WO2022014432A1 - フィルタ回路および、これを含む電源装置 - Google Patents
フィルタ回路および、これを含む電源装置 Download PDFInfo
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- WO2022014432A1 WO2022014432A1 PCT/JP2021/025589 JP2021025589W WO2022014432A1 WO 2022014432 A1 WO2022014432 A1 WO 2022014432A1 JP 2021025589 W JP2021025589 W JP 2021025589W WO 2022014432 A1 WO2022014432 A1 WO 2022014432A1
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- Prior art keywords
- coil
- filter circuit
- coil conductor
- inductor
- power supply
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/01—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for shielding from electromagnetic fields, i.e. structural association with shields
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0138—Electrical filters or coupling circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/09—Filters comprising mutual inductance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1708—Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/175—Series LC in series path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1758—Series LC in shunt or branch path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/0026—Multilayer LC-filter
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
Definitions
- the present disclosure relates to a filter circuit and a power supply device including the filter circuit.
- Filter circuits are often used as noise countermeasures for electronic devices.
- This filter circuit is, for example, an EMI (Electro-Magnetic Interference) removal filter or the like, and removes an unnecessary component through a necessary component of the current flowing through the conductor.
- a capacitor which is a capacitance element, is used in the filter circuit, but it is known that the noise suppression effect is reduced by the equivalent series inductance (ESL: Equivalent Series Inductance), which is the parasitic inductance of the capacitor.
- ESL Equivalent Series Inductance
- Patent Document 1 In order to cancel the equivalent series inductance of this capacitor, a technique using a coil component including two coils that are magnetically coupled is known (for example, Patent Document 1). In this technique, the equivalent series inductance is canceled by the negative inductance generated by the coil component, and the noise suppression effect of the filter circuit is widened.
- the power supply line is divided and the filter circuit is arranged. Therefore, the coil components included in the filter circuit must be able to withstand the current flowing through the power supply line. ..
- a filter circuit is used as a power source that allows a higher current to flow, it is necessary to take measures against high current, such as increasing the cross-sectional area of the conductor, for the coil components included in the filter circuit.
- an object of the present disclosure is to provide a filter circuit capable of passing a high current while considering restrictions on size and manufacturing cost, and a power supply device including the filter circuit.
- the filter circuit electrically connects a coil component in which a first coil conductor and a second coil conductor are magnetically coupled, and one end of the first coil conductor and one end of the second coil conductor.
- An inductor connected in parallel to a coil component, and a capacitor in which the other end of the first coil conductor and the other end of the second coil conductor are electrically connected and electrically connected between the electrode and the ground electrode.
- the power supply device includes a power supply, a power supply line connected to the power supply and supplying power to the load, and the above-mentioned filter circuit connected to the power supply line.
- the inductor is electrically connected to one end of the first coil conductor and one end of the second coil conductor and connected in parallel to the coil component, there are restrictions on size and manufacturing cost. It is possible to realize a filter circuit capable of passing a high current and a power supply device including the filter circuit while considering the above.
- the filter circuit and the power supply device including the filter circuit according to the present embodiment will be described below.
- FIG. 1 is a circuit diagram of a filter circuit including coil components according to the present embodiment.
- FIG. 2 is a perspective view and a side view of the coil component according to the present embodiment.
- FIG. 3 is an exploded plan view showing the configuration of the coil component according to the present embodiment.
- the filter circuit 100 is, for example, an EMI removal filter and is a third-order T-type LC filter circuit.
- a coil component 1 is used in the filter circuit 100.
- a third-order T-type LC filter circuit will be described as a configuration of the filter circuit 100, but the fifth-order T-type LC filter circuit and a higher-order T-type LC filter circuit may be used. However, coil components having the same configuration can be applied.
- the filter circuit 100 includes a coil component 1, an inductor 2, and a capacitor C1.
- a coil component 1, an inductor 2, and a capacitor C1 are mounted on a substrate (not shown).
- the coil component 1 magnetically couples the coil L1 (first coil conductor) and the coil L2 (second coil conductor).
- the inductor 2 is electrically connected to one end of the coil L1 and one end of the coil L2, and is connected in parallel to the coil component 1.
- the other end of the coil L1 and the other end of the coil L2 are electrically connected and electrically connected between the electrode 4c (third electrode) and the GND electrode (ground electrode).
- the capacitor C1 is not only a multilayer ceramic capacitor containing BaTiO3 (barium titanate) as a main component, but also a multilayer ceramic capacitor containing other materials as a main component, which is not a multilayer ceramic capacitor, for example, other types such as an aluminum electrolytic capacitor. It may be a capacitor.
- the capacitor C1 has an inductor L3 as a parasitic inductance (equivalent series inductance (ESL)), which is equivalent to a circuit configuration in which the inductor L3 is connected in series with the capacitor C1a.
- ESL Equivalent series inductance
- the capacitor C1 may be equivalent to a circuit configuration in which a parasitic resistance (equivalent series resistance (ESR)) is further connected in series to the inductor L3 and the capacitor C1a.
- the coil L1 and the coil L2 are connected to the electrode 4c.
- the coil L1 and the coil L2 are magnetically coupled to generate a negative inductance component.
- the parasitic inductance (inductor L3) of the capacitor C1 can be canceled, and the inductance component of the capacitor C1 can be apparently reduced.
- the filter circuit 100 composed of the capacitor C1, the coil L1 and the coil L2 has a negative inductance component due to the mutual inductance of the coil L1 and the coil L2, and cancels the parasitic inductance of the capacitor C1 to suppress noise in the high frequency band. Can be improved.
- the power supply line is divided and the filter circuit 100 is arranged. Therefore, the coil component 1 included in the filter circuit 100 is used as the current flowing through the power supply line. Need to be endured. Specifically, when the electrode 4a (first electrode) and the electrode 4b (second electrode) are connected to the power supply line, the current of the power supply line flows through the coil L1 and the coil L2, so that a higher current can be passed. It is necessary to take measures against high current, such as increasing the cross-sectional area of the conductors of the coil L1 and the coil L2.
- the inductor 2 connected in parallel to the coil component 1 is provided.
- the inductor 2 is a chip coil, ferrite beads, or the like that is electrically connected to one end of the coil L1 and one end of the coil L2.
- the current of the power supply line can be divided into a current flowing through the coil L1 and the coil L2 and a current flowing through the inductor 2. Therefore, in the filter circuit 100, it is possible to pass a high current without adopting a high current withstanding measure for the coil component 1.
- the inductor 2 In order for the inductor 2 to simply function as a current bypass path for the coil component 1, the inductor 2 must mount the coil component 1 and the inductor 2 on a substrate so as not to magnetically couple with the coil component 1. Is preferable. Specifically, the coil component 1 and the inductor are located at positions where the opening of the coil conductor (not shown) formed inside the inductor 2 does not overlap with the openings of the coil L1 and the coil L2 when viewed from the stacking direction of the laminated body 3. It is preferable to mount 2 and 2 on the substrate.
- the coil component 1 is composed of a laminated body 3 (ceramic prime field) of a ceramic layer in which a plurality of substrates (ceramic green sheets) on which coil wiring is formed are laminated.
- the laminated body 3 has a pair of main surfaces facing each other and side surfaces connecting the main surfaces.
- the coil L1 and the coil L2 are formed parallel to the main surface of the laminated body 3.
- the side surfaces of the laminated body 3 include a first side surface (side surface forming the electrode 4c) and a second side surface (side surface forming the electrode 4d) on the long side side, and a third side surface (electrode 4a) on the short side side. It has a formed side surface) and a fourth side surface (side surface on which the electrode 4b is formed).
- the wiring pattern 10, the wiring pattern 20, and the wiring pattern 30 constituting the coils L1 and L2 are arranged inside the laminated body 3.
- one end 11 is electrically connected to the electrode 4a
- the other end 12 is electrically connected to the middle layer wiring pattern 20 via the via 5.
- one end 22 is electrically connected to the lower wiring pattern 10 via the via 5
- the other end 23 is electrically connected to the upper wiring pattern 30 via the via 6. It is connected.
- the wiring pattern 20 has an end portion 21 electrically connected to the electrode 4c between one end portion 22 and the other end portion 23.
- one end 31 is electrically connected to the electrode 4b, and the other end 32 is electrically connected to the middle layer wiring pattern 20 via the via 6.
- the coil L1 (first coil conductor) is formed by the wiring pattern 10 and the wiring pattern 20 from the end 21 to the end 22, and the wiring pattern 30 and the wiring pattern 20 from the end 21 to the end 23 form the coil L1 (first coil conductor).
- a coil L2 (second coil conductor) is configured.
- the short side direction is the X direction
- the long side direction is the Y direction
- the height direction is the Z direction.
- the stacking direction of the substrates is the Z direction
- the direction of the arrow indicates the upper layer direction.
- the coil component 1 is configured by laminating three wiring patterns 10 to 30 as shown in FIG. 2 (b).
- each of the wiring pattern 10, the wiring pattern 20, and the wiring pattern 30 is configured by laminating a plurality of wirings.
- the wiring pattern 20 may have a smaller number of stacked wirings than the wiring pattern 10 and the wiring pattern 30.
- the wiring patterns 10 to 30 are shown with a difference in thickness.
- each of the wiring pattern 10, the wiring pattern 20, and the wiring pattern 30 is a wiring pattern in which a conductive paste (Ni paste) is printed on ceramic green sheets 3a to 3c, which are substrates, by a screen printing method.
- a conductive paste Ni paste
- the ceramic green sheet 3a shown in FIG. 3A is formed with an electrode of the wiring pattern 30, an end portion 31 connected to the electrode 4b, and a connecting portion 6a connected to the via 6 at the end portion 32.
- the wiring pattern 30 shown in FIG. 2 is formed by laminating a plurality of the ceramic green sheets 3a (for example, 6 layers).
- the ceramic green sheet 3b shown in FIG. 3B has an electrode of the wiring pattern 20, an end portion 21 connected to the electrode 4c, a connection portion 5b connected to the via 5 at the end portion 22, and a via 6 connected to the end portion 23.
- the connecting portion 6b is formed.
- the wiring pattern 20 shown in FIG. 2 is formed by laminating a plurality of the ceramic green sheets 3b (for example, three layers).
- the ceramic green sheet 3c shown in FIG. 3C is formed with an electrode of the wiring pattern 10, an end portion 11 connected to the electrode 4a, and a connecting portion 5a connected to the via 5 at the end portion 12.
- the wiring pattern 10 shown in FIG. 2 is formed by laminating a plurality of the ceramic green sheets 3c (for example, 6 layers).
- a plurality of each of the plurality of ceramic green sheets 3a to 3c shown in FIG. 3 are laminated, and a plurality of ceramic green sheets (dummy layers) having no wiring pattern printed on both upper and lower sides thereof are laminated.
- an unfired laminated body 3 (ceramic prime field) is formed.
- the formed laminate 3 is fired, and copper electrodes are baked onto the outside of the fired laminate 3 so as to be conductive with the wiring pattern to form the electrodes 4a to 4d.
- the wiring pattern 10 In the coil component 1, a plurality of ceramic green sheets forming the wiring of the wiring pattern 10, the wiring pattern 20, and the wiring pattern 30 constituting the coils L1 and L2 are laminated. Therefore, in the coil component 1, the wiring pattern 10, the wiring pattern 20, and the wiring pattern 30 have a multi-layer structure to reduce the resistance and size of the coils L1 and L2.
- FIG. 4 is a block diagram for explaining the configuration of the filter circuit.
- FIG. 4A is a block diagram showing the configuration of the filter circuit 100 according to the present embodiment.
- the inductor (LQM) 2 is connected in parallel to the filter circuit (LCT) 1, and the filter circuit (LCT) 1 is connected to the GND electrode via the capacitor C1. ..
- the DC resistance value of the inductor 2 is smaller than the DC resistance value between one end of the coil L1 of the coil component 1 and one end of the coil L2 (hereinafter, simply referred to as the DC resistance value of the coil component 1). preferable.
- the DC resistance value of the coil component 1 is 40 m ⁇
- a ferrite bead of 19 m ⁇ smaller than the DC resistance value of the coil component 1 is used for the inductor 2.
- the filter circuit 100 can allow more direct current to flow from the coil component 1 side to the inductor 2 side.
- the filter circuit 100 can be applied to a power source that allows a current of 9 A to flow if a current of 6 A can be passed through the inductor 2.
- the impedance value of the inductor 2 may be equal to or higher than the impedance value between one end of the coil L1 of the coil component 1 and one end of the coil L2 (hereinafter, simply referred to as the impedance value of the coil component 1). preferable.
- the inductance value of the coil component 1 is 8 nH so that the impedance value of the inductor 2 is equal to or higher than the impedance value of the coil component 1, the inductor 2 has 100 nH ferrite beads equal to or higher than the inductance value of the coil component 1. Is used.
- the filter circuit 100 can allow more AC noise components from the power supply to flow from the inductor 2 side to the coil component 1 side.
- FIG. 5 is a graph showing transmission characteristics with respect to the frequency of the filter circuit.
- a circuit simulation was performed on the filter circuit 100 shown in FIG. 4, and the results showing the transmission characteristics with respect to the frequency are shown as a graph in FIG.
- the horizontal axis is the frequency Freq (MHz) and the vertical axis is the transmission characteristic S21 (dB).
- the graph A shown in FIG. 5 is a graph showing the transmission characteristics when the circuit is simulated for the filter circuit 100 shown in FIG. 4 (a).
- the transmission characteristic S21 is -50 dB or less at a frequency Freq up to about 550.0 MHz, indicating that noise signals in the high frequency band including the FM band (several tens of MHz) can be suppressed.
- the transmission characteristic S21 suddenly increases at frequencies after about 300.0 MHz. This is because the inductor 2 has a self-resonant frequency due to stray capacitance in the vicinity of about 300.0 MHz, and when the frequency becomes higher than the frequency, the impedance value of the inductor 2 drops sharply. That is, in the filter circuit 100, the AC noise component from the power supply tends to flow to the inductor 2 side at a frequency of about 300.0 MHz or higher, and the filter effect of the AC noise component by the coil component 1 is reduced.
- FIG. 5 is a graph showing transmission characteristics when a circuit is simulated for the filter circuit shown in FIG. 4 (b).
- FIG. 4B is a block diagram showing a configuration related to the filter circuit to be compared with the filter circuit 100.
- the inductor 2 is not provided and only the coil component 1 is provided, and the coil component 1 is connected to the GND electrode via the capacitor C1.
- Graph B shows that the transmission characteristic S21 is -50 dB or less at a frequency Freq up to about 1000.0 MHz, and noise signals in the high frequency band including the FM band (several tens of MHz) can be suppressed.
- the filter circuit shown in FIG. 4B does not have the inductor 2, and is not affected by the change in the impedance value of the inductor 2.
- the filter circuit that does not have the inductor 2 cannot pass a high current unless measures against high current resistance are adopted.
- FIG. 5 is a graph showing the transmission characteristics when the circuit is simulated for the filter circuit shown in FIG. 4 (c).
- FIG. 4C is a block diagram showing a configuration related to a filter circuit to be compared with the filter circuit 100. In the filter circuit shown in FIG. 4C, the coil component 1 and the inductor 2 are not provided, and the capacitor C1 is connected between the power supply line and the GND electrode.
- Graph C shows that the transmission characteristic S21 is -50 dB or less at a frequency Freq up to about 20.0 MHz, but the noise signal in the high frequency band including the FM band (several tens of MHz) cannot be suppressed.
- the filter circuit 100 shown in FIG. 4A can suppress the noise signal more than the filter circuit shown in FIG. 4B without the inductor 2.
- the band narrows.
- the filter circuit 100 shown in FIG. 4A can sufficiently suppress noise signals in a high frequency band including the FM band (several tens of MHz) than the filter circuit shown in FIG. 4C.
- FIG. 6 is a block diagram for explaining the configuration of the power supply device according to the present embodiment.
- the power supply unit 300 supplies electric power to a load 500 such as a motor.
- the power supply device 300 includes a power supply 200, a power supply line 210 connecting the power supply 200 and the load 500, and a filter circuit 100 provided in the middle of the power supply line 210.
- the filter circuit 100 can use the coil component 1 having a rated current lower than the current flowing through the load 500 such as a motor, the size of the coil component 1 can be reduced and inexpensive components can be used. Therefore, the power supply device 300 can remove the AC noise component and allow a high current to flow to the load 500 while considering the restrictions of the size and the manufacturing cost.
- the coil component 1 preferably has a configuration in which the electrode 4a at one end of the coil L1 and the electrode 4b at one end of the coil L2 shown in FIG. 1 are connected in series to the power supply line.
- the inductor 2 is connected in parallel to the coil component 1 connected in series to the power supply line.
- the filter circuit 100 can also use the coil component 1 for the inductor 2. That is, the filter circuit 100 is configured to connect two coil components 1 in parallel.
- the filter circuit 100 having this configuration can make the current flowing through the filter circuit 100 twice the rated current of the coil component 1 while enhancing the effect of removing the AC noise component.
- the filter circuit 100 includes the coil component 1, the inductor 2, and the capacitor C1.
- the coil component 1 the coil L1 and the coil L2 are magnetically coupled.
- the inductor 2 is electrically connected to one end of the coil L1 and one end of the coil L2, and is connected in parallel to the coil component 1.
- the capacitor C1 the other end of the coil L1 and the other end of the coil L2 are electrically connected and electrically connected between the electrode 4c and the GND electrode.
- the inductor 2 is electrically connected to one end of the coil L1 and one end of the coil L2 and is connected in parallel to the coil component 1, so that the size and manufacture of the inductor 2 are as follows. High current can be passed while considering cost constraints.
- the coil component 1 includes a laminated body 3 having a plurality of laminated insulating layers, and a coil L1 and a coil L2 formed by being laminated inside the laminated body 3. Further, the coil component 1 is formed on the side surface of the laminated body 3, the electrode 4a electrically connected to one end of the coil L1 and the side surface of the laminated body 3 different from the electrode 4a, and the coil component 1 is formed on the side surface of the laminated body 3. An electrode 4b electrically connected to one end of the coil L2 is provided. Further, the coil component 1 includes an electrode 4c formed on a side surface of a laminate 3 different from the electrodes 4a and 4b, and the other end of the coil L1 and the other end of the coil L2 are electrically connected to each other.
- the coil L1 and the coil L2 are laminated inside the laminated body 3 so that the openings overlap when viewed from the stacking direction of the laminated body 3, and the electrode 4c is electrically connected to one end of the capacitor C1.
- the coil component 1 in which the coil L1 and the coil L2 are magnetically coupled can be manufactured at low cost.
- the DC resistance value of the inductor 2 is preferably smaller than the DC resistance value between one end of the coil L1 of the coil component 1 and one end of the coil L2. As a result, the filter circuit 100 can pass a large amount of current to the inductor 2 side.
- the impedance value of the inductor 2 is preferably equal to or higher than the impedance value between one end of the coil L1 and one end of the coil L2 of the coil component 1. Further, the impedance value of the inductor 2 is preferably twice or more the impedance value between one end of the coil L1 and one end of the coil L2 of the coil component 1. As a result, the filter circuit 100 can allow a large amount of AC noise components to flow toward the coil component 1.
- the filter circuit 100 has a high effect of removing the AC noise component on the power supply.
- the coil component 1 and the inductor 2 can be mounted on the substrate at a position where the opening of the coil conductor formed inside the inductor 2 does not overlap with the openings of the coil L1 and the coil L2 when viewed from the stacking direction of the laminated body 3. preferable. As a result, the inductor 2 simply functions as a current bypass path.
- the power supply device 300 includes a power supply 200, a power supply line 210 connected to the power supply 200 and supplying power to the load 500, and a filter circuit 100 connected to the power supply line 210. As a result, the power supply device 300 can pass a high current through the load 500.
- each of the first wiring pattern, the second wiring pattern, and the third wiring pattern is configured by laminating a plurality of wirings, but it is composed of a single layer wiring. May be.
- the second wiring pattern has a smaller number of layers of the laminated wiring as compared with the first wiring pattern and the third wiring pattern, but the same number of layers has been described. May be.
- the filter circuit 100 has described that the coil component 1, the inductor 2, and the capacitor C1 are mounted on the substrate, but the present invention is not limited to this, and the coil component 1, the inductor 2, and the capacitor C1 are mounted on the substrate. It may not be configured.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Filters And Equalizers (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022536291A JP7318815B2 (ja) | 2020-07-13 | 2021-07-07 | フィルタ回路および、これを含む電源装置 |
| CN202190000527.8U CN219164535U (zh) | 2020-07-13 | 2021-07-07 | 滤波器电路以及包含该滤波器电路的电源装置 |
| DE212021000381.8U DE212021000381U1 (de) | 2020-07-13 | 2021-07-07 | Filterschaltung und Leistungsversorgungsvorrichtung einschliesslich derselben |
| US17/986,942 US12301197B2 (en) | 2020-07-13 | 2022-11-15 | Filter circuit and power supply device including the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020120127 | 2020-07-13 | ||
| JP2020-120127 | 2020-07-13 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US17/986,942 Continuation US12301197B2 (en) | 2020-07-13 | 2022-11-15 | Filter circuit and power supply device including the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022014432A1 true WO2022014432A1 (ja) | 2022-01-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/025589 Ceased WO2022014432A1 (ja) | 2020-07-13 | 2021-07-07 | フィルタ回路および、これを含む電源装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12301197B2 (enExample) |
| JP (1) | JP7318815B2 (enExample) |
| CN (1) | CN219164535U (enExample) |
| DE (1) | DE212021000381U1 (enExample) |
| WO (1) | WO2022014432A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2023210499A1 (enExample) * | 2022-04-28 | 2023-11-02 | ||
| WO2024075624A1 (ja) * | 2022-10-03 | 2024-04-11 | 株式会社村田製作所 | コイル部品、およびフィルタ回路 |
| WO2024172015A1 (ja) * | 2023-02-16 | 2024-08-22 | 株式会社村田製作所 | コイル部品、これを含むフィルタ回路 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102335426B1 (ko) * | 2020-01-07 | 2021-12-06 | 삼성전기주식회사 | 코일 부품 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005217839A (ja) * | 2004-01-30 | 2005-08-11 | Tdk Corp | ノイズ抑制回路 |
| JP2019220876A (ja) * | 2018-06-21 | 2019-12-26 | 株式会社デンソー | ブラシレスモータ制御装置 |
| WO2020121592A1 (ja) * | 2018-12-10 | 2020-06-18 | 株式会社村田製作所 | コイル部品および、これを含むフィルタ回路 |
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|---|---|---|---|---|
| JP2001160728A (ja) | 1999-09-21 | 2001-06-12 | Murata Mfg Co Ltd | Lcフィルタ |
| CN1161880C (zh) | 1999-09-21 | 2004-08-11 | 株式会社村田制作所 | 电感电容滤波器 |
| US6788169B1 (en) * | 1999-12-29 | 2004-09-07 | Broadband Royalty Corporation | Amplifier composite triple beat (CTB) reduction by phase filtering |
| CN206472116U (zh) * | 2013-11-05 | 2017-09-05 | 株式会社村田制作所 | 层叠型线圈及通信终端装置 |
| JP5874718B2 (ja) * | 2013-12-06 | 2016-03-02 | 株式会社村田製作所 | 周波数可変共振回路および周波数可変フィルタ |
| JP6195033B2 (ja) * | 2015-03-11 | 2017-09-13 | 株式会社村田製作所 | インピーダンス変換素子および通信装置 |
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- 2021-07-07 DE DE212021000381.8U patent/DE212021000381U1/de active Active
- 2021-07-07 JP JP2022536291A patent/JP7318815B2/ja active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005217839A (ja) * | 2004-01-30 | 2005-08-11 | Tdk Corp | ノイズ抑制回路 |
| JP2019220876A (ja) * | 2018-06-21 | 2019-12-26 | 株式会社デンソー | ブラシレスモータ制御装置 |
| WO2020121592A1 (ja) * | 2018-12-10 | 2020-06-18 | 株式会社村田製作所 | コイル部品および、これを含むフィルタ回路 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2023210499A1 (enExample) * | 2022-04-28 | 2023-11-02 | ||
| JP7673872B2 (ja) | 2022-04-28 | 2025-05-09 | 株式会社村田製作所 | 回路装置、およびフィルタ回路 |
| WO2024075624A1 (ja) * | 2022-10-03 | 2024-04-11 | 株式会社村田製作所 | コイル部品、およびフィルタ回路 |
| WO2024172015A1 (ja) * | 2023-02-16 | 2024-08-22 | 株式会社村田製作所 | コイル部品、これを含むフィルタ回路 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE212021000381U1 (de) | 2023-01-19 |
| CN219164535U (zh) | 2023-06-09 |
| US20230071624A1 (en) | 2023-03-09 |
| US12301197B2 (en) | 2025-05-13 |
| JPWO2022014432A1 (enExample) | 2022-01-20 |
| JP7318815B2 (ja) | 2023-08-01 |
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