WO2021218871A1 - 一种耳机 - Google Patents

一种耳机 Download PDF

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Publication number
WO2021218871A1
WO2021218871A1 PCT/CN2021/089713 CN2021089713W WO2021218871A1 WO 2021218871 A1 WO2021218871 A1 WO 2021218871A1 CN 2021089713 W CN2021089713 W CN 2021089713W WO 2021218871 A1 WO2021218871 A1 WO 2021218871A1
Authority
WO
WIPO (PCT)
Prior art keywords
movement
earphone
housing
magnet
equal
Prior art date
Application number
PCT/CN2021/089713
Other languages
English (en)
French (fr)
Inventor
王真
刘志青
王永根
毛辛男
游芬
Original Assignee
深圳市韶音科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202020720094.0U external-priority patent/CN211702349U/zh
Priority claimed from CN202020720106.XU external-priority patent/CN211702350U/zh
Priority claimed from CN202010367108.XA external-priority patent/CN113596649A/zh
Application filed by 深圳市韶音科技有限公司 filed Critical 深圳市韶音科技有限公司
Priority to KR1020227031765A priority Critical patent/KR102662478B1/ko
Priority to BR112022013798A priority patent/BR112022013798A2/pt
Priority to CN202180014980.9A priority patent/CN115136618A/zh
Priority to EP21797782.6A priority patent/EP4072158A4/en
Priority to JP2022549732A priority patent/JP7451736B2/ja
Publication of WO2021218871A1 publication Critical patent/WO2021218871A1/zh
Priority to US17/809,013 priority patent/US20220337929A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105—Earpiece supports, e.g. ear hooks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1025—Accumulators or arrangements for charging
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/105—Manufacture of mono- or stereophonic headphone components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/107—Monophonic and stereophonic headphones with microphone for two-way hands free communication
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/033—Headphones for stereophonic communication
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H04R9/066—Loudspeakers using the principle of inertia

Definitions

  • This application relates to the field of acoustics, and specifically to a headset.
  • Bone conduction is a sound conduction method, which converts electrical signals into mechanical vibrations and passes the mechanical vibrations through the human skull, bone labyrinth, inner ear lymph, spiral organs, auditory spirit, and cerebral cortex auditory center Come this way to realize the transmission of sound waves.
  • Bone conduction headphones use bone conduction technology to receive speech, close to the skull, and sound waves can be transmitted directly to the auditory nerve through the bones without passing through the external auditory canal and eardrum, which can "liberate" both ears.
  • the headset may include a movement module.
  • the movement module may include a movement housing and a movement.
  • the movement housing may include a bottom wall and an annular peripheral wall.
  • the bottom wall may face the user's head, one end of the annular peripheral wall may be integrally connected with the bottom wall, and one end of the annular peripheral wall away from the bottom wall is open, so The movement may be provided in the movement housing through the opening.
  • the movement may include a magnet, and the magnet may be configured to cause the movement module to be adsorbed on a magnetic object through one side of the bottom wall.
  • the magnet may be a cylinder
  • the diameter of the magnet may be greater than or equal to the first diameter and less than or equal to the second diameter
  • the thickness of the magnet may be greater than or equal to the first thickness and less than or equal to the second thickness .
  • the diameter of the magnet may be 10.8 mm, and the thickness of the magnet may be 3.5 mm.
  • the movement may further include a magnetic cover, a magnetic plate, and a coil.
  • the magnetic conductive cover may include a bottom plate and an annular side plate integrally connected with the bottom plate, and the magnet is arranged in the annular side plate and fixed on the bottom plate.
  • the magnetic conductive plate may be fixed on the side of the magnet facing away from the bottom plate.
  • the coil may be arranged in a magnetic gap between the magnet and the annular side plate.
  • the diameter of the magnetic conductive plate may be equal to the diameter of the magnet, and the thickness of the magnetic conductive plate may be equal to the thickness of the magnetic conductive cover.
  • the thickness of the magnetic conductive cover may be greater than or equal to the third thickness and less than or equal to the fourth thickness.
  • the thickness of the magnetic conductive cover may be 0.5 mm.
  • the height of the annular side plate may be greater than or equal to the first height and less than or equal to the second height.
  • the height of the annular side plate may be 3.7 mm.
  • the movement module may further include a movement support.
  • the movement support may be arranged in the movement housing, and the coil may be fixed on the movement support.
  • the magnetic gap between the magnet and the annular side plate may be greater than or equal to the first gap and less than or equal to the second gap.
  • the earphone may further include an ear hook component, and one end of the ear hook component may be connected to the movement module.
  • the earhook assembly may include an earhook housing.
  • the earhook shell may include a storage compartment, a fixing part and a bending transition part.
  • the accommodating compartment can be used for accommodating a battery or a main control circuit board.
  • the fixing portion may be covered on the open end of the movement housing to form a cavity for accommodating the movement, and the bending transition portion may connect the accommodating bin and the The fixing part is arranged in a bent shape to hang on the outside of the human ear.
  • the elastic modulus of the movement shell may be greater than the elastic modulus of the earhook shell.
  • the fixing part may be provided with a reinforcing structure that can make the difference between the rigidity of the bottom wall and the rigidity of the fixing part and the rigidity of the bottom wall less than The ratio is less than or equal to the preset ratio threshold.
  • the reinforcing structure may include reinforcing ribs provided on the fixing part.
  • the reinforcing structure may include metal parts.
  • the reinforcing structure and the earphone fixing portion may be a metal insert injection molding integrally molded structure.
  • the movement module may further include a cover plate.
  • the cover plate may be covered on the opening of the annular peripheral wall of the movement housing, and the fixing part may be covered on the side of the cover plate away from the movement housing.
  • the elastic modulus of the cover plate may be greater than the elastic modulus of the ear hook shell.
  • the elastic modulus of the cover plate may be less than or equal to the elastic modulus of the movement shell.
  • the earhook assembly may further include a decorative bracket.
  • a first groove may be provided on the bending transition portion.
  • the decorative bracket may be embedded and fixed in the first groove to form a wiring channel, thereby allowing wires to extend from the movement module through the wiring channel to the accommodating bin.
  • the earphone fixing portion may be provided with a key fitting hole, and the key fitting hole may communicate with one end of the first groove.
  • the earhook assembly may also include buttons. The button may be arranged on the other side of the earhook shell away from the decorative bracket and exposed through the button fitting hole.
  • the decorative bracket may extend above the key exposed through the key fitting hole in a cantilever form, and can trigger the key under external force.
  • the number of the movement modules may be two.
  • the polarities of the magnets of the two movement modules near the bottom wall of the movement housing can be different, so that when the earphone is in a non-wearing state, the two movement modules can be mutually Adsorption.
  • the number of the two ear hook components may be two.
  • the earphone may also include a back-hanging component for wrapping around the back side of the user's head. Both ends of the rear hanging component can be respectively connected to the storage bins of the two ear hanging components.
  • Fig. 1 is a schematic diagram of an exploded structure of a bone conduction earphone according to some embodiments of the present application
  • Fig. 2 is a schematic diagram of an exploded structure of the ear hook assembly shown in Fig. 1 according to some embodiments of the present application;
  • FIG. 3 is a schematic diagram of the structure of the ear hook shell shown in FIG. 2 according to some embodiments of the present application;
  • FIG. 4 is another exploded structural diagram of the ear hook assembly in FIG. 1 according to some embodiments of the present application;
  • FIG. 5 is a schematic structural diagram of the earhook housing shown in FIG. 4 according to some embodiments of the present application;
  • FIG. 6 is a schematic structural diagram of a side of the decorative bracket close to the earhook shell shown in FIG. 4 according to some embodiments of the present application;
  • FIG. 7 is a schematic diagram of the principle of triggering the button of the decorative bracket in FIG. 4 according to some embodiments of the present application.
  • FIG. 8 is a schematic diagram of an exploded structure of the movement module in FIG. 1 according to some embodiments of the present application;
  • Fig. 9 is a schematic diagram of a frequency response curve of bone conduction earphones according to some embodiments of the present application.
  • FIG. 10 is a schematic cross-sectional structural view of the reinforcing structure provided on the earhook shell in FIG. 8 according to some embodiments of the present application;
  • FIG. 11 is a schematic top view of the reinforcing structure provided on the earhook shell in FIG. 8 according to some embodiments of the present application;
  • FIG. 12 is a schematic diagram of frequency response curves corresponding to the reinforcing structures in FIG. 10 and FIG. 11 according to some embodiments of the present application;
  • FIG. 13 is a schematic cross-sectional structure view of the movement module shown in FIG. 8 along the direction I-I after assembly according to some embodiments of the present application;
  • FIG. 14 is a schematic structural diagram of the movement support in FIG. 8 according to some embodiments of the present application.
  • FIG. 15 is a schematic top view of the structure of the movement module shown in FIG. 8 after assembly according to some embodiments of the present application;
  • FIG. 16 is a schematic diagram of an exploded structure of the movement module in FIG. 1 according to some embodiments of the present application;
  • FIG. 17 is a schematic diagram of frequency response curves of the structure corresponding to different types of gels arranged between the earhook assembly and the cover in FIG. 14 according to some embodiments of the present application;
  • FIG. 18 is a schematic cross-sectional view of the movement module shown in FIG. 16 along the II-II direction after assembly according to some embodiments of the present application;
  • FIG. 19 is a schematic structural diagram of the cover plate in FIG. 16 close to the side of the core casing according to some embodiments of the present application;
  • FIG. 20 is a schematic top view of the structure of the cover in FIG. 19 according to some embodiments of the present application.
  • FIG. 21 is a schematic diagram of an exploded structure of the movement module in FIG. 16 from another perspective according to some embodiments of the present application;
  • FIG. 22 is a schematic top view of the structure of the cover in FIG. 21 according to some embodiments of the present application.
  • FIG. 23 is a schematic diagram of the principle of a movement according to some embodiments of the present application.
  • FIG. 24 is a schematic diagram showing the relationship between the force coefficient BL of the magnet in FIG. 23 according to some embodiments of the present application.
  • 25 is a schematic diagram of the relationship between the thickness of the magnetic shield and the magnetic conductive plate in FIG. 23 according to some embodiments of the present application to the force coefficient BL;
  • FIG. 26 is a schematic diagram showing the relationship between the height of the magnetic conductive cover in FIG. 23 and the force coefficient BL according to some embodiments of the present application;
  • FIG. 27 is a schematic diagram of the state of the bone conduction earphone shown in FIG. 1 when it is in a non-wearing state according to some embodiments of the present application;
  • Fig. 28 is a schematic sectional view of the rear suspension assembly in Fig. 1 along the direction III-III according to some embodiments of the present application.
  • Fig. 29 is an exemplary flowchart of a method for processing a rear suspension assembly according to some embodiments of the present application.
  • acoustic output device or “headphone” can also be replaced by other similar words, such as “speaker”, “sounding device”, “hearing aid” Or “speaker device” and so on.
  • the various implementations in the present invention can be easily applied to other non-speaker hearing devices.
  • professionals in the field after understanding the basic principle of earphones, they may make various modifications and changes in form and detail to the specific methods and steps of implementing earphones without departing from this principle.
  • the environmental sound pickup and processing function is added to the earphone, so that the earphone can realize the function of a hearing aid.
  • a microphone such as a microphone can pick up the sound of the user/wearer's surrounding environment, and send the processed sound (or the generated electrical signal) to the acoustic output part under a certain algorithm. That is, the earphone can be modified to add the function of picking up ambient sound, and after certain signal processing, the sound is transmitted to the user/wearer through the acoustic output module, so as to realize the functions of the acoustic output device and the traditional acoustic output device at the same time.
  • the algorithms mentioned here can include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling One or more combinations of suppression, volume control, etc.
  • the earphone in this application may be a stand-alone earphone that can be used directly, or a earphone that is plugged into an electronic device or used as a part of an electronic device.
  • a stand-alone earphone that can be used directly, or a earphone that is plugged into an electronic device or used as a part of an electronic device.
  • the following will be further described based on bone conduction earphones. It should be understood that the content described below can also be applied to air conduction headphones.
  • Fig. 1 is a schematic diagram of an exploded structure of a bone conduction earphone according to some embodiments of the present application.
  • Fig. 2 is an exploded structural diagram of the ear hook assembly in Fig. 1 according to some embodiments of the present application.
  • Fig. 3 is a schematic structural diagram of the earhook housing shown in Fig. 2 according to some embodiments of the present application.
  • Fig. 4 is another exploded structural diagram of the ear hook assembly in Fig. 1 according to some embodiments of the present application.
  • Fig. 5 is a schematic structural diagram of the ear hook housing shown in Fig. 4 according to some embodiments of the present application. As shown in FIGS.
  • the bone conduction earphone 10 may include two movement modules 20, two ear hook components 30, a rear hook component 40, a main control circuit board 50 and a battery 60.
  • one end of the two ear hook components 30 is respectively connected to the corresponding movement module 20, and two ends of the rear hook component 40 are respectively connected to the other end of the two ear hook components 30 away from the movement module 20.
  • the two earhook assemblies 30 are used to hang the two ears of the user, respectively, and the rear hanger assembly 40 is used to wrap around the back of the user's head, so as to meet the user's requirement of wearing the bone conduction earphone 10.
  • the two movement modules 20 are respectively located on the left and right sides of the user's head; Below, the two movement modules 20 can clamp the user's head and contact the user's skin, and thus can realize sound transmission based on bone conduction technology.
  • the bone conduction earphone 10 there are two movement modules 20 described in the present application, and both movement modules 20 can produce sound, so that the bone conduction earphone 10 can achieve stereo sound effects, thereby improving the user satisfaction of the bone conduction earphone 10 Sensitivity.
  • the number of movement modules 20 may not be limited to two.
  • the bone conduction earphone 10 may be provided with three or more movement modules 20.
  • the bone conduction headset 10 may also be provided with only one movement module 20.
  • the earphone may also include an air conduction earphone (for example, a monaural air conduction earphone) provided with a movement module 20, and the air conduction earphone may be hung by a fixed component (for example, an ear hook component).
  • a fixed component for example, an ear hook component
  • the main control circuit board 50 and the battery 60 may be arranged in the same ear-hook assembly 30, or may be arranged in two ear-hook assemblies 30 respectively.
  • the main control circuit board 50 and the battery 60 can both be connected to the two movement modules 20 through conductors (none of which are shown in FIGS. 1 to 5), and the main control circuit board 50 can be used to control the movement modules 20
  • the battery 60 can be used to provide power to the bone conduction earphone 10 (specifically, two movement modules 20).
  • the bone conduction headset 10 described in the present application may also include components such as microphones (for example, microphones, pickups, etc.), communication elements (for example, Bluetooth, etc.), and these components may also be connected to the main control circuit board through wires. 50.
  • the battery 60 is connected to realize the corresponding function.
  • the conductor may include a wire, and the wire may be used to achieve electrical connection between the various electronic components of the bone conduction earphone 10; if there are multiple circuits that need to be electrically connected, the conductor may be Correspondingly, multiple strands are provided, and the above-mentioned conductors can be simply understood as multiple strands of wires.
  • the ear hook assembly 30 may include an ear hook shell 31 and a decorative member 32, and the two may be connected by one or a combination of assembly methods such as glue connection, snap connection, and thread connection.
  • the decorative element 32 is located on the side of the earhook housing 31 away from the core module 20 when the bone conduction earphone 10 is in the wearing state, that is, on the outer side of the bone conduction earphone 10, so that the decorative element 32 is on the earhook housing.
  • the body 31 is decorated, so as to increase the aesthetic appearance of the bone conduction earphone 10.
  • the decorative element 32 may protrude from the ear hook shell 31 or may be embedded in the ear hook shell 31.
  • the decoration 32 may include stickers, plastic parts, metal parts, etc., on which geometric patterns, cartoon patterns, logo patterns, etc. may be printed, and fluorescent materials, reflective materials, etc. may also be coated to achieve The corresponding decorative effect.
  • the earhook housing 31 may include an earphone fixing part 311, a bending transition part 312 and a storage compartment 313 connected in sequence.
  • the earphone fixing portion 311 is used to fix the movement module 20, and the cooperation relationship between the two will be described in detail later.
  • the bending transition part 312 connects the accommodating bin 313 and the earphone fixing part 311, and is arranged in a bent shape so as to be hung on the outside of the human ear.
  • the end of the accommodating compartment 313 away from the earphone fixing portion 311 may be connected to the rear suspension assembly 40 through one or a combination of assembly methods such as glue connection, snap connection, and thread connection, so as to facilitate the realization of the ear suspension assembly.
  • the ear hook housing 31 may further include a bin body cover 314, and the bin body cover 314 is disposed on the open end of the receiving bin 313.
  • the bone conduction earphone 10 may further include a button module, an interface module, and the like.
  • the accommodating compartment 313 is used for accommodating the main control circuit board 50, as shown in FIG. Among them, the control key 33 and the TYPE-C (USB) interface 34 can be arranged on the accommodating bin 313 to facilitate the connection between the two and the main control circuit board 50, thereby shortening the wiring distance.
  • the control key 33 and the TYPE-C (USB) interface 34 may be partially exposed outside the earhook housing 31 to facilitate the user to perform corresponding operations.
  • the control key 33 can be used to realize functions such as turning on and off the bone conduction earphone 10 and adjusting the volume
  • the TYPE-C (USB) interface 34 can be used to realize functions such as data transmission and charging.
  • the ear hook assembly 30 may also include an indicator light 35.
  • the indicator light 35 may be arranged on the accommodating bin 313 to facilitate connection with the main control circuit board 50, thereby shortening the wiring distance.
  • the indicator light 35 may be partially exposed outside the earhook housing 31, or may specifically include an LED light source hidden in the earhook housing 31 and partly exposed in the earhook housing 31 The outer light guide (not shown in Fig. 2 and Fig. 3). With such a setting, the indicator light 35 can prompt when the bone conduction earphone 10 is charged or the battery is insufficient.
  • the bone conduction earphone 10 when the bone conduction earphone 10 is in the wearing state, the bone conduction earphone 10 will be hung on the outside of the human ear.
  • the movement module 20 is generally located on the front side of the human ear
  • the main control circuit board 50 or the battery 60 is generally located on the back side of the human ear.
  • the human ear serves as a fulcrum to support the bone conduction earphone 10, so that the human ear will bear most of the weight of the bone conduction earphone 10. After the user wears the bone conduction earphone 10 for a long time, it may cause discomfort.
  • the earhook shell 31 (especially the part of the bent transition portion 312) is generally made of a softer material, so as to improve the wearing comfort of the bone conduction earphone 10.
  • the material of the earhook shell 31 may include polycarbonate (PC), polyamide (PA), and acrylonitrile-butadiene-styrene copolymer (Acrylonitrile Butadiene Styrene, ABS).
  • the ear hook shell 31 has insufficient rigidity and is difficult to maintain its structure under the action of external force, and may even be broken due to insufficient strength.
  • the ear hook shell 31 may (at least in the bending transition portion 312) built-in elastic metal wire (not shown in FIG. 3), so as to improve the strength of the ear hook shell 31, thereby increasing the ear hook shell 31 Reliability.
  • the material of the elastic metal wire may include spring steel, titanium alloy, titanium nickel alloy, chromium molybdenum steel, etc., or any combination thereof.
  • the earhook shell 31 may be a metal insert injection molding integrally molded structure.
  • the movement module 20 is arranged at one end of the earhook assembly 30 (specifically, it may be the end where the earphone fixing portion 311 is located), the main control circuit board 50 or the battery 60 is arranged at another end of the earhook assembly 30.
  • One end specifically, the other end where the accommodating bin 313 is located, so that when the core module 20 is connected to the main control circuit board 50 and the battery 60 through a wire, the wire must pass through at least the area where the bending transition portion 312 is located.
  • the wire will not be exposed outside the earhook housing 31, but will pass through the earhook housing 31, so that at least the bent transition portion 312 covers the wire.
  • the ear hook housing 31 is provided with a first groove 315 at least on the bending transition portion 312, and the first groove 315 can be used for wiring.
  • the first groove 315 may be specifically arranged on the side of the ear hook shell 31 close to the decorative bracket 321.
  • the decorative member 32 can be embedded and fixed in the first groove 315 corresponding to the bending transition portion 312 to form a wiring channel (not marked in FIG. 2 and FIG.
  • the inner portion 20 extends into the accommodating bin 313 through the wiring channel, which facilitates the connection of the core module 20 with the main control circuit board 50 and the battery 60 by wires. It is so arranged that when the wire passes through the first groove 315 to pass through the ear hook shell 31, the decorative member 32 can cover the wire to prevent the wire from being exposed outside the ear hook shell 31. At this time, the decorative member 32 can not only decorate the ear hook shell 31, but also shield the wires, so that the decorative member 32 can realize "one piece and dual purpose".
  • the decoration 32 may include a decoration bracket 321 and a decoration strip 322.
  • the decorative bracket 321 and the bending transition portion 312 are correspondingly arranged in a bent shape, so that when the decorative bracket 321 is embedded and fixed in the first groove 315 corresponding to the bending transition portion 312, the decorative bracket 321 and the bending transition portion
  • the first groove 315 on the 312 cooperates to form a wiring channel to allow the wires to extend from the movement module 20 through the wiring channel to the accommodating bin 313.
  • the decorative strip 322 is embedded in the first groove 315 and is attached and fixed to the decorative bracket 321.
  • the decorative bracket 321 can be a plastic part, and can be assembled with the ear hook shell 31 by means of glue connection and/or snap connection.
  • the decorative strip 322 may be a sticker, and may be pasted on the decorative bracket 321 by means of adhesive bonding. With this arrangement, when the user wants to change the decorative effect of the decorative element 32, the user can replace the decorative strip 322 without removing the entire decorative element 32 from the ear hook shell 31.
  • FIG. 6 is a schematic structural diagram of a side of the decorative bracket 321 close to the ear hook shell 31 in FIG. 4 according to some embodiments of the present application. In some embodiments, as shown in FIG.
  • the decorative bracket 321 may further be provided with a second groove 3211 on the side facing the ear hook shell 31, so that when the decorative bracket 321 is inserted and fixed in the first groove 315 , The second groove 3211 and the first groove 315 cooperate with each other to form a wiring channel.
  • the bottom of the first groove 315 may be provided with a recess 316 at a position close to the end of the decorative strip 322 to allow the user to press the decorative strip 322 into the recess 316 to make the decorative strip 322
  • the end portion of the upper part is lifted from the first groove 315 to facilitate the replacement of the decorative strip 322.
  • the first groove 315 may further extend to the accommodating bin 313, and the pit 316 may be provided on the accommodating bin 313.
  • the pit 316 is located outside the coverage area of the first groove 315 of the decorative bracket 321, and the decorative strip 322 is attached and fixed on the decorative bracket 321 to cover the pit 316.
  • the overall length of the decorative strip 322 may be greater than the overall length of the decorative bracket 321.
  • the decorative bracket 321 and the decorative strip 322 may also be integrally formed structural members.
  • the material of the decorative bracket 321 and the material of the decorative strip 322 may be different, and the two can be two-color injection molding, so that the decorative bracket 321 can play a supporting role, and the decorative strip 322 can play a decorative role.
  • the overall length of the decorative strip 322 may be greater than or equal to the overall length of the decorative bracket 321.
  • the first groove 315 can be divided into a first sub-slot section 3151 located on the bending transition portion 312, a second sub-slot section 3152 located on the earphone fixing portion 311, and a second sub-slot section 3152 located on the receiving compartment 313.
  • the third sub-slot section 3153 wherein, the depth of the first sub-slot segment 3151 is greater than the depths of the second sub-slot segment 3152 and the third sub-slot segment 3153, so that the first sub-slot segment 3151 can be used to accommodate the decorative bracket 321 and realize wiring, while the second sub-slot segment
  • the groove section 3152 and the third sub-slot section 3153 can be used to accommodate the decorative strip 322.
  • the decorative strip 322 may further extend into the second sub-slot section 3152 and the third sub-slot section 3153.
  • the pit 316 may be provided in the third sub-slot section 3153.
  • the depth of the second sub-slot section 3152 may be equal to the depth of the third sub-slot section 3153, and after the decorative bracket 321 is inserted and fixed to the first sub-slot section 3151, the decorative bracket 321 faces away from the ear hook shell 31. It can be substantially flush with the groove bottoms of the second sub-slot section 3152 and the third sub-slot section 3153, so that the decorative strip 322 can be flatly attached to the earphone fixing portion 311, the decorative bracket 321, and the accommodating bin 313.
  • the bonding strength between the decorative strip 322 and the decorative bracket 321 may be less than the fixing strength between the decorative bracket 321 and the bending transition portion 312.
  • the bonding strength may refer to the bonding strength between the two.
  • the bonding strength may depend on the roughness of the surface on which the decorative support 321 and the decorative strip 322 are adhered; and/or the amount (and/or adhesiveness) of the glue between the decorative strip 322 and the decorative support 321 ).
  • the fixing strength may refer to the clamping strength between the two.
  • the fixing strength may depend on the fit gap between the decorative bracket 321 and the bending transition portion 312; and/or, the depth of the engagement between the two.
  • the storage compartment 313 shown in FIG. 2 when the storage compartment 313 shown in FIG. 2 is used for accommodating the main control circuit board 50, the storage compartment 313 shown in FIG. 4 may be used for accommodating the battery 60.
  • the ear hook assembly 30 shown in FIG. 2 corresponds to the left ear hook of the bone conduction earphone 10
  • the ear hook assembly 30 shown in FIG. 4 may correspond to the right ear hook of the bone conduction earphone 10;
  • the ear hook assembly 30 shown in 2 corresponds to the right ear hook of the bone conduction earphone 10
  • the ear hook assembly 30 shown in FIG. 4 may correspond to the left ear hook of the bone conduction earphone 10.
  • the main control circuit board 50 and the battery 60 can be arranged in the two ear hook assemblies 30 respectively.
  • This configuration can not only increase the capacity of the battery 60 to improve the endurance of the bone conduction earphone 10, but also balance the weight of the bone conduction earphone 10 to improve the wearing comfort of the bone conduction earphone 10.
  • the main control circuit board 50 and the battery 60 can be connected via wires built into the rear suspension assembly 40, and the specific structure will be described in detail later.
  • the left ear hook (or right ear hook) and/or the rear hook assembly 40 may be omitted, the bone conduction earphone 10 may be provided with an ear hook, and the ear hook accommodating compartment 313 may simultaneously accommodate the main controller Circuit board 50 and battery 60.
  • the earhook assembly 30 may further include a button 36, and the earhook housing 31 is also provided with a button fitting hole 317.
  • the decorative bracket 321 is assembled and fixed on one side of the earhook shell 31, and the button 36 is arranged on the other side of the earhook shell 31 away from the decorative bracket 321, and is exposed through the button fitting hole 317; the decorative bracket 321 is further cantilevered The form extends to the top of the button 36 exposed through the button fitting hole 317, and the button 36 can be triggered by an external force.
  • the button 36 can replace the aforementioned control key 33 to simplify the structure of the bone conduction headset 10; it can also coexist with the aforementioned control key 33, and can be used to implement functions such as play/pause and AI wake-up to expand bone conduction.
  • the button fitting hole 317 may be opened in the earphone fixing part 311, and the user can press the button 36 on the earphone fixing part 311.
  • the earhook assembly 30 may further include a sealing member 37 which is arranged between the button 36 and the earphone fixing portion 311.
  • the material of the sealing member 37 may include silica gel, rubber, and the like.
  • the movement module 20 is disposed at one end of the earhook assembly 30 (specifically, it may be the end where the earphone fixing portion 311 is located), the battery 60 is disposed at the other end of the earhook assembly 30 (specifically may be where the accommodating compartment 313 is located).
  • the wire must pass at least the area where the bending transition portion 312 is located, so that the movement module 20 is connected to the battery 60 through the wire.
  • the ear hook housing 31 is provided with a first groove 315 at least on the side of the earphone fixing portion 311 and the bending transition portion 312 close to the decorative bracket 321.
  • the first groove 315 can be used for walking.
  • one end of the first groove 315 is in communication with the key fitting hole 317, so that when the decoration bracket 321 is inserted and fixed in the first groove 315, the decoration bracket 321 can also cover the key fitting hole 317, so as to trigger the key 36.
  • the decorative element 32 can not only decorate the ear hook shell 31 and shield the wires, but also cover and trigger the buttons 36, so that the decorative element 32 can realize "one piece and four functions".
  • the first groove 315 can be divided into a first sub-slot section 3151 located on the bending transition portion 312 and a second sub-slot section 3152 located on the earphone fixing portion 311.
  • the depth of the first sub-slot segment 3151 is greater than the depth of the second sub-slot segment 3152, so that the first sub-slot segment 3151 can be used for wiring, and the second sub-slot segment 3152 and the first sub-slot segment 3151 are used together Accommodate the decorative bracket 321.
  • the key fitting hole 317 may be arranged in the second sub-slot section 3152, that is, the projections of the two on the earphone fixing portion 311 at least partially overlap.
  • first groove 315 may be further divided into a third sub-slot section 3153 located on the accommodating bin 313, and the third sub-slot section 3153 may also be provided with a pit 316.
  • the depth of the second sub-slot section 3152 may be greater than the depth of the third sub-slot section 3153, so that the third sub-slot section 3153 can be used to accommodate the decorative strip 322.
  • the decorative strip 322 may further extend into the third sub-slot segment 3153.
  • the side of the decorative bracket 321 facing away from the ear hook housing 31 may be substantially flush with the bottom of the third sub-slot section 3153, thereby making the decorative strip 322 It can be flatly attached to the earphone fixing part 311, the decorative bracket 321 and the accommodating bin 313, and the decorative bracket 321 may form a cantilever at the second sub-slot section 3152 corresponding to the key fitting hole 317.
  • the decoration bracket 321 may include a fixing portion 3212 corresponding to the first sub-slot segment 3151 and a pressing portion 3213 corresponding to the second sub-slot segment 3152.
  • the thickness of the fixing portion 3212 is greater than the thickness of the pressing portion 3213, so that the fixing portion 3212 can be used to realize the assembly between the decorative bracket 321 and the ear hook shell 31, and the pressing portion 3213 can be used to trigger the button 36.
  • the decorative bracket 321 is provided with a second groove 3211 on the side facing the earhook shell 31, the second groove 3211 may be provided on the fixing portion 3212.
  • FIG. 7 is a schematic diagram of the trigger button 36 of the decorative bracket 321 in FIG. 4 according to some embodiments of the present application.
  • the decorative bracket 321 may further include a connecting portion connected between the fixing portion 3212 and the pressing portion 3213
  • the connecting portion 3214 is bent and extended to a side away from the ear hook shell 31 compared to the fixed portion 3212, and the pressing portion 3213 is bent and extended to a side close to the ear hook shell 31 compared to the connecting portion 3214.
  • the connecting portion 3214 causes the pressing portion 3213 to be suspended relative to the fixing portion 3212, and there is a certain distance between the pressing portion 3213 and the fixing portion 3212. Wherein, the distance can be greater than or equal to the trigger stroke of the button 36.
  • This arrangement can effectively alleviate the problem of the other end of the decorative bracket 321 being raised when the user presses one end of the decorative bracket 321 (specifically, the end where the pressing portion 3213 is located).
  • the side of the pressing portion 3213 close to the earhook shell 31 may also be provided with a button protrusion 3215, so that when the pressing portion 3213 is pressed by an external force, the button protrusion 3215 can trigger the button 36.
  • the projections of the button protrusion 3215 and the button 36 on the earphone fixing portion 311 at least partially overlap, and the effective area of the button protrusion 3215 and the button 36 is smaller than the effective area of the pressing portion 3213 and the button 36. This arrangement can reduce the difficulty of triggering the button 36, especially when the seal 37 is arranged between the button 36 and the earphone fixing portion 311, because the button 36 needs to be deformed before the button 36 is triggered.
  • the key protrusion 3215 can reduce the above-mentioned effective area.
  • the decorative bracket 321 may also be provided with a stopper at the end close to the earphone fixing part 311
  • the stop portion 3216 is used to form a stop with the earphone fixing portion 311 away from the inner surface of the decorative bracket 321 to prevent the end of the decorative bracket 321 from lifting up from the first groove 315, especially under the action of external force.
  • the stopping portion 3216 may be specifically provided at an end of the pressing portion 3213 away from the fixing portion 3212. At this time, due to the stopping effect between the stopping portion 3216 and the earphone fixing portion 311, after the decorative bracket 321 is deformed under the external force to trigger the button 36, the decorative bracket 321 will not be warped due to excessive elastic recovery.
  • an end of the decorative bracket 321 close to the accommodating bin 313 may also be provided with an overlap portion 3217.
  • the thickness of the overlapping portion 3217 is smaller than the thickness of the fixing portion 3212, and it is structurally avoided with the reinforcing structure of the ear hook shell 31 (specifically located between the bending transition portion 312 and the accommodating bin 313).
  • FIG. 8 is a schematic diagram of an exploded structure of the movement module 20 in FIG. 1 according to some embodiments of the present application.
  • the movement module 20 may include a movement housing 21 and a movement 22.
  • One end of the movement housing 21 is open, and the earhook housing 31 (specifically, the earphone fixing portion 311) is covered on the open end of the movement housing 21 to form a cavity structure for accommodating the movement 22 .
  • the ear hook housing 31 is equivalent to a cover of the movement housing 21.
  • the cover assembly method of the earhook housing 31 and the movement housing 21 in the embodiment of the present application can improve the related art middle ear
  • the stress problem between the hanging structure and the movement structure at the insertion point further increases the reliability of the bone conduction earphone 10.
  • the earhook housing shown in Figure 8 is for the convenience of describing the relative positional relationship between the earhook housing and the movement housing, and then implicitly illustrates the earhook housing and the movement housing A possible way of assembly between.
  • the movement 22 may be directly or indirectly fixed in the movement casing 21, so that the movement 22 is excited by an electric signal, and the movement casing 21 vibrates along with it.
  • the skin contact area of the core housing 21 that is, the bottom wall 211 described later
  • the headset one side of the core housing 21 (for example, the bottom wall 211 described later) may face the head of the user.
  • the earphones also include air conduction earphones.
  • One or more sound guide holes may be provided on one side of the air conduction earphone, and when the user wears the air conduction earphone, the side provided with the one or more sound guide holes may face the ear canal of the user.
  • the sound signal generated by the earphone can be transmitted to the user by means of air conduction.
  • the one or more sound guide holes may be arranged on different side walls of the earphone, so as to achieve different sound transmission effects.
  • a first sound guide hole may be provided on the bottom wall of the earphone facing the user's head, and the first sound guide hole may be used to transmit the first sound signal to the ear canal of the user.
  • a second sound guide hole may be provided on a side wall other than the bottom wall, and the second sound guide hole may be used to transmit a second sound signal.
  • the second sound signal can be superimposed on the sound leakage sound wave generated by the vibration of the movement casing 21, so as to achieve the effect of reducing the sound leakage of the movement casing 21.
  • the movement module 20 may further include a movement support 23, and the movement support 23 is used to fix the movement 22 in the movement housing 21.
  • the low frequency refers to the sound with a frequency less than 500 Hz
  • the middle frequency refers to the sound with a frequency range of 500-4000 Hz
  • the high frequency refers to the sound with a frequency greater than 4000 Hz.
  • Fig. 9 is a schematic diagram of a frequency response curve of a bone conduction earphone according to some embodiments of the present application. As shown in Figure 9, the horizontal axis is the frequency of vibration (unit: Hz), and the vertical axis is the intensity of vibration (unit: dB); the high-frequency region (the range with a frequency greater than 4000 Hz) has the first high-frequency valley V, the first The high frequency peak P1 and the second high frequency peak P2.
  • the first high frequency valley V and the first high frequency peak P1 may be generated by deformation of the non-skin contact area of the core housing 21 (that is, the annular peripheral wall 212 described later) under high frequency
  • the second high frequency peak P2 may be caused by deformation of the skin contact area of the movement housing 21 under high frequency.
  • the frequency response curve in the frequency range of 500-6000 Hz is particularly critical for bone conduction earphones. Among them, in this frequency range, sharp peaks and valleys are not desired; the flatter the frequency response curve, the better the sound quality of bone conduction headphones.
  • the greater the rigidity of a structure (for example, the movement case 21), the smaller the deformation when the structure is subjected to force, which is also conducive to the generation of higher frequency resonance. Therefore, in most cases, the product manufacturer will increase the stiffness of the core housing 21 to move the first high frequency valley V, the first high frequency peak P1 and the second high frequency peak P2 to a higher frequency region. In other words, in order to obtain better sound quality, the rigidity of the movement housing 21 can be as large as possible.
  • the material of the core housing 21 may include a mixture of materials such as polycarbonate, polyamide, acrylonitrile-butadiene-styrene copolymer, and glass fiber or carbon fiber.
  • the material of the movement housing 21 can be made by mixing carbon fiber and polycarbonate in a certain proportion, or it can be made by mixing glass fiber and polycarbonate in a certain proportion, and it can also be made by mixing glass fiber and polycarbonate.
  • the amide is made by mixing in a certain proportion.
  • the material of the core housing 21 can be made by mixing carbon fiber, glass fiber, and polycarbonate in a certain proportion. Wherein, adding different proportions of carbon fiber and/or glass fiber, the elastic modulus of the material is different, and the rigidity of the manufactured movement shell 21 is also different. For example, adding 20%-50% of glass fiber to polycarbonate, the elastic modulus of the material can reach 6-8GPa.
  • the earhook housing 31 (especially the earphone fixing portion 311) is used as a part of the movement module 20 to form a cavity structure for accommodating the movement 22; on the other hand, the embodiment of the present application
  • the earhook housing 31 is generally made of a softer material, so that the stiffness of the earhook housing 31 is lower.
  • the rigidity of the earhook housing 31 (especially the earphone fixing portion 311) is less than that of the movement housing
  • the stiffness of 21 makes bone conduction headphones prone to sound leakage, which in turn affects the user's favorability.
  • the resonance frequency of a structure is related to the stiffness of the structure, and under the same mass, the greater the stiffness of the structure, the higher the resonance frequency.
  • the stiffness K of the structure is related to factors such as its material (specifically expressed as elastic modulus), specific structural form and other factors.
  • the greater the elastic modulus E of the material the greater the stiffness K of the structure; the greater the thickness t of the structure, the greater the stiffness K of the structure; the smaller the area S of the structure, the greater the stiffness K of the structure.
  • the above relationship can be simply described by the relationship K ⁇ (E ⁇ t)/S. Therefore, one or a combination of increasing the elastic modulus E of the material, increasing the thickness t of the structure, and reducing the area S of the structure can all increase the stiffness K of the structure, thereby increasing the resonance frequency of the structure.
  • the earhook shell 31 generally chooses a softer material (that is, a material with a lower elastic modulus, such as polycarbonate, polyamide, etc., whose elastic modulus is mostly 2-3 GPa) Is made, and the core shell 21 generally chooses a harder material (that is, a material with a larger elastic modulus, for example, 20%-50% glass fiber is added to polycarbonate, and the elastic modulus of the material is Can reach 6-8GPa, etc.) made.
  • a softer material that is, a material with a lower elastic modulus, such as polycarbonate, polyamide, etc., whose elastic modulus is mostly 2-3 GPa
  • the core shell 21 generally chooses a harder material (that is, a material with a larger elastic modulus, for example, 20%-50% glass fiber is added to polycarbonate, and the elastic modulus of the material is Can reach 6-8GPa, etc.) made.
  • a harder material that is, a material with a larger elastic modulus, for example, 20%-50%
  • the earphone fixing portion 311 is provided with a reinforcing structure 318, which can make the movement housing 21
  • the ratio of the difference between the stiffness K1 of the skin contact area and the stiffness K2 of the earphone fixing portion 311 to the stiffness K1 of the skin contact area of the movement housing 21 is less than or equal to the first preset ratio threshold.
  • the first preset ratio threshold may be 10%.
  • Fig. 10 is a schematic cross-sectional structural view of the reinforcing structure provided on the earhook shell in Fig. 8 according to some embodiments of the present application.
  • the movement housing 21 may include a bottom wall 211 and an annular peripheral wall 212.
  • the bottom wall 211 is the skin contact area of the movement housing 21, and one end of the annular peripheral wall 212 is integrally connected with the bottom wall 211.
  • the bottom wall 211 is used for contact with the user's skin or facing the user's head (for example, facing the user's ear canal).
  • the earphone fixing portion 311 may include a fixing body 3111 connected with the bending transition portion 312 and an annular flange 3112 integrally connected with the fixing body 3111 and extending toward the core housing 21.
  • the annular flange 3112 and the other end of the annular peripheral wall 212 away from the bottom wall 211 are butted against each other, and the two can be connected by glue connection or a combination of glue connection and snap connection.
  • the bottom wall 211 can be any one of rectangular, square, circular, elliptical, oval-like (similar to the shape of the earphone fixing portion 311 shown in FIG. 11), etc. kind.
  • the annular peripheral wall 212 may be perpendicular to the bottom wall 211, that is, the area of the open end of the movement housing 21 is equal to the area of the bottom wall 211.
  • the annular peripheral wall 212 may also be inclined outwardly with respect to the bottom wall 211 by an angle (for example, the inclination angle is less than or equal to 30°), that is, the area of the open end of the core housing 21 is greater than the area of the bottom wall 211.
  • the bottom wall 211 is elliptical, and the annular peripheral wall 212 is inclined 10° outward with respect to the bottom wall 211 as an example for illustration.
  • the reinforcing structure 318 may be an arc structure provided between the fixed body 3111 and the annular flange 3112, that is, a fillet treatment is performed.
  • the annular flange 3112 since the size of the annular flange 3112 in the thickness direction of the earphone fixing portion 311 is generally small, the annular flange 3112 can be integrated with the above-mentioned arc structure.
  • its structure may only include the fixing body 3111 and the reinforcing structure 318 of the arc structure.
  • the above-mentioned arc structure reduces the effective area of the earphone fixing portion 311, which can increase the stiffness of the earphone fixing portion 311, thereby reducing the difference in stiffness between the earphone fixing portion 311 and the movement housing 21. It should be noted that the size of the above-mentioned arc structure can be reasonably designed according to the rigidity requirement of the earphone fixing portion 311, and is not limited here.
  • the reinforcing structure 318 may be a thickened layer integrally provided with the fixed body 3111, that is, thicken processing is performed.
  • the material of the thickening layer may be the same as the material of the ear hook shell 31.
  • the material of the thickening layer is also any one of polycarbonate, polyamide, and acrylonitrile-butadiene-styrene copolymer.
  • the reinforcement structure 318 can be located on the side of the fixed body 3111 close to the movement housing 21, or on the other side of the fixed body 3111 away from the movement housing 21, and of course, can also be located on the side of the fixed body 3111. On both sides.
  • the annular flange 3112 can be integrated with the above-mentioned thickened layer.
  • its structure may only include the fixing body 3111 and the reinforcing structure 318 provided with the thickening layer.
  • the above-mentioned thickening layer increases the effective thickness of the earphone fixing portion 311, which can increase the rigidity of the earphone fixing portion 311, thereby reducing the difference in stiffness between the earphone fixing portion 311 and the movement housing 21.
  • the size of the above-mentioned thickening layer can be reasonably designed according to the rigidity requirement of the earphone fixing portion 311, which is not limited here.
  • the reinforcing structure 318 may be a metal part.
  • the material of the metal part may include aluminum alloy, magnesium alloy, titanium alloy, nickel alloy, chromium molybdenum steel, stainless steel, etc., or any combination thereof.
  • the reinforcing structure 318 and the earphone fixing portion 311 may be a metal insert injection molding integral structure. With this arrangement, the metal part can effectively increase the rigidity of the earphone fixing portion 311, thereby reducing the difference in rigidity between the earphone fixing portion 311 and the movement housing 21. It should be noted that the material, size and other parameters of the aforementioned reinforcing structure 318 can be reasonably designed according to the rigidity requirements of the earphone fixing portion 311, which are not limited here.
  • FIG. 11 is a schematic top view of the reinforcing structure 318 provided on the ear hook shell 31 in FIG. 8 according to some embodiments of the present application.
  • the reinforcing structure 318 may be a reinforcing rib provided on the earphone fixing portion 311.
  • the reinforcing ribs may be distributed on a side of the earphone fixing portion 311 close to the core housing 21.
  • the number of reinforcing ribs may be multiple.
  • the plurality of reinforcing ribs may be arranged side by side as shown in (a) and (b) of FIG. 11 or arranged in a grid as shown in (c) of FIG. 11.
  • the plurality of reinforcing ribs may also be arranged in a radial shape as shown in (d) of FIG. 11 with a preset reference point on the earphone fixing portion 311 as the center.
  • the material of the stiffener may be the same as that of the earhook shell 31, for example, the material of the stiffener is also any one of polycarbonate, polyamide, and acrylonitrile-butadiene-styrene copolymer. kind.
  • the stiffening ribs are provided on the earphone fixing part 311, which can increase the rigidity of the earphone fixing part 311.
  • the weight of the earphone fixing part 311 can be taken into consideration.
  • the earphone fixing portion 311 may have a long axis direction (the direction shown by the dashed line X in FIG. 11) and a short axis direction (the dashed line Y in FIG. 11). Direction shown). Wherein, the size of the earphone fixing portion 311 along the long axis direction may be larger than the size along the short axis direction.
  • a plurality of reinforcing ribs may extend in a strip-like manner along the long axis direction and be arranged side by side along the short axis direction.
  • the reinforcing structure 318 can be simply regarded as a long-side stiffening (Long-Side) of the earphone fixing part 311.
  • a plurality of reinforcing ribs may extend in the short axis direction in a strip-like manner and be arranged side by side in the long axis direction.
  • the reinforcing structure 318 can be simply regarded as the short-side reinforcement of the earphone fixing portion 311 (Short-Side).
  • a plurality of reinforcing ribs may be respectively arranged along the long axis direction and the short axis direction to form a grid shape.
  • the reinforcing structure 318 can be simply regarded as a cross reinforcement of the earphone fixing part 311.
  • the ends of the multiple reinforcement ribs close to each other can be arranged at intervals, and the extension lines of the multiple reinforcement ribs can intersect the preset reference point (as shown by the solid point O in Figure 11).
  • the reinforcing structure 318 can be simply regarded as the radiation reinforcement of the earphone fixing portion 311 (Radiational).
  • the ratio between the thickness of the reinforcing rib and the thickness of the earphone fixing portion 311 may be within the first ratio range.
  • the first ratio range may be 0.8-1.2.
  • the ratio between the width of the reinforcing rib and the thickness of the earphone fixing portion 311 may be within the second ratio range.
  • the second ratio range may be 0.4-0.6.
  • the ratio between the spacing of the reinforcing ribs and the thickness of the earphone fixing portion 311 may be within the third ratio range.
  • the third ratio range may be 1.6-2.4.
  • the thickness of the reinforcing rib and the thickness of the earphone fixing portion 311 may be the same, the width of the reinforcing rib may be half the thickness of the earphone fixing portion 311, and the spacing of the reinforcing ribs may be twice the thickness of the earphone fixing portion 311 .
  • this embodiment is exemplified by taking the thickness of the earphone fixing portion 311 as 0.8 mm, and the thickness, width, and spacing of the reinforcing ribs as 0.8 mm, 0.4 mm, and 1.6 mm, respectively.
  • FIG. 12 is a schematic diagram of a frequency response curve corresponding to the reinforcing structure 318 in FIG. 10 and FIG. 11 according to some embodiments of the present application.
  • the curve (A+B) can indicate that the material of the earphone fixing part 311 is different from the material of the movement housing 21 (for example, the elastic modulus of the former is smaller than that of the latter), and the earphone fixing part
  • the curve (B+B) can indicate that the material of the earphone fixing portion 311 is the same as the material of the movement housing 21 (for example, the elastic modulus of the two is equal)
  • the earphone fixing portion 311 is similar in structure to the core housing 21 (for example, the thickness of the two is equal, and the area of the earphone fixing portion 311 and the area of the bottom wall 211 are also equal) the frequency response curve of the earphone.
  • A can correspond to the earphone fixing portion 311
  • B can correspond to the bottom wall 211 (that is, the skin contact area of the core housing 21);
  • (A+B) and (B+B) can correspond in structure
  • the earhook housing 31 (specifically, the earphone fixing portion 311) is covered on the movement housing 21.
  • the resonance valley (which can correspond to the first high-frequency valley V mentioned above) appears at a frequency of about 5500 Hz; for the structure (B+ For B), the resonance valley (which may correspond to the first high frequency valley V mentioned above) appears at a frequency of about 8400 Hz. Obviously, if the structure (A+B) is improved to the structure (B+B), the resonance frequency of the structure can be effectively increased.
  • the earphone fixing portion 311 is provided with a fillet (Fillet) as shown in Figure 10 (a) and a thickening (Thicken) as shown in Figure 10 (b).
  • a fillet Fet
  • Thicken thickening
  • the long-side reinforcement Long-Side
  • the short-side reinforcement Short-Side
  • Figure 11 c
  • the resonance valleys of (A+B+ reinforcement structure) all appear in the frequency range of 5500- Within 8400Hz.
  • arranging the reinforcing structure 318 on the earphone fixing portion 311 does help to increase the resonance frequency of the structure, that is, it helps to reduce the difference in stiffness between the earphone fixing portion 311 and the movement housing 21, and thereby Helps to improve the above-mentioned leakage.
  • the structure of the reinforcing structure 318 is different, and the effect of increasing the resonance frequency is different, that is, the degree of improvement of the sound leakage is different.
  • the movement 22 vibrates under the excitation of the electric signal, and the movement core casing 21 vibrates along with it.
  • the bottom wall 211 that is, the skin contact area
  • the core housing 21 can be in contact with the user's skin, so that the above-mentioned vibration can be transmitted to the auditory nerve through the human skull, thereby enabling the user to The sound played by the bone conduction earphone 10 is heard.
  • the movement housing 21 needs to be able to vibrate together with the movement 22. Therefore, the movement 22 needs to be fixed in the movement housing 21.
  • FIG. 13 is a schematic cross-sectional view of the movement module shown in FIG. 8 along the direction I-I after assembly according to some embodiments of the present application.
  • one end of the movement housing 21 (for example, at the end far from the bottom wall 211) is open, and the movement support 23 and the movement 22 are accommodated in the movement housing 21.
  • the movement support 23 is used to fix the movement 22 in the movement housing 21.
  • FIG. 14 is a schematic structural diagram of the movement support 23 in FIG. 8 according to some embodiments of the present application.
  • the movement support 23 may include an annular support main body 231 and a limiting structure provided on the support main body 231.
  • the movement 22 is hung on the support main body 231 to be fixedly connected with the movement housing 21.
  • the limiting structure and the movement casing 21 can be interference-fitted, so that the movement support 23 is held with the movement casing 21 along the circumferential direction of the support body 231 (the direction shown by the arrow C in FIG. 14) Relatively fixed.
  • the plane where the bracket body 231 is located may be parallel to the plane where the bottom wall 211 is located to increase the degree of fit between the two, thereby increasing the above-mentioned vibration transmission effect.
  • a colloid such as structural glue, hot melt glue, instant glue, etc. (not shown in FIG. 13) may also be arranged between the bracket body 231 and the bottom wall 211.
  • the movement support 23 and the movement housing 21 can be assembled by a combination of clamping and gluing, thereby effectively limiting the degree of freedom between the movement support 23 and the movement housing 21.
  • the movement support 23 and the movement housing 21 can also be directly fixed by glue bonding.
  • a gel such as structural glue, hot melt glue, instant glue, etc. (not shown in FIG. 13) is arranged between the support body 231 and the bottom wall 211, which can also effectively restrict the movement support 23 and the movement housing 21
  • the degree of freedom between them can also simplify the structure of the movement housing 21.
  • the movement housing 21 may further include a positioning post 213 connected to the bottom wall 211 or the annular peripheral wall 212.
  • the limiting structure may include a first limiting structure 232. Wherein, the first limiting structure 232 is provided with an insertion hole 233. The positioning post 213 is inserted in the insertion hole 233.
  • the above-mentioned glue can also be arranged between the bracket body 231 and the bottom wall 211.
  • the limiting structure may further include a second limiting structure 234.
  • the second limiting structure 234 is spaced apart from the first limiting structure 232 along the circumferential direction of the bracket body 231 (the direction shown by the arrow C in FIG. 14 ). Wherein, the second limiting structure 234 can abut against the annular peripheral wall 212, which will be described in detail later. In this way, the second limiting structure 234 and the first limiting structure 232 are respectively matched with corresponding structures on the movement housing 21, so that the movement support 23 and the movement housing 21 are kept relatively fixed, that is, effectively restricting The degree of freedom between the movement holder 23 and the movement housing 21.
  • FIG. 15 is a schematic top view of the structure of the movement module shown in FIG. 8 after assembly according to some embodiments of the present application. As shown in FIG.
  • the first limiting structure 232 and the second limiting structure 234 are arranged on opposite sides of the stent body 231 at intervals along the long axis direction, and the first limiting structure 232 and the second limiting structure 234 are arranged in an annular shape.
  • the projection on the reference plane where the open end of the peripheral wall 212 is located (the plane shown by the dashed rectangular frame in FIG. 15) is at least partially located outside the projection of the bracket body 231 on the reference plane. It is arranged in such a way that the first limiting structure 232 is matched with the positioning column 213, and the second limiting structure 234 is matched with the annular peripheral wall 212.
  • the first limiting structure 232 may include a first axial extension 2321 and a first radial extension 2322.
  • the first axial extension 2321 is connected to the stent body 231, and extends along the axial direction of the stent body 231 (the direction shown by the dashed line Z in FIG. 14) to the side where the movement 22 is located; the first radial direction
  • the extension portion 2322 is connected to the first axial extension portion 2321 and extends to the outside of the stent body 231 along the radial direction of the stent body 231 (that is, the direction of the diameter of the stent body 231 ).
  • the second limiting structure 234 may include a second axial extension portion 2341 and a second radial extension portion 2342.
  • the second axial extension portion 2341 is connected to the bracket body 231 and extends along the axial direction of the bracket body 231 toward the side where the core 22 is located;
  • the second radial extension portion 2342 is connected to the second axial extension portion 2341, and It extends to the outside of the stent main body 231 along the radial direction of the stent main body 231.
  • the second radial extension portion 2342 abuts the annular peripheral wall 212, as shown in FIGS. 13 and 15, for example, the two are clamped, so that the second limiting structure 234 abuts the annular peripheral wall 212.
  • the movement 22 is located between the first axial extension 2321 and the second axial extension 2341.
  • the annular peripheral wall 212 may further include an inclined area 214 corresponding to the first limiting structure 232 and arranged obliquely with respect to the bottom wall 211.
  • the positioning pillar 213 may be arranged on the inclined area 214.
  • the number of the second limiting structure 234 may be two arranged at intervals along the short axis direction.
  • the projections of the first limiting structure 232 on the reference plane and the projections of the two second limiting structures 234 on the reference plane are connected in sequence to form an acute triangle (as shown by the dashed triangle in FIG. 15).
  • the acute-angled triangle may specifically be an acute-angled isosceles triangle or an equilateral triangle. It is so arranged that the interaction points between the movement support 23 and the movement housing 21 are arranged as symmetrically as possible, thereby increasing the reliability of the assembly of the movement support 23 and the movement housing 21.
  • the outer contour of the stent body 231 may be arranged in a circular shape, and the annular peripheral wall 212 may be provided with two arc-shaped recessed areas 2121 opposite to each other along the short axis direction. Wherein, the outer contour of the bracket body 231 is embedded in two arc-shaped recessed areas 2121 respectively. With this arrangement, the degree of freedom between the movement support 23 and the movement housing 21 can be further restricted.
  • the earhook housing 31 is connected to the movement housing 21 to form the above-mentioned structure (A+B) Due to the difference in stiffness, the resonance frequency of the structure (A+B) may be lower (as shown by the curve (A+B) in Figure 12), and the above-mentioned sound leakage is also prone to occur; and the structure (A+B) After being improved to the structure (B+B), the resonant frequency of the structure can be effectively increased (as shown by the curve (B+B) in Figure 12). Based on this, this embodiment improves the related structure of the movement module 20.
  • FIG. 16 is a schematic diagram of an exploded structure of the movement module 20 in FIG. 1 according to some embodiments of the present application.
  • the movement module 20 may further include a cover plate 24.
  • one end of the movement casing 21 is open, and the cover plate 24 is provided on the open end of the movement casing 21 to form a cavity structure for accommodating the movement 22.
  • the cover plate 24 is disposed on the other end of the annular peripheral wall 212 away from the bottom wall 211 and is disposed opposite to the bottom wall 211.
  • the cover plate 24 and the movement housing 21 can be connected by glue connection or a combination of clamping and glue connection.
  • the earhook housing 31 is connected to the cover plate 24, for example, the earphone fixing portion 311 is covered on the side of the cover plate 24 away from the core housing 21 in a fully or half-covered manner.
  • the full coverage of the cover plate 24 by the earphone fixing portion 311 is taken as an example for illustration.
  • the ear hook housing 31 and the movement housing 21 can still be connected by glue connection or a combination of clamping and glue connection.
  • the ear hook shell shown in Figure 16 is to facilitate the description of the relative positional relationship between the ear hook shell and the cover plate, and then implicitly indicate a kind of relationship between the ear hook shell and the cover plate. Possible assembly methods.
  • the elastic modulus of the core housing 21 is greater than the elastic modulus of the earhook housing 31, and the elastic modulus of the cover plate 24 is greater than the elastic modulus of the earhook housing 31.
  • the cover plate 24 is used instead of the earphone fixing portion 311 to be connected to the movement housing 21, which helps increase the structure at the open end of the movement housing 21 (specifically, the cover plate 24 and the earphone fixing portion 311)
  • the rigidity in turn helps to reduce the difference between the rigidity of the bottom wall 211 of the movement housing 21 and the rigidity of the structure of its open end.
  • This arrangement not only ensures that the movement housing 21 has a sufficiently large rigidity so that its resonant frequency is located in the high-frequency region as high as possible, but also helps increase the structure (movement housing 21 + cover plate 24 + earphone fixing part 311 ) Resonant frequency, and help to improve the above-mentioned leakage sound.
  • the elastic modulus of the cover plate 24 may be less than or equal to the elastic modulus of the movement housing 21.
  • the elastic modulus of the cover plate 24 is equal to the elastic modulus of the movement case 21.
  • a structure similar to the above-mentioned structure (B+B) can be formed.
  • the ratio of the difference between the stiffness K1 of the bottom wall 211 and the stiffness K3 of the cover plate 24 to the stiffness K1 of the bottom wall 211 can be less than or equal to the second preset ratio threshold.
  • the second preset ratio threshold may be 10%. That is, (K1-K3)/K1 ⁇ 10%, or K3/K1 ⁇ 90%.
  • the area of the bottom wall 211 is less than or equal to the area of the cover plate 24, and the thickness of the bottom wall 211 is less than or equal to the thickness of the cover plate 24.
  • the thickness of the bottom wall 211 needs to be less than or equal to the thickness of the cover plate 24.
  • the material of the cover plate 24 may be the same as that of the core housing 21, for example, the material of the cover plate 24 is a mixture of polycarbonate, glass fiber and/or carbon fiber.
  • the ratio of the thickness and area of the cover plate 24 to the thickness of the bottom wall 211 is required.
  • the ratio of the ratio to the area is greater than or equal to 90%.
  • the ratio of the thickness to the area of the bottom wall 211 may be equal to the ratio of the thickness to the area of the cover plate 24.
  • the cover plate 24 replaces the earphone fixing portion 311 and is connected to the movement housing 21, the earphone fixing portion 311 still needs to be connected to the side of the cover 24 away from the movement housing 21, for example, the earphone fixing portion 311 The cover plate 24 is fully covered.
  • the two can be formed into an integral structural part by two-color injection molding. If the earhook shell 31 is a plastic part and the cover plate 24 is a metal part, and the elastic modulus of the former is smaller than the elastic modulus of the latter, the two can be molded into an integral structural part by means of a metal insert. At this time, the ear hook housing 31 and the cover plate 24 will be connected to the movement housing 21 as a whole. With this arrangement, the vibration consistency of the ear hook shell 31 and the cover plate 24 can be well ensured. However, it is also difficult to set the buttons mentioned above, the second microphone mentioned later, etc. between the earhook shell 31 and the cover plate 24.
  • the earphone fixing portion 311 and the cover 24 are connected by glue connection or a combination of snap connection and glue connection. At this time, between the earhook shell 31 and the cover plate 24 are also provided the keys mentioned above, the second microphone mentioned below, etc. The specific structure will be described in detail later.
  • the filling degree of the gel (not shown in FIG. 16) provided between the earphone fixing portion 311 and the cover 24 should be as large as possible, for example, the filling degree is greater than or equal to 90%. .
  • FIG. 17 is a schematic diagram of frequency response curves of a structure corresponding to different types of gels arranged between the ear hook assembly 30 and the cover plate 24 in FIG. 14 according to some embodiments of the present application.
  • different types of glue such as structural glue, hot melt glue, instant glue, silica gel, etc.
  • glue arranged between the earphone fixing portion 311 and the cover plate 24 also have a greater influence on the resonance frequency of the structure.
  • the movement holder 23 can be used to fix the movement 22 in the movement housing 21 to increase the reliability of the movement 22 with the vibration of the movement housing 21; on the other hand, the cover The plate 24 can be used to increase the rigidity of the structure at the open end of the movement housing 21 (specifically, the cover plate 24 and the earphone fixing portion 311), so as to reduce the rigidity of the bottom wall 211 of the movement housing 21 and the rigidity of the structure at the open end. The difference between.
  • FIG. 18 is a schematic cross-sectional view of the movement module 20 in FIG. 16 along the II-II direction after assembly according to some embodiments of the present application.
  • FIG. 19 is a schematic diagram of the structure of the cover plate 24 close to the core housing 21 in FIG. 16 according to some embodiments of the present application. As shown in FIGS. 18 and 19, the cover plate 24 is not only provided on the open end of the movement housing 21, but the side of the cover plate 24 facing the movement housing 21 is also provided with a pressing structure. Wherein, the pressing structure is used to press and fix the movement support 23 in the movement housing 21.
  • the cover plate 24 can not only increase the rigidity of the structure at the open end of the movement housing 21 (specifically, the cover plate 24 and the earphone fixing portion 311), but also can press the movement support 23 into the movement housing 21 , which in turn enables the cover plate 24 to achieve "one-piece dual-purpose".
  • the cover plate 24 may include a cover plate main body 241 and a pressing structure integrally connected with the cover plate main body 241.
  • the pressing structure may include a first pressing column 242 and a second pressing column 243.
  • the first pressing column 242 and the second pressing column 243 are arranged at intervals along the circumference of the cover main body 241 and are connected to the movement support. 23 formed abutment.
  • the plane where the cover main body 241 is located can be parallel to the plane where the bottom wall 211 is located, so that the plane where the cover main body 241 is located can be parallel to the plane where the support main body 231 is located, so that the first pressing post 242 and
  • the extension direction of the second pressing column 243 may be perpendicular to the plane where the support body 231 is located, that is, the extension directions of the first pressing column 242 and the second pressing column 243 may both be parallel to the aforementioned Z direction.
  • This arrangement can effectively limit the degree of freedom between the movement support 23 and the movement housing 21, especially in the aforementioned Z direction.
  • FIG. 20 is a schematic top view of the structure of the cover plate in FIG. 19 according to some embodiments of the present application.
  • the cover plate 24 may have a long axis direction (the direction shown by the chain line X in FIG. 20) and a short axis direction (the direction shown by the chain line Y in FIG. 20).
  • the size of the cover plate 24 along the long axis direction may be larger than the size along the short axis direction.
  • the first pressing column 242 and the second pressing column 243 are spaced apart along the long axis direction. This arrangement increases the reliability of the cover plate 24 pressing the movement support 23 in the movement housing 21.
  • the number of the second pressing posts 243 may be two arranged at intervals along the short axis direction.
  • the projection of the first pressing column 242 on the cover body 241 and the projection of the two second pressing columns 243 on the cover body 241 are connected in sequence to form an acute triangle (as shown by the dashed triangle in FIG. 20) .
  • the acute-angled triangle may specifically be an acute-angled isosceles triangle or an equilateral triangle. This arrangement makes the interaction points between the cover 24 and the movement support 23 as symmetrically arranged as possible, thereby increasing the reliability of the cover 24 pressing the movement support 23 in the movement housing 21.
  • the first pressing column 242 contacts and forms abutment with the first limiting structure 232
  • the second pressing column 243 contacts and forms abutment with the second limiting structure 234.
  • the second limiting structure 232 and the annular peripheral wall 212 may not form an abutting and fitting relationship as shown in FIG. 13, so as to reduce the processing accuracy of the second limiting structure 232, thereby saving the manufacturing cost of the movement support 23 .
  • the first limiting structure 232 may include a first axial extension 2321 and a first radial extension 2322.
  • the first axial extension 2321 is connected to the stent body 231, and extends along the axial direction of the stent body 231 (the direction shown by the dashed line Z in FIG. 14) to the side where the movement 22 is located; the first radial direction
  • the extension portion 2322 is connected to the first axial extension portion 2321 and extends to the outside of the stent body 231 along the radial direction of the stent body 231 (that is, the direction of the diameter of the stent body 231 ).
  • the insertion hole 233 is provided on the first radial extension 2321, and the first pressing post 242 abuts against the first radial extension 2321, that is, the first pressing post 242 presses the first radial extension 2321.
  • the second limiting structure 234 may include a second axial extension portion 2341 and a second radial extension portion 2342.
  • the second axial extension portion 2341 is connected to the bracket body 231 and extends along the axial direction of the bracket body 231 toward the side where the core 22 is located; the second radial extension portion 2342 is connected to the second axial extension portion 2341, and It extends to the outside of the stent main body 231 along the radial direction of the stent main body 231.
  • the second pressing column 243 abuts against the second radial extension 2342, that is, the two contact and form a pressing force.
  • the number of the second pressing columns 243 is two arranged at intervals along the short axis direction, and the projection of the first pressing columns 242 on the cover body 241 and the two second pressing columns 243 are When the projections on the cover body 241 are connected in sequence to form an acute triangle, the number of the second limiting structures 234 may also be two spaced along the short axis direction, and respectively corresponding to the second pressing columns 243.
  • the first pressing column 242 abuts against the first limiting structure 232 (specifically, it may be the first radial extension 2322), the two second pressing columns 243 can respectively abut against the second limiting structure 232.
  • the position structure 234 (specifically may be the second radial extension portion 2342), thereby increasing the reliability of the cover plate 24 pressing the movement support 23 in the movement housing 21.
  • the first pressing column 242 and the second pressing column 243 also Extend toward the direction close to the movement housing 21, so that the height of the first limiting structure 232 and the second limiting structure 234 relative to the bracket body 231, the first pressing column 242 and the second pressing column 243 relative to the cover plate
  • the height of the main body 241 may be half of the distance between the cover main body 241 and the support main body 231.
  • This arrangement prevents the first limiting structure 232 and the second limiting structure 234 from being broken or falling off due to their excessive height relative to the bracket body 231 when the bone conduction earphone 10 falls, crashes, and other extreme conditions. ; Or, avoid the first and second compression columns 242 and 243 due to their excessive height relative to the cover main body 241, and the bone conduction earphone 10 may break or fall off when the bone conduction earphone 10 falls or crashes. Therefore, the structural strength of the first limiting structure 232 and the second limiting structure 234 on the support main body 231 and the structural strength of the first pressing column 242 and the second pressing column 243 on the cover main body 241 are taken into consideration.
  • the first pressing column 242 is in a tubular shape.
  • the positioning post 213 is not only inserted into the insertion hole 233 to increase the accuracy of assembly between the movement support 23 and the movement housing 21; it is also further inserted into the first pressing force. Inside the column 242 to increase the accuracy of the assembly between the cover plate 24 and the movement housing 21.
  • FIG. 21 is an exploded structural diagram of the movement module in FIG. 16 from another perspective according to some embodiments of the present application.
  • the movement module 20 may further include a first microphone 25 and a second microphone 26.
  • the two form a cavity structure for accommodating the movement 22.
  • the first microphone 25 can be accommodated in the movement casing 21, and the second microphone 26 can be arranged outside the movement casing 21, so that the cover plate 24 separates the first microphone 25 from the second microphone 26, and then Avoid interference between the two (especially the back sound cavity of the two).
  • the cover plate 24 can not only increase the rigidity of the structure at the open end of the movement housing 21 (specifically, the cover plate 24 and the earphone fixing portion 311), but can also press the movement support 23 into the movement housing 21 It is also possible to separate the first microphone 25 from the second microphone 26, so that the cover plate 24 can realize "one piece and three functions". Further, when the earhook housing 31 is covered on the cover plate 24, that is, when the earphone fixing portion 311 is covered on the side of the cover plate 24 away from the core housing 21, the second microphone 26 may be provided on the cover plate. 24 and the earphone fixing part 311.
  • both the first microphone 25 and the second microphone 26 can be connected to the main control circuit board 50, so that the sound can be processed and transmitted to the main control circuit board 50 by both.
  • the first microphone 25 and the second microphone 26 can be any one or a combination of electric, capacitive, piezoelectric, carbon particle, semiconductor, etc. types, and specifically can be electret pickups or silicon.
  • the specific structure of the microphone is within the understanding of those skilled in the art, and will not be described in detail here.
  • the first microphone 25 and the second microphone 26 can be used to pick up the sound of the wearer’s environment, so that the bone conduction earphone 10 can perform noise reduction processing, thereby improving the user’s favorability of the bone conduction earphone 10;
  • the voice of the wearer allows the bone conduction earphone 10 to realize the speaker function while also realizing the microphone function, thereby expanding the application range of the bone conduction earphone 10.
  • the first microphone 25 and the second microphone 26 can also pick up the voice of the wearer and the sound of the environment at the same time, so that while the bone conduction earphone 10 realizes the microphone function, it can also perform noise reduction processing to improve the bone conduction earphone.
  • an annular flange 215 is provided on the inner side of the annular peripheral wall 212, and the first microphone 25 can be embedded and fixed in the annular flange 215.
  • the cover 24 (specifically, the cover main body 241) is recessed with a microphone accommodating groove 244 on the side facing away from the core housing 21.
  • the second microphone 26 may be arranged in the microphone accommodating groove 244 and is secured by the earphone fixing portion 311. Covering to reduce the overall thickness after the second microphone 26 is arranged between the cover 24 and the earphone fixing portion 311, thereby increasing the structural feasibility and reliability of the three.
  • the first microphone 25 is fixed on the annular peripheral wall 212 and the second microphone 26 is fixed on the cover 24.
  • a sound pickup hole is generally opened on the annular wall 212 at a position corresponding to the first microphone 25 (as shown in the figure).
  • the position of the earphone fixing portion 311 corresponding to the second microphone 26 is generally provided with a pickup hole (not marked in the figure).
  • the sound input direction of the first microphone 25 may be parallel to the cover plate 24 or inclined relative to the cover plate 24, and the sound input direction of the second microphone 26 may be perpendicular to the cover plate 24.
  • the sound input direction of the first microphone 25 is perpendicular to the annular peripheral wall 212.
  • the plane where the cover plate 24 (specifically, the cover plate body 241) is located can be parallel to the plane where the bottom wall 211 is located, and the annular peripheral wall 212 can be perpendicular to the bottom wall 211, or can be opposite to the bottom wall 211.
  • Externally inclined by an angle (for example, the inclination angle is less than or equal to 30°). Therefore, when the annular peripheral wall 212 is perpendicular to the bottom wall 211, the sound input direction of the first microphone 25 is parallel to the cover 24;
  • the sound direction is inclined with respect to the cover 24, and the inclination angles of the two may be substantially equal.
  • the projection of the second microphone 26 on the cover 24 and the projection of the first microphone 25 on the cover 24 may be staggered from each other. With this configuration, the first microphone 25 and the second microphone 26 can pick up sounds from different directions, so as to increase the noise reduction effect and/or microphone effect of the bone conduction earphone 10, thereby improving the user's favorability of the bone conduction earphone 10.
  • the projection of the second microphone 26 on the cover plate 24 can be arranged closer to the bending transition portion 312 than the projection of the first microphone 25 on the cover plate 24. This arrangement increases the relative distance between the first microphone 25 and the second microphone 26, and further makes the first microphone 25 and the second microphone 26 pick up sounds from different directions. In some embodiments, the larger the relative distance, the better.
  • the first microphone 25 and the second microphone 26 are respectively located on opposite sides of the cover plate 24, and the first microphone 25 is located on the back of the cover plate 24, so that the first microphone 25
  • the projection on the cover plate 24 is actually invisible. Therefore, in order to facilitate the corresponding description, it is simply considered that the first microphone 25 and the second microphone 26 are located on the same side of the cover plate 24, and the projection of the first microphone 25 on the cover plate 24 is replaced by a dashed frame.
  • FIG. 22 is a schematic top view of the structure of the cover plate in FIG. 21 according to some embodiments of the present application.
  • the cover plate 24 may have a long axis direction (the direction shown by the dashed line X in FIG. 22) and a short axis direction (the direction shown by the dashed line Y in FIG. 22).
  • the size of the cover plate 24 along the long axis direction may be larger than the size along the short axis direction.
  • the angle between the line between the projection of the second microphone 26 on the cover 24 and the projection of the first microphone 25 on the cover 24 (the dotted line as shown in FIG. 22) and the long axis direction Less than 45°.
  • the included angle is less than or equal to 10°.
  • the connection line between the projection of the second microphone 26 on the cover 24 and the projection of the first microphone 25 on the cover 24 coincides with the long axis direction.
  • the projection of the second microphone 26 on the cover 24 and the projection of the first microphone 25 on the cover 24 can be staggered, and the relative distance between the two can be increased, thereby making the first microphone 25 And the second microphone 26 can further pick up sounds from different directions.
  • the projection of the second microphone 26 on the cover plate 24 can be arranged closer to the bending transition portion 312 than the projection of the first microphone 25 on the cover plate 24.
  • the movement 22 and the first microphone 25 can be arranged in the movement housing 21, and the cover plate 24 can be arranged on the open end of the movement housing 21.
  • the cover plate Corresponding through holes and grooves can be opened on 24.
  • the cover plate 24 is also provided with a threading hole 245.
  • the projection of the second microphone 26 on the cover 24 can be arranged closer to the bending transition portion 312 than the projection of the first microphone 25 on the cover 24, so that the threading hole 245 can be arranged close to the first microphone 25. It is so arranged to allow the wire connecting the first microphone 25 and the main control circuit board 50 (not shown in FIGS.
  • the side of the cover plate 24 facing away from the core housing 21 may also be recessed with a wiring groove 246. Wherein, one end of the wiring groove 246 is connected to the threading hole 245, and the above-mentioned wire may further extend along the wiring groove 146.
  • This arrangement reduces the overall thickness after a part of the wires are arranged between the cover plate 24 and the earphone fixing portion 311, thereby increasing the feasibility and reliability of the three structures.
  • glue can also be dispensed at least at both ends of the wire grooves 246, so that the wires and the cover plate 24 are relatively fixed. , Thereby increasing the structural compactness of the cover 24, the earphone fixing portion 311, and the wires. Among them, especially the dispensing at the threading hole 245 can also improve the air tightness of the movement module 20.
  • two cable management grooves 216 may be arranged side by side on the inner side of the annular peripheral wall 212, and the two cable management grooves 216 may be close to the annular flange 215.
  • the two solder joints formed between the positive and negative external wires (not shown in FIG. 21) and the positive and negative terminals of the movement 22 (not shown in FIG. 21) are accommodated in two cable management grooves 216. .
  • This arrangement avoids short-circuit and other undesirable phenomena when the positive and negative terminals of the movement 22 are welded to the positive and negative electrodes of the wires mentioned above, thereby increasing the reliability of the movement of the movement 22.
  • the side of the cover plate 24 away from the core housing 21 may also be provided with a button accommodating groove (visible in FIG. 1, but Not marked).
  • the button 36 is arranged in the button accommodating groove and is covered by the earphone fixing portion 311. This arrangement reduces the overall thickness after the button 36 is arranged between the cover plate 24 and the earphone fixing portion 311, thereby increasing the feasibility and reliability of the three structures.
  • the key accommodating groove is similar to the microphone accommodating groove 244 described above.
  • both the first microphone 25 and the second microphone 26 may specifically correspond to the ear hook assembly 30 shown in FIG.
  • the button 36 may specifically correspond to the ear hook assembly 30 shown in FIG. 4.
  • the button 36 corresponds to the left earhook of the bone conduction earphone 10
  • the first microphone 25 and the second microphone 26 can correspond to the right earhook of the bone conduction earphone 10; on the contrary, if the button 36 corresponds to the bone conduction earphone 10 10 right ear hook, the first microphone 25 and the second microphone 26 can correspond to the left ear hook of the bone conduction earphone 10.
  • the first microphone 25 and the second microphone 26 can correspond to the left ear hook of the bone conduction earphone 10.
  • the first microphone 25 and the second microphone 26 may need to be adjusted accordingly.
  • the bone conduction earphone 10 only has a first microphone 25 or a second microphone 26; or, the bone conduction earphone 10 still has a first microphone 25 and a second microphone 26, and the first microphone 25 and the second microphone 26
  • the button 36 is specifically fixed on the side of the earphone fixing portion 311 close to the core housing 21.
  • FIG. 23 is a schematic diagram of the principle of a movement according to some embodiments of the present application.
  • the movement 22 may include a magnetic conductive cover 221, a magnet 222, a magnetic conductive plate 223 and a coil 224.
  • the magnetic conductive cover 221 may include a bottom plate 2211 and an annular side plate 2212 integrally connected with the bottom plate 2211.
  • the magnet 222 may be arranged in the annular side plate 2212 and fixed on the bottom plate 2211, and the magnetic conductive plate 223 may be fixed on the side of the magnet 222 away from the bottom plate 2211.
  • the coil 224 can be arranged in the magnetic gap 225 between the magnet 222 and the annular side plate 2212 and can be fixed on the movement support 23.
  • the magnetic gap between the magnet 222 and the annular side plate 2212 may be m, and m may be greater than or equal to the first gap and less than or equal to the second gap, so as to balance the movement requirements of the coil 224 and the compactness of the movement 22 sex.
  • m may be greater than or equal to the first gap and less than or equal to the second gap, so as to balance the movement requirements of the coil 224 and the compactness of the movement 22 sex.
  • the movement shown in FIG. 23 can be applied to either the movement module shown in FIG. 8 or the movement module shown in FIG. 16.
  • the movement support shown in FIG. 23 is to facilitate the description of the relative positional relationship between the movement support and the movement, and then implicitly illustrates a possible assembly method between the movement support and the movement.
  • the magnet 222 may include a metal alloy magnet, ferrite, or the like.
  • the metal alloy magnet may include any one or a combination of neodymium iron boron, samarium cobalt, aluminum nickel cobalt, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, etc.
  • the ferrite may include barium ferrite, Any one or a combination of steel ferrite, manganese ferrite, lithium manganese ferrite, etc.
  • the magnet 222 has a magnetization direction so as to form a relatively stable magnetic field.
  • the magnetic conductive cover 221 and the magnetic conductive plate 223 cooperate with each other to adjust the magnetic field generated by the magnet 222 so as to increase the utilization rate of the magnetic field.
  • the magnetic shield 221 and the magnetic conductive plate 223 can be made of soft magnetic materials such as metal materials, metal alloys, metal oxide materials, and amorphous metal materials.
  • the aforementioned soft magnetic materials may include iron, iron-silicon alloys, iron-aluminum alloys, nickel-iron alloys, iron-cobalt alloys, low carbon steel, silicon steel sheets, silicon steel sheets, ferrites, and the like.
  • the coil 224 is in the magnetic field formed by the magnet 222, the magnetic shield 221 and the magnetic conductive plate 223, and under the excitation of the electrical signal, it is subjected to ampere force.
  • the coil 224 is driven by the ampere force to cause the movement 22 to generate mechanical vibration, and the movement 22 can be fixed in the movement housing 21 through the movement support 23 so that the movement housing 21 can vibrate together.
  • the resistance of the coil 224 may be a preset resistance value, such as 8 ⁇ , so as to take into account the ampere force generation requirement and the circuit structure of the movement 22.
  • the volume of the core housing 21 is often limited, and at least structural components such as the core 22, the core holder 23, and the first microphone 25 need to be accommodated.
  • the movement 22 for example, increasing the volume of the magnet 222 and/or increasing the number of turns of the coil 224
  • a larger ampere force can be obtained, thereby better driving the core housing 21; but this will also Increasing the weight and volume of the movement module 20 is not conducive to the lightness of the movement module 20.
  • the parameters B and L are often relatively determined values, and the parameter I changes with the change of the electrical signal input into the movement 22. Therefore, the optimized design of the movement 22 can be simply regarded as the optimized design of the force coefficient BL; and the parameters B and L can depend on the shape and size of the magnet 222, the magnetic cover 221, and the magnetic plate 223, etc. Structural parameters.
  • FIG. 24 is a schematic diagram of the relationship between the force coefficient BL of the magnet in FIG. 23 according to some embodiments of the present application.
  • the abscissa is the diameter ⁇ of the magnet 222
  • the ordinate is the thickness t1 of the magnet 222. It can be concluded from Fig. 24 that the larger the diameter ⁇ of the magnet 222, the larger the value of the force coefficient BL; the larger the thickness t1 of the magnet 222, the larger the value of the force coefficient BL.
  • the value of the force coefficient BL is greater than the force coefficient. Threshold.
  • the force coefficient threshold may be 1.3.
  • the diameter ⁇ of the magnet 222 may be greater than or equal to the first diameter and less than or equal to the second diameter. For example, 10.5mm ⁇ 11.5mm. For another example, the diameter ⁇ of the magnet 222 may be 10.8 mm.
  • the thickness t1 of the magnet 222 may be greater than or equal to the first thickness and less than or equal to the second thickness.
  • the thickness t1 can be 3.5 mm.
  • FIG. 25 is a schematic diagram showing the relationship between the thickness of the magnetic conductive cover and the magnetic conductive plate in FIG. 23 to the force coefficient BL according to some embodiments of the present application. As shown in FIG. 25, the abscissa is the thickness t2 of the magnetic conductive cover 221, and the ordinate is the force coefficient BL.
  • the thickness t2 of the magnetic conductive plate 223 and/or the magnetic conductive cover 221 can be greater than or equal to The third thickness is less than or equal to the fourth thickness.
  • the thickness t2 may be 0.5 mm.
  • FIG. 26 is a schematic diagram showing the relationship between the height of the magnetic conductive cover in FIG. 23 and the force coefficient BL according to some embodiments of the present application. As shown in FIG. 26, the abscissa is the height h of the magnetic conductive cover 221 (specifically, the annular side plate 2212), and the ordinate is the force coefficient BL.
  • the height h of the magnetic conductive cover 221 can be greater than or equal to the first height and less than or equal to the first height. Two height. For example, 3.4mm ⁇ h ⁇ 4.0mm. For another example, the height h of the magnetic conductive cover 221 may be 3.7 mm.
  • the bone conduction earphone 10 may include two movement modules 20.
  • any one of the two movement modules 20 may correspond to the movement module shown in FIG. 8, and the other may correspond to the movement module shown in FIG. 16.
  • the specific structure of each movement module 20 may be the same as or similar to any of the foregoing embodiments, and reference may be made to the detailed description of any of the foregoing embodiments, which will not be repeated here.
  • the number of movement modules 20 may not be limited to two.
  • the bone conduction earphone 10 may be provided with three or more movement modules 20.
  • the bone conduction headset 10 may also be provided with only one movement module 20.
  • the earphone may also include an air conduction earphone (for example, a monaural air conduction earphone) provided with a movement module 20, and the air conduction earphone may be hung by a fixed component (for example, an ear hook component).
  • a fixed component for example, an ear hook component
  • the magnet 222 may also be configured to cause the movement module 20 to be adsorbed on a magnetic object.
  • the magnet 222 may be arranged close to the bottom wall 211 of the core housing 21 so that the core module 20 can have magnetism on the side close to the bottom wall 211 so as to be attracted to the magnetic object through the side of the bottom wall 211.
  • the magnetic object includes a metal product (for example, a bracket) that can be adsorbed by the magnet 222, a mobile device (for example, a mobile phone), a charging device (for example, a magnetic charging device), and another movement module (for example, as shown in FIG. 27).
  • the illustrated two movement modules 20) that are mutually adsorbed, etc., or any combination thereof.
  • a magnetic joint may be provided on the bottom wall 211 of the core housing 21.
  • the magnetic suction connector and the corresponding power interface of the charger form a system, and the two are structurally matched with each other so that they can be adsorbed together, and then an electrical connection is established to charge the earphone.
  • the magnet 222 can be arranged on the inner side of the bottom wall 211 as a part of the magnetic coupling (ie the side of the bottom wall 211 away from the user's head), so that the magnetic coupling can be adsorbed on the power interface of the charging device .
  • the outer side of the bottom wall 211 (that is, the side of the bottom wall 211 facing the user's head) may be provided with a charging terminal, one side of the charging terminal may be electrically connected to the power interface of the charging device, and the other side may be connected to the battery 60 is connected (for example, through a wire), so as to cooperate with the power interface to charge the earphone.
  • the charging terminal may be omitted, and the earphone may be directly attached to the charging device through the magnet 222 for wireless charging.
  • Exemplary wireless charging methods may include electromagnetic induction wireless charging, magnetic resonance wireless charging, radio wave wireless charging, solar charging, etc., or any combination thereof.
  • the charging device may include a fixed charging device, a mobile charging device, and the like.
  • the bone conduction earphone 10 may include two movement modules 20.
  • the magnet 222 may be configured to enable the two movement modules 20 to attract each other.
  • Fig. 27 is a schematic diagram of the state of the bone conduction earphone shown in Fig. 1 in a non-wearing state according to some embodiments of the present application. As shown in FIG. 27, the magnets 222 of the two core modules 20 have different polarities on the side close to the bottom wall 211 of the core housing 21 where they are located, so that when the bone conduction earphone 10 is in a non-wearing state, The two movement modules 20 can absorb each other. It is set in this way to facilitate the user to store the bone conduction earphone 10.
  • the magnet 222 is also used to form a magnetic field, so that the coil 224 can vibrate under the excitation of an electrical signal.
  • the vibration of the coil 224 can be transmitted to the auditory nerve of the human ear through bone conduction and/or air conduction, so that the human can hear the sound.
  • the magnet 222 can realize "one piece and dual purpose".
  • the magnet 222 before the assembly of the movement module 20, the magnet 222 may not be pre-magnetized; instead, after the assembly of the movement module 20, the movement module 20 is placed in the magnetizing equipment as a whole The magnetization process is performed to make the magnet 222 magnetic.
  • the magnetic field directions of the magnets 222 of the two movement modules 20 can be as shown in FIG. 27.
  • FIG. 28 is a schematic cross-sectional structure view of the rear suspension assembly 40 in FIG. 1 along the direction III-III according to some embodiments of the present application.
  • the rear suspension assembly 40 may include an elastic metal wire 41, a wire 42, and an elastic covering body 43 covering the elastic metal wire 41 and the wire 42.
  • the elastic covering body 43 and the wire 42 are an integral structural member formed by extrusion molding; the covering body 43 is further formed with a threading channel (not marked in FIG. 28), and the elastic metal wire 41 is threaded through the threading channel.
  • the threading channel is formed during the extrusion molding process.
  • the material of the elastic metal wire 41 may include spring steel, titanium alloy, titanium nickel alloy, chromium molybdenum steel, etc.
  • the material of the elastic coating body 43 may include polycarbonate, polyamide, silicone, rubber, etc., So that the rear suspension assembly 40 takes into account both the comfort of wearing and the rigidity of the structure.
  • the area where the elastic metal wire 41 is located in FIG. 28 can be simply regarded as the threading channel in the covering body 43.
  • the diameter of the threading channel in the natural state may be smaller than the diameter of the elastic metal wire 41, so that the elastic metal wire 41 can be fixed with the elastic covering body 43 after being inserted into the threading channel, so as to prevent the rear suspension assembly 40 from being elastic.
  • the gap between the covering body 43 and the elastic metal wire 41 is too large to cause "sagging", especially when the user presses the rear suspension assembly 40, thereby increasing the structural compactness of the rear suspension assembly 40 .
  • the number of wires 42 may be at least two strands.
  • each strand of wire 42 may include a metal wire and an insulating layer covering the metal wire (none of which is shown in FIG. 28), and the insulating layer is used to achieve electrical insulation between the metal wires.
  • the main control circuit board 50 and the battery 60 can be respectively disposed in the two ear hook assemblies 30, and FIG. 2 and FIG.
  • the ear hook assembly 30 shown in 4 can respectively correspond to the left ear hook and the right ear hook of the bone conduction earphone 10, so that not only the main control circuit board 50 and the battery 60 need to be connected via the wire 42 built in the rear hook assembly 40, but also corresponding
  • the movement module 20 specifically, the movement 22
  • the buttons 36 of the ear hook assembly 30 in FIG. 1 (left) need to be further connected to the wires 42 built into the rear suspension assembly 40 and correspond to those shown in FIG.
  • the main control circuit board 50 of the earhook assembly 30 is connected, which corresponds to the movement module 20 of the earhook assembly 30 in FIG. 1 (on the right) (specifically, the movement 22, the first microphone 25 and the second microphone 26) It is also necessary to further connect the battery 60 corresponding to the earhook assembly 30 in FIG. 1 (left) via the wire 42 built in the rear hanger assembly 40. Therefore, the wire 42 needs to realize the connection of the above-mentioned three circuits at least.
  • Fig. 29 is an exemplary flowchart of a method for processing a rear suspension assembly according to some embodiments of the present application. Based on the above detailed description, the rear suspension assembly 40 of the embodiment of the present application can be manufactured according to the following process flow 2900.
  • step S2910 an extrusion molding equipment and wires are provided.
  • raw materials for molding the elastic covering body 43 can be added to the extrusion molding equipment.
  • the raw material of the elastic covering body 43 at least undergoes the stages of melt plasticization, die extrusion, shaping, cooling, and traction.
  • the number of wires 42 may be at least two strands, so as to realize the connection between the various electronic components in the bone conduction earphone 10.
  • each strand of wire 42 may include a metal wire and an insulating layer covering the metal wire to facilitate electrical insulation between the metal wires.
  • step S2920 the wire is placed in the extrusion molding equipment, so that the raw material of the elastic covering body and the wire can obtain the corresponding first semi-finished product during the extrusion molding process.
  • the extrusion molding equipment can pull the wire 42 to enable the elastic covering body 43 to cover the wire 42 during the extrusion molding process.
  • the die part of the extrusion molding device may be provided with a core, so that during the extrusion molding process, the inside of the elastic covering body 43 can simultaneously form the above-mentioned threading channel. Therefore, the above-mentioned first semi-finished product may specifically be an integral structure of the elastic covering body 43 and the wire 42, and the covering body 43 has a threading channel extending substantially along the axial direction thereof.
  • step S2930 according to the use requirements of the rear suspension assembly, the above-mentioned first semi-finished product is further cut into a second semi-finished product having a corresponding length.
  • the actual length of the second semi-finished product may be slightly larger than its use length for the rear suspension assembly, that is, the second semi-finished product still has a certain margin at this time to facilitate subsequent processing procedures.
  • step S2940 the elastic metal wire is threaded into the threading channel of the second semi-finished product to produce a back-hanging assembly.
  • the rear suspension assembly produced in step S2940 is essentially only a semi-finished product.
  • a long semi-finished product (specifically, an integrated structure of the elastic covering body 43 and the wire 42) be produced at one time with the aid of the extrusion molding process, and the inside of the covering body 43 can also be combined with this.
  • a threading channel extending substantially along its axis is formed, and then the semi-finished product is cut into small sections of corresponding length for subsequent processing, so that the production efficiency of the rear suspension assembly can be effectively improved.
  • the possible beneficial effects brought by the embodiments of the present application include but are not limited to: (1)
  • the decorative element has the functions of shielding wires, shielding keys, and triggering the keys while decorating the earhook shell, so as to realize the "one piece of four functions" of the decorative element. "; (2)
  • the magnet is designed so that when the earphone is not worn, the movement modules can absorb each other, which is convenient for users to store; (3)
  • the shape and size of the magnet and related components are set reasonably to take into account the vibration of the movement module Voice and lightweight requirements.
  • the possible beneficial effects may be any one or a combination of the above, or any other beneficial effects that may be obtained.
  • this application uses specific words to describe the embodiments of the application.
  • “one embodiment”, “an embodiment” and/or “some embodiments” mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that “an embodiment” or “an embodiment” or “an alternative embodiment” mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. .
  • some features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined.
  • numbers describing the number of ingredients and attributes are used. It should be understood that such numbers used in the description of the embodiments use the modifiers "about”, “approximately” or “substantially” in some examples. To modify. Unless otherwise stated, “approximately”, “approximately” or “substantially” indicates that the number is allowed to vary by ⁇ 20%.
  • the numerical data used in the specification and claims are approximate values, and the approximate values can be changed according to the required characteristics of individual embodiments. In some embodiments, the numerical data should consider the prescribed effective digits and adopt the method of general digit retention. Although the numerical range and data used to confirm the breadth of the range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values is as accurate as possible within the feasible range.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
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  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Headphones And Earphones (AREA)

Abstract

本申请提供一种耳机，所述耳机可以包括机芯模组。所述机芯模组可以包括机芯壳体和机芯。其中，所述机芯壳体可以包括底壁和环形周壁。当用户佩戴所述耳机时，所述底壁可以面向所述用户的头部，所述环形周壁的一端可以与所述底壁一体连接，所述环形周壁远离所述底壁的一端开口，所述机芯可以通过所述开口设置在所述机芯壳体中。所述机芯可以包括磁体，所述磁体可以被配置为使所述机芯模组通过所述底壁的一侧吸附在磁性物体上。

Description

一种耳机
交叉引用
本申请要求2020年4月30日提交的中国专利申请202020720094.0的优先权，2020年4月30日提交的中国专利申请202020720106.X的优先权，以及2020年4月30日提交的中国专利申请202010367108.X的优先权，其全部内容通过引用并入本文。
技术领域
本申请涉及声学领域，具体是涉及一种耳机。
背景技术
随着声学输出技术的发展，例如耳机等的声学输出装置得到了非常广泛的应用。与传统的入耳式、耳罩式耳机相比，开放双耳式耳机具有不堵塞、不覆盖耳道的特点，是一种在特定范围内实现声传导的便携式音频输出设备。以骨传导耳机为例，骨传导是一种声音传导方式，即将电信号转化为机械振动，并将机械振动通过人的颅骨、骨迷路、内耳淋巴液、螺旋器、听精神、大脑皮层听觉中枢来这一途径实现声波的传递。骨传导耳机利用骨传导技术受话，紧贴头骨，声波可直接通过骨头传至听神经，而无需经过外耳道和耳膜，能够“解放”双耳。
发明内容
本申请实施例之一提供一种耳机，所述耳机可以包括机芯模组。所述机芯模组可以包括机芯壳体和机芯。其中，所述机芯壳体可以包括底壁和环形周壁。当用户佩戴所述耳机时，所述底壁可以面向所述用户的头部，所述环形周壁的一端可以与所述底壁一体连接，所述环形周壁远离所述底壁的一端开口，所述机芯可以通过所述开口设置在所述机芯壳体中。所述机芯可以包括磁体，所述磁体可以被配置为使所述机芯模组通过所述底壁的一侧吸附在磁性物体上。
在一些实施例中，所述磁体可以为圆柱体，所述磁体的直径可以大于等于第一直径且小于等于第二直径，以及所述磁体的厚度可以大于等于第一厚度且小于等于第二厚度。
在一些实施例中，所述磁体的直径可以为10.8mm，所述磁体的厚度可以为3.5mm。
在一些实施例中，所述机芯还可以包括导磁罩、导磁板以及线圈。所述导磁罩可以包括底板和与所述底板一体连接的环形侧板，所述磁体设置在所述环形侧板内并固定在所述底板上。所述导磁板可以固定在所述磁体背离所述底板的一侧。以及，所述线圈可以设置在所述磁体与所述环形侧板之间的磁间隙内。
在一些实施例中，所述导磁板的直径可以与所述磁体的直径相等，所述导磁板的厚度可以与所述导磁罩的厚度相等。
在一些实施例中，所述导磁罩的厚度可以大于等于第三厚度且小于等于第四厚度。
在一些实施例中，所述导磁罩的厚度可以为0.5mm。
在一些实施例中，所述环形侧板的高度可以大于等于第一高度且小于等于第二高度。
在一些实施例中，所述环形侧板的高度可以为3.7mm。
在一些实施例中，所述机芯模组还可以包括机芯支架。所述机芯支架可以设置在所述机芯壳体内，所述线圈可以固定在所述机芯支架上。
在一些实施例中，所述磁体与所述环形侧板之间的磁间隙可以大于等于第一间隙且小于等于第二间隙。
在一些实施例中，所述耳机还可以包括耳挂组件，所述耳挂组件的一端可以与所述机芯模组连接。
在一些实施例中，所述耳挂组件可以包括耳挂壳体。所述耳挂壳体可以包括容置仓、固定部以及弯折过渡部。所述容置仓可以用于容纳电池或主控电路板。所述固定部可以盖设在所述机芯壳体的开口端上，以形成用于容纳所述机芯的腔体，以及，所述弯折过渡部可以连接所述容置仓和所述固定部，并呈弯折状设置以挂设于人耳外侧。
在一些实施例中，所述机芯壳体的弹性模量可以大于所述耳挂壳体的弹性模量。
在一些实施例中，所述固定部可以设置有补强结构，所述补强结构可以使所述底壁的刚度与所述固定部的刚度的差值与所述底壁的刚度之间的比值小于或等于预设比例阈值。
在一些实施例中，所述补强结构可以包括设置在所述固定部上的加强筋。
在一些实施例中，所述补强结构可以包括金属制件。其中，所述补强结构与所述耳机固 定部可以为金属嵌件注塑一体成型结构件。
在一些实施例中，所述机芯模组还可以包括盖板。所述盖板可以盖设在所述机芯壳体的所述环形周壁的开口上，所述固定部可以盖设在所述盖板背离所述机芯壳体的一侧。
在一些实施例中，所述盖板的弹性模量可以大于所述耳挂壳体的弹性模量。
在一些实施例中，所述盖板的弹性模量可以小于或等于所述机芯壳体的弹性模量。
在一些实施例中，所述耳挂组件还可以包括装饰支架。其中，所述弯折过渡部上可以设有第一凹槽。所述装饰支架可以嵌入并固定在所述第一凹槽内，以形成走线通道，进而允许导线从所述机芯模组内经所述走线通道延伸至所述容置仓内。
在一些实施例中，所述耳机固定部可以设有按键适配孔，所述按键适配孔可以与所述第一凹槽的一端连通。以及，所述耳挂组件还可以包括按键。所述按键可以设置在所述耳挂壳体背离所述装饰支架的另一侧，并经所述按键适配孔外露。
在一些实施例中，所述装饰支架可以以悬臂形式延伸至经所述按键适配孔外露的所述按键的上方，并能够在外力按压下触发所述按键。
在一些实施例中，所述机芯模组的数量可以为两个。所述两个机芯模组的磁体靠近所述机芯壳体的底壁一侧的极性可以相异，以在所述耳机处于非佩戴状态时，所述两个机芯模组能够相互吸附。
在一些实施例中，所述两个耳挂组件的数量可以为两个。所述耳机还可以包括用于绕设于所述用户头部后侧的后挂组件。所述后挂组件的两端可以分别与两个所述两个耳挂组件的容置仓连接。
附加的特征将在下面的描述中部分地阐述，并且对于本领域技术人员来说，通过查阅以下内容和附图将变得显而易见，或者可以通过实例的产生或操作来了解。本发明的特征可以通过实践或使用以下详细实例中阐述的方法、工具和组合的各个方面来实现和获得。
附图说明
本申请将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1是根据本申请一些实施例所示的骨传导耳机的分解结构示意图；
图2是根据本申请一些实施例所示的图1中耳挂组件的分解结构示意图；
图3是根据本申请一些实施例所示的图2中耳挂壳体的结构示意图；
图4是根据本申请一些实施例所示的图1中耳挂组件的另一分解结构示意图；
图5是根据本申请一些实施例所示的图4中耳挂壳体的结构示意图；
图6是根据本申请一些实施例所示的图4中装饰支架靠近耳挂壳体一侧的结构示意图；
图7是根据本申请一些实施例所示的图4中装饰支架触发按键的原理示意图；
图8是根据本申请一些实施例所示的图1中机芯模组的分解结构示意图；
图9是根据本申请一些实施例所示的骨传导耳机的频率响应曲线示意图；
图10是根据本申请一些实施例所示的图8中耳挂壳体上设置的补强结构的剖视结构示意图；
图11是根据本申请一些实施例所示的图8中耳挂壳体上设置的补强结构的俯视结构示意图；
图12是根据本申请一些实施例所示的图10及图11中补强结构所对应的频率响应曲线示意图；
图13是根据本申请一些实施例所示的图8中机芯模组组装之后沿着I-I方向的剖视结构示意图；
图14是根据本申请一些实施例所示的图8中机芯支架的结构示意图；
图15是根据本申请一些实施例所示的图8中机芯模组组装之后的俯视结构示意图；
图16是根据本申请一些实施例所示的图1中机芯模组的分解结构示意图；
图17是根据本申请一些实施例所示的图14中耳挂组件与盖板之间设置不同类型的胶体对应的结构的频率响应曲线示意图；
图18是根据本申请一些实施例所示的图16中机芯模组组装之后沿着II-II方向的剖视结构示意图；
图19是根据本申请一些实施例所示的图16中盖板靠近机芯壳体一侧的结构示意图；
图20是根据本申请一些实施例所示的图19中盖板的俯视结构示意图；
图21是根据本申请一些实施例所示的图16中机芯模组另一视角的分解结构示意图；
图22是根据本申请一些实施例所示的图21中盖板的俯视结构示意图；
图23是根据本申请一些实施例所示的机芯的原理示意图；
图24是根据本申请一些实施例所示的图23中磁体对力系数BL的关系示意图；
图25是根据本申请一些实施例所示的图23中导磁罩和导磁板的厚度对力系数BL的关系示意图；
图26是根据本申请一些实施例所示的图23中导磁罩的高度对力系数BL的关系示意图；
图27是根据本申请一些实施例所示的图1中骨传导耳机处于非佩戴状态时的状态示意图；
图28是根据本申请一些实施例所示的图1中后挂组件沿着III-III方向的断面结构示意图；以及
图29是根据本申请一些实施例所示的后挂组件加工方法的示例性流程图。
具体实施例
为了更清楚地说明本申请的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本申请应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本发明，而并非以任何方式限制本发明的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本申请和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、
“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。其他术语的相关定义将在下文描述中给出。以下，不失一般性，在描述本发明中关于传导相关技术时，将采用“声学输出装置”或“耳机”的描述。该描述仅仅为传导应用的一种形式，对于该领域的普通技术人员来说，“声学输出装置”或“耳机”也可用其他同类词语代替，比如“扬声器”、“发声装置”、“助听器”或“扬声装置”等。事实上，本发明中的各种实现方式可以很方便地应用到其它非扬声器类的听力设备上。例如，对于本领域的专业人员来说，在了解耳机的基本原理后，可能在不背离这一原理的情况下，对实施耳机的具体方式与步骤进行形式和细节上的各种修正和改变，特别地，在耳机中加入环境声音拾取和处理功能，使该耳机实现助听器的功能。例如，麦克风等传声器可以拾取使用者/佩戴者周围环境的声音，在一定的算法下，将声音处理后(或者产生的电信号)传送至声学输出部分。即耳机可以经过一定的修改，加入拾取环境声音的功能，并经过一定的信号处理后通过声学输出模块将声音传递给使用者/佩戴者，从而同时实现声学输出装置和传统声学输出装置的功能。作为举例，这里所说的算法可以包括噪声消除、自动增益控制、声反馈抑制、宽动态范围压缩、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制等一种或多种的组合。
本申请中的耳机可以是单独的、可直接使用的耳机，还可以是插接在电子设备上或作为电子设备的一部分而使用的耳机。仅仅为了说明的目的，以下将基于骨传导耳机进行进一步描述。需要知道的是，以下描述的内容也可以同样适用于气导耳机。
图1是根据本申请一些实施例所示的骨传导耳机的分解结构示意图。图2是根据本申请一些实施例所示的图1中耳挂组件的分解结构示意图。图3是根据本申请一些实施例所示的图2中耳挂壳体的结构示意图。图4是根据本申请一些实施例所示的图1中耳挂组件的另一分解结构示意图。图5是根据本申请一些实施例所示的图4中耳挂壳体的结构示意图。如图1至图5所示，骨传导耳机10可以包括两个机芯模组20、两个耳挂组件30、后挂组件40、主控电路板50和电池60。其中，两个耳挂组件30的一端分别连接对应的机芯模组20，后挂组件40的两端分别与两个耳挂组件30远离机芯模组20的另一端连接。进一步地，两个耳挂组件30用于分别挂设于用户的两耳外侧，后挂组件40用于绕设于用户的头部后侧，以便于实现用户佩戴骨传导耳机10的需求。如此设置，以在骨传导耳机10处于佩戴状态时，两个机芯模组20分别位于用户的头部的 左侧和右侧；并在两个耳挂组件30和后挂组件40的配合作用下，使得两个机芯模组20能够夹持用户的头部而与用户的皮肤接触，进而能够基于骨传导技术实现声音的传递。
需要说明的是，本申请所述的机芯模组20设置有两个，两个机芯模组20均可以发声，以便于骨传导耳机10实现立体声音效，从而改善骨传导耳机10的用户好感度。在一些实施例中，机芯模组20的数量可以不限于两个。例如，骨传导耳机10可以设置三个或以上的机芯模组20。又例如，在一些对立体声要求并不是特别高的应用场景下，例如听力患者助听、主持人直播提词等，骨传导耳机10也可以仅设置一个机芯模组20。再例如，所述耳机还可以包括设置有一个机芯模组20的气导耳机(例如，单耳式气导耳机)，所述气导耳机可以通过固定组件(例如，耳挂组件)挂设于用户耳廓，并通过一个或多个导声孔向用户传递声音信号。
在一些实施例中，主控电路板50和电池60可以设置在同一耳挂组件30内，也可以分别设置在两个耳挂组件30内，具体结构将在后文中进行详细的描述。其中，主控电路板50和电池60均可以通过导体(图1至图5中均未示出)与两个机芯模组20连接，主控电路板50可以用于控制机芯模组20的发声(例如将电信号转化成机械振动)，电池60可以用于给骨传导耳机10(具体可以是两个机芯模组20)提供电能。在一些实施例中，本申请所述的骨传导耳机10还可以包括传声器(例如，麦克风、拾音器等)、通信元件(例如，蓝牙等)等组件，这些组件也可以通过导线与主控电路板50、电池60等连接，以实现相应的功能。
在一些实施例中，所述导体可以包括导线，所述导线可以用于在骨传导耳机10的各个电子元器件之间实现电性连接；若需要电性连接的电路为多个，则导体可以相应地设置多股，进而上述的导体可以简单地理解为多股导线。
如图2所示，耳挂组件30可以包括耳挂壳体31和装饰件32，两者可以通过胶接、卡接、螺纹连接等组装方式中的一种或其组合进行连接。其中，装饰件32在骨传导耳机10处于佩戴状态时位于耳挂壳体31背离机芯模组20的一侧，也即是位于骨传导耳机10的外侧，以便于装饰件32对耳挂壳体31进行装饰，从而增加骨传导耳机10的外观美感。在一些实施例中，装饰件32可以凸出耳挂壳体31，也可以嵌入耳挂壳体31。在一些实施例中，装饰件32可以包括贴纸、塑胶制件、金属制件等，其上可以印制几何图案、卡通图案、logo图案等，也可以涂布荧光材料、反光材料等，以实现相应的装饰效果。
如图2及图3所示，耳挂壳体31可以包括依次连接的耳机固定部311、弯折过渡部312和容置仓313。其中，耳机固定部311用于固定机芯模组20，两者的配合关系将在后文中进行详细的说明。弯折过渡部312连接容置仓313和耳机固定部311，并呈弯折状设置，以挂设于人耳外侧。在一些实施例中，容置仓313远离耳机固定部311的一端可以通过胶接、卡接、螺纹连接等组装方式中的一种或其组合与后挂组件40连接，以便于实现耳挂组件30与后挂组件40之间的组装。其中，容置仓313的一端呈开口设置，以便用于容纳主控电路板50或电池60。此时，耳挂壳体31还可以包括仓体盖314，仓体盖314盖设在容置仓313的开口端上。
在一些实施例中，骨传导耳机10还可以包括按键模块、接口模块等。例如，当容置仓313用于容纳主控电路板50时，如图2所示，耳挂组件30还可以包括控制键33和TYPE-C(USB)接口34。其中，控制键33和TYPE-C(USB)接口34可以设置在容置仓313上，以便于两者与主控电路板50连接，进而缩短走线的距离。此时，控制键33和TYPE-C(USB)接口34可以部分裸露在耳挂壳体31外，以便于用户进行相应的操作。如此设置，控制键33可以用于实现骨传导耳机10的开启与关闭、音量的调节等功能，TYPE-C(USB)接口34可以用于实现数据传输、充电等功能。此外，耳挂组件30还可以包括指示灯35。其中，指示灯35可以设置在容置仓313上，以便于与主控电路板50连接，进而缩短走线的距离。在一些实施例中，如图2所示，指示灯35可以部分裸露在耳挂壳体31外，也可以具体包括藏匿在耳挂壳体31内的LED光源和部分裸露在耳挂壳体31外的导光件(图2及图3中均未示出)。如此设置，指示灯35可以在骨传导耳机10充电、电量不足等情景下进行提示。
在一些实施例中，当骨传导耳机10处于佩戴状态时，骨传导耳机10将挂在人耳外侧。具体地，机芯模组20一般位于人耳的前侧，主控电路板50或电池60一般位于人耳的后侧。此时，人耳作为一个支点而支撑骨传导耳机10，导致人耳将承受骨传导耳机10的大部分重量。用户在长时间佩戴骨传导耳机10之后，可能会引起不适感。为此，耳挂壳体31(尤其是弯折过渡部312部分)一般会选择质地较软的材质制成，以便于改善骨传导耳机10的佩戴舒适度。在一些实施例中，耳挂壳体31的材质可以包括聚碳酸酯(Polycarbonate,PC)、聚酰胺(Polyamides,PA)、丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile Butadiene Styrene,ABS)、聚苯乙烯 (Polystyrene,PS)、高冲击聚苯乙烯(High Impact Polystyrene,HIPS)、聚丙烯(Polypropylene,PP)、聚对苯二甲酸乙二酯(Polyethylene Terephthalate,PET)、聚氯乙烯(Polyvinyl Chloride,PVC)、聚氨酯(Polyurethanes,PU)、聚乙烯(Polyethylene,PE)、酚醛树脂(Phenol Formaldehyde,PF)、尿素-甲醛树脂(Urea-Formaldehyde,UF)、三聚氰胺-甲醛树脂(Melamine-Formaldehyde,MF)、硅胶等，或其任意组合。在一些实施例中，由于耳挂壳体31的质地较软，导致耳挂壳体31存在刚度不足而在外力作用下难以维持其结构，甚至是强度不足而断裂的风险。为此，耳挂壳体31可以(至少在弯折过渡部312部分)内置弹性金属丝(图3中未示出)，以便于改善耳挂壳体31的强度，进而增加耳挂壳体31的可靠性。其中，弹性金属丝的材质可以包括弹簧钢、钛合金、钛镍合金、铬钼钢等，或其任意组合。在一些实施例中，耳挂壳体31可以为金属嵌件注塑一体成型结构件。
基于上述的详细的描述，由于机芯模组20设置在耳挂组件30的一端(具体可以是耳机固定部311所在的一端)，主控电路板50或电池60设置在耳挂组件30的另一端(具体可以是容置仓313所在的另一端)，使得机芯模组20通过导线与主控电路板50和电池60连接时，导线至少要经过弯折过渡部312所在的区域。一般地，为了骨传导耳机10的外观美感，导线不会裸露在耳挂壳体31外，而是会穿设在耳挂壳体31内，使得至少弯折过渡部312包覆导线。然而，由于导线的质地一般较软，导致在耳挂壳体31内穿设导线的难度会较大。为此，在一些实施例中，如图2至图5所示，耳挂壳体31至少在弯折过渡部312上开设有第一凹槽315，第一凹槽315可以用于走线，以降低在耳挂壳体31内穿设导线的难度。其中，第一凹槽315具体可以设置在耳挂壳体31靠近装饰支架321的一侧。此时，装饰件32可以嵌入并固定在弯折过渡部312对应的第一凹槽315内，以形成一走线通道(图2及图4中未标注)，进而允许导线从机芯模组20内经走线通道延伸至容置仓313内，便于导线实现机芯模组20与主控电路板50和电池60的连接。如此设置，以在导线经第一凹槽315穿设于耳挂壳体31时，装饰件32可以覆盖在导线上，以避免导线裸露在耳挂壳体31外。此时，装饰件32不仅可以对耳挂壳体31进行装饰，还可以遮蔽导线，使得装饰件32能够实现“一件两用”。
如图2所示，装饰件32可以包括装饰支架321和装饰条322。其中，装饰支架321与弯折过渡部312对应地呈弯折状设置，以在装饰支架321嵌入并固定于弯折过渡部312对应的第一凹槽315时，装饰支架321与弯折过渡部312上的第一凹槽315配合形成一走线通道，以允许导线从机芯模组20内经走线通道延伸至容置仓313内。进一步地，装饰条322嵌入第一凹槽315，并与装饰支架321贴合固定。此时，装饰支架321可以为塑胶制件，并可以通过胶接和/或卡接的方式与耳挂壳体31组装。装饰条322可以为贴纸，并可以通过胶接的方式贴在装饰支架321上。如此设置，当用户想要改变装饰件32的装饰效果时，用户更换装饰条322即可，而无需将装饰件32这一整体从耳挂壳体31上拆下。图6是根据本申请一些实施例所示的图4中装饰支架321靠近耳挂壳体31一侧的结构示意图。在一些实施例中，如图6所示，装饰支架321在朝向耳挂壳体31的一侧还可以开设有第二凹槽3211，以在装饰支架321嵌入并固定于第一凹槽315时，第二凹槽3211和第一凹槽315相互配合，以形成走线通道。
在一些实施例中，第一凹槽315的底部在靠近装饰条322的端部的位置处可以设置有凹坑316，以允许用户通过将装饰条322压入凹坑316，而使得装饰条322的端部从第一凹槽315中翘起，以便于更换装饰条322。此时，第一凹槽315可以进一步延伸至容置仓313，凹坑316则可以设置在容置仓313上。其中，凹坑316位于装饰支架321对第一凹槽315的覆盖区域外，装饰条322贴合固定在装饰支架321上，并覆盖凹坑316。此时，装饰条322的整体长度可以大于装饰支架321的整体长度。
在一些实施例中，装饰支架321与装饰条322也可以为一体成型结构件。其中，装饰支架321的材质与装饰条322的材质可以不同，两者可以双色注塑成型，使得装饰支架321可以起到支撑的作用，装饰条322可以起到装饰的作用。此时，装饰条322的整体长度可以大于或等于装饰支架321的整体长度。
如图3所示，第一凹槽315可以划分成位于弯折过渡部312上的第一子槽段3151、位于耳机固定部311上的第二子槽段3152和位于容置仓313上的第三子槽段3153。其中，第一子槽段3151的深度大于第二子槽段3152和第三子槽段3153的深度，使得第一子槽段3151可以用于容纳装饰支架321并实现走线，而第二子槽段3152和第三子槽段3153可以用于容纳装饰条322。换句话说，装饰条322除了位于第一子槽段3151内，还可以进一步延伸到第二子槽段3152和第三子槽段3153内。此时，凹坑316可以设置在第三子槽段3153。进一步地，第二子槽段3152的深度 可以等于第三子槽段3153的深度，且在装饰支架321嵌入并固定于第一子槽段3151之后，装饰支架321背离耳挂壳体31的一面可以大体平齐于第二子槽段3152和第三子槽段3153的槽底，进而使得装饰条322能够平坦地贴在耳机固定部311、装饰支架321和容置仓313上。
在一些实施例中，装饰条322与装饰支架321之间的贴合强度可以小于装饰支架321与弯折过渡部312之间的固定强度。其中，当装饰条322与装饰支架321胶接时，该贴合强度可以指两者之间的胶接强度。此时，该贴合强度的大小可以取决于装饰支架321与装饰条322贴合的表面的粗糙度；和/或，装饰条322与装饰支架321之间的胶体的用量(和/或黏性)。在一些实施例中，当装饰支架321与弯折过渡部312卡接时，该固定强度可以指两者之间的卡接强度。此时，该固定强度可以取决于装饰支架321与弯折过渡部312之间的配合间隙；和/或，两者卡接的深度。如此设置，当装饰支架321与耳挂壳体31以卡接的方式组装时，装饰条322的两端可以分别与容置仓313和耳机固定部311胶接，可以起到进一步固定装饰支架321的作用，且在更换装饰条322以改变装饰件32的装饰效果时，装饰支架321也不会因为其与装饰条322之间的贴合强度过大而被带起。
在一些实施例中，当图2所示的容置仓313用于容纳主控电路板50时，图4所示的容置仓313则可以用于容纳电池60。此时，若图2所示的耳挂组件30对应于骨传导耳机10的左耳挂，则图4所示的耳挂组件30可以对应于骨传导耳机10的右耳挂；反之，若图2所示的耳挂组件30对应于骨传导耳机10的右耳挂，则图4所示的耳挂组件30可以对应于骨传导耳机10的左耳挂。换句话说，主控电路板50和电池60可以分别设置在两个耳挂组件30内。如此设置，不仅可以增加电池60的容量，以改善骨传导耳机10的续航能力，还可以对骨传导耳机10的重量进行均衡，以改善骨传导耳机10的佩戴舒适度。此时，主控制电路板50和电池60可以经内置于后挂组件40的导线连接，具体结构将在后文中进行详细的说明。在一些实施例中，左耳挂(或右耳挂)和/或后挂组件40可以省略，骨传导耳机10可以设置有一个耳挂，所述耳挂的容置仓313可以同时容纳主控电路板50和电池60。
如图4所示，耳挂组件30还可以包括按键36，耳挂壳体31还开设有按键适配孔317。其中，装饰支架321装配固定在耳挂壳体31的一侧，按键36设置在耳挂壳体31背离装饰支架321的另一侧，并经按键适配孔317外露；装饰支架321进一步以悬臂形式延伸至经按键适配孔317所外露的按键36的上方，并能够在外力按压下触发按键36。如此设置，按键36可以代替上述的控制键33，以简化骨传导耳机10的结构；也可以与上述的控制键33共存，并可以用于实现播放/暂停、AI唤醒等功能，以扩展骨传导耳机10的交互能力。
在一些实施例中，按键适配孔317可以开设于耳机固定部311，则用户可以在耳机固定部311对按键36进行按压操作。此时，耳挂组件30还可以包括密封件37，密封件37设置在按键36与耳机固定部311之间。其中，密封件37的材质可以包括硅胶、橡胶等。如此设置，既可以增加耳机固定部311在按键36所在区域的防水性能，也可以改善按键36的按压触感。
类似地，当机芯模组20设置在耳挂组件30的一端(具体可以是耳机固定部311所在的一端)，电池60设置在耳挂组件30的另一端(具体可以是容置仓313所在的另一端)时，导线至少要经过弯折过渡部312所在的区域，以便于机芯模组20通过导线与电池60连接。为此，如图4所示，耳挂壳体31至少在耳机固定部311和弯折过渡部312靠近装饰支架321的一侧开设有第一凹槽315，第一凹槽315可以用于走线，以降低在耳挂壳体31内穿设导线的难度。进一步地，第一凹槽315的一端与按键适配孔317连通，以在装饰支架321嵌入并固定于第一凹槽315时，装饰支架321还可以覆盖按键适配孔317，以便于触发按键36。
通过上述的方式，装饰件32不仅可以对耳挂壳体31进行装饰并遮蔽导线，还可以遮蔽并触发按键36，使得装饰件32能够实现“一件四用”。
如图5所示，第一凹槽315可以划分成位于弯折过渡部312上的第一子槽段3151和位于耳机固定部311上的第二子槽段3152。其中，第一子槽段3151的深度大于第二子槽段3152的深度，使得第一子槽段3151可以用于实现走线，第二子槽段3152与第一子槽段3151一同用于容纳装饰支架321。此时，按键适配孔317可以设置在第二子槽段3152，也即是两者在耳机固定部311上的投影至少部分重合。进一步地，第一凹槽315还可以划分成位于容置仓313上的第三子槽段3153，第三子槽段3153还可以设置凹坑316。其中，第二子槽段3152的深度可以大于第三子槽段3153的深度，使得第三子槽段3153可以用于容纳装饰条322。换句话说，装饰条322除了位于第一子槽段3151和第二子槽段3152内，还可以进一步延伸到第三子槽段3153内。此时，在装饰支架321嵌入并固定于第一子槽段3151之后，装饰支架321背离耳挂壳体31的一面可以大体平齐 于第三子槽段3153的槽底，进而使得装饰条322能够平坦地贴在耳机固定部311、装饰支架321和容置仓313上，且装饰支架321可以在第二子槽段3152对应按键适配孔317处形成悬臂。
如图6所示，装饰支架321可以包括与第一子槽段3151对应的固定部3212和与第二子槽段3152对应的按压部3213。其中，固定部3212的厚度大于按压部3213的厚度，使得固定部3212可以用于实现装饰支架321与耳挂壳体31之间的组装，按压部3213可以用于触发按键36。进一步地，当装饰支架321在朝向耳挂壳体31的一侧开设有第二凹槽3211时，第二凹槽3211可以设置在固定部3212上。
图7是根据本申请一些实施例所示的图4中装饰支架321触发按键36的原理示意图。如图6及图7所示，装饰支架321还可以包括连接在固定部3212和按压部3213之间的连接部
3214。其中，连接部3214相较于固定部3212向远离耳挂壳体31的一侧弯折延伸，按压部3213相较于连接部3214向靠近耳挂壳体31的一侧弯折延伸。此时，连接部3214使得按压部3213相对于固定部3212是悬空的，且按压部3213与固定部3212之间具有一定的距离。其中，该距离可以大于或等于按键36的触发行程。如此设置，可以有效改善在用户按压装饰支架321的一端(具体可以是按压部3213所在的一端)时，装饰支架321的另一端翘起的问题。
在一些实施例中，按压部3213靠近耳挂壳体31的一侧还可以设置有按键凸起3215，以在按压部3213受到外力按压时，按键凸起3215能够触发按键36。其中，按键凸起3215和按键36在耳机固定部311上的投影至少部分重合，且按键凸起3215与按键36接触的有效面积小于按压部3213与按键36接触的有效面积。如此设置，可以降低按键36的触发难度，尤其是在按键36与耳机固定部311之间设置有密封件37时，因为按键36被触发需要密封件37先发生变形。基于关系式F∝ε·S，在用户施加的外力F相同的情况下，密封件37需要发生变形的区域的有效面积S越小，使得密封件37产生的形变ε越大，进而更加容易触发按键36。显然，相较于按压部3213，按键凸起3215可以减小上述的有效面积。
在一些实施例中，装饰支架321在靠近耳机固定部311的端部还可以设置有止挡部
3216。其中，止挡部3216用于与耳机固定部311背离装饰支架321的内表面形成止挡，以防止装饰支架321的端部从第一凹槽315翘起，尤其是在外力作用下。如图7所示，止挡部3216具体可以设置在按压部3213远离固定部3212的一端。此时，由于止挡部3216与耳机固定部311之间的止挡作用，使得装饰支架321在外力按压下发生变形而触发按键36之后，装饰支架321不会因弹性回复过大而翘起。
参阅图2或图6，装饰支架321靠近容置仓313的一端(也即是其远离按压部3213的另一端)还可以设置有搭接部3217。其中，搭接部3217的厚度小于固定部3212的厚度，以与耳挂壳体31的加强结构(具体位于弯折过渡部312与容置仓313之间)进行结构上的避让。
图8是根据本申请一些实施例所示的图1中机芯模组20的分解结构示意图。如图8所示，机芯模组20可以包括机芯壳体21和机芯22。其中，机芯壳体21的一端开口，耳挂壳体31(具体可以是耳机固定部311)盖设在机芯壳体21的开口端上，以形成用于容纳机芯22的腔体结构。此时，耳挂壳体31相当于机芯壳体21的一个盖子。如此设置，相较于相关技术中耳挂结构与机芯结构的插接组装方式，本申请实施例中耳挂壳体31与机芯壳体21的盖设组装方式，可以改善相关技术中耳挂结构与机芯结构在插接处的应力问题，进而增加骨传导耳机10的可靠性。
需要说明的是，图8中所示的耳挂壳体是为了便于描述耳挂壳体与机芯壳体之间的相对位置关系，进而隐式地示意出耳挂壳体与机芯壳体之间一种可能的组装方式。
在一些实施例中，机芯22可以直接地或间接地固定在机芯壳体21内，使得机芯22在电信号的激励作用下产生振动，并带动机芯壳体21随之一起振动。在一些实施例中，在用户佩戴骨传导耳机10时，机芯壳体21的皮肤接触区域(也即是后文中所述的底壁211)可以与用户的皮肤接触，使得上述的振动能够经人的颅骨传递至听神经，进而使得用户能够听到骨传导耳机10播放的声音。在一些实施例中，当用户佩戴所述耳机时，机芯壳体21的一侧(例如，后文中所述的底壁211)可以面向用户的头部。例如，所述耳机还包括气导耳机。所述气导耳机的一侧可以设置一个或多个导声孔，当用户佩戴所述气导耳机时，设置有所述一个或多个导声孔的一侧可以面向用户的耳道。所述耳机产生的声音信号可以通过气导的方式传递给用户。可选地或附加地，所述一个或多个导声孔可以设置在所述耳机的不同侧壁上，从而实现不同的声音传递效果。例如，在所述耳机面向用户头部的底壁上可以设置第一导声孔，所述第一导声孔可以用于向用户的耳道传递第一声音信号。在不同于所述底壁的其他侧壁上可以设置第二导声孔，所述第二导声孔可以用于传递第二声音信号。所述第二声音信号可以与机芯壳体21振动产生的漏音声波相互叠加，从而达 到降低机芯壳体21漏音的效果。在一些实施例中，机芯模组20还可以包括机芯支架23，机芯支架23用于将机芯22固定在机芯壳体21内。
一般地，低频指的是频率小于500Hz的声音，中频指的是频率范围在500-4000Hz内的声音，高频指的是频率大于4000Hz的声音。图9是根据本申请一些实施例所示的骨传导耳机的频率响应曲线示意图。如图9所示，横轴为振动的频率(单位为Hz)，纵轴为振动的强度(单位为dB)；高频区(频率大于4000Hz的范围)具有第一高频谷V、第一高频峰P1和第二高频峰P2。其中，第一高频谷V和第一高频峰P1可以是机芯壳体21的非皮肤接触区域(也即是后文中所述的环形周壁212)在高频下变形而产生的，第二高频峰P2可以是机芯壳体21的皮肤接触区域在高频下变形而产生的。在一些实施例中，频率范围在500-6000Hz内的频率响应曲线对于骨传导耳机尤为关键。其中，在这个频率范围内，不希望出现尖锐的峰谷；频率响应曲线越平坦，骨传导耳机的音质越好。一般地，一个结构(例如，机芯壳体21)的刚度越大，所述结构受力时产生的形变就越小，也利于产生更高频率的谐振。因此，产品制造商在大多数情况下会通过增加机芯壳体21的刚度而使得第一高频谷V、第一高频峰P1和第二高频峰P2往更高频率的区域移动。换句话说，为了获得更好的音质，机芯壳体21的刚度可以尽可能的大。为此，在一些实施例中，机芯壳体21的材质可以包括聚碳酸酯、聚酰胺、丙烯腈-丁二烯-苯乙烯共聚物等材料与玻璃纤维或碳纤维的混合物。在一些实施例中，机芯壳体21的材质可以是碳纤维和聚碳酸酯按照一定比例混合制成，也可以是玻璃纤维和聚碳酸酯按照一定比例混合制成，还可以使玻璃纤维和聚酰胺按照一定比例混合制成。在其它一些实施例中，机芯壳体21的材质可以是碳纤维、玻璃纤维和聚碳酸酯按照一定比例混合制成。其中，加入不同比例的碳纤维和/或玻璃纤维，材料的弹性模量不同，制得的机芯壳体21的刚度也不同。例如，在聚碳酸酯中加入20％-50％的玻璃纤维，材料的弹性模量可以达到6-8GPa。
基于上述的详细描述，一方面，耳挂壳体31(尤其是耳机固定部311)作为机芯模组20的一部分结构以形成容纳机芯22的腔体结构；另一方面，本申请实施例中，为了改善骨传导耳机10的佩戴舒适度，耳挂壳体31一般会选择质地较软的材质制成，使得耳挂壳体31的刚度较小。如此设置，当耳挂壳体31盖设于机芯壳体21以形成容纳机芯22的腔体结构时，由于耳挂壳体31(尤其是耳机固定部311)的刚度小于机芯壳体21的刚度，使得骨传导耳机容易出现漏音的不良现象，进而影响用户的好感度。
一般地，结构的谐振频率与结构的刚度相关，且在相同质量下，结构的刚度越大，其谐振频率也越高。其中，结构的刚度K与其材料(具体表现为弹性模量)、具体结构形式等因素有关。一般地，材料的弹性模量E越大，结构的刚度K越大；结构的厚度t越大，结构的刚度K越大；结构的面积S越小，结构的刚度K越大。此时，以上关系可以简单地用关系式K∝(E·t)/S进行描述。因此，增加材料的弹性模量E、增加结构的厚度t、减小结构的面积S等方式中的一种或其组合均可以增加结构的刚度K，进而增加结构的谐振频率。
在一些实施例中，耳挂壳体31一般会选择质地较软的材质(也即是弹性模量较小的材料，例如聚碳酸酯、聚酰胺等，其弹性模量多为2-3GPa)制成，而机芯壳体21一般会选择质地较硬的材质(也即是弹性模量较大的材料，例如在聚碳酸酯中加入20％-50％的玻璃纤维，材料的弹性模量可以达到6-8GPa等)制成。显然，由于弹性模量的差异，使得耳挂壳体31的刚度与机芯壳体21的刚度也不一致，容易出现上述的漏音。另外，在耳挂壳体31与机芯壳体21连接之后，由于两者的刚度不一致，容易使得结构在相对较低的频率产生谐振。为此，在一些实施例中，当机芯壳体21的弹性模量大于耳挂壳体31的弹性模量时，耳机固定部311设置有补强结构318，可以使得机芯壳体21的皮肤接触区域的刚度K1与耳机固定部311的刚度K2之间的差值与机芯壳体21的皮肤接触区域的刚度K1的比值小于或等于第一预设比例阈值。在一些实施例中，所述第一预设比例阈值可以为10％。也即是(K1-K2)/K1≤10％，或是K2/K1≥90％。如此设置，既可以保证机芯壳体21具有足够大的刚度而使得其谐振频率位于尽可能高的高频区，也可以缩小耳机固定部311与机芯壳体21之间的刚度差值而增加结构的谐振频率，并改善上述的漏音。
图10是根据本申请一些实施例所示的图8中耳挂壳体上设置的补强结构的剖视结构示意图。在一些实施例中，如图10所示，机芯壳体21可以包括底壁211和环形周壁212。其中，底壁211为机芯壳体21的皮肤接触区域，环形周壁212的一端与底壁211一体连接。换句话说，底壁211用于与用户的皮肤接触或面向用户的头部(例如，面向用户的耳道)。在一些实施例中，耳机固定部311可以包括与弯折过渡部312连接的固定主体3111和与固定主体3111一体连接且向机芯壳体21延伸的环形凸缘3112。其中，环形凸缘3112与环形周壁212远离底壁211的另一端彼 此对接，两者可以通过胶接或胶接与卡接组合的方式进行连接。
需要说明的是，本申请实施例中，底壁211可以呈矩形、正方形、圆形、椭圆形、类椭圆形(与图11所示的耳机固定部311的形状类似)等形状中的任意一种。在一些实施例中，环形周壁212可以垂直于底壁211，也即是机芯壳体21开口端的面积等于底壁211的面积。在一些实施例中，环形周壁212也可以相对于底壁211向外倾斜一角度(例如倾斜角小于等于30°)，也即是机芯壳体21开口端的面积大于底壁211的面积。其中，本实施例以底壁211呈类椭圆形，环形周壁212相对于底壁211向外倾斜10°为例进行示例性的说明。如此设置，在保证一定佩戴舒适度的前提下(因为底壁211作为机芯壳体21的皮肤接触区域会与用户的皮肤接触，其面积不宜太小)，减小底壁211的面积，可以增加机芯壳体21的谐振频率。
如图10中(a)所示，补强结构318可以为设置在固定主体3111和环形凸缘3112之间的弧形结构，也即是进行倒角(Fillet)处理。在一些实施例中，由于环形凸缘3112在耳机固定部311的厚度方向上的尺寸一般较小，使得环形凸缘3112与上述的弧形结构可以融为一体。此时，对于耳机固定部311而言，其结构可以仅包括固定主体3111和弧形结构的补强结构318。如此设置，上述的弧形结构使得耳机固定部311的有效面积减小，可以增加耳机固定部311的刚度，进而缩小耳机固定部311与机芯壳体21之间的刚度差值。需要说明的是：上述的弧形结构的尺寸可以根据耳机固定部311的刚度需求进行合理的设计，在此不作限制。
如图10中(b)所示，补强结构318可以为与固定主体3111一体设置的增厚层，也即是进行加厚(Thicken)处理。其中，增厚层的材质可以与耳挂壳体31的材质相同，例如增厚层的材质也为聚碳酸酯、聚酰胺、丙烯腈-丁二烯-苯乙烯共聚物中的任意一种。需要说明的是：补强结构318既可以位于固定主体3111靠近机芯壳体21的一侧，也可以位于固定主体3111背离机芯壳体21的另一侧，当然还可以位于固定主体3111的两侧。在一些实施例中，由于环形凸缘3112在耳机固定部311的厚度方向上的尺寸一般较小，使得环形凸缘3112与上述的增厚层可以融为一体。此时，对于耳机固定部311而言，其结构可以仅包括固定主体3111和增厚层设置的补强结构318。如此设置，上述的增厚层使得耳机固定部311的有效厚度增加，可以增加耳机固定部311的刚度，进而缩小耳机固定部311与机芯壳体21之间的刚度差值。需要说明的是：上述的增厚层的尺寸可以根据耳机固定部311的刚度需求进行合理的设计，在此不作限制。
在一些实施例中，补强结构318可以为金属制件。其中，金属制件的材质可以包括铝合金、镁合金、钛合金、镍合金、铬钼钢、不锈钢等，或其任意组合。此时，补强结构318与耳机固定部311可以为金属嵌件注塑一体成型结构件。如此设置，金属制件可以有效增加耳机固定部311的刚度，进而缩小耳机固定部311与机芯壳体21之间的刚度差值。需要说明的是：上述的补强结构318的材质、尺寸等参数可以根据耳机固定部311的刚度需求进行合理的设计，在此不作限制。
图11是根据本申请一些实施例所示的图8中耳挂壳体31上设置的补强结构318的俯视结构示意图。在一些实施例中，如图11所示，补强结构318可以为设置在耳机固定部311上的加强筋。所述加强筋可以分布在耳机固定部311靠近机芯壳体21的一侧。在一些实施例中，加强筋的数量可以为多个。在一些实施例中，所述多个加强筋可以呈如图11中(a)及(b)所示的并排状或如图11中(c)所示的网格状设置。在一些实施例中，所述多个加强筋也可以以耳机固定部311上的预设参考点为中心而呈如图11中(d)所示的辐射状设置。在一些实施例中，加强筋的材质可以与耳挂壳体31的材质相同，例如加强筋的材质也为聚碳酸酯、聚酰胺、丙烯腈-丁二烯-苯乙烯共聚物中的任意一种。如此设置，相较于在耳机固定部311注塑设置金属制件或直接对耳机固定部311进行增厚处理等方式，在耳机固定部311上设置加强筋，既可以增加耳机固定部311的刚度，又可以兼顾耳机固定部311的重量。
在一些实施例中，如图11所示，耳机固定部311可以具有一长轴方向(如图11中点划线X所示的方向)和一短轴方向(如图11中点划线Y所示的方向)。其中，耳机固定部311沿长轴方向的尺寸可以大于其沿短轴方向的尺寸。下面就加强筋的分布进行示例性的说明：
如图11中(a)所示，多个加强筋可以以条状的方式沿长轴方向延伸并沿短轴方向并排设置。此时，补强结构318可以简单地看作是耳机固定部311的长边加筋(Long-Side)。
如图11中(b)所示，多个加强筋可以以条状的方式沿短轴方向延伸并沿长轴方向并排设置。此时，补强结构318可以简单地看作是耳机固定部311的短边加筋(Short-Side)。
如图11中(c)所示，多个加强筋可以分别沿长轴方向和短轴方向设置以形成网格状。此时，补强结构318可以简单地看作是耳机固定部311的十字加筋(Cross)。
如图11中(d)所示，多个加强筋相互靠近的一端可以间隔设置，且多个加强筋的延长线可以交于预设参考点(如图11中实心点O所示)。此时，补强结构318可以简单地看作是耳机固定部311的辐射加筋(Radiational)。
在一些实施例中，当加强筋与耳机固定部311之间满足预设的尺寸关系时，既可以有效地增加耳机固定部311的刚度，又可以很好地兼顾耳机固定部311的重量。在一些实施例中，加强筋的厚度与耳机固定部311的厚度之间的比值可以在第一比值范围内。例如，所述第一比值范围可以是0.8-1.2。在一些实施例中，加强筋的宽度与耳机固定部311的厚度之间的比值可以在第二比值范围内。例如，所述第二比值范围可以是0.4-0.6。在一些实施例中，加强筋的间距与耳机固定部311的厚度之间的比值可以在第三比值范围内。例如，所述第三比值范围可以是1.6-2.4。在一些实施例中，加强筋的厚度与耳机固定部311的厚度可以相同，加强筋的宽度可以为耳机固定部311的厚度的一半，加强筋的间距可以为耳机固定部311的厚度的两倍。仅作为示例，本实施例以耳机固定部311的厚度为0.8mm，加强筋的厚度、宽度和间距分别为0.8mm、0.4mm和1.6mm进行示例性的说明。
需要说明的是，图10及图11中所示的各种补强结构可以根据耳机固定部311的刚度需求进行合理的组合，在此不作限制。
图12是根据本申请一些实施例所示的图10及图11中补强结构318所对应的频率响应曲线示意图。如图12所示，曲线(A+B)可以表示耳机固定部311的材质与机芯壳体21的材质不相同(例如前者的弹性模量小于后者的弹性模量)，且耳机固定部311在结构上也未做任何改进时耳机的频率响应曲线；曲线(B+B)可以表示耳机固定部311的材质与机芯壳体21的材质相同(例如两者的弹性模量相等)，耳机固定部311在结构上与机芯壳体21相似(例如两者的厚度相等，耳机固定部311的面积与底壁211的面积也相等)时耳机的频率响应曲线。其中，A可以对应于耳机固定部311，B可以对应于底壁211(也即是机芯壳体21的皮肤接触区域)；(A+B)和(B+B)在结构上则可以对应于耳挂壳体31(具体可以是耳机固定部311)盖设在机芯壳体21上。
由图12可以毫无疑义地得出：对于结构(A+B)而言，其谐振谷(可以对应于上述的第一高频谷V)出现在频率约5500Hz处；而对于结构(B+B)而言，其谐振谷(可以对应于上述的第一高频谷V)出现在频率约8400Hz处。显然，若将结构(A+B)改进为结构(B+B)，则可以有效地增加结构的谐振频率。
进一步地，对于结构(A+B)而言，在耳机固定部311上设置如图10中(a)所示的倒角(Fillet)、如图10中(b)所示的加厚(Thicken)、如图11中(a)所示的长边加筋(Long-Side)、如图11中(b)所示的短边加筋(Short-Side)、如图11中(c)所示的十字加筋(Cross)、如图11中(d)所示的辐射加筋(Radiational)等补强结构318之后，(A+B+补强结构)的谐振谷均出现在频率范围5500-8400Hz内。换句话说，在耳机固定部311上设置补强结构318确实有助于增加结构的谐振频率，也即是有助于缩小耳机固定部311与机芯壳体21之间的刚度差值，进而有助于改善上述的漏音。需要注意的是，补强结构318的结构不同，谐振频率的增加效果各有不同，也即是漏音的改善程度各有不同。仅作为示例，若将补强结构318对谐振频率的增加效果由极优到相对较优进行排序，则该顺序为：十字加筋>短边加筋>辐射加筋>加厚>长边加筋>倒角。
基于上述的详细描述，机芯22在电信号的激励作用下产生振动，并带动机芯壳体21随之一起振动。在用户佩戴骨传导耳机10时，机芯壳体21的底壁211(也即是皮肤接触区域)可以与用户的皮肤接触，使得上述的振动能够经人的颅骨传递至听神经，进而使得用户能够听到骨传导耳机10播放的声音。此时，为了保证振动的传递过程具有可靠性，至少需要机芯壳体21能够跟随机芯22一起振动。因此，需要将机芯22固定在机芯壳体21内。
图13是根据本申请一些实施例所示的图8中机芯模组组装之后沿着I-I方向的剖视结构示意图。如图13及图8所示，机芯壳体21的一端(例如，在远离所述底壁211的一端)开口，机芯支架23和机芯22容置在机芯壳体21内。其中，机芯支架23用于将机芯22固定在机芯壳体21内。图14是根据本申请一些实施例所示的图8中机芯支架23的结构示意图。如图14所示，机芯支架23可以包括环形的支架主体231和设置在支架主体231上的限位结构。机芯22挂设在支架主体231上，以与机芯壳体21固定连接。如图13所示，限位结构与机芯壳体21可以干涉配合，使得机芯支架23沿支架主体231的周向(如图14中箭头C所示的方向)与机芯壳体21保持相对固定。其中，支架主体231所在的平面可以平行于底壁211所在的平面，以增加两者之间的 贴合度，进而增加上述的振动的传递效果。此时，支架主体231与底壁211之间还可以设置诸如结构胶、热熔胶、瞬干胶等胶体(图13中未示出)。如此设置，机芯支架23与机芯壳体21之间可以通过卡接与胶接组合的方式进行组装，进而可以有效地限制机芯支架23与机芯壳体21之间的自由度。在一些实施例中，机芯支架23与机芯壳体21之间也可以直接通过胶接的方式进行固定。例如，在支架主体231与底壁211之间设置诸如结构胶、热熔胶、瞬干胶等胶体(图13中未示出)，同样可以有效地限制机芯支架23与机芯壳体21之间的自由度，还可以简化机芯壳体21的结构。
如图13所示，机芯壳体21还可以包括连接于底壁211或环形周壁212的定位柱213。如图14所示，限位结构可以包括第一限位结构232。其中，第一限位结构232设置有插置孔233。定位柱213插置在插置孔233内。如此设置，可以有效地增加机芯支架23与机芯壳体21之间组装的精准度。此时，支架主体231与底壁211之间还可以设置上述的胶体。
在一些实施例中，如图14所示，限位结构还可以包括第二限位结构234。第二限位结构234沿支架主体231的周向(如图14中箭头C所示的方向)与第一限位结构232间隔设置。其中，第二限位结构234能够与环形周壁212形成抵接，将在后文中进行详细的说明。如此设置，第二限位结构234和第一限位结构232分别与机芯壳体21上对应的结构配合，使得机芯支架23与机芯壳体21保持相对固定，也即是有效地限制机芯支架23与机芯壳体21之间的自由度。
如图8所示，环形周壁212的开口端具有一长轴方向(如图8中点划线X所示的方向)和一短轴方向(如图8中点划线Y所示的方向)。其中，环形周壁212的开口端沿长轴方向的尺寸可以大于沿短轴方向的尺寸。进一步地，图15是根据本申请一些实施例所示的图8中机芯模组组装之后的俯视结构示意图。如图15所示，第一限位结构232和第二限位结构234沿长轴方向间隔设置在支架主体231的相对两侧，且第一限位结构232和第二限位结构234在环形周壁212的开口端所在的参考平面(如图15中虚线矩形框所示的平面)上的投影至少部分位于支架主体231在参考平面上的投影的外侧。如此设置，以便于第一限位结构232与定位柱213配合，第二限位结构234与环形周壁212配合。
如图14所示，第一限位结构232可以包括第一轴向延伸部2321和第一径向延伸部2322。其中，第一轴向延伸部2321与支架主体231连接，并沿支架主体231的轴向(如图14中点划线Z所示的方向)向机芯22所在一侧延伸；第一径向延伸部2322与第一轴向延伸部2321连接，并沿支架主体231的径向(也即是支架主体231的直径所在的方向)向支架主体231的外侧延伸。此时，插置孔233设置在第一径向延伸部2322上，如图13至图15所示，以便于第一限位结构232与定位柱213配合。进一步地，如图14所示，第二限位结构234可以包括第二轴向延伸部2341和第二径向延伸部2342。其中，第二轴向延伸部2341与支架主体231连接，并沿支架主体231的轴向向机芯22所在一侧延伸；第二径向延伸部2342与第二轴向延伸部2341连接，并沿支架主体231的径向向支架主体231的外侧延伸。此时，第二径向延伸部2342与环形周壁212抵接，如图13及图15所示，例如两者卡接，以便于第二限位结构234与环形周壁212形成抵接。如此设置，如图13所示，机芯22位于第一轴向延伸部2321和第二轴向延伸部2341之间。
需要说明的是，如图13至图15所示，以机芯22作为参考，若第一轴向延伸部2321和第二轴向延伸部2341之间的区域为支架主体231的内侧，则该内侧以外的区域即为支架主体231的外侧。
参阅图13，环形周壁212还可以包括与第一限位结构232对应且相对于底壁211倾斜设置的倾斜区域214。其中，定位柱213可以设置在倾斜区域214上。如此设置，可以缩小第一径向延伸部2322与底壁211之间的有效距离，也即是减小定位柱213的高度，进而增加定位柱213(尤其是其与倾斜区域214连接的根部)在机芯壳体21上的结构强度，以避免定位柱213在骨传导耳机10发生跌落、碰撞等极限情况时出现断裂、脱落的不良现象。
参阅图15，第二限位结构234的数量可以为沿短轴方向间隔设置的两个。其中，第一限位结构232在参考平面上的投影和两个第二限位结构234在参考平面上的投影依次连线形成一锐角三角形(如图15中虚线三角形所示)。此时，该锐角三角形具体可以是锐角等腰三角形，也可以是等边三角形。如此设置，以使得机芯支架23与机芯壳体21之间的相互作用点尽量地呈对称设置，进而增加机芯支架23与机芯壳体21组装的可靠性。
在一些实施例中，支架主体231的外轮廓可以呈圆形设置，环形周壁212沿短轴方向可以相对设置有两个弧形凹陷区2121。其中，支架主体231的外轮廓分别嵌入两个弧形凹陷区2121。如此设置，可以进一步限制机芯支架23与机芯壳体21之间的自由度。
基于上述的详细描述，当机芯壳体21的弹性模量大于耳挂壳体31的弹性模量时，耳挂壳体31与机芯壳体21连接之后形成上述的结构(A+B)，由于刚度的差异，使得结构(A+B)的谐振频率可能较低(如图12中曲线(A+B)所示)，也容易出现上述的漏音；而将结构(A+B)改进为结构(B+B)之后，可以有效地增加结构的谐振频率(如图12中曲线(B+B)所示)。基于此，本实施例对机芯模组20的相关结构进行改进。
图16是根据本申请一些实施例所示的图1中机芯模组20的分解结构示意图。如图16所示，机芯模组20还可以包括盖板24。其中，机芯壳体21的一端开口，盖板24盖设在机芯壳体21的开口端上，以形成用于容纳机芯22的腔体结构。换句话说，盖板24盖设在环形周壁212远离底壁211的另一端，并与底壁211相对设置。此时，盖板24与机芯壳体21之间可以通过胶接或卡接与胶接组合的方式进行连接。进一步地，耳挂壳体31连接于盖板24，例如耳机固定部311以全覆盖或半覆盖的方式覆盖在盖板24背离机芯壳体21的一侧。其中，本实施例以耳机固定部311对盖板24进行全覆盖为例进行示例性的说明。此时，耳挂壳体31与机芯壳体21之间依然可以通过胶接或卡接与胶接组合的方式进行连接。
需要说明的是，图16中示意的耳挂壳体，是为了便于描述耳挂壳体与盖板之间的相对位置关系，进而隐式地示意出耳挂壳体与盖板之间一种可能的组装方式。
在一些实施例中，机芯壳体21的弹性模量大于耳挂壳体31的弹性模量，盖板24的弹性模量大于耳挂壳体31的弹性模量。此时，本实施例以盖板24代替耳机固定部311与机芯壳体21连接，有助于增加位于机芯壳体21开口端的结构(具体可以是盖板24和耳机固定部311)的刚度，进而有助于缩小机芯壳体21的底壁211的刚度与其开口端的结构的刚度之间的差值。如此设置，既可以保证机芯壳体21具有足够大的刚度而使得其谐振频率位于尽可能高的高频区，也有助于增加结构(机芯壳体21+盖板24+耳机固定部311)的谐振频率，并有助于改善上述的漏音。
在一些实施例中，盖板24的弹性模量可以小于或等于机芯壳体21的弹性模量。例如，盖板24的弹性模量等于机芯壳体21的弹性模量。此时，盖板24与机芯壳体21连接之后可以形成类似于上述的结构(B+B)。如此设置，可以使得底壁211的刚度K1与盖板24的刚度K3之间的差值与底壁211的刚度K1的比值小于或等于第二预设比例阈值。在一些实施例中，所述第二预设比例阈值可以为10％。也即是(K1-K3)/K1≤10％，或是K3/K1≥90％。
在一些实施例中，底壁211的面积小于或等于盖板24的面积，且底壁211的厚度小于或等于盖板24的厚度。基于上述的详细描述，在保证一定佩戴舒适度的前提下，减小底壁211的面积，可以增加机芯壳体21的谐振频率。因此，本实施方式出于保证机芯壳体21具有足够大的刚度而使得其谐振频率位于尽可能高的高频区的考虑，使得底壁211的面积小于或等于盖板24的面积，也即是机芯壳体21开口端的面积大于底壁211的面积。在一些实施例中，根据上述的关系式K∝(E·t)/S，当盖板24的弹性模量小于或等于机芯壳体21的弹性模量，且底壁211的面积小于或等于盖板24的面积时，为了满足上述的关系式(K1-K3)/K1≤10％，需要底壁211的厚度小于或等于盖板24的厚度。
在一些实施例中，盖板24的材质可以与机芯壳体21的相同，例如盖板24的材质为聚碳酸酯与玻璃纤维和/或碳纤维的混合物。在一些实施例中，根据上述的关系式K∝(E·t)/S，为了满足上述的关系式K3/K1≥90％，需要盖板24的厚度和面积的比值与底壁211的厚度和面积的比值之间的比值大于或等于90％。仅作为示例，底壁211的厚度和面积的比值可以与盖板24的厚度和面积的比值相等。
需要说明的是，根据上述的关系式K∝(E·t)/S，为了满足上述的关系式(K1-K3)/K1≤10％，可以基于盖板24和机芯壳体21的材质去设计盖板24和机芯壳体21的结构参数(例如厚度、面积及其比例)，也可以根据盖板24和机芯壳体21的结构参数去选择盖板24和机芯壳体21的材质。因此，上述的实施方式仅作为示例给出了两种可能的设计方案。
基于上述的详细描述，当盖板24代替耳机固定部311与机芯壳体21连接之后，耳机固定部311依旧需要与盖板24背离机芯壳体21的一侧连接，例如耳机固定部311对盖板24进行全覆盖。
在一些实施例中，若耳挂壳体31和盖板24均为塑胶制件，且前者的弹性模量小于后者的弹性模量，则两者可以借助双色注塑形成一体结构件。若耳挂壳体31为塑胶制件，而盖板24为金属制件，且前者的弹性模量小于后者的弹性模量，则两者可以借助金属嵌件注塑形成一体结构件。此时，耳挂壳体31和盖板24将作为一个整体与机芯壳体21连接。如此设置，可以很好地保证耳挂壳体31和盖板24在振动上的一致性。但是耳挂壳体31与盖板24之间也将很难设置前 文中提及的按键、后文中提及的第二传声器等。
在一些实施例中，耳机固定部311与盖板24之间通过胶接或卡接与胶接组合的方式进行连接。此时，耳挂壳体31与盖板24之间还设置前文中提及的按键、后文中提及的第二传声器等，具体结构将在后文中进行详细的说明。在一些实施例中，耳机固定部311与盖板24之间设置的胶体(图16中未示出)在两者之间的填充度应该尽可能的大，例如该填充度大于或等于90％。因为，当耳机固定部311与盖板24之间设置的胶体在两者之间的填充度较小时，不仅耳机固定部311与盖板24的连接强度难以得到保证，两者的振动也可能存在较大滞后的问题，两者之间可能还会夹杂空气，导致结构的谐振频率受到不利的影响，也即是上述的将结构(A+B)改进为结构(B+B)的有益效果难以得到保证，结构在振动的过程中还可能出现杂音的问题。
图17是根据本申请一些实施例所示的图14中耳挂组件30与盖板24之间设置不同类型的胶体对应的结构的频率响应曲线示意图。如图17所示，耳机固定部311与盖板24之间设置不同类型的胶体(例如结构胶、热熔胶、瞬干胶、硅胶等)对结构的谐振频率也有较大的影响。其中，由图17可以得出：不同类型的胶体确实对结构的谐振频率存在影响；若将上述的胶体对谐振频率的有利效果由优到劣进行排序，则该顺序为：结构胶>热熔胶>瞬干胶>硅胶。需要说明的是，由于硅胶的质地一般较软，使得其对结构的谐振频率的有利效果最弱。因此，如果考虑结构的谐振频率，那么可以在耳机固定部311与盖板24之间设置硬度较大的胶体。
基于上述的详细描述，一方面，机芯支架23可以用于将机芯22固定在机芯壳体21内，以增加机芯22带动机芯壳体21振动的可靠性；另一方面，盖板24可以用于增加位于机芯壳体21开口端的结构(具体可以是盖板24和耳机固定部311)的刚度，以缩小机芯壳体21的底壁211的刚度与其开口端的结构的刚度之间的差值。其中，就机芯支架23与机芯壳体21之间的配合(尤其是在上述的Z方向上的)而言，可以通过支架主体231与底壁211之间的胶接；和/或，限位结构与环形周壁212之间的卡接来实现。进一步地，本实施例基于盖板24，就机芯支架23与机芯壳体21之间的配合(尤其是在上述的Z方向上的)提供了另一发明构思。
图18是根据本申请一些实施例所示的图16中机芯模组20组装之后沿着II-II方向的剖视结构示意图。图19是根据本申请一些实施例所示的图16中盖板24靠近机芯壳体21一侧的结构示意图。如图18及图19所示，盖板24不仅盖设在机芯壳体21的开口端上，盖板24朝向机芯壳体21的一侧还设置抵压结构。其中，抵压结构用于将机芯支架23抵压固定在机芯壳体21内。如此设置，盖板24不仅可以增加位于机芯壳体21开口端的结构(具体可以是盖板24和耳机固定部311)的刚度，还可以将机芯支架23压设在机芯壳体21内，进而使得盖板24能够实现“一件两用”。
如图19所示，盖板24可以包括盖板主体241和与盖板主体241一体连接的抵压结构。其中，抵压结构可以包括第一抵压柱242和第二抵压柱243，第一抵压柱242与第二抵压柱243沿盖板主体241的周向间隔设置，并与机芯支架23形成抵接。在一些实施例中，盖板主体241所在的平面可以平行于底壁211所在的平面，使得盖板主体241所在的平面可以平行于支架主体231所在的平面，进而使得第一抵压柱242和第二抵压柱243的延伸方向均可以垂直于支架主体231所在的平面，也即是第一抵压柱242和第二抵压柱243的延伸方向均可以平行于上述的Z方向。如此设置，可以有效地限制机芯支架23与机芯壳体21之间的自由度，尤其是在上述的Z方向上的。
图20是根据本申请一些实施例所示的图19中盖板的俯视结构示意图。如图20所示，盖板24可以具有一长轴方向(如图20中点划线X所示的方向)和一短轴方向(如图20中点划线Y所示的方向)。其中，盖板24沿长轴方向的尺寸可以大于沿短轴方向的尺寸。此时，第一抵压柱242与第二抵压柱243沿长轴方向间隔设置。如此设置，以增加盖板24将机芯支架23压设在机芯壳体21内的可靠性。
在一些实施例中，第二抵压柱243的数量可以为沿短轴方向间隔设置的两个。其中，第一抵压柱242在盖板主体241上的投影和两个第二抵压柱243在盖板主体241上的投影依次连线形成一锐角三角形(如图20中虚线三角形所示)。此时，该锐角三角形具体可以是锐角等腰三角形，也可以是等边三角形。如此设置，以使得盖板24与机芯支架23之间的相互作用点尽量地呈对称设置，进而增加盖板24将机芯支架23压设在机芯壳体21内的可靠性。
参阅图18，第一抵压柱242与第一限位结构232接触并形成抵接，第二抵压柱243与第二限位结构234接触并形成抵接。此时，第二限位结构232与环形周壁212之间可以不形成如图13所示的抵接配合关系，以降低第二限位结构232的加工精度，进而节省机芯支架23的制作成 本。
类似地，如图14所示，第一限位结构232可以包括第一轴向延伸部2321和第一径向延伸部2322。其中，第一轴向延伸部2321与支架主体231连接，并沿支架主体231的轴向(如图14中点划线Z所示的方向)向机芯22所在一侧延伸；第一径向延伸部2322与第一轴向延伸部2321连接，并沿支架主体231的径向(也即是支架主体231的直径所在的方向)向支架主体231的外侧延伸。此时，插置孔233设置在第一径向延伸部2321上，第一抵压柱242与第一径向延伸部2321抵接，也即是由第一抵压柱242抵压第一径向延伸部2321。进一步地，如图14所示，第二限位结构234可以包括第二轴向延伸部2341和第二径向延伸部2342。其中，第二轴向延伸部2341与支架主体231连接，并沿支架主体231的轴向向机芯22所在一侧延伸；第二径向延伸部2342与第二轴向延伸部2341连接，并沿支架主体231的径向向支架主体231的外侧延伸。此时，第二抵压柱243与第二径向延伸部2342抵接，也即是两者接触并形成抵压。
需要说明的是，当第二抵压柱243的数量为沿短轴方向间隔设置的两个，且第一抵压柱242在盖板主体241上的投影和两个第二抵压柱243在盖板主体241上的投影依次连线形成一锐角三角形时，第二限位结构234的数量也可以为沿短轴方向间隔设置的两个，并分别与第二抵压柱243对应设置。如此设置，以在第一抵压柱242抵接于第一限位结构232(具体可以为第一径向延伸部2322)时，两个第二抵压柱243能够分别抵接于第二限位结构234(具体可以为第二径向延伸部2342)，进而增加盖板24将机芯支架23压设在机芯壳体21内的可靠性。
值得注意的是，如图18所示，由于第一轴向延伸部2321和第二轴向延伸部2341朝向靠近盖板24的方向延伸，第一抵压柱242和第二抵压柱243也朝向靠近机芯壳体21的方向延伸，使得第一限位结构232和第二限位结构234相对于支架主体231的高度、第一抵压柱242和第二抵压柱243相对于盖板主体241的高度，均可以为盖板主体241与支架主体231之间距离的一半。如此设置，以避免第一限位结构232和第二限位结构234因其相对于支架主体231的高度过大而在骨传导耳机10发生跌落、碰撞等极限情况时出现断裂、脱落的不良现象；或者，避免第一抵压柱242和第二抵压柱243因其相对于盖板主体241的高度过大而在骨传导耳机10发生跌落、碰撞等极限情况时出现断裂、脱落的不良现象，进而兼顾第一限位结构232和第二限位结构234在支架主体231上的结构强度与第一抵压柱242和第二抵压柱243在盖板主体241上的结构强度。
参阅图19，第一抵压柱242呈管状设置。此时，如图18所示，定位柱213不仅插置在插置孔233内，以增加机芯支架23与机芯壳体21之间组装的精准度；还进一步插置在第一抵压柱242内，以增加盖板24与机芯壳体21之间组装的精准度。
图21是根据本申请一些实施例所示的图16中机芯模组另一视角的分解结构示意图。如图21所示，机芯模组20还可以包括第一传声器25和第二传声器26。其中，当盖板24盖设在机芯壳体21的开口端上之后，两者形成用于容纳机芯22的腔体结构。此时，第一传声器25可以容纳在机芯壳体21内，第二传声器26可以设置在机芯壳体21外，以使得盖板24将第一传声器25与第二传声器26隔开，进而避免两者之间产生干扰(尤其是两者的后音腔)。如此设置，盖板24不仅可以增加位于机芯壳体21开口端的结构(具体可以是盖板24和耳机固定部311)的刚度，并可以将机芯支架23压设在机芯壳体21内，还可以将第一传声器25与第二传声器26隔开，进而使得盖板24能够实现“一件三用”。进一步地，当耳挂壳体31盖设于盖板24时，也即是耳机固定部311盖设在盖板24背离机芯壳体21的一侧时，第二传声器26可以设置在盖板24与耳机固定部311之间。
在一些实施例中，第一传声器25和第二传声器26均可以与主控电路板50连接，以便于两者将声音处理后传送至主控电路板50。其中，第一传声器25和第二传声器26可以是电动式、电容式、压电式、碳粒式、半导体式等类型中的任意一种或其组合，具体的可以是驻极体式拾音器或硅式拾音器，其具体结构在本领域技术人员的理解范围之内，此处不再详述。此时，第一传声器25和第二传声器26可以用于拾取佩戴者所在环境的声音，以便于骨传导耳机10进行降噪处理，进而改善骨传导耳机10的用户好感度；也可以用于拾取佩戴者的语音，以便于骨传导耳机10在实现扬声器功能的同时还可以实现麦克风功能，进而扩大骨传导耳机10的应用范围。当然，第一传声器25和第二传声器26还可以同时拾取佩戴者的语音及其所在环境的声音，以在骨传导耳机10实现麦克风功能的同时，还可以进行降噪处理，进而改善骨传导耳机10的用户好感度。
如图21所示，环形周壁212的内侧设置有环形凸缘215，第一传声器25可以嵌入并固定在环形凸缘215内。盖板24(具体可以是盖板主体241)背离机芯壳体21的一侧凹陷设置有传声 器容置槽244，第二传声器26可以设置在传声器容置槽244内，并由耳机固定部311覆盖，以降低盖板24与耳机固定部311之间设置第二传声器26之后的整体厚度，进而增加三者在结构上的可行性及可靠性。换句话说，第一传声器25固定在环形周壁212上，第二传声器26固定在盖板24上。此时，为了便于第一传声器25和第二传声器26拾取佩戴者的语音和/或其所在环境的声音，环形周壁212上对应于第一传声器25的位置一般会开设一拾音孔(图中未标注)，耳机固定部311上对应于第二传声器26的位置一般也会开设一拾音孔(图中未标注)。其中，第一传声器25的入声方向可以平行于盖板24或相对于盖板24倾斜设置，第二传声器26的入声方向可以垂直于盖板24。如此设置，使得第一传声器25和第二传声器26能够拾取来自不同方向的声音，以增加骨传导耳机10的降噪效果和/或麦克风效果，进而改善骨传导耳机10的用户好感度。
需要说明的是，第一传声器25的入声方向垂直于环形周壁212。基于上述的详细描述，盖板24(具体可以是盖板主体241)所在的平面可以平行于底壁211所在的平面，而环形周壁212可以垂直于底壁211，也可以相对于底壁211向外倾斜一角度(例如倾斜角小于等于30°)。因此，当环形周壁212垂直于底壁211时，第一传声器25的入声方向平行于盖板24；而当环形周壁212相对于底壁211向外倾斜一角度时，第一传声器25的入声方向相对于盖板24倾斜设置，且两者的倾斜角度可以大体相等。
在一些实施例中，第二传声器26在盖板24上的投影与第一传声器25在盖板24上的投影可以彼此错开。如此设置，使得第一传声器25和第二传声器26能够拾取来自不同方向的声音，以增加骨传导耳机10的降噪效果和/或麦克风效果，进而改善骨传导耳机10的用户好感度。其中，第二传声器26在盖板24上的投影可以相较于第一传声器25在盖板24上的投影更靠近弯折过渡部312设置。如此设置，以增加第一传声器25和第二传声器26之间的相对距离，进一步使得第一传声器25和第二传声器26拾取来自不同方向的声音。在一些实施例中，该相对距离越大越好。
需要说明的是，在图21所示的视角下，第一传声器25和第二传声器26分别位于盖板24的相对两侧，且第一传声器25位于盖板24的背面，使得第一传声器25在盖板24上的投影实际上是不可见的。因此，为了便于进行相应的描述，此处简单地看作第一传声器25和第二传声器26位于盖板24的同一侧，并用虚线框代替第一传声器25在盖板24上的投影。
图22是根据本申请一些实施例所示的图21中盖板的俯视结构示意图。如图22所示，盖板24可以具有一长轴方向(如图22中点划线X所示的方向)和一短轴方向(如图22中点划线Y所示的方向)。其中，盖板24沿长轴方向的尺寸可以大于沿短轴方向的尺寸。此时，第二传声器26在盖板24上的投影与第一传声器25在盖板24上的投影之间的连线(如图22中所示的虚线)与长轴方向之间的夹角小于45°。例如，该夹角小于或等于10°。再例如，第二传声器26在盖板24上的投影与第一传声器25在盖板24上的投影之间的连线即与长轴方向重合。如此设置，既可以使得第二传声器26在盖板24上的投影与第一传声器25在盖板24上的投影可以彼此错开，又可以增加两者之间的相对距离，进而使得第一传声器25和第二传声器26能够进一步拾取来自不同方向的声音。其中，第二传声器26在盖板24上的投影可以相较于第一传声器25在盖板24上的投影更靠近弯折过渡部312设置。
基于上述的详细描述，机芯22及第一传声器25可以设置在机芯壳体21内，且盖板24又可以盖设在机芯壳体21的开口端上，为了便于走线，盖板24上可以开设相应的通孔及凹槽。如图21及图16所示，盖板24还开设有穿线孔245。其中，由于第二传声器26在盖板24上的投影可以相较于第一传声器25在盖板24上的投影更靠近弯折过渡部312设置，使得穿线孔245可以靠近第一传声器25设置。如此设置，以允许连接第一传声器25与主控电路板50的导线(图21及图16中均未示出)可以从机芯壳体21内经穿线孔245延伸至盖板24背离机芯壳体21的一侧，并进一步经弯折过渡部312内的走线通道延伸至容置仓313内。此时，在耳机固定部311覆盖盖板24之后，导线也会至少部分(其长度可以至少为穿线孔245相对于第二传声器26的直线距离)位于盖板24与耳机固定部311之间。
在一些实施例中，如图21及图16所示，盖板24背离机芯壳体21的一侧还可以凹陷设置有走线槽246。其中，走线槽246的一端与穿线孔245连通，上述的导线可以进一步沿走线槽146延伸。如此设置，以降低盖板24与耳机固定部311之间设置部分导线之后的整体厚度，进而增加三者在结构上的可行性及可靠性。
需要说明的是，在导线从机芯壳体21内经穿线孔245及走线槽246进行走线之后，还可以至少在走线槽246的两端进行点胶，使得导线与盖板24相对固定，进而增加盖板24、耳机固定 部311及导线在结构上的紧凑性。其中，尤其是在穿线孔245处进行点胶，还可以改善机芯模组20的气密性。
在一些实施例中，如图21所示，环形周壁212的内侧还可以并排设置有两个理线槽216，两个理线槽216可以靠近环形凸缘215。其中，正负外部导线(图21中未示出)与机芯22的正负接线端(图21中未示出)之间所形成的两个焊点分容纳在两个理线槽216内。如此设置，以避免机芯22的正负接线端与上述的导线的正负极焊接时出现短路等不良现象，进而增加机芯22走线的可靠性。
在一些实施例中，当骨传导耳机10还设置有如图4所示的按键36时，盖板24背离机芯壳体21的一侧还可以设置有按键容置槽(图1中可见，但未标注)。其中，按键36设置在按键容置槽内，并由耳机固定部311覆盖。如此设置，以降低盖板24与耳机固定部311之间设置按键36之后的整体厚度，进而增加三者在结构上的可行性及可靠性。此时，按键容置槽类似于上述的传声器容置槽244。
需要说明的是，图2所示的容置仓313可以用于容纳主控电路板50，而图4所示的容置仓313可以用于容纳电池60。因此，第一传声器25和第二传声器26均可以具体对应于图2所示的耳挂组件30，以便于两者与主控电路板50连接，进而缩短走线的距离。另外，由于机芯模组20及耳挂组件30的体积有限，如果将按键36与第一传声器25和第二传声器26设置在一起，可能会导致三者在结构上产生干涉。因此，按键36可以具体对应于图4所示的耳挂组件30。换句话说，若按键36对应于骨传导耳机10的左耳挂，则第一传声器25和第二传声器26可以对应于骨传导耳机10的右耳挂；反之，若按键36对应于骨传导耳机10的右耳挂，则第一传声器25和第二传声器26可以对应于骨传导耳机10的左耳挂。在一些实施例中，对于如图8所示的机芯模组20而言，由于其并不具有如图16所示的机芯模组20的盖板24，使得上述的第一传声器25、第二传声器26及按键36等相关结构可能需要进行相应的调整。例如：骨传导耳机10仅具有一个第一传声器25或第二传声器26；或者，骨传导耳机10依旧具有第一传声器25和第二传声器26，并在第一传声器25和第二传声器26中的任意一者对应于骨传导耳机10的左耳挂时，另一者则对应于骨传导耳机10的右耳挂。再例如：按键36具体固定在耳机固定部311靠近机芯壳体21的一侧。
图23是根据本申请一些实施例所示的机芯的原理示意图。如图23所示，机芯22可以包括导磁罩221、磁体222、导磁板223和线圈224。其中，导磁罩221可以包括底板2211和与底板2211一体连接的环形侧板2212。进一步地，磁体222可以设置在环形侧板2212内并固定在底板2211上，导磁板223可以固定在磁体222背离底板2211的一侧。线圈224可以设置在磁体222与环形侧板2212之间的磁间隙225内，并可以固定在机芯支架23上。在一些实施例中，磁体222与环形侧板2212之间的磁间隙可以为m，m可以大于等于第一间隙且小于等于第二间隙，以便于兼顾线圈224的运动需求及机芯22的紧凑性。例如，1.0mm≤m≤1.5mm。
需要说明的是，图23所示的机芯既可以应用于图8所示的机芯模组中，也可以应用于图16所示的机芯模组中。图23中示意的机芯支架，是为了便于描述机芯支架与机芯之间的相对位置关系，进而隐式地示意出机芯支架与机芯之间一种可能的组装方式。
在一些实施例中，磁体222可以包括金属合金磁铁、铁氧体等。具体地，金属合金磁铁可以包括钕铁硼、钐钴、铝镍钴、铁铬钴、铝铁硼、铁碳铝等中的任意一种或其组合；铁氧体可以包括钡铁氧体、钢铁氧体、美锰铁氧体、锂锰铁氧体等中的任意一种或其组合。在一些实施例中，磁体222具有一磁化方向，以便于形成一个相对稳定的磁场。
导磁罩221和导磁板223相互配合，用于调整磁体222产生的磁场，以便于增加该磁场的利用率。其中，导磁罩221和导磁板223可以由金属材料、金属合金、金属氧化物材料、非晶金属材料等软磁材料加工制得。具体地，上述的软磁材料可以包括铁、铁硅系合金、铁铝系合金、镍铁系合金、铁钴系合金、低碳钢、硅钢片、矽钢片、铁氧体等。
如此设置，线圈224处于磁体222、导磁罩221和导磁板223形成的磁场中，并在电信号的激励作用下，受到安培力的作用。线圈224在安培力的驱动下使得机芯22产生机械振动，而机芯22可以通过机芯支架23固定在机芯壳体21内，使得机芯壳体21能够随之一起振动。本实施例中，线圈224的电阻可以为预设电阻值，例如8Ω，以便于兼顾安培力的产生需求及机芯22的电路结构。
基于上述的详细描述，机芯壳体21的容积往往是有限的，其中至少需要容纳设置机芯22、机芯支架23及第一传声器25等结构件。虽然通过增大机芯22(例如增大磁体222的体积和/ 或增加线圈224的匝数)的方式可以获得更大的安培力，进而更好地带动机芯壳体21；但是这样也会增加机芯模组20的重量及体积，不利于机芯模组20的轻质化。为此，在一些实施例中，可以基于安培力公式F＝BILsinθ对机芯22进行研究及优化设计。其中，参数B可以表示磁体222、导磁罩221和导磁板223形成的磁场的强度，参数L可以表示线圈224在上述的磁场中的有效长度，而参数θ则可以表示两者的夹角(此处取θ＝90°)，参数I可以表示线圈224中某一时刻的电流。显然，对于一个设计、制造并组装完成的机芯22而言，参数B和L往往是相对确定的数值，而参数I则是随着机芯22中输入的电信号的变化而变化。因此，对机芯22的优化设计，可以简单地看作是对力系数BL的优化设计；而参数B和L又可以取决于磁体222、导磁罩221和导磁板223的形状、尺寸等结构参数。
下面就磁体222、导磁罩221和导磁板223的形状、尺寸等结构参数对力系数BL的影响进行详细的说明。在一些实施例中，磁体222可以呈圆柱体。图24是根据本申请一些实施例所示的图23中磁体对力系数BL的关系示意图。如图24所示，横坐标为磁体222的直径φ，纵坐标为磁体222的厚度t1。由图24可以得出：磁体222的直径φ越大，力系数BL的数值随之越大；磁体222的厚度t1越大，力系数BL的数值也随之越大。在一些实施例中，为了使得骨传导耳机10能够产生足够的音量，也即是产生足够大的安培力以驱动线圈224进而带动机芯壳体21振动，一般需要力系数BL的数值大于力系数阈值。仅作为示例，所述力系数阈值可以是1.3。在一些实施例中，综合考虑机芯模组20(具体可以是机芯22)的重量及体积，磁体222的直径φ可以大于等于第一直径且小于等于第二直径。例如，10.5mm≤φ≤11.5mm。再例如，磁体222的直径φ可以取10.8mm。在一些实施例中，磁体222的厚度t1可以大于等于第一厚度且小于等于第二厚度。例如，3.0mm≤t1≤4.0mm。再例如，厚度t1可以取3.5mm。
在一些实施例中，导磁板223的直径与磁体222的直径可以相等，导磁板223的厚度与导磁罩221的厚度也可以相等，导磁板223与导磁罩221还可以由相同的材质制得。图25是根据本申请一些实施例所示的图23中导磁罩和导磁板的厚度对力系数BL的关系示意图。如图25所示，横坐标为导磁罩221的厚度t2，纵坐标为力系数BL。由图25可以得出：在一定的范围之内，力系数BL的数值随着厚度t2的增加而增加；但是，对于t2＞0.8mm而言，力系数BL的数值的变化并不明显，也即是在t2＞0.8mm之后继续增加厚度t2不仅收益甚小反而还会增加机芯22的重量。因此，综合考虑力系数BL的数值(至少大于1.3)和机芯模组20(具体可以是机芯22)的重量及体积，导磁板223和/或导磁罩221的厚度t2可以大于等于第三厚度且小于等于第四厚度。例如，0.4mm≤t2≤0.8mm。再例如，厚度t2可以取0.5mm。
在一些实施例中，环形侧板2212也可以呈圆柱状，其直径D可以为磁体222的直径φ与两倍的磁间隙m之和，也即是D＝φ+2m。图26是根据本申请一些实施例所示的图23中导磁罩的高度对力系数BL的关系示意图。如图26所示，横坐标为导磁罩221(具体可以为环形侧板2212)的高度h，纵坐标为力系数BL。由图26可以得出：在一定的范围之内，力系数BL的数值随着导磁罩221的高度h的增加而增加；但是，对于h＞4.2mm而言，力系数BL的数值反而越来越小。因此，综合考虑力系数BL的数值(至少大于1.3)和机芯模组20(具体可以是机芯22)的重量及体积，导磁罩221的高度h可以大于等于第一高度且小于等于第二高度。例如，3.4mm≤h≤4.0mm。再例如，导磁罩221的高度h可以取3.7mm。
参阅图1，骨传导耳机10可以包括两个机芯模组20。其中，两个机芯模组20中的任意一者可以对应于图8所示的机芯模组，另一者则可以对应于图16所示的机芯模组。需要说明的是，每一机芯模组20的具体结构可以与上述任一实施例的相同或相似，可以参照上述任一实施例的详细描述，在此不再赘述。在一些实施例中，机芯模组20的数量可以不限于两个。例如，骨传导耳机10可以设置三个或以上的机芯模组20。又例如，在一些对立体声要求并不是特别高的应用场景下，例如听力患者助听、主持人直播提词等，骨传导耳机10也可以仅设置一个机芯模组20。再例如，所述耳机还可以包括设置有一个机芯模组20的气导耳机(例如，单耳式气导耳机)，所述气导耳机可以通过固定组件(例如，耳挂组件)挂设于用户耳廓，并通过一个或多个导声孔向用户传递声音信号。
在一些实施例中，磁体222还可以被配置为使所述机芯模组20吸附在磁性物体上。例如，磁体222可以靠近机芯壳体21的底壁211设置，使得机芯模组20可以在靠近底壁211的一侧具有磁性，从而通过底壁211的一侧吸附在磁性物体上。所述磁性物体包括可以被磁体222吸附的金属制品(例如，支架)、移动设备(例如，手机)、充电设备(例如，磁吸充电设备)、另一机芯模组(例如，如图27所示的相互吸附的两个机芯模组20)等，或其任意组合。
以磁性物体为充电设备为例，机芯壳体21的底壁211上可以设置有磁吸接头。在对耳机进行充电时，所述磁吸接头与充电器的对应电源接口构成一系统，二者在结构上互相匹配从而能够吸附在一起，进而建立电连接以对耳机进行充电。例如，磁体222可以作为所述磁吸接头的一部分设置在底壁211的内侧(即底壁211的背离用户头部的一侧)，使得所述磁吸接头可以吸附在充电设备的电源接口上。底壁211的外侧(即底壁211的面向用户头部的一侧)可以设置有充电端，所述充电端的一侧可以与充电设备的电源接口建立电连接，另一侧可以与耳机的电池60连接(例如，通过导线)，从而配合所述电源接口对耳机进行充电。在一些实施例中，所述充电端可以省略，所述耳机可以通过磁体222直接吸附在充电设备上以进行无线充电。示例性的无线充电方式可以包括电磁感应式无线充电、磁场共振无线充电、无线电波式无线充电、太阳能充电等，或其任意组合。在一些实施例中，所述充电设备可以包括固定充电设备、移动充电设备等。
在一些实施例中，骨传导耳机10可以包括两个机芯模组20。磁体222可以被配置为使两个机芯模组20能够相互吸附。图27是根据本申请一些实施例所示的图1中骨传导耳机处于非佩戴状态时的状态示意图。如图27所示，两个机芯模组20的磁体222靠近各自所在的机芯壳体21的底壁211一侧的极性互异，以在骨传导耳机10处于非佩戴状态时，两个机芯模组20能够相互吸附。如此设置，以便于用户收纳骨传导耳机10。值得注意的是，磁体222还用于形成磁场，使得线圈224在电信号的激励作用下能够产生振动。线圈224的振动可以通过骨传导和/或气导的方式传递到人耳的听觉神经，从而使人听到声音。此时，磁体222可以实现“一件两用”。
在一些实施例中，在机芯模组20组装之前，磁体222可以并未预先充磁；而是在机芯模组20组装之后，将机芯模组20作为一个整体置于充磁设备中进行充磁处理，进而使得磁体222具有磁性。其中，上述的充磁处理之后，两个机芯模组20的磁体222的磁场方向可以如图27所示。如此设置，由于磁体222在装配前没有磁性，使得机芯模组20的装配不会受到磁力的干扰，以增加机芯模组20的组装效率及良品率，进而增加骨传导耳机10的产能及效益。
图28是根据本申请一些实施例所示的图1中后挂组件40沿着III-III方向的断面结构示意图。如图28所示，后挂组件40可以包括弹性金属丝41、导线42和包覆弹性金属丝41和导线42的弹性包覆体43。其中，弹性包覆体43与导线42为挤出成型的一体结构件；包覆体43进一步形成有穿线通道(图28中未标注)，弹性金属丝41穿设在穿线通道内。例如，穿线通道在该挤出成型的过程中形成。在一些实施例中，弹性金属丝41的材质可以包括弹簧钢、钛合金、钛镍合金、铬钼钢等，弹性包覆体43的材质可以包括聚碳酸酯、聚酰胺、硅胶、橡胶等，以便于后挂组件40兼顾佩戴的舒适性及结构的刚度。
需要说明的是，由于弹性金属丝41经由穿线通道而穿设在包覆体43内，使得图28中弹性金属丝41所在的区域即可简单地看作是包覆体43内的穿线通道。
在一些实施例中，穿线通道在自然状态下的直径可以小于弹性金属丝41的直径，使得弹性金属丝41插入穿线通道后能够与弹性包覆体43保持固定，以避免后挂组件40因弹性包覆体43与弹性金属丝41之间的间隙过大而出现“压陷”的不良现象，尤其是在用户按压后挂组件40的情况下，进而增加后挂组件40在结构上的紧凑性。
在一些施例中，导线42的数量可以为至少两股。其中，每一股导线42可以包括金属线和包覆金属线的绝缘层(图28中均未示出)，绝缘层用于在金属线之间实现电绝缘。
在一些实施例中，如图1、图2、图4、图8及图16所示，由于主控电路板50和电池60可以分别设置在两个耳挂组件30内，且图2和图4所示的耳挂组件30可以分别对应于骨传导耳机10的左耳挂和右耳挂，使得不仅主控制电路板50和电池60需要经内置于后挂组件40的导线42连接，而且对应于图1中(左边的)耳挂组件30的机芯模组20(具体可以是其机芯22)及按键36需要进一步经内置于后挂组件40的导线42与对应于图1中(右边的)耳挂组件30的主控电路板50连接，对应于图1中(右边的)耳挂组件30的机芯模组20(具体可以是其机芯22、第一传声器25及第二传声器26)也需要进一步经内置于后挂组件40的导线42与对应于图1中(左边的)耳挂组件30的电池60连接。因此，导线42需要至少实现上述的三路电路的连接。
图29是根据本申请一些实施例所示的后挂组件加工方法的示例性流程图。基于上述的详细描述，本申请实施例的后挂组件40可以按照如下工艺流程2900加工制得。
步骤S2910，提供一挤出成型设备及导线。一方面，挤出成型设备中可以添加用于成型弹性包覆体43的原料。其中，在挤出成型的过程中，弹性包覆体43的原料至少会经历熔融塑化、机头口模挤出、定型、冷却、牵引等阶段。另一方面，导线42的数量可以为至少两股，以便于实现骨传导耳机10中各个电子元件之间的连接。在一些实施例中，每一股导线42可以包括金属线 和包覆金属线的绝缘层，以便于实现金属线之间的电绝缘。
步骤S2920，将导线置于挤出成型设备，使得弹性包覆体的原料与导线在挤出成型的过程中能够得到相应的第一半成品。其中，挤出成型设备可以牵引导线42，以在挤出成型的过程中，使得弹性包覆体43能够包覆于导线42。在一些实施例中，挤出成型设备的机头部分可以设置型芯，以在挤出成型的过程中，还使得弹性包覆体43的内部能够同时形成上述的穿线通道。因此，上述的第一半成品具体可以是弹性包覆体43与导线42的一体结构件，且包覆体43的内部具有一大体沿其轴线方向延伸的穿线通道。
步骤S2930，根据后挂组件的使用需求，将上述的第一半成品进一步切割成具有相应长度的第二半成品。其中，第二半成品的实际长度可以略大于其用于后挂组件的使用长度，也即是第二半成品此时还具有一定的余量，以便于进行后续的加工工序。
步骤S2940，将弹性金属丝穿设在第二半成品的穿线通道内，以制得后挂组件。其中，在步骤S2940之后，不仅需要将后挂组件成型成具有一定形状的弯曲结构，以便于其与用户的头部后侧适配；还需要对后挂组件的两端进行相应的处理，以便于其与耳挂组件进行结构上的固定连接，并实现上述的主控电路板、电池、按键、机芯、第一及第二传声器之间的电路连接。因此，步骤S2940制得的后挂组件实质上也只是半成品。
通过上述的方式，由于借助挤出成型工艺不仅可以一次性制得很长的半成品(具体可以是弹性包覆体43与导线42的一体结构件)，且包覆体43的内部还可以与此同时地形成一大体沿其轴线方向延伸的穿线通道，然后将该半成品切割成相应长度的小段以进行后续的加工工艺，使得后挂组件的制作效率能够有效地得以提高。
本申请实施例可能带来的有益效果包括但不限于：(1)装饰件对耳挂壳体进行装饰的同时具有遮蔽导线、遮蔽按键并触发按键的功能，实现装饰件的“一件四用”；(2)设计磁体使得耳机处于非佩戴状态时，机芯模组能够相互吸附，便于用户收纳；(3)合理设置磁体及相关组件的形状、尺寸等参数，兼顾机芯模组的振动发声与轻质化需求。需要说明的是，不同实施例可能产生的有益效果不同，在不同的实施例里，可能产生的有益效果可以是以上任意一种或几种的组合，也可以是其他任何可能获得的有益效果。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述发明披露仅仅作为示例，而并不构成对本申请的限定。虽然此处并没有明确说明，本领域技术人员可能会对本申请进行各种修改、改进和修正。该类修改、改进和修正在本申请中被建议，所以该类修改、改进、修正仍属于本申请示范实施例的精神和范围。
同时，本申请使用了特定词语来描述本申请的实施例。如“一个实施例”、“一实施例”和/或“一些实施例”意指与本申请至少一个实施例相关的某一特征、结构或特点。因此，应强调并注意的是，本说明书中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一替代性实施例”并不一定是指同一实施例。此外，本申请的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
此外，本领域技术人员可以理解，本申请的各方面可以通过若干具有可专利性的种类或情况进行说明和描述，包括任何新的和有用的工序、机器、产品或物质的组合或对他们的任何新的和有用的改进。相应地，本申请的各个方面可以完全由硬件执行、可以完全由软件(包括固件、常驻软件、微码等)执行、也可以由硬件和软件组合执行。以上硬件或软件均可被称为“数据块”、“模块”、“引擎”、“单元”、“组件”或“系统”。此外，本申请的各方面可能表现为位于一个或多个计算机可读介质中的计算机产品，该产品包括计算机可读程序编码。
此外，除非权利要求中明确说明，本申请处理元素和序列的顺序、数字字母的使用或其他名称的使用，并非用于限定本申请流程和方法的顺序。尽管上述披露中通过各种示例讨论了一些目前认为有用的发明实施例，但应当理解的是，该类细节仅起到说明的目的，附加的权利要求并不仅限于披露的实施例，相反，权利要求旨在覆盖所有符合本申请实施例实质和范围的修正和等价组合。例如，虽然以上所描述的系统组件可以通过硬件设备实现，但是也可以只通过软件的解决方案得以实现，如在现有的服务器或移动设备上安装所描述的系统。
同理，应当注意的是，为了简化本申请披露的表述，从而帮助对一个或多个发明实施例的理解，前文对本申请实施例的描述中，有时会将多种特征归并至一个实施例、附图或对其的描述中。但是，这种披露方法并不意味着本申请对象所需要的特征比权利要求中提及的特征多。实际上，实施例的特征要少于上述披露的单个实施例的全部特征。
一些实施例中使用了描述成分、属性数量的数字，应当理解的是，此类用于实施例描述 的数字，在一些示例中使用了修饰词“大约”、“近似”或“大体上”等来修饰。除非另外说明，“大约”、“近似”或“大体上”表明数字允许有±20％的变化。相应地，在一些实施例中，说明书和权利要求中使用的数值数据均为近似值，该近似值根据个别实施例所需特点可以发生改变。在一些实施例中，数值数据应考虑规定的有效数位并采用一般位数保留的方法。尽管本申请一些实施例中用于确认其范围广度的数值域和数据为近似值，在具体实施例中，此类数值的设定在可行范围内尽可能精确。

Claims (25)

  1. 一种耳机，其特征在于，包括机芯模组，所述机芯模组包括机芯壳体和机芯，其中：
    所述机芯壳体包括底壁和环形周壁，当用户佩戴所述耳机时，所述底壁面向所述用户的头部，所述环形周壁的一端与所述底壁一体连接，所述环形周壁远离所述底壁的一端开口，所述机芯通过所述开口设置在所述机芯壳体中；以及
    所述机芯包括磁体，所述磁体被配置为使所述机芯模组通过所述底壁的一侧吸附在磁性物体上。
  2. 根据权利要求1所述的耳机，其特征在于，所述磁体为圆柱体，所述磁体的直径大于等于第一直径且小于等于第二直径，以及所述磁体的厚度大于等于第一厚度且小于等于第二厚度。
  3. 根据权利要求2所述的耳机，其特征在于，所述磁体的直径为10.8mm，所述磁体的厚度为3.5mm。
  4. 根据权利要求1-3中任一项所述的耳机，其特征在于，所述机芯还包括：
    导磁罩，所述导磁罩包括底板和与所述底板一体连接的环形侧板，所述磁体设置在所述环形侧板内并固定在所述底板上；
    导磁板，所述导磁板固定在所述磁体背离所述底板的一侧；以及
    线圈，所述线圈设置在所述磁体与所述环形侧板之间的磁间隙内。
  5. 根据权利要求4所述的耳机，其特征在于，所述导磁板的直径与所述磁体的直径相等，所述导磁板的厚度与所述导磁罩的厚度相等。
  6. 根据权利要求5所述的耳机，其特征在于，所述导磁罩的厚度大于等于第三厚度且小于等于第四厚度。
  7. 根据权利要求6所述的耳机，其特征在于，所述导磁罩的厚度为0.5mm。
  8. 根据权利要求4-7中任一项所述的耳机，其特征在于，所述环形侧板的高度大于等于第一高度且小于等于第二高度。
  9. 根据权利要求8所述的耳机，其特征在于，所述环形侧板的高度为3.7mm。
  10. 根据权利要求4-9中任一项所述的耳机，其特征在于，所述机芯模组还包括机芯支架，所述机芯支架设置在所述机芯壳体内，所述线圈固定在所述机芯支架上。
  11. 根据权利要求4-10中任一项所述的耳机，其特征在于，所述磁体与所述环形侧板之间的磁间隙大于等于第一间隙且小于等于第二间隙。
  12. 根据权利要求1-11中任一项所述的耳机，其特征在于，还包括耳挂组件，所述耳挂组件的一端与所述机芯模组连接。
  13. 根据权利要求12所述的耳机，其特征在于，所述耳挂组件包括耳挂壳体，所述耳挂壳体包括：
    容置仓，所述容置仓用于容纳电池或主控电路板；
    固定部，所述固定部盖设在所述机芯壳体的开口端上，以形成用于容纳所述机芯的腔体；以及
    弯折过渡部，所述弯折过渡部连接所述容置仓和所述固定部，并呈弯折状设置以挂设于人耳外 侧。
  14. 根据权利要求13所述的耳机，其特征在于，所述机芯壳体的弹性模量大于所述耳挂壳体的弹性模量。
  15. 根据权利要求13或权利要求14所述的耳机，其特征在于，所述固定部设置有补强结构，所述补强结构使所述底壁的刚度与所述固定部的刚度的差值与所述底壁的刚度之间的比值小于或等于预设比例阈值。
  16. 根据权利要求15所述的耳机，其特征在于，所述补强结构包括设置在所述固定部上的加强筋。
  17. 根据权利要求15所述的耳机，其特征在于，所述补强结构包括金属制件，其中，所述补强结构与所述耳机固定部为金属嵌件注塑一体成型结构件。
  18. 根据权利要求13-17中任一项所述的耳机，其特征在于，所述机芯模组还包括盖板，所述盖板盖设在所述机芯壳体的所述环形周壁的开口上，所述固定部盖设在所述盖板背离所述机芯壳体的一侧。
  19. 根据权利要求18所述的耳机，其特征在于，所述盖板的弹性模量大于所述耳挂壳体的弹性模量。
  20. 根据权利要求18或权利要求19所述的耳机，其特征在于，所述盖板的弹性模量小于或等于所述机芯壳体的弹性模量。
  21. 根据权利要求13-20中任一项所述的耳机，其特征在于，所述耳挂组件还包括装饰支架，其中：
    所述弯折过渡部上设有第一凹槽，所述装饰支架嵌入并固定在所述第一凹槽内，以形成走线通道，进而允许导线从所述机芯模组内经所述走线通道延伸至所述容置仓内。
  22. 根据权利要求21所述的耳机，其特征在于，
    所述耳机固定部设有按键适配孔，所述按键适配孔与所述第一凹槽的一端连通；以及
    所述耳挂组件还包括按键，所述按键设置在所述耳挂壳体背离所述装饰支架的另一侧，并经所述按键适配孔外露。
  23. 根据权利要求22所述的耳机，其特征在于，
    所述装饰支架以悬臂形式延伸至经所述按键适配孔外露的所述按键的上方，并能够在外力按压下触发所述按键。
  24. 根据权利要求12-23中任一项所述的耳机，其特征在于，所述机芯模组的数量为两个，所述两个机芯模组的磁体靠近所述机芯壳体的底壁一侧的极性相异，以在所述耳机处于非佩戴状态时，所述两个机芯模组能够相互吸附。
  25. 根据权利要求24所述的耳机，其特征在于，所述两个耳挂组件的数量为两个，所述耳机还包括用于绕设于所述用户头部后侧的后挂组件，所述后挂组件的两端分别与两个所述两个耳挂组件的容置仓连接。
PCT/CN2021/089713 2020-04-30 2021-04-25 一种耳机 WO2021218871A1 (zh)

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