WO2021213204A1 - Led 基板、 led 封装体及其制作方法、显示装置 - Google Patents

Led 基板、 led 封装体及其制作方法、显示装置 Download PDF

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Publication number
WO2021213204A1
WO2021213204A1 PCT/CN2021/086602 CN2021086602W WO2021213204A1 WO 2021213204 A1 WO2021213204 A1 WO 2021213204A1 CN 2021086602 W CN2021086602 W CN 2021086602W WO 2021213204 A1 WO2021213204 A1 WO 2021213204A1
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WO
WIPO (PCT)
Prior art keywords
die
led
colloid
dam
glue
Prior art date
Application number
PCT/CN2021/086602
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English (en)
French (fr)
Inventor
孙平如
陈彦铭
Original Assignee
深圳市聚飞光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010328690.9A external-priority patent/CN113054059A/zh
Priority claimed from CN202020632383.5U external-priority patent/CN212257436U/zh
Application filed by 深圳市聚飞光电股份有限公司 filed Critical 深圳市聚飞光电股份有限公司
Publication of WO2021213204A1 publication Critical patent/WO2021213204A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to LED (Light Emitting Diode, light-emitting diode) field, in particular to an LED substrate, an LED package, a manufacturing method thereof, and a display device.
  • LED Light Emitting Diode, light-emitting diode
  • the "Ultra HD Video Industry Development Action Plan (2019-2022)” proposes that the overall technical route of "4K first, taking into account 8K” will be implemented to vigorously promote the development of the UHD video industry and applications in related fields.
  • Using flip-chip small-pitch COB (Chips on Board) as the backlight of the smart screen (LCD TV) is one of the effective ways to improve the quality of video display.
  • the backlight production method of COB LED modules is to print solder paste on the substrate and then place the LED chip, test after reflow soldering, and after the test is OK, mold a transparent resin adhesive layer with a thickness of about 0.2-0.4mm on the substrate, and then dry it.
  • a COB LED module is manufactured.
  • a manufactured COB LED module is shown in FIG.
  • the resin glue layer that is, the encapsulation glue layer 13.
  • the packaging glue layer 13 is a whole, and its size is close to the size of the substrate 11, and the length and width are generally tens of centimeters; COB LED modules with this structure are prone to colloid detachment from the substrate or cracking of the colloid in actual work.
  • the embodiments of the present invention provide an LED substrate, an LED package, a manufacturing method thereof, and a display device, which solve the problem that the packaging glue of the existing LED module is prone to fall off or cracks, resulting in poor reliability, low luminous efficiency, and low luminous brightness. And the color is prone to unevenness.
  • an embodiment of the present invention provides an LED substrate, the LED substrate includes a circuit board;
  • a plurality of die-attach areas for placing LED chips are provided on the front of the circuit board, and the circuit board further includes a connection circuit for electrically connecting the multiple die-attach areas;
  • the LED substrate further includes a colloidal dam surrounding each die-bonding area formed around the die-bonding area, and the colloid dam constitutes a bowl of the LED chip arranged in the die-bonding area.
  • embodiments of the present invention also provide an LED package, the LED package includes an LED chip and the LED substrate as described above, the LED chip is a mini LED chip or a Micro LED chip; the colloid The dam constitutes a bowl of LED chips arranged in the die-bonding zone, and the LED chips are arranged in the die-bonding zone in each of the colloidal dams;
  • the LED package also includes a sealing material arranged in each of the colloidal dams to cover the LED chips in each of the colloidal dams.
  • an embodiment of the present invention also provides a method for manufacturing an LED package, including:
  • a circuit board Preparing a circuit board, a plurality of die-bonding areas for placing LED chips are distributed on the front side of the circuit board, and the multiple die-bonding areas are electrically connected by a connecting circuit included in the circuit board;
  • the LED chip is a mini LED chip or a Micro LED chip
  • a sealing material covering the LED chip is arranged in each of the colloidal dams.
  • an embodiment of the present invention also provides a display device, which includes the LED package as described above.
  • the embodiment of the present invention provides an LED substrate, an LED package body and a manufacturing method thereof, and a display device.
  • the LED substrate includes a circuit board.
  • the front of the circuit board is distributed with multiple die-bonding areas for placing LED chips, and multiple die-bonding areas.
  • the LED chip can be, but not limited to, a mini LED chip or a Micro LED chip; a gel dam enclosing each die-bonding area is formed around each die-bonding area on the circuit board , So that the adjacent die-bonding areas are separated by a colloidal dam; the die-attachment of the LED chip is completed on the die-bonding area in each colloid dam, and the sealing material covering the LED chip is set in each colloid dam, and the The LED package manufactured by the LED substrate and the LED package manufacturing method has at least the following advantages:
  • Each die-bonding area can be directly electrically connected through the connection circuit included in the circuit board, thereby electrically connecting the LED chips in each die-bonding area to form a backlight light source or an illumination light source, with a simple structure, high integration, and better product reliability;
  • the colloidal dam formed around each die-bonding area can form the bowl of the LED chip located in the die-bonding area, which can protect the LED chip, and the light emitted by the LED chip can be formed after being reflected and mixed by the sidewall of the bowl More uniform light, improve the uniformity and brightness of the light (that is, improve the light efficiency);
  • the conductive metal layer (such as a copper layer) on the circuit board and the colloidal dam are used to form a similar LED support structure, thereby avoiding the use of LED support alone, which can Reduce material costs and manufacturing costs, and improve manufacturing efficiency, improve the integrity of the LED package and reduce its thickness;
  • the sealing material for example, but not limited to encapsulating glue
  • the sealing material is also separated into a plurality of small sealed units by the colloidal dam.
  • the manufactured LED package is less affected by thermal expansion and has stronger resistance to thermal stress, thereby greatly reducing the occurrence of dead lights caused by colloid falling or cracking, and improving the quality and reliability of the product.
  • the die bonding of the LED chip is completed on the die-bonding areas in each colloidal dam.
  • the method of firstly bonding the LED chip on the circuit board, and then forming a colloidal dam around each die-bonding area it can avoid the setting process of the LED chip and the circuit connection between the LED chip and the circuit board in the colloidal dam. It is damaged in the process, so the yield and reliability of the products obtained are higher;
  • the advantages of the above LED package enable the display device including the LED package to have a good display effect, as well as better product quality and product competitiveness.
  • Figure 1 is a first schematic diagram of an existing LED package
  • Figure 2 is a schematic diagram of an LED substrate provided by an embodiment of the present invention.
  • FIG. 3 is a second schematic diagram of an LED package provided by an embodiment of the present invention.
  • Fig. 4 is a third schematic diagram of an LED package provided by an embodiment of the present invention.
  • Fig. 5 is a fourth schematic diagram of an LED package provided by an embodiment of the present invention.
  • Fig. 6 is a three-dimensional schematic diagram of the LED package in Figs. 3 to 5;
  • Fig. 7 is a fifth schematic diagram of an LED package provided by an embodiment of the present invention.
  • FIG. 8 is a sixth schematic diagram of an LED package provided by an embodiment of the present invention.
  • FIG. 9 is a seventh schematic diagram of an LED package provided by an embodiment of the present invention.
  • FIG. 10 is a first schematic diagram of a manufacturing method of an LED package provided by an embodiment of the present invention.
  • FIG. 11 is a second schematic diagram of the manufacturing method of the LED package provided by the embodiment of the present invention.
  • the LED substrate and LED package provided in this embodiment can be used but not limited to making COB lighting devices (such as COB light bars, COB lamps, etc.) or display light source devices (such as backlight light sources, or direct-display display light source devices); Compared with the LED package shown in Figure 1, at least it has more uniform light output, higher light output efficiency, good integration, low cost, less affected by thermal expansion, stronger resistance to thermal stress, better product quality and reliability, etc. advantage.
  • COB lighting devices such as COB light bars, COB lamps, etc.
  • display light source devices such as backlight light sources, or direct-display display light source devices
  • the LED substrate provided in this embodiment includes a circuit board, a plurality of die-attach areas for placing LED chips are distributed on the front of the circuit board, and also includes a colloidal dam surrounding each die-attach area formed around each die-attach area; circuit; Each die-bonding area on the front of the board can be directly electrically connected through the connection circuit included in the circuit board, thereby electrically connecting the LED chips in each die-bonding area to form a backlight light source or a lighting source.
  • the structure is simple, the integration is high, and the product reliability is better. .
  • the LED package made by using the LED substrate also includes LED chips arranged in the die-bonding area of each colloid dam; the colloid dam can constitute the bowl of the LED chip placed in the die-bonding area, and the adjacent solid The crystal regions are separated by a colloid dam; the LED package also includes a sealing material arranged in each colloid dam to cover the LED chip in each colloid dam.
  • the sealing material can provide reliable physical protection for the LED chip and improve the reliability of the product.
  • the sealing material arranged in the colloidal dam is also separated into a plurality of small sealed units by the colloidal dam, so that the prepared LED package is affected by The effect of thermal expansion is small, and the ability to resist thermal stress is stronger, thereby greatly reducing the occurrence of dead lights caused by colloid falling or cracking, and improving the quality and reliability of the product.
  • circuit board in this embodiment can be flexibly selected, it can be a flexible circuit board or a non-flexible circuit board, and the material of the circuit board can be flexibly selected, for example, but not limited to epoxy glass fiber board.
  • the front surface of the circuit board is distributed with a plurality of die-attach areas for placing LED chips, and correspondingly, the die-attach area is provided with electrical conduction with the connection circuit on the circuit board for connecting with the LED chip.
  • the negative electrodes are respectively electrically connected to the electrode connection area.
  • one die bonding zone can be used to set up one LED chip, or more than two LED chips can be set up as required, and when more than two LED chips are set, the electrical connection between the LED chips can be Series, parallel or combination of series and parallel, etc.
  • the number, type, light-emitting color of the LED chips provided in each die-bonding area and the electrical connection between the LED chips can be the same, or can be different or partially different according to the settings.
  • the LED chips between the die-bonding regions can be electrically connected according to requirements, and the electrical connection mode can be series, parallel, or series-parallel combination; of course, in some application scenarios, It can also be arranged that the LED chips between the part of the die-bonding areas are not electrically connected.
  • the details can be flexibly set according to application requirements.
  • the LED chip provided in the die bonding zone can be, but is not limited to, a mini LED chip or a Micro LED chip.
  • the mini LED chip or Micro The LED chip can be flip-chip mini LED chip or flip-chip Micro LED chip, it can also be a formal mini LED chip or a formal Micro
  • the LED chip can be flexibly set according to requirements.
  • the colloid dam constitutes the bowl of the LED chip to be arranged in the die-bonding area, and the adjacent die-bonding areas on the front surface of the circuit board are separated by the colloid dam.
  • the light emitted by the LED chip in the die bonding area can be emitted through the side wall of the bowl, refracted and emitted through mixing, which can not only improve the brightness of the light, but also improve the uniformity of the light; at the same time, the bowl can also be used for die bonding.
  • the LED chips in the zone form physical protection to improve the safety of the LED chips.
  • the manner of forming a colloidal dam surrounding each die-attach area on the circuit board can be flexibly set.
  • a colloid can be arranged around each die-attach area on the circuit board through but not limited to a printing process, and then the printed colloid can be cured to form a colloid dam.
  • a colloidal dam enclosing the die-bonding areas is formed around the die-bonding areas.
  • the process is simple, the production efficiency is high, the cost is low, the precision is good, the printing colloid has strong covering power and adhesion, and the consistency is good. It should be understood that, in some application scenarios, it is also possible to form a colloidal dam around each die-attach area on the circuit board by means of molding.
  • the type of colloid forming the dam in this embodiment can also be flexibly set according to requirements.
  • the selected white glue or transparent glue can be thermosetting or UV type.
  • the height of the colloid dam can be flexibly set according to requirements, and the height can be greater than the height of the LED chip; of course, in some application scenarios, it can also be set to be less than or equal to the height of the LED chip according to requirements. In this implementation, it is preferable that the height of the colloid dam is greater than the height of the LED chip.
  • the colloid dam may be 0.1mm to 1mm, specifically but not limited to 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.7mm, 0.8mm, 0.9mm or 1mm, etc.
  • the shape formed by the colloidal dam that is, the shape of the formed bowl
  • the shape formed by the colloidal dam can also be flexibly set according to requirements.
  • the inner side of each colloidal dam located in the corresponding die bonding area is an inclined surface, that is, the inner side of the formed bowl is an inclined surface
  • the inclination angle of the inclined surface ( That is, the angle between the inner side and the front of the circuit board) can also be flexibly set according to requirements, for example, it can be set to any value between 15° and 75° (for example, but not limited to 30°, 45°, 60°) At an angle, the size of the opening of the bowl thus formed is larger than the size of the bottom of the bowl.
  • the colloid dams of adjacent die-bonding areas on the front surface of the circuit board can be connected as a whole, that is, the colloid layer forming the colloid dam on the front side of the circuit board can be integrally formed The colloidal layer.
  • the colloidal dams of adjacent die-bonding areas on the front of the circuit board are separated from each other, that is, the colloid layer forming the colloidal dam on the front of the circuit board does not completely cover the adjacent The area of the circuit board between the die-bonding areas.
  • the colloid layer forming the colloid dam is also divided into a plurality of small units, which can further make the LED package produced less affected by thermal expansion and stronger resistance to thermal stress, thereby further reducing the occurrence of colloid shedding or cracking.
  • the area of the circuit board not covered by the colloid layer can be directly used to dissipate heat directly to the outside, which improves the heat dissipation efficiency.
  • a guide hole for guiding the inflow of the colloid can also be provided; in this way, on the front of the circuit board
  • the colloid can flow into the guide hole.
  • the colloid in the guide hole is combined with the inner wall of the guide hole to improve the connection of the colloid on the circuit board. Strength can further enhance the reliability of the product.
  • the shape (which may be a regular shape or an irregular shape), size, and number of the guide holes in this embodiment can be flexibly set, as long as the above purpose can be achieved.
  • the guide hole may or may not penetrate the back of the circuit board, that is, the specific depth of the guide hole can also be flexibly set according to requirements.
  • a colloidal dam is directly arranged around the die bonding area on the circuit board, and a conductive metal layer (such as a copper layer) on the circuit board is used to form a similar LED substrate structure with the colloidal dam, thereby avoiding the use of LED substrates alone. , Which can not only reduce material costs and manufacturing costs, but also improve manufacturing efficiency, improve the integrity of the LED package and reduce its thickness.
  • the LED chip can be placed on the die-bonding zone through but not limited to the function of the die-bonding machine or the mass transfer machine, and the electrode of each LED chip is electrically connected to the corresponding electrode connection zone in the die-bonding zone.
  • conductive connection materials such as silver glue or solder paste can be printed on the electrode connection area in the die bonding area, and then the LED chip can be placed in the die bonding area using the function of a die bonder or a mass transfer machine.
  • conductive connection materials such as silver glue or solder paste
  • the colloidal dams surrounding the die-bonding areas on the circuit board are first formed around the die-bonding areas, and then the LED chip die is completed on the die-bonding areas in the colloidal dams, Compared with the method of first bonding the LED chip on the circuit board, and then forming a colloidal dam around each die-bonding area, it can avoid the LED chip and the circuit connection between the LED chip and the circuit board in the setting process of the colloidal dam It is damaged, so the yield and reliability of the product obtained are higher.
  • the material selected for the sealing material in this embodiment can be flexibly selected; for example, in an example, the sealing material can be, but is not limited to, an encapsulant.
  • the arrangement of the encapsulating glue in each glue dam can be through but not limited to glue dispensing, glue spraying, printing, molding, etc.
  • the selected encapsulation glue can be transparent glue or semi-transparent glue, it can also be luminescence conversion glue or other types of encapsulation glue.
  • the colloid can be but not limited to epoxy resin, resin, silica gel or UV glue.
  • the specific settings of the encapsulant in this embodiment can be flexibly set according to, but not limited to, the color of the light emitted by the LED package.
  • a quantum dot film can also be provided on the LED chip according to requirements.
  • the quantum dot film is located between the LED chip and the packaging glue layer.
  • the packaging glue layer can be set It is but not limited to a transparent adhesive layer or a semi-transparent adhesive layer.
  • the height of the encapsulating glue in the colloid dam is preferably set to be less than or equal to the height of the colloid dam, so that the adjacent die-bonding areas on the circuit board are separated by the colloid dam,
  • the encapsulant in the colloid dam is also completely isolated by the colloid dam into multiple small encapsulant units, so that the resulting LED package is less affected by thermal expansion and has a stronger resistance to thermal stress, thereby greatly reducing colloid shedding or The occurrence of dead lights due to cracking and other conditions improves the quality and reliability of the product.
  • the shape of the top surface of the encapsulating glue arranged in each glue dam can also be flexibly set according to requirements, for example, it can be set as an arc-shaped surface.
  • the top surface of the encapsulant can be a concave arc surface to form a similar concave lens, and the top surface of the encapsulant can also be a convex arc surface to form a slightly convex convex lens ;
  • the specific curvature of the top surface can be flexibly selected according to specific application scenarios, thereby further improving the uniformity of light emission and brightness.
  • This embodiment also provides a display device, which may include the LED package as exemplified above.
  • the display device in this embodiment may include, but is not limited to, a COB lighting device (such as a COB light bar, a COB lamp, etc.), a display light source device (such as a backlight light source, or a direct display type display light source device).
  • a COB lighting device such as a COB light bar, a COB lamp, etc.
  • a display light source device such as a backlight light source, or a direct display type display light source device.
  • An LED substrate shown in Figure 2 is shown in Figure 3, and an LED package made using the LED substrate shown in Figure 2 is shown in Figures 2 and 3.
  • the colloid dam 32 set around the crystal area, the LED chip 33 set in the die bonding area in the colloid dam 32, and the encapsulant 34 filled in the colloid dam 32, the encapsulant 34 on the top surface of the colloid dam 32 is
  • the convex curved surface forms a similar convex lens to further improve the brightness and uniformity of the light.
  • the LED package shown in FIG. 4 is higher than the LED package obtained in FIG. 3, and the height of the encapsulating glue 34 is higher, which is basically flush with the top surface of the glue dam 32, and the top surface of the encapsulating glue 34 is a concave curved surface. , Forming a similar concave lens to further improve the brightness and uniformity of the light. That is, the specific height of the packaging glue 34 and the shape of its top surface can be flexibly set; for example, see the LED package shown in FIG.
  • the top surface of 32 is a plane and is flush with the top surface of colloidal dam 32. Of course, the top surface of colloidal dam 32 can also be lower than that of colloidal dam 32, or higher than that of colloidal dam 32 as required. Top surface.
  • the LED package shown in FIG. 5 is a three-dimensional effect diagram of the LED package shown in FIGS. 3 to 5.
  • the LED packages shown in Figures 7, 8 and 9, compared to the LED packages shown in Figures 3, 4, and 5, adjacent colloid dams 32 are arranged separately, so that the PCB 31 and the colloid surround The influence of thermal expansion between the dams 32 is smaller, the ability to resist thermal stress is strong, and the heat dissipation effect is better.
  • the LED package shown in FIGS. 3 to 9 is compared with the LED package shown in FIG.
  • the side walls of the bowl are reflected and mixed to form a more uniform light, which improves the uniformity and brightness of the light (that is, improves the light efficiency); at the same time, it can avoid the use of LED substrates alone, which can reduce material costs and manufacturing costs. It can also improve the manufacturing efficiency, improve the integrity of the LED package and reduce its thickness; since the adjacent die-bonding areas on the PCB 31 are separated by a colloid dam, the packaging glue 34 arranged in the colloid dam 32 is also damped by the colloid.
  • LED package into a plurality of small packaging glue units, so that the produced LED package is less affected by thermal expansion, has stronger resistance to thermal stress, and greatly reduces the occurrence of dead lights caused by colloid falling or cracking.
  • the LED package is not only suitable for blue chip backlight (matching QD film to produce white light), but also suitable for fluorescent glue to emit white light, which improves the comprehensive competitiveness of LED package products.
  • This embodiment also provides a method for an LED package.
  • the prepared LED package at least has more uniform light output, higher light output efficiency, good integration, low cost, and is more affected by thermal expansion. Smaller, stronger resistance to thermal stress, better product quality and reliability, etc.
  • circuit board in this step can be selected flexibly, see but not limited to the above examples, and will not be repeated here.
  • the circuit board in this step can be the circuit board shown in the above example, which will not be repeated here.
  • the colloidal dam formed in this step constitutes the bowl of the LED chip to be set in the die-bonding area, so that the light emitted by the LED chip in the die-bonding area can be emitted through the side wall of the bowl, refracted and mixed and emitted. It can not only improve the brightness of the light, but also improve the uniformity of the light; at the same time, the bowl can also form a physical protection for the LED chip in the die bonding area, and improve the safety of the LED chip.
  • the manner of forming a colloidal dam surrounding each die-attach area on the circuit board in this embodiment can also be flexibly set.
  • a colloid can be printed around each die-attach area on the circuit board through a printing process, and then the colloid is cured to form a colloid dam.
  • a colloidal dam enclosing the die-bonding areas is formed around the die-bonding areas. The process is simple, the production efficiency is high, the cost is low, the precision is good, the printing colloid has strong covering power and adhesion, and the consistency is good.
  • the type of colloid forming the dam in this step can also be flexibly set according to requirements.
  • the selected white glue or transparent glue can be thermosetting or UV type.
  • One example of the setting method can include:
  • a steel mesh or wire mesh with corresponding patterns is set on the front of the circuit board.
  • the area around each die-attach area on the circuit board used to form a colloidal dam is exposed outside the steel mesh or wire mesh, and other areas on the front of the circuit board are exposed. It is closely covered by steel mesh or screen, and then the gel is printed on the steel mesh or screen so that the gel for forming the colloidal dam is set around each solid crystal area;
  • the printed colloid is cured (when the colloid is a thermosetting type, it can be cured by high-temperature baking, and when it is a UV type, it can be cured by UV irradiation) to form a colloid enclosure that encloses the solid crystal regions. dam.
  • the height of the formed colloidal dam can be flexibly set according to requirements, and the height can be greater than the height of the LED chip; of course, in some application scenarios, it can also be set to be less than or equal to the height of the LED chip according to requirements.
  • the shape formed by the colloid dam that is, the shape of the formed bowl, can also be flexibly set according to requirements.
  • the colloidal dams surrounding the die-bonding areas are formed around the die-bonding areas on the front of the circuit board, and the colloid dams of the adjacent die-bonding areas can be connected as a whole, that is, in the circuit
  • the colloid layer forming the colloid dam on the front surface of the board may be an integrally formed colloid layer.
  • the colloidal dams surrounding each die-bonding area are formed around each die-attach area on the front surface of the circuit board, and the colloidal dams of each adjacent die-bonding area are separated from each other.
  • the colloid can flow into the guide hole.
  • the colloid in the guide hole is combined with the inner wall of the guide hole to increase the connection strength of the colloid on the circuit board, which can further improve the reliability of the product sex.
  • a colloidal dam is directly arranged around the die bonding area on the circuit board, and a conductive metal layer (for example, a copper layer) on the circuit board is used to form a similar LED support structure with the colloidal dam, thereby avoiding the use of LED stents alone. , Which can not only reduce material costs and manufacturing costs, but also improve manufacturing efficiency, improve the integrity of the LED package and reduce its thickness.
  • the LED chip can be placed on the die-bonding zone through but not limited to the function of the die-bonding machine or the mass transfer machine, and the electrode of each LED chip is electrically connected to the corresponding electrode connection area in the die-bonding zone.
  • the LED chip set in the die bonding area in this step can be but not limited to mini LED chip or Micro LED chip.
  • conductive connection materials such as silver glue or solder paste can be printed on the electrode connection area in the die bonding area, and then the LED chip can be placed in the die bonding area using the function of a die bonder or a mass transfer machine.
  • conductive connection materials such as silver glue or solder paste
  • the colloidal dams surrounding the die-bonding areas on the circuit board are first formed around the die-bonding areas, and then the LED chip die is completed on the die-bonding areas in the colloidal dams, Compared with the method of first bonding the LED chip on the circuit board, and then forming a colloidal dam around each die-bonding area, it can avoid the LED chip and the circuit connection between the LED chip and the circuit board in the setting process of the colloidal dam It is damaged, so the yield and reliability of the product obtained are higher.
  • S104 A sealing material covering the LED chip is arranged in each colloid dam on the circuit board.
  • the sealing material arranged in each colloid dam to cover the LED chip can provide reliable physical protection for the LED chip; and it should be understood that the material selected for the sealing material can be flexibly selected.
  • the sealing material may be, but is not limited to, packaging glue.
  • the way of arranging the encapsulating glue in each colloid dam can be, but not limited to, glue dispensing, glue spraying, printing, molding, etc.
  • the step of arranging a quantum dot film (QD film) on the LED chip can also be performed, and finally the quantum dot film is formed on the LED chip and the encapsulant layer.
  • the packaging glue layer at this time can be set as but not limited to a transparent glue layer or a semi-transparent glue layer.
  • the height of the encapsulating glue provided in the colloid dam can be set to be less than or equal to the height of the colloid dam, so that the adjacent die-attach areas on the circuit board are separated by the colloid dam,
  • the encapsulant arranged in the colloid dam is also separated by the colloid dam into multiple small encapsulant units, so that the LED package produced is less affected by thermal expansion and has stronger resistance to thermal stress, thereby greatly reducing colloid shedding Or cracking and other situations lead to dead lights, which improves the quality and reliability of the product.
  • FIG. 11 For ease of understanding, this embodiment will exemplify the manufacturing process of the LED package in combination with some specific process steps. Please refer to FIG. 11, including:
  • S111 Prepare PCB301.
  • the die-bonding area is provided with the positive and negative electrodes of the LED chip that are electrically connected to the circuit on the PCB. Respectively electrically connected electrode connection area.
  • a guide hole for guiding the colloid to flow in can also be provided to improve the adhesion.
  • S112 Print white glue (for example, white oil) or transparent glue (for example, thermosetting resin finger) around each die bonding area on the front side of the PCB, and bake or UV irradiate the printed white glue or transparent glue to form a colloidal dam 32.
  • white glue for example, white oil
  • transparent glue for example, thermosetting resin finger
  • S113 Place silver glue or solder paste on the electrode connection area of each die-bonding area.
  • S114 Place the flip-chip LED chip 33 in each bonding area, and the positive and negative electrodes of the LED chip are respectively connected to the corresponding electrode connection area through silver glue or solder paste, and the bonding is completed by baking or reflow soldering.
  • the packaging glue 34 is filled, the packaging glue is dried by UV irradiation or high-temperature baking to obtain the LED package in S117; the obtained LED package can be further tested.
  • one LED chip is arranged in one colloidal dam 32, and it should be understood that multiple LED chips can be arranged according to requirements.
  • the vertical section of the cavity formed by the colloid dam 32 on the PCB 31 is an inverted trapezoid, that is, the inner wall of the colloid dam 32 is a slope.
  • the encapsulant 34 is a concave arc surface on the top surface of the colloid dam 32 to form a similar concave lens.
  • the LED package shown in FIGS. 3 to 9 can also be manufactured through the manufacturing process shown in FIG. 11.
  • the LED package shown in FIGS. 3 to 9 is not limited to be manufactured by the manufacturing method exemplified in this embodiment.
  • the LED package shown in Figs. 3-9 compared with the LED package shown in Fig. 1, the colloidal dam 32 formed around each die-bonding area on the PCB 31 can protect the LED chip, and at the same time the light emitted by the LED chip After being reflected and mixed by the side wall of the bowl, a more uniform light can be formed, which improves the uniformity and brightness of the light (that is, improves the light efficiency); at the same time, it can avoid the use of LED brackets alone, which can reduce material costs and manufacturing costs , It can also improve manufacturing efficiency, improve the integrity of the LED package and reduce its thickness; because the adjacent die-bonding areas on the PCB 31 are separated by a colloid dam, the encapsulant 34 arranged in the colloid dam 32 is also surrounded by the colloid.
  • the dam is separated into a plurality of small packaging glue units, so that the produced LED package is less affected by thermal expansion, has a stronger resistance to thermal stress, and greatly reduces the occurrence of dead lights caused by colloid falling or cracking.
  • the LED package is not only suitable for blue chip backlight (matching QD film to produce white light), but also suitable for fluorescent glue to emit white light, which improves the comprehensive competitiveness of LED package products.

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Abstract

一种LED基板、LED封装体及其制作方法、显示装置，该LED基板包括电路板（31），在电路板（31）上的各固晶区周围形成胶体围坝（32），在各胶体围坝（32）内的固晶区内完成LED晶片（33）的固晶，并在各胶体围坝（32）内设置将LED晶片（33）覆盖的密封材料（34）。

Description

LED基板、LED封装体及其制作方法、显示装置 技术领域
本发明涉及LED（Light Emitting Diode，发光二极管）领域，尤其涉及一种LED基板、LED封装体及其制作方法、显示装置。
 背景技术
《超高清视频产业发展行动计划(2019-2022年)》提出，将施行“4K先行、兼顾8K”的总体技术路线，大力推进超高清视频产业发展和相关领域的应用。采用倒装芯片小间距COB（Chips on Board，板上芯片）方式作为智慧屏体（液晶电视）背光是提高视频显示质量的有效方法之一。
目前，COB LED模组的背光制作方式是先在基板上印刷锡膏然后放置LED芯片，回流焊后测试，测试OK后在基板上方模压厚度约0.2—0.4mm的透明树脂胶层，烘干后制成COB LED模组，例如一种制得的COB LED模组参见图1所示，该成品包括基板11，直接设置于基板11上的LED芯片，以及在基板上方模压、烘干形成的透明树脂胶层，也即封装胶层13。这种封装胶层13为一个整体，且其尺寸与基板11尺寸接近，长度和宽度一般在几十厘米；这种结构的COB LED模组在实际工作中很容易出现胶体脱离基板或者胶体开裂的情况，从而失去背光功能；同时， LED芯片是直接设置在电路板上的，LED芯片位置没有反射杯，LED芯片上方法线方向亮度高，LED芯片之间的亮度低，发光时会出现亮度和颜色差异，且发出的光损失也比较大；也即这种COB LED模组还存在发光效率低、且发光亮度和颜色易存在不均的问题。
 技术问题
本发明实施例提供一种LED基板、LED封装体及其制作方法、显示装置，解决现有LED模组的封装胶容易出现脱落或开裂的情况发生导致可靠性差，以及发光效率低、且发光亮度和颜色易存在不均的问题。
 技术解决方案
为解决上述技术问题，本发明实施例提供一种LED基板，所述LED基板包括电路板；
所述电路板正面设置有多个用于放置LED晶片的固晶区，所述电路板还包括将所述多个固晶区电连接的连接电路；
所述LED基板还包括在所述各固晶区周围形成的围合所述各固晶区的胶体围坝，所述胶体围坝构成设置于所述固晶区内的LED晶片的碗杯。
基于同样的发明思路， 本发明实施例还提供一种LED封装体，所述LED封装体包括LED晶片和如上所述的LED基板，所述LED晶片为mini LED晶片或Micro LED晶片；所述胶体围坝构成设置于所述固晶区内的LED晶片的碗杯，所述LED晶片设置于所述各胶体围坝中的固晶区内；
所述LED封装体还包括设置于所述各胶体围坝中将各胶体围坝内的所述LED晶片覆盖的密封材料。
基于同样的发明思路， 本发明实施例还提供一种LED封装体制作方法，包括：
准备电路板，所述电路板正面分布有多个用于放置LED晶片的固晶区，所述多个固晶区通过所述电路板包括的连接电路电连接；
在所述各固晶区周围形成围合所述各固晶区的胶体围坝，所述胶体围坝构成待设置于所述固晶区内的LED晶片的碗杯；
在所述各胶体围坝内的固晶区完成LED晶片的固晶，所述LED晶片为mini LED晶片或Micro LED晶片；
在所述各胶体围坝内设置将所述LED晶片覆盖的密封材料。
基于同样的发明思路，本发明实施例还提供一种显示装置，所述显示装置包括如上所述的LED封装体。
 有益效果
本发明实施例提供了一种LED基板、LED封装体及其制作方法、显示装置，LED基板包括电路板，电路板正面分布有多个用于放置LED晶片的固晶区，多个固晶区通过所述电路板包括的连接电路电连接，且该LED晶片可为但不限于mini LED晶片或Micro LED晶片；在电路板上的各固晶区周围形成围合各固晶区的胶体围坝，使得相邻固晶区之间通过胶体围坝隔离；在各胶体围坝内的固晶区上完成LED晶片的固晶，并在各胶体围坝内设置将LED晶片覆盖的密封材料，通过该LED基板和LED封装体制作方法所制得的LED封装体至少具有以下优点：
各固晶区可直接通过电路板包括的连接电路电连接，从而将各固晶区内的LED晶片电连接形成背光光源或照明光源，结构简单且集成度高，产品可靠性更好；
各固晶区周围形成的胶体围坝可构成位于固晶区的LED晶片的碗杯，其既能对LED晶片形成保护，同时LED晶片发出的光通过碗杯的侧壁反射、混合后可形成更均匀的光，提高出光的均匀性和出光亮度（也即提高了出光效率）；
通过直接在电路板上固晶区的周围设置胶体围坝，利用电路板上的导电金属层（例如铜层）与该胶体围坝形成类似的LED支架结构，从而避免单独采用LED支架，既能降低材料成本和制造成本，又能提升制造效率，提升LED封装体的一体性并降低其厚度；
由于电路板上相邻固晶区之间通过胶体围坝隔离，设置于胶体围坝内的密封材料（例如可为但不限于封装胶）也被胶体围坝隔离成多个小的密封单元，从而使得制得的LED封装体受热膨胀影响较小，抵抗热应力能力更强，从而大大减少胶体脱落或开裂等情况而导致死灯的情况出现，提高了产品的质量和可靠性。
另外，在制作过程中，由于先在电路板上的各固晶区周围形成围合各固晶区的胶体围坝，然后才在各胶体围坝内的固晶区上完成LED晶片的固晶，相对先将LED晶片在电路板上完成固晶，然后再在各固晶区周围形成胶体围坝的方式，可以避免LED晶片以及LED晶片与电路板上的线路连接在胶体围坝的设置过程中遭到损伤，因此得到的产品的良品率和可靠性更高；
以上LED封装体的优点，使得包括该LED封装体的显示装置具有好的显示效果，以及具有更好的产品质量和产品竞争力。
 附图说明
图1为现有LED封装体示意图一；
图2为本发明实施例提供的LED基板示意图；
图3为本发明实施例提供的LED封装体示意图二；
图4为本发明实施例提供的LED封装体示意图三；
图5为本发明实施例提供的LED封装体示意图四；
图6为图3至图5中的LED封装体的立体示意图；
图7为本发明实施例提供的LED封装体示意图五；
图8为本发明实施例提供的LED封装体示意图六；
图9为本发明实施例提供的LED封装体示意图七。
图10为本发明实施例提供的LED封装体的制作方法流程示意图一；
图11为本发明实施例提供的LED封装体的制作方法流程示意图二。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，下面通过具体实施方式结合附图对本发明实施例作进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本施例提供的LED基板及LED封装体可用于但不限于制作COB照明器件（例如COB灯条、COB灯等）或显示屏光源器件（例如背光光源，或直显式显示屏光源器件）；相对图1所示的LED封装体，至少具有出光更均匀、出光效率更高，一体性好，成本低，且受热膨胀影响较小，抵抗热应力能力更强，产品质量和可靠性更好等优点。
为了便于理解，本实施例下面对LED基板及LED封装体的结构进行示例说明。
本实施例提供LED基板包括电路板，电路板正面分布设置有多个用于放置LED晶片的固晶区，还包括在各固晶区周围形成的围合各固晶区的胶体围坝；电路板正面的各固晶区可直接通过电路板包括的连接电路电连接，从而将各固晶区内的LED晶片电连接形成背光光源或照明光源，结构简单且集成度高，产品可靠性更好。利用该LED基板制得的LED封装体还包括设置于各胶体围坝中的固晶区内的LED晶片；胶体围坝可构成设置于固晶区内的LED晶片的碗杯，且相邻固晶区之间通过胶体围坝隔离；LED封装体还包括设置于各胶体围坝中将各胶体围坝内的LED晶片覆盖的密封材料。该密封材料可以为LED晶片提供可靠的物理保护，提升产品的可靠性。且由于电路板上相邻固晶区之间通过胶体围坝隔离，设置于胶体围坝内的密封材料也被胶体围坝隔离成多个小的密封单元，从而使得制得的LED封装体受热膨胀影响较小，抵抗热应力能力更强，从而大大减少胶体脱落或开裂等情况而导致死灯的情况出现，提高了产品的质量和可靠性。
应当理解的是，本实施例中的电路板类型可以灵活选用，可以为柔性电路板，也可以为非柔性电路板，且电路板的材质可以灵活选用，例如可以采用但不限于环氧玻璃纤维板FR-4，FR-1，CEM-1，CEM-3，厚铜箔，高TG线路板，铝基电路板，铜基板，无卤素板，罗杰斯高频板，PTFE聚四氟乙烯，Teflon铁氟龙，陶瓷板，聚酰亚胺（PI），BT材料等。
本实施例中的电路板正面分布有多个用于放置LED晶片的固晶区，相应的在固晶区设置有与电路板上的连接电路电气导通的，用于与LED晶片的正、负电极分别电连接的电极连接区。本实施例中，一个固晶区可以用于设置一颗LED晶片，也可根据需求设置两颗以上的LED晶片，且设置两颗以上的LED晶片时，LED晶片之间的电连接方式可以为串联、并联或串并联结合等。且各固晶区中所设置的LED晶片的个数、类型、发光颜色以及LED晶片之间的电连接方式可以相同，也可根据设置为不同或部分不同。且各固晶区之间的LED晶片之间（也即各固晶区之间）可以根据需求电连接，且电连接的方式可以为串联、并联或串并联结合；当然在一些应用场景中，也可设置部分固晶区之间的LED芯片之间不电连接。具体都可根据应用需求灵活设置。
本实施例中在固晶区设置的LED晶片可为但不限于mini LED晶片或Micro LED晶片。且在一些应用场景中，设置的mini LED晶片或Micro LED晶片可以为倒装mini LED晶片或倒装Micro LED晶片，也可以为正装mini LED晶片或正装Micro LED晶片，具体可根据需求灵活设定。
本实施例中，胶体围坝构成待设置于固晶区内的LED晶片的碗杯，且电路板正面上各相邻固晶区之间通过胶体围坝形成隔离。这样固晶区内的LED晶片发出的光可通过该碗杯的侧壁产生发射、折射经过混合射出，既能提升出光亮度，又能提升出光的均匀性；同时该碗杯还可对固晶区内的LED晶片形成物理保护，提升LED晶片的安全性。
应当理解的是，本实施例中在电路板上的各固晶区周围形成围合各固晶区的胶体围坝的方式可以灵活设置。例如，一种示例中，可以通过但不限于印刷工艺在电路板上的各固晶区周围设置胶体，然后对印刷的胶体进行固化处理形成胶体围坝。通过印刷工艺在各固晶区周围通过形成围合各固晶区的胶体围坝，工艺简单、制作效率高、成本低、精度好，印刷的胶体覆盖力和附着力强，一致性好。应当理解的是，在一些应用场景中，也可通过模压的方式，在电路板上在各固晶区周围形成胶体围坝。
本实施例中形成围坝的胶体类型也可根据需求灵活设置，例如可以采用但不限于白胶或透明胶，选用的白胶或透明胶可以为热固型，也可为UV型。
本实施例中，胶体围坝的高度可以根据需求灵活设置，该高度可以大于LED晶片的高度；当然，在一些应用场景中也可根据需求设置为小于等于LED晶片的高度。在本实施中，优选胶体围坝的高度大于LED晶片的高度，例如该胶体围坝可以为0.1mm至1mm，具体可为但不限于0.1mm、0.2mm、0.3mm、0.5mm、0.7mm、0.8mm、0.9mm或1mm等。
在本示例中，胶体围坝所围合成的形状，也即形成的碗杯的形状也可根据需求灵活设置，例如在一种示例中，考虑到LED晶片侧面和正面的出光角度，为了进一步提升LED晶片的出光亮度以及混光效果，可以设置且各胶体围坝位于对应固晶区内的内侧面为倾斜面，也即形成的碗杯的内侧面为倾斜面，该倾斜面的倾斜角度（也即内侧面与电路板正面之间的夹角）也可根据需求灵活设置，例如可以设置为15°至75°（例如可以为但不限于30°，45°，60°）之间的任意一个角度，这样形成的碗杯的开口尺寸大于碗杯底部的尺寸。
在本实施例的一种示例中，在电路板正面上各相邻固晶区的胶体围坝之间可以连接为一体，也即在电路板正面上形成胶体围坝的胶体层可以为一体成型的胶体层。
在本实施例中的另一示例中，在电路板正面上各相邻固晶区的胶体围坝之间相互分离，也即在电路板正面上形成胶体围坝的胶体层不完全覆盖相邻固晶区之间的电路板区域。这样将形成胶体围坝的胶体层也划分为多个小的单元，可进一步使得制得的LED封装体受热膨胀影响更小，抵抗热应力能力更强，从而进一步减少胶体脱落或开裂等情况而导致死灯的情况出现，提高产品的质量和可靠性；同时可以直接利用未被该胶体层覆盖的电路板区域直接向外散热，提升散热效率。
可选地，在本实施例中，在电路板正面上各固晶区周围，用于设置胶体围坝所对应的区域内，还可设置有引导胶体流入的导孔；这样在电路板正面上各固晶区周围设置胶体以形成胶体围坝时，设置的胶体可流入该导孔内，在该胶体固化后，例如导孔内的胶体与导孔内壁结合从而提升胶体在电路板上的连接强度，可进一步提升产品的可靠性。应当理解的是，本实施例中导孔的形状（可以为规则形状，也可为不规则形状）、尺寸以及个数都可灵活设置，只要能达到上述目的即可。且导孔可以贯穿电路板的背面，也可不贯穿电路板的背面，也即导孔的具体深度也可根据需求灵活设置。当然，也可将在电路板正面上各固晶区周围，用于设置胶体围坝所对应的区域设置为粗糙面以提升胶体与电路板的结合强度。
本实施例通过直接在电路板上固晶区的周围设置胶体围坝，利用电路板上的导电金属层（例如铜层）与该胶体围坝形成类似的LED基板结构，从而避免单独采用LED基板，既能降低材料成本和制造成本，又能提升制造效率，提升LED封装体的一体性并降低其厚度。
本实施例中，可以通过但不限于固晶机或巨量转移机功能将LED晶片放置于固晶区上，每个LED晶片的电极与固晶区内对应电极连接区电连接。
在一些应用场景中，可在固晶区内的电极连接区位置印刷银胶或锡膏等导电连接材料后，再利用固晶机或巨量转移机功能将LED晶片放置于固晶区内。在另一些应用场景中，如果采用自带焊料的LED晶片，则不需要在固晶区内的电极连接区位置印刷银胶或锡膏等导电连接材料。
在本实施例中，由于先在电路板上的各固晶区周围形成围合各固晶区的胶体围坝，然后才在各胶体围坝内的固晶区上完成LED晶片的固晶，相对先将LED晶片在电路板上完成固晶，然后再在各固晶区周围形成胶体围坝的方式，可以避免LED晶片以及LED晶片与电路板上的线路连接在胶体围坝的设置过程中遭到损伤，因此得到的产品的良品率和可靠性更高。
应当理解的是，本实施例中的密封材料所选用的材质可以灵活选用；例如一种示例中，该密封材料可以为但不限于封装胶。在密封材料采用封装胶时，在各胶体围坝内封装胶的设置方式可以通过但不限于点胶、喷胶、印刷、模压等方式。且所选用的封装胶可以为透明胶或半透明胶，也可为发光转换胶或其他类型的封装胶。且胶体可以采用但不限于环氧树脂，树脂，硅胶或UV胶等。且本实施例中封装胶的具体设置可以根据但不限于LED封装体所需发出的光的颜色灵活设置。
且可选地，在一些应用示例中，根据需求还可在LED晶片上设置量子点膜（QD膜），该量子点膜位于LED晶片与封装胶层之间，此时的封装胶层可以设置为但不限于透明胶层或半透明胶层。
在本实施例的一些示例中，胶体围坝内的封装胶的高度优选设置为小于或等于胶体围坝的高度，这样由于电路板上相邻固晶区之间通过胶体围坝隔离，设置于胶体围坝内的封装胶也被胶体围坝完全隔离成多个小的封装胶单元，从而使得制得的LED封装体受热膨胀影响较小，抵抗热应力能力更强，从而大大减少胶体脱落或开裂等情况而导致死灯的情况出现，提高了产品的质量和可靠性。
在本示例中，在各胶体围坝内设置的封装胶的顶面的形状也可根据需求灵活设定，例如可以设置为弧形面。一种示例中，封装胶的顶面可为下凹的弧形面从而构成类似的凹形透镜，封装胶的顶面也可为上凸的弧形面以构成类似微凸形的凸形透镜；其中该顶面的具体弧度则可根据具体应用场景灵活选择，从而进一步提高发光均匀性和出光亮度。
本实施例还提供了一种显示装置，该显示装置可包括如上示例的LED封装体。本实施例中的显示装置可以包括但不限于COB照明器件（例如COB灯条、COB灯等）、显示屏光源器件（例如背光光源，或直显式显示屏光源器件）。
为了便于理解，本实施例下面结合图2至图9所示的几种具体的LED基板及LED封装体结构做进一步示例性说明。
如图2所示的为一种LED基板，图3所示的利用图2所示的LED基板制得的LED封装体，参见图2和图3所示，其包括PCB31，PCB31正面上各固晶区周围设置的胶体围坝32，胶体围坝32内的固晶区中设置的LED晶片33，以及在胶体围坝32填充的封装胶34，封装胶34在胶体围坝32的顶面为上凸的弧形面，形成类似的凸形透镜，以进一步提升出光亮度和均匀性。
图4所示的LED封装体相对图3得到的LED封装体，封装胶34的高度更高，基本与胶体围坝32的顶面齐平，封装胶34的顶面为下凹的弧形面，形成类似的凹形透镜，以进一步提升出光亮度和均匀性。也即封装胶34的具体高度以及其顶面的形状可以灵活设置；例如参见图5所示的LED封装体，相对图,3和图4所示的LED封装体，封装胶34在胶体围坝32的顶面为平面，且与胶体围坝32的顶面齐平，当然该胶体围坝32的顶面也可低于胶体围坝32的顶面，或者根据需求高于胶体围坝32的顶面。图5所示的LED封装体为图3-图5所示的LED封装体的立体效果图。图7、图8和图9所示的LED封装体，相对于图3、图4和图5所示的LED封装体，相邻胶体围坝32之间是分离设置的，这样PCB31与胶体围坝32之间的热膨胀影响更小，抵抗热应力能力强，且散热效果更好。
图3至图9所示的LED封装体，相对图1所示的LED封装体， PCB31上各固晶区周围形成的胶体围坝32既能对LED晶片形成保护，同时LED晶片发出的光通过碗杯的侧壁反射、混合后可形成更均匀的光，提高出光的均匀性和出光亮度（也即提高了出光效率）；同时能避免单独采用LED基板，既能降低材料成本和制造成本，又能提升制造效率，提升LED封装体的一体性并降低其厚度；由于PCB31上相邻固晶区之间通过胶体围坝隔离，设置于胶体围坝32内的封装胶34也被胶体围坝隔离成多个小的封装胶单元，从而使得制得的LED封装体受热膨胀影响较小，抵抗热应力能力更强，大大减少胶体脱落或开裂等情况而导致死灯的情况出现。且该LED封装体不仅适用于蓝光芯片背光（匹配QD膜产生白光），也适用于荧光胶发白光背光，提升了LED封装体的产品综合竞争力。
本实施例还提供了一种LED封装体的方法，制得的LED封装体相对现有LED封装体，至少具有出光更均匀、出光效率更高，一体性好，成本低，且受热膨胀影响较小，抵抗热应力能力更强，产品质量和可靠性更好等优点。
为了便于理解，本实施例下面结合图10所示的LED封装体制作方法为示例进行说明。请参见图10所示的LED封装体制作方法，包括：
S101：准备电路板。
应当理解的是，本步骤中的电路板类型可以灵活选用，参见但不限于上述示例所示，在此不再赘述。本步骤中的电路板可采用上述示例所示的电路板，在此不再赘述。
S102：在电路板上的各固晶区周围形成围合各固晶区的胶体围坝。
本步骤中形成的胶体围坝构成待设置于固晶区内的LED晶片的碗杯，这样固晶区内的LED晶片发出的光可通过该碗杯的侧壁产生发射、折射经过混合射出，既能提升出光亮度，又能提升出光的均匀性；同时该碗杯还可对固晶区内的LED晶片形成物理保护，提升LED晶片的安全性。
本步骤中，在电路板上的各固晶区周围形成围合各固晶区的胶体围坝后，电路板正面上各相邻固晶区之间通过胶体围坝形成隔离。另外，应当理解的是，本实施例中在电路板上的各固晶区周围形成围合各固晶区的胶体围坝的方式也可以灵活设置。例如，一种示例中，可以通过印刷工艺在电路板上的各固晶区周围印刷胶体，然后对该胶体进行固化处理形成胶体围坝。通过印刷工艺在各固晶区周围通过形成围合各固晶区的胶体围坝，工艺简单、制作效率高、成本低、精度好，印刷的胶体覆盖力和附着力强，一致性好。
本步骤中形成围坝的胶体类型也可根据需求灵活设置，例如可以采用但不限于白胶或透明胶，选用的白胶或透明胶可以为热固型，也可为UV型。其中一种示例的设置方式可以包括：
在电路板的正面上设置具有对应图形的钢网或丝网，电路板上各固晶区周围用于形成胶体围坝的区域裸露于钢网或丝网外，电路板正面上的其他区域则被钢网或丝网紧贴覆盖， 然后在钢网或丝网上印刷胶体从而在各固晶区周围设置好用于形成胶体围坝的胶体；
将印刷好的胶体进行固化处理（胶体为热固型时可以采用高温烘烤使其固化，为UV型时，可以采用UV照射使其固化），形成围合所述各固晶区的胶体围坝。
应当理解的是，在一些应用场景中，也可通过模压的方式，在电路板上在各固晶区周围形成胶体围坝；此时需要定制相应结构的钢制公模和母模，该公模和母模将电路板夹持在中间，且对应电路板上各固晶区周围用于形成胶体围坝的区域形成相应的空腔，该空腔与公模和母模上对应的注胶口相通，电路板正面上的其他区域则被公模或母模紧贴覆盖，然后通过注胶口向上述各空腔内注入胶体。
本步骤中，形成的胶体围坝的高度可以根据需求灵活设置，该高度可以大于LED晶片的高度；当然，在一些应用场景中也可根据需求设置为小于等于LED晶片的高度。在本示例中，胶体围坝所围合成的形状，也即形成的碗杯的形状也可根据需求灵活设置。
在本步骤中，在电路板正面上的各固晶区周围形成的围合各固晶区的胶体围坝，各相邻固晶区的胶体围坝之间可以连接为一体，也即在电路板正面上形成胶体围坝的胶体层可以为一体成型的胶体层。当然，在另一些应用场景中，在电路板正面上的各固晶区周围形成的围合各固晶区的胶体围坝，各相邻固晶区的胶体围坝之间相互分离。
可选地，在电路板正面上各固晶区周围，用于设置胶体围坝所对应的区域内，设置有引导胶体流入的导孔时；在电路板正面上各固晶区周围设置胶体以形成胶体围坝的过程中，胶体可流入该导孔内，在该胶体固化后，例如导孔内的胶体与导孔内壁结合从而提升胶体在电路板上的连接强度，可进一步提升产品的可靠性。
本实施例通过直接在电路板上固晶区的周围设置胶体围坝，利用电路板上的导电金属层（例如铜层）与该胶体围坝形成类似的LED支架结构，从而避免单独采用LED支架，既能降低材料成本和制造成本，又能提升制造效率，提升LED封装体的一体性并降低其厚度。
S103：在各胶体围坝内的固晶区完成LED晶片的固晶。
本步骤中，可以通过但不限于固晶机或巨量转移机功能将LED晶片放置于固晶区上，每个LED晶片的电极与固晶区内对应电极连接区电连接。本步骤中在固晶区设置的LED晶片可为但不限于mini LED晶片或Micro LED晶片。
在一些应用场景中，可在固晶区内的电极连接区位置印刷银胶或锡膏等导电连接材料后，再利用固晶机或巨量转移机功能将LED晶片放置于固晶区内。在另一些应用场景中，如果采用自带焊料的LED晶片，则不需要在固晶区内的电极连接区位置印刷银胶或锡膏等导电连接材料。
在本实施例中，由于先在电路板上的各固晶区周围形成围合各固晶区的胶体围坝，然后才在各胶体围坝内的固晶区上完成LED晶片的固晶，相对先将LED晶片在电路板上完成固晶，然后再在各固晶区周围形成胶体围坝的方式，可以避免LED晶片以及LED晶片与电路板上的线路连接在胶体围坝的设置过程中遭到损伤，因此得到的产品的良品率和可靠性更高。
S104：在电路板上的各胶体围坝内设置将LED晶片覆盖的密封材料。
本步骤中在各胶体围坝内设置的将LED晶片覆盖的密封材料，可以为LED晶片提供可靠的物理保护；且应当理解的是，该密封材料所选用的材质可以灵活选用。例如一种示例中，该密封材料可以为但不限于封装胶。
本步骤中，密封材料为封装胶时，在各胶体围坝内设置封装胶的方式可以通过但不限于点胶、喷胶、印刷、模压等方式。且可选地，在一些应用示例中，根据需求在形成密封胶层之前，还可执行在LED晶片上设置量子点膜（QD膜）的步骤，最终形成量子点膜位于LED晶片与封装胶层之间，此时的封装胶层可以设置为但不限于透明胶层或半透明胶层。
在本实施例的一些示例中，在胶体围坝内设置的封装胶的高度可设置为小于或等于胶体围坝的高度，这样由于电路板上相邻固晶区之间通过胶体围坝隔离，设置于胶体围坝内的封装胶也被胶体围坝隔离成多个小的封装胶单元，从而使得制得的LED封装体受热膨胀影响较小，抵抗热应力能力更强，从而大大减少胶体脱落或开裂等情况而导致死灯的情况出现，提高了产品的质量和可靠性。
为了便于理解，本实施例下面结合一些具体的工艺流程步骤，对LED封装体的制作过程进行示例性的说明，请参见图11所示，包括：
S111：准备好PCB301，PCB正面分布有多个用于放置LED晶片的固晶区，相应的在固晶区设置有与PCB上的线路电气导通的，用于与LED晶片的正、负电极分别电连接的电极连接区。在PCB正面上各固晶区周围，用于设置胶体围坝所对应的区域内，还可设置有引导胶体流入的导孔，提高粘接力。
S112：在PCB正面上各固晶区周围印刷白胶（例如白油）或透明胶（例如热固型树指），并烘烤或UV照射印刷的白胶或透明胶形成胶体围坝32。
S113：在各固晶区的电极连接区上放置银胶或锡膏。
S114：将倒装LED晶片33放置于各固晶区内，且LED晶片的正、负电极分别通过银胶或锡膏与对应的电极连接区连接，通过烘烤或回流焊完成固晶。
S115：通过测试后，通过注胶设备4或喷胶设备或印刷胶设备向各胶体围坝32内填充封装胶34（可为UV型或热固型树脂，当然本步骤中也可设置其他密封材料）。
S116：在封装胶34填充完之后，通过UV照射或高温烘烤烤干封装胶体，得到S117中的LED封装体；并可进一步对得到的LED封装体进行测试。
图11中S117得到的LED封装体中，一个胶体围坝32内的设置了一颗LED晶片，应当理解的是根据需求可以设置多颗。胶体围坝32在PCB31上形成的空腔的竖截面为倒梯形，也即胶体围坝32的内壁为斜面。封装胶34在胶体围坝32的顶面为下凹的弧形面，形成类似的凹形透镜。当然，通过图11所示的制作工艺也可制得图3至图9所示的LED封装体。
 应当理解的是，图3至图9所示的LED封装体并不限于通过本实施例所示例的制作方法制得。且图3至图9所示的LED封装体，相对图1所示的LED封装体， PCB31上各固晶区周围形成的胶体围坝32既能对LED晶片形成保护，同时LED晶片发出的光通过碗杯的侧壁反射、混合后可形成更均匀的光，提高出光的均匀性和出光亮度（也即提高了出光效率）；同时能避免单独采用LED支架，既能降低材料成本和制造成本，又能提升制造效率，提升LED封装体的一体性并降低其厚度；由于PCB31上相邻固晶区之间通过胶体围坝隔离，设置于胶体围坝32内的封装胶34也被胶体围坝隔离成多个小的封装胶单元，从而使得制得的LED封装体受热膨胀影响较小，抵抗热应力能力更强，大大减少胶体脱落或开裂等情况而导致死灯的情况出现。且该LED封装体不仅适用于蓝光芯片背光（匹配QD膜产生白光），也适用于荧光胶发白光背光，提升了LED封装体的产品综合竞争力。
以上内容是结合具体的实施方式对本发明实施例所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。

Claims (15)

  1. 一种LED基板，其特征在于，所述LED基板包括电路板；
    所述电路板正面设置有多个用于放置LED晶片的固晶区，所述电路板还包括将所述多个固晶区电连接的连接电路；
    所述LED基板还包括在所述各固晶区周围形成的围合所述各固晶区的胶体围坝，所述胶体围坝构成设置于所述固晶区内的LED晶片的碗杯。
  2. 如权利要求1所述的LED基板，其特征在于，所述胶体围坝由白胶或透明胶构成。
  3. 如权利要求1或2所述的LED基板，其特征在于，所述电路板上在所述各固晶区周围用于形成所述胶体围坝的区域内，设置有导孔，形成所述胶体围坝的部分胶体在固化之前流入所述导孔内，并在固化后与所述导孔内壁结合。
  4. 如权利要求1或2所述的LED基板，其特征在于，所述胶体围坝的高度为0.1mm至1mm。
  5. 如权利要求1或2所述的LED基板，其特征在于，所述电路板正面上，一个所述固晶区对应一个将其围合的胶体围坝，且相邻所述固晶区的胶体围坝之间相互分离。
  6. 一种LED封装体，其特征在于，所述LED封装体包括LED晶片和如权利要求1-5任一项所述的LED基板，所述LED晶片为mini LED晶片或Micro LED晶片；所述胶体围坝构成设置于所述固晶区内的LED晶片的碗杯，所述LED晶片设置于所述各胶体围坝中的固晶区内；
    所述LED封装体还包括设置于所述各胶体围坝中将各胶体围坝内的所述LED晶片覆盖的密封材料。
  7. 如权利要求6所述的LED封装体，其特征在于，所述LED晶片为倒装mini LED晶片或倒装Micro LED晶片。
  8. 如权利要求6或7所述的LED封装体，其特征在于，所述密封材料为封装胶，所述封装胶为透明胶、半透明胶或发光转换胶，所述封装胶的高度小于等于所述胶体围坝的高度。
  9. 如权利要求6或7所述的LED封装体，其特征在于，所述密封材料为封装胶，位于所述胶体围坝内的所述封装胶的顶面为弧形面。
  10. 一种LED封装体制作方法，其特征在于，包括：
    准备电路板，所述电路板正面分布有多个用于放置LED晶片的固晶区，所述多个固晶区通过所述电路板包括的连接电路电连接；
    在所述各固晶区周围形成围合所述各固晶区的胶体围坝，所述胶体围坝构成待设置于所述固晶区内的LED晶片的碗杯；
    在所述各胶体围坝内的固晶区完成LED晶片的固晶，所述LED晶片为mini LED晶片或Micro LED晶片；
    在所述各胶体围坝内设置将所述LED晶片覆盖的密封材料。
  11. 如权利要求10所述的LED封装体制作方法，其特征在于，所述电路板上，在所述各固晶区周围用于形成所述胶体围坝的区域内，设置有引导胶体流入的导孔，在所述各固晶区周围形成所述胶体围坝的胶体时，部分胶体流入所述导孔内，并在固化后与所述导孔内壁结合。
  12. 如权利要求10所述的LED封装体制作方法，其特征在于，所述在所述各固晶区周围形成围合所述各固晶区的胶体围坝包括：
    在所述各固晶区周围印刷胶体，所述胶体为白胶或透明胶；
    将印刷好的所述胶体进行固化，形成围合所述各固晶区的胶体围坝。
  13. 如权利要求10-12任一项所述的LED封装体制作方法，其特征在于，所述在所述各固晶区周围形成围合所述各固晶区的胶体围坝包括：对应一个所述固晶区形成一个围合该固晶区的胶体围坝，且相邻所述固晶区的胶体围坝之间相互分离。
  14. 如权利要求10-12任一项所述的LED封装体制作方法，其特征在于，所述密封材料为封装胶，在所述各胶体围坝内设置将所述LED晶片覆盖的封装胶包括：
    在所述各胶体围坝内设置将所述LED晶片覆盖的封装胶；将所述封装胶固化处理，固化后的所述封装胶的顶面为弧形面。
  15. 一种显示装置，其特征在于，所述显示装置包括如权利要求6-9任一项所述的LED封装体。
PCT/CN2021/086602 2020-04-23 2021-04-12 Led 基板、 led 封装体及其制作方法、显示装置 WO2021213204A1 (zh)

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