WO2022022499A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022022499A1
WO2022022499A1 PCT/CN2021/108622 CN2021108622W WO2022022499A1 WO 2022022499 A1 WO2022022499 A1 WO 2022022499A1 CN 2021108622 W CN2021108622 W CN 2021108622W WO 2022022499 A1 WO2022022499 A1 WO 2022022499A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
battery
antenna
speaker module
electronic device
Prior art date
Application number
PCT/CN2021/108622
Other languages
English (en)
French (fr)
Inventor
姚成伟
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP21850529.5A priority Critical patent/EP4192033A4/en
Publication of WO2022022499A1 publication Critical patent/WO2022022499A1/zh
Priority to US18/098,682 priority patent/US20230176633A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/022—Cooling arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1635—Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present application belongs to the field of communication technologies, and specifically relates to an electronic device.
  • the conventional solution is to set the heat sink on the magnetic isolation sheet (part of the speaker structure), the BOX steel sheet of the speaker and the battery, so as to conduct the heat generated by the speaker to the battery side, so as to realize Cooling of the speaker module.
  • the common heat sink will form a parasitic capacitance with the conductive layer inside the electronic device due to its conductivity, which will resonate with the antenna around the speaker and affect the transceiver performance of the antenna around the speaker.
  • the purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of interference to the antenna caused by the parasitic capacitance generated by the heat sink.
  • an embodiment of the present application provides an electronic device, comprising: a casing, a battery, an antenna, a speaker module and a heat sink; the battery, the antenna, the speaker module and the heat sink are all is arranged in the cavity formed by the casing, wherein the battery and the speaker module are arranged adjacent to each other, and there is a gap between the battery and the speaker module;
  • the heat sink is disposed on the speaker module and the battery, and an opening is provided on the heat sink, and the opening is directly opposite to the gap.
  • the battery, the antenna, the speaker module and the heat sink are all arranged in the cavity formed by the casing, wherein the battery and the speaker module are arranged adjacent to each other, and the antenna is arranged on the peripheral side of the area where the battery and the speaker module are located ,
  • the heat sink By arranging the heat sink on the speaker module and the battery, the heat generated by the speaker module can be conducted to the battery side, thereby realizing heat dissipation.
  • the parasitic resonance formed by the heat sink can be moved out of the working frequency band of the antenna, so as to ensure the audio output effect of the speaker module. At the same time, the interference to the transmit and receive performance of the antenna is reduced.
  • FIG. 1 shows one of the schematic structural diagrams of an electronic device according to an embodiment of the present invention
  • FIG. 2 shows the second schematic structural diagram of an electronic device according to an embodiment of the present invention
  • FIG. 3 shows a third schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • this application sorts out the antenna standard, the degree of influence of the heat sink on the antenna, the difference in structure design, etc., and avoids the situation that the heat sink cannot be attached in the front-end structure design, which can solve the problem of the heat sink due to the conductivity.
  • the conductive layer inside the electronic device forms parasitic capacitance, which resonates with the antenna around the speaker, which affects the transceiver performance of the antenna around the speaker.
  • the present application provides an electronic device, comprising a casing 1, a battery 2, an antenna 6, a speaker module and a heat sink 3; the battery 2, the antenna 6, the speaker module
  • the battery 2 and the speaker module are arranged adjacent to each other, and there is a gap between the battery 2 and the speaker module, so
  • the antenna 6 is arranged on the peripheral side of the area where the battery and the speaker module are located;
  • the heat sink 3 is arranged on the speaker module and the battery 2; wherein, the heat sink 3 is provided with an opening , the opening is directly opposite to the gap.
  • the heat sink 3 is made of materials with good thermal conductivity.
  • thermally conductive materials such as thermally conductive adhesive, thermally conductive silicone grease, thermally conductive silicone sheets, etc. have the advantages of high thermal conductivity and high flexibility, which can ensure thermal conductivity under low installation pressure conditions.
  • the material can fill the gap of the contact surface most fully, reduce the thermal resistance between the heat sink 3 and the contact surface, thereby improving the heat dissipation efficiency.
  • the heat sink is a graphene heat sink, and the graphene heat sink has excellent thermal conductivity, which can not only achieve good heat conduction in the opposite direction of the speaker module and the battery 2, but also conduct heat in the longitudinal direction perpendicular to the plane, It is conducive to the conduction of heat.
  • the graphene heat sink itself has excellent flexibility, which can well fit the heat dissipation and installation requirements of functional devices.
  • a metal plate such as magnesium alloy, aluminum alloy, n-alloy
  • the height difference between the metal plate and the graphene heat sink is similar to two polar plates, and the metal plate is equivalent to the reference ground.
  • high-frequency parasitics will be formed between the graphene heat sink with electrical conductivity and the reference ground plane. Capacitance, a parasitic antenna is derived.
  • the larger the height difference between the graphene heat sink and the reference ground plane the larger the parasitic capacitance will be, and the resulting parasitic antenna will generate a resonance frequency, which will have an unacceptable impact on the antenna performance.
  • the heat sink 3 is attached to the speaker module and the battery 2 in a large area, so that the heat generated by the speaker module can be conducted to the battery side through the heat sink 3, thereby realizing the heat dissipation of the speaker module. Further, by setting the opening at the position of the heat sink 3 facing the gap between the battery 2 and the speaker module, the formed parasitic resonance can be moved out of the working frequency band of the antenna, and the influence of the parasitic capacitance formed by the heat sink 3 on the antenna can be reduced, thereby While ensuring the audio output effect of the speaker module, it can also achieve the effect of not affecting the transceiver performance of the antenna, and improve the user experience.
  • the antenna 6 includes a high-frequency antenna, an intermediate-frequency antenna and a low-frequency antenna, the high-frequency antenna and the intermediate-frequency antenna are arranged on the first side of the speaker module away from the battery 2, and the low-frequency antenna is disposed on the second side, and the second side is adjacent to the first side.
  • the housing 1 includes a middle frame, and the first side is the inner side of the middle frame close to the speaker module.
  • a high frequency antenna and an intermediate frequency antenna are arranged on the inner side of the middle frame 1 near the edge of the speaker module.
  • the parasitic antenna formed by the heat sink 3 in this environment will have a greater impact on the performance of the high-frequency antenna and the intermediate frequency antenna on the first side. If the gap between 2 and the speaker module is right, the parasitic resonance formed by the heat sink 3 can be moved out of the working frequency band of the high-frequency antenna and the intermediate-frequency antenna, thereby reducing the influence of parasitic capacitance on the transceiver performance of the antenna.
  • the size of the opening is related to the installation position of the antenna 6 .
  • the structure of the antenna 6 is designed and laid out according to the intermediate frequency and high frequency, and the length and width of the opening on the heat sink 3 can be determined based on the setting position of the antenna 6 and the effect of simulated coupling.
  • the length direction of the opening corresponds to the extending direction of the gap between the battery and the speaker module, and the width direction of the opening corresponds to the width direction of the gap. In this way, based on the installation position of the antenna 6 , an appropriate opening size can be set, which can minimize the influence of parasitic capacitance on the performance of the antenna 6 .
  • the speaker module includes a steel sheet 5 and a magnetic isolation sheet 4 , the gap formed between the magnetic isolation sheet 4 and the battery 2 is a first gap, and the heat sink A first opening 301 is provided on the 3 at a position facing the first gap.
  • the magnetic isolation sheet 4 is a magnetic sheet with high magnetic permeability. It has a soft texture and is covered with viscous glue on one side. It can be made into different thicknesses according to different applications, and can be die-cut to the required size and shape.
  • the magnetic isolation sheet uses the electron scattering caused by the thermal motion of the functional component lattice electric field and the interaction between electrons and electrons to absorb electromagnetic wave energy and convert it into heat energy, so as to achieve the purpose of attenuating electromagnetic waves.
  • the steel sheet 5 is the BOX steel sheet, the thickness of the BOX steel sheet is 0.2mm, and the plastic BOX is 0.5mm.
  • the thickness of the whole machine is 0.3mm, and the cavity structure of the speaker is designed to increase the volume of the sound cavity and achieve a good effect of the speaker of the whole machine.
  • the heat sink 3 is provided with a unilateral opening structure, that is, the heat sink 3 is only provided with an opening at the gap between the magnetic separator 4 and the battery 2 , while the gap between the steel sheet 5 and the battery 2 is open. No opening is provided. Since the graphite heat sink and the metal plate under the display screen form two polar plates of the capacitor, the greater the height difference between the two, the greater the parasitic capacitance generated, and the greater the interference to the transceiver performance of the antenna 6 . The distance between the area between the magnetic separator and the battery on the terminal product and the metal plate under the display screen is the largest, and the interference to the antenna 6 is the largest. Therefore, arranging an opening at the gap between the magnetic isolation sheet 4 and the battery 2 can effectively reduce the generation of parasitic capacitance, thereby improving the transmission and reception performance of the antenna 6 .
  • the structural design of attaching the heat sink 2 and opening the slits can not only ensure the heat dissipation performance but also reduce the impact on the performance of the antenna 6 . That is, the heat sink provided with the first opening 301 and the heat sink without the first opening 301 have almost the same heat dissipation performance for the speaker module, but since the opening will not form a capacitor with the metal plate under the display screen, Therefore, the influence of the heat sink provided with the first opening 301 on the antenna 6 provided on the peripheral side of the middle frame is greatly reduced compared to that of the heat sink provided with the first opening 301 . Therefore, this embodiment can simultaneously reduce the influence of parasitic capacitance on the performance of the antenna 6 without affecting the heat dissipation performance of the speaker module.
  • the gap formed between the steel sheet 5 and the battery 2 is a second gap, and a second opening 302 is provided on the heat sink 3 at a position facing the second gap. .
  • the heat sink 3 is provided with a structure with bilateral openings, that is, the heat sink 3 is provided with a first opening at the gap between the magnetic isolation sheet 4 and the battery 2 , and the first opening is set at the gap between the steel sheet 5 and the battery 2 .
  • the second opening is provided, and the heat of the speaker module is conducted to the battery side through the connecting part of the heat sink 3 between the first opening 301 and the second opening 302. The effect of the complete parasitic capacitance on the antenna 6 cannot be resolved.
  • the magnetic isolation sheet 4 is suspended on the sound cavity of the speaker module.
  • the electronic device includes a display screen, a metal plate is arranged below the display screen, and the steel sheet 5 is connected to the metal plate by a single bolt, so as to realize the connection method of the single-point grounding of the steel sheet 5, or the steel sheet 5 It is connected with the metal plate by a plurality of bolts to realize the connection method of the steel sheet 5 evenly grounded, or the steel sheet 5 is suspended on the side of the speaker module away from the metal plate, so that the steel sheet 5 is not grounded connection method.
  • an insulating layer is provided between the magnetic isolation sheet 4 and the heat sink 3 .
  • the insulating layer has little influence on the temperature rise of the speaker module, so that the influence of the parasitic capacitance formed by the heat sink 3 on the performance of the antenna 6 can be further reduced.
  • the insulating layer is a thermally conductive insulating layer.
  • it can be a PET insulating layer.
  • PET is commonly known as polyester resin, which is a crystalline saturated polyester. It is a milky white or light yellow, highly crystalline polymer with a smooth and shiny surface, creep resistance, fatigue resistance, abrasion resistance and Good dimensional stability, low wear and high hardness.
  • the thickness of the insulating layer is not less than 0.1 mm. In this way, if space allows, the parasitic antenna coupling path can be better reduced, thereby reducing the influence of parasitic capacitance on the performance of the antenna 6 .
  • the casing 1 is provided with a heat dissipation layer on the side close to the speaker module.
  • the side of the housing 1 close to the speaker module is set as a heat dissipation interlayer structure, for example, a sheet layer with good thermal conductivity such as graphene or copper is arranged on the housing 1 at the position facing the speaker module.
  • the heat generated by the speaker module can be directly dissipated through the casing 1 , which can increase the heat dissipation path, thereby better improving the heat dissipation performance of the speaker module, and at the same time, the strength and toughness of the casing 1 can be improved.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请公开了一种电子设备，属于电子产品技术领域。电子设备包括：壳体，电池、天线，扬声器模组和散热片；所述电池，所述天线，所述扬声器模组和所述散热片均设置于所述壳体形成的腔体内，其中，所述电池和所述扬声器模组相邻设置，所述电池和所述扬声器模组间具有间隙，所述天线设置于所述电池和所述扬声器模组所在区域的周侧；所述散热片设置于所述扬声器模组和所述电池上，所述散热片上设置有开口，所述开口与所述间隙正对。

Description

电子设备
相关申请的交叉引用
本申请主张在2020年7月28日在中国提交的中国专利申请号No.202010737350.1的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于通信技术领域，具体涉及一种电子设备。
背景技术
随着智能终端发展，智能终端的音频扬声器外放应用场景越来越多，扬声器工作过程中的功率转化为热量，越来越多的应用场景在扬声器处的热量集中，导致发热问题。
相关技术中，针对扬声器的发热问题，常规的解决思路是在隔磁片(扬声器的一部分结构)、扬声器的BOX钢片和电池上设置散热片，将喇叭产生的热量传导至电池侧，从而实现扬声器模组的散热。然而，常见的散热片由于具有导电性，会与电子设备内部的导电层形成寄生电容，与扬声器周边天线产生谐振，影响扬声器周边天线的收发性能。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决由于散热片产生的寄生电容对天线的干扰问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种电子设备，包括：壳体，电池，天线，扬声器模组和散热片；所述电池，所述天线，所述扬声器模组和所述散热片均设置于所述壳体形成的腔体内，其中，所述电池和所述扬声器模组相邻设置，所述电池和所述扬声器模组之间具有间隙；
所述散热片设置于所述扬声器模组和所述电池上，所述散热片上设置有开口，所述开口与所述间隙正对。
在本申请实施例中，电池，天线，扬声器模组和散热片均设置于壳体形成的腔体内，其中电池和扬声器模组相邻设置，天线设置于电池和扬声器模组所在区域的周侧，通过将散热片设置在扬声器模组和电池上，能够将扬声器模组产生的热量传导至电池侧，从而实现散热。进一步通过在散热片上、正对电池和扬声器模组之间的间隙位置处设置开口，能够使散热片形成的寄生谐振移出天线的工作频段外，从而能够在保证扬声器模组的音频外放效果的同时降低对天线收发性能的干扰。
附图说明
图1表示本发明实施例的电子设备的结构示意图之一；
图2表示本发明实施例的电子设备的结构示意图之二；
图3表示本发明实施例的电子设备的结构示意图之三；
附图标记说明：
1-壳体；2-电池；3-散热片；301-第一开口；302-第二开口；4-隔磁片；5-钢片；6-天线。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
为解决上述问题，本申请从天线标准、散热片对天线影响程度、结构设计差异等方面进行梳理，从前端结构设计时规避不能贴散热片的情况，能够解决由于散热片的导电性，会与电子设备内部的导电层形成寄生电容，与扬 声器周边天线产生谐振，影响扬声器周边天线的收发性能的问题。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
请参照图1至图3，本申请提供一种电子设备，包括壳体1，电池2、天线6，扬声器模组和散热片3；所述电池2，所述天线6，所述扬声器模组和所述散热片3均设置于所述壳体1形成的腔体内，其中，所述电池2和所述扬声器模组相邻设置，所述电池2和所述扬声器模组间具有间隙，所述天线6设置于所述电池和所述扬声器模组所在区域的周侧；所述散热片3设置于所述扬声器模组和所述电池2上；其中，所述散热片3上设置有开口，所述开口与所述间隙正对。
其中，散热片3选用导热性能好的材料，常用的导热材料如导热胶、导热硅脂、导热硅胶片等，具有高导热性、高柔韧性等优点，可以保证在较低安装压力条件下导热材料能够最充分地填充接触表面的空隙，减小散热片3与接触表面的热阻，从而提高散热效率。可选地，散热片为石墨烯散热片，石墨烯散热片具有优异的导热能力，不仅可以在扬声器模组和电池2的相对方向上实现良好导热，还能够在垂直该平面的纵向上导热，有利于热量的传导，此外石墨烯散热片本身具备优良的柔韧性，能够很好的贴合功能器件的散热和安装要求。
应当指出，电子设备的显示屏下设置有金属板(如镁合金、铝合金、n合金)，扬声器模组和电池2上贴石墨烯散热片后，石墨烯散热片与金属板之间具有一定的高度差，而金属板与石墨烯散热片之间类似于两块极板，金属板相当于参考地面，这样，具有导电性能的石墨烯散热片会与参考地平面之间会形成高频寄生电容，衍生出寄生天线。而且石墨烯散热片会与参考地平面之间的高度差越大形成的寄生电容越大，衍生出的寄生天线产生谐振频率，会对天线性能产生不可接受的影响。
该实施例中，散热片3大面积的贴在扬声器模组和电池2上，能够将扬声器模组产生的热量通过散热片3传导至电池侧，从而实现扬声器模组的散热。进一步通过在散热片3正对电池2和扬声器模组之间的间隙位置处设置开口，能够使形成的寄生谐振移出天线的工作频段外，减少散热片3形成的 寄生电容对天线的影响，从而能够在保证扬声器模组的音频外放效果的同时，还能够达到不影响天线的收发性能的效果，提升用户的使用体验。
在一实施例中，天线6包括高频天线、中频天线和低频天线，所述高频天线和所述中频天线设置于所述扬声器模组远离所述电池2的第一侧，所述低频天线设置于第二侧，所述第二侧与所述第一侧相邻。
具体的，所述壳体1包括中框，所述第一侧为所述中框靠近扬声器模组的内侧，例如，中框1内侧靠近扬声器模组的边缘位置设置高频天线和中频天线。可以理解，散热片3在此环境下形成的寄生天线，会对第一侧的高频天线和中频天线的性能产生较大影响，而本申请通过将散热片3上设置开口，将开口与电池2和扬声器模组之间的间隙正对，则能够将散热片3形成的寄生谐振移出高频天线和中频天线的工作频段外，从而减少寄生电容对天线的收发性能影响。
在一实施例中，所述开口的尺寸与所述天线6的设置位置相关。
需要指出，天线6的结构按照中频和高频设计布局，散热片3上的开口的长度距离和宽度距离可基于天线6的设置位置，根据仿真耦合影响确定。其中，开口的长度方向对应与电池和扬声器模组之间的间隙的延伸方向一致，开口的宽度方向对应与间隙的宽度方向一致。这样，基于天线6的设置位置，设置合适的开口尺寸，能够最大程度的减少寄生电容对天线6性能的影响。
参见图2，在一实施例中，所述扬声器模组包括钢片5和隔磁片4，所述隔磁片4与所述电池2之间形成的间隙为第一间隙，所述散热片3上与所述第一间隙正对的位置设置有第一开口301。
需要说明的是，隔磁片4是一种具有高磁导率的磁性薄片，它质感柔软，一面覆有粘性胶，可根据不同的应用做成不同的厚度，同时可以模切加工成所需要的大小形状。隔磁片是利用功能成份晶格电场热运动引起的电子散射以及电子与电子之间的相互作用，吸收电磁波能量并将其转化为热能，从而达到衰减电磁波的目的。进一步的，配合整机结构设计厚度的考虑，钢片5为BOX钢片，BOX钢片的厚度是0.2mm，塑胶BOX是0.5mm，在保证整机厚度的前提下，使用BOX钢片能够优化0.3mm的整机厚度设计喇叭腔体结构，提升音腔体积达到良好的整机喇叭外放效果。
该实施例中，散热片3为单边开口的结构设置，即，散热片3仅在隔磁片4与电池2之间的间隙处设置开口，而钢片5与电池2之间的间隙处未设置开口。由于石墨散热片与显示屏下的金属板形成电容的两个极板，二者之间的高度差越大产生的寄生电容越大，对天线6收发性能的干扰也就越大。在终端产品上隔磁片与电池之间的区域到显示屏下的金属板的间距最大，对天线6的干扰最大。因此，在隔磁片4与电池2之间的间隙处设置开口可以有效减少寄生电容的产生，进而提高天线6的收发性能。
需要说明的是，相比于贴散热片3且不开缝的方式，贴散热片2且开缝的结构设计，能够既保证散热性能又能够减小对天线6性能的影响。也即，设置有第一开口301的散热片与不设置有第一开口301的散热片对扬声器模组具有几乎相同的散热性能，但由于开口处不会与显示屏下的金属板形成电容，因而设置有第一开口301的散热片对设置于中框周侧的天线6的影响较不设置有第一开口301的散热片大大降低。因此，该实施例能够在不影响扬声器模组的散热性能的情况下，同时减少寄生电容对天线6性能的影响。
进一步的，如图3中，所述钢片5与所述电池2之间形成的间隙为第二间隙，所述散热片3上与所述第二间隙正对的位置设置有第二开口302。
该实施例中，散热片3为双边开口的结构设置，即，散热片3在隔磁片4与电池2之间的间隙处设置第一开口，在钢片5与电池2之间的间隙处设置第二开口，扬声器模组的热量通过第一开口301与第二开口302之间的散热片3的连接部分传导至电池侧，散热片3的双边开口的结构设置，能够解决单边开口所不能解决彻底的寄生电容对天线6的影响。
需要说明的是，所述隔磁片4悬浮设置于所述扬声器模组的音腔上。所述电子设备包括显示屏，所述显示屏的下方设置有金属板，所述钢片5与所述金属板通过单个螺栓连接，实现钢片5的单点接地的连接方式，或者钢片5与所述金属板通过多个螺栓连接，实现钢片5均匀接地的连接方式，或者所述钢片5悬浮设置在所述扬声器模组远离所述金属板的一侧，实现钢片5不接地的连接方式。
在一实施例中，为了减少寄生天线的耦合路径，所述隔磁片4与所述散热片3之间设置有绝缘层。而绝缘层对扬声器模组的温升影响较小，这样， 能够进一步减少散热片3形成的寄生电容对天线6性能的影响。
具体的，所述绝缘层为导热绝缘层。例如，可以为PET绝缘层，PET俗称涤纶树脂，属结晶型饱和聚酯，为乳白色或浅黄色、高度结晶的聚合物，表面平滑有光泽，耐蠕变、耐抗疲劳性、耐磨擦和尺寸稳定性好，磨耗小而硬度高。
进一步的，所述绝缘层的厚度不小于0.1mm。这样，在空间允许的情况下，能够更好的减少寄生天线耦合路径，从而减少寄生电容对天线6性能的影响。
在一实施例中，所述壳体1在靠近所述扬声器模组的一侧设置有散热隔层。例如，将壳体1靠近扬声器模的一侧设置为散热隔层结构，如在壳体1上与扬声器模组正对的位置设置石墨烯或者铜等导热性良好的片层。这样，扬声器模组产生的热量可以直接通过壳体1散出，能够增加散热路径，进而更好的提升扬声器模组的散热性能，同时可以提高壳体1的强度和韧性。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种电子设备，包括：壳体，电池，天线，扬声器模组和散热片；
    所述电池，所述天线，所述扬声器模组和所述散热片均设置于所述壳体形成的腔体内；其中，所述电池和所述扬声器模组相邻设置，所述电池和所述扬声器模组之间具有间隙，所述天线设置于所述电池和所述扬声器模组所在区域的周侧；所述散热片设置于所述扬声器模组和所述电池上，所述散热片上设置有开口，所述开口与所述间隙正对。
  2. 根据权利要求1所述的电子设备，其中，所述扬声器模组包括钢片和隔磁片，所述隔磁片与所述电池之间形成的所述间隙为第一间隙，所述散热片上与所述第一间隙正对的位置设置有第一开口。
  3. 根据权利要求2所述的电子设备，其中，所述钢片与所述电池之间形成的所述间隙为第二间隙，所述散热片上与所述第二间隙正对的位置设置有第二开口。
  4. 根据权利要求2所述的电子设备，其中，所述隔磁片与所述散热片之间设置有绝缘层。
  5. 根据权利要求4所述的电子设备，其中，所述绝缘层为导热绝缘层。
  6. 根据权利要求4所述的电子设备，其中，所述绝缘层的厚度不小于0.1mm。
  7. 根据权利要求1所述的电子设备，其中，所述散热片为石墨散热片。
  8. 根据权利要求2所述的电子设备，其中，所述隔磁片悬浮设置于所述扬声器模组的音腔上。
  9. 根据权利要求1所述的电子设备，其中，所述开口的尺寸与所述天线的设置位置相关。
  10. 根据权利要求9所述的电子设备，其中，所述天线包括高频天线、中频天线和低频天线，所述高频天线和所述中频天线设置于所述扬声器模组远离所述电池的第一侧，所述低频天线设置于第二侧，所述第二侧与所述第一侧相邻。
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