WO2022099836A1 - 一种全周光led发光线及其封装方法、光源和灯 - Google Patents

一种全周光led发光线及其封装方法、光源和灯 Download PDF

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Publication number
WO2022099836A1
WO2022099836A1 PCT/CN2020/134282 CN2020134282W WO2022099836A1 WO 2022099836 A1 WO2022099836 A1 WO 2022099836A1 CN 2020134282 W CN2020134282 W CN 2020134282W WO 2022099836 A1 WO2022099836 A1 WO 2022099836A1
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WIPO (PCT)
Prior art keywords
full
led light
flip
circumferential
series
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PCT/CN2020/134282
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English (en)
French (fr)
Inventor
严钱军
郑昭章
马玲莉
Original Assignee
杭州杭科光电集团股份有限公司
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Priority claimed from CN202011273622.3A external-priority patent/CN114512582A/zh
Priority claimed from CN202022630509.8U external-priority patent/CN214753822U/zh
Application filed by 杭州杭科光电集团股份有限公司 filed Critical 杭州杭科光电集团股份有限公司
Publication of WO2022099836A1 publication Critical patent/WO2022099836A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50—Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the invention relates to the technical field of LED lighting, in particular to a full-circumference LED lighting line and a packaging method thereof, a light source and a lamp.
  • the common flexible filament includes a substrate, a circuit covering the substrate, a flip chip is fixed with solder paste, and a glue mixed with phosphor powder is coated.
  • the existing flexible filament often uses an FPC substrate, which has low light efficiency and durability. Low temperature, poor heat dissipation and short service life.
  • the present invention provides a full-circumference LED light-emitting line and a packaging method thereof, a light source and a lamp, which have high luminous efficiency and high temperature resistance. , The advantages of long life, breaking through the bottleneck of FPC substrate temperature resistance and heat dissipation.
  • a full-circumferential LED light-emitting line comprising more than one flip-chip and two or more conductive parts; wherein, more than one flip-chip is connected by the conductive parts, so as to realize more than one flip-chip in series, parallel or The electrical connection relationship of the series-parallel combination.
  • the pads of flip chips with series, parallel or combination of series and parallel are connected by conductive members.
  • the conductive member is a metal material.
  • the conductive components are arranged between flip chips, or the conductive components are arranged on both sides of the flip chips.
  • connection between the conductive member and the flip chip pad is concave.
  • the conductive member is provided with one or more through holes.
  • the flip-chips at both ends of the full-circumferential LED light-emitting line are respectively connected to a conductive terminal through conductive components.
  • the flip chip is located in the protective layer; part or all of the conductive components connecting the flip chip are located in the protective layer; the protective layer is transparent, translucent or opaque.
  • the conductive member is in the shape of a sheet or a wire.
  • the protective layer contains phosphor powder or does not contain phosphor powder.
  • the material of the phosphor is one or more combinations of silicate, nitride, fluoride or YAG.
  • a full-circumferential LED light source includes one or more of the above-mentioned full-circumferential LED light-emitting lines, which are connected to work in one-way DC or two-way AC.
  • the full-circumference LED light-emitting line is located in a transparent, translucent or opaque protective cover.
  • the protective cover contains phosphor powder or does not contain phosphor powder.
  • the material of the phosphor is one or more combinations of silicate, nitride, fluoride or YAG.
  • a packaging method for a full-circumferential LED light-emitting line comprising: fixing more than one flip-chip on an auxiliary part; Electrical connection in series or parallel or combination of series and parallel; covering one side of the flip chip with a transparent, translucent or opaque protective layer; drying; removing auxiliary parts; again covering the other side of the flip chip with transparent, translucent or opaque protective layer; toasted dry.
  • solder paste process eutectic soldering, reflow soldering, ultrasonic soldering, hot plate, laser soldering and Bonding process are used to combine series, parallel or hybrid series-parallel flip chips. connected by conductive parts.
  • the method further includes: the flip-chips at both ends of the full-circumferential LED light-emitting line realizing more than one flip-chip series, parallel or series-parallel combination are respectively connected to a conductive terminal through conductive components.
  • An LED lamp comprising a full-circumferential LED light source described in any one of the above, a casing, and a driver located in or outside the casing, wherein more than one full-circumferential LED light source of the full-circumference LED light source is provided.
  • the conductive terminal of the light LED light-emitting line is connected with the driver; the casing is filled with a liquid or gaseous heat-conducting substance.
  • the casing is further provided with a stem, and the full-circumference LED light source is fixed on the stem.
  • the material of the casing is glass or plastic.
  • the inner surface or the outer surface of the casing is provided with a reflective layer.
  • the auxiliary parts play an auxiliary role such as a fixed support. After the series-parallel relationship of the flip-chip is determined, the auxiliary parts are removed, so that the light-emitting line has high temperature resistance, good heat dissipation, high light efficiency, The advantages of long life, and can adapt to the needs of different modeling design changes.
  • FIG. 1 is a schematic diagram of a series structure of a full-circumferential LED light-emitting line according to an embodiment of the present invention.
  • FIG. 2 is a second schematic diagram of a series structure of a full-circumferential LED light-emitting line according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of an electrical connection structure of a series-parallel combination of full-circumferential LED light-emitting lines according to an embodiment of the present invention.
  • FIG. 4 is a second schematic diagram of an electrical connection structure of a series-parallel combination of full-circumferential LED light-emitting lines according to an embodiment of the present invention.
  • FIG. 5 is one of the schematic structural diagrams of an LED lamp according to an embodiment of the present invention.
  • FIG. 6 is a second schematic diagram of an LED lamp structure according to an embodiment of the present invention.
  • FIG. 7 is a third schematic structural diagram of an LED lamp according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a full-circumferential LED light-emitting line according to an embodiment of the present invention.
  • the present embodiment proposes a full-circumference LED light-emitting line, which includes more than one flip chip 1 and more than two conductive parts 2 ; wherein, more than one flip chip 1 is connected by the conductive parts 2 , in order to realize the electrical connection relationship of more than one flip chip 1 in series, parallel or series-parallel combination, as shown in Figure 1-4, showing the electrical connection relationship of more than one flip-chip 1 in series, parallel or series-parallel combination .
  • the technical solution of this embodiment has low thermal resistance, low loss, high conversion efficiency, high luminous efficiency, high temperature resistance and long service life.
  • the two electrode lead-out portions on the flip chip 1 are respectively connected with a conductive member 2 to supply power to one flip chip 1 and make the flip chip 1 emit light.
  • the two flip-chips 1 can be connected in series or in parallel, and both are realized by connecting the conductive parts 2.
  • the number of flip-chips 1 is three or more, the three flip-chips 1 can be connected in series or in parallel.
  • the electrical connection relationship between them can be series, parallel or a combination of series and parallel, all of which are realized through the connection of the conductive parts 2 .
  • the material, shape, connection relationship and relative positional relationship between the conductive member 2 and the flip chip 1 can be changed without limitation. In actual mass production applications, considering factors such as cost, product yield, stability and reliability, the above-mentioned characteristics of the conductive component 2 will be adaptively adjusted and changed.
  • the conductive member 2 is a metal material, which can be any one of gold, silver, copper, alloy, conductive plastic, conductive rubber, etc., and is not limited by the examples in this embodiment; the conductive member 2 and the pad 101 of the flip chip 1
  • the connection is in a concave shape (recessed inward), and the concave shape is realized by etching, laser, laser and other processes; the shape of the concave shape can be various shapes such as round and square, depending on the convenience and cost of the actual packaging process. The selection is determined by comprehensive consideration of factors such as these, and is not limited by the enumeration in this embodiment.
  • the conductive member 2 is provided with more than one through hole to improve the light transmittance of the light-emitting line.
  • the electrical connection relationship of series, parallel or series-parallel combination is realized between several flip chips 1 constituting the light-emitting line through the conductive member 2.
  • the conductive member 2 will block part of the light of the flip-chip 1 and affect the light-emitting effect.
  • more than one through hole can be set on the conductive member 2, so that the light emitted by the flip chip 1 can pass through the conductive member 2.
  • the through holes radiate out, thereby improving the overall light transmittance of the light-emitting line.
  • the size, shape and position of the through holes provided on the conductive member 2 are not limited. It can be comprehensively determined according to the actual process requirements and other factors.
  • the pads 101 of the flip-chip 1 with series, parallel or series-parallel combination are connected through conductive members 2, as shown in FIG. connection relationship.
  • the conductive parts 2 are arranged between the flip chips 1, or the conductive parts 2 are located on both sides of the flip chips 1, so as to realize the electrical connection relationship of the series, parallel or series-parallel combination of a plurality of flip chips 1, and the form of the conductive parts 2 Can be linear or sheet.
  • the conductive member 2 is linear, it can be used alone to connect a plurality of flip chips 1 in a series, parallel or series-parallel combination of electrical connection, or in combination with a sheet-shaped conductive member 2 to connect a plurality of flip chips 1.
  • the conductive member 2 When the conductive member 2 is in the form of a sheet, it can be used alone to connect multiple flip chips 1 in series, in parallel, or in an electrical connection relationship of a combination of series and parallel; it can also be used in combination with a linear conductive member 2 to connect multiple flip chips 1. The electrical connection relationship of the series, parallel or series-parallel combination of the chip 1.
  • the flip chips 1 at both ends of the full-circumferential LED light-emitting line are respectively connected to a conductive terminal 3 through the conductive member 2;
  • the full-circumference LED light-emitting line of this embodiment further includes a protective layer, and the flip-chip 1 is located in a transparent, translucent or opaque protective layer; part or all of the conductive parts 2 are located in a transparent, translucent or opaque protective layer.
  • the protective layer that is, according to the electrical connection relationship of series, parallel or combination of series and parallel, more than one flip-chip 1 is connected by conductive parts 2, and the conductive parts 2 are located between the flip-chips 1, or located in the flip-chip
  • the conductive parts 2 provided on both sides of the flip chip 1 are located in a transparent, translucent or opaque protective layer, they are equivalent to the conductive parts 2 on both sides of the flip chip 1
  • Both are located in the transparent, translucent or opaque protective layer, in other words, both the conductive member 2 and the flip chip 1 are located in the transparent, translucent or opaque protective layer.
  • the conductive parts 2 provided on both sides of the flip chip 1 may also be located outside the transparent, translucent or opaque protective layer. That is, only the flip chip 1 and the conductive parts 2 between the flip chips 1 are located in the transparent, translucent or opaque protective layer, and the rest of the conductive parts 2 are located outside the transparent, translucent or opaque protective layer .
  • the protective layer can be made of plastic, rubber, glue, silica gel and other materials to make transparent, translucent or opaque effects to protect the flip chip 1 and the conductive parts 2, and ensure that the full-circle LED light-emitting line is connected reliably and conducts well.
  • the protective layer may contain phosphor powder or not, which can be selected and determined according to the technological performance requirements of different products.
  • the material of the phosphor is one or more combinations of silicate, nitride, fluoride or YAG.
  • the conductive member 2 is in the shape of a sheet or a wire.
  • the flip-chip 1 can be connected by the sheet-shaped conductive member 2 to form an electrical connection combination of series, parallel or series-parallel combination. It is located between the flip-chips 1, and can also be located on the outside of the two sides of the flip-chip 1; when the conductive parts 2 are linear, the flip-chips 1 can be connected by the linear conductive parts 2 into series, parallel or series-parallel combination
  • the conductive member 2 may be located between the flip chips 1 or may be located on the outer sides of both sides of the flip chip 1 .
  • the present embodiment proposes a full-circumferential LED light source, which includes more than one full-circumferential LED light-emitting line described above, which are connected to work in unidirectional DC or bidirectional AC.
  • the two-way AC works, it can work directly with the AC mains, and can also use a common dimmer for adjusting the conduction angle to adjust the brightness to make a dimming lamp.
  • the at least one LED light-emitting line When the at least one LED light-emitting line is connected to work in unidirectional DC, it can work with a DC power supply or an AC power supply; when using an AC power supply, the driver can be composed of a capacitor and a resistor in parallel with a current limiting circuit and a rectifier filter circuit; It can be a switching power supply and constant current device without a transformer.
  • the full-circumferential LED light source of this embodiment can be composed of full-circumferential LED light-emitting lines of the same or different luminous colors, such as the same blue-light or other monochromatic full-circumferential LED light-emitting lines; it can also be different light-emitting LED light-emitting lines Colored full-circle LED light-emitting line.
  • the full-circumferential LED light-emitting line is located in a transparent, translucent or opaque protective cover.
  • the material of the protective cover can be selected from glass, plastic, rubber, silicone, etc., and can be made into transparent, translucent or opaque effects.
  • the protective cover can contain phosphors with different luminous effects, and can also contain no phosphors, which can be selected and determined according to the customized needs of the product.
  • the material of the phosphor is one or more combinations of silicate, nitride, fluoride or YAG.
  • the protective cover is a glass tube
  • the all-circumferential LED light-emitting line emits blue light and needs to be converted into white light with phosphor powder
  • the phosphor powder can be mixed in the glass tube of the all-circumferential LED light-emitting line inside the transparent medium, or coated on the inner or outer wall of the glass tube.
  • the present embodiment provides a packaging method for a full-circumferential LED light-emitting wire.
  • the method includes:
  • solder paste technology eutectic One of the soldering, reflow soldering, ultrasonic soldering, heating plate and Bonding (Chinese translation name: Bonding) process or its combination to connect the series, parallel or series-parallel hybrid flip chips 1 through conductive parts 2 .
  • a linear conductive member 2 is used to electrically connect more than one flip chip 1 , one or more flip chips 1 can be electrically connected in series, parallel or a combination of series and parallel by wire bonding.
  • the wire bonding method is mostly used for the front-mounted chip. Compared with the front-mounted chip, the pads of the flip-chip 1 are larger.
  • One or more metal wires metal wires are an implementation manner of the conductive member 2 in this embodiment) can be electrically connected between them, as shown in FIG. 3 .
  • This process step is used to process and fix the electrical connection relationship between the flip chips 1 in series, in parallel or in a combination of series and parallel. Further, to realize the electrical connection relationship of more than one flip chip 1 in series, in parallel or a combination of series and parallel, the flip chips 1 at both ends of the full-circumference LED light-emitting line are respectively connected with a conductive terminal 3 through the conductive member 2, so as to connect the power supply. power supply.
  • the auxiliary parts play an auxiliary role such as temporary fixing and support. After the electrical connection relationship of the series, parallel or series-parallel combination of the flip-chip 1 is set and determined, the auxiliary parts are removed so that the light-emitting lines have Low energy consumption and high flexibility can adapt to the needs of different design changes.
  • Through holes 21 are formed on the surface of the conductive member 2 used in step S102. As shown in FIG. 8, the through holes 21 on the conductive member 2 can be distributed evenly or unevenly, without affecting the good and reliable conductivity of the conductive member 2. Under the premise, it can be arbitrarily set according to the process requirements, and is not limited by the enumeration of this embodiment. Compared with the conductive member 2 without the through hole 21, the through hole 21 can penetrate the flip chip 1. The emitted light can improve the light transmittance of the luminous line.
  • the present embodiment proposes an LED lamp, which includes the above-mentioned full-circumferential LED light source 401, a casing 402, a driver located in or outside the casing, the full-circumferential light
  • the conductive terminals of one or more full-circumferential LED light-emitting lines of the LED light source 401 are connected to the driver; the casing is filled with a liquid or gaseous heat-conducting substance.
  • a stem 403 is further provided in the casing, and the full-circumference LED light source is fixed on the stem.
  • a bulb lamp includes a housing 402, a stem 403 with an exhaust pipe, an electrical lead wire and a bracket, at least one full-circumferential LED light source, a driver, and a lamp holder , the light source is fixed on the core column, the pins of the light source are connected with the output control end of the driver through the electric lead-out line of the core column, and the input end of the driver is connected with the lamp head; the core column and the shell are vacuum sealed to form a sealed cavity, which is sealed The cavity is filled with liquid or gaseous heat-conducting substances.
  • a reflective layer may or may not be provided at any position on the inner surface or outer surface of the shell of the bulb lamp; the inner surface or outer surface of the bulb lamp shell may also be partially or completely coated with fluorescent powder.
  • the material of the phosphor is one or more combinations of silicate, nitride, fluoride or YAG.
  • the liquid heat-conducting material can be glycerin, methyl silicone oil, dimethyl silicone oil, heat-conducting oil, transformer oil, etc., and the gaseous heat-conducting material can be helium, helium gas mixture, etc.; in practical application, the selection of the above-mentioned heat-conducting material is not subject to this requirement. Examples are limited.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种全周光LED发光线及其封装方法、光源和灯，具体涉及LED发光技术领域。全周光LED发光线包括一个以上的倒装芯片（1），及两段以上的导电部件（2）；其中，一个以上的倒装芯片（1）通过导电部件（2）连接，以实现一个以上的倒装芯片（1）串联、并联或串并联组合的电连接关系。针对现有的FPC基板光效低、耐温低、散热差的技术问题，突破了FPC基板散热和耐温的瓶颈。

Description

一种全周光LED发光线及其封装方法、光源和灯 技术领域
本发明涉及LED发光技术领域，具体涉及一种全周光LED发光线及其封装方法、光源和灯。
背景技术
目前常见的柔性灯丝包含基板，覆于基板上的线路，采用锡膏固定倒装芯片，涂覆混合着荧光粉的胶水，现有柔性灯丝常采用FPC基板，此种柔性灯丝光效低、耐温低、散热差，使用寿命短。
发明内容
1、发明要解决的技术问题
针对现有的FPC基板光效低、耐温低、散热差的技术问题，本发明提供了一种全周光LED发光线及其封装方法、光源和灯，它具有光效高、耐温高、长寿命的优点，突破了FPC基板耐温与散热的瓶颈。
2、技术方案
为解决上述问题，本发明提供的技术方案为：
一种全周光LED发光线，包括一个以上的倒装芯片，及两段以上的导电部件；其中，一个以上的倒装芯片通过导电部件连接，以实现一个以上的倒装芯片串联、并联或串并联组合的电连接关系。
可选的，具有串联、并联或串并联组合的倒装芯片的焊盘之间通过导电部件连接。
可选的，所述导电部件为金属材料。
可选的，所述导电部件设于倒装芯片之间，或导电部件设于倒装芯片的两侧。
可选的，所述导电部件与倒装芯片焊盘连接处呈内凹状。
可选的，所述导电部件上设有一个及以上的通孔。
可选的，所述全周光LED发光线两端的倒装芯片通过导电部件分别与一导电端子连接。
可选的，还包括保护层，所述倒装芯片位于保护层内；连接所述的倒装芯片的导电部件部分或全部位于保护层内；所述保护层为透明、半透明或不透明的。
可选的，所述导电部件为片状或线状。
可选的，所述保护层中含有荧光粉或不含有荧光粉。
可选的，所述荧光粉的材料为硅酸盐、氮化物、氟化物或YAG中的一种或多种组合。
一种全周光LED光源，包括一条以上的以上任一项所述的一种全周光LED发光线，被连接成单向DC工作或双向AC工作。
可选的，所述全周光LED发光线位于透明、半透明或不透明的保护套内。
可选的，所述保护套中含有荧光粉或不含有荧光粉。
可选的，所述荧光粉的材料为硅酸盐、氮化物、氟化物或YAG中的一种或多种组合。
一种全周光LED发光线的封装方法，根据以上任一项所述的一种全周光LED发光线，包括：将一个以上的倒装芯片固定在辅助件上；倒装芯片通过导电部件串联或并联或串并联组合的方式进行电连接；在倒装芯片一面覆盖透明、半透明或不透明的保护层；烤干；去除辅助件；再次在倒装芯片另一面覆盖透明、半透明或不透明的保护层；烤干。
可选的，采用锡膏工艺、共晶焊、回流焊、超声波焊接、加热板、激光焊接和Bonding工艺中的一种或多种组合，以将串联、并联或串并联混合的倒装芯片之间通过导电部件连接。
可选的，还包括：所述实现一个以上的倒装芯片串联、并联或串并联组合的全周光LED发光线两端的倒装芯片通过导电部件分别与一导电端子连接。
一种LED灯，包括以上任一项所述的一种全周光LED光源，壳体，还包括位于壳体内或壳体外的驱动器，所述一种全周光LED光源的一条以上的全周光LED发光线的导电端子与驱动器连接；所述壳体中充设有液态或气态的导热物质。
可选的，所述壳体内还设有芯柱，所述全周光LED光源固定在芯柱上。
可选的，所述壳体的材质为玻璃或塑料。
可选的，所述壳体内表面或外表面设有反光层。
3、有益效果
采用本发明提供的技术方案，与现有技术相比，具有如下有益效果：
在倒装芯片连接时，辅助件起到固定支撑等辅助作用，将倒装芯片的串并联关系设置确定后，再去除辅助件，以使发光线具有耐温高、散热好、光效高、长寿命的优点，并且可适应不同造型设计变换的需求。
附图说明
图1为本发明实施例提出的一种全周光LED发光线串联结构示意图之一。
图2为本发明实施例提出的一种全周光LED发光线串联结构示意图之二。
图3为本发明实施例提出的一种全周光LED发光线串并联组合的电连接结构示意图之一。
图4为本发明实施例提出的一种全周光LED发光线串并联组合的电连接结构示意图之 二。
图5为本发明实施例提出的一种LED灯结构示意图之一。
图6为本发明实施例提出的一种LED灯结构示意图之二。
图7为本发明实施例提出的一种LED灯结构示意图之三。
图8为本发明实施例提出的一种全周光LED发光线结构示意图。
具体实施方式
为进一步了解本发明的内容，结合附图及实施例对本发明作详细描述。可以理解的是，此处所描述的具体实施例仅仅用于解释相关发明，而非对该发明的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与发明相关的部分。本发明中所述的第一、第二等词语，是为了描述本发明的技术方案方便而设置，并没有特定的限定作用，均为泛指，对本发明的技术方案不构成限定作用。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
实施例1
第一方面，本实施例提出了一种全周光LED发光线，包括一个以上的倒装芯片1，及两段以上的导电部件2；其中，一个以上的倒装芯片1通过导电部件2连接，以实现一个以上的倒装芯片1串联、并联或串并联组合的电连接关系，如图1-4所示，展示了一个以上的倒装芯片1串联、并联或串并联组合的电连接关系。本实施例的技术方案热阻低，损耗小，转换效率高，光效高，耐温高，寿命长。
当倒装芯片1的数量为一个时，倒装芯片1上的两个电极引出部分，分别与一导电部件2连接，以实现对一个倒装芯片1供电，使倒装芯片1发光。
当倒装芯片1的数量为两个时，两个倒装芯片1可串联或并联，均通过导电部件2连接实现，当倒装芯片1的数量为三个及以上时，三个倒装芯片之间可以是串联、并联或者串并组合的电连接关系，均通过导电部件2连接实现。
导电部件2的材质，形态，及其与倒装芯片1的连接关系和相对位置关系均可作变化，不受限制，可以想到的是，本实施例的一种全周光LED发光线，在实际量产应用中，考虑到成本、产品良率、稳定性和可靠性等因素，会对导电部件2的上述特征做适应性调整和变化。
导电部件2为金属材料，可以是金、银、铜、合金、导电塑料、导电橡胶等中的任意一种，不受本实施例列举所限；导电部件2与倒装芯片1的焊盘101连接处呈内凹状(向内凹陷)，内凹状通过蚀刻、镭射、激光等工艺方式加工实现；内凹状的形态可以是圆形、方形等各种形状，可根据实际封装过程的便捷性，成本等因素综合考虑选择确定，不受本实施例列 举所限。
所述导电部件2上设有一个以上的通孔，用以提高发光线的透光率。构成发光线的若干倒装芯片1之间通过导电部件2实现串联、并联或串并联组合的电连接关系，在发光线发光时，导电部件2会遮挡倒装芯片1的部分光线，影响发光效果，为进一步提高发光线的透光率，在不影响导电部件2良好可靠的导电性能的前提下，可在导电部件2上设置一个以上的通孔，以使倒装芯片1发出的光线通过该通孔散发出去，从而提高发光线整体的透光率，设于导电部件2上的通孔的大小、形态及位置均不受限制，在不影响导电部件2良好可靠的导电性能的前提下，可根据实际工艺加工过程中的需求等因素综合确定。
具有串联、并联或串并联组合的倒装芯片1的焊盘101之间通过导电部件2连接，如图1所示，以实现一个以上的倒装芯片1的串联、并联或串并联组合的电连接关系。
导电部件2设于倒装芯片1之间，或导电部件2位于倒装芯片1的两侧，实现多个倒装芯片1的串联、并联或串并联组合的电连接关系，导电部件2的形态可以是线形或片状。当导电部件2为线形时，可单独用于连接多个倒装芯片1的串联、并联或串并联组合的电连接组合关系，或与片状的导电部件2组合使用，用于连接多个倒装芯片1的串联、并联或串并联组合的电连接组合关系。当导电部件2为片状时，可单独用于连接多个倒装芯片1的串联，并联或串并联组合的电连接关系；也可与线形的导电部件2组合使用，用于连接多个倒装芯片1的串联、并联或串并联组合的电连接关系。
全周光LED发光线两端的倒装芯片1通过导电部件2分别与一导电端子3连接；方便全周光LED发光线与电源连接，以使全周光LED发光线发光。
本实施例的全周光LED发光线还包括保护层，所述倒装芯片1位于透明、半透明或不透明的保护层内；所述的导电部件2部分或全部位于透明、半透明或不透明的保护层内，即，根据串联、并联或串并联组合的电连接关系，通过导电部件2将一个以上的倒装芯片1连接起来，导电部件2位于倒装芯片1之间，或位于倒装芯片1两面的外侧；其中一实施例，当设于所述倒装芯片1两侧的导电部件2位于透明、半透明或不透明的保护层内时，相当于倒装芯片1两侧的导电部件2均位于该透明、半透明或不透明的保护层内，换言之，导电部件2和倒装芯片1均位于该透明、半透明或不透明的保护层内。
此外，设于所述倒装芯片1两面的导电部件2还可以均位于透明、半透明或不透明的保护层外。即，仅有倒装芯片1，及位于倒装芯片1之间的导电部件2位于透明、半透明或不透明的保护层内，其余导电部件2均位于该透明、半透明或不透明的保护层外。
保护层可选择塑料、橡胶、胶水、硅胶等材质制成透明、半透明或不透明的效果，用以 保护倒装芯片1和导电部件2，确保全周光LED发光线连接可靠，导电良好。保护层中可含有荧光粉或不含荧光粉，可根据不同产品的工艺性能要求选择确定。荧光粉的材料为硅酸盐、氮化物、氟化物或YAG中的一种或多种组合。
导电部件2为片状或线状，当导电部件2为片状时，倒装芯片1可通过片状的导电部件2连接形成串联、并联或串并联组合的电连接组合关系，导电部件2可位于倒装芯片1之间，也可位于倒装芯片1的两面外侧；当导电部件2为线状时，倒装芯片1可通过线状的导电部件2连接成串联、并联或串并联组合的电连接关系，导电部件2可位于倒装芯片1之间，也可以位于倒装芯片1两面的外侧。
第二方面，本实施例提出了一种全周光LED光源，包括一条以上的以上所述一种全周光LED发光线，被连接成单向DC工作或双向AC工作。所述双向AC工作时，可直接用交流市电工作，还可用普通的调导通角的调光器调节光亮度，制成调光灯。所述至少一条LED发光线连接成单向DC工作时，可用DC电源或交流电源工作；在用交流电源时，所述驱动器可以由一电容和电阻并联的限流电路和整流滤波电路构成；也可以是不带变压器的开关电源和恒流装置。
本实施例的全周光LED光源可以由相同或不同发光色的全周光LED发光线组合而成，例如为相同的蓝光或其它单色光的全周光LED发光线；也可以是不同发光色的全周光LED发光线。
全周光LED发光线位于透明、半透明或不透明的保护套内，保护套的材质可选择玻璃、塑料、橡胶、硅胶等，可以制成透明、半透明或不透明的效果。保护套可以含有荧光粉，具有不同的发光效果，还可以不含有荧光粉，根据产品的定制需求选择确定。荧光粉的材料为硅酸盐、氮化物、氟化物或YAG中的一种或多种组合。
其中一实施例，当保护套为玻璃管时，若全周光LED发光线发蓝光，并需要用荧光粉将其转变成白光时，其荧光粉可混合在全周光LED发光线的玻璃管内的透明介质内，或涂覆在玻璃管的内壁或外壁上。
第三方面，本实施例提出了一种全周光LED发光线的封装方法，根据以上所述的一种全周光LED发光线，包括：
S101、将一个以上的倒装芯片1固定在辅助件上；因倒装芯片1的尺寸小，重量轻，辅助件可起到临时固定支撑倒装芯片1的作用。
S102、按照一个以上的倒装芯片1串联、并联或串并联组合的电连接关系，将串联、并联或串并联混合的倒装芯片1之间通过导电部件2连接；采用锡膏工艺、共晶焊、回流焊、 超声波焊接、加热板和Bonding(中文翻译名称：邦定)工艺中的一种或其混合，以将串联、并联或串并联混合的倒装芯片1之间通过导电部件2连接。
若采用线形的导电部件2进行一个以上的倒装芯片1的电连接时，可通过打线的方式将一个以上的倒装芯片1形成串联、并联或串并联组合的电连接关系。相关技术中打线方式多用于正装芯片，与正装芯片相比，因倒装芯片1的焊盘较大，采用打线方式实现电连接关系时，具有电连接关系的倒装芯片1的焊盘间可通过一根及以上金属线(金属线为本实施例的导电部件2的一种实现方式)进行电连接，如图3所示。当具有电连接关系的倒装芯片1的焊盘间通过打线方式设有两根以上金属线时，若其中一根金属线受损，不影响倒装芯片1间的电连接关系，可提高倒装芯片1间的电连接关系的可靠性，确保导电良好。
通过该工艺步骤以加工和固定倒装芯片1之间的串联、并联或串并联组合的电连接关系。进一步的，实现一个以上的倒装芯片1串联、并联或串并联组合的电连接关系，全周光LED发光线两端的倒装芯片1通过导电部件2分别与一导电端子3连接，以便连接供电电源。
S103、在倒装芯片1一侧覆盖透明、半透明或不透明的保护层，烤干；可通过剥离，或切割等方式去除辅助件；
S104、再次在倒装芯片1另一面覆盖透明、半透明或不透明的保护层；烤干。
辅助件在倒装芯片1连接时，起到临时固定支撑等辅助作用，将倒装芯片1的串联、并联或串并联组合的电连接关系设置确定后，再去除辅助件，以使发光线具有较低的能耗和较高的柔性，可适应不同造型设计变换的需求。
步骤S102中用到的导电部件2的表面开设通孔21，如图8所示，导电部件2上的通孔21可均匀分布，也可不均匀分布，在不影响导电部件2导电性能良好可靠的前提下，可根据工艺需求进行随意设置，不受本实施例列举所限，开设通孔21的导电部件2与不开设通孔的导电部件2相比，通孔21可透过倒装芯片1发出的光线，可提高发光线的透光率。
第四方面，本实施例提出了一种LED灯，包括以上所述的一种全周光LED光源401，还包括壳体402，位于壳体内或壳体外的驱动器，所述一种全周光LED光源401的一条以上的全周光LED发光线的导电端子与驱动器连接；所述壳体中充设有液态或气态的导热物质。作为另一实施例，如图5-7所示，壳体内还设有芯柱403，所述全周光LED光源固定在芯柱上。比如，可制成球泡灯，球泡灯壳体材质可以为玻璃、塑料等，不受限制。作为可选的实施方式，一种球泡灯，它包括一个壳体402，一个带有排气管、电引出线和支架的芯柱403，至少一个全周光LED光源，一个驱动器，一个灯头，光源固定在芯柱上，光源的管脚经芯柱的电引出线与驱动器的输出控制端连接，驱动器的输入端与灯头连接；所述的芯 柱和壳体真空密封形成密封腔，密封腔内充入液态或气态的导热物质。在球泡灯的壳体内表面或外表面任一位置处，可设有反光层，也可不设置反光层；在球泡灯的壳体内表面或外表面还可以部分或全部涂覆荧光粉。荧光粉的材料为硅酸盐、氮化物、氟化物或YAG中的一种或多种组合。
液态导热物质可以是甘油、甲基硅油、二甲基硅油、导热油、变压器油等，气态导热物质可以是氦气、氦气混合气等；实际应用时，上述导热物质的选择，不受本实施例列举所限。
以上示意性的对本发明及其实施方式进行了描述，该描述没有限制性，附图中所示的也只是本发明的实施方式之一，实际的结构并不局限于此。所以，如果本领域的普通技术人员受其启示，在不脱离本发明创造宗旨的情况下，不经创造性的设计出与该技术方案相似的结构方式及实施例，均应属于本发明的保护范围。

Claims (22)

  1. 一种全周光LED发光线，其特征在于，包括一个以上的倒装芯片，及两段以上的导电部件；其中，
    一个以上的倒装芯片通过导电部件连接，以实现一个以上的倒装芯片串联、并联或串并联组合的电连接关系。
  2. 根据权利要求1所述的一种全周光LED发光线，其特征在于，具有串联、并联或串并联组合的倒装芯片的焊盘之间通过导电部件连接。
  3. 根据权利要求1所述的一种全周光LED发光线，其特征在于，所述导电部件为金属材料。
  4. 根据权利要求1所述的一种全周光LED发光线，其特征在于，所述导电部件设于倒装芯片之间，或导电部件设于倒装芯片的两侧。
  5. 根据权利要求1所述的一种全周光LED发光线，其特征在于，所述导电部件与倒装芯片焊盘连接处呈内凹状。
  6. 根据权利要求1所述的一种全周光LED发光线，其特征在于，所述导电部件上设有一个及以上的通孔。
  7. 根据权利要求1所述的一种全周光LED发光线，其特征在于，所述全周光LED发光线两端的倒装芯片通过导电部件分别与一导电端子连接。
  8. 根据权利要求1-7任一项所述的一种全周光LED发光线，其特征在于，还包括保护层，所述倒装芯片位于保护层内；
    连接所述的倒装芯片的导电部件部分或全部位于保护层内；
    所述保护层为透明、半透明或不透明的。
  9. 根据权利要求8所述的一种全周光LED发光线，其特征在于，所述导电部件为片状或线状。
  10. 根据权利要求8所述的一种全周光LED发光线，其特征在于，所述保护层中含有荧光粉或不含有荧光粉。
  11. 根据权利要求10所述的一种全周光LED发光线，其特征在于，所述荧光粉的材料为硅酸盐、氮化物、氟化物或YAG中的一种或多种组合。
  12. 一种全周光LED光源，其特征在于，包括一条以上的权利要求1-11任一项所述的一种全周光LED发光线，被连接成单向DC工作或双向AC工作。
  13. 根据权利要求12所述的一种全周光LED光源，其特征在于，所述全周光LED发光线位于透明、半透明或不透明的保护套内。
  14. 根据权利要求12所述的一种全周光LED光源，其特征在于，所述保护套中含有荧光粉或不含有荧光粉。
  15. 根据权利要求14所述的一种全周光LED光源，其特征在于，所述荧光粉的材料为硅酸盐、氮化物、氟化物或YAG中的一种或多种组合。
  16. 一种全周光LED发光线的封装方法，其特征在于，根据权利要求1-11任一项所述的一种全周光LED发光线，包括：
    将一个以上的倒装芯片固定在辅助件上；
    倒装芯片通过导电部件串联、并联或串并联组合的方式进行电连接；
    在倒装芯片一面覆盖透明、半透明或不透明的保护层；
    烤干；
    去除辅助件；
    再次在倒装芯片另一面覆盖透明、半透明或不透明的保护层；
    烤干。
  17. 根据权利要求16所述的一种全周光LED发光线的封装方法，其特征在于，采用锡膏工艺、共晶焊、回流焊、超声波焊接、加热板、激光焊接和Bonding工艺中的一种或多种组合，以将串联、并联或串并联混合的倒装芯片之间通过导电部件连接。
  18. 根据权利要求16所述的一种全周光LED发光线的封装方法，其特征在于，还包括：
    实现一个以上的倒装芯片串联、并联或串并联混合的全周光LED发光线两端的倒装芯片通过导电部件分别与一导电端子连接。
  19. 一种LED灯，其特征在于，包括权利要求12-15任一项所述的一种全周光LED光源，壳体，还包括位于壳体内或壳体外的驱动器，所述一种全周光LED光源的一条以上的全周光LED发光线的导电端子与驱动器连接；
    所述壳体中充设有液体或气体的导热物质。
  20. 根据权利要求19所述的一种LED灯，其特征在于，所述壳体内还设有芯柱，所述全周光LED光源固定在芯柱上。
  21. 根据权利要求19所述的一种LED灯，其特征在于，所述壳体的材质为玻璃或塑料。
  22. 根据权利要求19-21任一项所述的一种LED灯，其特征在于，所述壳体内表面或外表面设有反光层。
PCT/CN2020/134282 2020-11-14 2020-12-07 一种全周光led发光线及其封装方法、光源和灯 WO2022099836A1 (zh)

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