CN114311130B

CN114311130B - Drilling machine for circuit board and drilling method thereof

Info

Publication number: CN114311130B
Application number: CN202011079721.8A
Authority: CN
Inventors: 袁绩
Original assignee: Suzhou Vega Technology Co Ltd
Current assignee: Suzhou Vega Technology Co Ltd
Priority date: 2020-10-10
Filing date: 2020-10-10
Publication date: 2022-09-09
Anticipated expiration: 2040-10-10
Also published as: CN114311130A; WO2022073288A1

Abstract

The embodiment of the invention discloses a drilling machine for a circuit board and a drilling method thereof, wherein in the first stage, a drill bit and a pressure foot are controlled to simultaneously accelerate to a first speed V1; in the second stage, the drill cutter and the pressure foot are controlled to simultaneously move at a reduced speed until the speed of the drill cutter and the speed of the pressure foot are a second speed V2, and the pressure foot touches the circuit board to be drilled and presses the circuit board to be drilled; in the third stage, controlling the drill cutter to continue to move at a third speed V3 in a decelerating manner, and enabling the drill cutter to touch the circuit board to be drilled; in a fourth stage, the drill continues to move the first distance S1 at a third speed V3; in the fifth stage, the drill is controlled to move at a fourth speed V4 in an accelerated mode until the drill moves at a constant speed at a fourth speed V4; and in the sixth stage, controlling the drill cutter to move in a decelerating manner until the speed of the drill cutter is 0m/min, and drilling the circuit board to be drilled to the drilling stopping point of the circuit board to be drilled by the drill cutter to complete the drilling stroke of the circuit board to be drilled. The embodiment of the invention has higher drilling precision and higher drilling efficiency.

Description

Drilling machine for circuit board and drilling method thereof

Technical Field

The embodiment of the invention relates to the technical field of numerical control drilling, in particular to a drilling machine for a circuit board and a drilling method thereof.

Background

A Printed Circuit Board (PCB) is a chassis for holding electronic components and realizes the interconnection of the components. Drilling is a very important process in the manufacturing process of the PCB, and the precision and the processing quality of the drilling have important influence on the circuit board.

However, with the rapid development of electronic technology, the size of the PCB structure is smaller and smaller, and the diameter of the PCB drilled hole is smaller and smaller, so that higher requirements are provided for the processing precision and the processing speed of the PCB, and how to further improve the drilling processing speed of the PCB on the premise of ensuring the drilling precision is a technical problem to be solved urgently at present.

Disclosure of Invention

In view of the above problems, embodiments of the present invention provide a drilling machine for a circuit board and a drilling method thereof, so as to improve the drilling precision of the circuit board and the drilling processing speed of the circuit board, thereby achieving the purpose of improving the production efficiency of the circuit board.

In a first aspect, an embodiment of the present invention provides a method for drilling a circuit board, which is performed by a drilling machine for a circuit board, the drilling machine for a circuit board including a work table and at least one drilling tool; the working table surface is used for placing a circuit board to be drilled; the drilling tool comprises a drill bit and a pressure foot arranged around the drill bit;

the drilling method comprises the following steps: a first stage, a second stage, a third stage, a fourth stage, a fifth stage and a sixth stage;

in the first stage, controlling the drill bit and the pressure foot to simultaneously do acceleration movement from the initial position along a first direction until the speed of the drill bit and the pressure foot is a first speed V1;

in the second stage, the drill cutter and the pressure foot are controlled to simultaneously perform deceleration movement along the first direction, and when the speeds of the drill cutter and the pressure foot are the second speed V2, the pressure foot touches the circuit board to be drilled and presses the circuit board to be drilled;

in the third stage, the pressure foot is kept still, and when the drill bit is controlled to perform deceleration movement to a third speed V3, the drill bit touches the circuit board to be drilled;

in the fourth stage, the pressure foot is kept still, and the drill bit continues to move at the third speed V3 along the first direction for a first distance S1 in the circuit board to be drilled;

in the fifth stage, the pressure foot is kept still, the drill cutter is controlled to move in the circuit board to be drilled in an accelerated mode until the speed of the drill cutter is a fourth speed V4, and the drill cutter moves in the circuit board to be drilled in the first direction at a constant speed at the fourth speed V4;

in the sixth stage, when the speed of the drill cutter moving in the circuit board to be drilled in a decelerating manner to the position where the drill cutter moves in the circuit board to be drilled is 0m/min, the drill cutter drills to a drilling cut-off point of the circuit board to be drilled, and the drilling stroke of the circuit board to be drilled is completed;

wherein the first direction is a vertical direction in which the drilling tool is pointed towards the work table, the first distance S1 being greater than 0.

Optionally, the method further includes: an alignment stage preceding the first stage;

in the alignment stage, controlling the drilling tool to move to a horizontal drilling position of the circuit board to be drilled along a second direction and/or a third direction;

the horizontal drilling position of the circuit board to be drilled is the initial position, the second direction and the third direction are crossed, and the second direction and the third direction are both perpendicular to the first direction.

Optionally, after the alignment stage is finished and before the first stage starts, a distance between a side surface of the pressure foot close to the workbench surface and a side surface of the circuit board to be drilled away from the workbench surface is a first distance L1;

when the distance of movement of the drill bit and the pressure foot in the first direction in the first stage is a second distance S2 and the distance of movement of the drill bit and the pressure foot in the first direction in the second stage is a third distance S3, and S2+ S3 < L1, the drilling method further comprises a first stage of constant motion between the first stage and the second stage;

in the first uniform motion stage, the drill bit and the pressure foot simultaneously move at the first speed V1 for a fourth distance S4 in the first direction; wherein, S2+ S3+ S4 is L1.

Optionally, at the end time of the second stage, the distance between the tool tip of the drill and the side surface of the circuit board to be drilled away from the work table is a second distance L2;

when the distance that the drill moves in the first direction in the third stage is a fifth distance S5, and S5 < L2, the drilling method further includes a second uniform motion stage between the second stage and the third stage;

in the second uniform motion stage, the drill bit moves uniformly in the first direction at the second speed V2 by a sixth distance S6; wherein, S5+ S6 ═ L2.

Optionally, the fifth stage specifically includes:

acquiring a preset drilling speed F;

controlling the speed of the drill cutter to move in the circuit board to be drilled in an accelerated mode to k x F according to the preset drilling speed F; wherein, V4 is k F, k is a speed coefficient, and k is more than or equal to 1 and less than or equal to 1.5;

and controlling the drilling knife to move at a constant speed in the circuit board to be drilled along the first direction at a speed k x F.

Optionally, the ratio of the second speed V2 to the preset drill-down speed F is 0.5;

the ratio of the third speed V3 to the preset drill-down speed F is 0.4.

Optionally, the value range of the first speed V1 is: v1 is more than 6m/min and less than 8 m/min.

Optionally, after the sixth stage, a seventh stage is further included:

and in the seventh stage, controlling the speed of the drill cutter moving in an accelerating manner along the fourth direction to the drill cutter to be a fifth speed V5, and after the drill cutter moves at a constant speed for a preset time at the fifth speed V5, controlling the speed of the drill cutter moving in a decelerating manner along the fourth direction to the drill cutter to be 0m/min, and simultaneously restoring the drill cutter and the pressure foot to the initial positions.

Optionally, the deceleration motion comprises at least one of a continuous uniform deceleration motion, an intermittent uniform deceleration motion and a deceleration motion with variable acceleration;

the acceleration motion includes at least one of a continuous uniform acceleration motion, an intermittent uniform acceleration motion, and a variable acceleration motion.

In a second aspect, an embodiment of the present invention further provides a drilling machine for a circuit board, including: a table top, at least one drilling tool, and a controller;

when the drilling tool is used for drilling a circuit board to be drilled on the working table, the controller is used for executing the drilling method of the circuit board.

According to the drilling machine for the circuit board and the drilling method thereof provided by the embodiment of the invention, before the pressure foot touches the circuit board to be drilled, the drilling tool for drilling and the pressure foot for fixing the circuit board are controlled to move in an accelerated manner, so that the time required before the pressure foot is contacted with the circuit board is shortened; before the pressure foot is contacted with the circuit board, the pressure foot and the drill are controlled to simultaneously perform deceleration movement, so that the pressure foot can have lower speed when contacting the circuit board, and the phenomenon that the circuit board to be drilled has larger slippage displacement and the drilling precision is influenced due to larger impact on the circuit board caused by higher speed when the pressure foot is contacted with the circuit board is prevented; after the pressure foot is contacted with the circuit board and before the drill bit is contacted with the circuit board, the pressure foot can be controlled to keep the pressing state of the circuit board still so as to achieve the purpose of fixing the circuit board, and meanwhile, the drill bit is controlled to do deceleration movement so as to enable the drill bit to be contacted with the circuit board at a lower speed, reduce the deformation quantity generated when the drill bit is contacted with the circuit board, and reduce the impact generated by the drill bit on the circuit board to be drilled so as to reduce the slippage quantity of the circuit board to be drilled, thereby improving the drilling precision; after the drill cutter is contacted with the circuit board, the speed of the drill cutter in contact with the circuit board can be kept, namely, the drill cutter is drilled at a certain depth at a lower speed so as to accurately position the drilling position, then the drill cutter is controlled to accelerate to the maximum drilling speed, the drill cutter is controlled to drill at the maximum drilling speed, and the drill cutter is controlled to accelerate in advance before the drilling is finished, so that the speed of the drill cutter can be reduced to 0m/min just when the drill cutter drills to a cut-off point. Therefore, the drilling efficiency can be improved on the premise of ensuring higher drilling precision, and the production efficiency of the circuit board is further improved.

Drawings

Fig. 1 is a partial structural schematic view of a drilling machine according to an embodiment of the present invention;

fig. 2 is a flowchart of a drilling method for a circuit board according to an embodiment of the present invention;

FIG. 3 is a timing diagram illustrating a drilling process of a circuit board according to an embodiment of the present invention;

fig. 4 is a schematic top view of a circuit board to be drilled according to an embodiment of the present invention;

fig. 5 is a flowchart of a drilling method for a circuit board according to another embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Fig. 1 is a partial structural schematic view of a drilling machine provided in an embodiment of the present invention. As shown in fig. 1, the drill comprises a work top 10 and at least one drilling tool 20. The working table top 10 is used for placing a circuit board 30 to be drilled; the drilling tool 20 comprises a drill 22 and a pressure foot 21 arranged around the drill 22.

Specifically, the circuit board 30 to be drilled, which is placed on the work table 10, may include a cover plate 31, a circuit board main body 32 and a backing plate 33, wherein the cover plate 31 and the backing plate 33 are mainly used for protecting the circuit board main body 32 in the middle. The circuit board main body 32 of the circuit board 30 to be drilled is composed of a plurality of circuit structures, and the circuit structures are electrically connected through corresponding communication holes. Typically, after the circuit structures are assembled into the circuit board main body 32, communication holes for connecting the circuit structures are provided by drilling, and each circuit board 30 to be drilled may include one or more communication holes. Before drilling, a cover plate 31 and a pad plate 33 are respectively disposed on the upper and lower surfaces of the circuit board main body 32 to protect the circuit board main body 32.

When the circuit board 30 to be drilled is drilled, the pressure foot 21 of the drilling tool 20 contacts with the cover plate 31 and presses the circuit board 30 to be drilled, so as to fix the circuit board 30 to be drilled; after the pressing foot 21 presses the circuit board 30 to be drilled, the drill 22 of the drilling tool 20 descends to contact the circuit board 30 to be drilled, and continues to descend to drill the circuit board 30 to be drilled. When the drilling tool 20 is used to drill a hole in the circuit board 30 to be drilled, the drilled hole may be a through hole or a blind hole, which is not specifically limited in the embodiment of the present invention.

It should be noted that fig. 1 is a drawing illustrating only an embodiment of the present invention, and fig. 1 illustrates an example of a drilling tool 20 in a drilling machine. In the embodiment of the present invention, the drilling machine may include one drilling tool, two drilling tools, or a plurality of drilling tools, and when the drilling machine includes two or more drilling tools, each drilling tool may be controlled to drill the same circuit board to be drilled or different circuit boards to be drilled.

When the drilling tool of the drilling tool is used for drilling the circuit to be drilled, the drilling speed of the drilling tool is smaller, the sliding amount of the drilling tool in contact with the circuit board to be drilled is smaller, and the drilling precision is higher. However, when the drilling speed is reduced, the drilling time is increased accordingly, thereby reducing the drilling efficiency and thus reducing the overall production efficiency of the circuit board. Therefore, as described in the background art, how to improve the drilling efficiency while ensuring higher drilling accuracy is an urgent technical problem to be solved by the embodiments of the present invention.

The embodiment of the invention provides a circuit board drilling method, which is executed by a circuit board drilling machine and can control the running state of a drilling tool in the drilling machine. Fig. 2 is a flowchart of a method for drilling a circuit board according to an embodiment of the present invention. As shown in fig. 2, the method for drilling the circuit board at least comprises the following steps:

s110, in the first stage, the drill bit and the pressure foot are controlled to simultaneously perform acceleration movement from the initial positions in the first direction until the speed of the drill bit and the pressure foot is the first speed V1.

Specifically, fig. 3 is a timing chart of drilling a circuit board according to an embodiment of the present invention. Referring to fig. 1 and 3, at the start time T0 of the first stage, the drilling of the hole by the drilling tool 20 has been completed in alignment with the position of the circuit board 30 to be drilled where the communication hole is provided, and the drilling tool 20 is in the initial position. When the drilling tool 20 is in the initial position, a first distance L1 is provided between a side surface of the pressure foot 21 of the drilling tool 20 close to the work table 10 (i.e., a bottom surface of the pressure foot 21) and a side surface of the circuit board 30 to be drilled away from the work table 10 (i.e., a top surface of the cover plate 31 or a top surface of the circuit board 30 to be drilled), a second distance L2 is provided between a tip of the drill 22 of the drilling tool 20 and a side surface of the pressure foot 21 of the drilling tool 20 close to the work table 10 (i.e., a bottom surface of the pressure foot 21), a total drilling distance L is provided between the tip of the drill 22 and a drilling cutoff point, and a required drilling depth of the circuit board 30 to be drilled is L3-L1-L2. When the vertical direction of the drilling tool 20 directed to the table top 10 is taken as the first direction + Z, the pressure foot 21 and the drill 22 of the drilling tool 20 are controlled to move simultaneously in the first direction + Z between the start time T0 of the first phase and the end time T1 of the first phase, accelerated at the maximum acceleration at which the drilling tool 20 can move, and the speeds of the pressure foot 21 and the drill 22 are increased to the maximum moving speed of the drilling tool, i.e., the first speed V1, at the end time T1 of the first phase. At this time, neither the pressure foot 21 nor the drill 22 contacts the circuit board 30 to be drilled.

And S120, controlling the drill cutter and the pressure foot to perform deceleration movement along the first direction at the same time in the second stage, and when the speeds of the drill cutter and the pressure foot are the second speed V2, touching the circuit board to be drilled by the pressure foot and pressing the circuit board to be drilled.

In particular, with continued reference to fig. 1 and 3, since at the end of the first phase, neither the pressure foot 21 nor the drill 22 touches the circuit board 30 to be drilled, it is necessary to continue to control the pressure foot 21 and the drill 22 to continue to move in the first direction + Z. At the start time T2 of the second phase, the speed of the pressure foot 21 and the drill 22 is the first speed V1. In the second phase, the pressure foot 21 and the drill 22 are controlled to continue to move in the first direction + Z while decelerating with the maximum acceleration, and at the end time T3 of the second phase, the bottom surface of the pressure foot 21 just contacts with the upper surface of the circuit board 30 to be drilled and presses the circuit board 30 to be drilled, and the pressure foot 21 and the drill 22 decelerate to the second speed V2 simultaneously. At this time, the drill 22 does not touch the circuit board 30 to be drilled.

In this way, the pressure foot 21 and the drill 22 are controlled to accelerate to the maximum movement speed (the first speed V1) of the pressure foot 21 and the drill 22 at the same time in the first stage, so as to shorten the time required before the pressure foot 21 contacts the circuit board 30 to be drilled; and in the second stage, the pressure foot 21 and the drill 22 are controlled to be decelerated to a smaller speed (the second speed V2) at the same time, so that the pressure foot 21 can be in contact with the circuit board 30 to be drilled at a smaller speed, the vibration caused by the impact generated on the circuit board 30 to be drilled when the pressure foot 21 is in contact is reduced, the phenomenon that the position of the drilled hole deviates due to the displacement of the circuit board 30 to be drilled is prevented, the time for the pressure foot 21 to move for the second distance L2 can be shortened on the premise of ensuring higher drilling precision, and the production efficiency of the circuit board 30 to be drilled is further improved.

S130, in the third stage, the pressure foot is kept still, and when the drill cutter is controlled to perform deceleration movement to a third speed V3, the drill cutter touches the circuit board to be drilled;

s140, in the fourth stage, the pressure foot is kept still, and the drill continues to move at the third speed V3 in the first direction within the circuit board to be drilled for the first distance S1.

In particular, with continued reference to fig. 1 and 3, it is necessary to continue to control the movement of the drill 22 in the first direction + Z, since at the end of the second phase, the drill 22 has not yet reached the circuit board 30 to be drilled. At the start time T4 of the third stage, the drill bit 22 is maintained at the speed at the end time T3 of the second stage (i.e., the second speed V2). In the third stage, the pressure foot 21 keeps the state of pressing the circuit board 30 to be drilled still, only the drill 22 is controlled to continue to move with the maximum acceleration deceleration along the first direction + Z, and at the end time T5 of the third stage, the drill 22 decelerates to the third speed V3; at this point, the drill bit 22 just touches the circuit board 30 to be drilled. And entering a fourth stage from the moment T5, wherein the drill 22 keeps a smaller movement speed (i.e. the third speed V3) to continuously cut into the circuit board 30 to be drilled along the first direction + Z, and drills down the circuit board 30 to be drilled at the third speed V3 for a first distance S1 at a constant speed so as to locate the drilling position of the circuit board 30 to be drilled. The first distance S1 is greater than 0.

In this way, the drill 22 can touch the circuit board 30 to be drilled at the minimum movement speed (i.e., the third speed V3), that is, the drill 22 touches the circuit board 30 to be drilled with relatively small kinetic energy, so that the sliding amount of the circuit board 30 to be drilled and the deformation amount of the drill 22 can be reduced, the drill 22 can accurately cut into the drilling position of the circuit board 30 to be drilled, the positioning accuracy of the drilling position is improved, and the drilling precision is further improved.

S150, in the fifth stage, the pressure foot is kept still, the drill cutter is controlled to move in the circuit board to be drilled in an accelerated mode until the speed of the drill cutter is the fourth speed V4, and the drill cutter moves in the circuit board to be drilled at a constant speed in the first direction at the fourth speed V4;

and S160, in the sixth stage, controlling the drill cutter to move in the circuit board to be drilled in a speed reducing manner until the speed of the drill cutter is 0m/min, and drilling the circuit board to be drilled to the drilling cut-off point of the circuit board to be drilled by the drill cutter to complete the drilling stroke of the circuit board to be drilled.

Specifically, with continued reference to fig. 1 and 3, the end time of the fourth phase and the start time of the fifth phase are both times T6, at which time T6 the speed of the drill bit 22 is the third speed V3. In the fifth stage, the drill 22 is controlled to move at the maximum acceleration speed to the maximum drilling speed (i.e. the fourth speed V4), and continues to move at the fourth speed V4 in the first direction + Z for a period of time at a constant speed in the circuit board 30 to be drilled, until the end time T7 of the fifth stage. Meanwhile, the end time of the fifth stage is the start time of the sixth stage, and the speed of the drill 22 is the fourth speed V4. In the sixth phase, the drill 22 is controlled to continue to move in the first direction + Z with the maximum acceleration in the circuit board 30 to be drilled, and at the end time T8 of the sixth phase, the drill 22 is decelerated to V0 which is 0m/min, and the drill 22 just reaches the drilling stop position of the circuit board 30 to be drilled. Because the speed of the drill 22 contacting the upper surface of the circuit board 30 to be drilled is slow, the drill 22 has a small deformation amount and the circuit board 30 to be drilled has a small slippage amount, so the drill 22 can have a high drilling positioning accuracy, and thus has a high drilling accuracy at the initial stage of drilling, and in the subsequent drilling process, even if the speed of the drill 22 is increased to the maximum drilling speed (the fourth speed V4), the overall drilling accuracy of the circuit board 30 to be drilled can still be ensured. Meanwhile, when the speed of the drill 22 is increased to the maximum drilling speed (the fourth speed V4) during the drilling process, the time required for drilling can be shortened, so that the time required for drilling the circuit board 30 to be drilled is reduced, the drilling time can be shortened on the premise of ensuring higher drilling precision, and the production efficiency of the circuit board 30 to be drilled is improved.

In the fifth stage, a preset drilling speed F is required to be obtained first, wherein the preset drilling speed is the drilling speed set by the system and is the maximum drilling speed; controlling the drill 22 to accelerate from a third speed V3 to a fourth speed V4 according to the obtained preset drilling speed F, wherein the fourth speed V4 is k F, k is a speed coefficient, and k is more than or equal to 1 and less than or equal to 1.5; and when the drill 22 accelerates to the fourth speed V4, the drill is controlled to continue to move at a constant speed in the circuit board 30 to be drilled along the first direction + Z at the fourth speed V4 ═ k × F until the remaining drilling distance is reduced from the fourth speed V4 at the maximum acceleration to the speed V0 ═ 0m/min, the constant speed movement is stopped, the sixth stage is performed, and the drilling is finished when the speed is reduced at the maximum acceleration to the speed V0 ═ 0m/min in the sixth stage. Optionally, the ratio of the second speed V2 to the preset drill-down speed F may be 0.5; the ratio of the third speed V3 to the preset drill-down speed F may be 0.4, and the first speed V1 may range from 6m/min < V1 < 8 m/min.

It should be noted that fig. 3 is a schematic diagram of an embodiment of the present invention, and both the acceleration process and the deceleration process of the drilling tool in fig. 3 are fixed accelerations, that is, the acceleration motion is a uniform acceleration motion, and the deceleration motion is a uniform deceleration motion; the acceleration process and the deceleration process of the drilling tool in the embodiment of the invention can also be a square wave speed changing process or a variable acceleration process, namely, the acceleration motion can also be intermittent uniform acceleration motion or acceleration motion with variable acceleration, the deceleration motion can also be intermittent uniform deceleration motion or deceleration motion with variable acceleration, and the acceleration and deceleration modes of each stage are the same or different.

Optionally, when the pressure foot and the drill move towards the circuit board to be drilled, the tool tip of the drill needs to be aligned with the drilling position of the circuit board to be drilled, that is, an alignment stage needs to be included before the first stage. Fig. 4 is a schematic top view of a circuit board to be drilled according to an embodiment of the present invention. Referring to fig. 3 and 4 in combination with fig. 1, in the alignment phase (T0' -T0), the drilling tool 20 (pressure foot 21 and drill 22)

To the horizontal drilling position of the circuit board 30 to be drilled in the second direction X and/or the third direction Y. Wherein, the horizontal drilling position of the circuit board 30 to be drilled is the initial position of the drilling tool 20, i.e. the horizontal position of the circuit board 30 to be drilled for setting the communication hole; the second direction X intersects the third direction Y, and both the second direction X and the third direction Y are perpendicular to the first direction + Z.

In addition, optionally, as shown in fig. 1 and fig. 3, if after the alignment phase is finished and before the first phase is started, the distance between the side surface of the pressure foot 21 close to the workbench 10 and the side surface of the circuit board 30 to be drilled away from the workbench 10 is the first distance L1, while the distance that the drill 22 and the pressure foot 22 move along the first direction + Z in the first phase (T0-T1) is the second distance S2, and the distance that the drill 22 and the pressure foot 22 move along the first direction + Z in the second phase (T2-T3) is the third distance S3, and S2+ S3 < L1, the drilling method further includes a first uniform motion phase T1-T2 between the first phase and the second phase. At the first uniform motion stage T1-T2, the drill bit 22 and the pressure foot 21 simultaneously move at a uniform speed in the first direction + Z by a fourth distance S4 at the maximum moving speed (first speed V1) of the drill bit 22 and the pressure foot 21, so that S2+ S3+ S4 is L1; the first stage, the first constant speed stage and the second stage are combined to be a stage from the initial position to the contact of the pressure foot 21 with the circuit board 30 to be drilled, so that the time required by the pressure foot 21 from the initial position to the pressing of the circuit board 30 to be drilled can be shortened on the premise of ensuring that the pressure foot 21 has a lower speed when contacting with the circuit board 30 to be drilled.

Optionally, as shown in fig. 1 and fig. 3, if at the end of the second stage, the distance between the tip of the drill and the surface of the circuit board to be drilled, which is far away from the work table, is a second distance L2, where the second distance L2 is the vertical distance between the tip of the drill 22 and the bottom surface of the pressure foot 21 at the initial position, and in the third stage, the distance that the drill 22 moves in the first direction + Z is a fifth distance S5, and S5 is less than L2, the drilling method further includes a second uniform motion stage T3-T4 between the second stage and the third stage. At a second uniform motion stage T3-T4, the drill 22 moves uniformly at a second speed V2 in the first direction + Z for a sixth distance S6, such that S5+ S6 is L2; namely, after the pressure foot 21 presses the circuit board 30 to be drilled, the second uniform motion stage and the third stage structure form a stage in which the drill 22 moves independently to contact the circuit board 30 to be drilled, so that the drill 22 has a smaller speed when contacting the circuit board 30 to be drilled, the drill 22 has a smaller deformation amount and the circuit board 30 to be drilled has a smaller slip amount, and the time required by the drill 22 to contact the circuit board 30 to be drilled from the initial position can be shortened on the premise of ensuring higher drilling precision.

Optionally, the first stage to the sixth stage are drilling tool descending processes, and after the drill tool drills to a drilling stop position of the circuit board to be drilled, the drill tool needs to be lifted up until the drill tool returns to the initial position. Fig. 5 is a flowchart of a drilling method for a circuit board according to another embodiment of the present invention. As shown in fig. 5, the method for drilling the circuit board includes:

s210, in the first stage, controlling the drill bit and the pressure foot to simultaneously make accelerated motion along the first direction from the initial positions until the speed of the drill bit and the pressure foot is a first speed V1;

s220, in the first uniform motion stage, the drill bit and the pressure foot simultaneously move at a first speed V1 for a fourth distance S4 along the first direction at a uniform speed;

s230, controlling the drill cutter and the pressure foot to perform deceleration movement along the first direction at the same time in the second stage, and when the speeds of the drill cutter and the pressure foot are the second speed V2, enabling the pressure foot to touch the circuit board to be drilled and tightly press the circuit board to be drilled;

s240, in the second uniform motion stage, the drill bit moves at a uniform speed for a sixth distance S6 along the first direction at a second speed V2;

s250, in the third stage, the pressure foot is kept still, and when the drill cutter is controlled to perform deceleration movement to a third speed V3, the drill cutter touches the circuit board to be drilled;

s260, in the fourth stage, the pressure foot is kept still, and the drill bit continues to move for a first distance S1 in the circuit board to be drilled along the first direction at a third speed V3;

s270, in the fifth stage, the pressure foot is kept still, the drill cutter is controlled to move in the circuit board to be drilled in an accelerated mode until the speed of the drill cutter is the fourth speed V4, and the drill cutter moves in the circuit board to be drilled at a constant speed along the first direction at the fourth speed V4;

s280, in the sixth stage, controlling the drill cutter to move in the circuit board to be drilled in a speed reducing manner until the speed of the drill cutter is 0m/min, and drilling the circuit board to be drilled to a drilling cut-off point of the circuit board to be drilled by the drill cutter to complete the drilling stroke of the circuit board to be drilled;

and S290, in the seventh stage, controlling the speed of the drill cutter to move in an accelerated manner along the fourth direction to the fifth speed V5, controlling the drill cutter to move in a decelerated manner along the fourth direction to the speed of the drill cutter to be 0m/min after the drill cutter moves at a constant speed for a preset time at the fifth speed V5, and simultaneously restoring the drill cutter and the pressure foot to the initial positions.

Specifically, with continuing reference to fig. 1 and 3, at the time T8 when the sixth stage ends, the speed of the drill 22 decreases to V0, and the drill 22 reaches the drilling cutoff point of the circuit board 30 to be drilled, and the drilling process is ended; at this time, the seventh stage is started, the drill 22 is controlled to move in the fourth direction-Z with the maximum acceleration to the maximum lifting speed (the fifth speed V5) of the drill 22; when the drill 22 is controlled to move at the constant speed V5 for a certain period of time, which may be, for example, from the position where the constant speed movement ends to the return initial position, the speed can be reduced from the fifth speed V5 to just 0m/min at the maximum acceleration. The pressure foot 21 is also restored to the initial position simultaneously with the drill 22 in the process.

Based on the same inventive concept, the embodiment of the invention also provides a drilling machine for the circuit board, which can comprise a working table, at least one drilling tool and a controller; the controller is used for executing the circuit board drilling method provided by the embodiment of the invention when the drilling tool is used for drilling the circuit board to be drilled on the worktable.

Since the drilling machine for circuit boards provided by the embodiment of the present invention can be used to execute the drilling method for circuit boards provided by the embodiment of the present invention, the drilling machine for circuit boards provided by the embodiment of the present invention also has the technical features and beneficial effects of the drilling method for circuit boards provided by the present invention in real time, and for the same points, reference may be made to the above description of the drilling method for circuit boards provided by the embodiment of the present invention, and details are not repeated herein.

It is to be noted that the foregoing description is only exemplary of the invention and that the principles of the technology may be employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A drilling method of a circuit board is characterized in that the drilling method is executed by a drilling machine of the circuit board, wherein the drilling machine of the circuit board comprises a working table and at least one drilling cutter; the working table surface is used for placing a circuit board to be drilled; the drilling tool comprises a drill bit and a pressure foot arranged around the drill bit;

in the first stage, controlling the drill bit and the pressure foot to simultaneously make an accelerating movement from the initial position in a first direction to the speed of the drill bit and the pressure foot to be a first speed V1;

in the fourth phase, the pressure foot is kept still, and the drill bit continues to move at the third speed V3 along the first direction for a first distance S1 in the circuit board to be drilled;

in the sixth stage, when the speed of the drill cutter in the circuit board to be drilled in the speed reduction mode is controlled to be 0m/min, the drill cutter drills to a drilling cut-off point of the circuit board to be drilled, and the drilling stroke of the circuit board to be drilled is completed;

wherein the first direction is a vertical direction in which the drilling tool points towards the work surface, the first distance S1 being greater than 0.

2. The drilling method of claim 1, further comprising: an alignment phase preceding the first phase;

3. The drilling method according to claim 2, characterized in that after the alignment stage is finished and before the first stage is started, the distance between the side surface of the pressure foot close to the workbench surface and the side surface of the circuit board to be drilled far away from the workbench surface is a first distance L1;

when the distance moved by the drill bit and the pressure foot in the first direction in the first stage is a second distance S2, and the distance moved by the drill bit and the pressure foot in the first direction in the second stage is a third distance S3, and S2+ S3 < L1, the drilling method further comprises a first constant velocity movement stage between the first stage and the second stage;

4. The drilling method according to claim 1, characterized in that at the end of the second stage, the distance between the tip of the drill and the side surface of the circuit board to be drilled away from the work table is a second distance L2;

in the second uniform motion stage, the drill bit moves uniformly in the first direction at the second speed V2 by a sixth distance S6; wherein, S5+ S6 is L2.

5. The drilling method according to claim 1, characterized in that the fifth phase comprises in particular:

acquiring a preset drilling speed F;

controlling the speed of the drill cutter to move in the circuit board to be drilled in an accelerated mode to k x F according to the preset drilling speed F; wherein, V4 ═ k × F, k is a speed coefficient, and k is more than or equal to 1 and less than or equal to 1.5;

and controlling the drill cutter to move at a constant speed in the circuit board to be drilled along the first direction at a speed k x F.

6. The drilling method according to claim 5, wherein the ratio of the second speed V2 to the preset drill-down speed F is 0.5;

the ratio of the third speed V3 to the preset drill-down speed F is 0.4.

7. The drilling method according to claim 1, wherein the first velocity V1 has a value range of: v1 is more than 6m/min and less than 8 m/min.

8. The drilling method according to claim 1, further comprising, after the sixth stage, a seventh stage of:

9. The drilling method according to any one of claims 1 to 8, wherein the deceleration motion comprises at least one of a continuous uniform deceleration motion, an intermittent uniform deceleration motion, and a variable acceleration deceleration motion;

10. A drilling machine for circuit boards, comprising: a table top, at least one drilling tool, and a controller;

the controller is configured to perform the method of drilling a circuit board according to any one of claims 1 to 9 when the drilling tool is used to drill a circuit board to be drilled placed on the table surface.