WO2022048667A1

WO2022048667A1 - Laser projection device

Info

Publication number: WO2022048667A1
Application number: PCT/CN2021/116727
Authority: WO
Inventors: 韩玉伟; 蔡文榜
Original assignee: 青岛海信激光显示股份有限公司
Priority date: 2020-09-07
Filing date: 2021-09-06
Publication date: 2022-03-10

Abstract

Disclosed is a laser projection device, belonging to the field of projection display. The device comprises: a housing, connecting posts provided within the housing, and at least two circuit boards provided within the housing and arranged in a stacked manner. A first end of each connecting post is connected to a first circuit board, and a second end is connected to a second circuit board. The first circuit board and the second circuit board are any two adjacent circuit boards in said at least two circuit boards.

Description

Laser Projection Equipment

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Chinese patent applications with application number 202010930193.6 and application number 202010929236.9 filed on September 07, 2020, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the field of projection display, in particular to a laser projection device.

Background technique

Laser projection equipment is an electronic device that integrates light, electricity, heat and structure. Usually, light refers to the optical light path, electricity refers to the circuit power supply and driving part, heat refers to the heat dissipation module, and structure refers to the above modules. Part arrangement and fixing, sealing, etc. In order to ensure the normal operation of the laser projection equipment, each module part cooperates with each other. When designing the structure, it is necessary to take into account the position and volume of each module. For example, if the optical engine is too large, the heat dissipation module will also increase accordingly, and the volume of the entire device will become very large. If the height of the stacked circuit board is too high If it is too high, it may be difficult to re-compress the thickness of the whole machine even after compressing the optical engine and heat dissipation module, which is not conducive to the development of ultra-thin and miniaturization of laser projection equipment.

SUMMARY OF THE INVENTION

An embodiment of the present application provides a laser projection device, comprising: a casing, a connection column located in the casing, and at least two circuit boards located in the casing and arranged in layers; wherein the first part of the connection column is One end is connected to the first circuit board, the second end is connected to the second circuit board, and the first circuit board and the second circuit board are any two adjacent circuit boards among the at least two circuit boards.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present disclosure more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

1 is a schematic diagram of a partial structure of a laser projection device provided by the related art;

2 is a schematic partial structure diagram of another laser projection device provided by the related art;

3 is a schematic diagram of a partial structure of another laser projection device provided by the related art;

4 is a schematic diagram of a partial structure of still another laser projection device provided by the related art;

5 is a schematic partial structure diagram of still another laser projection device provided by the related art;

6 is a schematic partial structure diagram of a laser projection device provided by some embodiments of the present application;

7 is a schematic partial structure diagram of another laser projection device provided by some embodiments of the present application;

8 is a schematic structural diagram of a connecting column provided by some embodiments of the present application;

9 is a cross-sectional view of a connecting column provided by some embodiments of the present application;

10 is a side view of a connecting column provided by some embodiments of the present application;

11 is a schematic partial structure diagram of another laser projection device provided by some embodiments of the present application;

FIG. 12 is a schematic partial structure diagram of still another laser projection device provided by some embodiments of the present application;

13 is a schematic structural diagram of a fixing member provided by some embodiments of the present application;

14 is a cross-sectional view of a fixing member provided by some embodiments of the present application;

15 is a side view of another fixing member provided by some embodiments of the present application;

16 is a schematic partial structure diagram of still another laser projection device provided by some embodiments of the present application;

FIG. 17 is a schematic partial structure diagram of still another laser projection device provided by some embodiments of the present application;

FIG. 18 is a schematic partial structure diagram of still another laser projection device provided by some embodiments of the present application;

FIG. 19 is a schematic partial structural diagram of still another laser projection apparatus provided by some embodiments of the present application.

detailed description

In order to make the objectives, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

1 to 5 are schematic structural diagrams of the related art. Referring to FIG. 1 , FIG. 2 , FIG. 3 , FIG. 4 and FIG. 5 , the laser projection device includes at least two circuit boards (Fig. Only the first circuit board 01 and the second circuit board 02) and the electronic components provided on each circuit board are shown.

In the related art, in order to avoid mutual influence of electronic devices on two adjacent circuit boards, the laser projection device is provided with a support frame 03 located in the housing 00 , and the support frame 03 includes a support plate 031 and at least two There are several connecting parts (the first connecting part 032 and the second connecting part 033 are shown in the figure), and the supporting plate 031 has a certain thickness. Each connecting portion is connected to one of the adjacent two circuit boards, and the connecting portion has a certain height.

However, since the support plate 031 has a certain thickness, and each connecting portion has a certain height, the height of the entire support frame 03 is relatively high, resulting in a relatively thick overall thickness of the laser projection device, which is not conducive to the ultra-high performance of the laser projection device. Light and ultra-thin development.

FIG. 6 is a schematic partial structure diagram of a laser projection device provided by an embodiment of the present disclosure. As shown in FIG. 6 , the laser projection apparatus includes a housing 0 , and an accommodating space is formed in the housing 0 . The laser projection apparatus further includes an optical engine 1 , a circuit part 2 , a heat dissipation part 3 and a sound box part 4 located in the accommodating space of the casing 0 .

In a possible embodiment, the optical engine 1 includes a laser light source, an optical machine, and a lens. In a possible implementation manner, the light source is a single-color laser light source, a two-color laser light source, or a three-color laser light source, which is used to provide a laser illumination beam. The laser beam provided by the light source enters the illumination light path part of the optical machine after being combined and shaped. The back end of the illumination light path is a digital micro-mirror device (DMD) array. In the digital light processing (DLP) projection architecture, the DMD chip is the core light modulation device. The DMD chip receives the driving control signal corresponding to the image signal, and flips the thousands of tiny mirrors on its surface to the positive or negative angle corresponding to the driving signal, and reflects the light beam irradiating the surface into the lens. The lens is used to project the image beam onto the projection screen, so as to realize the display of the projected image.

In a possible embodiment, the heat dissipation part 3 includes a plurality of fans and a plurality of water pumps, which are used to dissipate heat for each component in the laser projection apparatus. The sound box section 4 includes a speaker for realizing sound reproduction.

The circuit part 2 includes a plurality of circuit boards for providing the optical engine 1 with electrical driving signals, including power-supplied driving signals, such as power supply signals and driving signals.

The circuit unit 2 includes a plurality of circuit boards, wherein at least two circuit boards are stacked.

And, a metal bottom plate 21 is provided at the bottom of the housing 0 , and in a possible implementation manner, the metal bottom plate 21 is the ground end of the laser projection device. At least two stacked circuit boards in the circuit part 2 are connected to the metal base plate 21 so as to realize a common ground.

The above at least two circuit boards include a display circuit board and a TV signal board.

In addition, the plurality of circuit boards in the circuit part 2 further include a power supply board 22 , wherein the power supply board 22 is arranged below the above-mentioned at least two circuit boards stacked, that is, the power supply board 22 is arranged closer to the metal base plate 21 .

And, in a specific implementation, the power board 22 is fixedly connected to the metal base plate 21 through a metal bracket 23 due to the provision of a plurality of high-height electronic devices (such as coils, large resistors or capacitors, etc.).

The circuit part 2 shown in FIG. 6 also includes a connecting column (not shown), which penetrates through and connects the at least two circuit boards.

The connecting column is made of metal material, and can be connected to the metal base plate 21 to realize grounding.

FIG. 7 is a partial schematic diagram of another laser projection device provided by an embodiment of the present disclosure. As shown in FIG. 7 , the circuit portion 2 includes at least two circuit boards that are stacked in the accommodating space of the housing 0 . For simplicity, the following description will be given by taking the at least two circuit boards including two circuit boards as an example.

In a specific embodiment, the at least two circuit boards include a first circuit board 20 and a second circuit board 30 . The first circuit board 20 and the second circuit board 30 are any adjacent circuit boards among the at least two circuit boards, and the above-mentioned adjacent circuit boards refer to a relative positional relationship between upper and lower layers in spatial position.

In a possible embodiment, each of the first circuit board 20 and the second circuit board 30 is a printed circuit board (printed circuit board, PCB). A circuit board 20 is a TV signal board, and the second circuit board 30 is a display circuit board; in the DLP projection architecture, the display circuit board includes a DLP control system.

And, it should be noted that the first circuit board 20 and the second circuit board 30 are not limited to only refer to two circuit boards having an adjacent relationship, but also can be two groups of circuit boards, each group of circuit boards includes a plurality of circuit boards .

And, for convenience only, in the following example, the relative positional relationship between the first circuit board 20 and the second circuit board 30 may be that the first circuit board 20 is on the top and the second circuit board 30 is on the bottom.

In the partial exploded structural diagram shown in FIG. 7 , the connecting column 40 is used to connect and support the first circuit board 20 and the second circuit board 30 .

Wherein, each of the first circuit board 20 and the second circuit board 30 is provided with a through hole for allowing the connection post 40 to pass through.

There may be various ways of connecting the connecting post 40 to the first circuit board 20 and the second circuit board 30 .

In one possible embodiment, a connecting post 40 passes through each through hole. Specifically, one end of the connecting column 40 is connected to the first circuit board 20 , and the other end of the connecting column 40 penetrates the second circuit board 30 and is connected to the fixing member 50 , thereby realizing the connection with the second circuit board 30 . The fixing member 50 is fixedly disposed on the side of the second circuit board 30 away from the first circuit board 20 .

When the connecting posts connect three or more layers of circuit boards, the fixing member 50 may be provided on the side of the circuit board located at the lowermost layer away from other circuit boards.

Referring to FIG. 7 , the second circuit board 30 is provided with a through hole 301, and the other end of the connecting column 40 penetrates through the second circuit board 30 through the through hole 301 to realize the connection with the fixing member 50. In a possible implementation manner, the through hole 301 is a threaded hole, or an optical hole without threads.

The connecting post 40 and the fixing member 50 may be connected by clip connection, welding or screw connection.

In a possible implementation manner, the material of the connecting column 40 is a metal material, on the one hand, to ensure the stability of the connection between the connecting objects such as the first circuit board 20 and the second circuit board 30 . For example, the material of the connection pillars 40 may be copper, and the connection pillars 40 may be copper pillar structures with ribs. On the other hand, the connecting column 40 connects the objects to be connected, such as the first circuit board 20 and the second circuit board 30, and the grounding lines of the two circuit boards can be unified. The connection post 40 serves as a part of the ground line.

In the above connection manner, the fixing member 50 is welded or plugged on the second circuit board 30 . When the connecting posts are connected to circuit boards with three or more layers, the fixing member 50 can be soldered or plugged on the circuit board located on the lowermost layer.

And, in a possible implementation manner, the connection post 40 is connected with the first circuit board 20 by a screw thread. For example, one end of the connecting column 40 is provided with a first thread, specifically an external thread, the end passes through the through hole of the first circuit board 20 and is locked and connected by a first nut.

Alternatively, the first thread provided at one end of the connecting column 40 is an internal thread hole, and the end is passed through the through hole of the first circuit board 20 and then locked and connected by a first screw.

In a possible implementation, the laser projection device includes a plurality of connection posts 40 (only three connection posts 40 are shown in FIG. 7 ), and each connection post 40 is respectively connected to the first circuit board 20 and the second circuit board 30 connections. The first circuit board 20 and the second circuit board 30 are connected through a plurality of connecting posts 40, which improves the stability and reliability of the connection between the first circuit board and the second circuit board.

In some embodiments of the present application, since the other end of the connecting column 40 penetrates through the second circuit board 30 and is connected to the fixing member 50, the height between the first circuit board and the second circuit board is reduced, thereby reducing the laser projection The overall thickness of the device is thicker, and at the same time, the weight of the laser projection device is reduced, which is beneficial to the ultra-light and ultra-thin development of the laser projection device.

In the related art, two adjacent circuit boards are connected by a support frame, so that the height between the two adjacent circuit boards is relatively high, for example, usually 30 millimeters (mm). In some embodiments of the present application, the first circuit board 20 and the second circuit board 30 are connected by connecting posts 40. Since there is no need to provide a metal support frame between the two circuit boards, the metal The height between the circuit board 20 and the second circuit board 30 is reduced. In a possible implementation, the first circuit board 20 and the second circuit board 30 are reduced to 15 mm. Compared with the related art, in some embodiments of the present application, the height between any two adjacent circuit boards is reduced by 15 mm.

In the case of stacking at least two circuit boards, since any two adjacent circuit boards are connected by connecting posts, compared with the related art, any two adjacent circuit boards among the plurality of circuit boards are supported by metal. In some embodiments of the present application, any two adjacent circuit boards are connected by connecting posts, which reduces the stacking height of the circuit portion, optimizes the layout of the circuit boards, and compresses the internal space of the entire laser projection device. , reducing the occupation of the internal space of the laser projection device and reducing the overall thickness of the laser projection device. At the same time, the weight of the laser projection device is reduced, which is beneficial to the ultra-light and ultra-thin development of the laser projection device.

And, in some embodiments of the present application, both the first circuit board 20 and the second circuit board 30 are provided with electronic devices. Since the first circuit board 20 and the second circuit board 30 are connected by the connecting column 40, the height between the first circuit board 20 and the second circuit board 30 can be flexibly adjusted by adjusting the length of the connecting column 40, so that the first circuit board 20 and the second circuit board 30 can be flexibly adjusted. The height between the first circuit board 20 and the second circuit board 30 is greater than or equal to the safe height threshold between the two circuit boards. Therefore, it can be ensured that the electronic components on the first circuit board 20 and the electronic components on the second circuit board 30 do not affect each other, and the display effect of the laser projection device is ensured.

A laser projection device provided by the above-mentioned embodiment includes a connecting column, and the connecting column is used for connecting and supporting the stacked multilayer circuit boards, such as a first circuit board and a second circuit board. The first end of the connecting column penetrates the second circuit board and is connected to the fixing member, and the second end is screwed and connected to the first circuit board, which reduces the height between the first circuit board and the second circuit board, which is beneficial to reduce the laser projection equipment. The overall thickness or height is conducive to the development of ultra-thin and miniaturization of laser projection equipment.

For the above-mentioned case where the at least two circuit boards include multi-layer circuit boards, since any two adjacent circuit boards of the at least two circuit boards are connected by connecting posts, compared with the related art, the embodiments of the present disclosure can The connection post connects any two adjacent circuit boards, which further reduces the stacking height of the circuit part. Furthermore, the optimization of the circuit board arrangement is realized, the internal space of the entire laser projection device is compressed, the occupation of the internal space of the laser projection device is reduced, and the overall thickness of the laser projection device is reduced. Moreover, the weight of the laser projection device is reduced, which is beneficial to the lightening and ultra-thin development of the laser projection device.

In a possible implementation manner, the connecting posts 40 are respectively connected to the first circuit board 20 and the second circuit board 30 , so as to be connected to the ground of the laser projection device, so as to realize the common connection between the first circuit board 20 and the second circuit board 30 . ground, ensuring the safety of the circuit board and meeting EMC and other test standards.

And, in another possible implementation, the lowermost circuit board of the multi-layer circuit board connected by the connection post 40 is fixedly connected to the metal bracket of the power supply board, so that the connection post 40 serves as the grounding line of the multi-layer circuit board For example, the uppermost circuit board is connected to the lowermost circuit board through connecting posts, and the lowermost circuit board is connected to the metal bottom plate through a metal bracket to realize grounding.

In a specific implementation manner, the connecting post 40 is connected with the first circuit board 20 and the fixing member 50 by screws.

FIG. 8 is a schematic structural diagram of a connecting column provided by an embodiment of the present disclosure. FIG. 9 is a cross-sectional view of a connection column provided by an embodiment of the present disclosure, and FIG. 10 is a side view of a connection column provided by an embodiment of the present disclosure. As shown in FIG. 8 , FIG. 9 and FIG. 10 , one end of the connecting column 40 is provided with a first threaded hole 401 , and the other end is provided with an external thread 402 .

FIG. 11 is a schematic partial structural diagram of another laser projection device provided by some embodiments of the present application. As shown in FIG. 10 , the laser projection apparatus further includes a first screw 60 , a first through hole 701 is provided on the first circuit board 20 , and the first screw 60 passes through the first through hole 701 and is connected to the first threaded hole 401 , This realizes that the first circuit board 20 is connected to one end of the connecting column 40 .

In a possible implementation manner, the first through hole 701 is a threaded hole, or the first through hole 701 is an optical hole without threads.

In some embodiments of the present application, the laser projection apparatus includes a plurality of first screws 60 (only three first screws 60 are shown in FIG. 10 ), and the first circuit board 20 is provided with a plurality of first through holes 701 ( FIG. 10 shows only 3 first through holes 701). Each of the first screws 60 is connected to a first threaded hole 401 through a first through hole 701 , thereby improving the stability and reliability of the connection between the connecting post 40 and the first circuit board 20 .

FIG. 11 is a schematic partial structural diagram of another laser projection device provided by some embodiments of the present application. FIG. 12 is a schematic partial structural diagram of a laser projection apparatus provided by some embodiments of the present application. FIG. 13 is a schematic structural diagram of a fixing member provided by some embodiments of the present application. As shown in FIG. 11 , FIG. 12 and FIG. 13 , the fixing member 50 is provided with a second threaded hole 403 , and one end of the connecting column 40 is connected with the second threaded hole 403 .

Fig. 14 is a cross-sectional view of a fixing member provided by some embodiments of the present application, and Fig. 15 is a side view of another fixing member provided by some embodiments of the present application. Referring to FIGS. 11 to 15 , the second circuit board 30 is provided with a second through hole 702 and a third through hole 703 . The fixing member 50 includes a body 501 and pins 502 connected to the body 501 .

The body 501 is located on the side of the second circuit board 30 away from the first circuit board 20 , and the body 501 is provided with a second threaded hole 403 , and the other end of the connecting post 40 passes through the second through hole 702 and the second threaded hole 403 connect. The pins 502 are connected to the side of the second circuit board 30 close to the first circuit board 20 through the third through holes 703 , thereby realizing the connection between the fixing member 50 and the second circuit board 30 .

In a possible implementation manner, the second through hole 702 and the third through hole 703 are both threaded holes, or both the second through hole 702 and the third through hole 703 are light holes without threads. The second through hole 702 is the above-mentioned through hole 301 .

Referring to Figure 13, the fixture 50 includes a plurality of pins 502 (only four pins 502 are shown in Figure 13).

Referring to FIGS. 11 and 12 , the second circuit board 30 is provided with a plurality of third through holes 703 corresponding to the plurality of pins 502 (only four third through holes 703 are shown in FIGS. 11 and 12 ), and many The third through holes 703 surround the second through holes 702 .

FIG. 16 is a schematic partial structural diagram of still another laser projection device provided by some embodiments of the present application. Referring to FIG. 16 , each pin 502 is connected to a side of the second circuit board 30 close to the first circuit board 20 through a corresponding third through hole 703 .

In some embodiments of the present application, since the fixing member 50 includes a plurality of pins 502, the second through holes 702 surrounded by a plurality of third through holes 703 are provided on the second circuit board 30, and each pin 502 passes through a corresponding A third through hole 703 is connected to the side of the second circuit board 30 close to the first circuit board 20, thereby improving the stability and reliability of the connection between the fixing member and the second circuit board.

In a possible implementation manner, each pin 502 passes through a corresponding third through hole 703 and is welded to the side of the second circuit board 30 close to the first circuit board 20 .

FIG. 17 is a schematic partial structure diagram of still another laser projection apparatus provided by some embodiments of the present application. As shown in FIG. 17 , the second circuit board 30 is provided with a plurality of second through holes 702 (only one second through hole is schematically indicated in FIG. 17 ), and a third through hole surrounding the second through hole 702 hole 703. The fixing member 50 passes through a plurality of third through holes 703 from a side close to the first circuit board 20 , and is further connected to the second circuit board 30 . In a possible implementation manner, the fixing member 50 is fixed on the second circuit board 30 by spot welding, and the connection method between the fixing member 50 and the second circuit board 30 is not limited in this application. The connecting post 40 passes through the fixing member 50 and is connected to the second through hole 702 , and then is connected to the second circuit board 30 ; the first screw 60 passes through the first through hole 701 and is connected to the connecting post 40 . The first circuit board 20 and the second circuit board 30 are connected through the above connection manner.

In a possible implementation manner, the first end of the connecting column is provided with a first threaded hole, and the first screw 60 is connected to the connecting column through the first threaded hole; The end is provided with an external thread, and the connecting post is connected with the second through hole 702 through the external thread. It should be noted that, in other possible implementation manners, the connection between the screw 60 and the connection post may be in other ways, and the connection between the connection post and the second through hole 702 may be in other ways, which are not limited in this application.

In some embodiments of the present application, surface mounted technology (SMT) can be used to pass each pin 502 through a corresponding third through hole 703 and the second circuit board 30 close to the first circuit board 20 Welded on one side.

And, in another connection method, taking the connecting post connecting two layers of circuit boards as an example, both ends of the connecting post are provided with external threads or internal threads, and each layer of the two-layer circuit boards is provided with through holes, and the connecting posts are provided with external threads or internal threads. Pass through the through holes of each layer of the circuit board, and use each nut or screw to lock the layer of the circuit board.

Furthermore, when the connection post is connected to the three-layer circuit board, based on the above-mentioned connection method for connecting the two-layer circuit board, a third thread can be provided in the middle position between the two ends of the connection post, and the third thread is an external thread. The connecting post also passes through the through hole of the other circuit board, and the third thread is locked and connected with the third nut.

FIG. 18 is a schematic partial structural diagram of still another laser projection device provided by some embodiments of the present application. FIG. 19 is a schematic partial structural diagram of still another laser projection apparatus provided by some embodiments of the present application. As shown in FIGS. 18 and 19 , the at least two circuit boards include a display circuit board 90 , a correction circuit board 91 , a switch circuit board 92 , a first TV signal board 93 and a second TV signal board 94 .

In a possible implementation manner, the display circuit board 90 , the correction circuit board 91 , and the switching circuit board 92 are sequentially stacked on the first TV signal main board 93 . Alternatively, the display circuit board 90 , the correction circuit board 91 and the switching circuit board 92 are sequentially stacked on the second TV signal main board 94 , and the display circuit board 90 and the first TV signal main board 93 are arranged on the same layer.

In some embodiments of the present application, the first circuit board 20 and the second circuit board 30 are the display circuit board 90 , the correction circuit board 91 , the switching circuit board 92 , the first TV signal main board 93 and the second TV signal main board 94 any two adjacent circuit boards. That is, any two adjacent circuit boards among the display circuit board 90 , the correction circuit board 91 , the switching circuit board 92 , the first TV signal main board 93 and the second TV signal main board 94 can be connected by connecting posts.

In a possible implementation, referring to FIGS. 18 and 19 , the first circuit board is a display circuit board 90 , and the second circuit board is a correction circuit board 91 . Alternatively, the first circuit board is the correction circuit board 91 , and the second circuit board is the transition circuit board 92 . Alternatively, the first circuit board is the switching circuit board 92 , and the second circuit board is the first TV signal main board 93 . Alternatively, the first circuit board is the first TV signal main board 93 , and the second circuit board is the second TV signal main board 94 .

It should be noted that the at least two circuit boards in some embodiments of the present application may further include a display circuit board 90 , a correction circuit board 91 , a switching circuit board 92 , a first TV signal motherboard 93 and a second TV signal other than the above-mentioned display circuit board 90 . For other circuit boards other than the main board 94, the embodiments of the present application do not limit the types of the at least two circuit boards.

Referring to FIGS. 18 and 19 , the laser projection apparatus further includes a base plate 95 , a power supply board 96 and a metal support frame 97 . Wherein, the bottom plate 95 in this example acts similarly to the metal bottom plate 21 in FIG. 6 , and the metal support frame 97 acts similarly to the metal bracket 23 in FIG. 6 .

The bottom plate 95 , the power board 96 , the metal support frame 97 and at least two circuit boards are sequentially stacked and arranged between the lower casing 001 and the upper casing 002 . Wherein, the metal support frame 97 is connected with the bottom plate 95, and forms an accommodating space, and the power board 96 is located in the accommodating space. The metal support frame 97 is also connected to the second TV signal main board 94 of the at least two circuit boards.

Since the power board 96 has many electronic devices with high power, the accommodating space formed by the metal support frame 97 and the bottom plate 95 can ensure a safe distance between the power board 96 and the second TV signal board 94, and avoid the power board 96 The electronics on the device are affected to ensure the normal operation of the laser projection equipment.

In a possible implementation manner, the material of the bottom plate 95 is a metal material, such as iron. Since the material of the bottom plate 95 is a metal material, the bottom plate 95 can absorb electromagnetic signals transmitted to its surface. Referring to FIG. 18, the display circuit board 90, the correction circuit board 91, the switching circuit board 92, the first TV signal main board 93, the second TV signal main board 94, the metal support frame 97 and the power supply board 96 are sequentially connected to the bottom plate 95, This achieves the effect of grounding at least two circuit boards.

Compared with the higher height between two adjacent circuit boards in the technology, the difference between the first circuit board and the second circuit board adjacent to the at least two circuit boards in the laser projection device provided by the embodiments of the present application is The height of the circuit board is reduced, so the electromagnetic signals generated by the electronic devices on the first circuit board and the electronic devices on the second circuit board can be transmitted to the bottom plate more, avoiding the occurrence of high heights between two adjacent circuit boards. As a result, more electromagnetic signals are not transmitted to the base plate and are radiated outside the casing of the projection device, thereby reducing the radiation to the user.

In the case where the at least two circuit boards include three or more circuit boards, since the height between the adjacent first circuit boards and the second circuit boards is reduced, compared with the related art, the embodiments of the present disclosure provide The laser projection device can transmit more electromagnetic signals generated by electronic devices on a plurality of circuit boards to the base plate 95, thereby further reducing radiation to users.

In some embodiments of the present application, the first TV signal mainboard 93 and the second TV signal mainboard 94 are mainly used to decode and decode external audio and video signals. The second TV signal mainboard 94 is provided with a system on chip (SoC) 61, which can decode data in different data formats into a normalized format. The data in the normalized format is transmitted to the first TV signal mainboard 93 through the connector, and the first TV signal mainboard 93 transmits the data in the normalized format to the display circuit board 90 . For example, the data in the normalized format is a video image signal.

In an embodiment, the display circuit board 90 is provided with an algorithm processing module field programmable gate array (field programmable gate array, FPGA) and a main control chip. The algorithm processing module FPGA is used to process the video image signal input by the first TV signal main board 93, such as performing motion estimation and motion compensation (Motion Estimation and Motion Compensation, MEMC) frequency doubling processing, or image correction, etc. for image enhancement function realization. The main control chip is connected with the algorithm processing module FPGA, and is used for receiving the processed video image processing signal data as the image data to be displayed. It should be noted that the algorithm processing module FPGA usually exists as an enhanced function module. In some low-cost solutions, this module part may not be provided. The main control chip is connected to the first TV signal motherboard 93, and the main control chip receives the first TV signal. A video image display signal output from the TV signal main board 93 .

The switching circuit board 92 is used to convert the format of the signal transmitted by the first TV signal main board 93 , and transmit the converted image to the correction circuit board 91 . The correction circuit board 91 is used to correct the projection position of the image. The power supply board 96 can be used for each of the optical engine 1 , the heat dissipation part 3 , the sound box part 4 , the display circuit board 90 , the correction circuit board 91 , the switching circuit board 92 , the first TV signal board 93 and the second TV signal board 94 . The device or part of the module is powered to ensure the normal power supply of each part of the laser projection equipment.

In some embodiments of the present application, the laser projection device is a laser projection television.

In the related art, since any two adjacent circuit boards among the plurality of circuit boards are connected by a support frame, the stacking height of the plurality of circuit boards is relatively high, and the internal space of the laser projection equipment is occupied greatly. The overall thickness of the laser projection equipment is thicker, and the weight of the laser projection equipment is heavier. At the same time, due to the high mold cost of the support frame, the manufacturing cost of the laser projection equipment is high.

However, in the embodiment of the present disclosure, the adjacent first circuit boards and the second circuit boards are connected by connecting posts, which reduces the height between the first circuit board and the second circuit board, thereby reducing the overall thickness of the laser projection device. At the same time, the weight of the laser projection device is reduced, which is beneficial to the ultra-light and ultra-thin development of the laser projection device.

Since any two adjacent circuit boards among the plurality of circuit boards are connected by connecting posts, compared with the related art, any two adjacent circuit boards among the plurality of circuit boards are connected by a support frame. In the embodiment of the present disclosure, any two adjacent circuit boards are connected by connecting posts, which reduces the stacking height of multiple circuit boards, realizes the optimization of circuit board layout, compresses the internal space of the entire laser projection device, and reduces the need for laser projection. The occupation of the internal space of the device reduces the overall thickness of the laser projection device, and at the same time reduces the weight of the laser projection device, which is beneficial to the ultra-light and ultra-thin development of the laser projection device.

Compared with the use of a support frame to connect the first circuit board and the second circuit board in the related art, the embodiment of the present disclosure connects the adjacent first circuit board and the second circuit board through the connecting column, which reduces the manufacturing cost and saves the cost of opening. mold time.

In addition, for different laser projection devices, connection posts with different heights can be used, so that they can be applied to different circuit boards, and the connection posts have high versatility.

Moreover, since the height of the part of the connecting column between the first circuit board and the second circuit board is greater than or equal to the safety height threshold, it is ensured that the electronic device on the first circuit board and the electronic device on the second circuit board are not connected to each other. will affect each other, thus ensuring the display effect of the laser projection equipment.

In addition, the connecting column is made of metal material, which not only connects and supports the adjacent two-layer circuit boards, but also forms a communication path for the grounding lines of the adjacent circuit boards, so that both the uppermost layer and the middle layer of the circuit board are connected. A metal connection post can be used to form a part of the grounding line, and finally connect to the grounded metal bottom plate of the laser projection equipment, so as to facilitate the common ground of the multi-layer circuit board and ensure the safety and working requirements of the multi-layer circuit board. There is no need to set a special ground point on the circuit board, and set a special metal piece to connect to the metal base plate of the device for common grounding, which saves the use of components, and also avoids the structural interference or possible increase in volume caused by additional components. space problem.

To sum up, the laser projection equipment of the above-mentioned embodiments includes a connecting column, which is used to support the multilayer circuit boards arranged in layers. The metal support frame can reduce the height between two adjacent layers of circuit boards, thereby reducing the overall thickness of the laser projection equipment and facilitating the ultra-thin development of the laser projection equipment.

In the case where the at least two circuit boards include three or more circuit boards, any two adjacent circuit boards among the at least two circuit boards may be connected by connecting posts. Therefore, compared with the related art, the embodiment of the present disclosure connects any two adjacent circuit boards through connecting posts, which further reduces the stacking height of the circuit portion, compresses the internal space of the entire laser projection device, and realizes the arrangement of circuit boards. The optimization reduces the occupation of the internal space of the laser projection equipment and reduces the overall thickness of the laser projection equipment. At the same time, the weight of the laser projection device is reduced, which is beneficial to the ultra-light and ultra-thin development of the laser projection device.

On the other hand, the connecting column is made of metal material, which can also function as a conducting circuit for the common ground between the circuit boards of each layer while connecting and supporting, so as to realize the common ground between the circuit boards arranged in layers. There is no need to set a special ground point on the circuit board, and set a special metal piece to connect to the metal base plate of the device for common grounding, which saves the use of components, and also avoids the structural interference or possible increase in volume caused by additional components. space problem.

In the embodiments of the present disclosure, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance. The term "plurality" refers to two or more.

The above are only optional embodiments of the present disclosure, and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection of the present disclosure. within the range.

Claims

A laser projection device, comprising: a casing, a connecting column located in the casing, and at least two circuit boards located in the casing and arranged in layers;

Wherein, the first end of the connecting column is connected to the first circuit board, the second end is connected to the second circuit board, and the first circuit board and the second circuit board are any of the at least two circuit boards. two adjacent circuit boards.
The laser projection apparatus according to claim 1, wherein a height of a portion of the connecting post located between the first circuit board and the second circuit board is greater than or equal to a safe height threshold.
The laser projection apparatus according to claim 1, wherein the connecting post is connected with the first circuit board or the second circuit board by screws.
The laser projection device according to claim 3, wherein the laser projection device further comprises a screw; the first circuit board has a first through hole, and the screw passes through the first through hole and is connected to the connection post connect.
The laser projection apparatus according to claim 3, wherein a through hole is formed on the second circuit board, and the second end of the connection post is connected with the through hole.
The laser projection apparatus of claim 1, wherein a first end of the connecting column has a first threaded hole, and a second end has an external thread.
The laser projection apparatus according to claim 1, wherein the laser projection apparatus further comprises a fixing member, and the fixing member is connected with the second circuit board.
The laser projection apparatus according to claim 7, wherein the fixing member has a second threaded hole, and the connecting post is connected with the second threaded hole.
The laser projection apparatus according to claim 8, wherein the second circuit board has a second through hole, and the second end of the connection post is connected to the fixing member through the second through hole.
The laser projection apparatus according to claim 7, wherein the fixing member has a plurality of pins, the second circuit board has a plurality of third through holes, the pins pass through the third through holes and the The second circuit board is connected.
The laser projection apparatus of claim 10, wherein the third through hole is disposed around the second through hole.
The laser projection apparatus according to claim 1, wherein the laser projection apparatus further comprises a metal base plate, and the connection post communicates with the metal base plate to realize grounding.
The laser projection apparatus according to claim 1, wherein the at least two circuit boards include a power board, and the power board is fixed by a metal bracket fixedly connected to the metal base plate.
The laser projection apparatus according to claim 7, wherein the fixing member is connected to the second circuit board by means of spot welding.
The laser projection apparatus according to claim 1, wherein the connecting column is a metal material.