WO2022068567A1 - 用于承载芯片模块的卡片基材及其智能卡 - Google Patents

用于承载芯片模块的卡片基材及其智能卡 Download PDF

Info

Publication number
WO2022068567A1
WO2022068567A1 PCT/CN2021/118042 CN2021118042W WO2022068567A1 WO 2022068567 A1 WO2022068567 A1 WO 2022068567A1 CN 2021118042 W CN2021118042 W CN 2021118042W WO 2022068567 A1 WO2022068567 A1 WO 2022068567A1
Authority
WO
WIPO (PCT)
Prior art keywords
concave portion
degrees
contour
arc
end point
Prior art date
Application number
PCT/CN2021/118042
Other languages
English (en)
French (fr)
Inventor
潘艺文
张蓉
张溢琪
Original Assignee
上海伯乐电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海伯乐电子有限公司 filed Critical 上海伯乐电子有限公司
Priority to EP21874228.6A priority Critical patent/EP4202762A1/en
Publication of WO2022068567A1 publication Critical patent/WO2022068567A1/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/305Associated digital information
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate

Definitions

  • the invention relates to the field of smart cards, in particular to a card base material for carrying a chip module and a smart card with the card base material.
  • Smart card also known as IC card, smart card, microcircuit card, microchip module card, etc.
  • IC card also known as IC card, smart card, microcircuit card, microchip module card, etc.
  • the communication method between the smart card and the reader can be either contact or non-contact.
  • the contact smart card is in use, the integrated circuit of the card is directly contacted and connected with the external interface circuit through the tangible metal electrode contacts, so as to provide the power supply for the operation of the integrated circuit and exchange data.
  • the chip module of the contactless smart card is electrically connected to the sensing antenna inside the smart card through conductive materials such as solder paste, it only needs to be close to the card reading device when in use, that is, the data can be read by remote sensing with the card reading device through radio waves.
  • a three-roller tester that is, use three rollers to squeeze the chip
  • module and simulate reading devices such as bank deposit and withdrawal machines
  • the present invention aims to provide a card substrate for carrying a chip module that can solve or at least alleviate the above problems, and a smart card having the card substrate.
  • the present invention provides a card substrate for carrying a chip module, the card substrate having opposite first and second surfaces, and a card substrate recessed from the first surface toward the second surface.
  • a recessed portion for accommodating the chip module, the recessed portion includes a first recessed portion recessed from the first surface toward the second surface, and a bottom wall of the first recessed portion toward the second recessed portion.
  • the second concave portion whose surface is further concave, in the left-right direction, the size of the second concave portion gradually narrows from the middle to the two sides, and in the up-down direction, the size of the second concave portion gradually narrows from the middle to the two sides Narrowing, the first included angle is between 50 degrees and 80 degrees formed by the connection line between the right end point and the upper end point of the contour of the second concave part and the connection line between the right end point and the lower end point of the outline of the second concave part.
  • the second included angle formed by the connection line between the left end point and the upper end point of the contour of the second concave portion and the connection line between the left end point and the lower end point of the contour of the second concave portion is also 50 degrees to 80 degrees. between.
  • the connecting line between the upper end point and the left end point of the contour of the second concave portion and the connecting line between the upper end point and the right end point of the contour of the second concave portion form a third included angle, and the first The triangular angle is between 100 degrees and 130 degrees.
  • the ratio of the distance between the left and right end points of the contour of the second concave portion to the distance between the upper and lower end points of the contour of the second concave portion is between 1.2 and 2.5.
  • the outline of the second concave portion includes two curved sections arranged in the left-right direction and connected to each other, each curved section includes a first arc-shaped section substantially located in the middle, and is respectively connected to the Two second arc-shaped sections at both ends of the first arc-shaped section.
  • the central angle corresponding to the first arc-shaped section is between 81 degrees and 134 degrees, and the radius corresponding to the first arc-shaped section is between 0.4 mm and 1 mm.
  • the central angle corresponding to the second arc-shaped section is between 16 degrees and 40 degrees, and the radius corresponding to the second arc-shaped section is between 3 mm and 7 mm.
  • the curved section further includes two straight sections respectively connected to one end of the two second arc-shaped sections away from the first arc-shaped section.
  • the distance between the left and right endpoints of the outline of the second recessed portion is between 2.5mm and 7.5mm, and the distance between the upper and lower endpoints of the outline of the second recessed portion is between 2.5mm and 2.5mm. between 5mm.
  • the outline of the second concave portion includes two curved sections arranged in the left-right direction and connected to each other, the two curved sections together form a quadrilateral, and each curved section includes two straight areas
  • the profile further includes a circular arc-shaped connecting section for connecting two adjacent straight sections.
  • the contour of the second concave portion is used for good support and protection of the chip module, so that the chip module will not absorb too much vibration and extrusion during the three-roller test.
  • the contour of the second recess is substantially football-shaped.
  • the present invention provides a smart card.
  • the smart card includes the card base material and a chip module accommodated in the concave portion of the card base material.
  • the contour of the second concave portion in the present invention is similar to two opposite triangles, and when the chip module is assembled to the card substrate provided by the present invention, the chip module can be well supported and protected. Even during the three-roller test, the chip does not absorb much vibration and squeeze, which helps improve the pass rate of the chip's reliability test.
  • Fig. 1 is the three-dimensional schematic diagram that the smart card of the present invention carries out the three-roller test
  • Fig. 2 is a perspective view of another angle when the smart card shown in Fig. 1 performs a three-roller test;
  • Fig. 3 is the sectional view that the smart card shown in Fig. 1 carries out the three-roller test;
  • FIG. 4 is a plan view of the first embodiment of the smart card of the present invention.
  • Fig. 5 is a partial cross-sectional view of the smart card shown in Fig. 4;
  • Fig. 6 is a partial cross-sectional view of the card base material of the smart card shown in Fig. 4;
  • Fig. 7A is a partial top view of the card base material of the smart card shown in Fig. 4, wherein parameters related to angles are identified;
  • Fig. 7B is a partial top view of the card base material of the smart card shown in Fig. 4, wherein parameters related to distance are identified;
  • FIG. 8 is a partial cross-sectional view of the card base material of the second embodiment of the smart card of the present invention.
  • FIG. 9 is a partial top view of the card base material of the third embodiment of the smart card of the present invention.
  • FIG. 10 is a partial top view of the card base material of the fourth embodiment of the smart card of the present invention.
  • the smart card of the present invention includes a rectangular card base 10 and a chip module 20 accommodated in the card base 10 .
  • one of the rollers 30 is pressed against the surface of the chip module 20
  • the other two rollers 30 are pressed against a surface of the card substrate 10 opposite to the chip module 20 at intervals.
  • each roller 30 rolls back and forth along the length direction of the card base 10 to simulate a reading device such as a bank teller machine, so as to perform a reliability test on the chip module 20 .
  • the rolling direction of each roller 30 is consistent with the direction in which the smart card is inserted into or taken out of the cash machine.
  • the smart card of the present invention can adopt either a contact communication mode or a non-contact communication mode.
  • the metal layer of the chip module 20 for direct contact with the external interface circuit is formed on the outer surface of the chip module 20 and is preferably flush with the surface of the card base 10 .
  • the card substrate 10 of the smart card has opposite first surfaces 11 and second surfaces 12 , and a recessed surface 11 from the first surface 11 toward the second surface 12
  • the concave portion 13 for accommodating the chip module 20 .
  • the recessed portion 13 includes a first recessed portion 14 recessed from the first surface 11 of the card base 10 toward the second surface 12 of the card base 10 , and a bottom wall of the first recessed portion 14 .
  • the second recessed portion 15 is further recessed toward the second surface 12 of the card base 10 .
  • the first concave portion 14 is used to accommodate the substrate 21 of the chip module 20
  • the second concave portion 15 is used to accommodate the chip 22 of the chip module 20 , wherein the substrate 21 of the chip module 20 is electrically connected to the chip 22 .
  • the smart card in this embodiment can realize non-contact reading, and the card base 10 is further formed with two further recesses from the bottom wall of the first concave portion 14 toward the second surface 12 of the card base 10 .
  • There are three third concave portions 16 and the two third concave portions 16 are respectively located at both ends of the second concave portion 15 along the insertion direction of the smart card.
  • Conductive material 160 such as solder paste, is accommodated in the two third recessed portions 16 for connecting the positive and negative electrodes of the power supply of the chip module 20 and the antenna (not shown) arranged in the card base 10, respectively.
  • the insertion direction of the smart card is defined as the left-right direction X
  • the direction perpendicular to the insertion direction of the smart card is defined as the up-down direction Y.
  • the size of the second concave portion 15 of the card base 10 of the smart card of the present invention gradually narrows from the middle to the two sides.
  • the size of the second concave portion 15 of the card base material 10 of the smart card of the present invention also gradually narrows from the middle to both sides.
  • the included angle formed by the connecting line between the right end point and the upper end point of the contour of the second concave portion 15 and the connecting line between the right end point and the lower end point of the contour of the second concave portion 15 is R3 between 50 degrees and 80 degrees. between.
  • the included angle formed by the connecting line between the left end point and the upper end point of the contour of the second concave portion 15 and the connecting line between the left end point and the lower end point of the contour of the second concave portion 15 is also 50 degrees to 80 degrees. between degrees.
  • the included angle formed by the connecting line between the upper end point and the left end point of the contour of the second concave portion 15 and the connecting line between the upper end point and the right end point of the contour of the second concave portion 15 is R4.
  • the included angle R4 is between 100 degrees and 130 degrees.
  • the included angle formed by the connecting line between the lower end point and the left end point of the contour of the second concave portion 15 and the connecting line between the lower end point and the right end point of the contour of the second concave portion 15 is also 100 degrees to 130 degrees. between degrees.
  • the ratio of the distance M3 between the left and right end points of the contour of the second recessed portion 15 to the distance M1 between the upper and lower end points is between 1.2 and 2.5.
  • the distance M3 between the left and right end points of the outline of the second recessed portion 15 is between 2.5 mm and 7.5 mm.
  • the distance M1 between the upper and lower end points of the contour of the second recessed portion 15 is between 2.5 mm and 5 mm.
  • the contour of the second concave portion 15 of the present invention is similar to two opposite triangles, and when the chip module 20 is assembled into the card base 10 in this embodiment, the chip is well supported and protected. Even during the three-roller 30 test, the chip does not absorb much vibration and squeeze, thereby helping to improve the pass rate of the chip's reliability test.
  • the outline of the first concave portion 14 of the card base 10 is substantially rectangular and includes four first straight sections 140 connected end to end.
  • the contour of the first concave portion 14 further includes a circular arc-shaped first connecting section 141 for connecting two adjacent first straight sections 140 .
  • the outline of the second concave portion 15 of the card base 10 is approximately rugby-shaped, and includes two symmetrical and mutually connected curved sections 150 arranged along the left-right direction X.
  • the curved section 150 includes a first arc-shaped section 152 located approximately in the middle, two second arc-shaped sections 153 respectively connected to both ends of the first arc-shaped section 152, and respectively connected to Two second straight line segments 154 at one end of the two second arcuate segments 153 away from the first arcuate segment 152 .
  • a second straight section 154 of each curved section 150 is connected with a corresponding second straight section 154 of the other curved section 150 .
  • the two curved sections 150 may also be asymmetric in the left-right direction X.
  • the midpoints of the two first circular arc segments 152 are the left and right endpoints of the contour of the second recessed portion 15 , respectively.
  • Any point on the upper second straight section 154 is the upper end point of the contour of the second concave portion 15 .
  • Any point on the second straight section 154 on the lower side is the lower end point of the contour of the second concave portion 15 .
  • the central angle R1 corresponding to the first circular arc section 152 is between 81 degrees and 134 degrees.
  • the radius r1 of the first circular arc-shaped section 152 is between 0.4 mm and 1 mm.
  • the central angle R2 of the second circular arc section 153 is between 16 degrees and 40 degrees.
  • the radius r2 of the second circular arc-shaped section 153 is between 3 mm and 7 mm.
  • the contour of the second concave portion 15 in this embodiment includes six arc-shaped sections (two first arc-shaped sections 152 and four second arc-shaped sections 153 ) and two Line segments (each line segment includes two second line segments 154). It should be noted that the number and arrangement of the arc-shaped sections and the straight-line sections in this embodiment are only shown as examples, and in other embodiments, other numbers and arrangements of arc-shaped sections may also be used and straight segments. For example, in other embodiments, the contour of the second concave portion may be formed by connecting only a plurality of arc-shaped sections, or the above-mentioned first arc-shaped section 152 and the second arc-shaped section 153 may be composed of multiple sections respectively. Arc composition.
  • the contour of the second concave portion may be composed of a plurality of arc-shaped sections and a plurality of straight sections, wherein the plurality of arc-shaped sections may be connected in sequence, and the plurality of straight sections may be Sequentially connected and then connected to both ends of the aforesaid successively connected multiple arc-shaped segments, or, multiple arc-shaped segments and multiple linear segments may be arranged and connected periodically at intervals, or, multiple The arc-shaped section and the straight sections can be randomly connected and arranged randomly, as long as the finally formed second recess can use its specific shape to support and protect the chip module well.
  • the smart card of the second embodiment of the present invention is similar to the smart card of the first embodiment, and the similarities are not repeated here.
  • the main difference between the smart card of the second embodiment and the smart card of the first embodiment is that the smart card in this embodiment is a contact smart card, and the recessed portion 213 in the second embodiment no longer includes the aforementioned third recessed portion 16 .
  • the smart card of the third embodiment of the present invention is similar to the smart card of the first embodiment, and the similarities are not repeated here.
  • the main difference between the smart card of the third embodiment and the smart card of the first embodiment is that the contour of the second recess is slightly different.
  • the curved section 350 of the contour of the second concave portion 315 in this embodiment no longer includes the second straight section 154 , but only includes the first circular arc section 352 located approximately in the middle, and respectively
  • the two second arc-shaped sections 353 are connected to both ends of the first arc-shaped section 352 .
  • a second circular arc-shaped section 353 of each curved section 350 is directly connected with a corresponding second circular arc-shaped section 353 of the other curved section 350 .
  • the two curved sections 350 are symmetrical in the left-right direction.
  • the central angle R6 corresponding to the first circular arc section 352 is between 81 degrees and 134 degrees.
  • the radius r3 corresponding to the first circular arc section 352 is between 0.4 mm and 1 mm.
  • the central angle R7 corresponding to the second arc-shaped section 353 is between 16 degrees and 40 degrees.
  • the radius r4 corresponding to the second arc-shaped section 353 is between 3 mm and 7 mm.
  • Two adjacent second circular arc segments 353 may be on the same circumference, or may be on different circumferences. When two adjacent second circular arc segments 353 are on the same circumference, the two second circular arc segments 353 may also be merged to be regarded as a segment of circular arc.
  • the smart card of the fourth embodiment of the present invention is similar to the smart card of the first embodiment, and the similarities are not repeated here.
  • the main difference between the smart card of the fourth embodiment and the smart card of the first embodiment is that the contour of the second recess is different.
  • the curved section 450 of the second concave portion 415 in this embodiment includes two third straight sections 451 .
  • the two curved sections 450 together form a generally diamond-shaped outline.
  • the contour of the second concave portion 415 in this embodiment further includes a circular arc-shaped second connecting section 452 for connecting two adjacent third straight sections 451 .
  • a first included angle R8 is formed between the two third straight line segments 451 of each curved segment 450 , and the first included angle R8 is between 50 degrees and 80 degrees.
  • a second included angle R9 is formed between two adjacent third straight line segments 451 of the two curved segments 450 , and the second included angle R9 is between 100 degrees and 130 degrees.
  • the contour of the second concave portion 415 may not be a rhombus, but a quadrilateral formed by two asymmetrical triangles.
  • the two curved sections 450 may have different first included angles R8.

Abstract

一种用于承载芯片模块(20)的卡片基材(10),卡片基材(10)具有相对的第一表面(11)和第二表面(12)、以及自第一表面(11)凹陷的用于容纳芯片模块(20)的凹陷部(13),凹陷部(13)包括第一凹陷部(14)、以及自第一凹陷部(14)的底壁进一步凹陷的第二凹陷部(15);在左右方向(X)上,第二凹陷部(15)的尺寸从中间逐渐向两侧收窄;在上下方向(Y)上,第二凹陷部(15)的尺寸从中间逐渐向两侧收窄,第二凹陷部(15)的轮廓的右端点与上端点之间的连线和其右端点与下端点之间的连线形成的第一夹角(R3)在50度到80度之间,第二凹陷部(15)的轮廓的左端点与上端点之间的连线和其左端点与下端点之间的连线形成的第二夹角也在50度到80度之间。有益效果:可以对芯片模块(20)进行良好的支撑和保护。

Description

用于承载芯片模块的卡片基材及其智能卡 技术领域
本发明涉及智能卡领域,尤其涉及一种用于承载芯片模块的卡片基材、以及具有该卡片基材的智能卡。
背景技术
智能卡,又称IC卡、智慧卡、微电路卡、微芯片模块卡等,其因体积小便于携带、存储容量大、可靠性高、使用寿命长、保密性强、安全性高等特点而被广泛应用于支付卡、SIM卡、交通卡、信用卡等领域。智能卡与读写器之间的通讯方式既可以是接触式,也可以是非接触式。接触式智能卡在使用时,通过有形的金属电极触点将卡的集成电路与外部接口电路直接接触连接,提供集成电路工作的电源并进行数据交换。非接触式智能卡由于其芯片模块通过锡膏等导电材料与智能卡内部的感应天线电连接,使用时仅需接近读卡设备,即可以通过无线电波与读卡设备进行远距离感应而读取数据。
无论是接触式智能卡还是非接触式智能卡,其均包括卡片基材、以及收容于卡片基材内的芯片模块,且其在制造完成后往往需要通过三滚轮测试仪(即使用三滚轮挤压芯片模块而模拟银行存取款机等读取设备)进行可靠性测试。然而,现有一些类型的芯片模块比较薄而且软,在进行三滚轮测试时,芯片模块容易被损坏而导致无法通过可靠性测试。
技术问题
鉴于此,本发明旨在提供一种可以解决或至少减轻上述问题的用于承载芯片模块的卡片基材、以及具有该卡片基材的智能卡。
技术解决方案
一方面,本发明提供一种用于承载芯片模块的卡片基材,所述卡片基材具有相对的第一表面和第二表面、以及自所述第一表面朝向所述第二表面凹陷的用于容纳所述芯片模块的凹陷部,所述凹陷部包括自所述第一表面朝向所述第二表面凹陷的第一凹陷部、以及自所述第一凹陷部的底壁朝向所述第二表面进一步凹陷的第二凹陷部,在左右方向上,所述第二凹陷部的尺寸从中间逐渐向两侧收窄,在上下方向上,所述第二凹陷部的尺寸从中间逐渐向两侧收窄,第二凹陷部的轮廓的右端点与上端点之间的连线以及第二凹陷部的轮廓的右端点与下端点之间的连线形成的第一夹角50度到80度之间,第二凹陷部的轮廓的左端点与上端点之间的连线以及第二凹陷部的轮廓的左端点与下端点之间的连线形成的第二夹角也在50度到80度之间。
优选地,所述第二凹陷部的轮廓的上端点与左端点之间的连线以及第二凹陷部的轮廓的上端点与右端点之间的连线形成一第三夹角,所述第三夹角在100度到130度之间。
优选地,第二凹陷部的轮廓的左、右端点之间的距离与第二凹陷部的轮廓的上、下端点之间的距离的比值在1.2至2.5之间。
优选地,所述第二凹陷部的轮廓包括沿左右方向布置且彼此连接的两个弯曲区段,每一弯曲区段包括大致位于中部的第一圆弧形区段、以及分别连接于所述第一圆弧形区段的两端的两第二圆弧形区段。
优选地,所述第一圆弧形区段对应的圆心角在81度到134度之间,所述第一圆弧形区段对应的半径在0.4mm到1mm之间。
优选地,所述第二圆弧形区段对应的圆心角在16度到40度之间,所述第二圆弧形区段对应的半径在3mm到7mm之间。
优选地,所述弯曲区段还包括分别连接于所述两第二圆弧形区段的远离所述第一圆弧形区段的一端的两直线区段。
优选地,所述第二凹陷部的轮廓的左、右端点之间的距离在2.5mm至7.5mm之间,所述第二凹陷部的轮廓的上、下端点之间的距离在2.5mm~5mm之间。
优选地,所述第二凹陷部的轮廓包括沿左右方向布置且彼此连接的两个弯曲区段,所述两个弯曲区段共同围合形成一四边形,每一弯曲区段包括两个直线区段,所述轮廓进一步包括用于连接相邻的两个直线区段的圆弧形的连接区段。
优选地,所述第二凹陷部的轮廓用于对芯模块片进行良好的支撑和保护,使所述芯片模块在进行三滚轮测试时不会吸收太多的振动和挤压。
优选地,所述第二凹陷部的轮廓大致呈橄榄球形。
另一方面,本发明提供一种智能卡,所述智能卡包括所述的卡片基材、以及收容于所述卡片基材的所述凹陷部内的芯片模块。
有益效果
本发明中的第二凹陷部的轮廓类似两个相对的三角形,当芯片模块装配至本发明提供的卡片基材后,以对芯片模块进行良好的支撑和保护。即使在进行三滚轮测试时,芯片也不会吸收太多的振动和挤压,从而有助于提高芯片的可靠性测试的通过率。
附图说明
本发明的进一步的特征将从以下对优选实施例的描述中变得更加清晰明了,所述优选实施例仅通过示例的方式结合附图提供,其中:
图1是本发明智能卡进行三滚轮测试的立体示意图;
图2是图1所示智能卡进行三滚轮测试的另一角度的立体示意图;
图3是图1所示智能卡进行三滚轮测试的剖视图;
图4是本发明智能卡的第一实施例的平面图;
图5是图4所示智能卡的局部剖视图;
图6是图4所示智能卡的卡片基材的局部剖视图;
图7A是图4所示智能卡的卡片基材的局部俯视图,其中标识出了有关角度的参数;
图7B是图4所示智能卡的卡片基材的局部俯视图,其中标识出了有关距离的参数;
图8是本发明智能卡的第二实施例的卡片基材的局部剖视图;
图9是本发明智能卡的第三实施例的卡片基材的局部俯视图;
图10是本发明智能卡的第四实施例的卡片基材的局部俯视图。
本发明的实施方式
以下将结合附图以及具体实施方式对本发明进行详细说明,以使得本发明的技术方案及其有益效果更为清晰明了。可以理解,附图仅提供参考与说明用,并非用来对本发明加以限制,附图中显示的尺寸仅仅是为了便于清晰描述,而并不限定比例关系。
参考图1至图3,本发明的智能卡包括矩形的卡片基材10、以及收容于卡片基材10内的芯片模块20。本发明的智能卡制造完成后在进行三滚轮测试时,其中一滚轮30挤压于芯片模块20的表面,另外两滚轮30间隔挤压于卡片基材10的与芯片模块20相对的一表面。测试时,各滚轮30沿着卡片基材10的长度方向往复滚动,以模拟银行取款机等读取设备,从而对芯片模块20进行可靠性测试。换言之,各滚轮30滚动的方向与将智能卡插入取款机或者从取款机取出智能卡的方向一致。值得说明的是,本发明的智能卡既可以采用接触式通讯方式,也可以采用非接触式通讯方式。当采用接触式通讯方式时,芯片模块20的用于与外部接口电路直接接触的金属层形成于所述芯片模块20的外表面并优选与所述卡片基材10的表面齐平。
参考图4至图6,本发明第一实施例的智能卡的卡片基材10具有相对的第一表面11和第二表面12、以及自所述第一表面11朝向所述第二表面12凹陷的用于容纳所述芯片模块20的凹陷部13。所述凹陷部13包括自所述卡片基材10的第一表面11朝向所述卡片基材10的第二表面12凹陷的第一凹陷部14、以及自所述第一凹陷部14的底壁朝向所述卡片基材10的第二表面12进一步凹陷的第二凹陷部15。所述第一凹陷部14用于收容芯片模块20的基板21,所述第二凹陷部15用于收容芯片模块20的芯片22,其中芯片模块20的基板21与芯片22电连接。
本实施例中的智能卡可实现非接触式读取,其卡片基材10上还形成有自所述第一凹陷部14的底壁朝向所述卡片基材10的第二表面12进一步凹陷的两个第三凹陷部16,两个第三凹陷部16分别位于第二凹陷部15的沿智能卡的插入方向的两端。两个所述第三凹陷部16内均收容有导电材料160,例如锡膏,用于分别连接芯片模块20的电源正负极和布置于卡片基材10内的天线(未示出)。
以图7A和7B作为参考,定义智能卡的插入方向为左右方向X,与智能卡的插入方向垂直的方向为上下方向Y。在左右方向X上,本发明的智能卡的卡片基材10的第二凹陷部15的尺寸从中间逐渐向两侧收窄。在上下方向Y上,本发明的智能卡的卡片基材10的第二凹陷部15的尺寸也从中间逐渐向两侧收窄。第二凹陷部15的轮廓的右端点与上端点之间的连线以及第二凹陷部15的轮廓的右端点与下端点之间的连线形成的夹角在R3在50度到80度之间。同样地,第二凹陷部15的轮廓的左端点与上端点之间的连线以及第二凹陷部15的轮廓的左端点与下端点之间的连线形成的夹角也在50度到80度之间。
假定第二凹陷部15的轮廓的上端点与左端点之间的连线以及第二凹陷部15的轮廓的上端点与右端点之间的连线形成的夹角为R4。优选地,所述夹角R4在100度到130度之间。同样地,第二凹陷部15的轮廓的下端点与左端点之间的连线以及第二凹陷部15的轮廓的下端点与右端点之间的连线形成的夹角也在100度到130度之间。
优选地,第二凹陷部15的轮廓的左、右端点之间的距离M3与上、下端点之间的距离M1的比值在1.2至2.5之间。所述第二凹陷部15的轮廓的左、右端点之间的距离M3在2.5mm~7.5mm之间。第二凹陷部15的轮廓的上、下端点之间的距离M1在2.5mm~5mm之间。
本发明的第二凹陷部15的轮廓类似两个相对的三角形,当芯片模块20装配至本实施例中的卡片基材10中后,对芯片进行良好的支撑和保护。即使在进行三滚轮30测试时,芯片也不会吸收太多的振动和挤压,从而有助于提高芯片的可靠性测试的通过率。
具体到图7A和7B所示的实施例,卡片基材10的第一凹陷部14的轮廓大致呈矩形并包括四个首尾相连的第一直线区段140。优选地,第一凹陷部14的轮廓还包括用于连接相邻的两个第一直线区段140的圆弧形的第一连接区段141。
本实施例中,卡片基材10的第二凹陷部15的轮廓大致呈橄榄球形,包括沿左右方向X布置的两个对称且彼此连接的弯曲区段150。所述弯曲区段150包括大致位于中部的第一圆弧形区段152、分别连接于所述第一圆弧形区段152的两端的两第二圆弧形区段153、以及分别连接于所述两第二圆弧形区段153的远离所述第一圆弧形区段152的一端的两第二直线区段154。每一弯曲区段150的一第二直线区段154与另一弯曲区段150的一相应的第二直线区段154连接。在其他实施例中,两个弯曲区段150在左右方向X上也可以不对称。
本实施例中,两个第一圆弧形区段152的中点分别为第二凹陷部15的轮廓的左、右端点。上侧第二直线区段154上的任意一点为第二凹陷部15的轮廓的上端点。下侧第二直线区段154上的任意一点为第二凹陷部15的轮廓的下端点。
优选地,所述第一圆弧形区段152对应的圆心角R1在81度到134度之间。所述第一圆弧形区段152的半径r1在0.4mm到1mm之间。优选地,所述第二圆弧形区段153的圆心角R2在16度到40度之间。所述第二圆弧形区段153的半径r2在3mm到7mm之间。
由此可见,本实施例中的第二凹陷部15的轮廓包括六个圆弧形区段(两个第一圆弧形区段152和四个第二圆弧形区段153)和两个直线段(每一直线段包括两个第二直线区段154)。值得注意地是,本实施例中的圆弧形区段和直线区段的数量和排布仅作为示例示出,在其他实施例中,也可以采用其他数量和排布的圆弧形区段和直线区段。例如,在其他实施例中,第二凹陷部的轮廓可以仅由多段圆弧形区段连接而成,或者上述第一圆弧形区段152和第二圆弧形区段153可分别由多段圆弧构成。又或者,在一些实施例中,第二凹陷部的轮廓可以由多个圆弧形区段和多个直线区段构成,其中多个圆弧形区段可以依次连接,多个直线区段可以依次连接再和前述的依次连接的多个圆弧形区段的两端连接,或者,多个圆弧形区段和多个直线区段可以周期性间隔地排布和连接,又或者,多个圆弧形区段和多个直线区段可以无规律地随意连接和排布,只要最终形成的第二凹陷部可以利用其特定的形状对芯片模块起到良好的支撑和保护即可。
参考图8,本发明第二实施例的智能卡与第一实施例的智能卡类似,相同之处在此不再赘述。第二实施例的智能卡与第一实施例的智能卡的主要区别在于,本实施例中的智能卡为接触式智能卡,第二实施例中的凹陷部213不再包括前述第三凹陷部16。
参考图9,本发明第三实施例的智能卡与第一实施例的智能卡类似,相同之处在此不再赘述。第三实施例的智能卡与第一实施例的智能卡的主要区别在于第二凹陷部的轮廓有些许不同。
具体地,本实施例中的第二凹陷部315的轮廓的弯曲区段350不再包括所述第二直线区段154,而仅包括大致位于中部的第一圆弧形区段352、以及分别连接于所述第一圆弧形区段352的两端的两第二圆弧形区段353。每一弯曲区段350的一第二圆弧形区段353与另一弯曲区段350的相应的一第二圆弧形区段353直接相连。优选地,两个弯曲区段350在左右方向上对称。
优选地,所述第一圆弧形区段352对应的圆心角R6在81度到134度之间。所述第一圆弧形区段352对应的半径r3在0.4mm到1mm之间。优选地,所述第二圆弧形区段353对应的圆心角R7在16度到40度之间。所述第二圆弧形区段353对应的半径r4在3mm到7mm之间。相邻的两个第二圆弧形区段353可以在同一个圆周上,也可以在不同的圆周上。当相邻的两个第二圆弧形区段353在同一个圆周上时,两个第二圆弧形区段353也可以合并视为一段圆弧。
参考图10,本发明第四实施例的智能卡与第一实施例的智能卡类似,相同之处在此不再赘述。第四实施例的智能卡与第一实施例的智能卡的主要区别在于第二凹陷部的轮廓不同。
具体地,本实施例中的第二凹陷部415的弯曲区段450包括两个第三直线区段451。两个弯曲区段450共同围合形成一大致呈菱形的轮廓。本实施例中的第二凹陷部415的轮廓还包括用于连接相邻的两个第三直线区段451的圆弧形的第二连接区段452。
优选地,每一弯曲区段450的两第三直线区段451之间形成第一夹角R8,所述第一夹角R8在50度到80度之间。两个弯曲区段450的相邻的两第三直线区段451之间形成第二夹角R9,所述第二夹角R9在100度到130度之间。可以理解地,在其他实施例中,第二凹陷部415的轮廓也可以不呈菱形,而呈两个不对称三角形构成的四边形。例如,两个弯曲区段450可以具有不同的第一夹角R8。
以上所述仅为本发明较佳的具体实施方式,本发明的保护范围不限于以上列举的实施例,任何熟悉本技术领域的技术人员在本发明披露的技术范围内,可显而易见地得到的技术方案的简单变化或等效替换均落入本发明的保护范围内。

Claims (12)

  1. 一种用于承载芯片模块的卡片基材,所述卡片基材具有相对的第一表面和第二表面、以及自所述第一表面朝向所述第二表面凹陷的用于容纳所述芯片模块的凹陷部,所述凹陷部包括自所述第一表面朝向所述第二表面凹陷的第一凹陷部、以及自所述第一凹陷部的底壁朝向所述第二表面进一步凹陷的第二凹陷部,其特征在于,在左右方向上,所述第二凹陷部的尺寸从中间逐渐向两侧收窄,在上下方向上,所述第二凹陷部的尺寸从中间逐渐向两侧收窄,第二凹陷部的轮廓的右端点与上端点之间的连线以及第二凹陷部的轮廓的右端点与下端点之间的连线形成的第一夹角50度到80度之间,第二凹陷部的轮廓的左端点与上端点之间的连线以及第二凹陷部的轮廓的左端点与下端点之间的连线形成的第二夹角也在50度到80度之间。
  2. 根据权利要求1所述的用于承载芯片模块的卡片基材,其特征在于,所述第二凹陷部的轮廓的上端点与左端点之间的连线以及第二凹陷部的轮廓的上端点与右端点之间的连线形成一第三夹角,所述第三夹角在100度到130度之间。
  3. 根据权利要求1所述的用于承载芯片模块的卡片基材,其特征在于,第二凹陷部的轮廓的左、右端点之间的距离与第二凹陷部的轮廓的上、下端点之间的距离的比值在1.2至2.5之间。
  4. 根据权利要求1所述的用于承载芯片模块的卡片基材,其特征在于,所述第二凹陷部的轮廓包括沿左右方向布置且彼此连接的两个弯曲区段,每一弯曲区段包括大致位于中部的第一圆弧形区段、以及分别连接于所述第一圆弧形区段的两端的两第二圆弧形区段。
  5. 根据权利要求4所述的用于承载芯片模块的卡片基材,其特征在于,所述第一圆弧形区段对应的圆心角在81度到134度之间,所述第一圆弧形区段对应的半径在0.4mm到1mm之间。
  6. 根据权利要求4所述的用于承载芯片模块的卡片基材,其特征在于,所述第二圆弧形区段对应的圆心角在16度到40度之间,所述第二圆弧形区段对应的半径在3mm到7mm之间。
  7. 根据权利要求4所述的用于承载芯片模块的卡片基材,其特征在于,所述弯曲区段还包括分别连接于所述两第二圆弧形区段的远离所述第一圆弧形区段的一端的两直线区段。
  8. 根据权利要求1所述的用于承载芯片模块的卡片基材,其特征在于,所述第二凹陷部的轮廓的左、右端点之间的距离在2.5mm至7.5mm之间,所述第二凹陷部的轮廓的上、下端点之间的距离在2.5mm~5mm之间。
  9. 根据权利要求1所述的用于承载芯片模块的卡片基材,其特征在于,所述第二凹陷部的轮廓包括沿左右方向布置且彼此连接的两个弯曲区段,所述两个弯曲区段共同围合形成一四边形,每一弯曲区段包括两个直线区段,所述轮廓进一步包括用于连接相邻的两个直线区段的圆弧形的连接区段。
  10. 根据权利要求1所述的用于承载芯片模块的卡片基材,其特征在于,所述第二凹陷部的轮廓用于对芯模块片进行良好的支撑和保护,使所述芯片模块在进行三滚轮测试时不会吸收太多的振动和挤压。
  11. 根据权利要求1所述的用于承载芯片模块的卡片基材,其特征在于,所述第二凹陷部的轮廓大致呈橄榄球形。
  12. 一种智能卡,其特征在于,所述智能卡包括根据权利要求1-11中任一项所述的卡片基材、以及收容于所述卡片基材的所述凹陷部内的芯片模块。
PCT/CN2021/118042 2020-09-30 2021-09-13 用于承载芯片模块的卡片基材及其智能卡 WO2022068567A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP21874228.6A EP4202762A1 (en) 2020-09-30 2021-09-13 Card substrate for carrying chip module and smart card thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011064735.2 2020-09-30
CN202011064735.2A CN114330626A (zh) 2020-09-30 2020-09-30 用于承载芯片模块的卡片基材及其智能卡

Publications (1)

Publication Number Publication Date
WO2022068567A1 true WO2022068567A1 (zh) 2022-04-07

Family

ID=80949649

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/118042 WO2022068567A1 (zh) 2020-09-30 2021-09-13 用于承载芯片模块的卡片基材及其智能卡

Country Status (4)

Country Link
US (1) US20230240013A1 (zh)
EP (1) EP4202762A1 (zh)
CN (1) CN114330626A (zh)
WO (1) WO2022068567A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0339763A2 (en) * 1988-04-28 1989-11-02 Citizen Watch Co. Ltd. IC card
JPH03275394A (ja) * 1990-03-26 1991-12-06 Ryoden Kasei Co Ltd Icカードの製造方法
CN206849823U (zh) * 2017-05-27 2018-01-05 湘能华磊光电股份有限公司 一种用于led芯片刮片测试的固定模具
CN208992362U (zh) * 2018-09-29 2019-06-18 襄阳赛普尔电子有限公司 芯片磨角机的磨角结构及用于芯片磨角机的卡盘
CN209801161U (zh) * 2018-11-12 2019-12-17 安徽中控仪表有限公司 一种便于更换的合金催化防垢防蜡芯片装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0339763A2 (en) * 1988-04-28 1989-11-02 Citizen Watch Co. Ltd. IC card
JPH03275394A (ja) * 1990-03-26 1991-12-06 Ryoden Kasei Co Ltd Icカードの製造方法
CN206849823U (zh) * 2017-05-27 2018-01-05 湘能华磊光电股份有限公司 一种用于led芯片刮片测试的固定模具
CN208992362U (zh) * 2018-09-29 2019-06-18 襄阳赛普尔电子有限公司 芯片磨角机的磨角结构及用于芯片磨角机的卡盘
CN209801161U (zh) * 2018-11-12 2019-12-17 安徽中控仪表有限公司 一种便于更换的合金催化防垢防蜡芯片装置

Also Published As

Publication number Publication date
EP4202762A1 (en) 2023-06-28
US20230240013A1 (en) 2023-07-27
CN114330626A (zh) 2022-04-12

Similar Documents

Publication Publication Date Title
US7239011B2 (en) Memory card with a cap having indented portions
JP5278611B2 (ja) 通信システム、情報記録媒体、中継通信装置
US20130270349A1 (en) Uicc apparatus and related methods
CN101666816A (zh) 电连接装置及触头
WO2022068567A1 (zh) 用于承载芯片模块的卡片基材及其智能卡
CN108701248B (zh) 集成电路卡的电路层
US20110143596A1 (en) Smart card connector
CN210038843U (zh) 一种智能卡读写器
JPH0241073B2 (zh)
KR102399331B1 (ko) 부정조작 방지식 결제 판독기
TW200426703A (en) Card device with a sweep-type fingerprint sensor
CN216848778U (zh) Idip16l倒管治具
CN100568490C (zh) 连接装置
JPH11105477A (ja) Icカード
JP2005149355A (ja) Uimアダプタ
JPS6142219Y2 (zh)
TWI606401B (zh) 智能卡、智能卡接觸墊載板及其製造方法
CN218384846U (zh) 一种大容量mlcc电容阵列板
JP2012063989A (ja) Icモジュール及びicカード
CN109243991B (zh) 一种金属电化学反应的测试结构及测试方法、电子装置
CN208848230U (zh) 一种ic卡读写设备
CN206249377U (zh) 一种rfid在无源状态下使能或禁用的保护系统
JP2006252050A (ja) Icカードモジュール
KR20110104223A (ko) 이동통신단말기 검사용 유심칩의 간극구조
CN202196577U (zh) 一种带智能卡的钥匙型u盘

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21874228

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021874228

Country of ref document: EP

Effective date: 20230324

NENP Non-entry into the national phase

Ref country code: DE