WO2021217815A1 - 显示面板及其制作方法 - Google Patents
显示面板及其制作方法 Download PDFInfo
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- WO2021217815A1 WO2021217815A1 PCT/CN2020/096359 CN2020096359W WO2021217815A1 WO 2021217815 A1 WO2021217815 A1 WO 2021217815A1 CN 2020096359 W CN2020096359 W CN 2020096359W WO 2021217815 A1 WO2021217815 A1 WO 2021217815A1
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- display area
- display panel
- groove
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- the present application relates to the field of display technology, in particular to the field of display panel manufacturing technology, in particular to a display panel and a manufacturing method thereof.
- OLED Organic Light Emitting Diode
- OLED Organic Light Emitting Diode
- display devices have the advantages of light weight, thin thickness, flexibility, and large viewing angle range.
- OLED materials are prone to rapid attenuation and aging when encountering water and oxygen. Therefore, it is necessary to provide packaging around the OLED material. Layers are encapsulated.
- the packaging layer needs to occupy more edge areas of the OLED display panel, resulting in a larger non-display area of the OLED display panel, and reducing the screen-to-body ratio of the OLED display panel.
- the purpose of the present invention is to provide a display panel and a manufacturing method thereof.
- the first inorganic layer and the second inorganic layer in the encapsulation layer are prepared through the same optical mask, so that the first inorganic layer and the second inorganic layer have the same boundary.
- the existing packaging layer needs to occupy more edge areas of the OLED display panel, thereby solving the problem of a relatively low screen occupancy of the OLED display panel.
- An embodiment of the present invention provides a display panel having a display area and a non-display area surrounding the display area, and the display panel includes:
- the substrate has a groove, the groove is provided in the non-display area, when the display panel is cut from the side of the groove away from the display area, the groove is used To prevent crack extension;
- An encapsulation layer is provided on the substrate, the encapsulation layer is provided on the side of the trench close to the display area, the encapsulation layer includes a first inorganic layer and a second inorganic layer, so The first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed by the same optical mask to shorten the gap between the boundary and the display area. distance;
- a photoresist layer is provided on a side of the encapsulation layer close to the substrate, the photoresist layer includes a first photoresist portion, and the first photoresist portion is disposed opposite to the trench , The boundary between the first inorganic layer and the second inorganic layer is located on the first photoresist part;
- the retaining wall is arranged between the encapsulation layer and the photoresist layer, the retaining wall is arranged on the side of the groove close to the display area, the groove and the retaining wall The horizontal distance between them is greater than 30 microns and less than 100 microns.
- the photoresist layer further includes a second photoresist portion, the second photoresist portion is provided on a side of the trench close to the display area, and the second photoresist portion carries the The retaining wall and the encapsulation layer.
- the encapsulation layer is disposed on the first photoresist part, the gap, the retaining wall, and the first photoresist part.
- the second photoresist part there is a gap between the second photoresist part and the first photoresist part, and the encapsulation layer is disposed on the first photoresist part, the gap, the retaining wall, and the first photoresist part. The second photoresist part.
- the encapsulation layer further includes an organic layer, the organic layer is disposed between the first inorganic layer and the second inorganic layer, and the organic layer is disposed on the retaining wall close to the One side of the display area.
- An embodiment of the present invention also provides another display panel, the display panel having a display area and a non-display area surrounding the display area, and the display panel includes:
- the substrate has a groove, the groove is provided in the non-display area, when the display panel is cut from the side of the groove away from the display area, the groove is used To prevent crack extension;
- An encapsulation layer is provided on the substrate, the encapsulation layer is provided on the side of the trench close to the display area, the encapsulation layer includes a first inorganic layer and a second inorganic layer, so The first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed by the same optical mask to shorten the gap between the boundary and the display area. distance.
- the display panel further includes a photoresist layer, the photoresist layer is disposed on a side of the encapsulation layer close to the substrate, the photoresist layer includes a first photoresist portion, and the The first photoresist part is disposed opposite to the groove.
- the boundary between the first inorganic layer and the second inorganic layer is located on the first photoresist part.
- the display panel further includes a retaining wall, the retaining wall is disposed between the encapsulation layer and the photoresist layer, and the retaining wall is disposed on the groove near the display area.
- the horizontal distance between the groove and the retaining wall is greater than 30 microns and less than 100 microns.
- the photoresist layer further includes a second photoresist portion, the second photoresist portion is provided on a side of the trench close to the display area, and the second photoresist portion carries the The retaining wall and the encapsulation layer.
- the encapsulation layer is disposed on the first photoresist part, the gap, the retaining wall, and the first photoresist part.
- the second photoresist part there is a gap between the second photoresist part and the first photoresist part, and the encapsulation layer is disposed on the first photoresist part, the gap, the retaining wall, and the first photoresist part. The second photoresist part.
- the encapsulation layer further includes an organic layer, the organic layer is disposed between the first inorganic layer and the second inorganic layer, and the organic layer is disposed on the retaining wall close to the One side of the display area.
- the embodiment of the present invention also provides a manufacturing method of a display panel for manufacturing the display panel as described above, the display panel having a display area and a non-display area surrounding the display area, wherein the method includes:
- a substrate is provided, the substrate is provided with a groove, the groove is provided in the non-display area, and when the display panel is cut from the side of the groove away from the display area, the groove Groove is used to stop crack extension;
- An encapsulation layer is formed on the substrate, the encapsulation layer is provided on the side of the trench close to the display area, the encapsulation layer includes a first inorganic layer, a second inorganic layer, and the first inorganic layer It has the same boundary as the second inorganic layer, and the first inorganic layer and the second inorganic layer are formed by the same photomask to shorten the distance between the boundary and the display area.
- the method before the step of forming an encapsulation layer on the substrate, the method further includes:
- a retaining wall is formed on the substrate, the retaining wall is provided on the side of the groove close to the display area, and the horizontal distance between the groove and the retaining wall is greater than 30 microns and less than 100 Micrometers.
- the method before the step of forming an encapsulation layer on the substrate, the method further includes:
- a photoresist layer is formed on the substrate, the photoresist layer includes a first photoresist portion, and the first photoresist portion is disposed opposite to the trench.
- the present invention provides a display panel and a manufacturing method thereof.
- the display panel and the display device have a display area and a non-display area surrounding the display area, including a substrate and an encapsulation layer provided on the substrate.
- the first and second inorganic layers in the encapsulation layer are prepared through the same optical mask, so that the first and second inorganic layers have the same boundary, so as to shorten the boundary and the display area.
- the distance between the display panel to occupy less edge area of the display panel which increases the screen-to-body ratio of the display panel.
- FIG. 1 is a schematic cross-sectional view of a display panel structure provided by an embodiment of the present invention.
- FIG. 2 is a flowchart of a manufacturing method of a display panel provided by an embodiment of the present invention.
- the present invention provides a display panel, and the display panel includes but is not limited to the following embodiments.
- the display panel 100 has a display area 01 and a non-display area 02 surrounding the display area 01.
- the display panel 100 includes a substrate 101, which is disposed on the substrate. 101 on the encapsulation layer 102.
- the substrate 101 has a groove 03
- the groove 03 is provided in the non-display area 02, when the groove 03 is cut from the cutting line 04 on the side away from the display area
- the groove 03 is used to prevent cracks from extending.
- the number of the grooves 03 is not less than one, for example, the number of the grooves 03 may be 2, which can strengthen the prevention of crack extension.
- the encapsulation layer 102 is disposed on the side of the trench 03 close to the display area 01, the encapsulation layer 102 includes a first inorganic layer 1021, a second inorganic layer 1022, and the first inorganic layer 1021 It has the same boundary as the second inorganic layer 1022, and the first inorganic layer 1021 and the second inorganic layer 1022 are formed by the same optical mask to shorten the distance between the boundary and the display area 01 .
- the optical mask is a pattern master used in a photolithography process commonly used in micro-nano processing technology
- a mask pattern structure is formed on a transparent substrate by an opaque light-shielding film.
- the mask to be processed is composed of a glass/quartz substrate, a chromium layer, and a photoresist layer.
- the pattern structure can be obtained through a plate-making process.
- the commonly used processing equipment is a direct-write lithography equipment, such as laser direct-write optical Engraving machine, electron beam lithography machine, etc. It can be seen that the material of the optical reticle has a high melting point, stable chemical properties, and is not easily deformed under high temperature and high pressure. Therefore, the optical reticle can be processed to form a thin film pattern with a finer pattern.
- the photomask The error range can be less than 3 microns.
- the display panel 100 further includes a photoresist layer 103, the photoresist layer 103 is provided on the side of the encapsulation layer 102 close to the substrate 101, and the light
- the resist layer 103 includes a first photoresist portion 1031, and the first photoresist portion 1031 is disposed opposite to the trench 03.
- the first photoresist portion 1031 may fill the trench 03. It is understandable that the constituent materials of the photoresist layer 103 mainly include resin and photosensitizer. The first photoresist portion 1031 can protect the groove 03 and can further block the cutting of the display panel 100 along the cutting line 04. At this time, the crack extends to the encapsulation layer 102.
- the boundary between the first inorganic layer 1021 and the second inorganic layer 1022 is located on the first photoresist portion 1031. It is understandable that since the first inorganic layer 1021 and the second inorganic layer 1022 are formed by the same optical mask, and the error range of the photomask may be less than 3 microns, it can ensure that the first inorganic layer The boundary between 1021 and the second inorganic layer 1022 is located on the first photoresist portion 1031. Further, since the first photoresist portion 1031 is located on the lower side of the boundary between the first inorganic layer 1021 and the second inorganic layer 1022, the first inorganic layer 1021 and the second inorganic layer 1022 are etched. When the material of the layer 1022 is used to form the first inorganic layer 1021 and the second inorganic layer 1022, the first photoresist portion 1031 can prevent the etching material from corroding the substrate 101.
- the display panel 100 further includes a retaining wall 05 which is provided on the side of the packaging layer 102 close to the substrate 101, and the retaining wall 05 Located on the side of the groove 03 close to the display area 01, the horizontal distance between the groove 03 and the retaining wall 05 is greater than 30 micrometers and less than 100 micrometers.
- the groove 03 can be combined with The horizontal distance between the retaining wall 05 is set to be greater than 30 microns and less than 100 microns. Compared with the prior art, this is equivalent to reducing the level between the groove 03 and the retaining wall 05.
- the distance, when the position of the retaining wall 05 is constant, is equivalent to moving the groove 03 to the display area 01, so that the cutting line 04 can move to the display area 01. After the line 04 cuts the display panel 100, compared with the prior art, the area of the non-display area 02 of the display panel 100 is reduced, and the screen-to-body ratio of the display panel 100 is increased.
- the photoresist layer 103 further includes a second photoresist portion 1032, and the second photoresist portion 1032 is disposed on a side of the trench 03 close to the display area 01
- the second photoresist portion 1032 carries the barrier wall 05 and the encapsulation layer 102.
- the constituent materials of the first photoresist portion 1032 and the second photoresist portion 1033 may be the same. Further, the first photoresist portion 1032 and the second photoresist portion 1033 may be prepared in the same layer.
- the encapsulation layer 102 further includes an organic layer 1023.
- the organic layer 1023 is disposed between the first inorganic layer 1021 and the second inorganic layer 1022.
- the organic layer 1023 is arranged on the side of the retaining wall 05 close to the display area 01.
- the display panel 100 further includes a device layer 104, the device layer 104 is provided in the display area 01, and the device layer 104 is provided in the photoresist layer 103 and the photoresist layer. Between the encapsulation layers 102, the device layer 104 may include thin film transistor devices and OLED devices.
- the encapsulation layer 102 may sequentially include the first inorganic layer 1021, the organic layer 1023, the second inorganic layer 1022, other organic layers, other inorganic layers, etc., from bottom to top.
- the encapsulation layer 102 may include at least one organic layer and at least one inorganic layer alternately arranged up and down, and directly in contact with the substrate 101 and the retaining wall 05 is the first inorganic layer 1021, wherein the organic layer
- the specific number of layers and the inorganic layer can be determined according to the conditions of other layers of the display panel 100.
- the main function of the first inorganic layer 1021, the second inorganic layer 1022, and the other inorganic layers is to isolate water and oxygen, and prevent water and oxygen from invading the device layer 104.
- the first The composition material of the inorganic layer 1021, the second inorganic layer 1022, and the other inorganic layers may include at least one of SiNx, SiOx, SiOxNy, and AlOx, where x and y are both positive integers; the organic layer 1023 and The main function of the other organic layer is to wrap the device layer 104 and release stress.
- the composition material of the organic layer 1023 and the other organic layer may include acrylate, hexamethyl simethicone, and Alucone. At least one.
- first inorganic layer 1021, the second inorganic layer 1022, and the other inorganic layers can be prepared by at least one of a chemical vapor deposition method and an atomic layer deposition method.
- the organic layer 1023 and the other organic layers may be prepared by at least one process including inkjet printing, dispensing, and chemical vapor deposition.
- the barrier wall 05 is arranged around the display area 01, and aims to prevent the organic layer 1023 in the display panel 100 from flowing out of the coverage area of the first inorganic layer 1021 Therefore, the shape and number of the retaining wall 1012 can be determined according to the specific conditions of the first inorganic layer 1021, the second inorganic layer 1022, the other inorganic layers, the organic layer 1023, and the other organic layers.
- the shape of the horizontal projection of the retaining wall 05 can be a circular ring or a frame shape, and the number of the retaining wall 05 can be one or two.
- the constituent material of the retaining wall 05 may include organic materials, such as polymer materials such as parylene, and the retaining wall 05 may be prepared by at least one method including exposure, development, and embossing.
- the substrate 101 may include a base 1011 and an inorganic layer.
- the base 1011 may be a flexible substrate, for example, the base 1011 may be a polyimide film, and the groove 03 may be provided on the inorganic layer 1012.
- the present invention also provides a manufacturing method of a display panel for manufacturing a display panel as described above, the display panel having a display area and a non-display area surrounding the display area, and the manufacturing method of the display panel includes but It is not limited to the following examples.
- the method includes the following steps:
- S10 Provide a substrate with grooves on the substrate.
- the grooves are provided in the non-display area. When the display panel is cut from a side of the groove away from the display area, The grooves are used to prevent cracks from extending.
- the substrate may include a base and an inorganic layer
- the base may be a flexible substrate, for example, the base may be a polyimide film
- the groove may be provided on the inorganic layer.
- the number of the grooves is not less than one, for example, the number of the grooves may be 2, which can strengthen the prevention of crack extension.
- An encapsulation layer is formed on the substrate, the encapsulation layer is provided on a side of the trench close to the display area, the encapsulation layer includes a first inorganic layer, a second inorganic layer, and the first The inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed by the same photomask to shorten the distance between the boundary and the display area.
- step S20 the following steps may be further included before the step S20:
- a photoresist layer is formed on the substrate, the photoresist layer includes a first photoresist portion, and the first photoresist portion is disposed opposite to the trench.
- the first photoresist part may fill the trench.
- the constituent materials of the photoresist layer mainly include resin and sensitizer, and the first photoresist portion can protect the grooves and can further prevent the cracks from extending to when the display panel is cut along the cutting line.
- the encapsulation layer mainly include resin and sensitizer, and the first photoresist portion can protect the grooves and can further prevent the cracks from extending to when the display panel is cut along the cutting line.
- the photoresist layer further includes a second photoresist portion, the second photoresist portion is provided on a side of the trench close to the display area, and the second photoresist portion carries the In the encapsulation layer, there is a gap between the second photoresist part and the first photoresist part.
- constituent materials of the first photoresist part and the second photoresist part may be the same, and further, the first photoresist part and the second photoresist part may be prepared in the same layer.
- the boundary between the first inorganic layer and the second inorganic layer is located on the first photoresist part. It is understandable that since the first inorganic layer and the second inorganic layer are formed by the same optical mask, specifically, the error range of the photomask may be less than 3 microns, so that the first inorganic layer can be guaranteed The boundary with the second inorganic layer is located on the first photoresist part.
- the first photoresist part is located on the lower side of the boundary between the first inorganic layer and the second inorganic layer, the material of the first inorganic layer and the second inorganic layer is etched to When the first inorganic layer and the second inorganic layer are formed, the first photoresist part can prevent the etching material from corroding the substrate.
- step S20 the following steps may be further included before the step S20:
- a retaining wall is formed on the substrate, the retaining wall is provided on the side of the groove close to the display area, and the horizontal distance between the groove and the retaining wall is greater than 30 microns and less than 100 Micrometers.
- the groove and the barrier can be separated
- the horizontal distance between the walls is set to be greater than 30 microns and less than 100 microns. Compared with the prior art, this is equivalent to reducing the horizontal distance between the groove and the retaining wall. When the position of the wall is constant, it is equivalent to moving the groove to the display area. Compared with the prior art, the area of the non-display area of the display panel is reduced, and the screen occupancy of the display panel is increased. Compare.
- the encapsulation layer is provided on the first photoresist part, the gap, the retaining wall, and the second photoresist part.
- step S20 may include the following steps:
- the boundary of the first inorganic film can extend to the side of the trench away from the display area, that is, it can be considered that there is no need to consider the boundary of the first inorganic film, which reduces the cost of forming the first inorganic film. Difficulty.
- the constituent material of the organic layer may include at least one of acrylate, hexamethyl simethicone, and Alucone.
- the boundary of the second inorganic film may extend to a side of the trench away from the display area.
- the boundary of the second inorganic film may be the same as the boundary of the first inorganic film.
- the constituent material of the first inorganic film and the second inorganic film may include at least one of SiNx, SiOx, SiOxNy, and AlOx.
- a layer of photoresist material to facilitate the later etching of the first inorganic film and the second inorganic film to form the first inorganic layer and the second inorganic layer.
- the present invention provides a display panel and a manufacturing method thereof.
- the display panel and the display device have a display area and a non-display area surrounding the display area, including a substrate and an encapsulation layer provided on the substrate.
- the first and second inorganic layers in the encapsulation layer are prepared through the same optical mask to make the first and second inorganic layers have the same boundary to occupy less edge area of the display panel. Improved the screen-to-body ratio of the display panel.
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Abstract
一种显示面板(100)及其制作方法,显示面板(100)包括衬底(101)和封装层(102);衬底(101)上具有设于非显示区(02)的沟槽(03),当从沟槽(03)远离显示区(01)的一侧切割显示面板(100)时,沟槽(03)阻挡裂纹延伸;封装层(102)设于沟槽(03)靠近显示区(01)的一侧,封装层(102)包括具有相同的边界、且通过同一光学掩模版形成的第一无机层(1021)、第二无机层(1022),以缩短所述边界与所述显示区(01)之间的距离。
Description
本申请涉及显示技术领域,尤其涉及显示面板制造技术领域,具体涉及显示面板及其制作方法。
OLED(Organic Light Emitting Diode,有机发光二极管)显示器件具备重量轻、厚度薄、可弯曲、视角范围大等优点,但是OLED材料遇到水氧容易快速衰减及老化,因此需要在OLED材料外围设置封装层进行封装。
然而,现有的封装技术中,封装层需要占用OLED显示面板较多的边缘区域,导致OLED显示面板的非显示区较大,降低了OLED显示面板的屏占比。
综上所述,有必要提供可以提高屏占比的显示面板以及显示装置。
本发明的目的在于提供显示面板及其制作方法,通过同一光学掩模版制备封装层中的第一无机层、第二无机层,使得第一无机层、第二无机层具有相同的边界,解决了现有的封装层需要占用OLED显示面板较多的边缘区域,从而解决了OLED显示面板的屏占比较低的问题。
本发明实施例提供一种显示面板,所述显示面板具有显示区和包围所述显示区的非显示区,所述显示面板包括:
衬底,所述衬底上具有沟槽,所述沟槽设于所述非显示区,当从所述沟槽远离所述显示区的一侧切割所述显示面板时,所述沟槽用于阻挡裂纹延伸;
封装层,所述封装层设于所述衬底上,所述封装层设于所述沟槽靠近所述显示区的一侧,所述封装层包括第一无机层、第二无机层,所述第一无机层和所述第二无机层具有相同的边界,所述第一无机层和所述第二无机层通过同一光学掩模版形成,以缩短所述边界与所述显示区之间的距离;
光阻层,所述光阻层设于所述封装层靠近所述衬底的一侧,所述光阻层包括第一光阻部,所述第一光阻部与所述沟槽相对设置,所述第一无机层和所述第二无机层的边界位于所述第一光阻部上;
挡墙,所述挡墙设于所述封装层与所述光阻层之间,所述挡墙设于所述沟槽靠近所述显示区的一侧,所述沟槽与所述挡墙之间的水平距离大于30微米、且小于100微米。
在一实施例中,所述光阻层还包括第二光阻部,所述第二光阻部设于所述沟槽靠近所述显示区的一侧,所述第二光阻部承载所述挡墙以及所述封装层。
在一实施例中,所述第二光阻部与所述第一光阻部之间具有间隙,所述封装层设于所述第一光阻部、所述间隙、所述挡墙以及所述第二光阻部上。
在一实施例中,所述封装层还包括有机层,所述有机层设于所述第一无机层和所述第二无机层之间,所述有机层设于所述挡墙靠近所述显示区的一侧。
本发明实施例还提供另一种显示面板,所述显示面板具有显示区和包围所述显示区的非显示区,所述显示面板包括:
衬底,所述衬底上具有沟槽,所述沟槽设于所述非显示区,当从所述沟槽远离所述显示区的一侧切割所述显示面板时,所述沟槽用于阻挡裂纹延伸;
封装层,所述封装层设于所述衬底上,所述封装层设于所述沟槽靠近所述显示区的一侧,所述封装层包括第一无机层、第二无机层,所述第一无机层和所述第二无机层具有相同的边界,所述第一无机层和所述第二无机层通过同一光学掩模版形成,以缩短所述边界与所述显示区之间的距离。
在一实施例中,所述显示面板还包括光阻层,所述光阻层设于所述封装层靠近所述衬底的一侧,所述光阻层包括第一光阻部,所述第一光阻部与所述沟槽相对设置。
在一实施例中,所述第一无机层和所述第二无机层的边界位于所述第一光阻部上。
在一实施例中,所述显示面板还包括挡墙,所述挡墙设于所述封装层与所述光阻层之间,所述挡墙设于所述沟槽靠近所述显示区的一侧,所述沟槽与所述挡墙之间的水平距离大于30微米、且小于100微米。
在一实施例中,所述光阻层还包括第二光阻部,所述第二光阻部设于所述沟槽靠近所述显示区的一侧,所述第二光阻部承载所述挡墙以及所述封装层。
在一实施例中,所述第二光阻部与所述第一光阻部之间具有间隙,所述封装层设于所述第一光阻部、所述间隙、所述挡墙以及所述第二光阻部上。
在一实施例中,所述封装层还包括有机层,所述有机层设于所述第一无机层和所述第二无机层之间,所述有机层设于所述挡墙靠近所述显示区的一侧。
本发明实施例还提供显示面板的制作方法,用于制作如上文任一所述的显示面板,所述显示面板具有显示区和包围所述显示区的非显示区,其中,所述方法包括:
提供一衬底,所述衬底上具有沟槽,所述沟槽设于所述非显示区,当从所述沟槽远离所述显示区的一侧切割所述显示面板时,所述沟槽用于阻挡裂纹延伸;
在所述衬底上形成封装层,所述封装层设于所述沟槽靠近所述显示区的一侧,所述封装层包括第一无机层、第二无机层,所述第一无机层和所述第二无机层具有相同的边界,所述第一无机层和所述第二无机层通过同一光掩模版形成,以缩短所述边界与所述显示区之间的距离。
在一实施例中,所述在所述衬底上形成封装层的步骤之前,还包括:
在所述衬底上形成挡墙,所述挡墙设于所述沟槽靠近所述显示区的一侧,所述沟槽与所述挡墙之间的水平距离大于30微米、且小于100微米。
在一实施例中,所述在所述衬底上形成封装层的步骤之前,还包括:
在所述衬底上形成光阻层,所述光阻层包括第一光阻部,所述第一光阻部与所述沟槽相对设置。
本发明提供了显示面板及其制作方法,该显示面板和显示装置具有显示区和包围显示区的非显示区,包括衬底以及设于衬底上的封装层,衬底上具有设于非显示区的沟槽,通过同一光学掩模版制备封装层中的第一无机层、第二无机层,使得第一无机层、第二无机层具有相同的边界,以缩短所述边界与所述显示区之间的距离,以占用显示面板较少的边缘区域,提高了显示面板的屏占比。
下面通过附图来对本发明进行进一步说明。需要说明的是,下面描述中的附图仅仅是用于解释说明本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种显示面板结构的剖面示意图。
图2为本发明实施例提供的一种显示面板的制作方法的流程图。
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在本发明的描述中,需要理解的是,术语“上”、“下”、“左”、“右”、“靠近”、“远离”等指示的方位或位置关系为基于附图所示的方位或位置关系,例如,“上”只是表面在物体上方,具体指代正上方、斜上方、上表面都可以,只要居于物体水平之上即可,“下”、“左”、“右”可以参考上述关于“上”的理解;“靠近”则是指相比较而言,与目标距离更小的一侧,以上方位或位置关系仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
另外,还需要说明的是,附图提供的仅仅是和本发明关系比较密切的结构和步骤,省略了一些与发明关系不大的细节,目的在于简化附图,使发明点一目了然,而不是表明实际中装置和方法就是和附图一模一样,不作为实际中装置和方法的限制。
本发明提供显示面板,所述显示面板包括但不限于以下实施例。
在一实施例中,如图1所示,所述显示面板100具有显示区01和包围所述显示区01的非显示区02,所述显示面板100包括衬底101、设于所述衬底101上的封装层102。
其中,所述衬底101上具有沟槽03,所述沟槽03设于所述非显示区02,当从所述沟槽03远离所述显示区的一侧处的切割线04切割所述显示面板100时,所述沟槽03用于阻挡裂纹延伸。具体的,所述沟槽03的数目不少于一个,例如所述沟槽03的数目可以为2,可以加强阻挡裂纹延伸。
特别的,所述封装层102设于所述沟槽03靠近所述显示区01的一侧,所述封装层102包括第一无机层1021、第二无机层1022,所述第一无机层1021和所述第二无机层1022具有相同的边界,所述第一无机层1021和所述第二无机层1022通过同一光学掩模版形成,以缩短所述边界与所述显示区01之间的距离。
可以理解的,由于光学掩模版是微纳加工技术常用的光刻工艺所使用的图形母版,是由不透明的遮光薄膜在透明基板上形成掩膜图形结构。其中,待加工的掩膜版由玻璃/石英基片、铬层和光刻胶层构成,其图形结构可通过制版工艺加工获得,常用加工设备为直写式光刻设备,如激光直写光刻机、电子束光刻机等。由此可知,光学掩模版的材质的熔点较高、化学性质稳定,在高温高压下不易发生形变,故用光学掩模版可以加工形成图案较为精细的薄膜图案,具体的,所述光掩模版的误差范围可以小于3微米。
在一实施例中,如图1所示,所述显示面板100还包括光阻层103,所述光阻层103设于所述封装层102靠近所述衬底101的一侧,所述光阻层103包括第一光阻部1031,所述第一光阻部1031与所述沟槽03相对设置。
进一步的,所述第一光阻部1031可以填充所述沟槽03。可以理解的,所述光阻层103的组成材料主要包括树脂、感光剂,所述第一光阻部1031可以保护所述沟槽03,并且可以进一步阻挡沿切割线04切割所述显示面板100时,裂纹延伸至所述封装层102。
在一实施例中,如图1所示,所述第一无机层1021和所述第二无机层1022的边界位于所述第一光阻部1031上。可以理解的,由于所述第一无机层1021和所述第二无机层1022通过同一光学掩模版形成,且所述光掩模版的误差范围可以小于3微米,故可以保证所述第一无机层1021和所述第二无机层1022的边界位于所述第一光阻部1031上。进一步的,由于所述第一光阻部1031位于所述第一无机层1021和所述第二无机层1022的边界的下侧,在刻蚀所述第一无机层1021和所述第二无机层1022的材料以形成所述第一无机层1021和所述第二无机层1022时,所述第一光阻部1031可以防止刻蚀材料腐蚀所述衬底101。
在一实施例中,如图1所示,所述显示面板100还包括挡墙05,所述挡墙05设于所述封装层102靠近所述衬底101的一侧,所述挡墙05设于所述沟槽03靠近所述显示区01的一侧,所述沟槽03与所述挡墙05之间的水平距离大于30微米、且小于100微米。
可以理解的,由于所述第一无机层1021和所述第二无机层1022通过同一光学掩模版形成,且所述光掩模版的误差范围可以小于3微米,故可以将所述沟槽03与所述挡墙05之间的水平距离设置为大于30微米、且小于100微米,此时与现有技术相比较,相当于减小了所述沟槽03与所述挡墙05之间的水平距离,在所述挡墙05的位置一定时,相当于将所述沟槽03往所述显示区01移动,可以使得所述切割线04向所述显示区01移动,当沿着所述切割线04切割所述显示面板100以后,与现有技术相比较,减小了所述显示面板100的非显示区02的面积,提高了所述显示面板100的屏占比。
在一实施例中,如图1所示,所述光阻层103还包括第二光阻部1032,所述第二光阻部1032设于所述沟槽03靠近所述显示区01的一侧,所述第二光阻部1032承载所述挡墙05以及所述封装层102。
其中,所述第一光阻部1032、所述第二光阻部1033的组成材料可以相同,进一步的,所述第一光阻部1032和所述第二光阻部1033可以同层制备。
其中,所述第二光阻部1033与所述第一光阻部1032之间具有间隙,所述封装层103设于所述第一光阻部1032、所述间隙、所述挡墙05以及所述第二光阻部1032上。
在一实施例中,如图1所示,所述封装层102还包括有机层1023,所述有机层1023设于所述第一无机层1021和所述第二无机层1022之间,所述有机层1023设于所述挡墙05靠近所述显示区01的一侧。
在一实施例中,如图1所示,所述显示面板100还包括器件层104,所述器件层104设于所述显示区01,所述器件层104设于所述光阻层103与所述封装层102之间,所述器件层104可以包括薄膜晶体管器件、OLED器件。
可以理解的,所述封装层102从下到上可以依次包括所述第一无机层1021、所述有机层1023、所述第二无机层1022、其它有机层、其它无机层等等,即所述封装层102可以包括上下交替设置的至少一有机层和至少一无机层,并且与所述衬底101以及所述挡墙05等直接接触的是所述第一无机层1021,其中所述有机层和所述无机层的具体层数可以根据所述显示面板100的其他膜层情况确定。
其中,所述第一无机层1021、所述第二无机层1022以及所述其它无机层的主要作用是隔绝水与氧气,防止水与氧气入侵所述器件层104,具体的,所述第一无机层1021、所述第二无机层1022以及所述其它无机层的组成材料可以包括SiNx、SiOx、SiOxNy、AlOx中的至少一种,其中x、y均为正整数;所述有机层1023以及所述其它有机层的主要作用是包裹所述器件层104、缓释应力,所述有机层1023以及所述其它有机层的组成材料可以包括丙烯酸酯、六甲基二甲硅醚、Alucone中的至少一种。可以理解的,所述第一无机层1021、所述第二无机层1022以及所述其它无机层可以通过包括化学气相淀积法、原子层沉积法中的至少一种工艺制备,所述有机层1023以及所述其它有机层可以通过包括喷墨印刷法、点胶法、化学气相淀积法中的至少一种工艺制备。
可以理解的,所述挡墙05是围绕在所述显示区01的四周而设置,目的在于防止所述显示面板100内的所述有机层1023流出所述所述第一无机层1021的覆盖区域,因此所述挡墙1012的形状和数量可以根据所述第一无机层1021、所述第二无机层1022、所述其它无机层、所述有机层1023以及所述其它有机层的具体情况来设置,例如,所述挡墙05的水平投影的形状可以为圆环形或者框型,所述挡墙05的数量可以为一个或者两个。可以理解的,所述挡墙05的组成材料可以包括有机材料,例如派瑞林等高分子材料,所述挡墙05可以通过包括曝光、显影、压印中的至少一种方法制备。
在一实施例中,如图1所示,所述衬底101可以包括基底1011和无机层
1012,所述基底1011可以为柔性基板,例如所述基底1011可以为聚酰亚胺薄膜,所述无机层1012上可以设置有所述沟槽03。
本发明还提供显示面板的制作方法,用于制作如上文任一所述的显示面板,所述显示面板具有显示区和包围所述显示区的非显示区,所述显示面板的制作方法包括但不限于以下实施例。
在一实施例中,如图2所示,所述方法包括如下步骤:
S10,提供一衬底,所述衬底上具有沟槽,所述沟槽设于所述非显示区,当从所述沟槽远离所述显示区的一侧切割所述显示面板时,所述沟槽用于阻挡裂纹延伸。
其中,所述衬底可以包括基底和无机层,所述基底可以为柔性基板,例如所述基底可以为聚酰亚胺薄膜,所述无机层上可以设置有所述沟槽。具体的,所述沟槽的数目不少于一个,例如所述沟槽的数目可以为2,可以加强阻挡裂纹延伸。
S20,在所述衬底上形成封装层,所述封装层设于所述沟槽靠近所述显示区的一侧,所述封装层包括第一无机层、第二无机层,所述第一无机层和所述第二无机层具有相同的边界,所述第一无机层和所述第二无机层通过同一光掩模版形成,以缩短所述边界与所述显示区之间的距离。
在一实施例中,在所述步骤S20之前还可以包括如下步骤:
在所述衬底上形成光阻层,所述光阻层包括第一光阻部,所述第一光阻部与所述沟槽相对设置。
进一步的,所述第一光阻部可以填充所述沟槽。可以理解的,所述光阻层的组成材料主要包括树脂、感光剂,所述第一光阻部可以保护所述沟槽,并且可以进一步阻挡沿切割线切割所述显示面板时,裂纹延伸至所述封装层。
在一实施例中,所述光阻层还包括第二光阻部,所述第二光阻部设于所述沟槽靠近所述显示区的一侧,所述第二光阻部承载所述封装层,所述第二光阻部与所述第一光阻部之间具有间隙。
其中,所述第一光阻部、所述第二光阻部的组成材料可以相同,进一步的,所述第一光阻部和所述第二光阻部可以同层制备。
在一实施例中,所述第一无机层和所述第二无机层的边界位于所述第一光阻部上。可以理解的,由于所述第一无机层和所述第二无机层通过同一光学掩模版形成,具体的,所述光掩模版的误差范围可以小于3微米,故可以保证所述第一无机层和所述第二无机层的边界位于所述第一光阻部上。进一步的,由于所述第一光阻部位于所述第一无机层和所述第二无机层的边界的下侧,在刻蚀所述第一无机层和所述第二无机层的材料以形成所述第一无机层和所述第二无机层时,所述第一光阻部可以防止刻蚀材料腐蚀所述衬底。
在一实施例中,在所述步骤S20之前还可以包括如下步骤:
在所述衬底上形成挡墙,所述挡墙设于所述沟槽靠近所述显示区的一侧,所述沟槽与所述挡墙之间的水平距离大于30微米、且小于100微米。
可以理解的,由于所述第一无机层和所述第二无机层通过同一光学掩模版形成,且所述光掩模版的误差范围可以小于3微米,故可以将所述沟槽与所述挡墙之间的水平距离设置为大于30微米、且小于100微米,此时与现有技术相比较,相当于减小了所述沟槽与所述挡墙之间的水平距离,在所述挡墙的位置一定时,相当于将所述沟槽往所述显示区移动,与现有技术相比较,减小了所述显示面板的非显示区的面积,提高了所述显示面板的屏占比。
其中,所述封装层设于所述第一光阻部、所述间隙、所述挡墙以及所述第二光阻部上。
在一实施例中,所述步骤S20可以包括如下步骤:
S201,在所述光阻层以及所述衬底上形成第一无机膜。
其中,所述第一无机膜的边界可以延伸至所述沟槽远离所述显示区的一侧,即可以认为无需考虑所述第一无机膜的边界,降低了形成所述第一无机膜的难度。
S202,在所述第一无机膜上形成有机层,所述有机层设于所述挡墙靠近所述显示区的一侧。
其中,所述有机层的组成材料可以包括丙烯酸酯、六甲基二甲硅醚、Alucone中的至少一种。
S203,在所述有机层以及所述第一无机膜上形成第二无机膜。
其中,所述第二无机膜的边界可以延伸至所述沟槽远离所述显示区的一侧,例如所述第二无机膜的边界可以和所述第一无机膜的边界一致。其中,所述第一无机膜和所述第二无机膜的组成材料可以包括SiNx、SiOx、SiOxNy、AlOx中的至少一种。
S204,利用同一光掩模版对所述第一无机膜和所述第二无机膜进行图案化处理,形成所述第一无机层、所述第二无机层。
可以理解的,由于需要对第一无机膜和所述第二无机膜进行图案化处理,在所述第一无机膜和所述第二无机膜上方或者仅在所述第二无机膜上方应该形成一层光阻材料,以便于后期对所述第一无机膜和所述第二无机膜进行刻蚀以形成所述第一无机层、所述第二无机层。
本发明提供了显示面板及其制作方法,该显示面板和显示装置具有显示区和包围显示区的非显示区,包括衬底以及设于衬底上的封装层,衬底上具有设于非显示区的沟槽,通过同一光学掩模版制备封装层中的第一无机层、第二无机层,使得第一无机层、第二无机层具有相同的边界,以占用显示面板较少的边缘区域,提高了显示面板的屏占比。
以上对本发明实施例所提供的显示面板及其制作方法进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的技术方案及其核心思想;本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例的技术方案的范围。
Claims (14)
- 一种显示面板,其中,所述显示面板具有显示区和包围所述显示区的非显示区,所述显示面板包括:衬底,所述衬底上具有沟槽,所述沟槽设于所述非显示区,当从所述沟槽远离所述显示区的一侧切割所述显示面板时,所述沟槽用于阻挡裂纹延伸;封装层,所述封装层设于所述衬底上,所述封装层设于所述沟槽靠近所述显示区的一侧,所述封装层包括第一无机层、第二无机层,所述第一无机层和所述第二无机层具有相同的边界,所述第一无机层和所述第二无机层通过同一光学掩模版形成,以缩短所述边界与所述显示区之间的距离;光阻层,所述光阻层设于所述封装层靠近所述衬底的一侧,所述光阻层包括第一光阻部,所述第一光阻部与所述沟槽相对设置,所述第一无机层和所述第二无机层的边界位于所述第一光阻部上;挡墙,所述挡墙设于所述封装层与所述光阻层之间,所述挡墙设于所述沟槽靠近所述显示区的一侧,所述沟槽与所述挡墙之间的水平距离大于30微米、且小于100微米。
- 如权利要求1所述的显示面板,其中,所述光阻层还包括第二光阻部,所述第二光阻部设于所述沟槽靠近所述显示区的一侧,所述第二光阻部承载所述挡墙以及所述封装层。
- 如权利要求2所述的显示面板,其中,所述第二光阻部与所述第一光阻部之间具有间隙,所述封装层设于所述第一光阻部、所述间隙、所述挡墙以及所述第二光阻部上。
- 如权利要求1所述的显示面板,其中,所述封装层还包括有机层,所述有机层设于所述第一无机层和所述第二无机层之间,所述有机层设于所述挡墙靠近所述显示区的一侧。
- 一种显示面板,其中,所述显示面板具有显示区和包围所述显示区的非显示区,所述显示面板包括:衬底,所述衬底上具有沟槽,所述沟槽设于所述非显示区,当从所述沟槽远离所述显示区的一侧切割所述显示面板时,所述沟槽用于阻挡裂纹延伸;封装层,所述封装层设于所述衬底上,所述封装层设于所述沟槽靠近所述显示区的一侧,所述封装层包括第一无机层、第二无机层,所述第一无机层和所述第二无机层具有相同的边界,所述第一无机层和所述第二无机层通过同一光学掩模版形成,以缩短所述边界与所述显示区之间的距离。
- 如权利要求5所述的显示面板,其中,所述显示面板还包括光阻层,所述光阻层设于所述封装层靠近所述衬底的一侧,所述光阻层包括第一光阻部,所述第一光阻部与所述沟槽相对设置。
- 如权利要求6所述的显示面板,其中,所述第一无机层和所述第二无机层的边界位于所述第一光阻部上。
- 如权利要求6所述的显示面板,其中,所述显示面板还包括挡墙,所述挡墙设于所述封装层与所述光阻层之间,所述挡墙设于所述沟槽靠近所述显示区的一侧,所述沟槽与所述挡墙之间的水平距离大于30微米、且小于100微米。
- 如权利要求8所述的显示面板,其中,所述光阻层还包括第二光阻部,所述第二光阻部设于所述沟槽靠近所述显示区的一侧,所述第二光阻部承载所述挡墙以及所述封装层。
- 如权利要求9所述的显示面板,其中,所述第二光阻部与所述第一光阻部之间具有间隙,所述封装层设于所述第一光阻部、所述间隙、所述挡墙以及所述第二光阻部上。
- 如权利要求8所述的显示面板,其中,所述封装层还包括有机层,所述有机层设于所述第一无机层和所述第二无机层之间,所述有机层设于所述挡墙靠近所述显示区的一侧。
- 一种显示面板的制作方法,用于制作如权利要求5-11任一所述的显示面板,所述显示面板具有显示区和包围所述显示区的非显示区,其中,所述方法包括:提供一衬底,所述衬底上具有沟槽,所述沟槽设于所述非显示区,当从所述沟槽远离所述显示区的一侧切割所述显示面板时,所述沟槽用于阻挡裂纹延伸;在所述衬底上形成封装层,所述封装层设于所述沟槽靠近所述显示区的一侧,所述封装层包括第一无机层、第二无机层,所述第一无机层和所述第二无机层具有相同的边界,所述第一无机层和所述第二无机层通过同一光掩模版形成,以缩短所述边界与所述显示区之间的距离。
- 如权利要求12所述的方法,其中,所述在所述衬底上形成封装层的步骤之前,还包括:在所述衬底上形成挡墙,所述挡墙设于所述沟槽靠近所述显示区的一侧,所述沟槽与所述挡墙之间的水平距离大于30微米、且小于100微米。
- 如权利要求12所述的方法,其中,所述在所述衬底上形成封装层的步骤之前,还包括:在所述衬底上形成光阻层,所述光阻层包括第一光阻部,所述第一光阻部与所述沟槽相对设置。
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