WO2022073288A1

WO2022073288A1 - Drilling method for circuit board, and drilling machine for circuit board

Info

Publication number: WO2022073288A1
Application number: PCT/CN2020/131851
Authority: WO
Inventors: 袁绩; 常远
Original assignee: 苏州维嘉科技股份有限公司
Priority date: 2020-10-10
Filing date: 2020-11-26
Publication date: 2022-04-14
Also published as: CN114311130B; CN114311130A

Abstract

A drilling method for a circuit board (30), and a drilling machine for a circuit board. The drilling method for a circuit board comprises: in a first stage, controlling a drilling tool (22) and a pressure foot (21) to perform an accelerated motion at the same time until the speed is a first speed V1; in a second stage, controlling the drilling tool and the pressure foot to perform a decelerated motion at the same time until the speed of the drilling tool and the pressure foot is a second speed V2, the pressure foot coming into contact with a circuit board to be drilled and pressing said circuit board; in a third stage, when the drilling tool is controlled to perform a decelerated motion until a third speed V3 is reached, the drilling tool coming into contact with said circuit board; in a fourth stage, controlling the drilling tool to move a first distance S1 at the third speed V3; in a fifth stage, controlling the drilling tool to perform an accelerated motion until the speed of the drilling tool is a fourth speed V4, and to move at a constant speed, i.e. the fourth speed V4; and in a sixth stage, when the drilling tool is controlled to perform a decelerated motion until the speed of the drilling tool is 0 m/min, the drilling tool performing drilling to a drilling cut-off point on said circuit board, so that the drilling stroke of said circuit board is completed.

Description

Drilling method for circuit board and drilling machine for circuit board

This application claims the priority of a Chinese patent application with application number 202011079721.8 filed with the China Patent Office on October 10, 2020, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of numerical control drilling, for example, a method for drilling a circuit board and a drilling machine for a circuit board.

Background technique

Printed Circuit Board (PCB) is a chassis that houses electronic components and realizes the interconnection between components. Drilling is a very important process in the PCB manufacturing process, and the precision and processing quality of the drilling have an important impact on the circuit board.

With the rapid development of electronic technology, the size of the PCB structure is getting smaller and smaller, and the diameter of the PCB drilling hole is getting smaller and smaller, which puts forward higher requirements on the processing accuracy and processing speed of the PCB.

SUMMARY OF THE INVENTION

The present application provides a circuit board drilling method and a circuit board drilling machine, so as to improve the drilling accuracy of the circuit board and at the same time improve the drilling processing speed of the circuit board, thereby achieving the purpose of improving the production efficiency of the circuit board .

Provided is a method for drilling a circuit board, which is performed by a drilling machine for a circuit board, the drilling machine for a circuit board includes a work surface and at least one drilling tool; wherein, the work surface is configured to place a hole to be drilled a circuit board; each drilling tool includes a drill and a pressure foot disposed around the drill;

The drilling method includes: a first stage, a second stage, a third stage, a fourth stage, a fifth stage and a sixth stage;

In the first stage, the speed of controlling the drill tool and the pressure foot to simultaneously accelerate from the initial position along the first direction to the speed of the drill tool and the pressure foot is the first speed V1;

In the second stage, the drill and the pressure foot are controlled to decelerate along the first direction at the same time, and when the speed of the drill and the pressure foot is the second speed V2, the pressure The feet touch the circuit board to be drilled and press the circuit board to be drilled;

In the third stage, the pressure foot remains stationary, and when the drill is controlled to decelerate along the first direction to a third speed V3, the drill touches the circuit board to be drilled;

In the fourth stage, the pressure foot is kept still, and the drill is controlled to move a first distance S1 in the circuit board to be drilled along the first direction at the third speed V3;

In the fifth stage, the pressure foot remains stationary, and the speed at which the drill is controlled to accelerate along the first direction in the circuit board to be drilled to the speed of the drill is the fourth speed V4, and move at a constant speed along the first direction in the circuit board to be drilled at the fourth speed V4;

In the sixth stage, the drill is controlled to decelerate and move along the first direction in the circuit board to be drilled until the speed of the drill is 0 m/min, and the drill drills to the The drilling cut-off point of the circuit board to be drilled, completes the drilling stroke of the circuit board to be drilled;

Wherein, the first direction is the vertical direction in which the drilling tool points to the work table, and the first distance S1 is greater than 0.

Also provided is a circuit board drilling machine, comprising: a work surface, at least one drilling tool and a controller;

In the case where the circuit board to be drilled placed on the work surface is drilled with the at least one drilling tool, the controller is configured to perform the above-mentioned method for drilling the circuit board.

Description of drawings

1 is a schematic diagram of a partial structure of a drilling machine provided by an embodiment of the present application;

2 is a flowchart of a method for drilling a circuit board provided by an embodiment of the present application;

3 is a drilling sequence diagram of a circuit board provided by an embodiment of the present application;

4 is a schematic top-view structural diagram of a circuit board to be drilled provided by an embodiment of the present application;

FIG. 5 is a flowchart of another method for drilling a circuit board provided by an embodiment of the present application.

Detailed ways

The present application will be described below with reference to the accompanying drawings and embodiments.

FIG. 1 is a schematic partial structure diagram of a drilling machine provided by an embodiment of the present application. As shown in FIG. 1 , the drilling machine includes a work surface 10 and at least one drilling tool 20 . The work surface 10 is configured to place the circuit board 30 to be drilled; the drilling tool 20 includes a drill tool 22 and a pressure foot 21 arranged around the drill tool 22 .

The circuit board 30 to be drilled placed on the work surface 10 may include a cover plate 31 , a circuit board main body 32 and a backing plate 33 , and the cover plate 31 and the backing plate 33 are arranged to protect the circuit board main body 32 in the middle. The circuit board main body 32 of the circuit board 30 to be drilled is composed of multi-layer circuit structures, and the multi-layer circuit structures need to be electrically connected through corresponding communication holes. Generally, after the multi-layer circuit structure is assembled into the circuit board body 32, the via holes for connecting the multi-layer circuit structures are provided by drilling, and each circuit board 30 to be drilled may include one or more via holes. Before drilling, a cover plate 31 and a backing plate 33 are respectively provided on the upper and lower surfaces of the circuit board main body 32 to protect the circuit board main body 32 .

When drilling the to-be-drilled circuit board 30 , the pressure feet 21 of the drilling tool 20 will contact the cover plate 31 and press the to-be-drilled circuit board 30 to fix the to-be-drilled circuit board 30 ; And the drill 22 of the drilling tool 20 will descend to contact with the circuit board 30 to be drilled after the pressure foot 21 is pressed against the circuit board 30 to be drilled, and continue to descend to drill the circuit board 30 to be drilled. When using the drilling tool 20 to drill the circuit board 30 to be drilled, the drilled hole may be a through hole or a blind hole, which is not limited in the embodiment of the present application.

FIG. 1 is only an exemplary drawing of an embodiment of the present application, and FIG. 1 exemplarily shows a drilling tool 20 in a drilling machine. However, in the embodiment of the present application, the drilling machine may include one drilling tool, two drilling tools, or multiple drilling tools, and when the drilling machine includes two or more drilling tools, multiple drilling tools can be controlled simultaneously. Each drilling tool drills the same circuit board to be drilled or different circuit boards to be drilled, and the embodiment of the present application does not limit the number of drilling tools in the drilling machine.

When the drill of the drilling tool is used to drill the circuit to be drilled, the lower the drilling speed of the drill, the smaller the sliding amount of the drill when it contacts the circuit board to be drilled, and the higher the drilling accuracy. However, when the drilling speed is reduced, the drilling time will increase accordingly, thereby reducing the drilling efficiency and thus the overall production efficiency of the circuit board.

An embodiment of the present application provides a method for drilling a circuit board, the method for drilling a circuit board is performed by a drilling machine for the circuit board, and the operation state of the drilling tool in the drilling machine can be controlled. FIG. 2 is a flowchart of a method for drilling a circuit board provided by an embodiment of the present application. As shown in Figure 2, the drilling method of the circuit board includes:

S110. In the first stage, control the drill tool and the pressure foot to simultaneously accelerate from the initial position along the first direction until the speed of the drill tool and the pressure foot is the first speed V1.

FIG. 3 is a drilling sequence diagram of a circuit board provided by an embodiment of the present application. 1 and FIG. 3 , at the start time T0 of the first stage, the drilling positions of the drilling tool 20 and the connecting holes of the circuit board 30 to be drilled have been aligned, and the drilling tool 20 is in the initial position. When the drilling tool 20 is in the initial position, the side surface of the pressure foot 21 of the drilling tool 20 close to the work table 10 (ie the bottom surface of the pressure foot 21 ) and the side surface of the circuit board 30 to be drilled away from the work table 10 The distance between the top surface of the cover plate 31 or the upper surface of the circuit board 30 to be drilled is the first distance L1, and the tip of the drill tool 22 of the drilling tool 20 and the pressure foot 21 of the drilling tool 20 The distance between one side surface close to the work table 10 (that is, the bottom surface of the pressure foot 21) is the second distance L2, the distance between the cutting edge of the drill 22 and the drilling cut-off point is the total drilling distance L, and the distance to be The required drilling depth for drilling the circuit board 30 is L3=L-L1-L2. When the drilling tool 20 is directed to the vertical direction of the work table 10 as the first direction +Z, the pressure foot 21 of the drilling tool 20 is controlled between the start time T0 of the first stage and the end time T1 of the first stage Simultaneously with the drilling tool 22 along the first direction +Z, the movement is accelerated with the maximum acceleration that the drilling tool 20 can move, and at the end time T1 of the first stage, the speed of the pressure foot 21 and the drilling tool 22 is increased to the level of the drilling tool The maximum moving speed of 20, that is, the first speed V1. At this time, neither the pressure foot 21 nor the drill 22 touches the circuit board 30 to be drilled.

S120. In the second stage, control the drill blade and the pressure foot to decelerate in the first direction at the same time. When the speed of the drill blade and the pressure foot is the second speed V2, the pressure foot touches the circuit board to be drilled and presses it tightly. The circuit board to be drilled.

Referring to FIGS. 1 and 3 , since neither the pressure foot 21 nor the drill 22 touches the circuit board 30 to be drilled at the end of the first stage, it is necessary to continue to control the pressure foot 21 and the drill 22 to continue along the first direction +Z sports. At the start time T2 of the second stage, the speed of the pressure foot 21 and the drill 22 is the first speed V1. In the second stage, the pressure foot 21 and the drill 22 are controlled to continue to move along the first direction +Z while decelerating at the maximum acceleration, and at the end time T3 of the second stage, the bottom surface of the pressure foot 21 is just in line with the circuit board to be drilled The upper surface of 30 contacts and presses the circuit board 30 to be drilled, and the pressure foot 21 and the drill 22 decelerate to the second speed V2 at the same time. At this time, the drill blade 22 has not yet touched the circuit board 30 to be drilled.

In this way, in the first stage, the pressure foot 21 and the drill 22 are controlled to accelerate to the maximum movement speed (the first speed V1) of the pressure foot 21 and the drill 22 at the same time, so as to shorten the time before the pressure foot 21 contacts the circuit board 30 to be drilled. In the second stage, the pressure foot 21 and the drill 22 are controlled to decelerate to a smaller speed (the second speed V2) at the same time, so that the pressure foot 21 can be at a smaller speed with the circuit board 30 to be drilled. contact to reduce the vibration caused by the impact of the circuit board 30 to be drilled when the pressure foot 21 is in contact, and prevent the displacement of the circuit board 30 to be drilled and the phenomenon that the drilling position is displaced, so that the On the premise of ensuring high drilling accuracy, the time for the pressure foot 21 to move the first distance L1 is shortened, thereby helping to improve the production efficiency of the circuit board 30 to be drilled.

S130. In the third stage, the pressure foot remains stationary, and when the drill is controlled to decelerate to the third speed V3, the drill touches the circuit board to be drilled.

S140. In the fourth stage, the pressure foot remains stationary, and the drill continues to move the first distance S1 in the circuit board to be drilled along the first direction at the third speed V3.

1 and 3 , since the drill 22 has not touched the circuit board 30 to be drilled at the end of the second stage, it is necessary to continue to control the drill 22 to move in the first direction +Z. At the start time T4 of the third stage, the drill 22 is maintained at the speed at the end time T3 of the second stage (ie, the second speed V2). In the third stage, the pressure foot 21 keeps pressing the circuit board 30 to be drilled, and only controls the drill 22 to continue to decelerate along the first direction +Z with the maximum acceleration, and at the end time T5 of the third stage , the drill 22 decelerates to the third speed V3; at this time, the drill 22 just touches the circuit board 30 to be drilled. The fourth stage is entered from time T5, and in the fourth stage, the drill 22 maintains a relatively small moving speed (ie, the third speed V3) and continues to cut into the circuit board 30 to be drilled along the first direction +Z, and moves at the third At the speed V3, the circuit board 30 to be drilled is drilled down the first distance S1 at a constant speed, so as to locate the drilling position of the circuit board 30 to be drilled. Wherein, the first distance S1 may be greater than 0.

In this way, the drill 22 can touch the circuit board 30 to be drilled at the minimum moving speed (ie, the third speed V3 ), that is, the drill 22 touches the circuit board 30 to be drilled with less kinetic energy, thereby reducing the need for drilling The slippage of the circuit board 30 and the deformation of the drill 22 are adjusted so that the drill 22 can accurately cut into the drilling position of the circuit board 30 to be drilled, thereby improving the positioning accuracy of the drilling position and further improving the drilling accuracy.

S150. In the fifth stage, the pressure foot is kept still, and the drill is controlled to accelerate in the circuit board to be drilled until the speed of the drill is the fourth speed V4, and the inner edge of the circuit board to be drilled is controlled at the fourth speed V4. Uniform motion in the first direction.

S160. In the sixth stage, control the drill to decelerate and move in the circuit board to be drilled until the speed of the drill is 0 m/min, and the drill reaches the drilling cut-off point of the circuit board to be drilled, and the circuit to be drilled is completed. Drilling stroke of the plate.

Referring to FIG. 1 and FIG. 3 in combination, the end time of the fourth stage and the start time of the fifth stage are both time T6, and the speed of the drill 22 at the time T6 is the third speed V3. In the fifth stage, the drill 22 is first controlled to accelerate to the maximum drilling speed (ie, the fourth speed V4 ) at the maximum acceleration, and continue to move in the circuit board 30 to be drilled along the first direction +Z at the fourth speed V4 Move at a constant speed for a period of time until the end time T7 of the fifth stage. Meanwhile, the end time of the fifth stage is the start time of the sixth stage, and the speed of the drill 22 at this time is the fourth speed V4. In the sixth stage, the drill 22 is controlled to continue to move along the first direction +Z with the maximum acceleration in the circuit board 30 to be drilled, and at the end time T8 of the sixth stage, the drill 22 decelerates to V0=0m/min, And the drill 22 just reaches the drilling cut-off position of the circuit board 30 to be drilled. Since the speed of the drill 22 in contact with the upper surface of the circuit board 30 to be drilled is relatively slow, the drill 22 has a smaller deformation amount and the circuit board 30 to be drilled has a smaller slip. It can have high drilling positioning accuracy, so as to have high drilling accuracy in the early stage of drilling, and in the subsequent drilling process, even if the speed of the drill 22 is increased to the maximum speed of drilling (the fourth speed). V4), the overall drilling accuracy of the circuit board 30 to be drilled can still be guaranteed. At the same time, when the speed of the drill 22 is increased to the maximum speed of drilling (the fourth speed V4) during the drilling process, the time required for drilling can be shortened, thereby reducing the time required for drilling the circuit board 30 to be drilled. Therefore, on the premise of ensuring high drilling accuracy, the drilling time can be shortened and the production efficiency of the circuit board 30 to be drilled can be improved.

In the circuit board drilling machine and the drilling method provided by the embodiments of the present application, before the pressure foot touches the circuit board to be drilled, the drilling tool for drilling and the pressure foot for fixing the circuit board are controlled to accelerate movement, In order to shorten the time required for the pressure foot to contact the circuit board; and before the pressure foot contacts the circuit board, control the pressure foot and the drill to decelerate at the same time, so that the pressure foot can have a smaller speed when it contacts the circuit board, preventing When the pressure foot is in contact with the circuit board, the speed is high, which has a large impact on the circuit board, causing the circuit board to be drilled to have a large slip displacement, which affects the drilling accuracy; between the pressure foot and the circuit board After the contact and before the drill is in contact with the circuit board, the pressure foot can be controlled to keep the circuit board pressed to achieve the purpose of fixing the circuit board. Speed contact with the circuit board, reduce the amount of deformation generated when the drill is in contact with the circuit board, and reduce the impact of the drill on the circuit board to be drilled, so as to reduce the slip of the circuit board to be drilled, thereby improving Drilling accuracy; after the drill is in contact with the circuit board, it can be maintained at the speed when the drill is in contact with the circuit board, that is, a certain depth is drilled at a small speed to accurately locate the drilling position, and then control the drill. Accelerate to the maximum drilling speed, and control the drill to drill at the maximum drilling speed, and control the acceleration of the drill in advance before the end of drilling, so that when the drill reaches the cut-off point, it can just decelerate to 0m/min. In this way, on the premise of ensuring high drilling accuracy, the drilling efficiency can be improved, thereby improving the production efficiency of the circuit board.

In the fifth stage, the preset drilling speed F needs to be obtained first, and the preset drilling speed F is the drilling speed set by the system, not the maximum drilling speed; according to the obtained preset drilling speed F, Control the drill 22 to accelerate from the third speed V3 to the fourth speed V4, the fourth speed V4 is k*F, k is the speed coefficient, and 1≤k≤1.5; and the drill 22 is accelerated to the fourth speed V4 At this time, the drill 22 is controlled to continue to move at a constant speed in the circuit board 30 to be drilled in the first direction +Z at the fourth speed V4=k*F, until the remaining drilling distance is from the fourth speed V4 at the maximum acceleration Just when the speed is V0=0m/min, stop moving at a constant speed, enter the sixth stage, and in the sixth stage, decelerate to the speed V0=0m/min with the maximum acceleration and end the drilling. Optionally, the ratio between the second speed V2 and the preset drilling speed F may be 0.5; the ratio between the third speed V3 and the preset drilling speed F may be 0.4, and the value range of the first speed V1 may be 6m/min<V1<8m/min.

Fig. 3 is only an exemplary drawing of the embodiment of the present application, and the acceleration process and deceleration process of the drilling tool in Fig. 3 are both fixed accelerations, that is, the acceleration motion is uniform acceleration motion, and the deceleration motion is uniform deceleration motion; The acceleration process and the deceleration process of the drilling tool in the application embodiment can also be a square wave variable speed process or a variable acceleration process, that is, the acceleration motion can also be an intermittent uniform acceleration motion or a variable acceleration acceleration motion, and the deceleration motion can also be intermittent. The uniform deceleration motion or the deceleration motion with variable acceleration, and the acceleration and deceleration methods of multiple stages are the same or different, the embodiments of the present application do not limit the acceleration motion process and the deceleration motion process of the drilling tool.

Optionally, when the pressure foot and the drill move toward the circuit board to be drilled, it is also necessary to align the tip of the drill with the drilling position of the circuit board to be drilled, that is, before the first stage, it is also necessary to include a pair of bit stage. FIG. 4 is a schematic top-view structural diagram of a circuit board to be drilled provided by an embodiment of the present application. 1, 3 and 4, in the alignment stage (T0'-T0), the drilling tool 20 (the pressure foot 21 and the drilling tool 22) moves along the second direction X and/or the third direction Y to The horizontal drilling position 301 of the circuit board 30 to be drilled. Wherein, the horizontal drilling position 301 of the circuit board 30 to be drilled is the initial position of the drilling tool 20, that is, the horizontal position in the circuit board 30 to be drilled for setting communication holes; the second direction X and the third The directions Y intersect, and both the second direction X and the third direction Y are perpendicular to the first direction +Z.

Optionally, as shown in FIG. 1 and FIG. 3 , if the alignment stage is over, but before the first stage starts, the side surface of the pressure foot 21 close to the work table 10 and a side surface of the circuit board 30 to be drilled away from the work table 10 . The distance between the side surfaces is the first distance L1, while the distance the drill 22 and the pressure foot 22 move in the first direction +Z in the first stage (T0-T1) is the second distance S2, and in the second stage In (T2-T3), the distance between the drill 22 and the pressure foot 22 moving in the first direction +Z is the third distance S3, and S2+S3<L1, the drilling method should also include the first stage and the second stage. The first uniform motion phase between T1-T2. In the first uniform motion stage T1-T2, the drill 22 and the pressure foot 21 simultaneously move a fourth distance S4 in the first direction +Z at the maximum motion speed (the first speed V1) of the drill 22 and the pressure foot 21, so that S2+S3+S4=L1; that is, the combination of the first stage, the first constant speed stage and the second stage is the stage from the initial position of the pressure foot 21 to the contact with the circuit board 30 to be drilled, so as to ensure that the pressure foot 21 and the to-be-drilled circuit board 30 are combined. On the premise that the drilling circuit board 30 has a relatively small speed when contacting, the time required for the pressing foot 21 to press the circuit board 30 to be drilled from the initial position is shortened.

Optionally, as shown in FIG. 1 and FIG. 3 , at the end of the second stage, the distance between the tool tip of the drill and the side surface of the circuit board to be drilled away from the work surface is the second distance L2. , the second distance L2 is the vertical distance between the tip of the drill 22 and the bottom surface of the pressure foot 21 at the initial position, and in the third stage, the drill 22 moves along the first direction +Z If the distance is the fifth distance S5, and S5<L2, the drilling method should further include a second uniform motion stage T3-T4 between the second stage and the third stage. In the second constant speed stage T3-T4, the drill 22 moves at a second speed V2 along the first direction +Z at a constant speed for a sixth distance S6, so that S5+S6=L2; that is, the press foot 21 presses the circuit board 30 to be drilled Then, the second uniform speed stage and the third stage structure constitute the stage where the drill 22 moves independently to the stage of contacting the circuit board 30 to be drilled, so as to ensure that the drill 22 has a lower speed when contacting the circuit board 30 to be drilled, The drill 22 has a small amount of deformation and the circuit board 30 to be drilled has a small slip, so that the drill 22 can be shortened from the initial position to the point of contact with the to-be-drilled under the premise of ensuring high drilling accuracy. The time required for the circuit board 30.

Optionally, the above-mentioned first to sixth stages are all the drilling process of the drilling tool. After the drilling tool reaches the drilling cut-off position of the circuit board to be drilled, the drilling tool needs to be lifted until it returns to the initial position. FIG. 5 is a flowchart of another method for drilling a circuit board provided by an embodiment of the present application. As shown in Figure 5, the drilling method of the circuit board includes:

S210. In the first stage, control the drill tool and the pressure foot to simultaneously accelerate from the initial position along the first direction until the speed of the drill tool and the pressure foot is the first speed V1.

S220. In the first stage of constant speed movement, the drill blade and the pressure foot simultaneously move at a first speed V1 along a first direction at a constant speed for a fourth distance S4.

S230. In the second stage, control the drill and the pressure foot to decelerate in the first direction at the same time. When the speed of the drill and the pressure foot is the second speed V2, the pressure foot touches the circuit board to be drilled and presses it tightly. The circuit board to be drilled.

S240. In the second constant speed stage, the drill cutter moves at a constant speed along the first direction for a sixth distance S6 at the second speed V2.

S250. In the third stage, the pressure foot remains stationary, and when the drill is controlled to decelerate to the third speed V3, the drill touches the circuit board to be drilled.

S260. In the fourth stage, the pressure foot remains stationary, and the drill continues to move the first distance S1 in the circuit board to be drilled along the first direction at the third speed V3.

S270. In the fifth stage, the pressure foot is kept still, the drill is controlled to accelerate in the circuit board to be drilled until the speed of the drill is the fourth speed V4, and the inner edge of the circuit board to be drilled is controlled at the fourth speed V4. Uniform motion in the first direction.

S280. In the sixth stage, control the drill to decelerate and move in the circuit board to be drilled until the speed of the drill is 0 m/min. Drilling stroke of the plate.

S290. In the seventh stage, the drill is controlled to accelerate along the fourth direction until the speed of the drill is the fifth speed V5, and after moving at a constant speed at the fifth speed V5 for a preset time, the drill is controlled to decelerate along the fourth direction When the speed of the drill blade is 0m/min, the drill blade and the pressure foot return to the original position at the same time.

1 and 3, at the end time T8 of the sixth stage, the speed of the drill 22 is reduced to V0, and the drill 22 reaches the drilling cut-off point of the circuit board 30 to be drilled, ending the process of drilling down; , start to enter the seventh stage, you can first control the drill 22 to accelerate along the fourth direction -Z with the maximum acceleration until the speed of the drill 22 is the maximum lifting speed (the fifth speed V5); in the control of the drill 22 to the fifth speed V5 moves at a constant speed for a period of time. For example, when the drill tool returns from the position where the constant speed movement ends to the initial position, it can decelerate from the fifth speed V5 to a speed of 0m/min at the maximum acceleration. During this process, the pressure foot 21 and the drill 22 also return to the initial position at the same time.

Embodiments of the present application also provide a circuit board drilling machine, which may include a work surface, at least one drilling tool, and a controller; wherein, when the drilling tool is used to drill holes placed on the work surface When drilling the circuit board, the controller is configured to execute the method for drilling the circuit board provided by the embodiments of the present application.

Since the circuit board drilling machine provided by the embodiments of the present application can be configured to perform the circuit board drilling method provided by the embodiments of the present application, the circuit board drilling machine provided by the embodiments of the present application also has the functions provided by the embodiments of the present application. For the technical features and effects of the method for drilling a circuit board according to the present invention, reference may be made to the above description of the method for drilling a circuit board provided by the embodiments of the present application, and details are not repeated here.

Claims

A circuit board drilling method, applied to a circuit board drilling machine, the circuit board drilling machine comprising a work surface and at least one drilling tool; wherein, the work surface is configured to place a circuit board to be drilled ; each drilling tool includes a drill and a pressure foot arranged around the drill;

The drilling method includes: a first stage, a second stage, a third stage, a fourth stage, a fifth stage and a sixth stage;

In the first stage, the speed of controlling the drill tool and the pressure foot to simultaneously accelerate from the initial position along the first direction to the speed of the drill tool and the pressure foot is the first speed V1;

In the second stage, the drill and the pressure foot are controlled to decelerate along the first direction at the same time, and when the speed of the drill and the pressure foot is the second speed V2, the pressure The feet touch the circuit board to be drilled and press the circuit board to be drilled;

In the third stage, the pressure foot remains stationary, and when the drill is controlled to decelerate along the first direction to a third speed V3, the drill touches the circuit board to be drilled;

In the fourth stage, the pressure foot is kept still, and the drill is controlled to move a first distance S1 in the circuit board to be drilled along the first direction at the third speed V3;

In the fifth stage, the pressure foot remains stationary, and the speed at which the drill is controlled to accelerate along the first direction in the circuit board to be drilled to the speed of the drill is the fourth speed V4, and move at a constant speed along the first direction in the circuit board to be drilled at the fourth speed V4;

In the sixth stage, the drill is controlled to decelerate and move along the first direction in the circuit board to be drilled until the speed of the drill is 0 m/min, and the drill drills to the The drilling cut-off point of the circuit board to be drilled, completes the drilling stroke of the circuit board to be drilled;

Wherein, the first direction is the vertical direction in which the drilling tool points to the work table, and the first distance S1 is greater than 0.
The drilling method of claim 1, further comprising: an alignment stage prior to the first stage;

In the alignment stage, controlling the drilling tool to move to a horizontal drilling position of the circuit board to be drilled along at least one of the second direction and the third direction;

The horizontal drilling position of the circuit board to be drilled is the initial position, the second direction and the third direction intersect, and both the second direction and the third direction are the same as the third direction. One direction is vertical.
The drilling method according to claim 2, wherein, after the alignment stage is completed and before the first stage starts, a side surface of the pressure foot close to the work table is connected to the circuit to be drilled The distance between the side surfaces of the board away from the work surface is the first distance L1;

The distance that the drill and the pressure foot move in the first direction in the first stage is a second distance S2, and in the second stage the drill and the pressure foot move along the In the case where the distance of movement in the first direction is the third distance S3, and S2+S3<L1, the drilling method further includes a first uniform movement stage located between the first stage and the second stage ;

In the first stage of uniform motion, the drill and the pressure foot simultaneously move at the first speed V1 along the first direction for a fourth distance S4; where S2+S3+S4=L1.
The drilling method according to claim 1, wherein, at the end of the second stage, there is a gap between the tip of the drill and the side surface of the circuit board to be drilled away from the work surface. The spacing is the second spacing L2;

In the third stage, the distance that the drill cutter moves along the first direction is a fifth distance S5, and in the case of S5<L2, the drilling method further includes the drilling method in the second stage and the second stage. The second uniform motion stage between the third stages;

In the second constant speed stage, the drill cutter moves at a constant speed along the first direction for a sixth distance S6 at the second speed V2; wherein, S5+S6=L2.
The drilling method according to claim 1, wherein the speed at which the drill is controlled to accelerate along the first direction in the circuit board to be drilled to the drill is a fourth speed V4, And move at a constant speed along the first direction in the circuit board to be drilled at the fourth speed V4, including:

Get the preset drilling speed F;

According to the preset drilling speed F, the speed at which the drill is controlled to accelerate along the first direction in the circuit board to be drilled to the drill is k*F; wherein, V4=k* F, k is the speed coefficient, and 1≤k≤1.5;

The drill is controlled to move at a constant speed in the circuit board to be drilled along the first direction at a speed k*F.
The drilling method according to claim 5, wherein the ratio of the second speed V2 to the preset drilling speed F is 0.5;

The ratio between the third speed V3 and the preset drilling speed F is 0.4.
The drilling method according to claim 1, wherein the value range of the first speed V1 is: 6m/min<V1<8m/min.
The drilling method of claim 1, further comprising: a seventh stage subsequent to the sixth stage:

In the seventh stage, the speed at which the drill tool is accelerated to move along the fourth direction from the drilling cut-off point to the drill tool is controlled to be the fifth speed V5, and the fifth speed V5 is used to move along the fifth speed V5. After the four-direction uniform movement for a preset time, the drill is controlled to decelerate along the fourth direction until the speed of the drill is 0 m/min, and the drill and the pressure foot simultaneously return to the initial state Location.
The drilling method according to any one of claims 1 to 8, wherein the deceleration motion comprises at least one of continuous uniform deceleration motion, intermittent uniform deceleration motion and variable acceleration deceleration motion;

The acceleration motion includes at least one of continuous uniform acceleration motion, discontinuous uniform acceleration motion and variable acceleration acceleration motion.
A circuit board drilling machine, comprising: a work surface, at least one drilling tool and a controller;

In the case where the at least one drilling tool is used to drill the circuit board to be drilled placed on the work surface, the controller is configured to execute the circuit board according to any one of claims 1 to 9 drilling method.