WO2021212984A1 - On-chip measurement circuit and measurement method for low-voltage sram time parameters - Google Patents
On-chip measurement circuit and measurement method for low-voltage sram time parameters Download PDFInfo
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- WO2021212984A1 WO2021212984A1 PCT/CN2021/076791 CN2021076791W WO2021212984A1 WO 2021212984 A1 WO2021212984 A1 WO 2021212984A1 CN 2021076791 W CN2021076791 W CN 2021076791W WO 2021212984 A1 WO2021212984 A1 WO 2021212984A1
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- G—PHYSICS
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C29/50012—Marginal testing, e.g. race, voltage or current testing of timing
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/12015—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details comprising clock generation or timing circuitry
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/022—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in I/O circuitry
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/023—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in clock generator or timing circuitry
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/36—Data generation devices, e.g. data inverters
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- the invention relates to the technical field of integrated circuit testing, in particular to an on-chip measurement circuit and a measurement method for low-voltage SRAM time parameters.
- DRAM has a high density, a relatively simple storage structure using capacitors, low latency, high performance, and durability close to unlimited access, and low power consumption.
- SRAM has a very fast read and write speed, and data can be sent to the CPU for processing in the shortest time and quickly output to the outside, so SRAM is widely used in various occasions.
- the purpose of the present invention is to provide a low-voltage SRAM time parameter on-chip measurement circuit and measurement method.
- the large-scale in-chip mass SRAM test can be achieved.
- the MBIST test While carrying on the MBIST test, also realized the measurement of the access time of each storage unit of SRAM.
- the present invention provides an on-chip measurement circuit for low-voltage SRAM time parameters, which includes a measurement control module and a time measurement module, the time measurement module is connected to the measurement control module, and the time measurement module is controlled by the measurement control module.
- the measurement control module is based on A self-test module is built in the memory.
- the measurement control module includes BIST control logic, BIST test vector generation logic, and a time measurement control module.
- the time measurement module includes a delay unit, a comparator, and an accumulator.
- a further improvement is that: the time measurement control module is a multiplexer that selects or shields the signal, and the module connects the input SRAM test vector generated by the built-in memory self-test and the result output from the SRAM to be tested to the time measurement module.
- the time measurement module includes a total of 15 stages of delay units D0-D14 connected in series, and the system clock CLK is connected to D0.
- the signal CLK generates signals CLK_1-CLK_15 after D0-D14.
- the delay unit is composed of two-stage inverters. The delay of the first-stage delay unit D0 is 1 ns, and the delays of the other delay units D1-D14 are all 20 ps.
- a further improvement is that the clock terminals of the comparators C0-C15 receive the measured SRAM output signal Q_0, the C0 data terminal is connected to the system clock signal, the C1 data terminal is connected to the system clock via the D0 delay unit signal CLK_1, and the C2 data terminal is connected to the system clock via D0, D1 delay unit signal CLK_2, and so on, CLK, CLK_1-CLK_15 are respectively connected to the data terminals of the comparators C0-C15, and then the results obtained by the comparator Z0-Z15 are input to the accumulator (ACC), and finally the accumulator result OUT output.
- ACC accumulator
- the present invention also provides a measurement method of the low-voltage SRAM time parameter on-chip measurement circuit, the method includes the following steps:
- Step 1 Start MBIST and time measurement, set bist_en and bitm_en to "1";
- Step 2 Capture the output data signal Q_0 of the SRAM under test and the system clock CLK;
- Step 3 CLK generates CLK_1-CLK_15 through delay units D0-D14;
- Step 4 The comparator samples the data terminal signal until the 16-level comparator has finished sampling
- Step 5 The accumulator counts and encodes the number of level "1" in the sampled signal, and finally outputs the result to the off-chip for calculation.
- the measurement control module includes a BIST controller, a BIST test vector generator, and a time measurement control circuit. Among them, the time measurement control circuit is used to control the signal gating between the memory test circuit and the time measurement module. While performing the BIST test, the access time of the SRAM can be measured.
- MBIST is a mature technical solution for memory testing in the industry.
- the test vector required for time parameter measurement is write 0 to read 0, write 1 to read 1.
- Such test vectors generally exist in the MBIST algorithm. Therefore, the MBIST test vector set is sufficient
- the test vector required for time parameter measurement In view of the integration of SRAMs of different specifications and large quantities of SRAMs in the chip, designing a control module separately for the selection of multiple SRAMs will increase the area overhead, and it is more appropriate to share this part of the logic with MBIST. In summary, it is undoubtedly simpler and the least costly to carry out SRAM time parameter measurement design on the basis of the MBIST test scheme.
- the time measurement control module is a multiplexer that selects or shields the signal.
- the module connects the input SRAM test vector generated by the built-in memory and the result output from the SRAM to be tested to the time measurement module.
- the beneficial effects of the present invention are: by adding a measurement control module and a time measurement module, a large-scale SRAM test in a large-scale chip is performed. While the MBIST test is performed, it also realizes the measurement of the access time of each storage unit of the SRAM. Or multiple SRAMs can measure the access time at the same time to achieve "full speed" self-measurement, the measurement results are more accurate, and the dependence on ATE is reduced, which effectively reduces the cost of testing.
- Figure 1 is a schematic diagram of the overall measurement circuit of the present invention.
- Fig. 2 is a schematic diagram of the measurement control module of the present invention.
- Fig. 3 is a schematic diagram of the time measurement module of the present invention.
- Fig. 4 is a schematic diagram of the comparator of the present invention.
- Fig. 5 is a schematic diagram of the measurement process of the present invention.
- Fig. 6 is a schematic diagram of an example access time parameter measurement circuit of the present invention.
- Fig. 7 is a schematic diagram of measurement waveforms of an example circuit of the present invention.
- this embodiment provides a low-voltage SRAM time parameter on-chip measurement circuit, including a measurement control module and a time measurement module, the time measurement module is connected to the measurement control module, and the time measurement is controlled by the measurement control module Module, the measurement control module is based on a memory built-in self-test module, the measurement control module includes BIST control logic, BIST test vector generation logic, and a time measurement control module, and the time measurement module includes a delay unit, a comparator, and an accumulator.
- MBIST is a mature technical solution for memory testing in the industry.
- the test vector required for time parameter measurement is write 0 to read 0, write 1 to read 1.
- Such test vectors generally exist in the MBIST algorithm. Therefore, the MBIST test vector set is sufficient
- the test vector required for time parameter measurement In view of the integration of SRAMs of different specifications and large quantities of SRAMs in the chip, designing a control module separately for the selection of multiple SRAMs will increase the area overhead, and it is more appropriate to share this part of the logic with MBIST. In summary, it is undoubtedly simpler and the least costly to carry out SRAM time parameter measurement design on the basis of the MBIST test scheme.
- the measurement control module is shown in Figure 2.
- the time measurement control module is a multiplexer that selects or shields the signal.
- the module is connected to the built-in memory to input the SRAM test vector generated by the test and the result output from the SRAM to be tested to the time Measurement module.
- the time measurement module is shown in Figure 3.
- the time measurement module includes a total of 15 delay units D0-D14 in series, the system clock CLK is connected to the D0 delay unit, and the signal CLK generates the signal CLK_1-CLK_15 after D0-D14 ,
- the delay unit is composed of two-stage inverters, the first-stage delay unit D0 has a delay of 1 ns, and the other delay units D1-D14 have delays of 20 ps. In the design, more delay units can be added according to the requirements of accuracy and area.
- the access time parameter of the measurement object selected in this patent is slightly larger than 1ns, so the combination of 1ns (D0) and 20ps (D1-D14) is finally selected.
- the delayed unit can be modified according to the actual measurement object.
- the clock terminals of the comparators C0-C15 and C0-C15 receive the test SRAM output signal Q_0, the C0 data terminal is connected to the system clock signal CLK, the C1 data terminal is connected to the system clock via the D0 delay unit signal CLK_1, and the C2 data terminal is connected to the system clock via D0. , D1 delay unit signal CLK_2, and so on, CLK, CLK_1-CLK_15 are respectively connected to the data terminals of the comparators C0-C15.
- the specific working waveform of the comparator is shown in Figure 4. When the clock pulse is over, the trigger can record how many time units are delayed, that is, the time that the trigger clock terminal signal lags behind the trigger data terminal signal.
- the results Z0-Z15 obtained by the comparator are input to the accumulator (ACC).
- the accumulator is realized by a counter.
- the accumulator counts the number of level "1" in the sampled signal, and then encodes the output result according to the designed delay unit information
- T access The SRAM access time (T access ) can be determined very intuitively.
- the first step is to start MBIST and time measurement, and set bist_en and bitm_en to "1".
- the second step is to capture the output data signal Q_0 of the SRAM under test and the system clock CLK.
- CLK generates CLK_1-CLK_15 through delay units D0-D14, respectively.
- the comparator samples the data terminal signal until the 16-level comparator has finished sampling.
- the accumulator counts and encodes the number of level "1" in the sampled signal, and finally outputs the result to the off-chip for calculation.
- the measurement calculation formula: ⁇ T 1+(N-1)*0.02, where N is the final output result of the accumulator (N ⁇ 15), and the time unit is nanoseconds.
- the verification object is selected as a low-voltage 6T SRAM (capacity: 32x16), the row address is 4, and the column address is 8.
- Figure 6 shows the access time parameter measurement circuit for verifying this method example.
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Abstract
An on-chip measurement circuit and measurement method for low-voltage SRAM time parameters, the measurement circuit comprising a measurement control module and a time measurement module, wherein the time measurement module is connected to the measurement control module; the time measurement module is controlled by means of the measurement control module; the measurement control module has a memory-based built-in self-test module; the measurement control module comprises BIST control logic, BIST test vector generation logic, and a time measurement control module; and the time measurement module comprises a delay unit, a comparator, and an accumulator. By means of adding a measurement control module and a time measurement module, a large quantity of SRAMs are tested in a large-scale chip. While performing MBIST testing, the measurement of the access time of each memory unit of the SRAM is also implemented, and the access time for one or more SRAMs is measured at the same time, thus achieving "full speed" self-measurement and accurate measurement results, reducing dependence on ATE, and effectively reducing test costs.
Description
本发明涉及集成电路测试技术领域,尤其涉及一种低电压SRAM时间参数的片上测量电路及测量方法。The invention relates to the technical field of integrated circuit testing, in particular to an on-chip measurement circuit and a measurement method for low-voltage SRAM time parameters.
在信息化大潮中,人工智能、物联网、大数据、区块链相互赋能,产业优化升级和经济快速发展。而数据在这些高新技术发展的过程中发挥着核心角色的作用,这也当然会对电子信息存储产品提出了更高的要求——高密度、高速度、低功耗、低成本等。FLASH、DRAM、SRAM存储是当前市场主流。DRAM密度高、使用电容储存结构相对简单,又具有低延迟、高效能和接近无限次存取的耐用度,功耗也比较低。SRAM由于其读写速度非常快,数据能够在最短的时间送入CPU进行处理并快速输出至外部,因此SRAM被广泛的应用于各种场合。In the tide of informatization, artificial intelligence, Internet of Things, big data, and blockchain are mutually empowering, industrial optimization and upgrading, and rapid economic development. Data plays a central role in the development of these high-tech industries, which of course puts forward higher requirements for electronic information storage products-high density, high speed, low power consumption, low cost, etc. FLASH, DRAM, and SRAM storage are the mainstream in the current market. DRAM has a high density, a relatively simple storage structure using capacitors, low latency, high performance, and durability close to unlimited access, and low power consumption. SRAM has a very fast read and write speed, and data can be sent to the CPU for processing in the shortest time and quickly output to the outside, so SRAM is widely used in various occasions.
芯片低功耗和高速度之间的矛盾,业界一直认为两者平衡是不回避这一矛盾最关键的解决方法。低功耗SRAM设计中,降低电源电压最为有效。在低电压设计中,追求更低的工作电压和功耗,势必会对SRAM的性能约束更为苛刻。SRAM的访问时间是性能主要时间参数之一,通常外部探测对高性能电路的不利影响,以及需要考虑的参数和误差的量级,使用外部设备进行测量变得非常困难。因此,对于测试人员或外部设备测量准确的访问时间,通常需要具有内置测量的片上解决方案。用于测量SRAM的时间参数测量的测试方案很多,但当前,芯 片上SRAM部分占比越来越来越大,不同规格的SRAM种类也越来越多,尤其是低功耗的需求,对于低电压SRAM的时间参数的性能需求更为苛刻,传统的方案已经无法满足当前时间参数测量的需求,探索一种能够大规模、大批量、精确且方便的方法极为重要。The contradiction between low power consumption and high speed of the chip, the industry has always believed that the balance between the two is the most critical solution not to avoid this contradiction. In the low-power SRAM design, reducing the power supply voltage is the most effective. In the low-voltage design, the pursuit of lower operating voltage and power consumption will inevitably impose stricter constraints on the performance of SRAM. SRAM access time is one of the main time parameters of performance. Usually, the adverse effects of external detection on high-performance circuits, as well as the magnitude of the parameters and errors that need to be considered, make it very difficult to measure with external equipment. Therefore, for testers or external devices to measure accurate access time, an on-chip solution with built-in measurement is usually required. There are many test schemes for measuring the time parameters of SRAM, but at present, the proportion of SRAM on the chip is increasing, and there are more and more types of SRAM with different specifications, especially the demand for low power consumption. The performance requirements of the time parameters of the voltage SRAM are more demanding. The traditional solutions can no longer meet the current time parameter measurement requirements. It is extremely important to explore a large-scale, large-scale, accurate and convenient method.
发明内容Summary of the invention
针对现有技术的不足,本发明的目的是提供了一种低电压SRAM时间参数的片上测量电路及测量方法,通过增添测量控制模块与时间测量模块,对大规模芯片内大批量SRAM测试,在进行MBIST测试的同时,也实现了对SRAM各个存储单元访问时间的测量。In view of the shortcomings of the prior art, the purpose of the present invention is to provide a low-voltage SRAM time parameter on-chip measurement circuit and measurement method. By adding a measurement control module and a time measurement module, the large-scale in-chip mass SRAM test can be achieved. While carrying on the MBIST test, also realized the measurement of the access time of each storage unit of SRAM.
本发明提供一种低电压SRAM时间参数的片上测量电路,包括测量控制模块与时间测量模块,所述时间测量模块与测量控制模块连接,通过测量控制模块控制时间测量模块,所述测量控制模块基于存储器内建自测试模块,测量控制模块包含BIST控制逻辑、BIST测试向量生成逻辑以及时间测量控制模块,所述时间测量模块包含延迟单元,比较器和累加器。The present invention provides an on-chip measurement circuit for low-voltage SRAM time parameters, which includes a measurement control module and a time measurement module, the time measurement module is connected to the measurement control module, and the time measurement module is controlled by the measurement control module. The measurement control module is based on A self-test module is built in the memory. The measurement control module includes BIST control logic, BIST test vector generation logic, and a time measurement control module. The time measurement module includes a delay unit, a comparator, and an accumulator.
进一步改进在于:所述时间测量控制模块为多路选择器,选择或屏蔽信号,该模块连接存储器内建自测试产生的输入待测SRAM测试向量和从待测SRAM输出的结果至时间测量模块。A further improvement is that: the time measurement control module is a multiplexer that selects or shields the signal, and the module connects the input SRAM test vector generated by the built-in memory self-test and the result output from the SRAM to be tested to the time measurement module.
进一步改进在于:所述时间测量模块共包含15级延迟单元D0-D14串联,系统时钟CLK接D0,信号CLK经D0-D14后产生信号CLK_1-CLK_15,其中延迟单元由两级反相器构成,第一级延迟单元D0的延迟为1ns,其他延迟单元D1-D14延迟均为20ps。A further improvement is that the time measurement module includes a total of 15 stages of delay units D0-D14 connected in series, and the system clock CLK is connected to D0. The signal CLK generates signals CLK_1-CLK_15 after D0-D14. The delay unit is composed of two-stage inverters. The delay of the first-stage delay unit D0 is 1 ns, and the delays of the other delay units D1-D14 are all 20 ps.
进一步改进在于:所述比较器C0-C15时钟端接待测SRAM输出信号Q_0,C0数据端接系统时钟信号,C1数据端接系统时钟经D0延迟单元信号CLK_1,C2数据端接系统时钟经D0、D1延迟单元信号CLK_2,以此类推,CLK、CLK_1-CLK_15分别连接比较器C0-C15的数据端,再将比较器得出的结果Z0-Z15输入至累加器(ACC),最终将累加器结果OUT输出。A further improvement is that the clock terminals of the comparators C0-C15 receive the measured SRAM output signal Q_0, the C0 data terminal is connected to the system clock signal, the C1 data terminal is connected to the system clock via the D0 delay unit signal CLK_1, and the C2 data terminal is connected to the system clock via D0, D1 delay unit signal CLK_2, and so on, CLK, CLK_1-CLK_15 are respectively connected to the data terminals of the comparators C0-C15, and then the results obtained by the comparator Z0-Z15 are input to the accumulator (ACC), and finally the accumulator result OUT output.
本发明还提供一种所述的低电压SRAM时间参数的片上测量电路的测量方法,所述方法包括以下步骤:The present invention also provides a measurement method of the low-voltage SRAM time parameter on-chip measurement circuit, the method includes the following steps:
步骤一:启动MBIST和时间测量,置bist_en和bitm_en为“1”;Step 1: Start MBIST and time measurement, set bist_en and bitm_en to "1";
步骤二:捕获待测SRAM输出数据信号Q_0和系统时钟CLK;Step 2: Capture the output data signal Q_0 of the SRAM under test and the system clock CLK;
步骤三:CLK经延迟单元D0-D14,分别产生CLK_1-CLK_15;Step 3: CLK generates CLK_1-CLK_15 through delay units D0-D14;
步骤四:比较器采样数据端信号,直至16级比较器采样完毕;Step 4: The comparator samples the data terminal signal until the 16-level comparator has finished sampling;
步骤五:累加器计数采样信号中电平“1”的个数并编码,最终将结果输出至片外进行计算。Step 5: The accumulator counts and encodes the number of level "1" in the sampled signal, and finally outputs the result to the off-chip for calculation.
进一步改进在于:所述步骤五中的测算公式为ΔT=1+(N-1)*0.02,其中N为累加器最终输出的结果(N<15),所述时间单位为纳秒。A further improvement is that the calculation formula in the fifth step is ΔT=1+(N-1)*0.02, where N is the final output result of the accumulator (N<15), and the time unit is nanoseconds.
在MBIST(存储器内建自测试)电路基础上,增添测量控制模块与时间测量模块,测量控制模块包含BIST控制器、BIST测试向量生成器以及时间测量控制电路。其中,时间测量控制电路用于控制存储器测试电路与时间测量模块之间的信号选通,在进行BIST测试的同时,可以对SRAM进行访问时间的测量。On the basis of the MBIST (Memory Built-in Self Test) circuit, a measurement control module and a time measurement module are added. The measurement control module includes a BIST controller, a BIST test vector generator, and a time measurement control circuit. Among them, the time measurement control circuit is used to control the signal gating between the memory test circuit and the time measurement module. While performing the BIST test, the access time of the SRAM can be measured.
MBIST是业内成熟的用于存储器测试的技术方案,时间参数测量所需 测试向量为写0读0,写1读1,这样的测试向量普遍存在于MBIST算法中,因此,MBIST测试向量集足以满足时间参数测量所需测试向量。针对于芯片内集成不同规格的SRAM和大批量的SRAM,对多片SRAM的选择单独设计控制模块会增加面积开销,与MBIST共用这部分逻辑较为合适。综上所述,在MBIST测试方案的基础上进行SRAM时间参数测量设计无疑是较为简易且付出的代价最少。MBIST is a mature technical solution for memory testing in the industry. The test vector required for time parameter measurement is write 0 to read 0, write 1 to read 1. Such test vectors generally exist in the MBIST algorithm. Therefore, the MBIST test vector set is sufficient The test vector required for time parameter measurement. In view of the integration of SRAMs of different specifications and large quantities of SRAMs in the chip, designing a control module separately for the selection of multiple SRAMs will increase the area overhead, and it is more appropriate to share this part of the logic with MBIST. In summary, it is undoubtedly simpler and the least costly to carry out SRAM time parameter measurement design on the basis of the MBIST test scheme.
时间测量控制模块为多路选择器,选择或屏蔽信号,该模块连接存储器内建自测试产生的输入待测SRAM测试向量和从待测SRAM输出的结果至时间测量模块。外界通过与BIST控制器通信进行控制(bist_en=1、bitm_en=1),启动控制器进入时间参数测量模式,BIST控制器启动BIST测试向量生成器,根据算法生成预先设计好的一系列的测试激励,施加给待测电路,同时时间测量控制电路控制存储器测试电路与时间测量模块之间的信号选通,将待测SRAM的响应(Q_0)输入至时间测量模块。The time measurement control module is a multiplexer that selects or shields the signal. The module connects the input SRAM test vector generated by the built-in memory and the result output from the SRAM to be tested to the time measurement module. The outside world controls by communicating with the BIST controller (bist_en=1, bitm_en=1), starts the controller to enter the time parameter measurement mode, the BIST controller starts the BIST test vector generator, and generates a series of pre-designed test stimuli based on the algorithm , Applied to the circuit under test, and the time measurement control circuit controls the signal gating between the memory test circuit and the time measurement module, and inputs the response (Q_0) of the SRAM under test to the time measurement module.
本发明的有益效果是:通过增添测量控制模块与时间测量模块,对大规模芯片内大批量SRAM测试,在进行MBIST测试的同时,也实现了对SRAM各个存储单元访问时间的测量,可针对一个或者多个SRAM同时进行访问时间测量,实现“全速”自测量,测量结果更为准确,并降低对ATE的依赖,有效降低测试成本。The beneficial effects of the present invention are: by adding a measurement control module and a time measurement module, a large-scale SRAM test in a large-scale chip is performed. While the MBIST test is performed, it also realizes the measurement of the access time of each storage unit of the SRAM. Or multiple SRAMs can measure the access time at the same time to achieve "full speed" self-measurement, the measurement results are more accurate, and the dependence on ATE is reduced, which effectively reduces the cost of testing.
图1是本发明的整体测量电路示意图。Figure 1 is a schematic diagram of the overall measurement circuit of the present invention.
图2是本发明的测量控制模块示意图。Fig. 2 is a schematic diagram of the measurement control module of the present invention.
图3是本发明的时间测量模块示意图。Fig. 3 is a schematic diagram of the time measurement module of the present invention.
图4是本发明的比较器示意图。Fig. 4 is a schematic diagram of the comparator of the present invention.
图5是本发明的测量流程示意图。Fig. 5 is a schematic diagram of the measurement process of the present invention.
图6是本发明的实例访问时间参数测量电路示意图。Fig. 6 is a schematic diagram of an example access time parameter measurement circuit of the present invention.
图7是本发明的实例电路测量波形示意图。Fig. 7 is a schematic diagram of measurement waveforms of an example circuit of the present invention.
为了加深对本发明的理解,下面将结合实施例对本发明作进一步的详述,本实施例仅用于解释本发明,并不构成对本发明保护范围的限定。如图1所示,本实施例提供了一种低电压SRAM时间参数的片上测量电路,包括测量控制模块与时间测量模块,所述时间测量模块与测量控制模块连接,通过测量控制模块控制时间测量模块,所述测量控制模块基于存储器内建自测试模块,测量控制模块包含BIST控制逻辑、BIST测试向量生成逻辑以及时间测量控制模块,所述时间测量模块包含延迟单元,比较器和累加器。In order to deepen the understanding of the present invention, the present invention will be described in further detail below in conjunction with examples. The examples are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention. As shown in Figure 1, this embodiment provides a low-voltage SRAM time parameter on-chip measurement circuit, including a measurement control module and a time measurement module, the time measurement module is connected to the measurement control module, and the time measurement is controlled by the measurement control module Module, the measurement control module is based on a memory built-in self-test module, the measurement control module includes BIST control logic, BIST test vector generation logic, and a time measurement control module, and the time measurement module includes a delay unit, a comparator, and an accumulator.
MBIST是业内成熟的用于存储器测试的技术方案,时间参数测量所需测试向量为写0读0,写1读1,这样的测试向量普遍存在于MBIST算法中,因此,MBIST测试向量集足以满足时间参数测量所需测试向量。针对于芯片内集成不同规格的SRAM和大批量的SRAM,对多片SRAM的选择单独设计控制模块会增加面积开销,与MBIST共用这部分逻辑较为合适。综上所述,在MBIST测试方案的基础上进行SRAM时间参数测量设计无疑是较为简易且付出的代价最少。MBIST is a mature technical solution for memory testing in the industry. The test vector required for time parameter measurement is write 0 to read 0, write 1 to read 1. Such test vectors generally exist in the MBIST algorithm. Therefore, the MBIST test vector set is sufficient The test vector required for time parameter measurement. In view of the integration of SRAMs of different specifications and large quantities of SRAMs in the chip, designing a control module separately for the selection of multiple SRAMs will increase the area overhead, and it is more appropriate to share this part of the logic with MBIST. In summary, it is undoubtedly simpler and the least costly to carry out SRAM time parameter measurement design on the basis of the MBIST test scheme.
测量控制模块如图2所示,时间测量控制模块为多路选择器,选择或 屏蔽信号,该模块连接存储器内建自测试产生的输入待测SRAM测试向量和从待测SRAM输出的结果至时间测量模块。外界通过与BIST控制器通信进行控制(bist_en=1、bitm_en=1),启动控制器进入时间参数测量模式,BIST控制器启动BIST测试向量生成器,根据算法生成预先设计好的一系列的测试激励,施加给待测电路,同时时间测量控制电路控制存储器测试电路与时间测量模块之间的信号选通,将待测SRAM的响应(Q_0)输入至时间测量模块。The measurement control module is shown in Figure 2. The time measurement control module is a multiplexer that selects or shields the signal. The module is connected to the built-in memory to input the SRAM test vector generated by the test and the result output from the SRAM to be tested to the time Measurement module. The outside world controls by communicating with the BIST controller (bist_en=1, bitm_en=1), starts the controller to enter the time parameter measurement mode, the BIST controller starts the BIST test vector generator, and generates a series of pre-designed test stimuli based on the algorithm , Applied to the circuit under test, and the time measurement control circuit controls the signal gating between the memory test circuit and the time measurement module, and inputs the response (Q_0) of the SRAM under test to the time measurement module.
时间测量模块如图3所示,鉴于精度和面积的考量,时间测量模块共包含15级延迟单元D0-D14串联,系统时钟CLK接D0延迟单元,信号CLK经D0-D14后产生信号CLK_1-CLK_15,其中延迟单元由两级反相器构成,第一级延迟单元D0的延迟为1ns,其他延迟单元D1-D14延迟均为20ps。在设计中可根据精度和面积的要求,增加更多的延迟单元,本专利选取的测量对象访问时间参数略大于1ns,故最终选择1ns(D0)与20ps(D1-D14)组合。延迟的单元可根据实际的测量对象进行修改。The time measurement module is shown in Figure 3. In view of accuracy and area considerations, the time measurement module includes a total of 15 delay units D0-D14 in series, the system clock CLK is connected to the D0 delay unit, and the signal CLK generates the signal CLK_1-CLK_15 after D0-D14 , The delay unit is composed of two-stage inverters, the first-stage delay unit D0 has a delay of 1 ns, and the other delay units D1-D14 have delays of 20 ps. In the design, more delay units can be added according to the requirements of accuracy and area. The access time parameter of the measurement object selected in this patent is slightly larger than 1ns, so the combination of 1ns (D0) and 20ps (D1-D14) is finally selected. The delayed unit can be modified according to the actual measurement object.
所述比较器C0-C15,C0-C15时钟端接待测SRAM输出信号Q_0,C0数据端接系统时钟信号CLK,C1数据端接系统时钟经D0延迟单元信号CLK_1,C2数据端接系统时钟经D0、D1延迟单元信号CLK_2,以此类推,CLK、CLK_1-CLK_15分别连接比较器C0-C15的数据端。具体的比较器工作波形如图4所示,当时钟脉冲结束后,触发器可以记录延迟多少个时间单位,也就是触发器时钟端信号相对于触发器数据端信号落后的时间。比较器得出的结果Z0-Z15输入至累加器 (ACC),累加器由计数器实现,累加器计数采样信号中电平“1”的个数,然后编码输出结果,根据所设计的延迟单元信息可以非常直观的确定SRAM的访问时间(T
access)。
The clock terminals of the comparators C0-C15 and C0-C15 receive the test SRAM output signal Q_0, the C0 data terminal is connected to the system clock signal CLK, the C1 data terminal is connected to the system clock via the D0 delay unit signal CLK_1, and the C2 data terminal is connected to the system clock via D0. , D1 delay unit signal CLK_2, and so on, CLK, CLK_1-CLK_15 are respectively connected to the data terminals of the comparators C0-C15. The specific working waveform of the comparator is shown in Figure 4. When the clock pulse is over, the trigger can record how many time units are delayed, that is, the time that the trigger clock terminal signal lags behind the trigger data terminal signal. The results Z0-Z15 obtained by the comparator are input to the accumulator (ACC). The accumulator is realized by a counter. The accumulator counts the number of level "1" in the sampled signal, and then encodes the output result according to the designed delay unit information The SRAM access time (T access ) can be determined very intuitively.
测量步骤如图5流程图所示:The measurement steps are shown in the flowchart in Figure 5:
第一步,启动MBIST和时间测量,置bist_en和bitm_en为“1”。The first step is to start MBIST and time measurement, and set bist_en and bitm_en to "1".
第二步,捕获待测SRAM输出数据信号Q_0和系统时钟CLK。The second step is to capture the output data signal Q_0 of the SRAM under test and the system clock CLK.
第三步,CLK经延迟单元D0-D14,分别产生CLK_1-CLK_15。In the third step, CLK generates CLK_1-CLK_15 through delay units D0-D14, respectively.
第四步,比较器采样数据端信号,直至16级比较器采样完毕。In the fourth step, the comparator samples the data terminal signal until the 16-level comparator has finished sampling.
第五步,累加器计数采样信号中电平“1”的个数并编码,最终将结果输出至片外进行计算。测量计算公式:ΔT=1+(N-1)*0.02,其中N为累加器最终输出的结果(N<15),所述时间单位为纳秒。In the fifth step, the accumulator counts and encodes the number of level "1" in the sampled signal, and finally outputs the result to the off-chip for calculation. The measurement calculation formula: ΔT=1+(N-1)*0.02, where N is the final output result of the accumulator (N<15), and the time unit is nanoseconds.
为验证该测量电路的有效性,选取验证对象为低电压6T SRAM(容量:32x16),其行地址为4,列地址为8。图6为验证该方法实例访问时间参数测量电路。图7为第一个地址第一位存储单元,实际测量的波形图,根据步骤5的测量计算方法,列出以下算式并得出结果:ΔT=1+(10-1)*0.02=1.180ns。In order to verify the validity of the measurement circuit, the verification object is selected as a low-voltage 6T SRAM (capacity: 32x16), the row address is 4, and the column address is 8. Figure 6 shows the access time parameter measurement circuit for verifying this method example. Figure 7 is the actual measured waveform of the first memory cell of the first address. According to the measurement calculation method in step 5, the following formulas are listed and the result is obtained: ΔT=1+(10-1)*0.02=1.180ns .
Claims (6)
- 一种低电压SRAM时间参数的片上测量电路,其特征在于:包括测量控制模块与时间测量模块,所述时间测量模块与测量控制模块连接,通过测量控制模块控制时间测量模块,所述测量控制模块基于存储器内建自测试模块,测量控制模块包含BIST控制逻辑、BIST测试向量生成逻辑以及时间测量控制模块,所述时间测量模块包含延迟单元,比较器和累加器。An on-chip measurement circuit for low-voltage SRAM time parameters, characterized in that it comprises a measurement control module and a time measurement module, the time measurement module is connected to the measurement control module, and the time measurement module is controlled by the measurement control module, the measurement control module Based on the memory built-in self-test module, the measurement control module includes BIST control logic, BIST test vector generation logic, and time measurement control module. The time measurement module includes a delay unit, a comparator, and an accumulator.
- 如权利要求1所述的一种低电压SRAM时间参数的片上测量电路,其特征在于:所述时间测量控制模块为多路选择器,选择或屏蔽信号,该模块连接存储器内建自测试产生的输入待测SRAM测试向量和从待测SRAM输出的结果至时间测量模块。The on-chip measurement circuit for low-voltage SRAM time parameters according to claim 1, wherein the time measurement control module is a multiplexer, which selects or shields signals, and the module is connected to the built-in self-test of the memory. Input the test vector of the SRAM to be tested and the result output from the SRAM to be tested to the time measurement module.
- 如权利要求1所述的一种低电压SRAM时间参数的片上测量电路,其特征在于:所述时间测量模块共包含15级延迟单元D0-D14串联,系统时钟CLK接D0,信号CLK经D0-D14后产生信号CLK_1-CLK_15,其中延迟单元由两级反相器构成,第一级延迟单元D0的延迟为1ns,其他延迟单元D1-D14延迟均为20ps。The on-chip measurement circuit for low-voltage SRAM time parameters according to claim 1, wherein the time measurement module includes a total of 15 delay units D0-D14 connected in series, the system clock CLK is connected to D0, and the signal CLK passes through D0- Signals CLK_1-CLK_15 are generated after D14, where the delay unit is composed of two-stage inverters, the first-stage delay unit D0 has a delay of 1 ns, and the other delay units D1-D14 have delays of 20 ps.
- 如权利要求3所述的一种低电压SRAM时间参数的片上测量电路,其特征在于:所述比较器C0-C15时钟端接待测SRAM输出信号Q_0,C0数据端接系统时钟信号,C1数据端接系统时钟经D0延迟单元信号CLK_1,C2数据端接系统时钟经D0、D1延迟单元信号CLK_2,以此类推,CLK、CLK_1-CLK_15分别连接比较器C0-C15的数据端,再将比较器得出的结果Z0-Z15输入至累加器,最终将累加器结果 OUT输出。The on-chip measurement circuit for low-voltage SRAM time parameters according to claim 3, characterized in that: the clock terminals of the comparators C0-C15 receive the test SRAM output signal Q_0, the C0 data terminal is connected to the system clock signal, and the C1 data terminal The system clock is connected to the D0 delay unit signal CLK_1, the C2 data terminal is connected to the system clock through the D0, D1 delay unit signal CLK_2, and so on, CLK, CLK_1-CLK_15 are respectively connected to the data terminals of the comparators C0-C15, and then the comparator is The results Z0-Z15 are input to the accumulator, and finally the accumulator result OUT is output.
- 一种如权利要求1-4任意一项所述的低电压SRAM时间参数的片上测量电路的测量方法,其特征在于:所述方法包括以下步骤:A method for measuring a low-voltage SRAM time parameter on-chip measurement circuit according to any one of claims 1 to 4, wherein the method comprises the following steps:步骤一:启动MBIST和时间测量,置bist_en和bitm_en为“1”;Step 1: Start MBIST and time measurement, set bist_en and bitm_en to "1";步骤二:捕获待测SRAM输出数据信号Q_0和系统时钟CLK;Step 2: Capture the output data signal Q_0 of the SRAM under test and the system clock CLK;步骤三:CLK经延迟单元D0-D14,分别产生CLK_1-CLK_15;Step 3: CLK generates CLK_1-CLK_15 through delay units D0-D14;步骤四:比较器采样数据端信号,直至16级比较器采样完毕;Step 4: The comparator samples the data terminal signal until the 16-level comparator has finished sampling;步骤五:累加器计数采样信号中电平“1”的个数并编码,最终将结果输出至片外进行计算。Step 5: The accumulator counts and encodes the number of level "1" in the sampled signal, and finally outputs the result to the off-chip for calculation.
- 如权利要求5所述的一种低电压SRAM时间参数的片上测量电路的测量方法,其特征在于:所述步骤五中的测算公式为ΔT=1+(N-1)*0.02,其中N为累加器最终输出的结果(N<15),所述时间单位为纳秒。The measurement method of a low-voltage SRAM time parameter on-chip measurement circuit as claimed in claim 5, characterized in that: the calculation formula in step 5 is ΔT=1+(N-1)*0.02, where N is The final output result of the accumulator (N<15), and the time unit is nanoseconds.
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