WO2022037138A1 - 光源和光源的生产工艺 - Google Patents

光源和光源的生产工艺 Download PDF

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Publication number
WO2022037138A1
WO2022037138A1 PCT/CN2021/093071 CN2021093071W WO2022037138A1 WO 2022037138 A1 WO2022037138 A1 WO 2022037138A1 CN 2021093071 W CN2021093071 W CN 2021093071W WO 2022037138 A1 WO2022037138 A1 WO 2022037138A1
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Prior art keywords
light
circuit board
flexible circuit
light source
emitting unit
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PCT/CN2021/093071
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English (en)
French (fr)
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宋以文
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深圳市圳明光电有限公司
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Publication of WO2022037138A1 publication Critical patent/WO2022037138A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/40—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity
    • F21V9/45—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity by adjustment of photoluminescent elements

Definitions

  • the present invention relates to the field of lighting, in particular to a light source.
  • the existing light source is generally a corn lamp with SMD lamp beads + flexible circuit board + heat sink, which has high cost, low production efficiency and uneven light emission, or a silicone lamp with SMD lamp beads + circuit board, which emits unevenly. , large chromatic aberration, low efficiency, therefore, it is necessary to provide a light source that can improve the uneven lighting problem of corn lamps.
  • the purpose of the present invention is to provide a light source that can improve the problem of uneven illumination of corn lamps.
  • a light source comprising:
  • the lamp body includes a cylinder
  • the flexible circuit board is attached to the outer surface of the cylinder;
  • the plurality of light-emitting units are mounted on the flexible circuit board and are arranged at intervals adjacent to the light-emitting units;
  • the light-transmitting layer covers the outside of the flexible circuit board and the light-emitting unit, so as to mix the light emitted by a plurality of the light-emitting units, and make the light source emit light uniformly.
  • phosphor powder is mixed in the light-transmitting layer.
  • the light-transmitting layer includes a light-transmitting glue mixed with phosphor powder.
  • the light-emitting unit is a light-emitting chip wafer, and the light-emitting chip wafer is mounted on the flexible circuit board.
  • the light source further includes a transparent lampshade sleeved outside the light-transmitting layer.
  • the column body is made of a heat-dissipating material.
  • the lamp body includes a base connected to one end of the lamp body, the base is annular, and a lead hole is provided between the column and the base.
  • the flexible circuit board is attached to the side surface and one end surface of the column.
  • the present invention also provides a production process of the light source, and the production process of the light source includes:
  • the present invention further provides a production process of a light source, and the production process of the light source includes:
  • the beneficial effect of the present invention is that the light-transmitting layer covers the outside of the flexible circuit board and the light-emitting unit, so as to mix the light emitted by a plurality of the light-emitting units, so that the light source emits evenly,
  • the present application can greatly improve the light-emitting effect, realize uniform and integrated light-emitting, and have no segments and no spots.
  • FIG. 1 is a schematic structural diagram of a light source provided by an embodiment of the present invention
  • Fig. 2 Fig. 1 in the light source removes the structure schematic diagram of the transparent mask and the light-transmitting layer
  • Fig. 3 is the structural representation of another angle of Fig. 2;
  • FIG. 4 is a schematic structural diagram of a flexible circuit board attached with a light-emitting unit
  • FIG. 5 is a schematic structural diagram of a flexible circuit board.
  • a light source 100 including:
  • Lamp body 1 the lamp body 1 includes a column body 11, and the column body 11 can be a column body 11 in a cylindrical shape or any other shape;
  • the flexible circuit board 2, the flexible circuit board 2 is attached to the outer surface of the cylinder 11;
  • a plurality of light-emitting units 3, the plurality of light-emitting units 3 are mounted on the flexible circuit board 2 and arranged adjacent to the light-emitting units 3 at intervals, the flexible circuit board 2 supplies power to the light-emitting units 3, and the plurality of light-emitting units 3 can be arranged for the edge;
  • the light-transmitting layer 4 covers the outside of the flexible circuit board 2 and the light-emitting unit 3 to mix the light emitted by the light-emitting units 3 to make the light source 100 emit light uniformly.
  • the present application can greatly improve the luminous effect, achieve uniform and integrated luminescence, no segmentation and no light spots.
  • phosphor powder is mixed in the light-transmitting layer 4 .
  • the light-transmitting layer 4 includes a light-transmitting glue mixed with phosphor powder.
  • the light-transmitting glue can be silicone.
  • the light-transmitting layer 4 is not limited to being silica gel, and may be other transparent colloids or other transparent materials.
  • the light-emitting unit 3 is a light-emitting chip wafer, and the light-emitting chip wafer is mounted on the flexible circuit board 2 .
  • the chip is directly mounted on the flexible circuit board 2, and the die is directly bonded, eliminating the need for SMD lamp beads.
  • the light source 100 further includes a transparent lampshade 5 sleeved outside the light-transmitting layer 4 , and the transparent lampshade 5 may be made of glass or other transparent materials.
  • the light-transmitting layer 4 is located between the transparent lampshade 5 and the lamp body 1 (covered with the flexible circuit board 2 attached with the light-emitting unit 3 , and the light source 100 may or may not have the transparent lampshade 5 .
  • the column body 11 is made of a heat-dissipating material.
  • the lamp body 1 can be made of ceramics or metals.
  • the lamp body 1 includes a base 12 connected to one end of the lamp body 1, the base 12 is annular, and a lead hole 10 is provided between the column 11 and the base 12, please refer to FIG. 2 and 3, the base 12 is in the shape of a sleeve, its inner diameter is larger than the outer diameter of the cylinder 11, at least two connecting pieces 13 are connected circumferentially between the base 12 and the cylinder 11, and adjacent connecting pieces 13 are arranged at intervals, A lead hole 10 is formed to lead out the connecting wire 23 of the flexible circuit board 2.
  • the lead hole 10 can also be used as an exhaust hole for exhausting the gas in the light-transmitting glue. During the mixing process of the light-transmitting glue and the phosphor, some Air bubbles, expel the air bubbles to avoid them affecting the glowing effect.
  • the flexible circuit board 2 is attached to the side surface and one end surface of the column body 11. Please refer to FIG. 4 and FIG. 5.
  • the flexible circuit board 2 includes a first part 21 for attaching to the side surface of the column body 11 and a The second part 22 of one end face of the column body 11 realizes 360° light emission at the side and the top.
  • the plurality of light-emitting units 3 disposed on the side surface can be arranged in multiple rows, and the light-emitting units 3 in each row are arranged at intervals along the axial direction of the column body 11 .
  • Positive and negative connection wires 23 are drawn from the flexible circuit board 2 and can be connected to any type of light source connector 6 .
  • the present invention also provides a production process of the light source 100, and the production process of the light source 100 includes:
  • the transparent lampshade 5 is directly fixed outside the lamp body 1,
  • the present invention further provides a production process of the light source 100.
  • the difference between the production process of the light source 100 and the above-mentioned production process of the light source 100 is that the transparent lampshade 5 is replaced by a mold, and the finally formed light source 100 does not have the transparent lampshade 5. , only has the silica gel light-transmitting layer 4, and the production process of the light source 100 includes:
  • the light emitting unit 3 is mounted on the flexible circuit board 2 by means of die bonding.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种光源（100）和光源（100）的生产工艺。光源（100）包括灯体（1）、柔性电路板（2）、多个发光单元（3）以及透光层（4）。灯体（1）包括柱体（11）；柔性电路板（2）贴合于柱体（11）的外表面；多个发光单元（3）安装于柔性电路板（2）上且相邻发光单元（3）间隔设置；透光层（4）覆盖于柔性电路板（2）和发光单元（3）的外侧，以混合多个发光单元（3）发出的光，使光源（100）发光均匀，可以大大改善发光效果，实现均匀一体发光，无分段无光斑。

Description

光源和光源的生产工艺 技术领域
本发明涉及照明领域，尤其涉及一种光源。
 背景技术
现有的光源一般为贴片灯珠+柔性电路板+散热体的玉米灯，其成本高，生产效率低、发光不均匀，或者为贴片灯珠+电路板的硅胶灯，其发光不均匀、色差大、效率低，因此，有必要提供一种能改善玉米灯发光不均匀问题的光源。
 技术解决方案
为了克服现有技术的不足，本发明的目的在于提供一种能改善玉米灯发光不均匀问题的光源。
本发明的目的之一采用如下技术方案实现：
一种光源，包括：
灯体，所述灯体包括柱体；
柔性电路板，所述柔性电路板贴合于所述柱体的外表面；
多个发光单元，多个所述发光单元安装于所述柔性电路板上且相邻所述发光单元间隔设置；
透光层，覆盖于所述柔性电路板和所述发光单元的外侧，以混合多个所述发光单元发出的光，使所述光源发光均匀。
进一步地，所述透光层内混合有荧光粉。
进一步地，所述透光层包括混合有荧光粉的透光胶。
进一步地，所述发光单元为发光芯片晶元，且所述发光芯片晶元贴装于所述柔性电路板上。
进一步地，所述光源还包括套设于所述透光层外的透明灯罩。
进一步地，所述柱体由为散热材质制成。
进一步地，所述灯体包括连接于所述灯体一端的底座，所述底座呈环状，所述柱体与所述底座之间设置有引线孔。
进一步地，所述柔性电路板贴合于所述柱体的侧面和一端面。
本发明还提供一种光源的生产工艺，所述光源的生产工艺包括：
将发光单元贴装于柔性电路板上；
将贴好所述发光单元的所述柔性电路板粘贴到柱体的表面上；
在灯罩内注入含有荧光粉的胶水；
将贴好所述柔性电路板的柱体放入注入有含有荧光粉的胶水的所述透明灯罩内；
将含有荧光粉的胶水烤干。
本发明另提供一种光源的生产工艺，所述光源的生产工艺包括：
将发光单元贴装于柔性电路板上；
将贴好所述发光单元的所述柔性电路板粘贴到柱体的表面上；
在模具内注入含有荧光粉的胶水；
将贴好所述柔性电路板的柱体放入注入有含有荧光粉的胶水的所述模具内；
将含有荧光粉的胶水烤干；
将贴好所述柔性电路板的柱体从所述模具中拔出，所述柔性电路板和所述发光单元上覆盖有含有荧光粉的胶水。
 有益效果
相比现有技术，本发明的有益效果在于：透光层覆盖于所述柔性电路板和所述发光单元的外侧，以混合多个所述发光单元发出的光，使所述光源发光均匀，使得本申请可以大大改善发光效果，实现均匀一体发光，无分段无光斑。
 附图说明
图1为本发明实施例提供的光源的结构示意图；
图2图1中光源去除透明面罩和透光层的结构示意图；
图3为图2的另一角度的结构示意图；
图4为贴有发光单元的柔性电路板的结构示意图；
图5为柔性电路板的结构示意图。
图中：
100、光源；1、灯体；11、柱体；2、柔性电路板；3、发光单元；4、透光层；5、透明灯罩；12、底座；10、引线孔；13、连接件；21、第一部分；22、第二部分；23、接电线；6、光源接头。
 本发明的实施方式
下面，结合附图以及具体实施方式，对本发明做进一步描述，需要说明的是，在不相冲突的前提下，以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
需要说明的是，本发明实施例中所有方向性指示（诸如上、下、左、右、前、后、顶部、底部……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
还需要说明的是，当元件被称为“固定于”或“设置于”另一个元件上时，该元件可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为“连接”另一个元件，它可以是直接连接另一个元件或者可能同时存在居中元件。
如图1-5，请参照一种光源100，包括：
灯体1，所述灯体1包括柱体11，柱体11可为呈圆柱形或其他任意形状的柱体11；
柔性电路板2，所述柔性电路板2贴合于所述柱体11的外表面；
多个发光单元3，多个所述发光单元3安装于所述柔性电路板2上且相邻所述发光单元3间隔设置，柔性电路板2为发光单元3供电，多个发光单元3可设置为沿；
透光层4，覆盖于所述柔性电路板2和所述发光单元3的外侧，以混合多个所述发光单元3发出的光，使所述光源100发光均匀。本申请可以大大改善发光效果，实现均匀一体发光，无分段无光斑。
优选所述透光层4内混合有荧光粉。
优选所述透光层4包括混合有荧光粉的透光胶。透光胶可为硅胶。透光层4不限于为硅胶，可为其他透明胶体，也可为其他透明材质。
优选所述发光单元3为发光芯片晶元，且所述发光芯片晶元贴装于所述柔性电路板2上。将芯片直接贴装在柔性电路板2上，直接固晶，省去了贴片灯珠。
优选所述光源100还包括套设于所述透光层4外的透明灯罩5，透明灯罩5可为玻璃材质，也可为其他透明材质。透光层4位于透明灯罩5和灯体1(覆盖有贴装有发光单元3的柔性电路板2之间，光源100可具有透明灯罩5，也可不具有透明灯罩5。
优选所述柱体11由为散热材质制成。灯体1可为陶瓷或金属等材质。
优选所述灯体1包括连接于所述灯体1一端的底座12，所述底座12呈环状，所述柱体11与所述底座12之间设置有引线孔10，请参照图2和图3，底座12呈套筒状，其内径大于柱体11的外径，底座12和柱体11之间沿周向连接有至少两个连接件13，相邻连接件13之间间隔设置，形成引线孔10，引出柔性电路板2的接电线23，该引线孔10也可作为用于排出透光胶中气体的排气孔，透光胶在和荧光粉混合过程中，可能会产生一些气泡，排出气泡，避免其影响发光效果。
优选所述柔性电路板2贴合于所述柱体11的侧面和一端面，请参照图4和图5柔性电路板2包括用于贴在柱体11的侧面的第一部分21和用于贴在柱体11的一端面的第二部分22，实现侧面及顶部360°发光。多个设置于侧面的发光单元3可设置为多排，且每一排的发光单元3沿柱体11的轴向方向间隔排布。柔性电路板2上引出正负接电线23，可连接于任何种类型的光源接头6。
本发明还提供一种光源100的生产工艺，所述光源100的生产工艺包括：
将发光单元3贴装于柔性电路板2上；
将贴好所述发光单元3的所述柔性电路板2粘贴到柱体11的表面上；
在灯罩内注入含有荧光粉的胶水；
将贴好所述柔性电路板2的柱体11放入注入有含有荧光粉的胶水的所述透明灯罩5内；
将含有荧光粉的胶水烤干。
胶水烤干后，透明灯罩5直接固定在灯体1外，
本发明另提供一种光源100的生产工艺，该种光源100的生产工艺与上述光源100的生产工艺之间的区别在于，将透明灯罩5替换为模具，最终成型的光源100不具有透明灯罩5，仅具有硅胶体透光层4，该种光源100的生产工艺包括：
将发光单元3贴装于柔性电路板2上；
将贴好所述发光单元3的所述柔性电路板2粘贴到柱体11的表面上；
在模具内注入含有荧光粉的胶水；
将贴好所述柔性电路板2的柱体11放入注入有含有荧光粉的胶水的所述模具内；
将含有荧光粉的胶水烤干；
将贴好所述柔性电路板2的柱体11从所述模具中拔出，所述柔性电路板2和所述发光单元3上覆盖有含有荧光粉的胶水。利用烤箱烤干后拔出，做成硅胶体的灯。
以上两种光源100的生产工艺均通过固晶的方式将发光单元3贴装于柔性电路板2上。
上述实施方式仅为本发明的优选实施方式，不能以此来限定本发明保护的范围，本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。

Claims (10)

  1. 一种光源，其特征在于，包括：
    灯体，所述灯体包括柱体；
    柔性电路板，所述柔性电路板贴合于所述柱体的外表面；
    多个发光单元，多个所述发光单元安装于所述柔性电路板上且相邻所述发光单元间隔设置；
    透光层，覆盖于所述柔性电路板和所述发光单元的外侧，以混合多个所述发光单元发出的光，使所述光源发光均匀。
  2. 根据权利要求1所述的光源，其特征在于：所述透光层内混合有荧光粉。
  3. 根据权利要求1所述的光源，其特征在于：所述透光层包括混合有荧光粉的透光胶。
  4. 根据权利要求1所述的光源，其特征在于：所述发光单元为发光芯片晶元，且所述发光芯片晶元贴装于所述柔性电路板上。
  5. 根据权利要求1所述的光源，其特征在于：所述光源还包括套设于所述透光层外的透明灯罩。
  6. 根据权利要求1所述的光源，其特征在于：所述柱体由为散热材质制成。
  7. 根据权利要求1所述的光源，其特征在于：所述灯体包括连接于所述灯体一端的底座，所述底座呈环状，所述柱体与所述底座之间设置有引线孔。
  8. 根据权利要求1所述的光源，其特征在于：所述柔性电路板贴合于所述柱体的侧面和一端面。
  9. 一种光源的生产工艺，其特征在于，所述光源的生产工艺包括：
    将发光单元贴装于柔性电路板上；
    将贴好所述发光单元的所述柔性电路板粘贴到柱体的表面上；
    在灯罩内注入含有荧光粉的胶水；
    将贴好所述柔性电路板的柱体放入注入有含有荧光粉的胶水的透明灯罩内；
    将含有荧光粉的胶水烤干。
  10. 一种光源的生产工艺，其特征在于，所述光源的生产工艺包括：
    将发光单元贴装于柔性电路板上；
    将贴好所述发光单元的所述柔性电路板粘贴到柱体的表面上；
    在模具内注入含有荧光粉的胶水；
    将贴好所述柔性电路板的柱体放入注入有含有荧光粉的胶水的所述模具内；
    将含有荧光粉的胶水烤干；
    将贴好所述柔性电路板的柱体从所述模具中拔出，所述柔性电路板和所述发光单元上覆盖有含有荧光粉的胶水。
PCT/CN2021/093071 2020-08-17 2021-05-11 光源和光源的生产工艺 WO2022037138A1 (zh)

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KR101416897B1 (ko) * 2011-09-27 2014-07-08 주식회사 휴닉스 엘이디 조명 장치
CN104235658A (zh) * 2014-10-17 2014-12-24 上海新凯元照明科技有限公司 柱型led灯泡
CN204403824U (zh) * 2014-12-20 2015-06-17 西安信唯信息科技有限公司 一种led灯
CN112032675A (zh) * 2020-08-17 2020-12-04 深圳市圳明光电有限公司 光源和光源的生产工艺
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CN104235658A (zh) * 2014-10-17 2014-12-24 上海新凯元照明科技有限公司 柱型led灯泡
CN204403824U (zh) * 2014-12-20 2015-06-17 西安信唯信息科技有限公司 一种led灯
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