WO2022044867A1 - Composition pour placage, et procédé de fabrication d'élément lié métal et résine - Google Patents
Composition pour placage, et procédé de fabrication d'élément lié métal et résine Download PDFInfo
- Publication number
- WO2022044867A1 WO2022044867A1 PCT/JP2021/029896 JP2021029896W WO2022044867A1 WO 2022044867 A1 WO2022044867 A1 WO 2022044867A1 JP 2021029896 W JP2021029896 W JP 2021029896W WO 2022044867 A1 WO2022044867 A1 WO 2022044867A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- resin member
- cladding composition
- base material
- resin
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 168
- 239000002184 metal Substances 0.000 title claims abstract description 168
- 229920005989 resin Polymers 0.000 title claims abstract description 98
- 239000011347 resin Substances 0.000 title claims abstract description 98
- 239000000203 mixture Substances 0.000 title claims abstract description 91
- 238000005253 cladding Methods 0.000 title claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000011230 binding agent Substances 0.000 claims abstract description 30
- 239000011358 absorbing material Substances 0.000 claims abstract description 21
- 239000003960 organic solvent Substances 0.000 claims abstract description 16
- 230000001678 irradiating effect Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 74
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 239000010457 zeolite Substances 0.000 claims description 10
- -1 zeolite compound Chemical class 0.000 claims description 10
- 229910021536 Zeolite Inorganic materials 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 4
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims 1
- 238000005304 joining Methods 0.000 abstract description 18
- 238000010438 heat treatment Methods 0.000 abstract description 11
- 239000008199 coating composition Substances 0.000 abstract description 2
- 239000011324 bead Substances 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 14
- 239000004734 Polyphenylene sulfide Substances 0.000 description 12
- 229920000069 polyphenylene sulfide Polymers 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000010419 fine particle Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 8
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical class O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 7
- 239000011259 mixed solution Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 150000005846 sugar alcohols Polymers 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 239000001913 cellulose Chemical class 0.000 description 4
- 229920002678 cellulose Chemical class 0.000 description 4
- 235000010980 cellulose Nutrition 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 239000002808 molecular sieve Substances 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001241 acetals Chemical class 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- NMRPBPVERJPACX-UHFFFAOYSA-N octan-3-ol Chemical compound CCCCCC(O)CC NMRPBPVERJPACX-UHFFFAOYSA-N 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 2
- CETWDUZRCINIHU-UHFFFAOYSA-N 2-heptanol Chemical compound CCCCCC(C)O CETWDUZRCINIHU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 2
- FCOUHTHQYOMLJT-UHFFFAOYSA-N 6-methylheptan-2-ol Chemical compound CC(C)CCCC(C)O FCOUHTHQYOMLJT-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical class CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical class COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- RZKSECIXORKHQS-UHFFFAOYSA-N Heptan-3-ol Chemical compound CCCCC(O)CC RZKSECIXORKHQS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000002734 clay mineral Substances 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 2
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical compound CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 description 2
- 239000006072 paste Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- ZQTYQMYDIHMKQB-RRKCRQDMSA-N (1s,3r,4r)-bicyclo[2.2.1]heptan-3-ol Chemical compound C1C[C@H]2[C@H](O)C[C@@H]1C2 ZQTYQMYDIHMKQB-RRKCRQDMSA-N 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- WPCMSUSLCWXTKB-UHFFFAOYSA-N 1-cyclopentylethanol Chemical compound CC(O)C1CCCC1 WPCMSUSLCWXTKB-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- XXXFZKQPYACQLD-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl acetate Chemical compound CC(=O)OCCOCCO XXXFZKQPYACQLD-UHFFFAOYSA-N 0.000 description 1
- WOFPPJOZXUTRAU-UHFFFAOYSA-N 2-Ethyl-1-hexanol Natural products CCCCC(O)CCC WOFPPJOZXUTRAU-UHFFFAOYSA-N 0.000 description 1
- QJQZRLXDLORINA-UHFFFAOYSA-N 2-cyclohexylethanol Chemical compound OCCC1CCCCC1 QJQZRLXDLORINA-UHFFFAOYSA-N 0.000 description 1
- TZYRSLHNPKPEFV-UHFFFAOYSA-N 2-ethyl-1-butanol Chemical compound CCC(CC)CO TZYRSLHNPKPEFV-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- PPPFYBPQAPISCT-UHFFFAOYSA-N 2-hydroxypropyl acetate Chemical compound CC(O)COC(C)=O PPPFYBPQAPISCT-UHFFFAOYSA-N 0.000 description 1
- NDVWOBYBJYUSMF-UHFFFAOYSA-N 2-methylcyclohexan-1-ol Chemical compound CC1CCCCC1O NDVWOBYBJYUSMF-UHFFFAOYSA-N 0.000 description 1
- WIYNOPYNRFPWNB-UHFFFAOYSA-N 3,5-Dimethylcyclohexanol Chemical compound CC1CC(C)CC(O)C1 WIYNOPYNRFPWNB-UHFFFAOYSA-N 0.000 description 1
- NMRPBPVERJPACX-QMMMGPOBSA-N 3-Octanol Natural products CCCCC[C@@H](O)CC NMRPBPVERJPACX-QMMMGPOBSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 1
- ZVHAANQOQZVVFD-UHFFFAOYSA-N 5-methylhexan-1-ol Chemical compound CC(C)CCCCO ZVHAANQOQZVVFD-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- AXPZDYVDTMMLNB-UHFFFAOYSA-N Benzyl ethyl ether Chemical compound CCOCC1=CC=CC=C1 AXPZDYVDTMMLNB-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Chemical class 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 229910001347 Stellite Inorganic materials 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- XRLHGXGMYJNYCR-UHFFFAOYSA-N acetic acid;2-(2-hydroxypropoxy)propan-1-ol Chemical compound CC(O)=O.CC(O)COC(C)CO XRLHGXGMYJNYCR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical class C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002635 aromatic organic solvent Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 1
- YFNONBGXNFCTMM-UHFFFAOYSA-N butoxybenzene Chemical compound CCCCOC1=CC=CC=C1 YFNONBGXNFCTMM-UHFFFAOYSA-N 0.000 description 1
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- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- AHICWQREWHDHHF-UHFFFAOYSA-N chromium;cobalt;iron;manganese;methane;molybdenum;nickel;silicon;tungsten Chemical compound C.[Si].[Cr].[Mn].[Fe].[Co].[Ni].[Mo].[W] AHICWQREWHDHHF-UHFFFAOYSA-N 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- QCRFMSUKWRQZEM-UHFFFAOYSA-N cycloheptanol Chemical compound OC1CCCCCC1 QCRFMSUKWRQZEM-UHFFFAOYSA-N 0.000 description 1
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- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzylether Substances C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical class CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
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- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
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- 239000004615 ingredient Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000004584 polyacrylic acid Chemical class 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Chemical class 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
Definitions
- the present invention relates to a cladding composition and a method for manufacturing a metal / resin bonding member.
- Examples of the new material include those in which different materials are joined together.
- Adhesives are commonly used when joining dissimilar materials together.
- the use of an adhesive has a large environmental load, the adhesive itself deteriorates over time, and there is a problem in terms of bonding strength.
- Patent Document 1 a metal powder is adhered to one surface of a metal substrate and irradiated with a laser to form a superimposed fine particle structure alloyed with the metal substrate, and the superimposed fine particles are formed.
- a joining method for joining a metal base material and a resin member by pressing a resin member against a structure and irradiating the interface with a laser to heat the structure is disclosed.
- the present invention has been made in view of the above circumstances, and the bonding strength between the metal base material and the resin member is higher without using an adhesive, and the bonding strength deteriorates with time in a high temperature and high humidity environment. It is an object of the present invention to provide a method for manufacturing a metal / resin joint member in which the amount is suppressed. Another object of the present invention is to provide a cladding composition capable of stably bonding a metal base material and a resin member and suppressing deterioration of bonding strength over time in a high temperature and high humidity environment. do.
- the present invention has adopted the following configuration. That is, the first aspect of the present invention is a cladding composition comprising a metal powder, a binder, a water absorbing material, and an organic solvent.
- a second aspect of the present invention is a method for manufacturing a metal / resin bonding member in which a metal base material and a resin member are bonded, and a bracket of the first aspect of the present invention is applied to at least a part of the metal base material.
- the bonding strength between the metal base material and the resin member is higher without using an adhesive, and the bonding strength deteriorates with time in a high temperature and high humidity environment. It is possible to manufacture a metal / resin joint member in which the amount is suppressed. Further, according to the cladding composition of the present invention, the metal substrate and the resin member can be stably bonded, and the deterioration of the bonding strength between the metal substrate and the resin member over time in a high temperature and high humidity environment is suppressed. can do.
- the cladding composition of the present embodiment contains a metal powder, a binder, a water absorbing material, and an organic solvent.
- the "cladding composition” in the present invention refers to a material that melts and solidifies on the surface of a metal base material that is a base material to form beads (projections of an alloy).
- Metal powder examples include aluminum, nickel, chromium, iron, copper, titanium, silicon, stellite, vanadium, or alloys thereof.
- the metal powder one type may be used alone, or two or more types may be used in combination. By combining two or more kinds of metals, it becomes easy to form a porous structure on the bead surface, and for example, it becomes easy to increase the bonding strength between the metal base material and the resin member.
- the metal powder preferably contains at least one selected from the group consisting of aluminum powder and titanium powder, and examples thereof include those containing aluminum powder and titanium powder.
- the average particle size of the metal powder is, for example, about 10 ⁇ m or more and 100 ⁇ m or less.
- the "average particle size of powder" in the present invention means the value of the volume average particle size of powder measured by a known particle size distribution measuring device.
- the content of the metal powder is preferably 25 to 94% by mass, more preferably 30 to 85% by mass, still more preferably 35 to 75% by mass, based on the total amount (100% by mass) of the cladding composition. , 40-65% by mass is particularly preferable.
- the content of the metal powder is not less than the lower limit of the above-mentioned preferable range, for example, the bonding strength between the metal base material and the resin member is more likely to be increased, while when it is not more than the upper limit of the above-mentioned preferable range. , Easy to handle as a composition.
- the binder in the present embodiment acts as a dispersant for metal powders and also as a viscosity modifier in the cladding composition.
- An organic compound may be used or an inorganic compound may be used as the binder.
- Examples of the organic compound in the binder include polyvinyl acetal, cellulose compounds, polyacrylic acid and other acrylic compounds, polyvinyl alcohol, epoxy compounds and the like.
- Specific examples of the polyvinyl acetal include polyvinyl formal and polyvinyl butyral.
- Specific examples of the cellulose compound include hydroxypropyl cellulose and hydroxyethyl cellulose.
- Examples of the inorganic compound in the binder include clay minerals.
- Specific examples of clay minerals include bentonite, smectite, and montmorillonite.
- the binder may be used alone or in combination of two or more.
- the binder is preferably an organic compound, and among them, a binder containing polyvinyl acetal is preferable because it has strong adhesiveness to a metal and has good dispersibility with metal powder, and among them, a binder containing polyvinyl butyral is particularly preferable. preferable.
- a binder containing polyvinyl butyral for example, those having a mass average molecular weight (Mw) of 10,000 to 80,000, more preferably those having Mw of 20,000 to 60,000, and Mw are more preferable because the bonding strength between the metal base material and the resin member is likely to be increased. Is more preferably 30,000 to 50,000.
- the binder is more preferably one containing a cellulose compound because it is easy to adjust the viscosity of the composition.
- a cellulose compound hydroxypropyl cellulose is preferable.
- hydroxypropyl celluloses for example, those having a Mw of 100,000 to 800,000 are preferable, those having a Mw of 110,000 to 700,000, and those having a Mw of 120,000 to 650000 are preferable because the bonding strength between the metal base material and the resin member is likely to be increased. Is more preferable.
- the binder content is preferably 0.01 to 10% by mass, more preferably 0.05 to 7% by mass, and 0.1 to 5% by mass, based on the total amount (100% by mass) of the cladding composition. By mass% is more preferable, 0.2 to 5% by mass is particularly preferable, and 0.5 to 2% by mass is most preferable.
- the binder content is at least the lower limit of the above-mentioned preferable range, for example, the bonding strength between the metal base material and the resin member can be more easily increased, and the applicability of the composition to the metal base material can be improved. Improve more.
- it is not more than the upper limit of the above-mentioned preferable range it becomes easy to handle as a composition.
- the water-absorbing material in the present embodiment absorbs moisture that has penetrated into the bonding interface between the metal base material and the resin member over time. As a result, corrosion of the joint portion is prevented, and deterioration of the joint strength between the metal base material and the resin member with time is suppressed.
- the water absorbing material include zeolite compounds, alumina, silica, activated carbon, calcium oxide and the like.
- the zeolite compound any of synthetic zeolite, artificial zeolite, and natural zeolite can be used, and examples thereof include molecular sieve and high silica zeolite.
- the water absorbing material one type may be used alone, or two or more types may be used in combination.
- the water-absorbing material is preferably a zeolite compound, and more preferably one containing at least one selected from the group consisting of molecular sieves and high silica zeolites.
- the molecular sieve and high silica zeolite are preferably molded into powder or pellet form, and their average particle size is, for example, about 1 ⁇ m or more and 50 ⁇ m or less.
- the content of the water-absorbent material is preferably 5 to 40% by mass, more preferably 5 to 35% by mass, still more preferably 6 to 25% by mass, based on the total amount (100% by mass) of the cladding composition. , 6-15% by mass is particularly preferable.
- the content of the water-absorbing material is at least the lower limit of the above-mentioned preferable range, for example, deterioration of the bonding strength between the metal base material and the resin member in a high-temperature and high-humidity environment with time is likely to be suppressed.
- the bonding strength between the metal base material and the resin member can be further increased. In addition, it becomes easy to handle as a composition.
- the mixing ratio of the metal powder and the water absorbing material is preferably 90/10 to 50/50 as a mass ratio, and 90/10 to 60. It is more preferably / 40, and even more preferably 90/10 to 70/30.
- the mass ratio is at least the lower limit of the above-mentioned preferable range, the bonding strength between the metal base material and the resin member can be further increased.
- it is not more than the upper limit of the above-mentioned preferable range, it becomes easy to handle as a composition.
- organic solvent in the present embodiment examples include those that serve as a dispersion medium for the above-mentioned metal powder and binder.
- organic solvent methanol, ethanol, n-propyl alcohol, isopropyl alcohol, n-pentyl alcohol, s-pentyl alcohol, t-pentyl alcohol, isopentyl alcohol, 2-methyl-1-propanol, 2- Ethylbutanol, neopentyl alcohol, n-butanol, s-butanol, t-butanol, n-hexanol, 2-heptanol, 3-heptanol, 2-methyl-1-butanol, 2-methyl-2-butanol, 4-methyl -2-Pentanol, 1-butoxy-2-propanol, propylene glycol monopropyl ether, 5-methyl-1-hexanol, 6-methyl-2-heptanol, 1-oc
- polyhydric alcohols such as monoalkyl ethers such as butyl ether or compounds having an ether bond such as monophenyl ether [among these, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferable].
- monoalkyl ethers such as butyl ether
- compounds having an ether bond such as monophenyl ether
- PGMEA propylene glycol monomethyl ether acetate
- PGME propylene glycol monomethyl ether
- Ring type like dioxane Ethers and esters such as methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate; anisole, ethylbenzyl ether, Aromatic organic solvents such as cresylmethyl ether, diphenyl ether, dibenzyl ether, phenetol, butylphenyl ether, ethylbenzene, diethylbenzene, pentylbenzene, isopropylbenzene, toluene, xylene, simene, mesitylen, dimethylsulfoxide (DMSO) and the like can be mentioned. Be done.
- DMSO dimethylsulfoxide
- the organic solvent preferably contains a derivative of a polyhydric alcohol.
- the derivative of the polyhydric alcohol the polyhydric alcohol or the monoalkyl ether of the compound having an ester bond is preferable, and specifically, PGMEA and PGME are preferably mentioned.
- the content of the organic solvent is preferably 0.1 to 60% by mass, more preferably 10 to 50% by mass, and 15 to 40% by mass with respect to the total amount (100% by mass) of the cladding composition. More preferably, 20 to 30% by mass is particularly preferable.
- the cladding composition of the present embodiment may further contain other components other than the above-mentioned metal powder, binder, water absorbing material and organic solvent.
- other components include carbon powder, surfactant and the like.
- the cladding composition of the present embodiment further preferably contains carbon powder.
- the bead is easily formed by melting and solidifying on the surface of the metal base material which is the base material.
- the average particle size of the carbon powder is, for example, about 10 nm or more and 100 ⁇ m or less.
- the content of the carbon powder is preferably 0.1 to 40% by mass, more preferably 0.5 to 30% by mass, and 1 to 20% with respect to the total amount (100% by mass) of the cladding composition. % By mass is more preferred.
- the content of the carbon powder is not less than the lower limit of the above-mentioned preferable range, for example, the bonding strength between the metal base material and the resin member is more likely to be increased, while it is not more than the upper limit of the above-mentioned preferable range.
- the fluidity of the composition becomes better.
- the mixing ratio (mass ratio) of both is equal to or higher than the lower limit of the above-mentioned preferable range, for example, the bonding strength between the metal base material and the resin member can be more easily increased, while it is equal to or less than the upper limit of the above-mentioned preferable range. If so, the fluidity of the composition becomes better.
- the cladding composition of the present embodiment can be produced, for example, by a production method including a step of preparing a mixed solution of a binder and an organic solvent, and a step of mixing the mixed solution with a metal powder and a water absorbing material. can.
- the binder concentration is preferably 0.01 to 80% by mass, more preferably 0.1 to 40% by mass, and 1 to 15% by mass with respect to the mixed solution (100% by mass). % Is more preferable.
- the binder concentration is not less than the lower limit of the above-mentioned preferable range, the applicability of the composition to the metal substrate is further improved, while when it is not more than the upper limit of the above-mentioned preferable range, the composition is appropriately applied. It becomes easy to adjust the viscosity.
- a mixed powder in which the metal powder and the carbon powder are mixed may be mixed in advance.
- the metal powder and the water-absorbing material are preferably dispersed in a mixed solution of the binder and the organic solvent.
- the cladding composition of the embodiment include forms such as pastes, slurries, and suspensions, and pastes are preferable.
- paste as used herein means that the paste has fluidity and high viscosity, and the viscosity is in the range of 1000 cps (1 Pa ⁇ s) or more and 200,000 cps (200 Pa ⁇ s) or less.
- the viscosity of the paste indicates a value measured at 25 ° C. using an E-type viscometer.
- the cladding composition of the above-described embodiment contains a water-absorbing material, the moisture that has entered the bonding interface between the metal base material and the resin member is easily absorbed. Therefore, it is possible to prevent corrosion of the entire bead over time. As a result, deterioration of the bonding strength between the metal base material and the resin member over time is suppressed.
- the manufacturing method of the first embodiment is a method for manufacturing a metal / resin bonding member in which a metal base material and a resin member are bonded, and the above-mentioned cladding composition is applied to at least a part of the metal base material.
- examples of the metal base material as the base material include aluminum alloys, aluminum die casts, stainless steel, SPCC (cold rolled steel sheet) and the like.
- examples of the resin member include polyamide (nylon 6, nylon 6, 6, etc.), polycarbonate, polypropylene, polyphenylene sulfide (PPS), and the like.
- step (i) the above-mentioned cladding composition is applied to at least a part of the metal substrate.
- the method of applying the composition for cladding is not particularly limited, and examples thereof include screen application, dispenser, and spraying.
- the thickness of the coating film of the cladding composition applied to the metal substrate may be appropriately set according to the compounding components of the composition and the like, and is, for example, about 50 to 200 ⁇ m.
- the coated portion of the cladding composition on the metal substrate is irradiated with a laser.
- the laser that irradiates the coated portion may be any laser that can heat the metal powder, and examples thereof include a semiconductor laser, a fiber laser, an Nd: YAG laser, and a carbon dioxide gas laser.
- the coated part is irradiated with a laser and the metal powder melts.
- the metal in the molten state is alloyed with the metal base material to form beads (protrusions of the alloy, so-called overlay portions) on the surface of the metal base material.
- the binder and the like are burnt down by heating by laser irradiation.
- the bead preferably has a size (height with respect to the metal base material surface) of 1 ⁇ m or more and 200 ⁇ m or less.
- this bead has a superposed fine particle structure.
- the "superimposed fine particle structure” refers to a microstructure in which the fine concavo-convex shape structure is superposed on the fine concavo-convex shape surface.
- An anchor effect is exhibited by forming beads having a superposed fine particle structure on the surface of the metal substrate.
- the superimposed fine particle structure includes the case where an alloy layer made of any of eutectic, solid solution, and intermetallic compound is formed.
- the resin member is arranged on the laser irradiation portion of the metal substrate.
- a method of arranging the resin member on the laser irradiation part for example, a method of applying a resin composition which is a material of the resin member on the laser irradiation part to form a film, or a method of irradiating a molded body of the resin composition with a laser. There is a method of arranging it on the department. Further, when arranging the resin member on the laser irradiation portion, it is preferable that the resin member is in contact with and pressed against the metal base material.
- the optimum conditions may be selected in the pressure range of 0.1 to 3 MPa. As a result, the joint strength between the two is sufficiently increased.
- Step (iv) In the step (iv), the interface between the laser irradiation unit and the resin member is heated to bond the metal base material and the resin member to obtain a metal / resin bonding member.
- the method for heating the interface is not particularly limited, and examples thereof include heating by a heater and heating by laser irradiation.
- the method for heating the interface between the laser irradiation unit and the resin member is preferably heating by laser irradiation.
- the bead having a superposed fine particle structure formed on the surface of the metal substrate does not have transparency with respect to the wavelength of the laser. Therefore, in the case of heating by laser irradiation, the laser irradiated on the bead surface is converted into heat. The converted heat propagates to the surface of the resin member that is in contact and pressed, and melts the resin member. The molten resin member permeates the inside of the superimposed fine particle structure, and as a result, the metal base material and the resin member are firmly bonded to each other.
- the method of irradiating the laser from the resin member side is common.
- the metal is transmitted by irradiating the laser from the metal base material side, contrary to the general case.
- the interface between the metal base material and the resin member can be heated by heat.
- a bead having a superposed fine particle structure is formed on the surface of the metal substrate by using a cladding composition containing a binder and a water absorbing material together with the metal powder. .. Since the bead contains a water-absorbing material, the water that has entered the bonding interface between the metal base material and the resin member is absorbed by the water-absorbing material. This prevents corrosion of the joint portion and the like. Therefore, according to the manufacturing method of the first embodiment, it is possible to manufacture a metal / resin bonding member having a higher bonding strength between the metal base material and the resin member without using an adhesive.
- the bonding strength of the metal / resin bonding member produced by the production method of the first embodiment is, for example, 35 to 80 MPa.
- the cladding composition used exhibits appropriate viscosity by containing a binder and an organic solvent together with the metal powder, so that even when the metal base material is arranged on an inclined surface, it may be arranged on an inclined surface.
- the composition can be reliably applied to the planned joining site.
- the cladding composition used can be applied to the planned joining site in a less uniform amount and in a more uniform state than the metal powder. For this reason, the utilization efficiency of the cladding composition is particularly improved during laser irradiation.
- the cladding composition used can be uniformly applied even if the metal base material has a wider size than the metal powder. Therefore, the composition is useful for joining members having a wide size.
- the binder since the binder is contained together with the metal powder, it has an appropriate coarse and dense distribution, and beads with large irregularities are likely to be formed. Therefore, the bonding strength can be further increased, and the metal base material and the resin member can be stably bonded.
- the method for producing the cladding composition and the metal / resin bonding member according to the present invention is not limited to the above-described embodiment, and for example, the metal used for the cladding composition in the production method of the first embodiment.
- the powder it is preferable to use a mixed metal powder of one or more metals that are the same as the metal constituting the metal substrate and other metals.
- the cladding composition containing such a mixed metal powder the compatibility between the metal powder and the metal base material is enhanced. Therefore, beads having an appropriate coarse and dense distribution are likely to be formed on the surface of the metal substrate. As a result, the metal base material and the resin member can be joined more firmly and stably.
- other embodiments include, for example, use in cladding of a composition containing a metal powder, a binder, a water absorbing material, and an organic solvent.
- the metal base material and the resin member can be bonded more firmly without using an adhesive. Therefore, the manufacturing method to which the present invention is applied is useful as a method for manufacturing a new material that realizes weight reduction of the vehicle body.
- Metal base material A5052 aluminum plate with a length of 5 cm x width of 2 cm x thickness of 1 mm
- Resin member a sheet made of polyphenylene sulfide (PPS) with a length of 5 cm x width of 2 cm x thickness of 1 mm
- a laser for the laser irradiation here, a semiconductor laser having a wavelength of 970 nm, which was shaped into a spot beam having a diameter of 2 mm by using an optical system, was used.
- the scanning speed of the spot beam was set to 30 mm / s.
- the spot beam was scanned over a width of 20 mm to irradiate an area of 40 mm 2 or more.
- the irradiation conditions of the laser spot here were an average output of 150 W, a repetition frequency of 1000 Hz, a duty of 50%, and a scanning speed of 10 mm / s.
- Shear tensile strength test The shear tensile strength test in JIS K6850 was used as a reference. The shear tensile strength was calculated from the breaking force and the area of the clad layer for the joining member of the aluminum plate and the sheet made of PPS.
- FIG. 1 is a graph showing the results of measuring changes in bonding strength over time in the 85/85 test for bonding members manufactured using the cladding compositions of Example 1, Example 4, and Comparative Example 1. ..
- the vertical axis represents the shear joint strength (MPa) measured by the shear tensile strength test, and the horizontal axis represents the elapsed time (days).
- the bonding strength after one week of the 85/85 test was about the initial bonding strength. It is 90% or more, the bonding strength after 2 weeks is about 80% or more of the initial bonding strength, and the bonding strength is maintained at about 60% or more of the initial bonding strength even after 1000 hours have passed. You can confirm that you are there.
- the bonding strength after 1 week of the 85/85 test decreased to about 60% of the initial bonding strength, and the bonding strength after 2 weeks passed. Was reduced to about 50% of the initial bonding strength, and the bonding strength after 1000 hours was reduced to about one-third of the initial bonding strength.
- the bonding strength between the metal base material and the resin member is further enhanced, and the deterioration of the bonding strength over time in a high temperature and high humidity environment is suppressed. It was confirmed that the parts could be manufactured. Further, according to the cladding composition to which the present invention is applied, the metal substrate and the resin member can be stably bonded, and the bonding strength between the metal substrate and the resin member deteriorates with time in a high temperature and high humidity environment. It was confirmed that it was possible to suppress.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Selon l'invention, une composition pour placage qui comprend une poudre de métal, un liant, un matériau absorbant l'eau et un solvant organique, est mise en œuvre dans la liaison d'un substrat métallique et d'un élément en résine. L'invention met également en œuvre un procédé de fabrication d'élément lié métal et résine qui présente : une étape au cours de laquelle cette composition pour placage est appliquée sur au moins une partie du substrat métallique ; une étape au cours de laquelle un laser irradie la partie application de composition pour placage sur le substrat métallique ; une étape au cours de laquelle l'élément en résine est disposé au niveau de la partie irradiation au laser sur le substrat métallique ; et une étape au cours de laquelle l'interface entre la partie irradiation au laser et l'élément en résine est chauffée, et le substrat métallique et l'élément en résine sont liés.
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JP2009255153A (ja) * | 2008-04-21 | 2009-11-05 | Nippon Genma:Kk | ソルダペースト |
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JP2018006084A (ja) * | 2016-06-29 | 2018-01-11 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
WO2019198591A1 (fr) * | 2018-04-13 | 2019-10-17 | 東京応化工業株式会社 | Composition de gainage, et procédé de production d'un élément lié métal/résine |
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- 2020-08-27 JP JP2020143896A patent/JP2023169443A/ja active Pending
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2021
- 2021-08-16 WO PCT/JP2021/029896 patent/WO2022044867A1/fr active Application Filing
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Patent Citations (5)
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JP2002524270A (ja) * | 1998-09-16 | 2002-08-06 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | セラミックと金属を溶接するためのペースト及び溶接結合を製造する方法 |
JP2009255153A (ja) * | 2008-04-21 | 2009-11-05 | Nippon Genma:Kk | ソルダペースト |
CN105710561A (zh) * | 2014-12-05 | 2016-06-29 | 陕西子竹电子有限公司 | 一种外绝缘高导电锡膏 |
JP2018006084A (ja) * | 2016-06-29 | 2018-01-11 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
WO2019198591A1 (fr) * | 2018-04-13 | 2019-10-17 | 東京応化工業株式会社 | Composition de gainage, et procédé de production d'un élément lié métal/résine |
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