WO2022016963A1 - 海绵刷的更换工具和安装方法、半导体化学机械抛光设备 - Google Patents

海绵刷的更换工具和安装方法、半导体化学机械抛光设备 Download PDF

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Publication number
WO2022016963A1
WO2022016963A1 PCT/CN2021/093136 CN2021093136W WO2022016963A1 WO 2022016963 A1 WO2022016963 A1 WO 2022016963A1 CN 2021093136 W CN2021093136 W CN 2021093136W WO 2022016963 A1 WO2022016963 A1 WO 2022016963A1
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WO
WIPO (PCT)
Prior art keywords
hook
sponge brush
replacement tool
sliding
sponge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/093136
Other languages
English (en)
French (fr)
Inventor
党金伟
古进忠
韩岭峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changxin Memory Technologies Inc
Original Assignee
Changxin Memory Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changxin Memory Technologies Inc filed Critical Changxin Memory Technologies Inc
Priority to US17/443,538 priority Critical patent/US12122014B2/en
Publication of WO2022016963A1 publication Critical patent/WO2022016963A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING
    • B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G7/00—Devices for assisting manual moving or tilting heavy loads
    • B65G7/12—Load carriers, e.g. hooks, slings, harness, gloves, modified for load carrying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C1/00—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles
    • B66C1/10—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means
    • B66C1/22—Rigid members, e.g. L-shaped members, with parts engaging the under surface of the loads; Crane hooks
    • B66C1/28—Duplicate, e.g. pivoted, members engaging the loads from two sides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Definitions

  • the present disclosure relates to the field of semiconductor technology, and in particular, to a replacement tool for a sponge brush in a semiconductor chemical mechanical polishing device, an installation method for a sponge brush in a semiconductor chemical mechanical polishing device, and a semiconductor chemical mechanical polishing device.
  • the wafer needs to be cleaned with a sponge brush and chemical substances.
  • the sponge brush is mostly replaced by the operator's bare hands. , it is easy to cause pollution to the sponge brush, which in turn affects the cleaning ability of the sponge brush.
  • the purpose of the present disclosure is to overcome the deficiencies of the prior art, and provide a replacement tool for sponge brushes in semiconductor chemical mechanical polishing equipment, an installation method for sponge brushes in semiconductor chemical mechanical polishing equipment, and semiconductor chemical mechanical polishing equipment.
  • a first aspect of the present disclosure provides a replacement tool for a sponge brush in a semiconductor chemical mechanical polishing device, the replacement tool includes a first beam, a connecting mechanism, a second beam, a first hook and a second hook;
  • the first beam is connected with the second beam through the connecting mechanism;
  • the first hook is fixedly connected with the first beam, and the part of the first hook can be inserted into the concave end of the sponge brush;
  • the second hook is fixedly connected with the second beam, and a part of the second hook is sleeved on the protruding end of the sponge brush;
  • first beam and the second beam can move relative to each other, so that the first hook and the second hook can be respectively engaged with the concave end and the protruding end of the sponge brush or phase separation.
  • the connecting mechanism is a hinge mechanism
  • the hinge mechanism includes a first connecting piece, a rotating shaft and a second connecting piece; the first connecting piece is rotatably connected with the second connecting piece through the rotating shaft; the first connecting piece and the first beam connection; the second connecting piece is connected with the second beam.
  • the connecting mechanism is a sliding mechanism
  • the sliding mechanism includes a sliding structure and a return spring
  • the sliding structure is disposed on the second beam
  • the first beam A sliding hole is provided for sliding cooperation with the sliding structure; both ends of the return spring are respectively connected with the first beam and the second beam; wherein, the first hook is connected between the sliding structure and the second beam.
  • the sliding hole can move toward or away from the second hook when sliding relatively.
  • the sliding structure includes a connecting rod mounted on the second beam and at least one group of sliding assemblies disposed on the connecting rod; wherein,
  • the sliding assembly includes a sliding shaft, a first limiting piece and a second limiting piece; one end of the sliding shaft is mounted on the connecting rod, and the other end passes through the sliding hole; the first limiting piece The position is limited on the side of the first beam close to the second beam and is sleeved on the sliding shaft; the second limit piece is limited on the other side of the first beam away from the second beam. one side and connected with the sliding shaft.
  • the first hook includes a first flat portion and a second flat portion having a certain included angle, and a connection connecting the first flat portion and the second flat portion arc portion;
  • the outer surfaces of the first flat part, the second flat part and the arc-shaped part can fit with the inner wall surface of the groove end of the sponge brush.
  • the second hook includes a third plane portion and a fourth plane portion parallel to each other, and a fifth plane portion connecting the third plane portion and the fourth plane portion a plane part, the fifth plane part is connected by an arc transition between the third plane part and the fourth plane part, wherein,
  • the inner surfaces of the third flat portion, the fourth flat portion and the fifth flat portion are in contact with the outer wall surface of the protruding end of the sponge brush.
  • the replacement tool is an anti-corrosion structure.
  • a second aspect of the present disclosure provides an installation method for a sponge brush in a semiconductor chemical mechanical polishing device, the installation method comprising:
  • the concave end of the sponge brush rides on the driven shaft of the semiconductor chemical mechanical polishing device
  • a driving force is applied from the second hook of the replacement tool to the first hook, so that the concave end of the sponge brush is fully matched with the driven shaft, and the convex end of the sponge brush is assembled on the drive shaft of the semiconductor chemical mechanical polishing apparatus;
  • the second hook of the replacement tool is disengaged from the protruding end.
  • the disengaging the first hook of the replacement tool from the concave end includes: rotating the first beam in a direction away from the sponge brush , so that the first hook is lifted and disengaged from the protruding end of the sponge brush; or
  • the step of disengaging the first hook of the replacement tool from the concave end includes: sliding the first beam in a direction close to the driven shaft, so as to make the first hook move away from The direction of the second hook slides and is disengaged from the protruding end of the sponge brush.
  • a third aspect of the present disclosure provides a semiconductor chemical mechanical polishing device, comprising: a driving shaft, a driven shaft, a sponge brush and the replacement tool according to any one of the above; the sponge brush has a concave end and a convex end, The sponge brush is installed through the replacement tool so that the concave end and the protruding end are fitted with the driven shaft and the driving shaft, respectively.
  • the replacement tool provided by the present disclosure to replace the sponge brush suitable for semiconductor chemical mechanical polishing equipment can avoid the situation that the sponge brush is contaminated due to human touch when replacing the sponge brush, that is, compared with the replacement of the sponge brush by the operator
  • the solution of the sponge brush this solution can greatly reduce the possibility of the sponge brush being polluted during the replacement process, thereby avoiding the situation of residual particles on the wafer surface caused by the contamination of the sponge brush, and improving the product quality.
  • the replacement tool is easy to use, and the operator can use the replacement tool to complete the replacement of the sponge brush through simple training.
  • FIG. 1 shows a schematic diagram of the assembly of a replacement tool and a sponge brush according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram showing the assembly of the first hook of the slippery tool and the concave end of the sponge brush according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram illustrating the assembly of the second hook of the slippery tool and the protruding end of the sponge brush according to an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of the wafer surface cleaned by the sponge brush after the operator replaces the sponge brush with bare hands in the prior art
  • FIG. 5 is a schematic diagram of the wafer surface cleaned by the sponge brush after the sponge brush is replaced by a replacement tool according to an embodiment of the disclosure
  • FIG. 6 shows a schematic plan view of the replacement tool according to an embodiment of the present disclosure from a viewing angle
  • FIG. 7 shows a perspective structural schematic diagram of a replacement tool according to another embodiment of the present disclosure.
  • FIG. 8 shows a perspective structural schematic diagram of the first beam, the second beam, and the sliding mechanism in the replacement tool according to another embodiment of the present disclosure
  • FIG. 9 shows a schematic plan view of the first hook of the replacement tool according to an embodiment of the present disclosure from a viewing angle
  • FIG. 10 is a schematic perspective view of the second hook of the replacement tool according to an embodiment of the present disclosure from a viewing angle;
  • FIG. 11 shows a flowchart of a method for installing a sponge brush in a semiconductor chemical mechanical polishing device according to an embodiment of the present disclosure
  • FIG. 12 is a schematic diagram showing the positional relationship of some structures in the semiconductor chemical mechanical polishing apparatus according to an embodiment of the present disclosure.
  • Tool replacement 110, first beam; 1101, sliding hole; 111, second beam; 112, first hook; 1120, first plane part; 1121, second plane part; 1122, arc part; 113 1130, the third plane part; 1131, the fourth plane part; 1132, the fifth plane part; 1133, the installation gap; 114, the hinge mechanism; 1141, the first connecting piece; 1142, the second connection sheet; 1143, rotating shaft; 115, sliding mechanism; 1150, return spring; 1151, connecting rod; 1152, sliding shaft; 1153, first limit piece; 1154, second limit piece;
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments can be embodied in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.
  • an embodiment of the present disclosure provides a replacement tool 11 , and the replacement tool 11 can replace the sponge brush 10 suitable for semiconductor chemical mechanical polishing equipment; wherein:
  • the sponge brush 10 may include a rolling brush portion 101 and protruding ends 102 and concave ends 103 located at both ends of the rolling brush portion 101;
  • the rolling brush portion 101 may include a rolling brush shaft and a sponge structure wrapped around the outer peripheral surface of the rolling brush shaft, and the sponge
  • the outer surface of the structure can have sponge brush heads 1010 evenly and spaced apart for better cleaning of the surface of the wafer;
  • the protruding end 102 can be located at one end of the roller brush shaft, opposite to one end face of the sponge structure
  • the concave end 103 can be located at the other end of the roller brush shaft, and is concavely disposed relative to the other end face of the sponge structure; wherein, the protruding end 102 can be used to cooperate with the driving shaft in the semiconductor chemical mechanical polishing equipment, and the concave end
  • the end 103 is used for fitting with the driven shaft in the semiconductor chemical mechanical polishing apparatus, so that the entire sponge brush 10 is installed in the semiconductor chemical mechanical polishing apparatus.
  • roller brush shaft, the protruding end 102 and the concave end 103 can be made of metal material or alloy material, which can ensure the structural strength of the entire sponge brush 10, so as to facilitate the sponge brush 10 and other structures (for example: driven shaft, driving shaft, replacement tool 11, etc.); but not limited to this, other materials can also be used, as long as the sponge brush 10 can be guaranteed to have a certain strength as a whole.
  • the protruding end 102, the concave end 103 and the roller brush shaft are detachable or non-detachable, depending on the specific situation.
  • the replacement tool 11 may include a first beam 110 , connecting mechanisms 114 and 115 , a second beam 111 , a first hook 112 and a second hook 113 ; the first beam 110 can be connected to the second beam through the connecting mechanisms 114 and 115 .
  • the first hook 112 can be fixedly connected with the first beam 110, and part of the first hook 112 can be inserted into the concave end 103 of the sponge brush 10;
  • the second hook 113 is fixedly connected with the second beam 111, and A part of the second hook 113 is sleeved on the protruding end 102 of the sponge brush 10; wherein, the first beam 110 and the second beam 111 can move relative to each other, so that the first hook 112 and the second hook 113 can be respectively connected with The concave end 103 and the protruding end 102 of the sponge brush 10 are separated; specifically, when the sponge brush 10 in the semiconductor chemical mechanical polishing equipment needs to be replaced, part of the second hook 113 can be sleeved on the sponge brush 10 Then move the first beam 110 relative to the second beam 111, so that the first hook 112 snaps into the concave end 103 of the sponge brush 10, so that the replacement tool 11 clamps the sponge brush 10, and then adjusts the sponge brush 10.
  • the brush 10 is replaced; when the replacement of the sponge brush 10 is completed, the first beam 110 can be moved relative to the second beam 111, so that the first hook 112 is detached from the concave end 103 of the sponge brush 10, and the second The hook 113 is disengaged from the protruding end 102 of the sponge brush 10 .
  • FIG. 4 is a schematic diagram of the surface of the wafer 15 cleaned by the sponge brush 10 after the operator replaces the sponge brush 10 with bare hands in the prior art; Disclosed is a schematic diagram of the surface of the wafer 15 cleaned by the sponge brush 10 after the sponge brush 10 is replaced by the replacement tool 11; after comparing the particles on the surface of the wafer 15 in FIG. 4 and FIG. 5 (black spots on the wafer 15 in the figure) residual It can be seen from the situation that in FIG. 4 , there are more particles remaining on the surface of the wafer 15 , and less particles remain on the surface of the wafer 15 in FIG. 5 .
  • the replacement tool 11 is easy to use, and the operator can use the replacement tool 11 to complete the replacement of the sponge brush 10 through simple training.
  • the fixed connection mentioned in this disclosure means that the two components will not move relative to each other after they are connected, and it does not mean that the two connected components are not detachable.
  • the two components that are fixedly connected in this disclosure can be It is integrally formed and cannot be disassembled; it can also be disassembled, depending on the specific situation.
  • the position of the second beam 111 is usually determined first, and then the position of the first beam 110 is adjusted; therefore, in order to facilitate and quickly adjust the second beam 111 , such as As shown in FIG. 6 , the length of the first beam 110 may be smaller than, but not limited to, the length of the second beam 111 , and may be greater than or equal to the length of the second beam 111 , depending on the specific situation.
  • the aforementioned connecting mechanism may be a hinge mechanism 114 ; wherein the hinge mechanism 114 may include a first connecting piece 1141 , a rotating shaft 1143 and a second connecting mechanism 114 . connecting piece 1142; the first connecting piece 1141 can be rotatably connected with the second connecting piece 1142 through the shaft 1143; the first connecting piece 1141 can be connected with the first beam 110; and the second connecting piece 1142 can be connected with the second beam 111; Specifically, when the sponge brush 10 in the semiconductor chemical mechanical polishing equipment needs to be replaced, part of the second hook 113 can be sleeved on the protruding end 102 of the sponge brush 10 first.
  • the second beam 111 The position has been determined; then the first beam 110 is rotated toward the direction close to the sponge brush 10, so that the first hook 112 is engaged with the concave end 103 of the sponge brush 10, so that the replacement tool 11 holds the sponge brush 10, and then The sponge brush 10 is replaced; when the replacement of the sponge brush 10 is completed, the first beam 110 can be rotated in a direction away from the sponge brush 10, so that the first hook 112 is detached from the concave end 103 of the sponge brush 10; The second hook 113 is disengaged from the protruding end 102 of the sponge brush 10 .
  • the hinge mechanism 114 may be a metal material or an alloy material to ensure that the hinge mechanism 114 has sufficient strength and structural stability; but not limited to this, other materials may also be used, depending on the specific situation.
  • first connecting piece 1141 can be connected with the first beam 110 through screws; and the second connecting piece 1142 can be connected with the second beam 111 through screws; but it is not limited to this, and other ways can also be used to connect.
  • the connecting mechanism is a sliding mechanism 115
  • the sliding mechanism 115 may include a sliding structure and a return spring 1150 ;
  • the sliding structure may be disposed on the second beam 111 , and the first beam 110 is provided with a sliding hole 1101 that is slidably matched with the sliding structure;
  • the two ends of the return spring 1150 are respectively connected with the first beam 110 and the second beam 111; wherein, the first hook 112 is in the sliding structure and the sliding hole 1101 can move toward or away from the second hook 113 when sliding relatively
  • the position of the second beam 111 has been determined at this time; then the first beam 110 is pulled away from the second beam 111, so that the first hook 112 can be locked into the sponge brush 10
  • the concave end 103 of the brush 10 so that the replacement tool 11 clamps the sponge brush 10, and then replaces the sponge brush 10; when the replacement of the sponge brush 10 is completed, pull the
  • the sliding structure may include a connecting rod 1151 installed on the second beam 111 and at least one set of sliding assemblies disposed on the connecting rod 1151 ; wherein the sliding assembly may include a sliding shaft 1152 , the first limit piece 1153 and the second limit piece 1154; one end of the sliding shaft 1152 can be installed on the connecting rod 1151, and the other end passes through the sliding hole 1101; and the first limit piece 1153 is limited to the first beam 110 is close to the side of the second beam 111 and is sleeved on the sliding shaft 1152; the second limiting piece 1154 is limited on the other side of the first beam 110 away from the second beam 111 and is connected with the sliding shaft 1152.
  • the limiting piece 1154 can be detachably connected with the sliding shaft 1152 or not, depending on the specific situation.
  • the sliding hole 1101 can be an oval shape.
  • the length direction of the sliding hole 1101 can be the length direction of the first beam 110 and the second beam 111 ;
  • the second limiting piece 1154 can be circular, as shown in FIG. 8 , and the radial dimension of the first limiting piece 1153 and the second limiting piece 1154 is larger than the width of the sliding hole 1101 to ensure that the first limiting piece 1153 and The second limiting pieces 1154 are respectively positioned on both sides of the first beam 110 to ensure the connection stability of the first beam 110 and the second beam 111 .
  • the shapes of the sliding hole 1101 , the first limiting piece 1153 and the second limiting piece 1154 are not limited to the aforementioned shapes, and may also be other shapes, as long as the first beam 110 and the second beam 111 are guaranteed They can slide relative to each other, and the sliding is stable.
  • two or more sliding components can be provided, so that the sliding stability can be ensured while the first beam 110 and the second beam 111 can slide relative to each other.
  • connection mechanism of the embodiment of the present disclosure is not limited to the hinge mechanism 114 and the sliding mechanism 115 mentioned above, but also other mechanisms, as long as it can ensure that the replacement tool 11 can easily clamp the sponge brush 10 and is easy to remove The sponge brush 10 can be detached from it.
  • the first hook 112 may include a first plane portion 1120 and a second plane portion 1121 having a certain angle, and connect the first plane portion 1120 and the second plane portion 1121 .
  • the above-mentioned design of the hook 112 can limit the overall spatial freedom of the sponge brush 10 and prevent the relative rotation between the first hook 112 and the groove end of the sponge brush 10, thereby ensuring the stable clamping of the replacement tool 11 Sponge brush 10 to avoid the situation that the sponge brush 10 falls.
  • the included angle between the first plane portion 1120 and the second plane portion 1121 may be an acute angle or a right angle, but not limited thereto.
  • first hook 112 can also be designed in other forms, as long as the first hook 112 can be smoothly inserted into and pulled out of the groove end of the sponge brush 10 and the first hook 112 can restrain the sponge brush 10 The overall spatial freedom is sufficient.
  • the first hook 112 can be detachably connected to the first beam 110 through screws or bolts, so that when the first hook 112 is damaged, only the first hook 112 needs to be replaced, no need Maintenance or replacement of the entire replacement tool 11 can reduce maintenance costs.
  • the first hook 112 can also be integrally formed with the first beam 110 to simplify the assembly difficulty of the replacement tool 11 .
  • the second hook 113 includes a third plane portion 1130 and a fourth plane portion 1131 that are parallel to each other, and connects the third plane portion 1130 and the The fifth plane portion 1132 of the fourth plane portion 1131 is connected by an arc transition between the fifth plane portion 1132 and the third plane portion 1130 and the fourth plane portion 1131 , wherein the third plane portion 1130 and the fourth plane portion 1131 and the inner surface of the fifth plane portion 1132 is in contact with the outer wall surface of the protruding end 102 of the sponge brush 10; through the aforementioned design of the second hook 113, the overall spatial freedom of the sponge brush 10 can be limited, and the second The hook 113 and the protruding end 102 of the sponge brush 10 can rotate relative to each other, so that the replacement tool 11 can stably hold the sponge brush 10 and prevent the sponge brush 10 from falling.
  • the position of the second hook 113 opposite to the third plane portion 1130 is an installation gap 1133 , and the second hook 113 can be set on the sponge brush 10 through the installation gap 1133 .
  • the protruding end 102 or the protruding end 102 of the sponge brush 10 falls off.
  • the second hook 113 can also be designed in other forms, as long as it is ensured that the second hook 113 can smoothly slip on and come off the protruding end 102 of the sponge brush 10, and that the second hook 113 can restrict the sponge brush 10 overall spatial degrees of freedom is sufficient.
  • the second hook 113 can be detachably connected to the second beam 111 through screws or bolts, so that when the second hook 113 is damaged, only the second hook 113 needs to be replaced, no need Maintenance or replacement of the entire replacement tool 11 can reduce maintenance costs.
  • the second hook 113 can also be integrally formed with the second beam 111 to simplify the assembly difficulty of the replacement tool 11 .
  • the replacement tool 11 has an anti-corrosion structure as a whole, so as to avoid cleaning crystals in the semiconductor chemical mechanical polishing device during the replacement process of the sponge brush 10 suitable for the semiconductor chemical mechanical polishing device.
  • the round spray liquid corrodes the replacement tool 11 , prolonging the service life of the replacement tool 11 .
  • the overall material of the replacement tool 11 may include, but not limited to, PTFE (polytetrafluoroethylene) and stainless steel, which are resistant to acid and alkali corrosion.
  • PTFE polytetrafluoroethylene
  • stainless steel which are resistant to acid and alkali corrosion.
  • the replacement tool 11 described in any of the foregoing embodiments is not only suitable for replacing the sponge brush 10 in the semiconductor chemical mechanical polishing equipment, but also for replacing other structures, and has a wide range of applications.
  • the present disclosure also provides an installation method for the sponge brush 10 in a semiconductor chemical mechanical polishing device, and the installation method utilizes the replacement tool 11 shown in any of the foregoing embodiments in FIG. 1 to FIG. 10 ; As shown in Figure 11, this installation method may include:
  • Step S100 insert the first hook 112 of the replacement tool 11 into the concave end 103 of the sponge brush 10 and set the second hook 113 of the replacement tool 11 on the protruding end 102 of the sponge brush 10 to clamp the sponge brush 10;
  • Step S102 by moving the replacement tool 11, so that the concave end 103 of the sponge brush 10 rides on the driven shaft of the semiconductor chemical mechanical polishing device;
  • Step S104 detaching the first hook 112 of the replacement tool 11 from the recessed end 103;
  • step S106 a driving force is applied from the second hook 113 of the replacement tool 11 to the first hook 112, so that the concave end 103 of the sponge brush 10 is completely matched with the driven shaft, and the protruding end 102 of the sponge brush 10 is assembled On the driving shaft of semiconductor chemical mechanical polishing equipment;
  • step S108 the second hook 113 of the replacement tool 11 is detached from the protruding end 102 .
  • the replacement tool 11 by using the replacement tool 11 to replace the sponge brush 10, compared with the solution in which the operator replaces the sponge brush 10 with bare hands, the possibility of the sponge brush 10 being contaminated during the replacement process can be greatly reduced, so that the The situation that particles remain on the wafer surface due to the contamination of the sponge brush 10 is avoided, product quality is improved, abnormal consumption of wafer consumables is reduced, and labor costs are saved.
  • the first hook 112 of the replacement tool 11 can be inserted into the concave end 103 of the sponge brush 10 first, and then the second hook 113 of the replacement tool 11 is sleeved on the sponge brush 10 .
  • the protruding end 102; but not prior to this, the second hook 113 of the replacement tool 11 can also be set on the protruding end 102 of the sponge brush 10, and then the first hook 112 can be inserted into the depression of the sponge brush 10 Alternatively, when the first hook 112 is engaged with the concave end 103 of the sponge brush 10 , the second hook 113 of the replacement tool 11 is sleeved on the protruding end 102 of the sponge brush 10 .
  • step S104 may include: rotating the first beam 110 in a direction away from the sponge brush 10, so that the first hook 112 Lift up and disengage from the protruding end 102 of the sponge brush 10 .
  • step S104 may include: sliding the first beam 110 in a direction close to the driven shaft, so that the first hook 112 Slide to the direction away from the second hook 113 and disengage from the protruding end 102 of the sponge brush 10 .
  • the present disclosure also provides a semiconductor chemical mechanical polishing device, which includes a driving shaft (not shown in the figure), a driven shaft (not shown in the figure), and the sponge described in any of the embodiments in FIGS. 1 to 10 .
  • the brush 10 and the replacement tool 11 described in any of the above embodiments; the sponge brush 10 has a concave end 103 and a convex end 102, the specific structure of the sponge brush 10 can refer to the structure described in the previous embodiment, and will not be detailed here.
  • the sponge brush 10 is installed by replacing the tool 11 so that the concave end 103 and the protruding end 102 of the sponge brush 10 are respectively matched with the driven shaft and the driving shaft; wherein, the specific installation method of the sponge brush 10 can refer to the aforementioned embodiments.
  • the installation method of the sponge brush 10 suitable for the semiconductor chemical mechanical polishing equipment will not be described in detail here.
  • the semiconductor chemical mechanical polishing apparatus may further include a spray mechanism 12 for spraying cleaning liquid on the wafer surface to further clean the wafer surface and remove particulate impurities on the wafer surface.
  • a plurality of sponge brushes 10 and spray mechanisms 12 can be provided, and are respectively located on both sides of the wafer, so as to simultaneously clean the two surfaces of the wafer and improve the cleaning efficiency.
  • the semiconductor chemical mechanical polishing apparatus may further include a driving wheel 13 and an idler wheel 14 for driving the wafer to rotate, and the idler wheel 14 is used to ensure the smooth rotation of the wafer; wherein, the driving wheel 13 and the idler wheel 14 Multiple can be set.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
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Abstract

一种适用于半导体化学机械抛光设备中海绵刷（10）的更换工具（11）、安装方法以及半导体化学机械抛光设备，更换工具（11）包括第一横梁（110）、连接机构（114、115）、第二横梁（111）、第一卡勾（112）和第二卡勾（113）；第一横梁（110）通过连接机构（114、115）与第二横梁（111）连接；第一卡勾（112）与第一横梁（110）固定连接，且第一卡勾（112）的部分能够卡入海绵刷（10）的凹陷端（103）；第二卡勾（113）与第二横梁（111）固定连接，且第二卡勾（113）的部分套设在海绵刷（10）的凸出端（102）；其中，第一横梁（110）与第二横梁（111）能够相对运动，以使第一卡勾（112）、第二卡勾（113）能够分别与海绵刷（10）的凹陷端（103）和凸出端（102）相合或相分离。本方案可大大降低海绵刷（10）在更换过程中被污染，且该更换工具（11）上手简单，操作人员通过简单训练即可利用更换工具（11）完成海绵刷（10）的更换。

Description

海绵刷的更换工具和安装方法、半导体化学机械抛光设备
相关申请的交叉引用
本公开要求于2020年07月23日提交的申请号为202010714828.9、名称为“海绵刷的更换工具和安装方法、半导体化学机械抛光设备”的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及半导体技术领域，具体而言，涉及一种适用于半导体化学机械抛光设备中海绵刷的更换工具、适用于半导体化学机械抛光设备中海绵刷的安装方法以及半导体化学机械抛光设备。
背景技术
现阶段，在半导体化学机械抛光(Chemical Mechanical Polishing，简称：CMP)工艺中，在晶圆研磨完成后，需要通过海绵刷搭配化学物质对晶圆进行清洁，目前海绵刷多通过操作人员徒手进行更换，容易对海绵刷造成污染，进而对海绵刷清洁能力造成影响。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。
发明内容
本公开的目的是克服现有技术的不足，提供了一种适用于半导体化学机械抛光设备中海绵刷的更换工具、适用于半导体化学机械抛光设备中海绵刷的安装方法以及半导体化学机械抛光设备。
本公开第一方面提供了一种适用于半导体化学机械抛光设备中海绵刷的更换工具，所述更换工具包括第一横梁、连接机构、第二横梁、第一卡勾和第二卡勾；所述第一横梁通过所述连接机构与所述第二横梁连接；所述第一卡勾与所述第一横梁固定连接，且所述第一卡勾的部分能够卡入海绵刷的凹陷端；所述第二卡勾与所述第二横梁固定连接，且所述第二卡勾的部分套设在所述海绵刷的凸出端；
其中，所述第一横梁与所述第二横梁能够相对运动，以使所述第一卡勾、所述第二卡勾能够分别与所述海绵刷的凹陷端和凸出端相卡合或相分离。
在本公开的一种示例性实施例中，所述连接机构为合页机构；
所述合页机构包括第一连接片、转轴和第二连接片；所述第一连接片通过所述转轴与所述第二连接片转动连接；所述第一连接片与所述第一横梁连接；所述第二连接片与所述第二横梁连接。
在本公开的一种示例性实施例中，所述连接机构为滑动机构，所述滑动机构包括滑动结构及复位弹簧；所述滑动结构设置在所述第二横梁上，且所述第一横梁开设有与所述滑动结构滑动配合的滑孔；所述复位弹簧的两端分别与所述第一横梁和所述第二横梁连接；其中，所述第一卡勾在所述滑动结构与所述滑孔相对滑动时能够向靠近或远离所述第二卡勾的方向移动。
在本公开的一种示例性实施例中，所述滑动结构包括安装在所述第二横梁上的连杆和至少一组设置在所述连杆上的滑动组件；其中，
所述滑动组件包括滑动轴、第一限位片和第二限位片；所述滑动轴的一端安装在所述连杆上，另一端穿过所述滑孔；所述第一限位片限位在所述第一横梁靠近所述第二横梁的一侧并套设在所述滑动轴上；所述第二限位片限位在所述第一横梁远离所述第二横梁的另一侧并与所述滑动轴连接。
在本公开的一种示例性实施例中，所述第一卡勾包括具有一定夹角的第一平面部和第二平面部，以及连接所述第一平面部和所述第二平面部的弧形部；
其中，所述第一平面部、所述第二平面部和所述弧形部的外表面能够与所述海绵刷的凹槽端的内壁面贴合。
在本公开的一种示例性实施例中，所述第二卡勾包括相互平行的第三平面部和第四平面部、以及连接所述第三平面部和所述第四平面部的第五平面部，所述第五平面部与所述第三平面部和所述第四平面部之间为圆弧过渡连接，其中，
所述第三平面部、所述第四平面部和所述第五平面部的内表面与所述海绵刷的凸出端的外壁面贴合。
在本公开的一种示例性实施例中，所述更换工具为防腐结构。
本公开第二方面提供了一种适用于半导体化学机械抛光设备中海绵刷的安装方法，所述安装方法包括：
将上述任一项所述的更换工具的第一卡勾卡入所述海绵刷的凹陷端和将所述更换工具的第二卡勾套设在所述海绵刷的凸出端，以夹持所述海绵刷；
通过移动所述更换工具，以使所述海绵刷的凹陷端搭在所述半导体化学机械抛光 设备的从动轴上；
将所述更换工具的第一卡勾从所述凹陷端中脱离出来；
从所述更换工具的第二卡勾向所述第一卡勾施加驱动力，以使所述海绵刷的凹陷端与所述从动轴完全配合，并使所述海绵刷的凸出端装配在所述半导体化学机械抛光设备的主动轴上；
将所述更换工具的第二卡勾从所述凸出端上脱离出来。
在本公开的一种示例性实施例中，所述将所述更换工具的第一卡勾从所述凹陷端中脱离出来，包括：使所述第一横梁向远离所述海绵刷的方向转动，以使所述第一卡勾翘起并从所述海绵刷的凸出端脱离出来；或
所述将所述更换工具的第一卡勾从所述凹陷端中脱离出来，包括：使所述第一横梁向靠近所述从动轴的方向滑动，以使所述第一卡勾向远离所述第二卡勾的方向滑动并从所述海绵刷的凸出端脱离出来。
本公开第三方面提供了一种半导体化学机械抛光设备，其包括：主动轴、从动轴、海绵刷和上述任一项所述的更换工具；所述海绵刷具有凹陷端和凸出端，所述海绵刷通过所述更换工具以使其所述凹陷端和所述凸出端分别与所述从动轴和所述主动轴配合安装。
本公开提供的技术方案可以达到以下有益效果：
利用本公开所提供的更换工具对适用于半导体化学机械抛光设备中海绵刷进行更换，可避免在更换海绵刷时人为触碰而导致海绵刷被污染的情况，即：相比于操作人员徒手更换海绵刷的方案，本方案可大大降低海绵刷在更换过程中被污染的可能，从而可避免由于海绵刷污染而导致晶圆表面颗粒物残留的情况，提高了产品质量。此外，该更换工具上手简单，操作人员通过简单训练即可利用更换工具完成海绵刷的更换。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图1示出了本公开一实施例所述的更换工具与海绵刷的装配示意图；
图2示出了本公开一实施例所述的更滑工具的第一卡勾与海绵刷的凹陷端的装配示意图；
图3示出了本公开一实施例所述的更滑工具的第二卡勾与海绵刷的凸出端的装配示意图；
图4为现有技术中操作人员徒手更换海绵刷后，海绵刷清洁完的晶圆表面的示意图；
图5为本公开一实施例中采用更换工具更换海绵刷后，海绵刷清洁完的晶圆表面的示意图；
图6示出了本公开一实施例所述的更换工具在一视角下的平面示意图；
图7示出了本公开另一实施例所述的更换工具的透视结构示意图；
图8示出了本公开另一实施例所述的更换工具中第一横梁、第二横梁及滑动机构装配后的透视结构示意图；
图9示出了本公开一实施例所述的更换工具的第一卡勾在一视角下的平面示意图；
图10示出了本公开一实施例所述的更换工具的第二卡勾在一视角下的立体示意图；
图11示出了本公开一实施例所述的适用于半导体化学机械抛光设备中海绵刷的安装方法的流程图；
图12示出了本公开一实施例所述的半导体化学机械抛光设备中部分结构的位置关系示意图。
附图标记：
10、海绵刷；101、滚刷部；1010、海绵刷头；102、凸出端；103、凹陷端；
11、更换工具；110、第一横梁；1101、滑孔；111、第二横梁；112、第一卡勾；1120、第一平面部；1121、第二平面部；1122、弧形部；113、第二卡勾；1130、第三平面部；1131、第四平面部；1132、第五平面部；1133、安装缺口；114、合页机构；1141、第一连接片；1142、第二连接片；1143、转轴；115、滑动机构；1150、复位弹簧；1151、连杆；1152、滑动轴；1153、第一限位片；1154、第二限位片；
12、喷淋机构；13、主动轮；14、惰性轮；15、晶圆。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本公开将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。
虽然本说明书中使用相对性的用语，例如“上”“下”来描述图标的一个组件对于另一组件的相对关系，但是这些术语用于本说明书中仅出于方便，例如根据附图中所述的示例的方向。能理解的是，如果将图标的装置翻转使其上下颠倒，则所叙述在“上”的组件将会成为在“下”的组件。当某结构在其它结构“上”时，有可能是指某结构一体形成于其它结构上，或指某结构“直接”设置在其它结构上，或指某结构通过另一结构“间接”设置在其它结构上。
用语“一个”、“一”、“该”、“所述”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等；用语“第一”和“第二”等仅作为标记使用，不是对其对象的数量限制。
如图1、图2、图3、图7所示，本公开实施例提供了一种更换工具11，此更换工具11可对适用于半导体化学机械抛光设备中的海绵刷10进行更换；其中：
海绵刷10可包括滚刷部101和位于滚刷部101两端的凸出端102和凹陷端103；此滚刷部101可包括滚刷轴及包裹在滚刷轴外周面的海绵结构，且海绵结构的外表面可具有均匀且间隔排布的海绵刷头1010，以用于对晶圆的表面进行更好的清洁；凸出端102可位于滚刷轴的一端，并相对海绵结构的一端面凸出设置；凹陷端103可位于滚刷轴的另一端，并相对海绵结构的另一端面凹陷设置；其中，此凸出端102可用于与半导体化学机械抛光设备中的主动轴配合安装，凹陷端103用于与半导体化学机械抛光设备中的从动轴配合安装，以使整个海绵刷10安装在半导体化学机械抛光设备中。
需要说明的是，此滚刷轴、凸出端102、凹陷端103可为金属材料或合金材料，这样可保证整个海绵刷10的结构强度，以便于海绵刷10与其他结构(例如：从动轴、主动轴、更换工具11等)配合；但不限于此，也可为其他材料，只要能够保证海绵刷10整体具有一定强度即可。此外，凸出端102、凹陷端103与滚刷轴之间为可拆卸连接或不可拆卸连接，视具体情况而定。
而更换工具11可包括第一横梁110、连接机构114、115、第二横梁111、第一卡勾112和第二卡勾113；此第一横梁110可通过连接机构114、115与第二横梁111连接；第一卡勾112可与第一横梁110固定连接，且第一卡勾112的部分能够卡入海绵刷10的凹陷端103；第二卡勾113与第二横梁111固定连接，且第二卡勾113的部分套设在海绵刷10的凸出端102；其中，第一横梁110与第二横梁111能够相对运动，以使第一卡勾112、第二卡勾113能够分别与海绵刷10的凹陷端103和凸出端102相分离；具体地，在需要对半导体化学机械抛光设备中的海绵刷10进行更换时，可使第二卡勾113的部分套设在海绵刷10的凸出端102，然后使第一横梁110相对第二横梁111运动，使得第一卡勾112卡入海绵刷10的凹陷端103，从而使得更换工具11夹持住海绵刷10，然后对海绵刷10进行更换；当完成海绵刷10的更换时，可使第一横梁110相对第二横梁111运动，以使第一卡勾112从海绵刷10的凹陷端103脱离出来，并使第二卡勾113从海绵刷10的凸出端102上脱离出来。
在本公开的实施例中，通过利用本公开所提供的更换工具11对适用于半导体化学机械抛光设备中海绵刷10进行更换，可避免在更换海绵刷10时人为直接或间接触碰而导致海绵刷10被污染的情况，具体如图4和图5所示，图4为现有技术中操作人员徒手更换海绵刷10后，海绵刷10清洁完的晶圆15表面的示意图；图5为本公开采用更换工具11更换海绵刷10后，海绵刷10清洁完的晶圆15表面的示意图；经对比图4和图5中晶圆15表面的颗粒物(图中晶圆15上的黑点)残留情况可知，图4中晶圆15表面的颗粒物残留较多，图5中晶圆15表面的颗粒物残留较少。
由此可知，本方案通过采用更换工具11对海绵刷10进行更换，相比于操作人员徒手更换海绵刷10的方案，可大大降低海绵刷10在更换过程中被污染的可能，从而可避免由于海绵刷10污染而导致晶圆表面颗粒物残留过多的情况，提高了产品质量，降低了晶圆耗材的异常消耗，以及节约了人力成本。
此外，该更换工具11上手简单，操作人员通过简单训练即可利用更换工具11完成海绵刷10的更换。
需要说明的是，本公开中提到的固定连接指的是两个部件连接之后不会发生相对运动，并不是指代相连接的两个部件不可拆卸，本公开中固定连接的两个部件可为一体成型，不可拆卸；也可进行拆卸，视具体情况而定。
举例而言，由于在更换工具11夹持海绵刷10的过程中，通常先确定第二横梁111的位置，然后再调整第一横梁110的位置；因此，为了方便快速调整第二横梁111， 如图6所示，可使第一横梁110的长度可小于第二横梁111的长度，但不限于此，也可大于或等于第二横梁111的长度，视具体情况而定。
在本公开的一个实施例中，如图1和图6所示，前述提到的连接机构可为合页机构114；其中，合页机构114可包括第一连接片1141、转轴1143和第二连接片1142；此第一连接片1141可通过转轴1143与第二连接片1142转动连接；第一连接片1141可与第一横梁110连接；且第二连接片1142可与第二横梁111连接；具体地，在需要对半导体化学机械抛光设备中的海绵刷10进行更换时，可先使第二卡勾113的部分套设在海绵刷10的凸出端102，此时，第二横梁111的位置已确定；然后使第一横梁110向靠近海绵刷10的方向转动，以使得第一卡勾112卡入海绵刷10的凹陷端103，从而使得更换工具11夹持住海绵刷10，然后对海绵刷10进行更换；当完成海绵刷10的更换时，可使第一横梁110向远离海绵刷10的方向转动，以使第一卡勾112从海绵刷10的凹陷端103脱离出来；然后使第二卡勾113从海绵刷10的凸出端102上脱离出来。
需要说明的是，合页机构114可为金属材料或合金材料，以保证合页机构114具有足够的强度，保证结构稳定性；但不限于此，也可为其他材质，视具体情况而定。此外，第一连接片1141可通过螺钉与第一横梁110连接；且第二连接片1142可通过螺钉与第二横梁111连接；但不限于此，也可采用其他方式连接。
在本公开的另一个实施例中，如图7和图8所示，连接机构为滑动机构115，此滑动机构115可包括滑动结构和复位弹簧1150；此滑动结构可设置在第二横梁111上，且第一横梁110开设有与滑动结构滑动配合的滑孔1101；复位弹簧1150的两端分别与第一横梁110和第二横梁111连接；其中，第一卡勾112在滑动结构与滑孔1101相对滑动时能够向靠近或远离第二卡勾113的方向移动；具体地，在需要对半导体化学机械抛光设备中的海绵刷10进行更换时，可先使第二卡勾113的部分套设在海绵刷10的凸出端102，此时，第二横梁111的位置已确定；然后将第一横梁110向远离第二横梁111的方向拉动，使得第一卡勾112能够卡入海绵刷10的凹陷端103，从而使得更换工具11夹持住海绵刷10，然后对海绵刷10进行更换；当完成海绵刷10的更换时，将第一横梁110向远离第二方向的方向拉动，以使第一卡勾112从海绵刷10的凹陷端103脱离出来；然后使第二卡勾113从海绵刷10的凸出端102上脱离出来。需要说明的是，在更换工具11从海绵刷10上脱离下来后，第一横梁110可在复位弹簧1150恢复弹性形变时向靠近第一横梁110的方向滑动，即：完成复位。
在一个实施例中，如图8所示，滑动结构可包括安装在第二横梁111上的连杆1151和至少一组设置在连杆1151上的滑动组件；其中，滑动组件可包括滑动轴1152、第一限位片1153和第二限位片1154；此滑动轴1152的一端可安装在连杆1151上，另一端穿过滑孔1101；而第一限位片1153限位在第一横梁110靠近第二横梁111的一侧并套设在滑动轴1152上；第二限位片1154限位在第一横梁110远离第二横梁111的另一侧并与滑动轴1152连接，此第二限位片1154可与滑动轴1152可拆卸连接或不可拆卸连接，视具体情况而定。
举例而言，此滑孔1101可为长圆形，如图8所示，滑孔1101的长度方向可为第一横梁110和第二横梁111的长度方向；而第一限位片1153和第二限位片1154可为圆形，如图8所示，且第一限位片1153和第二限位片1154的径向尺寸大于滑孔1101的宽度，以保证第一限位片1153和第二限位片1154分别限位在第一横梁110的两侧，以保证第一横梁110和第二横梁111的连接稳定性。
需要说明的是，滑孔1101、第一限位片1153和第二限位片1154的形状不限于此前述提到的形状，也可为其他形状，只要保证第一横梁110和第二横梁111之间能够相对滑动，且滑动稳定即可。
如图8所示，滑动组件可设置两个，或者更多个，这样在保证第一横梁110和第二横梁111能够相对滑动的同时，还可保证滑动稳定性。
需要说明的是，本公开实施例的连接机构不限于为前述提到的合页机构114和滑动机构115，也可为其他机构，只要能保证更换工具11能够便于夹持海绵刷10和便于从海绵刷10上脱离下来即可。
在本公开的一实施例中，如图2和图9所示，第一卡勾112可包括具有一定夹角的第一平面部1120和第二平面部1121，以及连接第一平面部1120和第二平面部1121的弧形部1122；其中，第一平面部1120、第二平面部1121和弧形部1122的外表面能够与海绵刷10的凹槽端的内壁面贴合；通过将第一卡勾112进行前述设计，这样可限制海绵刷10整体的空间自由度，避免第一卡勾112与海绵刷10的凹槽端能够发生相对转动的情况，从而能够保证更换工具11稳定地夹持海绵刷10，避免海绵刷10掉落的情况。
举例而言，此第一平面部1120和第二平面部1121之间的夹角可为锐角或直角，但不限于此。
需要说明的是，第一卡勾112也可设计为其他形式，只要保证第一卡勾112能够 顺利卡入和脱出海绵刷10的凹槽端，且保证第一卡勾112能够限制海绵刷10整体的空间自由度即可。
举例而言，此第一卡勾112可通过螺钉或螺栓与第一横梁110可拆卸连接，这样可在第一卡勾112损坏时，只需对第一卡勾112进行更换即可，不需要对整个更换工具11进行维修或替换，可降低维修成本。但不限于此，第一卡勾112也可与第一横梁110为一体成型，以简化更换工具11的组装难度。
在本公开的一实施例中，如图3、图7及图10所示，第二卡勾113包括相互平行的第三平面部1130和第四平面部1131、以及连接第三平面部1130和第四平面部1131的第五平面部1132，第五平面部1132与第三平面部1130和第四平面部1131之间为圆弧过渡连接，其中，第三平面部1130、第四平面部1131和第五平面部1132的内表面与海绵刷10的凸出端102的外壁面贴合；通过将第二卡勾113进行前述设计，这样可限制海绵刷10整体的空间自由度，避免第二卡勾113与海绵刷10的凸出端102能够发生相对转动的情况，从而能够保证更换工具11稳定地夹持海绵刷10，避免海绵刷10掉落的情况。
应当理解的是，如图10所示，第二卡勾113中与第三平面部1130相对的位置为安装缺口1133，第二卡勾113可通过经此安装缺口1133套设在海绵刷10的凸出端102或从海绵刷10的凸出端102脱落下来。
需要说明的是，第二卡勾113也可设计为其他形式，只要保证第二卡勾113能够顺利套上和脱出海绵刷10的凸出端102，且保证第二卡勾113能够限制海绵刷10整体的空间自由度即可。
举例而言，此第二卡勾113可通过螺钉或螺栓与第二横梁111可拆卸连接，这样可在第二卡勾113损坏时，只需对第二卡勾113进行更换即可，不需要对整个更换工具11进行维修或替换，可降低维修成本。但不限于此，第二卡勾113也可与第二横梁111为一体成型，以简化更换工具11的组装难度。
在本公开的一实施例中，此更换工具11整体为防腐结构，以避免在对适用于半导体化学机械抛光设备中的海绵刷10进行更换的过程中，半导体化学机械抛光设备中用于清洁晶圆的喷淋液腐蚀更换工具11的情况，延长了更换工具11的使用寿命。
举例而言，更换工具11的整体材质可以包括但不限于PTFE(聚四氟乙烯)及不锈钢在内的耐酸碱腐蚀材质。
应当理解的是，前述任一实施例所描述的更换工具11不仅可适用于对半导体化 学机械抛光设备中的海绵刷10进行更换，也可对其他结构进行更换，适用范围广泛。
本公开还提供了一种适用于半导体化学机械抛光设备中海绵刷10的安装方法，此安装方法利用到了前述图1至图10中任一实施例所示出的更换工具11；具体地，如图11所示，此安装方法可包括：
步骤S100，将更换工具11的第一卡勾112卡入海绵刷10的凹陷端103和将更换工具11的第二卡勾113套设在海绵刷10的凸出端102，以夹持海绵刷10；
步骤S102，通过移动更换工具11，以使海绵刷10的凹陷端103搭在半导体化学机械抛光设备的从动轴上；
步骤S104，将更换工具11的第一卡勾112从凹陷端103中脱离出来；
步骤S106，从更换工具11的第二卡勾113向第一卡勾112施加驱动力，以使海绵刷10的凹陷端103与从动轴完全配合，并使海绵刷10的凸出端102装配在半导体化学机械抛光设备的主动轴上；
步骤S108，将更换工具11的第二卡勾113从凸出端102上脱离出来。
在本公开的实施例中，通过采用更换工具11对海绵刷10进行更换，相比于操作人员徒手更换海绵刷10的方案，可大大降低海绵刷10在更换过程中被污染的可能，从而可避免由于海绵刷10污染而导致晶圆表面颗粒物残留的情况，提高了产品质量，降低了晶圆耗材的异常消耗，以及节约了人力成本。
需要说明的是，在步骤S100中，更换工具11的第一卡勾112可先卡入海绵刷10的凹陷端103，然后在使更换工具11的第二卡勾113套设在海绵刷10的凸出端102；但不先于此，也可先使更换工具11的第二卡勾113套设在海绵刷10的凸出端102，然后使第一卡勾112卡入海绵刷10的凹陷端103；或者，第一卡勾112卡入海绵刷10的凹陷端103的同时，更换工具11的第二卡勾113套设在海绵刷10的凸出端102。
在本公开的一实施例中，当更换工具11中的连接机构为合页机构114时，步骤S104可包括：使第一横梁110向远离海绵刷10的方向转动，以使第一卡勾112翘起并从海绵刷10的凸出端102脱离出来。
在本公开的另一实施例中，当更换工具11中的连接机构为滑动机构115时，步骤S104可包括：使第一横梁110向靠近从动轴的方向滑动，以使第一卡勾112向远离第二卡勾113的方向滑动并从海绵刷10的凸出端102脱离出来。
本公开还提供了一种半导体化学机械抛光设备，其包括主动轴(图中未示出)、从动轴(图中未示出)、图1至图10中任一实施例所描述的海绵刷10和上述任一实 施例所描述的更换工具11；海绵刷10具有凹陷端103和凸出端102，此海绵刷10的具体结构可参考前述实施例所描述的结构，在此不再详细赘述；且海绵刷10通过更换工具11以使其凹陷端103和凸出端102分别与从动轴和主动轴配合安装；其中，海绵刷10的具体安装方法可参考前述实施例中所提到的适用于半导体化学机械抛光设备中海绵刷10的安装方法，在此不再详细赘述。
此外，如图12所示，半导体化学机械抛光设备还可包括喷淋机构12，用于向晶圆表面喷淋清洁液体，以对晶圆表面进行进一步清洁，去除晶圆表面上的颗粒杂质。
需要说明的是，海绵刷10和喷淋机构12可设置多个，并分别位于晶圆的两侧，以同时对晶圆的两个表面进行清洁，提高清洁效率。
如图12所示，半导体化学机械抛光设备还可包括主动轮13和惰性轮14，用于驱动晶圆转动，惰性轮14用于保证晶圆转动平稳性；其中，主动轮13、惰性轮14可设置多个。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由所附的权利要求指出。

Claims (10)

  1. 一种适用于半导体化学机械抛光设备中海绵刷的更换工具，其中，所述更换工具包括第一横梁、连接机构、第二横梁、第一卡勾和第二卡勾；所述第一横梁通过所述连接机构与所述第二横梁连接；所述第一卡勾与所述第一横梁固定连接，且所述第一卡勾的部分能够卡入海绵刷的凹陷端；所述第二卡勾与所述第二横梁固定连接，且所述第二卡勾的部分套设在所述海绵刷的凸出端；
    其中，所述第一横梁与所述第二横梁能够相对运动，以使所述第一卡勾、所述第二卡勾能够分别与所述海绵刷的凹陷端和凸出端相合或相分离。
  2. 根据权利要求1所述的更换工具，其中，所述连接机构为合页机构；
    所述合页机构包括第一连接片、转轴和第二连接片；所述第一连接片通过所述转轴与所述第二连接片转动连接；所述第一连接片与所述第一横梁连接；所述第二连接片与所述第二横梁连接。
  3. 根据权利要求1所述的更换工具，其中，所述连接机构为滑动机构，所述滑动机构包括滑动结构及复位弹簧；所述滑动结构设置在所述第二横梁上，且所述第一横梁开设有与所述滑动结构滑动配合的滑孔；所述复位弹簧的两端分别与所述第一横梁和所述第二横梁连接；其中，所述第一卡勾在所述滑动结构与所述滑孔相对滑动时能够向靠近或远离所述第二卡勾的方向移动。
  4. 根据权利要求3所述的更换工具，其中，
    所述滑动结构包括安装在所述第二横梁上的连杆和至少一组设置在所述连杆上的滑动组件；其中，
    所述滑动组件包括滑动轴、第一限位片和第二限位片；所述滑动轴的一端安装在所述连杆上，另一端穿过所述滑孔；所述第一限位片限位在所述第一横梁靠近所述第二横梁的一侧并套设在所述滑动轴上；所述第二限位片限位在所述第一横梁远离所述第二横梁的另一侧并与所述滑动轴连接。
  5. 根据权利要求1所述的更换工具，其中，所述第一卡勾包括具有一定夹角的第一平面部和第二平面部，以及连接所述第一平面部和所述第二平面部的弧形部；
    其中，所述第一平面部、所述第二平面部和所述弧形部的外表面能够与所述海绵刷的凹槽端的内壁面贴合。
  6. 根据权利要求1所述的更换工具，其中，所述第二卡勾包括相互平行的第三 平面部和第四平面部、以及连接所述第三平面部和所述第四平面部的第五平面部，所述第五平面部与所述第三平面部和所述第四平面部之间为圆弧过渡连接，其中，
    所述第三平面部、所述第四平面部和所述第五平面部的内表面与所述海绵刷的凸出端的外壁面贴合。
  7. 根据权利要求1至6中任一项所述的更换工具，其中，所述更换工具为防腐结构。
  8. 一种适用于半导体化学机械抛光设备中海绵刷的安装方法，其中，所述安装方法包括：
    将如权利要求1所述的更换工具的第一卡勾卡入所述海绵刷的凹陷端和将所述更换工具的第二卡勾套设在所述海绵刷的凸出端，以夹持所述海绵刷；
    通过移动所述更换工具，以使所述海绵刷的凹陷端搭在所述半导体化学机械抛光设备的从动轴上；
    将所述更换工具的第一卡勾从所述凹陷端中脱离出来；
    从所述更换工具的第二卡勾向所述第一卡勾施加驱动力，以使所述海绵刷的凹陷端与所述从动轴完全配合，并使所述海绵刷的凸出端装配在所述半导体化学机械抛光设备的主动轴上；
    将所述更换工具的第二卡勾从所述凸出端上脱离出来。
  9. 根据权利要求8所述的安装方法，其中，
    所述更换工具为权利要求2所述的更换工具；其中，所述将所述更换工具的第一卡勾从所述凹陷端中脱离出来，包括：使所述第一横梁向远离所述海绵刷的方向转动，以使所述第一卡勾翘起并从所述海绵刷的凸出端脱离出来；或
    所述更换工具为权利要求3所述的更换工具；其中，所述将所述更换工具的第一卡勾从所述凹陷端中脱离出来，包括：使所述第一横梁向靠近所述从动轴的方向滑动，以使所述第一卡勾向远离所述第二卡勾的方向滑动并从所述海绵刷的凸出端脱离出来。
  10. 一种半导体化学机械抛光设备，其中，包括：主动轴、从动轴、海绵刷和如权利要求要求1至7中任一项所述的更换工具；所述海绵刷具有凹陷端和凸出端，所述海绵刷通过所述更换工具以使其所述凹陷端和所述凸出端分别与所述从动轴和所述主动轴配合安装。
PCT/CN2021/093136 2020-07-23 2021-05-11 海绵刷的更换工具和安装方法、半导体化学机械抛光设备 Ceased WO2022016963A1 (zh)

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