WO2021243778A1 - 一种摄像模组及组装方法 - Google Patents
一种摄像模组及组装方法 Download PDFInfo
- Publication number
- WO2021243778A1 WO2021243778A1 PCT/CN2020/099083 CN2020099083W WO2021243778A1 WO 2021243778 A1 WO2021243778 A1 WO 2021243778A1 CN 2020099083 W CN2020099083 W CN 2020099083W WO 2021243778 A1 WO2021243778 A1 WO 2021243778A1
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- WIPO (PCT)
- Prior art keywords
- lens
- circuit board
- connecting portion
- correction plane
- camera module
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000003384 imaging method Methods 0.000 claims abstract description 92
- 239000003292 glue Substances 0.000 claims abstract description 88
- 238000012937 correction Methods 0.000 claims abstract description 79
- 230000003287 optical effect Effects 0.000 claims abstract description 28
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000007514 turning Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 17
- 238000005516 engineering process Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
- G02B7/004—Manual alignment, e.g. micromanipulators
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Definitions
- the invention belongs to the field of optical technology, and in particular relates to a camera module and an assembly method.
- non-consumer camera modules are basically fixed-focus modules (non-autofocus).
- the best imaging surface of the lens will drift, and the working temperature conditions of such modules are relatively harsh (such as vehicle-mounted
- the field generally requires -40—+85°C), so that the camera module maintains good performance in the full temperature range, and the camera module is required to have higher accuracy during assembly (not only need to ensure the performance at room temperature, but also consider low temperature , The lens rear focus temperature drift under high temperature conditions, the assembly margin is smaller when assembled at room temperature).
- AA glue is an indispensable key factor: after the lens and the circuit board are calibrated to the best relative position through the AA technology, the lens and the circuit board or the base are connected and fixed by AA glue to finally make the lens Always keep the best relative position with the circuit board (the imaging surface of the lens coincides with the photosensitive surface of the photoelectric imaging sensor on the circuit board).
- AA glue has a characteristic, it will shrink after curing, and the thickness of the glue is different, the shrinkage is different; the greater the thickness of the glue, the greater the shrinkage.
- the reason for the inconsistent thickness of the AA glue is due to the deviation of the components of the camera module. Among them is the deviation of the optical lens (specifically, the deviation of the optical back focus and the deviation of the optical axis tilt).
- the optical lens is assembled from a number of lenses, which also contains structural parts (spacers, lens barrels, etc.). All lenses and structural parts are There are tolerances, which lead to inconsistent positions of the optical focal surface of the optical lens relative to the glue bonding surface, which directly leads to inconsistent glue thickness.
- the height deviation of the photoelectric imaging sensor and the height deviation of the base directly affect the size of the AA gap, thereby affecting the thickness of the AA glue.
- the purpose of the present invention is to solve the above-mentioned problems, provide a camera module and an assembly method, and solve the problem that the resolution cannot be guaranteed due to the inconsistent glue thickness of the same batch of camera modules.
- the present invention provides a camera module, including a lens, a connector, a circuit board, and a photoelectric imaging sensor arranged on the circuit board.
- the connector includes a first connection fixedly connected to the lens Part and a second connection part connected to the circuit board, the first connection part is provided with a correction plane on the side facing the second connection part or the second connection part is provided with a correction plane on the side close to the circuit board A plane, the correction plane is parallel to the imaging surface of the lens, and a connecting glue layer of a predetermined thickness is provided between the correction plane and the second connecting portion or between the correction plane and the circuit board.
- d represents the thickness of the connecting glue layer
- F represents the distance from the correction plane to the imaging surface
- h represents the height of the photosensitive surface of the photoelectric imaging sensor from the surface of the circuit board
- H represents the height of the second connecting portion.
- d represents the thickness of the connecting adhesive layer
- F represents the distance from the correction plane to the imaging surface
- h represents the height of the photosensitive surface of the photoelectric imaging sensor from the surface of the circuit board.
- the second connecting portion is assembled with the circuit board, and a side of the first connecting portion facing the second connecting portion is provided with a correction plane.
- the first connecting portion and the second connecting portion are integrally formed, and a side of the second connecting portion close to the circuit board is provided with a correction plane.
- the first connection part is a lens flange
- the second connection part is a lens holder
- the lens is assembled with the second connection part through a first connection
- the second connection The side of the part close to the circuit board is provided with a correction plane.
- the present invention also provides an assembling method for the above-mentioned camera module, including:
- the first connecting part or the second connecting part is processed to remove material to obtain the free end and the set d value based on the imaging surface of the lens.
- the first connecting portion and the second connecting portion are fixed by a connecting glue layer or the second connecting portion and the circuit board are fixed by a connecting glue layer.
- the assembly method includes:
- the correction plane of the first connecting portion and the second connecting portion are fixedly connected through a connecting glue layer.
- the assembly method includes:
- the lens and the first connecting part and the second connecting part are assembled into one part, or the first connecting part and the second connecting part are selected as an integrally formed connector and the lens to form a part;
- the circuit board and the calibration plane of the second connecting part are fixedly connected through a connecting glue layer.
- the method of performing material removal processing on the first connecting portion or the second connecting portion to obtain a correction plane includes cutting, turning, cutting, milling, or chemical etching.
- a correction plane is provided on the side of the first connection portion facing the second connection portion or a correction plane is provided on the side of the second connection portion facing the circuit board, and the correction plane and the imaging surface of the lens are mutually Parallel, perpendicular to the actual optical axis of the lens. So that the distance between the lower side of the first connecting part and the second connecting part (base) is the same or the distance between the lower side of the second connecting part and the circuit board is the same, ensuring that the thickness of the filled glue is the same in the AA process Consistent, the shrinkage of the glue is the same, which solves the problem of poor resolution of the camera module caused by the inconsistent thickness of the filled glue.
- the thickness of the connecting adhesive layer between the calibration plane and the second connecting portion or the circuit board is set to be the same, so that the thickness of the connecting adhesive layer in all camera modules is the same, so that all camera modules have the same thickness.
- the glue shrinks the same amount, which helps to improve the consistency of the product.
- the connecting portion of the present invention is provided with sufficient size margin.
- Fig. 1 schematically shows a structural diagram of a camera module according to an embodiment of the present invention
- Figure 2 schematically shows the assembly structure diagram of the camera module in an ideal state
- Fig. 3 schematically shows the angle between the actual optical axis and the mechanical axis of the lens
- Figure 4 schematically shows an assembly diagram of the camera module in an actual state
- Fig. 5 schematically shows a diagram of a correction plane according to the present invention
- Fig. 6 schematically shows a diagram of the deviation of the imaging surface of the lens
- FIG. 7 schematically shows a diagram of the glue thickness required during assembly of the camera module corresponding to the deviation of the different imaging planes in FIG. 6;
- FIG. 8 schematically shows an assembly diagram of the camera module of the second embodiment in an ideal state
- Fig. 9 schematically shows an assembly diagram of the camera module in an actual state
- FIG. 10 schematically shows a diagram of a correction plane of the second embodiment
- FIG. 11 schematically shows a structural diagram of a camera module according to a second embodiment of the present invention.
- FIG. 12 schematically shows a diagram of the camera module in the ideal state of the third embodiment
- FIG. 13 schematically shows a diagram of the camera module in the actual state of the third embodiment
- FIG. 14 schematically shows a diagram of a correction plane according to a third embodiment of the present invention.
- FIG. 15 schematically shows a structural diagram of a camera module according to a third embodiment of the present invention.
- the camera module of the present invention includes a lens 1, a connector 2, a circuit board 3, a photoelectric imaging sensor arranged on the circuit board, and a correction plane 4.
- the connecting member 2 includes a first connecting portion 21 fixedly connected to the lens and a second connecting portion 22 connected to the circuit board 3.
- the first connecting portion 21 and the second connecting portion 22 are Separate components are connected, or the first connecting portion 21 and the second connecting portion 22 are integrally formed.
- the correction plane 4 is provided on the side of the first connecting portion 21 facing the second connecting portion 22 or on the side of the second connecting portion 22 facing the circuit board 3.
- the correction plane 4 of the present invention and the imaging surface of the lens 1 are parallel to each other and perpendicular to the optical axis of the lens 1.
- a connecting adhesive layer A is provided between the correction plane 4 and the second connecting portion 22 or a connecting adhesive layer A is provided between the correction plane 4 and the circuit board 3. It should be noted that for all camera modules, the thickness of the connecting glue layer A is set to be the same, that is to say, when all camera modules are assembled, the thickness of the filling glue used for assembly is the same.
- the first connecting portion 21 and the second connecting portion 22 of the connecting piece 2 are both separate components.
- the first connecting portion 21 is a connecting flange
- the first connecting portion 21 is fixedly connected to the lens 1
- the second connecting portion 22 is a lens holder.
- the base and circuit board 3 are assembled, and then the lens 1 is assembled with the base and circuit board 3 by AA. After finding the best imaging position of the lens, fill in glue (connecting glue layer)
- glue connecting glue layer
- the lens 1 needs to be tilted at a certain angle during assembly to ensure that the actual optical axis is
- the vertical arrangement of the photosensitive chip in this state, will cause the gap between the first connecting portion 21 (connecting flange) and the second connecting portion 22 (base) to be inconsistent in the circumferential direction, as shown in the cross-sectional view shown in Figure 4
- the gap between the first connecting portion 21 and the left side of the base 22 is d1
- the gap between the first connecting portion 21 and the right side of the base 22 is d2, d1>d2.
- a correction plane 4 is provided on the side of the first connecting portion 21 facing the second connecting portion 22. That is, the lower side of the first connecting portion 21 is the correction plane 4, and the correction plane 4 is parallel to the imaging surface of the lens 1 and perpendicular to the actual optical axis of the lens 1. So that the distance between the lower side of the first connecting portion 21 and the second connecting portion 22 (base) is consistent, so that the thickness of the glue filled between the first connecting portion 21 and the second connecting portion 22 is consistent and the glue is consistent. The shrinkage is consistent, which solves the problem of poor resolution of the camera module caused by the inconsistent thickness of the glue filled between the first connecting portion 21 and the second connecting portion 22.
- the thickness of the glue filled between the correction plane 4 and the second connecting portion 22 is preset, that is, the thickness of the connecting glue layer A It is set in advance, so as to ensure that the thickness of the connecting glue layer in each camera module is consistent, thereby helping to solve the problems of poor product consistency and low pass rate.
- the lens 1 in addition to the deviation of the mechanical axis and the actual optical axis, the lens 1 also has an imaging surface deviation.
- the middle diagram in Fig. 6 shows the ideal position of the imaging surface B of the lens 1
- the left diagram shows that the imaging surface B of the lens 1 has a negative deviation
- the right diagram shows that the imaging surface B of the lens 1 has a positive deviation. deviation.
- the glue thickness when there is a negative deviation in the rear focus of the lens 1, the glue thickness will be small. The greater the deviation, the smaller the thickness, and the deviation reaches a certain level. When the glue thickness is negative, it means that the lens 1 and the base 22 interfere. At this time, due to the deviation of the back focus of lens 1, camera assembly is no longer possible. When there is a positive deviation in the rear focus of lens 1, the thickness of the glue will become larger, and the greater the deviation, the greater the thickness. If the glue thickness is too small, the gap between the lens 1 and the base 22 is very small, which may cause interference during AA and assembly failure. If the thickness of the glue is too small, the adhesive strength of the glue may not be enough, and the stability of the module is poor.
- the thickness of the glue is too large, that is, the AA interval between the lens 1 and the base 22 is relatively large, more glue is needed to fill this gap, resulting in a waste of glue.
- the glue gap is too large, the uniformity of the glue will deteriorate and the stability of the module will be affected.
- the thickness of the required filling glue is different, and the shrinkage of the connecting glue layer of different thicknesses is different during work. Therefore, the quality of the camera module cannot be guaranteed.
- the greater the thickness of the glue the greater the shrinkage, and the greater the difference in shrinkage.
- the focal depth range of the module is generally within a few microns. If the thickness of the glue is too large and the difference in shrinkage is much larger than the focal depth range, it cannot be guaranteed that the module will reach a good level after AA assembly Performance.
- the camera module of the present invention solves this problem.
- d represents the thickness of the connecting adhesive layer A
- F represents the distance from the correction plane 4 to the imaging surface
- h represents the height of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board 3
- H represents the second connecting portion 22 height.
- the camera module of the present invention can ensure that the thickness of the glue is consistent, and the thickness of the glue is small, and it is recommended to be less than 200um. Of course, under the premise of ensuring the strength of the glue, it can be as small as possible.
- the first connecting portion 21 and the second connecting portion 22 of the connecting piece 2 are both separate components.
- the first connecting portion 21 is a connecting flange, and is fixedly connected to the lens 1.
- the second connecting portion 22 is a base.
- the lens 1, the first connecting portion 21 and the second connecting portion 22 are assembled first, and then assembled with the circuit board 3 through the AA process.
- the lens 1 needs to be tilted, which results in the second connecting portion 22 assembled with the lens 1 also being tilted, so that the second connecting portion 22 and The gaps between the circuit boards 3 are different.
- a correction plane 4 is provided on the side of the second connection portion 22 facing the circuit board 3, that is, the lower side of the second connection portion 22 is the correction plane 4, and the correction plane 4 is connected to the imaging surface B of the lens 1.
- Parallel setting, perpendicular to the actual optical axis of lens 1. As a result, the gap between the second connecting portion 22 and the circuit board 3 is consistent, and the thickness of the glue used to connect the second connecting portion 22 to the circuit board 3 is also consistent.
- FIG. F+h in order to avoid the influence of the back focus deviation of the lens 1 on the resolution of the camera module.
- d represents the thickness of the connecting adhesive layer A
- F represents the distance from the correction plane 4 to the imaging surface
- h represents the height of the photosensitive surface of the photoelectric imaging sensor from the upper surface of the circuit board 3.
- the correction plane 4 is located below the imaging plane, so F is a negative value.
- the first connecting portion 21 and the second connecting portion 22 of the connecting member 2 are integrally formed.
- the lens 1 and the connecting portion 2 are assembled, they are assembled with the circuit board through the AA process.
- a correction plane 4 is provided on the side of the second connection portion 22 facing the circuit board 3, that is, the lower side of the second connection portion 22 is the correction plane 4, and the correction plane 4 is connected to the imaging surface B of the lens 1. Parallel setting, perpendicular to the actual optical axis of lens 1.
- the gap between the second connecting portion 22 and the circuit board 3 is consistent, and the thickness of the glue used to connect the second connecting portion 22 to the circuit board 3 is also consistent.
- the present invention also provides a method for assembling the above-mentioned camera module, including: S1, assembling a lens with a connector with a size margin; S2, determining the height of the photosensitive surface of the photoelectric imaging sensor from the surface of the circuit board h; S3, setting the thickness d of the connecting adhesive layer; S4, determining the imaging surface of the lens; S5, according to the h value obtained in step S2 and the set d value, taking the imaging surface of the lens as a reference,
- the first connecting portion or the second connecting portion is processed to remove material to obtain a correction plane that is a free end and parallel to the imaging surface, and the first connecting portion and the second connecting portion are fixed by a connecting glue layer or the second connecting portion It is fixed with the circuit board through a connecting glue layer.
- the assembling method of the present invention includes: measuring the height H of the second connecting part, assembling the circuit board and the second connecting part into one component; measuring the distance between the photosensitive surface of the photoelectric imaging sensor The height h of the surface of the circuit board; set the thickness d of the connecting adhesive layer; determine the imaging surface of the lens, according to obtain H, h, and d, take the imaging surface as the reference, and perform the material removal process on the first connecting part to obtain and
- the assembling method of the present invention includes: assembling the lens, the first connecting portion, and the second connecting portion into one component or selecting the first connecting portion and the second connecting portion as an integral structure
- the method for removing material from the first connecting part or the second connecting part to obtain the correction plane includes cutting, turning, cutting, milling or chemical etching.
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Abstract
Description
Claims (10)
- 一种摄像模组,包括镜头(1)、连接件(2)、线路板(3)和设置在所述线路板(3)的光电成像传感器,沿光轴方向,连接件(2)包括与镜头(1)固定连接的第一连接部(21)和与线路板(3)连接的第二连接部(22),其特征在于,所述第一连接部(21)朝向所述第二连接部(22)的一侧设有校正平面(4)或者所述第二连接部(22)靠近所述线路板(3)的一侧设有校正平面(4),所述校正平面(4)与所述镜头(1)的成像面平行,所述校正平面(4)与所述第二连接部(22)之间或者所述校正平面(4)与所述线路板(3)之间设有预定厚度的连接胶层(A)。
- 根据权利要求1所述的摄像模组,其特征在于,所述连接胶层(A)设置在所述校正面(4)与所述第二连接部(22)之间,存在:d=F+h-H;其中,d表示所述连接胶层(A)的厚度,F表示所述校正平面(4)到成像面的距离,h表示光电成像传感器感光面距离所述线路板(3)上表面的高度,H表示第二连接部(22)的高度。
- 根据权利要求1所述的摄像模组,其特征在于,所述连接胶层(A)设置在所述校正平面(4)与所述线路板(3)之间,存在d=F+h;其中,d表示所述连接胶层(A)的厚度,F表示所述校正平面(4)到成像面的距离,h表示光电成像传感器感光面距离所述线路板(3)上表面的高度。
- 根据权利要求2所述的摄像模组,其特征在于,所述第二连接部(22)与所述线路板(3)组配,所述第一连接部(21)朝向所述第二连接部(22)的一侧设有校正平面(4)。
- 根据权利要求3所述的摄像模组,其特征在于,所述第一连接部(21)与所述第二连接部(22)一体成型,所述第二连接部(22)靠近所述线路 板(3)的一侧设有校正平面(4)。
- 根据权利要求3所述的摄像模组,其特征在于,所述第一连接部(21)为镜头法兰,所述第二连接部(22)为镜座,所述镜头(1)通过第一连接(21)与所述第二连接部(22)组配,所述第二连接部(22)靠近所述线路板(3)的一侧设有校正平面(4)。
- 一种用于权利要求1-6任一项所述的摄像模组的组装方法,包括:S1、将镜头与具有尺寸余量的连接件组配;S2、确定光电成像传感器感光面距离所述线路板(3)上表面高度h;S3、设定连接胶层的厚度d;S4、确定镜头的成像面;S5、依据所述步骤S2获得的h值以及设定的d值,以所述镜头的成像面为基准,对第一连接部或第二连接部进行去除材料处理以获得为自由端且与所述成像面平行的校正平面,将第一连接部与第二连接部通过连接胶层固定或者将第二连接部与所述线路板通过连接胶层固定。
- 根据权利要求7所述的组装方法,其特征在于,所述组装方法包括:测量第二连接部的高度H,将镜头与第一连接部组配,将线路板与第二连接部组配成一个部件;测量光电成像传感器感光面距离所述线路板(3)上表面的高度h;设定连接胶层的厚度d;确定镜头成像面位置;依据设定的d、测量的H和h,以所述成像面为基准,对第一连接部进行去除材料处理获得与成像面相平行的校正平面,使校正平面到所述成像面的距离F=H+d-h;将所述第一连接部的校正平面与第二连接部通过连接胶层固定连接。
- 根据权利要求7所述的组装方法,其特征在于,所述组装方法包括:将镜头和第一连接部、第二连接部组配成一个部件或选择第一连接部和第二连接部为一体成型结构的连接件与镜头组成一个部件;测量光电成像传感器感光面距离所述线路板(3)上表面的高度h;设定连接胶层的厚度d;确定镜头成像面位置;依据设定的d和测量的h,以所述成像面为基准,对第二连接部进行去除材料处理获得与成像面相平行的校正平面,并使所述校正平面到所述成像面的距离F=d-h,将线路板与第二连接部的校正平面通过连接胶层固定连接。
- 根据权利要求7所述的组装方法,其特征在于,对于所述第一连接部或所述第二连接部进行去除材料处理以获得校正平面的方式包括切削、车削、切割、铣磨或化学腐蚀方式。
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JP2023524567A (ja) | 2023-06-12 |
US20230038371A1 (en) | 2023-02-09 |
KR20220160682A (ko) | 2022-12-06 |
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