WO2022036950A1 - Halogen-free solder paste and preparation method therefor - Google Patents

Halogen-free solder paste and preparation method therefor Download PDF

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Publication number
WO2022036950A1
WO2022036950A1 PCT/CN2020/135738 CN2020135738W WO2022036950A1 WO 2022036950 A1 WO2022036950 A1 WO 2022036950A1 CN 2020135738 W CN2020135738 W CN 2020135738W WO 2022036950 A1 WO2022036950 A1 WO 2022036950A1
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Prior art keywords
halogen
solder paste
free solder
weight
parts
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PCT/CN2020/135738
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French (fr)
Chinese (zh)
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梁宏平
欧阳亮
郑富东
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惠州市源德智科技有限公司
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Publication of WO2022036950A1 publication Critical patent/WO2022036950A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Definitions

  • the invention belongs to the technical field of solder paste and preparation, and particularly relates to a halogen-free solder paste and a preparation method thereof.
  • Solder paste is a new type of soldering material that came into being with SMT.
  • Solder paste is a complex system, which is a paste made of tin powder, flux and other additives.
  • the solder paste has a certain viscosity at room temperature, which can initially stick the electronic components in a given position. At the soldering temperature, with the volatilization of the solvent and some additives, the soldered components and the printed circuit pads are welded together. Permanent connection.
  • Chinese patent application CN101143407A discloses a solder paste and its preparation method.
  • the components of the solder paste and the weight percentages of each component are: alloy solder powder 80-90%; organic solvent 6-8%; organic acid 1-8% %; Resin 2-10%; Surfactant 0.2-2%.
  • the alloy solder powder is composed of 95.5%-99.5% tin by weight, 0.3%-4% by weight silver and 0.1-0.7% by weight copper.
  • the flux of this solder paste does not contain halides, the solder paste is highly adaptable, and there is no residue around the solder joints after soldering, and no cleaning is required.
  • the alloy solder powder of the solder paste has poor refinement degree, uneven distribution, low elongation rate of the alloy solder powder, and poor mechanical properties of the solder paste.
  • the present invention provides a halogen-free solder paste and a preparation method thereof, wherein no halogen is detected in the halogen-free solder paste, and both the adhesion and the expansion rate are stronger than those of the solder paste composed of conventional formulas.
  • the plan is as follows:
  • the object of the present invention is to provide a halogen-free solder paste, the technical point of which is: in terms of the weight parts of the halogen-free solder paste, the halogen-free solder paste is composed of 80-90 parts by weight of Sn-X alloy powder, 0.5-1.5 parts by weight of halogen-free activator, 2-4 parts by weight of organic solvent, 3-5 parts by weight of liquid rosin resin, 0.5-1 part by weight of thixotropic agent and 0.05-0.5 part by weight of leveling agent are mixed prepared.
  • the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 0.1-2 wt %.
  • X element in the above-mentioned Sn-X alloy powder is at least one of silver element, bismuth element, aluminum element and tellurium element.
  • the above-mentioned halogen-free activator is at least one of acetic acid, lactic acid, pyruvic acid, propionic acid, butyric acid, isobutyric acid, methanesulfonic acid and ethylsulfonic acid.
  • the above-mentioned organic solvent is at least one of dodecyl alcohol, terpineol, tributyl citrate and butyl carbitol acetate.
  • the density of the liquid rosin resin is 1-1.1 g/cm 2
  • the solid content of the liquid rosin resin is 48-50 wt %
  • the pH is 4.5-6.5.
  • the above-mentioned thixotropic agent is at least one of fumed silica, clay particles, hydrogenated castor oil and dodecyl stearic acid.
  • the above-mentioned leveling agent is at least one of polyether polyester-modified organosiloxane and alkyl-modified organosiloxane.
  • the object of the present invention is to provide a kind of preparation method of halogen-free solder paste, and its technical point is: the preparation method of described halogen-free solder paste is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix evenly to obtain mixture A.
  • the rotation speed of the mixer is 500-700 rmp, and the stirring time is 500-700 rpm. for 10-20min;
  • Step 2 Put the Sn-X alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3- 5min;
  • Step 3 According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste.
  • the rotating speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3 -5min.
  • the viscosity of the above-mentioned halogen-free solder paste at a rotational speed of 10 rmp is 190-270 Pa ⁇ s/25°C.
  • a halogen-free solder paste of the present invention includes Sn-X alloy powder, halogen-free activator, organic solvent, liquid rosin resin, thixotropic agent and leveling agent, which solves the problem of halogen butt welding.
  • the halogen-free solder paste of the present invention has good adhesion between the soldering base material and can effectively solve the problem of poor soldering performance of the conventional solder paste.
  • a halogen-free solder paste of the present invention consists of 85 parts by weight of Sn-X alloy powder, 1 part by weight of halogen-free activator, 3 parts by weight of organic solvent, 4 parts by weight of liquid rosin resin, 0.75 It is prepared by mixing thixotropic agent in parts by weight and leveling agent in 0.2 parts by weight.
  • the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 1 wt %.
  • the X element in the above-mentioned Sn-X alloy powder is silver element.
  • the above-mentioned halogen-free activator is acetic acid.
  • the above-mentioned organic solvent is alcohol lipid twelve.
  • the density of the above-mentioned liquid rosin resin is 1.05/cm 2
  • the solid content of the liquid rosin resin is 49 wt %
  • the pH value is 5.5.
  • the thixotropic agent is fumed silica.
  • the leveling agent is polyether polyester modified organosiloxane.
  • the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix evenly to obtain mixture A, the speed of the mixer is 600rmp, and the stirring time is 15min ;
  • Step 2 Put the Sn-X alloy powder into the mixture A prepared in the step 1, and mix it uniformly in a homogenizer to obtain the mixture B.
  • the rotation speed of the homogenizer is 1100 rmp, and the homogenization time is 4min;
  • Step 3 According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste.
  • the rotating speed of the homogenizer is 1100rmp and the homogenization time is 5min.
  • the viscosity of the halogen-free solder paste at 10 rpm was 230 Pa ⁇ s/25°C.
  • a halogen-free solder paste of the present invention consists of 90 parts by weight of Sn-X alloy powder, 1.5 parts by weight of halogen-free activator, 4 parts by weight of organic solvent, 5 parts by weight of liquid rosin resin, 1 It is prepared by mixing thixotropic agent in parts by weight and leveling agent in 0.5 parts by weight.
  • the weight of the above-mentioned Sn-X alloy powder is 100wt%, and the weight of the X element is 2wt%.
  • the X element in the above-mentioned Sn-X alloy powder is bismuth element.
  • the above-mentioned halogen-free activator is lactic acid.
  • the above-mentioned organic solvent is terpineol.
  • the density of the above-mentioned liquid rosin resin is 1 g/cm 2
  • the solid content of the liquid rosin resin is 48 wt %
  • the pH value is 4.5.
  • the thixotropic agent is clay particles.
  • the leveling agent is an alkyl-modified organosiloxane.
  • the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix uniformly to obtain mixture A.
  • the rotation speed of the mixer is 700rmp and the stirring time is 10min ;
  • Step 2 Put the Sn-X alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1000 rmp, and the homogenization time is 5min;
  • Step 3 According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste.
  • the rotating speed of the homogenizer is 1000 rpm and the homogenization time is 5 min.
  • the viscosity of the halogen-free solder paste at 10 rpm was 270 Pa ⁇ s/25°C.
  • a halogen-free solder paste of the present invention is composed of 80 parts by weight of Sn-X alloy powder, 0.5 parts by weight of halogen-free activator, 2 parts by weight of organic solvent, 3 parts by weight of liquid rosin resin, 0.5 It is prepared by mixing a thixotropic agent in parts by weight and 0.05 parts by weight of a leveling agent.
  • the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 0.1 wt %.
  • the X element in the above-mentioned Sn-X alloy powder is aluminum element.
  • the above-mentioned halogen-free activator is pyruvic acid.
  • the above-mentioned organic solvent is tributyl citrate.
  • the density of the above-mentioned liquid rosin resin is 1 g/cm 2
  • the solid content of the liquid rosin resin is 48 wt %
  • the pH value is 4.5.
  • the thixotropic agent is gas-phase dodecahydroxystearic acid.
  • the leveling agent is a mixture of polyether polyester modified organosiloxane and alkyl modified organosiloxane.
  • the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix uniformly to obtain mixture A.
  • the rotation speed of the mixer is 700rmp and the stirring time is 10min ;
  • Step 2 Put the Sn-X alloy powder into the mixture A prepared in the step 1, and mix it uniformly in a homogenizer to obtain the mixture B.
  • the rotation speed of the homogenizer is 1200 rmp, and the homogenization time is 3min;
  • Step 3 According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste.
  • the rotating speed of the homogenizer is 1200rmp and the homogenization time is 3min.
  • the viscosity of the halogen-free solder paste at 10 rpm was 190 Pa ⁇ s/25°C.
  • a halogen-free solder paste of the present invention consists of 88 parts by weight of Sn-X alloy powder, 1.2 parts by weight of halogen-free activator, 3.5 parts by weight of organic solvent, 4.5 parts by weight of liquid rosin resin, 0.9 It is prepared by mixing a thixotropic agent in parts by weight and 0.35 parts by weight of a leveling agent.
  • the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 1.5 wt %.
  • the X element in the above-mentioned Sn-X alloy powder is tellurium element.
  • the above-mentioned halogen-free activator is a mixture of butyric acid and ethylsulfonic acid.
  • the above-mentioned organic solvent is butyl carbitol acetate.
  • the density of the above-mentioned liquid rosin resin is 1.03 g/cm 2
  • the solid content of the liquid rosin resin is 49 wt %
  • the pH value is 5.
  • the thixotropic agent is dodecylhydroxystearic acid.
  • the leveling agent is polyether polyester modified organosiloxane.
  • the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
  • Step 1 Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix evenly to obtain mixture A, the speed of the mixer is 550rmp, and the stirring time is 18min ;
  • Step 2 Put the Sn-X alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B.
  • the rotation speed of the homogenizer is 1000 rmp, and the homogenization time is 5min;
  • Step 3 According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste.
  • the rotating speed of the homogenizer is 1000 rpm and the homogenization time is 5 min.
  • the viscosity of the halogen-free solder paste at 10 rpm was 200 Pa ⁇ s/25°C.
  • Example 1 The “liquid rosin resin” in Example 1 was replaced with “rosin resin” of the same quality, and the rest of the operation methods were the same as those in Example 1.
  • Example 1 The "Sn-X alloy powder" in Example 1 was replaced with “tin powder", and the rest of the operation methods were the same as those in Example 1.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A halogen-free solder paste and a preparation method therefor. The halogen-free solder paste comprises 80-90 parts by weight of an Sn-X alloy powder, 0.5-1.5 parts by weight of a halogen-free activator, 2-4 parts by weight of an organic solvent, 3-5 parts by weight of a liquid rosin resin, 0.5-1 part by weight of a thixotropic agent, and 0.05-0.5 part by weight of a leveling agent. The influence of halogen on the weldability after welding is avoided; few residues remain after welding; and the halogen-free solder paste does not need to be cleaned, is environmentally friendly and non-toxic, is relatively low in cost and has a very strong market competitiveness. By virtue of the good adhesion between the halogen-free solder paste and a welding substrate, the problem of the poor welding performance of the conventional solder paste can be effectively solved.

Description

一种无卤素锡膏及其制备方法A kind of halogen-free solder paste and preparation method thereof 技术领域technical field
本发明属于锡膏及制备技术领域，具体涉及一种无卤素锡膏及其制备方法。The invention belongs to the technical field of solder paste and preparation, and particularly relates to a halogen-free solder paste and a preparation method thereof.
背景技术Background technique
锡膏是伴随着SMT应运而生的一种新型焊接材料。锡膏是一个复杂的体系，是由锡粉、助焊剂以及其它的添加物混合而成的膏体。锡膏在常温下有一定的粘性，可将电子元器件初粘在既定位置，在焊接温度下，随着溶剂和部分添加剂的挥发，将被焊元器件与印制电路焊盘焊接在于起形成永久连接。Solder paste is a new type of soldering material that came into being with SMT. Solder paste is a complex system, which is a paste made of tin powder, flux and other additives. The solder paste has a certain viscosity at room temperature, which can initially stick the electronic components in a given position. At the soldering temperature, with the volatilization of the solvent and some additives, the soldered components and the printed circuit pads are welded together. Permanent connection.
中国专利申请CN101143407A公开了一种锡膏及其制备方法，该锡膏组分及各组分的重量百分比含量为；合金焊粉80-90％；有机溶剂6-8％；有机酸1-8％；树脂2-10％；表面活性剂0.2-2％。所述合金焊粉由重量百分比为95.5％-99.5％的锡，重量百分比为0.3％-4％的银和重量百分比为0.1-0.7％的铜组成。虽然该锡膏的助焊剂中不含卤化物，锡膏适应性强，焊接后焊点周围无残留物，免清洗。但是该该锡膏的合金焊粉细化程度较差，分布不均匀，合金焊粉的延伸率较低，锡膏的力学性能较差。Chinese patent application CN101143407A discloses a solder paste and its preparation method. The components of the solder paste and the weight percentages of each component are: alloy solder powder 80-90%; organic solvent 6-8%; organic acid 1-8% %; Resin 2-10%; Surfactant 0.2-2%. The alloy solder powder is composed of 95.5%-99.5% tin by weight, 0.3%-4% by weight silver and 0.1-0.7% by weight copper. Although the flux of this solder paste does not contain halides, the solder paste is highly adaptable, and there is no residue around the solder joints after soldering, and no cleaning is required. However, the alloy solder powder of the solder paste has poor refinement degree, uneven distribution, low elongation rate of the alloy solder powder, and poor mechanical properties of the solder paste.
发明内容SUMMARY OF THE INVENTION
为了解决上述问题，本发明提供一种无卤素锡膏及其制备方法，该无卤素锡膏未检出卤素，且附着力和扩展率均比常规配方组成的锡膏要强，本发明的具有技术方案如下：In order to solve the above problems, the present invention provides a halogen-free solder paste and a preparation method thereof, wherein no halogen is detected in the halogen-free solder paste, and both the adhesion and the expansion rate are stronger than those of the solder paste composed of conventional formulas. The plan is as follows:
本发明的目的在于提供一种无卤素锡膏，其技术点在于：以所述无卤素锡膏的重量份数计，所述无卤素锡膏由80-90重量份的Sn-X合金粉、0.5-1.5 重量份的无卤素活化剂、2-4重量份的有机溶剂、3-5重量份的液态松香树脂、0.5-1重量份的触变剂和0.05-0.5重量份的流平剂混合制备而成。The object of the present invention is to provide a halogen-free solder paste, the technical point of which is: in terms of the weight parts of the halogen-free solder paste, the halogen-free solder paste is composed of 80-90 parts by weight of Sn-X alloy powder, 0.5-1.5 parts by weight of halogen-free activator, 2-4 parts by weight of organic solvent, 3-5 parts by weight of liquid rosin resin, 0.5-1 part by weight of thixotropic agent and 0.05-0.5 part by weight of leveling agent are mixed prepared.
在本发明的有的实施例中，以上述的Sn-X合金粉的重量为100wt％,所述X元素的重量为0.1-2wt％。In some embodiments of the present invention, the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 0.1-2 wt %.
在本发明的有的实施例中，上述的Sn-X合金粉中X元素为银元素、铋元素、铝元素和碲元素中的至少一种。In some embodiments of the present invention, X element in the above-mentioned Sn-X alloy powder is at least one of silver element, bismuth element, aluminum element and tellurium element.
在本发明的有的实施例中，上述的无卤素活化剂为乙酸、乳酸、丙酮酸、丙酸、丁酸、异丁酸、甲基磺酸和乙基磺酸的至少一种。In some embodiments of the present invention, the above-mentioned halogen-free activator is at least one of acetic acid, lactic acid, pyruvic acid, propionic acid, butyric acid, isobutyric acid, methanesulfonic acid and ethylsulfonic acid.
在本发明的有的实施例中，上述的有机溶剂为醇脂十二、松油醇、柠檬酸三丁酯和丁基卡必醇醋酸酯中的至少一种。In some embodiments of the present invention, the above-mentioned organic solvent is at least one of dodecyl alcohol, terpineol, tributyl citrate and butyl carbitol acetate.
在本发明的有的实施例中，上述的液态松香树脂的密度为1-1.1g/cm 2，所述液态松香树脂的固含量为48-50wt％，pH值为4.5-6.5。 In some embodiments of the present invention, the density of the liquid rosin resin is 1-1.1 g/cm 2 , the solid content of the liquid rosin resin is 48-50 wt %, and the pH is 4.5-6.5.
在本发明的有的实施例中，上述的触变剂为气相二氧化硅、陶土颗粒、氢化蓖麻油和十二羟基硬脂酸中的至少一种。In some embodiments of the present invention, the above-mentioned thixotropic agent is at least one of fumed silica, clay particles, hydrogenated castor oil and dodecyl stearic acid.
在本发明的有的实施例中，上述的流平剂为聚醚聚酯改性有机硅氧烷和烷基改性有机硅氧烷中的至少一种。In some embodiments of the present invention, the above-mentioned leveling agent is at least one of polyether polyester-modified organosiloxane and alkyl-modified organosiloxane.
根据上述配方，本发明的目的在于提供一种无卤素锡膏的制备方法，其技术点在于：所述无卤素锡膏的制备方法为：According to above-mentioned formula, the object of the present invention is to provide a kind of preparation method of halogen-free solder paste, and its technical point is: the preparation method of described halogen-free solder paste is:
步骤一：用分析天平精确称量每个原料的组分，将有机溶剂、无卤素活化剂和液态松香树脂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为500-700rmp，搅拌时间为10-20min；Step 1: Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix evenly to obtain mixture A. The rotation speed of the mixer is 500-700 rmp, and the stirring time is 500-700 rpm. for 10-20min;
步骤二：将Sn-X合金粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1000-1200rmp，均质时间 为3-5min；Step 2: Put the Sn-X alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B. The rotation speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3- 5min;
步骤三：根据混合物B的状况，加入触变剂和流平剂于均质机中混合均匀得到所述的无卤素锡膏，所述均质机的转速为1000-1200rmp，均质时间为3-5min。Step 3: According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste. The rotating speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3 -5min.
在本发明的有的实施例中，上述的无卤素锡膏的于10rmp转速下的粘度为190-270Pa·s/25℃。In some embodiments of the present invention, the viscosity of the above-mentioned halogen-free solder paste at a rotational speed of 10 rmp is 190-270 Pa·s/25°C.
与现有技术相比，本发明的有益效果：Compared with the prior art, the beneficial effects of the present invention:
本发明的一种无卤素锡膏本发明的一种无卤素锡膏包括Sn-X合金粉、无卤素活化剂、有机溶剂、液态松香树脂、触变剂和流平剂，解决了卤素对焊后可焊性造成的影响，焊后残留物少，免清洗，环保无毒，成本较低，具有很强的市场竞争力。本发明无卤素锡膏跟焊接基材之间的粘附性好能有效的解决常规锡膏焊接性能差的问题。A halogen-free solder paste of the present invention A halogen-free solder paste of the present invention includes Sn-X alloy powder, halogen-free activator, organic solvent, liquid rosin resin, thixotropic agent and leveling agent, which solves the problem of halogen butt welding. The impact of post-weldability, less residue after welding, no cleaning, environmental protection, non-toxic, low cost, and strong market competitiveness. The halogen-free solder paste of the present invention has good adhesion between the soldering base material and can effectively solve the problem of poor soldering performance of the conventional solder paste.
具体实施方式detailed description
下面将对本发明实施例中的技术方案进行清楚、完整地描述，以使本领域的技术人员能够更好的理解本发明的优点和特征，从而对本发明的保护范围做出更为清楚的界定。本发明所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例，基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below, so that those skilled in the art can better understand the advantages and features of the present invention, and thus make a clearer definition of the protection scope of the present invention. The described embodiments of the present invention are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementations obtained by those of ordinary skill in the art without creative work For example, all belong to the protection scope of the present invention.
实施例1Example 1
本发明的一种无卤素锡膏按照重量份数计由85重量份的Sn-X合金粉、1重量份的无卤素活化剂、3重量份的有机溶剂、4重量份的液态松香树脂、0.75重量份的触变剂和0.2重量份的流平剂混合制备而成。A halogen-free solder paste of the present invention consists of 85 parts by weight of Sn-X alloy powder, 1 part by weight of halogen-free activator, 3 parts by weight of organic solvent, 4 parts by weight of liquid rosin resin, 0.75 It is prepared by mixing thixotropic agent in parts by weight and leveling agent in 0.2 parts by weight.
其中，以上述的Sn-X合金粉的重量为100wt％,所述X元素的重量为1wt％。Wherein, the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 1 wt %.
其中，上述的Sn-X合金粉中X元素为银元素。Wherein, the X element in the above-mentioned Sn-X alloy powder is silver element.
其中，上述的无卤素活化剂为乙酸。Wherein, the above-mentioned halogen-free activator is acetic acid.
其中，上述的有机溶剂为醇脂十二。Wherein, the above-mentioned organic solvent is alcohol lipid twelve.
其中，上述的液态松香树脂的密度为1.05/cm 2，所述液态松香脂的固含量为49wt％，pH值为5.5。 Wherein, the density of the above-mentioned liquid rosin resin is 1.05/cm 2 , the solid content of the liquid rosin resin is 49 wt %, and the pH value is 5.5.
其中，触变剂为气相二氧化硅。Among them, the thixotropic agent is fumed silica.
其中，流平剂为聚醚聚酯改性有机硅氧烷。Wherein, the leveling agent is polyether polyester modified organosiloxane.
根据上述配方，本发明的目的在于提供一种无卤素锡膏的制备方法为：According to above-mentioned formula, the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
步骤一：用分析天平精确称量每个原料的组分，将有机溶剂、无卤素活化剂和液态松香树脂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为600rmp，搅拌时间为15min；Step 1: Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix evenly to obtain mixture A, the speed of the mixer is 600rmp, and the stirring time is 15min ;
步骤二：将Sn-X合金粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1100rmp，均质时间为4min；Step 2: Put the Sn-X alloy powder into the mixture A prepared in the step 1, and mix it uniformly in a homogenizer to obtain the mixture B. The rotation speed of the homogenizer is 1100 rmp, and the homogenization time is 4min;
步骤三：根据混合物B的状况，加入触变剂和流平剂于均质机中混合均匀得到所述的无卤素锡膏，所述均质机的转速为1100rmp，均质时间为5min。Step 3: According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste. The rotating speed of the homogenizer is 1100rmp and the homogenization time is 5min.
其中，无卤素锡膏的于10rmp转速下的粘度为230Pa·s/25℃。The viscosity of the halogen-free solder paste at 10 rpm was 230 Pa·s/25°C.
实施例2Example 2
本发明的一种无卤素锡膏按照重量份数计由90重量份的Sn-X合金粉、1.5重量份的无卤素活化剂、4重量份的有机溶剂、5重量份的液态松香树脂、1重量份的触变剂和0.5重量份的流平剂混合制备而成。A halogen-free solder paste of the present invention consists of 90 parts by weight of Sn-X alloy powder, 1.5 parts by weight of halogen-free activator, 4 parts by weight of organic solvent, 5 parts by weight of liquid rosin resin, 1 It is prepared by mixing thixotropic agent in parts by weight and leveling agent in 0.5 parts by weight.
其中，以上述的Sn-X合金粉的重量为100wt％,所述X元素的重量为2wt％。Wherein, the weight of the above-mentioned Sn-X alloy powder is 100wt%, and the weight of the X element is 2wt%.
其中，上述的Sn-X合金粉中X元素为铋元素。Wherein, the X element in the above-mentioned Sn-X alloy powder is bismuth element.
其中，上述的无卤素活化剂为乳酸。Wherein, the above-mentioned halogen-free activator is lactic acid.
其中，上述的有机溶剂为松油醇。Wherein, the above-mentioned organic solvent is terpineol.
其中，上述的液态松香树脂的密度为1g/cm 2，所述液态松香树脂的固含量为48wt％，pH值为4.5。 Wherein, the density of the above-mentioned liquid rosin resin is 1 g/cm 2 , the solid content of the liquid rosin resin is 48 wt %, and the pH value is 4.5.
其中，触变剂为陶土颗粒。Among them, the thixotropic agent is clay particles.
其中，流平剂为烷基改性有机硅氧烷。Among them, the leveling agent is an alkyl-modified organosiloxane.
根据上述配方，本发明的目的在于提供一种无卤素锡膏的制备方法为：According to above-mentioned formula, the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
步骤一：用分析天平精确称量每个原料的组分，将有机溶剂、无卤素活化剂和液态松香树脂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为700rmp，搅拌时间为10min；Step 1: Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix uniformly to obtain mixture A. The rotation speed of the mixer is 700rmp and the stirring time is 10min ;
步骤二：将Sn-X合金粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1000rmp，均质时间为5min；Step 2: Put the Sn-X alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B. The rotation speed of the homogenizer is 1000 rmp, and the homogenization time is 5min;
步骤三：根据混合物B的状况，加入触变剂和流平剂于均质机中混合均匀得到所述的无卤素锡膏，所述均质机的转速为1000rmp，均质时间为5min。Step 3: According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste. The rotating speed of the homogenizer is 1000 rpm and the homogenization time is 5 min.
其中，无卤素锡膏的于10rmp转速下的粘度为270Pa·s/25℃。The viscosity of the halogen-free solder paste at 10 rpm was 270 Pa·s/25°C.
实施例3Example 3
本发明的一种无卤素锡膏按照重量份数计由80重量份的Sn-X合金粉、0.5重量份的无卤素活化剂、2重量份的有机溶剂、3重量份的液态松香树脂、0.5重量份的触变剂和0.05重量份的流平剂混合制备而成。A halogen-free solder paste of the present invention is composed of 80 parts by weight of Sn-X alloy powder, 0.5 parts by weight of halogen-free activator, 2 parts by weight of organic solvent, 3 parts by weight of liquid rosin resin, 0.5 It is prepared by mixing a thixotropic agent in parts by weight and 0.05 parts by weight of a leveling agent.
其中，以上述的Sn-X合金粉的重量为100wt％,所述X元素的重量为0.1wt％。Wherein, the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 0.1 wt %.
其中，上述的Sn-X合金粉中X元素为铝元素。Wherein, the X element in the above-mentioned Sn-X alloy powder is aluminum element.
其中，上述的无卤素活化剂为丙酮酸。Wherein, the above-mentioned halogen-free activator is pyruvic acid.
其中，上述的有机溶剂为柠檬酸三丁酯。Wherein, the above-mentioned organic solvent is tributyl citrate.
其中，上述的液态松香树脂的密度为1g/cm 2，所述液态松香树脂的固含量为48wt％，pH值为4.5。 Wherein, the density of the above-mentioned liquid rosin resin is 1 g/cm 2 , the solid content of the liquid rosin resin is 48 wt %, and the pH value is 4.5.
其中，触变剂为气相十二羟基硬脂酸。Wherein, the thixotropic agent is gas-phase dodecahydroxystearic acid.
其中，流平剂为聚醚聚酯改性有机硅氧烷和烷基改性有机硅氧烷的混合物。The leveling agent is a mixture of polyether polyester modified organosiloxane and alkyl modified organosiloxane.
根据上述配方，本发明的目的在于提供一种无卤素锡膏的制备方法为：According to above-mentioned formula, the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
步骤一：用分析天平精确称量每个原料的组分，将有机溶剂、无卤素活化剂和液态松香树脂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为700rmp，搅拌时间为10min；Step 1: Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix uniformly to obtain mixture A. The rotation speed of the mixer is 700rmp and the stirring time is 10min ;
步骤二：将Sn-X合金粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1200rmp，均质时间为3min；Step 2: Put the Sn-X alloy powder into the mixture A prepared in the step 1, and mix it uniformly in a homogenizer to obtain the mixture B. The rotation speed of the homogenizer is 1200 rmp, and the homogenization time is 3min;
步骤三：根据混合物B的状况，加入触变剂和流平剂于均质机中混合均匀得到所述的无卤素锡膏，所述均质机的转速为1200rmp，均质时间为3min。Step 3: According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste. The rotating speed of the homogenizer is 1200rmp and the homogenization time is 3min.
其中，无卤素锡膏的于10rmp转速下的粘度为190Pa·s/25℃。The viscosity of the halogen-free solder paste at 10 rpm was 190 Pa·s/25°C.
实施例4Example 4
本发明的一种无卤素锡膏按照重量份数计由88重量份的Sn-X合金粉、1.2重量份的无卤素活化剂、3.5重量份的有机溶剂、4.5重量份的液态松香树 脂、0.9重量份的触变剂和0.35重量份的流平剂混合制备而成。A halogen-free solder paste of the present invention consists of 88 parts by weight of Sn-X alloy powder, 1.2 parts by weight of halogen-free activator, 3.5 parts by weight of organic solvent, 4.5 parts by weight of liquid rosin resin, 0.9 It is prepared by mixing a thixotropic agent in parts by weight and 0.35 parts by weight of a leveling agent.
其中，以上述的Sn-X合金粉的重量为100wt％,所述X元素的重量为1.5wt％。Wherein, the weight of the above-mentioned Sn-X alloy powder is 100 wt %, and the weight of the X element is 1.5 wt %.
其中，上述的Sn-X合金粉中X元素为碲元素。Wherein, the X element in the above-mentioned Sn-X alloy powder is tellurium element.
其中，上述的无卤素活化剂为丁酸和乙基磺酸的混合物。Wherein, the above-mentioned halogen-free activator is a mixture of butyric acid and ethylsulfonic acid.
其中，上述的有机溶剂为丁基卡必醇醋酸酯。Wherein, the above-mentioned organic solvent is butyl carbitol acetate.
其中，上述的液态松香树脂的密度为1.03g/cm 2，所述液态松香树脂的固含量为49wt％，pH值为5。 Wherein, the density of the above-mentioned liquid rosin resin is 1.03 g/cm 2 , the solid content of the liquid rosin resin is 49 wt %, and the pH value is 5.
其中，触变剂为十二羟基硬脂酸。Among them, the thixotropic agent is dodecylhydroxystearic acid.
其中，流平剂为聚醚聚酯改性有机硅氧烷。Wherein, the leveling agent is polyether polyester modified organosiloxane.
根据上述配方，本发明的目的在于提供一种无卤素锡膏的制备方法为：According to above-mentioned formula, the purpose of this invention is to provide a kind of preparation method of halogen-free solder paste is:
步骤一：用分析天平精确称量每个原料的组分，将有机溶剂、无卤素活化剂和液态松香树脂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为550rmp，搅拌时间为18min；Step 1: Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix evenly to obtain mixture A, the speed of the mixer is 550rmp, and the stirring time is 18min ;
步骤二：将Sn-X合金粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1000rmp，均质时间为5min；Step 2: Put the Sn-X alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B. The rotation speed of the homogenizer is 1000 rmp, and the homogenization time is 5min;
步骤三：根据混合物B的状况，加入触变剂和流平剂于均质机中混合均匀得到所述的无卤素锡膏，所述均质机的转速为1000rmp，均质时间为5min。Step 3: According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste. The rotating speed of the homogenizer is 1000 rpm and the homogenization time is 5 min.
其中，无卤素锡膏的于10rmp转速下的粘度为200Pa·s/25℃。The viscosity of the halogen-free solder paste at 10 rpm was 200 Pa·s/25°C.
对比例1Comparative Example 1
将实施例1中的“液态松香树脂”换成同等质量的“松香树脂”，其余操作方法同实施例1。The "liquid rosin resin" in Example 1 was replaced with "rosin resin" of the same quality, and the rest of the operation methods were the same as those in Example 1.
对比例2Comparative Example 2
将实施例1中的“Sn-X合金粉”换成“锡粉”，其余操作方法同实施例1。The "Sn-X alloy powder" in Example 1 was replaced with "tin powder", and the rest of the operation methods were the same as those in Example 1.
实验例Experimental example
取实施例1-4制备得到的锡膏机械绿色含量和扩展率的测试，同时检测焊接后锡膏的附着力，具体结果见表1：Get the test of the mechanical green content and expansion rate of the solder paste prepared in Example 1-4, and detect the adhesion of the solder paste after welding simultaneously, and the specific results are shown in Table 1:
表1Table 1
   卤素含量halogen content 扩展率/％Expansion rate/% 附着力/NAdhesion/N
实施例1Example 1 未检出not detected 82.282.2 4.24.2
实施例2Example 2 未检出not detected 83.583.5 4.34.3
实施例3Example 3 未检出not detected 86.186.1 4.64.6
实施例4Example 4 未检出not detected 82.182.1 4.24.2
对比例1Comparative Example 1 未检出not detected 75.375.3 4.14.1
对比例2Comparative Example 2 未检出not detected 84.284.2 3.53.5
最后应当说明的是，以上实施例仅用以说明本发明的技术方案，而非对本发明保护范围的限制，尽管参照较佳实施例对本发明作了详细地说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that , the technical solutions of the present invention may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims (10)

  1. 一种无卤素锡膏，其特征在于：以所述无卤素锡膏的重量份数计，所述无卤素锡膏由80-90重量份的Sn-X合金粉、0.5-1.5重量份的无卤素活化剂、2-4重量份的有机溶剂、3-5重量份的液态松香树脂、0.5-1重量份的触变剂和0.05-0.5重量份的流平剂混合制备而成。A halogen-free solder paste, characterized in that: based on the weight parts of the halogen-free solder paste, the halogen-free solder paste is composed of 80-90 parts by weight of Sn-X alloy powder, 0.5-1.5 parts by weight of It is prepared by mixing halogen activator, 2-4 parts by weight of organic solvent, 3-5 parts by weight of liquid rosin resin, 0.5-1 part by weight of thixotropic agent and 0.05-0.5 part by weight of leveling agent.
  2. 根据权利要求1所述一种无卤素锡膏，其特征在于：所述以所述Sn-X合金粉的重量为100wt％,所述X元素的重量为0.1-2wt％。The halogen-free solder paste according to claim 1, wherein the weight of the Sn-X alloy powder is 100wt%, and the weight of the X element is 0.1-2wt%.
  3. 根据权利要求1或2任一所述一种无卤素锡膏，其特征在于：所述Sn-X合金粉中X元素为银元素、铋元素、铝元素和碲元素中的至少一种。The halogen-free solder paste according to any one of claims 1 and 2, wherein X element in the Sn-X alloy powder is at least one of silver element, bismuth element, aluminum element and tellurium element.
  4. 根据权利要求1所述一种无卤素锡膏，其特征在于：所述无卤素活化剂为乙酸、乳酸、丙酮酸、丙酸、丁酸、异丁酸、甲基磺酸和乙基磺酸的至少一种。A kind of halogen-free solder paste according to claim 1, is characterized in that: described halogen-free activator is acetic acid, lactic acid, pyruvic acid, propionic acid, butyric acid, isobutyric acid, methanesulfonic acid and ethylsulfonic acid at least one of.
  5. 根据权利要求1所述一种无卤素锡膏，其特征在于：所述有机溶剂为醇脂十二、松油醇、柠檬酸三丁酯和丁基卡必醇醋酸酯中的至少一种。The halogen-free solder paste according to claim 1, wherein the organic solvent is at least one of alcohol dodecyl, terpineol, tributyl citrate and butyl carbitol acetate.
  6. 根据权利要求1所述一种无卤素锡膏，其特征在于：所述液态松香树脂的密度为1-1.1g/cm 2，所述液态松香树脂的固含量为48-50wt％，pH值为4.5-6.5。 The halogen-free solder paste according to claim 1, wherein the density of the liquid rosin resin is 1-1.1 g/cm 2 , the solid content of the liquid rosin resin is 48-50wt%, and the pH is 4.5-6.5.
  7. 根据权利要求1所述一种无卤素锡膏，其特征在于：所述触变剂为气相二氧化硅、陶土颗粒、氢化蓖麻油和十二羟基硬脂酸中的至少一种。A halogen-free solder paste according to claim 1, wherein the thixotropic agent is at least one of fumed silica, clay particles, hydrogenated castor oil and dodecylhydroxystearic acid.
  8. 根据权利要求1所述一种无卤素锡膏，其特征在于：所述流平剂为聚醚聚酯改性有机硅氧烷和烷基改性有机硅氧烷中的至少一种。The halogen-free solder paste according to claim 1, wherein the leveling agent is at least one of polyether polyester modified organosiloxane and alkyl modified organosiloxane.
  9. 根据权利要求1-8所述一种无卤素锡膏，其特征在于：所述无卤素锡膏的制备方法为：A kind of halogen-free solder paste according to claim 1-8, is characterized in that: the preparation method of described halogen-free solder paste is:
    步骤一：用分析天平精确称量每个原料的组分，将有机溶剂、无卤素活化剂和液态松香树脂置于搅拌机中混合均匀得到混合物A，所述搅拌机的转速为500-700rmp，搅拌时间为10-20min；Step 1: Accurately weigh the components of each raw material with an analytical balance, place the organic solvent, halogen-free activator and liquid rosin resin in a mixer to mix evenly to obtain mixture A. The rotation speed of the mixer is 500-700 rmp, and the stirring time is 500-700 rpm. for 10-20min;
    步骤二：将Sn-X合金粉放入步骤一中制备得到的混合物A中，在均质机中混合均匀得到混合物B，所述均质机的转速为1000-1200rmp，均质时间为3-5min；Step 2: Put the Sn-X alloy powder into the mixture A prepared in step 1, and mix it uniformly in a homogenizer to obtain a mixture B. The rotation speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3- 5min;
    步骤三：根据混合物B的状况，加入触变剂和流平剂于均质机中混合均匀得到所述的无卤素锡膏，所述均质机的转速为1000-1200rmp，均质时间为3-5min。Step 3: According to the condition of mixture B, add thixotropic agent and leveling agent and mix evenly in a homogenizer to obtain the halogen-free solder paste. The rotating speed of the homogenizer is 1000-1200rmp, and the homogenization time is 3 -5min.
  10. 根据权利要求9所述的一种无卤素锡膏，其特征在于：所述无卤素锡膏的于10rmp转速下的粘度为190-270Pa·s/25℃。The halogen-free solder paste according to claim 9, wherein the halogen-free solder paste has a viscosity of 190-270 Pa·s/25°C at a rotational speed of 10 rpm.
PCT/CN2020/135738 2020-08-17 2020-12-11 Halogen-free solder paste and preparation method therefor WO2022036950A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115091074A (en) * 2022-07-19 2022-09-23 深圳市鑫富锦新材料有限公司 Heated variable viscosity solder paste and device for preventing solder paste from dripping

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111940947B (en) * 2020-08-17 2022-05-13 惠州市源德智科技有限公司 Halogen-free tin paste and preparation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101642855A (en) * 2009-08-19 2010-02-10 浙江一远电子材料研究院 Rear-earth-containing halogen free Sn-Ag-C series tinol
CN101653876A (en) * 2009-08-19 2010-02-24 浙江一远电子材料研究院 Low-silver halogen free soldering paste
CN102248321A (en) * 2011-07-06 2011-11-23 江西理工大学 Lead-free solder paste used for halogen-free LED (light-emitting diode) lamp
CN102581523A (en) * 2012-03-21 2012-07-18 瑞玛泰（北京）科技有限公司 Halogen-free solder paste and preparation method thereof
CN103706968A (en) * 2012-09-28 2014-04-09 钟广飞 Halogen-free soldering flux
CN104476007A (en) * 2014-12-17 2015-04-01 东莞永安科技有限公司 High-melting-point lead-free and halogen-free soldering paste and preparing method of high-melting-point lead-free and halogen-free soldering paste
CN104668818A (en) * 2015-01-16 2015-06-03 北京鹏瑞中联科技有限公司 Low-voidage soldering paste for packaging semiconductor chip and preparation method of low-voidage soldering paste
JP2017170522A (en) * 2016-09-20 2017-09-28 株式会社タムラ製作所 Lead-free solder alloy, electronic circuit board, and electronic control device
CN111940947A (en) * 2020-08-17 2020-11-17 惠州市源德智科技有限公司 Halogen-free solder paste and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100450700C (en) * 2006-04-30 2009-01-14 北京市航天焊接材料厂 Lead-free halogen-free tinol and preparation process
CN101966632B (en) * 2010-09-29 2013-07-17 广州瀚源电子科技有限公司 Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof
CN102489898B (en) * 2011-11-30 2013-07-31 昆山成利焊锡制造有限公司 Low-silver lead-free flux paste and preparation method thereof
CN102489899B (en) * 2011-12-16 2013-07-31 昆山成利焊锡制造有限公司 Lead-free soldering paste and preparation method thereof
CN103706961B (en) * 2012-09-28 2016-08-03 钟广飞 Halogen-free tin paste
JP5877822B2 (en) * 2013-08-22 2016-03-08 株式会社タムラ製作所 Cold and heat shock resistant flux composition, solder paste composition, method for producing solder joints, and method for producing electronic circuit boards
TW201607992A (en) * 2014-08-29 2016-03-01 昇貿科技股份有限公司 Solder flux composition
CN104476016A (en) * 2014-11-05 2015-04-01 苏州赛普特电子科技有限公司 Lead-free and halogen-free soldering paste for semiconductors
CN106312361A (en) * 2016-10-12 2017-01-11 哈尔滨工业大学（威海） Ceramic substrate and copper clad foil low-temperature connecting soldering paste and production process thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101642855A (en) * 2009-08-19 2010-02-10 浙江一远电子材料研究院 Rear-earth-containing halogen free Sn-Ag-C series tinol
CN101653876A (en) * 2009-08-19 2010-02-24 浙江一远电子材料研究院 Low-silver halogen free soldering paste
CN102248321A (en) * 2011-07-06 2011-11-23 江西理工大学 Lead-free solder paste used for halogen-free LED (light-emitting diode) lamp
CN102581523A (en) * 2012-03-21 2012-07-18 瑞玛泰（北京）科技有限公司 Halogen-free solder paste and preparation method thereof
CN103706968A (en) * 2012-09-28 2014-04-09 钟广飞 Halogen-free soldering flux
CN104476007A (en) * 2014-12-17 2015-04-01 东莞永安科技有限公司 High-melting-point lead-free and halogen-free soldering paste and preparing method of high-melting-point lead-free and halogen-free soldering paste
CN104668818A (en) * 2015-01-16 2015-06-03 北京鹏瑞中联科技有限公司 Low-voidage soldering paste for packaging semiconductor chip and preparation method of low-voidage soldering paste
JP2017170522A (en) * 2016-09-20 2017-09-28 株式会社タムラ製作所 Lead-free solder alloy, electronic circuit board, and electronic control device
CN111940947A (en) * 2020-08-17 2020-11-17 惠州市源德智科技有限公司 Halogen-free solder paste and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115091074A (en) * 2022-07-19 2022-09-23 深圳市鑫富锦新材料有限公司 Heated variable viscosity solder paste and device for preventing solder paste from dripping
CN115091074B (en) * 2022-07-19 2023-08-15 深圳市鑫富锦新材料有限公司 Solder paste with variable viscosity under heating and device for preventing solder paste from dripping

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