WO2022095457A1

WO2022095457A1 - Electronic apparatus, vehicle-mounted heat dissipation system and vehicle

Info

Publication number: WO2022095457A1
Application number: PCT/CN2021/101054
Authority: WO
Inventors: 尹建强
Original assignee: 华为技术有限公司
Priority date: 2020-11-05
Filing date: 2021-06-18
Publication date: 2022-05-12
Also published as: CN114449795A

Abstract

Disclosed in the embodiments of the present application are an electronic apparatus, a vehicle-mounted heat dissipation system and a vehicle, belonging to the technical field of heat dissipation. The electronic apparatus comprises a liquid cooling plate, a bottom housing, a circuit board and a connector, wherein the liquid cooling plate is connected to the bottom housing, a sealed accommodating cavity is defined between the liquid cooling plate and the bottom housing, an insulating liquid is accommodated in the accommodating cavity, the circuit board is located in the accommodating cavity and immersed in the insulating liquid, the circuit board is connected to the bottom housing, the connector and the bottom housing are integrally formed in an injection-molded manner, one end of the connector is located in the accommodating cavity and connected to the circuit board, and the other end of the connector is located outside the accommodating cavity. Since the connector and the bottom housing are integrally formed in an injection-molded manner, the connector and the bottom housing have a good sealing performance, such that the insulating liquid can be prevented from leaking from a joint of the connector and the bottom housing, thereby ensuring that the electronic apparatus can work stably.

Description

Electronic equipment, vehicle cooling system and vehicle

This application claims the priority of the Chinese patent application with the application number 202011225267.2, filed on November 5, 2020, and the invention title is "Electronic Equipment, Vehicle-mounted Cooling System and Vehicle", the entire contents of which are incorporated into this application by reference.

technical field

The present application relates to the field of heat dissipation technology, and in particular, to an electronic device, a vehicle-mounted heat dissipation system and a vehicle.

Background technique

Electronic devices usually generate heat during the working process. In order to ensure the normal operation of the electronic devices, it is usually necessary to dissipate heat to reduce the temperature of the electronic devices.

Taking a vehicle as an example, a mobile data center (MDC), also called a trip computer, is an important electronic device on a vehicle. The on-board computer will generate a lot of heat during the working process, which will cause the temperature of the on-board computer to rise and affect its performance and stability.

SUMMARY OF THE INVENTION

The embodiments of the present application provide an electronic device, a vehicle-mounted cooling system and a vehicle, which can overcome the problems in the related art, and the technical solutions are as follows:

In a first aspect, an electronic device is provided. In the embodiments of the present application, a trip computer of a vehicle is used as an example. The electronic device includes a housing, a circuit board, and a connector. The circuit board is located in the accommodating cavity in the casing, the connector is connected with the circuit board, one end of the connector is located in the casing, and the other end protrudes from the casing, the casing An insulating liquid is contained in the interior, and the circuit board is immersed in the insulating liquid.

In the embodiment of the present application, the housing includes a liquid cooling plate and a bottom case, the liquid cooling plate is connected to the bottom case, and the closed accommodating cavity is formed between the liquid cooling plate and the bottom case .

Based on the above structure, when the electronic device is in use, the liquid cooling plate is connected to the cooling liquid circulation pipeline, so that the liquid cooling plate can maintain a relatively low temperature state. The heat generated by the circuit board vaporizes the insulating liquid, and the vaporized insulating liquid rises to the liquid cooling plate. Because the temperature of the liquid cooling plate is relatively low, the vaporized insulating liquid liquefies on the surface of the liquid cooling plate and drips. Back to the bottom of the accommodating cavity, and circulating in this way, the heat generated by the circuit board is transferred to the liquid cooling plate, and is emitted through the liquid cooling plate to achieve the purpose of heat dissipation and reduce the temperature of the electronic equipment.

In the embodiment of the present application, the connector and the bottom case are integrally injection-molded. Since the connector and the bottom shell are integrally injection-molded, there is no gap between the connector and the bottom shell, so the insulating liquid will not leak at the connection between the connector and the bottom shell, thus avoiding the adverse consequences caused by the leakage of the insulating liquid , so that electronic equipment can work efficiently and stably.

In some examples, the electronic device includes multiple connectors of different types, one, two, or more of each connector.

Based on the above structure, when the electronic device is connected with other devices, according to the different devices to be connected, a corresponding connector is selected for connection.

In the embodiments of the present application, the injection molding includes at least one of primary injection molding, secondary injection molding, multiple injection molding, and two-color molding. Specifically, according to the shape and complexity of the structure of the connector and the bottom shell, one-shot injection molding, secondary injection molding, multiple injection molding or two-color molding are selected.

Optionally, the liquid cooling plate and the bottom case are welded or connected by screws.

In some examples, the liquid cooling plate is connected to the bottom case by welding. For example by means of laser welding. By connecting the liquid cooling plate and the bottom case by welding, the gap between the liquid cooling plate and the bottom case can be eliminated, thereby avoiding leakage at the connection between the liquid cooling plate and the bottom case.

In other examples, the liquid cooling plate is connected to the bottom case by means of screw connection. The liquid-cooling plate and the bottom case are connected by screws. When the circuit board and other structures inside the shell need to be repaired, the screws are directly removed to separate the liquid-cooling plate and the bottom case. The cold plate is connected with the bottom case.

In the embodiment of the present application, when the liquid cooling plate and the bottom case are connected by screws, a sealing ring is provided between the liquid cooling plate and the bottom case. By tightening the screws, the liquid-cooling plate and the bottom case are clamped to the sealing ring, so as to improve the sealing between the liquid-cooling plate and the bottom case, and avoid the liquid-cooling plate and the bottom case. leaks at the connection.

In the embodiment of the present application, the sealing ring is integrally injection-molded with any one of the liquid cooling plate and the bottom case.

For example, the sealing ring and the liquid cooling plate are integrally injection-molded, so that the sealing ring and the liquid cooling plate are formed as a whole. Or the sealing ring and the bottom case are integrally injection-molded, so that the sealing ring and the bottom case form a whole. The injection molding method includes at least one of primary injection molding, secondary injection molding, multiple injection molding and two-color molding.

Based on the above structure, the sealing ring is integrally injection-molded with one of the liquid cooling plate and the bottom case, so that the sealing ring is connected more tightly, and the sealing performance between the liquid cooling plate and the bottom case can be further improved.

In the embodiment of the present application, the bottom case includes a side plate and a bottom plate. The side plate is located on one side of the bottom plate, the side plate is connected to the bottom plate, and the liquid cooling plate is connected to the side plate. The enclosed accommodating cavity is formed by the side plate, the bottom plate and the liquid cooling plate, the bottom plate serves as a basis for installing the circuit board, and the connector is located on the side plate.

In the embodiment of the present application, the aforementioned sealing ring is located between the liquid cooling plate and the side plate. The side plate has a groove for accommodating the sealing ring. When the liquid cooling plate is connected with the bottom shell, the sealing ring presses the inner wall of the groove to form a seal, which increases the contact area between the sealing ring and the side plate and improves the sealing performance.

As an example, one side of the bottom plate has a plurality of support protrusions, the plurality of support protrusions are located in the accommodating cavity, and the circuit board is fixed on the plurality of support protrusions.

In the solution shown in the embodiment of the present application, a plurality of support protrusions are provided, and the circuit board is supported by the support protrusions, so that a certain distance is maintained between the circuit board and the bottom plate, so that the lower surface of the circuit board can be fully contacted with the insulating liquid.

Optionally, the circuit board and the connector are connected by wires. The wires refer to wire harnesses for data transmission.

Based on the above structure, after the connector and the bottom case are integrally injection-molded, the circuit board is first fixed on the bottom case, then one end of the wire is connected to the circuit board, and the other end of the wire is connected to the end of the connector located in the accommodating cavity Connected, easy to operate.

In the embodiment of the present application, both the interior of the liquid cooling plate and the surface of the liquid cooling plate close to the circuit board are provided with fins.

As an example, the liquid-cooling plate is a hollow structure. When the electronic device is in use, the cavity inside the liquid-cooling plate is continuously injected and discharged with cooling liquid, and the cooling liquid is used to reduce the temperature of the liquid-cooling plate, so that the liquid The cold plate continues to maintain a relatively low temperature, and the vaporized insulating liquid liquefies on the surface of the liquid cold plate. The fins inside the liquid-cooling plate can increase the contact area between the cooling liquid and the liquid-cooling plate, accelerate the heat exchange between the liquid-cooling plate and the cooling liquid, and help improve the heat dissipation capacity of the electronic equipment. The fins of the liquid cooling plate close to the circuit board are located in the accommodating cavity, and the fins are arranged to increase the contact area between the vaporized insulating liquid and the liquid cooling plate, which is beneficial to the liquefaction of the vaporized insulating liquid.

In a second aspect, an in-vehicle cooling system is also provided. The vehicle-mounted heat dissipation system includes a cooling liquid circulation pipeline and any of the electronic devices described in the previous aspect. The coolant circulation pipeline is used to dissipate heat from various parts of the vehicle, such as dissipating heat from the cab of the vehicle and dissipating heat from the vehicle's battery.

In the embodiment of the present application, the liquid cooling plate of the electronic device communicates with the cooling liquid circulation pipeline.

Based on the above structure, the cooling liquid circulation pipeline radiates heat to the liquid cooling plate of the electronic device, reduces the temperature of the liquid cooling plate, and keeps the liquid cooling plate in a relatively low temperature state. In this way, the insulating liquid in the electronic equipment can be liquefied on the surface of the liquid cooling plate after being vaporized.

In a third aspect, a vehicle is also provided. The vehicle includes the vehicle-mounted cooling system as described in the second aspect.

Based on the above structure, the electronic equipment in the vehicle-mounted heat dissipation system of the vehicle can be well dissipated to ensure the performance and stability of the electronic equipment.

Description of drawings

1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application;

2 is a schematic diagram of an external structure of an electronic device provided by an embodiment of the present application;

3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application;

Fig. 4 is the I-I sectional view in Fig. 2;

5 is a schematic structural diagram of a bottom case of an electronic device provided by an embodiment of the present application;

6 is a schematic diagram of an internal structure of an electronic device provided by an embodiment of the present application;

7 is a schematic diagram of the internal structure of a liquid cooling plate provided by an embodiment of the present application;

8 is a schematic structural diagram of a liquid cooling plate provided by an embodiment of the present application;

9 is a structural block diagram of a vehicle-mounted cooling system provided by the present application;

FIG. 10 is a schematic diagram of the connection between a cooling liquid circulation pipeline and an electronic device provided by the present application.

illustration

1. Millimeter wave radar 10, liquid cooling plate 10a, liquid inlet 10b, liquid outlet

100. Electronic equipment 101. Fins

2. Lidar 20, bottom case 201, side plate 202, bottom plate

201a, liquid injection port 201b, groove 2021, support protrusion 2021a, threaded hole

3. Vehicle controller 30. Circuit board

4. Telematics 40. Connector

5. Camera 50. Insulating liquid

6. Trip computer 60. Sealing ring

7. Cloud data center 70. Sealing plug

80, wire

91, the first screw 92, the second screw 900, the coolant circulation line 910, the condenser

920, electric compressor 930, evaporator 940, first expansion valve 950, battery cooler

960, electric water pump 970, battery cooling plate 980, electronic water valve 990, second expansion valve

A. accommodating cavity

Detailed ways

The embodiments of the present application provide an electronic device, a vehicle-mounted cooling system, and a vehicle. The embodiments of the present application take the electronic device as an on-board computer of a vehicle as an example, and the vehicle includes at least an automobile and an electric vehicle.

With the development of autonomous driving technology, there are more and more electronic devices in the vehicle, and these electronic devices are usually connected to the on-board computer. For example, FIG. 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application. As shown in Figure 1, a millimeter-wave radar 1 and a lidar 2 are arranged at the front of the vehicle, a vehicle control unit (VCU) 3 is also arranged at the center console of the vehicle, and a cab is also arranged There is a telematics box 4 (telematics box, T-BOX), and the telematics processor is used to establish contact with the cloud data center 7 . A camera is also usually provided on the vehicle, for example, a camera 5 is usually provided in the driver's cab. The millimeter wave radar 1 , the laser radar 2 , the vehicle controller 3 , the telematics processor 4 and the camera 5 are respectively connected to the trip computer 6 . The amount of data that the trip computer needs to process is getting larger and larger, and the computing power demand for the trip computer is also increasing. It has gradually increased from the previous 10Tflops to 300Tflops, or even higher, and the electronic components on the circuit board inside the trip computer are naturally also More and more, reaching more than 200pcs. Usually, more electronic components mean higher power consumption, and the power consumption of the on-board computer has gradually increased from about 20w to about 300w, resulting in a large increase in heat generation and an increase in the overall temperature of the on-board computer.

High temperature will affect the performance and stability of the on-board computer. In order to make the on-board computer work efficiently and stably in the case of a large increase in heat generation, it is necessary to improve the heat dissipation capacity of the on-board computer. The trip computer 6 includes a casing, a circuit board, and a connector 40, the circuit board is located inside the casing, the connector 40 is mounted on the circuit board, and the connector 40 protrudes from the casing. The trip computer 6 usually includes a plurality of connectors 40 , and devices such as the millimeter wave radar 1 , the lidar 2 , the vehicle controller 3 , the telematics processor 4 , and the camera 5 are connected to the plurality of connectors 40 through signal lines.

An insulating liquid is contained in the casing, and the circuit board is immersed in the insulating liquid. During the working process of the trip computer 6, the electronic components on the circuit board heat up, the insulating liquid absorbs heat and vaporizes, and the vaporized insulating liquid rises to the top of the shell, where the temperature is lower at the top of the shell, and the vaporized insulating liquid It liquefies and releases heat, and the liquefied insulating liquid drips back to the bottom of the enclosure. This cycle transfers the heat generated by the circuit board to the top of the case for dissipation. Since the vaporization of the insulating liquid will absorb a lot of heat, this method of utilizing the phase change of the material has a strong heat dissipation capacity.

However, the insulating liquid in the casing is easy to leak through the gap between the connector 40 and the casing, and the insulating liquid changes from a liquid state to a gaseous state, and the volume is greatly increased, which will lead to an increase in the pressure inside the casing, and the greater the heat generation, the higher the pressure. The more it rises, the easier it is for the insulating liquid to leak. The leakage of insulating liquid will reduce the heat dissipation capacity of the on-board computer, and once the insulating liquid leaks enough to submerge the circuit board, the heat on the circuit board will hardly be dissipated, the temperature will rise rapidly, and it is very likely to burn out.

FIG. 2 is a schematic diagram of an external structure of an electronic device provided by an embodiment of the present application. FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application. As shown in FIGS. 2 and 3 , the electronic device includes a housing, a circuit board 30 and a connector 40 . Wherein, the outer casing includes a liquid cooling plate 10 and a bottom casing 20 .

Fig. 4 is a sectional view taken along line I-I in Fig. 2 . As shown in FIG. 4 , the liquid cooling plate 10 is connected to the bottom case 20 , a closed accommodating cavity A is formed between the liquid cooling plate 10 and the bottom shell 20 , and the accommodating cavity A holds the insulating liquid 50 .

The circuit board 30 is located in the accommodating cavity A, and the circuit board 30 is connected to the bottom case 20 , and the circuit board 30 is immersed in the insulating liquid 50 .

The connector 40 is integrally injection-molded with the bottom case 20 , one end of the connector 40 is located in the accommodating cavity A and connected to the circuit board 30 , and the other end of the connector 40 is located outside the accommodating cavity A.

In FIG. 4 , the hollow arrow in the accommodating cavity A indicates the rising direction of the gasified insulating gas 50 , the solid arrow in the accommodating cavity A indicates the dripping direction of the liquefied insulating liquid 50 , and the black dots indicate the insulating gas 50 . Droplets formed after the liquid 50 liquefies. The solid arrows inside the liquid cold plate 10 indicate the flow direction of the cooling water for cooling the liquid cold plate 10 .

During the operation of the on-board computer, the insulating liquid 50 located at the bottom of the accommodating cavity A vaporizes and rises to the top of the accommodating cavity A, and the temperature of the liquid cooling plate 10 is relatively low, so that the vaporized insulating liquid 50 is in the liquid cooling plate 10. The surface liquefies and drops to the bottom of the accommodating cavity A, and circulates in this way to transfer the heat generated by the circuit board 30 to the liquid cooling plate 10 and dissipate it to achieve the purpose of heat dissipation. Since the connector 40 and the bottom case 20 are integrally injection-molded, there is no gap at the connection between the connector 40 and the bottom case 20, so the insulating liquid 50 will not leak at the connection between the connector 40 and the bottom case 20, thereby avoiding the leakage of the insulating liquid 50. The adverse consequences caused by the leakage of the liquid 50 enable the on-board computer to work efficiently and stably.

Optionally, the insulating liquid 50 is fluorinated liquid or silicone oil. Both fluorinated liquid and silicone oil have good insulating properties.

In the embodiments of the present application, integral injection molding refers to forming a whole by means of injection molding. The connector 40 and the bottom case 20 are integrally formed by injection molding, so as to eliminate the gap between the connector 40 and the bottom case 20 and avoid the leakage of the insulating liquid 50 .

In the embodiments of the present application, injection molding includes primary injection molding, secondary injection molding, multiple injection molding, and two-color molding.

One-shot injection molding is the simplest injection molding method. During production, after the mold is closed, the connector 40 and the bottom shell 20 are obtained as a whole through the process of plastic injection, pressure holding, cooling, mold opening, and product extraction.

Secondary injection molding is a special injection molding method. After the semi-finished product is made by one-time injection molding in one set of molds, the semi-finished product is placed in another set of molds, and then undergoes one mold clamping, injection, and pressure holding. , cooling, mold opening, and finally the product is taken out to obtain a connector 40 and bottom shell 20 that form a whole. The material injected in the two injections is the same, or the material injected in the two injections is different.

In overmolding, the semi-finished product is any one of the following structures: connector 40, bottom shell 20, part of connector 40, part of bottom shell 20, complete connector 40 and part of bottom shell 20, complete The bottom case 20 and a part of the connector 40 , and a part of the connector 40 and a part of the bottom case 20 .

The multiple injection molding is based on the secondary injection molding, and then goes through at least one time of mold clamping, glue injection, pressure holding, cooling, mold opening, and product removal, to form an integral connector 40 and bottom shell 20 . The material injected for each shot is the same, or the material injected for each shot is different.

Two-color molding is a molding process in which two different materials are injected into the same set of molds. The color of the two materials is different, or the hardness is different, or both the color and the hardness are different. The difference between two-color molding and one-shot injection molding is that the finished product obtained by two-color molding has different materials in different parts. For example, the connector 40 and the bottom case 20 are formed by one injection molding, the material of the connector 40 and the bottom case 20 are the same, the connector 40 and the bottom case 20 are formed by two-color molding, and the material of the connector 40 and the bottom case 20 are formed. different.

In the embodiment of the present application, according to the complexity of the shape and structure of the connector 40 and the bottom shell 20, one-shot injection molding, secondary injection molding, multiple injection molding or two-color molding are selected.

FIG. 5 is a schematic structural diagram of a bottom case of an electronic device provided by an embodiment of the present application. As shown in FIG. 5 , the bottom case 20 includes a side plate 201 and a bottom plate 202 . The bottom plate 202 is opposite to the liquid cooling plate 10 , the side plate 201 is located on the side of the bottom plate 202 close to the liquid cooling plate 10 , and is connected to the bottom plate 202 and the liquid cooling plate 10 , and the connector 40 is located on the side plate 201 .

The bottom plate 202 of the bottom case 20 serves as the base for placing the trip computer. When the trip computer is placed, it is supported by the bottom plate 202 and is placed flat on the corresponding position of the vehicle. The connector 40 is arranged on the side plate 201 to facilitate the connection of various signal lines with the connector 40 .

The number of the side plates 201 is set according to the shape of the electronic device. For example, in the embodiment of the present application, the bottom plate 202 is rectangular, and the bottom case 20 includes four side plates 201 . In other examples, the bottom plate 202 is in other polygonal shapes, such as pentagons, hexagons, etc., and the number of side plates 201 also changes accordingly.

If the electronic device includes multiple connectors 40 , the multiple connectors 40 are located on the same side board 201 , or distributed on multiple side boards 201 .

In some examples, a row of connectors 40 is distributed on the side panel 201 . For example, in FIG. 5 , only one row of connectors 40 is distributed on the side plate 201 .

In other examples, two or more rows of connectors 40 are distributed on the side plate 201 .

As shown in FIG. 3 or FIG. 5 , the side plate 201 further has a liquid injection port 201 a, and the liquid injection port 201 a is used for filling the accommodating cavity A with the insulating liquid 50 . The liquid injection port 201 a and the connector 40 are located on different side plates 201 to facilitate the filling of the insulating liquid 50 .

The bottom case 20 further includes a sealing plug 70, which is detachably installed on the side plate 201 and is located at the liquid injection port 201a. After the filling of the insulating liquid 50 is completed, the sealing plug 70 is installed on the side plate 201 , and the filling port 201 a is blocked by the sealing plug 70 to prevent the insulating liquid 50 from leaking.

As an example, the sealing plug 70 is a screw plug, and the sealing plug 70 is screwed to the liquid injection port 201a.

FIG. 6 is a schematic diagram of an internal structure of an electronic device provided by an embodiment of the present application. The liquid cooling plate 10 is omitted in FIG. 6 . As shown in FIG. 5 and FIG. 6 , the bottom plate 202 is opposite to the circuit board 30 , and the side of the bottom plate 202 close to the liquid cooling plate 10 has a plurality of supporting protrusions 2021 , and the plurality of supporting protrusions 2021 are located between the bottom plate 202 and the circuit board 30 and connected to the circuit board 30 .

The support protrusions 2021 support the circuit board 30 from the bottom plate 202 , so that the circuit board 30 and the bottom plate 202 are spaced apart from each other.

The number of the supporting protrusions 2021 is set according to the area of the circuit board 30 . The larger the area of the circuit board 30 is, the more the supporting protrusions 2021 are provided, so as to firmly and stably fix the circuit board 30 in the bottom case 20 . As an example, in the embodiment of the present application, six support protrusions 2021 are provided on the bottom plate 202 .

As shown in FIG. 5 , the top surface of the support protrusion 2021 has threaded holes 2021 a , and the circuit board 30 is fixedly connected to the top surface of the support protrusion 2021 through the second screw 92 .

Optionally, the included angle formed by the plane where the circuit board 30 is located and the plane where the bottom plate 202 is located is an acute angle. That is, the circuit board 30 is not parallel to the bottom plate 202 , but presents a certain angle, which is beneficial for the bubbles formed by the vaporization of the insulating liquid 50 to rise to the outside of the liquid surface directly below the circuit board 30 , so as to prevent the bubbles from accumulating under the circuit board 30 . This affects the heat dissipation of the lower surface of the circuit board 30 .

As shown in FIG. 6 , the circuit board 30 and the connector 40 are connected by wires 80 . The wire 80 here refers to a wire harness that can be used for data transmission. The wire 80 is used to connect the circuit board 30 and the connector 40 to facilitate the manufacture of the trip computer. In the related art, the connector 40 is usually directly mounted on the circuit board 30 to form an integral body with the circuit board 30 . When the trip computer is assembled, the connector 40 and the circuit board 30 are placed into the housing for installation. In the embodiment of the present application, the connector 40 and the bottom case 20 are integrally injection-molded, and the connector 40 and the bottom case 20 are integral, so it is difficult to directly install the connector 40 on the circuit board 30, and the wire 80 is used to connect the circuit board 30 and the circuit board 30. The connector 40 enables the circuit board 30 and the connector 40 to be installed independently, and the operation is convenient.

When connecting the circuit board 30 and the connector 40 , the number of wires 80 may be different for different connectors 40 , and only a few wires 80 are schematically shown in FIG. 6 .

Optionally, one end of the connector 40 located in the accommodating cavity A is also immersed in the insulating liquid 50 . During the operation of the electronic device, in addition to the large amount of heat generated by the electronic components on the circuit board 30, the connector 40 will also generate a certain amount of heat. In the insulating liquid 50 , the heat generated by the connector 40 can also be dissipated through the insulating liquid 50 to prevent the connector 40 from overheating.

In some examples, wires 80 connecting circuit board 30 and connector 40 are also submerged in insulating liquid 50 . The wire 80 also generates a certain amount of heat during the working process and the temperature rises. The surface of the wire 80 usually has a layer of insulation, and the insulation will accelerate aging when heated. The wire 80 is immersed in the insulating liquid 50, and the insulation The liquid 50 dissipates heat to the wire 80 , which is beneficial to reduce the temperature of the wire 80 , thereby delaying the aging speed of the insulating skin of the wire 80 and prolonging the service life of the wire 80 .

FIG. 7 is a schematic diagram of the internal structure of a liquid cooling plate provided by an embodiment of the present application. As shown in FIG. 7 , the liquid cooling plate 10 has a hollow structure. The liquid cooling plate 10 has a liquid inlet 10a and a liquid outlet 10b. The liquid inlet 10a and the liquid outlet 10b are used for circulating cooling liquid, and the cooling liquid flows from the liquid inlet port. 10a enters the liquid cooling plate 10, and flows out of the liquid cooling plate 10 from the liquid outlet 10b. During the circulation of the cooling liquid, the heat of the liquid cooling plate 10 can be taken away, thereby reducing the temperature of the liquid cooling plate 10 .

Illustratively, the cooling liquid is water.

As shown in FIG. 7 , the liquid cooling plate 10 has fins 101 inside. The fins 101 located inside the liquid-cooling plate 10 increase the contact area between the liquid-cooling plate 10 and the cooling liquid, and can take away heat more quickly, which is beneficial to enhance the heat dissipation capability of the liquid-cooling plate 10 .

FIG. 8 is a schematic structural diagram of a liquid cooling plate provided by an embodiment of the present application. The lower surface of the liquid cooling plate 10 in FIG. 8 is the side of the liquid cooling plate 10 close to the circuit board 30 . As shown in FIG. 8 , the surface of the liquid cooling plate 10 close to the circuit board 30 also has fins 101 . After the liquid cooling plate 10 is installed on the bottom case 20, the fins 101 of the liquid cooling plate 10 close to the surface of the circuit board 30 are located in the accommodating cavity A, and this part of the fins 101 increases the volume of the vaporized insulating liquid 50 and the liquid cooling plate. 10, so that during the working process of the electronic device, after the insulating liquid 50 is vaporized, it can be liquefied on the surface of the liquid cooling plate 10 more quickly, which is beneficial to speed up the heat exchange speed between the insulating liquid 50 and the liquid cooling plate 10. , which further improves the heat dissipation capacity of electronic equipment. Moreover, after the insulating liquid 50 is liquefied on the surface of the liquid cooling plate 10 , it slides down along the surface of the fins 101 , so as to quickly gather into larger droplets and drop back into the bottom case 20 .

Optionally, the liquid-cooling plate 10 is a metal piece, and metals generally have strong thermal conductivity, which is beneficial to the heat exchange between the liquid-cooling plate 10 and the insulating liquid 50 and between the liquid-cooling plate 10 and the cooling liquid. Improve the heat dissipation capacity of electronic equipment.

In some examples, the liquid cooling plate 10 is made of aluminum or aluminum alloy. Both aluminum and aluminum alloy have strong thermal conductivity, and are inexpensive, easy to reduce manufacturing costs, light in weight, and easy to install.

In other examples, the liquid cooling plate 10 is made of other metals, such as steel, copper, or copper alloys.

Referring to FIG. 3 again, the liquid cooling plate 10 and the bottom case 20 are connected by first screws 91 to facilitate the disassembly and assembly of the electronic device. The first screws 91 are arranged at intervals along the edge of the liquid cooling plate 10 .

Optionally, the electronic device further includes a sealing ring 60 , and the sealing ring 60 is located between the side plate 201 and the liquid cooling plate 10 . Setting the sealing ring 60 can improve the sealing ability between the liquid cooling plate 10 and the bottom case 20. When the liquid cooling plate 10 is connected to the bottom case 20, the liquid cooling plate 10 and the bottom case 20 clamp the sealing ring 60 together to prevent the insulating liquid 50 leaks from between the liquid cooling plate 10 and the bottom case 20 .

In some examples, the sealing ring 60 is integrally injection molded with the side plate 201 . That is, the sealing ring 60 and the bottom case 20 are integrally injection-molded. By integrally injection molding the sealing ring 60 and the bottom case 20 , the sealing ring 60 and the side plate 201 are combined more closely, the gap between the sealing ring 60 and the side plate 201 is eliminated, and the gap between the liquid cooling plate 10 and the bottom case 20 is improved. sealing effect.

The sealing ring 60 and the side plate 201 are made of secondary injection molding, multiple injection molding or two-color molding. The sealing ring 60 is usually made of a softer material with certain elasticity, while the bottom shell 20 is usually made of a relatively hard material. The ring 60 and the bottom case 20 are made of different materials. Secondary injection molding, multiple injection molding or two-color molding are used to directly inject the sealing ring 60 on the bottom case 20, so that the sealing ring 60 and the bottom case 20 are integrated.

In other examples, the sealing ring 60 is integrally injection molded with the liquid cooling plate 10 . The integral injection molding of the sealing ring 60 and the liquid cooling plate 10 can make the sealing ring 60 and the liquid cooling plate 10 combine more closely, eliminate the gap between the sealing ring 60 and the liquid cooling plate 10, and improve the liquid cooling plate 10 and the bottom shell 20. sealing effect between.

Exemplarily, when manufacturing the sealing ring 60 , the liquid cooling plate 10 is placed in a mold, and the sealing ring 60 is injection-molded on the surface of the liquid cooling plate 10 .

If the sealing ring 60 and the liquid cooling plate 10 are integrally injection-molded, the side plate 201 is provided with a groove 201b for accommodating the sealing ring 60 (see FIG. 3 ). The cross section of the groove 201b is arc-shaped. When the bottom case 20 is connected, the sealing ring 60 presses the inner wall of the groove 201b to form a seal.

In other examples, the side plate 201 is welded with the liquid cooling plate 10 . The liquid cooling plate 10 and the bottom case 20 are connected as a whole by welding, so that the sealing ring 60 is not required and the leakage of the insulating liquid 50 from between the liquid cooling plate 10 and the bottom case 20 can be avoided.

Exemplarily, the side plate 201 and the liquid cooling plate 10 are welded by laser. The bottom case 20 is a plastic part, and the liquid cooling plate 10 is usually a metal part. The plastic part and the metal part can be welded into a whole by using laser welding technology, so that the bottom case 20 and the liquid cooling plate 10 can be welded as a whole.

FIG. 9 is a structural block diagram of a vehicle-mounted cooling system provided by the present application. As shown in FIG. 9 , the vehicle-mounted heat dissipation system includes a cooling liquid circulation pipeline 900 and any electronic device 100 shown in FIGS. 2 to 8 . The liquid cooling plate 10 of the electronic device 100 communicates with the cooling liquid circulation pipeline 900 .

During the operation of the on-board computer, the insulating liquid at the bottom of the accommodating cavity vaporizes and rises to the top of the accommodating cavity, and the temperature of the liquid cooling plate is relatively low, so that the vaporized insulating liquid liquefies on the surface of the liquid cooling plate and drips onto the surface of the accommodating cavity. The bottom of the accommodating cavity is circulated in this way to transfer the heat generated by the circuit board to the liquid cooling plate and dissipate it to achieve the purpose of heat dissipation. Since the connector and the bottom shell are integrally injection-molded, there is no gap between the connector and the bottom shell, so the insulating liquid will not leak at the connection between the connector and the bottom shell, thus avoiding the adverse consequences caused by the leakage of the insulating liquid , so that the trip computer can work efficiently and stably.

The liquid cooling plate 10 is communicated with the cooling liquid circulation line 900. When the cooling liquid circulates in the cooling liquid circulation line 900, the cooling liquid flows through the liquid cooling plate 10, and the heat of the liquid cooling plate 10 is taken away. 10 to dissipate heat to keep the liquid cooling plate 10 in a relatively low temperature state, so that the vaporized insulating liquid liquefies on the surface of the liquid cooling plate 10 . By connecting the liquid cooling plate 10 of the electronic device 100 to the cooling liquid circulation line 900 of the vehicle itself, there is no need to provide additional circulation lines.

FIG. 10 is a schematic diagram of the connection between a cooling liquid circulation pipeline and an electronic device provided by the present application. As shown in FIG. 10 , the cooling liquid circulation pipeline 900 includes a battery cooling plate 970 , the battery cooling plate 970 is used for cooling the battery of the vehicle, and the liquid cooling plate 10 is connected in parallel with the battery cooling plate 970 . After the electronic device 100 is connected to the battery cooling plate 970 in parallel, part of the circulating cooling liquid enters the battery cooling plate 970 and the other part enters the liquid cooling plate 10 of the electronic device 100 to cool the battery cooling plate 970 and the electronic device 100 respectively.

In other examples, the liquid cooling plate 10 is connected in series with the battery cooling plate 970 . After the electronic device 100 is connected to the battery cooling plate 970 in series, the circulating cooling liquid flows through the liquid cooling plate 10 and the battery cooling plate 970 of the electronic device 100 successively to cool the electronic device 100 and the battery cooling plate 970 successively.

As shown in FIG. 10 , the cooling liquid circulation pipeline 900 includes a condenser 910, an electric compressor 920, an evaporator 930, a first expansion valve 940, a battery cooler 950, an electric water pump 960, a battery cooling plate 970, and an electronic water valve 980 and a second expansion valve 990.

The inlet of the condenser 910 is connected with the outlet of the electric compressor 920, the outlet of the condenser 910 is connected with the inlet of the first expansion valve 940, the outlet of the first expansion valve 940 is connected with the inlet of the evaporator 930, and the outlet of the evaporator 930 is connected with the inlet of the first expansion valve 940. The inlet of the electric compressor 920 is connected. The outlet of the condenser 910 is also connected to the refrigerant inlet of the battery cooler 950 , and the refrigerant outlet of the battery cooler 950 is connected to the inlet of the electric compressor 920 .

The electric compressor 920 provides power for the circulation of the refrigerant, exemplarily, the refrigerant is an aqueous glycol solution, Freon.

When the refrigerant flows out of the condenser 910 , it is liquid, and a part of the refrigerant flowing out of the condenser 910 enters the evaporator 930 . The liquid refrigerant flows through the evaporator 930 and becomes gaseous, and the gaseous refrigerant passes through the electric compressor 920 . Return to condenser 910 and convert to liquid state. The first expansion valve 940 is used to adjust the flow rate of the refrigerant flowing through the evaporator 930. If the first expansion valve 940 is completely closed, that is, the flow rate of the refrigerant flowing through the evaporator 930 is 0, the evaporator 930 does not work. The refrigerant circulates between the condenser 910 and the evaporator 930, transferring heat from the evaporator 930 to the condenser 910, reducing the temperature of the evaporator 930. The cool air near the evaporator 930 is blown into the cab of the vehicle through a fan, thereby cooling the cab of the vehicle.

Another part of the refrigerant flowing out of the condenser 910 flows through the battery cooler 950 , is also converted into a gaseous state after passing through the battery cooler 950 , and is returned to the condenser 910 by the electric compressor 920 . The refrigerant circulates between the condenser 910 and the battery cooler 950, transferring heat from the battery cooler 950 to the condenser 910, reducing the temperature of the battery cooler 950.

The cooling water inlet of the battery cooler 950 is connected to the outlet of the electric water pump 960, the cooling water outlet of the battery cooler 950 is connected to the inlet of the second expansion valve 990, and the outlet of the second expansion valve 990 is connected to the inlet of the electronic water valve 980, The outlet of the electronic water valve 980 is connected to the water inlet of the battery cooling plate 970 , and the water outlet of the battery cooling plate 970 is connected to the water inlet of the electric water pump 960 .

Electric water pump 960 powers the circulation of cooling water. Under the action of the electric water pump 960 , the cooling water circulates between the battery cooler 950 and the battery cooling plate 970 , transferring the heat of the battery cooling plate 970 to the battery cooler 950 . Under the action, it is transferred to the condenser 910 .

The second expansion valve 990 and the electronic water valve 980 can adjust the flow rate of cooling water. The second expansion valve 990 is an electronic expansion valve, a thermal expansion valve or a solenoid valve, which can actively adjust the flow of cooling water according to the pressure and temperature in the pipeline.

As shown in FIG. 10 , the electronic device 100 is connected in parallel with the battery cooling plate 970 , that is, the liquid inlet 10 a of the liquid cooling plate 10 of the electronic device 100 is connected to the water inlet of the battery cooling plate 970 , and the liquid cooling plate 10 of the electronic device 100 is connected The liquid outlet 10b is connected to the water outlet of the battery cooling plate 970 . Part of the cooling water flowing through the electronic water valve 980 flows through the battery cooling plate 970 , and the other part flows through the liquid cooling plate 10 of the electronic device 100 .

In other examples, the electronic device 100 is connected to the battery cooling plate 970 in series, for example, the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100 is connected to the outlet of the electronic water valve 980, and the liquid cooling plate of the electronic device 100 is connected The liquid outlet 10b of 10 is connected to the water inlet of the battery cooling plate 970, and the water outlet of the battery cooling plate 970 is connected to the inlet of the electric water pump 960; or, the water inlet of the battery cooling plate 970 is connected to the outlet of the electronic water valve 980. , the water inlet of the battery cooling plate 970 is connected to the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100 , and the liquid outlet 10b of the liquid cooling plate 10 of the electronic device 100 is connected to the inlet of the electric water pump 960 .

When the electronic device 100 is connected in parallel with the battery cooling plate 970 , part of the cooling water flowing from the electronic water valve 980 flows through the battery cooling plate 970 , and the other part flows through the liquid cooling plate 10 of the electronic device 100 . The heat dissipation effect of the battery cooling plate 970 is related to the flow rate of the cooling water. The greater the flow rate of the cooling water, the better the heat dissipation effect. In order to keep the flow rate of the cooling water flowing through the battery cooling plate 970 before the electronic device 100 is connected level, the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980.

When the electronic device 100 and the battery cooling plate 970 are connected in series, the cooling water flowing out from the electronic water valve 980 will flow through the liquid cooling plate 10 and the battery cooling plate 970 of the electronic device 100 successively. If the cooling water first flows through the liquid cooling plate 10 of the electronic device 100 and then flows through the battery cooling plate 970 , the temperature of the cooling water will increase after flowing through the liquid cooling plate 10 of the electronic device 100 . Under the condition that the flow rate of the cooling water is constant, the lower the temperature of the cooling water flowing through the battery cooling plate 970 is, the better the heat dissipation effect of the battery cooling plate 970 is. In order to keep the heat dissipation effect of the battery cooling plate 970 at the level before the electronic device 100 is connected, the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980 to increase the flow of cooling water to compensate for the The cooling water first flows through the liquid cooling plate 10 of the electronic device 100 and the adverse effect is caused by the temperature rise. If the cooling water first flows through the battery cooling plate 970 and then flows through the liquid cooling plate 10 of the electronic device 100 , the heat dissipation effect of the battery cooling plate 970 will not be affected when the flow rate of the cooling water remains unchanged. Although the temperature of the cooling water will increase after flowing through the battery cooling plate 970 , if the increased temperature of the cooling water is sufficient to dissipate heat from the liquid cooling plate 10 of the electronic device 100 , the original cooling water flow rate will be maintained, that is, cooling The flow of water remains at the level before the electronic device 100 was plugged in. If the cooling water flow of crude oil is used for heat dissipation, it is not enough to maintain the temperature of the electronic device 100 within the allowable temperature range, then the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980, so that the electronic The temperature of the device 100 can be maintained within the allowable temperature range.

An embodiment of the present application further provides a vehicle, which includes the vehicle-mounted cooling system shown in FIG. 9 or FIG. 10 . The vehicle includes at least an automobile and an electric vehicle. By arranging the vehicle-mounted heat dissipation system in FIG. 9 or FIG. 10 , the electronic device 100 can be well dissipated during the driving process of the vehicle, ensuring that the electronic device 100 can work stably and with high performance.

The above are only exemplary embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the protection of the present application. within the range.

Claims

An electronic device, characterized in that it comprises a liquid cooling plate (10), a bottom case (20), a circuit board (30) and a connector (40);

The liquid cooling plate (10) is connected to the bottom shell (20), and a closed accommodating cavity (A) is formed between the liquid cooling plate (10) and the bottom shell (20), and the container An insulating liquid (50) is contained in the cavity (A);

The circuit board (30) is located in the accommodating cavity (A) and connected to the bottom case (20), and the circuit board (30) is immersed in the insulating liquid (50);

The connector (40) is integrally injection-molded with the bottom case (20), one end of the connector (40) is located in the accommodating cavity (A) and is connected to the circuit board (30), and the other One end is located outside the accommodating cavity (A).
The electronic device according to claim 1, wherein the bottom case (20) comprises a side plate (201) and a bottom plate (202), and the bottom plate (202) is opposite to the liquid cooling plate (10), The side plate (201) is located on the side of the bottom plate (202) close to the liquid cooling plate (10), and is connected to the bottom plate (202) and the liquid cooling plate (10), and the connector (40) is located on the side plate (201).
The electronic device according to claim 2, wherein the side plate (201) is welded to the liquid cooling plate (10).
The electronic device according to claim 2, characterized in that, the electronic device further comprises a sealing ring (60), and the sealing ring (60) is located on the side plate (201) and the liquid cooling plate (10) between;

The sealing ring (60) and the side plate (201) are integrally injection-molded, or the sealing ring (60) and the liquid cooling plate (10) are integrally injection-molded.
The electronic device according to any one of claims 2 to 4, wherein the bottom plate (202) is opposite to the circuit board (30), and the bottom plate (202) is close to the liquid cooling plate (10) One side of the base plate has a plurality of support protrusions (2021), and the plurality of support protrusions (2021) are located between the bottom plate (202) and the circuit board (30) and are connected with the circuit board (30).
The electronic device according to any one of claims 1 to 5, characterized in that, the circuit board (30) and the connector (40) are connected by wires (80).
The electronic device according to any one of claims 1 to 6, characterized in that, one end of the connector (40) located in the accommodating cavity (A) is immersed in the insulating liquid (50).
The electronic device according to any one of claims 1 to 7, wherein the inside of the liquid cooling plate (10) and the surface of the liquid cooling plate (10) close to the circuit board (30) At least one place has fins (101).
The electronic device according to any one of claims 1 to 8, wherein the insulating liquid (50) is a fluorinated liquid or a silicone oil.
A vehicle-mounted cooling system, characterized by comprising a cooling liquid circulation pipeline (900) and the electronic device (100) according to any one of claims 1 to 9, the liquid cooling plate (10) and the cooling The liquid circulation pipeline (900) is communicated.
The vehicle-mounted cooling system according to claim 10, characterized in that, the cooling liquid circulation pipeline (900) comprises a battery cooling plate (970), and the battery cooling plate (970) is used for cooling the battery of the vehicle, the The liquid cooling plate (10) is connected in parallel or in series with the battery cooling plate (970).
A vehicle, characterized by comprising the vehicle-mounted cooling system according to claim 10 or 11.