WO2022021881A1 - 接触式温度传感器 - Google Patents

接触式温度传感器 Download PDF

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Publication number
WO2022021881A1
WO2022021881A1 PCT/CN2021/079713 CN2021079713W WO2022021881A1 WO 2022021881 A1 WO2022021881 A1 WO 2022021881A1 CN 2021079713 W CN2021079713 W CN 2021079713W WO 2022021881 A1 WO2022021881 A1 WO 2022021881A1
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WO
WIPO (PCT)
Prior art keywords
sensor chip
casing
temperature sensor
inclined extension
contact temperature
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Application number
PCT/CN2021/079713
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English (en)
French (fr)
Inventor
肖俊承
王一龙
邵革良
Original Assignee
广东伊戈尔智能电器有限公司
佛山市顺德区伊戈尔电力科技有限公司
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Application filed by 广东伊戈尔智能电器有限公司, 佛山市顺德区伊戈尔电力科技有限公司 filed Critical 广东伊戈尔智能电器有限公司
Publication of WO2022021881A1 publication Critical patent/WO2022021881A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures

Definitions

  • the invention relates to the technical field of temperature detection, in particular to a contact temperature sensor structure for detecting the surface temperature of an electric coil heating body.
  • the common contact temperature sensors on the market are mostly square or cylindrical, usually composed of a sensing chip, an insulating layer and epoxy resin.
  • the insulating sleeve and insulating shell are common insulating layer materials.
  • the sensing chip can be wrapped first.
  • the insulating sleeve or the sensing chip is directly arranged in the insulating casing, and then the sensing chip is encapsulated and fixed in the casing through epoxy resin, so that the sensing chip and the detected element are insulated from each other.
  • the thickness of the insulating layer must be thick enough to maintain a sufficiently large insulating distance between the sensing chip and the detected element, but materials with good insulating properties generally have poor thermal conductivity and are too thick.
  • the insulating layer of the temperature sensor will be detrimental to the rapid and accurate temperature detection of the temperature sensor.
  • the outer insulation layer is generally large and thermally conductive.
  • the outer casing with good performance, but the outer casing with better thermal conductivity will lead to its own large heat capacity, and when the heat of the detected element is transferred to the outer casing, it will quickly spread to other parts of the outer casing element , and then transferred to the induction chip arranged in the middle of the outer casing, which is not conducive to the response speed of the induction chip, seriously affects the control accuracy of the controller, and even causes the heating element to run beyond the set temperature in severe cases. damage.
  • the temperature sensor includes a sensor chip with leads and a casing for encapsulating the sensor chip, the leads extend out of the casing for transmitting electrical signals of the sensor chip; it is characterized in that the casing has a lower surface , viewed from the cross section, the lower surface includes a lower working surface for contact-type detection of the surface temperature of the heating element, and a left inclined extension surface and a right inclined extending surface extending upward from the lower working surface to the left and right sides respectively.
  • the inclined extension surface, the lower working surface and the left inclined extension surface and the right inclined extension surface together define a trapezoidal heat conduction area, and the sensor chip arrangement is bonded to the trapezoidal heat conduction area.
  • the lead refers to the connecting wire connected to the sensor chip and used to transmit the electrical signal of the sensor chip, and the part of the lead connected to the sensor chip is packaged in the sensor chip together with the sensor chip.
  • the lead wire also includes an exposed part exposed outside the casing; in order to protect the lead wire, the lead wire is also covered with a lead wire sleeve, and the lead wire sleeve can Only cover the exposed part of the lead exposed outside the casing, or cover both the exposed part of the lead exposed outside the casing and the part of the lead enclosed in the casing; further In order to prevent the lead wires exposed outside the casing from being damaged due to friction during use, an outer lead wire sleeve can also be added outside the lead wire sleeve.
  • the lower surface in addition to including a working surface disposed on the housing for contacting with the surface of the heating body, also includes the lower working surface that is placed on both sides of the lower working surface and extends obliquely upward.
  • the left inclined extension surface and the right inclined extension surface; from the cross section, the left inclined extension surface and the right inclined extension surface are both inclined surfaces, which is equivalent to cutting off the parts on both sides of the lower left corner and the lower right corner of the housing material, which reduces the heat transfer from the surface of the heating element to the lower left corner and the lower right corner of the casing, so that the heat is transmitted along the casing between the left inclined extension surface and the right inclined extension surface Pass up.
  • the left inclined extension surface and the right inclined extension surface itself may be either straight or slightly arc-shaped when viewed in cross section.
  • the heat conduction area refers to a trapezoidal space area jointly defined by the lower working surface, the left inclined extension surface and the right inclined extension surface, and the heat conduction area can be used to transfer heat; the heating element Under the guidance of the lower working surface and the left inclined extension surface and the right inclined extension surface, the heat will first pass through the heat conduction area and then be transferred upward to other parts of the casing.
  • the heat conduction area is approximately In the shape of a trapezoid that is wide at the top and narrow at the bottom, the heat of the heating element follows the shape of the heat conduction area to form an upward and diffusing path.
  • the sensor chip arrangement is combined with the trapezoidal heat conduction area to define the position of the sensor chip arrangement, and at least part of the sensor chip extends into the heat conduction area or contacts the heat conduction area, so that the The heat radiated from the heating element is transferred to the sensor chip in the shortest possible route.
  • the beneficial technical effect of the present invention is that: by setting a trapezoidal heat conduction area, the sensor chip arrangement is combined with the trapezoidal heat conduction area, and the heat is guided preferentially into the trapezoidal heat conduction area.
  • the heat conduction area is preferentially transferred to the sensor chip, which improves the speed and accuracy of the response.
  • the left inclined extension surface or/and the right inclined extension surface respectively have one step.
  • the step is arranged on the left inclined extension surface or the right inclined extension surface, and includes a step plane which is substantially parallel to the lower working surface and faces the surface of the detected heating element and a surface along the step. The plane starts from the side of the step that extends downward obliquely to the lower working surface; the step arrangement includes the following two situations, the first is that the step is only arranged in the left inclined extension surface or the right inclined extension surface. On the surface of one of the two, the steps are simultaneously arranged on the left inclined extension surface and the right inclined extension surface at the same time.
  • a top trapezoidal bump is formed by making the trapezoidal heat conduction area close to one end of the lower working surface.
  • the heat from the heating body is first transferred to the top trapezoidal bumps of the heat conduction area through the lower working surface, and then the top trapezoidal bumps are further transferred to the top trapezoidal bumps to make the heat transfer more efficient. It is transmitted to the sensor chip close to the heat conduction area in a concentrated direction, thereby improving the detection response speed of the sensor chip.
  • the housing In order to facilitate the installation and fixation of the housing, the housing also has an upper surface, and the upper surface is parallel to the lower working surface. In this way, by applying a pressing force to the upper surface, the casing can be easily pressed and fixed on the surface of the heating element, and at the same time, the lower working surface of the casing can be connected to the heating element. The surface fits better, which is conducive to heat transfer.
  • the width of the upper surface is equal to the width of the lower surface.
  • the width of the lower surface refers to the total width of the projection of the lower working surface, the left inclined extension surface and the right inclined extension face to the plane where the lower working surface is located. It is beneficial to cooperate with other fastening parts to press and fix the casing.
  • the width of the housing is greater than the height so as to be flat.
  • the casing is elongated and its front end is closed, the leads extend from the rear end of the casing, and the sensor chip is arranged near the front end of the casing s position.
  • the elongated casing can well fix and protect the sensor chip and part of the leads connected to the sensor chip, and the closed front end of the casing can allow the sensor chip to be positioned It is arranged at a position close to the front end of the casing, and such beneficial effects are that, in the first aspect, it is conducive to the installation of the sensor chip; in the second aspect, the position of the sensor chip is well fixed, which is beneficial to the When fixing the housing, let the sensor chip close to the desired temperature measurement point; thirdly, extending the lead wire from the rear end of the housing can keep the lead wire away from the temperature measurement point with higher temperature , which is beneficial to protect the leads.
  • the rear end of the housing is further provided with a positioning plate, and the lead wires extend through the positioning plate and are positioned on the positioning plate.
  • the positioning plate provided at the rear end of the casing not only facilitates the positioning of the casing during installation, but also can be used to fix the lead wires extending from the rear end of the casing to keep the lead wires away from the heat generation body surface and reduce friction caused by the wobble of the leads.
  • the shell is filled with thermally conductive material.
  • the thermally conductive material is conducive to quickly transferring the heat transferred from the casing to the sensor chip, which greatly improves the response speed of the sensor chip.
  • the present invention has the above-mentioned features and advantages, it can be applied to a contact temperature sensor.
  • FIG. 1 is a schematic diagram of the axial direction structure of a contact temperature sensor applying the technical solution of the present invention
  • FIG. 2 is a schematic view of the structure of the contact temperature sensor applying the technical solution of the present invention, showing the structural relationship between the sensor chip and the housing;
  • FIG. 3 is a schematic cross-sectional structure diagram taken along the A-A direction in FIG. 2 , showing the structure of the casing and a schematic diagram of a heat transfer path;
  • FIG. 4 is a partial enlarged view of the M part in FIG. 3 , showing a dimensional relationship diagram of the structure of the heat conduction area.
  • the present invention proposes a contact temperature sensor, as shown in FIG. 1 and FIG. 2 , generally, the contact temperature sensor is arranged on the surface of the heating body 1, and the contact temperature sensor is induced by the heating body The heat transferred from the surface 1 is converted into electrical signals representing different temperature values, and is conducted outward through the lead 3 .
  • the contact temperature sensor includes a sensor chip 4 with leads 3 and a housing 2 encapsulating the sensor chip 4 .
  • the sensor chip 4 includes a chip body 41 sealed and packaged and electrode pins 42 , and the electrode pins 42 are connected to the leads 3 .
  • the casing 2 is a thin casing made of engineering plastics with high temperature resistance, good electrical insulation and good thermal conductivity.
  • the casing 2 and the sensor chip 4 are generally packaged in the following two ways :
  • the first is an integral molding injection method, in which the sensor chip 4 and the casing 2 are integrally formed and injected, and the casing 2 can completely seal the sensor chip 4;
  • the second is to inject the casing first Body 2, the casing 2 is provided with a cavity for accommodating the sensor chip 4, the sensor chip 4 is first placed in the cavity, and then a packaging material (such as a ring) is poured into the cavity Oxygen resin glue) for sealing and curing.
  • a packaging material such as a ring
  • the lead 3 extends out of the housing 2 for transmitting the electrical signal of the sensor chip 4 , wherein the lead 3 is connected to the sensor chip 4 , so part of the lead 3 is together with the sensor chip 4 It is encapsulated in the casing 2, and the casing 2 or the packaging material has good insulation performance, so the connection electrode part of the lead 3 and the sensor chip 4 can directly pass through when there is a sufficient safety distance. Encapsulation material for insulating isolation. However, in order to ensure the normal signal transmission of electrical signals through the lead 3, the lead sleeve 31 is sleeved on the exposed part of the lead 3 exposed outside the casing 2, or the lead 3 is exposed where the lead 3 is exposed.
  • the exposed part outside the casing 2 and the part of the lead wire 3 encapsulated in the casing 2 are sleeved with the lead wire sleeve 31, so that the lead wire 3 can be well insulated and isolated, and the signal transmission can be ensured. effectiveness.
  • the casing 2 is in the shape of a long strip and its front end is closed, the leads 3 extend from the rear end of the casing 2 , and the sensor chip 4 is arranged close to The position of the front end of the housing 2.
  • the elongated casing 2 can well fix and protect the sensor chip 4 and part of the leads 3 connected to the sensor chip 4 , and the closed front end of the casing 2 allows The sensor chip 4 is positioned close to the front end of the housing 2 .
  • extending the lead 3 from the rear end of the housing 2 can keep the lead 3 away from the temperature measurement point with a higher temperature, which is beneficial to protect the lead 3 .
  • the lead 3 is prone to friction with the rear end of the housing 2 , or the lead 3 is also prone to friction with the fixing component when it is fixed. In this way, an outer lead sleeve can be added outside the lead 3 . tube 32 to protect the lead 3 .
  • the casing 2 has a lower surface 29 .
  • the lower surface 29 includes a lower working surface 21 for contact-type detection of the surface temperature of the heating element 1 and a lower surface 21 from the lower surface 29 .
  • the lower working surface 21 starts from a left inclined extending surface 22 and a right inclined extending surface 23 which extend upwards obliquely to the left and right sides respectively.
  • the lower working surface 21 is the surface in contact with the surface of the heating body 1, and the heat of the heating element 1 is transferred upward through the lower working surface 21.
  • This heat transfer structure is simple and stable, which is conducive to heat transmission.
  • the left inclined extension surface 22 and the right inclined extension surface 23 are provided, this is equivalent to cutting part of the material on both sides of the lower left corner and the lower right corner of the housing 2 , which reduces the amount of material from the surface of the heating body 1 .
  • the transferred heat is transferred to the left and right sides of the casing 2, so that the heat is mainly transferred upward along the casing between the left inclined extension surface 22 and the right inclined extension surface 23, thus shortening the heat transfer path, It is beneficial to control the heat transfer to the specified direction.
  • the lower working surface 21 and the left inclined extending surface 22 and the right inclined extending surface 23 together define a trapezoidal heat conduction area 24 .
  • the heat conduction area 24 is a space area jointly defined by the lower working surface 21 , the left inclined extension surface 22 and the right inclined extension surface 23 , and the space area can transfer heat.
  • the heat of the heating body 1 will be first transferred to the heat conduction area 24 and then transferred upward to other parts of the housing 2 .
  • the heat conduction area 24 is roughly in the shape of a trapezoid that is wide at the top and narrow at the bottom, and the heat of the heating element 1 follows the shape of the heat conduction area to form an upwardly diffusing transfer path.
  • the sensor chip 4 is arranged and bonded to the trapezoidal heat conduction area 24 , so that the heat transferred by the heating body 1 is directly transferred to the sensor chip 4 through the heat conduction area 24 , reducing the length of time.
  • the heat transfer distance between the sensor chip 4 and the heating body 1 greatly improves the response speed of the sensor chip 4 .
  • the left inclined extension surface 22 or/and the right inclined extension surface 23 respectively have one level of steps ( 221 , 231 ).
  • the arrangement of the steps (221, 231) may include the following two situations. The first is that the step 221 is only arranged on the left inclined extension surface 22, or the step 231 is only arranged on the right inclined extension. The second is that the steps ( 221 , 231 ) are simultaneously arranged on the left inclined extension surface 22 or the right inclined extension surface 23 respectively.
  • the step 221 provided on the left inclined extension surface 22 includes a left side that is substantially parallel to the lower working surface 21 and faces the detected heating element 1 .
  • the step plane 2211 and the left step side surface 2212 extending obliquely downward along the left step plane 2211 toward the lower working surface 21 are substantially parallel to the left step side surface 2212;
  • the step 231 on the right inclined extension surface 23 includes a right step plane 2311 that is substantially parallel to the lower working surface 21 and faces the detected heating element 1, and a right step plane 2311 starts from the right step plane 2311 to the lower side.
  • the right stepped side surface 2312 of the working surface 21 is inclined downwardly extending, and the right stepped side surface 2312 is substantially parallel to the left inclined extending surface 23 .
  • the arrangement shapes of the steps (221, 231) are various.
  • the steps ( 221 , 231 ) make the trapezoidal heat conduction area 24 a convex shape, and form a top trapezoidal bump at one end of the lower working surface 21 , so that the heat from the heating element 1 passes through the lower working surface 21 .
  • the housing 2 further has an upper surface 25 , and the upper surface 25 is parallel to the lower working surface 21 .
  • the width of the upper surface 25 is equal to the width of the lower surface 29 .
  • the width of the lower surface 29 refers to the total width of the projection of the lower working surface 21 , the left inclined extension surface 22 and the right inclined extension surface 23 to the plane where the lower working surface 21 is located.
  • the width of the upper surface 25 is favorable for other fastening parts to press and fix the casing 2 .
  • the upper surface 25 is provided with a compression spring or elastic sheet to press the casing 2 on the surface of the heating body 1 .
  • the casing 2 has a width greater than a height and thus is flat. Under the condition of ensuring sufficient strength and safe insulation distance of the casing 2, the materials used for the casing 2 are reduced as much as possible, so that the casing 2 is formed into a thin shell, which is conducive to reducing the number of the casing 2. In this way, it is beneficial to ensure the detection response speed of the sensor chip 4 .
  • the rear end of the housing 2 is further provided with a positioning plate 26 , and the lead 3 extends through the positioning plate 26 and is positioned on the positioning plate 26 .
  • the positioning plate 26 provided at the rear end of the casing 2 can not only be used to position or fix the casing 2, but also can be used to fix the lead wires 3 extending from the rear end of the casing 2 to allow the The lead 3 is kept away from the surface of the heating body 1 and the friction between the lead 3 and the positioning plate 26 is reduced.
  • the casing 2 is filled with thermally conductive material.
  • the thermally conductive material is beneficial to quickly transfer the heat transferred from the casing 2 to the sensor chip 4 , which greatly improves the response speed of the sensor chip 4 .
  • each structural surface of the convex heat conduction area 24 on the casing and the sensor chip 4 is optimized as follows:
  • the package size of the sensor chip 4 (including the packaging resin) is a;

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  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

接触式温度传感器，包括带引线（3）的传感器芯片（4）和封装传感器芯片（4）的壳体（2），引线（3）延伸出壳体（2）用于传递传感器芯片（4）的电信号；壳体（2）具有下表面（29），从横截面上看，下表面（29）包括用于接触式检测发热体（1）表面温度的下工作表面（21）以及从下工作表面（21）出发分别向左右两个侧边倾斜向上延伸的左倾斜延伸面（22）和右倾斜延伸面（23），下工作表面（21）与左倾斜延伸面（22）和右倾斜延伸面（23）共同定义了一个呈梯形的热传导区（24），传感器芯片（4）布置结合到呈梯形的热传导区（24）。通过设置呈梯形的热传导区（24），传感器芯片（4）布置结合到呈梯形的热传导区（24），引导热量优先进入到热传导区（24）并优先传递给传感器芯片（4），提高了响应的速度和精度。

Description

接触式温度传感器 技术领域
本发明涉及温度检测技术领域，特别涉及用于检测电线圈发热体表面温度的接触式温度传感器结构。
 背景技术
为了保证具有发热体的产品例如具有电线圈的电源适配器、变压器、整流器等能够正常安全地运行，一般需要控制发热体运行在设定的温度范围内以防止发热体因超出设定温度而造成损坏。常见的用于检测发热体表面温度的方式有接触式检测与非接触式检测，其中接触式检测因其结构简单、检测稳定以及成本较低的优点而广受用户欢迎。
市面上常见的接触式温度传感器多为方形或圆柱形，通常是由感应芯片、绝缘层以及环氧树脂组成，绝缘套管与绝缘壳体是常见的绝缘层材质，所述感应芯片可以先包裹绝缘套管，或者感应芯片直接设置于绝缘壳体中，然后通过环氧树脂把所述感应芯片封装固定于壳体中，使所述感应芯片与所述被检测元件形成绝缘隔离。为了取得良好的电气安全距离，绝缘层的厚度要足够厚才能使所述感应芯片与所述被检测元件保持足够大的绝缘距离，但绝缘性能好的材料，其导热性能一般较差，过厚的绝缘层会不利温度传感器快速、精确地实现温度检测。为了提高温度检测的精确性，后来人们使用了薄型的绝缘材料对所述感应芯片进行封装，但为了便于温度传感器的安装以及提高电极引线的绝缘效果，在绝缘层外一般套装体积较大且导热性能良好的外壳体，但这个导热较好的所述外壳体会导致其自身形成较大的热容量，当被检测元件的热量传递到所述外壳体后会快速扩散到所述外壳体元件的其它部位，然后再传递到设置于所述外壳体中部的所述感应芯片，这样不利于感应芯片的响应速度，严重影响控制器的控制精确度，严重时还会造成发热体超出设定温度运行而造成损坏。
 技术解决方案
针对现有温度传感器检测精度不准确、响应速度慢的技术问题，本发明提出一种接触式温度传感器。该温度传感器包括带引线的传感器芯片和封装所述传感器芯片的壳体，所述引线延伸出所述壳体用于传递所述传感器芯片的电信号；其特征在于，所述壳体具有下表面，从横截面上看，所述下表面包括用于接触式检测发热体表面温度的下工作表面以及从所述下工作表面出发分别向左右两个侧边倾斜向上延伸的左倾斜延伸面和右倾斜延伸面，所述下工作表面与所述左倾斜延伸面和右倾斜延伸面共同定义了一个呈梯形的热传导区，所述传感器芯片布置结合到所述呈梯形的热传导区。
其中，所述引线，是指连接在所述传感器芯片上并用于传递所述传感器芯片的电信号连接线，连接在所述传感器芯片上的部分所述引线与所述传感器芯片一起封装于所述壳体中，而为了向外传递电信号，所述引线还包括露在所述壳体外的外露部分；为了保护所述引线，所述引线外还套有引线套管，所述引线套管可以只套在所述引线露在所述壳体外的外露部分，也可以既套在所述引线露在所述壳体外的外露部分又套在所述引线封装于所述壳体中的部分；进一步的，为了防止露在所述壳体外的所述引线在使用时因摩擦而损伤，还可以在所述引线套管外再增加外引线套管。
其中，所述下表面，除了包括设置于所述壳体上用于与所述发热体表面相接触下的工作表面，还包括分置于所述下工作表面两侧并倾斜向上延伸的所述左倾斜延伸面和右倾斜延伸面；从横截面上看，所述左倾斜延伸面和右倾斜延伸面均为斜面，这相当于切减了所述壳体左下角与右下角两侧的部分材料，这减少了从所述发热体表面传递而来的热量向所述壳体左下角与右下角两侧传递，使热量沿着所述左倾斜延伸面和右倾斜延伸面之间的壳体向上传递。所述左倾斜延伸面和右倾斜延伸面本身，从横截面上看既可以是直线状的也可呈稍微的弧形状。
其中，所述热传导区，是指由所述下工作表面与所述左倾斜延伸面和右倾斜延伸面共同界定的呈梯形的空间区域，所述热传导区能够用于传递热量；所述发热体的热量在所述下工作表面与所述左倾斜延伸面和右倾斜延伸面的引导下，会首先经过所述热传导区再向上传递到所述壳体的其它部分，另外，所述热传导区大致呈上宽下窄的梯形，所述发热体的热量跟随所述热传导区的形状形成向上并呈扩散状传递的路径。
其中，所述传感器芯片布置结合到所述呈梯形的热传导区，定义了所述传感器芯片布置的位置，至少部分所述传感器芯片伸入到所述热传导区或接触到所述热传导区，让从所述发热体辐射出来的热量以尽可能短的路线传递给所述传感器芯片。
根据上述技术方案，与现有技术相比，本发明的有益技术效果在于：通过设置呈梯形的热传导区，所述传感器芯片布置结合到所述呈梯形的热传导区，引导热量优先进入到所述热传导区并优先传递给所述传感器芯片，提高了响应的速度和精度。
为了进一步提高所述传感器芯片的响应速度，所述左倾斜延伸面或/和所述右倾斜延伸面分别具有一级台阶。其中，所述台阶设置于所述左倾斜延伸面或所述右倾斜延伸面上，包括有与所述下工作表面基本平行的朝向所述被检测的发热体表面的台阶平面以及沿所述台阶平面出发向所述下工作表面倾斜向下延伸的台阶侧面；所述台阶设置方式包括以下两种情况，第一种是台阶只设置在所述左倾斜延伸面或所述右倾斜延伸面的其中之一的表面上，第二种是所述台阶同时分别设置在所述左倾斜延伸面和所述右倾斜延伸面上。通过在所述左倾斜延伸面或/和所述右倾斜延伸面设置所述台阶，让所述梯形的热传导区靠近所述下工作表面的一端形成顶部梯形凸块。这样，在进一步减少所述壳体用料的同时，由所述发热体的热量通过所述下工作表面首先传递到所述热传导区的顶部梯形凸块，再由所述顶部梯形凸块以更为集中的方向传递向靠近所述热传导区的所述传感器芯片，从而提高所述传感器芯片检测响应速度。
为了便于所述壳体的安装与固定，所述壳体还具有上表面，所述上表面平行于所述下工作表面。这样，通过向所述上表面施加作压紧用力就能够方便地把所述壳体紧压固定在所述发热体的表面上，同时也让所述壳体的下工作表面与所述发热体的表面更好地贴合，有利于热量传递。
进一步的，所述上表面的宽度等于所述下表面的宽度。其中，所述下表面的宽度是指所述下工作表面、左倾斜延伸面以及所述右倾斜延伸面向所述下工作表面所在平面的投影的总宽度，通过较大的所述上表面宽度有利于与其它紧固零件相配合以压紧固定所述壳体。
进一步的，为了减少所述壳体的热容量，所述壳体的宽度大于高度从而呈扁平状。所述壳体在保证有足够的强度与安全绝缘距离的条件下，尽量的减少所述壳体的用料有利于减少所述壳体的热容量，这样，有利于保证所述传感器芯片的检测响应速度。
为了便于所述传感器芯片的安装，进一步的，所述壳体呈长条状其前端封闭，所述引线从所述壳体的后端延伸出来，所述传感器芯片布置在靠近所述壳体前端的位置。其中，呈长条状的所述壳体能够很好的固定与保护所述传感器芯片以及连接在所述传感器芯片上的部分引线，而所述壳体的前端封闭则能够让所述传感器芯片定位设置在靠近所述壳体的前端部的位置，这样的有益效果在于，第一方面，有利于所述传感器芯片的安装；第二方面，很好地固定了所述传感器芯片的位置，有利于在固定所述壳体时让所述传感器芯片靠近希望的测温点；第三方面，让所述引线从所述壳体的后端延伸出来能够让所述引线远离温度较高的测温点，有利于保护引线。
进一步的，所述壳体后端还设置有定位板，所述引线穿过所述定位板延伸出来并定位在所述定位板上。这样，设置在所述壳体后端定位板，不但有利于所述壳体安装时的定位，还能够用于固定从所述壳体后端延伸出来的引线以让所述引线远离所述发热体表面以及减少所述引线的摆动所产生的摩擦。
进一步的，所述壳体内填充有导热材料。所述导热材料有利于把所述壳体传递而来的热量快速地传递到所述传感器芯片上，大大提高了所述传感器芯片的响应速度。
由于本发明具有上述特点和优点，为此可以应用到接触式温度传感器中。
 附图说明
图1是应用本发明技术方案的接触式温度传感器的轴侧方向结构示意图；
图2是应用本发明技术方案的接触式温度传感器的府视方向结构示意图，显示所述传感器芯片与壳体的结构关系；
图3是图2中的A-A方向的剖面结构示意图，显示所述壳体的结构以及热传递路径示意图；
图4是图3中的M部的局部放大图，显示热传导区结构的尺寸关系图。
 本发明的实施方式
下面结合附图对应用本发明技术方案的接触式温度传感器的结构作进一步的说明。
本发明提出一种接触式温度传感器，如图1与图2所示，一般地，所述接触式温度传感器布置于发热体1的表面上，所述接触式温度传感器通过感应由所述发热体1表面传递而来的热量并转变为代表不同温度值的电信号，并通过所述引线3向外传导。所述接触式温度传感器包括带引线3的传感器芯片4和封装所述传感器芯片4的壳体2。其中，所述传感器芯片4包括密封封装的芯片主体41以及电极引脚42，所述电极引脚42与所述引线3相连接。其中，所述壳体2由耐高温、电气绝缘性良好并具有良好导热能力的工程塑料制成的薄形壳体，所述壳体2与所述传感器芯片4的封装方式一般包括以下两种：第一种为一体成形注塑方式，所述传感器芯片4与所述壳体2为一体成形注塑，所述壳体2能够完全密封地包裹住所述传感器芯片4；第二种为先注塑好壳体2，所述壳体2上设置有的容纳所述传感器芯片4的腔体，所述传感器芯片4先放置到所述腔体中，再向所述腔体中灌入封装材料（如环氧树脂胶）进行密封固化。所述引线3延伸出所述壳体2用于传递所述传感器芯片4的电信号，其中所述引线3连接在所述传感器芯片4上，故部分所述引线3与所述传感器芯片4一起封装于所述壳体2中，而壳体2或封装材料具有较好的绝缘性能，故所述引线3与所述传感器芯片4的连接电极部在具有足够的安全距离的情况下可以直接通过封装材料进行绝缘隔离。然而，为了保证电信号通所述引线3能够进行正常的信号传送，在所述引线3露在所述壳体2外的外露部分套接引线套管31，或者在所述引线3露在所述壳体2外的外露部分以及在所述引线3封装于所述壳体2中的部分均套接引线套管31，这样能够很好地让所述引线3形成绝缘隔离，保障信号传送的有效性。
为了便于所述传感器芯片4的安装，进一步的，所述壳体2呈长条状其前端封闭，所述引线3从所述壳体2的后端延伸出来，所述传感器芯片4布置在靠近所述壳体2前端的位置。其中，呈长条状的所述壳体2能够很好地固定与保护所述传感器芯片4以及连接在所述传感器芯片4上的部分引线3，而所述壳体2的前端封闭则能够让所述传感器芯片4定位设置在靠近所述壳体2的前端部的位置。另一方面，让所述引线3从所述壳体2的后端延伸出来能够让所述引线3远离温度较高的测温点，有利于保护引线3。进一步的，所述引线3与所述壳体2的后端部容易产生摩擦，或者所述引线3在固定时也容易与固定部件产生摩擦，这样，可以在所述引线3外增加外引线套管32以保护所述引线3。
如图1～图4所示，所述壳体2具有下表面29，从横截面上看，所述下表面29包括用于接触式检测发热体1表面温度的下工作表面21以及从所述下工作表面21出发分别向左右两个侧边倾斜向上延伸的左倾斜延伸面22和右倾斜延伸面23。其中，所述下工作表面21是与所述发热体1表面相接触的表面，由所述发热1的热量通过所述下工作表面21向上传递，这种热量传递结构简单而且稳定，有利于热量的传递。而由于设置有所述左倾斜延伸面22和右倾斜延伸面23，这相当于切减了所述壳体2左下角与右下角两侧的部分材料，这减少了从所述发热体1表面传递而来的热量向所述壳体2左右两侧传递，使得热量主要沿着所述左倾斜延伸面22和右倾斜延伸面23之间的壳体向上传递，这样减短热量传递的路径，有利于控制热量向指定的方向传递。所述下工作表面21与所述左倾斜延伸面22和右倾斜延伸面23共同定义了一个呈梯形的热传导区24。其中所述热传导区24由所述下工作表面21、所述左倾斜延伸面22和右倾斜延伸面23共同界定的空间区域，该空间区域能够传递热量，所述下工作表面21与所述发热体1表面相接触，所述发热体1的热量会首先传递到所述热传导区24再向上传递到所述壳体2的其它部分。如图3所示，所述热传导区24大致呈上宽下窄的梯形，所述发热体1的热量跟随所述热传导区的形状形成向上呈扩散状的传递路径。进一步的，所述传感器芯片4布置结合到所述呈梯形的热传导区24，这样由所述发热体1传递上来的热量通过所述热传导区24直接传递到所述传感器芯片4上，减短了所述传感器芯片4与所述发热体1之间的热传递距离，从而大大提高所述传感器芯片4的响应速度。
为了进一步提高所述传感器芯片4的响应速度，所述左倾斜延伸面22或/和所述右倾斜延伸面23分别具有一级台阶（221，231）。所述台阶（221，231）的设置可以是包括以下两种情况，第一种是所述台阶221只设置在所述左倾斜延伸面22，或所述台阶231只设置在所述右倾斜延伸面23的其中之一的表面上；第二种是所述台阶（221，231）同时分别设置在所述左倾斜延伸面22或所述右倾斜延伸面23上。如图3所示，在本实施例中，设置在所述左倾斜延伸面22上的所述台阶221包括有与所述下工作表面21基本平行且朝向所述被检测的发热体1的左台阶平面2211以及沿所述左台阶平面2211出发向所述下工作表面21倾斜向下延伸的左台阶侧面2212，所述左台阶侧面2212与所述左倾斜延伸面22基本平行；设置在所述右倾斜延伸面23上的所述台阶231包括有与所述下工作表面21基本平行且朝向所述被检测的发热体1的右台阶平面2311以及沿所述右台阶平面2311出发向所述下工作表面21倾斜向下延伸的右台阶侧面2312，所述右台阶侧面2312与所述左倾斜延伸面23基本平行。当然，在其它实施例中所述台阶（221，231）的设置形状是多样的。所述台阶（221，231）让所述梯形的热传导区24呈凸字形，并在下工作表面21的一端形成顶部梯形凸块，这样，由所述发热体1的热量通过所述下工作表面21首先传递到所述热传导区24的顶部梯形凸块，再由所述顶部梯形凸块以更为集中的传递路径向靠近所述热传导区24的所述传感器芯片4传递，从而提高所述传感器芯片4检测响应速度。
为了便于对所述壳体2进行固定，所述壳体2还具有上表面25，所述上表面25平行于所述下工作表面21。这样，通过向所述上表面25施加压紧作用力就能够把所述壳体2压紧在所述发热体1上，从而让所述壳体2的下工作表面21与所述发热体1的表面更好地贴合。进一步的，所述上表面25的宽度等于所述下表面29的宽度。其中，所述下表面29的宽度是指所述下工作表面21、左倾斜延伸面22以及所述右倾斜延伸面23向所述下工作表面21所在平面的投影的总宽度，通过较大的所述上表面25宽度有利于让其它紧固零件压紧固定所述壳体2。在其中一种实施例中，在所述上表面25上通过设置有压紧弹簧或弹片把所述壳体2压紧在所述这发热体1的表面上。
进一步的，为了减少所述壳体2的热容量，所述壳体2的宽度大于高度从而呈扁平状。所述壳体2在保证有足够的强度与安全绝缘距离的条件下，尽量的减少所述壳体2的用料，使所述壳体2形成薄形的外壳有利于减少所述壳体2的热容量，这样，有利于保证所述传感器芯片4的检测响应速度。
进一步的，所述壳体2后端还设置有定位板26，所述引线3穿过所述定位板26延伸出来并定位在所述定位板26上。这样，设置在所述壳体2后端定位板26，不但可以用于定位或固定所述壳体2，还能够用于固定从所述壳体2后端延伸出来的引线3以让所述引线3远离所述发热体1表面以及减少所述引线3与所述定位板26之间的摩擦。
进一步的，所述壳体2内填充有导热材料。所述导热材料有利于把所述壳体2传递而来的热量快速地传递到所述传感器芯片4上，大大提高了所述传感器芯片4的响应速度。
为了让所述壳体2形成较薄的外壳并让所述传感器芯片4具有足够的绝缘安全距离，进一步提高所述温度传感器的响应速度以及测量精度，如图4所示，本实施例对所述壳体上呈凸形热传导区24各结构面与所述传感器芯片4之间的位置尺寸关系作如下优化设计：
1）其中所述传感器芯片4（含封装树脂）的封装尺寸为a；
2）所述下工作表面21与所述发热体1表面相接触的宽度b与所述传感器芯片4的封装尺寸a的关系：0.5a<b<1.5a；
3）所述下工作表面21与所述传感器芯片4之间的垂直最短距离h与所述传感器芯片4的封装尺寸a的关系：0.3mm<h<1/3a；
4）所述左台阶侧面2212与所述传感器芯片4之间的垂直最短距离为h1，所述右台阶侧面2312与所述传感器芯片4之间的垂直最短距离为h2，h1、h2与h的关系：0.5h<（h1或h2）<2h；
5）所述下工作表面21与所述左台阶平面2211或右台阶平面2311之间的距离c与h的关系：0.5h<c<2h；
6）所述左台阶平面2211或右台阶平面2311的宽度d与b的关系：0<d<2b。

Claims (8)

  1. 接触式温度传感器，包括带引线的传感器芯片和封装所述传感器芯片的壳体，所述引线延伸出所述壳体用于传递所述传感器芯片的电信号；其特征在于，所述壳体具有下表面，从横截面上看，所述下表面包括用于接触式检测发热体表面温度的下工作表面以及从所述下工作表面出发分别向左右两个侧边倾斜向上延伸的左倾斜延伸面和右倾斜延伸面，所述下工作表面与所述左倾斜延伸面和右倾斜延伸面共同定义了一个呈梯形的热传导区，所述传感器芯片布置结合到所述呈梯形的热传导区。
  2. 根据权利要求1所述的接触式温度传感器，其特征在于，所述左倾斜延伸面或/和所述右倾斜延伸面分别具有一级台阶。
  3. 根据权利要求1所述的接触式温度传感器，其特征在于，所述壳体还具有上表面，所述上表面平行于所述下工作表面。
  4. 根据权利要求3所述的接触式温度传感器，其特征在于，所述上表面的宽度等于所述下表面的宽度。
  5. 根据权利要求3所述的接触式温度传感器，其特征在于，所述壳体的宽度大于高度从而呈扁平状。
  6. 根据权利要求1到5任一所述的接触式温度传感器，其特征在于，所述壳体呈长条状其前端封闭，所述引线从所述壳体的后端延伸出来，所述传感器芯片布置在靠近所述壳体前端的位置。
  7. 根据权利要求6所述的接触式温度传感器，其特征在于，所述壳体后端还设置有定位板，所述引线穿过所述定位板延伸出来并定位在所述定位板上。
  8. 根据权利要求1到5任一所述的接触式温度传感器，其特征在于，所述壳体内填充有导热材料。
PCT/CN2021/079713 2020-07-29 2021-03-09 接触式温度传感器 WO2022021881A1 (zh)

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