WO2022000190A1 - 散热装置、散热组件及移动平台 - Google Patents

散热装置、散热组件及移动平台 Download PDF

Info

Publication number
WO2022000190A1
WO2022000190A1 PCT/CN2020/098933 CN2020098933W WO2022000190A1 WO 2022000190 A1 WO2022000190 A1 WO 2022000190A1 CN 2020098933 W CN2020098933 W CN 2020098933W WO 2022000190 A1 WO2022000190 A1 WO 2022000190A1
Authority
WO
WIPO (PCT)
Prior art keywords
bracket
circuit board
heat dissipation
heat
dissipation device
Prior art date
Application number
PCT/CN2020/098933
Other languages
English (en)
French (fr)
Inventor
桑晓庆
张雅文
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2020/098933 priority Critical patent/WO2022000190A1/zh
Priority to CN202080005481.9A priority patent/CN112789958A/zh
Publication of WO2022000190A1 publication Critical patent/WO2022000190A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the present application relates to the technical field of cooling and heat dissipation, and in particular, to a heat dissipation device, a heat dissipation component and a mobile platform.
  • the existing highly integrated UAV internal devices are gradually integrated and protected inside the UAV, resulting in the concentration of heat in the device and the inability to dissipate naturally. It is necessary to install heat dissipation components for active heat dissipation.
  • the internal components of the drone are relatively complex, and at least one heating element is arranged on multiple planes. The heating elements on multiple planes may generate heat at the same time, and the high temperature of the heating element may easily lead to damage.
  • the heat dissipation structure can only be arranged horizontally or vertically, and can only dissipate heat from the heating elements located on the same plane.
  • the multiple systems are arranged in multiple different spaces in space.
  • the current heat dissipation structure cannot achieve a better heat dissipation effect.
  • Embodiments of the present application provide a heat dissipation device, a heat dissipation assembly, and a mobile platform.
  • the heat dissipation device of the embodiment of the present application is used for dissipating heat for the first circuit board, and the heat dissipation device includes a first bracket, a second bracket and a heat dissipation member.
  • the first bracket is used to install the first circuit board;
  • the second bracket is connected to the first bracket, and the second bracket and the first bracket are not in the same plane;
  • the heat sink is connected to the The second bracket is connected, so that the heat generated by the first circuit board can be dissipated through the heat dissipation member after passing through the first bracket and the second bracket in sequence.
  • the heat generated by the circuit board installed on the first bracket can pass through the first bracket and the second bracket in sequence. After the bracket, it is dissipated through the heat sink, and the first bracket and the second bracket are not in the same plane, so that the heat sink can dissipate heat for components installed on at least two different planes. Devices with components distributed on at least two different planes dissipate heat.
  • the heat dissipation device of the embodiment of the present application is used to dissipate heat for at least the first circuit board and the second circuit board.
  • the heat dissipation device includes a heat-conducting member and a heat-dissipating member, and the heat-conducting member includes a first section and a second section that are connected to each other.
  • the heat dissipation member is connected to the second section of the heat-conducting member; wherein the first section is used for installing the first circuit board, and the second section for installing the second circuit board, so that the heat generated by the first circuit board and the second circuit board is conducted to the heat dissipation member for heat dissipation; or, the first section is used for installing the A first circuit board, the heat generated by the first circuit board can be conducted to the heat dissipation member for heat dissipation; the heat dissipation member is also used for mounting with the second circuit board, so that the second circuit The heat generated by the plate can be dissipated through the heat sink.
  • the first section and the second section of the heat conduction member are not on the same plane, and the heat dissipation member is connected to the second section of the heat conduction member, and the first section and the second section of the heat conduction member absorb the The heat can be transferred to the heat sink. Since the first section and the second section of the heat conduction member are not on the same plane, the heat sink can dissipate heat for circuit boards located on at least two different planes, so that the heat sink can be applied to Dissipate heat for devices with many components and multiple components distributed on at least two different planes.
  • the heat dissipation assembly of the embodiment of the present application includes a first circuit board, a second circuit board, and the heat dissipation device described in any one of the above embodiments, and the heat dissipation device is used to dissipate heat for the first circuit board and the second circuit board.
  • the mobile platform of the embodiment of the present application includes a body and a heat dissipation assembly, the heat dissipation assembly is mounted on the body, and the heat dissipation assembly includes a first circuit board, a second circuit board and the heat dissipation assembly described in any embodiment of the present application.
  • a heat dissipation device is used for dissipating heat for the first circuit board and the second circuit board.
  • the heat dissipation device can dissipate heat for a plurality of internal components distributed on at least two different planes.
  • FIG. 1 is a schematic three-dimensional assembly diagram of a mobile platform according to an embodiment of the present application.
  • FIG. 2 is a perspective exploded schematic diagram of a heat dissipation assembly according to an embodiment of the present application
  • FIG. 3 is a schematic exploded perspective view of the heat dissipation assembly of the embodiment of the present application from another perspective;
  • FIG. 4 is a schematic three-dimensional assembly diagram of a heat sink according to an embodiment of the present application.
  • FIG. 5 is a schematic exploded perspective view of a heat sink according to an embodiment of the present application.
  • FIG. 6 is a schematic three-dimensional assembly diagram of a heat dissipation assembly according to an embodiment of the present application.
  • FIG. 7 is a schematic three-dimensional assembly diagram of a heat dissipation assembly according to an embodiment of the present application.
  • FIG. 8 is a schematic exploded perspective view of a heat dissipation assembly according to an embodiment of the present application.
  • FIG. 9 is a schematic three-dimensional assembly diagram of a heat sink according to an embodiment of the present application.
  • FIG. 10 is a schematic three-dimensional assembly diagram of a heat sink according to an embodiment of the present application.
  • FIG. 11 is a schematic three-dimensional assembly diagram of a heat sink according to an embodiment of the present application.
  • a first feature "on” or “under” a second feature may be in direct contact with the first and second features, or the first and second features indirectly through an intermediary get in touch with.
  • the first feature being “above”, “over” and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature being “below”, “below” and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • the mobile platform 2000 includes a body 400 and a heat dissipation assembly 1000 , and the heat dissipation assembly 1000 is installed on the body 400 .
  • the mobile platform 2000 may specifically be any device that can move or rotate.
  • the mobile platform 2000 may include, but is not limited to, land mobile equipment, water mobile equipment, air mobile equipment, and other types of mobile vehicles.
  • mobile platform 2000 may include passenger vehicles, unmanned aerial vehicles, unmanned vehicles, unmanned boats, and the like, and operation of mobile platform 2000 may include flying, parading, crawling, and the like.
  • the embodiments of the present application are illustratively described by taking the mobile platform 2000 as an unmanned aerial vehicle as an example, and it can be understood that the mobile platform 2000 is not limited to an unmanned aerial vehicle, and may be other types.
  • the unmanned aerial vehicle may be a multi-rotor unmanned aerial vehicle, such as a quad-rotor unmanned aerial vehicle, a six-rotor unmanned aerial vehicle, an eight-rotor unmanned aerial vehicle, a twelve-rotor unmanned aerial vehicle, and the like.
  • Unmanned aerial vehicles can be used to carry loads to complete predetermined tasks, such as carrying imaging devices for shooting, carrying pesticides, nutrient solutions and spraying devices for plant protection tasks, etc.
  • Unmanned aerial vehicles can also be used in miniature selfie, express transportation, disaster rescue, observation of wild animals, monitoring of infectious diseases, surveying and mapping, news reporting, power inspection, disaster relief, film and television shooting and other fields.
  • the fuselage 400 can be used as an installation carrier for the functional components of the mobile platform 2000.
  • a gimbal, a load, a heat dissipation component 1000, etc. can be installed outside the fuselage 400, and a power module, a flight control system, a video transmission device, etc. can be installed inside the fuselage 400. Wait.
  • the body 400 may provide protection against water and dust for the functional components installed in the body 400, and the body 400 may provide installation space for the heat dissipation component 1000, the gimbal, and the like.
  • the heat dissipation assembly 1000 of the embodiment of the present application includes a first circuit board 200 , a second circuit board 300 and a heat dissipation device 100 , and the heat dissipation device 100 is used for the first circuit board 200 and the second circuit board 300 to dissipate heat.
  • the heat dissipation assembly 1000 may be installed on the fuselage 400 by means of bonding, welding, fastener connection, or the like.
  • the first circuit board 200 may be mounted with components such as processors and various chips.
  • the first circuit board 200 and the components mounted on the first circuit board 200 will generate a large amount of heat during operation. When the heat of the board 200 and the components mounted on the first circuit board 200 is too high, damage may occur or the service life may be shortened, which may further cause the mobile platform 2000 to fail to operate normally.
  • the second circuit board 300 can be mounted with components such as processors and various chips.
  • the second circuit board 300 and the components mounted on the second circuit board 300 can generate a large amount of heat during operation. When the heat of the components mounted on the second circuit board 300 is too high, damage may occur or the service life may be shortened, which may further cause the mobile platform 2000 to fail to operate normally.
  • the components mounted on the second circuit board 300 may be the same as the components mounted on the first circuit board 200 , and the components mounted on the second circuit board 300 may also be different from those mounted on the first circuit board 200 .
  • the heat generated by the first circuit board 200 may be the same as the heat generated by the second circuit board 300, and the heat generated by the first circuit board 200 may also be different from the heat generated by the second circuit board 300.
  • the first circuit board The heat generated by the first circuit board 200 is smaller than the heat generated by the second circuit board 300 , or the heat generated by the first circuit board 200 is greater than the heat generated by the second circuit board 300 .
  • the first circuit board 200 is mounted with one or more of the image transmission transmitter chip, the image transmission amplifying chip and the image transmission processing chip, for example, the first circuit board 200 is mounted with a graphic transmission chip.
  • the transmission chip, or the image transmission amplifying chip is installed on the first circuit board 200, or the image transmission processing chip is installed on the first circuit board 200, or the image transmission transmission chip and the image transmission amplification chip are installed on the first circuit board 200.
  • an image transmission transmitter chip and an image transmission processing chip are installed on the first circuit board 200
  • an image transmission amplifying chip and an image transmission processing chip are installed on the first circuit board 200
  • an image transmission chip is installed on the first circuit board 200 .
  • Transmission transmitter chip image transmission amplifying chip and image transmission processing chip. It should be noted that the components mounted on the first circuit board 200 are not limited to the above-mentioned image transmission transmitter chip, image transmission amplifying chip and image transmission processing chip, but may also be other components.
  • the first circuit board 200 is mounted with one or more of the image transmission transmitter chip, the image transmission amplifying chip and the image transmission processing chip, so that the heat sink 100 can better dissipate the image transmission
  • the heat sink 100 can better dissipate the image transmission
  • One or more of the amplifying chip and the image transmission processing chip are dissipated for heat dissipation, so that one or more of the image transmission transmitting chip, the image transmission amplifying chip and the image transmission processing chip are not prone to malfunction due to excessive temperature during operation. Ensure that the image processing and transmission process is stable and reliable.
  • one or more of a vision processing chip and a memory chip are mounted on the second circuit board 300 , for example, a vision processing chip is mounted on the second circuit board 300 , or the second circuit board 300 A memory chip is mounted thereon, or a vision processing chip and a memory chip are mounted on the second circuit board 300 .
  • the heat dissipation device 100 can dissipate heat for one or more of the vision processing chip and the storage chip mounted on the second circuit board 300, so that one or more of the vision processing chip and the storage chip are not easily affected by the temperature during operation. If it is too high, it will lead to failure, and the process of visual positioning or information storage is guaranteed to be stable and reliable.
  • the components mounted on the second circuit board 300 are not limited to the above-mentioned vision processing chip and memory chip, and may also be other components.
  • the heat dissipation device 100 in the embodiment of the present application is used to dissipate heat for the first circuit board 200
  • the heat dissipation device 100 includes a first bracket 10 , a second bracket 20 and a heat dissipation member 30 .
  • the first bracket 10 is used to install the first circuit board 200
  • the second bracket 20 is connected to the first bracket 10
  • the second bracket 20 and the first bracket 10 are not in the same plane
  • the heat sink 30 is connected to the second bracket 20, so that the The heat generated by the first circuit board 200 can pass through the first bracket 10 and the second bracket 20 in sequence and dissipate through the heat dissipation member 30 .
  • the heat sink 100 , the heat sink assembly 1000 and the mobile platform 2000 in the embodiments of the present application are provided with the first bracket 10 and the second bracket 20 connected to each other, and the heat sink 30 is connected to the second bracket 20 and installed on the first bracket 10
  • the heat generated by the circuit board on the top can be dissipated through the first bracket 10 and the second bracket 20 through the heat sink 30 in sequence, and the first bracket 10 and the second bracket 20 are not in the same plane, so that the heat sink 100 can be installed in the
  • the heat dissipating device 100 is suitable for dissipating heat for a device with a large number of elements, and a plurality of elements are distributed on at least two different planes.
  • the heat dissipation assembly 1000 can dissipate heat for components distributed on at least two different planes, which reduces the temperature of the fuselage of the unmanned aerial vehicle and the components installed on the fuselage, and makes the unmanned aerial vehicle less prone to abnormal operation.
  • the structure of the heat dissipation assembly 1000 of the embodiment of the present application is more compact than the heat dissipation assembly that uses a plurality of single-plane heat dissipation devices at the same time, which can reduce the cost of the unmanned aerial vehicle. volume and weight.
  • the installation position of the first circuit board 200 on the first bracket 10 is not limited here.
  • the first circuit board 200 can be installed on the side of the first bracket 10 close to the second bracket 20 .
  • the circuit board 200 may also be mounted on the side of the first bracket 10 away from the second bracket 20 .
  • the second bracket 20 and the first bracket 10 may be fixedly connected or detachably connected.
  • the second bracket 20 may be fixedly connected to the first bracket 10 by welding, bonding, etc.
  • the second bracket 20 is detachably connected to the first bracket 10 by means of pins, snaps and the like.
  • first bracket 10 and the second bracket 20 are not on the same plane, it can be understood that the first bracket 10 and the second bracket 20 are arranged on different planes, so that the first bracket 10 and the second bracket 20 can be installed on at least different on two planes. That is, the first bracket 10 is installed on one surface of the device, and the second bracket 20 can be installed on the other surface of the device.
  • the heat sink 30 may be specifically a heat sink tooth, a heat sink, a fan, a copper tube, etc.
  • the connection between the heat sink 30 and the second bracket 20 may be that the heat sink 30 is attached to the second bracket 20, or the heat sink 30 is connected. on one end of the second bracket 20 .
  • the heat sink 30 and the second bracket 20 may be fixedly or detachably connected.
  • the heat generated by the first circuit board 200 can pass through the first bracket 10 and the second bracket 20 and then dissipate through the heat sink 30, so that the heat sink 30 can dissipate heat to the first circuit board 200 mounted on the first bracket 10, and the heat dissipation
  • the device 100 can also dissipate heat for components not mounted on the plane where the heat sink 30 is located, so that the heat dissipating device 100 can dissipate heat for components on multiple different planes at the same time.
  • the heat dissipation device 100 is also used to dissipate heat for the second circuit board 300 .
  • the second bracket 20 is used to mount the second circuit board 300 .
  • the second circuit board 300 can be installed at any position on the second bracket 20, for example, the second circuit board 300 can be installed on the side of the second bracket 20 close to the first bracket 10, and the second circuit board 300 can also be installed On the side of the second bracket 20 remote from the first bracket 10 .
  • the second circuit board 300 may be partially mounted on the second bracket 20 , and the second circuit board 300 may also be fully mounted on the second bracket 20 .
  • the second circuit board 300 is mounted on the second bracket 20. Since the heat sink 30 is connected to the second bracket 20, the heat sink 30 can also dissipate heat from the second circuit board 300, thereby reducing the temperature of the second circuit board 300 so that the The second circuit board 300 will not be damaged due to excessive temperature.
  • the heat sink 30 is used to mount the second circuit board 300 .
  • the second circuit board 300 can be installed on any position of the heat dissipation member 30 , so that the heat dissipation member 30 can dissipate heat to the second circuit board 300 .
  • the second circuit board 300 may be attached to the heat sink 30 , and the second circuit board 300 may also be mounted on the end of the heat sink 30 that is not connected to the second bracket 20 .
  • the second circuit board 300 is mounted on the heat sink 30, so that the heat sink 30 can dissipate heat to the second circuit board 300, and the second circuit board 300 and the components mounted on the second circuit board 300 are not easily damaged due to excessive temperature .
  • the second bracket 20 and the heat sink 30 are used together to mount the second circuit board 300 .
  • part of the second circuit board 300 may be installed on the heat sink 30, and part of the second circuit board 300 may be installed on the second bracket 20; or the second circuit board 300 may be installed between the second bracket 20 and the heat sink 30 time; the positional relationship between the second circuit board 300 and the second bracket 20 and the heat sink 30 is not limited herein.
  • the first bracket 10 can be made of metal material, plastic material, elastic material, etc.
  • the first bracket 10 can be attached to the first circuit board 200 , or the first bracket 10 can be The circuit boards 200 are connected at intervals, or a thermally conductive element such as a thermally conductive sheet can be installed between the first bracket 10 and the first circuit board 200 , or the first bracket 10 and the first circuit board 200 are filled with thermally conductive silicone grease and thermally conductive adhesive. and other heat transfer liquids.
  • the first bracket 10 is made of a metal material, for example, the first bracket 10 is made of a metal material such as iron, copper, aluminum, alloy, etc. In this way, the first bracket 10 can have high hardness, and the first bracket 10 The bracket 10 is not easily deformed, and the thermal conductivity of the first bracket 10 is good.
  • the first bracket 10 is attached to the first circuit board 200, so that the heat generated on the first circuit board 200 can be better transferred to the first bracket 10, so that the first bracket 10 can transfer the heat to the second bracket After 20, it is dissipated by the heat sink 30.
  • the first bracket 10 is made of a plastic material, for example, the first bracket 10 is made of a plastic material such as plastic, plastic, etc. Therefore, compared with a metal material, the quality of the first bracket 10 is relatively high Small, larger design space can be provided during spatial arrangement, and the mass of the heat dissipation device 100 , the heat dissipation assembly 1000 and the mobile platform 2000 is reduced.
  • the first bracket 10 is also used for mounting the third circuit board 500 , and opposite sides of the first bracket 10 are respectively used for mounting the first circuit board 200 and the third circuit board 500, thus, the heat dissipation device 100 can also dissipate heat to the third circuit board 500 and reduce the temperature of the third circuit board 500, so that the temperature of the third circuit board 500 and the components mounted on the third circuit board 500 are not If it is too high, failure will occur, so that the heat dissipation assembly 1000 and the mobile platform 2000 can work normally.
  • the components mounted on the third circuit board 500 may be the same as the components mounted on the first circuit board 200 , and the components mounted on the third circuit board 500 may also be the same as the components mounted on the first circuit board 200 Are not the same.
  • the third circuit board 500 and the first circuit board 200 are not on the same side of the first bracket 10 , and the third circuit board 500 is mounted on the opposite side of the first bracket 10 where the first circuit board 200 is mounted, so that the third circuit board 500 can The generated heat is transferred to the first bracket 10 , so that the heat dissipation member 30 can dissipate more heat generated by the third circuit board 500 , and the temperature of the third circuit board 500 is lower.
  • the second bracket 20 can be made of plastic material, metal material, elastic material, etc.
  • the second bracket 20 can be attached to the second circuit board 300 , and the second bracket 20 can also be
  • the circuit boards 300 are arranged at intervals, and a thermally conductive element such as a thermally conductive sheet can also be arranged between the second bracket 20 and the second circuit board 300 , and thermally conductive silicone grease, thermally conductive adhesive, etc. can also be filled between the second bracket 20 and the second circuit board 300 . liquid.
  • the second bracket 20 is made of a metal material, for example, the second bracket 20 can be made of a metal material such as iron, copper, aluminum, alloy, etc., thus, the second bracket 20 can have higher hardness and strength, the second bracket 20 is not easily deformed, and at the same time, the second bracket 20 can better transfer heat.
  • the second bracket 20 is used to fit with the second circuit board 300 , so that the heat generated by the second circuit board 300 can be transferred to the second bracket 20 , and then further transferred from the second bracket 20 to the heat sink 30 to be dissipated. 30 pieces are distributed.
  • the second bracket 20 is made of a plastic material, for example, the second bracket 20 is made of a plastic material such as plastic, plastic, etc. In this way, the quality of the second bracket 20 is relatively higher than that of a metal material. Small, larger design space can be provided during spatial arrangement, and the mass of the heat dissipation device 100 , the heat dissipation assembly 1000 and the mobile platform 2000 is reduced.
  • the heat sink 30 is detachably mounted on the second bracket 20 , as shown in FIGS. 2 and 5 . It is disassembled and installed on the second bracket 20, so that when one of the heat sink 30 and the second bracket 20 is damaged, the damaged one of the heat sink 30 and the second bracket 20 is disassembled for maintenance or replacement, which reduces the amount of discarding.
  • the number of components reduces the maintenance cost of the heat sink 100 .
  • the second bracket 20 is provided with a fixing post
  • the heat sink 30 is provided with a stud
  • the second bracket 20 and the heat sink 30 are fixedly connected by screws.
  • the heat sink 30 and the second bracket 20 are integrally formed.
  • the heat sink 30 and the second bracket 20 are formed by casting , The forging method is manufactured into an integrated structure, which can reduce the manufacturing cost of the heat sink 30 and the second bracket 20, and at the same time, the relative position between the heat sink 30 and the second bracket 20 is more stable.
  • the second bracket 20 includes a first end 21 and a second end 22 , the first bracket 10 is connected to the first end 21 of the second bracket 20 , and the heat sink 30 It is connected to the second end 22 of the second bracket 20 , so that the heat on the first bracket 10 can be transferred from the first end 21 of the second bracket 20 to the second end 22 of the second bracket 20 .
  • the heat sinks 30 on the two ends 22 can dissipate the received heat, so as to reduce the heat of the first circuit board 200 mounted on the first bracket 10 .
  • the first end 21 and the second end 22 of the second bracket 20 may be located on different sides of the second bracket 20 , for example, the first end 21 and the second end 22 can be the adjacent two ends of the second bracket 20, as shown in FIG. 9, the first end 21 and the second end 22 can also be opposite ends of the second bracket 20, as shown in FIG. 2 and FIG. 5 .
  • the first bracket 10 is connected to the first end 21 of the second bracket 20 and is not on the same plane as the second bracket 20 .
  • the first bracket 10 can be connected to the second bracket 20 vertically or obliquely.
  • the heat sink 30 may be connected to the second end 22 of the second bracket 20 by means of screws, pins, welding, etc., so as to dissipate the heat of the second bracket 20 .
  • first end 21 and the second end 22 are opposite ends of the second bracket 20, respectively, the first bracket 10 is vertically connected to the first end 21 of the second bracket 20, and the first bracket 10 and the The included angle formed between the second brackets 20 is a right angle.
  • the first bracket 10 is provided with countersunk holes
  • the second bracket 20 is provided with studs.
  • the heat sink 30 is attached to the second circuit board 300, so that the heat generated by the second circuit board 300 can be directly transferred to the heat sink 30, and then dissipated by the heat sink 30, The temperature of the second circuit board 300 and the components mounted on the second circuit board 300 is lowered, so that the second circuit board 300 and the components mounted on the second circuit board 300 are less likely to fail.
  • the heat dissipation member 30 and the second circuit board 300 are arranged at intervals. Specifically, the heat dissipation member 30 is not directly attached to the second circuit board 300 , for example, a thermal conduction is disposed between the heat dissipation member 30 and the second circuit board 300 . sheet, heat conduction block, gasket, etc., or there is a gap between the heat sink 30 and the second circuit board 300, or the second circuit board 300 is attached to the second bracket 20, and the heat sink 30 is connected to the second bracket 20. Not in direct contact with the second circuit board 300 .
  • the heat sink 30 includes a body 31 and a plurality of heat sinks 32 , the plurality of heat sinks 32 are connected to the body 31 , and the body 31 and at least two heat sinks A heat conduction channel 33 is formed between 32 .
  • the cooling fins 32 may be metal sheets, and the plurality of cooling fins 32 may be arranged in a tooth shape on the main body 31 .
  • the heat sinks 32 on both sides of the heat conduction channel 33 may be connected to the main body 31 at equal or unequal intervals.
  • the main body 31 is also formed with a thermal conductive glue overflow groove 311 , the thermal conductive glue overflow groove 311 is located between at least two heat sinks 32 , and the thermal conductive glue overflow groove 311 is communicated with the heat conduction channel 33 , so that the thermal conductive glue overflow groove 311 can pass through the thermal conductive glue overflow groove.
  • 311 is filled with thermally conductive liquid such as thermally conductive silicone grease or thermally conductive adhesive, so that the components installed in the thermal conduction channel 33 can fully contact the heat sink 30 , so that the heat of the components in the thermal conduction channel 33 can be better dissipated by the heat sink 30 .
  • the heat dissipation device 100 further includes an air supply member 40 , the air supply member 40 is mounted on the second bracket 20 , and the air supply member 40 and the heat dissipation member 30 are substantially located on the same straight line , so that the air flow generated by the air supply member 40 is directed to the heat dissipation member 30 . Therefore, the air supply member 40 can better guide the airflow to the heat dissipation member 30, so as to speed up the heat dissipation on the heat dissipation member 30, and transfer the heat generated by the first circuit board 200 and the second circuit board 300 more quickly, so that the first circuit board 200 and the second circuit board 300 can be transferred more quickly.
  • the temperature of the first circuit board 200 and the second circuit board 300 is not easy to be too high.
  • the airflow direction of the air supply member 40 is from the front side of the fuselage 400 to the rear side of the fuselage 400 , so that the airflow The airflow generated by the air element 40 will not be contrary to the airflow generated when the fuselage 400 moves, so as to affect the flow of the airflow blown by the air supply element 40 to the heat dissipation element 30 .
  • the air supply member 40 may be a centrifugal fan, an axial flow fan, a fan, or other element capable of driving airflow, and the air supply member 40 may be detachably installed or fixedly installed on the second bracket 20 .
  • the air supply member 40 and the heat dissipation member 30 are substantially located on the same straight line. The centers of the pieces 30 lie approximately on the same line. In one embodiment, the center of the air supply member 40 and the center of the heat dissipation member 30 are located on the same line, so that the airflow generated by the air supply member 40 can be directly blown to the heat dissipation member 30 to better remove the temperature on the heat dissipation member 30 .
  • the air supply member 40 is a centrifugal fan. Compared with an axial flow fan of the same size and rotational speed, the airflow generated by the centrifugal fan is more concentrated, and more airflow can be blown toward the heat dissipation member 30 .
  • the axial fan needs to be vertically installed on the second bracket 20, which will increase the volume of the heat dissipation device 100; while the centrifugal fan can change the direction of the airflow, and the use of the centrifugal fan can reduce the size of the heat dissipation device 100, the heat dissipation assembly 1000 and the mobile platform
  • the volume of 2000 makes the heat dissipation device 100 , the heat dissipation assembly 1000 and the mobile platform 2000 more compact.
  • the air supply member 40 may be provided with positioning holes, the side of the air supply member 40 close to the second bracket 20 may be provided with a back glue, and the second bracket 20 is provided with a positioning column. The positioning column is then adhered to the second bracket 20 through back glue, so that the position of the air supply member 40 is relatively stable during operation.
  • a buffer member 41 is also installed between the air supply member 40 and the second bracket 20 , and the buffer member 41 can buffer the vibration generated by the air supply member 40 during operation.
  • the bracket 20 is not easily driven by the air supply member 40 to vibrate together.
  • the buffer member 41 includes, but is not limited to, buffer foam, sponge, spring, silicone member and other elements with buffer performance.
  • the heat dissipation device 100 further includes a heat-conducting member 50 , and the heat-conducting member 50 is used for transferring the heat of the first circuit board 200 and/or the second circuit board 300 to the heat-dissipating member 30 , the heat conducting member 50 includes a first segment 51 and a second segment 52, the first segment 51 and the second segment 52 are not on the same plane, the first segment 51 is fixed on the first bracket 10, and the second segment 52 is fixed on the second bracket 20 on.
  • the heat of the first circuit board 200 and/or the second circuit board 300 can be transferred to the heat dissipation member 30 through the heat conducting member 50, so that the heat dissipation member 30 can better dissipate the first circuit board 200 and/or the second circuit board 300.
  • the first section 51 and the second section 52 are not on the same plane, and are respectively fixed on the first bracket 10 and the second bracket 20, so that the heat-conducting member 50 can dissipate heat at least two different planes of the device to dissipate heat.
  • the heat-conducting member 50 may be a component that can conduct heat, such as a copper tube, a heat-conducting sheet, or the like.
  • the first section 51 and the second section 52 are not on the same plane. It can be understood that the heat conducting member 50 is not straight, but may be bent, so that the first section 51 and the second section 52 can be respectively fixed to the first bracket 10 and on the second bracket 20 .
  • the first section 51 is fixed on the first bracket 10 and the second section 52 is fixed on the second bracket 20, so that the heat-conducting member 50 is not easily damaged, and the heat-conducting member 50 can be It is used to dissipate heat for devices that require heat dissipation on multiple surfaces.
  • the heat dissipation device 100 includes a first bracket 10 , a second bracket 20 , a heat dissipation member 30 , an air supply member 40 and a heat conduction member 50 , and the heat conduction member 50 transfers the heat of the first circuit board 200 and the second circuit board 300 to the heat dissipation member 30 , and then the air supply member 40 generates airflow to blow the heat dissipation member 30 for heat dissipation.
  • a limit scenario is set: the ambient temperature is 40°C, and the simulation test is performed under static conditions without wind.
  • the thermally conductive member 50 is connected to the first circuit board 200 .
  • the thermally conductive member 50 is attached to the first circuit board 200 , or the thermally conductive silicone grease, thermally conductive adhesive and other objects are filled between the thermally conductive member 50 and the first circuit board 200 , or the thermally conductive member 50 passes through the first bracket 10 and the first circuit board 200 .
  • a circuit board 200 is connected, so that the heat of the first circuit board 200 can be transferred to the heat-conducting member 50, and the heat-conducting member 50 can transfer the received heat to the heat-dissipating member 30, so that the heat-dissipating member 30 can transfer the heat generated by the first circuit board 200 to the heat-dissipating member 30.
  • the heat dissipates.
  • the heat conducting member 50 is connected to the second circuit board 300 .
  • the heat-conducting member 50 is attached to the second circuit board 300 , or the space between the heat-conducting member 50 and the second circuit board 300 is filled with heat-conducting liquid such as heat-conducting silicone grease, heat-conducting glue, or the like, or the heat-conducting member 50 is connected to the second bracket 20 through the second bracket 20 .
  • the second circuit board 300 is connected; thus, the heat of the second circuit board 300 can be transferred to the heat-conducting member 50, and the heat-conducting member 50 can transfer the received heat to the heat-dissipating member 30, so that the heat-dissipating member 30 can dissipate more heat.
  • the heat of the second circuit board 300 is connected to the second circuit board 300 .
  • the heat conducting member 50 is connected to the first circuit board 200 and the second circuit board 300 .
  • the first section 51 is attached to the first circuit board 200
  • the second section 52 is attached to the second circuit board 300 ; or the space between the first section 51 and the first circuit board 200 is filled with thermally conductive silicone grease, thermally conductive adhesive, etc.
  • the second section 52 and the second circuit board 300 are filled with thermally conductive silicone grease, thermally conductive adhesive and other objects; or the first section 51 and the first circuit board 200 are respectively attached to two opposite sides of the first bracket 10 .
  • the second section 52 and the second circuit board 300 are respectively attached to opposite sides of the second bracket 20 .
  • the heat generated by the first circuit board 200 and the second circuit board 300 can be transferred to the heat-conducting member 50, and the heat-conducting member 50 can transfer the received heat to the heat-dissipating member 30, so that the heat-dissipating member 30 can transfer the first circuit board 200 to the heat-dissipating member 30.
  • the heat generated by the second circuit board 300 is dissipated.
  • the second section 52 can extend into the heat conduction channel 33 of the heat dissipation member 30 described in the above-mentioned embodiment, so that the heat on the heat conduction member 50 can be transferred to the heat dissipation member 30 and then dissipated by the heat dissipation member 30, thereby improving the heat dissipation device. 100 to the heat dissipation efficiency of the first circuit board 200 and the second circuit board 300 .
  • the second section 52 can cover the thermal conductive overflow groove 311 formed on the main body 31 , so that the thermal conductive liquid such as thermal conductive silicone grease or thermal conductive glue can be filled through the thermal conductive overflow groove 311 , so that the heat sink 30 can be fully contacted with the thermal conduction member 50 . , so that the heat on the heat-conducting member 50 can be fully transferred to the heat-dissipating member 30 and then dissipated by the heat-dissipating member 30 , thereby effectively improving the heat dissipation efficiency of the heat-dissipating device 100 to the first circuit board 200 and the second circuit board 300 .
  • the thermal conductive liquid such as thermal conductive silicone grease or thermal conductive glue
  • the first end 21 and the second end 22 are the two adjacent ends of the second bracket 20 .
  • the extending direction of the second section 52 is inconsistent with the flow direction of the air flow formed by the air supply member 40 .
  • a bracket 20 is installed on the left side wall of the fuselage 400, and the flow direction of the airflow formed by the air supply member 40 can still be consistent with the moving direction of the mobile platform 2000, which can speed up the heat dissipation on the heat dissipation member 30, so that the heat dissipation assembly 1000 can It is used to dissipate heat for any plane on the fuselage 400 .
  • the thermally conductive member 50 further includes a third segment 53 , the third segment 53 and the second segment 52 are respectively connected to both ends of the first segment 51 , and the third segment 53 is connected to the The first section 51 is not on the same plane, and the third section 53 is used to mount the third circuit board, so as to transfer the heat generated by the third circuit board to the heat sink 30 , thus, the heat sink 100 can be a more complex heating system.
  • the device conducts multi-dimensional heat dissipation to achieve better heat dissipation effect.
  • the heat-conducting member 50 can be bent multiple times and is divided into a first section 51, a second section 52 and a third section 53, and the third section 53 and the second section 52 are respectively connected to both ends of the first section 51,
  • the third segment 53 is not on the same plane as the first segment 51
  • the second segment 52 is not on the same plane as the first segment 51 .
  • the second end 22 and the third segment 53 may be on the same plane or on two different planes respectively.
  • the third circuit board is mounted on the third section 53 of the heat-conducting member 50, so that the heat generated by the third circuit board can be transferred to the third section 53 of the heat-conducting member 50, and then passes through the first section 51 and the second section 52 in sequence to reach the Heat sink 30 .
  • the heat dissipation device 100 further includes a third bracket 60 , the third bracket 60 is connected to the first bracket 10 , and the third bracket 60 and the first bracket 10 are not on the same plane, and the third segment 53 is installed on the third bracket 10 .
  • the third circuit board is mounted on the third bracket 60, or the third circuit board is mounted on the third section 53, so that the heat of the third circuit board can be transferred to the third section 53, and then transferred to the third section 53.
  • a section 51 and a second section 52 is
  • connection structure between the first bracket 10 , the second bracket 20 , and the third bracket 60 may also be as shown in FIG. 11 .
  • the first bracket 10 when the heat dissipation assembly 1000 is installed on the fuselage 400, the first bracket 10 can be installed on the right side wall of the fuselage 400.
  • the extension direction of the heat conducting member 50 is inconsistent with the airflow direction of the air supply member 40, and the air supply member 40
  • the airflow direction of the fuselage is still the same as the moving direction of the mobile platform 2000 , which can speed up the heat dissipation of the heat sink 30 , so that the heat sink assembly 1000 can dissipate heat on the left side wall of the fuselage 400 and the components on the left side wall.
  • first bracket 10 can also be installed on the right side wall, rear side wall and bottom wall of the fuselage 400 .
  • the connection structure between the third bracket 60 and the first bracket 10 is not limited to the structure shown in FIG. 11 , for example, the third bracket 60 may be installed on the bottom wall of the fuselage 400 .
  • the first bracket 10 and the second bracket 20 together form an accommodation space 23 , and the accommodation space 23 can be used to accommodate some functional devices (eg, the first circuit board 200 ). , the second circuit board 300 , etc.) or other devices (eg, batteries) for avoiding the mobile platform 2000 .
  • some functional devices eg, the first circuit board 200 .
  • the second circuit board 300 etc.
  • other devices eg, batteries
  • the first segment 51 is disposed on the opposite or the same side of the receiving space 23 of the first bracket 10 .
  • the first circuit board 200 may be disposed on the opposite side of the first bracket 10 or on the same side as the receiving space 23 , the first section 51 and the first circuit board 200 may be disposed on the same side of the first bracket 10 , and the first The segment 51 and the first circuit board 200 may also be disposed on opposite sides of the first bracket 10 respectively.
  • the second segment 52 is disposed on the same or opposite side of the receiving space 23 of the second bracket 20 .
  • the second segment 52 and the accommodating space 23 can be on the same side of the second bracket 20
  • the second segment 52 and the accommodating space 23 can also be on opposite sides of the second bracket 20 respectively.
  • the second circuit board 300 can be arranged on the same side of the second bracket 20 as or opposite to the receiving space 23
  • the second section 52 and the second circuit board 300 can be arranged on the same side of the second bracket 20
  • the second segment 52 and the second circuit board 300 may also be disposed on opposite sides of the second bracket 20 , respectively.
  • the first section 51 is arranged on the opposite side or the same side of the first bracket 10 from the receiving space 23
  • the second section 52 is arranged on the opposite side of the second bracket 20 from the receiving space 23 .
  • the first segment 51 is arranged on the side of the first bracket 10 that faces away from the accommodating space 23
  • the second segment 52 is arranged on the side of the second bracket 20 that faces away from the accommodating space 23
  • the first segment 51 is arranged on the same side as the receiving space 23 of the first bracket 10
  • the second segment 52 is arranged on the same side as the receiving space 23 of the second bracket 20
  • the first segment 51 is arranged on the same side as the first bracket 23
  • the second section 52 is arranged on the same side of the second bracket 20 as the receiving space 23
  • the second segment 52 is disposed on the side of the second bracket 20 opposite to the receiving space 23 .
  • the second bracket 20 is provided with a via hole 24 , and the thermally conductive member 50 passes through the via hole 24 .
  • One of the first section 51 and the second section 52 is located inside the accommodating space 23 , and the other section is located outside the accommodating space 23 .
  • the first section 51 is located in the receiving space 23, and the second section 52 is located outside the receiving space 23, that is, the first section 51 is disposed on the same side of the first bracket 10 as the receiving space 23, and the second section 52 is disposed On the side of the second bracket 20 opposite to the receiving space 23 .
  • the second section 52 is located in the receiving space 23, and the first section 51 is located outside the receiving space 23, that is, the first section 51 is disposed on the side of the first bracket 10 opposite to the receiving space 23, and the second section 52 is disposed On the same side of the second bracket 20 as the receiving space 23 .
  • the first bracket 10 includes a first plate body 11 and a plurality of first limiting ribs 12 .
  • the first board body 11 is used for mounting the first circuit board 200
  • the plurality of first limiting ribs 12 are connected to the first board body 11 .
  • the plurality of first limiting ribs 12 and the first plate body 11 together form a first limiting space 13
  • the first segment 51 is at least partially accommodated in the first limiting space 13 , so that the first limiting space 13 can limit
  • the position of the first section 51 is such that the first section 51 is not easily moved on the first bracket 10 , the first section 51 is not easily damaged, and the first section 51 can better conduct heat on the first circuit board 200 .
  • the first circuit board 200 is mounted on the first board body 11 , the first limiting ribs 12 and the first board body 11 together form a first limiting space 13 , and the first limiting space 13 can limit the first segment 51 at least part of the lateral movement on the first bracket 10 to avoid damage to the first end 51 of the heat-conducting member 50 during movement.
  • the number of the first limiting ribs 12 may be two, three, four, five, etc. more.
  • all of the first segments 51 are accommodated in the first limiting space 13 , so that the first limiting space 13 can better restrict the movement of the heat-conducting member 50 , thereby preventing the heat-conducting member 50 from moving and causing the heat-conducting member 50 to move.
  • Injury condition the first limiting space 13
  • a first glue overflow groove 111 is formed on the first plate body 11 , and the first glue overflow groove 111 is located between the plurality of first limiting ribs 12 . , the first overflow groove 111 communicates with the first limiting space 13 .
  • the first glue overflow groove 111 can be used to accommodate thermally conductive liquids such as thermally conductive silicone grease or thermally conductive glue filled between the thermally conductive member 50 , the first bracket 10 , and the first circuit board 200 ; on the other hand, the thermally conductive member 50 , Liquids such as thermally conductive silicone grease or thermally conductive glue filled between the first circuit board 200 and the first bracket 10 can overflow through the first glue overflow groove 111; The first segment 51 can be tightly connected to the first bracket 10 and is not easily loosened.
  • thermally conductive liquids such as thermally conductive silicone grease or thermally conductive glue filled between the thermally conductive member 50 , the first bracket 10 , and the first circuit board 200 ;
  • the thermally conductive member 50 Liquids such as thermally conductive silicone grease or thermally conductive glue filled between the first circuit board 200 and the first bracket 10 can overflow through the first glue overflow groove 111;
  • the first segment 51 can be tightly connected to the first bracket 10 and is not easily
  • the first plate body 11 is also provided with a weight reduction hole, the weight reduction hole can reduce the weight of the first bracket 10, and at the same time, the weight reduction hole can also be used to dispense thermally conductive glue to the first plate body 11.
  • the role of the circuit board 200 is also provided.
  • the second bracket 20 further includes a second plate body 25 and a plurality of second limiting ribs 26 , and the second plate body 25 is used for mounting the second circuit board 300 .
  • a plurality of second limiting ribs 26 are connected to the second plate body 25 , and the plurality of second limiting ribs 26 and the second plate body 25 together form a second limiting space 27 , and the second section 52 is at least partially accommodated in the second limiting space 27 . within the limit space 27.
  • the second limiting space 27 can be limited to the second segment 52 , so that the second segment 52 cannot easily move on the second bracket 20 , and the heat conducting member 50 can better conduct the heat of the second circuit board 300 .
  • the second circuit board 300 is mounted on the second body 25 , the second limiting ribs 26 and the second board body 25 together form a second limiting space 27 , and the second limiting space 27 can limit the second segment 52 . At least part of the lateral movement on the second bracket 20 to avoid damage to the second end 52 of the thermally conductive member 50 during movement.
  • the number of the second limiting ribs 26 may be two, three, four, five, or more.
  • the second segment 52 is all accommodated in the second limiting space 27 , so that the second limiting space 27 can better limit the movement of the heat-conducting member 50 , thereby preventing the movement of the second segment 52 from causing the second segment 52 to move.
  • the second stage 52 is damaged.
  • a second glue overflow groove 251 is formed on the second plate body 25 , and the second glue overflow groove 251 is located between the plurality of second limiting ribs 26 , the second overflow groove 251 communicates with the second limiting space 27 , so that the thermal conductive silicone grease or thermal conductive glue filled between the thermally conductive member 50 , the first circuit board 200 and the first bracket 10 can pass through the second overflow.
  • Glue tank 251 overflows.
  • the heat dissipation device 100 of the embodiment of the present application may not include the above-mentioned first bracket 10 and second bracket 20 .
  • the heat dissipation device 100 includes the heat-conducting member 50 and the heat-dissipating member 30 described in the above embodiments, the first section 51 and the second section 52 are not on the same plane, and the second section 52 is connected to the heat-dissipating member 30 .
  • the first section 51 is used for mounting the first circuit board 200
  • the second section 52 is used for mounting the second circuit board 300 , so as to conduct the heat generated by the first circuit board 200 and the second circuit board 300 to the heat sink 30 or the first section 51 is used to install the first circuit board 200 , the heat generated by the first circuit board 200 can be conducted to the heat sink 30 for heat dissipation, and the heat sink 30 is also used to fit the second circuit board 300 , so that the heat generated by the second circuit board 300 can be dissipated through the heat dissipation member 30 .
  • the first section 51 and the second section 52 are not on the same plane, and the second section 52 is connected to the heat dissipation member 30 , and the first section 51 and the second section 52 on the heat conduction member 50 absorb heat The obtained heat can be transferred to the heat sink 30 . Since the first section and the second section of the heat-conducting member are not on the same plane, the heat dissipation device can dissipate heat for circuit boards located on at least two different planes. Devices on at least two different planes are dissipated.
  • the first section 51 and the second section 52 are used to mount the first circuit board 200 and the second circuit board 300 respectively, and the heat of the first circuit board 200 and the second circuit board 300 can be transferred respectively to the first section 51 and the second section 52, so that the heat sink 30 can dissipate heat to the first circuit board 200 and the second circuit board 300. Since the first section 51 and the second section 52 are respectively on two different planes, The heat dissipation device 100 can simultaneously dissipate heat from circuit boards on at least two different planes.
  • the heat generated by the first circuit board 200 is greater than the heat generated by the second circuit board 300 .
  • the heat from the high-temperature part of the heat-conducting member 50 will be transferred to the low-temperature part, and the heat generated by the first circuit board 200 is greater than the heat generated by the second circuit board 300 , so that the heat of the first circuit board 200 can be better transferred by the first section 51 To the second section 52 , it is effectively avoided that the heat on the heat-conducting member 50 cannot be transferred to the heat-dissipating member 30 from the second section 52 to the first section 51 .
  • the first bracket 10 is installed on the front side of the fuselage 400, when the mobile platform 2000 is moving, the external airflow will impact the front side of the fuselage 400, and the external airflow can better take away the circuit board located on the front side of the fuselage 400.
  • the heat of the first circuit board 200 is set on the front side of the fuselage 400, and the heat of the first circuit board 200 is set to be greater than the heat of the second circuit board 300, which effectively utilizes the heat dissipation on the front side of the fuselage 400.
  • the faster feature prevents the temperature of the first circuit board 200 or the second circuit board 300 from being too high.
  • the first section 51 is used to mount the first circuit board 200 , so that the heat of the first circuit board 200 can be transferred to the first section 51 , and then can be dissipated by the heat dissipation member 30 , and the heat dissipation member 30 is connected to the second circuit board 200 .
  • the circuit board 300 is installed in a close fit, so that the heat generated by the second circuit board 300 can also be dissipated through the heat dissipation member 30 . Since the heat sink 30 is connected to the second segment 52, that is, the second circuit board 300 and the first circuit board 200 on the heat sink 30 can be on two different planes, the heat sink 100 can The circuit board dissipates heat.
  • references to the terms “certain implementations,” “one implementation,” “some implementations,” “example,” “specific example,” or “some examples” and the like are meant to be combined with the implementation
  • a particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application.
  • schematic representations of the above terms are not necessarily directed to the same embodiment or example.
  • the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
  • those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features delimited with “first”, “second” may expressly or implicitly include at least one of said features. In the description of the present application, “plurality” means at least two, such as two, three, unless expressly and specifically defined otherwise.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置(100)、散热组件(1000)及移动平台(2000)，散热装置(100)用于为第一电路板(200)散热，散热装置(100)包括第一支架(10)、第二支架(20)及散热件(30)。第一支架(10)用于安装第一电路板(200)，第二支架(20)与第一支架(10)连接，第二支架(20)与第一支架(10)不在同一平面内，散热件(30)与第二支架(20)连接，以使第一电路板(200)产生的热量能够依次经由第一支架(10)和第二支架(20)后并通过散热件(30)散发。

Description

散热装置、散热组件及移动平台 技术领域
本申请涉及冷却散热技术领域，特别涉及一种散热装置、散热组件及移动平台。
背景技术
现有高度集成的无人机内部器件逐渐集成化，且保护在无人机内部，导致器件的热量集中且无法自然散热，需要加装散热部件进行主动散热。同时，无人机内部器件比较复杂，在多个平面上均布置有至少一个发热元件，多个平面上的发热元件可能同时发热，发热元件的温度较高容易导致损坏。
但是目前散热结构只能够横向布置或者纵向布置，只能对位于同一个平面上的发热元件进行散热，对于无人机这种存在多个发热系统，且多个系统布置在空间上的多个不同的平面上，目前的散热结构无法较好的达到散热效果。
发明内容
本申请的实施方式提供了一种散热装置、散热组件及移动平台。
本申请实施方式的散热装置用于为第一电路板散热，所述散热装置包括第一支架、第二支架及散热件。所述第一支架用于安装所述第一电路板；所述第二支架与所述第一支架连接，所述第二支架与所述第一支架不在同一平面内；所述散热件与所述第二支架连接，以使得所述第一电路板产生的热量能够依次经由所述第一支架和第二支架后通过所述散热件进行散发。
本申请实施方式的散热装置，通过设置相互连接的第一支架与第二支架，散热件与第二支架连接，安装在第一支架上的电路板产生的热量能够依次经由第一支架和第二支架后通过散热件进行散发，且第一支架与第二支架不在同一平面内，使得散热装置可以为安装在至少两个不同平面上的元件进行散热，散热装置适用于为元件较多，且多个元件分布在至少两个不同的平面上的设备进行散热。
本申请实施方式的散热装置用于至少为第一电路板及第二电路板散热，散热装置包括导热件及散热件，所述导热件包括相互连接的第一段及第二段，所述第一段和所述第二段不在同一平面上；所述散热件与所述导热件的第二段连接；其中，所述第一段用于安装所述第一电路板，所述第二段用于安装所述第二电路板，从而将所述第一电路板和所述第二电路板产生的热量传导至所述散热件上进行散热；或者，所述第一段用于安装所述第一电路板，所述第一电路板产生的热量能够传导至所述散热件上进行散热；所述散热件还用于与所述第二电路板贴合安装，从而使得所述第二电路板产生的热量能够通过所述散热件散发。
本申请实施方式中的散热装置中，导热件的第一段及第二段不在同一平面上，且散热件与导热件的第二段连接，导热件上第一段及第二段上吸收到的热量均可以传递至散热件，由于导热件的第一段与第二段不在同一个平面上，散热装置可以为至少位于两个不同平面上的电路板进行散热，以使散热装置可以适用于为元件较多，且多个元件分布在至少两个不同的平面上的设备进行散热。
本申请实施方式的散热组件包括第一电路板、第二电路板及上述任一实施方式所述的散热装置，所述散热装置用于为第一电路板及第二电路板散热。
本申请实施方式的移动平台包括机身和散热组件，所述散热组件安装在所述机身上，所述散热组件包括第一电路板、第二电路板及本申请任一实施方式所述的散热装置，所述散热装置用于为第一电路板及第二电路板散热。
本申请实施方式的散热组件及移动平台，通过散热装置可以为内部的分布在至少两个不同的平面上的多个元件进行散热。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的移动平台的立体装配示意图；
图2是本申请实施方式的散热组件的一个视角的立体分解示意图；
图3是本申请实施方式的散热组件的另一个视角的立体分解示意图；
图4是本申请实施方式的散热装置的立体装配示意图；
图5是本申请实施方式的散热装置的立体分解示意图；
图6是本申请实施方式的散热组件的立体装配示意图；
图7是本申请实施方式的散热组件的立体装配示意图；
图8是本申请实施方式的散热组件的立体分解示意图；
图9是本申请实施方式的散热装置的立体装配示意图；
图10是本申请实施方式的散热装置的立体装配示意图；
图11是本申请实施方式的散热装置的立体装配示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参阅图1及图2，本申请实施方式的移动平台2000包括机身400及散热组件1000，散热组件1000安装在机身400上。移动平台2000具体可以是能够移动或转动的任何设备。其中，移动平台2000可以包括但不限于陆地移动设备、水中移动设备、空中移动设备以及其他类型的机动载运工具。出于说明性目的，移动平台2000可以包括载客载运工具、无人飞行器、无人车、无人船等，并且移动平台2000的运行可以包括飞行、游行、爬行等方式。本申请实施方式以移动平台2000为无人飞行器为例进行示例性说明，可以理解，移动平台2000不限于无人飞行器，可以是其他。
无人飞行器可以是多旋翼无人飞行器，例如四旋翼无人飞行器、六旋翼无人飞行器、八旋翼无人飞行器、十二旋翼无人飞行器等。无人飞行器可以用于搭载负载以完成预定的任务，例如搭载成像装置以进行拍摄，搭载农药、营养液及喷洒装置以进行植保任务等。无人飞行器还可以被用于微型自拍、快递运输、灾难救援、观察野生动物、监控传染病、测绘、新闻报道、电力巡检、救灾、影视拍摄等领域。
机身400可以作为移动平台2000的功能部件的安装载体，例如机身400外可以安装云台、负载、散热组件1000等等，机身400内可以安装电源模块、飞控系统、图传装置等等。机身400可以为安装在机身400内的功能部件提供防水、防尘等的保护，机身400可以为散热组件1000、云台等提供安装空间。
请参阅图2及图3，本申请实施方式的散热组件1000包括第一电路板200、第二电路板300及散热装置100，散热装置100用于为第一电路板200及第二电路板300进行散热。散热组件1000可以通过粘结、焊接、紧固件连接等方式安装在机身400上。
具体地，第一电路板200上可以安装有处理器、多种芯片等元件，第一电路板200及安装在第一电路板200上的元件在工作时会产生较大的热量，第一电路板200及安装在第一电路板200上的元件的热量过高时可能会发生损坏或者缩短使用寿命，进一步可能会导致移动平台2000无法正常运行。
第二电路板300上可以安装有处理器、多种芯片等元件，第二电路板300及安装在第二电路板300上的元件在工作时能够产生较大的热量，第二电路板300及安装在第二电路板300上的元件的热量过高时可能会发生损坏或者缩短使用寿命，进一步可能会导致移动平台2000无法正常运行。
其中，第二电路板300上安装的元件可以与第一电路板200上安装的元件相同，第二电路板300上安装的元件也可以与第一电路板200上安装的元件不同。
进一步地，第一电路板200产生的热量可以与第二电路板300产生的热量相同，第一电路板200产生的热量也可以与第二电路板300产生的热量不相同，例如第一电路板200产生的热量小于第二电路板300产生的热量，或者第一电路板200产生的热量大于第二电路板300产生的热量。
更具体地，在某些实施方式中，第一电路板200上安装有图传发射芯片、图传放大芯片及图传处理芯片中的一个或多个，例如第一电路板200上安装有图传发射芯片、或者第一电路板200上安装有图传放大芯片、或者第一电路板200上安装有图传处理芯片、或者第一电路板200上安装有图传发射芯片和图传放大芯片、或者第一电路板200上安装有图传发射芯片及图传处理芯片、或者第一电路板200上安装有图传放大芯片及图传处理芯片，再或者第一电路板200上安装有图传发射芯片、图传放大芯片及图传处理芯片。需要说明的是，第一电路板200上的安装的元件不局限于上述的图传发射芯片、图传放大芯片及图传处理芯片，还可以是其它元件。
本实施方式中，第一电路板200上安装有图传发射芯片、图传放大芯片及图传处理芯片中的一个或多个，使得散热装置100可以较好地对图传发射芯片、图传放大芯片及图传处理芯片中的一个或多个进行散热，以使图传发射芯片、图传放大芯片及图传处理芯片中的一个或多个在工作中不易因温度过高而导致故障，保证图像处理及传输过程稳定可靠。
进一步地，在某些实施方式中，第二电路板300上安装有视觉处理芯片及存储芯片中的一个或多个，例如第二电路板300上安装有视觉处理芯片，或者第二电路板300上安装有存储芯片，或者第二电路板300上安装有视觉处理芯片及存储芯片。这样，散热装置100可以对安装在第二电路板300上的视觉处理芯片及存储芯片中的一个或多个进行散热，使得视觉处理芯片及存储芯片中的一个或多个在工作中不易因温度过高而导致故障，保证视觉定位或信息存储的过程稳定可靠。需要说明的是，第二电路板300上安装的元件不局限于上述所述的视觉处理芯片及存储芯片，还可以是其它元件。
请参阅图2至图4，本申请实施方式中的散热装置100用于为第一电路板200散热，散热装置100包括第一支架10、第二支架20及散热件30。第一支架10用于安装第一电路板200，第二支架20与第一支架10连接，第二支架20与第一支架10不在同一平面内，散热件30与第二支架20连接，以使第一电路板200产生的热量能够依次经由第一支架10和第二支架20后并通过散热件30散发。
本申请实施方式中的散热装置100、散热组件1000及移动平台2000，通过设置相互连接的第一支架10与第二支架20，散热件30与第二支架20连接，且安装在第一支架10上的电路板产生的热量能够依次经由第一支架10和第二支架20后通过散热件30进行散发，且第一支架10与第二支架20不在同一平面内，使得散热装置100可以为安装在至少两个不同平面上的器件进行散热，散热装置100适用于为为元件较多，且多个元件分布在至少两个不同的平面上的设备进行散热。
例如，在移动平台2000为无人飞行器时，无人飞行器的机身的至少两个面上分布的元件在工作时会产生大量的热量，将本申请实施方式的散热组件1000安装在无人飞行器的机身上，散热组件1000可以至少为两个不同的平面上分布的元件进行散热，降低了无人飞行器的机身及机身上安装的元件的温度，使得无人飞行器工作不易发生异常。同时，本申请实施方式的散热组件1000的结构相较于同时使用多个单平面布置的散热装置的散热组件而言，本申请实施方式的散热组件1000的结构更加紧凑，可以减少无人飞行器的体积以及重量。
具体地，第一电路板200在第一支架10上的安装位置在此不做限制，例如第一电路板200可以安装在第一支架10的靠近于第二支架20的一侧上，第一电路板200也可以安装在第一支架10的远离第二支架20的一侧上。第二支架20与第一支架10之间可以是固定连接，也可以是可拆卸连接，例如通过焊接、粘接等方式使第二支架20固定连接在第一支架10上，或者，通过螺钉、销钉、卡扣等方式使第二支架20可拆卸连接在第一支架10上。
进一步地，第一支架10与第二支架20不在同一个平面上，可以理解，第一支架10与第二支架20异面设置，使得第一支架10与第二支架20可以安装在至少不同的两个平面上。即，第一支架10安装在设备的一个面上，第二支架20可以安装在设备的其它面上。
散热件30具体可以是散热齿、散热片、风机、铜管等元件，散热件30与第二支架20连接具体可以是散热件30贴设在第二支架20上，也可以是散热件30连接在第二支架20的一端上。散热件30与第二支架20之间可以是固定连接或者可拆卸连接。第一电路板200产生的热量能够依次经由第一支架10及第二支架20后通过散热件30散发，使得散热件30可以对安装在第一支架10上的第一电路板200 进行散热，散热装置100还可以对未安装在散热件30所在的平面上的元件进行散热，以使散热装置100可以为多个不同的平面上的元件同时进行散热。
请参阅图2及图3，在某些实施方式中，散热装置100还用于为第二电路板300散热。
在一个实施例中，第二支架20用于安装第二电路板300。第二电路板300可以安装在第二支架20上的任意位置，例如第二电路板300可以安装在第二支架20的靠近于第一支架10的一侧上，第二电路板300也可以安装在第二支架20远离第一支架10的一侧上。第二电路板300可以部分安装在第二支架20上，第二电路板300也可以全部安装在第二支架20上。第二电路板300安装在第二支架20上，由于散热件30与第二支架20连接，使得散热件30还可以对第二电路板300进行散热，降低了第二电路板300的温度以使第二电路板300不会因温度过高而发生损坏。
在再一个实施例中，散热件30用于安装第二电路板300。其中，第二电路板300可以安装在散热件30的任意位置上，以使散热件30可以对第二电路板300散热。例如，第二电路板300可以与散热件30贴合，第二电路板300也可以安装在散热件30上未与第二支架20连接的一端。将第二电路板300安装在散热件30上，使散热件30可以对第二电路板300进行散热，第二电路板300及安装于第二电路板300上的元件不易因温度过高而损坏。
在另一个实施例中，第二支架20和散热件30共同用于安装第二电路板300。其中，可以是部分第二电路板300安装在散热件30上，部分第二电路板300安装在第二支架20上；也可以是第二电路板300安装在第二支架20和散热件30之间；第二电路板300与第二支架20及散热件30的位置关系在此不做限制。通过将第二电路板300安装在第二支架20和散热件30上，可以对第二电路板300进行散热，第二电路板300及安装于第二电路板300上的元件不易因温度过高而损坏。
请参阅图4及图5，第一支架10可以由金属材料、塑性材料、弹性材料等材料制成，第一支架10可以与第一电路板200贴合，或者第一支架10可以与第一电路板200间隔连接，或者第一支架10与第一电路板200之间还可以安装导热片等导热元件，再或者第一支架10与第一电路板200之间填充有导热硅脂、导热胶等导热液体。
在一个实施例中，第一支架10由金属材料制成，例如第一支架10由铁、铜、铝、合金等金属材料制成，如此，第一支架10可以具有较高的硬度，第一支架10不易发生变形，且第一支架10的导热性能较好。另外，第一支架10与第一电路板200贴合，使得第一电路板200上产生的热量可以更好地传递至第一支架10，以使第一支架10能够将热量传递至第二支架20后被散热件30散发。
在另一个实施例中，第一支架10由塑性材料制成，例如第一支架10由塑料、塑胶等塑性材料制成，如此，相较于金属材料而言，第一支架10的质量相对较小，在空间布置时可以有更大的设计空间，减小了散热装置100、散热组件1000及移动平台2000的质量。
请参阅图6，在某些实施方式中，第一支架10还用于安装第三电路板500，第一支架10的相背的两侧分别用于安装第一电路板200及第三电路板500，由此，散热装置100还可以对第三电路板500进行散热，降低第三电路板500的温度，以使第三电路板500及安装在第三电路板500上的元器件的温度不会过高而发生故障，使散热组件1000及移动平台2000能够正常工作。
具体地，第三电路板500上安装的元器件可以与第一电路板200上安装的元器件相同，第三电路板500上安装的元器件也可以与第一电路板200上安装的元器件不相同。第三电路板500与第一电路板200不在第一支架10的同一侧，第三电路板500安装在第一支架10安装第一电路板200相背的一侧，使得第三电路板500可以将产生的热量传递至第一支架10，以使散热件30可以更多的散发第三电路板500的产生的热量，第三电路板500的温度更低。
请参阅图2及图3，第二支架20可以由塑性材料、金属材料、弹性材料等材料制成，第二支架20可以与第二电路板300贴合，第二支架20也可以与第二电路板300间隔设置，第二支架20与第二电路板300之间还可以设置导热片等导热元件，第二支架20与第二电路板300之间还可以填充导热硅脂、导热胶等导热液体。
在一个实施例中，第二支架20由金属材料制成，例如第二支架20可以是由铁、铜、铝、合金等金属材料制成，由此，第二支架20可以具有较高的硬度及强度，第二支架20不易发生变形，同时第二支架20还能够更好地传递热量。另外，第二支架20用于与第二电路板300贴合，以使第二电路板300产生的热量能够传递至第二支架20，然后进一步由第二支架20传递至散热件30以被散热件30散发。
在另一个实施例中，第二支架20由塑性材料制成，例如第二支架20由塑料、塑胶等塑性材料制成，这样，相较于金属材料而言，第二支架20的质量相对较小，在空间布置时可以有更大的设计空间，减小了散热装置100、散热组件1000及移动平台2000的质量。
请参阅图2及图5，在一个实施例中，散热件30可拆卸地安装在第二支架20上，如图2及图5所示，例如，散热件30通过螺钉、卡扣等方式可拆卸安装在第二支架20上，使得散热件30与第二支架20中的一个损坏时，将散热件30与第二支架20中的损坏的那个拆卸下来进行维修或者更换，减小了被抛弃部件的数量，降低了散热装置100的维修成本。例如，第二支架20上设置有固定柱，散热件30上设置有螺柱，通过螺钉将第二支架20与散热件30固定连接。
请参阅图7及图8，在另一个实施例中，散热件30与第二支架20为一体成型的结构，如图7及图8所示，例如，散热件30与第二支架20通过铸造、锻造的方式制造成一体的结构，可以降低散热件30与第二支架20的制造成本，同时散热件30与第二支架20之间的相对位置更加稳固。
请参阅图2及图5，在某些实施方式中，第二支架20包括第一端21及第二端22，第一支架10连接在第二支架20的第一端21上，散热件30连接在第二支架20的第二端22上，由此，第一支架10上的热量可以由第二支架20的第一端21传递至第二支架20的第二端22上，设置在第二端22上的散热件30能够散发接收到的热量，以降低第一支架10上安装的第一电路板200的热量。
具体地，请结合图2、图5及图9，第二支架20的第一端21及第二端22可以分别位于第二支架20的不同的一侧，例如第一端21与第二端22可以为第二支架20的相邻的两端，如图9所示，第一端21与第二端22也可以为第二支架20的相对的两端，如图2及图5所示。第一支架10连接在第二支架20的第一端21上，且与第二支架20不在同一个平面，例如第一支架10可以与第二支架20垂直连接或倾斜连接。其中，散热件30可以通过螺钉、销、焊接等方式连接在第二支架20的第二端22，以散发第二支架20的热量。
在一个实施例中，第一端21与第二端22分别为第二支架20上相对的两端，第一支架10垂直连接在第二支架20的第一端21上，第一支架10与第二支架20之间形成的夹角为直角。
请结合图2及图3，在一个例子中，第一支架10上开设有沉孔，第二支架20设置有螺柱，通过将第二支架20的螺柱插接在第一支架10上的沉孔上，然后再通过螺钉穿入该螺柱，以将第一支架10与第二支架20固定连接。
请参阅图2，在一个实施例中，散热件30与第二电路板300贴合，以使第二电路板300产生的热量能够直接传递至散热件30上，然后被散热件30散发出去，降低了第二电路板300及安装在第二电路板300上元器件的温度，使第二电路板300及安装在第二电路板300上的元器件不易发生故障。
在另一个实施例中，散热件30与第二电路板300间隔设置，具体地，散热件30并非直接贴合第二电路板300，例如散热件30与第二电路板300之间设置有导热片、导热块、垫片等元件，或者散热件30与第二电路板300之间存在间隙，或者第二电路板300贴合在第二支架20上，散热件30与第二支架20连接而未直接与第二电路板300接触。
请参阅图2、图5及图7，在某些实施方式中，散热件30包括主体31及多个散热片32，多个散热片32连接在主体31上，主体31与至少两个散热片32之间形成有导热通道33。具体地，散热片32可以是金属片，多个散热片32在主体31上可以呈齿状布置。其中，导热通道33两侧的散热片32可以是等间距或者不等间距连接在主体31上。
进一步地，主体31上还形成有导热溢胶槽311，导热溢胶槽311位于至少两个散热片32之间，且导热溢胶槽311与导热通道33相通，以使可以通过导热溢胶槽311填充导热硅脂或导热胶等导热液体，以使安装在导热通道33内的元件可以充分与散热件30接触，使得导热通道33内的元件的热量可以更好地被散热件30散发。
请参阅图2及图4，在某些实施方式中，散热装置100还包括送风件40，送风件40安装在第二支架20上，送风件40与散热件30大致位于同一直线上，以使送风件40生成的气流导向散热件30。由此，送风件40能够较好地将气流导向散热件30，以加快散热件30上的热量散发，可以更快地传递第一电路板200及第二电路板300产生的热量，使得第一电路板200及第二电路板300的温度不易过高。
在某些实施方式中，请结合图1，散热组件1000安装在机身400上时，送风件40的气流方向为由机身400的前侧向机身400的后侧流动，以使送风件40产生的气流不会与机身400移动时产生的气流 相背而影响送风件40吹向对散热件30的气流量。
具体地，送风件40可以是离心风机、轴流风机、风扇等能够驱动气流流动的元件，送风件40可以可拆卸安装或者固定安装在第二支架20上。进一步地，送风件40与散热件30大致位于同一直线上，可以是送风件40的中心与散热件30的中心大致位于同一直线上，也可以是送风件40出风口的中心与散热件30的中心大致位于同一直线上。在一个实施例中，送风件40的中心与散热件30的中心位于同一直线上，使得送风件40产生的气流可以直接吹至散热件30，以更好地带走散热件30上的温度。
在一个实施例中，送风件40为离心风机，相较于相同尺寸及转速的轴流风机，离心风机产生的气流更加集中，更多地气流可以吹向散热件30。同时，轴流风机需要竖直安装在第二支架20上，会增大散热装置100的体积；而离心风机可以改变气流的方向，采用离心风机可以减小散热装置100、散热组件1000及移动平台2000的体积，使得散热装置100、散热组件1000及移动平台2000更加紧凑。
更具体地，送风件40上可以开设有定位孔，送风件40靠近于第二支架20的一面可以设置背胶，在第二支架20上设置有定位柱，通过将定位孔套设在定位柱上，然后通过背胶粘在第二支架20上，由此，送风件40在工作时的位置比较稳定。
进一步地，请结合图2，在送风件40与第二支架20之间还安装有缓冲件41，缓冲件41能够缓冲送风件40在工作时产生的振动，第一支架10及第二支架20不易被送风件40带动一起振动。其中，缓冲件41包括但不限于缓冲泡棉、海绵、弹簧、硅胶件等具有缓冲性能的元件。
请参阅图2和图5，在某些实施方式中，散热装置100还包括导热件50，导热件50用于将第一电路板200及/或第二电路板300的热量传递至散热件30，导热件50包括第一段51及第二段52，第一段51和第二段52不在同一平面上，第一段51固定在第一支架10上，第二段52固定在第二支架20上。一方面，可以通过导热件50将第一电路板200及/或第二电路板300的热量传递至散热件30，以使散热件30能够更好地散发第一电路板200及/或第二电路板300的热量；另一方面，第一段51和第二段52不在同一平面上，分别固定在第一支架10上及第二支架20上，由此，导热件50可以对需要进行散热的设备的至少两个不同的平面进行散热。
具体地，导热件50可以是铜管、导热片等可以导热的元件。第一段51及第二段52不在同一平面上，可以理解，导热件50并非笔直的，可以是有弯折的，以便于第一段51和第二段52可以分别固定在第一支架10及第二支架20上。同时，第一段51固定在第一支架10上、第二段52固定在第二支架20上，使得导热件50不易发生损坏，还可以使导热件50可以做成较复杂的结构，以可以用于给多个面均需要散热的设备进行散热。
散热装置100包括第一支架10、第二支架20、散热件30、送风件40及导热件50，导热件50将第一电路板200及第二电路板300的热量传递至散热件30上，然后送风件40产生气流对散热件30吹风散热。在一个实验中，设置极限场景：环境温度40℃、静置无风条件仿真测试，第一电路板200上安装的核心发热器件(例如图传发射芯片、图传放大芯片及图传处理芯片等)的温度分别从104℃将至84.2℃、92.1℃将至79.3℃，第二电路板300上安装的核心发热器件(例如视觉处理芯片及存储芯片等)的温度分别从105℃降至89.6℃、99℃降至86.2℃。
在一个实施例中，导热件50与第一电路板200连接。例如，导热件50贴合在第一电路板200上，或者导热件50与第一电路板200之间填充有导热硅脂、导热胶等物体，再或者导热件50通过第一支架10与第一电路板200连接，使得第一电路板200的热量可以传递至导热件50，导热件50可以将接收到的热量传递至散热件30，以使散热件30能够将第一电路板200产生的热量散发出去。
在再一个实施例中，导热件50与第二电路板300连接。例如，导热件50贴合在第二电路板300上，或者导热件50与第二电路板300之间填充有导热硅脂、导热胶等导热液体，再或者导热件50通过第二支架20与第二电路板300连接；由此，第二电路板300的热量可以传递至导热件50，导热件50可以将接收到的热量传递至散热件30，以使散热件30能够更多地散发第二电路板300的热量。
在另一个实施例中，导热件50与第一电路板200及第二电路板300连接。例如，第一段51与第一电路板200贴合，第二段52与第二电路板300贴合；或者第一段51与第一电路板200之间填充有导热硅脂、导热胶等物体，第二段52与第二电路板300之间填充有导热硅脂、导热胶等物体；再或者第一段51与第一电路板200分别贴设在第一支架10的相背的两侧，第二段52与第二电路板300分别贴设在第二支架20的相背的两侧。这样，第一电路板200及第二电路板300产生的热量能够传递至导热件 50，导热件50可以将接收到的热量传递至散热件30，以便于散热件30将第一电路板200和第二电路板300产生的热量散发出去。
进一步地，第二段52可以伸入上述实施方式所述的散热件30的导热通道33中，使得导热件50上的热量可以传递至散热件30，然后被散热件30散发，提高了散热装置100对第一电路板200及第二电路板300的散热效率。
同时，第二段52能够覆盖形成在主体31上的导热溢胶槽311，以通过导热溢胶槽311填充导热硅脂或者导热胶等导热液体，以使散热件30能够充分与导热件50接触，使得导热件50上的热量能够充分地传递至散热件30，然后被散热件30散发，有效地提高了散热装置100对第一电路板200及第二电路板300的散热效率。
请结合图9，第一端21与第二端22为第二支架20上相邻的两端，此时第二段52的延伸方向与送风件40形成的气流的流动方向不一致，即使第一支架20安装在机身400的左侧壁上，送风件40形成的气流的流动方向仍然可以与移动平台2000的移动方向一致，可以加快散热件30上热量的散发，使得散热组件1000可以用于为机身400上的任何一个平面进行散热。
进一步地，请结合图10，在某些实施方式中，导热件50还包括第三段53，第三段53与第二段52分别连接在第一段51的两端，第三段53与第一段51不在同一平面上，第三段53用于安装第三电路板，以传递第三电路板产生的热量至散热件30，由此，散热装置100可以为发热系统多且更加复杂的设备进行多维度的散热，实现较好地散热效果。
具体地，导热件50可以发生多次弯折，分成了第一段51、第二段52及第三段53，第三段53与第二段52分别连接在第一段51的两端，第三段53与第一段51不在同一平面上，第二段52与第一段51不在同一平面上。其中，第二端22与第三段53可以在同一平面也可以是分别在两个不同的平面上。第三电路板安装在导热件50的第三段53上，使得第三电路板产生的热量可以传递至导热件50的第三段53，然后依次经过第一段51及第二段52后到达散热件30。
更具体地，散热装置100还包括第三支架60，第三支架60连接在第一支架10上，且第三支架60与第一支架10不在同一个平面上，第三段53安装在第三支架60上，第三电路板安装在第三支架60上，或者第三电路板安装在第三段53上，以使第三电路板的热量能够传递至第三段53上，进而传递至第一段51及第二段52。
请参阅图11，第一支架10、第二支架20、第三支架60之间的连接结构也可以如图11所示。具体地，散热组件1000安装在机身400上时，第一支架10可以安装在机身400的右侧壁上，导热件50的延伸方向与送风件40的气流方向不一致，送风件40的气流方向仍然与移动平台2000的移动方向相同，可以加快散热件30热量的散发，使得散热组件1000可以对机身400的左侧壁及左侧壁上的元件进行散热。当然，第一支架10也可以安装在机身400的右侧壁、后侧壁、底壁上。第三支架60与第一支架10的连接结构并不局限于图11所示的结构，例如，第三支架60可以安装在机身400的底壁上。
请参阅图4、图6及图7，在某些实施方式中，第一支架10与第二支架20共同形成收容空间23，收容空间23可以用于收容部分功能器件(例如第一电路板200、第二电路板300等)或者用于避让移动平台2000的其他器件(例如电池)。
进一步地，在一个实施例中，第一段51设置在第一支架10的与收容空间23相背或相同的一侧。其中，第一电路板200可以设置在第一支架10的与收容空间23相背或相同的一侧，第一段51与第一电路板200可以设置在第一支架10的同一侧，第一段51与第一电路板200也可以分别设置在第一支架10的相背的两侧。
进一步地，在再一个实施例中，第二段52设置在第二支架20的与收容空间23相同或相背的一侧。可以理解，第二段52与收容空间23可以在第二支架20的同一侧，第二段52与收容空间23也可以分别在第二支架20的相背的两侧。其中，第二电路板300可以设置在设置在第二支架20的与收容空间23相同或相背的一侧，第二段52与第二电路板300可以设置在第二支架20的同一侧，第二段52与第二电路板300也可以分别设置在第二支架20的相背的两侧。
进一步地，在另一个实施例中，第一段51设置在与第一支架10的与收容空间23相背或相同的一侧，以及第二段52设置在第二支架20的与收容空间23相同或相背的一侧。例如，第一段51设置在与第一支架10的与收容空间23相背的一侧，第二段52设置在第二支架20的与收容空间23相背的一侧； 或者，第一段51设置在与第一支架10的与收容空间23相同的一侧，第二段52设置在第二支架20的与收容空间23相同的一侧；或者，第一段51设置在与第一支架10的与收容空间23相背的一侧，第二段52设置在第二支架20的与收容空间23相同的一侧；再或者，第一段51设置在与第一支架10的与收容空间23相同的一侧，第二段52设置在第二支架20的与收容空间23相背的一侧。
请结合图2及图5，在某些实施方式中，第二支架20上开设有过孔24，导热件50穿设过孔24。第一段51与第二段52中的一段位于收容空间23内，另一段位于收容空间23外。例如，第一段51位于收容空间23内，第二段52位于收容空间23外，即，第一段51设置在与第一支架10的与收容空间23相同的一侧，第二段52设置在第二支架20的与收容空间23相背的一侧。或者第二段52位于收容空间23内，第一段51位于收容空间23外，即，第一段51设置在与第一支架10的与收容空间23相背的一侧，第二段52设置在第二支架20的与收容空间23相同的一侧。
请参阅图2及图5，在某些实施方式中，第一支架10包括第一板体11及多个第一限位筋12。第一板体11用于安装第一电路板200，多个第一限位筋12连接在第一板体11上。多个第一限位筋12与第一板体11共同形成第一限位空间13，第一段51至少部分收容在第一限位空间13内，由此，第一限位空间13可以限制第一段51的位置，以使第一段51不易在第一支架10上移动，第一段51不易发生损伤，第一段51可以更好地传导第一电路板200上的热量。
具体地，第一电路板200安装在第一板体11上，第一限位筋12与第一板体11共同形成第一限位空间13，第一限位空间13可以限制第一段51的至少部分在第一支架10上的横向移动，以避免导热件50的第一端51在移动时发生损坏。其中，第一限位筋12的数量可以是两个、三个、四个、五个等更多数量。
在一个实施例中，第一段51全部收容在第一限位空间13内，以使第一限位空间13可以更好地限制导热件50的移动，可以避免导热件50移动导致导热件50损伤的情况。
进一步地，请参阅图2及图5，在某些实施方式中，第一板体11上形成有第一溢胶槽111，第一溢胶槽111位于多个第一限位筋12之间，第一溢胶槽111与第一限位空间13相通。一方面，通过第一溢胶槽111可以用于容纳导热件50、第一支架10、第一电路板200之间填充的导热硅脂或者导热胶等导热液体；再一方面，导热件50、第一电路板200和第一支架10之间填充的导热硅脂或者导热胶等液体可以通过第一溢胶槽111溢出；另一方面，还可以通过第一溢胶槽111点固定胶，以使第一段51可以紧密连接在第一支架10上不易发生松动。
进一步地，在一个实施例中，在第一板体11上还开设有减重孔，减重孔可以减小第一支架10的重量，同时减重孔还可以起到点导热胶到第一电路板200的作用。
请参阅图2及图5，在某些实施方式中，第二支架20还包括第二板体25及多个第二限位筋26，第二板体25用于安装第二电路板300。多个第二限位筋26连接在第二板体25上，多个第二限位筋26与第二板体25共同形成第二限位空间27，第二段52至少部分收容在第二限位空间27内。如此，第二限位空间27可以限制至第二段52，使得第二段52不易在第二支架20上移动，导热件50可以更好地传导第二电路板300的热量。
具体地，第二电路板300安装在第二本体25上，第二限位筋26与第二板体25共同形成第二限位空间27，第二限位空间27可以限制第二段52的至少部分在第二支架20上的横向移动，以避免导热件50的第二端52在移动时发生损坏。其中，第二限位筋26的数量可以是两个、三个、四个、五个等更多数量。
在一个实施例中，第二段52全部收容在第二限位空间27内，以使第二限位空间27可以更好地限制导热件50的移动，可以避免第二段52发生移动导致第二段52损伤的情况。
进一步地，请参阅图2及图5，在某些实施方式中，第二板体25上形成有第二溢胶槽251，第二溢胶槽251位于多个第二限位筋26之间，第二溢胶槽251与第二限位空间27相通，由此，导热件50、第一电路板200和第一支架10之间填充的导热硅脂或者导热胶等液体可以通过第二溢胶槽251溢出。
当然，本申请实施方式的散热装置100也可以不包括上述的第一支架10及第二支架20。散热装置100包括上述实施方式所述的导热件50及散热件30，第一段51与第二段52不在同一平面上，第二段52与散热件30连接。其中，第一段51用于安装第一电路板200，第二段52用于安装第二电路板300，从而将第一电路板200及第二电路板300产生的热量传导至散热件30上进行散热；或者第一段51用于 安装第一电路板200，第一电路板200产生的热量能够传导至散热件30上进行散热，散热件30还用于与第二电路板300贴合安装，从而使得第二电路板300产生的热量能够通过散热件30散发。
本申请实施方式的散热装置100中，第一段51与第二段52不在同一平面上，且第二段52与散热件30连接，导热件50上第一段51及第二段52上吸收到的热量均可以传递至散热件30。由于导热件的第一段与第二段不在同一个平面上，散热装置可以为至少位于两个不同平面上的电路板进行散热，散热装置可以适用于为元件较多，且多个元件分布在至少两个不同的平面上的器件进行散热。
具体地，在一个实施例中，第一段51及第二段52分别用于安装第一电路板200及第二电路板300，第一电路板200及第二电路板300的热量可以分别传递至第一段51及第二段52，以使散热件30能够对第一电路板200及第二电路板300散热，由于第一段51和第二段52分别在两个不同的平面上，散热装置100能够同时对至少两个不同平面上的电路板进行散热。
进一步地，第一电路板200产生的热量大于第二电路板300产生的热量。导热件50上高温部分的热量会向低温部分传递，第一电路板200产生的热量大于第二电路板300产生的热量，使得第一电路板200的热量能够更好地由第一段51传递至第二段52，有效地避免了导热件50上的热量由第二段52向第一段51而导致导热件50的热量无法传递至散热件30。同时，由于第一支架10安装在机身400的前侧，移动平台2000在移动时，外界气流将冲击在机身400前侧，外界气流可以更好地带走位于机身400前侧的电路板的热量，将第一电路板200设置在机身400的前侧，且将第一电路板200的热量设置得到大于第二电路板300的热量，有效地利用了位于机身400的前侧散热较快的特点，避免第一电路板200或第二电路板300的温度过高。
在另一个实施例中，第一段51用于安装第一电路板200，使得第一电路板200的热量能够传递至第一段51，然后能够被散热件30散发，散热件30与第二电路板300贴合安装，使得第二电路板300产生的热量也能够通过散热件30散发。由于散热件30与第二段52连接，即散热件30上的第二电路板300与第一电路板200可以在两个不同的平面上，散热装置100能够同时对至少两个不同平面上的电路板进行散热。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (37)

  1. 一种散热装置，其特征在于，所述散热装置用于为第一电路板散热，所述散热装置包括：
    第一支架，所述第一支架用于安装所述第一电路板；
    第二支架，所述第二支架与所述第一支架连接，所述第二支架与所述第一支架不在同一平面内；及
    散热件，所述散热件与所述第二支架连接，以使得所述第一电路板产生的热量能够依次经由所述第一支架和第二支架后通过所述散热件进行散发。
  2. 根据权利要求1所述的散热装置，其特征在于，所述散热装置还用于为第二电路板散热；
    其中，所述第二支架用于安装所述第二电路板；或，所述散热件用于安装所述第二电路板；或，所述第二支架和所述散热件共同用于安装所述第二电路板。
  3. 根据权利要求2所述的散热装置，其特征在于，所述散热件可拆卸地安装在所述第二支架上；或，所述散热件与所述第二支架为一体成型的结构。
  4. 根据权利要求2所述的散热装置，其特征在于，所述第二支架包括第一端及第二端，所述第一支架连接在所述第一端，所述散热件连接在所述第二端。
  5. 根据权利要求2所述的散热装置，其特征在于，所述第一支架由金属材料制成，所述第一支架用于与所述第一电路板贴合；及/或
    所述第二支架由金属材料制成，所述第二支架用于与所述第二电路板贴合。
  6. 根据权利要求2所述的散热装置，其特征在于，所述散热件与所述第二电路板贴合；或
    所述散热件与所述第二电路板间隔设置。
  7. 根据权利要求2所述的散热装置，其特征在于，所述第一支架还用于安装第三电路板，所述第一支架的相背的两侧分别用于安装所述第一电路板及所述第三电路板。
  8. 根据权利要求2所述的散热装置，其特征在于，所述散热装置还包括送风件，所述送风件安装在所述第二支架上，所述送风件与所述散热件大致位于同一直线上，以使所述送风件生成的气流导向所述散热件。
  9. 根据权利要求2至8任意一项所述的散热装置，其特征在于，所述散热装置还包括导热件，所述导热件用于将所述第一电路板及/或所述第二电路板的热量传递至所述散热件，所述导热件包括第一段及第二段，所述第一段和所述第二段不在同一平面上，所述第一段固定在所述第一支架上，所述第二段固定在所述第二支架上。
  10. 根据权利要求9所述的散热装置，其特征在于，所述第一支架与所述第二支架共同形成收容空间；
    其中，所述第一段设置在所述第一支架的与所述收容空间相背或相同的一侧；及/或
    所述第二段设置在所述第二支架的与所述收容空间相背或相同的一侧。
  11. 根据权利要求9所述的散热装置，其特征在于，所述第一支架与所述第二支架共同形成收容空间；所述第二支架上开设有过孔，所述导热件穿设所述过孔，所述第一段与所述第二段中的一段位于所述收容空间内，另一段位于所述收容空间外。
  12. 根据权利要求9所述的散热装置，其特征在于，所述第一支架包括：
    第一板体，所述第一板体用于安装所述第一电路板；及
    多个第一限位筋，多个所述第一限位筋连接在所述第一板体上，多个所述第一限位筋与所述第一板体共同形成第一限位空间，所述第一段至少部分收容在所述第一限位空间内。
  13. 根据权利要求12所述的散热装置，其特征在于，所述第一板体上形成有第一溢胶槽，所述第一溢胶槽位于多个所述第一限位筋之间，所述第一溢胶槽与所述第一限位空间相通。
  14. 根据权利要求9所述的散热装置，其特征在于，所述第二支架包括：
    第二板体，所述第二板体用于安装所述第二电路板；及
    多个第二限位筋，多个所述第二限位筋连接在所述第二板体上，多个所述第二限位筋与所述第二板体共同形成第二限位空间，所述第二段至少部分收容在所述第二限位空间内。
  15. 根据权利要求14所述的散热装置，其特征在于，所述第二板体上形成有第二溢胶槽，所述第二溢胶槽位于多个所述第二限位筋之间，所述第二溢胶槽与所述第二限位空间相通。
  16. 根据权利要求9所述的散热装置，其特征在于，所述散热件包括：
    主体；及
    多个散热片，多个所述散热片连接在所述主体上，所述主体与至少两个所述散热片之间形成有导热通道，所述第二段伸入所述导热通道内并与所述主体贴合。
  17. 根据权利要求16所述的散热装置，其特征在于，所述主体上形成有导热溢胶槽，所述导热溢胶槽位于至少两个所述散热片之间，所述导热溢胶槽与所述导热通道相通。
  18. 一种散热装置，其特征在于，所述散热装置用于至少为第一电路板及第二电路板散热，所述散热装置包括：
    导热件，所述导热件包括相互连接的第一段及第二段，所述第一段和所述第二段不在同一平面上；及
    散热件，所述散热件与所述导热件的第二段连接；
    其中，所述第一段用于安装所述第一电路板，所述第二段用于安装所述第二电路板，从而将所述第一电路板和所述第二电路板产生的热量传导至所述散热件上进行散热；或者，
    所述第一段用于安装所述第一电路板，所述第一电路板产生的热量能够传导至所述散热件上进行散热；所述散热件还用于与所述第二电路板贴合安装，从而使得所述第二电路板产生的热量能够通过所述散热件散发。
  19. 根据权利要求18所述的散热装置，其特征在于，所述散热件包括：
    主体；及
    多个散热片，多个所述散热片连接在所述主体上，所述主体与至少两个所述散热片之间形成有导热通道，所述第二段伸入所述导热通道内并与所述主体贴合。
  20. 根据权利要求19所述的散热装置，其特征在于，所述主体上形成有导热溢胶槽，所述导热溢胶槽位于至少两个所述散热片之间，所述导热溢胶槽与所述导热通道相通。
  21. 根据权利要求18至20任意一项所述的散热装置，其特征在于，所述散热装置还包括：
    第一支架，所述第一段设置在所述第一支架上；及
    第二支架，所述第二段设置在所述第二支架上，所述第二支架与所述第一支架连接，所述第二支架与所述第一支架不在同一平面内。
  22. 根据权利要求21所述的散热装置，其特征在于，所述散热件可拆卸地安装在所述第二支架上；或，所述散热件与所述第二支架为一体成型的结构。
  23. 根据权利要求21所述的散热装置，其特征在于，所述第二支架包括第一端及第二端，所述第一支架连接在所述第一端，所述散热件连接在所述第二端。
  24. 根据权利要求21所述的散热装置，其特征在于，所述第一支架由金属材料制成，所述第一支架用于与所述第一电路板贴合；及/或
    所述第二支架由金属材料制成，所述第二支架用于与所述第二电路板贴合。
  25. 根据权利要求21所述的散热装置，其特征在于，所述第一支架还用于安装第三电路板，所述第一支架的相背的两侧分别用于安装所述第一电路板及所述第三电路板，所述第一段位于所述第一电路板与所述第三电路板之间。
  26. 根据权利要求21所述的散热装置，其特征在于，所述散热装置还包括送风件，所述送风件安装在所述第二支架上，所述送风件与所述散热件大致位于同一直线上，以使所述送风件生成的气流导向所述散热件。
  27. 根据权利要求21所述的散热装置，其特征在于，所述第一支架与所述第二支架共同形成收容空间；
    其中，所述第一段设置在所述第一支架的与所述收容空间相背或相同的一侧；及/或
    所述第二段设置在所述第二支架的与所述收容空间相背或相同的一侧。
  28. 根据权利要求21所述的散热装置，其特征在于，所述第一支架与所述第二支架共同形成收容空间；所述第二支架上开设有过孔，所述导热件穿设所述过孔，所述第一段与所述第二段中的一段位于所述收容空间内，另一段位于所述收容空间外。
  29. 根据权利要求21所述的散热装置，其特征在于，所述第一支架包括：
    第一板体，所述第一板体用于安装所述第一电路板；及
    多个第一限位筋，多个所述第一限位筋连接在所述第一板体上，多个所述第一限位筋与所述第一板体共同形成第一限位空间，所述第一段至少部分收容在所述第一限位空间内。
  30. 根据权利要求29所述的散热装置，其特征在于，所述第一板体上形成有第一溢胶槽，所述第一溢胶槽位于多个所述第一限位筋之间，所述第一溢胶槽与所述第一限位空间相通。
  31. 根据权利要求21所述的散热装置，其特征在于，所述第二支架包括：
    第二板体，所述第二板体用于安装所述第二电路板；及
    多个第二限位筋，多个所述第二限位筋连接在所述第二板体上，多个所述第二限位筋与所述第二板体共同形成第二限位空间，所述第二段至少部分收容在所述第二限位空间内。
  32. 根据权利要求31所述的散热装置，其特征在于，所述第二板体上形成有第二溢胶槽，所述第二溢胶槽位于多个所述第二限位筋之间，所述第二溢胶槽与所述第二限位空间相通。
  33. 根据权利要求18所述的散热装置，其特征在于，所述导热件还包括第三段，所述第三段与所述第二段分别连接在所述第一段的两端，所述第三段与所述第一段不在同一平面上，所述第三段用于安装第三电路板，以传递所述第三电路板产生的热量至所述散热件。
  34. 一种散热组件，其特征在于，包括：
    第一电路板；
    第二电路板；及
    权利要求1至33任意一项所述散热装置，所述散热装置用于为所述第一电路板及所述第二电路板散热。
  35. 根据权利要求34所述的散热组件，其特征在于，所述第一电路板产生的热量大于所述第二电路板产生的热量。
  36. 根据权利要求34所述的散热组件，其特征在于，所述第一电路板上安装有图传发射芯片、图传放大芯片及图传处理芯片中的一个或多个；及/或
    所述第二电路板上安装有视觉处理芯片及存储芯片中的一个或多个。
  37. 一种移动平台，其特征在于，包括：
    机身；及
    权利要求34至36任意一项所述的散热组件，所述散热组件安装在所述机身上。
PCT/CN2020/098933 2020-06-29 2020-06-29 散热装置、散热组件及移动平台 WO2022000190A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2020/098933 WO2022000190A1 (zh) 2020-06-29 2020-06-29 散热装置、散热组件及移动平台
CN202080005481.9A CN112789958A (zh) 2020-06-29 2020-06-29 散热装置、散热组件及移动平台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/098933 WO2022000190A1 (zh) 2020-06-29 2020-06-29 散热装置、散热组件及移动平台

Publications (1)

Publication Number Publication Date
WO2022000190A1 true WO2022000190A1 (zh) 2022-01-06

Family

ID=75754053

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/098933 WO2022000190A1 (zh) 2020-06-29 2020-06-29 散热装置、散热组件及移动平台

Country Status (2)

Country Link
CN (1) CN112789958A (zh)
WO (1) WO2022000190A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113260228B (zh) * 2021-05-14 2022-12-06 维沃移动通信有限公司 电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105988546A (zh) * 2015-02-10 2016-10-05 鸿富锦精密工业(武汉)有限公司 散热模组
US20190033932A1 (en) * 2017-07-28 2019-01-31 Intel Corporation Thermal management systems for unmanned aerial vehicles
CN110896688A (zh) * 2018-07-02 2020-03-20 深圳市大疆创新科技有限公司 散热组件及遥控器
CN110896689A (zh) * 2018-07-02 2020-03-20 深圳市大疆创新科技有限公司 散热组件及遥控器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN212259664U (zh) * 2020-06-29 2020-12-29 深圳市大疆创新科技有限公司 散热装置、散热组件及移动平台

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105988546A (zh) * 2015-02-10 2016-10-05 鸿富锦精密工业(武汉)有限公司 散热模组
US20190033932A1 (en) * 2017-07-28 2019-01-31 Intel Corporation Thermal management systems for unmanned aerial vehicles
CN110896688A (zh) * 2018-07-02 2020-03-20 深圳市大疆创新科技有限公司 散热组件及遥控器
CN110896689A (zh) * 2018-07-02 2020-03-20 深圳市大疆创新科技有限公司 散热组件及遥控器

Also Published As

Publication number Publication date
CN112789958A (zh) 2021-05-11

Similar Documents

Publication Publication Date Title
US8897012B2 (en) Electronic device and heat dissipation module thereof
TWI251737B (en) Heatsink assembly
JP2000049479A (ja) 電子装置
CN110896689B (zh) 散热组件及遥控器
US10477731B1 (en) Liquid-cooled radiator
WO2020118629A1 (zh) 电子设备
JPH09326458A (ja) ヒートシンク構造を有する電子装置
US7312992B2 (en) Apparatus and method for transferring heat from processors
WO2020034160A1 (zh) 散热组件、散热模组和无人飞行器
TW201334679A (zh) 散熱模組
CN110896688B (zh) 散热组件及遥控器
WO2022000190A1 (zh) 散热装置、散热组件及移动平台
US20140000851A1 (en) Heat-dissipating module for digital light processing projector
US10790215B1 (en) Heat dissipation device
US10082850B2 (en) Electronic device
CN212259664U (zh) 散热装置、散热组件及移动平台
WO2019127356A1 (zh) 中心板单元及无人飞行器
JP2019087775A (ja) 監視カメラ
WO2023035761A1 (zh) 散热器固定结构及板级散热装置
JP7170088B2 (ja) 支持アセンブリ及び表示装置
WO2021056194A1 (zh) 无人机
US9900975B2 (en) Chip heater and heating aid arrangement
CN213122562U (zh) 摄像机用控温风冷装置
TW201639440A (zh) 散熱模組
CN211352911U (zh) 测绘装置及控制系统

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20942825

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20942825

Country of ref document: EP

Kind code of ref document: A1