WO2022052920A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2022052920A1
WO2022052920A1 PCT/CN2021/116995 CN2021116995W WO2022052920A1 WO 2022052920 A1 WO2022052920 A1 WO 2022052920A1 CN 2021116995 W CN2021116995 W CN 2021116995W WO 2022052920 A1 WO2022052920 A1 WO 2022052920A1
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WO
WIPO (PCT)
Prior art keywords
groove
optical module
unlocking
cantilever
module according
Prior art date
Application number
PCT/CN2021/116995
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English (en)
French (fr)
Inventor
迟亚勋
薛楠
陶旭贞
杨鹏
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN202021942876.5U external-priority patent/CN213091953U/zh
Priority claimed from CN202022007055.9U external-priority patent/CN213122372U/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2022052920A1 publication Critical patent/WO2022052920A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • Optical communication technology will be used in new business and application modes such as cloud computing, mobile Internet, and video.
  • the optical module realizes the function of photoelectric conversion in the field of optical communication technology, and is one of the key components in optical communication equipment.
  • the optical signal intensity input by the optical module to the external optical fiber directly affects the quality of optical fiber communication.
  • the light emitting part of some optical modules is encapsulated in a micro-optical form, that is, the light emitted by the optical chip enters the air, and devices such as lenses and optical fiber adapters are arranged on the optical path, and the light emitted by the optical chip is coupled to the optical fiber adapter through the lens.
  • Fiber optic adapters connect with optical fibers. The coupling efficiency of the light emitted by the optical chip into the optical fiber affects the optical power of the optical signal, and the transmission loss of the light in the optical fiber also affects the optical power of the optical signal.
  • an optical module provided by the present disclosure includes: a casing, including a side wall forming a wrapping cavity, and a recessed area is provided on the side wall; an unlocking part is matched to connect the recessed area; a shielding part is provided on the The recessed area and the unlocking member cover the shielding member in the recessed area, and the shielding member is electrically connected to the side wall and the unlocking member.
  • an embodiment of the present disclosure discloses an optical module, comprising: a lower casing; an upper casing, covering the lower casing to form a cavity; a first support plate and a groove are provided on the upper casing, The groove is arranged adjacent to the first support plate; the circuit board is arranged in the cavity, and the first support plate is arranged between the circuit board and the main body of the upper casing; There is a gold finger, the groove is arranged above the gold finger, and the gold finger and the first support plate are respectively located on both sides of the groove.
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • FIG. 3 is a structural diagram of an optical module provided according to some embodiments.
  • FIG. 4 is an exploded structural diagram of an optical module according to some embodiments.
  • FIG. 5 is a schematic structural diagram of another optical module provided according to some embodiments.
  • FIG. 6 is a schematic structural diagram of removing an unlocking part of an optical module according to some embodiments.
  • FIG. 7 is an exploded schematic diagram of an optical module and an unlocking component provided according to some embodiments.
  • FIG. 8 is a cross-sectional view of an optical module with conductive pads provided in accordance with some embodiments.
  • FIG. 9 is a schematic diagram of an external structure of still another optical module provided according to some embodiments.
  • FIG. 10 is a schematic structural diagram of an upper casing in an optical module provided according to some embodiments.
  • FIG. 11 is another angular structural schematic diagram of an upper casing in an optical module according to some embodiments.
  • FIG. 12 is a partial cross-sectional schematic diagram of an optical module provided according to some embodiments.
  • FIG. 13 is an enlarged schematic view of the position A in FIG. 12 .
  • optical communication technology light is used to carry the information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost and low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, and realizes electrical connection with an optical network terminal (for example, an optical cat) through the electrical port. It is mainly used to realize power supply, I2C signal transmission, data signal transmission and grounding; optical network terminals transmit electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).
  • Wi-Fi wireless fidelity technology
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103;
  • the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, and the like.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 can establish a two-way optical signal connection; electrical signal connection.
  • the optical module 200 realizes the mutual conversion of optical signals and electrical signals, so as to establish a connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101 .
  • the optical network terminal 100 includes a substantially rectangular housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 can establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 are connected.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200.
  • the optical network terminal 100 as the host computer of the optical module 200, can monitor the optical module 200. work.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • OLT Optical Line Terminal
  • a bidirectional signal transmission channel is established between the remote server 1000 and the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105 , and an electrical connector disposed inside the cage 106 .
  • the electrical connector is configured to be connected to the electrical port of the optical module 200 ; the heat sink 107 has protrusions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 .
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection.
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 and the optical fiber 100 establish a bidirectional electrical signal connection.
  • FIG. 3 is a structural diagram of an optical module provided according to some embodiments
  • FIG. 4 is an exploded structural diagram of an optical module according to some embodiments.
  • the optical module 200 includes a casing, a circuit board 204 disposed in the casing, and an optical transceiver;
  • the casing includes an upper casing 300 and a lower casing 400.
  • the upper casing 300 is covered on the lower casing 400 to form the above casing with two openings 202 and 203; the outer contour of the casing generally presents a square shape.
  • the lower casing 400 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the upper casing 300 includes a cover plate, and two side plates located on both sides of the cover plate and perpendicular to the cover plate. The two upper side plates are combined with the two side plates to realize that the upper casing 300 is covered on the lower casing 400 .
  • the direction of the connection between the two openings 202 and 203 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 203 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 202 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 202 is located at the end of the optical module 200
  • the opening 203 is located at the side of the optical module 200 .
  • the opening 203 is an electrical port, and the golden fingers of the circuit board 204 protrude from the electrical port 203 and are inserted into the host computer (such as the optical network terminal 100 );
  • the optical fiber connector 201 is connected to the optical transceiver device inside the optical module 200 .
  • the combination of the upper casing 300 and the lower casing 400 is used to facilitate the installation of the circuit board 204, the optical transceiver and other components into the casing, and the upper casing 300 and the lower casing 400 can form encapsulation protection for these components.
  • the upper casing 300 and the lower casing 400 can form encapsulation protection for these components.
  • the upper casing 300 and the lower casing 400 are generally made of metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component 500 located on the outer wall of the housing thereof.
  • the unlocking component 500 is configured to realize a fixed connection between the optical module 200 and the host computer, or release the connection between the optical module 200 and the host computer. fixed connection.
  • the unlocking components 500 are located on the outer walls of the two lower side panels of the lower casing 400 , and include engaging components matching with the cage of the upper computer (eg, the cage 106 of the optical network terminal 100 ).
  • the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging part of the unlocking part 500; when the unlocking part 500 is pulled, the engaging part of the unlocking part 500 moves accordingly, thereby changing the The connection relationship between the engaging member and the host computer is used to release the engaging relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 204 includes circuit traces, electronic components (such as capacitors, resistors, triodes, MOS transistors) and chips (such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP) Wait.
  • electronic components such as capacitors, resistors, triodes, MOS transistors
  • chips such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP) Wait.
  • the circuit board 204 connects the above-mentioned devices in the optical module 200 together according to the circuit design through circuit traces, so as to realize functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board 204 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry chips smoothly; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. , in some embodiments disclosed in the present disclosure, metal pins/gold fingers are formed on one end surface of the rigid circuit board for connecting with the electrical connector; these are inconvenient to be realized by the flexible circuit board.
  • Flexible circuit boards are also used in some optical modules; flexible circuit boards are generally used in conjunction with rigid circuit boards.
  • flexible circuit boards can be used to connect the rigid circuit boards and optical transceivers as a supplement to the rigid circuit boards.
  • the optical transceiver device includes an optical transmitting sub-module and an optical receiving sub-module.
  • the light-emitting sub-module and the light-receiving sub-module may adopt a TO (coaxial) package, a COB (chip-on-board) package, or a combination of the two.
  • the light emitting sub-module 205 and the light receiving sub-module 206 in FIG. 4 adopt the COB package structure.
  • the optical transmitting sub-module 205 and the optical receiving sub-module 206 are respectively connected to the optical fiber connector 201 through the optical fiber ribbon 207, and then connected to the external optical fiber through the optical fiber connector 201.
  • FIG. 4 shows an optical module structure in which the end of the unlocking member 500 is fitted and connected to the outer wall of the side plate of the upper casing 300 , but the end of the unlocking member 500 in the present disclosure is not limited to being fitted and connected to the outer wall of the side plate of the upper casing 300 , and can also be matched and connected to the outer wall of the side plate of the lower casing 400 .
  • the unlocking component 500 provided by the embodiment of the present disclosure includes a handle 510 , a first unlocking cantilever 520 and a second unlocking cantilever 530 .
  • One end of the handle 510 is connected to one end of the first unlocking cantilever 520 and one end of the second unlocking cantilever 530 .
  • the handle 510 is provided to facilitate the use of the unlocking component 500 .
  • the first unlocking cantilever 520 and the second unlocking cantilever 530 are metal parts, such as metal sheet metal parts.
  • the outer wall of the housing and the unlocking part are relatively hard materials such as metal materials, and when the hard material is in direct contact and mating, it is a hard contact, and then there will be a gap between the outer wall of the housing and the unlocking part when they are in hard contact. Therefore, the electromagnetic wave radiated from the electrical port of the optical module can propagate along the gap.
  • a shielding component is provided on the outer wall of the housing, the unlocking component is covered on the shielding component, and the shielding component conducts electricity.
  • the side wall and the unlocking part are connected and the shielding part is used to seal the gap between the housing side wall and the unlocking part.
  • the shielding member conducts the connection between the side plate and the unlocking member, and on the other hand, avoids forming a gap between the outer wall of the casing and the unlocking member, thereby preventing electromagnetic waves from Radiation propagates through the gap between the outer wall of the housing and the unlocking part, thereby improving the electromagnetic shielding effect of the optical module.
  • the shielding component may be a conductive pad disposed on the outer wall of the casing, or may be a rib-position protrusion formed on the outer wall of the casing.
  • a recessed area is provided on the side wall of the optical module, and the recessed area is used to fit one end of the first unlocking cantilever 520 connected to the unlocking member 500 and the second unlocking cantilever 530, and the shielding member is arranged in the recessed area.
  • the shielding member is disposed on the side wall of the casing, such as the side wall of the upper casing 300 , the side wall of the lower casing 400 , or the sides of the upper casing 300 and the lower casing 400 . on the wall.
  • FIG. 5 is a schematic structural diagram of another optical module provided according to some embodiments. As shown in FIG.
  • the optical module provided by the embodiment of the present disclosure includes conductive pads; the conductive pads are arranged on the outer walls of the side plates of the upper casing 300 and the side plates of the lower casing 400 , but the present disclosure is not limited to the conductive pads At the same time, they are arranged on the outer walls of the side plate of the upper casing 300 and the side plate of the lower casing 400 .
  • the unlocking part 500 is projected and covered on the conductive pad on the side plate of the upper casing 300 and the side plate of the lower casing 400 ; in some embodiments of the present disclosure, the first unlocking cantilever 520 or the second unlocking cantilever 530 is on the upper casing 300
  • the side plate and the side plate of the lower casing 400 are projected and covered on the conductive pad, and the conductive pad is used for conductively connecting the first unlocking cantilever 520 , the side plate of the upper casing 300 and the side plate of the lower casing 400 , or conductively connecting the second unlocking arm 520 .
  • the cantilever 530 , the side plate of the upper casing 300 and the side plate of the lower casing 400 are used for conductively connecting the first unlocking cantilever 520 , the side plate of the upper casing 300 and the side plate of the lower casing 400 , or conductively connecting the second unlocking arm 520 .
  • the contact between the outer wall of the casing made of metal material and the unlocking member 500 is a hard contact, and a gap often occurs between the hard contacts.
  • a conductive pad is provided between the contact between the outer wall of the casing and the unlocking member 500 , and the conductive pad is relatively softer than the outer wall of the casing and the unlocking member 500 , so that the contact between the outer wall of the casing and the unlocking member 500 can be realized through the conductive pad.
  • the gap between the outer wall of the housing and the unlocking part 500 is sealed.
  • the optical module When the optical module is inserted into the upper computer cage, if the contact between the outer wall of the casing and the unlocking part 500 is a rigid contact and there is a gap, the electromagnetic wave radiated from the electrical port of the optical module can radiate along the gap between the outer wall of the casing and the unlocking part.
  • the optical module provided by the embodiment of the present disclosure is provided with a conductive pad on the outer wall of the side plate, and the conductive pad is used to connect the side plate and the unlocking part, so as to avoid the formation of a gap between the outer wall of the side plate and the unlocking part, thereby preventing electromagnetic waves from passing from the casing side. Radiation spreads through the gap between the wall and the unlocking part, thereby improving the electromagnetic shielding effect of the optical module.
  • the conductive pad can be a flexible conductive cloth, a flexible wave-absorbing material pad, etc., and the conductive pad can be pasted on the outer wall of the housing.
  • the thickness of the conductive pad is 0.1 mm-0.3 mm.
  • the conductive pad includes a first conductive pad and a second conductive pad.
  • the first conductive pad 610 is provided on one side of the housing, the first unlocking cantilever 520 is covered on the first conductive pad 610 , and the first conductive pad 610 is fixed on the first unlocking cantilever 520 and the housing. Between the outer walls, the first conductive pad 610 conducts the first unlocking cantilever 520 and the outer wall of the housing to achieve the effect of the first conductive pad 610 sealing the gap between the first unlocking cantilever 520 and the outer wall of the housing, thereby avoiding the The gap between the unlocking cantilever 520 and the outer wall of the housing radiates out.
  • the second conductive pad (shielded) is arranged on the other side of the housing, the second unlocking cantilever 530 is covered on the second conductive pad, and the second conductive pad is fixed between the second unlocking cantilever 530 and the outer wall of the housing.
  • the second conductive pad conducts the second unlocking cantilever 530 and the outer wall of the casing, so as to achieve the effect of the second conductive pad sealing the gap between the second unlocking cantilever 530 and the outer wall of the casing, thereby avoiding the second unlocking cantilever 530 and the outer wall of the casing.
  • the gaps between the outer walls of the housing radiate out.
  • FIG. 6 is a schematic structural diagram of removing an unlocking part of an optical module according to some embodiments
  • FIG. 7 is an exploded schematic diagram of an optical module and an unlocking part provided according to some embodiments.
  • the upper casing 300 includes a cover plate 310 , a first side plate 320 and a second side plate 330 , and the first side plate 320 and the second side plate 330 are disposed on the cover plate 310 on both sides in the length direction
  • the lower case 400 includes a main board 410, a third side board 420 and a fourth side board 430, the third side board 420 is located on one side of the main board 410 in the length direction, and the fourth side board 430 is located in the length of the main board 410. the other side of the direction.
  • a first concave area 20 - 1 is formed on the first side plate 320 and the third side plate 420 , and the first concave area 20 - 1 is used to cooperate and connect the first unlocking cantilever 520 , and the first conductive pad 610 is provided in the first recessed area 20-1.
  • a second recessed area 30 - 1 is formed on the second side plate 330 and the fourth side plate 430 . The second recessed area 30 - 1 is used for mating and connecting the second unlocking cantilever 520 , and the second conductive pad 620 is provided The second recessed area 30-1.
  • the first conductive pad 610 seals the gaps between the first unlocking cantilever 520 and the first side plate 320 and the third side plate 420 , and then the first conductive pad 610 is conductively connected to the first side plate 320 , the third side plate 420 and the third side plate 420 .
  • An unlocking cantilever 520; the second conductive pad 620 seals the gap between the second unlocking cantilever 530 and the second side plate 330 and the fourth side plate 430, and the second conductive pad 620 is conductively connected to the second side plate 330 and the fourth side Plate 430 and second unlocking cantilever 530 .
  • the first unlocking cantilever is fully guaranteed 520 is in full contact with the outer wall of the casing and the second unlocking cantilever 530 is in full contact with the outer wall of the casing, so as to avoid electromagnetic waves from being radiated from the gap between the outer wall of the casing and the first unlocking cantilever 520 or the second unlocking cantilever 530, so as to more fully enhance the optical module electromagnetic shielding effect.
  • the middle part of the first unlocking cantilever 520 is covered on the first conductive pad 610
  • the middle part of the second unlocking cantilever 530 is covered on the second conductive pad 620 .
  • the middle portion of the first unlocking cantilever 520 is in pressing contact with the first conductive pad 610
  • the middle portion of the second unlocking cantilever 530 is pressed in contact with the second conductive pad 620 .
  • the width of the first conductive pad 610 is greater than or equal to the width of the middle of the first unlocking cantilever 520
  • the width of the second conductive pad 620 is greater than or equal to the width of the middle of the second unlocking cantilever 530
  • the width of the first conductive pad 610 is equal to the width of the middle portion of the first unlocking cantilever 520
  • the width of the second conductive pad 620 is equal to the width of the middle portion of the second unlocking cantilever 530 .
  • the other end of the first unlocking cantilever 520 is provided with a first locking hook 521 .
  • the first locking hook 521 is embedded in the first locking slot 321; when the unlocking member 500 is dragged, the first locking hook 521 is in the first locking hook along the dragging direction. Move in the slot 321 ; release the drag unlocking member 500 , and the first locking hook 521 returns to the first locking slot 321 . Therefore, the first locking hook 321 can be used to accommodate the first locking hook 521 and limit the movement of the first locking hook 521 .
  • the other end of the first unlocking cantilever 520 is further provided with a first protrusion 522 and a third protrusion 523, the first protrusion 522 is located on one side of the first unlocking cantilever 520, The third protrusion 523 is located on the other side of the first unlocking cantilever 520 .
  • a first limiting groove 322 is provided on the first side plate 320 and a third limiting groove 421 is provided on the third side plate 420 , the first protrusion 522 is embedded in the first limiting groove 322 , and the third protrusion 523 Embedded in the third limiting groove 421 .
  • the first protrusion 522 moves in the first limiting groove 322
  • the third protrusion 523 moves within the third limiting groove 421 .
  • the cooperation of the first protrusion 522 with the first limiting groove 322 and the cooperation of the third protrusion 523 with the third limiting groove 421 are more convenient to realize the limit of the unlocking movement of the first unlocking cantilever 520 and ensure the stability of the unlocking component 500 in use.
  • the other end of the second unlocking cantilever 530 is provided with a second locking hook 531 .
  • a second locking slot 331 is provided thereon.
  • the second locking hook 531 is embedded in the second locking slot 331; when the unlocking member 500 is dragged, the second locking hook 531 is locked in the second locking hook along the dragging direction. Move in the slot 331 ; release the drag unlocking member 500 , and the second locking hook 531 returns to the second locking slot 331 . Therefore, the second locking hook 331 can be used to accommodate the second locking hook 531 and limit the movement of the second locking hook 531 .
  • the handle 510 is dragged, and the first locking hook 521 and the second locking hook 531 are used to lift the locking member on the upper computer cage, so that the optical module can be Unlock and disengage from the upper computer cage.
  • the other end of the second unlocking cantilever 530 is further provided with a second protrusion 532 and a fourth protrusion 533 , the second protrusion 532 is located on one side of the second unlocking cantilever 530 , The fourth protrusion 533 is located on the other side of the second unlocking cantilever 530 .
  • the second limiting groove 332 is provided on the second side plate 330 and the fourth limiting groove 431 is provided on the fourth side plate 430 , the second protrusion 532 is embedded in the second limiting groove 332 , and the fourth protrusion 533 Embedded in the fourth limiting groove 431 .
  • the second protrusion 532 moves in the second limiting groove 332
  • the fourth protrusion 533 moves within the fourth limiting groove 431 .
  • the second protrusion 532 cooperates with the second limiting groove 332 and the fourth protrusion 533 cooperates with the fourth limiting groove 431 , which is more convenient to realize the limit of the unlocking movement of the second unlocking cantilever 530 and ensure the stability of the unlocking component 500 .
  • the first mounting surface 323 is disposed on the outer wall of the first side plate 320 , the first mounting surface 323 is located in the first recessed area 20 - 1 , and the first conductive pad 610 is pasted and connected to the first mounting surface 323 .
  • the installation position of the first installation surface 323 should avoid interference with the unlocking component 500.
  • the installation of the first installation surface 323 helps facilitate the installation and installation of the first conductive pad 610, and at the same time, it can ensure the installation accuracy of the first conductive pad 610 and avoid the first installation of the conductive pad 610. Improper installation of the conductive pad 610 affects the use of the unlocking component 500 .
  • the first installation surface 323 should be relatively far away from the first locking slot 321 .
  • the position of the first installation surface 323 may correspond to the position of the clamp of the upper computer cage clamping the optical module, and the clamp of the upper computer cage clamping the optical module can be squeezed when clamping the optical module. Press the first unlocking cantilever 520 to fully contact the first conductive pad 610 .
  • a second mounting surface 333 is provided on the outer wall of the second side plate 330 , the second mounting surface 333 is located in the second recessed area 30 - 1 , and the second conductive pad 620 is attached to the second mounting surface 333 .
  • the setting position of the second mounting surface 333 should avoid interfering with the unlocking component 500.
  • the setting of the second mounting surface 333 is helpful to facilitate the installation and setting of the second conductive pad 620, and at the same time, it can ensure the installation accuracy of the second conductive pad 620 and avoid the second Improper installation of the conductive pad 620 affects the use of the unlocking component 500 .
  • the second mounting surface 333 should be relatively far away from the second locking slot 331 .
  • the position of the second mounting surface 333 may correspond to the position of the clamp for clamping the optical module in the upper computer cage, and then the clamp for clamping the optical module in the upper computer cage can clamp the optical module. Squeeze the second unlocking cantilever 530 to fully contact the second conductive pad 620 .
  • the first mounting surface may also be provided on the third side panel 420 or the fourth side panel 430 ; correspondingly, the second mounting surface may also be provided on the fourth side panel 430 or the third side panel 430 . on the side panel 420.
  • a first spring groove and a second spring groove are respectively provided on both sides of the head of the housing, a first spring is provided in the first spring groove and a second spring is provided in the second spring groove, and the unlocking part is provided with The first spring hook and the second spring hook, the first spring hook is matched to connect to the first spring, and the second spring hook is matched to connect to the second spring.
  • the first spring hook cooperates with the first spring and the second spring hook cooperates with the second spring to realize automatic recovery after the unlocking component unlocks the optical module.
  • a first spring groove 340 and a second spring groove 350 are respectively provided on both sides of the upper casing 300 near the optical port.
  • a first spring 340-1 is provided, and a second spring 350-1 is provided in the second spring groove 350.
  • the connecting end of the first unlocking cantilever 520 and the handle 510 is provided with a first spring hook 524
  • the connecting end of the second unlocking cantilever 530 and the handle 510 is provided with a second spring hook 534 .
  • FIG. 8 is a cross-sectional view of an optical module with conductive pads provided in accordance with some embodiments.
  • the first conductive pad 610 is between the first side plate 320 and the third side plate 420 and the first unlocking cantilever 520 , and one side of the first conductive pad 610 contacts the outer wall of the first side plate 320 and the first unlocking cantilever 520 .
  • the outer wall and the other side of the three side plates 420 contact the first unlocking cantilever 520 , and the first conductive pad 610 can be used to seal the gaps between the first side plate 320 and the third side plate 420 and the first unlocking cantilever 520 respectively.
  • the conduction between the first side plate 320 , the third side plate 420 and the first unlocking cantilever 520 is achieved through the first conductive pad 610 , thereby preventing electromagnetic waves from being transmitted from the first side plate 320 and the third side plate 420 to the
  • the gaps between the first unlocking cantilevers 520 radiate out to improve the electromagnetic shielding effect of the optical module.
  • the second conductive pad 620 is located between the second side plate 330 and the fourth side plate 430 and the second unlocking cantilever 530 , and one side of the second conductive pad 620 contacts the second side plate 330
  • the outer wall and the outer wall and the other side of the fourth side plate 430 are in contact with the second unlocking cantilever 530 , and the second conductive pad 620 can be used to seal the gap between the second side plate 330 and the fourth side plate 430 and the second unlocking cantilever 530 respectively. gap.
  • the conduction between the second side plate 330 , the fourth side plate 430 and the second unlocking cantilever 530 is achieved through the second conductive pad 620 , thereby preventing electromagnetic waves from being transmitted from the second side plate 330 and the fourth side plate 430 to
  • the gap between the second unlocking cantilevers 530 radiates out, so as to improve the electromagnetic shielding effect of the optical module.
  • FIG. 9 is a schematic diagram of an external structure of still another optical module provided according to some embodiments. As shown in FIG. 9 , several rib-position protrusions are arranged on the side wall of the housing of the optical module. In some embodiments of the present disclosure, a plurality of first rib-position protrusions 324 are disposed on the first side plate 320 , and the first rib-position protrusions 324 are electrically connected to the first unlocking cantilever 520 and the first side plate 320 .
  • the third side plate 420 is provided with a plurality of second rib-position protrusions 422 , and the second rib-position protrusions 422 are electrically connected to the first unlocking cantilever 520 and the third side plate 420 for sealing the gap between the first unlocking cantilever 520 and the third side plate 420 . Then, when the optical module is inserted into the host computer for use, the electromagnetic radiation in the host computer is transmitted to the first rib position protrusion 324 and the second rib position protrusion 422, and the first rib position protrusion 324 and the second rib position protrusion 422.
  • Sealing the first unlocking cantilever 520 can be used to prevent electromagnetic waves from radiating out of the gap between the first unlocking cantilever 520 and the side wall of the housing; meanwhile, the raised grooves formed between the adjacent rib-position protrusions can radiate electromagnetic radiation multiple times.
  • the purpose of improving the electromagnetic shielding effect is achieved by reflection and absorption. Therefore, the electromagnetic shielding effect of the host computer can be improved through the first rib-position protrusion 324 and the second rib-position protrusion 422 .
  • the second side plate may further be provided with a third rib-position protrusion and the fourth side plate may further be provided with a fourth rib-position protrusion, the third rib-position protrusion and the fourth rib-position protrusion
  • the first rib-position protrusion 324 and the second rib-position protrusion 422 may be provided with a fourth rib-position protrusion, the third rib-position protrusion and the fourth rib-position protrusion.
  • the protrusion height of the ribs on the outer walls of the first side plate, the second side plate, the third side plate and the fourth side plate is 0.05-0.15mm, and the rib protrusions are 0.05-0.15mm.
  • the width of the rib is 0.5-1.5mm, and the spacing between the adjacent ribs is 0.5-1.5mm. This is convenient to ensure the effect of electromagnetic shielding.
  • FIG. 10 is a schematic structural diagram of an upper casing in an optical module according to some embodiments
  • FIG. 11 is another angular structural schematic diagram of an upper casing in an optical module according to some embodiments.
  • the upper casing 300 is provided with a first supporting plate 2011 and a groove, the first supporting plate 2011 is disposed adjacent to the groove, and the first supporting plate 2011 is disposed on the main body of the upper casing 300 Between the circuit board 204 and the circuit board 204 , it is used to support and fix the circuit board 204 .
  • the first support plate 2011 and the groove are parallel to each other, and are disposed along the width direction of the upper casing 300 .
  • the first support plate 2011 can divide the main body of the upper casing 300 into a first part and a second part, the second part is located above the gold finger on the circuit board 204 , and the groove is disposed on the upper
  • the second part of the housing 300 is used for reflection and attenuation of the electromagnetic waves conducted on the circuit board 204 .
  • the upper casing 300 may be provided with at least two grooves, the first support plate 2011 is disposed in parallel with the at least two grooves, and the at least two grooves are disposed on the same side of the first support plate 2011 .
  • the electromagnetic waves generated by the optoelectronic devices on the circuit board 204 can be conducted from the gap between the first support plate 2011 and the circuit board 204, and the conducted electromagnetic waves enter the grooves of the upper casing 300, and the electromagnetic waves are reflected in the grooves. Change the propagation direction of the electromagnetic wave to reduce the energy of the electromagnetic wave; then the electromagnetic wave enters another groove and continues to reflect in the other groove to reduce the energy of the electromagnetic wave. In this way, the electromagnetic waves conducted to the outside of the optical module can be reduced, so as to avoid electromagnetic interference caused by the electromagnetic waves to other communication devices outside the optical module.
  • the golden finger connector connected with the golden finger also generates electromagnetic waves, and the electromagnetic waves can also be conducted into the optical module from the gap between the first support plate 2011 and the circuit board 204 .
  • the electromagnetic wave generated by the gold finger connector enters the groove of the upper casing 300, and the electromagnetic wave is reflected in the groove to change the propagation direction of the electromagnetic wave and reduce the energy of the electromagnetic wave; then the electromagnetic wave enters another groove, Reflection continues in the other groove to dissipate the electromagnetic energy. In this way, the electromagnetic waves conducted to the inside of the optical module can be reduced, so as to prevent electromagnetic waves from causing electromagnetic interference to the optoelectronic devices inside the optical module.
  • FIG. 12 is a partial cross-sectional schematic diagram of an optical module provided according to some embodiments
  • FIG. 13 is an enlarged schematic diagram of part A in FIG. 12
  • a first groove 2012 and a second groove 2013 may be provided on the upper casing 300 , the first support plate 2011 , the first groove 2012 and the second groove 2013 are arranged in parallel, and the A side surface of a groove 2012 may be the same side surface as a side surface of the first support plate 2011 , that is, the first groove 2012 and the first support plate 2011 share the same side surface.
  • the first groove 2012 and the second groove 2013 are spaced apart, and a baffle plate is disposed between the first groove 2012 and the second groove 2013 .
  • one side of the baffle is the same side as the other side of the first groove 2012
  • the other opposite side of the baffle is the same side as one side of the second groove 2013 . That is, among the two opposite sides of the baffle, one side is shared with the first groove 2012 , and the other side is shared with the second groove 2013 .
  • the groove width of the first groove 2012 and the second groove 2013 on the upper casing 300 may be 0.6-1 mm, and the first groove The width of the baffle plate between the groove 2012 and the second groove 2013 may be 0.6 ⁇ 1 mm. In this way, after the electromagnetic wave is reflected in the first groove 2012, the reflected electromagnetic wave easily enters the second groove 2013 and continues to reflect in the second groove 2013 to reduce the energy of the electromagnetic wave.
  • the radiation angle of the electromagnetic wave can spread in all directions; or the electromagnetic wave generated by the gold finger connector enters the optical module.
  • the radiation angle of the electromagnetic wave also has multiple directions.
  • the depth of the first groove 2012 should be a preset depth to accommodate more electromagnetic waves.
  • the depth of the second groove 2013 should also be a preset depth, so that the reflected electromagnetic waves can enter the second groove 2013 as much as possible.
  • the preset depths of the first groove 2012 and the second groove 2013 may both be 0.6 ⁇ 2 mm.
  • the depth of the baffle between the first groove 2012 and the second groove 2013 can also be 0.6-2 mm, so as to prevent the baffle from blocking the input from the first groove 2012 to the second groove 2013.
  • the depths of the first grooves 2012 and the second grooves 2013 are not limited to the preset depths, and the preset depths of the first grooves 2012 and the second grooves 2013 can also be reasonably selected according to the actual situation. All belong to the protection scope of the embodiments of the present disclosure.
  • the first groove 2012 and the second groove 2013 are both disposed along the width direction of the upper casing 300, and the first groove 2012 and the second groove 2013 are used to reflect the electromagnetic waves conducted by the circuit board 204, the first groove
  • the dimensions of the 2012 and the second groove 2013 may be equal to or slightly larger than the width dimension of the circuit board 204 , so as to receive as many electromagnetic waves conducted by the circuit board 204 as possible.
  • the size of the first groove 2012 and the second groove 2013 may be 12.8 mm ⁇ 0.9 mm.
  • a first support plate and at least two grooves are arranged on the upper casing, the grooves and the first support plate are arranged in parallel, and the first support plate is arranged on the main body of the upper casing and the circuit board between them to support the circuit board; one end of the circuit board is provided with a gold finger, the groove is arranged above the gold finger, and the gold finger and the first support plate are located on both sides of the groove, so that the photoelectric devices on the circuit board generate After the electromagnetic wave is conducted through the gap between the first support plate and the circuit board, the electromagnetic wave enters the groove and is reflected in the groove, changing the propagation direction of the electromagnetic wave, thereby reducing the output of the electromagnetic wave and preventing the electromagnetic wave from being transmitted to the optical module.
  • the electromagnetic wave generated by the gold finger connector can also be reflected in the groove to reduce the electromagnetic wave, prevent the electromagnetic wave from entering the interior of the optical module, and avoid electromagnetic interference to the optoelectronic devices inside the optical module.
  • at least two grooves are arranged on the upper casing to reflect the electromagnetic waves from the inside of the optical module or the gold finger connector, which changes the propagation direction of the electromagnetic waves and reduces the output of the electromagnetic waves. Electromagnetic shielding is performed to improve the electromagnetic shielding performance of the optical module.
  • the embodiment of the present disclosure also provides an optical module, the optical module is provided with a groove on the lower casing, and the groove is set below the gold finger, The electromagnetic wave conducted by the gap at the electrical port of the optical module is injected into the groove and reflected in the groove, which can reduce the electromagnetic wave output, avoid electromagnetic interference from electromagnetic waves to other communication equipment, and improve the electromagnetic shielding performance of the optical module.
  • the lower case 202 is provided with a second support plate and a groove, the second support plate is disposed adjacent to the groove, and the second support plate is disposed on the main body of the lower case 202 and the circuit board 204 for supporting and fixing the circuit board 204 .
  • the second support plate and the groove are parallel to each other, and both are disposed along the width direction of the lower case 202 .
  • At least two grooves may be provided on the lower casing 202 , the second support plate is disposed in parallel with the at least two grooves, and the at least two grooves are disposed on the same side of the second support plate.
  • the electromagnetic waves generated by the optoelectronic devices on the circuit board 204 can be conducted from the gap between the second support plate and the circuit board 204, and the conducted electromagnetic waves enter the grooves of the lower casing 202, and the electromagnetic waves are reflected in the grooves, changing the The propagation direction of the electromagnetic wave reduces the energy of the electromagnetic wave; then the electromagnetic wave enters another groove and continues to reflect in the other groove to reduce the energy of the electromagnetic wave. In this way, electromagnetic waves conducted to the outside of the optical module can be reduced, and electromagnetic waves can be prevented from causing electromagnetic interference to other communication devices outside the optical module.
  • the golden finger connector connected with the golden finger also generates electromagnetic waves, and the electromagnetic waves can also be conducted into the optical module from the gap between the second support plate and the circuit board 204 .
  • the electromagnetic wave generated by the gold finger connector enters the groove of the lower casing 202, and the electromagnetic wave is reflected in the groove to change the propagation direction of the electromagnetic wave and reduce the energy of the electromagnetic wave; then the emitted electromagnetic wave enters another The grooves continue to reflect in another groove to reduce the electromagnetic wave energy. In this way, the electromagnetic waves conducted to the inside of the optical module can be reduced, and the electromagnetic interference of the electromagnetic waves to the optoelectronic devices inside the optical module can be avoided.
  • a third groove and a fourth groove may be provided on the lower casing 202 , the second support plate, the third groove and the fourth groove are arranged in parallel, and the third groove is One side surface and one side surface of the second support plate may be the same side surface, that is, the third groove and the second support plate share the same side surface.
  • the third groove and the fourth groove are arranged at intervals, and a baffle plate is arranged between the third groove and the fourth groove.
  • one side surface of the baffle is the same side surface as the other side surface of the third groove, and the other side surface opposite to the baffle plate is the same side surface as the one side surface of the fourth groove. That is, among the two opposite sides of the baffle, one side is shared with the third groove, and the other side is shared with the fourth groove.
  • the groove widths of the third groove and the fourth groove on the lower casing 202 may be 0.6-1 mm, and the third groove and the The width of the baffle plate between the fourth grooves may be 0.6 ⁇ 1 mm. In this way, after the electromagnetic wave is reflected in the first groove 2012, the reflected electromagnetic wave easily enters the second groove 2013 and continues to reflect in the second groove 2013 to reduce the energy of the electromagnetic wave.
  • the radiation angle of the electromagnetic wave can be spread in all directions; or when the electromagnetic wave generated by the gold finger connector enters the inside of the optical module , the radiation angle of electromagnetic waves also has multiple directions.
  • the depth of the third groove should be a preset depth to accommodate more electromagnetic waves.
  • the depth of the fourth groove should also be a preset depth, so that the reflected electromagnetic waves can enter the fourth groove as much as possible.
  • the preset depths of the third groove and the fourth groove may both be 0.6-2 mm.
  • the depth of the baffle between the third groove and the fourth groove can also be 0.6-2mm, so as to prevent the baffle from blocking the electromagnetic waves input into the fourth groove from the third groove .
  • the depths of the third groove and the fourth groove are not limited to the preset depths, and the preset depths of the third groove and the fourth groove can also be reasonably selected according to the actual situation, all of which belong to the present disclosure Scope of protection of the embodiments.
  • the third groove and the fourth groove are both disposed along the width direction of the lower casing 202, and the third groove and the fourth groove are used to reflect the electromagnetic waves conducted by the circuit board 204, the third groove and the fourth groove are The dimensions of the slots may be equal to or slightly larger than the width dimension of the circuit board 204 to receive as many electromagnetic waves conducted by the circuit board 204 as possible. In the embodiment of the present disclosure, considering the size of the lower case 202 and the circuit board 204 , the size of the third groove and the fourth groove may be 12.8 mm ⁇ 0.9 mm.
  • a second support plate and at least two grooves are arranged on the lower casing, the grooves and the second support plate are arranged in parallel, and the second support plate is arranged between the main body of the lower casing and the circuit board , to support the circuit board; one end of the circuit board is provided with a gold finger, the groove is arranged below the gold finger, and the gold finger and the second support plate are located on both sides of the groove, so that the electromagnetic waves generated by the optoelectronic devices on the circuit board are generated.
  • the electromagnetic wave after being conducted through the gap between the second support plate and the circuit board, the electromagnetic wave enters the groove and is reflected in the groove, changing the propagation direction of the electromagnetic wave, thereby reducing the output of the electromagnetic wave and preventing the electromagnetic wave from being transmitted to the outside of the optical module.
  • the electromagnetic wave generated by the gold finger connector can also be reflected in the groove to reduce the electromagnetic wave, prevent the electromagnetic wave from entering the interior of the optical module, and avoid electromagnetic interference to the optoelectronic devices inside the optical module.
  • at least two grooves are arranged on the upper casing to reflect the electromagnetic waves from the inside of the optical module or the gold finger connector, which changes the propagation direction of the electromagnetic waves and reduces the output of the electromagnetic waves.
  • Electromagnetic shielding is performed to improve the electromagnetic shielding performance of the optical module.
  • a groove can be provided on the upper casing or the lower casing to reflect the electromagnetic wave from the inside of the optical module or the golden finger connector, change the propagation direction of the electromagnetic wave, reduce the output of the electromagnetic wave, and improve the performance of the optical module. Electromagnetic shielding performance. However, considering the size of the optical module, it is not suitable to provide grooves for reducing electromagnetic waves on the upper casing and the lower casing respectively.

Abstract

本公开提供的光模块，包括：壳体，包括形成包裹腔体的侧壁，所述侧壁上设置凹陷区域；解锁部件，配合连接所述凹陷区域；屏蔽部件，设置在所述凹陷区域，所述屏蔽部件导通连接所述侧壁和所述解锁部件。本公开提供的光模块，通过在壳体的外壁上设置屏蔽部件，一方面通过屏蔽部件导通连接侧板和解锁部件，另一方面避免在壳体外壁与解锁部件形成间隙，进而避免电磁波从壳体外壁与解锁部件的间隙辐射传播，从而提升了光模块的电磁屏蔽效果。

Description

一种光模块
本公开要求在2020年09月08日提交中国专利局、申请号为202021942876.5、专利名称为“一种光模块”、在2020年09月14日提交中国专利局、申请号为202022007055.9、专利名称为“一种光模块”的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
在云计算、移动互联网、视频等新型业务和应用模式，均会用到光通信技术。光模块在光通信技术领域中实现光电转换的功能，是光通信设备中的关键器件之一，光模块向外部光纤中输入的光信号强度直接影响光纤通信的质量。
部分光模块的光发射部分采用微光学形态封装，即光芯片发出的光进入空气中，在光学路径上设置透镜、光纤适配器等器件，将光芯片发出的光经透镜后耦合至光纤适配器中，光纤适配器与光纤连接。光芯片发出的光耦合至光纤中的效率影响光信号的光功率，光在光纤中的传输损耗同样对光信号的光功率有所影响。
发明内容
一方面，本公开提供的一种光模块，包括：壳体，包括形成包裹腔体的侧壁，所述侧壁上设置凹陷区域；解锁部件，配合连接所述凹陷区域；屏蔽部件，设置在所述凹陷区域且所述解锁部件在所述凹陷区域覆盖所述屏蔽部件，所述屏蔽部件导通连接所述侧壁和所述解锁部件。
另一方面，本公开实施例公开了一种光模块，包括：下壳体；上壳体，盖合所述下壳体上，形成腔体；其上设有第一支撑板与凹槽，所述凹槽与所述第一支撑板相邻设置；电路板，设置于所述腔体内，所述第一支撑板设置于所述电路板与所述上壳体主体之间；其一端设有金手指，所述凹槽设置于所述金手指的上方，且所述金手指与所述第一支撑板分别位于所述凹槽的两侧。
附图说明
为了更清楚地说明本公开的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为根据一些实施例的光通信系统连接关系图；
图2为根据一些实施例的光网络终端结构图；
图3为根据一些实施例提供的光模块结构图；
图4为根据一些实施例的光模块分解结构图；
图5为根据一些实施例提供的另一种光模块的结构示意图；
图6为根据一些实施例提供的一种光模块拆除解锁部件的结构示意图；
图7为根据一些实施例提供的一种光模块与解锁部件的分解示意图；
图8为根据一些实施例提供的一种具有导电垫光模块的剖视图；
图9为根据一些实施例提供的再一种光模块的外部结构示意图；
图10为根据一些实施例提供的一种光模块中上壳体的结构示意图；
图11为根据一些实施例提供的一种光模块中上壳体的另一角度结构示意图；
图12为根据一些实施例提供的一种光模块的局部剖面示意图；
图13为图12中A处放大示意图。
具体实施方式
为了使本技术领域的人员更好地理解本公开中的技术方案，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本公开保护的范围。
光通信技术中使用光携带待传输的信息，并使携带有信息的光信号通过光纤或光波导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光信号通过光纤或光波导中传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要用于实现供电、I2C信号传输、数据信号传输以及接地等；光网络终端通过网线或无线保真技术(Wi-Fi)将电信号传输给计算机等信息处理设备。
图1为根据一些实施例的光通信系统连接关系图。如图1所示，光通信系统主要包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103；
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现超长距离传输。因此在通常的光通信系统中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平板电脑、电视机等。
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。
光模块200包括光口和电口。光口被配置为与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立连接。示例的，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。
光网络终端100包括大致呈长方体的壳体(housing)，以及设置在壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。示例的，光网络终端100将来自光模块200的电信号传递给网线103，将来自网线103的信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立了双向的信号传递通道。
图2为根据一些实施例的光网络终端结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100的与光模块200相关的结构。如图2所示，光网络终端100中还包括设置于壳体内的PCB电路板105，设置在PCB电路板105的表面的笼子106，以及设置在笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而光模块200与光纤100建立双向的电信号连接。
图3为根据一些实施例提供的光模块结构图，图4为根据一些实施例的光模块分解结构图。如图3和图4所示，光模块200包括壳体、设置于壳体中的电路板204及光收发器件；
壳体包括上壳体300和下壳体400，上壳体300盖合在下壳体400上，以形成具有两个开口202和203的上述壳体；壳体的外轮廓一般呈现方形体。
在一些实施例中，下壳体400包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体300包括盖板，以及位于盖板两侧与盖板垂直设置的两个上侧板，由两个侧 壁与两个侧板结合，以实现上壳体300盖合在下壳体400上。
两个开口202和203的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。在本公开的某一些实施例中，开口203位于光模块200的端部(图3的右端)，开口202也位于光模块200的端部(图3的左端)。或者，开口202位于光模块200的端部，而开口203则位于光模块200的侧部。其中，开口203为电口，电路板204的金手指从电口203伸出，插入上位机(如光网络终端100)中；开口202为光口，配置为接入外部的光纤接头201，以使光纤接头201连接光模块200内部的光收发器件。
采用上壳体300、下壳体400结合的装配方式，便于将电路板204、光收发器件等器件安装到壳体中，由上壳体300、下壳体400可以对这些器件形成封装保护。此外，在装配电路板204等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化的实施生产。
在一些实施例中，上壳体300及下壳体400一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外壁的解锁部件500，解锁部件500被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
在本公开的某一些实施例中，解锁部件500位于下壳体400的两个下侧板的外壁，包括与上位机的笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200插入上位机的笼子里，由解锁部件500的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件500时，解锁部件500的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板204包括电路走线、电子元件(如电容、电阻、三极管、MOS管)及芯片(如MCU、激光驱动芯片、限幅放大芯片、时钟数据恢复CDR、电源管理芯片、数据处理芯片DSP)等。
电路板204通过电路走线将光模块200中的上述器件按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。
电路板204一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；硬性电路板还可以插入上位机笼子中的电连接器中，在本公开公开的某一些实施例中，在硬性电路板的一侧末端表面形成金属引脚/金手指，用于与电连接器连接；这些都是柔性电路板不便于实现的。
部分光模块中也会使用柔性电路板；柔性电路板一般与硬性电路板配合使用，如硬性电路板与光收发器件之间可以采用柔性电路板连接，作为硬性电路板的补充。
光收发器件包括光发射次模块及光接收次模块。光发射次模块和光接收次模块可采用TO(同轴)封装、COB(板上芯片)封装或两者组合等结构形式。图4中的光发射次模块205和光接收次模块206采用的COB封装结构形式。光发射次模块205和光接收次模块 206分别通过光纤带207连接光纤接头201，然后通过光纤接头201连接外部光纤。
图4示出了一种解锁部件500的端部配合连接上壳体300侧板外壁的光模块结构，但本公开中解锁部件500的端部不局限于配合连接上壳体300的侧板外壁，还可以配合连接下壳体400的侧板外壁。
如图4所示，本公开实施例提供的解锁部件500包括手柄510、第一解锁悬臂520和第二解锁悬臂530。手柄510的一端连接第一解锁悬臂520的一端和第二解锁悬臂530的一端，第一解锁悬臂520的另一端配合连接上壳体300的一侧板外壁，第二解锁悬臂530的另一端配合连接上壳体300的另一侧板外壁。拖动手柄510将带动第一解锁悬臂520和第二解锁悬臂530沿上壳体300的侧板延伸方向移动，设置手柄510便于解锁部件500的使用。在本公开实施例中，第一解锁悬臂520和第二解锁悬臂530为金属件，如金属钣金件。
当壳体的外壁以及解锁部件为金属材料等相对较硬的材料，而当硬性材料直接接触配合时属于硬性接触，进而壳体的外壁与解锁部件硬性接触时两者之间将会产生间隙，从而光模块电口出辐射出的电磁波可沿该间隙进行传播。为避免电磁波沿壳体的外壁与解锁部件之间的间隙辐射传输，本公开实施例提供的光模块中，壳体的外壁上设置屏蔽部件，解锁部件覆盖在屏蔽部件上，通过屏蔽部件导通连接侧壁和解锁部件且屏蔽部件用于密封壳体侧壁和解锁部件之间的间隙。本公开提供的光模块，通过在壳体的外壁上设置屏蔽部件，一方面通过屏蔽部件导通连接侧板和解锁部件，另一方面避免在壳体外壁与解锁部件形成间隙，进而避免电磁波从壳体外壁与解锁部件的间隙辐射传播，从而提升了光模块的电磁屏蔽效果。
在本公开实施例中，屏蔽部件可以为设置在壳体外壁上的导电垫，也可以是壳体外壁上形成筋位凸起。如图4所示，为方便解锁部件500的安装以及保证光模块外形结构的平整性，光模块的侧壁上设置凹陷区域，凹陷区域用于配合连接解锁部件500的第一解锁悬臂520的一端和第二解锁悬臂530，且屏蔽部件设置在凹陷区域。
本公开实施例提供的光模块中，屏蔽部件设置在壳体的侧壁上，如上壳体300的侧壁上、下壳体400的侧壁上或上壳体300和下壳体400的侧壁上。图5为根据一些实施例提供的另一种光模块的结构示意图。如图5所示，本公开实施例提供的光模块中，包括导电垫；导电垫设置在上壳体300侧板和下壳体400侧板的外壁上，但本公开中不局限于导电垫同时设置在上壳体300侧板和下壳体400侧板的外壁上。解锁部件500在上壳体300侧板和下壳体400侧板上投影覆盖在导电垫上；在本公开的某一些实施例中，第一解锁悬臂520或第二解锁悬臂530在上壳体300侧板和下壳体400侧板上投影覆盖在导电垫上，导电垫用于导通连接第一解锁悬臂520、上壳体300侧板和下壳体400侧板，或导通连接第二解锁悬臂530、上壳体300侧板和下壳体400侧板。
若同时采用金属材料的壳体外壁和解锁部件500之间直接接触，则壳体的外壁和解锁部件500的接触为硬性接触，硬性接触物之间往往会产生间隙。本公开实施例中，壳体外壁和解锁部件500的接触处之间设置导电垫，导电垫较壳体外壁和解锁部件500相对软一些，进而能够通过导电垫实现壳体外壁和解锁部件500之间的导通，密封壳体的外壁和解 锁部件500之间的间隙。当将光模块插入上位机笼子时，若壳体的外壁和解锁部件500的接触为硬性接触而存在间隙时，光模块电口出辐射出的电磁波可沿壳体外壁与解锁部件的间隙辐射传播，而本公开实施例提供的光模块在侧板的外壁上设置导电垫，通过导电垫导通连接侧板和解锁部件，避免在侧板外壁与解锁部件形成间隙，进而避免电磁波从壳体侧壁与解锁部件的间隙辐射传播，从而提升了光模块的电磁屏蔽效果。导电垫可为柔性导电布、柔性吸波材料垫等，导电垫可粘贴设置在壳体的外壁上。在本公开的某一些实施例中，导电垫的厚度为0.1mm-0.3mm。
在本公开实施例中，导电垫包括第一导电垫和第二导电垫。如图5所示，第一导电垫610设置在壳体的一侧，第一解锁悬臂520覆盖在第一导电垫610上，将第一导电垫610固定在第一解锁悬臂520和壳体的外壁之间，第一导电垫610导通第一解锁悬臂520和壳体的外壁，达到第一导电垫610密封第一解锁悬臂520和壳体的外壁之间间隙的效果，进而避免从第一解锁悬臂520和壳体的外壁之间间隙辐射出去。相应的，第二导电垫(被遮挡)设置在壳体的另一侧，第二解锁悬臂530覆盖在第二导电垫上，将第二导电垫固定在第二解锁悬臂530和壳体的外壁之间，第二导电垫导通第二解锁悬臂530和壳体的外壁，达到第二导电垫密封第二解锁悬臂530和壳体的外壁之间间隙的效果，进而避免从第二解锁悬臂530和壳体的外壁之间间隙辐射出去。
图6为根据一些实施例提供的一种光模块拆除解锁部件的结构示意图，图7为根据一些实施例提供的一种光模块与解锁部件的分解示意图。如图6和7所示，本公开实施例中，上壳体300包括盖板310、第一侧板320和第二侧板330，第一侧板320和第二侧板330设置在盖板310长度方向的两侧；下壳体400包括主板410、第三侧板420和第四侧板430，第三侧板420位于主板410长度方向的一侧，第四侧板430位于主板410长度方向的另一侧。
如图6所示，第一侧板320和第三侧板420上形成第一凹陷区域20-1，第一凹陷区域20-1用于配合连接第一解锁悬臂520，第一导电垫610设置在第一凹陷区域20-1。如图7所示，第二侧板330和第四侧板430上形成第二凹陷区域30-1，第二凹陷区域30-1用于配合连接第二解锁悬臂520，第二导电垫620设置的第二凹陷区域30-1。第一导电垫610密封第一解锁悬臂520和第一侧板320、第三侧板420之间的间隙，进而第一导电垫610导通连接第一侧板320、第三侧板420和第一解锁悬臂520；第二导电垫620密封第二解锁悬臂530和第二侧板330、第四侧板430之间的间隙，第二导电垫620导通连接第二侧板330、第四侧板430和第二解锁悬臂530。如此通过将第一导电垫610设置在第一侧板320和第三侧板420上以及将第二导电垫620设置在第二侧板330和第四侧板430上，充分保证第一解锁悬臂520与壳体外壁以及第二解锁悬臂530与壳体外壁充分接触，避免电磁波从壳体外壁与第一解锁悬臂520或第二解锁悬臂530之间的间隙辐射传输，进而更加充分的提升光模块的电磁屏蔽效果。
在本公开实施例中，第一解锁悬臂520的中部覆盖在第一导电垫610上，第二解锁悬臂530的中部覆盖在第二导电垫620上。在本公开的某一些实施例中，第一解锁悬臂520的中部挤压接触第一导电垫610，第二解锁悬臂530的中部挤压接触第二导电垫620。
在本公开的某一些实施例中，第一导电垫610的宽度大于或等于第一解锁悬臂520中部的宽度，第二导电垫620的宽度大于或等于第二解锁悬臂530中部的宽度。在本公开的某一些实施例中，第一导电垫610的宽度等于第一解锁悬臂520中部的宽度，第二导电垫620的宽度等于第二解锁悬臂530中部的宽度。
为方便第一解锁悬臂520与第一侧板320的配合连接以及光模块与笼子解锁，第一解锁悬臂520的另一端设置第一锁止卡勾521，第一侧板320的外壁上第一锁止卡槽321。未拖动解锁部件500时，第一锁止卡勾521嵌入第一锁止卡槽321内；当拖动解锁部件500时，第一锁止卡勾521沿拖动方向在第一锁止卡槽321内移动；松开拖动解锁部件500，第一锁止卡勾521回到第一锁止卡槽321内。因此第一锁止卡槽321可用于容纳第一锁止卡勾521以及对第一锁止卡勾521进行运动限位。
在本公开的某一些实施例中，第一解锁悬臂520的另一端还设置有第一凸起522和第三凸起523，第一凸起522位于第一解锁悬臂520的一侧边上，第三凸起523位于第一解锁悬臂520的另一侧边上。相应的，第一侧板320上设置第一限位槽322以及第三侧板420上设置第三限位槽421，第一凸起522嵌入第一限位槽322内，第三凸起523嵌入第三限位槽421内。当拖动解锁部件500或拖动后松开解锁部件500时，第一凸起522在第一限位槽322内移动，第三凸起523在第三限位槽421内移动。第一凸起522与第一限位槽322配合以及第三凸起523与第三限位槽421配合更加便于实现第一解锁悬臂520解锁运动时的限位，保证解锁部件500使用稳定性。
相应的，为方便第二解锁悬臂530与第二侧板330的配合连接以及光模块与笼子解锁，第二解锁悬臂530的另一端设置第二锁止卡勾531，第二侧板330的外壁上设置第二锁止卡槽331。未拖动解锁部件500时，第二锁止卡勾531嵌入第二锁止卡槽331内；当拖动解锁部件500时，第二锁止卡勾531沿拖动方向在第二锁止卡槽331内移动；松开拖动解锁部件500，第二锁止卡勾531回到第二锁止卡槽331内。因此第二锁止卡槽331可用于容纳第二锁止卡勾531以及对第二锁止卡勾531进行运动限位。
在本公开实施例中，光模块解锁过程中，拖动手柄510，第一锁止卡勾521和第二锁止卡勾531用于顶起上位机笼子上的锁止件，进而光模块可从上位机笼子中解锁脱离。
在本公开的某一些实施例中，第二解锁悬臂530的另一端还设置有第二凸起532和第四凸起533，第二凸起532位于第二解锁悬臂530的一侧边上，第四凸起533位于第二解锁悬臂530的另一侧边上。相应的，第二侧板330上设置第二限位槽332以及第四侧板430上设置第四限位槽431，第二凸起532嵌入第二限位槽332内，第四凸起533嵌入第四限位槽431内。当拖动解锁部件500或拖动后松开解锁部件500时，第二凸起532在第二限位槽332内移动，第四凸起533在第四限位槽431内移动。第二凸起532与第二限位槽332配合以及第四凸起533与第四限位槽431配合更加便于实现第二解锁悬臂530解锁运动时的限位，保证解锁部件500使用稳定性。
在本公开实施例中，第一侧板320的外壁上设置第一安装面323，第一安装面323位于第一凹陷区域20-1内，第一导电垫610粘贴连接第一安装面323。第一安装面323的设置位置应避免对解锁部件500产生干扰，设置第一安装面323有助于方便第一导电垫610 安装设置，同时可以保证第一导电垫610的安装精度，避免第一导电垫610的安装不当而影响解锁部件500的使用。如，防止第一导电垫610的安装不当而影响第一解锁悬臂520相对壳体的移动，因而第一安装面323应相对远离第一锁止卡槽321。在本公开的某一些实施例中，第一安装面323位置可与上位机笼子夹紧光模块的卡件位置相对应，上位机笼子夹紧光模块的卡件在夹紧光模块时可挤压第一解锁悬臂520与第一导电垫610充分接触。
相应的，第二侧板330的外壁上设置第二安装面333，第二安装面333位于第二凹陷区域30-1内，第二导电垫620粘贴连接第二安装面333。第二安装面333的设置位置应避免对解锁部件500产生干扰，设置第二安装面333有助于方便第二导电垫620安装设置，同时可以保证第二导电垫620的安装精度，避免第二导电垫620的安装不当而影响解锁部件500的使用。如，防止第二导电垫620的安装不当而影响第二解锁悬臂530相对壳体的移动，因而第二安装面333应相对远离第二锁止卡槽331。在本公开的某一些实施例中，第二安装面333位置可与上位机笼子夹紧光模块的卡件位置相对应，进而上位机笼子夹紧光模块的卡件在夹紧光模块时可挤压第二解锁悬臂530与第二导电垫620充分接触。
在本公开的某一些实施例中，第一安装面还可设置在第三侧板420或第四侧板430上；相应的，第二安装面还可设置在第四侧板430或第三侧板420上。
在本公开实施例中，壳体的头部两侧分别设置第一弹簧槽和第二弹簧槽，第一弹簧槽内设置第一弹簧和第二弹簧槽内设置第二弹簧，解锁部件上设置第一弹簧卡勾和第二弹簧卡勾，第一弹簧卡勾配合连接第一弹簧，第二弹簧卡勾配合连接第二弹簧。第一弹簧卡勾与第一弹簧配合以及第二弹簧卡勾与第二弹簧配合用于实现解锁部件解锁光模块后的自动回复。
在本公开的某一些实施例中，如附图5-7所示，上壳体300靠近光口处的两侧分别设置第一弹簧槽340和第二弹簧槽350，第一弹簧槽340内设置第一弹簧340-1，第二弹簧槽350内设置第二弹簧350-1。第一解锁悬臂520与手柄510的连接端设置第一弹簧卡勾524，第二解锁悬臂530与手柄510的连接端设置第二弹簧卡勾534。
图8为根据一些实施例提供的一种具有导电垫光模块的剖视图。如图8所示，第一导电垫610被第一侧板320和第三侧板420以及第一解锁悬臂520之间，第一导电垫610的一侧接触第一侧板320的外壁和第三侧板420的外壁、另一侧接触第一解锁悬臂520，进而第一导电垫610可用于密封第一侧板320和第三侧板420分别与第一解锁悬臂520之间的间隙。同时，通过第一导电垫610实现第一侧板320、第三侧板420和第一解锁悬臂520之间的导通，进而能够避免电磁波从第一侧板320和第三侧板420分别与第一解锁悬臂520之间的间隙辐射出去，提升光模块的电磁屏蔽效果。
相应的，如图8所示，第二导电垫620被第二侧板330和第四侧板430以及第二解锁悬臂530之间，第二导电垫620的一侧接触第二侧板330的外壁和第四侧板430的外壁、另一侧接触第二解锁悬臂530，进而第二导电垫620可用于密封第二侧板330和第四侧板430分别与第二解锁悬臂530之间的间隙。同时，通过第二导电垫620实现第二侧板330、第四侧板430和第二解锁悬臂530之间的导通，进而能够避免电磁波从第二侧板330和第四侧板430分别与第二解锁悬臂530之间的间隙辐射出去，以提升光模块的电磁屏蔽效果。
图9为根据一些实施例提供的再一种光模块的外部结构示意图。如图9所示，光模块的壳体侧壁上设置若干筋位凸起。在本公开的某一些实施例中，第一侧板320的上设置若干第一筋位凸起324，第一筋位凸起324导通连接第一解锁悬臂520和第一侧板320，用于密封第一解锁悬臂520与第一侧板320之间的间隙；第三侧板420的上设置若干第二筋位凸起422，第二筋位凸起422导通连接第一解锁悬臂520和第三侧板420，用于密封第一解锁悬臂520与第三侧板420之间的间隙。进而在光模块插入上位机使用时，上位机内的电磁辐射传输至第一筋位凸起324和第二筋位凸起422处，第一筋位凸起324和第二筋位凸起422密封第一解锁悬臂520可用于防止电磁波从第一解锁悬臂520与壳体侧壁之间的间隙辐射出去；同时相邻筋位凸起之间形成的凸起槽，可对电磁辐射进行多次反射以及吸收以达到提升电磁屏蔽效果的目的，因此可通过第一筋位凸起324和第二筋位凸起422达到提高上位机电磁屏蔽的效果。
在本公开的某一些实施例中，第二侧板还可设置第三筋位凸起以及第四侧板上还可设置第四筋位凸起，第三筋位凸起和第四筋位凸起的结构以及作用可参考第一筋位凸起324和第二筋位凸起422。
在本公开的某一些实施例中，第一侧板、第二侧板、第三侧板和第四侧板的外壁上筋位凸起的凸起高度为0.05-0.15mm,筋位凸起的宽度为0.5-1.5mm，相邻筋位凸起的间距为0.5-1.5mm。如此便于保证电磁屏蔽的效果。
图10为根据一些实施例提供的一种光模块中上壳体的结构示意图，图11为根据一些实施例提供的一种光模块中上壳体的另一角度结构示意图。如图10、图11所示，上壳体300上设置有第一支撑板2011与凹槽，第一支撑板2011与凹槽相邻设置，且第一支撑板2011设置在上壳体300主体与电路板204之间，用于支撑固定电路板204。在本公开实施例中，第一支撑板2011与凹槽相互平行，均沿上壳体300的宽度方向设置。
在本公开的某一些实施例中，第一支撑板2011可将上壳体300主体分为第一部分与第二部分，第二部分位于电路板204上金手指的上方，而凹槽设置在上壳体300的第二部分上，用于反射消减电路板204上传导出来的电磁波。
上壳体300上可设置至少两个凹槽，第一支撑板2011与至少两个凹槽并行设置，且至少两个凹槽设置于第一支撑板2011的同一侧。电路板204上的光电器件产生的电磁波可从第一支撑板2011与电路板204之间的缝隙传导出去，传导出去的电磁波进入上壳体300的凹槽内，电磁波在凹槽内发生反射，改变电磁波的传播方向，消减电磁波能量；之后电磁波进入另一个凹槽，在另一个凹槽内继续发生反射，以消减电磁波能量。如此下去，能够减少传导至光模块外部的电磁波，避免电磁波对光模块外部的其他通信设备产生电磁干扰。
同样，与金手指连接的金手指连接器也会产生电磁波，该电磁波也可从第一支撑板2011与电路板204之间的缝隙传导至光模块内部。在本公开实施例中，金手指连接器产生的电磁波进入上壳体300的凹槽内，电磁波在凹槽内发生反射，改变电磁波的传播方向，消减电磁波能量；之后电磁波进入另一个凹槽，在另一个凹槽内继续发生反射，以消减电磁波能量。如此下去，能够减少传导至光模块内部的电磁波，避免电磁波对光模块内部的 光电器件产生电磁干扰。
图12为根据一些实施例提供的一种光模块的局部剖面示意图，图13为图12中A处放大示意图。如图12、图13所示，上壳体300上可设置第一凹槽2012与第二凹槽2013，第一支撑板2011、第一凹槽2012与第二凹槽2013并行设置，且第一凹槽2012的一侧面可与第一支撑板2011的一侧面为同一侧面，即第一凹槽2012与第一支撑板2011共用同一侧面。
第一凹槽2012与第二凹槽2013间隔设置，且第一凹槽2012与第二凹槽2013之间设置有挡板。在本公开的某一些实施例中，挡板的一侧面与第一凹槽2012的另一侧面为同一侧面，挡板相对的另一侧面与第二凹槽2013的一侧面为同一侧面。即挡板相对的两侧面中，一侧面与第一凹槽2012共用，另一侧面与第二凹槽2013共用。
在本公开实施例中，根据光模块的尺寸及电路板204上的金手指，上壳体300上第一凹槽2012与第二凹槽2013的凹槽宽度可为0.6～1mm，第一凹槽2012与第二凹槽2013之间的挡板宽度可为0.6～1mm。如此电磁波在第一凹槽2012发生反射后，反射后的电磁波容易进入第二凹槽2013内，继续在第二凹槽2013内发生反射，以消减电磁波的能量。
电路板204上光电器件产生的电磁波在通过第一支撑板2011与电路板204之间的缝隙传导出来时，电磁波的辐射角度可遍布各个方向；或者金手指连接器产生的电磁波在进入光模块内部时，电磁波的辐射角度也具有多个方向。为使得电磁波能够尽可能多地进入第一凹槽2012内，第一凹槽2012的深度应为预设深度，以容纳较多的电磁波。同理，第二凹槽2013的深度也应为预设深度，以使得反射后的电磁波尽可能多地进入第二凹槽2013。在本公开实施例中，第一凹槽2012与第二凹槽2013的预设深度可均为0.6～2mm。
为分隔第一凹槽2012与第二凹槽2013，第一凹槽2012与第二凹槽2013之间挡板的深度也可为0.6～2mm，避免挡板遮挡由第一凹槽2012输入第二凹槽2013的电磁波。
在本公开实施例中，第一凹槽2012与第二凹槽2013的深度不仅限于预设深度，也可根据实际情况合理选择第一凹槽2012与第二凹槽2013的预设深度，其均属于本公开实施例的保护范围。
由于第一凹槽2012与第二凹槽2013均沿上壳体300的宽度方向设置，且第一凹槽2012与第二凹槽2013用于反射电路板204传导的电磁波，如此第一凹槽2012与第二凹槽2013的尺寸可等于或略大于电路板204的宽度尺寸，以尽可能多地接收电路板204传导的电磁波。在本公开实施例中，考虑到上壳体300与电路板204的尺寸，第一凹槽2012与第二凹槽2013的尺寸可为12.8mm×0.9mm。
本公开实施例提供的光模块，在上壳体上设置第一支撑板与至少两个凹槽，凹槽与第一支撑板并行设置，且第一支撑板设置在上壳体主体与电路板之间，以支撑电路板；电路板的一端设有金手指，凹槽设置于金手指的上方，且金手指与第一支撑板分别位于凹槽的两侧，如此电路板上的光电器件产生的电磁波，由第一支撑板与电路板之间的缝隙传导出去后，电磁波进入凹槽内，在凹槽内发生反射，改变电磁波的传播方向，从而消减电磁波的输出，避免电磁波传导至光模块外部，对其他通信设备产生电磁干扰。另外，金手指连接器产生的电磁波，也可在凹槽内发生反射，以消减电磁波，防止电磁波进入光模块的内 部，避免其对光模块内部光电器件产生电磁干扰。本公开在上壳体上设置至少两个凹槽，用于反射来自于光模块内部或金手指连接器的电磁波，改变了电磁波的传播方向，消减了电磁波的输出，在光模块的电口处进行电磁屏蔽，改善了光模块的电磁屏蔽性能。
针对光模块电口处电磁波屏蔽是光模块EMI设计的薄弱部位，本公开实施例还提供了一种光模块，该光模块在下壳体上设置凹槽，该凹槽设置于金手指的下方，由光模块电口处的缝隙传导处的电磁波射入凹槽内，在凹槽内发生反射，能够消减电磁波输出，避免电磁波对其他通信设备产生电磁干扰，提高光模块的电磁屏蔽性能。
在本公开的某一些实施例中，下壳体202上设置有第二支撑板与凹槽，第二支撑板与凹槽相邻设置，且第二支撑板设置在下壳体202主体与电路板204之间，用于支撑固定电路板204。在本示例中，第二支撑板与凹槽相互平行，均沿下壳体202的宽度方向设置。
下壳体202上可设置至少两个凹槽，第二支撑板与至少两个凹槽并行设置，且至少两个凹槽设置在第二支撑板的同一侧。电路板204上的光电器件产生的电磁波可从第二支撑板与电路板204之间的缝隙传导出去，传导出去的电磁波进入下壳体202的凹槽内，电磁波在凹槽内发生反射，改变电磁波的传播方向，消减电磁波能量；之后电磁波进入另一个凹槽，在另一个凹槽内继续发生反射，以消减电磁波能量。如此能够减少传导至光模块外部的电磁波，避免电磁波对光模块外部的其他通信设备产生电磁干扰。
同样，与金手指连接的金手指连接器也会产生电磁波，该电磁波也可从第二支撑板与电路板204之间的缝隙传导至光模块内部。在本公开实施例中，金手指连接器产生的电磁波进入下壳体202的凹槽内，电磁波在凹槽内发生反射，改变电磁波的传播方向，消减电磁波能量；之后发射后的电磁波进入另一个凹槽，在另一个凹槽内继续发生反射，以消减电磁波能量。如此能够减少传导至光模块内部的电磁波，避免电磁波对光模块内部的光电器件产生电磁干扰。
在本公开的某一些实施例中，下壳体202上可设置第三凹槽与第四凹槽，第二支撑板、第三凹槽与第四凹槽并行设置，且第三凹槽的一侧面可与第二支撑板的一侧面为同一侧面，即第三凹槽与第二支撑板共用同一侧面。
第三凹槽与第四凹槽间隔设置，且第三凹槽与第四凹槽之间设置有挡板。在本公开的某一些实施例中，挡板的一侧面与第三凹槽的另一侧面为同一侧面，挡板相对的另一侧面与第四凹槽的一侧面为同一侧面。即挡板相对的两侧面中，一侧面与第三凹槽共用，另一侧面与第四凹槽共用。
在本公开实施例中，根据光模块的尺寸及电路板204上的金手指，下壳体202上第三凹槽与第四凹槽的凹槽宽度可为0.6～1mm，第三凹槽与第四凹槽之间的挡板宽度可为0.6～1mm。如此电磁波在第一凹槽2012发生反射后，反射后的电磁波容易进入第二凹槽2013内，继续在第二凹槽2013内发生反射，以消减电磁波的能量。
电路板204上光电器件产生的电磁波在通过第二支撑板与电路板204之间的缝隙传导出来时，电磁波的辐射角度可遍布各个方向；或者金手指连接器产生的电磁波在进入光模块内部时，电磁波的辐射角度也具有多个方向。为使得电磁波能够尽可能多地进入第三凹槽内，第三凹槽的深度应为预设深度，以容纳较多的电磁波。同理，第四凹槽的深度也应 为预设深度，以使得反射后的电磁波尽可能多地进入第四凹槽。在本公开实施例中，第三凹槽与第四凹槽的预设深度可均为0.6～2mm。
为分隔第三凹槽与第四凹槽，第三凹槽与第四凹槽之间挡板的深度也可为0.6～2mm，避免挡板遮挡由第三凹槽输入第四凹槽的电磁波。
在本公开实施例中，第三凹槽与第四凹槽的深度不仅限于预设深度，也可根据实际情况合理选择第三凹槽与第四凹槽的预设深度，其均属于本公开实施例的保护范围。
由于第三凹槽与第四凹槽均沿下壳体202的宽度方向设置，且第三凹槽与第四凹槽用于反射电路板204传导的电磁波，如此第三凹槽与第四凹槽的尺寸可等于或略大于电路板204的宽度尺寸，以尽可能多地接收电路板204传导的电磁波。在本公开实施例中，考虑到下壳体202与电路板204的尺寸，第三凹槽与第四凹槽的尺寸可为12.8mm×0.9mm。
本公开实施例提供的光模块，在下壳体上设置第二支撑板与至少两个凹槽，凹槽与第二支撑板并行设置，且第二支撑板设置在下壳体主体与电路板之间，以支撑电路板；电路板的一端设有金手指，凹槽设置于金手指的下方，且金手指与第二支撑板分别位于凹槽的两侧，如此电路板上的光电器件产生的电磁波，由第二支撑板与电路板之间的缝隙传导出去后，电磁波进入凹槽内，在凹槽内发生反射，改变电磁波的传播方向，从而消减电磁波的输出，避免电磁波传导至光模块外部，对其他通信设备产生电磁干扰。另外，金手指连接器产生的电磁波，也可在凹槽内发生反射，以消减电磁波，防止电磁波进入光模块的内部，避免其对光模块内部光电器件产生电磁干扰。本公开在上壳体上设置至少两个凹槽，用于反射来自于光模块内部或金手指连接器的电磁波，改变了电磁波的传播方向，消减了电磁波的输出，在光模块的电口处进行电磁屏蔽，改善了光模块的电磁屏蔽性能。
在申请实施例中，可在上壳体或下壳体上设置凹槽，用于反射来自光模块内部或金手指连接器的电磁波，改变电磁波的传播方向，消减电磁波的输出，改善光模块的电磁屏蔽性能。但考虑到光模块的尺寸，不适合在上壳体与下壳体上分别设置消减电磁波的凹槽。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (19)

  1. 一种光模块，其特征在于，包括：
    壳体，包括形成包裹腔体的侧壁，所述侧壁上设置凹陷区域；
    解锁部件，配合连接所述凹陷区域；
    屏蔽部件，设置在所述凹陷区域，所述屏蔽部件导通连接所述侧壁和所述解锁部件。
  2. 根据权利要求1所述光模块，其特征在于，所述侧壁包括第一侧板、第二侧板、第三侧板和第四侧板，所述第一侧板和所述第三侧板配合连接且形成第一凹陷区域，所述第二侧板和所述第四侧板配合连接且形成第二凹陷区域；
    所述屏蔽部件包括第一导电垫和第二导电垫，所述第一导电垫设置在所述第一凹陷区域，所述第二导电垫设置在所述第二凹陷区域。
  3. 根据权利要求2所述光模块，其特征在于，所述解锁部件包括第一解锁悬臂、第二解锁悬臂和手柄；所述第一解锁悬臂的一端和所述第二解锁悬臂一端分别连接所述手柄，所述第一解锁悬臂的另一端配合连接所述第一侧板，所述第二解锁悬臂的另一端配合连接所述第二侧板；
    所述第一解锁悬臂的中部挤压接触所述第一导电垫，所述第二解锁悬臂的中部挤压接触所述第二导电垫。
  4. 根据权利要求1所述光模块，其特征在于，所述屏蔽部件为柔性导电布，所述柔性导电布粘贴连接所述凹陷区域。
  5. 根据权利要求3所述光模块，其特征在于，所述第一导电垫的宽度大于或等于所述第一解锁悬臂中部的宽度，所述第二导电垫的宽度大于或等于所述第二解锁悬臂中部的宽度。
  6. 根据权利要求2所述光模块，其特征在于，所述第一凹陷区域包括第一安装面，所述第一导电垫粘贴连接所述第一安装面；
    所述第二凹陷区域包括第二安装面，所述第二导电垫粘贴连接所述第二安装面。
  7. 根据权利要求1所述光模块，其特征在于，所述屏蔽部件包括若干筋位凸起，所述解锁部件覆盖所述筋位凸起。
  8. 根据权利要求3所述光模块，其特征在于，所述第一解锁悬臂的另一端设置第一锁止卡勾，所述第一侧板上设置第一锁止卡槽，所述第一锁止卡勾嵌入所述第一锁止卡槽内；
    所述第二解锁悬臂的另一端设置第二锁止卡勾，所述第二侧板上设置第二锁止卡槽，所述第二锁止卡勾嵌入所述第二锁止卡槽内。
  9. 根据权利要求3所述光模块，其特征在于，所述第一解锁悬臂的另一端还设置第一凸起，所述第一侧板上设置第一限位槽，所述第一凸起嵌入所述第一限位槽内；
    所述第二解锁悬臂的另一端还设置第二凸起，所述第二侧板上设置第二限位槽，所述第二凸起嵌入所述第二限位槽内。
  10. 根据权利要求3所述光模块，其特征在于，所述第一解锁悬臂的另一端还设置第 三凸起，所述第三侧板上设置第三限位槽，所述第三凸起嵌入所述第三限位槽内；
    所述第二解锁悬臂的另一端还设置第四凸起，所述第二侧板上设置第四限位槽，所述第四凸起嵌入所述第四限位槽内。
  11. 一种光模块，其特征在于，包括：
    下壳体；
    上壳体，盖合所述下壳体上，形成腔体；其上设有第一支撑板与凹槽，所述凹槽与所述第一支撑板相邻设置；
    电路板，设置于所述腔体内，所述第一支撑板设置于所述电路板与所述上壳体主体之间；其一端设有金手指，所述凹槽设置于所述金手指的上方，且所述金手指与所述第一支撑板分别位于所述凹槽的两侧。
  12. 根据权利要求11所述的光模块，其特征在于，所述上壳体上设置有至少两个凹槽，所述第一支撑板与至少两个所述凹槽并行设置，且至少两个所述凹槽设置于所述第一支撑板的同一侧。
  13. 根据权利要求12所述的光模块，其特征在于，所述上壳体上并行设置有第一凹槽与第二凹槽，所述第一凹槽的一侧面与所述第一支撑板的一侧面为同一侧面；所述第一凹槽与所述第二凹槽之间设置有挡板。
  14. 根据权利要求13所述的光模块，其特征在于，所述挡板的一侧面与所述第一凹槽的另一侧面为同一侧面，所述挡板相对的另一侧面与所述第二凹槽的一侧面为同一侧面。
  15. 根据权利要求13所述的光模块，其特征在于，所述第一凹槽与所述第二凹槽的宽度均为0.6～1mm。
  16. 根据权利要求14所述的光模块，其特征在于，所述挡板的宽度为0.6～1mm。
  17. 根据权利要求16所述的光模块，其特征在于，所述挡板的深度为0.6～2mm。
  18. 根据权利要求11所述的光模块，其特征在于，所述凹槽的深度为0.6～2mm。
  19. 根据权利要求11所述的光模块，其特征在于，所述凹槽的尺寸为12.8mm×0.9mm。
PCT/CN2021/116995 2020-09-08 2021-09-07 一种光模块 WO2022052920A1 (zh)

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