WO2022075108A1 - Thermal diffusion device - Google Patents

Abstract

A vapor chamber (1), which is one embodiment of this thermal diffusion device, is provided with a casing (10), a working medium (20), and a wick (30). The wick (30) includes a plurality of wick bodies (40) extending linearly from an evaporation unit (EP), at least some of the plurality of wick bodies (40) being in contact with at least one inner wall surface from among a first inner wall surface (11a) and a second inner wall surface (12a). An evaporation flow path (50) is formed between at least one set of adjacent wick bodies (40). In the adjacent wick bodies (40), a first liquid flow path (51) is formed in a space bounded by at least part of each of the wick bodies (40) and part of the casing (10). In at least one surface from among the surfaces where the wick bodies (40) are in contact with the first inner wall surface (11a) or the second inner wall surface (12a), a groove part is provided along the direction in which the wick bodies (40) extend, whereby a second liquid flow path (52) is formed.

Description

Heat diffusion device

The present invention relates to a heat diffusion device.

In recent years, the amount of heat generated has increased due to the high integration and high performance of devices. In addition, as the miniaturization of products progresses, the heat generation density increases, so heat dissipation measures are important. This situation is especially noticeable in the field of mobile terminals such as smartphones and tablets. As the heat countermeasure member, a graphite sheet or the like is often used, but since the heat transport amount is not sufficient, the use of various heat countermeasure members is being considered. Above all, the use of a vapor chamber, which is a planar heat pipe, is being studied as a heat diffusion device capable of diffusing heat very effectively.

The vapor chamber has a structure in which a working medium and a wick that transports the working medium by capillary force are enclosed inside the housing. The working medium absorbs heat from the heat generating element in the evaporation unit that absorbs heat from the heat generating element and evaporates in the vapor chamber, then moves in the vapor chamber, is cooled, and returns to the liquid phase. The working medium that has returned to the liquid phase moves to the evaporation part on the heat generating element side again by the capillary force of the wick, and cools the heat generating element. By repeating this, the vapor chamber operates independently without having external power, and can diffuse heat two-dimensionally at high speed by utilizing the latent heat of vaporization and the latent heat of condensation of the working medium.

The vapor chamber is also required to be thinner in order to support the thinner mobile terminals such as smartphones and tablets. In such a thin vapor chamber, it becomes difficult to secure mechanical strength and heat transfer efficiency.

Therefore, as described in Patent Documents 1 and 2, in order to secure the mechanical strength of the housing constituting the vapor chamber, the wick arranged inside the housing is to maintain the shape of the housing. It has been proposed to be used as a support for.

In the heat pipe described in Patent Document 1, the first wick portion and the second wick portion are arranged at intervals in the left-right direction, and a liquid pool portion formed between the first wick portion and the second wick portion. Is filled with the working medium of the liquid phase. According to Patent Document 1, according to the above configuration, the working medium of the liquid phase can be reliably returned to the evaporating part through the liquid pool part, so that the flow of the working medium of the liquid phase can be prevented from being stagnant. It is said that the decrease in heat transport efficiency can be suppressed.

In the vapor chamber described in Patent Document 2, a pair of inner wall surfaces facing each other of the housing, a side surface of the wick that does not contact the pair of inner wall surfaces, and a facing surface formed with a gap from the side surface of the wick. In the enclosed space, a liquid pool flow path of condensed working fluid is formed. According to Patent Document 2, by combining the wick and the liquid pool flow path, it is possible to create a state in which the liquid is always supplied to the wick, so that the pressure loss of the liquid as a whole of the liquid flow path can be reduced, and the pressure loss of the liquid can be reduced. As a result, it is said that the maximum heat transport amount of the vapor chamber can be increased.

Japanese Unexamined Patent Publication No. 2018-185110 Japanese Patent No. 6442594

As described in Patent Documents 1 and 2, if a liquid flow path is formed between the wicks, it is possible to prevent the flow of the working medium of the liquid phase from being stagnant. However, if the liquid flow path is increased in order to increase the maximum heat transport amount of the vapor chamber, the thermal conductivity of the vapor chamber may decrease.

The above problem is not limited to the vapor chamber, but is a problem common to heat diffusion devices capable of diffusing heat by the same configuration as the vapor chamber.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a heat diffusion device in which a decrease in thermal conductivity is suppressed and a maximum heat transport amount is large. It is also an object of the present invention to provide an electronic device provided with the heat diffusion device.

The heat diffusion device of the present invention has a housing having a first inner wall surface and a second inner wall surface facing each other in the thickness direction, an actuating medium enclosed in the internal space of the housing, and the internal space of the housing. Equipped with a placed wick. The housing has an evaporation unit that evaporates the working medium. The wick includes a plurality of wicks extending linearly from the evaporation portion and at least partially in contact with the inner wall surface of at least one of the first inner wall surface and the second inner wall surface. A steam flow path is formed between at least one set of adjacent wick bodies. In the adjacent wick bodies, a first liquid flow path is formed in a space surrounded by at least a part of each of the wick bodies and a part of the housing. A second liquid flow path is formed by providing a groove along the direction in which the wick body extends on at least one of the surfaces of the wick body in contact with the first inner wall surface or the second inner wall surface. Has been done.

The electronic device of the present invention includes the heat diffusion device of the present invention.

According to the present invention, it is possible to provide a heat diffusion device in which a decrease in thermal conductivity is suppressed and a maximum heat transport amount is large.

FIG. 1 is a perspective view schematically showing an example of a vapor chamber according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II of the vapor chamber shown in FIG. FIG. 3 is a cross-sectional view taken along the line III-III of the vapor chamber shown in FIG. FIG. 4 is an enlarged cross-sectional view of the portion shown by IV in FIG. FIG. 5 is a cross-sectional view schematically showing a first modification example of the position where the second liquid flow path is formed. FIG. 6 is a cross-sectional view schematically showing a second modification example of the position where the second liquid flow path is formed. FIG. 7 is a cross-sectional view schematically showing a modified example of the cross-sectional shape of the second liquid flow path. FIG. 8 is a cross-sectional view schematically showing an example of a vapor chamber according to a second embodiment of the present invention. FIG. 9 is a cross-sectional view schematically showing an example of a vapor chamber according to a third embodiment of the present invention. FIG. 10 is a cross-sectional view schematically showing an example of a vapor chamber according to a fourth embodiment of the present invention. FIG. 11 is a cross-sectional view schematically showing an example of a vapor chamber according to a fifth embodiment of the present invention. FIG. 12 is a cross-sectional view schematically showing an example of a vapor chamber according to a sixth embodiment of the present invention. FIG. 13 is a plan view schematically showing an example of the vapor chamber according to the seventh embodiment of the present invention. FIG. 14 is a plan view schematically showing an example of the vapor chamber according to the eighth embodiment of the present invention. FIG. 15 is a plan view schematically showing an example of the vapor chamber according to the ninth embodiment of the present invention. FIG. 16 is a plan view schematically showing an example of the vapor chamber according to the tenth embodiment of the present invention. FIG. 17 is a plan view schematically showing an example of the vapor chamber according to the eleventh embodiment of the present invention. FIG. 18 is a cross-sectional view schematically showing an example of a vapor chamber according to the eleventh embodiment of the present invention. FIG. 19 is a cross-sectional view schematically showing an example of a vapor chamber according to a twelfth embodiment of the present invention. FIG. 20 is a cross-sectional view schematically showing an example of a vapor chamber according to a thirteenth embodiment of the present invention. FIG. 21 is a cross-sectional view schematically showing an example of a vapor chamber according to the 14th embodiment of the present invention. FIG. 22 is a cross-sectional view schematically showing an example of the vapor chamber according to the fifteenth embodiment of the present invention. FIG. 23 is a cross-sectional view schematically showing another example of the vapor chamber according to the fifteenth embodiment of the present invention. FIG. 24 is a plan view schematically showing an example of the vapor chamber according to the 16th embodiment of the present invention. FIG. 25 is a plan view schematically showing an example of the vapor chamber according to the 17th embodiment of the present invention. FIG. 26 is a cross-sectional view schematically showing an example of a vapor chamber according to an eighteenth embodiment of the present invention. FIG. 27 is an enlarged cross-sectional view of the portion shown by XXVII in FIG. 26.

Hereinafter, the heat diffusion device of the present invention will be described.
However, the present invention is not limited to the following configuration, and can be appropriately modified and applied without changing the gist of the present invention. It should be noted that a combination of two or more of the individual desirable configurations of the present invention described below is also the present invention.

It goes without saying that each embodiment shown below is an example, and partial replacement or combination of the configurations shown in different embodiments is possible. In the second and subsequent embodiments, the description of the matters common to the first embodiment will be omitted, and only the differences will be described. In particular, the same action and effect due to the same configuration will not be mentioned sequentially for each embodiment.

In the following description, when each embodiment is not particularly distinguished, it is simply referred to as "heat diffusion device of the present invention".

Hereinafter, a vapor chamber will be described as an example of an embodiment of the heat diffusion device of the present invention. The heat diffusion device of the present invention can also be applied to a heat diffusion device such as a heat pipe.

The drawings shown below are schematic, and their dimensions and aspect ratio scale may differ from the actual product.

[First Embodiment]
FIG. 1 is a perspective view schematically showing an example of a vapor chamber according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II of the vapor chamber shown in FIG. FIG. 3 is a cross-sectional view taken along the line III-III of the vapor chamber shown in FIG.

The vapor chamber 1 shown in FIG. 1 includes a hollow housing 10 that is hermetically sealed. As shown in FIG. 3, the housing 10 has a first inner wall surface 11a and a second inner wall surface 12a facing each other in the thickness direction Z. As shown in FIGS. 2 and 3, the vapor chamber 1 further includes an actuating medium 20 enclosed in the internal space of the housing 10 and a wick 30 arranged in the internal space of the housing 10.

As shown in FIG. 2, the housing 10 is provided with an evaporation unit EP that evaporates the enclosed working medium 20. Further, the housing 10 may be set with a condensation portion CP for condensing the evaporated working medium 20. As shown in FIG. 1, a heat source HS, which is a heat generating element, is arranged on the outer wall surface of the housing 10. Examples of the heat source HS include electronic components of electronic devices, such as a central processing unit (CPU). In the internal space of the housing 10, the portion near the heat source HS and heated by the heat source HS corresponds to the evaporation portion EP. On the other hand, the portion away from the evaporation portion EP corresponds to the condensation portion CP. Further, the evaporated working medium 20 can be condensed other than the condensed portion CP. In the present embodiment, a portion where the evaporated working medium 20 is particularly easy to condense is expressed as a condensing portion CP.

The vapor chamber 1 is planar as a whole. That is, the housing 10 is planar as a whole. Here, the "plane" includes a plate shape and a sheet shape, and the dimension in the width direction X (hereinafter referred to as "width") and the dimension in the length direction Y (hereinafter referred to as "length") are in the thickness direction Z. It means a shape that is considerably larger than a dimension (hereinafter referred to as a thickness or a height), for example, a shape having a width and a length of 10 times or more, preferably 100 times or more the thickness.

The size of the vapor chamber 1, that is, the size of the housing 10 is not particularly limited. The width and length of the vapor chamber 1 can be appropriately set according to the intended use. The width and length of the vapor chamber 1 are, for example, 5 mm or more and 500 mm or less, 20 mm or more and 300 mm or less, or 50 mm or more and 200 mm or less, respectively. The width and length of the vapor chamber 1 may be the same or different.

It is preferable that the housing 10 is composed of the first sheet 11 and the second sheet 12 facing each other to which the outer edges are joined. The materials constituting the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for use as a vapor chamber, such as thermal conductivity, strength, flexibility, and flexibility. The material constituting the first sheet 11 and the second sheet 12 is preferably a metal, for example, copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing them as a main component, and particularly preferably copper. Is. The materials constituting the first sheet 11 and the second sheet 12 may be the same or different, but are preferably the same.

The first sheet 11 and the second sheet 12 are joined to each other at their outer edges. The joining method is not particularly limited, but for example, laser welding, resistance welding, diffusion welding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic welding, or resin encapsulation can be used, and is preferable. Can use laser welding, resistance welding or low welding.

The thicknesses of the first sheet 11 and the second sheet 12 are not particularly limited, but are preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and further preferably 40 μm or more and 60 μm or less, respectively. The thicknesses of the first sheet 11 and the second sheet 12 may be the same or different. Further, the thickness of each of the first sheet 11 and the second sheet 12 may be the same throughout, or a part thereof may be thin.

The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, in the example shown in FIG. 3, the first sheet 11 has a flat plate shape having a constant thickness, and the second sheet 12 has a shape in which the outer edge portion is thicker than the portion other than the outer edge portion.

The thickness of the entire vapor chamber 1 is not particularly limited, but is preferably 50 μm or more and 500 μm or less.

The working medium 20 is not particularly limited as long as it can cause a gas-liquid phase change in the environment inside the housing 10, and for example, water, alcohols, CFC substitutes, or the like can be used. For example, the working medium is an aqueous compound, preferably water.

The wick 30 includes a plurality of wick bodies 40 extending linearly from the evaporation unit EP. For example, the wick body 40 extends from the evaporation portion EP to the condensation portion CP. At least a part of the wick body 40 is in contact with at least one inner wall surface of the first inner wall surface 11a and the second inner wall surface 12a of the housing 10. In the present embodiment, the wick body 40 supports the first inner wall surface 11a and the second inner wall surface 12a of the housing 10 from the inside. By arranging the wick 30 including the plurality of wick bodies 40 in the internal space of the housing 10, it is possible to absorb the impact from the outside of the housing 10 while ensuring the mechanical strength of the housing 10.

In the example shown in FIG. 3, the wick body 40 constituting the wick 30 is in contact with the first inner wall surface 11a and the second inner wall surface 12a. The wick body 40 may be in contact with either the first inner wall surface 11a or the second inner wall surface 12a.

In this embodiment, at least one set of adjacent wick bodies 40 includes a first porous body 41 and a second porous body 42, respectively. These porous bodies function as wicks that transport the working medium 20 by capillary force. Further, by using a porous body as a support of the housing 10, the weight of the vapor chamber 1 can be reduced.

The first porous body 41 and the second porous body 42 are composed of, for example, a metal porous body, a ceramic porous body, or a resin porous body. The first porous body 41 and the second porous body 42 may be composed of a sintered body such as a metal porous sintered body or a ceramic porous sintered body, for example. The first porous body 41 and the second porous body 42 are preferably composed of a porous sintered body of copper or nickel.

A steam flow path 50 through which the working medium 20 of the gas phase flows is formed between at least one set of adjacent wick bodies 40.

On the other hand, the first liquid flow path 51 is formed in a space surrounded by at least a part of each wick body 40 and a part of the housing 10. In the present embodiment, the first liquid flow path 51 is formed in a space surrounded by a part of the first porous body 41, a part of the second porous body 42, and a part of the housing 10. Specifically, in each wick body 40, the first liquid flow path 51 is provided by providing a space between the first porous body 41 and the second porous body 42 along the direction in which the wick body 40 extends. It is formed. The first liquid flow path 51 can be used as a liquid flow path through which the working medium 20 of the liquid phase flows. The heat transport efficiency can be improved by, for example, arranging the liquid flow path and the vapor flow path alternately with the wick body 40 sandwiched between the first porous body 41 or the second porous body 42.

As shown in FIG. 3, the width a of the vapor flow path 50 is larger than the width b of the first liquid flow path 51. The width a of the steam flow path 50 is preferably 1000 μm or more and 3000 μm or less, and more preferably 1000 μm or more and 2000 μm or less. The width b of the first liquid flow path 51 is preferably 50 μm or more and 500 μm or less. In the above cross section, when the width of the steam flow path is different in the thickness direction Z, the width of the widest portion is defined as the width of the steam flow path. Similarly, when the width of the first liquid flow path is different in the thickness direction Z, the width of the widest portion is defined as the width of the first liquid flow path.

FIG. 4 is an enlarged cross-sectional view of the portion shown by IV in FIG.
As shown in FIGS. 3 and 4, at least one of the surfaces of the wick body 40 in contact with the first inner wall surface 11a or the second inner wall surface 12a is provided with a groove portion along the direction in which the wick body 40 extends. The second liquid flow path 52 is formed by the above. In the present embodiment, in the second liquid flow path 52, the surface where the first porous body 41 is in contact with the first inner wall surface 11a, the surface where the first porous body 41 is in contact with the second inner wall surface 12a, and the second porous body 42 are the first. 1 The surface in contact with the inner wall surface 11a and the second porous body 42 are formed on at least one of the surfaces in contact with the second inner wall surface 12a. Specifically, a groove portion is formed on the surface of the first porous body 41 facing the second inner wall surface 12a and the surface of the second porous body 42 facing the second inner wall surface 12a along the direction in which the wick body 40 extends. The second liquid flow path 52 is formed by the provision of the above. Similar to the first liquid flow path 51, the second liquid flow path 52 can be used as a liquid flow path through which the working medium 20 of the liquid phase flows.

The second liquid is on the surface of the wick body 40 in contact with the first inner wall surface 11a or the second inner wall surface 12a, for example, the surface of the first porous body 41 or the second porous body 42 facing the second inner wall surface 12a of the housing 10. By forming the flow path 52, it is possible to increase the number of liquid flow paths while maintaining the height of the steam flow path. Therefore, it is possible to suppress the decrease in thermal conductivity and increase the maximum heat transport amount. Further, by forming the flow path on the top surface or the bottom surface of the porous body, it becomes possible to smoothly flow the liquid to the heat source as compared with the case where the flow path is formed inside (central portion) of the porous body. ..

The method for forming the second liquid flow path 52 is not particularly limited, but for example, when the first porous body 41 and the second porous body are composed of the porous sintered body, for producing the porous sintered body. Examples thereof include a method of adjusting the viscosity of the paste and a method of pressing after applying the paste by printing such as screen printing.

In FIG. 4, the width e of the second liquid flow path 52 is smaller than either the width c ₁ of the first porous body 41 or the width c ₂ of the second porous body 42, and the height of the second liquid flow path 52 is high. It is preferable that the value f is smaller than either 1/2 of the height d ₁ of the first porous body 41 and 1/2 of the height d ₂ of the second porous body 42. That is, it is preferable that the relations of e <c ₁ and e <c ₂ and f <1 / 2d ₁ and f <1 / 2d ₂ are established. In the above cross section, when the width of the second liquid flow path is different in the thickness direction Z, the width of the widest portion is defined as the width of the second liquid flow path. Similarly, when the width of the porous body is different in the thickness direction Z, the width of the widest portion is defined as the width of the porous body. Further, in the above cross section, when the height of the second liquid flow path is different in the width direction X, the height of the highest portion is defined as the height of the second liquid flow path. Similarly, when the height of the porous body differs in the width direction X, the height of the highest portion is defined as the height of the porous body.

As described above, the width e of the second liquid flow path 52 is preferably smaller than either the width c ₁ of the first porous body 41 or the width c ₂ of the second porous body 42, but the width e of the first porous body 41 It may be the same as at least one of the width c ₁ and the width c ₂ of the second porous body 42.

The width c ₁ of the first porous body 41 and the width c ₂ of the second porous body 42 are preferably 50 μm or more and 300 μm or less, respectively. This makes it possible to obtain a high capillary force. The width c ₁ of the first porous body 41 may be the same as or different from the width c ₂ of the second porous body 42. As will be described in the second and subsequent embodiments, the width c ₁ of the first porous body 41 and the width c ₂ of the second porous body 42 do not have to be constant in the thickness direction Z. Further, a porous body having a constant width in the thickness direction Z and a porous body having a non-constant width in the thickness direction Z may coexist.

The height d ₁ of the first porous body 41 and the height d ₂ of the second porous body 42 are preferably 20 μm or more and 300 μm or less, and more preferably 50 μm or more and 300 μm or less, respectively. Even when the height d ₁ of the first porous body and the height d ₂ of the second porous body 42 are set in the above range and the entire vapor chamber 1 is thinned, the first porous body 41 and the second porous body 41 and the second porous body 41 are described as described above. By arranging the porous body 42 in the housing 10, it is possible to secure the mechanical strength and the maximum heat transport amount. The height d ₁ of the first porous body 41 may be the same as or different from the height d ₂ of the second porous body 42.

In FIG. 4, the second liquid flow path 52 is formed on both the surface of the first porous body 41 facing the second inner wall surface 12a and the surface of the second porous body 42 facing the second inner wall surface 12a. However, the second liquid flow path 52 is formed only on one of the surface of the first porous body 41 facing the second inner wall surface 12a and the surface of the second porous body 42 facing the second inner wall surface 12a. It may have been done.

FIG. 5 is a cross-sectional view schematically showing a first modification example of the position where the second liquid flow path is formed.
As shown in FIG. 5, the second liquid flow path 52 is formed on the surface of the first porous body 41 facing the first inner wall surface 11a and the surface of the second porous body 42 facing the first inner wall surface 11a. May be.

In FIG. 5, the second liquid flow path 52 is formed on both the surface of the first porous body 41 facing the first inner wall surface 11a and the surface of the second porous body 42 facing the first inner wall surface 11a. However, the second liquid flow path 52 is formed only on one of the surface of the first porous body 41 facing the first inner wall surface 11a and the surface of the second porous body 42 facing the first inner wall surface 11a. It may have been done.

FIG. 6 is a cross-sectional view schematically showing a second modification example of the position where the second liquid flow path is formed.
As shown in FIG. 6, the surface of the first porous body 41 facing the second inner wall surface 12a, the surface of the second porous body 42 facing the second inner wall surface 12a, and the first porous body facing the first inner wall surface 11a. The second liquid flow path 52 may be formed on the surface of the body 41 and the surface of the second porous body 42 facing the first inner wall surface 11a.

In FIG. 6, the surface of the first porous body 41 facing the second inner wall surface 12a, the surface of the second porous body 42 facing the second inner wall surface 12a, and the first porous body 41 facing the first inner wall surface 11a. The second liquid flow path 52 is formed on all of the surface and the surface of the second porous body 42 facing the first inner wall surface 11a, but the second liquid flow path 52 is formed on at least one surface. Should be formed.

The surface of the first porous body 41 facing the second inner wall surface 12a, the surface of the second porous body 42 facing the second inner wall surface 12a, the surface of the first porous body 41 facing the first inner wall surface 11a, and When the second liquid flow path 52 is formed on two or more of the surfaces of the second porous body 42 facing the first inner wall surface 11a, the second liquid flow path 52 formed on each surface. The cross-sectional shapes of the above may be the same or different. Further, the width e of the second liquid flow path 52 formed on each surface may be the same or different. Similarly, the height f of the second liquid flow path 52 formed on each surface may be the same or different.

The surface of the first porous body 41 facing the second inner wall surface 12a, the surface of the second porous body 42 facing the second inner wall surface 12a, the surface of the first porous body 41 facing the first inner wall surface 11a, and When the second liquid flow path 52 is formed on two or more of the surfaces of the second porous body 42 facing the first inner wall surface 11a, the second liquid flow path 52 formed on each surface. The positions of may be the same or different.

When the wick body 40 includes the first porous body 41 and the second porous body 42, the wick body 40 in which the second liquid flow path 52 is not formed may be included.

4 to 6 show an example of the second liquid flow path 52 having a quadrangular cross-sectional shape, but the cross-sectional shape of the second liquid flow path 52 is not particularly limited.

FIG. 7 is a cross-sectional view schematically showing a modified example of the cross-sectional shape of the second liquid flow path.
As shown in FIG. 7, a second liquid flow path 52A having a curved cross-sectional shape may be formed.

Next, the operation of the vapor chamber 1 configured as described above will be described.

In the evaporation unit EP, the working medium 20 of the liquid phase located on the surfaces of the first porous body 41 and the second porous body 42 is heated and evaporated through the inner wall surface of the housing 10. As the working medium 20 evaporates, the pressure of the gas in the steam flow path 50 in the vicinity of the evaporation unit EP increases. As a result, the working medium 20 of the gas phase moves in the steam flow path 50 toward the condensed portion CP side.

The gas phase working medium 20 that has reached the condensing portion CP is deprived of heat through the inner wall surface of the housing 10 and is condensed into droplets. As described above, the working medium 20 of the gas phase can be condensed other than the condensed portion CP. The droplets of the working medium 20 permeate into the pores of the first porous body 41 and the pores of the second porous body 42 by the capillary force. Further, a part of the working medium 20 of the liquid phase that has penetrated into the pores of the first porous body 41 and the pores of the second porous body 42 is inside the first liquid flow path 51 and the second liquid flow path. It flows into 52. Therefore, the liquid flow path is formed by the first porous body 41, the second porous body 42, the first liquid flow path 51, and the second liquid flow path 52.

The working medium 20 of the liquid phase in the pores of the first porous body 41, in the pores of the second porous body 42, in the first liquid flow path 51, and in the second liquid flow path 52 is an evaporation part due to the capillary force. Move to the EP side. Then, the working medium 20 of the liquid phase is supplied from the pores of the first porous body 41, the pores of the second porous body 42, the first liquid flow path 51, and the second liquid flow path 52 to the evaporation section EP. To. The working medium 20 of the liquid phase that has reached the evaporation unit EP evaporates again from the surfaces of the first porous body 41 and the second porous body 42 in the evaporation unit EP. As shown in FIG. 2, it is desirable that the first liquid flow path 51 reaches the evaporation unit EP. The evaporation unit EP may include the first liquid flow path 51 and the wick body 40, or the first liquid flow path 51 may not be included and only the wick body 40 may be contained, or the first liquid may be contained. The flow path 51 and the wick body 40 may not be included.

The working medium 20 that has evaporated and becomes a gas phase moves to the condensed portion CP side again through the steam flow path 50. In this way, the vapor chamber 1 can repeatedly transport the heat recovered on the evaporation unit EP side to the condensation unit CP side by repeatedly utilizing the gas-liquid phase change of the working medium 20.

The pore diameters of the first porous body 41 and the second porous body 42 are preferably 50 μm or less, respectively. By reducing the pore diameter, high capillary force can be obtained. The pore diameters of the first porous body 41 and the second porous body 42 may be the same or different. The shape of the hole is not particularly limited.

As shown in FIG. 2, at least one set of adjacent wick bodies 40 may be connected to each other at the end portions on the evaporation portion EP side, and the first liquid flow paths 51 may communicate with each other. Further, even if the ends of at least one set of adjacent wick bodies 40 opposite to the evaporation portion EP and the ends on the condensing portion CP side are connected to each other and the first liquid flow paths 51 communicate with each other. good.

As described above, in the vapor chamber 1, a liquid flow path and a steam flow path are formed between the wick bodies 40. Above all, as shown in FIG. 2, it is preferable that the density of the flow path in the evaporation part EP is higher than the density of the flow path in the portion away from the evaporation part EP, for example, the density of the flow path in the condensation part CP. Thereby, the maximum heat transport amount can be improved.

In the vapor chamber of the present invention, in the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body may each have a constant width in the thickness direction, and the width in the thickness direction may be constant. It does not have to be constant. For example, in the cross section perpendicular to the direction in which the wick body extends, the width of the end portion on the second inner wall surface side is narrower than the width of the end portion on the first inner wall surface side, respectively. You may. In this case, a portion having a constant width may be included.

[Second Embodiment]
In the second embodiment of the present invention, in the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body are each from the end portion on the first inner wall surface side to the end portion on the second inner wall surface side. The width becomes continuously narrower toward.

FIG. 8 is a cross-sectional view schematically showing an example of a vapor chamber according to a second embodiment of the present invention.

In the vapor chamber 1A shown in FIG. 8, the adjacent wick bodies 40 include the first porous body 41A and the second porous body 42A, respectively. In each of the first porous body 41A and the second porous body 42A, the width of the end portion on the second inner wall surface 12a side is narrower than the width of the end portion on the first inner wall surface 11a side. Further, the width of each of the first porous body 41A and the second porous body 42A is continuously narrowed from the end portion on the first inner wall surface 11a side toward the end portion on the second inner wall surface 12a side. In the example shown in FIG. 8, the cross-sectional shapes of the first porous body 41A and the second porous body 42A are trapezoidal, respectively. The cross-sectional shapes of the first porous body 41A and the second porous body 42A are not particularly limited, and may be other shapes.

In the vapor chamber 1A shown in FIG. 8, the first porous body 41A and the second porous body 42A have the above-mentioned cross-sectional shape, so that the pressure from the outside of the housing 10 can be dispersed. Further, since the internal space of the housing 10 can be easily maintained in the minimum area and the cross-sectional area of the vapor flow path and the liquid flow path can be secured to the maximum, the maximum heat transport amount and the heat diffusion capacity can be improved. Further, since the liquid flow path is formed in the acute-angled gap formed between the end portion on the second inner wall surface 12a side having a small area and the housing 10, the liquid phase is formed in the liquid flow path between the wick bodies 40. The working medium 20 can be easily drawn in, and the maximum heat transport capacity is improved. Alternatively, the exudation of the working medium 20 of the liquid phase into the vapor flow path is improved, and the heat diffusion capacity is improved.

[Third Embodiment]
In the third embodiment of the present invention, in the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body are each from the end portion on the first inner wall surface side to the end portion on the second inner wall surface side. The width gradually narrows toward.

FIG. 9 is a cross-sectional view schematically showing an example of a vapor chamber according to a third embodiment of the present invention.

In the vapor chamber 1B shown in FIG. 9, the adjacent wick bodies 40 include the first porous body 41B and the second porous body 42B, respectively. In each of the first porous body 41B and the second porous body 42B, the width of the end portion on the second inner wall surface 12a side is narrower than the width of the end portion on the first inner wall surface 11a side. Further, the widths of the first porous body 41B and the second porous body 42B are gradually narrowed from the end portion on the first inner wall surface 11a side toward the end portion on the second inner wall surface 12a side, respectively. In the example shown in FIG. 9, the cross-sectional shapes of the first porous body 41B and the second porous body 42B are arranged on the first inner wall surface 11a side and the second inner wall surface 12a side, respectively. , A shape that is a combination of a second rectangle that is narrower than the first rectangle. The cross-sectional shapes of the first porous body 41B and the second porous body 42B are not particularly limited, and may be other shapes.

In the vapor chamber 1B shown in FIG. 9, the first porous body 41B and the second porous body 42B have the above-mentioned cross-sectional shape, so that the same effect as that of the vapor chamber 1A shown in FIG. 8 can be obtained.

[Fourth Embodiment]
The fourth embodiment of the present invention is a modification of the second embodiment and the third embodiment. In the fourth embodiment of the present invention, the ends of the first porous body and the second porous body on the inner wall surface side are connected to each other. When the ends of the porous body on the first inner wall surface side are connected to each other, the contact area between the porous body and the first inner wall surface increases, and the adhesive strength increases, so that mechanical stress such as bending or vibration occurs. Can improve resistance to.

FIG. 10 is a cross-sectional view schematically showing an example of a vapor chamber according to a fourth embodiment of the present invention.

In the vapor chamber 1C shown in FIG. 10, the adjacent wick bodies 40 include the first porous body 41C and the second porous body 42C, respectively. In each of the first porous body 41C and the second porous body 42C, the width of the end portion on the second inner wall surface 12a side is narrower than the width of the end portion on the first inner wall surface 11a side. The cross-sectional shapes of the first porous body 41C and the second porous body 42C are not particularly limited.

Further, the ends of the first porous body 41C and the second porous body 42C on the first inner wall surface 11a side are connected to each other.

[Fifth Embodiment]
In the fifth embodiment of the present invention, in the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body are the end portion on the first inner wall surface side and the end portion on the second inner wall surface side, respectively. It has a portion wider than the end portion on the first inner wall surface side and the end portion on the second inner wall surface side.

FIG. 11 is a cross-sectional view schematically showing an example of a vapor chamber according to a fifth embodiment of the present invention.

In the vapor chamber 1D shown in FIG. 11, the adjacent wick bodies 40 include the first porous body 41D and the second porous body 42D, respectively. The first porous body 41D and the second porous body 42D are located between the end portion on the first inner wall surface 11a side and the end portion on the second inner wall surface 12a side, respectively, the end portion on the first inner wall surface 11a side and the second end. 2 It has a portion wider than the end portion on the inner wall surface 12a side.

In the vapor chamber 1D shown in FIG. 11, the first porous body 41D and the second porous body 42D have the above-mentioned cross-sectional shape, so that the same effect as that of the vapor chamber 1A shown in FIG. 8 can be obtained.

In the first porous body 41D and the second porous body 42D, the width of the end portion on the first inner wall surface 11a side may be the same as or different from the width of the end portion on the second inner wall surface 12a side.

In the first porous body 41D and the second porous body 42D, the position where a portion wider than the end portion on the first inner wall surface 11a side and the end portion on the second inner wall surface 12a side exists is not particularly limited. Further, there may be two or more portions wider than the end portion on the first inner wall surface 11a side and the end portion on the second inner wall surface 12a side. In that case, the widths of the end portion on the first inner wall surface 11a side and the portion wider than the end portion on the second inner wall surface 12a side may be the same or different.

The cross-sectional shapes of the first porous body 41D and the second porous body 42D are not particularly limited. The widths of the first porous body 41D and the second porous body 42D may be continuously changed or may be changed stepwise.

[Sixth Embodiment]
In the sixth embodiment of the present invention, in the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body are the end portion on the first inner wall surface side and the end portion on the second inner wall surface side, respectively. It has a portion narrower than the end portion on the first inner wall surface side and the end portion on the second inner wall surface side.

FIG. 12 is a cross-sectional view schematically showing an example of a vapor chamber according to a sixth embodiment of the present invention.

In the vapor chamber 1E shown in FIG. 12, the adjacent wick bodies 40 include the first porous body 41E and the second porous body 42E, respectively. The first porous body 41E and the second porous body 42E are located between the end portion on the first inner wall surface 11a side and the end portion on the second inner wall surface 12a side, respectively, the end portion on the first inner wall surface 11a side and the second end. 2 It has a portion narrower than the end portion on the inner wall surface 12a side.

In the vapor chamber 1E shown in FIG. 12, the first porous body 41E and the second porous body 42E have the above-mentioned cross-sectional shape, so that the pressure from the outside of the housing 10 can be dispersed. Further, the liquid phase working medium 20 is easily absorbed in the wide portion, while the evaporation of the working medium 20 is easily promoted in the narrow portion. As a result, the maximum heat transport capacity is improved.

In the first porous body 41E and the second porous body 42E, the width of the end portion on the first inner wall surface 11a side may be the same as or different from the width of the end portion on the second inner wall surface 12a side.

In the first porous body 41E and the second porous body 42E, the position where the end portion on the first inner wall surface 11a side and the portion narrower than the end portion on the second inner wall surface 12a side are present is not particularly limited. Further, there may be two or more portions narrower than the end portion on the first inner wall surface 11a side and the end portion on the second inner wall surface 12a side. In that case, the widths of the end portion on the first inner wall surface 11a side and the portion narrower than the end portion on the second inner wall surface 12a side may be the same or different.

The cross-sectional shapes of the first porous body 41E and the second porous body 42E are not particularly limited. The widths of the first porous body 41E and the second porous body 42E may be continuously changed or may be changed stepwise.

In the vapor chamber of the present invention, two or more types of porous body shapes described in the first to sixth embodiments may be combined.

[7th Embodiment]
FIG. 13 is a plan view schematically showing an example of the vapor chamber according to the seventh embodiment of the present invention.

In the vapor chamber 1F shown in FIG. 13, unlike the vapor chamber 1 shown in FIG. 2, the ends opposite to the evaporation portion EP of the adjacent wick bodies 40 are connected to each other, for example, the ends on the condensing portion CP side are connected to each other. The first liquid flow paths 51 do not communicate with each other. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

[Eighth Embodiment]
In the eighth embodiment of the present invention, the housing has a plurality of evaporation parts.

FIG. 14 is a plan view schematically showing an example of the vapor chamber according to the eighth embodiment of the present invention.

In the vapor chamber 1G shown in FIG. 14, a plurality of evaporation units EP1 and EP2 are set in the housing 10. As shown in FIG. 14, the density of the flow path in each of the evaporation parts EP1 and EP2 is higher than the density of the flow path in the portion away from each of the evaporation parts EP1 and EP2, for example, the density of the flow path in the condensation part CP. High is preferable. The number, arrangement, and size of the evaporated parts are not particularly limited. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

[9th Embodiment]
In the ninth embodiment of the present invention, the planar shape of the housing when viewed from the thickness direction is different from the first to eighth embodiments.

FIG. 15 is a plan view schematically showing an example of the vapor chamber according to the ninth embodiment of the present invention.

In the vapor chamber 1H shown in FIG. 15, the planar shape of the housing 10A is L-shaped. The plurality of wick bodies 40 extend along the planar shape of the housing 10A. Therefore, a vapor flow path and a liquid flow path are formed along the planar shape of the housing 10A. As an example, adjacent wick bodies 40 include a first porous body 41 and a second porous body 42, respectively. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

In the vapor chamber of the present invention, the planar shape of the housing when viewed from the thickness direction is not particularly limited, and examples thereof include polygons such as triangles and rectangles, circles, ellipses, and combinations thereof. Further, the planar shape of the housing may be L-shaped, C-shaped (U-shaped), or the like. Further, a through hole may be provided inside the housing. The planar shape of the housing may be a shape corresponding to the use of the vapor chamber, the shape of the place where the vapor chamber is incorporated, and other parts existing in the vicinity.

[10th Embodiment]
FIG. 16 is a plan view schematically showing an example of the vapor chamber according to the tenth embodiment of the present invention.

In the vapor chamber 1I shown in FIG. 16, unlike the vapor chamber 1 shown in FIG. 2, there is a wick body 40 extending along an oblique direction with respect to the width direction X and the length direction Y.

Like the vapor chamber 1I shown in FIG. 16, the wick 30 may include a wick body 40 radially extending from the evaporation unit EP. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

[11th Embodiment]
In the eleventh embodiment of the present invention, a plurality of columns that support the first inner wall surface and the second inner wall surface of the housing from the inside are arranged in the steam flow path.

FIG. 17 is a plan view schematically showing an example of the vapor chamber according to the eleventh embodiment of the present invention. FIG. 18 is a cross-sectional view schematically showing an example of a vapor chamber according to the eleventh embodiment of the present invention.

In the vapor chamber 1J shown in FIGS. 17 and 18, unlike the vapor chamber 1A shown in FIG. 8, a plurality of columns 60 are arranged in the steam flow path 50. The steam flow path 50 is divided between the columns 60. The support column 60 supports the first inner wall surface 11a and the second inner wall surface 12a of the housing 10 from the inside. When the number of the first liquid flow paths 51 is small, it is possible to support the housing 10 by arranging the columns 60 in the steam flow path 50. As described in the first to sixth embodiments, the shape may be other than the first porous body 41A and the second porous body 42A.

As shown in FIGS. 17 and 18, it is preferable that the columns 60 are arranged in all the steam flow paths 50, but there may be a steam flow path 50 in which the columns 60 are not arranged.

In the example shown in FIG. 18, the support column 60 is in contact with the first inner wall surface 11a and the second inner wall surface 12a. The column 60 may be in contact with either the first inner wall surface 11a or the second inner wall surface 12a, or may not be in contact with the first inner wall surface 11a or the second inner wall surface 12a.

The material forming the support column 60 is not particularly limited, and examples thereof include resin, metal, ceramics, a mixture thereof, and a laminate. Further, the support column 60 may be integrated with the housing 10, and may be formed by, for example, etching the inner wall surface of the first sheet 11 or the second sheet 12.

The shape of the support column 60 is not particularly limited as long as it can support the housing 10, but examples of the shape of the cross section perpendicular to the height direction of the support column 60 include polygons such as rectangles, circles, and ellipses. Can be mentioned.

The height of the support column 60 is not particularly limited, and may be the same as or different from the height of the wick body 40.

The height of the columns 60 may be the same or different in one vapor chamber. For example, the height of the strut 60 in one area and the height of the strut 60 in another area may be different.

In the cross section shown in FIG. 18, the width of the support column 60 is not particularly limited as long as it provides strength that can suppress deformation of the housing of the vapor chamber, but is a circle having a cross section perpendicular to the height direction of the end portion of the support column 60. The equivalent diameter is, for example, 100 μm or more and 2000 μm or less, preferably 300 μm or more and 1000 μm or less. By increasing the equivalent circle diameter of the support column 60, deformation of the housing of the vapor chamber can be further suppressed. On the other hand, by reducing the equivalent circle diameter of the support column 60, it is possible to secure a wider space for the steam of the working medium to move.

The arrangement of the columns 60 is not particularly limited, but is preferably arranged evenly in a predetermined area, more preferably evenly over the entire area, for example, so that the distance between the columns 60 is constant. By arranging the columns 60 evenly, uniform strength can be ensured over the entire vapor chamber.

[12th Embodiment]
The twelfth embodiment of the present invention is a modification of the eleventh embodiment of the present invention. In the twelfth embodiment of the present invention, the height of the columns is higher than the height of the wick body in the thickness direction.

FIG. 19 is a cross-sectional view schematically showing an example of a vapor chamber according to a twelfth embodiment of the present invention.

In the vapor chamber 1K shown in FIG. 19, unlike the vapor chamber 1J shown in FIG. 18, the height of the support column 60 is higher than the height of the first porous body 41A and the height of the second porous body 42A in the thickness direction Z. Higher than that.

[13th Embodiment]
In the thirteenth embodiment of the present invention, a third liquid flow path extending along the direction in which the wick body extends is formed in the steam flow path.

FIG. 20 is a cross-sectional view schematically showing an example of a vapor chamber according to a thirteenth embodiment of the present invention.

In the vapor chamber 1L shown in FIG. 20, unlike the vapor chamber 1 shown in FIG. 3, a third liquid flow path 53 extending in the steam flow path 50 along the length direction Y, which is an example of the direction in which the wick body 40 extends. Is formed. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

As shown in FIG. 20, the width g of the third liquid flow path 53 is smaller than the width b of the first liquid flow path 51. By making the width g of the third liquid flow path 53 smaller than the width b of the first liquid flow path 51, the third liquid flow path 53 can be used as the liquid flow path.

Further, in the thickness direction Z, the height of the third liquid flow path 53 is lower than the height of the first liquid flow path 51. By forming the third liquid flow path 53 in the steam flow path 50, the operation of the vapor chamber can be ensured even when the first liquid flow path 51 and the second liquid flow path 52, which are liquid flow paths, are damaged. .. It can also improve resistance to mechanical stress such as bending or vibration.

The third liquid flow path 53 may be provided on both the first inner wall surface 11a and the second inner wall surface 12a, and may be provided on only one of the first inner wall surface 11a and the second inner wall surface 12a. May be good. The third liquid flow path 53 may be formed by a portion protruding from the first inner wall surface 11a and the second inner wall surface 12a, for example, a columnar portion, or a recess in the first inner wall surface 11a and the second inner wall surface 12a. , For example, it may be formed by a groove or the like.

In FIG. 20, the width g of the third liquid flow path 53 is preferably 10 μm or more and 500 μm or less.

In the thickness direction Z, the height of the third liquid flow path 53 is preferably 10 μm or more and 100 μm or less.

[14th Embodiment]
In the 14th embodiment of the present invention, the shape of the housing is different.

FIG. 21 is a cross-sectional view schematically showing an example of a vapor chamber according to the 14th embodiment of the present invention.

In the vapor chamber 1M shown in FIG. 21, unlike the vapor chamber 1A shown in FIG. 8, the housing 10B is composed of the facing first sheet 11B and the second sheet 12B to which the outer edge portions are joined. The first sheet 11B has a flat plate shape having a constant thickness, and the second sheet 12B has a shape in which the thickness is constant and the portion other than the outer edge portion is convex outward with respect to the outer edge portion. As described in the first to sixth embodiments, the shape may be other than the first porous body 41A and the second porous body 42A.

In the 14th embodiment of the present invention, a dent is formed on the outer edge of the housing. Therefore, the dent can be used when mounting the vapor chamber. Further, other parts and the like can be arranged in the recess of the outer edge portion.

[15th Embodiment]
The vapor chamber according to the fifteenth embodiment of the present invention further includes at least one of the wicks arranged along the first inner wall surface and the wicks arranged along the second inner wall surface.

FIG. 22 is a cross-sectional view schematically showing an example of the vapor chamber according to the fifteenth embodiment of the present invention.

In the vapor chamber 1N shown in FIG. 22, unlike the vapor chamber 1 shown in FIG. 3, the wick 71 is arranged along the first inner wall surface 11a, and the wick 72 is arranged along the second inner wall surface 12a. .. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

FIG. 23 is a cross-sectional view schematically showing another example of the vapor chamber according to the fifteenth embodiment of the present invention.

In the vapor chamber 1O shown in FIG. 23, the wick 71 is not arranged along the first inner wall surface 11a, but the wick 72 is arranged along the second inner wall surface 12a. The wick 72 may not be arranged along the second inner wall surface 12a, and the wick 71 may be arranged along the first inner wall surface 11a.

The wicks 71 and 72 are not particularly limited as long as they have a capillary structure in which the working medium can be moved by a capillary force. The wick's capillary structure may be a known structure used in conventional vapor chambers. Examples of the capillary structure include microstructures having irregularities such as pores, grooves, and protrusions, such as a porous structure, a fiber structure, a groove structure, and a mesh structure.

The materials of the wicks 71 and 72 are not particularly limited, and for example, a metal porous film formed by etching or metal processing, a mesh, a non-woven fabric, a sintered body, a porous body, or the like is used. The mesh used as the material of the wick may be composed of, for example, a metal mesh, a resin mesh, or a surface-coated mesh thereof, and is preferably composed of a copper mesh, a stainless (SUS) mesh, or a polyester mesh. .. The sintered body used as the material of the wick may be composed of, for example, a metal porous sintered body and a ceramic porous sintered body, and is preferably composed of a copper or nickel porous sintered body. .. The porous body used as the material of the wick may be, for example, a porous body made of a metal porous body, a ceramic porous body, a resin porous body, or the like.

The size and shape of the wicks 71 and 72 are not particularly limited, but for example, it is preferable to have a size and shape that can be continuously installed from the evaporation part to the condensation part inside the housing 10.

The thicknesses of the wicks 71 and 72 are not particularly limited, but are, for example, 2 μm or more and 200 μm or less, preferably 5 μm or more and 100 μm or less, and more preferably 10 μm or more and 40 μm or less. The thicknesses of the wicks 71 and 72 may be partially different. The thickness of the wick 71 may be the same as or different from the thickness of the wick 72.

[16th Embodiment]
FIG. 24 is a plan view schematically showing an example of the vapor chamber according to the 16th embodiment of the present invention.

In the vapor chamber 1P shown in FIG. 24, unlike the vapor chamber 1 shown in FIG. 2, the wick 30 is arranged only on the outer peripheral portion of the housing 10. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

[17th Embodiment]
FIG. 25 is a plan view schematically showing an example of the vapor chamber according to the 17th embodiment of the present invention.

In the vapor chamber 1Q shown in FIG. 25, unlike the vapor chamber 1 shown in FIG. 2, the wick 30 is arranged only in the central portion of the housing 10. As described in the first to sixth embodiments, the shape may be other than the first porous body 41 and the second porous body 42.

[18th Embodiment]
In the eighteenth embodiment of the present invention, a support is arranged in the housing along the direction in which the wick body extends, and at least one set of adjacent wick bodies each includes a porous body supported by the support.

FIG. 26 is a cross-sectional view schematically showing an example of a vapor chamber according to the eighteenth embodiment of the present invention. FIG. 27 is an enlarged cross-sectional view of the portion shown by XXVII in FIG. 26.

The vapor chamber 1R shown in FIG. 26 further includes a support 80 arranged in the housing 10 along the direction in which the wick body 40 extends. In the example shown in FIGS. 26 and 27, two rows of supports (first support 81 and second support 82) are arranged so as to be parallel to each other along the direction in which the wick body 40 extends. Three or more rows of supports may be arranged so as to be parallel to each other along the direction in which the body 40 extends.

In this embodiment, at least one set of adjacent wick bodies 40 each includes a porous body 43 supported by a support 80.

The first liquid flow path 51 is formed in a space surrounded by a part of the porous body 43, a part of the housing 10, and a part of the support 80. Specifically, the first liquid flow path 51 is formed by providing a space between the first support 81 and the second support 82 along the direction in which the wick body 40 extends.

The second liquid flow path 52 is formed on at least one surface of the surface in which the porous body 43 is in contact with the first inner wall surface 11a or the second inner wall surface 12a. Specifically, the second liquid flow path 52 is formed by providing a groove portion along the direction in which the wick body 40 extends on the surface of the porous body 43 facing the second inner wall surface 12a.

In FIGS. 26 and 27, the support 80 is arranged on the first inner wall surface 11a, and the second liquid flow path 52 is formed on the surface of the porous body 43 facing the second inner wall surface 12a. The support 80 may be arranged on the wall surface 12a, and the second liquid flow path 52 may be formed on the surface of the porous body 43 facing the first inner wall surface 11a. Alternatively, these may be mixed.

The porous body 43 is composed of, for example, a metal porous body, a ceramic porous body, or a resin porous body. The porous body 43 may be composed of, for example, a sintered body such as a metal porous sintered body or a ceramic porous sintered body. The porous body 43 is preferably composed of a porous sintered body of copper or nickel.

The material forming the support 80 is not particularly limited, and examples thereof include resins, metals, ceramics, mixtures thereof, and laminates. Further, the support 80 may be integrated with the housing 10, and may be formed, for example, by etching the inner wall surface of the first sheet 11 or the second sheet 12.

The shape of the support 80 is not particularly limited, and may be composed of, for example, rail-shaped columns arranged along the direction in which the wick body 40 extends, at intervals along the direction in which the wick body 40 extends. It may be composed of a plurality of columns to be arranged.

The heat diffusion device of the present invention can be mounted on an electronic device for the purpose of heat dissipation. Therefore, an electronic device provided with the heat diffusion device of the present invention is also one of the present inventions. Examples of the electronic device of the present invention include smartphones, tablet terminals, notebook computers, game devices, wearable devices and the like. As described above, the heat diffusion device of the present invention operates independently without the need for external power, and can diffuse heat in two dimensions at high speed by utilizing the latent heat of vaporization and the latent heat of condensation of the working medium. Therefore, the electronic device provided with the heat diffusion device of the present invention can effectively realize heat dissipation in the limited space inside the electronic device.

The heat diffusion device of the present invention can be used for a wide range of applications in the field of portable information terminals and the like. For example, it can be used to lower the temperature of a heat source such as a CPU and extend the usage time of an electronic device, and can be used for smartphones, tablets, notebook PCs, and the like.

1,1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I, 1J, 1K, 1L, 1M, 1N, 1O, 1P, 1Q, 1R vapor chamber (heat diffusion device)
10, 10A, 10B Housing 11, 11B 1st sheet 11a 1st inner wall surface 12, 12B 2nd sheet 12a 2nd inner wall surface 20 Working medium 30, 71, 72 Wick 40 Wick body 41, 41A, 41B, 41C, 41D , 41E 1st porous body 42, 42A, 42B, 42C, 42D, 42E 2nd porous body 43 porous body 50 vapor flow path 51 1st liquid flow path 52, 52A 2nd liquid flow path 53 3rd liquid flow path 60 columns 80 Support 81 1st support 82 2nd support a Width of steam flow path b Width of 1st liquid flow path c ₁ Width of 1st porous body c ₂ Width of 2nd porous body d ₁ Of 1st porous body Height d ₂ Height of the second porous body e Width of the second liquid flow path f Height of the second liquid flow path g Width of the third liquid flow path CP Condensation part EP, EP1, EP2 Evaporation part HS Heat source X width Direction Y Length direction Z Thickness direction

Claims (27)

1. A housing having a first inner wall surface and a second inner wall surface facing each other in the thickness direction,
   The working medium enclosed in the internal space of the housing and
   With a wick arranged in the internal space of the housing,
   The housing has an evaporation unit that evaporates the working medium.
   The wick includes a plurality of wicks extending linearly from the evaporation portion and at least partially in contact with the inner wall surface of at least one of the first inner wall surface and the second inner wall surface.
   A steam flow path is formed between at least one set of adjacent wick bodies.
   In the adjacent wick bodies, a first liquid flow path is formed in a space surrounded by at least a part of each of the wick bodies and a part of the housing.
   A second liquid flow path is formed by providing a groove along the direction in which the wick body extends on at least one of the surfaces of the wick body in contact with the first inner wall surface or the second inner wall surface. Has been a heat diffusion device.
2. The adjacent wick bodies include a first porous body and a second porous body, respectively.
   The first liquid flow path is formed in a space surrounded by a part of the first porous body, a part of the second porous body, and a part of the housing.
   The second liquid flow path has a surface in which the first porous body is in contact with the first inner wall surface, a surface in which the first porous body is in contact with the second inner wall surface, and the second porous body is on the first inner wall surface. The heat diffusion device according to claim 1, wherein the surface in contact and the surface in which the second porous body is in contact with the second inner wall surface are formed on at least one surface.
3. In the cross section perpendicular to the direction in which the wick body extends, the width of the second liquid flow path is smaller than both the width of the first porous body and the width of the second porous body, and the width of the liquid flow path is smaller than that of the liquid flow path. The heat diffusion device according to claim 2, wherein the height is smaller than either 1/2 of the height of the first porous body and 1/2 of the height of the second porous body.
4. The heat diffusion device according to claim 2 or 3, wherein the width of the first porous body and the width of the second porous body are 50 μm or more and 300 μm or less, respectively, in a cross section perpendicular to the direction in which the wick body extends.
5. One of claims 2 to 4, wherein the height of the first porous body and the height of the second porous body are 20 μm or more and 300 μm or less, respectively, in a cross section perpendicular to the direction in which the wick body extends. The heat diffusion device described in.
6. The aspect according to any one of claims 2 to 5, wherein the first porous body and the second porous body each have a non-constant width in the thickness direction in a cross section perpendicular to the direction in which the wick body extends. Heat diffusion device.
7. In the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body are each end of the second inner wall surface side with respect to the width of the end portion of the first inner wall surface side. The heat diffusion device according to any one of claims 2 to 5, which has a narrow width.
8. In the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body each have a width from the end portion on the first inner wall surface side toward the end portion on the second inner wall surface side. The heat diffusion device according to any one of claims 2 to 5, wherein the heat diffusion device is continuously narrowed.
9. In the cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body each have a width from the end portion on the first inner wall surface side toward the end portion on the second inner wall surface side. The heat diffusion device according to any one of claims 2 to 5, wherein the heat diffusion device is gradually narrowed.
10. The heat diffusion device according to any one of claims 7 to 9, wherein the first porous body and the second porous body are connected to each other at the ends on the first inner wall surface side.
11. In a cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body are respectively between the end portion on the first inner wall surface side and the end portion on the second inner wall surface side. The heat diffusion device according to any one of claims 2 to 5, further comprising an end portion on the first inner wall surface side and a portion wider than the end portion on the second inner wall surface side.
12. In a cross section perpendicular to the direction in which the wick body extends, the first porous body and the second porous body are respectively between the end portion on the first inner wall surface side and the end portion on the second inner wall surface side. The heat diffusion device according to any one of claims 2 to 5, further comprising an end portion on the first inner wall surface side and a portion narrower than the end portion on the second inner wall surface side.
13. The heat diffusion device according to any one of claims 2 to 12, wherein the pore diameters of the first porous body and the second porous body are 50 μm or less, respectively.
14. Further provided with a plurality of columns arranged in the steam flow path and supporting the first inner wall surface and the second inner wall surface of the housing from the inside.
    The heat according to any one of claims 2 to 13, wherein the height of the column is higher than either the height of the first porous body or the height of the second porous body in the thickness direction. Spreading device.
15. Further comprising a support arranged in the housing along the direction in which the wick body extends.
    Each of the adjacent wicks comprises a porous body supported by the support.
    The first liquid flow path is formed in a space surrounded by a part of the porous body, a part of the housing, and a part of the support.
    The heat diffusion device according to claim 1, wherein the second liquid flow path is formed on at least one surface of the surface in which the porous body is in contact with the first inner wall surface or the second inner wall surface.
16. Any of claims 1 to 15, wherein the width of the vapor flow path is 1000 μm or more and 3000 μm or less, and the width of the first liquid flow path is 50 μm or more and 500 μm or less in a cross section perpendicular to the direction in which the wick body extends. The heat diffusion device according to item 1.
17. The heat diffusion device according to any one of claims 1 to 16, wherein the density of the flow path in the evaporation section is higher than the density of the flow path in the portion away from the evaporation section.
18. The heat diffusion device according to claim 17, wherein the housing has a plurality of the evaporation units.
19. The heat according to any one of claims 1 to 18, further comprising a plurality of columns arranged in the steam flow path and supporting the first inner wall surface and the second inner wall surface of the housing from the inside. Spreading device.
20. The heat diffusion device according to any one of claims 1 to 19, wherein the ends of the adjacent wick bodies on the evaporation portion side are connected to each other and the first liquid flow paths communicate with each other.
21. The heat diffusion device according to any one of claims 1 to 20, wherein the ends opposite to the evaporation portion of the adjacent wick body are connected to each other, and the first liquid flow paths communicate with each other.
22. The heat diffusion device according to any one of claims 1 to 21, wherein the plurality of wick bodies extend along the planar shape of the housing when viewed from the thickness direction.
23. In the vapor flow path, a third liquid flow path extending along the direction in which the wick body extends is formed.
    In the cross section perpendicular to the direction in which the wick body extends, the width of the third liquid flow path is smaller than the width of the first liquid flow path.
    The heat diffusion device according to any one of claims 1 to 22, wherein the height of the third liquid flow path is lower than the height of the first liquid flow path in the thickness direction.
24. The housing is configured by joining the outer edge portion of the first sheet having the first inner wall surface and the outer edge portion of the second sheet having the second inner wall surface.
    The first sheet has a flat plate shape having a constant thickness.
    The heat diffusion device according to any one of claims 1 to 23, wherein the second sheet has a shape in which the outer edge portion is thicker than the portion other than the outer edge portion.
25. The housing is configured by joining the outer edge portion of the first sheet having the first inner wall surface and the outer edge portion of the second sheet having the second inner wall surface.
    The first sheet has a flat plate shape having a constant thickness.
    The heat diffusion device according to any one of claims 1 to 23, wherein the second sheet has a constant thickness and a portion other than the outer edge portion is convex outward with respect to the outer edge portion. ..
26. The invention according to any one of claims 1 to 25, further comprising at least one of the wicks arranged along the first inner wall surface and the wicks arranged along the second inner wall surface. Heat diffusion device.
27. An electronic device comprising the heat diffusion device according to any one of claims 1 to 26.
    
    

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