WO2021243542A1 - 一种缓冲型电子产品封装结构 - Google Patents

一种缓冲型电子产品封装结构 Download PDF

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Publication number
WO2021243542A1
WO2021243542A1 PCT/CN2020/093867 CN2020093867W WO2021243542A1 WO 2021243542 A1 WO2021243542 A1 WO 2021243542A1 CN 2020093867 W CN2020093867 W CN 2020093867W WO 2021243542 A1 WO2021243542 A1 WO 2021243542A1
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WIPO (PCT)
Prior art keywords
operating platform
electronic product
sliding structure
type electronic
product packaging
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PCT/CN2020/093867
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English (en)
French (fr)
Inventor
黄路华
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南京溧水高新创业投资管理有限公司
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Application filed by 南京溧水高新创业投资管理有限公司 filed Critical 南京溧水高新创业投资管理有限公司
Priority to PCT/CN2020/093867 priority Critical patent/WO2021243542A1/zh
Publication of WO2021243542A1 publication Critical patent/WO2021243542A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Definitions

  • the invention relates to the field of electronic product packaging, in particular to a buffer type electronic product packaging structure.
  • Electronic packaging is a tube case used outside the installation of the integrated circuit chip, which plays a role of fixing and sealing, protecting the integrated circuit chip, enhancing the ability to adapt to the environment, and the riveting point on the integrated circuit chip is the contact point, which is welded to the package tube case
  • electronic packaging generally uses packaging machines, and the packaging glue is generally resin and other substances; when the buffered electronic product packaging machine is placed on the table when there is a slight unevenness during use, it will cause the electronic product to be unable to be placed horizontally. This will affect the packaging of electronic products.
  • the main purpose of the present invention is to provide a buffer type electronic product packaging structure, which can effectively solve the problems in the background art.
  • a buffer type electronic product packaging structure comprising a device base, a mobile support frame is arranged above the device base, a sliding structure is installed above the device base below the mobile support frame, and the sliding structure is installed above the sliding structure There is an operating platform, and four adjusting devices are symmetrically installed at the lower end of the sliding structure.
  • the front end of the device base is provided with an operation button, and the upper end of the device base is provided with a limit guide rail.
  • the limit guide rail By setting the limit guide rail, the movement of the sliding structure can be facilitated.
  • the front end of the movable support frame is provided with a movable slider
  • the front end of the movable slider is provided with a packaging machine
  • the upper end of the packaging machine is connected with a feeding tube
  • the lower end of the packaging machine is provided with a packaging head
  • the front end of the sliding structure is provided with a limit chute, and the limit chute penetrates the front end and the rear end of the sliding structure, and the sliding structure is installed on the limit guide rail through the limit chute, and the sliding
  • the upper end of the structure is provided with a fixed panel, and the upper end of the fixed panel is symmetrically provided with four No. 1 through holes.
  • the upper end of the operating platform is symmetrically provided with four receiving slots
  • the lower end of the operating platform is symmetrically provided with four No. 2 through holes below the four receiving slots
  • the No. 2 through holes connect the operating platform.
  • the lower end of the four receiving grooves penetrates through the receiving groove, and the inside of the four receiving grooves are respectively provided with a baffle, the lower ends of the four baffles are provided with adjusting screws in the second through hole, and the lower ends of the adjusting screws are respectively penetrated Passing through the second through hole and the first through hole, a support spring is arranged between the operating platform and the fixed panel on the outer side of the adjusting screw.
  • each of the four adjusting devices is provided with a threaded hole
  • the adjusting device is installed on the adjusting screw through the threaded hole
  • the outer ends of the four adjusting devices are symmetrically provided with a number of anti-skid protrusions
  • the present invention has the following beneficial effects.
  • the operating platform can be easily adjusted and leveled; by setting an adjustment device, it can be easily adjusted with the adjusting screw; by setting a fixed panel on the upper end of the sliding structure, the installation of the operating platform can be facilitated.
  • the operating platform of the packaging machine can be slightly adjusted in angle, and the impact of the uneven desktop on the packaging of electronic products is ultimately reduced.
  • FIG. 1 is a schematic diagram of the overall structure of a buffer type electronic product packaging structure of the present invention.
  • Fig. 2 is a structural schematic diagram of a sliding structure, an operating platform, and an adjusting device of a buffer type electronic product packaging structure of the present invention.
  • FIG. 3 is a schematic structural diagram of an adjusting device of a buffer type electronic product packaging structure of the present invention.
  • a buffer type electronic product packaging structure includes a device base 1, a mobile support frame 2 is provided above the device base 1, and a sliding frame is installed above the device base 1 and below the mobile support frame 2.
  • an operating platform 4 is installed above the sliding structure 3
  • four adjusting devices 5 are symmetrically installed at the lower end of the sliding structure 3.
  • the front end of the device base 1 is provided with an operation button 6, and the upper end of the device base 1 is provided with a limit guide 7; the front end of the movable support frame 2 is provided with a moving slider 8, and the front end of the moving slider 8 is provided with a packaging machine 9 and a packaging machine 9.
  • the upper end of the sliding structure 3 is connected with a feeding tube 10, and the lower end of the packaging machine 9 is provided with a packaging head 11; Installed on the limit rail 7 through the limit chute 12, the upper end of the sliding structure 3 is provided with a fixed panel 13, and the upper end of the fixed panel 13 is symmetrically provided with four No.
  • the upper end of the operating platform 4 is symmetrically provided with four
  • the lower end of the operating platform 4 is symmetrically opened with four second through holes 16 below the four receiving slots 15.
  • the second through hole 16 penetrates the lower end of the operating platform 4 and the receiving slot 15, and the four receiving
  • the groove 15 is provided with a baffle 18 respectively.
  • the lower ends of the four baffles 18 are provided with an adjusting screw 17 in the second through hole 16, and the lower ends of the adjusting screw 17 pass through the second through hole 16 and the first through hole 16 respectively.
  • each of the four adjusting devices 5 is provided with a threaded hole 19, and the adjusting device 5 is installed on the adjusting screw through the threaded hole 19
  • the outer ends of the four adjusting devices 5 are symmetrically provided with a number of non-slip protrusions 20.
  • the present invention is a buffer type electronic product packaging structure.
  • the packaging device When in use, the packaging device is first placed on the desktop. When the placed desktop is uneven, the angle of the operating platform 4 can be adjusted. The method is to rotate the four adjusting devices 5 according to the actual situation.
  • the adjusting device 5 When the adjusting device 5 is turned to one side, the adjusting screw 17 will move down along the threaded hole 19, and the operating platform will be pulled when the adjusting screw 17 moves down. 4 moves downward, which will compress the support spring 21.
  • the adjustment device 5 When the adjustment device 5 is turned to the other side, the adjustment device 5 will move downward along the adjustment screw 17, and at this time, the support spring 21 will push the operating platform to move upward. In turn, the adjusting screw 17 is pulled to move upward, and the adjusting device 5 is still tightly attached to the lower end of the fixed panel 13.
  • the electronic product to be packaged can be placed on the upper end of the operating platform 4 for packaging.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Buffer Packaging (AREA)

Abstract

本发明公开了一种缓冲型电子产品封装结构，包括装置底座，所述装置底座的上方设置有移动支撑架，所述装置底座的上方在位于移动支撑架的下方安装有滑动结构，所述滑动结构的上方安装有操作平台，所述滑动结构的下端对称安装有四个调节装置。本发明所述的一种缓冲型电子产品封装结构，通过设置可调节的操作平台，可以便于将操作平台调节平整；通过设置调节装置，可以便于其配合调节螺纹对操作平台进行调节；通过在滑动结构的上端设置固定面板，可以便于操作平台的安装，从而最终使得当放置的桌面存在不平整时，封装机的操作平台能够进行轻微角度调整，最终降低不平整桌面对电子产品封装的影响。

Description

一种缓冲型电子产品封装结构 技术领域
本发明涉及电子产品封装领域，特别涉及一种缓冲型电子产品封装结构。
 背景技术
电子封装就是安装集成电路内置芯片外用的管壳，起着安放固定密封，保护集成电路内置芯片，增强环境适应的能力，并且集成电路芯片上的铆点也就是接点，是焊接到封装管壳的引脚上的，电子封装一般要用到封装机，封装胶一般为树脂等物质；缓冲型电子产品封装机在使用过程中当放置的桌面存在轻微不平整时，会导致电子产品不能水平放置，从而会影响电子产品的封装。
 技术问题
本发明的主要目的在于提供一种缓冲型电子产品封装结构，可以有效解决背景技术中的问题。
 技术解决方案
为实现上述目的，本发明采取的技术方案为。
一种缓冲型电子产品封装结构，包括装置底座，所述装置底座的上方设置有移动支撑架，所述装置底座的上方在位于移动支撑架的下方安装有滑动结构，所述滑动结构的上方安装有操作平台，所述滑动结构的下端对称安装有四个调节装置。
优选的，所述装置底座的前端设置有操作按钮，所述装置底座的上端设置有限位导轨，通过设置限位导轨，可以便于滑动结构的移动。
优选的，所述移动支撑架的前端设置有移动滑块，所述移动滑块的前端设置有封装机，所述封装机的上端连接有送料管，所述封装机的下端设置有封装头，通过设置支撑架，可以便于封装机的移动。
优选的，所述滑动结构的前端开设有限位滑槽，所述限位滑槽将滑动结构的前端与后端贯穿，所述滑动结构通过限位滑槽安装在限位导轨上，所述滑动结构的上端设置有固定面板，所述固定面板的上端对称开设有四个一号通孔，通过在滑动结构的上端设置固定面板，可以便于操作平台的安装。
优选的，所述操作平台的上端对称开设有四个收纳槽，所述操作平台的下端在位于四个收纳槽的下方对称开设有四个二号通孔，所述二号通孔将操作平台的下端与收纳槽贯穿，四个所述收纳槽的内部分别设置有一个挡片，四个所述挡片的下端在位于二号通孔内设置有调节螺杆，所述调节螺杆的下端分别穿过二号通孔与一号通孔，所述调节螺杆的外侧在位于操作平台与固定面板之间设置有支撑弹簧，通过设置可调节的操作平台，可以便于将操作平台调节平整。
优选的，所述四个所述调节装置上分别开设有一个螺纹孔，所述调节装置通过螺纹孔安装在调节螺杆上，四个所述调节装置的外端均对称设置有若干个防滑突起，通过设置调节装置，可以便于其配合调节螺纹对操作平台进行调节。
 有益效果
与现有技术相比，本发明具有如下有益效果。
通过设置可调节的操作平台，可以便于将操作平台调节平整；通过设置调节装置，可以便于其配合调节螺纹对操作平台进行调节；通过在滑动结构的上端设置固定面板，可以便于操作平台的安装，从而最终使得当放置的桌面存在不平整时，封装机的操作平台能够进行轻微角度调整，最终降低不平整桌面对电子产品封装的影响。
 附图说明
图1为本发明一种缓冲型电子产品封装结构的整体结构示意图。
图2为本发明一种缓冲型电子产品封装结构的滑动结构、操作平台、调节装置的结构示意图。
图3为本发明一种缓冲型电子产品封装结构的调节装置的结构示意图。
图中：1、装置底座；2、移动支撑架；3、滑动结构；4、操作平台；5、调节装置；6、操作按钮；7、限位导轨；8、移动滑块；9、封装机；10、送料管；11、封装头；12、限位滑槽；13、固定面板；14、一号通孔；15、收纳槽；16、二号通孔；17、调节螺杆；18、挡片；19、螺纹孔；20、防滑突起；21、支撑弹簧。
 本发明的实施方式
为使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体实施方式，进一步阐述本发明。
在本发明的描述中，需要说明的是，术语“上”、“下”、“内”、“外”“前端”、“后端”、“两端”、“一端”、“另一端”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“设置有”、“连接”等，应做广义理解，例如“连接”，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
如图1-3所示，一种缓冲型电子产品封装结构，包括装置底座1，装置底座1的上方设置有移动支撑架2，装置底座1的上方在位于移动支撑架2的下方安装有滑动结构3，滑动结构3的上方安装有操作平台4，滑动结构3的下端对称安装有四个调节装置5。
装置底座1的前端设置有操作按钮6，装置底座1的上端设置有限位导轨7；移动支撑架2的前端设置有移动滑块8，移动滑块8的前端设置有封装机9，封装机9的上端连接有送料管10，封装机9的下端设置有封装头11；滑动结构3的前端开设有限位滑槽12，限位滑槽12将滑动结构3的前端与后端贯穿，滑动结构3通过限位滑槽12安装在限位导轨7上，滑动结构3的上端设置有固定面板13，固定面板13的上端对称开设有四个一号通孔14；操作平台4的上端对称开设有四个收纳槽15，操作平台4的下端在位于四个收纳槽15的下方对称开设有四个二号通孔16，二号通孔16将操作平台4的下端与收纳槽15贯穿，四个收纳槽15的内部分别设置有一个挡片18，四个挡片18的下端在位于二号通孔16内设置有调节螺杆17，调节螺杆17的下端分别穿过二号通孔16与一号通孔14，调节螺杆17的外侧在位于操作平台4与固定面板13之间设置有支撑弹簧21；四个调节装置5上分别开设有一个螺纹孔19，调节装置5通过螺纹孔19安装在调节螺杆17上，四个调节装置5的外端均对称设置有若干个防滑突起20。
需要说明的是，本发明为一种缓冲型电子产品封装结构，在使用时，首先将封装装置放置到桌面上，当放置的桌面存在不平整时，可以对操作平台4的角度进行调节，调节的方法为，根据实际情况分别转动四个调节装置5，当向一侧转动调节装置5时，调节螺杆17会顺着螺纹孔19向下移动，当调节螺杆17向下移动时会拉动操作平台4向下移动，进而会将支撑弹簧21压缩，当向另一侧转动调节装置5时，调节装置5会顺着调节螺杆17向下移动，而此时支撑弹簧21会推动操作平台向上移动，进而会拉动调节螺杆17向上移动，而调节装置5依旧会紧贴在固定面板13的下端，当操作面板4调节完毕之后，可以将需要封装的电子产品放置到操作平台4上端进行封装即可。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (6)

  1. 一种缓冲型电子产品封装结构，其特征在于：包括装置底座（1），所述装置底座（1）的上方设置有移动支撑架（2），所述装置底座（1）的上方在位于移动支撑架（2）的下方安装有滑动结构（3），所述滑动结构（3）的上方安装有操作平台（4），所述滑动结构（3）的下端对称安装有四个调节装置（5）。
  2. 根据权利要求1所述的一种缓冲型电子产品封装结构，其特征在于：所述装置底座（1）的前端设置有操作按钮（6），所述装置底座（1）的上端设置有限位导轨（7）。
  3. 根据权利要求1所述的一种缓冲型电子产品封装结构，其特征在于：所述移动支撑架（2）的前端设置有移动滑块（8），所述移动滑块（8）的前端设置有封装机（9），所述封装机（9）的上端连接有送料管（10），所述封装机（9）的下端设置有封装头（11）。
  4. 根据权利要求1所述的一种缓冲型电子产品封装结构，其特征在于：所述滑动结构（3）的前端开设有限位滑槽（12），所述限位滑槽（12）将滑动结构（3）的前端与后端贯穿，所述滑动结构（3）通过限位滑槽（12）安装在限位导轨（7）上，所述滑动结构（3）的上端设置有固定面板（13），所述固定面板（13）的上端对称开设有四个一号通孔（14）。
  5. 根据权利要求1所述的一种缓冲型电子产品封装结构，其特征在于：所述操作平台（4）的上端对称开设有四个收纳槽（15），所述操作平台（4）的下端在位于四个收纳槽（15）的下方对称开设有四个二号通孔（16），所述二号通孔（16）将操作平台（4）的下端与收纳槽（15）贯穿，四个所述收纳槽（15）的内部分别设置有一个挡片（18），四个所述挡片（18）的下端在位于二号通孔（16）内设置有调节螺杆（17），所述调节螺杆（17）的下端分别穿过二号通孔（16）与一号通孔（14），所述调节螺杆（17）的外侧在位于操作平台（4）与固定面板（13）之间设置有支撑弹簧（21）。
  6. 根据权利要求1所述的一种缓冲型电子产品封装结构，其特征在于：所述四个所述调节装置（5）上分别开设有一个螺纹孔（19），所述调节装置（5）通过螺纹孔（19）安装在调节螺杆（17）上，四个所述调节装置（5）的外端均对称设置有若干个防滑突起（20）。
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