CN221228066U - Heat radiation structure and power converter - Google Patents
Heat radiation structure and power converter Download PDFInfo
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- CN221228066U CN221228066U CN202322612475.3U CN202322612475U CN221228066U CN 221228066 U CN221228066 U CN 221228066U CN 202322612475 U CN202322612475 U CN 202322612475U CN 221228066 U CN221228066 U CN 221228066U
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- 230000005855 radiation Effects 0.000 title claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 166
- 239000007788 liquid Substances 0.000 claims abstract description 152
- 230000017525 heat dissipation Effects 0.000 claims abstract description 78
- 238000005057 refrigeration Methods 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000002826 coolant Substances 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000000565 sealant Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
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Abstract
The utility model discloses a heat radiation structure and a power converter, which comprises a liquid cooling heat exchange cavity, a refrigerating device and a circulating pipeline, wherein the liquid cooling heat exchange cavity is arranged in an electronic device and is used for loading a liquid cooling working medium to carry out liquid cooling heat radiation on the electronic device; the refrigerating device is used for refrigerating the liquid cooling working medium; the circulating pipeline is used for communicating the liquid cooling heat exchange cavity with the refrigerating device: in addition, the liquid cooling working medium which completes heat exchange in the liquid cooling heat exchange cavity can enter the refrigerating device through the circulating pipeline, and the liquid cooling working medium which completes refrigeration in the refrigerating device can return to the liquid cooling heat exchange cavity through the circulating pipeline. This heat radiation structure carries out circulative cooling heat dissipation to electronic device through liquid cooling heat dissipation mode, compares in traditional forced air cooling heat dissipation mode, has promoted the heat dissipation ability greatly, has effectively avoided the heat dissipation power not enough and can't satisfy the problem of heat dissipation demand.
Description
Technical Field
The present utility model relates to the field of electronic device heat dissipation technology, and more particularly, to a heat dissipation structure and a power converter.
Background
The power converter can be divided into an external heat dissipation cavity and an internal closed cavity from the aspect of a heat dissipation structure, wherein a heat dissipation shell of part of electronic devices (such as magnetic devices) is positioned in the external heat dissipation cavity, and the heat dissipation means commonly used at present for the part of electronic devices are air cooling heat dissipation modes such as air cooling heat dissipation of a radiator or natural air cooling. However, as the power density of the power converter is larger and larger, the existing air cooling heat dissipation mode has insufficient heat dissipation power, and cannot meet the heat dissipation requirement of the electronic device in the external heat dissipation cavity.
In summary, how to solve the problem that the heat dissipation power of the heat dissipation structure of the electronic device of the power converter is insufficient to meet the heat dissipation requirement has become a technical problem to be solved by those skilled in the art.
Disclosure of utility model
In view of the above, the present utility model provides a heat dissipation structure and a power converter, so as to solve the problem that the heat dissipation power of the heat dissipation structure of the electronic device of the power converter is insufficient to meet the heat dissipation requirement.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
A heat dissipation structure for an electronic device, comprising:
the liquid cooling heat exchange cavity is arranged in the electronic device and is used for loading a liquid cooling working medium to perform liquid cooling heat dissipation on the electronic device;
The refrigerating device is used for refrigerating the liquid cooling working medium;
The circulating pipeline is used for communicating the liquid cooling heat exchange cavity with the refrigerating device;
The liquid cooling working medium absorbs heat, evaporates and gasifies in the liquid cooling heat exchange cavity and enters the condenser through the circulating pipeline, and the gasified liquid cooling working medium is in the heat release liquefaction of the condenser and flows back to the liquid cooling heat exchange cavity through the circulating pipeline.
Optionally, the electronic device comprises an outer shell and a heating element arranged in the outer shell, and the outer shell and the wall of the electronic case installed by the outer shell enclose the liquid cooling heat exchange cavity; or the self shell wall of the outer shell is surrounded to form the liquid cooling heat exchange cavity.
Optionally, the heating component is soaked in the liquid cooling working medium loaded in the liquid cooling heat exchange cavity.
Optionally, the liquid cooling working medium is insulating liquid or non-insulating liquid, and when the liquid cooling working medium is non-insulating liquid, insulating paint is coated outside the heating element.
Optionally, the heating element includes a magnetic core and/or a coil.
Optionally, the electronic device is a magnetic component.
Optionally, the electronic device includes an inner housing, an outer housing, and a heat generating component;
The heating element is arranged in the inner shell, and a surrounding space formed between the inner shell and the outer shell forms the liquid cooling heat exchange cavity.
Optionally, a flow channel structure is arranged on the inner side of the liquid cooling heat exchange cavity, and the flow channel structure is arranged on the outer shell wall of the inner shell and/or the inner shell wall of the outer shell;
and/or the shell wall of the outer shell is provided with radiating fins.
Optionally, the refrigerating device comprises at least one condenser, the condenser is communicated with the liquid cooling heat exchange cavity through the circulating pipeline, and the installation height of the condenser is higher than that of the liquid cooling heat exchange cavity;
The liquid cooling working medium loaded in the liquid cooling heat exchange cavity is a phase change working medium, the phase change working medium is heated, evaporated and gasified in the liquid cooling heat exchange cavity and enters the condenser through the circulating pipeline, and the condenser can cool and liquefy the gasified phase change working medium and flow back to the liquid cooling heat exchange cavity through the circulating pipeline.
Optionally, the refrigerating device comprises a cooler for cooling the liquid cooling working medium, the circulating pipeline comprises a first communication pipeline and a second communication pipeline, the first communication pipeline is used for conveying the liquid cooling working medium in the liquid cooling heat exchange cavity to the cooler, and the second communication pipeline is used for conveying the liquid cooling working medium in the cooler to the liquid cooling heat exchange cavity.
Optionally, the cooler includes the cooling pond and is used for right the cooling fan of cooling pond, first intercommunication pipeline with the inlet intercommunication of cooling pond, the second intercommunication pipeline with the liquid outlet intercommunication of cooling pond.
Optionally, a power device is arranged on the first communication pipeline and/or the second communication pipeline, and the power device is used for providing power for liquid cooling working medium circulation.
Compared with the introduction of the background technology, the heat radiation structure is applied to an electronic device and comprises a liquid cooling heat exchange cavity, a refrigerating device and a circulating pipeline, wherein the liquid cooling heat exchange cavity is arranged in the electronic device and is used for loading liquid cooling working medium to carry out liquid cooling heat radiation on the electronic device; the refrigerating device is used for refrigerating the liquid cooling working medium; the circulating pipeline is used for communicating the liquid cooling heat exchange cavity with the refrigerating device: in addition, the liquid cooling working medium which completes heat exchange in the liquid cooling heat exchange cavity can enter the refrigerating device through the circulating pipeline, and the liquid cooling working medium which completes refrigeration in the refrigerating device can return to the liquid cooling heat exchange cavity through the circulating pipeline. This heat radiation structure, in the practical application in-process, through design liquid cooling heat exchange cavity in electronic device, this liquid cooling heat exchange cavity passes through circulation pipeline and refrigerating plant intercommunication, and the liquid cooling working medium is loaded in the liquid cooling heat exchange cavity, this liquid cooling working medium can absorb the heat that electronic device produced, liquid cooling working medium after the heat transfer can get into refrigerating plant through circulation pipeline, can cool off liquid cooling working medium through refrigerating plant, accomplish refrigerated liquid cooling working medium and can get back to liquid cooling heat exchange cavity through circulation pipeline again, thereby can carry out the circulative cooling heat dissipation to electronic device. Compared with the traditional air cooling heat dissipation mode, the liquid cooling heat dissipation mode of the electronic device has the advantages that the heat dissipation capacity is greatly improved, and the problem that the heat dissipation requirement cannot be met due to insufficient heat dissipation power is effectively solved.
In addition, the utility model also provides a power converter, which comprises an electronic case, an electronic device arranged in the electronic case and a heat dissipation structure for dissipating heat of the electronic device, wherein the heat dissipation structure is the heat dissipation structure described in any scheme. Because the heat dissipation structure has the above technical effects, the power converter with the heat dissipation structure should also have corresponding technical effects, and will not be described herein.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a first structure of a heat dissipation structure according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a second structure of a heat dissipation structure according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a structure of a flow channel disposed in a liquid cooling heat exchange cavity according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of a third structure of a heat dissipation structure according to an embodiment of the present utility model;
fig. 5 is a schematic diagram of a fourth structure of a heat dissipation structure according to an embodiment of the present utility model.
Wherein, in fig. 1-5:
The electronic device 1, an outer shell 11, a heating element 12, an inner shell 13, an outer shell 14 and a sealant 15;
The liquid cooling heat exchange cavity 2 and the flow channel structure 21;
Liquid cooling working medium 3;
A refrigerating device 4, a condenser 41, a cooler 42, a cooling tank 421 and a cooling fan 422;
A circulation line 5, a first communication line 51, a second communication line 52;
an electronic cabinet 6;
A power device 7;
an external heat dissipation cavity 8.
Detailed Description
The core of the utility model is to provide a heat dissipation structure and a power converter, so as to solve the problem that the heat dissipation power of the heat dissipation structure of the electronic device of the power converter is insufficient to meet the heat dissipation requirement.
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model specifically provides a heat dissipation structure, which is applied to an electronic device 1 and is mainly used for dissipating heat of the electronic device 1, wherein the electronic device 1 may be, but is not limited to, an electromagnetic component or the like, and those skilled in the art will understand that the electronic device 1 may be specifically mounted on a power converter or other equipment, such as an inverter or the like. The power converter comprises an external heat dissipation cavity 8 and an internal closed cavity, wherein the heat dissipation structure is mainly used for dissipating heat of the electronic device 1 in the external heat dissipation cavity 8, and can be applied to heat dissipation of the electronic device in the internal closed cavity, and can be selectively arranged according to actual requirements in the practical application process.
Specifically, the heat dissipation structure comprises a liquid cooling heat exchange cavity 2, a refrigerating device 4 and a circulating pipeline 5, wherein the liquid cooling heat exchange cavity 2 is arranged in the electronic device 1 and is used for loading a liquid cooling working medium 3 to perform liquid cooling heat dissipation on the electronic device 1; the refrigerating device 4 is used for refrigerating the liquid cooling working medium 3; the circulating pipeline 5 is used for communicating the liquid cooling heat exchange cavity 2 with the refrigerating device 4; in addition, the liquid cooling working medium 3 which completes heat exchange in the liquid cooling heat exchange cavity 2 can enter the refrigerating device 4 through the circulating pipeline 5, and the liquid cooling working medium 3 which completes refrigeration in the refrigerating device 4 can return to the liquid cooling heat exchange cavity 2 through the circulating pipeline 5.
This heat radiation structure, in the practical application in-process, through design liquid cooling heat transfer cavity 2 in electronic device 1, this liquid cooling heat transfer cavity 2 communicates with refrigerating plant 4 through circulation pipeline 5, and be equipped with liquid cooling working medium 3 in the liquid cooling heat transfer cavity 2, this liquid cooling working medium 3 can absorb the heat that electronic device 1 produced, liquid cooling working medium 3 after the heat transfer can get into refrigerating plant 4 through circulation pipeline 5, can cool off liquid cooling working medium 3 through refrigerating plant 4, accomplish refrigerated liquid cooling working medium 3 and can get back to liquid cooling heat transfer cavity 2 through circulation pipeline 5 again, thereby can carry out the circulative cooling heat dissipation to electronic device 1. Compared with the traditional air cooling heat dissipation mode, the liquid cooling heat dissipation mode of the electronic device has the advantages that the heat dissipation capacity is greatly improved, and the problem that the heat dissipation requirement cannot be met due to insufficient heat dissipation power is effectively solved.
In some specific embodiments, referring to fig. 1 and 4, the electronic device 1 may specifically include an outer shell 11 and a heating component 12 disposed in the outer shell 11, where the outer shell 11 and a wall of an electronic chassis 6 mounted therein enclose a liquid cooling heat exchange cavity 2, and at this time, the outer shell 11 and the wall of the electronic chassis 6 may be sealed and connected by a sealant 15 to form the liquid cooling heat exchange cavity 2. It can be understood that the above-mentioned outer shell 11 can also be designed to form the liquid cooling heat exchange cavity 2 by surrounding its own shell wall, the leading-out position of the corresponding components and parts can be sealed by the auxiliary of sealant at this time, the advantage of this structural form is that the leak of liquid is better, but the disadvantage is that the corresponding components and parts are inconvenient to install in the outer shell 11; in addition, the outer shell 11 can be designed into a structure form of an opening cavity, and the structure form of a sealing plate is designed by matching with the opening side, so that the installation of internal components can be met, and the tightness of the liquid cooling heat exchange cavity 2 is ensured more easily. In the practical application process, the configuration can be specifically configured according to practical requirements, and the configuration is not particularly limited herein. In addition, the heating component 12 can be specifically soaked in the liquid cooling working medium 3 loaded in the liquid cooling heat exchange cavity 2, and the heat transfer efficiency between the heating component 12 and the liquid cooling working medium 3 is higher in a soaking mode, so that the heat dissipation efficiency of the electronic device 1 is improved.
It should be noted that, the above-mentioned liquid cooling working medium 3 may be an insulating liquid, or may be a non-insulating liquid, and when the liquid cooling working medium 3 is a non-insulating liquid, the exterior of the heating element 12 may be coated with an insulating paint, so as to ensure normal use of the heating element 12.
In some specific embodiments, the electronic device 1 may be a magnetic component, where the corresponding heat generating component 12 may include a magnetic core and/or a coil, that is, may include a magnetic core, may include a coil, and may include both a magnetic core and a coil. Of course, as an electrical component, when the liquid-cooled working fluid 3 is a non-insulating liquid, the outside of the magnetic core and the coil needs to be impregnated with an insulating varnish. It should be noted that the above magnetic component is merely an example of the electronic device 1 according to the embodiment of the present utility model, and other electronic devices with heat dissipation requirements may be used in the actual application process, which is not limited in detail herein.
In other specific embodiments, as shown with reference to fig. 2, 3 and 5, the electronic device 1 may also be configured to include an inner housing 13, an outer housing 14 and a heat-generating component 12; wherein, the heating element 12 is arranged in the inner shell 13, and the enclosed space formed between the inner shell 13 and the outer shell 14 forms the liquid cooling heat exchange cavity 2. The inner shell 13 and the outer shell 14 may be designed into an integrally formed structure, such as a structure formed by inflation, or may be designed into a split fixed connection structure, such as a split sealing connection manner of the inner shell and the outer shell. In the actual application process, the arrangement can be selected according to the actual requirements. By designing the liquid cooling heat exchange cavity 2 into the structure, on the basis that the liquid cooling heat exchange cavity 2 can keep heat transfer with the electronic device 1, related components in the electronic device 1 are separated from the liquid cooling heat exchange cavity 2, and the performance index requirements of the related components in the electronic device 1 are reduced.
In a further embodiment, referring to fig. 3, the inner side of the liquid cooling heat exchange cavity 2 may be further provided with a flow channel structure 21, where the flow channel structure 21 may be specifically disposed on the outer shell wall of the inner shell 13 or may be designed on the inner shell wall of the outer shell 14, and the flow channel structure may specifically be, but is not limited to, a structural form of flow guide plates disposed at intervals. Through this runner structure of design for the heat transfer area of liquid cooling working medium in the liquid cooling heat transfer cavity 2 and electronic device 2 promotes greatly, helps promoting heat exchange efficiency. In addition, in order to further enhance the heat dissipation effect of the electronic device 1, heat dissipation fins may be further disposed on the housing wall of the outer housing 14.
In some specific embodiments, referring to fig. 1 and 2, the refrigerating apparatus 4 may specifically include at least one condenser 41, where the condenser 41 is in communication with the liquid-cooled heat exchange cavity 2 through the circulation line 5, and the condenser 41 is installed at a higher level than the liquid-cooled heat exchange cavity 2; the liquid cooling working medium 3 absorbs heat, evaporates and gasifies in the liquid cooling heat exchange cavity 2 and enters the condenser 41 through the circulating pipeline 5, and the gasified liquid cooling working medium 3 is subjected to heat radiation and liquefaction in the condenser 41 and flows back to the liquid cooling heat exchange cavity 2 through the circulating pipeline 5. Through designing into this kind of structural style, heat radiation structure can form the self-loopa of liquid cooling working medium 3 through the thermosiphon principle, need not additionally to provide power device for liquid cooling working medium 3 circulation. The working principle is as follows: the electronic device 1 and the liquid cooling heat exchange cavity 2 arranged in the electronic device constitute an evaporator, and the liquid cooling working medium in the evaporator absorbs heat generated by the electronic device 1 (mainly the heating component in the electronic device), so that the liquid cooling working medium is changed into gas from liquid, and then rises into the condenser 41 through the circulating pipeline 5, the specific structure of the condenser 41 can be in the form of a plurality of condensing pipes, and the condenser 41 is preferably further cooled by the cooling fan 422, and the gaseous working medium can be changed into liquid after being cooled by the condenser and flows back to the evaporator to form liquid circulation.
It will be understood, of course, that the above-mentioned refrigerating device 4 may be designed not to require the power device 7, but also to have the power device 7 as shown in fig. 4 and 5, for example, the refrigerating device 4 may include a cooler 42 for cooling the liquid-cooled working medium 3, the circulation line 5 includes a first communication line 51 and a second communication line 52, the first communication line 51 is used for conveying the liquid-cooled working medium 3 in the liquid-cooled heat exchange cavity 2 to the cooler 42, and the second communication line 52 is used for conveying the liquid-cooled working medium 3 in the cooler 42 to the liquid-cooled heat exchange cavity 2. The cooler 42 may specifically include a cooling tank 421 and a cooling fan 422 for cooling the cooling tank 421, where the first communication pipeline 51 is communicated with a liquid inlet of the cooling tank 421, and the second communication pipeline 52 is communicated with a liquid outlet of the cooling tank 421. It should be understood, of course, that the above-mentioned structures of the cooling tank 421 and the cooling fan 422 are merely examples of the structure of the cooler 42 according to the embodiments of the present utility model, and other structures of the cooler 42 may be designed in the practical application process, so long as the cooling of the liquid cooling medium 3 can be achieved, which is not limited in detail herein. The power device 7 is used for circularly providing power for the liquid cooling working medium 3, the specific design position of the power device can be selected and designed on the first communication pipeline 51, the second communication pipeline 52 and the first communication pipeline 51 and the second communication pipeline 52, the power devices 7 can be cooperatively coupled, the power devices 7 can be independently controlled to work, and the power device can be configured according to actual requirements in the practical application process. The power unit 7 may be a pump body, a main cooling line with power, or the power unit 7 may be shared by liquid cooling circulation lines corresponding to other heat generating devices.
In addition, the utility model also provides a power converter, which comprises an electronic case, an electronic device arranged in the electronic case and a heat dissipation structure for dissipating heat of the electronic device, wherein the heat dissipation structure is the heat dissipation structure described in any scheme. Because the heat dissipation structure has the above technical effects, the power converter with the heat dissipation structure should also have corresponding technical effects, and will not be described herein.
It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
It should be appreciated that the use of "systems," "devices," "units," and/or "modules" in this disclosure is but one way to distinguish between different components, elements, parts, portions, or assemblies at different levels. However, if other words can achieve the same purpose, the word can be replaced by other expressions.
As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The inclusion of an element defined by the phrase "comprising one … …" does not preclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.
Wherein, in the description of the embodiments of the present application, unless otherwise indicated, "/" means or, for example, a/B may represent a or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present application, "plurality" means two or more than two.
In addition, the terms "first," "second," are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
If a flowchart is used in the present application, the flowchart is used to describe the operations performed by a system according to an embodiment of the present application. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.
The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the core concepts of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.
Claims (13)
1. A heat dissipation structure for an electronic device (1), comprising:
the liquid cooling heat exchange cavity (2) is arranged in the electronic device (1) and is used for loading a liquid cooling working medium (3) to perform liquid cooling heat dissipation on the electronic device (1);
the refrigerating device (4) is used for refrigerating the liquid cooling working medium (3);
The circulating pipeline (5) is used for communicating the liquid cooling heat exchange cavity (2) with the refrigerating device (4);
The liquid cooling working medium (3) for completing heat exchange in the liquid cooling heat exchange cavity (2) can enter the refrigerating device (4) through the circulating pipeline (5), and the liquid cooling working medium (3) for completing refrigeration in the refrigerating device (4) can return to the liquid cooling heat exchange cavity (2) through the circulating pipeline (5).
2. The heat dissipation structure as defined in claim 1, wherein the electronic device (1) includes an outer shell (11) and a heating component (12) disposed in the outer shell (11), and the outer shell (11) and a wall of an electronic chassis (6) mounted therewith enclose to form the liquid cooling heat exchange cavity (2); or, the liquid cooling heat exchange cavity (2) is formed by surrounding the self shell wall of the outer shell (11).
3. The heat dissipation structure as defined in claim 2, wherein the heat generating component (12) is immersed in a liquid cooling medium (3) loaded in the liquid cooling heat exchange cavity (2).
4. A heat dissipating structure according to claim 3, wherein the liquid cooling medium (3) is an insulating liquid or a non-insulating liquid, and when the liquid cooling medium (3) is a non-insulating liquid, the heat generating component (12) is coated with an insulating paint.
5. The heat dissipating structure of claim 2, wherein the heat generating component (12) comprises a magnetic core and/or a coil.
6. The heat spreading structure according to claim 1, wherein the electronic device (1) is a magnetic component.
7. The heat dissipating structure of claim 1, wherein the electronic device (1) comprises an inner housing (13), an outer housing (14) and a heat generating component (12);
The heating element (12) is arranged in the inner shell (13), and a surrounding space formed between the inner shell (13) and the outer shell (14) forms the liquid cooling heat exchange cavity (2).
8. The heat radiation structure according to claim 7, characterized in that a flow channel structure (21) is arranged on the inner side of the liquid cooling heat exchange cavity (2), and the flow channel structure (21) is arranged on the outer shell wall of the inner shell (13) and/or the inner shell wall of the outer shell (14);
and/or the shell wall of the outer shell (14) is provided with radiating fins.
9. The heat radiation structure according to any one of claims 1-8, characterized in that the refrigerating device (4) comprises at least one condenser (41), the condenser (41) is communicated with the liquid-cooled heat exchange cavity (2) through the circulation pipeline (5), and the mounting height of the condenser (41) is higher than that of the liquid-cooled heat exchange cavity (2);
The liquid cooling working medium (3) absorbs heat, evaporates and gasifies in the liquid cooling heat exchange cavity (2) and enters the condenser (41) through the circulating pipeline (5), and the gasified liquid cooling working medium (3) is liquefied by heat release of the condenser (41) and flows back to the liquid cooling heat exchange cavity (2) through the circulating pipeline (5).
10. The heat radiation structure according to any one of claims 1-8, characterized in that the refrigerating device (4) comprises a cooler (42) for cooling the liquid-cooled working medium (3), the circulation line (5) comprises a first communication line (51) and a second communication line (52), the first communication line (51) is used for conveying the liquid-cooled working medium (3) in the liquid-cooled heat exchange cavity (2) to the cooler (42), and the second communication line (52) is used for conveying the liquid-cooled working medium (3) in the cooler (42) to the liquid-cooled heat exchange cavity (2).
11. The heat radiation structure according to claim 10, wherein the cooler (42) includes a cooling tank (421) and a cooling fan (422) for cooling the cooling tank (421), the first communication pipe (51) communicates with a liquid inlet of the cooling tank (421), and the second communication pipe (52) communicates with a liquid outlet of the cooling tank (421).
12. The heat dissipation structure as defined in claim 10, characterized in that a power device (7) is provided on the first communication pipeline (51) and/or the second communication pipeline (52), and the power device (7) is used for providing power for the circulation of the liquid cooling working medium (3).
13. A power converter comprising an electronic chassis (6), an electronic device (1) arranged in the electronic chassis (6), and a heat dissipation structure for dissipating heat from the electronic device (1), characterized in that the heat dissipation structure is a heat dissipation structure as claimed in any one of claims 1-12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322612475.3U CN221228066U (en) | 2023-09-25 | 2023-09-25 | Heat radiation structure and power converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322612475.3U CN221228066U (en) | 2023-09-25 | 2023-09-25 | Heat radiation structure and power converter |
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| Publication Number | Publication Date |
|---|---|
| CN221228066U true CN221228066U (en) | 2024-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202322612475.3U Active CN221228066U (en) | 2023-09-25 | 2023-09-25 | Heat radiation structure and power converter |
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| CN (1) | CN221228066U (en) |
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- 2023-09-25 CN CN202322612475.3U patent/CN221228066U/en active Active
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