WO2022048291A1 - Dispositif électronique, ensemble boîtier, ensemble plaque de recouvrement et module électrochromique - Google Patents

Dispositif électronique, ensemble boîtier, ensemble plaque de recouvrement et module électrochromique Download PDF

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Publication number
WO2022048291A1
WO2022048291A1 PCT/CN2021/103718 CN2021103718W WO2022048291A1 WO 2022048291 A1 WO2022048291 A1 WO 2022048291A1 CN 2021103718 W CN2021103718 W CN 2021103718W WO 2022048291 A1 WO2022048291 A1 WO 2022048291A1
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WIPO (PCT)
Prior art keywords
plastic frame
electrochromic module
layer
substrate
color
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PCT/CN2021/103718
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English (en)
Chinese (zh)
Inventor
蓝昊
彭明镇
袁广中
王雷
杨自美
李辉
Original Assignee
Oppo广东移动通信有限公司
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Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2022048291A1 publication Critical patent/WO2022048291A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/161—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/1533—Constructional details structural features not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Definitions

  • the present invention relates to the technical field of electronic equipment with a color changing function, in particular to an electronic equipment, a casing assembly, a cover plate assembly and an electrochromic module.
  • the electrochromic film is a kind of color-changing blocking film commonly used in the exterior glass of buildings and the rearview mirror of automobiles, etc.
  • the structure of the electrochromic film in the conventional technology generally has a large overall thickness.
  • the color-changing material in the electrochromic film is highly sensitive to water and oxygen. If the packaging of the color-changing material is not reliable, the color-changing material will deteriorate and the life of the electrochromic film will be shortened.
  • a first aspect of the embodiments of the present application provides an electrochromic module, the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are stacked in sequence; the plastic frame is surrounded by the color-changing material layer The circumference of the side edge can realize the circumferential sealing of the color-changing material layer; the water vapor transmission rate of the plastic frame is not more than 20g/m2/day.
  • an embodiment of the present application provides an electrochromic module, wherein the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are stacked in sequence; the plastic frame is surrounded by the color-changing material layer The surrounding of the side edge of the color-changing material layer can be sealed, and the plastic frame is formed by solidifying epoxy-based glue or acrylic-based glue.
  • an embodiment of the present application provides an electrochromic module, wherein the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are stacked in sequence; the plastic frame is surrounded by the color-changing material layer The side circumference of the plastic frame is used to realize the circumferential sealing of the color-changing material layer; the width of the plastic frame is greater than 1 mm, and the plastic frame is formed by solidifying epoxy-based glue or acrylic-based glue.
  • an embodiment of the present application provides an electrochromic module, wherein the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are stacked in sequence; the plastic frame is surrounded by the color-changing material layer The side circumference of the plastic frame is used to achieve the circumferential sealing of the color-changing material layer; the rubber frame is doped with a water vapor barrier.
  • an embodiment of the present application provides an electrochromic module, wherein the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame;
  • the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are stacked in sequence;
  • the plastic frame includes a first plastic frame and a second plastic frame, the first plastic frame is arranged around the side circumference of the color-changing material layer, and realizes the circumferential sealing of the color-changing material layer; the first plastic frame is The second plastic frame is arranged around the outer circumference of the first plastic frame.
  • an embodiment of the present application provides a cover plate assembly, the cover plate assembly includes a transparent cover plate and the electrochromic module according to any one of the above embodiments, the transparent cover plate and the electrical The first substrate of the photochromic module is attached.
  • an embodiment of the present application provides a casing assembly, the casing assembly includes a middle frame and the cover plate assembly according to any one of the above embodiments; It is bonded with the transparent cover plate and the middle frame.
  • an embodiment of the present application provides an electronic device, the electronic device includes a display screen module and the housing assembly according to any one of the above embodiments; the display screen module and the cover plate assembly They are respectively arranged on opposite sides of the middle frame.
  • an embodiment of the present application provides an electronic device, the electronic device includes a control circuit and the casing assembly according to any one of the above embodiments, the control circuit and the casing assembly are electrochromic The modules are coupled and connected, and the control circuit is used to receive a control instruction, and the control instruction is used to control the color change of the electrochromic module.
  • the overall structure of the electrochromic module is guaranteed to have good waterproof performance, thereby stabilizing the discoloration performance of the electrochromic module, and prolonging the service life.
  • FIG. 1 is a schematic cross-sectional view of the structure of an embodiment of an electrochromic module of the present application
  • FIG. 2 is a schematic view of a partial structure stacking of an embodiment of an electrochromic module
  • FIG. 3 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 4 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 5 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 6 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 7 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 8 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 9 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 10 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • FIG. 11 is a schematic top view of the structure of the electrochromic module in FIG. 10;
  • FIG. 12 is a schematic structural disassembly diagram of another embodiment of the electrochromic module of the present application.
  • FIG. 13 is a schematic cross-sectional view of the partial structure at the binding position in FIG. 12;
  • FIG. 14 is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of the present application.
  • 15 is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of the present application.
  • Fig. 16 is the structural disassembly schematic diagram of the electrochromic module in Fig. 15;
  • Figure 17 is an enlarged schematic diagram of the partial structure at A in Figure 15;
  • FIG. 18 is a schematic cross-sectional view of the partial structure at B-B in FIG. 15;
  • 19 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • 20 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application.
  • 21 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application.
  • FIG. 22 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application.
  • 23 is a schematic flowchart of an embodiment of an electrochromic module packaging method of the present application.
  • Figure 24 is a schematic view of the structure stacking of the electrochromic module stack structure (semi-finished product).
  • 25 is a schematic view of the structure stacking after forming a ring groove on the semi-finished product of the electrochromic module
  • Figure 26 is a schematic top view of the structure of Figure 25;
  • Fig. 27 is a structural schematic diagram after filling sealant in the ring groove of the semi-finished electrochromic module
  • FIG. 29 is a schematic flowchart of another embodiment of the electrochromic module packaging method of the present application.
  • FIG. 30 is a schematic view of the structure stacking after forming two ring grooves on the semi-finished product of the electrochromic module
  • Figure 31 is a schematic top view of the structure of Figure 30;
  • FIG. 33 is a schematic structural diagram of an embodiment of a cover plate assembly of the present application.
  • FIG. 35 is a schematic structural diagram of another embodiment of the cover plate assembly of the present application.
  • 36 is a schematic structural diagram of single-side lead binding of the cover plate assembly
  • FIG. 37 is a schematic cross-sectional view of the structure of another embodiment of the cover plate assembly of the present application.
  • 38 is a schematic cross-sectional view of the structure of another embodiment of the cover plate assembly of the present application.
  • FIG. 39 is a schematic flowchart of an embodiment of a method for assembling a cover plate assembly in the embodiment of FIG. 38;
  • Figure 40 is a schematic structural diagram of the electrochromic module and the transparent cover plate after lamination and dispensing;
  • 41 is a schematic structural diagram of the bonding of the rear cover plate and the middle frame of the electronic device in the conventional technology
  • Figure 43 is a schematic front view of the structure of the housing assembly in Figure 42;
  • FIG. 44 is a partial structural block diagram of an embodiment of the electronic device of the present application.
  • Fig. 45 is a structural composition block diagram of another embodiment of the electronic device of the present application.
  • 46 is a structural block diagram of another embodiment of the electronic device of the present application.
  • 47 is a schematic structural diagram of an embodiment of an electronic device
  • Figure 48 is a schematic diagram of an operational state of the electronic device
  • Figure 49 is a schematic diagram of another operating state of the electronic device.
  • Figure 50 is a schematic structural diagram of a reversely colored color block appearing when the electrochromic module fails
  • FIG. 51 is a schematic diagram of insufficient bonding when the elongation at break of the plastic frame of the electrochromic module is insufficient.
  • first”, “second” and “third” in the present invention are only used for description purposes, and should not be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, “third” may expressly or implicitly include at least one of that feature.
  • "a plurality of” means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship between various components under a certain posture (as shown in the accompanying drawings).
  • Electric equipment includes, but is not limited to, is configured to be connected via a wired line (eg, via a public switched telephone network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection, and/or another data connection/network) and/or via (eg, for cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters , and/or another communication terminal's) wireless interface to receive/send communication signals.
  • PSTN public switched telephone network
  • DSL digital subscriber line
  • WLAN wireless local area networks
  • a communication terminal arranged to communicate through a wireless interface may be referred to as a "wireless communication terminal", “wireless terminal” or “mobile terminal”.
  • Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radio telephones with data processing, fax, and data communication capabilities; may include radio telephones, pagers, Internet/Intranet access , a PDA with a web browser, memo pad, calendar, and/or a global positioning system (GPS) receiver; and conventional laptop and/or palm receivers or other electronic devices including radiotelephone transceivers.
  • a mobile phone is an electronic device equipped with a cellular communication module.
  • the embodiment of the present application first proposes a structure of an electrochromic module based on electrochromic technology.
  • the electrochromic material in the electrochromic module is based on organic polymers, such as polyaniline, polythiophene, and the like.
  • Electrochromic materials are based on the discoloration effect produced by electrochemical reactions. Electrochemical reactions have very strict requirements on water and oxygen. Once a small amount of water and oxygen invades, electrolytic water reaction occurs in the material, producing highly active oxygen, which will affect the material. The discoloration performance is irreversibly damaged, resulting in the problem of material oxidation and yellowing or even complete failure. Therefore, the sealing condition of the electrochromic material becomes the key to the structure of the electrochromic module.
  • FIG. 1 is a schematic cross-sectional view of the structure of an electrochromic module according to an embodiment of the present application;
  • the electrochromic module 100 in this embodiment includes a first substrate 110 , a first conductive layer 120 , and a color-changing material layer 130 , the second conductive layer 140 , the second substrate 150 and the plastic frame 160 .
  • the first substrate 110 , the first conductive layer 120 , the color-changing material layer 130 , the second conductive layer 140 and the second substrate 150 are stacked in sequence; in this embodiment,
  • the plastic frame 160 is disposed around the color-changing material layer 130 , and two ends of the plastic frame 160 are respectively bonded to the surfaces of the first conductive layer 120 and the second conductive layer 140 .
  • the material of the first substrate 110 and the second substrate 150 is a flexible transparent resin material, so that the overall structure of the electrochromic module 100 is a flexible and bendable structure.
  • the first substrate 110 and the second substrate 150 function to support and protect the internal structure.
  • the material of the first substrate 110 and the second substrate 150 may be PET (Polyethylene terephthalate for short PET or PEIT, commonly known as polyester resin, polycondensate of terephthalic acid and ethylene glycol), PMMA (polymethyl ethylene glycol).
  • Methyl acrylate (poly(methyl methacrylate), referred to as PMMA), also known as acrylic, acrylic (English Acrylic or plexiglass), PC (Polycarbonate, polycarbonate (English referred to as PC) is a molecular chain containing carbonic acid. Ester-based polymer), PI (Polyimide), etc. Regarding more material types of the first substrate 110 and the second substrate 150 , within the understanding of those skilled in the art, they will not be listed and described in detail here.
  • the formation method of the first conductive layer 120 and the second conductive layer 140 may be physical vapor deposition (PVD, Physical Vapor Deposition), specifically including vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating) , arc ion plating, reactive reactive ion plating, radio frequency ion plating, DC discharge ion plating) and so on.
  • PVD physical vapor deposition
  • ion plating hollow cathode ion plating, hot cathode ion plating
  • arc ion plating reactive reactive ion plating
  • radio frequency ion plating radio frequency ion plating
  • DC discharge ion plating DC discharge ion plating
  • the thicknesses of the first conductive layer 120 and the second conductive layer 140 may be respectively between 100 nm and 300 nm, and may specifically be 100 nm, 120 nm, 150 nm, 200 nm, 280 nm, and 300 nm.
  • the materials of the first conductive layer 120 and the second conductive layer 140 are made of transparent conductive materials.
  • the transparent conductive material may be indium tin oxide (ITO), zinc aluminum oxide (AZO), tin oxide doped with fluorine (FTO), or a graphene film.
  • FIG. 2 is a schematic diagram of a partial structure stacking of an embodiment of the electrochromic module, wherein the color-changing material layer 130 further includes a sub-layer structure.
  • the color-changing material layer 130 includes a An electrochromic layer (ie EC layer) 131 , a dielectric layer 132 , and an ion storage layer (ie IC layer) 133 are stacked in sequence between the first conductive layer 120 and the second conductive layer 140 .
  • the material of the electrochromic layer 131 can be selected from organic polymers (including polyaniline, polythiophene, etc.), inorganic materials (Prussian blue, transition metal oxides, such as tungsten trioxide), and small organic molecules (violet fine) etc.
  • the electrochromic layer 131 is an organic polymer as an example for description, and the electrochromic layer 131 may be a solid or gel state material.
  • the ion storage layer 133 and the dielectric layer 132 may be formed by PVD, and the electrochromic layer 131 (wherein the electrochromic layer 131 is the aforementioned organic polymer or inorganic material) may be It is formed by means of scraping coating or drip irrigation, and the detailed technical features of this part are within the understanding of those skilled in the art, and will not be described in detail here.
  • the electrochromic layer 131 may also use small organic molecules as electrolyte materials.
  • the specific formation method may be formed by a vacuum filling process between the first conductive layer 120 and the second conductive layer 140 , which will not be described in detail here.
  • FIG. 3 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; the difference from the previous embodiment is that the electrochromic module in this embodiment is a structure of large and small pieces.
  • the plastic frame 160 is surrounded by the first conductive layer 120 , the color-changing material layer 130 , the second conductive layer 140 and the side edges of the second substrate 150 and is connected with the The first substrate 110 is bonded toward the surface of the first conductive layer 120 .
  • FIG. 4 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110, a first conductive layer 120 , the color-changing material layer 130 , the second conductive layer 140 , the second substrate 150 and the plastic frame 160 ; different from the previous embodiments, the electrochromic module 100 in this embodiment further includes a water-oxygen blocking unit 170 .
  • the water-oxygen blocking unit 170 is attached to the surface of the second substrate 150 facing away from the second conductive layer 140 .
  • the area of the water and oxygen blocking unit 170 is larger than that of the second substrate 150 , and the surface of the water and oxygen blocking unit 170 and the second substrate 150 facing away from the second conductive layer 140 and the plastic frame 160 is bonded to the end face away from the first substrate 110 ; that is, the opposite ends of the plastic frame 160 are bonded to the first substrate 110 and the water-oxygen blocking unit 170 respectively.
  • the water and oxygen blocking unit 170 may be back bonded to the second substrate 150 through an optical adhesive layer 1701 (OCA (Optically Clear Adhesive)).
  • OCA Optically Clear Adhesive
  • UV or other liquid glue may be used for encapsulation between the second substrate 150 and the water-oxygen blocking unit 170 .
  • the water and oxygen barrier unit 170 includes a substrate 171 and a water and oxygen barrier layer 172 plated on at least one surface of the substrate 171 .
  • the substrate 171 may be made of a flexible transparent resin material, including polyethylene terephthalate PET, polycarbonate PC, polyimide PI, and the like.
  • the water and oxygen barrier layer 172 may be a dense metal oxide layer or an inorganic non-metallic layer or a composite layer in which materials and inorganic materials are superimposed. For example, aluminum oxide, silicon oxide, or a laminated composite structure of various materials.
  • the water-oxygen barrier unit 170 in this embodiment is a flexible substrate with a water-oxygen barrier layer 172 plated, and its water vapor transmission rate WVTR ⁇ 1 ⁇ 10-2g/m2/day.
  • the water vapor permeation direction of the water and oxygen blocking unit 170 in the embodiment of the present application is a physical representation of permeating from one surface of the water and oxygen blocking unit 170 in the thickness direction through the water and oxygen blocking unit 170 to the opposite surface.
  • the size of the second substrate 150 in the electrochromic module is smaller than the size of the first substrate 110 and the size of the water-oxygen blocking unit 170 .
  • the plastic frame 160 between the first substrate 110 and the water-oxygen blocking unit 170 can be used to form a ring-shaped enclosure to protect the electrochromic material of the core layer of the electrochromic unit and prevent water and oxygen from invading.
  • FIG. 5 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; in this embodiment, there is an optical adhesive layer 1701 between the second substrate 150 and the water-oxygen blocking unit 170 bond.
  • the optical adhesive layer 1701 can improve the adhesive force between the second substrate 150 and the water-oxygen blocking unit 170, and at the same time avoid the formation of an air layer between the two, that is, avoid the sealing of gas into the plastic frame 160, because the sealing gas will increase in temperature. High expansion, affecting the reliability of electrochromic materials.
  • the water vapor transmission rate of the plastic frame 160 is not greater than 20 g/m 2 /day.
  • the water vapor transmission rate actually includes two meanings, the water vapor transmission rate and the water vapor transmission coefficient. The meanings expressed by these two meanings are also different to some extent, but they can both be used to indicate the amount of water vapor passing through a certain material. ability.
  • the water vapor transmission rate represents the weight of the water vapor transmission material under a certain time, certain temperature and humidity conditions.
  • the water vapor transmission rate is the standard value of the water vapor transmission rate converted by the coefficient, and corresponds to the standard unit, which is used for comparison between different test results.
  • the water vapor transmission rate and water vapor transmission coefficient were measured according to GB/T 1037-1988 "Test method for water vapor permeability of plastic films and sheets--Cup method" (corresponding to the American Testing and Association Standard ASTM E96-1980). Specific measurement conditions and measurement methods are not specifically limited here.
  • the water vapor permeation direction of the plastic frame 160 in the embodiment of the present application is a physical representation of permeating from the outer surface of the plastic frame 160 in the direction of thickness T through the plastic frame 160 to the surface adjacent to the color-changing material layer 130 .
  • the glue frame 160 may be formed by solidifying epoxy-based glue or acrylic-based glue.
  • epoxy glue has better waterproof performance
  • acrylic glue has stronger adhesion.
  • Table 1 the following table is the water vapor transmission rate test data of the plastic frame under different conditions.
  • the width T of the plastic frame 160 in this embodiment may be greater than 1 mm. Specifically, it can be 1.1mm, 1.2mm, 1.5mm, 2mm, 3mm, etc., and the specific value is not specifically limited, and will not be listed one by one here. It should be noted that the width T of the plastic frame 160 mentioned here does not mean that the larger the better, when the water vapor barrier performance requirements are met, the overall black edge of the electrochromic module (the width of the non-colorable area) needs to be considered. Generally speaking, the width T of the plastic frame 160 is also controlled within 10mm.
  • the ambient temperature is 60°C
  • the relative humidity is 90% (referring to the percentage of the water vapor pressure in the air and the saturated water vapor pressure at the same temperature.
  • the absolute humidity of the humid air and the same temperature may be achieved
  • the ratio of the maximum absolute humidity It can also be expressed as the ratio of the partial pressure of water vapor in the humid air to the saturation pressure of water at the same temperature, relative humidity (Relative Humidity), expressed in RH. It represents the absolute humidity in the air and the same temperature and pressure.
  • the ratio of the saturated absolute humidity, the number is a percentage.
  • the water vapor transmission rate of the plastic frame 160 is 1-15 g/m2/day.
  • the elongation at break of the plastic frame 160 (the elongation at break is generally expressed as the relative elongation at break, that is, the ratio of the elongation at break of the plastic frame to its initial length, is expressed as a percentage. It is It is an index to characterize the softness and elasticity of the plastic frame. The larger the elongation at break, the better the softness and elasticity.) is 2-400%, or the modulus is less than 1Gpa (the modulus here refers to the modulus Quantity refers to the ratio of stress to strain of a material under stress. The reciprocal of modulus is called compliance. Significance: The elastic modulus can be regarded as an index to measure the ease of elastic deformation of a material.
  • the reason why the elongation at break of the plastic frame 160 is required in the embodiment of the present application is to ensure that the plastic frame has a stable structural state during the flexible deformation or bending process of the electrochromic module, and the plastic frame will not be damaged. Seal failure.
  • the bonding interface between the plastic frame 160 and other structural layers can be treated to a certain extent.
  • the opposite ends of the plastic frame 160 are blocked from the first substrate 110 and water and oxygen, respectively.
  • the bonding contact surface of the unit 170 in the embodiment of FIG. 1 , the opposite ends of the plastic frame 160 are respectively bonding contact surfaces with the first conductive layer 120 and the second conductive layer 140 .
  • the specific treatment methods of the bonding interface include plasma treatment, roughening or printing ink layer, etc., the purpose is to improve the bonding strength between the plastic frame 160 and other structural layers.
  • the intrusion of water vapor is not mainly from the bonding interface, but from the The body of the plastic frame 160 invades.
  • the plastic frame 160 and the lower layer (water and oxygen barrier film) and the upper layer (PET/ITO film) can be firmly bonded.
  • the specific adhesive force between the plastic frame 160 and other structural layers will be introduced later.
  • the glue frame 160 may also be doped with a water vapor barrier, which may be added in the glue during the formation of the glue frame 160 .
  • the mass fraction of the water vapor barrier agent in the plastic frame 160 is 1-10%. Specifically, it can be 1%, 3%, 5%, 8%, 10%, etc., and the mass fraction ratio of the water vapor barrier agent can be appropriately increased without affecting the strength of the plastic frame 160 .
  • some spacers can be added inside the glue, with a mass fraction of about 1-10%, to block the path of water vapor; or a certain amount of molecular sieve can be added to absorb water vapor and prolong life.
  • the main component of Spacer is SiO2, micron-scale SiO2 microspheres.
  • Molecular sieve is a common concept in chemistry, and its specific components are hydrated aluminosilicate (zeolite) or natural zeolite. Because Spacer is a SiO2 microsphere, it can block water vapor, and molecular sieves can absorb water vapor. The two can be added separately or used together.
  • FIG. 6 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110 and a first conductive layer that are stacked in sequence. 120, the color-changing material layer 130, the second conductive layer 140, the second substrate 150, and the water-oxygen blocking unit 170; the difference from the previous embodiment is that the plastic frame 160 in this embodiment includes a first plastic frame 161 and a second plastic Frame 162 , the first plastic frame 161 is arranged around the side circumference of the color-changing material layer 130 , and the second plastic frame 162 is arranged around the outer circumference of the first plastic frame 161 .
  • the first plastic frame 161 is closer to the color-changing material layer 130 , so the water vapor transmission rate of the first plastic frame 161 may be lower than the water vapor transmission rate of the second plastic frame 162 .
  • the adhesiveness of the second plastic frame 162 may be higher than that of the first plastic frame 161 .
  • the adhesiveness mentioned here refers to the difference between the adhesive interface between the plastic frame and other structural layers (specifically, the adhesive interface between the plastic frame and the first substrate 110 and the water-oxygen barrier unit 170 in the illustrated embodiment).
  • the degree of adhesion between the two that is, the degree to which it is not easy to peel off. This performance reflects the bonding reliability or firmness of the plastic frame and other structural layers.
  • the water and oxygen barrier properties of the outer plastic frames 162 may be slightly lower, and specifically, the water vapor transmission rate of the plastic frames 162 may not be greater than 20g/m2/day ;
  • the adhesive force of the outer plastic frame 162 is higher, and its elongation at break is required, and the elongation at break needs to be 2-400%; while the water and oxygen barrier properties of the inner plastic frame 161 are high, the specific requirements are
  • the water vapor transmission rate of the inner plastic frame 161 is not greater than 15 g/m 2 /day, and the adhesive force to the inner plastic frame 161 may be required to be lower.
  • the inner plastic frame 161 can use epoxy system glue with high water resistance
  • the outer plastic frame 162 can use acrylic system glue with relatively good adhesion.
  • the background of the double plastic frame solution is: in practical applications, under the requirements of some narrow borders and 3D curved surfaces, the plastic frame becomes narrower, and it is difficult to find glue that can block water vapor and meet the requirements of 3D bonding.
  • glue that can block water vapor and meet the requirements of 3D bonding.
  • the water vapor transmission rate of epoxy glue is better, but the adhesion between epoxy glue and PET and water-oxygen barrier film is relatively weak, and the glue is hard, which cannot well meet the requirements of 3D lamination.
  • Demand if only acrylic system glue or other glue with good adhesion and softness is used, the waterproof performance of this glue cannot meet the requirements well when the width of the plastic frame is certain (considering the problem of black edges).
  • the double-plastic frame solution of using epoxy system glue with better water resistance on the inside and acrylic system glue with better adhesion on the outside can solve the above problems very well.
  • Table 2 the table below is the comparison data of the test experiment between the double plastic frame scheme and the single plastic frame.
  • the water vapor transmission rate of the double plastic frame refers to the penetration of water vapor from the outer surface of the outer plastic frame (the second plastic frame 162) through the outer plastic frame and the inner plastic frame (the first plastic frame 161). ) to the physical characterization of the inner surface of the inner rubber frame.
  • the entire plastic frame (the first plastic frame 161 and the second plastic frame 162) can be satisfied.
  • the water vapor transmission rate of the second plastic frame 162) is not greater than the requirement of 20g/m2/day.
  • the width of the double plastic frame is 0.5, the waterproof performance is better than that of the epoxy-based single plastic frame with a width of 0.8.
  • the width T1 of the first plastic frame 161 and the width T2 of the second plastic frame 162 in this embodiment are both designed to be greater than 0.3. mm.
  • the first plastic frame 161 and the second plastic frame 162 may be arranged at intervals or in contact, and the formation method of the plastic frames will be described in detail in subsequent embodiments.
  • FIG. 7 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110 and a first conductive layer that are stacked in sequence.
  • the plastic frame 160 in this embodiment includes a first plastic frame 161, a second plastic A frame 162 and a third plastic frame 163, the first plastic frame 161 is arranged around the side edge of the color-changing material layer 130, the second plastic frame 162 is arranged around the outer circumference of the first plastic frame 161, and The third plastic frame 163 is disposed on the outer periphery of the second plastic frame 162 .
  • the technical solution of this embodiment may be to add a third plastic frame 163 on the basis of the previous embodiment, specifically, as shown in FIG.
  • the structure in FIG. 8 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; the structure in FIG. 8 is equivalent to adding a layer of plastic frame ( The third plastic frame 163), in this embodiment, by adding the structure of the third plastic frame 163, the waterproof performance of the electrochromic module as a whole can be further enhanced.
  • the material of the third plastic frame 163 can be made of the same epoxy-based glue as the first plastic frame 161 and solidified, and can also be a nano-hydrophobic material, such as polytetrafluoroethylene, fluorinated polyethylene, fluorocarbon wax, and the like.
  • the third plastic frame 163 can also be a waterproof foam or the like attached to the outer periphery of the second plastic frame 162 . Wherein, the water vapor transmission rate of the third plastic frame 163 is required to be less than 5g/m2/day.
  • Table 3 the following table is the test experimental comparison data of the double plastic frame scheme and the three plastic frame scheme.
  • the width of the plastic frame is 0.3mm
  • the waterproof performance of the three-plastic frame solution is obviously better than that of the double-plastic frame solution.
  • the width of the third plastic frame 163 may also be greater than 0.3 mm. Specifically, it can be 0.31mm, 0.4mm, 0.5mm, 0.8mm, 1mm, etc., which is not specifically limited here.
  • FIG. 9 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application.
  • the water and oxygen barrier unit 170 in this embodiment includes a substrate 171 , a water Oxygen barrier layer 172 and appearance film layer 173 .
  • the water and oxygen barrier layer 172 and the appearance film layer 173 are respectively disposed on opposite sides of the substrate 171 .
  • the appearance film layer 173 is used to achieve different appearance effects, and may specifically include a texture layer (which can be formed by UV transfer printing), a color coating layer (which can be abbreviations for NCVM (Non conductive vacuum metalization, also known as discontinuous coating) technology or non-conductive electroplating technology), nano-imprint layer, color coating layer, gradient effect layer, ink layer and varnish protective layer, etc., one or more combinations, which are not specifically limited here.
  • the overall thickness of the electrochromic module in this embodiment can be is 200-300um.
  • FIG. 10 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; the electrochromic module in this embodiment further includes a metal wiring 180 , and the metal wiring 180 specifically includes a first metal The wiring 181 and the second metal wiring 182 ; the first metal wiring 181 is connected to the first conductive layer 120 , and the second metal wiring 182 is connected to the second conductive layer 140 .
  • the metal wiring 180 includes, but is not limited to, silver paste wiring, copper plating, aluminum plating, or a multi-layer wiring structure such as molybdenum, aluminum, and molybdenum.
  • FIG. 11 is a schematic top view of the structure of the electrochromic module in FIG. 10 .
  • the first metal traces 181 are disposed along the edge position close to the surface of the first conductive layer 120
  • the second metal traces 182 are disposed along the edge position close to the surface of the second conductive layer 150 .
  • the square resistance of the first conductive layer 120 and the second conductive layer 140 is set to 40-150 ohms, such as 40 ohms, 50 ohms, 80 ohms, 100 ohms , 120 ohms, 550 ohms and other specific values; while the square resistance of the first metal trace 181 and the second metal trace 182 can be 0.05-2 ohms, specifically 0.05 ohms, 0.06 ohms, 0.1 ohms, 1.2 ohms, 1.5 ohms Euro, 2 Euro and other values are not specifically limited here.
  • the coloring speed of the electrochromic module can be between 10-20s, the fading speed is between 8-12s, or faster.
  • the electrochromic module 100 in this embodiment further includes a flexible circuit board 183 , and the flexible circuit board 183 is connected to the first metal wiring 181 and the second metal wire respectively. Trace 182 is connected.
  • the first metal traces 181 and the second metal traces 182 pass through the flexible circuit board 183 and an external driving circuit (specifically, the control circuit board of an electronic device or a self-contained chip structure, not shown in the figure, and also not done here. Specifically defined) connection, the external drive circuit provides power for the electrochromic module and drives the electrochromic material to change color.
  • an external driving circuit specifically, the control circuit board of an electronic device or a self-contained chip structure, not shown in the figure, and also not done here. Specifically defined
  • FIG. 12 is a schematic structural disassembly diagram of another embodiment of the electrochromic module of the present application
  • FIG. 13 is a partial structural cross-sectional schematic diagram of the binding position in FIG. 12 .
  • the first metal traces 181 and the second metal traces 182 are ring traces
  • the flexible circuit board 183 is connected to the first metal traces 181 and the second metal traces 182 on both sides respectively (specifically is connected to the first lead-out end 1811 of the first metal line 181 and the second lead-out end 1821 of the second metal line 182 ), wherein the shape of the flexible circuit board 183 is not limited to the embodiment of the present application
  • the Y-shaped structure can also be a T-shaped structure.
  • FIG. 14 is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of the present application.
  • the flexible circuit board 183 in FIG. 14 has a T-shaped structure.
  • 13 and 14 are both double-sided bonding, that is, the first metal wiring 181 and the second metal wiring 182 are respectively located on the conductive layers on both sides to bond with the flexible circuit board 183, That is, double-sided binding.
  • the advantages of double-sided bonding lie in reliable conduction of bonding, low process difficulty and compact overall structure.
  • FIG. 15 is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of the present application.
  • Schematic diagram of structure disassembly, FIG. 17 is an enlarged schematic diagram of the partial structure at A in FIG. 15 .
  • the first metal trace 181 and the second metal trace 182 are respectively provided with a first trace lead end 1811 and a second trace lead end 1821 .
  • the first substrate 110 is further provided with a wire connecting end 1801 adjacent to the first metal wire 181 and insulatingly disposed.
  • the photo-etching process forms islands corresponding to the second wire lead-out ends 1821 , and the wire connecting end 1801 and the first conductive layer 120 in other regions of the first substrate 110 are separated by the separation region 1802 .
  • the second metal trace 182 is electrically connected to the trace connection terminal 1801 on the first substrate 110
  • the flexible circuit board 183 is respectively connected to the trace connection terminal 1801 and
  • the first lead-out ends 1811 of the first metal wires 181 are connected to each other. In this way, the purpose of conducting the flexible circuit board 183 from the single-side substrate to the metal traces on both sides at the same time is achieved.
  • FIG. 18 is a schematic cross-sectional view of the partial structure at BB in FIG. 15 ; wherein the second metal trace 182 is electrically connected to the trace connection end 1801 on the first substrate 110
  • the connection method can be realized by using the first conductive silver paste 1803, and the first conductive silver paste 1803 can be formed by screen printing or dot coating, and the thickness is generally 3-10um.
  • the structure of single-sided binding can make the discoloration invalid area at the edge position narrower; since the flexible circuit board is bound on one side, the binding process is simpler.
  • FIG. 19 is a schematic cross-sectional view of the structure of another embodiment of the electrochromic module of the present application; the structure in this embodiment is different from that in the embodiment in FIG.
  • the outer periphery of the two metal traces 182 is also provided with an insulating protection layer, specifically, a first insulation protection layer 1810 and a second insulation protection layer 1820 are respectively provided on the outer periphery of the first metal trace 181 and the second metal trace 182;
  • the first insulating protection layer 1810 and the second insulating protection layer 1820 are used to block the first metal traces 181 and the second metal traces 182 and the color-changing material layer 130 to prevent the color-changing material layer 130 from interacting with the first metal
  • the traces 181 and the second metal traces 182 corrode.
  • the material of the first insulating protection layer 1810 and the second insulating protection layer 1820 may be an organic polymer or an inorganic material, such as silicon oxide.
  • FIG. 20 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application.
  • the outer periphery of the wire 182 is provided with an insulating protective layer, so it is inconvenient for the second metal wire 182 to be directly connected to the wire connection terminal 1801 located on the side of the first substrate 110 through the end face, or the effective contact area of the end face silver paste connection method is considered.
  • the technical solution in this embodiment is to provide a through hole 1401 in the position of the second conductive layer 140 corresponding to the second metal trace 182, and then use the second conductive silver paste 1804 to pass through the
  • the through hole 1401 realizes the conductive connection between the wire connecting end 1801 and the second metal wire 182 .
  • the number of the through holes 1401 may be multiple, which is not specifically limited here.
  • the wire connecting end 1801 is connected to the second metal wire 182 by means of punching holes and silver paste is used, which has the characteristics of high conduction reliability and does not need to destroy the insulation protection of the outer periphery of the metal wire. Floor.
  • FIG. 21 is a partial structure of another embodiment of the electrochromic module of the present application.
  • a schematic cross-sectional view FIG. 22 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application; optionally, at least one of the first metal wiring 181 and the second metal wiring 182 is embedded in the plastic frame 160 Among them, the metal traces embedded in the plastic frame 160 are isolated from the color-changing material layer.
  • the first metal traces 181 and the second metal traces 182 are both embedded in the plastic frame 160 , and the first metal traces 181 and the second metal traces embedded in the plastic frame 160 Line 182 is isolated from layer 130 of color-changing material. On the one hand, it can prevent the first metal traces 181 and the second metal traces 182 from being corroded by the discoloration material layer 130 , and on the other hand, the metal traces are embedded in the plastic frame 160 , which can reduce the damage of the non-discolored area S (black border). width.
  • the first metal traces 181 are embedded in the plastic frame 160 ; the second metal traces 182 are provided in the color-changing material layer 130 .
  • the second metal traces 182 may be buried in the ion storage layer (ie, the IC layer) 133 .
  • FIG. 23 is a schematic flowchart of an embodiment of an electrochromic module packaging method of the present application.
  • the packaging method includes but is not limited to the following steps.
  • step M100 a laminated structure of an electrochromic module is provided.
  • FIG. 24 is a schematic view of the structure of the semi-finished product of the laminated structure of the electrochromic module.
  • the layered structure of the electrochromic module (hereinafter referred to as the semi-finished product) includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140 and a second substrate 150 that are stacked in sequence. That is, the semi-finished material formed after the above five-layer structure is laminated.
  • Step M200 forming a ring groove on the laminated structure of the electrochromic module.
  • FIG. 25 is a schematic view of the structure stacking after forming ring grooves on the semi-finished product of the laminated structure of the electrochromic module
  • FIG. 26 is a schematic top view of the structure of FIG. 25 .
  • the annular groove 1001 at least penetrates through the second substrate 150 , the second conductive layer 140 , the color-changing material layer 130 and the first conductive layer 120 .
  • the ring groove 1001 can be realized by laser cutting, CNC cutting, etc., and the color-changing material layer 130 can be formed by erasing, pre-printing blue glue protection on the position of the first substrate 110 corresponding to the ring groove 1001 in advance, etc.
  • the ring groove is not specifically limited here.
  • the set blue glue can be acrylic UV curing system glue, which has solvent resistance and does not react with electrochromic materials.
  • the adhesive surface of the first substrate 110 can be exposed by directly peeling off the blue glue.
  • step M300 sealant is filled in the ring groove.
  • FIG. 27 is a schematic view of the structure after filling the sealant in the ring groove of the semi-finished electrochromic module.
  • the structure of the plastic frame 160 in the foregoing embodiment is formed.
  • a treatment to improve the bonding strength can also be performed on the bottom bonding surface of the first substrate 110 corresponding to the ring groove 1001, and the treatment methods include plasma treatment, roughening or printing ink layer, etc.
  • the purpose is to The bonding strength between the plastic frame 160 and the first substrate 110 is improved.
  • the electrochromic module packaging method provided by the embodiments of the present application solves the problems of packaging and module design of flexible electrochromic modules. Compatible with the process of photochromic film (semi-finished product). After the flexible electrochromic module is completed, it can be simply attached to the glass cover to realize functional applications, and has good reliability, and can be applied to electronic products such as mobile phones.
  • FIG. 28 is a schematic flowchart of another embodiment of the electrochromic module packaging method of the present application.
  • the packaging method is different from the previous embodiment in that it further includes:
  • step M400 after the sealant in the ring groove is fixed to form a plastic frame, the residual material is cut off along the outer periphery of the plastic frame.
  • FIG. 27 Please continue to refer to FIG. 27 .
  • the parts on both sides of the dotted line in FIG. 27 are cut off to form the structure in FIG. 3 as in the previous embodiment.
  • FIG. 29 is a schematic flowchart of another embodiment of the electrochromic module packaging method of the present application.
  • the packaging method is different from the embodiment of FIG. 28 in that the present embodiment further includes step M500 , in which the second substrate is A water-oxygen barrier unit is attached to the surface away from the second conductive layer.
  • the water and oxygen blocking unit 170 may be bonded to the surface of the second substrate 150 away from the second conductive layer 140 through the optical adhesive layer 1701 to form the structure shown in FIG. 4 in the foregoing embodiment.
  • the electrochromic module is formed by binding the flexible circuit board.
  • binding structure of the flexible circuit board please refer to the relevant descriptions of the foregoing embodiments, which will not be repeated here.
  • FIG. 30 is a schematic view of the structure stacking after forming two ring grooves on the semi-finished product of the electrochromic module
  • FIG. 31 is a schematic top view of the structure of FIG. It is sleeved on the outer periphery of the first ring groove 10011, and then the first ring groove 10011 and the second ring groove 10012 are filled with glue respectively to form a double plastic frame electrochromic module packaging structure.
  • glue in the two ring grooves For the selection of , please refer to the relevant descriptions in the foregoing embodiments, which will not be repeated here.
  • FIG. 32 is a schematic structural diagram of another double plastic frame of the electrochromic module.
  • the first plastic frame 161 and the second plastic frame 162 may be in contact with each other.
  • the packaging method of the three-plastic frame or the multi-plastic frame can be similar to that of the double-plastic frame, and will not be repeated here.
  • FIG. 33 is a schematic structural diagram of an embodiment of the cover plate assembly of the present application.
  • the cover plate assembly 10 (also referred to as a housing) includes: The electrochromic module 100 and the transparent cover plate 200 .
  • the transparent cover plate 200 is attached to the first substrate 110 of the electrochromic module 100 , and specifically, the optical adhesive layer 1101 may be used for bonding.
  • the material of the transparent cover plate 200 may be glass or transparent resin.
  • the transparent cover plate 200 generally refers to the back cover of the electronic device, that is, the battery cover.
  • FIG. 33 is a schematic structural diagram of another embodiment of the cover plate assembly of the present application. Different from the previous embodiment, a shielding layer 201 is provided at the edge of the transparent cover plate 200 in this embodiment.
  • the layer 201 corresponds to the plastic frame 160 of the electrochromic module 100 and the metal traces (the first metal traces 181 and the second metal traces 182 ), so as to realize the thickness direction of the electrochromic module 100 (
  • the plastic frame 160 of the electrochromic module and the metal wiring are shielded in the direction of the arrow in the figure).
  • the shielding layer 201 shields the plastic frame 160 and the metal wiring at the same time.
  • the shielding layer 201 may be designed to shield only one of them.
  • the blocking layer 201 includes any one of an ink layer, a yellow light treatment layer, and a matte gradient layer, which is not specifically limited here.
  • the color of the shielding layer 201 is the same as or similar to the color of the electrochromic module 100 in the color development state, so as to achieve the visual effect that the shielding layer 201 and the electrochromic module 100 are integrated in the color development state.
  • the color of the shielding layer 201 can also be made the same as or similar to the color of the non-colored state of the electrochromic module 100, and then the shielding layer 201 can make the electrochromic module 100 in the non-colored state of the electrochromic module 100.
  • the photochromic module 100 and the frame or the middle frame form a transitional color area to achieve a seamless visual effect of the entire electronic device.
  • FIG. 35 is a schematic structural diagram of another embodiment of the cover plate assembly of the present application.
  • the transparent cover plate 200 in this embodiment includes a bottom wall 210 and a
  • the bottom wall 210 is a side wall 220 of an integrated structure, the side wall 220 is bent and disposed relative to the bottom wall 210 , and the electrochromic module 100 is bonded to the bottom wall 210 and the side wall 220 .
  • the side walls 220 are arranged on opposite sides of the bottom wall 210, generally referred to as 2.5D in the industry, the side walls 220 are arranged on four sides of the bottom wall 210, in the industry Generally referred to as 3D), the requirements for the adhesion between the plastic frame of the electrochromic module 100 and other film structures are also different.
  • the bending angle a between the side wall 220 and the bottom wall 210 is greater than 30 degrees, the adhesive force between the plastic frame 160 and the first substrate 110 or the second substrate 150 is required to be greater than 20 N/inch, and the adhesive The adhesion between the frame 160 and the water-oxygen blocking unit 170 is greater than 20 N/inch.
  • the adhesive force between the plastic frame 160 and the first substrate 110 and the water-oxygen barrier unit 170 is about 28N/inch, especially considering that the 3D glass cover needs to be attached, the adhesive The part of the frame will be bent, and our bonding surface needs to be used as a structural support, so the bonding force needs to be high. If it is not used as a structural support, it is only from the perspective of waterproofing of the device (that is to say, the bending is not considered. 34), the adhesive force between the plastic frame and other structural layers only needs to be about 1N/inch, and the requirement for the elongation at break of the plastic frame can also be reduced. If the adhesive force is not enough, it is easy to open the glue.
  • the elongation at break of the plastic frame 160 ranges from 17% to 200%. If the elongation at break of the plastic frame 160 is insufficient, or is too low, there will be problems of insecure or in-place bonding, especially the position of the bending area of the 3D transparent cover. Please refer to Figure 51.
  • Figure 51 is a When the elongation at break of the electrochromic module plastic frame is insufficient, the bonding is not in place.
  • the solid line in the figure represents the schematic diagram of the structure of the electrochromic module 100 and the transparent cover 200 being bonded in place at the bending position, and the dotted line represents the structure of the electrochromic module 100 is too rigid due to insufficient elongation at break of the plastic frame 160 .
  • a gap 102 a is likely to be formed between the electrochromic module 100 and the transparent cover plate 200 , thereby generating air bubbles, which affects the bonding effect and the display effect.
  • 1101 in the figure represents an optical adhesive layer.
  • FIG. 36 is a schematic structural diagram of single-side lead binding of the cover plate assembly, wherein the electrochromic module needs to be connected to the control circuit board (not shown) through the flexible circuit board 183 .
  • a small portion of metal leads (specifically, the first metal traces 181 or the trace connection ends 1801 provided on the first substrate 110 , see FIG. 17 ) from the first conductive layer 120 on the side of the upper first substrate 110 , so as to bind with the flexible circuit board.
  • the bonding process may be a high-temperature lamination bonding process using ACF glue (Anisotropic Conductive Film (ACF)).
  • pressing temperature 120°C-140°C, pressure: 20-30N; pressing time: 5-15 seconds.
  • the assembling method of the cover plate assembly in the embodiment of the present application may be as follows: the electrochromic module 100 (including the water-oxygen barrier unit 170 ) as a whole is firstly pasted with the optical glue used for bonding the transparent cover plate 200 ; Then, the electrochromic module 100 attached with the optical glue is bound to the flexible circuit board 183 , and then the electrochromic module 100 bound with the flexible circuit board 183 is attached to the transparent cover plate 200 .
  • the assembly method of the cover plate assembly can also be as follows: firstly, the electrochromic module 100 and the flexible circuit board 183 are bound; after binding the flexible circuit board 183, the optical adhesive is attached; and finally the transparent cover is attached. board 200.
  • this solution can solve the impact of optical glue on the ACF bonding process. It can be bonded according to the normal pressure of 40N, which reduces the resulting poor press-fit conduction.
  • a small piece of protective glue 1808 is added to the bonding portion of the flexible circuit board 183 and the metal wire in order to prevent the subsequent intrusion of water vapor and cause the conduction failure of the ACF.
  • the protective glue 1808 can be liquid UV glue, which is covered on the position in the form of dispensing.
  • the flexible circuit board 183 can be effectively protected from corrosion by water vapor and the resulting salt mixture.
  • FIG. 37 is a schematic cross-sectional view of the structure of another embodiment of the cover plate assembly of the present application.
  • the photochromic module 100 is a staggered structure. Specifically, in this embodiment, the relative projections of the first conductive layer 120 and the second conductive layer 140 in the thickness direction overlap, and the color-changing material layer 130 is sandwiched between the first conductive layer Between the projected overlap area of the layer 120 and the second conductive layer 140, the first metal trace 181 and the second metal trace 182 are respectively connected with the first conductive layer 120 and the second conductive layer The projection non-overlapping area of 140 is connected; the first metal wiring 181 and the second metal wiring 182 are both embedded in the plastic frame 160 .
  • the transparent cover 200 , the plastic frame 160 and the water-oxygen blocking unit 170 realize water vapor barrier around the electrochromic module 100 .
  • the staggered-chip structure provided in this embodiment reduces the risk of easy short-circuiting of the metal wiring, and reduces the technological difficulty of the metal wiring (the wiring can be easily realized by dispensing silver paste with a glue dispenser or silk screen printing, and it will not be easy to correct the wiring).
  • the packaging scheme is carried out independently of the production process of other structural layers of the electrochromic module 100 , and the smallest packaging unit (the structure of a single electrochromic module 100 ) can be flexibly designed without affecting the electrochromic function, and can be adapted to multiple application scenarios. design requirements.
  • FIG. 38 is a schematic cross-sectional view of the structure of a cover plate assembly according to another embodiment of the present application; the cover plate assembly in this embodiment is characterized by the packaging position of the plastic frame.
  • each layered structure of the electrochromic module 100 is sandwiched between the transparent cover plate 200 and the water and oxygen blocking unit 170 , and the plastic frame 160 is surrounded by the electrochromic module 100 and the transparent cover plate 200 and the water and oxygen blocking unit 170 together to achieve the sealing of the electrochromic module 100 .
  • the feature of the cover plate assembly in this embodiment is that the upper plane, the lower plane and the periphery of the electrochromic module 100 are sealed by the transparent cover plate 200 , the water and oxygen blocking unit 170 and the plastic frame respectively, which can well prevent the intrusion of water vapor. .
  • the water and oxygen barrier unit 170 has good water and oxygen barrier performance, and the water and oxygen barrier unit 170 and the transparent cover plate 200 (specifically, a glass cover plate) are respectively well bonded to the encapsulation frame, preventing water and oxygen from invading from the edge interface.
  • the package reliability of the middle structure is high, the overall device is relatively light and thin, and the package frame is narrow, which can meet the application conditions of electronic products such as mobile phones.
  • FIG. 39 is a schematic flowchart of an embodiment of a method for assembling a cover plate assembly in the embodiment of FIG. 38 ; the assembling method includes the following steps.
  • Step M3901 attaching the electrochromic module to the transparent cover plate.
  • the preparation method of the electrochromic module generally includes the following steps.
  • the first is to prepare a conductive substrate with metal traces.
  • On the upper and lower two PET/ITO films (respectively, the first conductive layer 120 is formed on the first substrate 110 and the second conductive layer 140 is formed on the second substrate) by screen printing Ag or metallized film and then etching, etc.
  • the metal traces (the first metal trace 181 and the second metal trace 182 ) are made by the process method.
  • another insulating protective layer (1810, 1820) is prepared on the surface of the metal lines.
  • the preparation methods of the insulating protective layer include screen printing insulating varnish, exposure and development after coating insulating varnish, or deposition of an inorganic insulating protective layer (such as SiO2), and the like. Then, the electrochromic layer (ie EC layer) 131, the dielectric layer 132, and the ion storage layer (ie IC layer) 133 (see Figure 2 for details) are respectively coated on the upper and lower PET/ITO films, and then Alignment fit. Finally, laser cutting is carried out according to the design shape, the excess material on the edge is removed, and the edges of the upper and lower PET/ITO films are flush, and then the flexible circuit board is bound. .
  • an inorganic insulating protective layer such as SiO2
  • step M3902 glue is dispensed around the periphery of the electrochromic module to form a glue frame.
  • FIG. 40 is a schematic structural diagram of the electrochromic module and the transparent cover after lamination and dispensing.
  • Step M3903 attaching the water-oxygen blocking unit to a surface of the electrochromic module away from the transparent cover plate.
  • an optical glue (such as 1701 in the previous embodiment) may be used to separate the water-oxygen blocking unit 170 and the electrochromic module from the side surface of the transparent cover plate (specifically, the second substrate in this embodiment). 150 external surface) bonding.
  • the assembling method of the cover plate assembly provided in this embodiment has the characteristics of simple process and good waterproof performance of the formed cover plate assembly.
  • FIG. 41 is a schematic structural diagram of bonding a rear cover plate and a middle frame of an electronic device in the conventional technology.
  • the rear cover 200a of electronic equipment such as mobile phones is generally directly bonded with the middle frame 20a by dispensing 2002.
  • 55 indicates the structure of the battery, circuit board, etc. inside the electronic equipment
  • 2001 indicates the rear cover 200a.
  • the bonding method of the rear cover 200a and the middle frame 20a is too tight, so it is inconvenient to disassemble the rear cover 200a.
  • a hot air gun and a pulling and adsorption device are required to remove the rear cover 200a.
  • the vibration reduction effect between the rear cover 200a and the middle frame 20a is poor.
  • the rear cover 200a vibrates strongly, and the components attached to the rear cover 200a are easily detached by vibration. , and even vibration dislocation.
  • FIG. 42 is a schematic cross-sectional view of the structure of an embodiment of the casing assembly of the present application
  • FIG. 43 is the casing in FIG. 42
  • a schematic front view of the structure of the assembly; the casing assembly (also referred to as a casing) includes a middle frame 20 and a cover plate assembly 10; wherein, the cover plate assembly 10 can be the cover plate assembly structure in the previous embodiment, and this embodiment only A structure is taken as an example for schematic illustration.
  • opposite sides of the electrochromic module 100 are respectively bonded to the transparent cover 200 and the middle frame 20 , the bonding between the transparent cover 200 and the middle frame 20 is cancelled, and the transparent cover The plate 200 is spaced apart from the middle frame 20, and a buffer gap 202 is formed.
  • the water-oxygen blocking unit 170 of the electrochromic module 100 and the middle frame 20 may be bonded by foam glue 1702 , and specifically, it may be between the appearance film layer 173 of the water-oxygen blocking unit 170 and the middle frame 20 . Bonded by foam glue 1702.
  • the foam glue 1702 can play a bonding role on the one hand, and a buffering role on the other hand.
  • the indentation distance D1 of the electrochromic module 100 relative to the edge of the transparent cover plate 200 is 0.3-0.6 mm
  • the foam glue 1702 is attached to the bottom of the electrochromic module 100, and its width D2 can be 2-4 mm
  • the width D2 of the foam glue 1702 can be designed to be larger than the width T of the plastic frame 160 to ensure the reliability of bonding, and the thickness of the foam glue 1702 can be 0.2-0.4 mm, which is not specifically limited here.
  • the projection of the foam glue 1702 on the transparent cover plate 200 at least partially overlaps with the projection of the plastic frame 160 on the transparent cover plate 200 .
  • the purpose of this design is to ensure that the adhesive force of the foam glue 1702 to the electrochromic module 100 is close to the plastic frame 160, because the previous embodiment has described the plastic frame 160 with the substrate and the water and oxygen barrier unit.
  • the adhesive force of 170 is generally stronger than the adhesive force between the sub-layer structures of the color-changing material layer 130 (the pull-out force between the color-changing material layers 130 is generally less than 20N);
  • the width of the black border is D1+T) as small as possible.
  • the width of the black border is the width of the black border, otherwise the width of the black border is the sum of the two widths or the sum of the widths minus the width of the projection overlap.
  • the housing assembly can be roughly divided into a camera reserved area X, a discoloration area Y, and a black border area Z.
  • the electrochromic module 100 can be first bonded to the transparent cover plate 200 to form a cover plate assembly, and then the cover plate assembly can be conveniently assembled to the middle frame;
  • the width of the encapsulation layer of the electrochromic module can be designed to be thicker under the black edge condition design, which is beneficial to the protection of the electrochromic module; It can be repaired with high repetition rate and low repair cost.
  • FIG. 44 is a partial structural block diagram of an embodiment of the electronic device of the present application.
  • the electronic device in this embodiment includes a display screen module 30 and a casing
  • the display module 30 and the cover plate assembly 10 are respectively disposed on opposite sides of the middle frame 20, that is, the cover plate assembly 10 in this embodiment is a rear cover structure of an electronic device .
  • the detailed technical features of the structures of other parts of the electronic device are within the understanding of those skilled in the art, and will not be repeated here.
  • FIG. 42 and FIG. 44 Please refer to FIG. 42 and FIG. 44 in combination.
  • Cover plate, electrochromic module, water and oxygen barrier unit) are applied to electronic equipment to illustrate.
  • Table 4 for the specific sample data. Among them, reliability test conditions: temperature 65 degrees, humidity 95%.
  • FIG. 50 is a schematic diagram of the structure of the reverse color patch when the electrochromic module fails, and the position marked 888 in the figure represents the reverse color patch area.
  • Table 5 is the data table of the electronic equipment test experiment.
  • the test conditions are conventional test conditions in the field of electronic equipment (a mobile phone is used as an example for testing in this embodiment), and are used to test the working reliability of the electrochromic module on the electronic equipment.
  • the electrochromic module package structure in the embodiments of the present application can also meet the high temperature and high humidity tests of electronic products and meet the application conditions of electronic products.
  • an embodiment of the present application further provides an electronic device.
  • FIG. 45 is a structural block diagram of another embodiment of the electronic device of the present application.
  • the electronic device includes a control circuit 40 and a cover plate assembly 10 .
  • the control circuit 40 is coupled and connected to the electrochromic module 100 of the cover plate assembly 10 , and the control circuit 40 is configured to receive control instructions, and the control instructions are used to control the electrochromic module 100 to change color.
  • FIG. 46 is a structural block diagram of another embodiment of the electronic device of the present application. Different from the previous embodiment, the electronic device in this embodiment further includes a signal input device 50, wherein, The signal input device 50 is coupled to the control circuit 40 .
  • control circuit 40 is configured to receive a control command input through the signal input device 50, and control the working state of the electrochromic module 100 according to the control command; wherein, the electrochromic module
  • the working state of the electrochromic module 100 includes controlling and changing its voltage or current signal state to achieve the purpose of controlling the discoloration state of the electrochromic module 100 .
  • the signal input device 50 may include a touch display screen, an operation button, a trigger sensor, etc.
  • FIG. 47 is a schematic structural diagram of an embodiment of an electronic device, wherein the signal input device 50 may be a touch display screen 51, and the control command input by the signal input device 50 may be a touch display
  • the touch operation received by the screen 51 includes at least one of sliding, clicking and long pressing
  • FIG. 48 and FIG. 49 FIG. 48 is a schematic diagram of an operation state of the electronic device; A schematic diagram of an operating state.
  • the operator marked with 005 in the figure can be expressed as the operator's hand
  • the input process of the control command is performed according to the diagram or a specific position on the touch screen 51 .
  • the signal input device 50 may be an operation key 52
  • the control instruction may also be a trigger instruction of the operation key 52, wherein the operation key 52 may be a separate key, or a
  • Other functional buttons of the electronic device such as the multiplexing of the power button, the volume button, etc., are defined as different control commands received by the control circuit 40 according to different button triggering methods, and then the control circuit 40 can realize different operations on the electrochromic module 100. signal control.
  • the control instruction is a usage scenario that requires the electronic device to change color, which may specifically include at least one of an image capture requirement, a flash turning-on requirement, an automatic timing discoloration requirement, and other functional component requirements.
  • the image capture requirement can be applied to the user's shooting needs, such as scenes such as photography, videography, video calls, electronic device unlocking needs, payment, encryption, answering incoming calls, or other confirmation needs and other scenarios.
  • the demand for turning on the flashlight may be when the user needs to turn on the flashlight.
  • the control circuit 40 controls the electrochromic module 100 to change the transparent state, and can also be combined with structures such as the appearance film and the substrate color layer, so that the Electronic devices can exhibit a discolored appearance.
  • the signal input device 50 can be a trigger sensor 53, wherein the trigger sensor 53 can be a proximity sensor, a temperature sensor, an ambient light sensor, etc., the trigger sensor 53 collects peripheral signals of the electronic equipment, and controls the Circuit 40 controls the housing assembly to change appearance color. That is, the change of the appearance and color of the casing assembly can enable the user to actively control the operation, similar to the control method through the touch screen and the operation buttons; it is also possible to automatically detect the environmental signal through the trigger sensor in this embodiment, and automatically control the casing. The way a component changes its appearance color.
  • the electronic device provided by the embodiment of the present application has the appearance effect of discoloration display, and has very good appearance aesthetics.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)

Abstract

L'invention concerne un module électrochromique (100), comprenant un premier substrat (110), une première couche conductrice (120), une couche de matériau chromique (130), une seconde couche conductrice (140), un second substrat (150) et un cadre en caoutchouc (160), le premier substrat (110), la première couche conductrice (120), la couche de matériau chromique (130), la seconde couche conductrice (140) et le second substrat (150) étant empilés séquentiellement ; le cadre en caoutchouc (160) est disposé autour de la circonférence d'un bord latéral de la couche de matériau chromique (130) de manière à sceller la circonférence de la couche de matériau chromique (130) ; et le taux de transmission de vapeur d'eau du cadre en caoutchouc (160) n'est pas supérieur à 20 g/m2/jour. Au moyen de la conception et de la sélection de la structure et du matériau du cadre en caoutchouc (160), toute la structure du module électrochromique (100) est assurée pour avoir de bonnes performances d'étanchéité à l'eau, ce qui permet de stabiliser la propriété chromique du module électrochromique (100) et de prolonger la durée de vie.
PCT/CN2021/103718 2020-09-04 2021-06-30 Dispositif électronique, ensemble boîtier, ensemble plaque de recouvrement et module électrochromique WO2022048291A1 (fr)

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113805396A (zh) * 2020-06-12 2021-12-17 Oppo广东移动通信有限公司 电致变色组件和制备方法、电子设备
CN112147828B (zh) * 2020-09-04 2023-06-30 Oppo广东移动通信有限公司 电子设备、壳体组件、盖板组件以及电致变色模组
CN112954093A (zh) * 2021-02-10 2021-06-11 东莞市聚龙高科电子技术有限公司 一种渐变色手机后盖及其制备方法
CN114979319B (zh) * 2021-02-24 2023-04-14 Oppo广东移动通信有限公司 电子设备及其壳体组件
CN113311627B (zh) * 2021-05-31 2023-04-14 Oppo广东移动通信有限公司 电子设备、壳体组件、电致变色模组及其制作方法
CN113391495A (zh) * 2021-06-28 2021-09-14 Oppo广东移动通信有限公司 电子设备、壳体组件以及电致变色模组
CN113433755B (zh) * 2021-06-29 2023-03-28 Oppo广东移动通信有限公司 电子设备、壳体组件、电致变色模组及其制备方法
CN113899458A (zh) * 2021-09-22 2022-01-07 Oppo广东移动通信有限公司 光学传感器及电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5379146A (en) * 1992-04-28 1995-01-03 Saint-Gobain Vitrage International Electrochromic pane
US6373618B1 (en) * 2000-05-04 2002-04-16 Schott-Donnelly, Llc Chromogenic glazing for automobiles and display filters
CN109188818A (zh) * 2018-10-16 2019-01-11 Oppo广东移动通信有限公司 电致变色器件及制备方法、壳体、电子设备
CN109581777A (zh) * 2019-01-12 2019-04-05 Oppo广东移动通信有限公司 电子设备、壳体组件、电致变色模组及其制备方法
CN110308602A (zh) * 2019-05-30 2019-10-08 Oppo广东移动通信有限公司 电子设备、壳体组件、电致变色器件及其变色介质材料
CN110928096A (zh) * 2019-12-30 2020-03-27 Oppo广东移动通信有限公司 电致变色器件、壳体和电子设备
CN111443545A (zh) * 2020-05-12 2020-07-24 深圳市光羿科技有限公司 一种边缘密封导电基体与电致变色器件
CN112147828A (zh) * 2020-09-04 2020-12-29 Oppo广东移动通信有限公司 电子设备、壳体组件、盖板组件以及电致变色模组
CN112147827A (zh) * 2020-09-04 2020-12-29 Oppo广东移动通信有限公司 电子设备、壳体、电致变色模组及其封装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013218796A (ja) * 2012-04-04 2013-10-24 Sumitomo Chemical Co Ltd 電子デバイス

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5379146A (en) * 1992-04-28 1995-01-03 Saint-Gobain Vitrage International Electrochromic pane
US6373618B1 (en) * 2000-05-04 2002-04-16 Schott-Donnelly, Llc Chromogenic glazing for automobiles and display filters
CN109188818A (zh) * 2018-10-16 2019-01-11 Oppo广东移动通信有限公司 电致变色器件及制备方法、壳体、电子设备
CN109581777A (zh) * 2019-01-12 2019-04-05 Oppo广东移动通信有限公司 电子设备、壳体组件、电致变色模组及其制备方法
CN110308602A (zh) * 2019-05-30 2019-10-08 Oppo广东移动通信有限公司 电子设备、壳体组件、电致变色器件及其变色介质材料
CN110928096A (zh) * 2019-12-30 2020-03-27 Oppo广东移动通信有限公司 电致变色器件、壳体和电子设备
CN111443545A (zh) * 2020-05-12 2020-07-24 深圳市光羿科技有限公司 一种边缘密封导电基体与电致变色器件
CN112147828A (zh) * 2020-09-04 2020-12-29 Oppo广东移动通信有限公司 电子设备、壳体组件、盖板组件以及电致变色模组
CN112147827A (zh) * 2020-09-04 2020-12-29 Oppo广东移动通信有限公司 电子设备、壳体、电致变色模组及其封装方法

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