CN115091074A - Heated variable viscosity solder paste and device for preventing solder paste from dripping - Google Patents
Heated variable viscosity solder paste and device for preventing solder paste from dripping Download PDFInfo
- Publication number
- CN115091074A CN115091074A CN202210852353.9A CN202210852353A CN115091074A CN 115091074 A CN115091074 A CN 115091074A CN 202210852353 A CN202210852353 A CN 202210852353A CN 115091074 A CN115091074 A CN 115091074A
- Authority
- CN
- China
- Prior art keywords
- solder paste
- percent
- air inlet
- airtight
- dripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
Abstract
The invention discloses a solder paste with variable viscosity under heating, which consists of the following components in percentage by weight: alloy welding powder: 82% -85%, flux paste: 15% -18%, wherein the alloy welding powder comprises the following components in percentage by weight: 20 to 25 percent of lead powder, 2 to 2.5 percent of bismuth powder, 0.5 to 1 percent of silver powder, 5 to 8 percent of rare earth element and the balance of tin powder; the invention also discloses a device for preventing the solder paste from dripping, which comprises a solder paste shovel cavity, a holding pressure pipe, a solder paste scraper, a solder paste scraping partition plate and a one-way anti-dripping elastic sheet, wherein the solder paste shovel cavity is fixedly communicated with the holding pressure pipe, the solder paste scraper is fixedly arranged at the position of the lower surface of the solder paste shovel cavity, and the solder paste scraping partition plate is fixedly arranged in the solder paste shovel cavity close to the lower position.
Description
Technical Field
The invention relates to the technical field of solder paste, in particular to solder paste with variable viscosity under heating and a device for preventing the solder paste from dripping.
Background
The tin paste is a novel welding material which is produced along with SMT, and is a paste mixture formed by mixing tin powder and soldering flux, the traditional tin paste can be changed into mercury-shaped liquid after being heated and melted, the viscosity is low, once the traditional tin paste is subjected to vibration or other disturbance during welding, the component is easy to deviate, and the viscosity cannot be changed according to the temperature, so that the stability during welding is improved; and when utilizing the tin cream to carry out manual welding, the coating tin cream often can use the tin cream scraper to dip in and get the tin cream often, coats PCB board surface, and traditional tin cream scraper is dipping in and is got the tin cream after, because the tin cream has mobility, very easily drips and causes scrapping or damage on PCB board surface at the removal in-process.
Disclosure of Invention
The present invention is directed to a solder paste with a variable viscosity when heated and a device for preventing the solder paste from dropping, so as to solve the problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme: a solder paste with variable viscosity under heating is composed of the following components by weight percent: alloy welding powder: 82% -85%, flux paste: 15% -18%;
the alloy welding powder comprises the following components in percentage by weight: 20 to 25 percent of lead powder, 2 to 2.5 percent of bismuth powder, 0.5 to 1 percent of silver powder, 5 to 8 percent of rare earth element and the balance of tin powder;
the soldering paste comprises the following components in percentage by weight: 5 to 7 percent of antioxidant, 10 to 25 percent of paraffin, 5 to 7.5 percent of mica, 6 to 9.5 percent of acrylic acid, 17 to 21 percent of organic silicon resin, 4.3 to 5.7 percent of urea-formaldehyde resin and the balance of rosin.
The rare earth elements comprise the following components in percentage by weight: nb8.5% -10%, La 25% -28%, Yb0.5% -1.8%, Dy7.3% -10% and the balance Ce.
The organic silicon resin is prepared by mixing one or more of methyl trichlorosilane, dimethyl dichlorosilane, phenyl trichlorosilane, diphenyl dichlorosilane or methyl phenyl dichlorosilane.
A device for preventing solder paste from dripping for solder paste with variable heated viscosity comprises a solder paste shovel cavity, a holding pressure pipe, a solder paste scraper, a solder paste scraping partition plate and a one-way anti-dripping elastic sheet, wherein the solder paste shovel cavity is fixedly communicated with the holding pressure pipe, the solder paste scraper is fixedly installed at the surface position below the solder paste shovel cavity, the solder paste scraping partition plate is fixedly installed at the position, close to the lower position, inside the solder paste shovel cavity, the solder paste scraping partition plate is transversely and uniformly distributed in the solder paste shovel cavity in an arrayed manner, the one-way anti-dripping elastic sheet is symmetrically and fixedly installed between every two solder paste scraping partition plates, and two symmetrical one-way anti-dripping elastic sheets are mutually closed downwards;
the surface of the solder paste shovel cavity is provided with a one-way feeding structure;
a pressure plug structure is arranged in the holding pressure pipe and has an elastic pressing function;
the outside of holding the pressure pipe is close to top fixed position intercommunication and is provided with one-way structure and the regulation structure of admitting air of giving vent to anger, the regulation structure of admitting air has air intake flow regulatory function.
One-way feed structure includes that the tin cream absorbs hole, shutoff plugboard, spacing eaves and the connection shell fragment of keeping off, the tin cream absorbs the hole and runs through the surface position of seting up in tin cream shovel chamber, the shutoff plugboard is located the tin cream and absorbs downthehole portion, spacing eaves fixed mounting that keeps off is in the surface position of shutoff plugboard, and is located the inside in tin cream shovel chamber, the shutoff plugboard with the inner wall surface in tin cream shovel chamber is through connecting shell fragment elastic connection.
The pressure stopper structure includes pressure movable stopper, carries and draws the polished rod, pushes away cream pressure spring, seal cover, airtight gum cover and pull ring, pressure movable stopper goes up and down to set up in the inside that grips the pressure pipe, carry and draw polished rod fixed mounting at the upper surface position of pressure movable stopper, it establishes at the outside of carrying and drawing the polished rod to push away cream pressure spring cover, seal cover fixed mounting grips the upper surface position of pressure pipe, airtight gum cover fixed mounting is in the inside of seal cover, it alternates through airtight gum cover to carry and draws the polished rod, and airtight contact with it, it carries the upper end surface position of pull ring fixed mounting at carrying and drawing the polished rod to carry.
The one-way structure of giving vent to anger is including fixed trachea, airtight stifled ring, airtight rubber disk, rubber disk push away the dish, one-way spring and push away the spring support of pushing away, the fixed intercommunication of fixed trachea is close to the top position at the surface of gripping the pressure pipe, airtight stifled fixed the setting in fixed tracheal inside of ring.
The outer side surface position of airtight stifled ring is provided with airtight rubber disc, the outside fixed surface of airtight rubber disc installs the rubber disc and pushes away the dish, the outside fixed surface that the rubber disc pushed away the dish installs one-way spring that pushes away, the inside fixed mounting that fixes trachea pushes away the spring support, the other end that one-way pushes away the spring with push away spring support fixed mounting.
The air inlet adjusting structure comprises an air inlet communicating pipe, an adjusting air inlet groove, a matching threaded plug, a threaded sealing cap and an air tight contact ring.
The utility model discloses a pressure pipe's structure, including the fixed trachea of communicating pipe, intake communicating pipe fixed mounting is at fixed tracheal surface position, intake communicating pipe through fixed trachea and the inner chamber intercommunication of holding the pressure pipe, the surface of intake communicating pipe runs through and has seted up the regulation air inlet duct, it is rectangular form to adjust the air inlet duct, and its length direction is parallel with the axis direction of intake communicating pipe, the terminal surface fixed mounting of intake communicating pipe has the cooperation screw thread stopper, the screw thread sealing cap is installed to the outside spiral of cooperation screw thread stopper, the screw thread sealing cap is the cylinder tubulose, and its one end opening, the other end is sealed, the inside of screw thread sealing cap is close to open end position fixed mounting and has airtight contact ring, airtight contact ring is the ring form, and the cover is established and is installed at the surface position of intake communicating pipe, and with the surface airtight contact of intake communicating pipe.
Compared with the prior art, the invention has the beneficial effects that:
compared with the traditional solder paste, the solder paste with variable viscosity after being heated can have higher viscosity after being heated and melted, and the viscosity can be improved along with the rise of temperature, so that the adhesion of a surface mounted element is more convenient during surface mounted welding, the element deviation is avoided, and the welding quality and the positioning accuracy are improved;
according to the device for preventing the solder paste from dripping, the solder paste can be stored in the device through the arranged solder paste shovel cavity, and the blocking structure can be formed at the lower part of the solder paste shovel cavity through the arranged solder paste scraping partition plate and the one-way anti-dripping elastic sheet, so that the circuit board scrapping caused by the solder paste dripping is avoided;
through the arranged air inlet adjusting structure, the air entering the holding pressure pipe can be accurately adjusted, so that the falling speed of the pressure moving plug along with the air pressure can be accurately controlled, and the speed of discharging the solder paste at the lower end of the solder paste shovel cavity can be accurately adjusted;
the one-way feeding structure can be automatically opened when absorbing solder paste, and automatically closed when storing the solder paste, and when the solder paste is prevented from overflowing in work, the solder paste can be conveniently extracted and stored.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of another embodiment of the present invention;
FIG. 3 is a schematic view of a half-section configuration of the present invention;
FIG. 4 is a partial half-section schematic view of the present invention;
FIG. 5 is a top view of the present invention;
FIG. 6 is a cross-sectional view taken along line A-A of FIG. 5;
fig. 7 is an enlarged view of a portion a of fig. 6.
In the figure: 1. a solder paste shovel cavity; 2. holding the pressure tube; 3. a solder paste scraper; 4. scraping the paste partition plate; 5. a one-way drip-proof elastic sheet; 101. a solder paste suction hole; 102. plugging the plug disc; 103. limiting and blocking eaves; 104. connecting the elastic sheets; 201. a pressure-shifting plug; 202. lifting the polish rod; 203. a paste pushing pressure spring; 204. sealing sleeves; 205. an airtight rubber sleeve; 206. lifting the ring; 207. fixing the air pipe; 208. an airtight blocking ring; 209. an airtight rubber disc; 210. a rubber plate pushing plate; 211. a unidirectional push spring; 212. a spring pushing bracket; 213. an intake communicating pipe; 214. adjusting an air inlet groove; 215. matching with a threaded plug; 216. sealing a cap by screw thread; 217. a gas-tight contact ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, the present invention provides a technical solution: the tin paste with variable viscosity under heating comprises the following components in percentage by weight: alloy welding powder: 83%, flux paste: 17 percent;
the alloy welding powder comprises the following components in percentage by weight: 22% of lead powder, 2.2% of bismuth powder, 0.6% of silver powder, 5.5% of rare earth elements and the balance of tin powder;
the solder paste consists of the following components in percentage by weight: 6% of antioxidant, 15% of paraffin, 6% of acrylic acid, 18.5% of organic silicon resin, 5% of urea-formaldehyde resin and the balance of rosin.
The rare earth elements comprise the following components in percentage by weight: nb 9%, La 26%, Yb 1%, Dy8.5%, and the balance of Ce.
The organic silicon resin is prepared by mixing methyl trichlorosilane, dimethyl dichlorosilane, phenyl trichlorosilane, diphenyl dichlorosilane or methyl phenyl dichlorosilane.
A device for preventing solder paste from dripping for solder paste with variable viscosity by heating comprises a solder paste shovel cavity 1 and a holding pressure pipe 2, the solder paste scraping device comprises a solder paste scraping knife 3, a solder paste scraping partition plate 4 and a one-way anti-dripping elastic sheet 5, wherein a solder paste scraping cavity 1 is fixedly communicated with a holding pressure pipe 2, the solder paste scraping knife 3 is fixedly installed at the position of the lower surface of the solder paste scraping cavity 1, the solder paste scraping partition plate 4 is fixedly installed at the position, close to the lower position, inside the solder paste scraping cavity 1, the solder paste scraping partition plate 4 is transversely and uniformly distributed in the solder paste scraping cavity 1 in an arrayed manner, the one-way anti-dripping elastic sheet 5 is symmetrically and fixedly installed between every two solder paste scraping partition plates 4, the two symmetrical one-way anti-dripping elastic sheets 5 are mutually drawn together and attached downwards, the one-way anti-dripping elastic sheet 5 is made of a sheet made of an elastic material, the outer surface of the solder paste scraping cavity 1 can be sprayed with an anti-sticking coating, and the solder paste is prevented from being attached to the outer surface of the solder paste scraping cavity 1 in use;
the surface of the solder paste shovel cavity 1 is provided with a one-way feeding structure;
a pressure plug structure is arranged in the holding pressure pipe 2 and has an elastic pressing function;
the outside of holding pressure pipe 2 is close to the fixed intercommunication in top position and is provided with one-way structure and the structure of adjusting of admitting air, and the structure of adjusting of admitting air has the air intake flow regulatory function.
One-way feed structure includes that the solder paste absorbs hole 101, shutoff plugdisk 102, spacing eaves 103 and the connection shell fragment 104 of keeping off, the solder paste absorbs hole 101 and runs through the surface position of seting up in solder paste shovel chamber 1, shutoff plugdisk 102 is located solder paste and absorbs downthehole 101 inside, spacing eaves 103 fixed mounting that keeps off is in the surface position of shutoff plugdisk 102, and be located solder paste shovel chamber 1's inside, shutoff plugdisk 102 and solder paste shovel chamber 1's inner wall surface are through connecting shell fragment 104 elastic connection, it has elasticity to connect shell fragment 104.
The pressure plug structure comprises a pressure moving plug 201, a pulling polish rod 202, a paste pushing pressure spring 203, a sealing sleeve 204, an airtight rubber sleeve 205 and a pulling ring 206, wherein the pressure moving plug 201 is arranged inside a holding pressure pipe 2 in a lifting mode, the pulling polish rod 202 is fixedly arranged on the upper surface of the pressure moving plug 201, the paste pushing pressure spring 203 is arranged outside the pulling polish rod 202 in a sleeving mode, the sealing sleeve 204 is fixedly arranged on the upper surface of the holding pressure pipe 2, the airtight rubber sleeve 205 is fixedly arranged inside the sealing sleeve 204, the pulling polish rod 202 penetrates through the airtight rubber sleeve 205 and is in airtight contact with the airtight rubber sleeve, and therefore the upper portion of the pressure moving plug 201 can not leak air when generating negative pressure, and the pulling ring 206 is fixedly arranged on the upper end surface of the pulling polish rod 202.
The one-way air outlet structure comprises a fixed air pipe 207, an airtight blocking ring 208, an airtight rubber disc 209, a rubber disc pushing disc 210, a one-way pushing spring 211 and a pushing spring bracket 212, the fixed air pipe 207 is fixedly communicated with the position, close to the upper part, of the outer surface of the holding pressure pipe 2, and the airtight blocking ring 208 is fixedly arranged inside the fixed air pipe 207.
An airtight rubber disc 209 is arranged on the outer surface of the airtight blocking ring 208, a rubber disc pushing disc 210 is fixedly mounted on the outer surface of the airtight rubber disc 209, a one-way pushing spring 211 is fixedly mounted on the outer surface of the rubber disc pushing disc 210, a pushing spring support 212 is fixedly mounted inside the fixed air pipe 207, and the other end of the one-way pushing spring 211 is fixedly mounted with the pushing spring support 212.
The air inlet adjusting structure comprises an air inlet communicating pipe 213, an adjusting air inlet groove 214, a matching threaded plug 215, a threaded sealing cap 216 and an air tight contact ring 217; the air inlet communicating pipe 213 is fixedly installed at the outer surface position of the fixed air pipe 207, the air inlet communicating pipe 213 is communicated with the inner cavity of the holding pressure pipe 2 through the fixed air pipe 207, the outer surface of the air inlet communicating pipe 213 is provided with an adjusting air inlet groove 214 in a penetrating manner, the adjusting air inlet groove 214 is long-shaped, the length direction of the adjusting air inlet groove is parallel to the axial direction of the air inlet communicating pipe 213, the end surface of the air inlet communicating pipe 213 is fixedly provided with a matching threaded plug 215, the outside of the matching threaded plug 215 is spirally provided with a threaded sealing cap 216, the threaded sealing cap 216 is cylindrical, one end of the threaded sealing cap is opened, the other end of the threaded sealing cap is closed, an airtight contact ring 217 is fixedly installed at the position, close to the opening end, of the inside of the threaded sealing cap 216, the airtight contact ring 217 is annular, and the cover is installed at the outer surface position of the air inlet communicating pipe 213 and is in airtight contact with the outer surface of the air inlet communicating pipe 213.
When the tin paste shovel is used, the tin paste shovel cavity 1 is placed in a tin paste barrel, the lifting ring 206 is pulled, the pressure moving plug 201 rises to generate suction force at the lower part of the pressure moving plug, the tin paste is sucked into the tin paste shovel cavity 1, the blocking plug disc 102 is turned inwards when the tin paste is sucked, the tin paste passes through the tin paste sucking hole 101, and after the tin paste is sucked, the blocking plug disc 102 returns to the tin paste sucking hole 101 to block and seal the tin paste sucking hole 101 under the elastic force of the connecting elastic sheet 104, so that the tin paste is prevented from overflowing;
the solder paste stored in the solder paste shovel cavity 1 cannot drop downwards under the shielding of the one-way anti-dripping elastic sheet 5, and when the pressure moving plug 201 rises, positive pressure gas at the upper part of the pressure moving plug is discharged to the outside through the one-way air outlet structure, and after the lifting ring 206 is loosened, the pressure moving plug 201 and the elasticity of the paste pushing pressure spring 203 reach balance under the action of negative pressure at the upper part of the pressure moving plug, so that the solder paste cannot move downwards;
when scraping the tin cream, when needing the outside discharge of tin cream, rotatory screw thread sealing cap 216, make airtight contact ring 217 remove to the outside, adjust inlet channel 214 and outside air intercommunication gradually, outside air enters into the inside of holding pressure pipe 2 through adjusting inlet channel 214, make the inside atmospheric pressure of holding pressure pipe 2 change, pressure removes the pouring of stopper 201 along with its upper portion atmospheric pressure, and move down gradually under the elasticity of pushing away cream pressure spring 203, produce the malleation in its lower part, shovel the inside tin cream in chamber 1 outwards propelling movement with the tin cream, one-way antidrip shell fragment 5 is under the pressure of tin cream, turn up downwards, thereby make the tin cream gush out, scrape and cover, the gushing speed of tin cream is directly proportional with the open length who adjusts inlet channel 214, can carry out accurate regulation in use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The tin paste with variable viscosity under heating comprises the following components in percentage by weight: alloy welding powder: 82% -85%, flux paste: 15 to 18 percent;
the alloy welding powder comprises the following components in percentage by weight: 20 to 25 percent of lead powder, 2 to 2.5 percent of bismuth powder, 0.5 to 1 percent of silver powder, 5 to 8 percent of rare earth element and the balance of tin powder;
the soldering paste comprises the following components in percentage by weight: 5 to 7 percent of antioxidant, 10 to 25 percent of paraffin, 5 to 7.5 percent of mica, 6 to 9.5 percent of acrylic acid, 17 to 21 percent of organic silicon resin, 4.3 to 5.7 percent of urea-formaldehyde resin and the balance of rosin.
2. The solder paste of claim 1, wherein: the rare earth elements comprise the following components in percentage by weight: nb8.5-10%, La 25-28%, Yb0.5-1.8%, Dy7.3-10%, and the balance Ce.
3. The solder paste of claim 1, wherein: the organic silicon resin is prepared by mixing one or more of methyl trichlorosilane, dimethyl dichlorosilane, phenyl trichlorosilane, diphenyl dichlorosilane or methyl phenyl dichlorosilane.
4. The solder paste drip prevention device for a solder paste of a heat variable viscosity according to any one of claims 1 to 3, characterized in that: the solder paste scraping device comprises a solder paste scraping cavity (1), a holding pressure pipe (2), a solder paste scraper (3), a solder paste partition plate (4) and a one-way anti-dripping elastic sheet (5), wherein the solder paste scraping cavity (1) is fixedly communicated with the holding pressure pipe (2), the solder paste scraper (3) is fixedly installed at the surface position below the solder paste scraping cavity (1), the solder paste partition plate (4) is fixedly installed in the solder paste scraping cavity (1) and close to the lower position, the solder paste partition plate (4) is transversely and uniformly distributed in the solder paste scraping cavity (1) in an arrayed manner, the one-way anti-dripping elastic sheet (5) is symmetrically and fixedly installed between every two solder paste partition plates (4), and the two symmetrical one-way anti-dripping elastic sheets (5) are mutually closed and attached downwards;
the surface of the solder paste shovel cavity (1) is provided with a one-way feeding structure;
a pressure plug structure is arranged in the holding pressure pipe (2), and the pressure plug structure has an elastic pressing function;
the outside of holding pressure pipe (2) is close to top fixed position intercommunication and is provided with one-way structure and the regulation structure of admitting air of giving vent to anger, it has the air intake flow regulatory function to admit air the regulation structure.
5. The device for preventing solder paste from dripping according to claim 4, wherein: one-way feed structure includes that the solder paste absorbs hole (101), shutoff plug disc (102), spacing fender eaves (103) and connects shell fragment (104), the solder paste absorbs hole (101) and runs through the surface position of seting up in solder paste shovel chamber (1), shutoff plug disc (102) are located solder paste and absorb hole (101) inside, spacing fender eaves (103) fixed mounting is in the surface position of shutoff plug disc (102), and is located the inside of solder paste shovel chamber (1), shutoff plug disc (102) with the inner wall surface of solder paste shovel chamber (1) is through connecting shell fragment (104) elastic connection.
6. The device for preventing solder paste from dripping according to claim 4, wherein: the pressure stopper structure includes pressure removal stopper (201), carries and draws polished rod (202), pushes away cream pressure spring (203), seal cover (204), airtight gum cover (205) and carries and draws ring (206), pressure removal stopper (201) goes up and down to set up in the inside of gripping pressure pipe (2), carry the upper surface position of carrying polished rod (202) fixed mounting at pressure removal stopper (201), push away the outside of cream pressure spring (203) cover setting at carrying and drawing polished rod (202), seal cover (204) fixed mounting is at the upper surface position of gripping pressure pipe (2), airtight gum cover (205) fixed mounting is in the inside of seal cover (204), carry and draw polished rod (202) and alternate through airtight gum cover (205), and airtight contact with it, carry pull ring (206) fixed mounting and carry the upper end surface position that draws polished rod (202).
7. The device for preventing solder paste from dripping according to claim 4, wherein: one-way structure of giving vent to anger is including fixed trachea (207), airtight stifled ring (208), airtight rubber disc (209), rubber disc push away dish (210), one-way push away spring (211) and push away spring support (212), fixed trachea (207) fixed intercommunication is close to the top position at the surface that grips pressure pipe (2), airtight stifled ring (208) is fixed to be set up in the inside of fixed trachea (207).
8. The solder paste dripping prevention apparatus according to claim 7, wherein: the outer side surface position of airtight stifled ring (208) is provided with airtight rubber disc (209), the outer side fixed surface of airtight rubber disc (209) installs rubber disc and pushes away dish (210), the outer side fixed surface of rubber disc pushes away dish (210) installs one-way spring (211) that pushes away, the inside fixed mounting of fixed trachea (207) has and pushes away spring support (212), the other end that one-way spring (211) that pushes away with push away spring support (212) fixed mounting.
9. The device for preventing solder paste from dripping according to claim 4, wherein: the air inlet adjusting structure comprises an air inlet communicating pipe (213), an adjusting air inlet groove (214), a matching threaded plug (215), a threaded sealing cap (216) and an air-tight contact ring (217).
10. The solder paste dripping prevention apparatus according to claim 9, wherein: the air inlet communicating pipe (213) is fixedly arranged at the outer surface position of the fixed air pipe (207), the air inlet communicating pipe (213) is communicated with the inner cavity of the holding pressure pipe (2) through the fixed air pipe (207), the outer surface of the air inlet communicating pipe (213) is penetrated and provided with an adjusting air inlet groove (214), the adjusting air inlet groove (214) is long, the length direction of the adjusting air inlet groove is parallel to the axis direction of the air inlet communicating pipe (213), the end surface of the air inlet communicating pipe (213) is fixedly provided with a matched threaded plug (215), the outer part of the matched threaded plug (215) is spirally provided with a threaded sealing cap (216), the threaded sealing cap (216) is in a cylindrical pipe shape, one end of the threaded sealing cap is opened, the other end of the threaded sealing cap is closed, the inner part of the threaded sealing cap (216) is fixedly provided with an airtight contact ring (217) close to the opening end position, and the airtight contact ring (217) is in a circular ring shape, the sleeve is arranged at the outer surface position of the air inlet communicating pipe (213) and is in airtight contact with the outer surface of the air inlet communicating pipe (213).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210852353.9A CN115091074B (en) | 2022-07-19 | 2022-07-19 | Solder paste with variable viscosity under heating and device for preventing solder paste from dripping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210852353.9A CN115091074B (en) | 2022-07-19 | 2022-07-19 | Solder paste with variable viscosity under heating and device for preventing solder paste from dripping |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115091074A true CN115091074A (en) | 2022-09-23 |
| CN115091074B CN115091074B (en) | 2023-08-15 |
Family
ID=83299602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210852353.9A Active CN115091074B (en) | 2022-07-19 | 2022-07-19 | Solder paste with variable viscosity under heating and device for preventing solder paste from dripping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115091074B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5928404A (en) * | 1997-03-28 | 1999-07-27 | Ford Motor Company | Electrical solder and method of manufacturing |
| CN102785039A (en) * | 2012-07-30 | 2012-11-21 | 东莞永安科技有限公司 | Solder paste and preparation method thereof |
| CN104210225A (en) * | 2014-08-19 | 2014-12-17 | 弘益泰克自动化设备（惠州）有限公司 | Pump type scraper system for printing machine |
| CN104416297A (en) * | 2013-08-21 | 2015-03-18 | 苏州优诺电子材料科技有限公司 | Clean-free solder paste low in ICT (in circuit testing) false positive rate |
| CN104827198A (en) * | 2015-04-28 | 2015-08-12 | 苏州永创达电子有限公司 | Soldering tin paste |
| CN204864126U (en) * | 2015-08-25 | 2015-12-16 | 郑州人民医院 | Medical feeding bottle of dosing |
| CN108457451A (en) * | 2017-02-21 | 2018-08-28 | 顾东海 | A kind of piston type wall plastering apparatus |
| CN210904171U (en) * | 2019-04-26 | 2020-07-03 | 陈玉兰 | Fluid food feeding equipment for digestive patients |
| CN112059467A (en) * | 2020-09-22 | 2020-12-11 | 深圳市鑫富锦新材料有限公司 | Lead-free solder alloy soldering paste |
| CN212261900U (en) * | 2020-01-15 | 2021-01-01 | 西安交通大学医学院第一附属医院 | But most advanced split prevents stifled formula nutrition pipe |
| CN113941279A (en) * | 2021-12-01 | 2022-01-18 | 深圳市鑫富锦新材料有限公司 | Electronic packaging solder paste processing device adopting pressurization and air supply |
| WO2022036950A1 (en) * | 2020-08-17 | 2022-02-24 | 惠州市源德智科技有限公司 | Halogen-free solder paste and preparation method therefor |
| CN114544111A (en) * | 2022-04-21 | 2022-05-27 | 深圳市星芯顶科技有限公司 | Testing device for communication cable |
-
2022
- 2022-07-19 CN CN202210852353.9A patent/CN115091074B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5928404A (en) * | 1997-03-28 | 1999-07-27 | Ford Motor Company | Electrical solder and method of manufacturing |
| CN102785039A (en) * | 2012-07-30 | 2012-11-21 | 东莞永安科技有限公司 | Solder paste and preparation method thereof |
| CN104416297A (en) * | 2013-08-21 | 2015-03-18 | 苏州优诺电子材料科技有限公司 | Clean-free solder paste low in ICT (in circuit testing) false positive rate |
| CN104210225A (en) * | 2014-08-19 | 2014-12-17 | 弘益泰克自动化设备（惠州）有限公司 | Pump type scraper system for printing machine |
| CN104827198A (en) * | 2015-04-28 | 2015-08-12 | 苏州永创达电子有限公司 | Soldering tin paste |
| CN204864126U (en) * | 2015-08-25 | 2015-12-16 | 郑州人民医院 | Medical feeding bottle of dosing |
| CN108457451A (en) * | 2017-02-21 | 2018-08-28 | 顾东海 | A kind of piston type wall plastering apparatus |
| CN210904171U (en) * | 2019-04-26 | 2020-07-03 | 陈玉兰 | Fluid food feeding equipment for digestive patients |
| CN212261900U (en) * | 2020-01-15 | 2021-01-01 | 西安交通大学医学院第一附属医院 | But most advanced split prevents stifled formula nutrition pipe |
| WO2022036950A1 (en) * | 2020-08-17 | 2022-02-24 | 惠州市源德智科技有限公司 | Halogen-free solder paste and preparation method therefor |
| CN112059467A (en) * | 2020-09-22 | 2020-12-11 | 深圳市鑫富锦新材料有限公司 | Lead-free solder alloy soldering paste |
| CN113941279A (en) * | 2021-12-01 | 2022-01-18 | 深圳市鑫富锦新材料有限公司 | Electronic packaging solder paste processing device adopting pressurization and air supply |
| CN114544111A (en) * | 2022-04-21 | 2022-05-27 | 深圳市星芯顶科技有限公司 | Testing device for communication cable |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115091074B (en) | 2023-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115091074A (en) | Heated variable viscosity solder paste and device for preventing solder paste from dripping | |
| CN216834823U (en) | Workshop absolute ethyl alcohol storage tank | |
| RU2013103041A (en) | ROTARY TARGET CONNECTOR ASSEMBLY | |
| CN110586397A (en) | Spraying device for high-viscosity paint | |
| CN210701614U (en) | Welding station fume extractor | |
| CN209189998U (en) | A kind of plasma cutting machine cooling collection device of slag | |
| CN215692048U (en) | Buchner funnel | |
| CN215437013U (en) | Calcium hydrate production is with filling device's dust removal structure | |
| CN208313756U (en) | A kind of funnel device measuring powder density | |
| CN209939468U (en) | Can dismantle anti-spillage funnel that leaks | |
| WO2013011582A1 (en) | Vacuum pipe trap system for silicon single crystal growth device and pipe cleaning method using the system | |
| CN219083926U (en) | Ammonium nitrate explosive hot melting suction and discharge device | |
| CN210535143U (en) | Teaching experiment instrument capable of automatically collecting generated hydrogen and igniting generated hydrogen | |
| CN213271971U (en) | Oil coating equipment for flaky parts | |
| CN213728367U (en) | Be suitable for belt cleaning device of oil bath pot | |
| CN219357842U (en) | Inclined double-station sand floating mechanism | |
| CN108261832A (en) | A kind of filter core replacing structure that do not stop | |
| CN209188585U (en) | A kind of modular architectural insulated fire exterior wall installation equipment | |
| CN209065938U (en) | A kind of blast-melted ditch | |
| CN219342377U (en) | Single crystal furnace | |
| CN217040384U (en) | Suction tube head for oral cavity | |
| CN217314304U (en) | Lacquer ware drying device | |
| CN210533789U (en) | Water quality sampler | |
| CN210965156U (en) | Polyacrylamide mother liquor transfer device | |
| CN217684397U (en) | Filling equipment of nitrogen production device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |