WO2021258465A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2021258465A1
WO2021258465A1 PCT/CN2020/103190 CN2020103190W WO2021258465A1 WO 2021258465 A1 WO2021258465 A1 WO 2021258465A1 CN 2020103190 W CN2020103190 W CN 2020103190W WO 2021258465 A1 WO2021258465 A1 WO 2021258465A1
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WO
WIPO (PCT)
Prior art keywords
heat
fan
electronic device
heating element
speaker
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Application number
PCT/CN2020/103190
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English (en)
French (fr)
Inventor
王常亮
秦鹏
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技（南京）有限公司
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Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技（南京）有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2021258465A1 publication Critical patent/WO2021258465A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This application relates to the technical field of electronic device structure, and in particular to an electronic device with an overall heat dissipation function.
  • the communication industry has always maintained a high degree of attention to the heat dissipation of mobile phones and other electronic equipment.
  • heating components and speakers have become more and more powerful, and the temperature has become higher and higher, resulting in poor thermal reliability of heating components and speakers.
  • the traditional heat dissipation method generally only dissipates the heating element separately, and does not consider the thermal reliability of the speaker. Instead, the heating element and the speaker are used for heat dissipation at the same time. Although the thermal reliability of the speaker is improved, the thermal reliability of the heating element is less than The way to separate heat dissipation is significantly reduced.
  • the purpose of this application is to provide an electronic device with an overall heat dissipation function when using electronic devices, so as to solve the problem of heat dissipation of heating elements and speakers at the same time, and the thermal reliability of the heating elements is significantly lower than that of separate heat dissipation. problem.
  • An electronic device comprising a casing and a speaker, a heating element and a heat-conducting part arranged on the casing, the heat-conducting part is connected between the speaker and the heating element, and the heat-conducting part is used to The heat of the speaker and the heating element is transferred to the fan, the fan has a first tuyere and a second tuyere, the heat conducting member has a heat conduction section passing through the first tuyere, and the heat conduction section partially shields the first tuyere.
  • the air outlet the fan can generate air flow, the air flow enters the fan from the first air outlet through the heat conduction section and is discharged from the second air outlet or the air flow enters the fan through the second air outlet and Blow to the heat conducting section from the first tuyere.
  • the above-mentioned electronic equipment transfers the heat of the speaker and the heating element to the fan through the heat-conducting member and derives the heat through the air flow generated by the fan, which can dissipate the heating element and the speaker at the same time, and ensure the thermal reliability of the heating element and the speaker at the same time.
  • Figure 1 is an exploded schematic diagram of the electronic device of this application.
  • Fig. 2 is an axial view of the electronic device shown in Fig. 1 in one direction;
  • Figure 3 is a front view of the electronic device shown in Figure 2;
  • Figure 4 is a cross-sectional view along the line A-A in Figure 3;
  • Fig. 5 is a schematic diagram of an enlarged structure of part B in Fig. 4;
  • Fig. 6 is an axial view of the fan in the electronic device shown in Fig. 1 in another direction;
  • Fig. 7 is an axial view of the electronic device shown in Fig. 1 in another direction;
  • Figure 8 is a temperature distribution diagram of an electronic device with only a heat pipe provided on the chip
  • Figure 9 is a temperature distribution diagram of an electronic device with a heat pipe connected between the chip and the speaker;
  • FIG. 10 is a temperature distribution diagram of an electronic device with a fan located in the middle of a heat pipe in this application;
  • FIG. 11 is a temperature distribution diagram of an electronic device with a fan set close to the speaker in this application.
  • An electronic device 10 includes a casing 100 and a speaker 200 arranged on the casing 100, a heating element 300, and a heat conducting member 400.
  • the casing 100 is the middle frame of the mobile phone.
  • the casing 100 includes a first surface 110 and a second surface 120 that are opposed to each other.
  • the casing 100 is formed with a first mounting hole 130 and a second mounting hole 140. Both the first mounting hole 130 and the second mounting hole 140 penetrate the first surface 110 and the second surface 120.
  • a part of the speaker 200 is received in the first mounting hole 130 and connected to the casing 100. Another part of the speaker 200 is exposed on the second surface 120.
  • a part of the heating element 300 is received in the second mounting hole 140 and connected to the casing 100.
  • the other part of the heating element 300 is exposed on the second surface 120.
  • a heat conducting member 400 is connected between the speaker 200 and the heating element 300.
  • the two ends of the heat conducting member 400 are respectively attached to the speaker 200 and the heating element 300 to transfer the heat of the speaker 200 and the heating element 300.
  • the heat conducting member 400 is attached to the rear cover 210 of the speaker 200.
  • the heat-conducting member 400 is a heat pipe or a soaking plate.
  • the heat conducting member 400 is used to transfer the heat of the speaker 200 and the heating element 300 to the fan 500.
  • the fan 500 has a first tuyere 512 and a second tuyere 513.
  • the heat conducting member 400 has a heat conducting section 420 passing through the first tuyere 512.
  • the heat conducting section 420 partially shields the first tuyere 512.
  • the fan 500 can generate airflow. The airflow enters the fan 500 from the first air outlet 512 through the heat conducting section 420 and is discharged from the second air outlet 513 or the airflow enters the fan 500 from the second air outlet 513 and blows into the heating section 420 from the first air outlet 512.
  • the first tuyere 512 can be either the gas inlet of the fan 500 or the gas outlet of the fan 500, that is, the heat conducting section 420 can be located at the gas inlet of the fan 500 or the gas outlet of the fan 500.
  • the heat-conducting member 400 is attached to the casing 100, and the heat transferred to the heat-conducting member 400 can be transferred to the fan 500 and the casing 100 through the heat-conducting member 400.
  • the heat located on the casing 100 can be dissipated through the casing 100.
  • the heat located on the fan 500 can be discharged from the fan 500 through a gas powered by the fan 500, and the exported heat can be discharged from the casing 100 through a flow channel or diffused in the casing 100 to be absorbed by the casing 100 and finally dissipated by the casing 100.
  • the heating element 300 can be any element that requires heat dissipation in a chip, a battery, or a mobile phone.
  • the above-mentioned electronic device 10 transfers the heat of the speaker 200 and the heating element 300 to the fan 500 through the heat-conducting member 400 and dissipates the heat through the airflow generated by the fan 500, which can dissipate the heating element 300 and the speaker 200 at the same time, and at the same time ensure the heating element Thermal reliability of 300 and speaker 200.
  • the fan 500 has a housing 510.
  • the housing 510 includes a first outer wall 511 attached to the heat conducting element 400, and a first air port 512 is formed on the first outer wall 511.
  • the material of the shell 510 is a good heat conductor, or only the first outer wall 511 is prepared through a good heat conductor to facilitate heat transfer to the fan 500.
  • the housing 100 is provided with a stop portion 150.
  • the heat-conducting member 400 cooperates with the stopper 150 to prevent the heat-conducting member 400 from moving relative to the casing 100.
  • the first tuyere 512 is a gas inlet.
  • the air located outside the casing 510 is driven by the fan 500, passes through the heat conducting section 420, and carries heat thereon into the casing 510 through the first tuyere 512.
  • the housing 510 is further formed with a second tuyere 513, and the second tuyere 513 is used for the air-carrying heat-extracting fan 500.
  • the heat-carrying gas enters the housing 510, it is driven by the driving unit 520 and is led out from the second tuyere 513. That is, the gas that continuously carries heat enters the housing 510 and exits the housing 510, so as to reduce the temperature of the heat-conducting member 400, thereby reducing the temperature of the speaker 200 and the heating element 300.
  • the second tuyere 513 is formed on the housing 510 away from the speaker 200 and the heating element 300, so that the heat derived from the housing 510 does not flow directly to the speaker 200 and the heating element 300 with the gas, and avoiding the heat from the speaker 200 and the heating element 300.
  • the temperature is further increased on the basis of self-heating.
  • the casing 510 is disposed on the casing 100 through the heat-conducting member 400, that is, the heat-conducting member 400 is located between the first outer wall 511 and the casing 100.
  • the heat conducting element 400 may not be located between the first outer wall 511 and the housing 100, that is, the first outer wall 511 is located on the side of the housing 510 away from the housing 100 or the first outer wall 511 and the housing 100 presents a certain included angle, as long as it is ensured that the first outer wall 511 and the heat-conducting member 400 are attached to each other.
  • the casing 100 is provided with a through hole 160, and the first tuyere 512 is disposed opposite to and communicated with the through hole 160.
  • the heat-conducting element 400 is located between the first outer wall 511 and the casing 100, and the first outer wall 511 is provided with a first tuyere 512 for gas to enter the casing 510, so it is necessary to provide a through hole 160 on the casing 100, and the gas passes through in sequence
  • the through hole 160, the heat conducting section 420 and the first tuyere 512 enter the housing 510.
  • the gas When the gas enters the through hole 160, it will carry the heat on the housing 100, especially the heat of the housing 100 near the through hole 160, so as to reduce the temperature of the housing 100 near the through hole 160, thereby reducing the adhesion to the housing 100
  • the temperature of the thermally conductive member 400 is located between the first outer wall 511 and the casing 100, and the first outer wall 511 is provided with a first tuyere 512 for gas to enter the casing 510, so it is necessary to provide a through hole 160 on the casing 100, and the gas passes through in sequence
  • the heat-conducting element 400 has a branch portion 410, and the heat-conducting section 420 is formed at the branch portion 410.
  • the branch part 410 is arranged close to the speaker 200.
  • the fan 500 can also be arranged at other positions of the heat conducting element 400, for example, in the middle of the heat conducting element 400 or flexibly arranged according to the arrangement of mobile phone parts.
  • the shape of the heat conducting element 400 can also be arranged according to the mobile phone. Flexible design of parts arrangement.
  • FIG. 8 is a temperature distribution diagram of the electronic device 10 in which only the heat pipe is provided on the chip. It can be seen from FIG. 8 that a heat pipe is added to dissipate heat from the chip, and the heat pipe is connected to the casing 100.
  • the chip power is 3.5W
  • the chip temperature is 54.05°C, which is 12.7°C lower than in the case of no heat pipe.
  • the heat dissipation effect of the heat pipe is obvious, and the maximum temperature difference of the heat pipe is 4.39°C.
  • FIG. 9 is a temperature distribution diagram of the electronic device 10 with a heat pipe connected between the chip and the speaker 200. It can be seen from FIG.
  • the heat pipe dissipates heat to the chip and the speaker 200 at the same time, one end is connected to the chip, and the other end is connected to the back cover 210 of the speaker 200.
  • the chip power is 3.5W
  • the chip temperature is 59.81°C
  • the speaker 200 voice coil temperature is 103.56°C
  • the heat pipe temperature difference is 4.84°C.
  • the chip temperature increases by 5.76°C
  • FIG. 10 is a temperature distribution diagram of the electronic device 10 in which the fan 500 is located in the middle of the heat pipe in this application. It can be seen from FIG. 10 that the heat pipe radiates heat to the chip and the speaker 200 at the same time, and a fan 500 is added in the middle of the heat pipe to dissipate heat.
  • the chip power is 3.5W
  • the chip temperature is 55.84°C
  • the speaker 200 voice coil temperature is 98.94°C
  • the heat pipe temperature difference is 5.03°C.
  • the chip temperature is reduced by 3.97°C
  • the voice coil temperature of the speaker 200 is reduced by 4.62°C.
  • the effect of the fan 500 is more obvious.
  • FIG. 10 is a temperature distribution diagram of the electronic device 10 in which the fan 500 is located in the middle of the heat pipe in this application. It can be seen from FIG. 10 that the heat pipe radiates heat to the chip and the speaker 200 at the same time, and a fan 500 is added in the middle of the heat pipe to dissipate
  • FIG. 11 is a temperature distribution diagram of the electronic device 10 where the fan 500 is arranged close to the speaker 200 in this application. It can be seen from FIG. 11 that the heat pipe dissipates heat to the chip and the speaker 200 at the same time, and a fan 500 is added at the end of the heat pipe close to the speaker 200 to dissipate heat.
  • the chip power is 3.5W
  • the chip temperature is 55.60°C
  • the speaker 200 voice coil temperature is 98.17°C
  • the heat pipe temperature difference is 7.04°C.
  • the position of the fan 500 does not have a great influence on the result, and the voice coil temperature is slightly lowered because it is closer to the speaker 200.
  • arranging the fan 500 on the heat pipe can effectively improve the overall heat dissipation effect of the electronic device 10. Since the position of the fan 500 does not have a great influence on the result, the fan 500 can be flexibly arranged according to the actual temperature distribution requirements and the arrangement of mobile phone parts. Location.

Abstract

本申请提供了一种电子设备，包括机壳和设置在机壳上的扬声器、发热元件和导热件，扬声器和发热元件之间连接有导热件，导热件用于将扬声器和发热元件的热量传递至风扇，风扇具有第一风口和第二风口，导热件具有经过第一风口的导热段，导热段部分遮挡第一风口，风扇能够产生气流，气流经导热段由第一风口进入风扇并由第二风口排出或所述气流由所述第二风口进入所述风扇并由所述第一风口吹向所述导热段。上述电子设备，通过导热件将扬声器和发热元件的热量传递至风扇并通过风扇产生的气流将热量导出，可同时对发热元件和扬声器进行散热，并同时保证发热元件和扬声器的热可靠性。

Description

电子设备 技术领域
本申请涉及电子设备结构技术领域，尤其涉及一种具有整体散热功能的电子设备。
 背景技术
通讯行业对手机等电子设备的散热问题一直保持着较高的关注度，随着5G时代来临，发热元件和扬声器功率越来越大，温度越来越高，造成发热元件和扬声器的热可靠性差。传统散热方式一般只对发热元件进行单独散热，没有考虑扬声器的热可靠性问题，而采用同时对发热元件和扬声器进行散热，虽然提升了扬声器热可靠性，但发热元件的热可靠性，相比于单独散热的方式明显降低。
 技术问题
因此，有必要提供一种具有整体散热功能的电子设备。
 技术解决方案
本申请的目的在于在使用电子设备时，提供一种具有整体散热功能的电子设备，以解决同时对发热元件和扬声器进行散热，发热元件的热可靠性相比于单独散热的方式明显降低的技术问题。
本申请的技术方案如下：
一种电子设备，包括机壳和设置在所述机壳上的扬声器、发热元件和导热件，所述扬声器和所述发热元件之间连接有所述导热件，所述导热件用于将所述扬声器和所述发热元件的热量传递至风扇，所述风扇具有第一风口和第二风口，所述导热件具有经过所述第一风口的导热段，所述导热段部分遮挡所述第一风口，所述风扇能够产生气流，所述气流经所述导热段由所述第一风口进入所述风扇并由所述第二风口排出或所述气流由所述第二风口进入所述风扇并由所述第一风口吹向所述导热段。
 有益效果
本申请的有益效果在于：
上述电子设备，通过导热件将扬声器和发热元件的热量传递至风扇并通过风扇产生的气流将热量导出，可同时对发热元件和扬声器进行散热，并同时保证发热元件和扬声器的热可靠性。
 附图说明
图1为本申请的电子设备的爆炸示意图；
图2为图1所示电子设备的一个方向上的轴视图；
图3为图2所示电子设备的主视图；
图4为图3中A-A向剖视图；
图5为图4中B部放大结构示意图；
图6为图1所示电子设备中风扇的另一个方向上的轴视图；
图7为图1所示电子设备的另一个方向上的轴视图；
图8为只在芯片上设置热管的电子设备的温度分布图；
图9为在芯片和扬声器之间连接热管的电子设备的温度分布图；
图10为本申请中风扇位于热管中部的电子设备的温度分布图；
图11为本申请中风扇靠近扬声器设置的电子设备的温度分布图。
 本发明的实施方式
下面结合附图和实施方式对本申请作进一步说明。
请一并结合图1至图7，现对本申请提供的电子设备10进行说明。一种电子设备10，包括机壳100和设置在机壳100上的扬声器200、发热元件300和导热件400。具体地，机壳100为手机的中框。机壳100包括相对设置的第一表面110和第二表面120。机壳100上形成有第一安装孔130和第二安装孔140。第一安装孔130和第二安装孔140均贯通第一表面110和第二表面120。扬声器200的一部分收容于第一安装孔130与机壳100连接。扬声器200另一部分露设于第二表面120。发热元件300的一部分收容于第二安装孔140与机壳100连接。发热元件300的另一部分露设于第二表面120。进一步地，扬声器200和发热元件300之间连接有导热件400连接。具体地，导热件400的两端分别与扬声器200和发热元件300贴合，用于传递扬声器200和发热元件300的热量。具体地，导热件400与扬声器200的后盖板210贴合。本实施例中，导热件400为热管或均热板。
进一步地，导热件400用于将扬声器200和发热元件300的热量传递至风扇500。风扇500具有第一风口512和第二风口513。导热件400具有经过第一风口512的导热段420。导热段420部分遮挡第一风口512。风扇500能够产生气流。该气流经导热段420由第一风口512进入风扇500并由第二风口513排出或气流由第二风口513进入风扇500并由第一风口512吹向导热段420。第一风口512既可以是风扇500的气体入口又可以是风扇500的气体出口，即导热段420既可以位于风扇500的气体入口又可以位于风扇500的气体出口。具体地，导热件400与机壳100贴合，热量传递至导热件400后可通过导热件400传递至风扇500和机壳100。位于机壳100上的热量可通过机壳100散热。位于风扇500上的热量可通过风扇500提供动力的气体导出风扇500，导出的热量可通过流道排出机壳100或在机壳100内扩散被机壳100吸收并最终通过机壳100散热。发热元件300可为芯片或电池或手机中任意有散热需求的元件。上述电子设备10，通过导热件400将扬声器200和发热元件300的热量传递至风扇500并通过风扇500产生的气流将热量导出，可同时对发热元件300和扬声器200进行散热，并同时保证发热元件300和扬声器200的热可靠性。
进一步地，风扇500具有壳体510。壳体510包括与导热件400贴合的第一外壁511，第一外壁511上形成有第一风口512。制备壳体510的材质为热的良导体，或者只将第一外壁511通过热的良导体制备，以方便热量传递至风扇500。
请一并结合图1至图3，机壳100上设置有止档部150。导热件400与止档部150配合，以防止导热件400相对机壳100移动。
本实施例中，第一风口512为气体入口，位于壳体510外部的气体通过风扇500驱动，经过导热段420，携带其上的热量经第一风口512进入壳体510。进一步地，壳体510还形成有第二风口513，第二风口513用于气体携带热量导出风扇500。具体地，携带热量的气体进入壳体510后，在驱动单元520的驱动下由第二风口513导出。即形成不断携带热量的气体进入壳体510并导出壳体510，以降低导热件400温度，进而降低扬声器200和发热元件300的温度。
进一步地，第二风口513远离扬声器200和发热元件300形成在壳体510上，以使得由壳体510导出的热量不直接随气体流向扬声器200和发热元件300，避免在扬声器200和发热元件300自身发热的基础上进一步升温。本实施例中，壳体510通过导热件400设置于机壳100上，即导热件400位于第一外壁511和机壳100之间。可以理解为在其他实施例中，导热件400可以不位于第一外壁511和机壳100之间，即第一外壁511位于壳体510远离机壳100一侧设置或第一外壁511与机壳100呈一定夹角，只要保证第一外壁511与导热件400贴合即可。本实施例中，机壳100上设置有通孔160，第一风口512与通孔160相对设置且连通。导热件400位于第一外壁511和机壳100之间，而第一外壁511上设置有第一风口512用于气体进入壳体510，因此需要在机壳100上设置通孔160，气体依次经过通孔160、导热段420和第一风口512进入壳体510。气体在进入通孔160时会携带机壳100上的热量，尤其是通孔160附近机壳100部分的热量，以降低通孔160附近机壳100部分的温度，进而降低与机壳100贴合的导热件400的温度。
请一并结合图1至图3和图6，本实施例中，导热件400具有分支部410，导热段420形成于分支部410。分支部410靠近扬声器200设置。可以理解为在其他实施例中，风扇500还可以设置于导热件400的其他位置，例如位于导热件400的中部或根据手机零件排布灵活安排，同样的，导热件400的形状也可根据手机零件排布灵活设计。
下面通过对比来说明本申请的有益效果。
图8为只在芯片上设置热管的电子设备10的温度分布图。由图8可知，增加热管给芯片散热，将热管和机壳100相连。芯片功率3.5W时，芯片温度54.05℃，相比无热管情况下温度降低12.7℃，热管散热效果明显，热管最大温差4.39℃。图9为在芯片和扬声器200之间连接热管的电子设备10的温度分布图。由图9可知，热管同时给芯片和扬声器200散热，一端连接芯片，另一端连接扬声器200后盖板210。芯片功率3.5W时，芯片温度59.81℃，扬声器200音圈温度103.56℃，热管温差4.84℃。相比图8热管单独给芯片散热，芯片温度升高5.76℃，扬声器200音圈温度降低5.71℃。
图10为本申请中风扇500位于热管中部的电子设备10的温度分布图。由图10可知，热管同时给芯片和扬声器200散热，在热管中部增加风扇500散热。芯片功率3.5W时，芯片温度55.84℃，扬声器200音圈温度98.94℃，热管温差5.03℃。相比图9无风扇500情况，芯片温度降低3.97℃，扬声器200音圈温度降低4.62℃，风扇500的作用比较明显。图11为本申请中风扇500靠近扬声器200设置的电子设备10的温度分布图。由图11可知，热管同时给芯片和扬声器200散热，在热管靠近扬声器200端部增加风扇500散热。芯片功率3.5W时，芯片温度55.60℃，扬声器200音圈温度98.17℃，热管温差7.04℃。风扇500位置对结果的影响不是很大，由于更靠近扬声器200，音圈温度略有降低。
综上所述，在热管上设置风扇500可有效改善电子设备10的整体散热效果，由于风扇500位置对结果的影响不是很大，可根据实际温度分布需求以及手机零件排布灵活安排风扇500的位置。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。

Claims (7)

  1. 一种电子设备，包括机壳和设置在所述机壳上的扬声器、发热元件和导热件，所述扬声器和所述发热元件之间连接有所述导热件，其特征在于，所述导热件用于将所述扬声器和所述发热元件的热量传递至风扇，所述风扇具有第一风口和第二风口，所述导热件具有经过所述第一风口的导热段，所述导热段部分遮挡所述第一风口，所述风扇能够产生气流，所述气流经所述导热段由所述第一风口进入所述风扇并由所述第二风口排出或所述气流由所述第二风口进入所述风扇并由所述第一风口吹向所述导热段。
  2. 根据权利要求1所述的电子设备，其特征在于：所述风扇具有壳体，所述壳体包括与所述导热件贴合的第一外壁，所述第一外壁上形成有所述第一风口。
  3. 根据权利要求2所述的电子设备，其特征在于：所述第二风口远离所述扬声器和所述发热元件形成在所述壳体上。
  4. 根据权利要求3所述的电子设备，其特征在于：所述壳体通过所述导热件设置于所述机壳上，所述机壳上设置有通孔，所述第一风口与所述通孔相对设置且连通。
  5. 根据权利要求1~4任一权利要求所述的电子设备，其特征在于：所述导热件具有分支部，所述导热段形成于所述分支部。
  6. 根据权利要求5所述的电子设备，其特征在于：所述机壳上设置有止档部，所述导热件与所述止档部配合，以防止所述导热件相对所述机壳移动。
  7. 根据权利要求6所述的电子设备，其特征在于：所述导热件为热管或均热板。
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