WO2022036951A1 - 一种快速固化的无铅锡膏及其制备方法 - Google Patents

一种快速固化的无铅锡膏及其制备方法 Download PDF

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WO2022036951A1
WO2022036951A1 PCT/CN2020/135752 CN2020135752W WO2022036951A1 WO 2022036951 A1 WO2022036951 A1 WO 2022036951A1 CN 2020135752 W CN2020135752 W CN 2020135752W WO 2022036951 A1 WO2022036951 A1 WO 2022036951A1
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solder paste
fast
free solder
lead
curing
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PCT/CN2020/135752
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English (en)
French (fr)
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黄丽斯
薛广彬
郑富东
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惠州市源德智科技有限公司
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Publication of WO2022036951A1 publication Critical patent/WO2022036951A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Definitions

  • the invention belongs to the technical field of solder paste and preparation, and particularly relates to a fast-curing lead-free solder paste and a preparation method thereof.
  • Solder paste is a new type of soldering material that came into being with SMT.
  • Solder paste is a complex system, which is a paste made of tin powder, flux and other additives.
  • the solder paste has a certain viscosity at room temperature, which can initially stick the electronic components in a given position. At the soldering temperature, with the volatilization of the solvent and some additives, the soldered components and the printed circuit pads are welded together. Permanent connection.
  • the present invention provides a fast-curing lead-free solder paste and a preparation method thereof, wherein the detection of lead-free elements in the fast-curing lead-free solder paste is safe and environmentally friendly, and the curing temperature of the fast-curing lead-free solder paste is The temperature is below 120°C, the curing time is below 12min, the damage to the substrate is small, and no warping phenomenon occurs.
  • the technical solutions of the present invention are as follows:
  • a kind of fast-curing lead-free solder paste of the present invention its technical point is: in terms of weight parts of the fast-curing lead-free solder paste, the fast-curing lead-free solder paste is composed of 80-90 parts by weight It is prepared by mixing tin alloy powder, 3-5 parts by weight of rosin, 10-20 parts by weight of organic solvent and 1-10 parts by weight of resin.
  • the above-mentioned tin alloy powder is one or a mixture of two of spherical tin alloy powder or elliptical tin alloy powder.
  • the median particle size of the spherical tin alloy powder is 1-3 ⁇ m.
  • the long axis of the above-mentioned oval tin alloy powder is 2-4 ⁇ m, and the short axis is 1-2 ⁇ m.
  • the above-mentioned rosin is lead-free rosin.
  • the above-mentioned organic solvent is at least one of dodecyl alcohol, terpineol, tributyl citrate and butyl carbitol acetate.
  • the above-mentioned resin is at least one of phenolic resin, acrylic resin and vinyl chloride resin.
  • another object of the present invention is to provide a kind of preparation method of fast-curing lead-free solder paste, and its technical point is: the preparation method of described fast-curing lead-free solder paste is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, and mix the resin and the organic solvent in a mixer to obtain a mixture A.
  • the rotation speed of the mixer is 500-700rmp, and the stirring time is 10-20min;
  • Step 2 Put the tin alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3-5min ;
  • Step 3 In step 2, add rosin and mix in a homogenizer to obtain the fast-curing lead-free solder paste.
  • the speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3-5min.
  • the viscosity of the fast-curing lead-free solder paste at a rotational speed of 10 rpm is 190-270 Pa ⁇ s/25°C.
  • the fast-curing lead-free solder paste of the present invention comprises the following components in the following weight ratios: tin alloy powder, rosin, organic solvent and resin. Compared with the existing solder paste, the fast-curing lead-free solder paste has significantly lower curing temperature and shorter curing time, and can avoid the problem of substrate warpage caused by high curing temperature.
  • the fast-curing lead-free solder paste of the invention does not contain lead elements, is beneficial to environmental protection, does not cause damage to the atmosphere, and greatly reduces the heavy metal pollution to the environment.
  • a fast-curing lead-free solder paste is prepared by mixing 85 parts by weight of tin alloy powder, 4 parts by weight of rosin, 15 parts by weight of organic solvent and 5 parts by weight of resin in parts by weight.
  • the tin alloy powder is spherical tin alloy powder.
  • the median particle size of the spherical tin alloy powder was 2 ⁇ m.
  • the rosin is lead-free rosin.
  • the organic solvent is alcohol lipid twelve.
  • the resin is a phenolic resin.
  • the preparation method of a kind of fast-curing lead-free solder paste of the present invention is:
  • Step 1 accurately weigh the components of each raw material with an analytical balance, and mix the resin and the organic solvent in a mixer to obtain a mixture A.
  • the rotation speed of the mixer is 400 rpm and the stirring time is 15 min;
  • Step 2 Put the tin alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1100 rpm, and the homogenization time is 4 min;
  • Step 3 in step 2, add rosin and mix evenly in a homogenizer to obtain the fast-curing lead-free solder paste.
  • the rotation speed of the homogenizer is 1100 rpm and the homogenization time is 4 min.
  • the viscosity of the fast-curing lead-free solder paste at 10 rmp rotation speed is 230 Pa ⁇ s/25°C.
  • a fast-curing lead-free solder paste is prepared by mixing 90 parts by weight of tin alloy powder, 5 parts by weight of rosin, 20 parts by weight of organic solvent and 10 parts by weight of resin.
  • the tin alloy powder is one of spherical tin alloy powder or elliptical tin alloy powder or a mixture of both.
  • the long axis of the oval tin alloy powder was 3 ⁇ m, and the short axis was 1.5 ⁇ m.
  • the rosin is lead-free rosin.
  • the organic solvent is tributyl citrate.
  • the resin is acrylic resin.
  • the preparation method of a kind of fast-curing lead-free solder paste of the present invention is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, place the resin and the organic solvent in a mixer to mix evenly to obtain a mixture A, the rotation speed of the mixer is 500rmp, and the stirring time is 20min;
  • Step 2 Put the tin alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1000 rmp, and the homogenization time is 5min;
  • Step 3 In step 2, add rosin and mix evenly in a homogenizer to obtain the fast-curing lead-free solder paste.
  • the speed of the homogenizer is 1000 rpm and the homogenization time is 5 min.
  • the viscosity of the fast-curing lead-free solder paste at 10 rpm is 190 Pa ⁇ s/25°C.
  • a fast-curing lead-free solder paste is prepared by mixing 80 parts by weight of tin alloy powder, 3 parts by weight of rosin, 10 parts by weight of organic solvent and 1 part by weight of resin.
  • the tin alloy powder is a mixture of spherical tin alloy powder and elliptical tin alloy powder.
  • the median particle size of the spherical tin alloy powder was 2 ⁇ m.
  • the long axis of the oval tin alloy powder was 3 ⁇ m, and the short axis was 1.5 ⁇ m.
  • the rosin is lead-free rosin.
  • the organic solvent is alcohol lipid twelve.
  • the resin is vinyl chloride resin.
  • the preparation method of a kind of fast-curing lead-free solder paste of the present invention is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, and mix the resin and the organic solvent in a mixer to obtain a mixture A.
  • the rotation speed of the mixer is 500 rpm and the mixing time is 10 min;
  • Step 2 Put the tin alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1200 rpm, and the homogenization time is 3min;
  • Step 3 in Step 2, add rosin and mix evenly in a homogenizer to obtain the fast-curing lead-free solder paste.
  • the speed of the homogenizer is 1200 rpm and the homogenization time is 3 min.
  • the viscosity of the fast-curing lead-free solder paste at 10 rmp rotation speed is 200 Pa ⁇ s/25°C.
  • a fast-curing lead-free solder paste is prepared by mixing 88 parts by weight of tin alloy powder, 4.5 parts by weight of rosin, 18 parts by weight of organic solvent and 8 parts by weight of resin.
  • the tin alloy powder is a mixture of spherical tin alloy powder and elliptical tin alloy powder.
  • the median particle size of the spherical tin alloy powder was 2 ⁇ m.
  • the long axis of the oval tin alloy powder was 3 ⁇ m, and the short axis was 1.5 ⁇ m.
  • the rosin is lead-free rosin.
  • the organic solvent is alcohol lipid twelve.
  • the resin is vinyl chloride resin.
  • the preparation method of a kind of fast-curing lead-free solder paste of the present invention is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, and mix the resin and the organic solvent in a mixer to obtain a mixture A.
  • the rotation speed of the mixer is 500 rpm and the mixing time is 10 min;
  • Step 2 Put the tin alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1200 rpm, and the homogenization time is 3min;
  • Step 3 in Step 2, add rosin and mix evenly in a homogenizer to obtain the fast-curing lead-free solder paste.
  • the speed of the homogenizer is 1200 rpm and the homogenization time is 3 min.
  • the viscosity of the fast-curing lead-free solder paste at 10 rmp rotation speed is 260 Pa ⁇ s/25°C.
  • Example 1 The "tin alloy powder" in Example 1 was replaced with "tin powder", and the rest of the operations were the same as those in Example 1.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种快速固化的无铅锡膏及其制备方法，一种快速固化的无铅锡膏包括80-90重量份的锡合金粉、3-5重量份的松香、10-20重量份的有机溶剂和1-10重量份的树脂。该快速固化的无铅锡膏与现有锡膏相比，固化温度明显降低，固化时间明显缩短，能够避免由于固化温度高而导致的基材翘曲问题。无铅锡膏不含铅元素，有利于环保，并且不会对大气层造成破坏，也大大降低了对环境的重金污染。

Description

一种快速固化的无铅锡膏及其制备方法 技术领域
本发明属于锡膏及制备技术领域，具体涉及一种快速固化的无铅锡膏及其制备方法。
背景技术
锡膏是伴随着SMT应运而生的一种新型焊接材料。锡膏是一个复杂的体系，是由锡粉、助焊剂以及其它的添加物混合而成的膏体。锡膏在常温下有一定的粘性，可将电子元器件初粘在既定位置，在焊接温度下，随着溶剂和部分添加剂的挥发，将被焊元器件与印制电路焊盘焊接在于起形成永久连接。
但是目前特殊化的焊接需求越来越多，要求在焊接完毕后，要求残留的锡膏残留迅速固化，不能进行流动，避免锡膏流动对周遭环境造成影响，保证加工焊接的准确性，提高加工生产的稳定性。现有的锡膏还是具有较高的流动性，不易快速固化，不能满足特殊的焊接需求。
发明内容
为了解决上述问题，本发明提供一种快速固化的无铅锡膏及其制备方法，该快速固化的无铅锡膏中无铅元素检出安全环保，且该快速固化的无铅锡膏固化温度为120℃以下，固化时间12min以下，对基材的伤害小，无翘曲现象产生，本发明的具有技术方案如下：
本发明的一种快速固化的无铅锡膏，其技术点在于：以所述快速固化的无铅锡膏的重量份数计，所述快速固化的无铅锡膏由80-90重 量份的锡合金粉、3-5重量份的松香、10-20重量份的有机溶剂和1-10重量份的树脂混合制备而成。
在本发明的有的实施例中，上述的锡合金粉为球形锡合金粉或者椭圆形锡合金粉中的一种或者两种的混合物。
在本发明的有的实施例中，上述的球形锡合金粉的中值粒径为1-3μm。
在本发明的有的实施例中，上述的椭圆形锡合金粉的长轴为2-4μm，短轴为1-2μm。
在本发明的有的实施例中，上述的松香为无铅松香。
在本发明的有的实施例中，上述的有机溶剂为醇脂十二、松油醇、柠檬酸三丁酯和丁基卡必醇醋酸酯中的至少一种。
在本发明的有的实施例中，上述的树脂为酚醇树脂、丙烯酸树脂和氯乙烯树脂中的至少一种。
按照上述配方，本发明的另外一个目的在于提供一种快速固化的无铅锡膏的制备方法，其技术点在于：所述快速固化的无铅锡膏制备方法为：
步骤一：用分析天平精确称量每个原料的组分，将树脂和有机溶剂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为500-700rmp，搅拌时间为10-20min；
步骤二：将锡合金粉粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1000-1200rmp，均质时间为3-5min；
步骤三：在步骤二中加入松香于均质机中混合均匀得到所述的快速固化的无铅锡膏，所述均质机的转速为1000-1200rmp，均质时间为3-5min。
在本发明的有的实施例中，上述的快速固化的无铅锡膏的于10rmp转速下的粘度为190-270Pa·s/25℃。
与现有技术相比，本发明的有益效果：
本发明的一种快速固化的无铅锡膏包括如下重量比的各组分：锡合金粉、松香、有机溶剂和树脂。该快速固化的无铅锡膏与现有锡膏相比，固化温度明显降低，固化时间明显缩短，能够避免由于固化温度高而导致的基材翘曲问题。本发明快速固化的无铅锡膏不含铅元素，有利于环保，并且不会对大气层造成破坏，也大大降低了对环境的重金污染。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述，以使本领域的技术人员能够更好的理解本发明的优点和特征，从而对本发明的保护范围做出更为清楚的界定。本发明所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例，基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
一种快速固化的无铅锡膏按重量份数计由85重量份的锡合金粉、4重量份的松香、15重量份的有机溶剂和5重量份的树脂混合制 备而成。
其中，锡合金粉为球形锡合金粉。
其中，球形锡合金粉的中值粒径为2μm。
其中，松香为无铅松香。
其中，有机溶剂为醇脂十二。
其中，树脂为酚醇树脂。
按照上述配方，本发明的一种快速固化的无铅锡膏的制备方法为：
步骤一：用分析天平精确称量每个原料的组分，将树脂和有机溶剂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为400rmp，搅拌时间为15min；
步骤二：将锡合金粉粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1100rmp，均质时间为4min；
步骤三：在步骤二中加入松香于均质机中混合均匀得到所述的快速固化的无铅锡膏，所述均质机的转速为1100rmp，均质时间为4min。
其中，快速固化的无铅锡膏的于10rmp转速下的粘度为230Pa·s/25℃。
实施例2
一种快速固化的无铅锡膏按重量份数计由90重量份的锡合金粉、5重量份的松香、20重量份的有机溶剂和10重量份的树脂混合制备而成。
其中，锡合金粉为球形锡合金粉或者椭圆形锡合金粉中的一种或者两种的混合物。
其中，椭圆形锡合金粉的长轴为3μm，短轴为1.5μm。
其中，松香为无铅松香。
其中，有机溶剂为柠檬酸三丁酯。
其中，树脂为丙烯酸树脂。
按照上述配方，本发明的一种快速固化的无铅锡膏的制备方法为：
步骤一：用分析天平精确称量每个原料的组分，将树脂和有机溶剂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为500rmp，搅拌时间为20min；
步骤二：将锡合金粉粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1000rmp，均质时间为5min；
步骤三：在步骤二中加入松香于均质机中混合均匀得到所述的快速固化的无铅锡膏，所述均质机的转速为1000rmp，均质时间为5min。
其中，快速固化的无铅锡膏的于10rmp转速下的粘度为190Pa·s/25℃。
实施例3
一种快速固化的无铅锡膏按重量份数计由80重量份的锡合金粉、3重量份的松香、10重量份的有机溶剂和1重量份的树脂混合制备而成。
其中，锡合金粉为球形锡合金粉和椭圆形锡合金粉的混合物。
其中，球形锡合金粉的中值粒径为2μm。
其中，椭圆形锡合金粉的长轴为3μm，短轴为1.5μm。
其中，松香为无铅松香。
其中，有机溶剂为醇脂十二。
其中，树脂为氯乙烯树脂。
按照上述配方，本发明的一种快速固化的无铅锡膏的制备方法为：
步骤一：用分析天平精确称量每个原料的组分，将树脂和有机溶剂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为500rmp，搅拌时间为10min；
步骤二：将锡合金粉粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1200rmp，均质时间为3min；
步骤三：在步骤二中加入松香于均质机中混合均匀得到所述的快速固化的无铅锡膏，所述均质机的转速为1200rmp，均质时间为3min。
其中，快速固化的无铅锡膏的于10rmp转速下的粘度为200Pa·s/25℃。
实施例4
一种快速固化的无铅锡膏按重量份数计由88重量份的锡合金粉、4.5重量份的松香、18重量份的有机溶剂和8重量份的树脂混合制备而成。
其中，锡合金粉为球形锡合金粉和椭圆形锡合金粉的混合物。
其中，球形锡合金粉的中值粒径为2μm。
其中，椭圆形锡合金粉的长轴为3μm，短轴为1.5μm。
其中，松香为无铅松香。
其中，有机溶剂为醇脂十二。
其中，树脂为氯乙烯树脂。
按照上述配方，本发明的一种快速固化的无铅锡膏的制备方法为：
步骤一：用分析天平精确称量每个原料的组分，将树脂和有机溶剂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为500rmp，搅拌时间为10min；
步骤二：将锡合金粉粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1200rmp，均质时间为3min；
步骤三：在步骤二中加入松香于均质机中混合均匀得到所述的快速固化的无铅锡膏，所述均质机的转速为1200rmp，均质时间为3min。
其中，快速固化的无铅锡膏的于10rmp转速下的粘度为260Pa·s/25℃。
对比例
将实施例1中的“锡合金粉”换成“锡粉”，其余操作同实施例1。
实验例
取实施例1-4制备得到的锡膏和对比例制备得到的锡膏进行固化温度、固化时间的测试，同时观察固化后基材有无翘曲现象产生，检测其附着力，具体结果见表1：
表1
Figure PCTCN2020135752-appb-000001
最后应当说明的是，以上实施例仅用以说明本发明的技术方案，而非对本发明保护范围的限制，尽管参照较佳实施例对本发明作了详细地说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。

Claims (9)

  1. 一种快速固化的无铅锡膏，其特征在于：以所述快速固化的无铅锡膏的重量份数计，所述快速固化的无铅锡膏由80-90重量份的锡合金粉、3-5重量份的松香、10-20重量份的有机溶剂和1-10重量份的树脂混合制备而成。
  2. 根据权利要求1所述的一种快速固化的无铅锡膏，其特征在于：所述锡合金粉为球形锡合金粉或者椭圆形锡合金粉中的一种或者两种的混合物。
  3. 根据权利要求1所述的一种快速固化的无铅锡膏，其特征在于：所述球形锡合金粉的中值粒径为1-3μm。
  4. 根据权利要求1所述的一种快速固化的无铅锡膏，其特征在于：所述椭圆形锡合金粉的长轴为2-4μm，短轴为1-2μm。
  5. 根据权利要求1所述的一种快速固化的无铅锡膏，其特征在于：所述松香为无铅松香。
  6. 根据权利要求1所述的一种快速固化的无铅锡膏，其特征在于：所述有机溶剂为醇脂十二、松油醇、柠檬酸三丁酯和丁基卡必醇醋酸酯中的至少一种。
  7. 根据权利要求1所述的一种快速固化的无铅锡膏，其特征在于：所述树脂为酚醇树脂、丙烯酸树脂和氯乙烯树脂中的至少一种。
  8. 根据权利要求1-7任意所述的一种快速固化的无铅锡膏，其特征在于：所述快速固化的无铅锡膏制备方法为：
    步骤一：用分析天平精确称量每个原料的组分，将树脂和有机溶剂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为500-700rmp，搅拌时间为10-20min；
    步骤二：将锡合金粉粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1000-1200rmp，均质时间为3-5min；
    步骤三：在步骤二中加入松香于均质机中混合均匀得到所述的快速固化的无铅锡膏，所述均质机的转速为1000-1200rmp，均质时间为3-5min。
  9. 根据权利要求8所述的一种快速固化的无铅锡膏，其特征在于：所述快速固化的无铅锡膏的于10rmp转速下的粘度为190-270Pa·s/25℃。
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