片及ASIC芯片，所述MEMS芯片具有背腔，所述MEMS芯片电连接于ASIC芯片，其特征在于，所述框架的外壁靠近所述通孔的位置形成有屏蔽部。
- 根据权利要求1所述的MEMS麦克风，其特征在于，所述框架的外壁靠近所述通孔的位置形成有凹口，所述凹口的内壁设有金属屏蔽层，所述凹口及所述金属屏蔽层构成所述屏蔽部。
- 根据权利要求2所述的MEMS麦克风，其特征在于，所述框架的外壁包括两相对设置的第一外壁及两相对设置且分别与两所述第一外壁连接的第二外壁，所述第一外壁沿所述框架的长度方向延伸，所述第二外壁沿所述框架的宽度方向延伸，所述通孔设置在靠近所述第一外壁与所述第二外壁的连接处的位置。
- 根据权利要求3所述的MEMS麦克风，其特征在于，所述第一外壁靠近所述通孔的位置形成有向所述通孔方向延伸的第一屏蔽槽，所述第二外壁靠近所述通孔的位置形成有向所述通孔方向延伸且与所述第一屏蔽槽连接的第二屏蔽槽，所述第一屏蔽槽、第二屏蔽槽及第一屏蔽槽与第二屏蔽槽的连接处构成所述凹口。
- 根据权利要求4所述的MEMS麦克风，其特征在于，所述第一屏蔽槽包括垂直于所述第一外壁的第一内侧壁及平行于所述第一外壁且连接所述第一内侧壁的第一底壁，所述第二屏蔽槽包括垂直于所述第二外壁的第二内侧壁及平行于所述第二外壁且连接所述第二内侧壁的第二底壁，所述第一底壁与所述第二底壁连接，所述第一底壁、第二底壁及第一底壁与第二底壁的连接处设有所述金属屏蔽层。
- 根据权利要求5所述的MEMS麦克风，其特征在于，所述第一内侧壁及第二内侧壁上设有所述金属屏蔽层。
- 根据权利要求1所述的MEMS麦克风，其特征在于，所述第一线路板对应所述MEMS芯片的背腔的位置开设有声孔。
- 根据权利要求1所述的MEMS麦克风，其特征在于，所述框架的内壁设有金属屏蔽层。
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| CN206728290U (zh) * | 2017-04-27 | 2017-12-08 | 歌尔科技有限公司 | 信号屏蔽结构及麦克风 |
| US20180146302A1 (en) * | 2014-07-31 | 2018-05-24 | Merry Electronics (Shenzhen) Co., Ltd. | Mems microphone package structure and method for manufacturing the mems microphone package structures |
| CN211352443U (zh) * | 2019-12-23 | 2020-08-25 | 杭州士兰微电子股份有限公司 | 用于mems麦克风的电路板及mems麦克风 |
| CN111757230A (zh) * | 2020-08-31 | 2020-10-09 | 潍坊歌尔微电子有限公司 | Mems麦克风和电子设备 |
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| US20180146302A1 (en) * | 2014-07-31 | 2018-05-24 | Merry Electronics (Shenzhen) Co., Ltd. | Mems microphone package structure and method for manufacturing the mems microphone package structures |
| CN206728290U (zh) * | 2017-04-27 | 2017-12-08 | 歌尔科技有限公司 | 信号屏蔽结构及麦克风 |
| CN211352443U (zh) * | 2019-12-23 | 2020-08-25 | 杭州士兰微电子股份有限公司 | 用于mems麦克风的电路板及mems麦克风 |
| CN111757230A (zh) * | 2020-08-31 | 2020-10-09 | 潍坊歌尔微电子有限公司 | Mems麦克风和电子设备 |
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