WO2022050372A1 - Photocurable thermosetting resin composition, dry film, cured product, and electronic component comprising cured product - Google Patents
Photocurable thermosetting resin composition, dry film, cured product, and electronic component comprising cured product Download PDFInfo
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- WO2022050372A1 WO2022050372A1 PCT/JP2021/032395 JP2021032395W WO2022050372A1 WO 2022050372 A1 WO2022050372 A1 WO 2022050372A1 JP 2021032395 W JP2021032395 W JP 2021032395W WO 2022050372 A1 WO2022050372 A1 WO 2022050372A1
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- resin composition
- resin
- photocurable thermosetting
- epoxy resin
- photopolymerization initiator
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Definitions
- the present invention relates to a photocurable thermosetting resin composition, a dry film, a cured product, and an electronic component having the cured product.
- the present invention relates to a photocurable thermosetting resin composition consisting of at least a two-component system, a cured product thereof suitable for a printed wiring board, for example, a solder resist, and an electronic component having the cured product.
- solder resist has been used as a protective material for wiring board circuits, and high solder heat resistance and electrical insulation are required.
- the material composition for example, alkali-developing type light.
- examples thereof include curable thermosetting resin compositions.
- a photosensitive polymer having a carboxyl group is mainly contained as a material, but in order to enhance the solder heat resistance of the cured product obtained after curing the composition.
- an epoxy resin may be contained.
- the epoxy resin is relatively easy to react with the photosensitive polymer having a carboxyl group, there is a problem in long-term storage as a composition. Therefore, in general, a method has been used in which a two-component system in which easily reactive components are blended into different compositions is prepared, and they are mixed at the time of use to prepare a photocurable thermosetting resin composition.
- the density of printed wiring boards has been remarkably increased, and the minimum circuit size is 10 ⁇ m for lines and 10 ⁇ m for spaces, and higher insulation reliability than before is required.
- insoluble substances inorganic filler, crystalline epoxy resin, etc.
- the resin compositions of the two liquids stored for one month after preparation are used. After mixing, when applied to the carrier film, the coarse particles that are thought to have been generated during the storage period of those resin compositions stored in separate containers cause cissing and pinholes for a long period of time. There was also a problem with storage stability.
- Patent Document 1 discloses that, among the constituents of a photocurable thermosetting resin composition, an epoxy resin is focused on to prevent the generation of coarse particles. ..
- an epoxy resin is focused on to prevent the generation of coarse particles. ..
- the density of the printed wiring board is remarkably increased, and the photocurable thermosetting resin composition is required to have higher insulation reliability, and coarse particles due to various factors as well as the epoxy resin are required.
- HAST resistance electrical characteristics
- the generation of coarse particles due to various factors as well as the epoxy resin was suppressed, and pinholes were generated in the dry film production process. It is desirable to obtain long-term storage stability, such as suppressing the occurrence of pinholes and pinholes.
- an object of the present invention is to have excellent electrical characteristics (HAST resistance) of the cured product, good long-term storage stability, and at least 2 that can suppress the occurrence of cissing and pinholes in the dry film manufacturing process. It is an object of the present invention to provide a photocurable thermosetting resin composition which is composed in a liquid system. Further, an object of the present invention is a dry film and a cured product having excellent various properties as described above obtained by using such an alkali-developed solder resist composition, and a solder resist and the like depending on the dry film and the cured product. It is an object of the present invention to provide a printed wiring board on which a cured film is formed.
- the above-mentioned problems are (A) epoxy resin, (B) carboxyl group-containing resin, (C) photopolymerization initiator, (D) photosensitive monomer, (E) silica, (F).
- the resin composition is composed of at least two liquids.
- the (B) carboxyl group-containing resin, the (D) photosensitive monomer, and the (E) silica are different from the (A) epoxy resin, the (F) barium sulfate, and the (C) photopolymerization initiator.
- the resin composition containing the (C) photopolymerization initiator is composed of at least two liquids and is photocurable, characterized by containing an organic solvent capable of dissolving the (C) photopolymerization initiator. It has been found that it can be solved by a thermosetting resin composition, and the present invention has been completed. Of these, a preferred embodiment of the present invention is characterized by containing three types of the (A) epoxy resin, a semi-solid or solid epoxy resin at room temperature, a biphenyl type epoxy resin, and a novolak type. The present invention relates to a thermosetting resin composition.
- a more preferable aspect of the present invention is that the composition containing the epoxy resin (A) has a viscosity of 4 dPa ⁇ s or less, and the photocurable thermosetting obtained by mixing the respective resin compositions.
- the present invention relates to a photocurable thermosetting resin composition, wherein the resin composition has a viscosity of 4 dPa ⁇ s or less.
- the composition containing the (A) epoxy resin contains the (C) photopolymerization initiator and the organic solvent, with respect to 1 part by mass of the (C) photopolymerization initiator.
- the present invention relates to a photocurable thermosetting resin composition, which comprises 3 parts by mass or more of the organic solvent.
- Another aspect of the present invention relates to a dry film having a film thickness of 10 ⁇ m to 30 ⁇ m, which is obtained by applying and drying the above-mentioned photocurable thermosetting resin composition on a carrier film.
- Yet another aspect of the present invention also relates to the photocurable thermosetting resin composition described above, which is characterized by being used as a material for a solder resist.
- Yet another aspect of the present invention is characterized in that it is obtained by curing a resin layer of a cured product or a dry film, which is obtained by curing a photocurable thermosetting resin composition.
- the present invention relates to a cured product and an electronic component having the cured product thereof.
- the cured product obtained by curing the photocurable thermosetting resin composition has excellent electrical characteristics (HAST resistance), and each resin composition has good long-term storage stability and is dry. It is possible to provide a photocurable thermosetting resin composition composed of at least a two-component system capable of suppressing the generation of cissing and pinholes in the film manufacturing process. Further, according to the present invention, a dry film and a cured product having excellent various properties as described above obtained by using such a photocurable thermosetting resin composition, and a solder resist using the dry film and the cured product. It is possible to provide an electronic component such as a printed wiring board on which a cured film such as the above is formed.
- the photocurable thermosetting resin composition of the present invention is preferably composed of at least a two-component resin composition.
- a two-component system in which one resin composition is used as a main agent composition and the other resin composition is used as a curing agent composition can be mentioned.
- the main agent composition may be composed of (B) a carboxyl group-containing resin, (D) a photosensitive monomer, (E) silica, and, if necessary, an organic solvent, as a curing agent composition.
- C) Photopolymerization initiator, (F) Barium sulfate and (C) Photopolymerization initiator are preferably composed of a soluble organic solvent.
- (A) an epoxy resin and (B) a carboxyl group-containing resin, and (D) a photosensitive monomer and (C) a photopolymerization initiator are used, respectively. It is preferably contained in separate compositions. In addition, separation of the liquid surface of each composition (color floating / color separation), so-called Benard cell, may occur, which may impair the appearance of the liquid surface of each composition. Therefore, (E) silica and (F) barium sulfate are also used. Further, it is preferable that the components are separately contained in different compositions.
- composition containing the carboxyl group-containing resin is preferably contained in a composition different from that of the (C) photopolymerization initiator and the organic solvent for dissolving the photopolymerization initiator.
- the composition containing the epoxy resin (A) has a viscosity of 4 dPa ⁇ s or less, and the photocurable thermosetting resin composition obtained by mixing the respective resin compositions is 0.
- Having a viscosity of 1 dPa ⁇ s or more and 4 dPa ⁇ s or less is preferable because the precipitation of the (A) epoxy resin can be suppressed.
- the viscosity of the composition containing (A) epoxy resin is 0.1 dPa ⁇ s or more, it is preferable that the composition is easy to handle.
- the epoxy resin functions as a thermosetting component in the photocurable thermosetting resin composition and forms a cured product.
- epoxy resin a known and commonly used polyfunctional epoxy resin having at least two epoxy groups in one molecule can be used.
- the epoxy resin may be liquid, or may be solid or semi-solid.
- the polyfunctional epoxy resin includes bisphenol A type epoxy resin; brominated epoxy resin; novolak type epoxy resin; bisphenol F type epoxy resin; hydrogenated bisphenol A type epoxy resin; glycidylamine type epoxy resin; hydride-in type epoxy resin; oil ring.
- epoxy resin trihydroxyphenylmethane type epoxy resin; bixilenol type or biphenol type epoxy resin or a mixture thereof; bisphenol S type epoxy resin; bisphenol A novolak type epoxy resin; tetraphenylol ethane type epoxy resin; heterocyclic epoxy Resin; diglycidyl phthalate resin; tetraglycidyl xylenoyl ethane resin; naphthalene group-containing epoxy resin; epoxy resin having a dicyclopentadiene skeleton; glycidyl methacrylate copolymerized epoxy resin; cyclohexyl maleimide and glycidyl methacrylate copolymerized epoxy resin ; Epoxy-modified polybutadiene rubber derivative; CTBN-modified epoxy resin, epoxy resin having an isocyanul ring, and the like are preferable, but of course, the present invention is not limited thereto.
- epoxy resins can be used alone or in combination of two or more.
- the epoxy resin it is preferable to use a novolak type epoxy resin as opposed to a semi-solid or solid epoxy resin and a biphenyl type epoxy resin at room temperature. By using these epoxy resins together, it is possible to suppress the generation of repellents and pinholes during the formation of a dry film.
- the solid epoxy resin an epoxy resin having a dicyclopentadiene skeleton is particularly preferable because it has a low water absorption rate and is excellent in electrical characteristics.
- epoxy resin that is solid or semi-solid at room temperature examples include bisphenol A type epoxy resin (jER1001 manufactured by Mitsubishi Chemical Co., Ltd.), bisphenol F type epoxy resin (jER4004P manufactured by Mitsubishi Chemical Co., Ltd.), and naphthalene type epoxy resin (DIC Co., Ltd.).
- solid or semi-solid at room temperature means to exhibit solid or semi-solid at 15 ° C.
- the determination of solid or semi-solid can be performed in accordance with the "Liquid Confirmation Method" of Attachment 2 of the Ministerial Ordinance on Dangerous Goods Testing and Properties (Ministerial Ordinance No. 1 of 1989).
- the biphenyl type epoxy resin in the component (A) a known and commonly used polyfunctional epoxy resin having a biphenyl skeleton can be used.
- a biphenyl skeleton-containing polyfunctional solid epoxy resin NC-3000H, NC-3000 manufactured by Nippon Kayaku Co., Ltd.
- a biphenyl type epoxy resin YX-4000, YL-6121HA manufactured by Mitsubishi Chemical Corporation
- the novolak type epoxy resin in the component (A) include cresol novolak type epoxy resin (Epicron N-690 manufactured by DIC Corporation), phenol novolac type epoxy resin (Epicron N-770 manufactured by DIC Corporation), and Mitsubishi Chemical Co., Ltd. jER152) and the like.
- the content of the (A) epoxy resin as described above is preferably in the range of about 30 to 60 parts by mass, preferably in the range of 35 to 45 parts by mass with respect to 100 parts by mass of the following (B) carboxyl group-containing resin. Is more preferable.
- the (B) carboxyl group-containing resin used in the present invention has a carboxyl group in the molecule and does not have an ethylenically unsaturated group (non-photosensitive) or has this (photosensitive).
- Various conventionally known carboxyl group-containing resins can be used.
- carboxyl group-containing resin having no ethylenically unsaturated group include the following compounds (either oligomer or polymer).
- a dialcohol compound a polycarbonate-based polyol, which contains a diisocyanate such as an aliphatic diisocyanate, a branched aliphatic diisocyanate, an alicyclic diisocyanate, and an aromatic diisocyanate, and a carboxyl group such as dimethylolpropionic acid and dimethylolbutanoic acid.
- a diisocyanate such as an aliphatic diisocyanate, a branched aliphatic diisocyanate, an alicyclic diisocyanate, and an aromatic diisocyanate
- carboxyl group such as dimethylolpropionic acid and dimethylolbutanoic acid.
- a carboxyl group-containing urethane resin obtained by a double addition reaction of a diol compound such as a polyether polyol, a polyester polyol, a polyolefin polyol, a bisphenol A alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
- a diol compound such as a polyether polyol, a polyester polyol, a polyolefin polyol, a bisphenol A alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
- a carboxyl group-containing resin obtained by copolymerizing an unsaturated carboxylic acid such as (meth) acrylic acid with an unsaturated group-containing compound such as styrene, ⁇ -methylstyrene, lower alkyl (meth) acrylate, and isobutylene.
- a dicarboxylic acid such as adipic acid, phthalic acid, or hexahydrophthalic acid is reacted with a bifunctional epoxy resin or a bifunctional oxetane resin, and the generated hydroxyl group is subjected to phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, or the like.
- a carboxyl group-containing resin obtained by opening an epoxy resin or an oxetane resin and reacting the generated hydroxyl group with a polybasic acid anhydride.
- a polybasic acid anhydride is added to a reaction product such as a polyalcohol resin obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule, that is, a polyphenol compound, with an alkylene oxide such as ethylene oxide or propylene oxide.
- a reaction product such as a polyalcohol resin obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule, that is, a polyphenol compound, with an alkylene oxide such as ethylene oxide or propylene oxide.
- a carboxyl group-containing resin obtained by reacting with.
- carboxyl group-containing resin having an ethylenically unsaturated group include the following compounds (either oligomer or polymer).
- the ethylenically unsaturated bond in the carboxyl group-containing resin is preferably derived from acrylic acid, methacrylic acid or a derivative thereof.
- Dialcohol compounds polycarbonate-based polyols, which contain diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, aromatic diisocyanates, and carboxyl groups such as dimethylolpropionic acid and dimethylolbutanoic acid. Containing carboxyl group by double addition reaction of diol compound such as polyether polyol, polyester polyol, polyolefin polyol, acrylic polyol, bisphenol A alkylene oxide adduct diol, compound having phenolic hydroxyl group and alcoholic hydroxyl group Photosensitive urethane resin.
- diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, aromatic diisocyanates, and carboxyl groups such as dimethylolpropionic acid and dimethylolbutanoic acid. Containing carboxy
- Diisocyanate and bifunctional epoxy resin such as bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bixylenol type epoxy resin, biphenol type epoxy resin ( Meta)
- bisphenol A type epoxy resin hydrogenated bisphenol A type epoxy resin
- bisphenol F type epoxy resin bisphenol F type epoxy resin
- bisphenol S type epoxy resin bisphenol S type epoxy resin
- bixylenol type epoxy resin biphenol type epoxy resin
- Meta A carboxyl group-containing photosensitive urethane resin produced by a double addition reaction of an acrylate or a partially acid anhydride-modified product thereof and a carboxyl group-containing dialcohol compound.
- a carboxyl group-containing photosensitive resin obtained by reacting a bifunctional or higher polyfunctional (solid) epoxy resin with (meth) acrylic acid and adding a dibasic acid anhydride to a hydroxyl group existing in a side chain.
- a dicarboxylic acid such as adipic acid, phthalic acid, or hexahydrophthalic acid is reacted with a bifunctional oxetane resin, and two bases such as phthalic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride are added to the generated primary hydroxyl group.
- (Meta) acrylic acid is added to a reaction product such as a polyalcohol resin obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule, that is, a polyphenol compound, with an alkylene oxide such as ethylene oxide or propylene oxide.
- a carboxyl group-containing photosensitive resin obtained by reacting an unsaturated group-containing monocarboxylic acid such as the above with a reaction product obtained by further reacting a polybasic acid anhydride.
- Carboxyl group-containing photosensitive obtained by further adding a compound having one epoxy group and one or more (meth) acryloyl groups in one molecule to the above-mentioned resins (3), (7) to (15). Sex resin.
- carboxyl group-containing resins those other than those described in (7) to (16) can be used, and one type may be used alone or a plurality of types may be mixed and used. ..
- carboxyl group-containing resins a resin having an aromatic ring is particularly preferable because it has excellent resolution.
- the acid value of the (B) carboxyl group-containing resin is appropriately in the range of 40 to 200 mgKOH / g, and more preferably in the range of 45 to 120 mgKOH / g.
- the acid value of the carboxyl group-containing resin is within such a range, alkaline development is facilitated, dissolution of the exposed portion by the developer is suppressed, the line is not thinned more than necessary, and there is no dissolution peeling by the developer. Normal pattern drawing is possible.
- the mass average molecular weight of the above-mentioned (B) carboxyl group-containing resin varies depending on the resin skeleton, but is generally preferably in the range of 2,000 to 150,000, more preferably 5,000 to 100,000. .. When the mass average molecular weight is within such a range, the tack-free performance is excellent, the moisture resistance of the coating film after exposure is good, and the resolution, developability, and storage stability are excellent.
- the content of the (B) carboxyl group-containing resin is preferably in the range of 30 to 70% by mass, preferably 45 to 60% by mass in the main agent composition.
- the blending amount of the carboxyl group-containing resin is within such a range, the strength of the cured coating film does not decrease, and the thickening and the decrease in workability do not occur.
- the present invention may further contain an acryloyl group-containing resin as the acrylate-based resin.
- the acryloyl group-containing resin of the present invention contains two or more phenolic hydroxyl groups in a molecule containing the structure of the following general formula (I), which is obtained by a condensation reaction between a polymethylol form of bisphenol A or bisphenol F and phenols.
- the phenol compound (a) having a specific structure that is, a novolak-type phenol resin having a specific structure, the drying property of the ink composition before curing is improved, and a part or all of the phenolic hydroxyl groups of this resin is made into alcohol.
- Flexibility is imparted by conversion to an oxyalkyl group having a sex hydroxyl group, and ⁇ , ⁇ is added to the terminal hydroxyl group of the resulting oxyalkyl group by adding acrylic acid and / or methacrylic acid (c).
- acrylic acid and / or methacrylic acid c
- -Since an ethylenically unsaturated group is added to the end of the side chain, reactivity is improved, heat resistance and toughness are balanced at a high level, excellent in hardness and flexibility, and water resistance.
- a cured product having excellent chemical resistance and the like can be obtained.
- R 1 is -C (CH 3 ) 2- or -CH 2-
- R 2 is a hydrocarbon group having 1 to 11 carbon atoms
- a is an integer of 0 to 3
- n is 1 to 1. It represents an integer of 2
- m represents an integer of 1 to 10.
- phenols phenols, various cresols, alkylphenols such as various xylenols, and naphthols can be used, and o-cresol and 2,6-xylenol are preferably used. Further, these may be mixed and used.
- the addition ratio of the compound (b) having a cyclic ether group such as an alkylene oxide or a cyclic carbonate to the phenol compound (a) is 0.5 mol, preferably 0.8 per 1 equivalent of the phenolic hydroxyl group of the phenol compound (a). ⁇ 3.0 mol is good.
- the amount is in the range of 0.5 to 5.0 mol, the obtained acryloyl group-containing photosensitive resin is excellent in photocurability and drying property.
- the content of such an acryloyl group-containing resin is preferably in the range of 5 to 20% by mass, preferably 8 to 15% by mass in the main agent composition.
- Examples of the (C) photopolymerization initiator include bis- (2,6-dichlorobenzoyl) phenylphosphine oxide, bis- (2,6-dichlorobenzoyl) -2,5-dimethylphenylphosphinoxide, and bis-.
- Acetphenones such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone; anthraquinone, chloroanthraquinone.
- the content of the (C) photopolymerization initiator is preferably 5 to 15 parts by mass with respect to 100 parts by mass of the (B) carboxyl group-containing resin. When it is 5 parts by mass or more, the surface curability is good, and when it is 15 parts by mass or less, halation is less likely to occur and good resolution can be obtained.
- the photocurable thermosetting resin composition capable of forming the cured product of the present invention may contain a known and commonly used photosensitive monomer.
- the photosensitive monomer can be, for example, a compound having one or more ethylenically unsaturated groups in the molecule.
- Such (D) photosensitive monomer assists photocuring of (B) carboxyl group-containing resin by irradiation with active energy rays (when ethylenically unsaturated group is contained), and is a photocurable thermosetting resin. It cures the composition.
- the (D) photosensitive monomer preferably used in the present invention is, for example, methyl ⁇ - (allyloxymethyl) acrylate, or 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate.
- Diacrylate of diols such as 1,9-nonanediol diacrylate and 1,10-decanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, Dipropylene glycol diacrylate, tripropylene glycol diacrylate, polypropylene glycol diacrylate, neopentyl glycol diacrylate, neopentyl glycol diacrylate, caprolactone of diol obtained by adding at least one of ethylene oxide and propylene oxide to neopentyl glycol.
- Glycol diacrylates such as modified hydroxypivalate neopentyl glycol diacrylates, EO adduct diacrylates of bisphenol A, PO adduct diacrylates of bisphenol A, tricyclodecanedimethanol diacrylates, hydrogenated dicyclopentadienyldi.
- Bifunctional (meth) acrylates such as acrylates, diacrylates having a cyclic structure such as cyclohexyl diacrylates, or corresponding methacrylate monomers, pentaerythritol triacrylates, trimethylolpropane triacrylates, trimethylolmethanetriacrylates, and ethylene oxide modifications.
- the content of such (D) photosensitive monomer is preferably in the range of 10 to 27 parts by mass, preferably 15 to 20 parts by mass with respect to the total 100 parts by mass (solid content) of the (B) carboxyl group-containing resin.
- the range is more preferred.
- the photocurable thermosetting resin composition has sufficient photocurability, better patterning during development, and tackiness (d). The dryness to the touch) is also good.
- (E) silica is preferably contained as a filler in the main agent composition in the case of a two-component system.
- (E) Silica is preferably used in the present invention because it is excellent in its low hygroscopicity and low volume expansion.
- the silica may be either amorphous or crystalline, or a mixture thereof, but amorphous silica is preferable.
- (E) silica is usually preferably used as a slurry dispersed in a solvent from the viewpoint of ease of handling such as maintaining the degree of dispersion.
- (F) barium sulfate also acts as a filler like the above-mentioned (E) silica, but it is preferable that it is contained separately from (E) silica in the curing agent composition instead of the main agent composition. .. This is because the appearance of the composition coating film obtained from the mixed composition such as the formation of Benard cells may be impaired.
- (F) barium sulfate is usually preferably used as a slurry dispersed in a solvent.
- the silica (E) and barium (F) sulfate are preferably surface-treated, and it is more preferable that the surfaces thereof are surface-treated so that a curable reactive group can be introduced.
- the curable reactive group refers to a group that undergoes a curing reaction with (A) an epoxy resin or the like or (B) a carboxyl group-containing resin, and may be a photocurable reactive group or a thermosetting reactive group.
- Examples of the photocurable reactive group include a methacryl group, an acrylic group, a vinyl group, a styryl group and the like
- examples of the thermosetting reactive group include an epoxy group, an amino group, a hydroxyl group, a carboxyl group, an isocyanate group, an imino group and an oxetanyl.
- examples thereof include a group, a mercapto group, a methoxymethyl group, a methoxyethyl group, an ethoxymethyl group, an ethoxyethyl group, an oxazoline group and the like.
- the method for introducing the curable reactive group on the surfaces of (E) silica and (F) barium sulfate is not particularly limited, and the curable reactive group may be introduced by using a known and commonly used method, and a surface treatment agent having a curable reactive group, for example.
- the surface of the inorganic filler may be treated with a coupling agent or the like having a curable reactive group as an organic group.
- a coupling agent a silane coupling agent, a titanium coupling agent, a zirconium coupling agent, an aluminum coupling agent and the like can be used.
- Examples of the surface-treated inorganic filler having no curable reactive group include silica-alumina surface treatment, titanate-based coupling agent treatment, aluminate-based coupling agent treatment, and organically treated inorganic filler. Can be mentioned.
- the average particle size (D50) of the silica slurry is 2000 nm or less, more preferably 1200 nm or less.
- the lower limit thereof is preferably 0.1 nm or more as the average particle diameter (D50).
- the average particle size (D50) of the barium sulfate slurry (F) is 1000 nm or less, more preferably 500 nm or less.
- the lower limit thereof is preferably 0.1 nm or more as the average particle diameter (D50).
- the average particle size (D50) can be determined by a laser diffraction type particle size distribution measuring device and a measuring device by a dynamic light scattering method.
- Examples of the measuring device by the laser diffraction method include Microtrac MT3300EXII manufactured by Microtrac Bell, and examples of the measuring device by the dynamic light scattering method include Nanotrac Wave II UT151 manufactured by Microtrac Bell.
- the contents of (E) silica and (F) barium sulfate are of the present invention from the viewpoint that they can impart the properties necessary for a solder resist such as suppression of heat fog, high resolution, and good crack resistance. It is more preferably 15% by mass to 30% by mass, respectively, with respect to the total amount of the non-volatile components of the photocurable thermosetting resin composition.
- an organic solvent is used for preparing a photocurable thermosetting resin composition and adjusting its viscosity, or for preparing a slurry of (E) silica or a slurry of (F) barium sulfate. May be.
- organic solvents are ketones such as methyl ethyl ketone, cyclohexanone; aromatic hydrocarbons such as toluene, xylene, tetramethyl benzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, etc.
- Glycol ethers such as propylene glycol monomethyl ether, dipropylene glycol monomethyl ether (DPM), dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether; ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, Esters such as butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, and solvent naphtha.
- DPM dipropylene glycol monomethyl ether
- tripropylene glycol monomethyl ether tripropylene glycol monomethyl ether
- the content of the organic solvent is preferably in the range of 5% to 25% by mass with respect to the main composition of the photocurable thermosetting resin composition of the present invention.
- the content of this organic solvent also includes the organic solvent in the slurry of (E) silica.
- the curing agent composition is an organic solvent capable of dissolving (C) the photopolymerization initiator to be blended in the composition, and is 3 parts by mass or more with respect to 1 part by mass of (C) the photopolymerization initiator. It is preferable to contain the organic solvent of.
- the organic solvent capable of dissolving the photopolymerization initiator is " ⁇ : No crystals of the photopolymerization initiator were visually observed” as a result of the "confirmation test of solubility of the photopolymerization initiator” described later.
- (See Table 1) means an organic solvent. By selecting and using such an organic solvent, crystals of the (C) photopolymerization initiator are not formed, so that the generation of coarse particles can be suppressed.
- PMA and CA are excellent in coatability of the photocurable thermosetting resin composition after mixing and dryness to the touch after coating. Therefore, PMA alone or a mixture of PMA and CA is used. It is more preferable to use a solvent.
- the upper limit of the content of the organic solvent can be appropriately adjusted depending on the maximum dissolution amount of the (C) photopolymerization initiator (see Table 2 below). Similarly, photopolymerization initiators other than Omnirad TPO H shown in Tables 1-2 to 1-5 can be appropriately adjusted.
- thermosetting resin composition of the present invention it is of course possible to add additional additives as other components as necessary within the range not deviating from the object of the present invention.
- additional additives include, for example, colorants such as pigments and dyes, thermal polymerization inhibitors, ultraviolet absorbers, plasticizers, flame retardants, antistatic agents, antiaging agents, antibacterial / antifungal agents, leveling agents, thickening agents.
- adhesion-imparting agents adhesion-imparting agents, thixo-imparting agents, photoinitiator aids, sensitizers, photobase generators, thermoplastic resins, elastomers, organic fillers, fillers other than silica and barium sulfate, mold release agents, surface treatment agents , Dispersants, dispersion aids, surface modifiers, stabilizers, phosphors, cellulose resins and the like.
- the main ingredient composition and the curing agent composition of the photocurable thermosetting resin composition of the present invention can be prepared by mixing and dispersing each of these components in a predetermined amount, for example, with a three-roll mill or the like. ..
- the photocurable thermosetting resin composition of the present invention is preferably used as a dry film.
- the dry film of the present invention has a resin layer obtained by applying and drying the photocurable thermosetting resin composition of the present invention on a carrier film.
- the main agent composition and the curing agent composition are mixed well with each other to obtain the photocurable thermosetting resin composition of the present invention.
- a comma coater, blade coater, lip coater, rod coater, squeeze coater, reverse coater, transfer coater, gravure coater, spray is diluted with an organic solvent as needed to adjust the viscosity to an appropriate level.
- the applied composition is usually dried at a temperature of 50 to 130 ° C. for 1 to 30 minutes to form a resin layer.
- the coating film thickness is not particularly limited, but is generally selected as appropriate in the range of 10 to 150 ⁇ m, preferably 20 to 60 ⁇ m after drying.
- a plastic film is used, and for example, a polyester film such as polyethylene terephthalate (PET), a polyimide film, a polyamide-imide film, a polypropylene film, a polystyrene film, or the like can be used.
- PET polyethylene terephthalate
- the thickness of the carrier film is not particularly limited, but is generally appropriately selected in the range of 10 to 150 ⁇ m.
- the resin layer made of the photocurable thermosetting resin composition of the present invention After forming the resin layer made of the photocurable thermosetting resin composition of the present invention on the carrier film, for the purpose of preventing dust from adhering to the surface of the resin layer, further, on the surface of the resin layer. It is preferable to laminate a peelable cover film.
- a peelable cover film for example, a polyethylene film, a polytetrafluoroethylene film, a polypropylene film, a surface-treated paper, or the like can be used.
- the cover film may be one having a force smaller than the adhesive force between the resin layer and the carrier film when the cover film is peeled off.
- the photocurable thermosetting resin composition of the present invention is applied onto the cover film and dried to form a resin layer, and a carrier film is laminated on the surface thereof. May be good. That is, as the film to which the curable composition of the present invention is applied when producing the dry film in the present invention, either a carrier film or a cover film may be used.
- the photocurable thermosetting resin composition of the present invention is adjusted to a viscosity suitable for the coating method using, for example, an organic solvent, and is subjected to a dip coating method, a flow coating method, and a roll coating method on a substrate.
- a method such as a bar coater method, a screen printing method, a curtain coating method, etc.
- the organic solvent contained in the composition is volatilized and dried (temporarily dried) at a temperature of about 60 to 100 ° C. to make it tack-free. It is also possible to form a resin layer.
- the layer of the composition of the present invention is placed on the substrate so as to be in contact with the substrate by a laminator or the like.
- a resin layer can be formed by peeling off the carrier film after the resin layer is attached to the film.
- the base material includes a printed wiring board and a flexible printed wiring board whose circuit is previously formed of copper or the like, as well as paper phenol, paper epoxy, glass cloth epoxy, glass polyimide, glass cloth / non-woven cloth epoxy, and glass cloth / paper epoxy.
- Synthetic fiber epoxy, fluororesin / polyethylene / polyimideene ether, polyphenylene oxide / cyanate, etc. are used for high frequency circuit copper-clad laminates, etc., and all grades (FR-4, etc.) of copper-clad laminates are used. Examples thereof include a plate, a metal substrate, a polyimide film, a PET film, a polyethylene naphthalate (PEN) film, a glass substrate, a ceramic substrate, a wafer plate, and the like.
- the composition is applied onto a substrate, and the resin layer obtained after volatilizing and drying the solvent is exposed (light).
- the exposed portion (the portion irradiated with light) is cured.
- the unexposed portion is exposed to an alkaline aqueous solution (for example, by selectively exposing with active energy rays through a photomask in which a pattern is formed by a contact method or a non-contact method, or by directly exposing the pattern with a laser direct exposure machine. , 0.3 to 3% by mass of sodium carbonate aqueous solution) to form a resist pattern.
- thermosetting post-curing
- a hot air circulation type drying furnace for example, a hot air circulation type drying furnace, an IR furnace, a hot plate, a convection oven, etc. It can be performed by using a method of bringing hot air into countercurrent contact and a method of blowing hot air onto a support from a nozzle).
- the exposure machine used for the above-mentioned active energy ray irradiation if it is a device equipped with a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a metal halide lamp, a mercury short arc lamp, etc., and irradiates ultraviolet rays in the range of 350 to 450 nm.
- a direct drawing device eg, a laser direct imaging device that draws an image directly with a laser from CAD data from a computer
- the lamp light source or the laser light source of the direct drawing machine may have a maximum wavelength in the range of 350 to 410 nm.
- the exposure amount for image formation varies depending on the film thickness and the like, but is generally 20 to 1000 mJ / cm2, preferably 20 to 800 mJ / cm2.
- the development method can be a dipping method, a shower method, a spray method, a brush method, or the like, and the developers include potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, and the like.
- Alkaline aqueous solutions such as ammonia and amines can be used.
- the present invention can also provide an electronic component having the above-mentioned cured product.
- the photocurable thermosetting resin composition of the present invention By using the photocurable thermosetting resin composition of the present invention, electronic components having high quality, durability and reliability are provided.
- the electronic component means a component used in an electronic circuit, and includes active components such as printed wiring boards, transistors, light emitting diodes, and laser diodes, as well as passive components such as resistors, capacitors, inductors, and connectors. Is done.
- Test example 1 Confirmation of Solubility of Photopolymerization Initiator Prior to the experiment on each property of the photocurable thermosetting resin composition of the present invention, in order to select a suitable organic solvent for the photopolymerization initiator, a preliminary preparation. A test for confirming the solubility of the five photopolymerization initiators in an organic solvent was conducted as follows. First, a test was conducted to confirm the general solubility of the five photopolymerization initiators in various organic solvents, and the subsequent addition amount was used as a guideline (Tables 1-1 to 1-5).
- a predetermined amount of each of the four solvents was added to the prepared vial, and a photopolymerization initiator (Omnirad TPO H) was further added to the vial, and then the vial was shaken by hand to stir for 5 minutes. It was left still. Then, the presence or absence of crystals of the photopolymerization initiator was visually confirmed, and if no crystals were confirmed, the photopolymerization initiator was further added, the mixture was stirred by hand, and the mixture was allowed to stand for 5 minutes. This operation is repeated until crystals are confirmed, and when crystals are finally confirmed after being left for 5 minutes, the addition of the photopolymerization initiator is terminated, and the amount added before the crystals are confirmed is set to light.
- a photopolymerization initiator (Omnirad TPO H) was further added to the vial, and then the vial was shaken by hand to stir for 5 minutes. It was left still. Then, the presence or absence of crystals of the photopolymerization initi
- the maximum amount of the polymerization initiator Omnirad TPO H was used (Table 2).
- the evaluation criteria are as follows. ⁇ : No crystals of the photopolymerization initiator were visually observed. ⁇ : Crystals of the photopolymerization initiator were visually observed (not dissolved over time). The results are shown in Tables 1-1-5 and Table 2 below.
- -TPO Acylphosphine oxide-based photopolymerization initiator (Omnirad TPO H manufactured by IGM Resins B.V.) (2,4,6-trimethylbenzoyl-diphenyl-phosphinoxide) 907: ⁇ -aminoacetophenone-based photopolymerization initiator (Omnirad 907 manufactured by IGM Resins) (2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one) 379: Alkylphenone-based photopolymerization initiator (Omnirad 379EG manufactured by IGM Resins B.V.) (2- (dimethylamino) -2- (4-methylbenzyl) -1- (4-morpholinophenyl) butane-1 on) 784: Titanocene-based photopolymerization initiator (J
- reaction solution was washed with water using a 5% NaCl aqueous solution, toluene was removed by distillation under reduced pressure, and then diethylene glycol monoethyl ether acetate was added to obtain an acrylate resin solution having a solid content of 68%.
- reaction solution was neutralized with 35.35 parts of a 15% aqueous sodium hydroxide solution, and then washed with water. Then, toluene was distilled off while substituting 118.1 parts of diethylene glycol monoethyl ether acetate with an evaporator to obtain a novolak type acrylate resin solution.
- reaction solution was washed with 5% NaCl aqueous solution to remove toluene by distillation under reduced pressure, and then diethylene glycol monoethyl ether acetate was added to obtain an acryloyl group-containing resin solution having a solid content of 68%.
- thermosetting resin composition (a two-component system consisting of a main agent composition and a curing agent composition) was prepared.
- the main agent composition, the curing agent composition, and the photocurable thermosetting resin composition obtained by thoroughly mixing the main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3, respectively.
- the viscosity was measured using a cone plate type viscometer (model number: TVE-33H, manufactured by Tokyo Keiki Co., Ltd.) at a measurement temperature of 25 ° C. and a cone rotation speed of 5 rpm / min, and the values were taken as the initial viscosities.
- the degree of dispersion was measured by particle size measurement using a grind meter (manufactured by Yasuda Seiki Seisakusho), and the value was taken as the degree of dispersion (initial). The results are summarized in Table 5 below.
- ⁇ Dispersity (time)> The main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3 were prepared at 20 ° C. and 5 ° C., 5 days and 10 days after preparation.
- the degree of dispersion after 15 days, 20 days, and 30 days was measured by particle size measurement using a grind meter (manufactured by Yasuda Seiki Seisakusho), and the value was taken as the degree of dispersion (time).
- the evaluation criteria are as follows. ⁇ 10 ⁇ m: ⁇ ⁇ 12.5 ⁇ m: ⁇ ⁇ 20 ⁇ m: ⁇
- Table 6 The results are summarized in Table 6 below.
- ⁇ Appearance of dry film> The main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3 were stored at 20 ° C., and those after 5 days, 10 days, 15 days, 20 days and 30 days were mixed, respectively. A diluting solvent was added to the obtained photocurable thermosetting resin composition to adjust the viscosity to 4d ⁇ Ps. Next, the diluted photocurable thermosetting resin composition was applied to a PET film using an applicator so that the film thickness after drying was 15 ⁇ m and 30 ⁇ m, respectively, and dried in a hot air circulation drying oven for 30 minutes. rice field.
- the photocurable thermosetting resin composition of the present invention is excellent in electrical properties.
- the particle size measurement result using a grind meter was ⁇ 10 ⁇ m from the initial stage to 30 days after storage, no coarse particles were generated, and the degree of dispersion and storage stability were not generated. It turns out that it is excellent. Further, regarding the appearance of the composition, it can be seen that there is no problem such as surface separation in both the main agent composition and the curing agent composition until 30 days after storage, and the storage stability is excellent.
- the photocurable thermosetting resin composition of the present invention does not generate cissing and pinholes during the formation of a dry film until 30 days after storage, and is also excellent in storage stability in this respect.
- the main agent composition of Comparative Example 1 contains (B) a carboxyl group-containing resin and (C) a photopolymerization initiator, and since they are contained together, the detailed mechanism is unknown, but each example. It can be seen that the degree of dispersion (time) and the stability of the appearance of the composition over time are inferior to those of the above.
- the curing agent composition of Comparative Example 1 contains (E) silica and (F) barium sulfate, separation of the liquid surface (color floating / color separation), so-called Benard cell, occurs, and the liquid surface of the composition It can be seen that the appearance of the silica is impaired and the stability over time is inferior.
- the main agent composition of Comparative Example 2 contains (B) a carboxyl group-containing resin and (C) a photopolymerization initiator, and since they are contained together, the detailed mechanism is unknown, but it is compared with each example.
- the degree of dispersion (with time) and the stability of the appearance of the composition with time are inferior, and since (E) silica and (F) barium sulfate are contained, so-called Benard cells are formed, which are dispersed as compared with each example. It can be seen that the degree (time) and the stability of the appearance of the composition over time are inferior.
- the main agent composition of Comparative Example 3 does not contain (E) silica, and the curing agent composition does not contain (E) silica and contains only (F) barium sulfate, that is, both components are used in combination in one composition. Not done.
- each comparative example is a mixture thereof. It can be seen that the evaluation and electrical characteristics of repellents and the like during formation of the dry film obtained from the photocurable thermosetting resin composition of No. 1 are also clearly inferior to those of the examples.
Abstract
Description
このような光硬化性熱硬化性樹脂組成物の成分としては、主としてカルボキシル基を有する感光性ポリマーが材料として含有されるが、組成物の硬化後に得られる硬化物のはんだ耐熱性を高めるために、さらにエポキシ樹脂が含有されることもある。ところが、エポキシ樹脂は、カルボキシル基を有する感光性ポリマーと比較的反応しやすいために、組成物としての長期保存性に課題を有する。そこで、一般に、反応しやすい成分をそれぞれ別の組成物に配合した2液系とし、使用時にそれらを混合して光硬化性熱硬化性樹脂組成物を作製する方法が用いられてきた。 Conventionally, in printed wiring boards, solder resist has been used as a protective material for wiring board circuits, and high solder heat resistance and electrical insulation are required. As an example of the material composition, for example, alkali-developing type light. Examples thereof include curable thermosetting resin compositions.
As a component of such a photocurable thermosetting resin composition, a photosensitive polymer having a carboxyl group is mainly contained as a material, but in order to enhance the solder heat resistance of the cured product obtained after curing the composition. In addition, an epoxy resin may be contained. However, since the epoxy resin is relatively easy to react with the photosensitive polymer having a carboxyl group, there is a problem in long-term storage as a composition. Therefore, in general, a method has been used in which a two-component system in which easily reactive components are blended into different compositions is prepared, and they are mixed at the time of use to prepare a photocurable thermosetting resin composition.
また、2液系の光硬化性熱硬化性樹脂組成物をキャリアフィルム上に塗布・乾燥させてドライフィルムを作製した場合にあっては、作製後一ヵ月保存した2液それぞれの樹脂組成物を混合した後、キャリアフィルムに塗布した際に、それぞれ別容器で保管されたそれら樹脂組成物の保存期間中に発生したと考えられる粗大粒子により、ハジキやピンホールが発生するなどして、長期の保存安定性にも課題があった。 By the way, in recent years, the density of printed wiring boards has been remarkably increased, and the minimum circuit size is 10 μm for lines and 10 μm for spaces, and higher insulation reliability than before is required. Due to the high density of the printed circuit board, insoluble substances (inorganic filler, crystalline epoxy resin, etc.) exist as particles between the fine pattern circuits, which causes a short circuit between the circuits.
When a dry film is prepared by applying and drying a two-component photocurable thermosetting resin composition on a carrier film, the resin compositions of the two liquids stored for one month after preparation are used. After mixing, when applied to the carrier film, the coarse particles that are thought to have been generated during the storage period of those resin compositions stored in separate containers cause cissing and pinholes for a long period of time. There was also a problem with storage stability.
しかしながら、上述したようにプリント配線板の高密度化が著しく、光硬化性熱硬化性樹脂組成物においては、より高い絶縁信頼性が要求されており、エポキシ樹脂だけでなく様々な要因による粗大粒子の発生を抑えて、電気特性(HAST耐性)の更なる向上が求められている。
また、在庫確保の観点からも、それぞれの樹脂組成物を作製した後、一ヵ月経過した場合でも、エポキシ樹脂だけでなく様々な要因による粗大粒子の発生を抑えて、ドライフィルム作製工程でのハジキやピンホールの発生を抑えられる等、長期の保存安定性を得られることが望ましい。 On the other hand, for example, Patent Document 1 discloses that, among the constituents of a photocurable thermosetting resin composition, an epoxy resin is focused on to prevent the generation of coarse particles. ..
However, as described above, the density of the printed wiring board is remarkably increased, and the photocurable thermosetting resin composition is required to have higher insulation reliability, and coarse particles due to various factors as well as the epoxy resin are required. There is a demand for further improvement in electrical characteristics (HAST resistance) by suppressing the occurrence of.
In addition, from the viewpoint of securing inventory, even if one month has passed after each resin composition was produced, the generation of coarse particles due to various factors as well as the epoxy resin was suppressed, and pinholes were generated in the dry film production process. It is desirable to obtain long-term storage stability, such as suppressing the occurrence of pinholes and pinholes.
さらに本発明の目的は、このようなアルカリ現像型ソルダーレジスト組成物を用いることによって得られる上記のような諸特性に優れたドライフィルム及び硬化物、並びに該ドライフィルムや硬化物によりソルダーレジスト等の硬化皮膜が形成されてなるプリント配線板を提供することにある。 Therefore, an object of the present invention is to have excellent electrical characteristics (HAST resistance) of the cured product, good long-term storage stability, and at least 2 that can suppress the occurrence of cissing and pinholes in the dry film manufacturing process. It is an object of the present invention to provide a photocurable thermosetting resin composition which is composed in a liquid system.
Further, an object of the present invention is a dry film and a cured product having excellent various properties as described above obtained by using such an alkali-developed solder resist composition, and a solder resist and the like depending on the dry film and the cured product. It is an object of the present invention to provide a printed wiring board on which a cured film is formed.
前記光硬化性熱硬化性樹脂組成物を得るために少なくとも2液系の樹脂組成物に組成され、
前記(B)カルボキシル基含有樹脂、前記(D)感光性モノマーおよび前記(E)シリカは、前記(A)エポキシ樹脂、前記(F)硫酸バリウムおよび前記(C)光重合開始剤とは、別の樹脂組成物中に含まれ、
前記(C)光重合開始剤を含む樹脂組成物は、前記(C)光重合開始剤を溶解可能な有機溶剤を含むことを特徴とする、少なくとも2液系に組成されている、光硬化性熱硬化性樹脂組成物によって解決し得ることが見出され、本発明は完成した。
このうち本発明の好ましい態様は、前記(A)エポキシ樹脂として、常温にて半固形または固形のエポキシ樹脂、ビフェニル型エポキシ樹脂およびノボラック型の3種を含有することを特徴とする、光硬化性熱硬化性樹脂組成物に関する。
さらに好ましい本発明の態様は、前記(A)エポキシ樹脂を含有する組成物が4dPa・s以下の粘度を有し、および、各々の樹脂組成物を混合して得られた光硬化性熱硬化性樹脂組成物が4dPa・s以下の粘度を有することを特徴とする、光硬化性熱硬化性樹脂組成物に関する。
さらにより好ましい本発明の態様は、前記(A)エポキシ樹脂を含有する組成物が前記(C)光重合開始剤および有機溶剤を含有し、前記(C)光重合開始剤の1質量部に対して3質量部以上の前記有機溶剤を含有することを特徴とする、光硬化性熱硬化性樹脂組成物に関する。
また本発明の別の態様は、上記の光硬化性熱硬化性樹脂組成物を、キャリアフィルムに塗布および乾燥させて得られる、膜厚が10μm~30μmのドライフィルムに関する。
本発明のさらにまた別の態様は、ソルダーレジストの材料用であることを特徴とする、上記の光硬化性熱硬化性樹脂組成物にも関する。
本発明のさらにまた別の態様は、光硬化性熱硬化性樹脂組成物を、硬化して得られることを特徴とする硬化物、ドライフィルムの樹脂層を硬化して得られることを特徴とする硬化物、それらの硬化物を有することを特徴とする電子部品に関する。 As a result of diligent studies by the present inventor, the above-mentioned problems are (A) epoxy resin, (B) carboxyl group-containing resin, (C) photopolymerization initiator, (D) photosensitive monomer, (E) silica, (F). A photocurable thermosetting resin composition containing barium sulfate and.
In order to obtain the photocurable thermosetting resin composition, the resin composition is composed of at least two liquids.
The (B) carboxyl group-containing resin, the (D) photosensitive monomer, and the (E) silica are different from the (A) epoxy resin, the (F) barium sulfate, and the (C) photopolymerization initiator. Included in the resin composition of
The resin composition containing the (C) photopolymerization initiator is composed of at least two liquids and is photocurable, characterized by containing an organic solvent capable of dissolving the (C) photopolymerization initiator. It has been found that it can be solved by a thermosetting resin composition, and the present invention has been completed.
Of these, a preferred embodiment of the present invention is characterized by containing three types of the (A) epoxy resin, a semi-solid or solid epoxy resin at room temperature, a biphenyl type epoxy resin, and a novolak type. The present invention relates to a thermosetting resin composition.
A more preferable aspect of the present invention is that the composition containing the epoxy resin (A) has a viscosity of 4 dPa · s or less, and the photocurable thermosetting obtained by mixing the respective resin compositions. The present invention relates to a photocurable thermosetting resin composition, wherein the resin composition has a viscosity of 4 dPa · s or less.
In an even more preferable aspect of the present invention, the composition containing the (A) epoxy resin contains the (C) photopolymerization initiator and the organic solvent, with respect to 1 part by mass of the (C) photopolymerization initiator. The present invention relates to a photocurable thermosetting resin composition, which comprises 3 parts by mass or more of the organic solvent.
Another aspect of the present invention relates to a dry film having a film thickness of 10 μm to 30 μm, which is obtained by applying and drying the above-mentioned photocurable thermosetting resin composition on a carrier film.
Yet another aspect of the present invention also relates to the photocurable thermosetting resin composition described above, which is characterized by being used as a material for a solder resist.
Yet another aspect of the present invention is characterized in that it is obtained by curing a resin layer of a cured product or a dry film, which is obtained by curing a photocurable thermosetting resin composition. The present invention relates to a cured product and an electronic component having the cured product thereof.
さらに本発明によれば、このような光硬化性熱硬化性樹脂組成物を用いることによって得られる上記のような諸特性に優れたドライフィルム及び硬化物、並びに該ドライフィルムや硬化物によりソルダーレジスト等の硬化皮膜が形成されてなるプリント配線板等の電子部品を提供することができる。 According to the present invention, the cured product obtained by curing the photocurable thermosetting resin composition has excellent electrical characteristics (HAST resistance), and each resin composition has good long-term storage stability and is dry. It is possible to provide a photocurable thermosetting resin composition composed of at least a two-component system capable of suppressing the generation of cissing and pinholes in the film manufacturing process.
Further, according to the present invention, a dry film and a cured product having excellent various properties as described above obtained by using such a photocurable thermosetting resin composition, and a solder resist using the dry film and the cured product. It is possible to provide an electronic component such as a printed wiring board on which a cured film such as the above is formed.
ここで、保存期間中の化学反応を防止するという観点から、(A)エポキシ樹脂と(B)カルボキシル基含有樹脂、および、(D)感光性モノマーと(C)光重合開始剤とは、それぞれ互いに別々の組成物に含有されるのが好ましい。また、各組成物の液表面の分離(色浮き・色別れ)、いわゆるベナードセルが生じ、各組成物の液表面の外観を損なうおそれがあることから、(E)シリカと(F)硫酸バリウムもまた、互いに別の組成物中に分けて含有されるのが好ましい。
また、(B)カルボキシル基含有樹脂と(C)光重合開始剤を同じ組成物とすると、詳細なメカニズムは不明であるが当該組成物の外観不良および粗大粒子が生じることがあるため、(B)カルボキシル基含有樹脂を含む組成物は、(C)光重合開始剤およびこれを溶解するための有機溶剤とは、別の組成物に含有されるのが好ましい。
さらにまた、(A)エポキシ樹脂を含有する組成物が4dPa・s以下の粘度を有し、および、各々の樹脂組成物を混合して得られた光硬化性熱硬化性樹脂組成物が0.1dPa・s以上4dPa・s以下の粘度を有することにより、(A)エポキシ樹脂の析出を抑えることができるので好ましい。尚、(A)エポキシ樹脂を含有する組成物の粘度は、0.1dPa・s以上であると、組成物の取り扱いが容易で好ましい。 The photocurable thermosetting resin composition of the present invention is preferably composed of at least a two-component resin composition. For example, a two-component system in which one resin composition is used as a main agent composition and the other resin composition is used as a curing agent composition can be mentioned. In this case, for example, the main agent composition may be composed of (B) a carboxyl group-containing resin, (D) a photosensitive monomer, (E) silica, and, if necessary, an organic solvent, as a curing agent composition. , (A) Epoxy resin, (C) Photopolymerization initiator, (F) Barium sulfate and (C) Photopolymerization initiator are preferably composed of a soluble organic solvent.
Here, from the viewpoint of preventing a chemical reaction during the storage period, (A) an epoxy resin and (B) a carboxyl group-containing resin, and (D) a photosensitive monomer and (C) a photopolymerization initiator are used, respectively. It is preferably contained in separate compositions. In addition, separation of the liquid surface of each composition (color floating / color separation), so-called Benard cell, may occur, which may impair the appearance of the liquid surface of each composition. Therefore, (E) silica and (F) barium sulfate are also used. Further, it is preferable that the components are separately contained in different compositions.
Further, if (B) a carboxyl group-containing resin and (C) a photopolymerization initiator are used in the same composition, the detailed mechanism is unknown, but the appearance of the composition may be poor and coarse particles may occur. The composition containing the carboxyl group-containing resin is preferably contained in a composition different from that of the (C) photopolymerization initiator and the organic solvent for dissolving the photopolymerization initiator.
Furthermore, the composition containing the epoxy resin (A) has a viscosity of 4 dPa · s or less, and the photocurable thermosetting resin composition obtained by mixing the respective resin compositions is 0. Having a viscosity of 1 dPa · s or more and 4 dPa · s or less is preferable because the precipitation of the (A) epoxy resin can be suppressed. When the viscosity of the composition containing (A) epoxy resin is 0.1 dPa · s or more, it is preferable that the composition is easy to handle.
(A)エポキシ樹脂は、光硬化性熱硬化性樹脂組成物において熱硬化成分として機能し、硬化物を形成する。
このような(A) エポキシ樹脂としては、1分子中に少なくとも2つのエポキシ基を有する公知慣用の多官能エポキシ樹脂が使用できる。
(A)エポキシ樹脂は、液状であってもよく、固形ないし半固形であってもよい。
多官能エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂;ブロム化エポキシ樹脂;ノボラック型エポキシ樹脂;ビスフェノールF型エポキシ樹脂;水添ビスフェノールA型エポキシ樹脂;グリシジルアミン型エポキシ樹脂;ヒダントイン型エポキシ樹脂;脂環式エポキシ樹脂;トリヒドロキシフェニルメタン型エポキシ樹脂;ビキシレノール型もしくはビフェノール型エポキシ樹脂またはそれらの混合物;ビスフェノールS型エポキシ樹脂;ビスフェノールAノボラック型エポキシ樹脂;テトラフェニロールエタン型エポキシ樹脂;複素環式エポキシ樹脂;ジグリシジルフタレート樹脂;テトラグリシジルキシレノイルエタン樹脂;ナフタレン基含有エポキシ樹脂;ジシクロペンタジエン骨格を有するエポキシ樹脂;グリシジルメタアクリレート共重合系エポキシ樹脂;シクロヘキシルマレイミドとグリシジルメタアクリレートの共重合エポキシ樹脂;エポキシ変性のポリブタジエンゴム誘導体;CTBN変性エポキシ樹脂、イソシアヌル環を有するエポキシ樹脂等が好ましく挙げられるが、もちろんこれらに限られるものではない。
これらのエポキシ樹脂は、1種または2種以上を組合せて用いることができる。
エポキシ樹脂としては、常温にて半固形又は固形のエポキシ樹脂、ビフェニル型エポキシ樹脂に対して、ノボラック型エポキシ樹脂を用いることが好ましい。これらのエポキシ樹脂を併用することで、ドライフィルム形成時のハジキおよびピンホールの発生を抑制できる。また、固形のエポキシ樹脂としては、ジシクロペンタジエン骨格を有するエポキシ樹脂が、低吸水率であるため電気特性に優れ、特に好ましい。常温にて半固形又は固形のエポキシ樹脂、ビフェニル型エポキシ樹脂に対して、ノボラック型エポキシ樹脂の配合比率は、常温にて半固形又は固形のエポキシ樹脂:ビフェニル型エポキシ樹脂:ノボラック型エポキシ樹脂=1:1:1.5が好ましく、より好ましくは、1:1:2である。 [(A) Epoxy resin]
(A) The epoxy resin functions as a thermosetting component in the photocurable thermosetting resin composition and forms a cured product.
As such (A) epoxy resin, a known and commonly used polyfunctional epoxy resin having at least two epoxy groups in one molecule can be used.
(A) The epoxy resin may be liquid, or may be solid or semi-solid.
The polyfunctional epoxy resin includes bisphenol A type epoxy resin; brominated epoxy resin; novolak type epoxy resin; bisphenol F type epoxy resin; hydrogenated bisphenol A type epoxy resin; glycidylamine type epoxy resin; hydride-in type epoxy resin; oil ring. Formula epoxy resin; trihydroxyphenylmethane type epoxy resin; bixilenol type or biphenol type epoxy resin or a mixture thereof; bisphenol S type epoxy resin; bisphenol A novolak type epoxy resin; tetraphenylol ethane type epoxy resin; heterocyclic epoxy Resin; diglycidyl phthalate resin; tetraglycidyl xylenoyl ethane resin; naphthalene group-containing epoxy resin; epoxy resin having a dicyclopentadiene skeleton; glycidyl methacrylate copolymerized epoxy resin; cyclohexyl maleimide and glycidyl methacrylate copolymerized epoxy resin ; Epoxy-modified polybutadiene rubber derivative; CTBN-modified epoxy resin, epoxy resin having an isocyanul ring, and the like are preferable, but of course, the present invention is not limited thereto.
These epoxy resins can be used alone or in combination of two or more.
As the epoxy resin, it is preferable to use a novolak type epoxy resin as opposed to a semi-solid or solid epoxy resin and a biphenyl type epoxy resin at room temperature. By using these epoxy resins together, it is possible to suppress the generation of repellents and pinholes during the formation of a dry film. Further, as the solid epoxy resin, an epoxy resin having a dicyclopentadiene skeleton is particularly preferable because it has a low water absorption rate and is excellent in electrical characteristics. The mixing ratio of the novolak type epoxy resin to the semi-solid or solid epoxy resin or biphenyl type epoxy resin at room temperature is as follows: semi-solid or solid epoxy resin at room temperature: biphenyl type epoxy resin: novolak type epoxy resin = 1. 1: 1.5 is preferable, and more preferably 1: 1: 2.
ここで、本発明において常温で固形または半固形とは、15℃で固形または半固形を呈することを意味する。固形または半固形の判定は、危険物の試験及び性状に関する省令(平成元年自治省令第1号)の別紙第2の「液状の確認方法」に準じて行うことができる。
(A)成分におけるビフェニル型エポキシ樹脂としては、ビフェニル骨格を有する公知慣用の多官能エポキシ樹脂が使用できる。例えば、ビフェニル骨格含有多官能固形エポキシ樹脂(日本化薬(株)製 NC-3000H、 NC-3000)、ビフェニル型エポキシ樹脂(三菱ケミカル(株)製 YX-4000、YL-6121HA)などが挙げられる。
(A)成分におけるノボラック型エポキシ樹脂としては、クレゾールノボラック型エポキシ樹脂(DIC(株)製 エピクロンN-690)、フェノールノボラック型エポキシ樹脂(DIC(株)製 エピクロンN-770、三菱ケミカル社製のjER152)などが挙げられる。 As the component (A), a known and commonly used “epoxy resin that is solid or semi-solid at room temperature” can be used. For example, examples of the epoxy resin solid at room temperature include bisphenol A type epoxy resin (jER1001 manufactured by Mitsubishi Chemical Co., Ltd.), bisphenol F type epoxy resin (jER4004P manufactured by Mitsubishi Chemical Co., Ltd.), and naphthalene type epoxy resin (DIC Co., Ltd.). HP-4700), Naphthalene skeleton-containing polyfunctional solid epoxy resin (NC-7000 manufactured by Nippon Kayaku Co., Ltd.), Trisphenol epoxy resin (EPPN-502H manufactured by Nihon Kayaku Co., Ltd.), Dicyclopentadiene skeleton-containing Functional solid epoxy resin (Epiclon HP-7200 manufactured by DIC Co., Ltd.), phosphorus-containing epoxy resin (TX0712 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), Tris (2,3-epoxypropyl) isocyanurate (manufactured by Nissan Chemical Industry Co., Ltd.) TEPIC), examples of the epoxy resin that is semi-solid at room temperature include bisphenol A type epoxy resin (jER834 manufactured by Mitsubishi Chemical Co., Ltd.) and naphthalene type epoxy resin (HP-4032 manufactured by DIC Co., Ltd.).
Here, in the present invention, solid or semi-solid at room temperature means to exhibit solid or semi-solid at 15 ° C. The determination of solid or semi-solid can be performed in accordance with the "Liquid Confirmation Method" of Attachment 2 of the Ministerial Ordinance on Dangerous Goods Testing and Properties (Ministerial Ordinance No. 1 of 1989).
As the biphenyl type epoxy resin in the component (A), a known and commonly used polyfunctional epoxy resin having a biphenyl skeleton can be used. For example, a biphenyl skeleton-containing polyfunctional solid epoxy resin (NC-3000H, NC-3000 manufactured by Nippon Kayaku Co., Ltd.), a biphenyl type epoxy resin (YX-4000, YL-6121HA manufactured by Mitsubishi Chemical Corporation), and the like can be mentioned. ..
Examples of the novolak type epoxy resin in the component (A) include cresol novolak type epoxy resin (Epicron N-690 manufactured by DIC Corporation), phenol novolac type epoxy resin (Epicron N-770 manufactured by DIC Corporation), and Mitsubishi Chemical Co., Ltd. jER152) and the like.
本発明で用いられる(B)カルボキシル基含有樹脂としては、分子中にカルボキシル基を有し、さらにエチレン性不飽和基を有さない(非感光性の)、又はこれを有する(感光性の)従来公知の各種カルボキシル基含有樹脂を使用することができる。 [(B) Carboxyl group-containing resin]
The (B) carboxyl group-containing resin used in the present invention has a carboxyl group in the molecule and does not have an ethylenically unsaturated group (non-photosensitive) or has this (photosensitive). Various conventionally known carboxyl group-containing resins can be used.
本発明は、アクリレート系樹脂として、さらに、アクリロイル基含有樹脂を含有しても良い。本発明のアクリロイル基含有樹脂は、ビスフェノールAまたはビスフェノールFのポリメチロール体とフェノール類の縮合反応で得られた、下記一般式(I)の構造を含む分子中に2つ以上のフェノール性水酸基を有するフェノール化合物(a)、即ち、特定構造のノボラック型フェノール樹脂を用いることで、硬化前のインキ組成物の乾燥性を向上させ、また、この樹脂のフェノール性水酸基の一部又は全部を、アルコール性水酸基を有するオキシアルキル基に変換することによって可撓性が付与され、その結果生じたオキシアルキル基の末端水酸基にアクリル酸及び/又はメタクリル酸(c)の付加を行なうことによって、α,β-エチレン性不飽和基が側鎖の末端に付与されたものであるため、反応性が向上し、高いレベルで耐熱性と強靱性のバランスがとれ、硬度、可撓性に優れると共に、耐水性、耐薬品性等にも優れた硬化物が得られる。
前記一般式(I)の構造を含む分子中に2つ以上のフェノール性水酸基を有するフェノール化合物(a)は、ビスフェノールA又はビスフェノールFのポリメチロール体とフェノール類を酸性触媒存在下で縮合反応させることによって得られる。
フェノール類としてはフェノール、各種クレゾール類、各種キシレノール類などのアルキルフェノール類、ナフトール類を用いることができ、好ましくはo-クレゾール、2,6-キシレノールを用いる。また、これらを混合して用いてもよい。
上記フェノール化合物(a)に対するアルキレンオキシド、環状カーボネート等の環状エーテル基を有する化合物(b)の付加割合は、フェノール化合物(a)のフェノール性水酸基1当量当り0.5モル、好ましくは0.8~3.0モルがよい。0.5~5.0モルの範囲である場合、得られるアクリロイル基含有感光性樹脂において、光硬化性と乾燥性に優れる。
このようなアクリロイル基含有樹脂の含有量は、主剤組成物中に、5~20質量%、好ましくは、8~15質量%の範囲が好ましい。 [Acryloyl group-containing resin]
The present invention may further contain an acryloyl group-containing resin as the acrylate-based resin. The acryloyl group-containing resin of the present invention contains two or more phenolic hydroxyl groups in a molecule containing the structure of the following general formula (I), which is obtained by a condensation reaction between a polymethylol form of bisphenol A or bisphenol F and phenols. By using the phenol compound (a) having a specific structure, that is, a novolak-type phenol resin having a specific structure, the drying property of the ink composition before curing is improved, and a part or all of the phenolic hydroxyl groups of this resin is made into alcohol. Flexibility is imparted by conversion to an oxyalkyl group having a sex hydroxyl group, and α, β is added to the terminal hydroxyl group of the resulting oxyalkyl group by adding acrylic acid and / or methacrylic acid (c). -Since an ethylenically unsaturated group is added to the end of the side chain, reactivity is improved, heat resistance and toughness are balanced at a high level, excellent in hardness and flexibility, and water resistance. , A cured product having excellent chemical resistance and the like can be obtained.
The phenol compound (a) having two or more phenolic hydroxyl groups in the molecule containing the structure of the general formula (I) causes a condensation reaction between the polymethylol form of bisphenol A or bisphenol F and the phenols in the presence of an acidic catalyst. Obtained by that.
As the phenols, phenols, various cresols, alkylphenols such as various xylenols, and naphthols can be used, and o-cresol and 2,6-xylenol are preferably used. Further, these may be mixed and used.
The addition ratio of the compound (b) having a cyclic ether group such as an alkylene oxide or a cyclic carbonate to the phenol compound (a) is 0.5 mol, preferably 0.8 per 1 equivalent of the phenolic hydroxyl group of the phenol compound (a). ~ 3.0 mol is good. When the amount is in the range of 0.5 to 5.0 mol, the obtained acryloyl group-containing photosensitive resin is excellent in photocurability and drying property.
The content of such an acryloyl group-containing resin is preferably in the range of 5 to 20% by mass, preferably 8 to 15% by mass in the main agent composition.
(C)光重合開始剤としては、例えば、ビス-(2,6-ジクロロベンゾイル)フェニルフォスフィンオキサイド、ビス-(2,6-ジクロロベンゾイル)-2,5-ジメチルフェニルフォスフィンオキサイド、ビス-(2,6-ジクロロベンゾイル)-4-プロピルフェニルフォスフィンオキサイド、ビス-(2,6-ジクロロベンゾイル)-1-ナフチルフォスフィンオキサイド、ビス-(2,6-ジメトキシベンゾイル)フェニルフォスフィンオキサイド、ビス-(2,6-ジメトキシベンゾイル)-2,4,4-トリメチルペンチルフォスフィンオキサイド、ビス-(2,6-ジメトキシベンゾイル)-2,5-ジメチルフェニルフォスフィンオキサイド、ビス-(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド等のビスアシルフォスフィンオキサイド類;2,6-ジメトキシベンゾイルジフェニルフォスフィンオキサイド、2,6-ジクロロベンゾイルジフェニルフォスフィンオキサイド、2,4,6-トリメチルベンゾイルフェニルフォスフィン酸メチルエステル、2-メチルベンゾイルジフェニルフォスフィンオキサイド、ピバロイルフェニルフォスフィン酸イソプロピルエステル、2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド等のモノアシルフォスフィンオキサイド類;1-ヒドロキシ-シクロヘキシルフェニルケトン、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-ヒドロキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]フェニル}-2-メチル-プロパン-1-オン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン等のヒドロキシアセトフェノン類;ベンゾイン、ベンジル、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインn-プロピルエーテル、ベンゾインイソプロピルエーテル、ベンゾインn-ブチルエーテル等のベンゾイン類;ベンゾインアルキルエーテル類;ベンゾフェノン、p-メチルベンゾフェノン、ミヒラーズケトン、メチルベンゾフェノン、4,4’-ジクロロベンゾフェノン、4,4’-ビスジエチルアミノベンゾフェノン等のベンゾフェノン類;アセトフェノン、2,2-ジメトキシ-2-フェニルアセトフェノン、2,2-ジエトキシ-2-フェニルアセトフェノン、1,1-ジクロロアセトフェノン、1-ヒドロキシシクロヘキシルフェニルケトン、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノ-1-プロパノン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、2-(ジメチルアミノ)-2-[(4-メチルフェニル)メチル)-1-[4-(4-モルホリニル)フェニル]-1-ブタノン、N,N-ジメチルアミノアセトフェノン等のアセトフェノン類;チオキサントン、2-エチルチオキサントン、2-イソプロピルチオキサントン、2,4-ジメチルチオキサントン、2,4-ジエチルチオキサントン、2-クロロチオキサントン、2,4-ジイソプロピルチオキサントン等のチオキサントン類;アントラキノン、クロロアントラキノン、2-メチルアントラキノン、2-エチルアントラキノン、2-tert-ブチルアントラキノン、1-クロロアントラキノン、2-アミルアントラキノン、2-アミノアントラキノン等のアントラキノン類;アセトフェノンジメチルケタール、ベンジルジメチルケタール等のケタール類;エチル-4-ジメチルアミノベンゾエート、2-(ジメチルアミノ)エチルベンゾエート、p-ジメチル安息香酸エチルエステル等の安息香酸エステル類;1,2-オクタンジオン,1-[4-(フェニルチオ)-,2-(O-ベンゾイルオキシム)]、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)等のオキシムエステル類;ビス(η5-2,4-シクロペンタジエン-1-イル)-ビス(2,6-ジフルオロ-3-(1H-ピロール-1-イル)フェニル)チタニウム、ビス(シクロペンタジエニル)-ビス[2,6-ジフルオロ-3-(2-(1-ピル-1-イル)エチル)フェニル]チタニウム等のチタノセン類;フェニルジスルフィド2-ニトロフルオレン、ブチロイン、アニソインエチルエーテル、アゾビスイソブチロニトリル、テトラメチルチウラムジスルフィド等を挙げることができる。光重合開始剤は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。 [(C) Photopolymerization Initiator]
Examples of the (C) photopolymerization initiator include bis- (2,6-dichlorobenzoyl) phenylphosphine oxide, bis- (2,6-dichlorobenzoyl) -2,5-dimethylphenylphosphinoxide, and bis-. (2,6-dichlorobenzoyl) -4-propylphenylphosphine oxide, bis- (2,6-dichlorobenzoyl) -1-naphthylphosphinoxide, bis- (2,6-dimethoxybenzoyl) phenylphosphin oxide, Bis- (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, Bis- (2,6-dimethoxybenzoyl) -2,5-dimethylphenylphosphinoxide, Bis- (2,4) , 6-trimethylbenzoyl) -bisacylphosphinoxides such as phenylphosphinoxide; 2,6-dimethoxybenzoyldiphenylphosphinoxide, 2,6-dichlorobenzoyldiphenylphosphinoxide, 2,4,6-trimethylbenzoyl Monoacylphosphine oxides such as phenylphosphinic acid methyl ester, 2-methylbenzoyldiphenylphosphine oxide, pivaloylphenylphosphinic acid isopropyl ester, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 1-hydroxy -Cyclohexylphenyl ketone, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1-one, 2-hydroxy-1-{4- [4- (2) -Hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propane-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one and other hydroxyacetophenones; benzoin, benzyl , Benzoin methyl ether, benzoin ethyl ether, benzoin n-propyl ether, benzoin isopropyl ether, benzoin n-butyl ether and other benzoins; benzoin alkyl ethers; benzophenone, p-methylbenzophenone, Michler's ketone, methylbenzophenone, 4,4'- Benzophenones such as dichlorobenzophenone and 4,4'-bisdiethylaminobenzophenone; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1- Dichloroacetophenone, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-1-propanol, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) ) -Butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl) -1- [4- (4-morpholinyl) phenyl] -1-butanone, N, N-dimethylaminoacetophenone, etc. Acetphenones; thioxanthones such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone; anthraquinone, chloroanthraquinone. , 2-Methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, 2-aminoanthraquinone and other anthraquinones; acetphenone dimethyl ketal, benzyl dimethyl ketal and other ketals; ethyl Ethyl benzoates such as -4-dimethylaminobenzoate, 2- (dimethylamino) ethylbenzoate, p-dimethylbenzoic acid ethyl ester; 1,2-octanedione, 1- [4- (phenylthio)-, 2-( O-benzoyloxime)], etanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl]-, 1- (O-acetyloxime) and other oxime esters; (Η5-2,4-cyclopentadiene-1-yl) -bis (2,6-difluoro-3- (1H-pyrrole-1-yl) phenyl) titanium, bis (cyclopentadienyl) -bis [2, 6-Difluoro-3- (2- (1-pill-1-yl) ethyl) phenyl] Titanosen such as titanium; phenyldisulfide 2-nitrofluorene, butyloin, anisoin ethyl ether, azobisisobutyronitrile, tetra Methylthium disulfide and the like can be mentioned. As the photopolymerization initiator, one type may be used alone, or two or more types may be used in combination.
本発明の硬化物を形成し得る光硬化性熱硬化性樹脂組成物は、公知慣用の感光性モノマーを含有し得る。(D)感光性モノマーは、例えば、分子中に1個以上のエチレン性不飽和基を有する化合物であり得る。このような(D)感光性モノマーは、(エチレン性不飽和基が含まれる場合には、)活性エネルギー線照射による(B)カルボキシル基含有樹脂の光硬化を助け、光硬化性熱硬化性樹脂組成物を硬化させるものである。 [(D) Photosensitive Monomer]
The photocurable thermosetting resin composition capable of forming the cured product of the present invention may contain a known and commonly used photosensitive monomer. (D) The photosensitive monomer can be, for example, a compound having one or more ethylenically unsaturated groups in the molecule. Such (D) photosensitive monomer assists photocuring of (B) carboxyl group-containing resin by irradiation with active energy rays (when ethylenically unsaturated group is contained), and is a photocurable thermosetting resin. It cures the composition.
(D)感光性モノマーの含有量がこのような範囲内であれば、光硬化性熱硬化性樹脂組成物が十分な光硬化性を有し、現像時にパターンニングがより良好となり、タック性(指触乾燥性)も良好となる。 The content of such (D) photosensitive monomer is preferably in the range of 10 to 27 parts by mass, preferably 15 to 20 parts by mass with respect to the total 100 parts by mass (solid content) of the (B) carboxyl group-containing resin. The range is more preferred.
(D) When the content of the photosensitive monomer is within such a range, the photocurable thermosetting resin composition has sufficient photocurability, better patterning during development, and tackiness (d). The dryness to the touch) is also good.
本発明において、(E)シリカは、フィラーとして、2液系の場合においては、主剤組成物に含有されるのが好ましい。(E)シリカは、その低吸湿性、低体積膨張性に優れることから、本発明において好適に用いられる。
(E)シリカとしては、非晶質または結晶のいずれであっても、またこれらの混合物であってもよいが、非晶質のものが好ましい。
本発明においては、分散度を維持する等、扱いやすさの観点から、(E)シリカは通常、溶剤に分散したスラリーとして用いられるのが好ましい。 [(E) Silica]
In the present invention, (E) silica is preferably contained as a filler in the main agent composition in the case of a two-component system. (E) Silica is preferably used in the present invention because it is excellent in its low hygroscopicity and low volume expansion.
(E) The silica may be either amorphous or crystalline, or a mixture thereof, but amorphous silica is preferable.
In the present invention, (E) silica is usually preferably used as a slurry dispersed in a solvent from the viewpoint of ease of handling such as maintaining the degree of dispersion.
本発明において、(F)硫酸バリウムもまた上記(E)シリカと同様、フィラーとして作用するが、(E)シリカとは別々に、主剤組成物ではなく硬化剤組成物に含有されるのが好ましい。ベナードセルが生じる等混合後の組成物から得られる組成物塗膜の外観を損なうおそれがあるためである。本発明においては、分散度を維持する等、扱いやすさの観点から、(F)硫酸バリウムは通常、溶剤に分散したスラリーとして用いられるのが好ましい。 [(F) Barium sulfate]
In the present invention, (F) barium sulfate also acts as a filler like the above-mentioned (E) silica, but it is preferable that it is contained separately from (E) silica in the curing agent composition instead of the main agent composition. .. This is because the appearance of the composition coating film obtained from the mixed composition such as the formation of Benard cells may be impaired. In the present invention, from the viewpoint of ease of handling such as maintaining the degree of dispersion, (F) barium sulfate is usually preferably used as a slurry dispersed in a solvent.
ここで、硬化性反応基とは、(A)エポキシ樹脂等や(B)カルボキシル基含有樹脂と硬化反応する基を指し、光硬化性反応基でも熱硬化性反応基でもよい。光硬化性反応基としては、メタクリル基、アクリル基、ビニル基、スチリル基等が挙げられ、熱硬化性反応基としては、エポキシ基、アミノ基、水酸基、カルボキシル基、イソシアネート基、イミノ基、オキセタニル基、メルカプト基、メトキシメチル基、メトキシエチル基、エトキシメチル基、エトキシエチル基、オキサゾリン基等が挙げられる。
(E)シリカおよび(F)硫酸バリウムの表面に硬化性反応基を導入する方法は特に限定されず、公知慣用の方法を用いて導入すればよく、硬化性反応基を有する表面処理剤、例えば、硬化性反応基を有機基として有するカップリング剤等で無機フィラーの表面を処理すればよい。カップリング剤としては、シランカップリング剤、チタンカップリング剤、ジルコニウムカップリング剤、アルミニウムカップリング剤等を用いることができる。なお、硬化性反応基を有しない表面処理された無機フィラーとしては、例えば、シリカ-アルミナ表面処理、チタネート系カップリング剤処理、アルミネート系カップリング剤処理、有機処理がされた無機フィラー等が挙げられる。 The silica (E) and barium (F) sulfate are preferably surface-treated, and it is more preferable that the surfaces thereof are surface-treated so that a curable reactive group can be introduced.
Here, the curable reactive group refers to a group that undergoes a curing reaction with (A) an epoxy resin or the like or (B) a carboxyl group-containing resin, and may be a photocurable reactive group or a thermosetting reactive group. Examples of the photocurable reactive group include a methacryl group, an acrylic group, a vinyl group, a styryl group and the like, and examples of the thermosetting reactive group include an epoxy group, an amino group, a hydroxyl group, a carboxyl group, an isocyanate group, an imino group and an oxetanyl. Examples thereof include a group, a mercapto group, a methoxymethyl group, a methoxyethyl group, an ethoxymethyl group, an ethoxyethyl group, an oxazoline group and the like.
The method for introducing the curable reactive group on the surfaces of (E) silica and (F) barium sulfate is not particularly limited, and the curable reactive group may be introduced by using a known and commonly used method, and a surface treatment agent having a curable reactive group, for example. , The surface of the inorganic filler may be treated with a coupling agent or the like having a curable reactive group as an organic group. As the coupling agent, a silane coupling agent, a titanium coupling agent, a zirconium coupling agent, an aluminum coupling agent and the like can be used. Examples of the surface-treated inorganic filler having no curable reactive group include silica-alumina surface treatment, titanate-based coupling agent treatment, aluminate-based coupling agent treatment, and organically treated inorganic filler. Can be mentioned.
(F)硫酸バリウムスラリーの平均粒子径(D50)としては、1000nm以下であり、500nm以下であることがより好ましい。また、その下限値は、平均粒子径(D50)として、0.1nm以上が好ましい。
(E)シリカおよび(F)硫酸バリウムの平均粒子径が小さいほど光照射時の乱反射を抑えて硬化物パターンの微細加工を容易にすることができる。
平均粒子径(D50)は、レーザー回折式粒子径分布測定装置と動的光散乱法による測定装置により求めることができる。レーザー回折法による測定装置としては、マイクロトラック・ベル社製のMicrotracMT3300EXII、動的光散乱法による測定装置としては、マイクロトラック・ベル社製のNanotrac Wave II UT151が挙げられる。 (E) The average particle size (D50) of the silica slurry is 2000 nm or less, more preferably 1200 nm or less. The lower limit thereof is preferably 0.1 nm or more as the average particle diameter (D50).
The average particle size (D50) of the barium sulfate slurry (F) is 1000 nm or less, more preferably 500 nm or less. The lower limit thereof is preferably 0.1 nm or more as the average particle diameter (D50).
The smaller the average particle size of (E) silica and (F) barium sulfate, the more diffused reflection during light irradiation can be suppressed and the fine processing of the cured product pattern can be facilitated.
The average particle size (D50) can be determined by a laser diffraction type particle size distribution measuring device and a measuring device by a dynamic light scattering method. Examples of the measuring device by the laser diffraction method include Microtrac MT3300EXII manufactured by Microtrac Bell, and examples of the measuring device by the dynamic light scattering method include Nanotrac Wave II UT151 manufactured by Microtrac Bell.
本発明においては、光硬化性熱硬化性樹脂組成物の調製やその粘度調節のために、または、(E)シリカのスラリーあるいは(F)硫酸バリウムのスラリーを調製するために、有機溶剤を用いても良い。
そのような有機溶剤の例として、メチルエチルケトン、シクロヘキサノン等のケトン類;トルエン、キシレン、テトラメチルベンゼン等の芳香族炭化水素類;セロソルブ、メチルセロソルブ、ブチルセロソルブ、カルビトール、メチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル(DPM)、ジプロピレングリコールジエチルエーテル、トリプロピレングリコールモノメチルエーテル等のグリコールエーテル類;酢酸エチル、酢酸ブチル、乳酸ブチル、セロソルブアセテート、ブチルセロソルブアセテート、カルビトールアセテート、ブチルカルビトールアセテート、プロピレングリコールモノメチルエーテルアセテート、ジプロピレングリコールモノメチルエーテルアセテート、炭酸プロピレン等のエステル類;オクタン、デカン等の脂肪族炭化水素類;石油エーテル、石油ナフサ、ソルベントナフサ等の石油系溶剤などを使用することができる。
これらの有機溶剤は、単独で、または、2種類以上を組み合わせて用いることができる。
有機溶剤の含有量は、本発明の光硬化性熱硬化性樹脂組成物の主剤組成物対して、5質%~25質量%の範囲が好ましい。尚、この有機溶剤の含有量は、(E)シリカのスラリー中の有機溶剤も含まれる。
硬化剤組成物に対しては、同組成物に配合する(C)光重合開始剤を溶解可能な有機溶剤であって、(C)光重合開始剤の1質量部に対して3質量部以上の有機溶剤を含有することが好ましい。(C)光重合開始剤を溶解可能な有機溶剤とは、後述する「光重合開始剤の溶解性の確認試験」の結果、「〇:目視にて光重合開始剤の結晶が見られなかった」(表1参照)有機溶剤を意味する。このような有機溶剤を選択して用いることにより、(C)光重合開始剤の結晶が生じないので、粗大粒子の発生を抑えることができる。
表1記載の有機溶剤中、PMA及びCAが、混合後の光硬化性熱硬化性樹脂組成物の塗工性、塗工後の指触乾燥性に優れるため、PMA単独もしくはPMAとCAの混合溶剤を用いることがより好ましい。
なお、有機溶剤の含有量の上限は、当該(C)光重合開始剤の最大溶解量(下記表2参照)により、適宜調整することができる。表1-2~1-5に記載のOmnirad TPO H以外の光重合開始剤についても同様に適宜調整することが出来る。 [Organic solvent]
In the present invention, an organic solvent is used for preparing a photocurable thermosetting resin composition and adjusting its viscosity, or for preparing a slurry of (E) silica or a slurry of (F) barium sulfate. May be.
Examples of such organic solvents are ketones such as methyl ethyl ketone, cyclohexanone; aromatic hydrocarbons such as toluene, xylene, tetramethyl benzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, etc. Glycol ethers such as propylene glycol monomethyl ether, dipropylene glycol monomethyl ether (DPM), dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether; ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, Esters such as butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, and solvent naphtha. Can be used.
These organic solvents can be used alone or in combination of two or more.
The content of the organic solvent is preferably in the range of 5% to 25% by mass with respect to the main composition of the photocurable thermosetting resin composition of the present invention. The content of this organic solvent also includes the organic solvent in the slurry of (E) silica.
The curing agent composition is an organic solvent capable of dissolving (C) the photopolymerization initiator to be blended in the composition, and is 3 parts by mass or more with respect to 1 part by mass of (C) the photopolymerization initiator. It is preferable to contain the organic solvent of. (C) The organic solvent capable of dissolving the photopolymerization initiator is "○: No crystals of the photopolymerization initiator were visually observed" as a result of the "confirmation test of solubility of the photopolymerization initiator" described later. (See Table 1) means an organic solvent. By selecting and using such an organic solvent, crystals of the (C) photopolymerization initiator are not formed, so that the generation of coarse particles can be suppressed.
In the organic solvents shown in Table 1, PMA and CA are excellent in coatability of the photocurable thermosetting resin composition after mixing and dryness to the touch after coating. Therefore, PMA alone or a mixture of PMA and CA is used. It is more preferable to use a solvent.
The upper limit of the content of the organic solvent can be appropriately adjusted depending on the maximum dissolution amount of the (C) photopolymerization initiator (see Table 2 below). Similarly, photopolymerization initiators other than Omnirad TPO H shown in Tables 1-2 to 1-5 can be appropriately adjusted.
本発明の光硬化性熱硬化性樹脂組成物においては、本発明の目的から逸脱しない範囲において、必要に応じて、さらなる添加剤をその他の成分として配合することも勿論可能である。
そのような成分として、例えば、顔料および染料等の着色料、熱重合禁止剤、紫外線吸収剤、可塑剤、難燃剤、帯電防止剤、老化防止剤、抗菌・防黴剤、レベリング剤、増粘剤、密着性付与剤、チキソ性付与剤、光開始助剤、増感剤、光塩基発生剤、熱可塑性樹脂、エラストマー、有機フィラー、シリカおよび硫酸バリウム以外のフィラー、離型剤、表面処理剤、分散剤、分散助剤、表面改質剤、安定剤、蛍光体、セルロース樹脂等が挙げられる。 [Other ingredients]
In the photocurable thermosetting resin composition of the present invention, it is of course possible to add additional additives as other components as necessary within the range not deviating from the object of the present invention.
Such components include, for example, colorants such as pigments and dyes, thermal polymerization inhibitors, ultraviolet absorbers, plasticizers, flame retardants, antistatic agents, antiaging agents, antibacterial / antifungal agents, leveling agents, thickening agents. Agents, adhesion-imparting agents, thixo-imparting agents, photoinitiator aids, sensitizers, photobase generators, thermoplastic resins, elastomers, organic fillers, fillers other than silica and barium sulfate, mold release agents, surface treatment agents , Dispersants, dispersion aids, surface modifiers, stabilizers, phosphors, cellulose resins and the like.
本発明の光硬化性熱硬化性樹脂組成物は、ドライフィルム化して用いるのが好ましい。
本発明のドライフィルムは、キャリアフィルム上に、本発明の光硬化性熱硬化性樹脂組成物を塗布、乾燥させることにより得られる樹脂層を有する。ドライフィルムを形成する際には、まず、2液系の場合には、その主剤組成物および硬化剤組成物を互いによく混合して本発明の光硬化性熱硬化性樹脂組成物を得た後、そのまま、あるいは、必要に応じて有機溶剤で希釈して適切な粘度に調整した上で、コンマコーター、ブレードコーター、リップコーター、ロッドコーター、スクイズコーター、リバースコーター、トランスファロールコーター、グラビアコーター、スプレーコーター等により、キャリアフィルム上に均一な厚さに塗布する。その後、塗布された組成物を、通常、50~130℃の温度で1~30分間乾燥することで、樹脂層を形成することができる。塗布膜厚については特に制限はないが、一般に、乾燥後の膜厚で、10~150μm、好ましくは20~60μmの範囲で適宜選択される。 [Dry film]
The photocurable thermosetting resin composition of the present invention is preferably used as a dry film.
The dry film of the present invention has a resin layer obtained by applying and drying the photocurable thermosetting resin composition of the present invention on a carrier film. When forming a dry film, first, in the case of a two-component system, the main agent composition and the curing agent composition are mixed well with each other to obtain the photocurable thermosetting resin composition of the present invention. , As it is, or diluted with an organic solvent as needed to adjust the viscosity to an appropriate level, then a comma coater, blade coater, lip coater, rod coater, squeeze coater, reverse coater, transfer coater, gravure coater, spray. Apply to a uniform thickness on the carrier film with a coater or the like. Then, the applied composition is usually dried at a temperature of 50 to 130 ° C. for 1 to 30 minutes to form a resin layer. The coating film thickness is not particularly limited, but is generally selected as appropriate in the range of 10 to 150 μm, preferably 20 to 60 μm after drying.
本発明の光硬化性熱硬化性樹脂組成物を用いて硬化物を形成するには、その組成物を基板上に塗布し、溶剤を揮発乾燥した後に得られた樹脂層に対し、露光(光照射)を行うことにより、露光部(光照射された部分)が硬化する。具体的には、接触式または非接触方式により、パターンを形成したフォトマスクを通して選択的に活性エネルギー線により露光、もしくは、レーザーダイレクト露光機により直接パターン露光して、未露光部をアルカリ水溶液(例えば、0.3~3質量%炭酸ソーダ水溶液)により現像することにより、レジストパターンが形成される。さらに約100~180℃の温度に加熱して熱硬化(ポストキュア)させることにより、耐熱性、耐薬品性、耐吸湿性、密着性、電気特性等の諸特性に優れた硬化膜(硬化物)を形成することができる。 [Cursed product]
In order to form a cured product using the photocurable thermosetting resin composition of the present invention, the composition is applied onto a substrate, and the resin layer obtained after volatilizing and drying the solvent is exposed (light). By performing irradiation), the exposed portion (the portion irradiated with light) is cured. Specifically, the unexposed portion is exposed to an alkaline aqueous solution (for example, by selectively exposing with active energy rays through a photomask in which a pattern is formed by a contact method or a non-contact method, or by directly exposing the pattern with a laser direct exposure machine. , 0.3 to 3% by mass of sodium carbonate aqueous solution) to form a resist pattern. Further, by heating to a temperature of about 100 to 180 ° C. and thermosetting (post-curing), a cured film (cured product) having excellent various properties such as heat resistance, chemical resistance, hygroscopicity, adhesion, and electrical characteristics is obtained. ) Can be formed.
また、本発明は、上記硬化物を有する電子部品をも提供することができる。
本発明の光硬化性熱硬化性樹脂組成物を用いることによって、品質、耐久性及び信頼性の高い電子部品が提供される。
なお、本発明において電子部品とは、電子回路に使用する部品を意味し、プリント配線板、トランジスタ、発光ダイオード、レーザーダイオード等の能動部品の他抵抗、コンデンサ、インダクタ、コネクタ等の受動部品も含まれる。 [Electronic components]
The present invention can also provide an electronic component having the above-mentioned cured product.
By using the photocurable thermosetting resin composition of the present invention, electronic components having high quality, durability and reliability are provided.
In the present invention, the electronic component means a component used in an electronic circuit, and includes active components such as printed wiring boards, transistors, light emitting diodes, and laser diodes, as well as passive components such as resistors, capacitors, inductors, and connectors. Is done.
また、他に但書が無い限り、示される「部」および「%」は質量に基づくものとする。 Hereinafter, one aspect of the present invention will be specifically shown by way of examples, but of course, it is not an object to limit the scope of the invention according to the present invention.
Unless otherwise specified, the "parts" and "%" shown are based on mass.
本発明の光硬化性熱硬化性樹脂組成物の各特性についての実験に先立ち、光重合開始剤に対する有機溶剤として適したものを選択するため、予備的に、有機溶剤に対する5種の光重合開始剤の溶解性を確認する試験を下記のとおりに行った。
最初に、各種有機溶剤に対する5種の光重合開始剤の凡その溶解性を確認するための試験を行い、その後の添加量の設定の目安とした(表1-1~1-5)。
次に、用意したバイアル瓶に所定量の4種の溶剤をそれぞれ添加し、さらに光重合開始剤(Omnirad TPO H)を当該バイアル瓶に添加した後、手で振盪して撹拌を行い、5分間静置した。その後、光重合開始剤の結晶の有無を目視にて確認し、結晶が確認されなかった場合は、光重合開始剤をさらに添加して手による撹拌を行い、5分間静置した。結晶が確認されるまでこの操作を繰り返し、最終的に、5分間放置後に結晶が確認された場合には、光重合開始剤の添加を終了し、結晶が確認された前の添加量を、光重合開始剤Omnirad TPO Hの最大の添加量とした(表2)。
評価基準は、下記のとおりである。
〇:目視にて光重合開始剤の結晶が見られなかった
×:目視にて光重合開始剤の結晶が見られた(経時にて溶解しなかった)
結果を下記表1-1~1-5および表2に示す。 Test example 1. Confirmation of Solubility of Photopolymerization Initiator Prior to the experiment on each property of the photocurable thermosetting resin composition of the present invention, in order to select a suitable organic solvent for the photopolymerization initiator, a preliminary preparation. A test for confirming the solubility of the five photopolymerization initiators in an organic solvent was conducted as follows.
First, a test was conducted to confirm the general solubility of the five photopolymerization initiators in various organic solvents, and the subsequent addition amount was used as a guideline (Tables 1-1 to 1-5).
Next, a predetermined amount of each of the four solvents was added to the prepared vial, and a photopolymerization initiator (Omnirad TPO H) was further added to the vial, and then the vial was shaken by hand to stir for 5 minutes. It was left still. Then, the presence or absence of crystals of the photopolymerization initiator was visually confirmed, and if no crystals were confirmed, the photopolymerization initiator was further added, the mixture was stirred by hand, and the mixture was allowed to stand for 5 minutes. This operation is repeated until crystals are confirmed, and when crystals are finally confirmed after being left for 5 minutes, the addition of the photopolymerization initiator is terminated, and the amount added before the crystals are confirmed is set to light. The maximum amount of the polymerization initiator Omnirad TPO H was used (Table 2).
The evaluation criteria are as follows.
〇: No crystals of the photopolymerization initiator were visually observed. ×: Crystals of the photopolymerization initiator were visually observed (not dissolved over time).
The results are shown in Tables 1-1-5 and Table 2 below.
・TPO:アシルフォスフィンオキサイド系光重合開始剤(IGM Resins B.V.社製 Omnirad TPO H)(2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド)
・907:α-アミノアセトフェノン系光重合開始剤(IGM Resins社製 Omnirad 907)(2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン)
・379:アルキルフェノン系光重合開始剤(IGM Resins B.V.社製 Omnirad 379EG)(2-(ジメチルアミノ)-2-(4-メチルベンジル)-1-(4-モルホリノフェニル)ブタン-1オン)
・784:チタノセン系光重合開始剤(岳陽市金茂泰科技有限公司株式会社製 JMT-784)
・OXE02:オキシムエステル系光重合開始剤(BASFジャパン社製 イルガキュアOXE02(エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-1-(o-アセチルオキシム)
・PMA(プロピレングリコールモノメチルエーテルアセテート)
・CA(カルビトールアセテート)
・GBL(γ-ブチロラクトン)
・MEK(メチルエチルケトン)
-TPO: Acylphosphine oxide-based photopolymerization initiator (Omnirad TPO H manufactured by IGM Resins B.V.) (2,4,6-trimethylbenzoyl-diphenyl-phosphinoxide)
907: α-aminoacetophenone-based photopolymerization initiator (Omnirad 907 manufactured by IGM Resins) (2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one)
379: Alkylphenone-based photopolymerization initiator (Omnirad 379EG manufactured by IGM Resins B.V.) (2- (dimethylamino) -2- (4-methylbenzyl) -1- (4-morpholinophenyl) butane-1 on)
784: Titanocene-based photopolymerization initiator (JMT-784 manufactured by Yueyang Jinmao Technology Co., Ltd.)
OXE02: Oxime Ester Photopolymerization Initiator (Irgacure OXE02 (Etanon, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] -1- (o-) manufactured by BASF Japan Ltd.) Acetyloxime)
・ PMA (Propylene Glycol Monomethyl Ether Acetate)
・ CA (carbitol acetate)
・ GBL (γ-butyrolactone)
・ MEK (Methyl Ethyl Ketone)
冷却管、攪拌機を備えたフラスコに、ビスフェノールA456部、水228部、37%ホルマリン649部を仕込み、40℃以下の温度を保ち、25%水酸化ナトリウム水溶液228部を添加した、添加終了後50℃で10時間反応した。反応終了後40℃まで冷却し、40℃以下を保ちながら37.5%リン酸水溶液でpH4まで中和した。 その後静置し水層を分離した。分離後メチルイソブチルケトン300部を添加し均一に溶解した後、蒸留水500部で3回洗浄し、50℃以下の温度で減圧下、水、溶媒等を除去した。得られたポリメチロール化合物をメタノール550部に溶解し、ポリメチロール化合物のメタノール溶液1230部を得た。得られたポリメチロール化合物のメタノール溶液の一部を真空乾燥機中室温で乾燥したところ、固形分が55.2%であった。 [Synthesis example 1. Synthesis of Carboxyl Group-Containing Resin (B-1)]
A flask equipped with a cooling tube and a stirrer was charged with 456 parts of bisphenol A, 228 parts of water, and 649 parts of 37% formalin, kept at a temperature of 40 ° C. or lower, and 228 parts of a 25% sodium hydroxide aqueous solution was added. The reaction was carried out at ° C. for 10 hours. After completion of the reaction, the mixture was cooled to 40 ° C. and neutralized to pH 4 with a 37.5% aqueous phosphoric acid solution while maintaining 40 ° C. or lower. After that, it was allowed to stand and the aqueous layer was separated. After separation, 300 parts of methyl isobutyl ketone was added and uniformly dissolved, followed by washing with 500 parts of distilled water three times, and the water, solvent and the like were removed under reduced pressure at a temperature of 50 ° C. or lower. The obtained trimethylol compound was dissolved in 550 parts of methanol to obtain 1230 parts of a methanol solution of the trimethylol compound. When a part of the obtained methanol solution of the polypeptideol compound was dried in a vacuum dryer at room temperature, the solid content was 55.2%.
温度計、窒素導入装置兼アルキレンオキシド導入装置および撹拌装置を備えたオートクレーブに、クレゾールノボラック樹脂(アイカ工業製ショウノールCRG-951、OH当量:119.4)119.4部、水酸化カリウム1.19部およびトルエン119.4部を導入し、撹拌しつつ系内を窒素置換し、加熱昇温した。次に、プロピレンオキ シド63.8部を徐々に滴下し、125~132℃、0~4.8kg/cm2で16時間反応させた。その後、室温まで冷却し、この反応溶液に89%リン酸1.56部を添加混合して水酸化カリウムを中和し、不揮発分62.1%、水酸基価が182.2mgKOH/g(307.9g/eq.)であるノボラック型クレゾール樹脂のプロピレンオ キシド反応溶液を得た。これは、フェノール性水酸基1当量当りプロピレンオキシドが平均1.08モル付加したものであった。 [Synthesis example 2. Synthesis of Carboxyl Group-Containing Resin (B-2)]
In an autoclave equipped with a thermometer, a nitrogen introduction device and an alkylene oxide introduction device, and a stirring device, cresol novolak resin (Shonol CRG-951 manufactured by Aika Industries, OH equivalent: 119.4) 119.4 parts, potassium hydroxide 1. 19 parts and 119.4 parts of toluene were introduced, the inside of the system was replaced with nitrogen while stirring, and the temperature was raised by heating. Next, 63.8 parts of propylene oxyside was gradually added dropwise and reacted at 125 to 132 ° C. and 0 to 4.8 kg / cm2 for 16 hours. Then, the mixture was cooled to room temperature, 1.56 parts of 89% phosphoric acid was added to and mixed with this reaction solution to neutralize potassium hydroxide, the non-volatile content was 62.1%, and the hydroxyl value was 182.2 mgKOH / g (307. A propylene oxide reaction solution of a novolak-type cresol resin at 9 g / eq.) Was obtained. This had an average of 1.08 mol of propylene oxide added per equivalent amount of phenolic hydroxyl group.
冷却管、攪拌機を備えたフラスコに、ビスフェノールA456部、水228部、37%ホルマリン649部を仕込み、40℃以下の温度を保ち、25%水酸化ナトリウム水溶液228部を添加した、添加終了後50℃で10時間反応した。反応終了後40℃まで冷却し、40℃以下を保ちながら37.5%リン酸水溶液でpH4まで中和した。そ の後静置し水層を分離した。分離後メチルイソブチルケトン300部を添加し均一に溶解した後、蒸留水500部で3回洗浄し、50℃以下の温度で減圧下、水、溶媒等を除去した。得られたポリメチロール化合物をメタノール550部に溶解し、ポリメチロール化合物のメタノール溶液1230部を得た。得られたポリメチロール化合物のメタ ノール溶液の一部を真空乾燥機中室温で乾燥したところ、固形分が55.2%であった。 [Synthesis example 3. Synthesis of acryloyl group-containing resin]
A flask equipped with a cooling tube and a stirrer was charged with 456 parts of bisphenol A, 228 parts of water, and 649 parts of 37% formalin, kept at a temperature of 40 ° C. or lower, and 228 parts of a 25% sodium hydroxide aqueous solution was added. The reaction was carried out at ° C. for 10 hours. After completion of the reaction, the mixture was cooled to 40 ° C. and neutralized to pH 4 with a 37.5% aqueous phosphoric acid solution while maintaining 40 ° C. or lower. After that, it was left to stand and the water layer was separated. After separation, 300 parts of methyl isobutyl ketone was added and uniformly dissolved, followed by washing with 500 parts of distilled water three times, and the water, solvent and the like were removed under reduced pressure at a temperature of 50 ° C. or lower. The obtained trimethylol compound was dissolved in 550 parts of methanol to obtain 1230 parts of a methanol solution of the trimethylol compound. When a part of the obtained dimethylol compound methanol solution was dried in a vacuum dryer at room temperature, the solid content was 55.2%.
真球状シリカ(アドマテック社製SO-E2)700g、溶剤としてプロピレングリコールモノメチルエーテルアセテート(PMA)295g、湿潤分散剤を5g混合攪拌し、ビーズミルにて0.5μmのジルコニアビーズを用い分散処理を行った。これを3回繰り返して3μmフィルターでろ過した(E)シリカスラリーを作製した。得られたシリカスラリーの平均粒子径(D50)は、1200nm以下であった。 (E) Preparation of silica slurry 700 g of spherical silica (SO-E2 manufactured by Admatech), 295 g of propylene glycol monomethyl ether acetate (PMA) as a solvent, and 5 g of a wet dispersant are mixed and stirred, and 0.5 μm zirconia beads are mixed and stirred with a bead mill. Was used for dispersion processing. This was repeated 3 times and filtered through a 3 μm filter to prepare an (E) silica slurry. The average particle size (D50) of the obtained silica slurry was 1200 nm or less.
硫酸バリウム(堺化学工業社製B-30)700g、溶剤としてジエチレングリコールモノエチルエーテルアセテート(カルビトールアセテート)295g、湿潤分散剤5gを混合攪拌し、上記と同様にビーズミルにて分散処理を行った。これを3回繰り返して3μmフィルターでろ過した(F)硫酸バリウムスラリーを作製した。得られた硫酸バリウムスラリーの平均粒径(D50)で500nm以下であった。 (F) Preparation of barium sulfate slurry 700 g of barium sulfate (B-30 manufactured by Sakai Chemical Industry Co., Ltd.), 295 g of diethylene glycol monoethyl ether acetate (carbitol acetate) as a solvent, and 5 g of a wet dispersant are mixed and stirred, and a bead mill is used in the same manner as above. The dispersion processing was performed at. This was repeated 3 times to prepare a (F) barium sulfate slurry filtered with a 3 μm filter. The average particle size (D50) of the obtained barium sulfate slurry was 500 nm or less.
下記表3および4に示すとおりの各成分を、各配合量にて、撹拌機で予備混合した後、3本ロールミルにて混練し、実施例1~5および比較例1~3の光硬化性熱硬化性樹脂組成物(主剤組成物および硬化剤組成物から成る2液系)をそれぞれ調製した。 [Examples 1 to 5 and Comparative Examples 1 to 3]
Each component as shown in Tables 3 and 4 below was premixed with a stirrer at each compounding amount, kneaded with a three-roll mill, and the photocurability of Examples 1 to 5 and Comparative Examples 1 to 3. A thermosetting resin composition (a two-component system consisting of a main agent composition and a curing agent composition) was prepared.
*2 合成例2に従う
*3 合成例3に従う
*4 C.I.Pigment red 149
*5 C.I.Pigment yellow 147
*6 銅フタロシアニンブルー:
*7 カーボンブラック:MA-100(三菱ケミカル株式会社)
*8 メラミン
*9 BYK-350(ビッケミー・ジャパン社製)
*10 DPHA:ジペンタエリスリトールヘキサアクリレート(6官能アクリルモノマー、日本化薬社株式会社製)
*11 ラロマーLR8863:EO変性トリメチロールプロパントリアクリレート(BASFジャパン社製)
*12 (E)シリカスラリー
*13 PMA(プロピレングリコールモノメチルエーテルアセテート)
*14 (F)硫酸バリウムスラリー
*15 CA(カルビトールアセテート)
*16 Omnirad TPO H:アシルフォスフィンオキサイド系光重合開始剤(IGM ResinsB.V.社社製)
*17 JMT784:チタノセン系光重合開始剤(岳陽市金茂泰科技有限公司株式会社製)
*18 キノパワー QS-30:ナフトキノン系重合禁止剤(川崎化成工業社製)
*19 PMA(プロピレングリコールモノメチルエーテルアセテート)
*20 GBL(γ-ブチロラクトン)
*21 MEK(メチルエチルケトン)
*22 ジシクロペンタジエン型エポキシ樹脂(HP-7200L;DIC社製)
*23 BisA型エポキシ樹脂(jER834;三菱ケミカル社製)
*24 ビフェニル型エポキシ樹脂
*25 ノボラックエポキシ樹脂
* 2 Follow Synthesis Example 2
* 3 Follow Synthesis Example 3
* 4 C. I. Pigment red 149
* 5 C. I. Pigment yello 147
* 6 Copper Phthalocyanine Blue:
* 7 Carbon black: MA-100 (Mitsubishi Chemical Corporation)
* 8 Melamine
* 9 BYK-350 (manufactured by Bickemi Japan)
* 10 DPHA: Dipentaerythritol hexaacrylate (six-functional acrylic monomer, manufactured by Nippon Kayaku Co., Ltd.)
* 11 Laromar LR8863: EO-modified trimethylolpropane triacrylate (manufactured by BASF Japan Ltd.)
* 12 (E) Silica slurry
* 13 PMA (Propylene Glycol Monomethyl Ether Acetate)
* 14 (F) Barium sulfate slurry
* 15 CA (carbitol acetate)
* 16 Omnirad TPO H: Acylphosphinoxide-based photopolymerization initiator (manufactured by IGM Resins B.V.)
* 17 JMT784: Titanocene-based photopolymerization initiator (manufactured by Yueyang Jinmao Yasushi Technology Co., Ltd.)
* 18 Kinopower QS-30: Naphthoquinone-based polymerization inhibitor (manufactured by Kawasaki Kasei Chemicals, Inc.)
* 19 PMA (Propylene Glycol Monomethyl Ether Acetate)
* 20 GBL (γ-butyrolactone)
* 21 MEK (Methyl Ethyl Ketone)
* 22 Dicyclopentadiene type epoxy resin (HP-7200L; manufactured by DIC Corporation)
* 23 BisA type epoxy resin (jER834; manufactured by Mitsubishi Chemical Corporation)
* 24 Biphenyl type epoxy resin
* 25 Novolac epoxy resin
実施例1~5および比較例1~3のそれぞれの主剤組成物、硬化剤組成物、および主剤組成物と硬化剤組成物とをよく混合して得た光硬化性熱硬化性樹脂組成物の粘度を、コーンプレート型粘度計(型番:TVE-33H、東京計器社製)を用いて、測定温度25℃およびコーン回転数5rpm/minにて測定し、その数値を初期の粘度とした。分散度は、グラインドメーター(安田精機製作所製)を用いた粒度測定によって測定し、その数値を分散度(初期)とした。
結果を下記表5にまとめる。 <Dispersity (initial), initial viscosity>
The main agent composition, the curing agent composition, and the photocurable thermosetting resin composition obtained by thoroughly mixing the main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3, respectively. The viscosity was measured using a cone plate type viscometer (model number: TVE-33H, manufactured by Tokyo Keiki Co., Ltd.) at a measurement temperature of 25 ° C. and a cone rotation speed of 5 rpm / min, and the values were taken as the initial viscosities. The degree of dispersion was measured by particle size measurement using a grind meter (manufactured by Yasuda Seiki Seisakusho), and the value was taken as the degree of dispersion (initial).
The results are summarized in Table 5 below.
実施例1~5および比較例1~3のそれぞれの主剤組成物および硬化剤組成物について、20℃にて保管した場合および5℃にて保管した場合の、調製して5日後、10日後、15日後、20日後および30日後における分散度を、グラインドメーター(安田精機製作所製)を用いた粒度測定によって測定し、その数値を分散度(経時)とした。
評価基準は下記のとおりである。
<10μm :〇
<12.5μm:△
<20μm :×
結果を下記表6にまとめる。 <Dispersity (time)>
The main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3 were prepared at 20 ° C. and 5 ° C., 5 days and 10 days after preparation. The degree of dispersion after 15 days, 20 days, and 30 days was measured by particle size measurement using a grind meter (manufactured by Yasuda Seiki Seisakusho), and the value was taken as the degree of dispersion (time).
The evaluation criteria are as follows.
<10 μm: 〇 <12.5 μm: △
<20 μm: ×
The results are summarized in Table 6 below.
実施例1~5および比較例1~3のそれぞれの主剤組成物および硬化剤組成物について、20℃にて保管した場合の、調製して5日後、10日後、15日後、20日後および30日後における各々の組成物の表面を目視にて確認した。
評価基準は下記のとおりである。
表面の分離無し:○
表面の分離有り:×
結果を下記表7にまとめる。 <Appearance of composition>
5 days, 10 days, 15 days, 20 days and 30 days after preparation of the main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3 when stored at 20 ° C. The surface of each composition in the above was visually confirmed.
The evaluation criteria are as follows.
No surface separation: ○
With surface separation: ×
The results are summarized in Table 7 below.
実施例1~5および比較例1~3の主剤組成物および硬化剤組成物を20℃にて保管して、5日後、10日後、15日後、20日後および30日後のものをそれぞれ混合して得た光硬化性熱硬化性樹脂組成物に対して、希釈溶剤を添加して粘度を4d・Psに調整した。次に、希釈後の光硬化性熱硬化性樹脂組成物をアプリケーターを用いて、乾燥後膜厚がそれぞれ15μmおよび30μmとなるようにPETフィルムに塗布し、熱風循環乾燥炉にて30分間乾燥させた。その後、得られた塗膜の表面(30cm×30cm)を光学顕微鏡20倍にて観察し、ハジキおよびピンホールの発生数を確認した。
評価基準は下記のとおりである。
0個 :○
1個以上5個以下:△
5個超10個以下:×
結果を下記表8にまとめる。 <Appearance of dry film>
The main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3 were stored at 20 ° C., and those after 5 days, 10 days, 15 days, 20 days and 30 days were mixed, respectively. A diluting solvent was added to the obtained photocurable thermosetting resin composition to adjust the viscosity to 4d · Ps. Next, the diluted photocurable thermosetting resin composition was applied to a PET film using an applicator so that the film thickness after drying was 15 μm and 30 μm, respectively, and dried in a hot air circulation drying oven for 30 minutes. rice field. Then, the surface (30 cm × 30 cm) of the obtained coating film was observed with an optical microscope 20 times, and the number of repellents and pinholes was confirmed.
The evaluation criteria are as follows.
0: ○
1 or more and 5 or less: △
More than 5 and less than 10: ×
The results are summarized in Table 8 below.
実施例1~5および比較例1~3の主剤組成物および硬化剤組成物を混合して得た光硬化性熱硬化性樹脂組成物から、銅箔基板に代えてライン/スペース=20/20μmのくし型電極パターンを用いて、ドライフィルムをそれぞれ得た。得られたドライフィルムに対して真空加熱ラミネートを行い、DC10Vのバイアス電圧を印加し、130℃/85%にて絶縁抵抗値が10の4乗Ω以下となるまでの時間を測定した。尚、測定数5ピースを用いた平均時間を算出した。
評価基準は下記のとおりである。
接続時間200時間以上250時間以下:○
接続時間150時間以上200時間未満:×
結果を下記表9にまとめる。 <Electrical characteristics>
From the photocurable thermosetting resin composition obtained by mixing the main agent composition and the curing agent composition of Examples 1 to 5 and Comparative Examples 1 to 3, the line / space = 20/20 μm instead of the copper foil substrate. Dry films were obtained using comb-shaped electrode patterns. The obtained dry film was vacuum-heated and laminated, a bias voltage of DC10 V was applied, and the time until the insulation resistance value became 10 4 Ω or less at 130 ° C./85% was measured. The average time using 5 pieces of measurement was calculated.
The evaluation criteria are as follows.
Connection time 200 hours or more and 250 hours or less: ○
Connection time 150 hours or more and less than 200 hours: ×
The results are summarized in Table 9 below.
また、組成物の外観についても、保管30日後に至るまで、主剤組成物および硬化剤組成物共に、表面の分離等問題は無く、保存安定性に優れることがわかる。
さらに、本発明の光硬化性熱硬化性樹脂組成物は、保管30日後に至るまで、ドライフィルム形成時、ハジキおよびピンホールの発生が無く、この点でも保存安定性に優れる。
一方、比較例1の主剤組成物は、(B)カルボキシル基含有樹脂と(C)光重合開始剤を含有しており、これらを共に含むため、詳細なメカニズムは不明であるが、各実施例と比較して、分散度(経時)、組成物の外観の経時安定性で劣ることがわかる。また、比較例1の硬化剤組成物は、(E)シリカおよび(F)硫酸バリウムを含有するため、液表面の分離(色浮き・色別れ)、いわゆるベナードセルが生じ、該組成物の液表面の外観を損ない、経時安定性に劣ることがわかる。
比較例2の主剤組成物は、(B)カルボキシル基含有樹脂と(C)光重合開始剤を含有しており、これらを共に含むため、詳細なメカニズムは不明であるが、各実施例と比較して、分散度(経時)、組成物の外観の経時安定性で劣り、さらに(E)シリカおよび(F)硫酸バリウムを含有するため、いわゆるベナードセルが生じ、各実施例と比較して、分散度(経時)、組成物の外観の経時安定性で劣ることがわかる。
比較例3の主剤組成物は(E)シリカを含有せず、硬化剤組成物は(E)シリカを含有せず(F)硫酸バリウムのみ含有する、すなわち両成分を1つの組成物中に併用していない。また、主剤組成物において、(B)カルボキシル基含有樹脂と(C)光重合開始剤も併用していないため、分散度(経時)、組成物の外観の経時安定性の問題は無いものの、比較例3の主剤組成物および硬化剤組成物のいずれの組成物にも必須成分である(E)シリカを含有しないため、その混合物から得たドライフィルム形成時にハジキおよびピンホールが発生した。このため、比較例3は、電気特性評価が劣ることは明らかなので、同評価は実施していない。
上記の様に比較例1及び2の主剤組成物、硬化剤組成物につき、各成分の組み合わせに問題があるため、それぞれ経時で、外観不良および粗大粒子が発生し、その混合物である各比較例の光硬化性熱硬化性樹脂組成物から得たドライフィルム形成時のハジキ等の評価及び電気特性についても、実施例と比較して明らかに劣ることが分かる。 From the results shown in the above table, it can be seen that the photocurable thermosetting resin composition of the present invention is excellent in electrical properties. For both the main agent composition and the curing agent composition of the present invention, the particle size measurement result using a grind meter was <10 μm from the initial stage to 30 days after storage, no coarse particles were generated, and the degree of dispersion and storage stability were not generated. It turns out that it is excellent.
Further, regarding the appearance of the composition, it can be seen that there is no problem such as surface separation in both the main agent composition and the curing agent composition until 30 days after storage, and the storage stability is excellent.
Further, the photocurable thermosetting resin composition of the present invention does not generate cissing and pinholes during the formation of a dry film until 30 days after storage, and is also excellent in storage stability in this respect.
On the other hand, the main agent composition of Comparative Example 1 contains (B) a carboxyl group-containing resin and (C) a photopolymerization initiator, and since they are contained together, the detailed mechanism is unknown, but each example. It can be seen that the degree of dispersion (time) and the stability of the appearance of the composition over time are inferior to those of the above. Further, since the curing agent composition of Comparative Example 1 contains (E) silica and (F) barium sulfate, separation of the liquid surface (color floating / color separation), so-called Benard cell, occurs, and the liquid surface of the composition It can be seen that the appearance of the silica is impaired and the stability over time is inferior.
The main agent composition of Comparative Example 2 contains (B) a carboxyl group-containing resin and (C) a photopolymerization initiator, and since they are contained together, the detailed mechanism is unknown, but it is compared with each example. As a result, the degree of dispersion (with time) and the stability of the appearance of the composition with time are inferior, and since (E) silica and (F) barium sulfate are contained, so-called Benard cells are formed, which are dispersed as compared with each example. It can be seen that the degree (time) and the stability of the appearance of the composition over time are inferior.
The main agent composition of Comparative Example 3 does not contain (E) silica, and the curing agent composition does not contain (E) silica and contains only (F) barium sulfate, that is, both components are used in combination in one composition. Not done. Further, since (B) the carboxyl group-containing resin and (C) the photopolymerization initiator are not used in combination in the main composition, there are no problems in the degree of dispersion (time) and the stability of the appearance of the composition over time, but comparison is made. Since (E) silica, which is an essential component, is not contained in either the main agent composition or the curing agent composition of Example 3, repellents and pinholes are generated during the formation of the dry film obtained from the mixture. Therefore, in Comparative Example 3, it is clear that the evaluation of electrical characteristics is inferior, so that evaluation is not performed.
As described above, since there is a problem in the combination of the components of the main agent composition and the curing agent composition of Comparative Examples 1 and 2, poor appearance and coarse particles are generated over time, respectively, and each comparative example is a mixture thereof. It can be seen that the evaluation and electrical characteristics of repellents and the like during formation of the dry film obtained from the photocurable thermosetting resin composition of No. 1 are also clearly inferior to those of the examples.
Claims (8)
- (A)エポキシ樹脂、(B)カルボキシル基含有樹脂、(C)光重合開始剤、(D)感光性モノマー、(E)シリカ、(F)硫酸バリウムおよび有機溶剤を含有する、光硬化性熱硬化性樹脂組成物であって、
前記光硬化性熱硬化性樹脂組成物を得るために少なくとも2液系の樹脂組成物に組成され、
前記(B)カルボキシル基含有樹脂、前記(D)感光性モノマーおよび前記(E)シリカは、前記(A)エポキシ樹脂、前記(F)硫酸バリウムおよび前記(C)光重合開始剤とは、別の樹脂組成物中に含まれ、
前記(C)光重合開始剤を含む樹脂組成物は、前記(C)光重合開始剤を溶解可能な有機溶剤を含むことを特徴とする、
少なくとも2液系の樹脂組成物に組成されている光硬化性熱硬化性樹脂組成物。 Photocurable thermosetting containing (A) epoxy resin, (B) carboxyl group-containing resin, (C) photopolymerization initiator, (D) photosensitive monomer, (E) silica, (F) barium sulfate and organic solvent. It is a curable resin composition and is
In order to obtain the photocurable thermosetting resin composition, the resin composition is composed of at least two liquids.
The (B) carboxyl group-containing resin, the (D) photosensitive monomer, and the (E) silica are different from the (A) epoxy resin, the (F) barium sulfate, and the (C) photopolymerization initiator. Included in the resin composition of
The resin composition containing the (C) photopolymerization initiator is characterized by containing an organic solvent capable of dissolving the (C) photopolymerization initiator.
A photocurable thermosetting resin composition composed of at least a two-component resin composition. - 前記(A)エポキシ樹脂として、常温にて半固形または固形のエポキシ樹脂、ビフェニル型エポキシ樹脂およびノボラック型の3種を含有することを特徴とする、請求項1に記載の光硬化性熱硬化性樹脂組成物。 The photocurable thermosetting according to claim 1, wherein the (A) epoxy resin contains three types of a semi-solid or solid epoxy resin, a biphenyl type epoxy resin and a novolak type at room temperature. Resin composition.
- 前記(A)エポキシ樹脂を含有する樹脂組成物が4dPa・s以下の粘度を有し、および、各々の樹脂組成物を混合して得られた光硬化性熱硬化性樹脂組成物が4dPa・s以下の粘度を有することを特徴とする、請求項1または2に記載の光硬化性熱硬化性樹脂組成物。 The resin composition containing the epoxy resin (A) has a viscosity of 4 dPa · s or less, and the photocurable thermosetting resin composition obtained by mixing the respective resin compositions is 4 dPa · s. The photocurable thermosetting resin composition according to claim 1 or 2, which has the following viscosity.
- 前記(A)エポキシ樹脂を含有する樹脂組成物が前記(C)光重合開始剤および前記有機溶剤を含有し、前記(C)光重合開始剤の1質量部に対して3質量部以上の前記有機溶剤を含有することを特徴とする、請求項1~3のうちいずれか1項に記載の光硬化性熱硬化性樹脂組成物。 The resin composition containing the (A) epoxy resin contains the (C) photopolymerization initiator and the organic solvent, and is 3 parts by mass or more with respect to 1 part by mass of the (C) photopolymerization initiator. The photocurable thermosetting resin composition according to any one of claims 1 to 3, which contains an organic solvent.
- 請求項1~4のうちいずれか1項に記載の光硬化性熱硬化性樹脂組成物を、キャリアフィルムに塗布および乾燥させて得られる、膜厚が10μm~30μmのドライフィルム。 A dry film having a film thickness of 10 μm to 30 μm, which is obtained by applying and drying the photocurable thermosetting resin composition according to any one of claims 1 to 4 on a carrier film.
- 請求項1~4のいずれか一項に記載の光硬化性熱硬化性樹脂組成物を、硬化して得られることを特徴とする硬化物。 A cured product obtained by curing the photocurable thermosetting resin composition according to any one of claims 1 to 4.
- 請求項5記載のドライフィルムの樹脂層を、硬化して得られることを特徴とする硬化物。 A cured product obtained by curing the resin layer of the dry film according to claim 5.
- 請求項6または7記載の硬化物を有することを特徴とする電子部品。 An electronic component comprising the cured product according to claim 6 or 7.
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JP2015059983A (en) * | 2013-09-17 | 2015-03-30 | 太陽インキ製造株式会社 | Photosensitive resin composition, dry film, cured product, and printed wiring board |
JP2017003967A (en) * | 2015-06-05 | 2017-01-05 | 太陽インキ製造株式会社 | Alkali developable resin composition, dry film, cured article and printed wiring board |
WO2019188591A1 (en) * | 2018-03-30 | 2019-10-03 | 太陽インキ製造株式会社 | Alkali developable photocurable thermosetting resin composition |
JP2019174787A (en) * | 2018-03-28 | 2019-10-10 | 太陽インキ製造株式会社 | Photosensitive resin composition, two-liquid type photosensitive resin composition, dry film and printed wiring board |
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JP2015059983A (en) * | 2013-09-17 | 2015-03-30 | 太陽インキ製造株式会社 | Photosensitive resin composition, dry film, cured product, and printed wiring board |
JP2017003967A (en) * | 2015-06-05 | 2017-01-05 | 太陽インキ製造株式会社 | Alkali developable resin composition, dry film, cured article and printed wiring board |
JP2019174787A (en) * | 2018-03-28 | 2019-10-10 | 太陽インキ製造株式会社 | Photosensitive resin composition, two-liquid type photosensitive resin composition, dry film and printed wiring board |
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