WO2022007551A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2022007551A1
WO2022007551A1 PCT/CN2021/097828 CN2021097828W WO2022007551A1 WO 2022007551 A1 WO2022007551 A1 WO 2022007551A1 CN 2021097828 W CN2021097828 W CN 2021097828W WO 2022007551 A1 WO2022007551 A1 WO 2022007551A1
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WO
WIPO (PCT)
Prior art keywords
heat
component
optical module
upper casing
casing
Prior art date
Application number
PCT/CN2021/097828
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English (en)
Chinese (zh)
Inventor
于帮雨
姬景奇
郑龙
董本正
谢一帆
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN202021347340.9U external-priority patent/CN212647082U/zh
Priority claimed from CN202110075689.4A external-priority patent/CN114859478A/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2022007551A1 publication Critical patent/WO2022007551A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • Optical communication technology will be used in new business and application modes such as cloud computing, mobile Internet, and video.
  • the optical module realizes the function of photoelectric conversion in the field of optical communication technology, and is one of the key components in optical communication equipment.
  • the optical signal intensity input by the optical module to the external optical fiber directly affects the quality of optical fiber communication.
  • the integration of optical modules is getting higher and higher.
  • the power density of optical modules is also increasing, and the heat generation increases; and based on the characteristics of the photoelectric conversion process of optical modules, chips with high heat density in optical modules are generally set together, causing heat generation. Concentration, which needs to improve the heat dissipation of the optical module.
  • an optical module provided by an embodiment of the present disclosure includes: a lower casing; an upper casing, which cooperates with the lower casing to form a wrapping cavity, and the top of the upper casing is provided with a through hole, and the through hole penetrates through the upper casing
  • the circuit board which is arranged in the wrapping cavity formed by the cooperation of the upper casing and the lower casing
  • the part to be radiated which is arranged on the surface of the circuit board and is electrically connected to the circuit board
  • the radiator is arranged on the upper casing
  • the heat soaking part is arranged on the upper surface of the upper shell, the heat soaking part is arranged along the length direction of the upper shell, and one side is in contact with the radiator;
  • the heat conducting part is embedded in the through hole and penetrates through Inside and outside the cavity of the wrapped cavity, the top is in contact with the heat soaking part, and the bottom is in contact with the part to be dissipated;
  • an optical module includes: an upper casing and a lower casing, the upper casing is covered on the lower casing, and the outer wall of the upper casing is provided with heat dissipation fins; On the inner wall of the upper casing, the heat soaking part is arranged along the length of the casing, and the heat conduction efficiency of the heat soaking part is greater than that of the upper casing; the circuit board is arranged in the cavity enclosed by the upper casing and the lower casing Inside; the component to be dissipated, the lower surface of which is arranged on the circuit board, and the upper surface is in thermal contact with the heat soaking component.
  • Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals
  • Fig. 2 is a schematic diagram of the structure of an optical network unit
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure.
  • FIG. 4 provides a schematic diagram of an exploded structure of an optical module according to an embodiment of the present disclosure
  • FIG. 5 is a partial exploded schematic diagram 1 of an optical module according to an embodiment of the present disclosure.
  • FIG. 6 is a second partial exploded schematic diagram of an optical module according to an embodiment of the present disclosure.
  • FIG. 7 is a cross-sectional view of an internal structure of an optical module according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic assembly diagram of an upper casing, a heat soaking part and a heat conducting part according to an embodiment of the present disclosure
  • FIG. 9 is a schematic diagram 1 of the assembly of an upper casing and a thermally conductive component according to an embodiment of the present disclosure
  • FIG. 10 is an exploded schematic diagram 1 of an upper casing and a thermally conductive component according to an embodiment of the present disclosure
  • FIG. 11 is a second assembly schematic diagram of an upper casing and a thermally conductive component according to an embodiment of the present disclosure
  • FIG. 12 is a second exploded schematic view of an upper casing and a thermally conductive component provided by an embodiment of the present disclosure
  • FIG. 13 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.
  • FIG. 14 is a schematic diagram of an exploded structure of another optical module provided by an embodiment of the present disclosure.
  • FIG. 15 is a schematic diagram of a split structure of an upper casing and a heat soaking component in another optical module according to an embodiment of the present disclosure
  • 16 is a schematic diagram of the assembly structure of the upper casing and the heat soaking component in another optical module according to an embodiment of the present disclosure
  • FIG. 17 is a schematic diagram of an assembly structure of a heat soaking component and a circuit board in another optical module according to an embodiment of the present disclosure
  • FIG. 18 is a schematic diagram of an assembly structure of an upper casing, a heat soaking component, and a circuit board in another optical module according to an embodiment of the present disclosure.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used.
  • the optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the golden fingers on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data signal and grounding, etc.
  • the optical module realizes the optical connection with the external optical fiber through the optical interface. There are many ways to connect external optical fibers, and a variety of optical fiber connector types are derived; the use of gold fingers to achieve electrical connection at the electrical interface has become the mainstream connection method in the optical module industry.
  • the definition of the pin has formed a variety of industry protocols/standards; the optical connection method realized by the optical interface and the optical fiber connector has become the mainstream connection method in the optical module industry. Based on this, the optical fiber connector has also formed a variety of industry standards. Such as LC interface, SC interface, MPO interface, etc., the optical interface of the optical module is also designed for the adaptability of the optical fiber connector. Therefore, there are various types of optical fiber adapters set at the optical interface.
  • FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device.
  • the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
  • the optical interface of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101;
  • the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100;
  • the two-way mutual conversion between optical signals and electrical signals is realized inside the optical module, so as to establish an information connection between the optical fiber and the optical network terminal; in an embodiment of the present disclosure, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module After being input into the optical network terminal 100 , the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber 101 .
  • the optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200;
  • Signal connection generally the electrical signal of the Ethernet protocol, which belongs to a different protocol/type from the electrical signal used by the optical module
  • the connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100, in some embodiments of the present disclosure , the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network terminal serves as the upper computer of the optical module to monitor the operation of the optical module.
  • the optical network terminal is the host computer of the optical module. It provides data signals to the optical module and receives data signals from the optical module. So far, the remote server communicates with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables. Establish a two-way signal transmission channel.
  • Common local information processing equipment includes routers, home switches, electronic computers, etc.; common optical network terminals include optical network units ONU, optical line terminals OLT, data center servers, and data center switches.
  • FIG. 2 is a schematic structural diagram of an optical network terminal.
  • the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for connecting to an electrical interface (such as a gold finger, etc.) of an optical module. ;
  • a radiator 107 is provided on the cage 106, and the radiator 107 has raised portions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106 , and the optical interface of the optical module is connected to the optical fiber 101 .
  • the cage 106 is located on the circuit board and includes electrical connectors arranged on the circuit board; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage 106, and then passed through the radiator 107 on the cage. diffusion.
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of an exploded structure of an optical module according to an embodiment of the present disclosure.
  • the optical module 200 provided by the embodiment of the present disclosure includes an upper casing 201 , a lower casing 202 , a circuit board 300 , an optical component 400 , and the like.
  • the upper casing 201 is covered on the lower casing 202 to form a wrapping cavity with two openings, which is used as a casing of the optical module; the outer contour of the wrapping cavity generally presents a square shape.
  • the lower shell includes a main board and two side plates located on both sides of the main board and perpendicular to the main board; the upper shell includes a cover plate, and the cover plate is covered with the two side plates of the upper shell to form a wrapping cavity;
  • the casing may further include two side walls located on both sides of the cover plate and vertically arranged with the cover plate, and the two side walls are combined with the two side plates to realize that the upper casing is covered on the lower casing.
  • the upper casing 201 and the lower casing 202 form a wrapping cavity with two ports, specifically two ports (204, 205) in the same direction, or two ports in different directions; is the direction of the connection line of the openings 203 and 2044, which is consistent with the length direction of the optical module 200; the aforementioned different directions refer to the direction of the connection line of the openings 204 and 205 that is inconsistent with the length direction of the optical module 200, for example
  • the opening 203 is located on the end face of the optical module 200
  • the opening 204 is located on the side of the optical module 200 .
  • One of the ports is the electrical port 204, which is used to insert into the host computer such as the optical network unit; the other port is the optical port 205, which is used to connect the external optical fiber 101;
  • the optoelectronic device is located in the encapsulated cavity formed by the upper and lower shells.
  • the combination of the upper casing 201 and the lower casing 202 is adopted to facilitate the installation of the circuit board 300 and other components into the casing, and the upper casing 201 and the lower casing 202 form the outermost packaging protection casing of the optical module
  • the upper casing 201 and the lower casing 202 are generally made of metal materials, such as zinc alloys, which are beneficial to achieve electromagnetic shielding and heat dissipation; generally, the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning Components, heat dissipation and electromagnetic shielding components cannot be installed and are not conducive to production automation.
  • heat dissipation fins are provided on the upper case 201 and/or the lower case 202 to assist in increasing the heat dissipation capability of the optical module.
  • the optical module of the present disclosure also includes an unlocking part (not shown in the figure), and the unlocking part is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the host computer, or release the optical module from the host computer. fixed connection between machines.
  • the unlocking part has an engaging part that matches the cage of the upper computer; the end of the unlocking part can be pulled to move the unlocking part relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed by the engaging part of the unlocking part In the cage of the host computer; by pulling the unlocking part, the engaging part of the unlocking part moves along with it, thereby changing the connection relationship between the engaging part and the host computer, so as to release the engaging relationship between the optical module and the host computer, so that the optical The module is pulled out from the cage of the upper computer.
  • the circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, MOS tubes) and chips (such as MCU, laser driver chip, limiting amplifier, clock data recovery CDR, power management chip, data processing chip DSP) )Wait.
  • electronic components such as capacitors, resistors, triodes, MOS tubes
  • chips such as MCU, laser driver chip, limiting amplifier, clock data recovery CDR, power management chip, data processing chip DSP) )Wait.
  • the circuit board 300 connects the electrical components in the optical module together according to the circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver is located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • metal pins/gold fingers are formed on one end surface of the rigid circuit board for electrical connection with connector; these are inconvenient to implement with flexible circuit boards.
  • Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards.
  • flexible circuit boards can be used to connect the rigid circuit boards and optical transceivers.
  • the optical component 400 is used for transmitting and receiving optical signals.
  • the optical component 400 includes a laser, a laser driver, a silicon photonics chip, a transimpedance amplifier, and the like.
  • the high-frequency differential signal input on the gold finger on the circuit board 300 passes through the data processing chip (DSP, Digital Signal Processor) 301, and after signal stability is optimized, the signal traces on the circuit board 300 are connected to the optical Assembly 400 forms a data optical signal.
  • DSP Digital Signal Processor
  • the optical component 400 converts the optical signal into an electrical signal, it is sent to the data processing chip 301 through the signal wiring on the circuit board 300, After processing, the data processing chip 301 outputs a high-frequency differential signal to the gold finger on the circuit board 300 .
  • the above data processing chip 301 can also be replaced by a clock data recovery chip (Clock Data Recovery, CDR).
  • the embodiment of the present disclosure adopts a combination of a heat sink, a heat-sinking component, and a heat-conducting component to dissipate heat to the data processing chip 301.
  • the heat dissipation method provided by the embodiment of the present disclosure can also be used in an optical module.
  • this embodiment only takes the data processing chip 301 as an example.
  • FIG. 5 is a partial exploded schematic diagram 1 of an optical module according to an embodiment of the present disclosure
  • FIG. 6 is a partial exploded schematic diagram 2 of an optical module according to an embodiment of the present disclosure.
  • a heat sink 205 and a heat soaking member 206 are arranged on the upper surface of the upper casing 201 ;
  • the hole 2011 penetrates the upper surface and the lower surface of the upper casing 201; the through hole 2011 is used to embed the thermally conductive component 207.
  • the thermally conductive component 207 When the thermally conductive component 207 is embedded in the through hole 2011, the thermally conductive component 207 penetrates through the upper casing 201 and the lower casing 202 forms the inside and outside of the envelope cavity.
  • the top side of the heat-spreading part 206 is in contact with the heat sink 205, and heat transfer can be performed between the heat-spreading part 206 and the heat sink 205; the top of the heat-conducting part 207 is in contact with the heat-spreading part 206, and the heat is conducted Heat transfer can be performed between the component 207 and the heat-dissipating component 206, and the bottom of the heat-conducting component 207 is used for contacting and connecting the data processing chip 301 and waiting for the heat-dissipating component.
  • the heat conduction efficiency of the heat sink 205 In order to improve the heat dissipation efficiency of the waiting heat dissipation components of the data processing chip 301 , it is preferable that the heat conduction efficiency of the heat sink 205 , the heat conduction efficiency of the heat soaking part 206 and the heat conduction efficiency of the heat conduction part 207 are all greater than that of the upper casing 201 .
  • FIG. 7 is a cross-sectional view of an internal structure of an optical module according to an embodiment of the present disclosure, and the figure shows a heat dissipation path of a data processing chip 301 waiting for a heat dissipation component. As shown in FIG.
  • the top side of the heat soaking member 206 is in contact with the bottom of the heat sink 205 , and one end of the heat soaking member 206 is in contact with the heat conducting member 207 , and the heat conducting member 207 is also in contact with the data processing chip 301 , and then the data processing chip 301
  • the generated heat is firstly conducted to the heat-conducting component 207 , then to the heat-spreading component 206 through the heat-conducting component 207 , then to the heat sink 205 through the heat-spreading component 206 , and finally diffused to the outside of the optical module through the heat sink 205 .
  • both the heat soaking part 206 and the heat sink 205 are arranged along the length direction of the upper casing 201 , the heat generated by the data processing chip 301 can be uniformly conducted to the heat sink 205 through the heat soaking part 206 , avoiding the heat generated by the data processing chip 301 Too much is concentrated around the data processing chip 301; in addition, the heat dissipation effect of the heat sink 205 can be fully exerted, and the heat generated by the data processing chip 301 can be more quickly diffused to the outside of the optical module.
  • the heat sink 205, the heat soaking part 206 and the heat conduction part 207 are combined, so as to achieve uniform heat dissipation, avoid local heat concentration, make the internal temperature of the optical module uniform, and improve the optical efficiency.
  • the optoelectronic properties of the module are combined, so as to achieve uniform heat dissipation, avoid local heat concentration, make the internal temperature of the optical module uniform, and improve the optical efficiency.
  • the heat sink 205 has a relatively large fin density compared with the heat dissipation fins in the conventional optical module, which increases the contact area with the outside air flow; and the fins are closed to form a good flow.
  • the channel increases the internal flow rate, enhances the convection heat transfer, and makes the heat better and evenly distributed, and the heat dissipation effect is better.
  • the radiator 205 can be a radiator such as an aluminum extrusion radiator.
  • the aluminum extrusion radiator is a new type of radiator structure, the material is aluminum alloy, the thermal conductivity is higher than that of zinc alloy, and the density of aluminum extrusion radiator fins can be encrypted according to requirements, and its sealing performance is good, which can form a closed flow channel , so that the flow rate through the radiator increases, thereby enhancing convection heat transfer, so as to achieve better heat dissipation.
  • the data processing chip 301 is arranged at the rear of the optical module (close to the electrical port), and the data processing chip 301 generates a large amount of heat. If the heat generated by the data processing chip 301 cannot be dissipated in time, the A large amount of heat will be concentrated at the rear of the optical module, resulting in uneven temperature between the front and rear of the optical module.
  • the heat generated by the data processing chip 301 is transferred to the casing of the optical module by means of self-diffusion; due to the advantages of easy processing, good castability and low cost of zinc alloy, the casing of the optical module A zinc alloy is usually used, but the heat dissipation performance of the zinc alloy is limited, and the thermal diffusivity is not strong, so that the heat generated by the data processing chip 301 will be concentrated on the casing around the data processing chip 301 . If the data processing chip 301 is located at the rear of the optical module, the heat will be mainly concentrated in the rear of the casing, such as the rear of the upper casing 201, resulting in uneven temperature at the front and rear ends of the optical module, which will affect the high temperature of the optical module.
  • the heat soaking component 206 is used to rapidly conduct the heat concentrated at the rear of the optical module to the front of the optical module.
  • the heat conduction efficiency of the heat soaking component 206 is greater than that of the upper casing 201 , for example, it is made of pure copper, phosphor bronze and titanium alloy, or can be designed as a heat pipe with extremely high thermal conductivity.
  • the heat soaking member 206 adopts a VC soaking plate; the VC soaking plate is a material with good thermal conductivity, and its thermal conductivity is much better than that of zinc alloy, and the VC soaking plate is more convenient for heat diffusion.
  • the VC vapor chamber has a capillary structure for filling liquid.
  • the liquid in the capillary structure absorbs heat and evaporates to generate steam, which takes away the heat, and the heat is liquid
  • the steam flows from the central channel to the condensation section of the heat pipe, condenses into a liquid, and releases latent heat at the same time.
  • the working principle is similar to that of the heat pipe.
  • the heat-conducting component 207 is used to rapidly conduct the heat generated by the data processing chip 301 to the heat-spreading component 206 .
  • the thermally conductive member 207 may be made of a material with good thermal conductivity, such as copper and other metal materials with good thermal conductivity; in a possible implementation manner, the thermally conductive member 207 is a copper block.
  • the data processing chip 301 waits for the heat dissipation component to contact the thermally conductive component 207 , the thermally conductive component 207 to contact the heat soaking component 206 , and the heat soaking component 206 to contact the heat sink 205 .
  • Efficiency, thermal conductivity of the heat-spreading component 206 and heat-conducting efficiency of the heat sink 205 are all greater than the heat-conducting efficiency of the upper casing 201 , and the heat generated by the heat-dissipating component can be quickly conducted along the heat-conducting component 207 and the heat-spreading component 206 to the heat sink 205 , the heat inside the optical module is diffused to the outside of the optical module through the radiator 205; and since the heat soaking part 206 is arranged along the length direction of the upper casing 201, the heat generated by the data processing chip 301 waiting for the heat dissipation part can be more uniformly conducted To the entire radiator 205, to avoid the heat generated by the data processing chip 301 waiting for the heat dissipation component to be concentrated around the to-be-radiated component, in addition, the heat dissipation effect of the heat sink 205 is more fully exerted, and the heat generated by the data processing chip 301 waiting for the heat dissipation component
  • the heat is diffused to the outside of the optical module, thereby preventing the heat generated by the data processing chip 301 from waiting for the heat dissipation component to accumulate in one part of the optical module, making the internal temperature of the optical module uniform, and improving the optoelectronic performance of the optical module.
  • a first thermal conductive layer 208 is disposed between the data processing chip 301 and the thermally conductive component 207 , and then the bottom surface of the thermally conductive component 207 realizes heat conduction through the first thermally conductive layer 208 and the component to be dissipated.
  • the first thermally conductive layer 208 is used to The heat generated by the data processing chip 301 is conducted to the thermally conductive member 207 .
  • the first thermal conductive layer 208 is filled in the gap formed between the thermal conductive component 207 and the data processing chip 301 , and the first thermal conductive layer 208 has good thermal conductivity, and the first thermal conductive layer 208 ensures the data processing chip 301 and the thermal conductive component 207 through the first thermal conductive layer 208 Good heat transfer.
  • the first thermally conductive layer 208 is formed of a thermally conductive material, such as a thermally conductive pad, a thermally conductive gel, and the like.
  • the heat-conducting component and the component to be dissipated are in heat-conducting contact, and the heat-conducting contact may be direct contact or indirect contact by sandwiching a heat-conducting layer.
  • soft components are generally arranged between the hard components.
  • the data processing chip is a hard component
  • the first thermal conductive layer is a soft component.
  • FIG. 8 is an assembly schematic diagram of an upper casing, a heat soaking part, and a heat-conducting part according to an embodiment of the present disclosure
  • FIG. 9 is an assembly schematic diagram 1 of an upper casing and a heat-conducting part according to an embodiment of the disclosure
  • a first heat soaking groove 2012 is provided on the top upper surface of the upper casing 201
  • a second heat soaking groove 2071 is placed on the top of the heat conducting member 207
  • the heat soaking member 206 is embedded in the first heat soaking groove 2012 and the second heat soaking groove 2071, so that the first heat soaking groove 2012 and the second heat soaking groove 2071 facilitate the installation of the thermally conductive component 207 on the upper casing 201 and ensure that the heat soaking component 206 is fully in contact with the thermally conductive component 207.
  • the heat soaking member 206 and the heat conducting member 207 are respectively welded to the upper casing 201 .
  • the shapes of the first heat soaking tank 2012 and the second heat soaking groove 2071 can be selected according to the shape of the solid heat soaking component 206 .
  • the heat-conducting component 207 is connected to the heat-spreading component 206 by soldering paste, and the second soaking tank 2071 can also be used to store the solder paste.
  • the top of the upper casing 201 is provided with a first positioning fin 2013 and a second positioning fin 2014.
  • the first positioning fin 2013 is arranged on one side of the upper casing 201 in the length direction, and the second positioning fin
  • the fins 2014 are arranged on the other side of the length direction of the upper casing 201, and the first positioning fins 2013 and the second positioning fins 2014 are protruded and arranged on the side of the upper casing 201 in the shape of strips;
  • a positioning fin 2013 is arranged on the right side of the top surface of the upper casing 201, and the second positioning fin 2014 is arranged on the left side of the top surface of the upper casing 201; of course, the first positioning fin 2013 is not limited to being arranged on The right side of the top surface of the upper casing 201 and the second positioning fins 2014 are not limited to be disposed on the left side of the top surface of the upper casing 201 .
  • the first positioning fins 2013 and the second positioning fins 2014 are used for clamping and connecting the sides of the heat sink 205 , that is, when the heat sink 205 is installed on the top of the upper casing 201 , the heat sink 205 is clamped at the first position Between the fins 2013 and the second positioning fins 2014, the first positioning fins 2013 and the second positioning fins 2014 are used to limit the heat sink 205 from the side of the heat sink 205 to ensure the installation accuracy of the heat sink 205; The distance between the first positioning fin 2013 and the second positioning fin 2014 can be adjusted according to the needs of the width of the heat sink 205 .
  • the heat sink 205 is welded to the upper casing 201;
  • the gaps of the fins 2014 are filled with solder paste, and the heat sink 205 is connected with the first positioning fins 2013 and the second positioning fins 2014 by welding.
  • the top of the upper casing 201 is further provided with a first positioning step 2015 and a second positioning step 2016 , and the first positioning step 2015 is provided on the top of the upper casing 201 .
  • the second positioning step 2016 is provided on the other end of the top of the upper casing 201 ; exemplarily, the first positioning step 2015 is provided at the left end of the top surface of the upper casing 201 , and the second positioning step 2016 is provided on the top of the upper casing 201
  • the first positioning step 2015 is not limited to being disposed on the left end of the top surface of the upper casing 201
  • the second positioning step 2016 is not limited to being disposed at the right end of the top surface of the upper casing 201 .
  • the first positioning step 2015 and the second positioning step 2016 are used for clamping and connecting the end of the radiator 205 , that is, when the radiator 205 is installed on the top of the upper casing 201 , the radiator 205 is clamped on the first positioning step 2015 Between the second positioning step 2016 and the first positioning step 2015 , the first positioning step 2015 and the second positioning step 2016 are used to limit the heat sink 205 from the end of the heat sink 205 .
  • the arrangement positions of the first positioning step 2015 and the second positioning step 2016 can be adjusted according to the length of the heat sink 205 .
  • the top of the thermally conductive component 207 is provided with a first stepped surface 2072, and the first stepped surface 2072 is located at the edge of the top of the thermally conductive component 207.
  • the first stepped surface 2072 2072 is used for the assembly and positioning of the heat conducting component 207 and the upper casing 201 .
  • the first stepped surface 2072 is used to fit the upper casing 201 in close contact.
  • FIG. 11 is a second assembly schematic diagram of an upper casing and a thermally conductive component according to an embodiment of the present disclosure
  • FIG. 12 is a second exploded schematic diagram of an upper casing and a thermally conductive component according to an embodiment of the present disclosure. As shown in FIGS.
  • the inner wall of the upper casing 201 is provided with a second stepped surface 2017, the second stepped surface 2017 is disposed on the side of the through hole 2011, and the second stepped surface 2017 corresponds to the first stepped surface 2072;
  • the thermally conductive component 207 is assembled on the upper casing 201 , the top of the thermally conductive component 207 is disposed through the through hole 2011 , and the first stepped surface 2072 is matched and connected to the second stepped surface 2017 .
  • a plurality of thermally conductive bosses 2018 are further disposed on the inner wall of the upper casing 201 .
  • the stage 2018 is used for approaching or contacting the optical component 400 , and then for conducting the heat generated on the optical component 400 to the upper casing 201 and the heat sink 205 through the thermally conductive boss 2018 , so as to realize the rapid heat dissipation of the optical component 400 .
  • the plurality of thermally conductive bosses 2018 correspond to the lasers, laser drivers, silicon photonic chips, transimpedance amplifiers, etc. that are in contact and connected to the optical component 400 respectively.
  • the end of the thermally conductive boss 2018 is provided with a thermally conductive layer, and the thermally conductive layer is used to improve the heat conduction efficiency between the thermally conductive boss 2018 and the device in contact;
  • the thermally conductive layer can be formed of a thermally conductive material, such as Thermal pads, thermal gels, etc.
  • a modular design can be achieved; and when the heat dissipating part and its position are changed, only the heat conducting part 207 needs to be properly adjusted.
  • the position and structure of the bottom side can make the heat-conducting component 207 fit with the changed component to be dissipated.
  • FIG. 13 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure
  • FIG. 14 is a schematic structural diagram of an exploded structure of another optical module according to an embodiment of the present disclosure.
  • the optical module 200 provided by the embodiment of the present disclosure includes an upper casing 201 , a lower casing 202 , an unlocking handle, a circuit board 300 , a light emitting assembly 400 and a light receiving assembly 500 .
  • the upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body.
  • the combination of the upper casing and the lower casing is adopted to facilitate the installation of the circuit board 300, the light emitting assembly 400 and the light receiving assembly 500 into the casing.
  • the upper casing and the lower casing form the outermost layer of the optical module.
  • Encapsulate the protective casing; the upper casing and the lower casing are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation; generally, the casing of the optical module is not made into an integrated structure, so that when assembling circuit boards and other devices, positioning parts, Heat dissipation and electromagnetic shielding structures cannot be installed and are not conducive to production automation.
  • the embodiment of the present disclosure adopts a combination of heat dissipation fins and a heat soaking component to dissipate heat to the above-mentioned data processing chip 301.
  • the heat dissipation method provided by the embodiment of the present disclosure can also be used for other pending optical modules in the optical module.
  • this embodiment only takes the data processing chip 301 as an example.
  • FIG. 15 is a schematic diagram of a disassembled structure of an upper casing and a heat soaking component in another optical module provided by an embodiment of the present disclosure
  • FIG. 16 is an upper casing and a heat soaking component in another optical module according to an embodiment of the present disclosure.
  • Schematic diagram of the assembly structure FIG. 17 is a schematic diagram of the assembly structure of a heat soaking component and a circuit board in another optical module provided by an embodiment of the present disclosure, and
  • FIG. 18 is another optical module provided by the embodiment of the present disclosure.
  • a concave portion 2011 a matching the shape of the heat soaking member 206 is opened on the inner wall of the upper casing 201 , and the heat soaking member 206 is designed to be flat and fixed in the recess 2011a by welding or the like.
  • the heat conduction efficiency of the heat soaking component 206 is greater than that of the upper casing 201 , for example, it is made of materials such as diamond and silver, or it can also be designed as a heat pipe with extremely high thermal conductivity.
  • the heat soaking member 206 may also be designed in other shapes, and in addition, the concave portion 2011a may not be provided, that is, the heat soaking member 206 may be directly fixed on the inner wall of the upper casing 201 .
  • arranging the concave portion 2011a and setting the heat soaking part 206 as a flat structure can occupy a smaller internal space of the optical module, which is more conducive to the miniaturization of the optical module, and the heat soaking part 206 can be arranged at The thickness of the shell is more conducive to conduct heat to the outside of the optical module.
  • heat dissipation fins 2012a are provided on the outer wall of the upper casing 201.
  • the heat dissipation fins 2012a are protruded and arranged on the upper casing 201 in the shape of stripes.
  • the air flowing through the heat dissipation fins 2012a can speed up its circulation speed, thereby improving the heat dissipation efficiency between the upper casing 201 and the external environment from the heat dissipation contact area and the circulation speed, that is, improving the heat dissipation efficiency of the surface of the optical module housing.
  • the extending direction of the heat dissipation fins 2012a is set to be parallel or approximately parallel to the length direction of the casing, that is, along the direction of the connection between the electrical port and the optical port of the optical module, so as to better utilize the
  • the air supply provided by the host computer increases air convection and improves heat dissipation efficiency.
  • the data processing chip 301 is disposed on the circuit board 300 , and can be electrically connected to the circuit board 300 by bonding wires, and is electrically connected to the light-emitting component 400 and the light-receiving component 500 respectively through the wires on the circuit board 300 .
  • the data processing chip 301 is in contact with the heat soaking part 206. 301 is damaged.
  • a thermally conductive buffer member 80 is provided on the upper surface of the data processing chip 301 , wherein the thermally conductive buffer member 80 may be made of a thermally conductive thermal interface material such as thermally conductive silicone grease or thermally conductive gel.
  • the surface of the data processing chip 301 in contact with the circuit board 300 is referred to as the lower surface thereof, and the surface corresponding to the lower surface thereof is referred to as the upper surface.
  • the heat generated by the data processing chip 301 is conducted to the heat soaking member 206 through the thermal conduction buffer member 80 . Since the heat conduction efficiency of the heat soaking part 206 is higher than that of the upper casing 201 , the heat generated by the data processing chip 301 can be quickly conducted along the heat soaking part 206 , and then conducted to the upper casing 201 through the heat soaking part 206 .
  • the heat generated by the data processing chip 301 can be more uniformly conducted to the entire upper casing 201, and the heat dissipation effect of the heat dissipation fins 2012a can be fully exerted to dissipate the heat to the upper casing 201.
  • the heat generated by the data processing chip 301 can be prevented from accumulating in one part of the optical module, thereby improving the optoelectronic performance of the optical module under high temperature.
  • the heat soaking component 206 adopts a heat pipe, since it is a heat transfer element with extremely high thermal conductivity, the heat is transferred through the evaporation and condensation of the liquid in the fully enclosed vacuum tube, and its interior is It is pumped into a negative pressure state and filled with an appropriate liquid.
  • the liquid has a low boiling point and is easy to volatilize; the tube wall has a liquid absorbing core, which is composed of capillary porous materials.
  • One end of the heat pipe is the heat-absorbing end, and the other end is the heat-dissipating end.
  • the heat-absorbing end of the heat pipe is arranged in contact with the data processing chip 301, and the heat-conducting heat pipe can conduct the heat generated by the data processing chip 301 to its heat-dissipating end, so that the heat can be fully conducted to the heat-dissipating fins 2012a; at the same time, heat-dissipating fins can also be arranged.
  • the extension direction of the 2012a is consistent with the heat conduction direction of the heat pipe, and the convective heat transfer between the cooling fins 2012a and the air can be used to dissipate the heat to the outside of the optical module to improve the optoelectronic performance of the optical module at high temperature.
  • the data processing chip 301 in addition to the accident that the data processing chip 301 generates a lot of heat during operation, as the size of the transimpedance amplifying chip becomes smaller and smaller, its heat becomes more and more concentrated.
  • the heat sources in the optical module are distributed in a distributed layout.
  • the light receiving component 500 is divided into two parts and arranged on the upper and lower surfaces of the circuit board respectively.

Abstract

L'invention concerne un module optique (200), comprenant : un boîtier inférieur (202) ; un boîtier supérieur (201), la partie supérieure étant pourvue d'un trou traversant (2011), le trou traversant (2011) pénétrant à travers la surface supérieure et la surface inférieure du boîtier supérieur (201) ; une carte de circuit imprimé (300), disposée dans une cavité d'enveloppement formée par mise en correspondance du boîtier supérieur (201) et du boîtier inférieur (202) ; un composant à dissiper de la chaleur, disposé sur la surface de la carte de circuit imprimé (300) ; un dispositif de dissipation de chaleur (205), disposé sur la surface supérieure du boîtier supérieur (201) ; un composant d'égalisation thermique (206), disposé sur la surface supérieure du boîtier supérieur (201), un côté étant en contact avec le dispositif de dissipation thermique (205) ; un composant de conduction thermique (207), intégré dans le trou traversant (2011) et pénétrant à travers les parties interne et externe de la cavité d'enveloppement, la partie supérieure étant en contact avec le composant d'égalisation thermique (206) et le fond étant en contact avec le composant à dissiper de la chaleur. L'efficacité de conduction thermique du dispositif de dissipation thermique (205), l'efficacité de conduction thermique du composant d'égalisation thermique (206) et l'efficacité de conduction thermique du composant de conduction thermique (207) sont chacune supérieures à l'efficacité de conduction thermique du boîtier supérieur (201).
PCT/CN2021/097828 2020-07-09 2021-06-02 Module optique WO2022007551A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202021347340.9 2020-07-09
CN202021347340.9U CN212647082U (zh) 2020-07-09 2020-07-09 一种光模块
CN202110075689.4A CN114859478A (zh) 2021-01-20 2021-01-20 一种光模块
CN202110075689.4 2021-01-20

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CN1909424A (zh) * 2005-06-27 2007-02-07 英特尔公司 具有有有源热量传输的光转发器
US20070134003A1 (en) * 2005-12-12 2007-06-14 Lee Jyung C Optical transceiver case
US20130064512A1 (en) * 2011-09-08 2013-03-14 Nayana Ghantiwala Cooling system for an optical module
CN204482214U (zh) * 2015-04-03 2015-07-15 烽火通信科技股份有限公司 一种相干cfp光模块的散热盒
CN110060966A (zh) * 2018-01-18 2019-07-26 苏州旭创科技有限公司 光模块
CN110249718A (zh) * 2017-01-12 2019-09-17 申泰公司 带有附连的散热器的壳架
CN212647082U (zh) * 2020-07-09 2021-03-02 青岛海信宽带多媒体技术有限公司 一种光模块
US20210072473A1 (en) * 2019-09-05 2021-03-11 Infinera Corporation Thermal management of pluggable optical transceiver

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1909424A (zh) * 2005-06-27 2007-02-07 英特尔公司 具有有有源热量传输的光转发器
US20070134003A1 (en) * 2005-12-12 2007-06-14 Lee Jyung C Optical transceiver case
US20130064512A1 (en) * 2011-09-08 2013-03-14 Nayana Ghantiwala Cooling system for an optical module
CN204482214U (zh) * 2015-04-03 2015-07-15 烽火通信科技股份有限公司 一种相干cfp光模块的散热盒
CN110249718A (zh) * 2017-01-12 2019-09-17 申泰公司 带有附连的散热器的壳架
CN110060966A (zh) * 2018-01-18 2019-07-26 苏州旭创科技有限公司 光模块
US20210072473A1 (en) * 2019-09-05 2021-03-11 Infinera Corporation Thermal management of pluggable optical transceiver
CN212647082U (zh) * 2020-07-09 2021-03-02 青岛海信宽带多媒体技术有限公司 一种光模块

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