WO2022017027A1 - 可拉伸显示面板及其制作方法 - Google Patents

可拉伸显示面板及其制作方法 Download PDF

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Publication number
WO2022017027A1
WO2022017027A1 PCT/CN2021/098957 CN2021098957W WO2022017027A1 WO 2022017027 A1 WO2022017027 A1 WO 2022017027A1 CN 2021098957 W CN2021098957 W CN 2021098957W WO 2022017027 A1 WO2022017027 A1 WO 2022017027A1
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Prior art keywords
layer
substrate
color filter
film layer
display unit
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PCT/CN2021/098957
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English (en)
French (fr)
Inventor
王国强
薛金祥
孙中元
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京东方科技集团股份有限公司
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Priority to US17/919,393 priority Critical patent/US20230165103A1/en
Publication of WO2022017027A1 publication Critical patent/WO2022017027A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the technical field of stretchable display, and in particular, the present disclosure relates to a stretchable display panel and a manufacturing method thereof.
  • Stretch display as a new type of display device, has high stretching ratio and high-resolution display effect.
  • the stretch display design adopts the connection method of islands (display units) and bridges (connecting units), and forms a hollow area in the display area to have stretchability.
  • the existing tensile structure adopts a color filter-on-light-emitting substrate (COE) structure.
  • COE color filter-on-light-emitting substrate
  • a color filter protective layer (CF Cover) can be used. ) to perform a hollowing process for the hard mask, so that the influence of the deposition of the column support protective layer (PS Cover) on the characteristics of the low temperature polysilicon (LTPS) thin film transistor (TFT) and the effect of the second anode sublayer (AND2) can be effectively avoided.
  • PS Cover column support protective layer
  • LTPS low temperature polysilicon
  • TFT thin film transistor
  • AND2 second anode sublayer
  • the present disclosure proposes a method of fabricating a stretchable display panel.
  • the method includes: providing a substrate, and the substrate includes a display unit, a connection unit and a hollow area, and the hollow area is disposed between the display unit and the connection unit forming each film layer structure on the substrate, and the orthographic projection of each film layer structure on the substrate falls within the display unit, the connection unit and the hollow area; in the Each film layer structure is far away from the surface of the substrate to form a first planarization layer; a color filter layer is formed on the side of the first planarization layer away from the substrate, and the color filter layer is on the side of the first planarization layer away from the substrate.
  • the orthographic projection on the substrate falls into the display unit; a color filter protection layer is formed on the side of the color filter layer away from the substrate, and the color filter protection layer only covers the display unit and all the the connecting unit; performing an ashing process on the hollow area not covered by the color filter protection layer, and removing the first planarization layer and the respective film layer structures in the hollow area.
  • the color filter layer be fabricated on one side of the light-emitting substrate, but also the color filter protective layer can be used as a hard mask to perform an ashing process to form a hollow area.
  • the influence of the deposition of the columnar support protective layer on the characteristics of the low-temperature polysilicon thin film transistor and the problem of damage to the anode caused by etching can be effectively avoided.
  • the method further includes: forming a black matrix layer between the color filter layer and the color filter protection layer, and the black matrix layer covers part of the color filter layer;
  • the substrate is peeled off from each film layer structure, and a back film is attached to the surface of each film layer structure away from the color filter layer.
  • the step of forming each film layer structure includes: forming a flexible base, a flexible base protective layer, a thin film transistor structure and a second planarization layer on the substrate, wherein the thin film transistor structure forming inside the display unit; forming a source-drain electrode protection layer on the surface of the thin film transistor structure away from the substrate; forming an organic light-emitting structure and a columnar supporter on the surface of the thin film transistor structure away from the substrate , and the orthographic projections of the organic light-emitting structure and the columnar support on the substrate all fall within the display unit.
  • the step of forming the organic light-emitting structure includes: forming a light-emitting layer by vapor deposition through an open mask, and the light-emitting layer is formed of a white light organic light-emitting material.
  • the orthographic projection of the color filter layer on the substrate overlaps with the orthographic projection of the light-emitting layer on the substrate.
  • the first planarization layer directly covers a surface of the columnar support away from the substrate.
  • the anode in the organic light emitting diode structure is formed at one time.
  • the present disclosure proposes a stretchable display panel.
  • the stretchable display panel includes a display unit, a connecting unit and a hollow area, and the hollow area is disposed between the display unit and the connecting unit, and the stretchable display panel
  • the extension display panel includes: each film layer structure, the each film layer structure is inside the display unit and the connection unit; a first planarization layer, the first planarization layer is arranged on the each film layer structure one side, and the orthographic projection of the first planarization layer on the film layer structures falls within the display unit and the connection unit; a color filter layer, the color filter layer is arranged on the The first planarization layer is away from the side of each film layer structure, and the color filter layer is orthographically projected on each film layer structure and falls into the display unit; the color filter protection layer, the color filter The protective layer is arranged on the side of the color filter layer away from the respective film layer structures, and only covers the display unit and the connection unit.
  • the hollow area is formed by an ashing process using the color filter protection layer as a hard mask.
  • the low temperature polysilicon thin film transistor can have better characteristics and less damage to the anode, so that the The production yield of the stretchable display panel is higher, and the color filter layer can also be designed on one side of the light-emitting substrate, thereby making the thickness of the display panel thinner.
  • stretchable display panel may also have the following additional technical features:
  • the stretchable display panel further includes: a substrate, the substrate is disposed on a surface of each film layer structure away from the first planarization layer.
  • the stretchable display panel further includes: a back film attached to a surface of each film layer structure away from the first planarization layer.
  • each film layer structure includes a laminated flexible substrate, a flexible substrate protective layer, a thin film transistor structure, a second planarization layer, a source-drain electrode protective layer, an organic light-emitting structure, and a columnar supporter, wherein , the orthographic projections of the flexible substrate, the flexible substrate protective layer and the second planarization layer on the respective film layer structures fall within the display unit and the connection unit, and the thin film transistor structure , the orthographic projections of the organic light-emitting structure and the columnar support on the respective film layer structures fall within the display unit.
  • the light-emitting layers of the organic light-emitting structure are all formed of white light organic light-emitting materials, and the color filter layer is orthographically projected on the respective film layer structures and the light-emitting layer is on the respective film layers. Structurally orthographic overlap.
  • the first planarization layer directly covers a surface of the columnar support away from the flexible substrate.
  • the anode in the organic light emitting diode structure is formed of an integrated material.
  • Figure 1 is a photo of a normal anode (a) and a damaged anode (b) with silver disappearing;
  • FIG. 2 is a schematic flowchart of a method for fabricating a stretchable display panel according to an embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional structure diagram of a product in step S200 of the manufacturing method according to an embodiment of the present disclosure
  • FIG. 4 is a schematic cross-sectional structure diagram of a product in step S200 of the manufacturing method according to another embodiment of the present disclosure.
  • FIG. 5 is a schematic cross-sectional structural diagram of a semi-finished product in step S200 of the manufacturing method according to another embodiment of the present disclosure.
  • FIG. 6 is a schematic cross-sectional structural diagram of a semi-finished product in step S200 of the manufacturing method according to another embodiment of the present disclosure.
  • step S200 is a schematic cross-sectional structural diagram of a semi-finished product in step S200 of the manufacturing method according to another embodiment of the present disclosure.
  • step S200 is a schematic cross-sectional structural diagram of a semi-finished product in step S200 of the manufacturing method according to another embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram of a cross-sectional structure of a product in step S500 of the manufacturing method according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of a cross-sectional structure of a product in step S500 of the manufacturing method according to another embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of a cross-sectional structure of a product in step S600 of the manufacturing method according to an embodiment of the present disclosure
  • FIG. 12 is a schematic diagram of a cross-sectional structure of a product in step S700 of the manufacturing method according to an embodiment of the present disclosure
  • FIG. 13 is a schematic cross-sectional structure diagram of a stretchable display panel according to an embodiment of the present disclosure
  • FIG. 14 is a schematic cross-sectional structure diagram of a stretchable display panel according to another embodiment of the present disclosure.
  • FIG. 15 is a cross-sectional electron microscope photograph of the third planarizing layer after filling according to an embodiment of the present disclosure.
  • the present disclosure proposes a method of fabricating a stretchable display panel.
  • the manufacturing method includes:
  • a substrate 100 is provided, and the substrate 100 includes a display unit A, a connection unit B and a hollow area C, and a hollow area C is provided between the display unit A and the connection unit B.
  • the inventors of the present disclosure have found through long-term research that the current red-blue-green (RBG) stretchable display structure requires an additional source-drain electrode protection layer (SD) compared to the conventional manufacturing process of the RBG organic light-emitting diode (OLED) structure. Cover) and PS Cover.
  • SD source-drain electrode protection layer
  • cover and PS Cover.
  • AND2 which is far from the surface of the first anode sub-layer (AND1) of the PS Cover. If the indium tin oxide (ITO) in the AND1 is damaged, the subsequent alkaline etching process will further damage the silver (Ag) in the AND1, which may easily lead to the problem of poor display.
  • ITO indium tin oxide
  • the addition of SD Cover and PS Cover of silicon nitride material will also cause the problem of characteristic drift of LTPS TFT.
  • the three-color light-emitting layers in the RBG stretchable display structure also need to be evaporated using a high-definition mask (FMM) respectively, and the hollow structure on the FMM is unevenly distributed, which easily leads to the deformation of the FMM during the meshing process. non-uniform, resulting in RGB color mixing of the display unit.
  • FMM high-definition mask
  • the substrate 100 may include a plurality of display units A arranged in an array, and each display unit A may be composed of a plurality of pixel units, and the substrate 100 may further include a plurality of connections unit B, and a connection unit B is provided between two adjacent display units A, and a hollow area C is provided between each display unit A and the connection unit B.
  • the stretchable display panel finally produced can have both stretching performance and display performance.
  • each film layer structure 200 is formed on the substrate 100 , and the orthographic projection of each film layer structure 200 on the substrate 100 falls within the display unit A, the connection unit B and the hollow area C .
  • step S200 may include: S210 forming a flexible base 210 , a flexible base protective layer 220 , a thin film transistor structure and a second planarization layer 241 on the substrate 100 , wherein , the thin film transistor structure is formed in the display unit A; S220 forms a source-drain electrode protection layer 250 on the surface of the thin film transistor structure away from the substrate 100; S230 forms an organic light-emitting structure and a columnar supporter on the surface of the thin film transistor structure away from the substrate 100 280 , and the orthographic projection of the organic light emitting structure and the columnar support 280 on the substrate 100 falls within the display unit A. In this way, a light emitting (EL) substrate with more complete structure and function can be produced.
  • EL light emitting
  • the material for forming the light-emitting layer 2703 of the organic light-emitting structure can only be selected from white light organic light-emitting materials. In this way, the light-emitting layer can be formed by only one evaporation through an open mask. Compared with the RGB display design , only one evaporation process is needed, the evaporation cost is lower, and the color mixing problem of color separation evaporation is avoided.
  • the steps of forming the thin film transistor structure may include: referring to FIG. 4 , firstly, forming a buffer layer 2301 , an active layer 2302 , a first gate insulating layer 2303 , a first gate insulating layer 2303 , a first gate insulating layer 2303 , a first gate insulating layer 2303 , a buffer layer 2301 on the surface of the flexible base protective layer 220 away from the substrate 100 in sequence.
  • the first etching (EP1) is performed to remove the buffer layer 2301, A gate insulating layer 2303, a second gate insulating layer 2305 and an interlayer dielectric layer 2307 are removed; then a second etching (EP2) is performed to remove the flexible base protective layer 220 of the hollow area C;
  • the area other than A is filled with organic material to form the third planarization layer 242, so that the discontinuity can be reduced, and referring to FIG.
  • the thickness of the third planarization layer 242 can be 1-2 microns; then in the area of the active layer 2302 A via hole is formed, and the via hole penetrates the first gate insulating layer 2303, the second gate insulating layer 2305 and the interlayer dielectric layer 2307, so that the formed source-drain electrode 2308 can be contacted with the active layer 2302 through the via hole; then, Continue to fill the area other than the display unit A with organic material to form a second passivation layer 241 for wrapping the data line (SD line). In the middle, the SD line can be buffered when stretched, thereby further improving the stretchable amount of the display panel.
  • SD line data line
  • the source-drain electrode protection layer 250 is deposited on the surface of the interlayer dielectric layer 2307 away from the substrate 100, and only covering part of the source-drain electrodes 2308 can provide a package cross-section for subsequent packaging, and prevent packaging
  • the inorganic layer is in poor contact with the organic layer, and a groove (Dam) 251 is formed on the source-drain electrode protection layer 250, which can increase the water and oxygen intrusion path and improve the packaging reliability, and can also increase the stability of the inverted trapezoid PS and prevent it from falling off.
  • the step of forming the organic light emitting structure may include: forming a fourth planarization layer 260 on the surface of the source-drain electrode 2308 away from the substrate 100 to provide a planar interface for the anode;
  • the anode 2701 is formed on the surface away from the substrate 100;
  • the pixel defining layer 2702 is further formed on the surface of the anode 2701 and the fourth planarization layer 260 away from the substrate 100;
  • ) 280 to form a blocking structure; continue to form a light emitting layer 2703 on the surface of the pixel defining layer 2702 and the anode 2701 away from the substrate 100 ;
  • the anode 2701 in the organic light emitting diode structure can be formed at one time.
  • a columnar support protective layer PS Cover
  • a second anode sublayer (AND2), so as to effectively avoid the problem of damage to the anode 2701 caused by the AND2 etching, thereby increasing the production yield of the stretchable display panel.
  • a first planarization layer 300 is formed on the surface of each film layer structure 200 away from the substrate 100 .
  • the first planarization layer 300 may directly cover the surface of the columnar support 280 in each film layer structure 200 that is far from the substrate 100 .
  • the fabrication method does not need to additionally fabricate PS Cover and AND2 on the surface of the columnar support 280 away from the substrate 100, and can also use the color filter protection layer (CF Cover) 500 to be fabricated subsequently as a hard mask to hollow out the hollow area C, thereby Effectively avoid the problem of LTPS TFT characteristic drift caused by the PS Cover of the silicon nitride material, thereby making the production yield of the stretchable display panel higher.
  • CF Cover color filter protection layer
  • S400 Form a color filter layer on the side of the first planarization layer away from the substrate.
  • the color filter layer 400 is formed on the side of the first planarization layer 300 away from the substrate, and the orthographic projection of the color filter layer 400 on the substrate 100 falls within the display unit A.
  • the orthographic projection of the color filter layer 400 on the substrate 100 and the orthographic projection of the light-emitting layer 2703 on the substrate 100 may overlap. Specifically, the orthographic projection of the film layer 400 on the substrate 100 may fall. into the orthographic projection of the light emitting layer 2703 on the substrate 100 . In this way, the white light emitted by the light emitting layer 2703 can be modulated by the red, blue or green color filter layer 400 to emit colored light from the stretchable display panel.
  • the black matrix layer 600 may be formed on the surface of the color filter layer 400 away from the substrate 100 , and the black matrix layer 600 between the color filter layer 400 and the color filter protective layer 500 may only cover part of the Color filter layer 400 . In this way, not only the color filter layer 400 is fabricated on one side of the light-emitting substrate, but also the black matrix layer 600 for preventing light leakage is fabricated on one side of the light-emitting substrate, so that the display effect of the stretchable display panel can be better.
  • a color filter protection layer 500 is formed on the side of the color filter layer 400 away from the substrate 100 , and the color filter protection layer 500 only covers the display unit A and the connection unit B. In this way, the hollow area C is not Covered by the color filter protection layer 500 .
  • the material for forming the color filter protection layer 500 may be silicon nitride (SiN). In this way, the color filter protection layer 500 using the above material can better prevent the subsequent ashing process from affecting the color filter layers 300, 300 and 300. The atmosphere damage of the black matrix layer 400 and part of each film layer structure 200 .
  • S600 Perform an ashing process on the hollow area not covered by the color filter protective layer, and remove the first planarization layer and each film layer structure in the hollow area.
  • an ashing process is performed on the hollow area C that is not covered by the color filter protection layer 500 , and the first planarization layer 300 and each film structure 200 in the hollow area C are removed.
  • an oxygen-plasma (O Plasma) method can be selected for the ashing process.
  • a high-energy plasma is selected to remove the organic material in the hollow region C, so that the produced hollow region C has less residue and costs less less time.
  • the ashing process may remove the first planarization layer 300 , the second planarization layer 241 and the third planarization layer 242 in the hollow area C, so that the hollow area C
  • Each organic film layer formed by the organic material is completely removed by oxygen-plasma.
  • the manufacturing method may further include:
  • the substrate 100 is peeled off from each film layer structure 200 , and referring to FIG. 14 again, the back film 800 is continuously attached to the lower surface of each film layer structure 200 through the organic adhesive layer 700 , In this way, the manufacture of the stretchable display panel can be completed.
  • the present disclosure proposes a method for fabricating a stretchable display panel, which can not only fabricate the color filter layer on one side of the light-emitting substrate, but also use the color filter protection layer as the hard
  • the mask is subjected to an ashing process to form a hollow area, so that the influence of the deposition of the column support protective layer on the characteristics of the low temperature polysilicon thin film transistor and the damage of the alkaline etching solution to the anode can be effectively avoided.
  • the present disclosure proposes a stretchable display panel.
  • the stretchable display panel includes a display unit A, a connecting unit B and a hollow area C, and a hollow area C is provided between the display unit A and the connecting unit B, and the stretchable display panel
  • the extension display panel includes: each film layer structure 200, a first planarization layer 300, a color filter layer 400 and a color filter protective layer 500; wherein, each film layer structure 200 is within the display unit A and the connection unit B; the first flat layer The flattening layer 300 is arranged on one side of each film layer structure 200, and the orthographic projection of the first flattening layer 300 on each film layer structure 200 falls within the display unit A and the connecting unit B; the color filter layer 400 is arranged on the first A planarization layer 300 is far from each film layer structure 200 on one side, and the color filter layer 400 is orthographically projected on each film layer structure 200 and falls into the display unit A; One side of each film layer structure 200, and the color filter protection layer 500 only covers the connection units of the display units
  • the hollow area C of the stretchable display panel is formed by hollowing out the color filter protective layer 500 mask.
  • the selection of the color filter protective layer 500 is exactly the same as the shape of the display unit A and the connection unit B, so The influence of the deposition of the columnar support protective layer on the characteristics of the low-temperature polysilicon thin film transistor and the damage to the anode caused by etching are effectively avoided.
  • the stretchable display panel may include a plurality of display units A arranged in an array, and each display unit A may be composed of a plurality of pixel units, and the stretchable display panel may also It includes a plurality of connection units B, and a connection unit B is provided between two adjacent display units A, and a hollow area C is provided between each display unit A and the connection unit B. In this way, the stretchable display panel can have both stretch performance and display performance.
  • the stretchable display panel may further include a substrate 100 , and the substrate 100 is disposed on a surface of each film layer structure 200 away from the first planarization layer 300 .
  • the rigid substrate 100 can bring better support and flatness to the manufacturing.
  • the stretchable display panel may further include a back film 800 , and the back film 800 is attached to each film layer structure 200 through an organic adhesive layer 700 away from the first planarization layer 300 surface. In this way, the stretch resistance of the display panel can be improved.
  • each film layer structure 200 may include a laminated flexible substrate 210 , a flexible substrate protective layer 220 , a thin film transistor structure, a second planarization layer 240 , a source-drain electrode protective layer 250 , an organic The light emitting structure and the columnar support 280, wherein the orthographic projections of the flexible substrate 210, the flexible substrate protective layer 220 and the second planarization layer 240 on each film layer structure 200 fall within the display unit A and the connection unit B, while the thin film The orthographic projections of the transistor structure, the organic light emitting structure and the columnar support 280 on each film layer structure 200 all fall within the display unit A.
  • the light-emitting layer 2703 of the organic light-emitting structure may only be formed of a white light organic light-emitting material, and the color filter layer 400 is orthographically projected on each film layer structure 200 and the light-emitting layer 2703 is on each film layer structure 200
  • the orthographic projections overlap. Specifically, the orthographic projection of the film layer 400 on the substrate 100 may fall within the orthographic projection of the light-emitting layer 2703 on the substrate 100 .
  • the first planarization layer 300 may directly cover the surface of each membrane structure 200 where the columnar supports 280 are far away from the flexible substrate 210 .
  • a columnar support protective layer (PS Cover) and a second anode sub-layer (AND2) are additionally formed on the surface of 100, and a hollow area C can also be hollowed out by using the color filter protective layer (CF Cover) 500 produced subsequently as a hard mask, thereby Effectively avoid the problem of LTPS TFT characteristic drift caused by the PS Cover of the silicon nitride material, thereby making the production yield of the stretchable display panel higher.
  • the anode 2701 in the organic light emitting diode structure may be formed of an integral material. In this way, there is no need to make a PS Cover as a hard mask to form the hollow area C, and therefore there is no need to make an AND2, thereby effectively avoiding the problem of damage to the anode 2701 caused by the AND2 etching, thereby making the stretchable display panel a higher yield rate. .
  • the present disclosure proposes a stretchable display panel, the hollow area of which is formed by an ashing process using the color filter protection layer as a hard mask, so that the low temperature polysilicon can be Thin film transistors have better characteristics and less damage to the anode, so that the production yield of stretchable display panels is higher, and the color filter layer can also be designed on one side of the light-emitting substrate, so that the thickness of the display panel is thinner.
  • first”, “second”, “third”, and “fourth” are used for descriptive purposes only, and should not be construed as indicating or implying relative importance or implicit Contains the number of technical features indicated. Thus, features defined as “first”, “second”, “third”, “fourth” may expressly or implicitly include at least one of such features. In the description of the present disclosure, “plurality” means at least two, such as two, three, etc., unless expressly and specifically defined otherwise.

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Abstract

本公开提出可拉伸显示面板及其制作方法。该制作方法包括：提供衬底，其上包括显示单元、连接单元和镂空区；在衬底上形成各膜层结构且各膜层结构在衬底上的正投影落入显示单元、连接单元和镂空区之内；在各膜层结构远离衬底的表面形成第一平坦化层；在第一平坦化层远离衬底的一侧形成彩膜层，且彩膜层在衬底上的正投影落入显示单元之内；在彩膜层远离衬底的一侧形成彩膜保护层，且只覆盖显示单元和连接单元；对镂空区进行灰化工艺，去除镂空区内的第一平坦化层和各膜层结构。

Description

可拉伸显示面板及其制作方法
优先权信息
本申请请求2020年07月21日向中国国家知识产权局提交的、专利申请号为202010707450.X的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本公开涉及可拉伸显示技术领域，具体的，本公开涉及可拉伸显示面板及其制作方法。
背景技术
拉伸显示，作为一种新型的显示装置，具有高拉伸率兼具高分辨率的显示效果。拉伸显示设计采用岛(显示单元)和桥(连接单元)的连接方式，并在显示区形成镂空区而具有可拉伸性。目前，暂时未发现现有的拉伸结构采用彩膜在发光基板(COE)结构。
发明内容
本公开是基于发明人的下列发现而完成的：
本公开的发明人在研究过程中发现，可以在制作彩膜在显示基板(COE)的可拉伸显示结构的方法中，在完成彩膜层(CF)后再以彩膜保护层(CF Cover)为硬掩模进行镂空工艺，如此，可以有效地避免柱状支撑物保护层(PS Cover)的沉积对低温多晶硅(LTPS)薄膜晶体管(TFT)特性的影响和第二阳极亚层(AND2)的刻蚀对阳极的损伤问题。
在本公开的第一方面，本公开提出了一种制作可拉伸显示面板的方法。
根据本公开的实施例，所述方法包括：提供衬底，且所述衬底上包括显示单元、连接单元和镂空区，并且所述显示单元与所述连接单元之间设置有所述镂空区；在所述衬底上形成各膜层结构，且所述各膜层结构在所述衬底上的正投影落入所述显示单元、所述连接单元和所述镂空区之内；在所述各膜层结构远离所述衬底的表面，形成第一平坦化层；在所述第一平坦化层远离所述衬底的一侧形成彩膜层，且所述彩膜层在所述衬底上的正投影落入所述显示单元之内；在所述彩膜层远离所述衬底的一侧形成彩膜保护层，且所述彩膜保护层只覆盖所述显示单元和所述连接单元；对未被所述彩膜保护层覆 盖的所述镂空区进行灰化工艺，去除所述镂空区内的所述第一平坦化层和所述各膜层结构。
采用本公开实施例的制作可拉伸显示面板的方法，不仅能将彩膜层制作在发光基板的一侧，而且，以彩膜保护层为硬掩模进行灰化工艺形成镂空区，如此，可以有效地避免柱状支撑物保护层的沉积对低温多晶硅薄膜晶体管特性的影响，以及刻蚀对阳极的损伤问题。
另外，根据本公开上述实施例的制作方法，还可以具有如下附加的技术特征：
根据本公开的实施例，所述方法进一步包括：在所述彩膜层与所述彩膜保护层之间形成黑矩阵层，且所述黑矩阵层覆盖部分所述彩膜层；将所述衬底从所述各膜层结构上剥离，并在所述各膜层结构远离所述彩膜层的表面贴附背膜。
根据本公开的实施例，形成所述各膜层结构的步骤包括：在所述衬底上形成柔性基底、柔性基底保护层、薄膜晶体管结构和第二平坦化层，其中，所述薄膜晶体管结构形成在所述显示单元之内；在所述薄膜晶体管结构远离所述衬底的表面形成源漏电极保护层；在所述膜晶体管结构远离所述衬底的表面形成有机发光结构和柱状支撑物，且所述有机发光结构和所述柱状支撑物在所述衬底上的正投影都落入所述显示单元之内。
根据本公开的实施例，形成所述有机发光结构的步骤包括：通过开口掩模板蒸镀形成发光层，且所述发光层由白光有机发光材料形成。
根据本公开的实施例，所述彩膜层在所述衬底上正投影与所述发光层在所述衬底上正投影交叠。
根据本公开的实施例，所述第一平坦化层直接覆盖所述柱状支撑物远离所述衬底的表面。
根据本公开的实施例，所述有机发光二极管结构中的阳极是一次成型的。
在本公开的第二方面，本公开提出了一种可拉伸显示面板。
根据本公开的实施例，所述可拉伸显示面板上包括显示单元、连接单元和镂空区，且所述显示单元与所述连接单元之间设置有所述镂空区，并且，所述可拉伸显示面板包括：各膜层结构，所述各膜层结构在所述显示单元和所述连接单元之内；第一平坦化层，所述第一平坦化层设置在所述各膜层结构的一侧，且所述第一平坦化层在所述各膜层结构上的正投影落入所述显示单元和所述连接单元之内；彩膜层，所述彩膜层设置在所述第一平坦化层远离所述各膜层结构的一侧，且所述彩膜层在所述各膜层结构上正投影落入所述显示单元之内；彩膜保护层，所述彩膜保护层设置在所述彩膜层远离所述各膜层 结构的一侧，且只覆盖所述显示单元和所述连接单元。
本公开实施例的可拉伸显示面板，其镂空区是以彩膜保护层为硬掩模进行灰化工艺形成的，如此，可使低温多晶硅薄膜晶体管特性更好且阳极损伤更小，从而使可拉伸显示面板的制作良品率更高，并且，还可将彩膜层设计在发光基板的一侧，从而使显示面板的厚度更薄。
另外，根据本公开上述实施例的可拉伸显示面板，还可以具有如下附加的技术特征：
根据本公开的实施例，所述可拉伸显示面板进一步包括：衬底，所述衬底设置在所述各膜层结构远离所述第一平坦化层的表面。
根据本公开的实施例，所述可拉伸显示面板进一步包括：背膜，所述背膜贴附在所述各膜层结构远离所述第一平坦化层的表面。
根据本公开的实施例，所述各膜层结构包括层叠设置的柔性基底、柔性基底保护层、薄膜晶体管结构、第二平坦化层、源漏电极保护层、有机发光结构和柱状支撑物，其中，所述柔性基底、所述柔性基底保护层和所述第二平坦化层在所述各膜层结构上的正投影落入所述显示单元和所述连接单元之内，所述薄膜晶体管结构、所述有机发光结构和所述柱状支撑物在所述各膜层结构上的正投影落入所述显示单元之内。
根据本公开的实施例，所述有机发光结构的发光层都由白光有机发光材料形成，且所述彩膜层在所述各膜层结构上正投影与所述发光层在所述各膜层结构上正投影交叠。
根据本公开的实施例，所述第一平坦化层直接覆盖所述柱状支撑物远离所述柔性基底的表面。
根据本公开的实施例，所述有机发光二极管结构中的阳极是一体化材料形成的。
本公开的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本公开的实践了解到。
附图说明
本公开的上述的方面结合下面附图对实施例的描述进行解释，其中：
图1是正常的阳极(a)与受损后银消失的阳极(b)的照片；
图2是本公开一个实施例的制作可拉伸显示面板的方法流程示意图；
图3是本公开一个实施例的制作方法步骤S200的产品截面结构示意图；
图4是本公开另一个实施例的制作方法步骤S200的产品截面结构示意图；
图5是本公开另一个实施例的制作方法步骤S200的半成品截面结构示意图；
图6是本公开另一个实施例的制作方法步骤S200的半成品截面结构示意图；
图7是本公开另一个实施例的制作方法步骤S200的半成品截面结构示意图；
图8是本公开另一个实施例的制作方法步骤S200的半成品截面结构示意图；
图9是本公开一个实施例的制作方法步骤S500的产品截面结构示意图；
图10是本公开另一个实施例的制作方法步骤S500的产品截面结构示意图；
图11是本公开一个实施例的制作方法步骤S600的产品截面结构示意图；
图12是本公开一个实施例的制作方法步骤S700的产品截面结构示意图；
图13是本公开一个实施例的可拉伸显示面板的截面结构示意图；
图14是本公开另一个实施例的可拉伸显示面板的截面结构示意图；
图15是本公开一个实施例的第三平坦化层填充后的截面电镜照片。
附图标记
100 衬底
200 各膜层结构
210 柔性基底
220 柔性基底保护层
2301 缓冲层
2302 有源层
2303 第一栅绝缘层
2304 第一栅极
2305 第二栅绝缘层
2306 第二栅绝缘层
2307 层间介质层
2308 源漏电极
241 第二平坦化层
242 第三平坦化层
250 源漏电极保护层
251 凹槽
260 第四平坦化层
2701 阳极
2702 像素界定层
2703 发光层
2704 阴极
280 柱状支撑物
300 第一平坦化层
400 彩膜层
500 彩膜保护层
600 黑矩阵层
700 有机胶层
800 背膜
发明详细描述
下面详细描述本公开的实施例，本技术领域人员会理解，下面实施例旨在用于解释本公开，而不应视为对本公开的限制。除非特别说明，在下面实施例中没有明确描述具体技术或条件的，本领域技术人员可以按照本领域内的常用的技术或条件或按照产品说明书进行。
在本公开的一个方面，本公开提出了一种制作可拉伸显示面板的方法。根据本公开的实施例，参考图2，制作方法包括：
S100：提供衬底。
在该步骤中，提供衬底100，且衬底100上包括显示单元A、连接单元B和镂空区C，并且显示单元A与连接单元B之间设置有镂空区C。
本公开的发明人经过长期研究发现，目前的红蓝绿(RBG)可拉伸显示结构，相对于常规的RBG有机发光二极管(OLED)结构的制作工艺，需要额外增加源漏电极保护层(SD Cover)和PS Cover。但是，以PS Cover为硬掩模(Hard Mask)进行镂空工艺形成镂空区之后，还需对PS Cover远离第一阳极亚层(AND1)表面的AND2进行刻蚀，而刻蚀气氛过刻时会损伤AND1中的氧化铟锡(ITO)，则后续碱性的刻蚀液艺又会进一步损伤到AND1中的银(Ag)，容易导致显示不良的问题。此外，额外增加氮化硅材料的SD Cover和PS Cover还会导致LTPS TFT特性漂移的问题。
而且，RBG可拉伸显示结构中三种颜色的发光层，还需要分别使用高精细掩膜板(FMM)进行蒸镀，且FMM上的镂空结构分布不均，容易导致张网过程中FMM形变不均匀，从而导致显示单元的RGB混色。
在本公开的一些实施例中，衬底100上可以包括多个阵列排布的显示单元A，且每个显示单元A可以由多个像素单元组成，而衬底100上还可以包括多个连接单元B，且相邻的两个显示单元A之间都设置有连接单元B，而且，每个显示单元A与连接单元B之间设置有镂空区C。如此，可使最终制作出的可拉伸显示面板兼具拉伸性能和显示性能。
S200：在衬底上形成各膜层结构。
在该步骤中，参考图3，在衬底100上形成各膜层结构200，且各膜层结构200在衬底100上的正投影落入显示单元A、连接单元B和镂空区C之内。
在本公开的一些实施例中，参考图4～图8，步骤S200可以包括：S210在衬底100上形成柔性基底210、柔性基底保护层220、薄膜晶体管结构和第二平坦化层241，其中，薄膜晶体管结构形成在显示单元A之内；S220在薄膜晶体管结构远离衬底100的表面形成源漏电极保护层250；S230在薄膜晶体管结构远离衬底100的表面形成有机发光结构和柱状支撑物280，且有机发光结构和柱状支撑物280在衬底100上正投影都落入显示单元A之内。如此，可以制作出结构和功能都更完善的发光(EL)基板。
在一些具体示例中，形成有机发光结构的发光层2703的材料可以只选择白光有机发光材料，如此，只需通过开口掩模板(Open Mask)一次蒸镀即可形成发光层，相对于RGB显示设计，只需一次蒸镀工艺、蒸镀成本更低且避免了分色蒸镀的混色问题。
具体的，形成薄膜晶体管结构的步骤可以包括：参考图4，先在柔性基底保护层220远离衬底100的表面上依次形成缓冲层2301、有源层2302、第一栅绝缘层2303、第一栅极2304、第二栅绝缘层2305、第二栅绝缘层2306和层间介质层2307；参考图5，再进行第一次刻蚀(EP1)将显示单元A以外区域的缓冲层2301、第一栅绝缘层2303、第二栅绝缘层2305和层间介质层2307去除；然后进行第二次刻蚀(EP2)将镂空区C的柔性基底保护层220去除；参考图6，继续在显示单元A以外的区域填充有机材料形成第三平坦化层242，如此可以减少断差，且参考图15，第三平坦化层242的厚度可以为1～2微米；之后在有源层2302的区域内形成过孔，且过孔贯穿第一栅绝缘层2303、第二栅绝缘层2305和层间介质层2307，如此，可以使形成的源漏电极2308通过过孔与有源层2302接触；然后，在显示单元A以外的区域继续填充有机材料形成第二钝化层241，用于包覆数据线(SD线)，如此，由于第三平坦化层242与第二钝化层241将SD线夹在中间，在拉伸时可以对SD线起到缓冲作用，从而进一步提升显示面板的可拉伸量，具体的，拉伸量为5％时无裂纹产生而拉伸量达到10％时仅有轻微裂纹产生；参考图7，在层间介质层2307远离衬底100的表面沉积源漏电极保护层250，且仅覆盖 部分的源漏电极2308可以为后续的封装提供封装截面，且防止封装的无机层与有机层接触不良，并在源漏电极保护层250上形成凹槽(Dam)251，可以增加水氧入侵路径且提高封装信赖性，还可以增加倒梯形PS的稳固性并防止脱落。
具体的，参考图8，形成有机发光结构的步骤可以包括：在源漏电极2308远离衬底100的表面形成第四平坦化层260，为阳极提供平坦界面；然后，在第四平坦化层260远离衬底100的表面形成阳极2701；继续在阳极2701和第四平坦化层260远离衬底100的表面形成像素界定层2702；随后，在凹槽251上制作倒梯形的柱状隔垫物(PS)280，形成阻断结构；继续在像素界定层2702和阳极2701远离衬底100的表面形成发光层2703；最后，在发光层2703远离衬底100的表面形成阴极2704。
其中，有机发光二极管结构中的阳极2701可以是一次成型的，如此，后续无需制作柱状支撑物保护层(PS Cover)作为硬掩模去形成镂空区C，也就无需再制作第二阳极亚层(AND2)，从而有效地避免AND2刻蚀对阳极2701的损伤问题，进而使可拉伸显示面板的制作良品率更高。
S300：在各膜层结构远离衬底的表面，形成第一平坦化层。
在该步骤中，在各膜层结构200远离衬底100的表面形成第一平坦化层300。
在本公开的一些实施例中，参考图10，第一平坦化层300可以直接覆盖各膜层结构200中柱状支撑物280远离衬底100的表面。如此，该制作方法无需在柱状支撑物280远离衬底100的表面额外制作PS Cover和AND2，也能以后续制作的彩膜保护层(CF Cover)500为硬掩模镂空出镂空区C，从而有效地避免氮化硅材料的PS Cover导致LTPS TFT特性漂移的问题，进而使可拉伸显示面板的制作良品率更高。
S400：在第一平坦化层远离衬底的一侧形成彩膜层。
在该步骤中，在第一平坦化层300远离衬底的一侧形成彩膜层400，且彩膜层400在衬底100上的正投影落入显示单元A之内。
在本公开的一些实施例中，彩膜层400在衬底100上正投影与发光层2703在衬底100上正投影可以交叠，具体的，膜层400在衬底100上正投影可以落入发光层2703在衬底100上正投影之内。如此，发光层2703发出的白光可以通过红色、蓝色或绿色的彩膜层400调制后，从可拉伸显示面板发出彩色的光。
在本公开的一些实施例中，可以在彩膜层400远离衬底100的表面形成黑矩阵层600，且彩膜层400与彩膜保护层500之间的黑矩阵层600可以只覆盖部分的彩膜层400。如此，不仅将彩膜层400制作在发光基板的一侧，而且，还将防止漏光的黑矩阵层600也制作在发光基板的一侧，从而能使可拉伸显示面板的显示效果更佳。
S500：在彩膜层远离衬底的一侧形成彩膜保护层。
在该步骤中，参考图9，在彩膜层400远离衬底100的一侧形成彩膜保护层500，且彩膜保护层500只覆盖显示单元A和连接单元B，如此，镂空区C未被彩膜保护层500覆盖。根据本公开的实施例，形成彩膜保护层500的材料可以为氮化硅(SiN)，如此，采用上述材料的彩膜保护层500可以更好地防止后续灰化工艺对彩膜层300、黑矩阵层400和部分的各膜层结构200的气氛损伤。
S600：对未被彩膜保护层覆盖的镂空区进行灰化工艺，去除镂空区内的第一平坦化层和各膜层结构。
在该步骤中，参考图11，对未被彩膜保护层500覆盖的镂空区C进行灰化工艺，去除镂空区C内的第一平坦化层300和各膜层结构200。具体的，灰化工艺可以选择氧-等离子体(O Plasma)的方式，如此，选择高能量的等离子体去除镂空区C的有机材料，从而使制作出的镂空区C中的残余更少且花费时间更短。在本公开的一些实施例中，参考图12，灰化工艺可以去除镂空区C内的第一平坦化层300、第二平坦化层241和第三平坦化层242，如此，镂空区C内有机材料形成的各个有机膜层被氧-等离子体彻底去除。
在本公开的一些实施例中，在步骤S600之后，该制作方法可以进一步包括：
S700：将衬底从各膜层结构上剥离，并在各膜层结构远离彩膜层的表面贴附背膜。
在该步骤中，参考图13，将衬底100从各膜层结构200上剥离，再参考图14，继续将背膜800通过有机胶层700贴附到各膜层结构200的下表面上，如此，可以完成可拉伸显示面板的制作。
综上所述，根据本公开的实施例，本公开提出了一种制作可拉伸显示面板的方法，不仅能将彩膜层制作在发光基板的一侧，而且，以彩膜保护层为硬掩模进行灰化工艺形成镂空区，如此，可以有效地避免柱状支撑物保护层的沉积对低温多晶硅薄膜晶体管特性的影响，以及碱性刻蚀液对阳极的损伤问题。
在本公开的另一个方面，本公开提出了一种可拉伸显示面板。
根据本公开的实施例，参考图13，可拉伸显示面板上包括显示单元A、连接单元B和镂空区C，且显示单元A与连接单元B之间设置有镂空区C，并且，可拉伸显示面板包括：各膜层结构200、第一平坦化层300、彩膜层400和彩膜保护层500；其中，各膜层结构200在显示单元A和连接单元B之内；第一平坦化层300设置在各膜层结构200的一侧，且第一平坦化层300在各膜层结构200上的正投影落入显示单元A和 连接单元B之内；彩膜层400设置在第一平坦化层300远离各膜层结构200的一侧，且彩膜层400在各膜层结构200上正投影落入显示单元A之内；而彩膜保护层500设置在彩膜层400远离各膜层结构200的一侧，且彩膜保护层500只覆盖显示单元A和B连接单元。如此，可拉伸显示面板的镂空区C是以彩膜保护层500掩膜板进行镂空工艺形成的，彩膜保护层500的选择与显示单元A和连接单元B的形状之和完全相同，从而有效地避免柱状支撑物保护层的沉积对低温多晶硅薄膜晶体管特性的影响，以及刻蚀对阳极的损伤问题。
在本公开的一些实施例中，可拉伸显示面板上可以包括多个阵列排布的显示单元A，且每个显示单元A可以由多个像素单元组成，而可拉伸显示面板上还可以包括多个连接单元B，且相邻的两个显示单元A之间都设置有连接单元B，而且，每个显示单元A与连接单元B之间设置有镂空区C。如此，可使可拉伸显示面板兼具拉伸性能和显示性能。
在本公开的一些实施例中，参考图11，可拉伸显示面板可以进一步包括衬底100，且衬底100设置在各膜层结构200远离第一平坦化层300的表面。如此，在可拉伸显示面板的制作过程中，硬性的衬底100可以为制作带来更好的支撑和平整性。
在本公开的另一些实施例中，参考图14，可拉伸显示面板也可以进一步包括背膜800，且背膜800通过有机胶层700贴附在各膜层结构200远离第一平坦化层300的表面。如此，可使显示面板的抗拉伸性能更高。
根据本公开的实施例，参考图14，各膜层结构200可以包括层叠设置的柔性基底210、柔性基底保护层220、薄膜晶体管结构、第二平坦化层240、源漏电极保护层250、有机发光结构和柱状支撑物280，其中，柔性基底210、柔性基底保护层220和第二平坦化层240在各膜层结构200上的正投影落入显示单元A和连接单元B之内，而薄膜晶体管结构、有机发光结构和柱状支撑物280在各膜层结构200上的正投影都落入显示单元A之内。
在本公开的一些实施例中，有机发光结构的发光层2703可以只由白光有机发光材料形成，且彩膜层400在各膜层结构200上正投影与发光层2703在各膜层结构200上正投影交叠，具体的，膜层400在衬底100上正投影可以落入发光层2703在衬底100上正投影之内。如此，无需制作柱状支撑物保护层(PS Cover)作为硬掩模去形成镂空区C，也就无需再制作第二阳极亚层(AND2)，从而有效地避免AND2刻蚀对阳极2701的损伤问题，进而使可拉伸显示面板的制作良品率更高；并且，发光层2703发出的白光可以通过红色、蓝色或绿色的彩膜层400调制后，从使可拉伸显示面板发出彩色的光。
在本公开的一些实施例中，参考图14，第一平坦化层300可以直接覆盖各膜层结构200中柱状支撑物280远离柔性基底210的表面，如此，无需在柱状支撑物280远离衬底100的表面额外制作柱状支撑物保护层(PS Cover)和第二阳极亚层(AND2)，也能以后续制作的彩膜保护层(CF Cover)500为硬掩模镂空出镂空区C，从而有效地避免氮化硅材料的PS Cover导致LTPS TFT特性漂移的问题，进而使可拉伸显示面板的制作良品率更高。
在本公开的一些实施例中，有机发光二极管结构中的阳极2701可以是一体化材料形成的。如此，无需制作PS Cover作为硬掩模去形成镂空区C，也就无需再制作AND2，从而有效地避免AND2刻蚀对阳极2701的损伤问题，进而使可拉伸显示面板的制作良品率更高。
综上所述，根据本公开的实施例，本公开提出了一种可拉伸显示面板，其镂空区是以彩膜保护层为硬掩模进行灰化工艺形成的，如此，可使低温多晶硅薄膜晶体管特性更好且阳极损伤更小，从而使可拉伸显示面板的制作良品率更高，并且，还可将彩膜层设计在发光基板的一侧，从而使显示面板的厚度更薄。
在本公开的描述中，需要理解的是，语“第一”、“第二”、“第三”、“第四”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”、“第四”的特征可以明示或者隐含地包括至少一个该特征。在本公开的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本公开的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本公开的限制，本领域的普通技术人员在本公开的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (14)

  1. 一种制作可拉伸显示面板的方法，其特征在于，包括：
    提供衬底，且所述衬底上包括显示单元、连接单元和镂空区，并且所述显示单元与所述连接单元之间设置有所述镂空区；
    在所述衬底上形成各膜层结构，且所述各膜层结构在所述衬底上的正投影落入所述显示单元、所述连接单元和所述镂空区之内；
    在所述各膜层结构远离所述衬底的表面，形成第一平坦化层；
    在所述第一平坦化层远离所述衬底的一侧形成彩膜层，且所述彩膜层在所述衬底上的正投影落入所述显示单元之内；
    在所述彩膜层远离所述衬底的一侧形成彩膜保护层，且所述彩膜保护层只覆盖所述显示单元和所述连接单元；
    对未被所述彩膜保护层覆盖的所述镂空区进行灰化工艺，去除所述镂空区内的所述第一平坦化层和所述各膜层结构。
  2. 根据权利要求1所述的方法，其特征在于，进一步包括：
    在所述彩膜层与所述彩膜保护层之间形成黑矩阵层，且所述黑矩阵层覆盖部分所述彩膜层；
    将所述衬底从所述各膜层结构上剥离，并在所述各膜层结构远离所述彩膜层的表面贴附背膜。
  3. 根据权利要求1所述的方法，其特征在于，形成所述各膜层结构的步骤包括：
    在所述衬底上形成柔性基底、柔性基底保护层、薄膜晶体管结构和第二平坦化层，其中，所述薄膜晶体管结构形成在所述显示单元之内；
    在所述薄膜晶体管结构远离所述衬底的表面形成源漏电极保护层；
    在所述膜晶体管结构远离所述衬底的表面形成有机发光结构和柱状支撑物，且所述有机发光结构和所述柱状支撑物在所述衬底上的正投影都落入所述显示单元之内。
  4. 根据权利要求3所述的方法，其特征在于，形成所述有机发光结构的步骤包括：
    通过开口掩模板蒸镀形成发光层，且所述发光层由白光有机发光材料形成。
  5. 根据权利要求4所述的方法，其特征在于，所述彩膜层在所述衬底上正投影与所述发光层在所述衬底上正投影交叠。
  6. 根据权利要求3所述的方法，其特征在于，所述第一平坦化层直接覆盖所述柱状支撑物远离所述衬底的表面。
  7. 根据权利要求3所述的方法，其特征在于，所述有机发光二极管结构中的阳极是一次成型的。
  8. 一种可拉伸显示面板，其特征在于，所述可拉伸显示面板上包括显示单元、连接单元和镂空区，且所述显示单元与所述连接单元之间设置有所述镂空区，并且，所述可拉伸显示面板包括：
    各膜层结构，所述各膜层结构在所述显示单元和所述连接单元之内；
    第一平坦化层，所述第一平坦化层设置在所述各膜层结构的一侧，且所述第一平坦化层在所述各膜层结构上的正投影落入所述显示单元和所述连接单元之内；
    彩膜层，所述彩膜层设置在所述第一平坦化层远离所述各膜层结构的一侧，且所述彩膜层在所述各膜层结构上正投影落入所述显示单元之内；
    彩膜保护层，所述彩膜保护层设置在所述彩膜层远离所述各膜层结构的一侧，且只覆盖所述显示单元和所述连接单元。
  9. 根据权利要求8所述的可拉伸显示面板，其特征在于，进一步包括：
    衬底，所述衬底设置在所述各膜层结构远离所述第一平坦化层的表面。
  10. 根据权利要求8所述的可拉伸显示面板，其特征在于，进一步包括：
    背膜，所述背膜贴附在所述各膜层结构远离所述第一平坦化层的表面。
  11. 根据权利要求8～10中任一项所述的可拉伸显示面板，其特征在于，所述各膜层结构包括层叠设置的柔性基底、柔性基底保护层、薄膜晶体管结构、第二平坦化层、源漏电极保护层、有机发光结构和柱状支撑物，其中，所述柔性基底、所述柔性基底保护层和所述第二平坦化层在所述各膜层结构上的正投影落入所述显示单元和所述连接单元之内，所述薄膜晶体管结构、所述有机发光结构和所述柱状支撑物在所述各膜层结构上的正投影落入所述显示单元之内。
  12. 根据权利要求11所述的可拉伸显示面板，其特征在于，所述有机发光结构的发光层由白光有机发光材料形成，且所述彩膜层在所述各膜层结构上正投影与所述发光层在所述各膜层结构上正投影交叠。
  13. 根据权利要求11所述的可拉伸显示面板，其特征在于，所述第一平坦化层直接覆盖所述柱状支撑物远离所述柔性基底的表面。
  14. 根据权利要求11所述的可拉伸显示面板，其特征在于，所述有机发光二极管结构中的阳极是一体化材料形成的。
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