WO2022031503A1

WO2022031503A1 - Image capture devices having phase detection auto-focus pixels

Info

Publication number: WO2022031503A1
Application number: PCT/US2021/043607
Authority: WO
Inventors: Xiangli Li
Original assignee: Apple Inc.
Priority date: 2020-08-04
Filing date: 2021-07-29
Publication date: 2022-02-10
Also published as: US20220046196A1; US11563910B2

Abstract

An image capture device is described. The image capture device includes an array of pixels. Each pixel includes a 2x2 array of photodetectors. The image capture device also includes an array of 1x2 on chip lenses (OCLs) disposed over the array of pixels. For each pixel in the array of pixels, a respective pair of adjacent 1x2 OCLs is disposed over a pixel, with each respective pair of adjacent 1x2 OCLs including a respective first 1x2 OCL disposed over a first photodetector and a respective second photodetector in the 2x2 array of photodetectors for the pixel, and a second 1x2 OCL disposed over a third photodetector and a fourth photodetector in the 2x2 array of photodetectors for the pixel.

Description

IMAGE CAPTURE DEVICES HAVING PHASE DETECTION AUTO-FOCUS PIXELS

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This This Patent Cooperation Treaty patent application claims priority to U.S. Nonprovisional Patent Application No. 17/380,852, filed July 20, 2021 , and titled “Image Capture Devices Having Phase Detection Auto-Focus Pixels,” and U.S. Provisional Patent Application No. 63/061 ,074, filed August 4, 2020, and titled “Image Capture Devices Having Phase Detection Auto-Focus Pixels,” the contents of which are incorporated herein by reference in their entirety.

FIELD

[0002] The described embodiments relate generally to devices having a camera or other image capture device. More particularly, the described embodiments relate to an image capture device having phase detection auto-focus (PDAF) pixels.

BACKGROUND

[0003] Digital cameras and other image capture devices use an image sensor, such as a complementary metal-oxide-semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor, to capture an image. In some cases, a camera or other image capture device may include multiple image sensors, with the different image sensors having adjacent or interlaced arrays of pixels.

[0004] Many cameras and other image capture devices include one or more optical components (e.g., a lens or lens assembly) that are configurable to focus light, received or reflected from an image, onto the surface of an image sensor. Before or while capturing an image, the distance between the optical component(s) and image sensor (or a tilt or other parameters of the optical components or image sensor) may be adjusted to focus an image onto the image sensor. In some cases, macro (or rough) focusing may be performed for an image sensor prior to capturing an image using the image sensor (e.g., using a macro focus mechanism adjacent the image sensor). Micro (or fine) focusing can then be performed after acquiring one or more images using the image sensor. In other cases, all focusing may be performed prior to capturing an image (e.g., by adjusting one or more relationships between a lens, lens assembly, or image sensor); or all focusing may be performed after acquiring an image (e.g., by adjusting pixel values using one or more digital image processing algorithms). Many cameras and other image capture devices perform focusing operations frequently, and in some cases before and/or after the capture of each image capture frame. [0005] Focusing an image onto an image sensor often entails identifying a perceptible edge between objects, or an edge defined by different colors or brightness (e.g., an edge between dark and light regions), and making adjustments to a lens, lens assembly, image sensor, or pixel value(s) to bring the edge into focus.

SUMMARY

[0006] Embodiments of the systems, devices, methods, and apparatus described in the present disclosure are directed to an image capture device having PDAF pixels.

[0007] In a first aspect, the present disclosure describes an image capture device. The image capture device may include an array of pixels, and an array of 1x2 on-chip lenses (OCLs) disposed over the array of pixels. Each pixel may include a 2x2 array of photodetectors. For each pixel in the array of pixels, a respective pair of adjacent 1x2 OCLs may be disposed over a pixel. Each respective pair of adjacent 1x2 OCLs may include a respective first 1x2 OCL disposed over a first photodetector and a second photodetector in the 2x2 array of photodetectors for the pixel, and a respective second 1x2 OCL disposed over a third photodetector and a fourth photodetector in the 2x2 array of photodetectors for the pixel.

[0008] In another aspect, the present disclosure describes another image capture device. The image capture device may include an array of photodetectors, and an array of oblong OCLs disposed over the array of photodetectors. A different pair of photodetectors in the array of photodetectors may be disposed under each of the oblong OCLs, and every photodetector in the array of photodetectors may be disposed under a respective one of the oblong OCLs in the array of oblong OCLs.

[0009] In addition to the exemplary aspects and embodiments described above, further aspects and embodiments will become apparent by reference to the drawings and by study of the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:

[0011 ] FIGs. 1 A and 1 B show an example of a device that may include one or more image capture devices; [0012] FIG. 2 shows an example embodiment of an image capture device, including an image sensor, a lens or lens assembly, and an auto-focus mechanism;

[0013] FIG. 3 shows an example of an image that may be captured by an image capture device;

[0014] FIG. 4 shows a plan view of one example of an image sensor;

[0015] FIG. 5 shows an example imaging area (e.g., a plan view) of a pixel in an image capture device;

[0016] FIG. 6 shows an example cross-section of the pixel shown in FIG. 5;

[0017] FIG. 7 shows a simplified schematic of a pixel usable in an image sensor;

[0018] FIGs. 8A and 8B show an array of pixels;

[0019] FIGs. 9A-9D show an imaging area of an image capture device, in which the pixels of the image capture device are arranged in accordance with a Bayer pattern (i.e., a 2x2 pattern including red pixels and blue pixels along one diagonal, and green pixels along the other diagonal); and

[0020] FIG. 10 shows a sample electrical block diagram of an electronic device.

[0021] The use of cross-hatching or shading in the accompanying figures is generally provided to clarify the boundaries between adjacent elements and also to facilitate legibility of the figures. Accordingly, neither the presence nor the absence of cross-hatching or shading conveys or indicates any preference or requirement for particular materials, material properties, element proportions, element dimensions, commonalities of similarly illustrated elements, or any other characteristic, attribute, or property for any element illustrated in the accompanying figures.

[0022] Additionally, it should be understood that the proportions and dimensions (either relative or absolute) of the various features and elements (and collections and groupings thereof) and the boundaries, separations, and positional relationships presented therebetween, are provided in the accompanying figures merely to facilitate an understanding of the various embodiments described herein and, accordingly, may not necessarily be presented or illustrated to scale, and are not intended to indicate any preference or requirement for an illustrated embodiment to the exclusion of embodiments described with reference thereto.

DETAILED DESCRIPTION

[0023] Reference will now be made in detail to representative embodiments illustrated in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. To the contrary, it is intended to cover alternatives, modifications, and equivalents as can be included within the spirit and scope of the described embodiments as defined by the appended claims.

[0024] The present disclosure relates to an image capture device that provides improved PDAF performance.

[0025] In some cases, PDAF pixels (/.e., pixels configured to collect PDAF information) may have a metal shield configuration. A metal shield pixel may include a microlens that focuses incoming light on a photodiode, which photodiode in turn converts photons into electron (or hole) pairs. The collected electrons (for electron collection devices) or holes (for hole collection devices) may be converted into an analog voltage through a pixel source follower (SF) transistor amplifier. The analog voltage may then be converted to a digital signal by an analog-to-digital converter (ADC). A metal shield (e.g., a Tungsten (W) or Copper/Aluminum (Cu/AI) metal shield) may cover half of the photodiode (e.g., a left half or a right half). For a left-shielded pixel, light from left-incident angles is blocked by the metal shield, and only light approaching the pixel from right-incident angles is received by the photodiode. A right-shielded pixel functions in the opposite manner. The angular sensitivity of left and right metal shield pixels can be used to generate PDAF information.

[0026] Because the signal (e.g., the analog voltage or digital signal) generated by a metal shield pixel will be much lower than the signal generated by an unshielded (or regular) pixel, metal-shielded pixels need to be treated as defective pixels, and their signals need to be corrected before being used to generate an image. To minimize the effect that signal correction may have on image quality, metal shield pixels (or pairs of left/right-shielded pixels) may be sparsely distributed over the surface of an image sensor. That is, a relatively small number of an image sensor’s pixels (e.g., 3-4%) may be configured as left- or right- shielded pixels. In one example, for every eight rows and eight columns of pixels (e.g., for every block of 64 pixels in a pixel array), one left-shielded pixel and one right-shielded pixel may be provided.

[0027] At a vertical edge within an image (e.g., at an edge defined by a perceptible edge between objects, or at an edge defined by different colors or brightness (e.g., an edge between dark and light regions)), left- and right-shielded pixels will have disparate signals (e.g., signals not matched in magnitude and/or polarity) when an image is not in focus, but will have well-matched signals when an image is in focus. The signals of left- and right- shielded pixels therefore provide PDAF information that can be used by an auto-focus (AF) mechanism to adjust the position of one or more optical components (e.g., a lens) or an image sensor, and thereby adjust the focus of an image on the image sensor, or to digitally adjust or compensate for an out-of-focus condition. In some cases, an image may be brought into focus based on a PDAF information obtained during a single image capture frame. By analyzing PDAF information obtained during each image capture frame, images may be quickly and continuously focused on an image sensor.

[0028] In some embodiments, left- and right-shielded pixels may be fabricated without metal shields by placing both pixels adjacent one another under a single microlens. Each pixel has its own photodiode, and there may be implant isolation or physical trench isolation between the photodiodes of the two pixels. Because of the nature (e.g., curvature) of the microlens, light from left-incident angles is received mainly by the left-side pixel, and light from right-incident angles is received mainly by the right-side pixel. As a result, left- and right-side pixels placed adjacent one another under a single microlens may function similarly to left and right metal shielded pixels. In a Bayer pattern pixel configuration (i.e., a repetitive 2x2 pattern including red pixels and blue pixels along one diagonal, and green pixels along the other diagonal), one blue pixel in every 8x8 block of pixels may be replaced by a green pixel (or may be modified to function as a green pixel), so that two adjacent green pixels may be placed under a single microlens to provide PDAF information. The signals of both pixels need to be corrected before being used to generate an image.

[0029] Because the signals provided by metal shield pixels, or the signals provided by adjacent pixels under a microlens, need to be corrected before being used to generate an image, the density of such pixels may be kept low. However, this provides limited PDAF information, which in turn degrades AF performance (especially in low light conditions). To improve PDAF performance, each pixel in a pixel array may be divided into left and right sub-pixels, and PDAF information may be obtained from each pixel. Also, because all pixels are implemented in a similar manner, the sub-pixel signals for each pixel may be combined in a similar way, or signal corrections may be made to each pixel in a similar way, to increase the confidence level that pixel signals are being generated or corrected appropriately (especially in low light conditions). However, the PDAF information provided by such a pixel array (and by all pixel arrays using metal shield pixels or adjacent pixels under a single microlens) bases image focus entirely on vertical edges. For an image containing few vertical edges or more horizontal edges, or for an image acquired under a low light condition, PDAF performance may suffer. For example, it may be difficult or impossible to focus an image on an image sensor, or it may take longer than desired to focus an image on an image sensor.

[0030] In some cases, pixels in a pixel array may be configured to have a 2x2 array of sub-pixels (e.g., photodetectors) disposed under a microlens. In some embodiments, the entirety of a pixel array may incorporate such pixels. The pixels can be used, in various embodiments or configurations, to provide PDAF information based on edges having more than one orientation (e.g., vertical and horizontal edges), to improve PDAF performance (especially in low light conditions), to reduce or eliminate the need for signal correction, or to increase the resolution of an image sensor. However, the shared microlens over a 2x2 array of sub-pixels tends to reduce the signal-to-noise ratio (SNR) of the signals acquired by the sub-pixels. When the shared microlens is shifted as a result of manufacturing variance, the SNR of some sub-pixels may be reduced even further, and the SNR of each sub-pixel may differ (i.e., each of the four sub-pixels positioned under a shared microlens may have a different SNR). This greatly increases the processing burden (e.g., including lens offset or misalignment correction, re-mosaicing burden, and so on) that is needed to correct the signals produced by the various sub-pixels, and can lead to image resolution loss as a result of the lens offset or misalignment correction and other factors.

[0031] Disclosed herein is an image capture device in which a pair of adjacent 1x2 on- chip lenses (OCLs) are disposed over the sub-pixels (or photodetectors) of a pixel having a 2x2 array of sub-pixels (or photodetectors). Although this results in a mismatch between the footprints of the 1x2 OCLs and the imaging areas of the pixels (e.g., a 1x2 footprint versus a 2x2 footprint), it simplifies the corrections that need to be made for manufacturing variances resulting from shifts between the centroids of the sub-pixels or photodetectors and centroids of the OCLs or their focus areas. The simplification in the corrections that need to be made can improve focus and image quality; reduce re-mosaicing challenges; and enable 1x2 OCLs to be disposed over all of the pixels and photodetectors of an image capture device. A 1x2 OCL may also be shaped such that it allows more light into each of the sub-pixels over which it is disposed (e.g., as compared to a microlens disposed over a 2x2 array of subpixels). Allowing more light into a sub-pixel increases its SNR. If desired, the 1x2 OCLs can be oriented in different directions, to enable the focus of orthogonal sets of edges to be detected.

[0032] These and other embodiments are described with reference to FIGs. 1 A-10. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting.

[0033] Directional terminology, such as “top”, “bottom”, “upper”, “lower”, “front”, “back”, “over”, “under”, “above”, “below”, “left”, “right”, etc. is used with reference to the orientation of some of the components in some of the figures described below. Because components in various embodiments can be positioned in a number of different orientations, directional terminology is used for purposes of illustration only and is in no way limiting. The directional terminology is intended to be construed broadly, and therefore should not be interpreted to preclude components being oriented in different ways. The use of alternative terminology, such as “or”, is intended to indicate different combinations of the alternative elements. For example, A or B is intended to include, A, or B, or A and B.

[0034] FIGs. 1 A and 1 B show an example of a device 100 that may include one or more image capture devices. The device’s dimensions and form factor, including the ratio of the length of its long sides to the length of its short sides, suggest that the device 100 is a mobile phone (e.g., a smart phone). However, the device’s dimensions and form factor are arbitrarily chosen, and the device 100 could alternatively be any portable electronic device including, for example, a mobile phone, tablet computer, portable computer, portable music player, electronic watch, health monitor device, portable terminal, vehicle navigation system, robot navigation system, or other portable or mobile device. The device 100 could also be a device that is semi-permanently located (or installed) at a single location. FIG. 1 A shows a front isometric view of the device 100, and FIG. 1 B shows a rear isometric view of the device 100. The device 100 may include a housing 102 that at least partially surrounds a display 104. The housing 102 may include or support a front cover 106 or a rear cover 108. The front cover 106 may be positioned over the display 104, and may provide a window through which the display 104 may be viewed. In some embodiments, the display 104 may be attached to (or abut) the housing 102 and/or the front cover 106. In alternative embodiments of the device 100, the display 104 may not be included and/or the housing 102 may have an alternative configuration.

[0035] The display 104 may include one or more light-emitting elements including, for example, light-emitting diodes (LEDs), organic LEDs (OLEDs), a liquid crystal display (LCD), an electroluminescent (EL) display, or other types of display elements. In some embodiments, the display 104 may include, or be associated with, one or more touch and/or force sensors that are configured to detect a touch and/or a force applied to a surface of the front cover 106.

[0036] The various components of the housing 102 may be formed from the same or different materials. For example, the sidewall 118 may be formed using one or more metals (e.g., stainless steel), polymers (e.g., plastics), ceramics, or composites (e.g., carbon fiber). In some cases, the sidewall 118 may be a multi-segment sidewall including a set of antennas. The antennas may form structural components of the sidewall 118. The antennas may be structurally coupled (to one another or to other components) and electrically isolated (from each other or from other components) by one or more non-conductive segments of the sidewall 118. The front cover 106 may be formed, for example, using one or more of glass, a crystal (e.g., sapphire), or a transparent polymer (e.g., plastic) that enables a user to view the display 104 through the front cover 106. In some cases, a portion of the front cover 106 (e.g., a perimeter portion of the front cover 106) may be coated with an opaque ink to obscure components included within the housing 102. The rear cover 108 may be formed using the same material(s) that are used to form the sidewall 118 or the front cover 106. In some cases, the rear cover 108 may be part of a monolithic element that also forms the sidewall 118 (or in cases where the sidewall 118 is a multi-segment sidewall, those portions of the sidewall 118 that are non-conductive). In still other embodiments, all of the exterior components of the housing 102 may be formed from a transparent material, and components within the device 100 may or may not be obscured by an opaque ink or opaque structure within the housing 102.

[0037] The front cover 106 may be mounted to the sidewall 118 to cover an opening defined by the sidewall 118 (/.e., an opening into an interior volume in which various electronic components of the device 100, including the display 104, may be positioned). The front cover 106 may be mounted to the sidewall 118 using fasteners, adhesives, seals, gaskets, or other components.

[0038] A display stack or device stack (hereafter referred to as a “stack”) including the display 104 may be attached (or abutted) to an interior surface of the front cover 106 and extend into the interior volume of the device 100. In some cases, the stack may include a touch sensor (e.g., a grid of capacitive, resistive, strain-based, ultrasonic, or other type of touch sensing elements), or other layers of optical, mechanical, electrical, or other types of components. In some cases, the touch sensor (or part of a touch sensor system) may be configured to detect a touch applied to an outer surface of the front cover 106 (e.g., to a display surface of the device 100).

[0039] In some cases, a force sensor (or part of a force sensor system) may be positioned within the interior volume below and/or to the side of the display 104 (and in some cases within the device stack). The force sensor (or force sensor system) may be triggered in response to the touch sensor detecting one or more touches on the front cover 106 (or a location or locations of one or more touches on the front cover 106), and may determine an amount of force associated with each touch, or an amount of force associated with the collection of touches as a whole. Alternatively, the touch sensor (or touch sensor system) may be triggered in response to the force sensor detecting one or more forces on the front cover 106. In some cases, the force sensor may be used as (e.g., as an alternative to) a separate touch sensor.

[0040] As shown primarily in FIG. 1 A, the device 100 may include various other components. For example, the front of the device 100 may include one or more front-facing cameras 110 or other image capture devices (including one or more image sensors), speakers 112, microphones, or other components 114 e.g., audio, imaging, and/or sensing components) that are configured to transmit or receive signals to/from the device 100. In some cases, a front-facing camera 110, alone or in combination with other sensors, may be configured to operate as a bio-authentication or facial recognition sensor. The device 100 may also include various input devices, including a mechanical or virtual button 116, which may be accessible from the front surface (or display surface) of the device 100. In some embodiments, the front-facing camera 110, one or more other cameras, and/or one or more other optical emitters, optical detectors, or other optical sensors may be positioned under the display 104 instead of adjacent the display 104. In these embodiments, the camera(s), optical emitter(s), optical detector(s), or sensor(s) may emit and/or receive light through the display 104.

[0041] The device 100 may also include buttons or other input devices positioned along the sidewall 118 and/or on a rear surface of the device 100. For example, a volume button or multipurpose button 120 may be positioned along the sidewall 118, and in some cases may extend through an aperture in the sidewall 118. The sidewall 118 may include one or more ports 122 that allow air, but not liquids, to flow into and out of the device 100. In some embodiments, one or more sensors may be positioned in or near the port(s) 122. For example, an ambient pressure sensor, ambient temperature sensor, internal/external differential pressure sensor, gas sensor, particulate matter concentration sensor, or air quality sensor may be positioned in or near a port 122.

[0042] In some embodiments, the rear surface of the device 100 may include a rearfacing camera 124 or other image capture device (including one or more image sensors; see FIG. 1 B). A flash or light source 126 may also be positioned along the rear surface of the device 100 (e.g., near the rear-facing camera). In some cases, the rear surface of the device 100 may include multiple rear-facing cameras.

[0043] FIG. 2 shows an example embodiment of an image capture device (e.g., a camera 200), including an image sensor 202, a lens 204 or lens assembly, and a mechanical autofocus mechanism 206. In some embodiments, the components shown in FIG. 2 may be associated with the first camera 110 or the second camera 124 shown in FIGs. 1 A-1 B.

[0044] The image sensor 202 may include a plurality of pixels, such as a plurality of pixels arranged in a two-dimensional array of pixels. Multiple ones (or all) of the pixels may each include a two-dimensional array of photodetectors (e.g., a 2x2 array of photodetectors). The photodetectors that are associated with a pixel may be electrically isolated from each other. As will be described with reference to other figures, different OCLs may be disposed over different pairs of a pixel’s photodetectors. [0045] The lens 204 may be adjustable with respect to the image sensor 202, to focus an image of a scene 208 on the image sensor 202. In some embodiments, the lens 204 or lens assembly may be moved with respect to the image sensor 202 (e.g., moved to change a distance between the lens 204 or lens assembly and the image sensor 202, moved to change an angle between a plane of a lens 204 or lenses and a plane of the image sensor 202, and so on). In other embodiments, the image sensor 202 may be moved with respect to the lens 204 or lens assembly.

[0046] In some embodiments, the auto-focus mechanism 206 may include (or the functions of the auto-focus mechanism 206 may be provided by) a processor in combination with a voice coil, piezoelectric element, or other actuator mechanism that moves the lens 204, lens assembly, or image sensor 202. The auto-focus mechanism 206 may receive signals from the image sensor 202 and, in response to the signals, adjust a focus setting of the camera 200. In some embodiments, the signals may include PDAF information. The PDAF information may include horizontal phase detection signals, vertical phase detection signals, and/or other phase detection signals. In response to the PDAF information (e.g., in response to an out-of-focus condition identified from the PDAF information), the auto-focus mechanism 206 may adjust a focus setting of the camera 200 by, for example, adjusting a relationship between the image sensor 202 (or plurality of pixels) and the lens 204 or lens assembly (e.g., by adjusting a physical position of the lens 204, lens assembly, or image sensor 202). Additionally or alternatively, the processor of the auto-focus mechanism 206 may use digital image processing techniques to adjust the values output by the pixels and/or photodetectors of the image sensor 202. The values may be adjusted to digitally improve, or otherwise alter, the focus of an image of the scene 208. In some embodiments, the autofocus mechanism 206 may be used to provide only mechanical, or only digital, focus adjustments.

[0047] Referring now to FIG. 3, there is shown an example of an image 300 that may be captured by an image capture device, such as one of the cameras described with reference to FIGs. 1A-1 B or 2. The image 300 may include a number of objects 302, 304 having edges 306, 308 oriented in one or more directions. The edges 306, 308 may include perceptible edges between objects, or edges defined by different colors or brightness levels (e.g., an edge between dark and light regions). In some embodiments, the camera may only detect a focus of one set of edges (e.g., only horizontal edges or only vertical edges). In some embodiments, the camera may detect a focus of both a first set of edges (e.g., horizontal edges) and a second set of edges (e.g., vertical edges, or edges that are orthogonal to the first set of edges). [0048] The focus of the first and/or second sets of edges may be detected in the same or different image capture frames, using the same or different pixels. In some cases, a focus of edges in the first set of edges may be detected using a first subset of pixels configured to detect a focus of horizontal edges, in a same frame that a focus of edges in the second set of edges is detected by a second subset of pixels configured to detect a focus of vertical edges. A focus of edges may be detected based on a phase difference (e.g., magnitude and polarity of the phase difference) in light captured by different photodetectors in a pair of photodetectors associated with a pixel.

[0049] In some embodiments, a single pixel in a pixel array (and in some cases, some or each of the pixels in the pixel array, or each of the pixels in a subset of pixels in the pixel array) may be configured to produce a signal usable for detecting the focus of a horizontal edge or a vertical edge. In some embodiments, all of the pixels in a pixel array (or all of the pixels used to capture a particular image) may be employed in the detection of edge focus information for an image.

[0050] FIG. 4 shows a plan view of one example of an image sensor 400, such as an image sensor associated with one of the image capture devices or cameras described with reference to FIGs. 1 A-1 B and 2. The image sensor 400 may include an image processor 402 and an imaging area 404. The imaging area 404 may be implemented as a pixel array that includes a plurality of pixels 406. The pixels 406 may be same colored pixels (e.g., for a monochrome imaging area 404) or differently colored pixels (e.g., for a multi-color imaging area 404). In the illustrated embodiment, the pixels 406 are arranged in rows and columns. However, other embodiments are not limited to this configuration. The pixels in a pixel array may be arranged in any suitable configuration, such as, for example, a hexagonal configuration.

[0051] The imaging area 404 may be in communication with a column select circuit 408 through one or more column select lines 410, and with a row select circuit 412 through one or more row select lines 414. The row select circuit 412 may selectively activate a particular pixel 406 or group of pixels, such as all of the pixels 406 in a certain row. The column select circuit 408 may selectively receive the data output from a selected pixel 406 or group of pixels 406 (e.g., all of the pixels in a particular row).

[0052] The row select circuit 412 and/or column select circuit 408 may be in communication with an image processor 402. The image processor 402 may process data from the pixels 406 and provide that data to another processor (e.g., a system processor) and/or other components of a device (e.g., other components of the electronic device 100). In some embodiments, the image processor 402 may be incorporated into the system. The image processor 402 may also receive focus information (e.g., PDAF information) from some or all of the pixels, and may perform a focusing operation for the image sensor 400. In some examples, the image processor 402 may perform one or more of the operations performed by the auto-focus mechanism described with reference to FIG. 2.

[0053] FIG. 5 shows an example imaging area (e.g., a plan view) of a pixel 500 in an image capture device, such as a pixel included in an image sensor associated with one of the image capture devices or cameras described with reference to FIGS. 1 A-1 B and 2, or a pixel included in the image sensor described with reference to FIG. 4. In some embodiments, some pixels in an image sensor, each pixel in an image sensor, or each pixel in a subset of pixels in an image sensor, may be configured as shown in FIG. 5.

[0054] The imaging area of the pixel 500 includes a two-dimensional array of photodetectors 502. In some embodiments, the imaging area may include a 2x2 array of photodetectors (e.g., a set of photodetectors 502 arranged in two rows and two columns). For example, the array may include a first photodetector 502a and a second photodetector 502b arranged in a first row, and a third photodetector 502c and a fourth photodetector 502d arranged in a second row. The first photodetector 502a and the third photodetector 502c may be arranged in a first column, and the second photodetector 502b and the fourth photodetector 502d may be arranged in a second column.

[0055] Each photodetector 502 may be electrically isolated from each other photodetector 502 (e.g., by implant isolation or physical trench isolation). A first 1x2 OCL 504a may be disposed over two of the photodetectors in the pixel 500 (e.g., over the first photodetector 502a and the second photodetector 502b). A second 1x2 OCL 504b may be disposed over the remaining two of the photodetectors in the pixel 500 (e.g., over the third photodetector 502c and the fourth photodetector 502d).

[0056] An optional single-piece or multi-piece filter element (e.g., a red filter, a blue filter, a green filter, or the like) may be disposed over the array of photodetectors 502 (e.g., over the first photodetector 502a, the second photodetector 502b, the third photodetector 502c, and the fourth photodetector 502d). In some examples, the filter element may be applied to an interior or exterior of each 1x2 OCL 504a, 504b. In some examples, each OCL 504a, 504b may be tinted to provide the filter element. In some examples, each of the photodetectors may be separately encapsulated under the OCLs 504a, 504b, and the filter element may be applied to or in the encapsulant. In some examples, a filter element may be positioned between the array of photodetectors 502 and the OCLs 504a, 504b (although other configurations of the filter element may also be considered as being disposed “between” the photodetectors 502 and the OCLs 504a, 504b).

[0057] The photodetectors 502 may be connected to a shared readout circuit (i.e., a readout circuit shared by all of the photodetectors 502 associated with the pixel 500). A set of charge transfer transistors may be operable to connect the photodetectors 502 to the shared readout circuit (e.g., each charge transfer transistor in the set may be operable (e.g., by a processor) to connect a respective one of the photodetectors 502 to, and disconnect the respective one of the photodetectors 502 from, the shared readout circuit; alternatively, a charge transfer transistor may be statically configured to connect/disconnect a pair of the photodetectors 502 (e.g., a pair of photodetectors 502 under a common 1x2 OCL, or a pair of photodetectors 502 that are disposed along a direction that is orthogonal to each of the first and second OCLs 504a, 504b, to/from the shared readout circuit). In some cases, each charge transfer transistor may be operated individually. In other cases, the charge transfer transistors may be statically configured for pair-wise operation.

[0058] FIG. 6 shows an example cross-section of the pixel 500 shown in FIG. 5. By way of example, the cross-section is taken along line VI-VI, through the first row of photodetectors 502a, 50b shown in FIG. 5. A cross-section taken through the second row of photodetectors 502c, 502d shown in FIG. 5 (not shown) may be configured similarly to the cross-section shown in FIG. 6.

[0059] The first and second photodetectors 502a, 502b may be formed in a substrate 602. The substrate 602 may include a semiconductor-based material, such as, but not limited to, silicon, silicon-on-insulator (SOI), silicon-on-sapphire (SOS), doped and undoped semiconductor regions, epitaxial layers formed on a semiconductor substrate, well regions or buried layers formed in a semiconductor substrate, or other semiconductor structures.

[0060] The 1x2 OCL 504a may be disposed over part or all of both of the photodetectors 502a and 502b. The OCL 504a may be formed of any material or combination of materials that is translucent to at least one wavelength of light. The OCL 504a may have a lightreceiving side 612 opposite the array of photodetectors 502. The light-receiving side 612 of the OCL 504a may include a central portion 608 and a peripheral portion 610. The peripheral portion 610 may be configured to redirect at least a portion of light incident on the peripheral portion (e.g., the light 606a or light 606c) toward a corresponding peripheral portion of the imaging area that includes the photodetectors 502 (e.g., the light 606a may be redirected toward the photodetector 502a, and the light 606c may be redirected toward the photodetector 502b). In some embodiments, the OCL 504a may have a convex-shaped or dome-shaped light-receiving surface (or exterior surface).

[0061] The OCL 504a may be configured to focus incident light 606 received from different angles on different ones or both of the photodetectors 502a, 502b. For example, light 606a incident on the OCL 504a from a left side approach angle may be focused more (or solely) on the left side photodetector 502a, and thus the left side photodetector 502a may accumulate more charge than the right side photodetector 502b, making the signal response of the left side photodetector 502a greater than the signal response of the right side photodetector 502b. Similarly, light 606c incident on the OCL 504a from a right side approach angle may be focused more (or solely) on the right side photodetector 502b, and thus the right side photodetector 502b may accumulate more charge than the left side photodetector 502a, making the signal response of the right side photodetector 502b greater than the signal response of the left side photodetector 502a. Light 606b incident on the OCL 504a from the front center (or top) of the OCL 504a may be focused on both of the photodetectors 502a, 502b, making the signal response of the left and right side photodetectors 502a, 502b about equal.

[0062] An optional same color filter element 604 (e.g., a red filter, a blue filter, a green filter, or the like) may be disposed over each (or both) of the photodetectors 502a, 502b (as well as the photodetectors 502c and 502d, not shown).

[0063] Referring now to FIG. 7, there is shown a simplified schematic of a pixel 700 (and associated shared readout circuit 704) usable in an image sensor. In some embodiments, the pixel 700 may be an example of a pixel included in an image sensor associated with one of the image capture devices or cameras described with reference to FIGs. 1 A-1 B and 2, or a pixel included in the image sensor described with reference to FIG. 4, or the pixel described with reference to FIGs. 5-6. In some embodiments, some pixels in an image sensor, each pixel in an image sensor, or each pixel in a subset of pixels in an image sensor, may be configured as shown in FIG. 7, and the shared readout circuit 704 for the pixel 700 may be part of an overall pixel readout circuit for an image sensor.

[0064] The pixel 700 may include a two-dimensional array of photodetectors 702, with each photodetector 702 being selectively connectable to (and disconnectable from) the shared readout circuit 704 by a respective charge transfer transistor in a set of charge transfer transistors 706. In some embodiments, the two-dimensional array of photodetectors 702 may include a 2x2 array of photodetectors (e.g., an array of photodetectors 702 arranged in two rows and two columns). For example, the array may include a first photodetector 702a (PD_TL) and a second photodetector 702b (PD_TR) arranged in a first row, and a third photodetector 702c (PDJ3L) and a fourth photodetector 702d (PDJ3R) arranged in a second row. The first photodetector 702a and the third photodetector 702c may be arranged in a first column, and the second photodetector 702b and the fourth photodetector 702d may be arranged in a second column. As described with reference to FIGs. 5 and 6, the photodetectors 702 may be disposed (positioned) in a 2x2 array under a pair of adjacent 1x2 OCLs.

[0065] The shared readout circuit 704 may include a sense region 708, a reset (RST) transistor 710, a readout transistor 712, and a row select (RS) transistor 714. The sense region 708 may include a capacitor that temporarily stores charge received from one or more of the photodetectors 702. As described below, charge accumulated by one or more of the photodetectors 702 may be transferred to the sense region 708 by applying a drive signal (e.g., a gate voltage) to one or more of the charge transfer transistors 706. The transferred charge may be stored in the sense region 708 until a drive signal applied to the reset (RST) transistor 710 is pulsed.

[0066] Each of the charge transfer transistors 706 may have one terminal connected to a respective one of the photodetectors 702 and another terminal connected to the sense region 708. One terminal of the reset transistor 710 and one terminal of the readout transistor 712 may be connected to a supply voltage (e.g., VDD) 720. The other terminal of the reset transistor 710 may be connected to the sense region 708, while the other terminal of the readout transistor 712 may be connected to a terminal of the row select transistor 714. The other terminal of the row select transistor 714 may be connected to an output line 716.

[0067] By way of example only, and in one embodiment, each of the photodetectors 702 may be implemented as a photodiode (PD) or pinned photodiode, the sense region 708 may be implemented as a floating diffusion (FD) node, and the readout transistor 712 may be implemented as a source follower (SF) transistor. The photodetectors 702 may be electronbased photodiodes or hole-based photodiodes. The term photodetector is used herein to refer to substantially any type of photon or light detecting component, such as a photodiode, pinned photodiode, photogate, or other photon sensitive region. Additionally, the term sense region, as used herein, is meant to encompass substantially any type of charge storing or charge converting region.

[0068] In some embodiments, the pixel 700 may be implemented using additional or different components. For example, the row select transistor 714 may be omitted and a pulsed power supply may be used to select the pixel. [0069] When an image is to be captured, an integration period for the pixel begins and the photodetectors 702 accumulate photo-generated charge in response to incident light. When the integration period ends, the accumulated charge in some or all of the photodetectors 702 may be transferred to the sense region 708 by sequentially or simultaneously applying drive signals to (e.g., by pulsing gate voltages of) the charge transfer transistors 706. Typically, the reset transistor 710 is used to reset the voltage on the sense region 708 to a predetermined level prior to the transfer of charge from a set of one or more photodetectors 702 to the sense region 708. When charge is to be read out of the pixel 700, a drive signal may be applied to the row select transistor 714 (e.g., a gate voltage of the row select transistor 714 may be pulsed) via a row select line 718 coupled to row select circuitry, and charge from one, two, or any number of the photodetectors 702 may be read out over an output line 716 coupled to column select circuitry. The readout transistor 712 senses the voltage on the sense region 708, and the row select transistor 714 transfers an indication of the voltage to the output line 716. The column select circuitry may be coupled to an image processor, auto-focus mechanism, or combination thereof.

[0070] In some embodiments, a processor may be configured to operate the set of charge transfer transistors 706 to simultaneously transfer charge from multiple photodetectors 702 (e.g., a pair of photodetectors) to the sense region 708 or floating diffusion node. For example, the gates of first and second charge transfer transistors 706a (TX_A) and 706b (TX_B) (i.e., the charge transfer transistors of the first row) may be simultaneously driven to transfer charges accumulated by the first and second photodetectors 702a, 702b to the sense region 708, where the charges may be summed. After reading the summed charge out of the pixel 700, the gates of third and fourth charge transfer transistors 706c (TX_C) and 706d (TX_D) (i.e., the charge transfer transistors of the second row) may be simultaneously driven to transfer charges accumulated by the third and fourth photodetectors 702c, 702d to the sense region 708, where the charges may be summed. This summed charge may also be read out of the pixel 700. In a subsequent frame of image capture, the gates of the first and third charge transfer transistors 706a and 706c (i.e., the charge transfer transistors of the first column) may be simultaneously driven to transfer charges accumulated by the first and third photodetectors 702a, 702c to the sense region 708. After reading this charge out of the pixel 700, the gates of the second and fourth charge transfer transistors 706b and 706d (i.e., the charge transfer transistors of the second column) may be simultaneously driven to transfer charges accumulated by the second and fourth photodetectors 702b, 702d to the sense region 708. This charge may also be read out of the pixel 700. Additionally or alternatively, charge accumulated by the photodetectors 702 may be read out of the pixel 700 individually, or charges accumulated by any combination (including all) of the photodetectors 702 may be read out of the pixel 700 together, or charges accumulated by the photodetectors 702 along a left- or right-sloping diagonal may be read out of the pixel 700 together.

[0071] When charges accumulated by different photodetectors 702 are read out of the pixel 700 individually, the charges may be summed in various ways, or a processor may interpolate between the values read out of the photodetectors in different pixels of a pixel array (e.g., perform a de-mosaicing operation) to generate an image having an effective 4x resolution for the pixel array.

[0072] In some embodiments, a shared readout circuit per pixel may be configured differently for different pixels in a pixel array. For example, in a potentially lower cost image sensor, or in an image sensor implemented using front side illumination (FSI) technology, a single charge transfer transistor may be coupled to a pair of photodetectors, and may be operated by a processor to simultaneously read charges out of, and sum charges, integrated by a pair of photodetectors. For example, in one pixel of an image sensor, a single charge transfer transistor could replace both of the charge transfer transistors 706a and 706b and connect both of the photodetectors 702a and 702b to the shared readout circuit 704, and another charge transfer transistor could replace both of the charge transfer transistors 706c and 706d and connect both of the photodetectors 702c and 702d to the shared readout circuit 704. Similarly, in another pixel of the image sensor, a single charge transfer transistor could replace both of the charge transfer transistors 706a and 706c and connect both of the photodetectors 702a and 702c to the shared readout circuit 704, and another charge transfer transistor could replace both of the charge transfer transistors 706b and 706d and connect both of the photodetectors 702b and 702d to the shared readout circuit 704.

[0073] In some embodiments, an image capture device, such as a camera, may not include a shutter, and thus an image sensor of the image capture device may be constantly exposed to light. When the pixel 700 is used in these embodiments, the photodetectors 702 may have to be reset or depleted of charge before an image is captured (e.g., by applying drive signals (e.g., gate voltages) to the reset transistor 710 and charge transfer transistors 706). After the charge from the photodetectors 702 has been depleted, the charge transfer transistors 706 and reset transistor 710 may be turned off to isolate the photodetectors 702 from the shared readout circuit 704. The photodetectors 702 can then accumulate photongenerated charge during a charge integration period.

[0074] FIGs. 8A and 8B each show an array of pixels 800 (e.g., a 2x2 array of pixels). In some cases, the array of pixels 800 may represent a portion of a much larger array of pixels, such as an array of millions of pixels included in an image sensor. In some cases, the array of pixels 800 may be included in an image sensor associated with one of the image capture devices or cameras described with reference to FIGs. 1 A-1 B and 2, or a set of pixels included in the image sensor described with reference to FIG. 4. In some cases, each pixel 802 in the array of pixels 800 may be configured similarly to the pixel described with reference to FIGs. 5-6 and, in some cases, each pixel 802 may be associated with an instance of the shared readout circuit described with reference to FIG. 7.

[0075] By way of example, the array of pixels 800 includes a red pixel 800a, first and second green pixels 800b, 800c, and a blue pixel 800d arranged in a Bayer pattern. The Bayer pattern may be achieved by disposing a color filter array over the array of pixels 800. For example, different subsets of filter elements in the color filter array may be disposed over different subsets of pixels in the array of pixels 800, with each subset of filter elements having a different color (e.g., red filter elements 802a, green filter elements 802b, or blue filter elements 802c). In alternative embodiments, the different subsets of filter elements may be associated with different colors (e.g., cyan, yellow, and magenta filter elements; cyan, yellow, green, and magenta filter elements; red, green, blue, and white filter elements; and so on). In some alternative embodiments, a color filter array may not be provided, or all of the filter elements in the color filter array may have the same color.

[0076] Each pixel 800a, 800b, 800c, 800d may include a two-dimensional array of photodetectors 804. For example, each pixel 800a, 800b, 800c, 800d may include a first photodetector 804a and a second photodetector 804b arranged in a first row, and a third photodetector 804c and a fourth photodetector 804d arranged in a second row. The first photodetector 804a and the third photodetector 804c may be arranged in a first column, and the second photodetector 804b and the fourth photodetector 804d may be arranged in a second column.

[0077] Each photodetector 804a, 804b, 804c, 804d may be electrically isolated from each other photodetector 804a, 804b, 804c, 804d (e.g., by implant isolation or physical trench isolation).

[0078] An array of 1x2 OCLs 806 may be disposed over the array of pixels 800, with a pair of adjacent 1x2 OCLs 806a, 806b disposed over each pixel 800a, 800b, 800c, 800d. As shown, the pair of adjacent OCLs 806 may include a first 1x2 OCL 806a disposed over two adjacent photodetectors 802 (e.g., over the first and second photodetectors 804a, 804b), and a second 1x2 OCL 806b disposed over two other adjacent photodetectors 802 (e.g., over the third and fourth photodetectors 804c, 804d). [0079] The photodetectors 804a, 804b, 804c, 804d of a pixel 800a, 800b, 800c, or 800d may be connected to a shared readout circuit (i.e., a readout circuit shared by all of the photodetectors associated with the pixel, as described, for example, with reference to FIG. 7). A set of charge transfer transistors may be operable to connect the photodetectors 804a, 804b, 804c, 804d to the shared readout circuit (e.g., each charge transfer transistor in the set may be operable (e.g., by a processor) to connect a respective one of the photodetectors to, and disconnect the respective one of the photodetectors from, the shared readout circuit). In some cases, each charge transfer transistor may be operated individually. In some cases, pairs (or all) of the charge transfer transistors may be operated contemporaneously.

[0080] In some embodiments, all of the 1x2 OCLs 806 in the array of 1x2 OCLs may have a same orientation (e.g., a horizontal orientation, as shown; or alternatively, a vertical orientation). In other embodiments, and as shown in FIGs. 9C and 9D, the 1x2 OCLs disposed over alternating Bayer pattern rows, alternating Bayer pattern columns, or alternating 2x2 sets of Bayer pattern pixels may have different orientations.

[0081] By way of example, FIG. 8A shows each of the 1x2 OCLs 806 as having a similarly shaped and sized oval perimeter. Each of the 1x2 OCLs 806 may also have a similar curvature (i.e., curvature perpendicular to the plan view shown in FIG. 8A). In other embodiments, each of the 1x2 OCLs 806 may have a perimeter that is generally rectangular, or a perimeter having a different or non-symmetric shape. All of these perimeters may be referred to herein as oblong perimeters, providing oblong OCLs (e.g., 1x2 OCLs 806). In some cases, different 1x2 OCLs 806 may have somewhat different shapes as a result of manufacturing variance. More generally, each (or all) of the 1x2 OCLs 806 in the array of 1x2 OCLs 806 may have the same or different shape, size, or curvature. For purposes of this description, however, an OCL of any shape that extends over two adjacent photodetectors is considered a 1x2 OCL (and is also considered an oblong OCL).

[0082] Also by way of example, FIG. 8A shows each of the 1 x2 OCLs 806 to have a focus area 808 (e.g., the first 1x2 OCL 806a has a first focus area 808a, and the second 1x2 OCL 806b has a second focus area 808b). The focus area 808 of each 1x2 OCL is generally aligned with the perimeter of the OCL 806.

[0083] By way of further example, FIG. 8A shows that the perimeter of each 1x2 OCL 806 is generally aligned with respect to the pair of photodetectors over which it is disposed. For example, the first photodetector 804a has a first centroid 810a, the second photodetector 804b has a second centroid 810b, and the first 1x2 OCL 806a has a centroid 812 that is disposed in line with, and centered between, the first centroid 810a and the second centroid 810b. Similarly, FIG. 8A shows that the focus area 808 of each 1x2 OCL 806 is generally aligned with the perimeter of the 1x2 OCL 806, and generally aligned with respect to the pair of photodetectors over which it is disposed. For example, the first 1x2 OCL 806a has a focus centroid 814 that is disposed in line with, and centered between, the first centroid 810a and the second centroid 810b.

[0084] In some embodiments, the centroid of a 1x2 OCL (e.g., the centroid 812 of the first 1x2 OCL 806a) may not be aligned with respect to the pair of photodetectors over which it is disposed, and/or the focus centroid of a 1x2 OCL (e.g., the focus centroid 814 of the focus area 808a of the first 1x2 OCL 806a) may not be aligned with respect to the pair of photodetectors over which it is disposed. For example, and as shown in FIG. 8B, the focus area 808a of the first 1x2 OCL 806a may not be aligned with respect to the first and second photodetectors 804a, 804b (e.g., the focus centroid 814 of the first 1x2 OCL 806a is not aligned with, and is not centered between, the first centroid 810a then the second centroid 810b). In alternative embodiments, the focus centroid 814 may not be aligned with, but may be centered between, the first centroid 810a and the second centroid 810b; or, the focus centroid 814 may be aligned with, but not be centered between, the first centroid 810a and the second centroid 801 b.

[0085] Additionally or alternatively, the centroid of a 1x2 OCL may not be aligned with respect to the photodetectors over which it is disposed (e.g., because of manufacturing variances that affect the placement or shape of the perimeter of the 1x2 OCL).

[0086] FIGs. 9A-9D show an imaging area 900 of an image capture device (e.g., an image sensor), in which the pixels 902 of the image capture device are arranged in accordance with a Bayer pattern (i.e., a 2x2 pattern including red pixels and blue pixels along one diagonal, and green pixels along the other diagonal). The pixels 902 may be arranged in Bayer pattern rows 906a, 906b and Bayer pattern columns 908a, 908b. More generally, the pixels 902 may be arranged in rows extending in a first dimension, and in columns extending in a second dimension orthogonal to the first dimension.

[0087] FIGs. 9A-9D show each pixel 902 as having a 2x2 array of photodetectors 904, as described, for example, with reference to FIGs. 5-8B. In some embodiments, the imaging area 900 may be an example of an imaging area of an image sensor associated with one of the image capture devices or cameras described with reference to FIGs. 1 A-1 B and 2, or the imaging area of the image sensor described with reference to FIG. 4, or an imaging area including a plurality of the pixels described with reference to any of FIGs. 5-8B. [0088] An array of 1x2 OCLs 910 is disposed over the entirety of the imaging area 900, with a pair of adjacent 1x2 OCLs 910 disposed over each pixel 902, and with each 1x2 OCL 910 being disposed over a pair of adjacent photodetectors 904.

[0089] In FIG. 9A, the pixels 902 in all of the Bayer pattern rows 906a, 906b of the imaging area 900 are configured (or are operable) to detect a phase difference (e.g., an out- of-focus condition) in a first set of edges of an image (e.g., vertical edges). Each 1x2 OCL 910 in the array of 1 x2 OCLs 910 has a same orientation, with its longer dimension extending parallel to the Bayer pattern rows 906a, 906b.

[0090] In FIG. 9B, the pixels 902 in all of the Bayer pattern columns 908a, 908b of the imaging area 900 are configured (or are operable) to detect a phase difference (e.g., an out- of-focus condition) in a second set of edges of an image (e.g., horizontal edges). Each 1x2 OCL 910 in the array of 1x2 OCLs 910 has a same orientation, with its longer dimension extending parallel to the Bayer pattern columns 908a, 908b.

[0091] In FIG. 9C, the pixels 902 in the first Bayer pattern row 906a of the imaging area 900 are configured (or are operable) to detect a phase difference (e.g., an out-of-focus condition) in a first set of edges of an image (e.g., vertical edges), and the pixels 902 in the second Bayer pattern row 906b are configured (or are operable) to detect a phase difference in a second set of edges of the image (e.g., horizontal edges, or edges that are otherwise orthogonal to the first set of edges). The 1x2 OCLs 910 in the array of 1x2 OCLs 910 have different orientations, with a first subset of 1x2 OCLs 910 in the array of 1x2 OCLs 910 having a first orientation (e.g., with its longer dimension extending parallel to the Bayer pattern rows 906a, 906b), and a second subset of 1x2 OCLs 910 in the array of 1x2 OCLs 910 having a second orientation, orthogonal to the first orientation (e.g., with its longer dimension extending parallel to the Bayer pattern columns 908a, 908b). The first subset of 1x2 OCLs 910 may be disposed over a first set of rows of pixels 902 (e.g., over the Bayer pattern row 906a, or over interspersed rows (e.g., interspersed Bayer pattern rows 906) when the imaging area 900 includes more Bayer pattern rows than are shown). The second subset of 1x2 OCLs 910 may be disposed over a second set of rows of pixels 902 (e.g., over the Bayer pattern row 906b, or over interspersed rows (e.g., interspersed Bayer pattern rows 906) when the imaging area 900 includes more Bayer pattern rows than are shown). Alternatively, the first and second subsets of 1x2 OCLs 910 may be disposed over interspersed columns, such as interspersed Bayer pattern columns.

[0092] In FIG. 9D, the pixels 902 in a first lattice of pixels are configured (or are operable) to detect a phase difference (e.g., an out-of-focus condition) in a first set of edges of an image e.g., vertical edges), and the pixels 902 in a second lattice of pixels are configured (or are operable) to detect a phase difference in a second set of edges of the image (e.g., horizontal edges, or edges that are otherwise orthogonal to the first set of edges). The lattices of pixels may be overlapping checkerboard lattices of pixels, or overlapping checkerboard lattices of Bayer pattern sets of pixels (e.g., each segment of each lattice may be a 2x2 array of pixels 902). The 1x2 OCLs 910 in the array of 1x2 OCLs 910 have different orientations, with a first subset of 1x2 OCLs 910 in the array of 1x2 OCLs 910 having a first orientation (e.g., with its longer dimension extending parallel to the Bayer pattern rows 906a, 906b), and a second subset of 1x2 OCLs 910 in the array of 1x2 OCLs 910 having a second orientation, orthogonal to the first orientation (e.g., with its longer dimension extending parallel to the Bayer pattern columns 908a, 908b). The first subset of 1x2 OCLs 910 may be disposed over the first lattice of pixels 902, and the second subset of 1x2 OCLs 910 may be disposed over the second lattice of pixels 902.

[0093] In the configuration shown in FIG. 9D, at least some of the 1x2 OCLs 910 in the first subset of 1x2 OCLs 910 and at least some of the 1x2 OCLs 910 in the second subset of 1x2 OCLs 910 are disposed over a subset of pixels disposed under a same-colored subset of filter elements. In this manner, PDAF information for detecting the focus of two orthogonal sets of edges may be collected from pixels 902 having the same color.

[0094] FIG. 10 shows a sample electrical block diagram of an electronic device 1000, which may be the electronic device described with reference to FIGs. 1 A-1 B, 2, 4, and so on. The electronic device 1000 may include a display 1002 (e.g., a light-emitting display), a processor 1004, a power source 1006, a memory 1008 or storage device, a sensor 1010, and an input/output (I/O) mechanism 1012 (e.g., an input/output device and/or input/output port). The processor 1004 may control some or all of the operations of the electronic device 1000. The processor 1004 may communicate, either directly or indirectly, with substantially all of the components of the electronic device 1000. For example, a system bus or other communication mechanism 1014 may provide communication between the processor 1004, the power source 1006, the memory 1008, the sensor 1010, and/or the input/output mechanism 1012.

[0095] The processor 1004 may be implemented as any electronic device capable of processing, receiving, or transmitting data or instructions. For example, the processor 1004 may be a microprocessor, a central processing unit (CPU), an application-specific integrated circuit (ASIC), a digital signal processor (DSP), or combinations of such devices. As described herein, the term “processor” is meant to encompass a single processor or processing unit, multiple processors, multiple processing units, or other suitably configured computing element or elements.

[0096] It should be noted that the components of the electronic device 1000 may be controlled by multiple processors. For example, select components of the electronic device 1000 may be controlled by a first processor and other components of the electronic device 1000 may be controlled by a second processor, where the first and second processors may or may not be in communication with each other.

[0097] The power source 1006 may be implemented with any device capable of providing energy to the electronic device 1000. For example, the power source 1006 may be one or more batteries or rechargeable batteries. Additionally or alternatively, the power source 1006 may be a power connector or power cord that connects the electronic device 1000 to another power source, such as a wall outlet.

[0098] The memory 1008 may store electronic data that may be used by the electronic device 1000. For example, the memory 1008 may store electrical data or content such as, for example, audio and video files, documents and applications, device settings and user preferences, timing signals, control signals, data structures or databases, image data, or focus settings. The memory 1008 may be configured as any type of memory. By way of example only, the memory 1008 may be implemented as random access memory, read-only memory, Flash memory, removable memory, other types of storage elements, or combinations of such devices.

[0099] The electronic device 1000 may also include one or more sensors 1010 positioned substantially anywhere on the electronic device 1000. The sensor(s) 1010 may be configured to sense substantially any type of characteristic, such as but not limited to, pressure, light, touch, heat, movement, relative motion, biometric data, and so on. For example, the sensor(s) 1010 may include a heat sensor, a position sensor, a light or optical sensor, an accelerometer, a pressure transducer, a gyroscope, a magnetometer, a health monitoring sensor, and so on. Additionally, the one or more sensors 1010 may utilize any suitable sensing technology, including, but not limited to, capacitive, ultrasonic, resistive, optical, ultrasound, piezoelectric, and thermal sensing technology.

[0100] The I/O mechanism 1012 may transmit and/or receive data from a user or another electronic device. An I/O device may include a display, a touch sensing input surface such as a track pad, one or more buttons (e.g., a graphical user interface “home” button), one or more cameras, one or more microphones or speakers, one or more ports such as a microphone port, and/or a keyboard. Additionally or alternatively, an I/O device or port may transmit electronic signals via a communications network, such as a wireless and/or wired network connection. Examples of wireless and wired network connections include, but are not limited to, cellular, Wi-Fi, Bluetooth, IR, and Ethernet connections.

[0101] The foregoing description, for purposes of explanation, uses specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein are presented for purposes of illustration and description. They are not targeted to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings.

Claims

CLAIMS What is claimed is:

1 . An image capture device, comprising: an array of pixels, each pixel comprising a 2x2 array of photodetectors; and an array of 1x2 on-chip lenses (OCLs) disposed over the array of pixels; wherein, for each pixel in the array of pixels, a respective pair of adjacent 1x2 OCLs is disposed over a pixel, the respective pair of adjacent 1x2 OCLs including, a respective first 1x2 OCL disposed over a first photodetector and a second photodetector in the 2x2 array of photodetectors for the pixel; and a respective second 1x2 OCL disposed over a third photodetector and a fourth photodetector in the 2x2 array of photodetectors for the pixel.

2. The image capture device of claim 1 , wherein all 1x2 OCLs in the array of 1x2 OCLs have a same orientation.

3. The image capture device of claim 1 , wherein: a first subset of 1x2 OCLs in the array of 1x2 OCLs has a first orientation; and a second subset of 1x2 OCLs in the array of 1x2 OCLs has a second orientation, orthogonal to the first orientation.

4. The image capture device of claim 3, wherein: the array of pixels has rows of pixels extending in a first dimension and columns of pixels extending in a second dimension; the first subset of 1x2 OCLs is disposed over a first set of the rows of pixels; and the second subset of 1x2 OCLs is disposed over a second set of the rows of pixels, the second set of the rows of pixels interspersed with the first set of rows of the pixels.

5. The image capture device of claim 3, wherein: the array of pixels has rows of pixels extending in a first dimension and columns of pixels extending in a second dimension; the first subset of 1x2 OCLs is disposed over a first set of columns of pixels; and the second subset of 1x2 OCLs is disposed over a second set of columns of pixels, the second set of columns of pixels interspersed with the first set of columns of pixels.

6. The image capture device of claim 3, wherein: the array of pixels has rows of pixels extending in a first dimension and columns of pixels extending in a second dimension;

- 25 - the first subset of 1x2 OCLs is disposed over a first lattice of pixels extending over the rows of pixels and the columns of pixels; and the second subset of 1x2 OCLs is disposed over a second lattice of pixels extending over the rows of pixels and the columns of pixels, the second lattice of pixels overlapping the first lattice of pixels.

7. The image capture device of claim 1 , further comprising: a color filter array disposed over the array of pixels and having different subsets of filter elements disposed over different subsets of pixels in the array of pixels; wherein, each subset of filter elements has a different color.

8. The image capture device of claim 7, wherein: a first subset of filter elements in the different subsets of filter elements is disposed over a first subset of pixels in the array of pixels; a first subset of 1x2 OCLs in the array of 1x2 OCLs has a first orientation; a second subset of 1x2 OCLs in the array of 1x2 OCLs has a second orientation, orthogonal to the first orientation; and at least some 1x2 OCLs in the first subset of 1x2 OCLs and at least some 1x2 OCLs in the second subset of 1x2 OCLs are disposed over the first subset of pixels.

9. The image capture device of claim 8, wherein the different subsets of filter elements include red filter elements, blue filter elements, and green filter elements arranged in Bayer pattern rows and Bayer pattern columns.

10. The image capture device of claim 9, wherein all 1x2 OCLs in the array of 1x2 OCLs have a same orientation.

11 . The image capture device of claim 7, wherein: a first subset of 1x2 OCLs in the array of 1x2 OCLs has a first orientation; and a second subset of 1x2 OCLs in the array of 1x2 OCLs has a second orientation, orthogonal to the first orientation.

12. The image capture device of claim 1 , wherein, for at least one pixel in the array of pixels, the first photodetector has a first centroid; the second photodetector has a second centroid; and a 1x2 OCL in the array of 1x2 OCLs has a focus centroid that is not aligned with the first centroid and the second centroid.

13. The image capture device of claim 1 , wherein, for at least one pixel in the array of pixels, the first photodetector has a first centroid; the second photodetector has a second centroid; and a 1x2 OCL in the array of 1x2 OCLs has a focus centroid that is not centered between the first centroid and the second centroid.

14. The image capture device of claim 1 , wherein at least two 1x2 OCLs in the array of 1x2 OCLs have at least one of: different shapes, different sizes, or different curvatures.

15. The image capture device of claim 1 , further comprising: a pixel readout circuit comprising, for each pixel in the array of pixels, a shared readout circuit associated with the 2x2 array of photodetectors for the pixel; and a set of charge transfer transistors, each charge transfer transistor operable to connect a photodetector in the 2x2 array of photodetectors to the shared readout circuit.

16. An image capture device, comprising: an array of photodetectors; and an array of oblong on-chip lenses (OCLs) disposed over the array of photodetectors; wherein, a different pair of photodetectors in the array of photodetectors is disposed under each of the oblong OCLs; and every photodetector in the array of photodetectors is disposed under a respective one of the oblong OCLs in the array of oblong OCLs.