WO2021235654A1 - 펠티에 소자와 히터를 사용하는 3d 프린터 - Google Patents
펠티에 소자와 히터를 사용하는 3d 프린터 Download PDFInfo
- Publication number
- WO2021235654A1 WO2021235654A1 PCT/KR2021/002107 KR2021002107W WO2021235654A1 WO 2021235654 A1 WO2021235654 A1 WO 2021235654A1 KR 2021002107 W KR2021002107 W KR 2021002107W WO 2021235654 A1 WO2021235654 A1 WO 2021235654A1
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- WIPO (PCT)
- Prior art keywords
- peltier element
- heater
- printer
- board
- temperature
- Prior art date
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- 239000002994 raw material Substances 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 238000001816 cooling Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 4
- 238000011160 research Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 239000012620 biological material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/295—Heating elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/364—Conditioning of environment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
Definitions
- the present invention relates to a 3D printer using a Peltier element and a heater, and more particularly, to a 3D printer using a Peltier element when controlling a low temperature of the 3D printer and using a heater when controlling a high temperature of the 3D printer.
- the 3D printer controls the temperature of the raw material and sprays it, and controlling the temperature of the raw material in the 3D printer is very important. In particular, since biomaterials are sensitive to temperature changes, temperature control is becoming a very important issue in a bio 3D printer.
- a low-temperature module controllable at 4 to 80°C and a high-temperature module controllable at 200°C or higher are used separately to control the temperature of the raw material.
- the present invention is to solve the above problems, and more particularly, to a 3D printer using a Peltier element when controlling a low temperature of the 3D printer and using a heater when controlling a high temperature of the 3D printer.
- the raw material is stored, the dispenser is provided with a nozzle to which the raw material is sprayed; One side and the other side are cooled or heated according to the direction of the supplied current, the Peltier element coupled to the dispenser; a heater coupled to the dispenser and transferring heat to the dispenser; a sensor unit capable of measuring the temperature of the raw material stored in the dispenser; It characterized in that it comprises a; control unit for controlling the Peltier element and the heater according to the temperature of the sensor unit.
- the control unit of the 3D printer using the Peltier element and the heater of the present invention for solving the above problems operates the heater when the temperature sensed by the sensor unit is lower than the specified temperature, and the temperature detected by the sensor unit When is higher than the specified temperature, the Peltier device can be operated.
- One side cooled in the Peltier element of the 3D printer using the Peltier element and the heater of the present invention for solving the above-mentioned problems is in contact with the dispenser, and the other side heated by the Peltier element may be in contact with the heat sink.
- a first board receiving a signal from the sensor unit is connected to the Peltier element and the heater, and the first It may include a second board for selectively transmitting a signal to the Peltier element and the heater according to the signal of the board.
- a diode for allowing current to flow in one direction may be provided between the Peltier element and the first MOSFET of the 3D printer using the Peltier element and the heater of the present invention for solving the above-mentioned problems.
- the first board of the 3D printer using the Peltier element and the heater of the present invention for solving the above problems compares the temperature sensed from the sensor unit and the target temperature, and the first board is sensed by the sensor unit When the set temperature is lower than the target temperature, the first voltage value specified to the second board is transmitted, and when the temperature sensed by the sensor unit is higher than the target temperature, the second voltage value specified by the second board can be transmitted. .
- the heater of the 3D printer using the Peltier element and the heater of the present invention for solving the above problems may be made of a cartridge heater.
- the present invention is a project specific number: 1425136551, department name: Ministry of SMEs and Startups. Research and management institution: Small and Medium Business Technology Information Promotion Agency, Research project name: Start-up growth technology development (R&D), Research project name: Development of hybrid implant technology for facial tissue restoration using 3D printing-based self-tissue-inducing functional biomaterial, Hosted by: Medi Co., Ltd. Fab, research period: It was created through a national project corresponding to 2020-12-02 ⁇ 2021-12-01.
- the present invention is a project specific number: 1415168659, project number: 20008686, department name: Ministry of Trade, Industry and Energy, research management institution: Korea Industrial Technology Evaluation and Management Institute, research project name: bio-industrial technology development (R&D), research project name: tissue-derived extracellular Development of technology for commercialization of regenerative medicine through the development of substrate-based bioink, project execution institution: Medifab Co., Ltd., research period: It was created through a national project corresponding to 2021-01-01 ⁇ 2021-12-31.
- the present invention relates to a 3D printer using a Peltier element and a heater, and the 3D printer can be controlled at a low temperature using the Peltier element, and there is an advantage in that the 3D printer can be controlled at a high temperature using the heater.
- the present invention provides a diode that allows current to flow in only one direction between the first MOSFET and the Peltier element, thereby preventing the reverse voltage generated by the power generation effect of the Peltier element, thereby preventing the failure of the first MOSFET. There is this.
- FIG. 1 is a view showing that a Peltier element and a heater are combined in a dispenser according to an embodiment of the present invention.
- 2 (a) and 2 (b) is a view showing a Peltier device according to an embodiment of the present invention.
- FIG 3 is a view showing that a heat sink and a fan are provided on the other side of the Peltier device according to an embodiment of the present invention.
- FIG. 5 is a view showing an operation state diagram for selectively operating the Peltier element and the heater through the control unit according to an embodiment of the present invention.
- FIG. 6 is a view showing that the Peltier device according to an embodiment of the present invention is generated to generate a reverse voltage.
- FIG. 7 is a view showing that a diode is provided between the Peltier device and the first MOSFET according to an embodiment of the present invention.
- the present invention relates to a 3D printer using a Peltier element and a heater, and to a 3D printer using a Peltier element when controlling a low temperature of the 3D printer and using a heater when controlling a high temperature of the 3D printer.
- a 3D printer using a Peltier element and a heater includes a dispenser 110 , a Peltier element 120 , a heater 130 , a sensor unit 140 , and a control unit 200 .
- the dispenser 110 stores raw materials, and the dispenser 110 is provided with a nozzle 111 for spraying the stored raw materials.
- the dispenser 110 has a space therein so that raw materials can be stored, and the raw materials stored in the space are sprayed to the outside through the nozzle 111 .
- the Peltier element 120 is an element in which one side (or one surface) can be cooled and the other side (or the other surface) can be heated as current flows.
- the Peltier element 120 is cooled and heated when the direction of the supplied current is changed is changed. Specifically, when the direction of the current is changed as in FIG. 2(a) in FIG. 2(b), one side (or one surface) of the Peltier element 120 that has been cooled is heated, and the Peltier element 120 that has been heated. The other side is cooled.
- the 3D printer using the Peltier element and the heater according to an embodiment of the present invention uses the Peltier element 120 during low temperature control, and the dispenser 110 may be cooled through the Peltier element 120 .
- the Peltier element 120 may be coupled to the dispenser 110. In order to cool the dispenser 110 through the Peltier element 120 as described above, one side cooled in the Peltier element 120 is It is preferable to contact the dispenser 110 .
- the Peltier element 120 may be coupled to various points of the dispenser 110 if one side of the Peltier element 120 to be cooled can cool the dispenser 110 .
- a heat sink 150 may be provided on the other side heated by the Peltier element 120 .
- the Peltier element 120 is an element in which one side (or one surface) can be cooled and the other side (or the other surface) can be heated as current flows.
- the heat sink 150 is used to cool the other side of the Peltier device 120 that is heated, and heat generated from the other side of the Peltier device 120 may be dispersed through the heat sink 150 .
- the heat sink 150 is preferably made of a copper heat sink, but is not limited thereto, and may be made of various materials if heat generated from the other side of the Peltier element 120 can be dispersed.
- the heat sink 150 may be made of metal.
- the 3D printer using the Peltier element and the heater is a fan 160 or water cooling together with the heat sink 150 in order to improve the cooling function of the Peltier element 120 . It may include more wealth.
- a water cooling unit may be installed.
- the water cooling unit 170 may be provided on the other side to be heated of the Peltier element 120 , it may be provided on the other side of the heat sink 150 .
- the other side of the heated Peltier element 120 can be efficiently cooled, and the Peltier element that cools the dispenser 110 through this ( 120) to improve the cooling function.
- the water cooling unit 170 may be formed of various devices as long as it can cool the other heated side of the Peltier element 120 .
- the water block 171 may receive water from a tank 172 in which water is stored. When water is supplied from the tank 172 to the water block 171 , the water pump 173 provides power.
- the water cooled by the radiator 174 may be introduced into the tank 172 again, and may be supplied back to the water block 171 through the power of the water pump 173 .
- the water cooling unit 170 can cool the Peltier element 140 while circulating water between the tank 172 - the water block 171 - the radiator 174 .
- Power through which water is circulated is supplied by the water pump 173 provided in the tank 172 .
- the heater 130 is coupled to the dispenser 110 , and transfers heat to the dispenser 110 .
- the 3D printer using the Peltier element and the heater according to an embodiment of the present invention uses the heater 130 when controlling high temperature, and the dispenser 110 can be heated through the heater 130 .
- the sensor unit 140 may measure the temperature of the raw material stored in the dispenser 110 .
- the sensor unit 140 is coupled to the dispenser 110 , and various devices may be used as long as the sensor unit 140 can measure the temperature of the raw material stored in the dispenser 110 , and the dispenser 110 . ) can be combined at various points.
- the control unit 200 may control the Peltier element 120 and the heater 130 according to the temperature of the sensor unit 140 . Specifically, when the temperature sensed by the sensor unit 140 is lower than a specified temperature (target temperature), the controller 200 operates the heater 130 to heat the dispenser 110 , and the sensor unit When the temperature sensed at 140 is higher than the specified temperature (target temperature), the Peltier element 120 is operated to cool the dispenser 110 .
- target temperature a specified temperature
- control unit 200 the configuration of the control unit 200 and the operation of the control unit 200 according to the sensor unit 140 will be described in detail with reference to FIG. 5 .
- the controller 200 may include a first board 210 , a second board 220 , a first MOSFET 230 , a second MOSFET 240 , and a voltage supply unit 250 . .
- the first board 210 receives a signal from the sensor unit 140 , and may be a main board capable of comparing the temperature of the sensor unit 140 with a temperature that a user targets.
- the second board 220 is connected to the Peltier element 120 and the heater 130 according to a signal from the first board 210 while being connected to any one of the Peltier element 120 and the heater 130 . It is possible to selectively transmit a signal.
- the second board 220 is connected to the first board 210, the second board 220 according to the signal of the first board 210, the Peltier element 120 and the heater ( 130) may be an Atmega board that can selectively operate any one of them.
- first board 210 and the second board 220 are illustrated separately in FIG. 5 , the first board 210 and the second board 220 may be provided on one board, and FIG. 5 may be provided separately.
- the second board 220 and the Peltier device 120 may be connected through the first MOSFET 230 , and the second board 220 and the heater 130 connect the second MOSFET 240 to the second board 220 . can be connected through
- the first MOSFET 230 is provided between the second board 220 and the Peltier element 120, and the first MOSFET 230 has a first connection terminal 231 and a first board connection terminal ( 232), the first voltage connection terminal 233 is formed.
- the first connection terminal 231 is a terminal for connecting the first MOSFET 230 and the Peltier element 120 , and a line extending from the first connection terminal 231 is connected to the Peltier element 120 . do.
- the first voltage connection terminal 233 is a terminal for connecting the first MOSFET 230 and the voltage supply unit 250 , and a line extending from the first voltage connection terminal 233 is the voltage supply unit 250 . is connected to
- the second board connection terminal 242 is a terminal for connecting the second MOSFET 240 and the second board 220, and a line extending from the second board connection terminal 242 is connected to the second board ( 220) is connected.
- the voltage supply unit 250 is connected to the first MOSFET 230 through the first board connection terminal 232 , and is connected to the second MOSFET 240 through the second board connection terminal 242 . .
- the first MOSFET 230 receiving the signal from the second board 220 operates the Peltier element 120 , and the Peltier element 120 receives power from the voltage supply unit 250 while receiving power from the dispenser. (110) is cooled.
- the 3D printer using the Peltier element and the heater according to an embodiment of the present invention is provided with a diode 260 that allows current to flow only in one direction between the first MOSFET 230 and the Peltier element 120 to provide the Peltier element.
- a diode 260 that allows current to flow only in one direction between the first MOSFET 230 and the Peltier element 120 to provide the Peltier element.
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Abstract
Description
Claims (9)
- 3D 프린터에서 분사되는 원료가 적층 되면서 조형물로의 성형이 이루어지는 3D 프린터 있어서,원료가 저장되며, 원료가 분사되는 노즐이 구비되는 디스펜서;공급되는 전류의 방향에 따라 일측과 타측이 냉각 또는 가열되며, 상기 디스펜서에 결합되는 펠티에 소자;상기 디스펜서에 결합되며, 상기 디스펜서에 열을 전달하는 히터;상기 디스펜서에 저장된 원료의 온도를 측정할 수 있는 센서부;상기 센서부의 온도에 따라 상기 펠티에 소자와 상기 히터를 제어하는 제어부;를 포함하는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제1항에 있어서,상기 제어부는,상기 센서부에서 감지된 온도가 지정된 온도보다 낮을 때는 상기 히터를 작동시키며,상기 센서부에서 감지된 온도가 지정된 온도보다 높을 경우에는 상기 펠티에 소자를 작동시키는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제1항에 있어서,상기 펠티에 소자에서 냉각되는 일측은 상기 디스펜서에 접촉되며,상기 펠티에 소자에서 가열되는 타측에는 방열판이 접촉되는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제1항에 있어서,상기 펠티에 소자의 가열되는 타측을 냉각시킬 수 있는 팬 또는 수냉부를 더 포함하는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제1항에 있어서,상기 제어부는,상기 센서부로부터 신호를 전달받는 제1보드와,상기 펠티에 소자와 상기 히터와 연결되며, 상기 제1보드의 신호에 따라 상기 펠티에 소자와 상기 히터에 선택적으로 신호를 송신하는 제2보드를 포함하는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제5항에 있어서,상기 제어부는,상기 펠티에 소자와 상기 제2보드 사이에 구비되며, 전압 공급부와 연결되는 제1모스펫과,상기 히터와 상기 제2보드 사이에 구비되며, 전압 공급부와 연결되는 제2모스펫을 더 포함하는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제6항에 있어서,상기 펠티에 소자와 상기 제1모스펫 사이에는 전류를 일방향으로 흐르게 하는 다이오드가 구비되는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제5항에 있어서,상기 제1보드는 상기 센서부로부터 감지된 온도와 목표 온도를 비교하며,상기 제1보드는,상기 센서부에서 감지된 온도가 목표 온도보다 낮을 때는 상기 제2보드에 지정된 제1전압값을 송신하며,상기 센서부에서 감지된 온도가 목표 온도보다 높 때는 상기 제2보드에 지정된 제2전압값을 송신하는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
- 제1항에 있어서,상기 히터는, 카트리지 히터로 이루어지는 것을 특징으로 하는 펠티에 소자와 히터를 사용하는 3D 프린터.
Applications Claiming Priority (2)
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KR10-2020-0059944 | 2020-05-19 | ||
KR1020200059944A KR102217023B1 (ko) | 2020-05-19 | 2020-05-19 | 펠티에 소자와 히터를 사용하는 3d 프린터 |
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WO2021235654A1 true WO2021235654A1 (ko) | 2021-11-25 |
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KR20190016291A (ko) * | 2017-08-08 | 2019-02-18 | (주)엘에스비 | 3d 프린터용 냉각 기능을 포함하는 베이스 |
KR101966829B1 (ko) * | 2018-11-02 | 2019-04-08 | 주식회사 쓰리딜라이트 | 3d 프린터의 레진 온도 유지 장치 |
KR102055434B1 (ko) * | 2019-05-02 | 2019-12-12 | (주)쓰리디테크놀로지 | 냉각 기능이 증대된 3d프린터 노즐장치 |
KR20200034026A (ko) * | 2018-09-13 | 2020-03-31 | 인하대학교 산학협력단 | 3d 프린터 인쇄 정확도 향상을 위한 필라멘트 저장장치에 관한 방법 |
US20200139629A1 (en) * | 2018-11-07 | 2020-05-07 | Seiko Epson Corporation | Plasticizing Device, Three-Dimensional Modeling Device, And Injection Molding Device |
KR102217023B1 (ko) * | 2020-05-19 | 2021-02-18 | 주식회사 메디팹 | 펠티에 소자와 히터를 사용하는 3d 프린터 |
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KR20160030616A (ko) * | 2014-09-11 | 2016-03-21 | 김진규 | 펠티어소자를 이용한 3d 프린터용 노즐 및 헤드 |
JP6616134B2 (ja) * | 2015-09-08 | 2019-12-04 | 東洋リビング株式会社 | 3dプリンタ用防湿庫 |
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KR20190016291A (ko) * | 2017-08-08 | 2019-02-18 | (주)엘에스비 | 3d 프린터용 냉각 기능을 포함하는 베이스 |
KR20200034026A (ko) * | 2018-09-13 | 2020-03-31 | 인하대학교 산학협력단 | 3d 프린터 인쇄 정확도 향상을 위한 필라멘트 저장장치에 관한 방법 |
KR101966829B1 (ko) * | 2018-11-02 | 2019-04-08 | 주식회사 쓰리딜라이트 | 3d 프린터의 레진 온도 유지 장치 |
US20200139629A1 (en) * | 2018-11-07 | 2020-05-07 | Seiko Epson Corporation | Plasticizing Device, Three-Dimensional Modeling Device, And Injection Molding Device |
KR102055434B1 (ko) * | 2019-05-02 | 2019-12-12 | (주)쓰리디테크놀로지 | 냉각 기능이 증대된 3d프린터 노즐장치 |
KR102217023B1 (ko) * | 2020-05-19 | 2021-02-18 | 주식회사 메디팹 | 펠티에 소자와 히터를 사용하는 3d 프린터 |
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