CN213276224U

CN213276224U - Laser projection device

Info

Publication number: CN213276224U
Application number: CN202021947862.2U
Authority: CN
Inventors: 韩玉伟; 蔡文榜
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2020-09-07
Filing date: 2020-09-07
Publication date: 2021-05-25
Anticipated expiration: 2030-09-07

Abstract

The application discloses laser projection equipment belongs to the projection display field. The laser projection device comprises a connecting column, wherein the connecting column is used for supporting a first circuit board and a second circuit board which are arranged in a stacked mode. The other end of the connecting column penetrates through the second circuit board to be connected with the fixing piece. Therefore, the height between the first circuit board and the second circuit board is reduced, the overall thickness of the laser projection equipment is further reduced, and the ultra-thin development of the laser projection equipment is facilitated.

Description

Laser projection device

Technical Field

The present disclosure relates to the field of projection display, and more particularly, to a laser projection apparatus.

Background

The laser projection device may include a housing, at least two circuit boards stacked within the housing. Because the height of two adjacent circuit boards in at least two circuit boards is higher, the whole thickness of the laser projection equipment is caused, and the ultra-thin development of the laser projection equipment is not facilitated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the disclosure provides a laser projection device, which can solve the problem that the whole thickness of the laser projection device in the related art is not beneficial to the ultra-thin development of the laser projection device. The technical scheme is as follows:

in one aspect, a laser projection apparatus is provided, the laser projection apparatus comprising: a housing having an accommodating space formed therein;

at least two circuit boards which are arranged in the accommodating space in a stacked mode, wherein the at least two circuit boards comprise a first circuit board and a second circuit board;

and the connecting column and the fixing piece are arranged in the accommodating space, the fixing piece is fixed on one side, away from the first circuit board, of the second circuit board, one end of the connecting column is connected with the first circuit board, and the other end of the connecting column penetrates through the second circuit board and is connected with the fixing piece.

Optionally, the connecting column is connected with the first circuit board and the fixing piece through threads.

Optionally, one end of the connecting column is provided with a first threaded hole;

the laser projection apparatus further includes: the screw, be provided with first through-hole on the first circuit board, the screw passes first through-hole with first screw hole is connected.

Optionally, the other end of the connecting column is provided with an external thread, the fixing piece is provided with a second threaded hole, and the other end of the connecting column is connected with the second threaded hole.

Optionally, a second through hole and a third through hole are arranged on the second circuit board, and the fixing member includes: the fixing plate and the pins connected with the fixing plate;

the fixing plate is positioned on one side of the second circuit board, which is far away from the first circuit board, the fixing plate is provided with the second threaded hole, and the other end of the connecting column penetrates through the second through hole to be connected with the second threaded hole;

the pins penetrate through the third through holes and are connected with one side, close to the first circuit board, of the second circuit board.

Optionally, the fixing member includes a plurality of pins, the second circuit board is provided with a plurality of third through holes corresponding to the pins, and the plurality of third through holes surround the second through holes;

each pin penetrates through one corresponding third through hole to be connected with one side, close to the first circuit board, of the second circuit board.

Optionally, the laser projection device comprises a plurality of connecting columns.

Optionally, the connecting column is made of a metal material.

Optionally, the at least two circuit boards include: display circuit board, correction circuit board, switching circuit board, first mainboard and second mainboard.

Optionally, the housing includes: upper casing and lower casing that relative setting, laser projection equipment still includes: the power supply comprises a bottom plate, a power supply plate and a support frame;

the bottom plate, the power panel, the support frame and the at least two circuit boards are sequentially stacked between the lower shell and the upper shell.

The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure at least comprise:

the embodiment of the present disclosure provides a laser projection apparatus including a connection column for supporting a first circuit board and a second circuit board which are stacked. The other end of the connecting column penetrates through the second circuit board to be connected with the fixing piece, so that the electronic device on the first circuit board and the electronic device on the second circuit board are not influenced mutually.

In addition, a support frame is not required to be arranged between the first circuit board and the second circuit board, so that the height between the first circuit board and the second circuit board is reduced, the overall thickness of the laser projection equipment is further reduced, and the ultra-thin development of the laser projection equipment is facilitated.

In the case that the at least two circuit boards include three or more layers, any two adjacent circuit boards of the at least two circuit boards may be connected by the connection post. Therefore, compared with the related art, the embodiment of the disclosure connects any two adjacent circuit boards through the connecting column, further reduces the stacking height of the circuit part, compresses the internal space of the whole laser projection device, reduces the occupation of the internal space of the laser projection device, and reduces the overall thickness of the laser projection device. Meanwhile, the weight of the laser projection equipment is reduced, and the ultra-light and ultra-thin development of the laser projection equipment is facilitated.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a partial structural schematic diagram of a laser projection apparatus provided in the related art;

fig. 2 is a partial schematic structural view of another laser projection apparatus provided in the related art;

fig. 3 is a partial structural schematic view of still another laser projection apparatus provided in the related art;

fig. 4 is a partial structural schematic view of still another laser projection apparatus provided in the related art;

fig. 5 is a partial structural schematic view of still another laser projection apparatus provided in the related art;

fig. 6 is a schematic partial structural diagram of a laser projection apparatus provided in an embodiment of the present disclosure;

FIG. 7 is a schematic partial structure diagram of another laser projection apparatus provided in the embodiments of the present disclosure;

FIG. 8 is a schematic structural diagram of a connecting column according to an embodiment of the present disclosure;

FIG. 9 is a cross-sectional view of a connecting stud provided by an embodiment of the present disclosure;

FIG. 10 is a side view of a connecting stud provided by an embodiment of the present disclosure;

FIG. 11 is a schematic view of a partial structure of another laser projection apparatus provided in an embodiment of the present disclosure;

FIG. 12 is a schematic view of a partial structure of another laser projection apparatus provided in an embodiment of the present disclosure;

FIG. 13 is a schematic structural view of a fastener provided in accordance with an embodiment of the present disclosure;

FIG. 14 is a cross-sectional view of a fastener provided in accordance with an embodiment of the present disclosure;

FIG. 15 is a side view of another fastener provided in accordance with an embodiment of the present disclosure;

FIG. 16 is a schematic view of a partial structure of another laser projection apparatus provided in an embodiment of the present disclosure;

fig. 17 is a schematic partial structure diagram of another laser projection apparatus provided in an embodiment of the present disclosure;

fig. 18 is a schematic partial structural diagram of another laser projection apparatus provided in an embodiment of the present disclosure.

Detailed Description

To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

Referring to fig. 1, 2, 3, 4, and 5, in the related art, the laser projection apparatus may include at least two circuit boards (only a first circuit board 01 and a second circuit board 02 are shown) stacked within the housing 00, and electronic devices provided on each circuit board.

In the related art, in order to avoid the electronic devices on two adjacent circuit boards from affecting each other, the laser projection apparatus may further include a support frame 03 located in the housing 00, wherein the support frame 03 includes a support plate 031 and at least two connecting portions (a first connecting portion 032 and a second connecting portion 033 are shown) connected to the support plate 031, and the support plate 031 has a certain thickness. Each connecting part is connected with one of the two adjacent circuit boards, and the connecting parts have certain heights.

However, since the supporting plate 031 has a certain thickness and each connecting portion has a certain height, the height of the whole supporting frame 03 is high, so that the whole thickness of the laser projection device is thick, and the ultra-light and ultra-thin development of the laser projection device is not facilitated.

Fig. 6 is a schematic partial structural diagram of a laser projection apparatus provided in an embodiment of the present disclosure. As shown in fig. 6, the laser projection apparatus may include a housing 0, and an accommodating space is formed in the housing 0. The laser projection apparatus further includes an optical engine part 1, a circuit part 2, a heat dissipation part 3, and a sound box part 4 in the accommodating space of the housing 0.

The optical engine part 1 may include a laser source, an optical engine, and a lens. The light source can be a monochromatic laser light source, a bicolor laser light source or a tricolor laser light source and is used for providing laser illumination light beams. The laser beam provided by the light source is incident to the illumination light path part in the optical machine after light combination and shaping. The rear end of the illumination light path part is a digital micro-mirror device (DMD) array, and in a Digital Light Processing (DLP) projection architecture, a DMD chip is a core light modulation device. The DMD chip receives a driving control signal corresponding to an image signal, and turns over thousands of tiny mirrors on the surface of the DMD chip at a positive angle or a negative angle corresponding to the driving signal, so that light beams irradiating the surface of the DMD chip are reflected into a lens. The lens is used for projecting the image light beam to the projection screen, so that the display of the projection image is realized.

The heat dissipation part 3 may include a plurality of fans and a plurality of water pumps for dissipating heat from the respective components in the laser projection apparatus. The speaker portion 4 may include a speaker for playing sound.

Fig. 7 is a partial schematic view of another laser projection device provided by embodiments of the present disclosure. As shown in fig. 7, the circuit part 2 may include at least two circuit boards stacked and disposed in the receiving space of the case 0, the at least two circuit boards including a first circuit board 20 and a second circuit board 30. The first circuit board 20 and the second circuit board 30 are any adjacent two of the at least two circuit boards. Alternatively, each of the first circuit board 20 and the second circuit board 30 may be a Printed Circuit Board (PCB).

And a connecting column 40 and a fixing member 50 arranged in the accommodating space, wherein the fixing member 50 is fixed on one side of the second circuit board 30 far away from the first circuit board 20.

One end of the connecting column 40 is connected to the first circuit board 20, and the other end of the connecting column 40 penetrates through the second circuit board 30 to be connected to the fixing member 50, thereby realizing connection to the second circuit board 30. Referring to fig. 7, a through hole 301 may be formed on the second circuit board 30, and the other end of the connection post 40 penetrates through the second circuit board 30 through the threaded hole 301 to be connected to the fixing member 50. The through hole 301 may be a threaded hole or an unthreaded hole that is not provided with a thread.

Optionally, the material of the connecting column 40 is a metal material, thereby ensuring the stability of the connection between the first circuit board and the second circuit board. For example, the material of the connecting stud 40 may be copper. Alternatively, the material of the fixing member 50 may be a metal material.

Alternatively, the laser projection device may include a plurality of connection posts 40 (only 3 connection posts 40 are shown in fig. 7), each connection post 40 being connected to the first and

second circuit boards

20 and 30, respectively. The first circuit board 20 and the second circuit board 30 are connected by a plurality of connection posts 40, so that the stability and reliability of the connection of the first circuit board and the second circuit board are improved.

In the embodiment of the present disclosure, since the other end of the connecting column 40 penetrates through the second circuit board 30 to be connected to the fixing member 50, the height between the first circuit board and the second circuit board is reduced, and thus the overall thickness of the laser projection apparatus is reduced, and the weight of the laser projection apparatus is reduced, which is beneficial to the ultra-light and ultra-thin development of the laser projection apparatus.

In the related art, two adjacent circuit boards are connected through a support frame, and each circuit board needs to be supported by a metal support frame, and the metal support frames need to be connected with each other, so that the height between the two adjacent circuit boards is high, for example, 30 millimeters (mm) can be achieved. The embodiment of the present disclosure connects the first circuit board 20 and the second circuit board 30 through the connection post 40, and since there is no need to provide a support frame between the two circuit boards, the height between the first circuit board 20 and the second circuit board 30 can be reduced, for example, 15 mm. Compared with the related art, the height between any two adjacent circuit boards in the embodiment of the disclosure is reduced by 15 mm.

In the case that the at least two circuit boards include three or more circuit boards, since any two adjacent circuit boards are connected by the connection post, compared with the case that any two adjacent circuit boards in the plurality of circuit boards are connected by the support frame in the related art. According to the laser projection device, any two adjacent circuit boards are connected through the connecting column, the stacking height of the circuit part is reduced, the internal space of the whole laser projection device is compressed, the occupation of the internal space of the laser projection device is reduced, and the overall thickness of the laser projection device is reduced. Meanwhile, the weight of the laser projection equipment is reduced, and the ultra-light and ultra-thin development of the laser projection equipment is facilitated.

The first circuit board 20 and the second circuit board 30 in the embodiments of the present disclosure may each have electronic devices disposed thereon. Since the first circuit board 20 and the second circuit board 30 are connected through the connection post 40, the height between the first circuit board 20 and the second circuit board 30 can be flexibly adjusted by adjusting the length of the connection post 40, so that the height between the first circuit board 20 and the second circuit board 30 is greater than or equal to the safety height threshold value between the two circuit boards. Therefore, the electronic devices on the first circuit board 20 and the electronic devices on the second circuit board 30 can be ensured not to influence each other, and the display effect of the laser projection equipment is ensured.

In summary, embodiments of the present disclosure provide a laser projection apparatus including a connection column for supporting a first circuit board and a second circuit board that are stacked. Because the other end of this spliced pole runs through the second circuit board and is connected with this mounting, consequently reduced the height between first circuit board and the second circuit board, and then reduced laser projection equipment's whole thickness, be favorable to laser projection equipment's ultra-thin development.

For the case that the at least two circuit boards include the multilayer circuit board, since any two adjacent circuit boards in the at least two circuit boards are connected by the connection column, compared with the related art, the embodiment of the disclosure connects any two adjacent circuit boards by the connection column, and the stacking height of the circuit part is further reduced. Furthermore, the internal space of the whole laser projection equipment is compressed, the occupation of the internal space of the laser projection equipment is reduced, and the overall thickness of the laser projection equipment is reduced. And moreover, the weight of the laser projection equipment is reduced, and the ultra-light and ultra-thin development of the laser projection equipment is facilitated.

Alternatively, the connection post 40 and the first circuit board 20 and the fixing member 50 may be connected by screw.

Fig. 8 is a schematic structural diagram of a connection column according to an embodiment of the present disclosure. Fig. 9 is a cross-sectional view and fig. 10 is a side view of a connection column provided in accordance with an embodiment of the present disclosure. As shown in fig. 8, 9 and 10, the connecting post 40 is provided with a first threaded hole 401 at one end and an external thread 402 at the other end.

Fig. 11 is a partial schematic structural diagram of another laser projection apparatus provided in an embodiment of the present disclosure. As shown in fig. 11, the laser projection apparatus may further include a screw 60, the first circuit board 20 is provided with a first through hole 701, and the screw 60 passes through the first through hole 701 to be connected with the first threaded hole 401, thereby enabling the first circuit board 20 to be connected with one end of the connection post 40.

Optionally, the first through hole 701 may be a threaded hole, or the first through hole 701 may also be a light hole without threads.

In the embodiment of the present disclosure, the laser projection apparatus may include a plurality of screws 60 (only 3 screws 60 are shown in fig. 11), and a plurality of first through holes 701 (only 3 first through holes 701 are shown in fig. 11) may be provided on the first circuit board 20. Each screw 60 is connected to one first screw hole 401 through one first through hole 701, thereby improving the stability and reliability of the connection post 40 to the first circuit board 20.

Fig. 12 is a schematic partial structural diagram of another laser projection apparatus provided in an embodiment of the present disclosure. Fig. 13 is a schematic structural diagram of a fixing element provided in an embodiment of the present disclosure. As shown in fig. 11, 12 and 13, the fixing member 50 is provided with a second screw hole 403, and the other end of the connecting pole 40 is connected with the second screw hole 403.

Fig. 14 is a cross-sectional view of a fixing member provided in an embodiment of the present disclosure, and fig. 15 is a side view of another fixing member provided in an embodiment of the present disclosure. Referring to fig. 11 to 15, the second circuit board 30 is provided with a second through hole 702 and a third through hole 703. The fixing member 50 may include a fixing plate 501 and pins 502 connected to the fixing plate 501.

The fixing plate 501 is located on a side of the second circuit board 30 away from the first circuit board 20, a second threaded hole 403 is formed in the fixing plate 501, and the other end of the connecting stud 40 passes through the second through hole 702 and is connected with the second threaded hole 403. The pins 502 are connected to the side of the second circuit board 30 close to the first circuit board 20 through the third through holes 703, thereby connecting the fixing member 50 to the second circuit board 30.

Optionally, the second through hole 702 and the third through hole 703 may be both threaded holes, or the second through hole 702 and the third through hole 703 may also be both unthreaded holes without threads. The second through hole 702 is the through hole 301.

Referring to fig. 13, the fixture 50 may include a plurality of pins 502 (only 4 pins 502 are shown in fig. 13).

Referring to fig. 11 and 12, a plurality of third through holes 703 corresponding to the plurality of pins 502 are provided on the second circuit board 30 (only 4 third through holes 703 are shown in fig. 11 and 12), and the plurality of third through holes 703 surround the second through holes 702.

Fig. 16 is a partial schematic structural diagram of another laser projection apparatus provided in the embodiment of the present disclosure. Referring to fig. 16, each pin 502 passes through a corresponding one of the third through holes 703 to connect to a side of the second circuit board 30 adjacent to the first circuit board 20.

In the embodiment of the present disclosure, since the fixing member 50 may include a plurality of pins 502, a plurality of third through holes 703 provided on the second circuit board 30 surround the second through holes 702, and each pin 502 passes through a corresponding one of the third through holes 703 to be connected to a side of the second circuit board 30 close to the first circuit board 20, thereby improving stability and reliability of connection between the fixing member and the second circuit board.

Optionally, each pin 502 is soldered to the side of the second circuit board 30 close to the first circuit board 20 through a corresponding third through hole 703.

In the embodiment of the present disclosure, each pin 502 may be soldered to the side of the second circuit board 30 close to the first circuit board 20 through a corresponding one of the third through holes 703 by using Surface Mount Technology (SMT).

Fig. 17 is a schematic partial structure diagram of another laser projection apparatus provided in an embodiment of the present disclosure. Fig. 18 is a schematic partial structural diagram of another laser projection apparatus provided in an embodiment of the present disclosure. The at least two circuit boards may include a display circuit board 90, a correction circuit board 91, a relay circuit board 92, a first main board 93, and a second main board 94 as shown in fig. 17 and 18.

Alternatively, the display circuit board 90, the correction circuit board 91, and the relay circuit board 92 may be sequentially stacked on the first main board 93. Alternatively, the display circuit board 90, the calibration circuit board 91 and the adapting circuit board 92 may be sequentially stacked on the second main board 94, and the display circuit board 90 and the first main board 93 are disposed on the same layer.

In the embodiment of the present disclosure, the first circuit board 20 and the second circuit board 30 may be any adjacent two of the display circuit board 90, the correction circuit board 91, the relay circuit board 92, the first main board 93 and the second main board 94. That is, any two adjacent circuit boards of the display circuit board 90, the calibration circuit board 91, the adapting circuit board 92, the first main board 93 and the second main board 94 can be connected through the connection post.

For example, referring to fig. 17 and 18, the first circuit board may be a display circuit board 90, and the second circuit board may be a correction circuit board 91. Alternatively, the first circuit board may be the correction circuit board 91 and the second circuit board may be the relay circuit board 92. Alternatively, the first circuit board may be the through circuit board 92, and the second circuit board may be the first main board 93. Alternatively, the first circuit board may be the first main board 93, and the second circuit board may be the second main board 94.

It should be noted that the at least two circuit boards in the embodiment of the present disclosure may further include other circuit boards besides the display circuit board 90, the correction circuit board 91, the relay circuit board 92, the first main board 93, and the second main board 94, and the embodiment of the present disclosure does not limit the types of the at least two circuit boards.

Referring to fig. 17 and 18, the laser projection apparatus may further include a base plate 95, a power supply plate 96, and a support bracket 97. The bottom plate 95, the power supply board 96, the support bracket 97, and at least two circuit boards are sequentially stacked between the lower case 001 and the upper case 002. Wherein, the supporting frame 97 is connected with the bottom plate 95 and forms an accommodating space, and the power panel 96 is located in the accommodating space. The supporting bracket 97 is also connected to the second main board 94 of at least two circuit boards.

Because the number of electronic devices arranged on the power board 96 is large and the power is large, the accommodating space formed by the supporting frame 97 and the bottom board 95 can ensure the safe distance between the power board 96 and the second main board 94, prevent the electronic devices on the power board 96 from being affected, and ensure the normal work of the laser projection equipment.

Optionally, the material of the bottom plate 95 is a metal material, such as iron. Since the material of the bottom plate 95 is a metal material, the bottom plate 95 can absorb the electromagnetic signal transmitted to the surface thereof. Referring to fig. 17, the display circuit board 90, the calibration circuit board 91, the adapting circuit board 92, the first main board 93, the second main board 94, the supporting frame 97 and the power board 96 are sequentially connected to the bottom board 95, so as to achieve the effect of grounding at least two circuit boards.

Compared with the technology in which the height between two adjacent circuit boards is higher, because the height between the first circuit board 20 and the second circuit board 30 included in at least two circuit boards in the laser projection apparatus provided by the embodiment of the present disclosure is reduced, electromagnetic signals generated by the electronic devices on the first circuit board 20 and the electronic devices on the second circuit board 30 can be more transmitted to the bottom board 95, and the situation that more electromagnetic signals are not transmitted to the bottom board and radiate to the outside of the housing of the projection apparatus due to the higher height between two adjacent circuit boards is avoided, thereby reducing radiation to a user.

The connection column structure made of metal is used for connecting and supporting the first circuit board and the second circuit board, and is also used as a part of a conductive path of the two circuit boards, and finally connected to a common ground of equipment, namely a metal bottom plate 95, so that the grounding of each circuit board is realized.

In the case that the at least two circuit boards include three or more circuit boards, since the height between the adjacent first circuit board and the second circuit board is reduced, compared with the related art, the laser projection apparatus provided in the embodiment of the present disclosure can transmit more electromagnetic signals generated by electronic devices on the plurality of circuit boards to the bottom plate 95, so that radiation to a user can be further reduced.

In the embodiment of the present disclosure, the first main board 93 and the second main board 94 are mainly used for decoding external audio/video signals. The second main board 94 may be provided with a system on chip (SoC) 61, which is capable of decoding data in different data formats into a normalized format. And transmits the data in the normalized format to the first main board 93 through, for example, a connector (connector), and the first main board 93 transmits the data in the normalized format to the display circuit board 90. For example, the data in the normalized format may be a video image signal.

The display circuit board 90 may be provided with a Field Programmable Gate Array (FPGA) and a main control chip. The algorithm processing module FPGA is configured to process a video image signal input by the first main board 93, for example, perform Motion Estimation and Motion Compensation (MEMC) frequency multiplication processing, or perform image enhancement function such as image correction. The main control chip is connected with the algorithm processing module FPGA and used for receiving the processed video image processing signal data as image data to be displayed. It should be noted that the FPGA is usually used as an enhanced function module, and in some low-cost schemes, the FPGA may not be provided with the module part, and the main control chip is connected to the first main board 93 and receives the video image display signal output by the first main board 93.

The adapting circuit board 92 is used for converting the format of the signal transmitted by the first main board 93 and transmitting the converted image to the correcting circuit board 91. The correction circuit board 91 corrects the projection position of the image. The power board 96 can be used to supply power to the optical engine unit 1, the heat dissipation unit 3, the speaker unit 4, the display circuit board 90, the correction circuit board 91, the adapter circuit board 92, the first main board 93, and the second main board 94, and to ensure normal power supply to each part of the laser projection apparatus.

In the disclosed embodiments, the laser projection device may be a laser projection television.

In the correlation technique, because all connect through the support frame between two arbitrary adjacent circuit boards in a plurality of circuit boards, lead to the high height that piles up of a plurality of circuit boards, it is great to the occupation of laser projection equipment inner space, laser projection equipment's whole thickness is thicker, leads to laser projection equipment's weight heavier simultaneously. Meanwhile, the manufacturing cost of the laser projection equipment is high due to the fact that the mould cost of the support frame is high.

In the embodiment of the present disclosure, the first circuit board 20 and the second circuit board 30 are connected by the connecting column 40, so that the height between the first circuit board and the second circuit board is reduced, the overall thickness of the laser projection apparatus is reduced, and the weight of the laser projection apparatus is reduced, which is beneficial to the ultra-light and ultra-thin development of the laser projection apparatus.

Because any two adjacent circuit boards in the plurality of circuit boards are connected through the connecting column, compared with the prior art in which any two adjacent circuit boards in the plurality of circuit boards are connected through the supporting frame. This disclosed embodiment connects arbitrary two adjacent circuit boards through the spliced pole, has reduced the height that piles up of a plurality of circuit boards, has compressed the inner space of whole laser projection equipment, has reduced the occupation to laser projection equipment inner space, has reduced laser projection equipment's whole thickness, has reduced laser projection equipment's weight simultaneously, is favorable to laser projection equipment's ultralight, and ultra-thin development.

Compared with the prior art that the first circuit board and the second circuit board are connected by the support frame, the embodiment of the disclosure connects the first circuit board 20 and the second circuit board 30 by the connecting column 40, thereby reducing the manufacturing cost and saving the mold opening time.

And for different laser projection equipment, the connecting columns with different heights can be adopted, so that the connecting columns are suitable for different circuit boards, and the universality of the connecting columns is higher.

Moreover, since the height of the portion of the connecting column 40 between the first circuit board 20 and the second circuit board 30 is greater than or equal to the safety height threshold, it is ensured that the electronic devices on the first circuit board 20 and the electronic devices on the second circuit board 30 do not affect each other, and the display effect of the laser projection apparatus is ensured.

In summary, embodiments of the present disclosure provide a laser projection apparatus including a connection column for supporting a first circuit board and a second circuit board that are stacked. The other end of the connecting column penetrates through the second circuit board to be connected with the fixing piece, so that the electronic device on the first circuit board and the electronic device on the second circuit board are not influenced mutually.

In the case that the at least two circuit boards include three or more circuit boards, any two adjacent circuit boards of the at least two circuit boards may be connected to each other through the connection post. Therefore, compared with the related art, the embodiment of the disclosure connects any two adjacent circuit boards through the connecting column, further reduces the stacking height of the circuit part, compresses the internal space of the whole laser projection device, reduces the occupation of the internal space of the laser projection device, and reduces the overall thickness of the laser projection device. Meanwhile, the weight of the laser projection equipment is reduced, and the ultra-light and ultra-thin development of the laser projection equipment is facilitated.

In the disclosed embodiments, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more.

The above description is intended to be exemplary only and not to limit the present disclosure, and any modification, equivalent replacement, or improvement made without departing from the spirit and scope of the present disclosure is to be considered as the same as the present disclosure.

Claims

1. A laser projection device, characterized in that the laser projection device comprises:

a housing having an accommodating space formed therein;

2. The laser projection device of claim 1, wherein the connection post is threadably connected to both the first circuit board and the mount.

3. The laser projection device of claim 2, wherein one end of the attachment post is provided with a first threaded hole;

4. The laser projection device as claimed in claim 2, wherein the other end of the connection column is provided with an external thread, the fixing member is provided with a second threaded hole, and the other end of the connection column is connected with the second threaded hole.

5. The laser projection device of claim 4, wherein the second circuit board is provided with a second through hole and a third through hole, and the fixing member comprises: the fixing plate and the pins connected with the fixing plate;

6. The laser projection device of claim 5, wherein the fixing member includes a plurality of pins, the second circuit board is provided with a plurality of third through holes corresponding to the plurality of pins, and the plurality of third through holes surround the second through hole;

7. A laser projection device as claimed in any one of claims 1 to 6, wherein the laser projection device comprises a plurality of said connecting posts.

8. The laser projection device of any of claims 1 to 6, wherein the material of the connecting column is a metallic material.

9. The laser projection device of any of claims 1 to 6, wherein the at least two circuit boards comprise: display circuit board, correction circuit board, switching circuit board, first mainboard and second mainboard.

10. The laser projection device of any of claims 1 to 6, wherein the housing comprises: upper casing and lower casing that relative setting, laser projection equipment still includes: the power supply comprises a bottom plate, a power supply plate and a support frame;