WO2022095457A1 - Electronic apparatus, vehicle-mounted heat dissipation system and vehicle - Google Patents
Electronic apparatus, vehicle-mounted heat dissipation system and vehicle Download PDFInfo
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- WO2022095457A1 WO2022095457A1 PCT/CN2021/101054 CN2021101054W WO2022095457A1 WO 2022095457 A1 WO2022095457 A1 WO 2022095457A1 CN 2021101054 W CN2021101054 W CN 2021101054W WO 2022095457 A1 WO2022095457 A1 WO 2022095457A1
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- liquid
- cooling plate
- plate
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- circuit board
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
Definitions
- the present application relates to the field of heat dissipation technology, and in particular, to an electronic device, a vehicle-mounted heat dissipation system and a vehicle.
- Electronic devices usually generate heat during the working process. In order to ensure the normal operation of the electronic devices, it is usually necessary to dissipate heat to reduce the temperature of the electronic devices.
- a mobile data center also called a trip computer
- the on-board computer will generate a lot of heat during the working process, which will cause the temperature of the on-board computer to rise and affect its performance and stability.
- the embodiments of the present application provide an electronic device, a vehicle-mounted cooling system and a vehicle, which can overcome the problems in the related art, and the technical solutions are as follows:
- an electronic device In a first aspect, an electronic device is provided.
- a trip computer of a vehicle is used as an example.
- the electronic device includes a housing, a circuit board, and a connector.
- the circuit board is located in the accommodating cavity in the casing, the connector is connected with the circuit board, one end of the connector is located in the casing, and the other end protrudes from the casing, the casing
- An insulating liquid is contained in the interior, and the circuit board is immersed in the insulating liquid.
- the housing includes a liquid cooling plate and a bottom case, the liquid cooling plate is connected to the bottom case, and the closed accommodating cavity is formed between the liquid cooling plate and the bottom case .
- the liquid cooling plate when the electronic device is in use, the liquid cooling plate is connected to the cooling liquid circulation pipeline, so that the liquid cooling plate can maintain a relatively low temperature state.
- the heat generated by the circuit board vaporizes the insulating liquid, and the vaporized insulating liquid rises to the liquid cooling plate. Because the temperature of the liquid cooling plate is relatively low, the vaporized insulating liquid liquefies on the surface of the liquid cooling plate and drips. Back to the bottom of the accommodating cavity, and circulating in this way, the heat generated by the circuit board is transferred to the liquid cooling plate, and is emitted through the liquid cooling plate to achieve the purpose of heat dissipation and reduce the temperature of the electronic equipment.
- the connector and the bottom case are integrally injection-molded. Since the connector and the bottom shell are integrally injection-molded, there is no gap between the connector and the bottom shell, so the insulating liquid will not leak at the connection between the connector and the bottom shell, thus avoiding the adverse consequences caused by the leakage of the insulating liquid , so that electronic equipment can work efficiently and stably.
- the electronic device includes multiple connectors of different types, one, two, or more of each connector.
- the injection molding includes at least one of primary injection molding, secondary injection molding, multiple injection molding, and two-color molding. Specifically, according to the shape and complexity of the structure of the connector and the bottom shell, one-shot injection molding, secondary injection molding, multiple injection molding or two-color molding are selected.
- liquid cooling plate and the bottom case are welded or connected by screws.
- the liquid cooling plate is connected to the bottom case by welding.
- welding For example by means of laser welding.
- the liquid cooling plate is connected to the bottom case by means of screw connection.
- the liquid-cooling plate and the bottom case are connected by screws.
- the screws are directly removed to separate the liquid-cooling plate and the bottom case.
- the cold plate is connected with the bottom case.
- a sealing ring is provided between the liquid cooling plate and the bottom case.
- the liquid-cooling plate and the bottom case are clamped to the sealing ring, so as to improve the sealing between the liquid-cooling plate and the bottom case, and avoid the liquid-cooling plate and the bottom case. leaks at the connection.
- the sealing ring is integrally injection-molded with any one of the liquid cooling plate and the bottom case.
- the sealing ring and the liquid cooling plate are integrally injection-molded, so that the sealing ring and the liquid cooling plate are formed as a whole.
- the sealing ring and the bottom case are integrally injection-molded, so that the sealing ring and the bottom case form a whole.
- the injection molding method includes at least one of primary injection molding, secondary injection molding, multiple injection molding and two-color molding.
- the sealing ring is integrally injection-molded with one of the liquid cooling plate and the bottom case, so that the sealing ring is connected more tightly, and the sealing performance between the liquid cooling plate and the bottom case can be further improved.
- the bottom case includes a side plate and a bottom plate.
- the side plate is located on one side of the bottom plate, the side plate is connected to the bottom plate, and the liquid cooling plate is connected to the side plate.
- the enclosed accommodating cavity is formed by the side plate, the bottom plate and the liquid cooling plate, the bottom plate serves as a basis for installing the circuit board, and the connector is located on the side plate.
- the aforementioned sealing ring is located between the liquid cooling plate and the side plate.
- the side plate has a groove for accommodating the sealing ring.
- the sealing ring presses the inner wall of the groove to form a seal, which increases the contact area between the sealing ring and the side plate and improves the sealing performance.
- one side of the bottom plate has a plurality of support protrusions, the plurality of support protrusions are located in the accommodating cavity, and the circuit board is fixed on the plurality of support protrusions.
- a plurality of support protrusions are provided, and the circuit board is supported by the support protrusions, so that a certain distance is maintained between the circuit board and the bottom plate, so that the lower surface of the circuit board can be fully contacted with the insulating liquid.
- the circuit board and the connector are connected by wires.
- the wires refer to wire harnesses for data transmission.
- the circuit board is first fixed on the bottom case, then one end of the wire is connected to the circuit board, and the other end of the wire is connected to the end of the connector located in the accommodating cavity Connected, easy to operate.
- both the interior of the liquid cooling plate and the surface of the liquid cooling plate close to the circuit board are provided with fins.
- the liquid-cooling plate is a hollow structure.
- the cavity inside the liquid-cooling plate is continuously injected and discharged with cooling liquid, and the cooling liquid is used to reduce the temperature of the liquid-cooling plate, so that the liquid The cold plate continues to maintain a relatively low temperature, and the vaporized insulating liquid liquefies on the surface of the liquid cold plate.
- the fins inside the liquid-cooling plate can increase the contact area between the cooling liquid and the liquid-cooling plate, accelerate the heat exchange between the liquid-cooling plate and the cooling liquid, and help improve the heat dissipation capacity of the electronic equipment.
- the fins of the liquid cooling plate close to the circuit board are located in the accommodating cavity, and the fins are arranged to increase the contact area between the vaporized insulating liquid and the liquid cooling plate, which is beneficial to the liquefaction of the vaporized insulating liquid.
- an in-vehicle cooling system is also provided.
- the vehicle-mounted heat dissipation system includes a cooling liquid circulation pipeline and any of the electronic devices described in the previous aspect.
- the coolant circulation pipeline is used to dissipate heat from various parts of the vehicle, such as dissipating heat from the cab of the vehicle and dissipating heat from the vehicle's battery.
- the liquid cooling plate of the electronic device communicates with the cooling liquid circulation pipeline.
- the cooling liquid circulation pipeline radiates heat to the liquid cooling plate of the electronic device, reduces the temperature of the liquid cooling plate, and keeps the liquid cooling plate in a relatively low temperature state.
- the insulating liquid in the electronic equipment can be liquefied on the surface of the liquid cooling plate after being vaporized.
- a vehicle in a third aspect, includes the vehicle-mounted cooling system as described in the second aspect.
- the electronic equipment in the vehicle-mounted heat dissipation system of the vehicle can be well dissipated to ensure the performance and stability of the electronic equipment.
- FIG. 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application.
- FIG. 2 is a schematic diagram of an external structure of an electronic device provided by an embodiment of the present application.
- FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application.
- Fig. 4 is the I-I sectional view in Fig. 2;
- FIG. 5 is a schematic structural diagram of a bottom case of an electronic device provided by an embodiment of the present application.
- FIG. 6 is a schematic diagram of an internal structure of an electronic device provided by an embodiment of the present application.
- FIG. 7 is a schematic diagram of the internal structure of a liquid cooling plate provided by an embodiment of the present application.
- FIG. 8 is a schematic structural diagram of a liquid cooling plate provided by an embodiment of the present application.
- FIG. 9 is a structural block diagram of a vehicle-mounted cooling system provided by the present application.
- FIG. 10 is a schematic diagram of the connection between a cooling liquid circulation pipeline and an electronic device provided by the present application.
- Millimeter wave radar 10 liquid cooling plate 10a, liquid inlet 10b, liquid outlet
- the embodiments of the present application provide an electronic device, a vehicle-mounted cooling system, and a vehicle.
- the embodiments of the present application take the electronic device as an on-board computer of a vehicle as an example, and the vehicle includes at least an automobile and an electric vehicle.
- FIG. 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application.
- a millimeter-wave radar 1 and a lidar 2 are arranged at the front of the vehicle
- a vehicle control unit (VCU) 3 is also arranged at the center console of the vehicle
- a cab is also arranged
- a telematics box 4 (telematics box, T-BOX)
- the telematics processor is used to establish contact with the cloud data center 7 .
- a camera is also usually provided on the vehicle, for example, a camera 5 is usually provided in the driver's cab.
- the millimeter wave radar 1 , the laser radar 2 , the vehicle controller 3 , the telematics processor 4 and the camera 5 are respectively connected to the trip computer 6 .
- the amount of data that the trip computer needs to process is getting larger and larger, and the computing power demand for the trip computer is also increasing. It has gradually increased from the previous 10Tflops to 300Tflops, or even higher, and the electronic components on the circuit board inside the trip computer are naturally also More and more, reaching more than 200pcs. Usually, more electronic components mean higher power consumption, and the power consumption of the on-board computer has gradually increased from about 20w to about 300w, resulting in a large increase in heat generation and an increase in the overall temperature of the on-board computer.
- the trip computer 6 includes a casing, a circuit board, and a connector 40, the circuit board is located inside the casing, the connector 40 is mounted on the circuit board, and the connector 40 protrudes from the casing.
- the trip computer 6 usually includes a plurality of connectors 40 , and devices such as the millimeter wave radar 1 , the lidar 2 , the vehicle controller 3 , the telematics processor 4 , and the camera 5 are connected to the plurality of connectors 40 through signal lines.
- An insulating liquid is contained in the casing, and the circuit board is immersed in the insulating liquid.
- the electronic components on the circuit board heat up, the insulating liquid absorbs heat and vaporizes, and the vaporized insulating liquid rises to the top of the shell, where the temperature is lower at the top of the shell, and the vaporized insulating liquid It liquefies and releases heat, and the liquefied insulating liquid drips back to the bottom of the enclosure.
- This cycle transfers the heat generated by the circuit board to the top of the case for dissipation. Since the vaporization of the insulating liquid will absorb a lot of heat, this method of utilizing the phase change of the material has a strong heat dissipation capacity.
- the insulating liquid in the casing is easy to leak through the gap between the connector 40 and the casing, and the insulating liquid changes from a liquid state to a gaseous state, and the volume is greatly increased, which will lead to an increase in the pressure inside the casing, and the greater the heat generation, the higher the pressure.
- the leakage of insulating liquid will reduce the heat dissipation capacity of the on-board computer, and once the insulating liquid leaks enough to submerge the circuit board, the heat on the circuit board will hardly be dissipated, the temperature will rise rapidly, and it is very likely to burn out.
- FIG. 2 is a schematic diagram of an external structure of an electronic device provided by an embodiment of the present application.
- FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application.
- the electronic device includes a housing, a circuit board 30 and a connector 40 .
- the outer casing includes a liquid cooling plate 10 and a bottom casing 20 .
- Fig. 4 is a sectional view taken along line I-I in Fig. 2 .
- the liquid cooling plate 10 is connected to the bottom case 20 , a closed accommodating cavity A is formed between the liquid cooling plate 10 and the bottom shell 20 , and the accommodating cavity A holds the insulating liquid 50 .
- the circuit board 30 is located in the accommodating cavity A, and the circuit board 30 is connected to the bottom case 20 , and the circuit board 30 is immersed in the insulating liquid 50 .
- the connector 40 is integrally injection-molded with the bottom case 20 , one end of the connector 40 is located in the accommodating cavity A and connected to the circuit board 30 , and the other end of the connector 40 is located outside the accommodating cavity A.
- the hollow arrow in the accommodating cavity A indicates the rising direction of the gasified insulating gas 50
- the solid arrow in the accommodating cavity A indicates the dripping direction of the liquefied insulating liquid 50
- the black dots indicate the insulating gas 50 .
- the solid arrows inside the liquid cold plate 10 indicate the flow direction of the cooling water for cooling the liquid cold plate 10 .
- the insulating liquid 50 located at the bottom of the accommodating cavity A vaporizes and rises to the top of the accommodating cavity A, and the temperature of the liquid cooling plate 10 is relatively low, so that the vaporized insulating liquid 50 is in the liquid cooling plate 10.
- the surface liquefies and drops to the bottom of the accommodating cavity A, and circulates in this way to transfer the heat generated by the circuit board 30 to the liquid cooling plate 10 and dissipate it to achieve the purpose of heat dissipation.
- the connector 40 and the bottom case 20 are integrally injection-molded, there is no gap at the connection between the connector 40 and the bottom case 20, so the insulating liquid 50 will not leak at the connection between the connector 40 and the bottom case 20, thereby avoiding the leakage of the insulating liquid 50.
- the adverse consequences caused by the leakage of the liquid 50 enable the on-board computer to work efficiently and stably.
- the insulating liquid 50 is fluorinated liquid or silicone oil. Both fluorinated liquid and silicone oil have good insulating properties.
- integral injection molding refers to forming a whole by means of injection molding.
- the connector 40 and the bottom case 20 are integrally formed by injection molding, so as to eliminate the gap between the connector 40 and the bottom case 20 and avoid the leakage of the insulating liquid 50 .
- injection molding includes primary injection molding, secondary injection molding, multiple injection molding, and two-color molding.
- One-shot injection molding is the simplest injection molding method. During production, after the mold is closed, the connector 40 and the bottom shell 20 are obtained as a whole through the process of plastic injection, pressure holding, cooling, mold opening, and product extraction.
- Secondary injection molding is a special injection molding method. After the semi-finished product is made by one-time injection molding in one set of molds, the semi-finished product is placed in another set of molds, and then undergoes one mold clamping, injection, and pressure holding. , cooling, mold opening, and finally the product is taken out to obtain a connector 40 and bottom shell 20 that form a whole.
- the material injected in the two injections is the same, or the material injected in the two injections is different.
- the semi-finished product is any one of the following structures: connector 40, bottom shell 20, part of connector 40, part of bottom shell 20, complete connector 40 and part of bottom shell 20, complete The bottom case 20 and a part of the connector 40 , and a part of the connector 40 and a part of the bottom case 20 .
- the multiple injection molding is based on the secondary injection molding, and then goes through at least one time of mold clamping, glue injection, pressure holding, cooling, mold opening, and product removal, to form an integral connector 40 and bottom shell 20 .
- the material injected for each shot is the same, or the material injected for each shot is different.
- Two-color molding is a molding process in which two different materials are injected into the same set of molds.
- the color of the two materials is different, or the hardness is different, or both the color and the hardness are different.
- the difference between two-color molding and one-shot injection molding is that the finished product obtained by two-color molding has different materials in different parts.
- the connector 40 and the bottom case 20 are formed by one injection molding
- the material of the connector 40 and the bottom case 20 are the same
- the connector 40 and the bottom case 20 are formed by two-color molding
- the material of the connector 40 and the bottom case 20 are formed. different.
- one-shot injection molding, secondary injection molding, multiple injection molding or two-color molding are selected.
- FIG. 5 is a schematic structural diagram of a bottom case of an electronic device provided by an embodiment of the present application.
- the bottom case 20 includes a side plate 201 and a bottom plate 202 .
- the bottom plate 202 is opposite to the liquid cooling plate 10
- the side plate 201 is located on the side of the bottom plate 202 close to the liquid cooling plate 10
- the connector 40 is located on the side plate 201 .
- the bottom plate 202 of the bottom case 20 serves as the base for placing the trip computer. When the trip computer is placed, it is supported by the bottom plate 202 and is placed flat on the corresponding position of the vehicle.
- the connector 40 is arranged on the side plate 201 to facilitate the connection of various signal lines with the connector 40 .
- the number of the side plates 201 is set according to the shape of the electronic device.
- the bottom plate 202 is rectangular, and the bottom case 20 includes four side plates 201 .
- the bottom plate 202 is in other polygonal shapes, such as pentagons, hexagons, etc., and the number of side plates 201 also changes accordingly.
- the multiple connectors 40 are located on the same side board 201 , or distributed on multiple side boards 201 .
- a row of connectors 40 is distributed on the side panel 201 .
- a row of connectors 40 is distributed on the side plate 201 .
- only one row of connectors 40 is distributed on the side plate 201 .
- two or more rows of connectors 40 are distributed on the side plate 201 .
- the side plate 201 further has a liquid injection port 201 a, and the liquid injection port 201 a is used for filling the accommodating cavity A with the insulating liquid 50 .
- the liquid injection port 201 a and the connector 40 are located on different side plates 201 to facilitate the filling of the insulating liquid 50 .
- the bottom case 20 further includes a sealing plug 70, which is detachably installed on the side plate 201 and is located at the liquid injection port 201a. After the filling of the insulating liquid 50 is completed, the sealing plug 70 is installed on the side plate 201 , and the filling port 201 a is blocked by the sealing plug 70 to prevent the insulating liquid 50 from leaking.
- the sealing plug 70 is a screw plug, and the sealing plug 70 is screwed to the liquid injection port 201a.
- FIG. 6 is a schematic diagram of an internal structure of an electronic device provided by an embodiment of the present application.
- the liquid cooling plate 10 is omitted in FIG. 6 .
- the bottom plate 202 is opposite to the circuit board 30 , and the side of the bottom plate 202 close to the liquid cooling plate 10 has a plurality of supporting protrusions 2021 , and the plurality of supporting protrusions 2021 are located between the bottom plate 202 and the circuit board 30 and connected to the circuit board 30 .
- the support protrusions 2021 support the circuit board 30 from the bottom plate 202 , so that the circuit board 30 and the bottom plate 202 are spaced apart from each other.
- the number of the supporting protrusions 2021 is set according to the area of the circuit board 30 .
- six support protrusions 2021 are provided on the bottom plate 202 .
- the top surface of the support protrusion 2021 has threaded holes 2021 a , and the circuit board 30 is fixedly connected to the top surface of the support protrusion 2021 through the second screw 92 .
- the included angle formed by the plane where the circuit board 30 is located and the plane where the bottom plate 202 is located is an acute angle. That is, the circuit board 30 is not parallel to the bottom plate 202 , but presents a certain angle, which is beneficial for the bubbles formed by the vaporization of the insulating liquid 50 to rise to the outside of the liquid surface directly below the circuit board 30 , so as to prevent the bubbles from accumulating under the circuit board 30 . This affects the heat dissipation of the lower surface of the circuit board 30 .
- the circuit board 30 and the connector 40 are connected by wires 80 .
- the wire 80 here refers to a wire harness that can be used for data transmission.
- the wire 80 is used to connect the circuit board 30 and the connector 40 to facilitate the manufacture of the trip computer.
- the connector 40 is usually directly mounted on the circuit board 30 to form an integral body with the circuit board 30 .
- the connector 40 and the circuit board 30 are placed into the housing for installation.
- the connector 40 and the bottom case 20 are integrally injection-molded, and the connector 40 and the bottom case 20 are integral, so it is difficult to directly install the connector 40 on the circuit board 30, and the wire 80 is used to connect the circuit board 30 and the circuit board 30.
- the connector 40 enables the circuit board 30 and the connector 40 to be installed independently, and the operation is convenient.
- the number of wires 80 may be different for different connectors 40 , and only a few wires 80 are schematically shown in FIG. 6 .
- one end of the connector 40 located in the accommodating cavity A is also immersed in the insulating liquid 50 .
- the connector 40 will also generate a certain amount of heat.
- the heat generated by the connector 40 can also be dissipated through the insulating liquid 50 to prevent the connector 40 from overheating.
- wires 80 connecting circuit board 30 and connector 40 are also submerged in insulating liquid 50 .
- the wire 80 also generates a certain amount of heat during the working process and the temperature rises.
- the surface of the wire 80 usually has a layer of insulation, and the insulation will accelerate aging when heated.
- the wire 80 is immersed in the insulating liquid 50, and the insulation The liquid 50 dissipates heat to the wire 80 , which is beneficial to reduce the temperature of the wire 80 , thereby delaying the aging speed of the insulating skin of the wire 80 and prolonging the service life of the wire 80 .
- FIG. 7 is a schematic diagram of the internal structure of a liquid cooling plate provided by an embodiment of the present application.
- the liquid cooling plate 10 has a hollow structure.
- the liquid cooling plate 10 has a liquid inlet 10a and a liquid outlet 10b.
- the liquid inlet 10a and the liquid outlet 10b are used for circulating cooling liquid, and the cooling liquid flows from the liquid inlet port. 10a enters the liquid cooling plate 10, and flows out of the liquid cooling plate 10 from the liquid outlet 10b.
- the heat of the liquid cooling plate 10 can be taken away, thereby reducing the temperature of the liquid cooling plate 10 .
- the cooling liquid is water.
- the liquid cooling plate 10 has fins 101 inside.
- the fins 101 located inside the liquid-cooling plate 10 increase the contact area between the liquid-cooling plate 10 and the cooling liquid, and can take away heat more quickly, which is beneficial to enhance the heat dissipation capability of the liquid-cooling plate 10 .
- FIG. 8 is a schematic structural diagram of a liquid cooling plate provided by an embodiment of the present application.
- the lower surface of the liquid cooling plate 10 in FIG. 8 is the side of the liquid cooling plate 10 close to the circuit board 30 .
- the surface of the liquid cooling plate 10 close to the circuit board 30 also has fins 101 .
- the fins 101 of the liquid cooling plate 10 close to the surface of the circuit board 30 are located in the accommodating cavity A, and this part of the fins 101 increases the volume of the vaporized insulating liquid 50 and the liquid cooling plate.
- the insulating liquid 50 when it is vaporized, it can be liquefied on the surface of the liquid cooling plate 10 more quickly, which is beneficial to speed up the heat exchange speed between the insulating liquid 50 and the liquid cooling plate 10. , which further improves the heat dissipation capacity of electronic equipment.
- the insulating liquid 50 after the insulating liquid 50 is liquefied on the surface of the liquid cooling plate 10 , it slides down along the surface of the fins 101 , so as to quickly gather into larger droplets and drop back into the bottom case 20 .
- the liquid-cooling plate 10 is a metal piece, and metals generally have strong thermal conductivity, which is beneficial to the heat exchange between the liquid-cooling plate 10 and the insulating liquid 50 and between the liquid-cooling plate 10 and the cooling liquid. Improve the heat dissipation capacity of electronic equipment.
- the liquid cooling plate 10 is made of aluminum or aluminum alloy. Both aluminum and aluminum alloy have strong thermal conductivity, and are inexpensive, easy to reduce manufacturing costs, light in weight, and easy to install.
- the liquid cooling plate 10 is made of other metals, such as steel, copper, or copper alloys.
- the liquid cooling plate 10 and the bottom case 20 are connected by first screws 91 to facilitate the disassembly and assembly of the electronic device.
- the first screws 91 are arranged at intervals along the edge of the liquid cooling plate 10 .
- the electronic device further includes a sealing ring 60 , and the sealing ring 60 is located between the side plate 201 and the liquid cooling plate 10 .
- Setting the sealing ring 60 can improve the sealing ability between the liquid cooling plate 10 and the bottom case 20.
- the liquid cooling plate 10 and the bottom case 20 clamp the sealing ring 60 together to prevent the insulating liquid 50 leaks from between the liquid cooling plate 10 and the bottom case 20 .
- the sealing ring 60 is integrally injection molded with the side plate 201 . That is, the sealing ring 60 and the bottom case 20 are integrally injection-molded.
- the sealing ring 60 and the side plate 201 are combined more closely, the gap between the sealing ring 60 and the side plate 201 is eliminated, and the gap between the liquid cooling plate 10 and the bottom case 20 is improved. sealing effect.
- the sealing ring 60 and the side plate 201 are made of secondary injection molding, multiple injection molding or two-color molding.
- the sealing ring 60 is usually made of a softer material with certain elasticity, while the bottom shell 20 is usually made of a relatively hard material.
- the ring 60 and the bottom case 20 are made of different materials. Secondary injection molding, multiple injection molding or two-color molding are used to directly inject the sealing ring 60 on the bottom case 20, so that the sealing ring 60 and the bottom case 20 are integrated.
- the sealing ring 60 is integrally injection molded with the liquid cooling plate 10 .
- the integral injection molding of the sealing ring 60 and the liquid cooling plate 10 can make the sealing ring 60 and the liquid cooling plate 10 combine more closely, eliminate the gap between the sealing ring 60 and the liquid cooling plate 10, and improve the liquid cooling plate 10 and the bottom shell 20. sealing effect between.
- the liquid cooling plate 10 is placed in a mold, and the sealing ring 60 is injection-molded on the surface of the liquid cooling plate 10 .
- the side plate 201 is provided with a groove 201b for accommodating the sealing ring 60 (see FIG. 3 ).
- the cross section of the groove 201b is arc-shaped.
- the side plate 201 is welded with the liquid cooling plate 10 .
- the liquid cooling plate 10 and the bottom case 20 are connected as a whole by welding, so that the sealing ring 60 is not required and the leakage of the insulating liquid 50 from between the liquid cooling plate 10 and the bottom case 20 can be avoided.
- the side plate 201 and the liquid cooling plate 10 are welded by laser.
- the bottom case 20 is a plastic part
- the liquid cooling plate 10 is usually a metal part.
- the plastic part and the metal part can be welded into a whole by using laser welding technology, so that the bottom case 20 and the liquid cooling plate 10 can be welded as a whole.
- FIG. 9 is a structural block diagram of a vehicle-mounted cooling system provided by the present application.
- the vehicle-mounted heat dissipation system includes a cooling liquid circulation pipeline 900 and any electronic device 100 shown in FIGS. 2 to 8 .
- the liquid cooling plate 10 of the electronic device 100 communicates with the cooling liquid circulation pipeline 900 .
- the insulating liquid at the bottom of the accommodating cavity vaporizes and rises to the top of the accommodating cavity, and the temperature of the liquid cooling plate is relatively low, so that the vaporized insulating liquid liquefies on the surface of the liquid cooling plate and drips onto the surface of the accommodating cavity.
- the bottom of the accommodating cavity is circulated in this way to transfer the heat generated by the circuit board to the liquid cooling plate and dissipate it to achieve the purpose of heat dissipation.
- the connector and the bottom shell are integrally injection-molded, there is no gap between the connector and the bottom shell, so the insulating liquid will not leak at the connection between the connector and the bottom shell, thus avoiding the adverse consequences caused by the leakage of the insulating liquid , so that the trip computer can work efficiently and stably.
- the liquid cooling plate 10 is communicated with the cooling liquid circulation line 900.
- the cooling liquid circulates in the cooling liquid circulation line 900
- the cooling liquid flows through the liquid cooling plate 10, and the heat of the liquid cooling plate 10 is taken away. 10 to dissipate heat to keep the liquid cooling plate 10 in a relatively low temperature state, so that the vaporized insulating liquid liquefies on the surface of the liquid cooling plate 10 .
- FIG. 10 is a schematic diagram of the connection between a cooling liquid circulation pipeline and an electronic device provided by the present application.
- the cooling liquid circulation pipeline 900 includes a battery cooling plate 970 , the battery cooling plate 970 is used for cooling the battery of the vehicle, and the liquid cooling plate 10 is connected in parallel with the battery cooling plate 970 .
- part of the circulating cooling liquid enters the battery cooling plate 970 and the other part enters the liquid cooling plate 10 of the electronic device 100 to cool the battery cooling plate 970 and the electronic device 100 respectively.
- the liquid cooling plate 10 is connected in series with the battery cooling plate 970 . After the electronic device 100 is connected to the battery cooling plate 970 in series, the circulating cooling liquid flows through the liquid cooling plate 10 and the battery cooling plate 970 of the electronic device 100 successively to cool the electronic device 100 and the battery cooling plate 970 successively.
- the cooling liquid circulation pipeline 900 includes a condenser 910, an electric compressor 920, an evaporator 930, a first expansion valve 940, a battery cooler 950, an electric water pump 960, a battery cooling plate 970, and an electronic water valve 980 and a second expansion valve 990.
- the inlet of the condenser 910 is connected with the outlet of the electric compressor 920, the outlet of the condenser 910 is connected with the inlet of the first expansion valve 940, the outlet of the first expansion valve 940 is connected with the inlet of the evaporator 930, and the outlet of the evaporator 930 is connected with the inlet of the first expansion valve 940.
- the inlet of the electric compressor 920 is connected.
- the outlet of the condenser 910 is also connected to the refrigerant inlet of the battery cooler 950 , and the refrigerant outlet of the battery cooler 950 is connected to the inlet of the electric compressor 920 .
- the electric compressor 920 provides power for the circulation of the refrigerant, exemplarily, the refrigerant is an aqueous glycol solution, Freon.
- the refrigerant flows out of the condenser 910 , it is liquid, and a part of the refrigerant flowing out of the condenser 910 enters the evaporator 930 .
- the liquid refrigerant flows through the evaporator 930 and becomes gaseous, and the gaseous refrigerant passes through the electric compressor 920 .
- the first expansion valve 940 is used to adjust the flow rate of the refrigerant flowing through the evaporator 930. If the first expansion valve 940 is completely closed, that is, the flow rate of the refrigerant flowing through the evaporator 930 is 0, the evaporator 930 does not work.
- the refrigerant circulates between the condenser 910 and the evaporator 930, transferring heat from the evaporator 930 to the condenser 910, reducing the temperature of the evaporator 930.
- the cool air near the evaporator 930 is blown into the cab of the vehicle through a fan, thereby cooling the cab of the vehicle.
- the refrigerant circulates between the condenser 910 and the battery cooler 950, transferring heat from the battery cooler 950 to the condenser 910, reducing the temperature of the battery cooler 950.
- the cooling water inlet of the battery cooler 950 is connected to the outlet of the electric water pump 960, the cooling water outlet of the battery cooler 950 is connected to the inlet of the second expansion valve 990, and the outlet of the second expansion valve 990 is connected to the inlet of the electronic water valve 980,
- the outlet of the electronic water valve 980 is connected to the water inlet of the battery cooling plate 970 , and the water outlet of the battery cooling plate 970 is connected to the water inlet of the electric water pump 960 .
- Electric water pump 960 powers the circulation of cooling water. Under the action of the electric water pump 960 , the cooling water circulates between the battery cooler 950 and the battery cooling plate 970 , transferring the heat of the battery cooling plate 970 to the battery cooler 950 . Under the action, it is transferred to the condenser 910 .
- the second expansion valve 990 and the electronic water valve 980 can adjust the flow rate of cooling water.
- the second expansion valve 990 is an electronic expansion valve, a thermal expansion valve or a solenoid valve, which can actively adjust the flow of cooling water according to the pressure and temperature in the pipeline.
- the electronic device 100 is connected in parallel with the battery cooling plate 970 , that is, the liquid inlet 10 a of the liquid cooling plate 10 of the electronic device 100 is connected to the water inlet of the battery cooling plate 970 , and the liquid cooling plate 10 of the electronic device 100 is connected
- the liquid outlet 10b is connected to the water outlet of the battery cooling plate 970 .
- Part of the cooling water flowing through the electronic water valve 980 flows through the battery cooling plate 970 , and the other part flows through the liquid cooling plate 10 of the electronic device 100 .
- the electronic device 100 is connected to the battery cooling plate 970 in series, for example, the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100 is connected to the outlet of the electronic water valve 980, and the liquid cooling plate of the electronic device 100 is connected
- the liquid outlet 10b of 10 is connected to the water inlet of the battery cooling plate 970, and the water outlet of the battery cooling plate 970 is connected to the inlet of the electric water pump 960; or, the water inlet of the battery cooling plate 970 is connected to the outlet of the electronic water valve 980.
- the water inlet of the battery cooling plate 970 is connected to the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100
- the liquid outlet 10b of the liquid cooling plate 10 of the electronic device 100 is connected to the inlet of the electric water pump 960 .
- the electronic device 100 When the electronic device 100 is connected in parallel with the battery cooling plate 970 , part of the cooling water flowing from the electronic water valve 980 flows through the battery cooling plate 970 , and the other part flows through the liquid cooling plate 10 of the electronic device 100 .
- the heat dissipation effect of the battery cooling plate 970 is related to the flow rate of the cooling water. The greater the flow rate of the cooling water, the better the heat dissipation effect.
- the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980.
- the cooling water flowing out from the electronic water valve 980 will flow through the liquid cooling plate 10 and the battery cooling plate 970 of the electronic device 100 successively. If the cooling water first flows through the liquid cooling plate 10 of the electronic device 100 and then flows through the battery cooling plate 970 , the temperature of the cooling water will increase after flowing through the liquid cooling plate 10 of the electronic device 100 . Under the condition that the flow rate of the cooling water is constant, the lower the temperature of the cooling water flowing through the battery cooling plate 970 is, the better the heat dissipation effect of the battery cooling plate 970 is.
- the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980 to increase the flow of cooling water to compensate for the
- the cooling water first flows through the liquid cooling plate 10 of the electronic device 100 and the adverse effect is caused by the temperature rise. If the cooling water first flows through the battery cooling plate 970 and then flows through the liquid cooling plate 10 of the electronic device 100 , the heat dissipation effect of the battery cooling plate 970 will not be affected when the flow rate of the cooling water remains unchanged.
- the temperature of the cooling water will increase after flowing through the battery cooling plate 970 , if the increased temperature of the cooling water is sufficient to dissipate heat from the liquid cooling plate 10 of the electronic device 100 , the original cooling water flow rate will be maintained, that is, cooling The flow of water remains at the level before the electronic device 100 was plugged in. If the cooling water flow of crude oil is used for heat dissipation, it is not enough to maintain the temperature of the electronic device 100 within the allowable temperature range, then the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980, so that the electronic The temperature of the device 100 can be maintained within the allowable temperature range.
- An embodiment of the present application further provides a vehicle, which includes the vehicle-mounted cooling system shown in FIG. 9 or FIG. 10 .
- the vehicle includes at least an automobile and an electric vehicle.
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Abstract
Disclosed in the embodiments of the present application are an electronic apparatus, a vehicle-mounted heat dissipation system and a vehicle, belonging to the technical field of heat dissipation. The electronic apparatus comprises a liquid cooling plate, a bottom housing, a circuit board and a connector, wherein the liquid cooling plate is connected to the bottom housing, a sealed accommodating cavity is defined between the liquid cooling plate and the bottom housing, an insulating liquid is accommodated in the accommodating cavity, the circuit board is located in the accommodating cavity and immersed in the insulating liquid, the circuit board is connected to the bottom housing, the connector and the bottom housing are integrally formed in an injection-molded manner, one end of the connector is located in the accommodating cavity and connected to the circuit board, and the other end of the connector is located outside the accommodating cavity. Since the connector and the bottom housing are integrally formed in an injection-molded manner, the connector and the bottom housing have a good sealing performance, such that the insulating liquid can be prevented from leaking from a joint of the connector and the bottom housing, thereby ensuring that the electronic apparatus can work stably.
Description
本申请要求于2020年11月5日提交的申请号为202011225267.2、发明名称为“电子设备、车载散热系统及车辆”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with the application number 202011225267.2, filed on November 5, 2020, and the invention title is "Electronic Equipment, Vehicle-mounted Cooling System and Vehicle", the entire contents of which are incorporated into this application by reference.
本申请涉及散热技术领域,特别涉及一种电子设备、车载散热系统及车辆。The present application relates to the field of heat dissipation technology, and in particular, to an electronic device, a vehicle-mounted heat dissipation system and a vehicle.
电子设备在工作过程中通常都会发热,为了确保电子设备的正常工作,通常要对电子设备进行散热,降低其温度。Electronic devices usually generate heat during the working process. In order to ensure the normal operation of the electronic devices, it is usually necessary to dissipate heat to reduce the temperature of the electronic devices.
以车辆为例,移动数据中心(mobile data center,MDC),也叫行车电脑,是车辆上重要的电子设备。行车电脑在工作过程中会产生大量的热量,导致行车电脑温度升高,影响其性能和稳定性。Taking a vehicle as an example, a mobile data center (MDC), also called a trip computer, is an important electronic device on a vehicle. The on-board computer will generate a lot of heat during the working process, which will cause the temperature of the on-board computer to rise and affect its performance and stability.
发明内容SUMMARY OF THE INVENTION
本申请实施例提供了一种电子设备、车载散热系统及车辆,能够克服相关技术中的问题,所述技术方案如下:The embodiments of the present application provide an electronic device, a vehicle-mounted cooling system and a vehicle, which can overcome the problems in the related art, and the technical solutions are as follows:
第一方面,提供了一种电子设备。本申请实施例中以车辆的行车电脑为例。该电子设备包括外壳、电路板和连接器。所述电路板位于所述外壳内的容置腔中,所述连接器与所述电路板相连,所述连接器的一端位于所述外壳内,另一端相对所述外壳伸出,所述外壳内盛放有绝缘液体,所述电路板浸没在所述绝缘液体内。In a first aspect, an electronic device is provided. In the embodiments of the present application, a trip computer of a vehicle is used as an example. The electronic device includes a housing, a circuit board, and a connector. The circuit board is located in the accommodating cavity in the casing, the connector is connected with the circuit board, one end of the connector is located in the casing, and the other end protrudes from the casing, the casing An insulating liquid is contained in the interior, and the circuit board is immersed in the insulating liquid.
在本申请实施例中,所述外壳包括液冷板和底壳,所述液冷板与所述底壳相连,所述液冷板与所述底壳之间形成封闭的所述容置腔。In the embodiment of the present application, the housing includes a liquid cooling plate and a bottom case, the liquid cooling plate is connected to the bottom case, and the closed accommodating cavity is formed between the liquid cooling plate and the bottom case .
基于上述结构,该电子设备在使用时,液冷板连接冷却液循环管路,使液冷板保持相对较低的温度状态。电路板产生的热量使绝缘液体气化,气化后的绝缘液体上升到液冷板处,由于液冷板的温度相对较低,气化后的绝缘液体在液冷板表面液化,并滴落回容置腔的底部,如此循环,从而将电路板产生的热转移到液冷板,通过液冷板散发出去,达到散热的目的,降低电子设备的温度。Based on the above structure, when the electronic device is in use, the liquid cooling plate is connected to the cooling liquid circulation pipeline, so that the liquid cooling plate can maintain a relatively low temperature state. The heat generated by the circuit board vaporizes the insulating liquid, and the vaporized insulating liquid rises to the liquid cooling plate. Because the temperature of the liquid cooling plate is relatively low, the vaporized insulating liquid liquefies on the surface of the liquid cooling plate and drips. Back to the bottom of the accommodating cavity, and circulating in this way, the heat generated by the circuit board is transferred to the liquid cooling plate, and is emitted through the liquid cooling plate to achieve the purpose of heat dissipation and reduce the temperature of the electronic equipment.
在本申请实施例中,所述连接器与所述底壳一体注塑成型。由于连接器与底壳一体注塑成型,连接器与底壳在连接处没有缝隙,因此绝缘液体不会在连接器与底壳的连接处发生泄漏,从而避免了由绝缘液体泄漏所引发的不良后果,使电子设备能够高效率且稳定地工作。In the embodiment of the present application, the connector and the bottom case are integrally injection-molded. Since the connector and the bottom shell are integrally injection-molded, there is no gap between the connector and the bottom shell, so the insulating liquid will not leak at the connection between the connector and the bottom shell, thus avoiding the adverse consequences caused by the leakage of the insulating liquid , so that electronic equipment can work efficiently and stably.
在一些示例中,该电子设备包括类型不同的多种连接器,每种连接器有一个、两个或多个。In some examples, the electronic device includes multiple connectors of different types, one, two, or more of each connector.
基于上述结构,该电子设备在与其他设备进行连接时,根据所要连接的设备的不同,选择相应的连接器进行连接。Based on the above structure, when the electronic device is connected with other devices, according to the different devices to be connected, a corresponding connector is selected for connection.
在本申请实施例中,所述注塑成型包括一次注塑成型、二次注塑成型、多次注塑成型和 双色成型中的至少一种。具体根据连接器和底壳的形状、结构的复杂程度,选择采用一次注塑成型、二次注塑成型、多次注塑成型或双色成型。In the embodiments of the present application, the injection molding includes at least one of primary injection molding, secondary injection molding, multiple injection molding, and two-color molding. Specifically, according to the shape and complexity of the structure of the connector and the bottom shell, one-shot injection molding, secondary injection molding, multiple injection molding or two-color molding are selected.
可选地,所述液冷板与所述底壳焊接或者通过螺钉连接。Optionally, the liquid cooling plate and the bottom case are welded or connected by screws.
在一些示例中,所述液冷板与所述底壳通过焊接的方式相连。例如通过激光焊接的方式。通过焊接的方式连接液冷板与底壳,能够消除液冷板与底壳之间的缝隙,从而避免液冷板与底壳的连接处发生泄漏。In some examples, the liquid cooling plate is connected to the bottom case by welding. For example by means of laser welding. By connecting the liquid cooling plate and the bottom case by welding, the gap between the liquid cooling plate and the bottom case can be eliminated, thereby avoiding leakage at the connection between the liquid cooling plate and the bottom case.
在另一些示例中,所述液冷板与所述底壳通过螺钉连接的方式相连。通过螺钉连接液冷板与底壳,在需要对壳体内部的电路板等结构进行维修时,直接拆卸螺钉,将液冷板与底壳分离,在完成维修后,再重新拧紧螺钉,将液冷板与底壳连接在一起。In other examples, the liquid cooling plate is connected to the bottom case by means of screw connection. The liquid-cooling plate and the bottom case are connected by screws. When the circuit board and other structures inside the shell need to be repaired, the screws are directly removed to separate the liquid-cooling plate and the bottom case. The cold plate is connected with the bottom case.
在本申请实施例中,采用螺钉连接所述液冷板与所述底壳时,所述液冷板与所述底壳之间设置有密封圈。通过拧紧螺钉,使所述液冷板与所述底壳夹紧所述密封圈,提高所述液冷板与所述底壳之间的密封性,避免所述液冷板与所述底壳的连接处发生泄漏。In the embodiment of the present application, when the liquid cooling plate and the bottom case are connected by screws, a sealing ring is provided between the liquid cooling plate and the bottom case. By tightening the screws, the liquid-cooling plate and the bottom case are clamped to the sealing ring, so as to improve the sealing between the liquid-cooling plate and the bottom case, and avoid the liquid-cooling plate and the bottom case. leaks at the connection.
在本申请实施例中,所述密封圈与所述液冷板和所述底壳中的任意一个一体注塑成型。In the embodiment of the present application, the sealing ring is integrally injection-molded with any one of the liquid cooling plate and the bottom case.
例如,密封圈与液冷板一体注塑成型,使密封圈与液冷板形成一个整体。或者密封圈与底壳一体注塑成型,使密封圈与底壳形成一个整体。注塑成型的方式包括一次注塑成型、二次注塑成型、多次注塑成型和双色成型中的至少一种。For example, the sealing ring and the liquid cooling plate are integrally injection-molded, so that the sealing ring and the liquid cooling plate are formed as a whole. Or the sealing ring and the bottom case are integrally injection-molded, so that the sealing ring and the bottom case form a whole. The injection molding method includes at least one of primary injection molding, secondary injection molding, multiple injection molding and two-color molding.
基于上述结构,密封圈与液冷板和底壳中的一个一体注塑成型,使密封圈连接的更加紧密,能够进一步提高液冷板与底壳之间的密封性。Based on the above structure, the sealing ring is integrally injection-molded with one of the liquid cooling plate and the bottom case, so that the sealing ring is connected more tightly, and the sealing performance between the liquid cooling plate and the bottom case can be further improved.
在本申请实施例中,所述底壳包括侧板和底板。所述侧板位于所述底板的一侧,且所述侧板与所述底板相连,所述液冷板与所述侧板相连。通过所述侧板、所述底板和所述液冷板围成封闭的所述容置腔,所述底板作为安装所述电路板的基础,所述连接器位于所述侧板上。In the embodiment of the present application, the bottom case includes a side plate and a bottom plate. The side plate is located on one side of the bottom plate, the side plate is connected to the bottom plate, and the liquid cooling plate is connected to the side plate. The enclosed accommodating cavity is formed by the side plate, the bottom plate and the liquid cooling plate, the bottom plate serves as a basis for installing the circuit board, and the connector is located on the side plate.
在本申请实施例中,前述的密封圈位于所述液冷板与所述侧板之间。所述侧板上具有用于容纳所述密封圈的凹槽。液冷板与底壳相连时,密封圈压紧凹槽的内壁,形成密封,增大了密封圈与侧板的接触面积,提高了密封性。In the embodiment of the present application, the aforementioned sealing ring is located between the liquid cooling plate and the side plate. The side plate has a groove for accommodating the sealing ring. When the liquid cooling plate is connected with the bottom shell, the sealing ring presses the inner wall of the groove to form a seal, which increases the contact area between the sealing ring and the side plate and improves the sealing performance.
作为一种示例,所述底板的一面具有多个支撑凸起,所述多个支撑凸起位于所述容置腔内,所述电路板固定在所述多个支撑凸起上。As an example, one side of the bottom plate has a plurality of support protrusions, the plurality of support protrusions are located in the accommodating cavity, and the circuit board is fixed on the plurality of support protrusions.
本申请实施例所示的方案,通过设置多个支撑凸起,由支撑凸起支撑电路板,使电路板与底板之间保持一定的间距,使电路板的下表面与绝缘液体能够充分接触。In the solution shown in the embodiment of the present application, a plurality of support protrusions are provided, and the circuit board is supported by the support protrusions, so that a certain distance is maintained between the circuit board and the bottom plate, so that the lower surface of the circuit board can be fully contacted with the insulating liquid.
可选地,所述电路板与所述连接器之间通过导线相连。所述导线指用于进行数据传输的线束。Optionally, the circuit board and the connector are connected by wires. The wires refer to wire harnesses for data transmission.
基于上述结构,在连接器与底壳一体注塑成型之后,先将电路板固定在底壳上,然后将导线的一端与电路板相连,将导线的另一端与连接器位于容置腔内的一端相连,操作方便。Based on the above structure, after the connector and the bottom case are integrally injection-molded, the circuit board is first fixed on the bottom case, then one end of the wire is connected to the circuit board, and the other end of the wire is connected to the end of the connector located in the accommodating cavity Connected, easy to operate.
在本申请实施例中,所述液冷板的内部和所述液冷板靠近所述电路板的表面均具有翅片。In the embodiment of the present application, both the interior of the liquid cooling plate and the surface of the liquid cooling plate close to the circuit board are provided with fins.
作为一种示例,所述液冷板为空心结构,所述电子设备在使用时,所述液冷板内部的空腔不断注入和排出冷却液,利用冷却液降低液冷板的温度,使液冷板持续保持相对较低的温度,气化后的绝缘液体在液冷板的表面液化。液冷板内部的翅片能够增大冷却液与液冷板的接触面积,加快液冷板与冷却液之间的热交换,有利于提高电子设备的散热能力。液冷板靠近电路板的翅片位于容置腔内,设置翅片后增大了气化后的绝缘液体与液冷板可接触的面积,有利于气化后的绝缘液体的液化。As an example, the liquid-cooling plate is a hollow structure. When the electronic device is in use, the cavity inside the liquid-cooling plate is continuously injected and discharged with cooling liquid, and the cooling liquid is used to reduce the temperature of the liquid-cooling plate, so that the liquid The cold plate continues to maintain a relatively low temperature, and the vaporized insulating liquid liquefies on the surface of the liquid cold plate. The fins inside the liquid-cooling plate can increase the contact area between the cooling liquid and the liquid-cooling plate, accelerate the heat exchange between the liquid-cooling plate and the cooling liquid, and help improve the heat dissipation capacity of the electronic equipment. The fins of the liquid cooling plate close to the circuit board are located in the accommodating cavity, and the fins are arranged to increase the contact area between the vaporized insulating liquid and the liquid cooling plate, which is beneficial to the liquefaction of the vaporized insulating liquid.
第二方面,还提供了一种车载散热系统。该车载散热系统包括冷却液循环管路和前一方面所述的任一种电子设备。冷却液循环管路用于对车辆的各部位进行散热,例如对车辆的驾驶室进行散热,对车载的电池进行散热。In a second aspect, an in-vehicle cooling system is also provided. The vehicle-mounted heat dissipation system includes a cooling liquid circulation pipeline and any of the electronic devices described in the previous aspect. The coolant circulation pipeline is used to dissipate heat from various parts of the vehicle, such as dissipating heat from the cab of the vehicle and dissipating heat from the vehicle's battery.
在本申请实施例中,所述电子设备的液冷板与所述冷却液循环管路连通。In the embodiment of the present application, the liquid cooling plate of the electronic device communicates with the cooling liquid circulation pipeline.
基于上述结构,冷却液循环管路对电子设备的液冷板进行散热,降低液冷板的温度,使液冷板保持相对低温的状态。这样电子设备中的绝缘液体在气化后能够在液冷板的表面液化。Based on the above structure, the cooling liquid circulation pipeline radiates heat to the liquid cooling plate of the electronic device, reduces the temperature of the liquid cooling plate, and keeps the liquid cooling plate in a relatively low temperature state. In this way, the insulating liquid in the electronic equipment can be liquefied on the surface of the liquid cooling plate after being vaporized.
第三方面,还提供了一种车辆。该车辆包括如第二方面所述的车载散热系统。In a third aspect, a vehicle is also provided. The vehicle includes the vehicle-mounted cooling system as described in the second aspect.
基于上述结构,该车辆的车载散热系统中的电子设备能够得到良好的散热,确保电子设备的性能和稳定性。Based on the above structure, the electronic equipment in the vehicle-mounted heat dissipation system of the vehicle can be well dissipated to ensure the performance and stability of the electronic equipment.
图1是本申请实施例提供的一种车辆的结构示意图;1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application;
图2是本申请实施例提供的一种电子设备的外部结构示意图;2 is a schematic diagram of an external structure of an electronic device provided by an embodiment of the present application;
图3是本申请实施例提供的一种电子设备的分解结构示意图;3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application;
图4是图2中的Ⅰ-Ⅰ截面图;Fig. 4 is the I-I sectional view in Fig. 2;
图5是本申请实施例提供的一种电子设备的底壳的结构示意图;5 is a schematic structural diagram of a bottom case of an electronic device provided by an embodiment of the present application;
图6是本申请实施例提供的一种电子设备的内部结构示意图;6 is a schematic diagram of an internal structure of an electronic device provided by an embodiment of the present application;
图7是本申请实施例提供的一种液冷板的内部结构示意图;7 is a schematic diagram of the internal structure of a liquid cooling plate provided by an embodiment of the present application;
图8是本申请实施例提供的一种液冷板的结构示意图;8 is a schematic structural diagram of a liquid cooling plate provided by an embodiment of the present application;
图9是本申请提供的一种车载散热系统的结构框图;9 is a structural block diagram of a vehicle-mounted cooling system provided by the present application;
图10是本申请提供的一种冷却液循环管路与电子设备的连接示意图。FIG. 10 is a schematic diagram of the connection between a cooling liquid circulation pipeline and an electronic device provided by the present application.
图例说明illustration
1、毫米波雷达 10、液冷板 10a、进液口 10b、出液口1. Millimeter wave radar 10, liquid cooling plate 10a, liquid inlet 10b, liquid outlet
100、电子设备 101、翅片100. Electronic equipment 101. Fins
2、激光雷达 20、底壳 201、侧板 202、底板2. Lidar 20, bottom case 201, side plate 202, bottom plate
201a、注液口 201b、凹槽 2021、支撑凸起 2021a、螺纹孔201a, liquid injection port 201b, groove 2021, support protrusion 2021a, threaded hole
3、整车控制器 30、电路板3. Vehicle controller 30. Circuit board
4、远程信息处理器 40、连接器4. Telematics 40. Connector
5、摄像头 50、绝缘液体5. Camera 50. Insulating liquid
6、行车电脑 60、密封圈6. Trip computer 60. Sealing ring
7、云数据中心 70、密封塞7. Cloud data center 70. Sealing plug
80、导线80, wire
91、第一螺钉 92、第二螺钉 900、冷却液循环管路 910、冷凝器91, the first screw 92, the second screw 900, the coolant circulation line 910, the condenser
920、电动压缩机 930、蒸发器 940、第一膨胀阀 950、电池冷却器920, electric compressor 930, evaporator 940, first expansion valve 950, battery cooler
960、电动水泵 970、电池冷却板 980、电子水阀 990、第二膨胀阀960, electric water pump 970, battery cooling plate 980, electronic water valve 990, second expansion valve
A、容置腔A. accommodating cavity
本申请实施例提供了一种电子设备、车载散热系统及车辆,本申请实施例以该电子设备为车辆的行车电脑为例,车辆至少包括汽车和电动车。The embodiments of the present application provide an electronic device, a vehicle-mounted cooling system, and a vehicle. The embodiments of the present application take the electronic device as an on-board computer of a vehicle as an example, and the vehicle includes at least an automobile and an electric vehicle.
随着自动驾驶技术的发展,车载的电子设备越来越多,这些电子设备通常都与行车电脑相连。例如,图1是本申请实施例提供的一种车辆的结构示意图。如图1所示,在车辆的车头部位设置有毫米波雷达1和激光雷达2,在车辆的中控台位置还设置有整车控制器(vehicle control unit,VCU)3,驾驶室中还设置有远程信息处理器4(telematics box,T-BOX),远程信息处理器用于与云数据中心7建立联系。车辆上通常还设置有摄像头,例如在驾驶室中通常就设置有摄像头5。这些毫米波雷达1、激光雷达2、整车控制器3、远程信息处理器4和摄像头5分别与行车电脑6相连。行车电脑需要处理的数据量越来越大,对于行车电脑的算力需求也就不断提升,从以前的10Tflops逐渐提升到300Tflops,甚至更高,行车电脑内部的电路板上的电子元器件自然也就越来越多,达到了200pcs以上。通常更多的电子元器件意味着更高的功耗,行车电脑的功耗也从20w左右逐渐提升至了300w左右,导致发热量大增,行车电脑整体的温度上升。With the development of autonomous driving technology, there are more and more electronic devices in the vehicle, and these electronic devices are usually connected to the on-board computer. For example, FIG. 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application. As shown in Figure 1, a millimeter-wave radar 1 and a lidar 2 are arranged at the front of the vehicle, a vehicle control unit (VCU) 3 is also arranged at the center console of the vehicle, and a cab is also arranged There is a telematics box 4 (telematics box, T-BOX), and the telematics processor is used to establish contact with the cloud data center 7 . A camera is also usually provided on the vehicle, for example, a camera 5 is usually provided in the driver's cab. The millimeter wave radar 1 , the laser radar 2 , the vehicle controller 3 , the telematics processor 4 and the camera 5 are respectively connected to the trip computer 6 . The amount of data that the trip computer needs to process is getting larger and larger, and the computing power demand for the trip computer is also increasing. It has gradually increased from the previous 10Tflops to 300Tflops, or even higher, and the electronic components on the circuit board inside the trip computer are naturally also More and more, reaching more than 200pcs. Usually, more electronic components mean higher power consumption, and the power consumption of the on-board computer has gradually increased from about 20w to about 300w, resulting in a large increase in heat generation and an increase in the overall temperature of the on-board computer.
高温会影响行车电脑的性能和稳定性,为了使行车电脑在发热量大增的情况下能够高效率且稳定地工作,就需要提高行车电脑的散热能力。行车电脑6包括外壳、电路板和连接器40,电路板位于外壳内部,连接器40安装在电路板上,且连接器40相对外壳伸出。行车电脑6通常包括多个连接器40,毫米波雷达1、激光雷达2、整车控制器3、远程信息处理器4和摄像头5等设备通过信号线与多个连接器40相连。High temperature will affect the performance and stability of the on-board computer. In order to make the on-board computer work efficiently and stably in the case of a large increase in heat generation, it is necessary to improve the heat dissipation capacity of the on-board computer. The trip computer 6 includes a casing, a circuit board, and a connector 40, the circuit board is located inside the casing, the connector 40 is mounted on the circuit board, and the connector 40 protrudes from the casing. The trip computer 6 usually includes a plurality of connectors 40 , and devices such as the millimeter wave radar 1 , the lidar 2 , the vehicle controller 3 , the telematics processor 4 , and the camera 5 are connected to the plurality of connectors 40 through signal lines.
在外壳中盛放有绝缘液体,电路板浸没在绝缘液体中。行车电脑6工作过程中,电路板上的电子元器件发热,绝缘液体吸收热量而气化,气化后的绝缘液体上升到外壳的顶部,在外壳的顶部温度较低,气化后的绝缘液体会液化并将热量放出,液化后的绝缘液体滴落回外壳的底部。如此循环,将电路板产生的热量转移到外壳的顶部散发。由于绝缘液体气化会吸收大量的热,因此这种利用材料发生相变的方式具有很强的散热能力。An insulating liquid is contained in the casing, and the circuit board is immersed in the insulating liquid. During the working process of the trip computer 6, the electronic components on the circuit board heat up, the insulating liquid absorbs heat and vaporizes, and the vaporized insulating liquid rises to the top of the shell, where the temperature is lower at the top of the shell, and the vaporized insulating liquid It liquefies and releases heat, and the liquefied insulating liquid drips back to the bottom of the enclosure. This cycle transfers the heat generated by the circuit board to the top of the case for dissipation. Since the vaporization of the insulating liquid will absorb a lot of heat, this method of utilizing the phase change of the material has a strong heat dissipation capacity.
但是外壳内的绝缘液体容易通过连接器40与外壳连接处的缝隙泄漏,而且绝缘液体从液态转变为气态,体积大大增加了,这会导致外壳内部的压强升高,而且发热量越大,压强升高的也越多,使得绝缘液体更容易泄漏。绝缘液体的泄漏会降低行车电脑的散热能力,而且一旦绝缘液体泄漏到不足以浸没电路板,就会导致电路板上的热几乎无法散发,温度快速升高,极可能烧毁。However, the insulating liquid in the casing is easy to leak through the gap between the connector 40 and the casing, and the insulating liquid changes from a liquid state to a gaseous state, and the volume is greatly increased, which will lead to an increase in the pressure inside the casing, and the greater the heat generation, the higher the pressure. The more it rises, the easier it is for the insulating liquid to leak. The leakage of insulating liquid will reduce the heat dissipation capacity of the on-board computer, and once the insulating liquid leaks enough to submerge the circuit board, the heat on the circuit board will hardly be dissipated, the temperature will rise rapidly, and it is very likely to burn out.
图2是本申请实施例提供的一种电子设备的外部结构示意图。图3是本申请实施例提供的一种电子设备的分解结构示意图。如图2和图3所示,该电子设备包括外壳、电路板30和连接器40。其中,外壳包括液冷板10和底壳20。FIG. 2 is a schematic diagram of an external structure of an electronic device provided by an embodiment of the present application. FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application. As shown in FIGS. 2 and 3 , the electronic device includes a housing, a circuit board 30 and a connector 40 . Wherein, the outer casing includes a liquid cooling plate 10 and a bottom casing 20 .
图4是图2中的Ⅰ-Ⅰ截面图。如图4所示,液冷板10与底壳20相连,液冷板10与底壳20之间形成有封闭的容置腔A,容置腔A中盛放有绝缘液体50。Fig. 4 is a sectional view taken along line I-I in Fig. 2 . As shown in FIG. 4 , the liquid cooling plate 10 is connected to the bottom case 20 , a closed accommodating cavity A is formed between the liquid cooling plate 10 and the bottom shell 20 , and the accommodating cavity A holds the insulating liquid 50 .
电路板30位于容置腔A中,且电路板30与底壳20相连,电路板30浸没在绝缘液体50内。The circuit board 30 is located in the accommodating cavity A, and the circuit board 30 is connected to the bottom case 20 , and the circuit board 30 is immersed in the insulating liquid 50 .
连接器40与底壳20一体注塑成型,连接器40的一端位于容置腔A内且与电路板30相连,连接器40的另一端位于容置腔A外。The connector 40 is integrally injection-molded with the bottom case 20 , one end of the connector 40 is located in the accommodating cavity A and connected to the circuit board 30 , and the other end of the connector 40 is located outside the accommodating cavity A.
图4中,容置腔A内的空心箭头示意气化后的绝缘气体50的上升方向,容置腔A内的 实心箭头示意液化后的绝缘液体50的滴落方向,其中黑色圆点示意绝缘液体50液化后形成的液滴。液冷板10内的实心箭头示意用于冷却液冷板10的冷却水的流动方向。In FIG. 4 , the hollow arrow in the accommodating cavity A indicates the rising direction of the gasified insulating gas 50 , the solid arrow in the accommodating cavity A indicates the dripping direction of the liquefied insulating liquid 50 , and the black dots indicate the insulating gas 50 . Droplets formed after the liquid 50 liquefies. The solid arrows inside the liquid cold plate 10 indicate the flow direction of the cooling water for cooling the liquid cold plate 10 .
行车电脑工作过程中,位于容置腔A底部的绝缘液体50气化后上升到容置腔A的顶部,液冷板10温度相对较低,使得气化后的绝缘液体50在液冷板10表面液化并滴落到容置腔A的底部,如此循环从而将电路板30产生的热转移到液冷板10,并散发出去,达到散热的目的。由于连接器40与底壳20一体注塑成型,连接器40与底壳20在连接处没有缝隙,因此绝缘液体50不会在连接器40与底壳20的连接处发生泄漏,从而避免了由绝缘液体50泄漏所引发的不良后果,使行车电脑能够高效率且稳定地工作。During the operation of the on-board computer, the insulating liquid 50 located at the bottom of the accommodating cavity A vaporizes and rises to the top of the accommodating cavity A, and the temperature of the liquid cooling plate 10 is relatively low, so that the vaporized insulating liquid 50 is in the liquid cooling plate 10. The surface liquefies and drops to the bottom of the accommodating cavity A, and circulates in this way to transfer the heat generated by the circuit board 30 to the liquid cooling plate 10 and dissipate it to achieve the purpose of heat dissipation. Since the connector 40 and the bottom case 20 are integrally injection-molded, there is no gap at the connection between the connector 40 and the bottom case 20, so the insulating liquid 50 will not leak at the connection between the connector 40 and the bottom case 20, thereby avoiding the leakage of the insulating liquid 50. The adverse consequences caused by the leakage of the liquid 50 enable the on-board computer to work efficiently and stably.
可选地,绝缘液体50为氟化液或硅油。氟化液和硅油均具有良好的绝缘性。Optionally, the insulating liquid 50 is fluorinated liquid or silicone oil. Both fluorinated liquid and silicone oil have good insulating properties.
在本申请实施例中,一体注塑成型指通过注塑成型的方式形成一个整体。连接器40与底壳20通过注塑成型的方式形成一个整体,从而消除连接器40与底壳20之间的缝隙,避免绝缘液体50的泄漏。In the embodiments of the present application, integral injection molding refers to forming a whole by means of injection molding. The connector 40 and the bottom case 20 are integrally formed by injection molding, so as to eliminate the gap between the connector 40 and the bottom case 20 and avoid the leakage of the insulating liquid 50 .
在本申请实施例中,注塑成型包括一次注塑成型、二次注塑成型、多次注塑成型和双色成型。In the embodiments of the present application, injection molding includes primary injection molding, secondary injection molding, multiple injection molding, and two-color molding.
一次注塑成型是最为简单的注塑成型方式,制作时,模具合模后,经过射胶、保压、冷却、开模、制品取出的工艺流程,得到构成一个整体的连接器40和底壳20。One-shot injection molding is the simplest injection molding method. During production, after the mold is closed, the connector 40 and the bottom shell 20 are obtained as a whole through the process of plastic injection, pressure holding, cooling, mold opening, and product extraction.
二次注塑成型是一种特殊的注塑成型方式,在一套模具中通过一次注塑成型的方式制得半成品后,将半成品放置到另一套模具中,再经历一次合模、射胶、保压、冷却、开模,最后制品取出,得到构成一个整体的连接器40和底壳20。两次射胶所注入的材料相同,或者两次射胶所注入的材料不同。Secondary injection molding is a special injection molding method. After the semi-finished product is made by one-time injection molding in one set of molds, the semi-finished product is placed in another set of molds, and then undergoes one mold clamping, injection, and pressure holding. , cooling, mold opening, and finally the product is taken out to obtain a connector 40 and bottom shell 20 that form a whole. The material injected in the two injections is the same, or the material injected in the two injections is different.
在二次注塑成型中,半成品是以下任意结构中的一种:连接器40、底壳20、连接器40的一部分、底壳20的一部分、完整的连接器40与底壳20的一部分、完整的底壳20与连接器40的一部分、连接器40的一部分与底壳20的一部分。In overmolding, the semi-finished product is any one of the following structures: connector 40, bottom shell 20, part of connector 40, part of bottom shell 20, complete connector 40 and part of bottom shell 20, complete The bottom case 20 and a part of the connector 40 , and a part of the connector 40 and a part of the bottom case 20 .
多次注塑成型是在二次注塑成型的基础上,再经历至少一次合模、射胶、保压、冷却、开模、制品取出,到构成一个整体的连接器40和底壳20。每次射胶所注入的材料相同,或者每次射胶所注入的材料不同。The multiple injection molding is based on the secondary injection molding, and then goes through at least one time of mold clamping, glue injection, pressure holding, cooling, mold opening, and product removal, to form an integral connector 40 and bottom shell 20 . The material injected for each shot is the same, or the material injected for each shot is different.
双色成型是将两种不同的材料注塑到同一套模具中进行的成型工艺。两种材料的颜色不同,或者软硬不同,或者颜色和软硬均不同。双色成型与一次注塑成型的区别在于,双色成型得到的成品,不同部位的材料不同。例如连接器40与底壳20通过一次注塑成型形成,连接器40与底壳20的材料是相同的,连接器40与底壳20通过双色成型形成,连接器40的材料与底壳20的材料不同。Two-color molding is a molding process in which two different materials are injected into the same set of molds. The color of the two materials is different, or the hardness is different, or both the color and the hardness are different. The difference between two-color molding and one-shot injection molding is that the finished product obtained by two-color molding has different materials in different parts. For example, the connector 40 and the bottom case 20 are formed by one injection molding, the material of the connector 40 and the bottom case 20 are the same, the connector 40 and the bottom case 20 are formed by two-color molding, and the material of the connector 40 and the bottom case 20 are formed. different.
在本申请实施例中,根据连接器40和底壳20的形状与结构的复杂程度,选择采用一次注塑成型、二次注塑成型、多次注塑成型或双色成型。In the embodiment of the present application, according to the complexity of the shape and structure of the connector 40 and the bottom shell 20, one-shot injection molding, secondary injection molding, multiple injection molding or two-color molding are selected.
图5是本申请实施例提供的一种电子设备的底壳的结构示意图。如图5所示,底壳20包括侧板201和底板202。底板202与液冷板10相对,侧板201位于底板202靠近液冷板10的一侧,且与底板202和液冷板10相连,连接器40位于侧板201上。FIG. 5 is a schematic structural diagram of a bottom case of an electronic device provided by an embodiment of the present application. As shown in FIG. 5 , the bottom case 20 includes a side plate 201 and a bottom plate 202 . The bottom plate 202 is opposite to the liquid cooling plate 10 , the side plate 201 is located on the side of the bottom plate 202 close to the liquid cooling plate 10 , and is connected to the bottom plate 202 and the liquid cooling plate 10 , and the connector 40 is located on the side plate 201 .
底壳20的底板202作为行车电脑放置的基础,在行车电脑在放置时,以底板202为支撑,平放在车辆的相应位置。将连接器40布置在侧板201上,方便各种信号线与连接器40进行连接。The bottom plate 202 of the bottom case 20 serves as the base for placing the trip computer. When the trip computer is placed, it is supported by the bottom plate 202 and is placed flat on the corresponding position of the vehicle. The connector 40 is arranged on the side plate 201 to facilitate the connection of various signal lines with the connector 40 .
侧板201的数量根据电子设备的形状进行设置。例如在本申请实施例中,底板202呈矩形,底壳20包括4个侧板201。在另一些示例中,底板202呈其他多边形,例如五边形、六边形等,侧板201的数量也相应发生变化。The number of the side plates 201 is set according to the shape of the electronic device. For example, in the embodiment of the present application, the bottom plate 202 is rectangular, and the bottom case 20 includes four side plates 201 . In other examples, the bottom plate 202 is in other polygonal shapes, such as pentagons, hexagons, etc., and the number of side plates 201 also changes accordingly.
若电子设备包括多个连接器40,多个连接器40位于同一块侧板201上,或者分布在多个侧板201上。If the electronic device includes multiple connectors 40 , the multiple connectors 40 are located on the same side board 201 , or distributed on multiple side boards 201 .
在一些示例中,侧板201上分布有一排连接器40。例如图5中,侧板201上仅分布有一排连接器40。In some examples, a row of connectors 40 is distributed on the side panel 201 . For example, in FIG. 5 , only one row of connectors 40 is distributed on the side plate 201 .
在另一些示例中,侧板201上分布有两排或两排以上的连接器40。In other examples, two or more rows of connectors 40 are distributed on the side plate 201 .
如图3或图5所示,侧板201上还具有注液口201a,注液口201a用于向容置腔A中加注绝缘液体50。注液口201a与连接器40位于不同的侧板201上,以方便绝缘液体50的加注。As shown in FIG. 3 or FIG. 5 , the side plate 201 further has a liquid injection port 201 a, and the liquid injection port 201 a is used for filling the accommodating cavity A with the insulating liquid 50 . The liquid injection port 201 a and the connector 40 are located on different side plates 201 to facilitate the filling of the insulating liquid 50 .
底壳20还包括密封塞70,密封塞70可拆卸安装在侧板201上,且位于注液口201a处。在完成绝缘液体50的加注后,将密封塞70安装到侧板201上,通过密封塞70堵住注液口201a,防止绝缘液体50泄漏。The bottom case 20 further includes a sealing plug 70, which is detachably installed on the side plate 201 and is located at the liquid injection port 201a. After the filling of the insulating liquid 50 is completed, the sealing plug 70 is installed on the side plate 201 , and the filling port 201 a is blocked by the sealing plug 70 to prevent the insulating liquid 50 from leaking.
作为一种示例,密封塞70是螺塞,密封塞70与注液口201a螺纹连接。As an example, the sealing plug 70 is a screw plug, and the sealing plug 70 is screwed to the liquid injection port 201a.
图6是本申请实施例提供的一种电子设备的内部结构示意图。图6中省略了液冷板10。结合图5和图6所示,底板202与电路板30相对,底板202靠近液冷板10的一面具有多个支撑凸起2021,多个支撑凸起2021位于底板202和电路板30之间且与电路板30相连。FIG. 6 is a schematic diagram of an internal structure of an electronic device provided by an embodiment of the present application. The liquid cooling plate 10 is omitted in FIG. 6 . As shown in FIG. 5 and FIG. 6 , the bottom plate 202 is opposite to the circuit board 30 , and the side of the bottom plate 202 close to the liquid cooling plate 10 has a plurality of supporting protrusions 2021 , and the plurality of supporting protrusions 2021 are located between the bottom plate 202 and the circuit board 30 and connected to the circuit board 30 .
支撑凸起2021将电路板30支离底板202,使电路板30和底板202相互间隔,电路板30的下表面能够与绝缘液体50充分接触,将产生的热量传递给绝缘液体50。The support protrusions 2021 support the circuit board 30 from the bottom plate 202 , so that the circuit board 30 and the bottom plate 202 are spaced apart from each other.
支撑凸起2021设置的数量根据电路板30的面积大小进行设置,电路板30的面积越大,支撑凸起2021设置的数量越多,以牢固、稳定地将电路板30固定在底壳20中。作为示例,本申请实施例中,底板202上设置有6个支撑凸起2021。The number of the supporting protrusions 2021 is set according to the area of the circuit board 30 . The larger the area of the circuit board 30 is, the more the supporting protrusions 2021 are provided, so as to firmly and stably fix the circuit board 30 in the bottom case 20 . As an example, in the embodiment of the present application, six support protrusions 2021 are provided on the bottom plate 202 .
如图5所示,支撑凸起2021的顶面具有螺纹孔2021a,电路板30通过第二螺钉92固定连接在支撑凸起2021的顶面上。As shown in FIG. 5 , the top surface of the support protrusion 2021 has threaded holes 2021 a , and the circuit board 30 is fixedly connected to the top surface of the support protrusion 2021 through the second screw 92 .
可选地,电路板30所在平面与底板202所在平面所成的夹角为锐角。即电路板30与底板202并不平行,而是呈现一定的夹角,有利于在电路板30正下方,绝缘液体50气化形成的气泡上升到液面外,避免气泡在电路板30下方聚集而影响电路板30下表面的散热。Optionally, the included angle formed by the plane where the circuit board 30 is located and the plane where the bottom plate 202 is located is an acute angle. That is, the circuit board 30 is not parallel to the bottom plate 202 , but presents a certain angle, which is beneficial for the bubbles formed by the vaporization of the insulating liquid 50 to rise to the outside of the liquid surface directly below the circuit board 30 , so as to prevent the bubbles from accumulating under the circuit board 30 . This affects the heat dissipation of the lower surface of the circuit board 30 .
如图6所示,电路板30与连接器40之间通过导线80相连。这里的导线80是指能够用于进行数据传输的线束。采用导线80连接电路板30与连接器40,方便行车电脑的制造。在相关技术中,连接器40通常直接安装在电路板30上,与电路板30形成一个整体,在进行行车电脑的组装时,连接器40连同电路板30一起放置到壳体中进行安装。在本申请实施例中,连接器40与底壳20一体注塑成型,连接器40与底壳20为一个整体,难以将连接器40直接安装到电路板30上,采用导线80连接电路板30和连接器40,使得电路板30与连接器40能够单独进行安装,操作方便。As shown in FIG. 6 , the circuit board 30 and the connector 40 are connected by wires 80 . The wire 80 here refers to a wire harness that can be used for data transmission. The wire 80 is used to connect the circuit board 30 and the connector 40 to facilitate the manufacture of the trip computer. In the related art, the connector 40 is usually directly mounted on the circuit board 30 to form an integral body with the circuit board 30 . When the trip computer is assembled, the connector 40 and the circuit board 30 are placed into the housing for installation. In the embodiment of the present application, the connector 40 and the bottom case 20 are integrally injection-molded, and the connector 40 and the bottom case 20 are integral, so it is difficult to directly install the connector 40 on the circuit board 30, and the wire 80 is used to connect the circuit board 30 and the circuit board 30. The connector 40 enables the circuit board 30 and the connector 40 to be installed independently, and the operation is convenient.
在连接电路板30与连接器40时,对于不同的连接器40,所设置的导线80的根数也可能不同,图6中仅示意性地示出了若干根导线80。When connecting the circuit board 30 and the connector 40 , the number of wires 80 may be different for different connectors 40 , and only a few wires 80 are schematically shown in FIG. 6 .
可选地,连接器40位于容置腔A内的一端也浸没在绝缘液体50内。电子设备运行的过程中,除了电路板30上的电子元器件会产生大量的热之外,连接器40也会产生一定的热量, 通过将连接器40位于容置腔A内的一端也浸没在绝缘液体50内,使连接器40产生的热量也能够通过绝缘液体50进行散发,避免连接器40过热。Optionally, one end of the connector 40 located in the accommodating cavity A is also immersed in the insulating liquid 50 . During the operation of the electronic device, in addition to the large amount of heat generated by the electronic components on the circuit board 30, the connector 40 will also generate a certain amount of heat. In the insulating liquid 50 , the heat generated by the connector 40 can also be dissipated through the insulating liquid 50 to prevent the connector 40 from overheating.
在一些示例中,连接电路板30和连接器40的导线80也浸没在绝缘液体50中。导线80在工作过程中也会产生一定的热量而温度升高,导线80表层通常具有一层绝缘皮,绝缘皮在受热的情况下会加速老化,将导线80浸没在绝缘液体50中,利用绝缘液体50对导线80进行散热,有利于降低导线80的温度,从而延缓导线80的绝缘皮的老化速度,延长导线80的使用寿命。In some examples, wires 80 connecting circuit board 30 and connector 40 are also submerged in insulating liquid 50 . The wire 80 also generates a certain amount of heat during the working process and the temperature rises. The surface of the wire 80 usually has a layer of insulation, and the insulation will accelerate aging when heated. The wire 80 is immersed in the insulating liquid 50, and the insulation The liquid 50 dissipates heat to the wire 80 , which is beneficial to reduce the temperature of the wire 80 , thereby delaying the aging speed of the insulating skin of the wire 80 and prolonging the service life of the wire 80 .
图7是本申请实施例提供的一种液冷板的内部结构示意图。如图7所示,液冷板10为空心结构,液冷板10具有进液口10a和出液口10b,进液口10a和出液口10b用于循环冷却液,冷却液从进液口10a进入液冷板10内,从出液口10b流出液冷板10。冷却液在循环的过程中,能够将液冷板10的热量带走,从而降低液冷板10的温度。FIG. 7 is a schematic diagram of the internal structure of a liquid cooling plate provided by an embodiment of the present application. As shown in FIG. 7 , the liquid cooling plate 10 has a hollow structure. The liquid cooling plate 10 has a liquid inlet 10a and a liquid outlet 10b. The liquid inlet 10a and the liquid outlet 10b are used for circulating cooling liquid, and the cooling liquid flows from the liquid inlet port. 10a enters the liquid cooling plate 10, and flows out of the liquid cooling plate 10 from the liquid outlet 10b. During the circulation of the cooling liquid, the heat of the liquid cooling plate 10 can be taken away, thereby reducing the temperature of the liquid cooling plate 10 .
示例性地,冷却液为水。Illustratively, the cooling liquid is water.
如图7所示,液冷板10的内部具有翅片101。位于液冷板10内部的翅片101增大了液冷板10与冷却液的接触面积,能够将热量更快速地带走,有利于增强液冷板10的散热能力。As shown in FIG. 7 , the liquid cooling plate 10 has fins 101 inside. The fins 101 located inside the liquid-cooling plate 10 increase the contact area between the liquid-cooling plate 10 and the cooling liquid, and can take away heat more quickly, which is beneficial to enhance the heat dissipation capability of the liquid-cooling plate 10 .
图8是本申请实施例提供的一种液冷板的结构示意图。图8中液冷板10的下表面为液冷板10靠近电路板30的一面。如图8所示,液冷板10靠近电路板30的表面也具有翅片101。液冷板10安装到底壳20之后,液冷板10靠近电路板30的表面的翅片101位于容置腔A内,这一部分翅片101增大了气化后的绝缘液体50与液冷板10的接触面积,使得在电子设备工作过程中,绝缘液体50气化之后,能够更快速地在液冷板10的表面液化,有利于加快绝缘液体50与液冷板10之间的热交换速度,进一步提高了电子设备的散热能力。并且,绝缘液体50在液冷板10的表面液化后,顺着翅片101的表面下滑,从而快速聚集成较大的液滴并滴落回底壳20中。FIG. 8 is a schematic structural diagram of a liquid cooling plate provided by an embodiment of the present application. The lower surface of the liquid cooling plate 10 in FIG. 8 is the side of the liquid cooling plate 10 close to the circuit board 30 . As shown in FIG. 8 , the surface of the liquid cooling plate 10 close to the circuit board 30 also has fins 101 . After the liquid cooling plate 10 is installed on the bottom case 20, the fins 101 of the liquid cooling plate 10 close to the surface of the circuit board 30 are located in the accommodating cavity A, and this part of the fins 101 increases the volume of the vaporized insulating liquid 50 and the liquid cooling plate. 10, so that during the working process of the electronic device, after the insulating liquid 50 is vaporized, it can be liquefied on the surface of the liquid cooling plate 10 more quickly, which is beneficial to speed up the heat exchange speed between the insulating liquid 50 and the liquid cooling plate 10. , which further improves the heat dissipation capacity of electronic equipment. Moreover, after the insulating liquid 50 is liquefied on the surface of the liquid cooling plate 10 , it slides down along the surface of the fins 101 , so as to quickly gather into larger droplets and drop back into the bottom case 20 .
可选地,液冷板10为金属件,金属一般都具有较强的导热能力,有利于液冷板10与绝缘液体50之间以及液冷板10与冷却液之间的热交换,能够进一步提高电子设备的散热能力。Optionally, the liquid-cooling plate 10 is a metal piece, and metals generally have strong thermal conductivity, which is beneficial to the heat exchange between the liquid-cooling plate 10 and the insulating liquid 50 and between the liquid-cooling plate 10 and the cooling liquid. Improve the heat dissipation capacity of electronic equipment.
在一些示例中,液冷板10采用铝或铝合金制成,铝和铝合金均具有较强的导热能力,而且价格便宜,易于降低制作成本,重量轻,方便安装。In some examples, the liquid cooling plate 10 is made of aluminum or aluminum alloy. Both aluminum and aluminum alloy have strong thermal conductivity, and are inexpensive, easy to reduce manufacturing costs, light in weight, and easy to install.
在另一些示例中,液冷板10采用其他金属制成,例如钢、铜或铜合金等。In other examples, the liquid cooling plate 10 is made of other metals, such as steel, copper, or copper alloys.
再次参照图3,液冷板10与底壳20通过第一螺钉91相连,以方便电子设备的拆装。第一螺钉91沿液冷板10的边缘间隔布置。Referring to FIG. 3 again, the liquid cooling plate 10 and the bottom case 20 are connected by first screws 91 to facilitate the disassembly and assembly of the electronic device. The first screws 91 are arranged at intervals along the edge of the liquid cooling plate 10 .
可选地,该电子设备还包括密封圈60,密封圈60位于侧板201和液冷板10之间。设置密封圈60能够提高液冷板10与底壳20之间的密封能力,在液冷板10与底壳20相连时,液冷板10与底壳20共同夹紧密封圈60,防止绝缘液体50从液冷板10与底壳20之间泄漏。Optionally, the electronic device further includes a sealing ring 60 , and the sealing ring 60 is located between the side plate 201 and the liquid cooling plate 10 . Setting the sealing ring 60 can improve the sealing ability between the liquid cooling plate 10 and the bottom case 20. When the liquid cooling plate 10 is connected to the bottom case 20, the liquid cooling plate 10 and the bottom case 20 clamp the sealing ring 60 together to prevent the insulating liquid 50 leaks from between the liquid cooling plate 10 and the bottom case 20 .
在一些示例中,密封圈60与侧板201一体注塑成型。即密封圈60与底壳20一体注塑成型。通过将密封圈60与底壳20一体注塑成型,使密封圈60与侧板201结合的更紧密,消除密封圈60与侧板201之间的缝隙,提高液冷板10与底壳20之间的密封效果。In some examples, the sealing ring 60 is integrally injection molded with the side plate 201 . That is, the sealing ring 60 and the bottom case 20 are integrally injection-molded. By integrally injection molding the sealing ring 60 and the bottom case 20 , the sealing ring 60 and the side plate 201 are combined more closely, the gap between the sealing ring 60 and the side plate 201 is eliminated, and the gap between the liquid cooling plate 10 and the bottom case 20 is improved. sealing effect.
密封圈60与侧板201采用二次注塑成型、多次注塑成型或双色成型,密封圈60通常采用较软,具有一定弹性的材料制作,而底壳20通常采用相对较硬的材料制作,密封圈60和底壳20的制作材料不同,采用二次注塑成型、多次注塑成型或双色成型,直接将密封圈60注塑在底壳20上,使密封圈60和底壳20成为一个整体。The sealing ring 60 and the side plate 201 are made of secondary injection molding, multiple injection molding or two-color molding. The sealing ring 60 is usually made of a softer material with certain elasticity, while the bottom shell 20 is usually made of a relatively hard material. The ring 60 and the bottom case 20 are made of different materials. Secondary injection molding, multiple injection molding or two-color molding are used to directly inject the sealing ring 60 on the bottom case 20, so that the sealing ring 60 and the bottom case 20 are integrated.
在另一些示例中,密封圈60与液冷板10一体注塑成型。将密封圈60与液冷板10一体注塑成型能够使密封圈60与液冷板10结合的更紧密,消除密封圈60与液冷板10之间的缝隙,提高液冷板10与底壳20之间的密封效果。In other examples, the sealing ring 60 is integrally injection molded with the liquid cooling plate 10 . The integral injection molding of the sealing ring 60 and the liquid cooling plate 10 can make the sealing ring 60 and the liquid cooling plate 10 combine more closely, eliminate the gap between the sealing ring 60 and the liquid cooling plate 10, and improve the liquid cooling plate 10 and the bottom shell 20. sealing effect between.
示例性地,在制作密封圈60时,将液冷板10置于模具中,将密封圈60注塑在液冷板10的表面。Exemplarily, when manufacturing the sealing ring 60 , the liquid cooling plate 10 is placed in a mold, and the sealing ring 60 is injection-molded on the surface of the liquid cooling plate 10 .
若密封圈60与液冷板10一体注塑成型,侧板201上设置有用于容纳密封圈60的凹槽201b(见图3),凹槽201b的截面为圆弧形,在液冷板10与底壳20相连时,密封圈60压紧凹槽201b的内壁,形成密封。If the sealing ring 60 and the liquid cooling plate 10 are integrally injection-molded, the side plate 201 is provided with a groove 201b for accommodating the sealing ring 60 (see FIG. 3 ). The cross section of the groove 201b is arc-shaped. When the bottom case 20 is connected, the sealing ring 60 presses the inner wall of the groove 201b to form a seal.
在另一些示例中,侧板201与液冷板10焊接。通过焊接的方式将液冷板10与底壳20连为一个整体,从而不需要设置密封圈60也能够避免绝缘液体50从液冷板10和底壳20之间泄漏。In other examples, the side plate 201 is welded with the liquid cooling plate 10 . The liquid cooling plate 10 and the bottom case 20 are connected as a whole by welding, so that the sealing ring 60 is not required and the leakage of the insulating liquid 50 from between the liquid cooling plate 10 and the bottom case 20 can be avoided.
示例性地,侧板201与液冷板10采用激光焊接。底壳20为塑料件,液冷板10通常为金属件,采用激光焊接技术能够将塑料件与金属件焊接为一体,从而将底壳20与液冷板10焊接为一个整体。Exemplarily, the side plate 201 and the liquid cooling plate 10 are welded by laser. The bottom case 20 is a plastic part, and the liquid cooling plate 10 is usually a metal part. The plastic part and the metal part can be welded into a whole by using laser welding technology, so that the bottom case 20 and the liquid cooling plate 10 can be welded as a whole.
图9是本申请提供的一种车载散热系统的结构框图。如图9所示,该车载散热系统包括冷却液循环管路900和如图2~8所示的任一种电子设备100。该电子设备100的液冷板10与该冷却液循环管路900连通。FIG. 9 is a structural block diagram of a vehicle-mounted cooling system provided by the present application. As shown in FIG. 9 , the vehicle-mounted heat dissipation system includes a cooling liquid circulation pipeline 900 and any electronic device 100 shown in FIGS. 2 to 8 . The liquid cooling plate 10 of the electronic device 100 communicates with the cooling liquid circulation pipeline 900 .
行车电脑工作过程中,位于容置腔底部的绝缘液体气化后上升到容置腔的顶部,液冷板温度相对较低,使得气化后的绝缘液体在液冷板表面液化并滴落到容置腔的底部,如此循环从而将电路板产生的热转移到液冷板,并散发出去,达到散热的目的。由于连接器与底壳一体注塑成型,连接器与底壳在连接处没有缝隙,因此绝缘液体不会在连接器与底壳的连接处发生泄漏,从而避免了由绝缘液体泄漏所引发的不良后果,使行车电脑能够高效率且稳定地工作。During the operation of the on-board computer, the insulating liquid at the bottom of the accommodating cavity vaporizes and rises to the top of the accommodating cavity, and the temperature of the liquid cooling plate is relatively low, so that the vaporized insulating liquid liquefies on the surface of the liquid cooling plate and drips onto the surface of the accommodating cavity. The bottom of the accommodating cavity is circulated in this way to transfer the heat generated by the circuit board to the liquid cooling plate and dissipate it to achieve the purpose of heat dissipation. Since the connector and the bottom shell are integrally injection-molded, there is no gap between the connector and the bottom shell, so the insulating liquid will not leak at the connection between the connector and the bottom shell, thus avoiding the adverse consequences caused by the leakage of the insulating liquid , so that the trip computer can work efficiently and stably.
将液冷板10与冷却液循环管路900连通,冷却液在冷却液循环管路900中循环时,冷却液流经液冷板10,将液冷板10的热量带走,对液冷板10进行散热,使液冷板10保持在相对低温的状态,使得气化后的绝缘液体在液冷板10表面液化。通过将电子设备100的液冷板10接入车辆本身的冷却液循环管路900中,从而不需要额外设置循环管路。The liquid cooling plate 10 is communicated with the cooling liquid circulation line 900. When the cooling liquid circulates in the cooling liquid circulation line 900, the cooling liquid flows through the liquid cooling plate 10, and the heat of the liquid cooling plate 10 is taken away. 10 to dissipate heat to keep the liquid cooling plate 10 in a relatively low temperature state, so that the vaporized insulating liquid liquefies on the surface of the liquid cooling plate 10 . By connecting the liquid cooling plate 10 of the electronic device 100 to the cooling liquid circulation line 900 of the vehicle itself, there is no need to provide additional circulation lines.
图10是本申请提供的一种冷却液循环管路与电子设备的连接示意图。如图10所示,该冷却液循环管路900包括电池冷却板970,电池冷却板970用于冷却车辆的电池,液冷板10与电池冷却板970并联。电子设备100与电池冷却板970并联后,循环的冷却液一部分进入电池冷却板970,另一部分进入电子设备100的液冷板10,分别对电池冷却板970和电子设备100进行冷却。FIG. 10 is a schematic diagram of the connection between a cooling liquid circulation pipeline and an electronic device provided by the present application. As shown in FIG. 10 , the cooling liquid circulation pipeline 900 includes a battery cooling plate 970 , the battery cooling plate 970 is used for cooling the battery of the vehicle, and the liquid cooling plate 10 is connected in parallel with the battery cooling plate 970 . After the electronic device 100 is connected to the battery cooling plate 970 in parallel, part of the circulating cooling liquid enters the battery cooling plate 970 and the other part enters the liquid cooling plate 10 of the electronic device 100 to cool the battery cooling plate 970 and the electronic device 100 respectively.
在另一些示例中,液冷板10与电池冷却板970串联。电子设备100与电池冷却板970串联后,循环的冷却液先后流经电子设备100的液冷板10和电池冷却板970,先后对电子设备100和电池冷却板970进行冷却。In other examples, the liquid cooling plate 10 is connected in series with the battery cooling plate 970 . After the electronic device 100 is connected to the battery cooling plate 970 in series, the circulating cooling liquid flows through the liquid cooling plate 10 and the battery cooling plate 970 of the electronic device 100 successively to cool the electronic device 100 and the battery cooling plate 970 successively.
如图10所示,该冷却液循环管路900包括冷凝器910、电动压缩机920、蒸发器930、第一膨胀阀940、电池冷却器950、电动水泵960、电池冷却板970、电子水阀980和第二膨胀阀990。As shown in FIG. 10 , the cooling liquid circulation pipeline 900 includes a condenser 910, an electric compressor 920, an evaporator 930, a first expansion valve 940, a battery cooler 950, an electric water pump 960, a battery cooling plate 970, and an electronic water valve 980 and a second expansion valve 990.
冷凝器910的进口与电动压缩机920的出口相连,冷凝器910的出口与第一膨胀阀940的进口相连,第一膨胀阀940的出口与蒸发器930的进口相连,蒸发器930的出口与电动压缩机920的进口相连。冷凝器910的出口还与电池冷却器950的制冷剂入口相连,电池冷却器950的制冷剂出口与电动压缩机920的入口相连。The inlet of the condenser 910 is connected with the outlet of the electric compressor 920, the outlet of the condenser 910 is connected with the inlet of the first expansion valve 940, the outlet of the first expansion valve 940 is connected with the inlet of the evaporator 930, and the outlet of the evaporator 930 is connected with the inlet of the first expansion valve 940. The inlet of the electric compressor 920 is connected. The outlet of the condenser 910 is also connected to the refrigerant inlet of the battery cooler 950 , and the refrigerant outlet of the battery cooler 950 is connected to the inlet of the electric compressor 920 .
电动压缩机920为制冷剂的循环提供动力,示例性地,制冷剂为乙二醇水溶液、氟利昂。The electric compressor 920 provides power for the circulation of the refrigerant, exemplarily, the refrigerant is an aqueous glycol solution, Freon.
制冷剂从冷凝器910中流出时为液态,从冷凝器910中流出的一部分制冷剂进入蒸发器930,液态的制冷剂流经蒸发器930后变为气态,气态的制冷剂通过电动压缩机920返回冷凝器910并转化为液态。第一膨胀阀940用于调节流经蒸发器930的制冷剂的流量,若第一膨胀阀940完全关闭,即流经蒸发器930的制冷剂的流量为0,蒸发器930不工作。制冷剂在冷凝器910和蒸发器930之间循环,将热量从蒸发器930转移至冷凝器910,使蒸发器930的温度降低。通过风扇将蒸发器930附近的冷空气吹入车辆的驾驶室,从而为车辆的驾驶室降温。When the refrigerant flows out of the condenser 910 , it is liquid, and a part of the refrigerant flowing out of the condenser 910 enters the evaporator 930 . The liquid refrigerant flows through the evaporator 930 and becomes gaseous, and the gaseous refrigerant passes through the electric compressor 920 . Return to condenser 910 and convert to liquid state. The first expansion valve 940 is used to adjust the flow rate of the refrigerant flowing through the evaporator 930. If the first expansion valve 940 is completely closed, that is, the flow rate of the refrigerant flowing through the evaporator 930 is 0, the evaporator 930 does not work. The refrigerant circulates between the condenser 910 and the evaporator 930, transferring heat from the evaporator 930 to the condenser 910, reducing the temperature of the evaporator 930. The cool air near the evaporator 930 is blown into the cab of the vehicle through a fan, thereby cooling the cab of the vehicle.
从冷凝器910中流出的另一部分制冷剂流经电池冷却器950,流经电池冷却器950后也转化为气态,并被电动压缩机920送回冷凝器910。制冷剂在冷凝器910和电池冷却器950之间循环,将热量从电池冷却器950处转移至冷凝器910,使电池冷却器950的温度降低。Another part of the refrigerant flowing out of the condenser 910 flows through the battery cooler 950 , is also converted into a gaseous state after passing through the battery cooler 950 , and is returned to the condenser 910 by the electric compressor 920 . The refrigerant circulates between the condenser 910 and the battery cooler 950, transferring heat from the battery cooler 950 to the condenser 910, reducing the temperature of the battery cooler 950.
电池冷却器950的冷却水进口与电动水泵960的出口相连,电池冷却器950的冷却水出口与第二膨胀阀990的进口相连,第二膨胀阀990的出口与电子水阀980的进口相连,电子水阀980的出口与电池冷却板970的进水口相连,电池冷却板970的出水口与电动水泵960的进水口相连。The cooling water inlet of the battery cooler 950 is connected to the outlet of the electric water pump 960, the cooling water outlet of the battery cooler 950 is connected to the inlet of the second expansion valve 990, and the outlet of the second expansion valve 990 is connected to the inlet of the electronic water valve 980, The outlet of the electronic water valve 980 is connected to the water inlet of the battery cooling plate 970 , and the water outlet of the battery cooling plate 970 is connected to the water inlet of the electric water pump 960 .
电动水泵960为冷却水的循环提供动力。在电动水泵960的作用下,冷却水在电池冷却器950和电池冷却板970之间循环,将电池冷却板970的热量转移至电池冷却器950,并在流经电池冷却器950的制冷剂的作用下,被转移至冷凝器910。 Electric water pump 960 powers the circulation of cooling water. Under the action of the electric water pump 960 , the cooling water circulates between the battery cooler 950 and the battery cooling plate 970 , transferring the heat of the battery cooling plate 970 to the battery cooler 950 . Under the action, it is transferred to the condenser 910 .
第二膨胀阀990和电子水阀980能够对冷却水的流量进行调节。第二膨胀阀990为电子膨胀阀、热力膨胀阀或电磁阀,能够根据管路中的压强与温度主动对冷却水的流量进行调节。The second expansion valve 990 and the electronic water valve 980 can adjust the flow rate of cooling water. The second expansion valve 990 is an electronic expansion valve, a thermal expansion valve or a solenoid valve, which can actively adjust the flow of cooling water according to the pressure and temperature in the pipeline.
如图10所示,将电子设备100与电池冷却板970并联,即将电子设备100的液冷板10的进液口10a与电池冷却板970的进水口相连,将电子设备100的液冷板10的出液口10b与电池冷却板970的出水口相连。使得流经电子水阀980的冷却水,一部分流经电池冷却板970,另一部分流经电子设备100的液冷板10。As shown in FIG. 10 , the electronic device 100 is connected in parallel with the battery cooling plate 970 , that is, the liquid inlet 10 a of the liquid cooling plate 10 of the electronic device 100 is connected to the water inlet of the battery cooling plate 970 , and the liquid cooling plate 10 of the electronic device 100 is connected The liquid outlet 10b is connected to the water outlet of the battery cooling plate 970 . Part of the cooling water flowing through the electronic water valve 980 flows through the battery cooling plate 970 , and the other part flows through the liquid cooling plate 10 of the electronic device 100 .
在另一些示例中,将电子设备100与电池冷却板970串联,例如,将电子设备100的液冷板10的进液口10a与电子水阀980的出口相连,将电子设备100的液冷板10的出液口10b与电池冷却板970的进水口相连,将电池冷却板970的出水口与电动水泵960的进口相连;或者,将电池冷却板970的进水口与电子水阀980的出口相连,将电池冷却板970的进水口与电子设备100的液冷板10的进液口10a相连,将电子设备100的液冷板10的出液口10b与电动水泵960的进口相连。In other examples, the electronic device 100 is connected to the battery cooling plate 970 in series, for example, the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100 is connected to the outlet of the electronic water valve 980, and the liquid cooling plate of the electronic device 100 is connected The liquid outlet 10b of 10 is connected to the water inlet of the battery cooling plate 970, and the water outlet of the battery cooling plate 970 is connected to the inlet of the electric water pump 960; or, the water inlet of the battery cooling plate 970 is connected to the outlet of the electronic water valve 980. , the water inlet of the battery cooling plate 970 is connected to the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100 , and the liquid outlet 10b of the liquid cooling plate 10 of the electronic device 100 is connected to the inlet of the electric water pump 960 .
在电子设备100与电池冷却板970并联时,由电子水阀980流出的冷却水一部分流经电池冷却板970,另一部分流经电子设备100的液冷板10。电池冷却板970的散热效果与冷却水的流量是相关联的,冷却水的流量越大,散热效果越好,为了使流经电池冷却板970的冷却水的流量保持在接入电子设备100之前的水平,通过第二膨胀阀990和电子水阀980增大冷却水的总流量。When the electronic device 100 is connected in parallel with the battery cooling plate 970 , part of the cooling water flowing from the electronic water valve 980 flows through the battery cooling plate 970 , and the other part flows through the liquid cooling plate 10 of the electronic device 100 . The heat dissipation effect of the battery cooling plate 970 is related to the flow rate of the cooling water. The greater the flow rate of the cooling water, the better the heat dissipation effect. In order to keep the flow rate of the cooling water flowing through the battery cooling plate 970 before the electronic device 100 is connected level, the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980.
在电子设备100与电池冷却板970串联时,由电子水阀980流出的冷却水会先后流经电子设备100的液冷板10与电池冷却板970。若冷却水先流经电子设备100的液冷板10,后流经电池冷却板970,冷却水在流经电子设备100的液冷板10后,温度会升高。在冷却水的流量不变的情况下,流经电池冷却板970的冷却水温度越低,电池冷却板970的散热效果越好。为了使电池冷却板970的散热效果保持在接入电子设备100之前的水平,通过第二膨胀阀990和电子水阀980增大冷却水的总流量,以增大冷却水流量的方式,补偿由于冷却水先流经了电子设备100的液冷板10而温度升高导致的不良影响。若冷却水先流经电池冷却板970,后流经电子设备100的液冷板10,在冷却水的流量不变的情况下,电池冷却板970的散热效果不会受到影响。尽管冷却水在流经电池冷却板970后温度会升高,但若温度升高后的冷却水也足以对电子设备100的液冷板10进行散热,则保持原有的冷却水流量,即冷却水的流量保持在接入电子设备100之前的水平。若以原油的冷却水流量进行散热,不足以使电子设备100的温度维持在所允许的温度范围内,则通过第二膨胀阀990和电子水阀980增大冷却水的总流量,以使电子设备100的温度能够维持在所允许的温度范围内。When the electronic device 100 and the battery cooling plate 970 are connected in series, the cooling water flowing out from the electronic water valve 980 will flow through the liquid cooling plate 10 and the battery cooling plate 970 of the electronic device 100 successively. If the cooling water first flows through the liquid cooling plate 10 of the electronic device 100 and then flows through the battery cooling plate 970 , the temperature of the cooling water will increase after flowing through the liquid cooling plate 10 of the electronic device 100 . Under the condition that the flow rate of the cooling water is constant, the lower the temperature of the cooling water flowing through the battery cooling plate 970 is, the better the heat dissipation effect of the battery cooling plate 970 is. In order to keep the heat dissipation effect of the battery cooling plate 970 at the level before the electronic device 100 is connected, the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980 to increase the flow of cooling water to compensate for the The cooling water first flows through the liquid cooling plate 10 of the electronic device 100 and the adverse effect is caused by the temperature rise. If the cooling water first flows through the battery cooling plate 970 and then flows through the liquid cooling plate 10 of the electronic device 100 , the heat dissipation effect of the battery cooling plate 970 will not be affected when the flow rate of the cooling water remains unchanged. Although the temperature of the cooling water will increase after flowing through the battery cooling plate 970 , if the increased temperature of the cooling water is sufficient to dissipate heat from the liquid cooling plate 10 of the electronic device 100 , the original cooling water flow rate will be maintained, that is, cooling The flow of water remains at the level before the electronic device 100 was plugged in. If the cooling water flow of crude oil is used for heat dissipation, it is not enough to maintain the temperature of the electronic device 100 within the allowable temperature range, then the total flow of cooling water is increased through the second expansion valve 990 and the electronic water valve 980, so that the electronic The temperature of the device 100 can be maintained within the allowable temperature range.
本申请实施例还提供了一种车辆,该车辆包括图9或图10所示的车载散热系统。该车辆至少包括汽车和电动车。通过设置图9或图10中的车载散热系统,在车辆行驶过程中,能够使电子设备100得到良好的散热,确保电子设备100能够稳定且高性能地工作。An embodiment of the present application further provides a vehicle, which includes the vehicle-mounted cooling system shown in FIG. 9 or FIG. 10 . The vehicle includes at least an automobile and an electric vehicle. By arranging the vehicle-mounted heat dissipation system in FIG. 9 or FIG. 10 , the electronic device 100 can be well dissipated during the driving process of the vehicle, ensuring that the electronic device 100 can work stably and with high performance.
以上所述仅为本申请的示例性实施例,并不用以限制本申请,凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的保护范围之内。The above are only exemplary embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the protection of the present application. within the range.
Claims (12)
- 一种电子设备,其特征在于,包括液冷板(10)、底壳(20)、电路板(30)和连接器(40);An electronic device, characterized in that it comprises a liquid cooling plate (10), a bottom case (20), a circuit board (30) and a connector (40);所述液冷板(10)与所述底壳(20)相连,所述液冷板(10)与所述底壳(20)之间形成有封闭的容置腔(A),所述容置腔(A)中盛放有绝缘液体(50);The liquid cooling plate (10) is connected to the bottom shell (20), and a closed accommodating cavity (A) is formed between the liquid cooling plate (10) and the bottom shell (20), and the container An insulating liquid (50) is contained in the cavity (A);所述电路板(30)位于所述容置腔(A)中,且与所述底壳(20)相连,所述电路板(30)浸没在所述绝缘液体(50)内;The circuit board (30) is located in the accommodating cavity (A) and connected to the bottom case (20), and the circuit board (30) is immersed in the insulating liquid (50);所述连接器(40)与所述底壳(20)一体注塑成型,所述连接器(40)的一端位于所述容置腔(A)内且与所述电路板(30)相连,另一端位于所述容置腔(A)外。The connector (40) is integrally injection-molded with the bottom case (20), one end of the connector (40) is located in the accommodating cavity (A) and is connected to the circuit board (30), and the other One end is located outside the accommodating cavity (A).
- 根据权利要求1所述的电子设备,其特征在于,所述底壳(20)包括侧板(201)和底板(202),所述底板(202)与所述液冷板(10)相对,所述侧板(201)位于所述底板(202)靠近所述液冷板(10)的一侧,且与所述底板(202)和所述液冷板(10)相连,所述连接器(40)位于所述侧板(201)上。The electronic device according to claim 1, wherein the bottom case (20) comprises a side plate (201) and a bottom plate (202), and the bottom plate (202) is opposite to the liquid cooling plate (10), The side plate (201) is located on the side of the bottom plate (202) close to the liquid cooling plate (10), and is connected to the bottom plate (202) and the liquid cooling plate (10), and the connector (40) is located on the side plate (201).
- 根据权利要求2所述的电子设备,其特征在于,所述侧板(201)与所述液冷板(10)焊接。The electronic device according to claim 2, wherein the side plate (201) is welded to the liquid cooling plate (10).
- 根据权利要求2所述的电子设备,其特征在于,所述电子设备还包括密封圈(60),所述密封圈(60)位于所述侧板(201)和所述液冷板(10)之间;The electronic device according to claim 2, characterized in that, the electronic device further comprises a sealing ring (60), and the sealing ring (60) is located on the side plate (201) and the liquid cooling plate (10) between;所述密封圈(60)与所述侧板(201)一体注塑成型,或者所述密封圈(60)与所述液冷板(10)一体注塑成型。The sealing ring (60) and the side plate (201) are integrally injection-molded, or the sealing ring (60) and the liquid cooling plate (10) are integrally injection-molded.
- 根据权利要求2~4任一项所述的电子设备,其特征在于,所述底板(202)与所述电路板(30)相对,所述底板(202)靠近所述液冷板(10)的一面具有多个支撑凸起(2021),所述多个支撑凸起(2021)位于所述底板(202)和所述电路板(30)之间且与所述电路板(30)相连。The electronic device according to any one of claims 2 to 4, wherein the bottom plate (202) is opposite to the circuit board (30), and the bottom plate (202) is close to the liquid cooling plate (10) One side of the base plate has a plurality of support protrusions (2021), and the plurality of support protrusions (2021) are located between the bottom plate (202) and the circuit board (30) and are connected with the circuit board (30).
- 根据权利要求1~5任一项所述的电子设备,其特征在于,所述电路板(30)与所述连接器(40)之间通过导线(80)相连。The electronic device according to any one of claims 1 to 5, characterized in that, the circuit board (30) and the connector (40) are connected by wires (80).
- 根据权利要求1~6任一项所述的电子设备,其特征在于,所述连接器(40)位于所述容置腔(A)内的一端浸没在所述绝缘液体(50)内。The electronic device according to any one of claims 1 to 6, characterized in that, one end of the connector (40) located in the accommodating cavity (A) is immersed in the insulating liquid (50).
- 根据权利要求1~7任一项所述的电子设备,其特征在于,所述液冷板(10)的内部和所述液冷板(10)靠近所述电路板(30)的表面中的至少一处具有翅片(101)。The electronic device according to any one of claims 1 to 7, wherein the inside of the liquid cooling plate (10) and the surface of the liquid cooling plate (10) close to the circuit board (30) At least one place has fins (101).
- 根据权利要求1~8任一项所述的电子设备,其特征在于,所述绝缘液体(50)为氟化液或硅油。The electronic device according to any one of claims 1 to 8, wherein the insulating liquid (50) is a fluorinated liquid or a silicone oil.
- 一种车载散热系统,其特征在于,包括冷却液循环管路(900)和如权利要求1~9任一项所述的电子设备(100),所述液冷板(10)与所述冷却液循环管路(900)连通。A vehicle-mounted cooling system, characterized by comprising a cooling liquid circulation pipeline (900) and the electronic device (100) according to any one of claims 1 to 9, the liquid cooling plate (10) and the cooling The liquid circulation pipeline (900) is communicated.
- 根据权利要求10所述的车载散热系统,其特征在于,所述冷却液循环管路(900)包括电池冷却板(970),所述电池冷却板(970)用于冷却车辆的电池,所述液冷板(10)与所述电池冷却板(970)并联或串联。The vehicle-mounted cooling system according to claim 10, characterized in that, the cooling liquid circulation pipeline (900) comprises a battery cooling plate (970), and the battery cooling plate (970) is used for cooling the battery of the vehicle, the The liquid cooling plate (10) is connected in parallel or in series with the battery cooling plate (970).
- 一种车辆,其特征在于,包括如权利要求10或11所述的车载散热系统。A vehicle, characterized by comprising the vehicle-mounted cooling system according to claim 10 or 11.
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CN117835643A (en) * | 2023-11-24 | 2024-04-05 | 东莞市硅翔绝缘材料有限公司 | Preparation method of composite liquid cooling plate with heat dissipation and heat preservation functions and liquid cooling plate |
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