CN114449795A

CN114449795A - Electronic equipment, on-vehicle cooling system and vehicle

Info

Publication number: CN114449795A
Application number: CN202011225267.2A
Authority: CN
Inventors: 尹建强
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2022-05-06
Also published as: WO2022095457A1

Abstract

The embodiment of the application discloses electronic equipment, on-vehicle cooling system and vehicle belongs to the technical field of heat dissipation. This electronic equipment includes liquid cooling board, drain pan, circuit board and connector, and liquid cooling board links to each other with the drain pan, forms sealed holding chamber between liquid cooling board and the drain pan, has held insulating liquid in the holding chamber, and the circuit board is arranged in the holding chamber, and the submergence is in insulating liquid, and the circuit board links to each other with the drain pan, the integrative injection moulding of connector and drain pan, and the one end of connector is arranged in the holding intracavity and links to each other with the circuit board, and the other end of connector is arranged in the holding chamber outside. Because the connector and the bottom shell are integrally injection-molded, the connector and the bottom shell have good sealing performance, the leakage of insulating liquid from a joint of the connector and the bottom shell can be avoided, and the stable work of the electronic equipment can be ensured.

Description

Electronic equipment, on-vehicle cooling system and vehicle

Technical Field

The application relates to the technical field of heat dissipation, in particular to an electronic device, a vehicle-mounted heat dissipation system and a vehicle.

Background

Electronic equipment usually generates heat in the working process, and in order to ensure the normal work of the electronic equipment, the electronic equipment is usually subjected to heat dissipation to reduce the temperature of the electronic equipment.

Taking a vehicle as an example, a Mobile Data Center (MDC), also called a driving computer, is an important electronic device in the vehicle. The driving computer can generate a large amount of heat in the working process, so that the temperature of the driving computer is increased, and the performance and the stability of the driving computer are influenced.

Disclosure of Invention

The embodiment of the application provides an electronic equipment, a vehicle-mounted heat dissipation system and a vehicle, which can overcome the problems in the related art, and the technical scheme is as follows:

in a first aspect, an electronic device is provided. In the embodiment of the application, a driving computer of a vehicle is taken as an example. The electronic device includes a housing, a circuit board, and a connector. The circuit board is located in the containing cavity in the shell, the connector is connected with the circuit board, one end of the connector is located in the shell, the other end of the connector extends out relative to the shell, insulating liquid is contained in the shell, and the circuit board is immersed in the insulating liquid.

In this application embodiment, the shell includes liquid cooling board and drain pan, liquid cooling board with the drain pan links to each other, liquid cooling board with form the confined holding chamber between the drain pan.

Based on the structure, when the electronic equipment is used, the liquid cooling plate is connected with the cooling liquid circulating pipeline, so that the liquid cooling plate is kept in a relatively low temperature state. The heat that the circuit board produced makes insulating liquid gasification, and insulating liquid after the gasification rises to liquid cooling board department, because the temperature of liquid cooling board is lower relatively, and insulating liquid after the gasification liquefies on the liquid cooling board surface to drip back the bottom in holding chamber, so circulation, thereby the heat that produces the circuit board shifts the liquid cooling board, distributes away through the liquid cooling board, reaches radiating purpose, reduces electronic equipment's temperature.

In the embodiment of the present application, the connector is integrally injection-molded with the bottom case. Because the connector and the bottom shell are integrally molded by injection, and no gap exists at the joint of the connector and the bottom shell, the insulating liquid cannot leak at the joint of the connector and the bottom shell, so that the adverse effect caused by the leakage of the insulating liquid is avoided, and the electronic equipment can work efficiently and stably.

In some examples, the electronic device includes multiple connectors of different types, one, two, or more of each type of connector.

Based on the structure, when the electronic equipment is connected with other equipment, the corresponding connector is selected to be connected according to different equipment to be connected.

In an embodiment of the present application, the injection molding includes at least one of one-shot injection molding, two-shot injection molding, multi-shot injection molding, and two-color molding. Specifically, according to the shape and the structural complexity of the connector and the bottom shell, one-time injection molding, two-time injection molding, multiple-time injection molding or double-color molding is selected.

Optionally, the liquid cooling plate is welded or screwed to the bottom case.

In some examples, the liquid cooling plate is connected to the bottom case by welding. For example by means of laser welding. Connect liquid cooling board and drain pan through the welded mode, can eliminate the gap between liquid cooling board and the drain pan to avoid the junction of liquid cooling board and drain pan to take place to leak.

In other examples, the liquid cooling plate is connected with the bottom shell through a screw connection mode. Through screw connection liquid cooling board and drain pan, when needs maintain the inside circuit board isotructure of casing, directly dismantle the screw, with liquid cooling board and drain pan separation, after accomplishing the maintenance, tighten the screw again, link together liquid cooling board and drain pan.

In this application embodiment, adopt the screw connection the liquid cooling board with during the drain pan, the liquid cooling board with be provided with the sealing washer between the drain pan. Through screwing up the screw, make the liquid cooling board with the drain pan presss from both sides tightly the sealing washer improves the liquid cooling board with leakproofness between the drain pan avoids the liquid cooling board with the junction of drain pan takes place to leak.

In an embodiment of the present application, the sealing ring is integrally injection-molded with any one of the liquid cooling plate and the bottom case.

For example, the sealing ring and the liquid cooling plate are integrally injection-molded, so that the sealing ring and the liquid cooling plate form a whole. Or the sealing ring and the bottom shell are integrally formed by injection molding, so that the sealing ring and the bottom shell form a whole. The injection molding mode comprises at least one of one-time injection molding, two-time injection molding, multiple-time injection molding and two-color molding.

Based on above-mentioned structure, the sealing washer makes inseparabler that the sealing washer is connected with an integrative injection moulding in liquid cooling board and the drain pan, can further improve the leakproofness between liquid cooling board and the drain pan.

In an embodiment of the present application, the bottom case includes side plates and a bottom plate. The side plate is located on one side of the bottom plate, the side plate is connected with the bottom plate, and the liquid cooling plate is connected with the side plate. The side plate, the bottom plate and the liquid cooling plate are enclosed to form the closed accommodating cavity, the bottom plate is used as a foundation for mounting the circuit board, and the connector is located on the side plate.

In the embodiment of the present application, the aforementioned sealing ring is located between the liquid cooling plate and the side plate. The side plate is provided with a groove for accommodating the sealing ring. When the liquid cooling plate is connected with the bottom shell, the sealing ring compresses the inner wall of the groove to form sealing, so that the contact area of the sealing ring and the side plate is increased, and the sealing performance is improved.

As an example, one side of the bottom plate is provided with a plurality of supporting protrusions, the supporting protrusions are located in the accommodating cavities, and the circuit board is fixed on the supporting protrusions.

According to the scheme shown in the embodiment of the application, the circuit board is supported by the supporting bulges through the plurality of supporting bulges, so that a certain distance is kept between the circuit board and the bottom plate, and the lower surface of the circuit board can be fully contacted with the insulating liquid.

Optionally, the circuit board is connected to the connector through a wire. The wire refers to a wiring harness for data transmission.

Based on above-mentioned structure, after connector and the integrative injection moulding of drain pan, fix the circuit board on the drain pan earlier, then link to each other the one end of wire with the circuit board, link to each other the other end of wire and the one end that the connector is located the holding intracavity, convenient operation.

In the embodiment of the application, the inner part of the liquid cooling plate and the surface of the liquid cooling plate close to the circuit board are both provided with fins.

As an example, the liquid cooling plate is a hollow structure, when the electronic device is used, the cavity inside the liquid cooling plate is continuously filled with and drained of cooling liquid, the temperature of the liquid cooling plate is reduced by the cooling liquid, the liquid cooling plate is continuously kept at a relatively low temperature, and the gasified insulating liquid is liquefied on the surface of the liquid cooling plate. The fins in the liquid cooling plate can increase the contact area of the cooling liquid and the liquid cooling plate, so that heat exchange between the liquid cooling plate and the cooling liquid is accelerated, and the heat dissipation capacity of the electronic equipment is improved. The fins of the liquid cooling plate close to the circuit board are located in the containing cavity, the area of the gasified insulating liquid and the area of the liquid cooling plate which can be contacted with each other are increased after the fins are arranged, and liquefaction of the gasified insulating liquid is facilitated.

In a second aspect, a vehicle-mounted heat dissipation system is also provided. The vehicle-mounted heat dissipation system comprises a cooling liquid circulation pipeline and any one of the electronic devices described in the previous aspect. The coolant circulation line is used to dissipate heat from various parts of the vehicle, for example, a cab of the vehicle and a battery mounted on the vehicle.

In an embodiment of the present application, the liquid cooling plate of the electronic device is in communication with the cooling liquid circulation line.

Based on the structure, the cooling liquid circulation pipeline dissipates heat of the liquid cooling plate of the electronic equipment, reduces the temperature of the liquid cooling plate and enables the liquid cooling plate to be kept in a relatively low-temperature state. Thus, the insulating liquid in the electronic equipment can be liquefied on the surface of the liquid cooling plate after being gasified.

In a third aspect, a vehicle is also provided. The vehicle comprises the on-board heat dissipation system according to the second aspect.

Based on the structure, the electronic equipment in the vehicle-mounted heat dissipation system of the vehicle can be well dissipated, and the performance and the stability of the electronic equipment are ensured.

Drawings

FIG. 1 is a schematic structural diagram of a vehicle according to an embodiment of the present disclosure;

fig. 2 is an external structural schematic diagram of an electronic device according to an embodiment of the present disclosure;

fig. 3 is an exploded schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 4 is a cross-sectional view taken at I-I in FIG. 2;

fig. 5 is a schematic structural diagram of a bottom case of an electronic device according to an embodiment of the present disclosure;

fig. 6 is a schematic internal structure diagram of an electronic device according to an embodiment of the present application;

FIG. 7 is a schematic diagram of an internal structure of a liquid cooling plate according to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a liquid cooling plate according to an embodiment of the present disclosure;

FIG. 9 is a block diagram of an in-vehicle heat dissipation system provided in the present application;

fig. 10 is a schematic diagram illustrating connection between a cooling liquid circulation pipeline and an electronic device according to the present application.

Description of the figures

1. Millimeter wave radar 10, liquid cooling plate 10a, liquid inlet 10b, liquid outlet

100. Electronic device 101 and fin

2. Laser radar 20, bottom case 201, side plate 202 and bottom plate

201a, a liquid injection port 201b, a groove 2021, a supporting protrusion 2021a and a threaded hole

3. Vehicle control unit 30 and circuit board

4. Telematics 40, connector

5. Camera 50 and insulating liquid

6. Driving computer 60 and sealing ring

7. Cloud data center 70, sealing plug

80. Conducting wire

91. First screw 92, second screw 900, coolant circulation line 910, condenser

920. Electric compressor 930, evaporator 940, first expansion valve 950, battery cooler

960. Electric water pump 970, battery cooling plate 980, electronic water valve 990 and second expansion valve

A. Containing cavity

Detailed Description

The embodiment of the application provides an electronic device, a vehicle-mounted heat dissipation system and a vehicle.

With the development of automatic driving technology, more and more electronic devices are mounted on a vehicle, and the electronic devices are generally connected with a driving computer. For example, fig. 1 is a schematic structural diagram of a vehicle according to an embodiment of the present application. As shown in fig. 1, a millimeter wave radar 1 and a laser radar 2 are provided at a head portion of a vehicle, a Vehicle Control Unit (VCU) 3 is further provided at a center console position of the vehicle, and a telematics processor 4 (T-BOX) is further provided in a cab and used for establishing a connection with a cloud data center 7. A camera is also typically provided on the vehicle, for example a camera 5 is typically provided in the cab. The millimeter wave radar 1, the laser radar 2, the vehicle control unit 3, the remote information processor 4 and the camera 5 are respectively connected with a driving computer 6. The data volume that driving computer need handle is bigger and bigger, just also promotes constantly to driving computer's calculation power demand, promotes to 300Tflops from 10Tflops before gradually, and is even higher, and electronic components on the inside circuit board of driving computer is also more and more naturally, has reached more than 200 pcs. Generally, more electronic components mean higher power consumption, and the power consumption of the driving computer is gradually increased from about 20w to about 300w, so that the heat productivity is greatly increased, and the temperature of the whole driving computer is increased.

High temperature affects the performance and stability of the vehicle computer, and in order to enable the vehicle computer to work efficiently and stably with a large increase in heat generation, it is necessary to improve the heat dissipation capability of the vehicle computer. The cycle computer 6 includes a housing, a circuit board inside the housing, and a connector 40, the connector 40 being mounted on the circuit board, and the connector 40 extending relative to the housing. The driving computer 6 generally comprises a plurality of connectors 40, and devices such as the millimeter wave radar 1, the laser radar 2, the vehicle control unit 3, the remote information processor 4 and the camera 5 are connected with the plurality of connectors 40 through signal lines.

An insulating liquid is contained in the housing, and the circuit board is immersed in the insulating liquid. In the working process of the traveling crane computer 6, electronic components on the circuit board generate heat, the insulating liquid absorbs the heat and is gasified, the gasified insulating liquid rises to the top of the shell, the temperature at the top of the shell is lower, the gasified insulating liquid can be liquefied and emits the heat, and the liquefied insulating liquid drips back to the bottom of the shell. The circulation transfers the heat generated by the circuit board to the top of the shell for emission. This way of using the phase change of the material has a strong heat dissipation capacity, since the insulating liquid will absorb a lot of heat when it is vaporized.

However, the insulating liquid in the housing is liable to leak through the gap at the junction of the connector 40 and the housing, and the insulating liquid is changed from a liquid state to a gaseous state, which greatly increases the volume, which causes the pressure inside the housing to rise, and the higher the amount of heat generated, the more the pressure rises, making the insulating liquid more liable to leak. The leakage of the insulating liquid can reduce the heat dissipation capacity of the traveling crane computer, and once the insulating liquid leaks to a degree that the insulating liquid is not enough to immerse the circuit board, the heat on the circuit board can hardly be dissipated, the temperature rises rapidly, and the circuit board is possibly burnt.

Fig. 2 is an external structural schematic diagram of an electronic device according to an embodiment of the present application. Fig. 3 is an exploded schematic structure diagram of an electronic device according to an embodiment of the present application. As shown in fig. 2 and 3, the electronic apparatus includes a housing, a circuit board 30, and a connector 40. Wherein the housing comprises a liquid cooling plate 10 and a bottom shell 20.

Fig. 4 is a sectional view taken along line i-i in fig. 2. As shown in fig. 4, the liquid cooling plate 10 is connected to the bottom case 20, and a closed accommodating chamber a is formed between the liquid cooling plate 10 and the bottom case 20, and the accommodating chamber a contains an insulating liquid 50.

The circuit board 30 is located in the accommodating chamber a, and the circuit board 30 is connected to the bottom case 20, and the circuit board 30 is immersed in the insulating liquid 50.

The connector 40 and the bottom case 20 are integrally formed by injection molding, one end of the connector 40 is located in the accommodating cavity a and connected to the circuit board 30, and the other end of the connector 40 is located outside the accommodating cavity a.

In fig. 4, the hollow arrows in the housing chamber a indicate the ascending direction of the vaporized insulating gas 50, the solid arrows in the housing chamber a indicate the dropping direction of the liquefied insulating liquid 50, and the black dots indicate the droplets formed by the liquefied insulating liquid 50. The solid arrows within the liquid-cooled plate 10 illustrate the direction of flow of cooling water for cooling the liquid-cooled plate 10.

In the driving computer working process, the insulating liquid 50 that is located holding chamber A bottom rises to holding chamber A's top after gasifying, and liquid cooling board 10 temperature is lower relatively for insulating liquid 50 after the gasification is at 10 surface liquefaction of liquid cooling board and the bottom of drippage holding chamber A, thereby the circulation so shifts liquid cooling board 10 with the heat that circuit board 30 produced, and distributes away, reaches radiating purpose. Because the connector 40 and the bottom case 20 are integrally injection molded, there is no gap at the joint between the connector 40 and the bottom case 20, and therefore the insulating liquid 50 does not leak at the joint between the connector 40 and the bottom case 20, thereby avoiding the adverse effect caused by the leakage of the insulating liquid 50, and enabling the traveling crane computer to work efficiently and stably.

Optionally, the insulating liquid 50 is a fluorinated liquid or silicone oil. The fluorinated liquid and the silicone oil both have good insulating property.

In the embodiment of the present application, the integral injection molding means that the integral injection molding is formed by injection molding. The connector 40 is integrally formed with the bottom case 20 by injection molding, so that a gap between the connector 40 and the bottom case 20 is eliminated and leakage of the insulating liquid 50 is prevented.

In the embodiments of the present application, the injection molding includes one-shot injection molding, two-shot injection molding, multi-shot injection molding, and two-color molding.

One-time injection molding is the simplest injection molding mode, and during manufacturing, after a mold is closed, the connector 40 and the bottom shell 20 which form a whole are obtained through the process flows of glue injection, pressure maintaining, cooling, mold opening and product taking out.

The secondary injection molding is a special injection molding mode, after a semi-finished product is manufactured in a primary injection molding mode in one set of mold, the semi-finished product is placed in the other set of mold, and is subjected to primary mold closing, glue injection, pressure maintaining, cooling and mold opening, and finally the product is taken out, so that the connector 40 and the bottom shell 20 which form a whole are obtained. The materials injected by the two times of glue injection are the same or different.

In the secondary injection molding, the semi-finished product is one of the following arbitrary structures: connector 40, bottom housing 20, a portion of connector 40, a portion of bottom housing 20, a portion of complete connector 40 and bottom housing 20, a portion of complete bottom housing 20 and connector 40, a portion of connector 40 and a portion of bottom housing 20.

The multiple injection molding is based on the secondary injection molding, and the multiple injection molding is performed through at least one mold closing, glue injection, pressure maintaining, cooling, mold opening and product taking out to form the connector 40 and the bottom shell 20 which are integrated. The injected material is the same in each shot or different in each shot.

Two-color molding is a molding process in which two different materials are injected into the same set of mold. The two materials are different in color, or different in hardness, or different in both color and hardness. The difference between the two-color molding and the one-time injection molding is that the finished product obtained by the two-color molding is different in material of different parts. For example, the connector 40 and the bottom case 20 are formed by one-time injection molding, the material of the connector 40 and the material of the bottom case 20 are the same, the connector 40 and the bottom case 20 are formed by two-color molding, and the material of the connector 40 is different from the material of the bottom case 20.

In the embodiment of the present application, a single injection molding, a double injection molding, a multi-injection molding, or a two-color molding is selected according to the complexity of the shapes and structures of the connector 40 and the bottom case 20.

Fig. 5 is a schematic structural diagram of a bottom case of an electronic device according to an embodiment of the present application. As shown in fig. 5, the bottom chassis 20 includes side panels 201 and a bottom panel 202. The bottom plate 202 is opposite to the liquid cooling plate 10, the side plate 201 is located on one side of the bottom plate 202 close to the liquid cooling plate 10 and is connected with the bottom plate 202 and the liquid cooling plate 10, and the connector 40 is located on the side plate 201.

The bottom plate 202 of the bottom case 20 serves as a base for placing the vehicle computer, and when the vehicle computer is placed, the vehicle computer is flatly placed at a corresponding position of the vehicle by taking the bottom plate 202 as a support. The connector 40 is disposed on the side plate 201 to facilitate connection of various signal lines with the connector 40.

The number of the side panels 201 is set according to the shape of the electronic apparatus. For example, in the present embodiment, the bottom plate 202 is rectangular, and the bottom case 20 includes 4 side plates 201. In other examples, the bottom plate 202 has other polygonal shapes, such as a pentagon, a hexagon, etc., and the number of the side plates 201 varies accordingly.

If the electronic device includes a plurality of connectors 40, the plurality of connectors 40 are located on the same side board 201 or distributed on a plurality of side boards 201.

In some examples, a row of connectors 40 is distributed on the side panel 201. For example, in fig. 5, only one row of connectors 40 is distributed on the side plate 201.

In other examples, two or more rows of connectors 40 are distributed on the side panel 201.

As shown in fig. 3 or 5, the side plate 201 further has a liquid filling port 201a, and the liquid filling port 201a is used for filling the insulating liquid 50 into the accommodating chamber a. The pouring port 201a and the connector 40 are provided on different side plates 201 to facilitate the pouring of the insulating liquid 50.

The bottom shell 20 further comprises a sealing plug 70, and the sealing plug 70 is detachably mounted on the side plate 201 and is located at the liquid injection port 201 a. After the filling of the insulating liquid 50 is completed, the sealing plug 70 is attached to the side plate 201, and the filling port 201a is blocked by the sealing plug 70, thereby preventing the insulating liquid 50 from leaking.

As an example, the sealing plug 70 is a screw plug, and the sealing plug 70 is screwed to the pouring port 201 a.

Fig. 6 is a schematic internal structure diagram of an electronic device according to an embodiment of the present application. The liquid cooling plate 10 is omitted in fig. 6. Referring to fig. 5 and 6, the bottom plate 202 is opposite to the circuit board 30, a surface of the bottom plate 202 near the liquid cooling plate 10 has a plurality of supporting protrusions 2021, and the plurality of supporting protrusions 2021 are located between the bottom plate 202 and the circuit board 30 and connected to the circuit board 30.

The support protrusion 2021 supports the circuit board 30 away from the bottom plate 202, so that the circuit board 30 and the bottom plate 202 are spaced apart from each other, and the lower surface of the circuit board 30 can be sufficiently contacted with the insulating liquid 50 to transfer the generated heat to the insulating liquid 50.

The number of the supporting protrusions 2021 is set according to the area size of the circuit board 30, and the larger the area of the circuit board 30 is, the greater the number of the supporting protrusions 2021 is set, so as to firmly and stably fix the circuit board 30 in the bottom case 20. As an example, in the embodiment of the present application, 6 support protrusions 2021 are provided on the bottom plate 202.

As shown in fig. 5, the top surface of the support protrusion 2021 has a threaded hole 2021a, and the circuit board 30 is fixedly attached to the top surface of the support protrusion 2021 by a second screw 92.

Optionally, the plane of the circuit board 30 and the plane of the base plate 202 form an acute angle. That is, the circuit board 30 is not parallel to the bottom plate 202, but forms a certain included angle, which is beneficial for bubbles formed by the gasification of the insulating liquid 50 to rise out of the liquid level under the circuit board 30, and avoids the bubbles from gathering under the circuit board 30 to affect the heat dissipation of the lower surface of the circuit board 30.

As shown in fig. 6, the circuit board 30 is connected to the connector 40 by a wire 80. The wire 80 here refers to a wire harness that can be used for data transmission. The circuit board 30 and the connector 40 are connected by the lead 80, which is convenient for manufacturing the traveling computer. In the related art, the connector 40 is usually directly mounted on the circuit board 30 and is formed integrally with the circuit board 30, and when the laptop computer is assembled, the connector 40 is placed in the housing together with the circuit board 30 for mounting. In the embodiment of the present application, the connector 40 and the bottom case 20 are integrally injection molded, the connector 40 and the bottom case 20 are integrated, it is difficult to directly mount the connector 40 on the circuit board 30, and the circuit board 30 and the connector 40 are connected by the wires 80, so that the circuit board 30 and the connector 40 can be separately mounted, and the operation is convenient.

When connecting the circuit board 30 with the connector 40, the number of wires 80 provided may also be different for different connectors 40, only a few wires 80 being schematically shown in fig. 6.

Optionally, the end of the connector 40 located in the receiving cavity a is also immersed in the insulating liquid 50. In the operation process of the electronic device, besides that the electronic components on the circuit board 30 generate a large amount of heat, the connector 40 also generates a certain amount of heat, and the end of the connector 40 located in the accommodating cavity a is also immersed in the insulating liquid 50, so that the heat generated by the connector 40 can be dissipated through the insulating liquid 50, and the overheating of the connector 40 is avoided.

In some examples, the wires 80 connecting the circuit board 30 and the connector 40 are also immersed in the insulating liquid 50. The lead 80 can also generate certain heat in the working process and the temperature rises, the surface layer of the lead 80 is usually provided with a layer of insulating skin, the insulating skin can accelerate aging under the condition of being heated, the lead 80 is immersed in the insulating liquid 50, and the insulating liquid 50 is utilized to dissipate heat of the lead 80, so that the temperature of the lead 80 is favorably reduced, the aging speed of the insulating skin of the lead 80 is delayed, and the service life of the lead 80 is prolonged.

Fig. 7 is a schematic internal structural diagram of a liquid cooling plate according to an embodiment of the present application. As shown in fig. 7, the liquid-cooling plate 10 has a hollow structure, and the liquid-cooling plate 10 has a liquid inlet 10a and a liquid outlet 10b, where the liquid inlet 10a and the liquid outlet 10b are used for circulating cooling liquid, and the cooling liquid enters the liquid-cooling plate 10 from the liquid inlet 10a and flows out of the liquid-cooling plate 10 from the liquid outlet 10 b. The coolant can take away the heat of the liquid-cooled plate 10 during the circulation process, thereby reducing the temperature of the liquid-cooled plate 10.

Illustratively, the cooling fluid is water.

As shown in fig. 7, the liquid-cooling plate 10 has fins 101 inside. The fins 101 located inside the liquid cooling plate 10 increase the contact area between the liquid cooling plate 10 and the cooling liquid, so that heat can be taken away more quickly, and the heat dissipation capability of the liquid cooling plate 10 can be enhanced.

Fig. 8 is a schematic structural diagram of a liquid cooling plate according to an embodiment of the present application. In fig. 8, the lower surface of the liquid cooling plate 10 is the surface of the liquid cooling plate 10 close to the circuit board 30. As shown in fig. 8, the surface of the liquid cooling plate 10 near the circuit board 30 also has fins 101. After liquid cooling plate 10 is installed to bottom shell 20, fin 101 that liquid cooling plate 10 is close to the surface of circuit board 30 is located the holding chamber A, and this part fin 101 has increased the area of contact of insulating liquid 50 after the gasification and liquid cooling plate 10 for in electronic equipment working process, after insulating liquid 50 gasifies, can liquefy on the surface of liquid cooling plate 10 more fast, be favorable to accelerating the heat exchange speed between insulating liquid 50 and liquid cooling plate 10, further improved electronic equipment's heat-sinking capability. After the surface of the liquid cooling plate 10 is liquefied, the insulating liquid 50 slides down along the surface of the fin 101, and is rapidly collected into a large droplet and dropped back into the bottom case 20.

Optionally, the liquid cooling plate 10 is a metal member, and metal generally has a relatively strong heat conduction capability, which is beneficial to heat exchange between the liquid cooling plate 10 and the insulating liquid 50 and between the liquid cooling plate 10 and the cooling liquid, and can further improve the heat dissipation capability of the electronic device.

In some examples, the liquid cooling plate 10 is made of aluminum or aluminum alloy, which has strong heat conductivity, low price, easy reduction of manufacturing cost, light weight, and convenient installation.

In other examples, the liquid-cooled plate 10 is made of other metals, such as steel, copper, or copper alloys.

Referring to fig. 3 again, the liquid cooling plate 10 is connected to the bottom case 20 by a first screw 91 to facilitate the mounting and dismounting of the electronic device. The first screws 91 are spaced along the edge of the liquid cold plate 10.

Optionally, the electronic device further comprises a sealing ring 60, wherein the sealing ring 60 is located between the side plate 201 and the liquid cooling plate 10. The sealing ring 60 is arranged to improve the sealing capability between the liquid cooling plate 10 and the bottom case 20, and when the liquid cooling plate 10 is connected with the bottom case 20, the liquid cooling plate 10 and the bottom case 20 clamp the sealing ring 60 together to prevent the insulating liquid 50 from leaking between the liquid cooling plate 10 and the bottom case 20.

In some examples, the seal ring 60 is injection molded integrally with the side plate 201. I.e., the gasket 60 is integrally injection molded with the bottom case 20. By integrally injection molding the sealing ring 60 and the bottom shell 20, the sealing ring 60 and the side plate 201 are combined more tightly, a gap between the sealing ring 60 and the side plate 201 is eliminated, and the sealing effect between the liquid cooling plate 10 and the bottom shell 20 is improved.

The sealing ring 60 and the side plate 201 are formed by secondary injection molding, multiple injection molding or double-color molding, the sealing ring 60 is usually made of a softer material with certain elasticity, the bottom shell 20 is usually made of a harder material, the sealing ring 60 and the bottom shell 20 are made of different materials, and the sealing ring 60 is directly injected on the bottom shell 20 by secondary injection molding, multiple injection molding or double-color molding, so that the sealing ring 60 and the bottom shell 20 are integrated.

In other examples, the sealing ring 60 is integrally injection molded with the fluid cooling plate 10. The sealing ring 60 and the liquid cooling plate 10 are integrally formed by injection molding, so that the sealing ring 60 and the liquid cooling plate 10 are combined more tightly, a gap between the sealing ring 60 and the liquid cooling plate 10 is eliminated, and the sealing effect between the liquid cooling plate 10 and the bottom shell 20 is improved.

Illustratively, when the sealing ring 60 is manufactured, the liquid-cooled plate 10 is placed in a mold, and the sealing ring 60 is injection-molded on the surface of the liquid-cooled plate 10.

If the sealing ring 60 is integrally injection-molded with the liquid cooling plate 10, a groove 201b (see fig. 3) for accommodating the sealing ring 60 is formed in the side plate 201, and the cross section of the groove 201b is arc-shaped, so that when the liquid cooling plate 10 is connected to the bottom case 20, the sealing ring 60 presses the inner wall of the groove 201b to form a seal.

In other examples, the side plate 201 is welded to the liquid cooled plate 10. The liquid cooling plate 10 and the bottom shell 20 are connected into a whole by welding, so that the insulating liquid 50 can be prevented from leaking between the liquid cooling plate 10 and the bottom shell 20 without arranging the sealing ring 60.

Illustratively, the side plate 201 and the liquid cooling plate 10 are laser welded. The bottom case 20 is a plastic part, the liquid cooling plate 10 is usually a metal part, and the plastic part and the metal part can be welded together by using a laser welding technique, so that the bottom case 20 and the liquid cooling plate 10 are welded together.

Fig. 9 is a block diagram of a vehicle-mounted heat dissipation system provided in the present application. As shown in fig. 9, the vehicle-mounted heat dissipation system includes a cooling liquid circulation pipeline 900 and any of the electronic devices 100 shown in fig. 2 to 8. The liquid cooling plate 10 of the electronic device 100 is in communication with the cooling liquid circulation pipe 900.

In the driving computer working process, the insulating liquid located at the bottom of the accommodating cavity is gasified and then rises to the top of the accommodating cavity, the temperature of the liquid cooling plate is relatively low, so that the gasified insulating liquid is liquefied on the surface of the liquid cooling plate and drips to the bottom of the accommodating cavity, the heat generated by the circuit board is transferred to the liquid cooling plate in such a circulating manner, and the purpose of heat dissipation is achieved. Because the connector and the bottom shell are integrally molded by injection, and no gap exists at the joint of the connector and the bottom shell, the insulating liquid cannot leak at the joint of the connector and the bottom shell, thereby avoiding the adverse effect caused by the leakage of the insulating liquid and ensuring that the traveling crane computer can work efficiently and stably.

The liquid cooling plate 10 is communicated with the cooling liquid circulation pipeline 900, when cooling liquid circulates in the cooling liquid circulation pipeline 900, the cooling liquid flows through the liquid cooling plate 10, heat of the liquid cooling plate 10 is taken away, the liquid cooling plate 10 is cooled, the liquid cooling plate 10 is kept in a relatively low-temperature state, and insulating liquid after gasification is liquefied on the surface of the liquid cooling plate 10. By inserting the liquid cooling plate 10 of the electronic apparatus 100 into the coolant circulation line 900 of the vehicle itself, there is no need to additionally provide a circulation line.

Fig. 10 is a schematic diagram illustrating connection between a cooling liquid circulation pipeline and an electronic device according to the present application. As shown in fig. 10, the cooling fluid circulation line 900 includes a battery cooling plate 970, the battery cooling plate 970 is used for cooling the battery of the vehicle, and the liquid cooling plate 10 is connected in parallel with the battery cooling plate 970. After the electronic device 100 is connected in parallel with the battery cooling plate 970, a part of the circulating cooling liquid enters the battery cooling plate 970, and the other part of the circulating cooling liquid enters the liquid cooling plate 10 of the electronic device 100, so that the battery cooling plate 970 and the electronic device 100 are cooled respectively.

In other examples, the cold plate 10 is in series with the battery cold plate 970. After the electronic device 100 and the battery cooling plate 970 are connected in series, the circulating cooling liquid flows through the liquid cooling plate 10 of the electronic device 100 and the battery cooling plate 970 in sequence, and then cools the electronic device 100 and the battery cooling plate 970 in sequence.

As shown in fig. 10, the cooling liquid circulation line 900 includes a condenser 910, an electric compressor 920, an evaporator 930, a first expansion valve 940, a battery cooler 950, an electric water pump 960, a battery cooling plate 970, an electronic water valve 980, and a second expansion valve 990.

An inlet of the condenser 910 is connected to an outlet of the motor-driven compressor 920, an outlet of the condenser 910 is connected to an inlet of the first expansion valve 940, an outlet of the first expansion valve 940 is connected to an inlet of the evaporator 930, and an outlet of the evaporator 930 is connected to an inlet of the motor-driven compressor 920. The outlet of the condenser 910 is also connected to the refrigerant inlet of the battery cooler 950, and the refrigerant outlet of the battery cooler 950 is connected to the inlet of the motor-driven compressor 920.

The electric compressor 920 provides power for the circulation of a refrigerant, illustratively, an aqueous glycol solution, freon.

The refrigerant is in a liquid state when flowing out of the condenser 910, a part of the refrigerant flowing out of the condenser 910 enters the evaporator 930, the liquid refrigerant passes through the evaporator 930 and turns into a gaseous state, and the gaseous refrigerant returns to the condenser 910 through the electric compressor 920 and is converted into the liquid state. The first expansion valve 940 is used to adjust the flow rate of the refrigerant flowing through the evaporator 930, and if the first expansion valve 940 is completely closed, that is, if the flow rate of the refrigerant flowing through the evaporator 930 is 0, the evaporator 930 is not operated. The refrigerant circulates between the condenser 910 and the evaporator 930, transferring heat from the evaporator 930 to the condenser 910, causing the temperature of the evaporator 930 to decrease. The cold air near the evaporator 930 is blown into the cabin of the vehicle by a fan, thereby cooling the cabin of the vehicle.

Another portion of the refrigerant exiting condenser 910 passes through battery cooler 950, is converted to a gaseous state after passing through battery cooler 950, and is returned to condenser 910 by motor-driven compressor 920. Refrigerant is circulated between the condenser 910 and the battery cooler 950 to transfer heat from the battery cooler 950 to the condenser 910, lowering the temperature of the battery cooler 950.

The cooling water inlet of the battery cooler 950 is connected with the outlet of the electric water pump 960, the cooling water outlet of the battery cooler 950 is connected with the inlet of the second expansion valve 990, the outlet of the second expansion valve 990 is connected with the inlet of the electronic water valve 980, the outlet of the electronic water valve 980 is connected with the water inlet of the battery cooling plate 970, and the water outlet of the battery cooling plate 970 is connected with the water inlet of the electric water pump 960.

An electric water pump 960 powers the circulation of cooling water. Under the action of the electric water pump 960, cooling water circulates between the battery cooler 950 and the battery cooling plate 970, transferring the heat of the battery cooling plate 970 to the battery cooler 950, and is transferred to the condenser 910 under the action of the refrigerant flowing through the battery cooler 950.

The second expansion valve 990 and the electronic water valve 980 can adjust the flow rate of the cooling water. The second expansion valve 990 is an electronic expansion valve, a thermostatic expansion valve, or a solenoid valve, and can actively adjust the flow rate of the cooling water according to the pressure and temperature in the pipeline.

As shown in fig. 10, the electronic device 100 is connected in parallel with the battery cooling plate 970, that is, the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100 is connected to the water inlet of the battery cooling plate 970, and the liquid outlet 10b of the liquid cooling plate 10 of the electronic device 100 is connected to the water outlet of the battery cooling plate 970. So that a portion of the cooling water flowing through the electronic water valve 980 flows through the battery cooling board 970, and another portion flows through the liquid cooling board 10 of the electronic device 100.

In other examples, electronic device 100 is connected in series with battery cooling plate 970, for example, liquid inlet 10a of liquid cooling plate 10 of electronic device 100 is connected to outlet of electronic water valve 980, liquid outlet 10b of liquid cooling plate 10 of electronic device 100 is connected to water inlet of battery cooling plate 970, and water outlet of battery cooling plate 970 is connected to inlet of electric water pump 960; or, the water inlet of the battery cooling plate 970 is connected to the outlet of the electronic water valve 980, the water inlet of the battery cooling plate 970 is connected to the liquid inlet 10a of the liquid cooling plate 10 of the electronic device 100, and the liquid outlet 10b of the liquid cooling plate 10 of the electronic device 100 is connected to the inlet of the electric water pump 960.

When the electronic device 100 is connected in parallel with the battery cooling plate 970, a part of the cooling water flowing out of the electronic water valve 980 flows through the battery cooling plate 970, and the other part of the cooling water flows through the liquid cooling plate 10 of the electronic device 100. The heat dissipation effect of the battery cooling plate 970 is related to the flow rate of the cooling water, and the greater the flow rate of the cooling water, the better the heat dissipation effect, and in order to maintain the flow rate of the cooling water flowing through the battery cooling plate 970 at a level before the electronic device 100 is connected, the total flow rate of the cooling water is increased by the second expansion valve 990 and the electronic water valve 980.

When the electronic device 100 is connected in series with the battery cooling board 970, the cooling water flowing out of the electronic water valve 980 flows through the liquid cooling board 10 of the electronic device 100 and the battery cooling board 970 in sequence. If the cooling water flows through the liquid cooling plate 10 of the electronic device 100 and then flows through the battery cooling plate 970, the temperature of the cooling water will increase after flowing through the liquid cooling plate 10 of the electronic device 100. In the case where the flow rate of the cooling water is not changed, the lower the temperature of the cooling water flowing through the battery cooling plate 970 is, the better the heat dissipation effect of the battery cooling plate 970 is. In order to maintain the heat dissipation effect of the battery cooling plate 970 at a level before the electronic device 100 is connected, the total flow rate of the cooling water is increased by the second expansion valve 990 and the electronic water valve 980, so as to compensate for the adverse effect caused by the temperature increase of the cooling water due to the cooling water first passing through the liquid cooling plate 10 of the electronic device 100. If the cooling water flows through the battery cooling plate 970 first and then flows through the liquid cooling plate 10 of the electronic device 100, the heat dissipation effect of the battery cooling plate 970 is not affected under the condition that the flow rate of the cooling water is not changed. Although the temperature of the cooling water is increased after passing through the battery cooling plate 970, if the temperature of the cooling water is increased enough to dissipate heat from the liquid cooling plate 10 of the electronic device 100, the original flow rate of the cooling water, that is, the flow rate of the cooling water is maintained at the level before the electronic device 100 is connected. If the cooling water flow rate of the crude oil is insufficient to maintain the temperature of the electronic device 100 within the allowable temperature range, the total flow rate of the cooling water is increased by the second expansion valve 990 and the electronic water valve 980 so that the temperature of the electronic device 100 can be maintained within the allowable temperature range.

The embodiment of the application also provides a vehicle, and the vehicle comprises the vehicle-mounted heat dissipation system shown in fig. 9 or fig. 10. The vehicle includes at least an automobile and an electric vehicle. By providing the in-vehicle heat dissipation system in fig. 9 or 10, the electronic apparatus 100 can be well dissipated during the running of the vehicle, and the electronic apparatus 100 can be ensured to operate stably and with high performance.

The above description is only one embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electronic device, comprising a liquid cooling plate (10), a bottom case (20), a circuit board (30), and a connector (40);

the liquid cooling plate (10) is connected with the bottom shell (20), a closed accommodating cavity (A) is formed between the liquid cooling plate (10) and the bottom shell (20), and insulating liquid (50) is contained in the accommodating cavity (A);

the circuit board (30) is positioned in the accommodating cavity (A) and is connected with the bottom shell (20), and the circuit board (30) is immersed in the insulating liquid (50);

the connector (40) and the bottom shell (20) are integrally formed in an injection molding mode, one end of the connector (40) is located in the accommodating cavity (A) and connected with the circuit board (30), and the other end of the connector is located outside the accommodating cavity (A).

2. The electronic device of claim 1, wherein the bottom housing (20) comprises a side plate (201) and a bottom plate (202), the bottom plate (202) is opposite to the liquid-cooled plate (10), the side plate (201) is located on one side of the bottom plate (202) close to the liquid-cooled plate (10) and is connected with the bottom plate (202) and the liquid-cooled plate (10), and the connector (40) is located on the side plate (201).

3. The electronic device according to claim 2, characterized in that the side plates (201) are welded with the liquid-cooled plate (10).

4. The electronic device according to claim 2, further comprising a sealing ring (60), the sealing ring (60) being located between the side plate (201) and the liquid-cooled plate (10);

the sealing ring (60) and the side plate (201) are integrally formed by injection molding, or the sealing ring (60) and the liquid cooling plate (10) are integrally formed by injection molding.

5. The electronic device according to any one of claims 2 to 4, wherein the bottom plate (202) is opposite to the circuit board (30), a surface of the bottom plate (202) close to the liquid cooling plate (10) is provided with a plurality of supporting protrusions (2021), and the plurality of supporting protrusions (2021) are located between the bottom plate (202) and the circuit board (30) and connected with the circuit board (30).

6. The electronic device according to any of claims 1 to 5, wherein the circuit board (30) is connected to the connector (40) by a wire (80).

7. The electronic device according to any of claims 1 to 6, wherein an end of the connector (40) located in the receiving cavity (A) is immersed in the insulating liquid (50).

8. The electronic device according to any one of claims 1 to 7, wherein at least one of the inside of the liquid-cooled plate (10) and the surface of the liquid-cooled plate (10) near the circuit board (30) has a fin (101).

9. An electronic device according to any of claims 1-8, wherein the insulating liquid (50) is a fluorinated liquid or a silicone oil.

10. An on-vehicle heat dissipation system, characterized by comprising a cooling liquid circulation pipeline (900) and the electronic device (100) according to any one of claims 1 to 9, wherein the liquid cooling plate (10) is communicated with the cooling liquid circulation pipeline (900).

11. The vehicle cooling system according to claim 10, wherein the coolant circulation line (900) comprises a battery cooling plate (970), the battery cooling plate (970) is used for cooling a battery of the vehicle, and the coolant cooling plate (10) is connected in parallel or in series with the battery cooling plate (970).

12. A vehicle characterized by comprising the on-board heat dissipation system of claim 10 or 11.