WO2022007180A1 - 射频模组 - Google Patents

射频模组 Download PDF

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Publication number
WO2022007180A1
WO2022007180A1 PCT/CN2020/114435 CN2020114435W WO2022007180A1 WO 2022007180 A1 WO2022007180 A1 WO 2022007180A1 CN 2020114435 W CN2020114435 W CN 2020114435W WO 2022007180 A1 WO2022007180 A1 WO 2022007180A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
radio frequency
frequency module
antenna unit
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/114435
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English (en)
French (fr)
Inventor
王建安
陈勇利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Pte Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Pte Ltd
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Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Pte Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2022007180A1 publication Critical patent/WO2022007180A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures

Definitions

  • the utility model relates to the technical field of radio frequency terminals, in particular to a radio frequency module used in 5G products.
  • 5G mobile devices are undoubtedly the most common and portable 5G terminal devices.
  • 5G mobile devices include chips, antennas and radio frequency devices that process signals sent and received to realize 5G data transmission. Therefore, radio frequency modules have become an important module of 5G mobile devices.
  • the radio frequency module of the related art includes a high-frequency circuit board and an antenna unit that is stacked and fixed on the high-frequency circuit board.
  • the high-frequency circuit board used in the radio frequency module and the antenna unit are processed together. Although the performance is better, the material cost is high, and the processing cost is high; in addition, the high-frequency circuit The number of laminates of the board is large, generally more than 10 layers, which is difficult to process, which makes the processing cost high; and the value of the dielectric constant of the circuit board used in the high-frequency circuit board (English Dielectric Constant, DK for short) is low. , and applied to the processing of the antenna unit, which directly results in a larger volume of the antenna unit, which is not conducive to miniaturization applications.
  • the radio frequency module in the related art also needs to be connected to the radio frequency front-end module and the peripheral circuit module by setting two connectors, wherein, it is more complicated to assemble using two of the connectors, so that the radio frequency module is assembled
  • the process is complicated and the manufacturing cost is high.
  • the purpose of the utility model is to provide a radio frequency module with small volume, easy processing and assembly, and cost saving.
  • the present invention provides a radio frequency module, which includes a radio frequency module and a connection module for connecting the radio frequency module with an external motherboard;
  • the radio frequency module includes a circuit board and is stacked and fixed on the The antenna unit on one side of the circuit board; the circuit board and the antenna unit are made of low temperature co-fired ceramic technology, and the connection module and the radio frequency module are formed and fixed by surface assembly technology or gluing.
  • the circuit board and the antenna unit are integrally formed.
  • the circuit board and the antenna unit are fixed by surface mounting technology or gluing.
  • connection module includes a flexible circuit board and a connector that forms a detachable connection with the flexible circuit board and is used for connecting to an external motherboard.
  • the flexible circuit board is a polytetrafluoroethylene circuit board or a liquid crystal polymer circuit board or an improved polyimide circuit board or a polyimide circuit board.
  • the flexible circuit board is fixed to the side of the circuit board away from the antenna unit by surface mounting technology or gluing.
  • the flexible circuit board includes a first section connected to the circuit board and a second section bent and extended from the first section in a direction away from the circuit board, and the connector is fixed to the The second segment, the first segment is at least partially fixed to the circuit board by surface mounting technology or gluing.
  • the radio frequency module further includes a peripheral circuit module fixed on a side of the circuit board away from the antenna unit, and a radio frequency front-end module electrically connected to the antenna unit.
  • the antenna unit includes an antenna body and a radiating sheet fixed on a side of the antenna body away from the circuit board, and the radiating sheet is coupled with the antenna body.
  • the radiating sheet includes a plurality of the radiating sheets, and the plurality of the radiating sheets are spaced apart from each other.
  • the radio frequency module of the radio frequency module of the present invention is provided with a circuit board and an antenna unit fixed on the circuit board, and the circuit board and the antenna unit are made by using low temperature co-fired ceramic technology; The dielectric constant value of ceramics is high.
  • the circuit board and the antenna unit are made of low-temperature co-fired ceramic technology, which can reduce the size of the antenna, thereby reducing the volume of the RF module and saving the RF module in the whole machine.
  • the occupied space is convenient for assembly and application.
  • the radio frequency module is provided with a connection module for connecting the radio frequency module to an external motherboard, and the connection module and the radio frequency module are formed and fixed by surface assembly technology or gluing.
  • connection module and the antenna unit are separately processed and reassembled, so that the products can be effectively stacked and distributed to different products, which greatly reduces the difficulty of processing; this structure can also save the connectors that are electrically connected to each other, thereby reducing assembly. , and is also conducive to improving the processing and reliability of the RF module.
  • FIG. 1 is a three-dimensional schematic diagram of a radio frequency module of the present invention
  • FIG. 2 is an exploded view of a part of the three-dimensional structure of the radio frequency module of the present invention
  • FIG. 3 is a schematic three-dimensional structural diagram of the radio frequency module of the present invention from another angle;
  • FIG. 4 is a schematic diagram of the three-dimensional assembly structure of the radio frequency module and the main board of the present invention.
  • the present invention provides a radio frequency module 100 .
  • the radio frequency module 100 is connected to the external motherboard 200 .
  • the radio frequency module 100 is used for realizing 5G data transmission by sending and receiving signals.
  • the motherboard 200 is a device that implements 5G functions.
  • the radio frequency module 100 includes a radio frequency module 10 and a connection module 5 for connecting the radio frequency module 10 with the external motherboard 200 .
  • the radio frequency module 10 includes a circuit board 1 and an antenna unit 2 .
  • the circuit board 1 is used for circuit wiring and connecting circuit components.
  • the circuit board 1 and the antenna unit 2 are both made of Low Temperature Co-fired Ceramic (English Low Temperature Co-fired Ceramic, LTCC for short). Due to the higher dielectric constant of ceramics, the size of the antenna can be reduced, thereby reducing the volume of the radio frequency module 100 and saving the space occupied by the radio frequency module 100 in the whole machine, that is, the radio frequency module 100 is small in size , which is conducive to assembly and application.
  • Low Temperature Co-fired Ceramic English Low Temperature Co-fired Ceramic, LTCC for short. Due to the higher dielectric constant of ceramics, the size of the antenna can be reduced, thereby reducing the volume of the radio frequency module 100 and saving the space occupied by the radio frequency module 100 in the whole machine, that is, the radio frequency module 100 is small in size , which is conducive to assembly and application.
  • the antenna unit 2 is stacked and fixed on one side of the circuit board 1 .
  • the antenna unit 2 includes an antenna body 21 and a radiating sheet 22 fixed on a side of the antenna body 21 away from the circuit board 1 .
  • the radiation sheet 22 is coupled with the antenna body 21 .
  • the radiation sheet 22 includes a plurality of the radiation sheets 22, and the plurality of the radiation sheets 22 are spaced apart from each other.
  • the structure in which multiple pieces of the radiating sheet 22 are arranged on one side of the circuit board 1 is conducive to sending and receiving signals to realize 5G data.
  • the circuit board 1 and the antenna unit 2 are integrally formed, which is beneficial to reduce the processing difficulty of the radio frequency module 100 and improve the reliability of the radio frequency module 100 .
  • the circuit board 1 and the antenna unit 2 can be fixed in other ways.
  • the circuit board 1 and the antenna unit 2 can be fixed by surface mounting technology (English Surface Mounted Technology, referred to as "Surface Mounted Technology” for short). SMT) or glued to form a fixation.
  • the circuit board 1 and the antenna unit 2 are separately processed and reassembled, so that the radio frequency module 100 can be effectively stacked and distributed to different products, which greatly reduces the difficulty of processing.
  • the radio frequency module 10 further includes a peripheral circuit module 4 fixed on the side of the circuit board 1 away from the antenna unit 2 and a radio frequency front-end module 3 electrically connected to the antenna unit 2 .
  • the connection module 5 includes a flexible circuit board 51 and a connector 52 that forms a detachable connection with the flexible circuit board 51 and is used to connect to the external motherboard 200 .
  • the flexible circuit board 51 is made of a high-frequency flexible circuit board.
  • the flexible circuit board 51 is one of a polytetrafluoroethylene PTFE circuit board, a liquid crystal polymer LCP circuit board, an improved polyimide MPI circuit board, or a polyimide circuit board.
  • the connector 52 is installed and fixed on the flexible circuit board 51 .
  • the connector 52 is used for electrical connection with the external motherboard 200 .
  • the connection module 5 and the radio frequency module 10 are fixed by surface assembly technology or gluing, and the connection module 5 is only provided with the connector 52 for connecting with the main board 200 , which is beneficial to the radio frequency module 100 . Assembly, reduce assembly, save cost, and also improve reliability.
  • the flexible circuit board 51 includes a first section 511 connected to the circuit board 1 and a second section 512 bent and extended from the first section 511 in a direction away from the circuit board 1 .
  • the connector 52 is fixed to the second segment 512 .
  • the first section 511 is at least partially fixed to the circuit board 1 by surface mounting technology or gluing. The arrangement of this structure can save the connectors for electrically connecting the circuit board 1 and the connection module 5 to each other, thereby reducing assembly and improving the processing and reliability of the radio frequency module 100 .
  • the circuit board 1 is rectangular, and includes two long-axis sides arranged oppositely and two short-axis sides arranged oppositely, the first section 511 is attached and fixed to one of the short-axis sides, and One side of the first section 511 is flush with one of the long-axis sides, and the second section 512 extends vertically from the side of the first section 511 that is flush with the long-axis side.
  • This structure enables the radio frequency module 100 to be connected to one side of the motherboard 200 , which is beneficial to installation and use, and at the same time, is beneficial to reduce the processing cost of the radio frequency module 100 .
  • circuit board 1, the antenna unit 2, the RF front-end module 3, the peripheral circuit module 4 and the connection module 5 are all circuits, components and modules commonly used in the technical field , the specific models and performance indicators need to be selected according to actual use needs, and will not be described in detail here.
  • the radio frequency module of the radio frequency module of the present invention is provided with a circuit board and an antenna unit fixed on the circuit board, and the circuit board and the antenna unit are made by using low temperature co-fired ceramic technology; The dielectric constant value of ceramics is high.
  • the circuit board and the antenna unit are made of low-temperature co-fired ceramic technology, which can reduce the size of the antenna, thereby reducing the volume of the RF module and saving the RF module in the whole machine.
  • the occupied space is convenient for assembly and application.
  • the radio frequency module is provided with a connection module for connecting the radio frequency module to an external motherboard, and the connection module and the radio frequency module are formed and fixed by surface assembly technology or gluing.
  • connection module and the antenna unit are separately processed and reassembled, so that the products can be effectively stacked and distributed to different products, which greatly reduces the difficulty of processing; this structure can also save the connectors that are electrically connected to each other, thereby reducing assembly. , and is also conducive to improving the processing and reliability of the RF module.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请提供了一种射频模组，其包括射频模块和用于将所述射频模块与外部主板连接的连接模块；所述射频模块包括电路板和叠设固定于所述电路板一侧的天线单元；所述电路板与所述天线单元均为低温共烧陶瓷技术制成，所述连接模块与所述射频模块通过表面组装技术或者胶合技术进行固定。与相关技术相比，本申请的射频模组的体积小、易于加工和组装且节约成本。

Description

射频模组 技术领域
本实用新型涉及射频终端技术领域，尤其涉及一种运用于5G产品的射频模组。
 背景技术
随着5G时代的到来，5G的终端和设备应用的数量不断上升。而在5G产品之中，5G移动设备无疑是最常见、最便携的5G终端设备。目前，5G移动设备包括芯片以及处理收发信号实现5G数据传输的天线和射频器件，因此，射频模组成为5G移动设备的重要模块。
相关技术的所述射频模组包高频电路板和叠设固定于所述高频电路板的天线单元。
 技术问题
然而，相关技术中所述射频模组采用的所述高频电路板与所述天线单元共同加工，虽然性能较优，但是材料成本高，还有加工成本很高；另外，所述高频电路板的层叠数量较多，一般在10层以上，加工难度较大，使得加工成本高；还有所述高频电路板所采用的电路板介电常数（英文Dielectric Constant，简称DK）值较低，并应用于加工所述天线单元，直接造成所述天线单元的体积较大，不利于小型化应用。在应用上，相关技术中所述射频模组还需要通过设置两个连接器与射频前端模块和外围电路模块连接，其中，采用两个所述连接器进行装配较为复杂，从而使得射频模组装配工艺复杂，使得制造成本高。
因此，实有必要提供一种新的射频模组解决上述技术问题。
 技术解决方案
本实用新型的目的在于提供一种体积小、易于加工和组装以及节约成本的射频模组。
为了达到上述目的，本实用新型提供了一种射频模组，其包括射频模块和用于将所述射频模块与外部主板连接的连接模块；所述射频模块包括电路板和叠设固定于所述电路板一侧的天线单元；所述电路板与所述天线单元均为低温共烧陶瓷技术制成，所述连接模块与所述射频模块通过表面组装技术或者胶合形成固定。
优选的，所述电路板与所述天线单元一体成型。
优选的，所述电路板与所述天线单元通过表面组装技术或者胶合形成固定。
优选的，所述连接模块包括柔性电路板和与所述柔性电路板形成可拆卸连接且用于连接外部主板的连接器。
优选的，所述柔性电路板为聚四氟乙烯电路板或液晶聚合物电路板或改进型聚酰亚胺电路板或聚酰亚胺电路板。
优选的，所述柔性电路板通过表面组装技术或者胶合固定于所述电路板背离所述天线单元的一侧。
优选的，所述柔性电路板包括与所述电路板连接的第一段和由所述第一段向远离所述电路板的方向弯折延伸的第二段，所述连接器固定于所述第二段，所述第一段至少部分通过表面组装技术或者胶合固定于所述电路板。
优选的，所述射频模块还包括固定于所述电路板背离所述天线单元一侧的外围电路模块和与所述天线单元电连接的射频前端模块。
优选的，所述天线单元包括天线本体和固定于所述天线本体远离所述电路板一侧的辐射片，所述辐射片与所述天线本体耦合。
优选的，所述辐射片包括多个，多个所述辐射片相互间隔设置。
 有益效果
与相关技术相比，本实用新型的射频模组的射频模块设置电路板和固定于所述电路板的天线单元，并采用低温共烧陶瓷技术制成所述电路板与所述天线单元；由于陶瓷介电常数值较高，所述电路板与所述天线单元均由于采用低温共烧陶瓷技术制成，可减小天线尺寸，从而可减少射频模组体积，节约射频模组在整机内的占用空间，有利于组装和应用。另外，射频模组设置用于将所述射频模块与外部主板连接的连接模块，并将所述连接模块与所述射频模块通过表面组装技术或者胶合形成固定。该结构将所述连接模块和所述天线单元分开加工再组装，使得有效的将产品层叠分摊到不同产品，大大的降低了加工难度；该结构还可以节省相互电连接的连接器，从而减少装配，也有利于提高射频模组的加工和可靠性。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型射频模组的立体结构示意图；
图2为本实用新型射频模组的部分立体结构分解图；
图3为本实用新型射频模组另一角度的立体结构示意图；
图4为本实用新型射频模组与主板的立体装配结构示意图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请同时参阅图1-4，本实用新型提供了一种射频模组100。所述射频模组100与外部主板200连接。所述射频模组100用于实现收发信号实现5G数据传输。所述主板200为实现5G功能的设备。
所述射频模组100包括射频模块10和用于将所述射频模块10与外部主板200连接的连接模块5。
所述射频模块10包括电路板1和天线单元2。
所述电路板1用于电路走线及连接电路元器件。
所述电路板1与所述天线单元2均为低温共烧陶瓷技术（英文Low Temperature Co-fired Ceramic ，简称LTCC）制成。由于陶瓷介电常数值较高，可减小天线尺寸，从而可减少所述射频模组100体积，节约所述射频模组100在整机内的占用空间，即所述射频模组100体积小，有利于组装和应用。
所述天线单元2叠设固定于所述电路板1一侧。具体的，所述天线单元2包括天线本体21和固定于所述天线本体21远离所述电路板1一侧的辐射片22。所述辐射片22与所述天线本体21耦合。其中，所述辐射片22包括多个，多个所述辐射片22相互间隔设置。多片所述辐射片22设置于所述电路板1的一侧的结构有利于收发信号实现5G数据。
本实施方式中，所述电路板1与所述天线单元2一体成型，有利于降低了所述射频模组100加工难度，并也提高了所述射频模组100的可靠性。当然，不限于此，所述电路板1与所述天线单元2的固定方式还可以为其他方式，例如所述电路板1与所述天线单元2通过表面组装技术（英文Surface Mounted Technology，简称为SMT）或者胶合形成固定。该结构将所述电路板1和所述天线单元2分开加工再组装，使得有效的将所述射频模组100层叠分摊到不同产品，大大的降低了加工难度。
本实施方式中，所述射频模块10还包括固定于所述电路板1背离所述天线单元2一侧的外围电路模块4和与所述天线单元2电连接的射频前端模块3。
所述连接模块5包括柔性电路板51和与所述柔性电路板51形成可拆卸连接且用于连接外部主板200的连接器52。
本实施方式中，所述柔性电路板51为高频柔性电路板加工制成。具体的，所述柔性电路板51为聚四氟乙烯PTFE电路板或液晶聚合物LCP电路板或改进型聚酰亚胺MPI电路板或聚酰亚胺电路板中一种。
所述连接器52安装固定于所述柔性电路板51。所述连接器52用于与外部所述主板200电连接的。本实施方式中，连接模块5与射频模块10通过表面组装技术或者胶合形成固定，所述连接模块5只设置一个用于与所述主板200连接的所述连接器52，有利于射频模组100组装，减少装配，节约成本，同时也提高可靠性。
本实施方式中，所述柔性电路板51包括与所述电路板1连接的第一段511和由所述第一段511向远离所述电路板1的方向弯折延伸的第二段512，所述连接器52固定于所述第二段512。所述第一段511至少部分通过表面组装技术或者胶合固定于所述电路板1。该结构的设置可以节省所述电路板1与所述连接模块5相互电连接的连接器，从而减少装配，也有利于提高所述射频模组100的加工和可靠性。
本实施方式中，所述电路板1呈矩形，其包括相对设置的两长轴边和相对设置的两短轴边，所述第一段511贴合固定于其中一所述短轴边，且所述第一段511的其中一侧与其中一所述长轴边平齐，所述第二段512由所述第一段511平齐于所述长轴边的一侧垂直延伸。该结构使得射频模组100连接于所述主板200的一侧，有利于安装和使用，同时有利于降低射频模组100的加工成本。
    需要指出的是，所述电路板1、所述天线单元2、所述射频前端模块3、所述外围电路模块4以及所述连接模块5均为本技术领域中常用的电路、元器件和模块，具体型号和性能指标需要根据实际使用需要进行选择，在此不做详细描述。
与相关技术相比，本实用新型的射频模组的射频模块设置电路板和固定于所述电路板的天线单元，并采用低温共烧陶瓷技术制成所述电路板与所述天线单元；由于陶瓷介电常数值较高，所述电路板与所述天线单元均由于采用低温共烧陶瓷技术制成，可减小天线尺寸，从而可减少射频模组体积，节约射频模组在整机内的占用空间，有利于组装和应用。另外，射频模组设置用于将所述射频模块与外部主板连接的连接模块，并将所述连接模块与所述射频模块通过表面组装技术或者胶合形成固定。该结构将所述连接模块和所述天线单元分开加工再组装，使得有效的将产品层叠分摊到不同产品，大大的降低了加工难度；该结构还可以节省相互电连接的连接器，从而减少装配，也有利于提高射频模组的加工和可靠性。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (10)

  1. 一种射频模组，其特征在于，该射频模组包括射频模块和用于将所述射频模块与外部主板连接的连接模块；所述射频模块包括电路板和叠设固定于所述电路板一侧的天线单元；所述电路板与所述天线单元均为低温共烧陶瓷技术制成，所述连接模块与所述射频模块通过表面组装技术或者胶合形成固定。
  2. 根据权利要求1所述的射频模组，其特征在于，所述电路板与所述天线单元一体成型。
  3. 根据权利要求1所述的射频模组，其特征在于，所述电路板与所述天线单元通过表面组装技术或者胶合形成固定。
  4. 根据权利要求1所述的射频模组，其特征在于，所述连接模块包括柔性电路板和与所述柔性电路板形成可拆卸连接且用于连接外部主板的连接器。
  5. 根据权利要求4所述的射频模组，其特征在于，所述柔性电路板为聚四氟乙烯电路板或液晶聚合物电路板或改进型聚酰亚胺电路板或聚酰亚胺电路板。
  6. 根据权利要求4所述的射频模组，其特征在于，所述柔性电路板通过表面组装技术或者胶合固定于所述电路板背离所述天线单元的一侧。
  7. 根据权利要求6所述的射频模组，其特征在于，所述柔性电路板包括与所述电路板连接的第一段和由所述第一段向远离所述电路板的方向弯折延伸的第二段，所述连接器固定于所述第二段，所述第一段至少部分通过表面组装技术或者胶合固定于所述电路板。
  8. 根据权利要求1所述的射频模组，其特征在于，所述射频模块还包括固定于所述电路板背离所述天线单元一侧的外围电路模块和与所述天线单元电连接的射频前端模块。
  9. 根据权利要求1所述的射频模组，其特征在于，所述天线单元包括天线本体和固定于所述天线本体远离所述电路板一侧的辐射片，所述辐射片与所述天线本体耦合。
  10. 根据权利要求9所述的射频模组，其特征在于，所述辐射片包括多个，多个所述辐射片相互间隔设置。
PCT/CN2020/114435 2020-07-08 2020-09-10 射频模组 Ceased WO2022007180A1 (zh)

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