WO2021203328A1 - Circuit imprimé intégré et procédé de fabrication associé - Google Patents

Circuit imprimé intégré et procédé de fabrication associé Download PDF

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Publication number
WO2021203328A1
WO2021203328A1 PCT/CN2020/083827 CN2020083827W WO2021203328A1 WO 2021203328 A1 WO2021203328 A1 WO 2021203328A1 CN 2020083827 W CN2020083827 W CN 2020083827W WO 2021203328 A1 WO2021203328 A1 WO 2021203328A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
main body
metal base
sub
magnetic core
Prior art date
Application number
PCT/CN2020/083827
Other languages
English (en)
Chinese (zh)
Inventor
王蓓蕾
郭伟静
谢占昊
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Priority to PCT/CN2020/083827 priority Critical patent/WO2021203328A1/fr
Publication of WO2021203328A1 publication Critical patent/WO2021203328A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

Definitions

  • This application relates to the technical field of circuit boards, in particular to an embedded circuit board and a preparation method thereof.
  • the main technical problem solved by this application is to provide an embedded circuit board and a preparation method thereof, which can reduce the volume of the circuit board and improve the heat dissipation performance of the circuit board.
  • an embedded circuit board including: a circuit board main body; a magnetic core and a metal base, all embedded in the circuit board main body.
  • the preparation method includes: preparing a main body of a first sub-circuit board; A first accommodating groove is formed on the main body, and a magnetic core is placed in the first accommodating groove; a second sub-circuit board main body is formed on the side of the first sub-circuit board main body that exposes the magnetic core to cover The magnetic core; forming a second accommodating groove, placing the metal base in the second accommodating groove.
  • another technical solution adopted in this application is to provide a method for preparing an embedded circuit board, the preparation method includes: preparing a first sub-circuit board body; A first accommodating groove is formed on the main body, and the metal base is placed in the first accommodating groove; a second accommodating groove is formed on the main body of the first sub-circuit board, and the magnetic core is placed in the second accommodating groove. Placed in the groove; a second sub-circuit board body is formed on the side of the first sub-circuit board body that exposes the magnetic core to cover the magnetic core.
  • the beneficial effect of the present application is: in the embedded circuit board of the present application, the magnetic core and the metal base are embedded in the main body of the circuit board at the same time, which can reduce the volume of the circuit board and improve the heat dissipation performance of the circuit board. .
  • FIG. 1 is a schematic cross-sectional structure diagram of an embodiment of an embedded circuit board according to the present application
  • FIG. 2 is a schematic top view of the embedded circuit board of FIG. 1;
  • FIG. 3 is a schematic cross-sectional structure diagram of the embedded circuit board of FIG. 1 in an application scenario
  • FIG. 4 is a schematic cross-sectional structure diagram of the embedded circuit board of FIG. 1 in another application scenario
  • FIG. 5 is a schematic cross-sectional structure diagram of the embedded circuit board of FIG. 1 in another application scenario
  • FIG. 6 is a schematic cross-sectional structure diagram of another embodiment of an embedded circuit board according to the present application.
  • FIG. 7 is a schematic flowchart of an embodiment of a method for manufacturing an embedded circuit board according to the present application.
  • FIG. 8 is a preparation process diagram corresponding to the preparation method of FIG. 7;
  • Fig. 9 is a partial preparation process diagram of the preparation method of Fig. 7 in another application scenario.
  • FIG. 10 is a schematic flowchart of another embodiment of the method for manufacturing an embedded circuit board according to the present application.
  • FIG. 11 is a preparation process diagram corresponding to the preparation method of FIG. 10;
  • Fig. 12 is a partial preparation process diagram of the preparation method of Fig. 10 in another application scenario.
  • FIG. 1 is a schematic cross-sectional structure diagram of an embodiment of the embedded circuit board of the present application
  • FIG. 2 is a schematic top view of the embedded circuit board of FIG. 1.
  • the embedded circuit board 1000 includes a circuit board main body 1100, a magnetic core 1200 and a metal base 1300.
  • the circuit board main body 1100 plays a main supporting role in the entire embedded circuit board 1000, and the magnetic core 1200 and the metal base 1300 are embedded in the circuit board main body 1100 at the same time.
  • the material of the magnetic core 1200 may be manganese-zinc-iron, nickel-zinc-iron or amorphous magnetic material, and the material of the metal base 1300 may be copper, aluminum or an alloy including copper and aluminum, or other conductive materials.
  • embedding the magnetic core 1200 in the circuit board main body 1100 can reduce the volume of the embedded circuit board 1000 compared to being arranged on the surface of the circuit board main body 1100.
  • the metal base 1300 is made of conductive material, It can transfer heat and transfer the heat from the higher temperature area to the lower temperature area, thereby improving the heat dissipation performance of the embedded circuit board 1000. That is to say, in this embodiment, the magnetic core 1200 and the metal base 1300 are embedded at the same time. In the circuit board main body 1100, the volume of the embedded circuit board 1000 can be reduced, and the heat dissipation performance of the embedded circuit board 1000 can also be improved.
  • the metal base 1300 is provided with electronic components (not shown), such as chips, etc., and the metal base 1300 is used to dissipate the electronic components thereon.
  • signal transmission layers 1110 are provided on opposite sides of the circuit board main body 1100.
  • the signal transmission layer 1110 is made of conductive materials, such as copper, aluminum, etc., for signal transmission.
  • the metal base 1300 is electrically connected to the signal transmission layers 1110 located on opposite sides of the circuit board main body 1100 to realize signal transmission between the two signal transmission layers 1110. That is to say, at this time, the metal base 1300 can also realize the function of heat dissipation. Current-carrying function.
  • the circuit board main body 1100 may further include a signal transmission layer 1110 disposed inside. That is, the embedded circuit board 1000 is a multilayer board. In this case, any two layers of signal transmission
  • the layers 1110 may all be provided with a metal base 1300 that is electrically connected to each other, or, in other embodiments, the circuit board body 1100 is provided with a signal transmission layer 1110 on only one side surface and inside, and the metal base 1300 is electrically connected to the circuit board.
  • the thickness of the magnetic core 1200 is less than the thickness of the metal base 1300, and the cross section of the magnetic core 1200 can be circular, racetrack, square ring, etc., and the metal base 1300 has a cross-section along its thickness. Rectangular or T-shaped, there is no restriction here.
  • the number of metal bases 1300 is more than two, such as 2, 4, or more.
  • the number of metal bases 1300 is two.
  • two or more metal bases 1300 include a first metal base 1310 and a second metal base 1320.
  • the first metal base 1310 penetrates the magnetic core 1200, and the second metal base 1320 is located at the periphery of the magnetic core 1200.
  • the signal transmission layer 1110 includes a wire pattern 1111.
  • the wire pattern 1111 is provided across the first metal base 1310 and the second metal base 1320 to form a coil loop capable of transmitting current around the magnetic core 1200, that is, in this application In the scene, the first metal base 1310 and the second metal base 1320 cooperate with each other to form a coil loop that transmits current around the magnetic core 1200.
  • the remaining metal bases 1300 except for the first metal base 1310 and the second metal base 1320 can be distributed on the circuit board main body 1100. Any wiring that needs to achieve a large current carrying capacity There are no restrictions on the location or heat dissipation location.
  • the circuit board main body 1100 is also provided with a first via hole 1400, and a conductive material is provided in the first via hole 1400 for realizing the connection on both sides of the circuit board main body 1100
  • the electrical connection of the wire pattern 1111 that is, the wire pattern 1111 does not only rely on the metal base 1300 to achieve electrical connection.
  • the conductive material may be materials such as copper, aluminum, etc.
  • the conductive material is disposed on the inner wall of the first via hole 1400 or fills the first via hole 1400 (as shown in FIG. 1).
  • the number of the first via 1400 is at least one, such as 1, 2, 5, etc., and the at least one first via 1400 can be distributed at any position of the circuit board main body 1100, which is not limited here. .
  • the conductive pattern 1111 is bridged between at least two of the first vias 1400 for signal transmission.
  • FIG. 3 is a schematic cross-sectional structure diagram of the embedded circuit board of FIG. 1 in an application scenario.
  • the number of metal bases 1300 is more than one, for example, one, two or more.
  • the number of the metal base 1300 is taken as one for schematic illustration.
  • the one or more metal bases 1300 include a first metal base 1310, and the first metal base 1310 penetrates the magnetic core 1200.
  • the circuit board main body 1100 is provided with a second via hole 1500 located at the periphery of the magnetic core 1200, the signal transmission layer 1110 includes a wire pattern 1111, and a wire pattern 1111 is bridged between the first metal base 1310 and the second via hole 1500 ,
  • the second via hole 1500 is provided with a conductive material for electrically connecting the wire patterns 1111 on the two signal transmission layers 1110 to form a coil loop capable of transmitting current around the magnetic core 1200, that is, the same as the above application scenarios The difference is that in this application scenario, the first metal base 1310 and the second through hole 1500 cooperate with each other to form a coil loop that transmits current around the magnetic core 1200.
  • the structure of the second via hole 1500 is similar to the structure of the first via hole 1400, which can be referred to the foregoing embodiment.
  • the metal base 1300 other than the first metal base 1310 can also be embedded in any position of the circuit board main body 1100, which is not limited here.
  • FIG. 4 is a schematic cross-sectional structure diagram of the embedded circuit board of FIG. 1 in another application scenario.
  • the number of metal bases 1300 is also more than one, for example, one, two or more.
  • the difference from the structure in FIG. 3 is that the first metal base 1310 is located on the periphery of the magnetic core 1200, and the second through hole 1500 penetrates the magnetic core 1200. At this time, the mutual connection between the first metal base 1310 and the second through hole 1500 is used.
  • Cooperating to form a coil loop that transmits current around the magnetic core 1200 that is, a wire pattern 1111 is also bridged between the first metal base 1310 and the second via hole 1500, and a conductive material is also provided in the second via hole 1500.
  • the coil circuits that transmit current around the magnetic core 1200 all use the metal base 1300.
  • the metal base 1300 may not be used to form a coil circuit that transmits current around the magnetic core 1200, for example,
  • the through holes (not shown) provided inside and outside the magnetic core 1200 form a current-transmitting coil loop.
  • a conductive pattern 1111 is connected across the through holes provided inside and outside the magnetic core 1200, and Conductive materials are arranged in the through holes, so that a coil loop that transmits current around the magnetic core 1200 is formed through the mutual cooperation between the through holes.
  • the circuit board main body 1100 includes a core board 1120 and a prepreg 1130 bonding adjacent core boards 1120.
  • the number of the core board 1120 and the prepreg 1130 is not limited.
  • the signal transmission The layer 1110 is a conductive layer provided on the surface of the core board 1120.
  • the signal transmission layer 1110 may not be a conductive layer on the surface of the core board 1120, but a conductive layer bonded to the dielectric material layer through an adhesive layer.
  • the structure of the circuit board main body 1100 is not specifically limited.
  • the embedded circuit board 2000 includes two or more circuit board main bodies 2100, for example, two, three or more circuit board main bodies 2100, two or more circuit board main bodies 2100 are stacked, and each circuit board main body 2100 A magnetic core 2110 and a metal base 2120 are embedded in them.
  • two adjacent circuit board main bodies 2100 are bonded by an adhesive layer 2200, and at the same time, the material of the adhesive layer 2200 may be a prepreg or epoxy resin.
  • the application does not limit the number of layers of the circuit board main body 2100.
  • FIG. 7 is a schematic flowchart of an embodiment of a method for manufacturing an embedded circuit board according to the present application.
  • the preparation method includes:
  • the core board 6101 and the prepreg 6102 are stacked and arranged at intervals to form the first sub-circuit board main body 6100.
  • the structure of the first sub-circuit board main body 6100 may be other, which is not limited here.
  • the size of the first accommodating groove 6110 is slightly larger than the size of the magnetic core 6200 or is equivalent to the size of the magnetic core 6200.
  • a second sub-circuit board main body 6300 is formed on the side of the first sub-circuit board main body 6100 where the magnetic core 6200 is exposed to cover the magnetic core 6200.
  • the structure of the second sub-circuit board main body 6300 is similar to the structure of the first sub-circuit board main body 6100. Specifically, the board prepreg 6102 is first placed on the side of the first sub-circuit board main body 6100 where the magnetic core 6200 is exposed. Then the core board 6101 is placed, and the process is repeated, wherein the number of layers of the core board 6101 and the prepreg 6102 in the second sub-circuit board main body 6300 is determined according to the specific circumstances in different application scenarios.
  • the first accommodating groove 6110 is a through groove
  • the magnetic core 6200 is exposed on both sides of the first sub-circuit board main body 6100, so the second sub-circuit board main body 6300 is formed by a double-sided build-up method.
  • the first accommodating groove 6110 is not a through groove. Only one side of the first sub-circuit board main body 6100 exposes the magnetic core 6200, so the second sub-circuit board main body 6300 is formed by a single-sided build-up method.
  • S140 forming a second accommodating groove 6120, and placing the metal base 6400 in the second accommodating groove 6120.
  • the size of the second accommodating groove 6120 is slightly larger than the size of the metal base 6400, or is equivalent to the size of the metal base 6400.
  • the magnetic core 6200 is buried first, and then the metal base 6400 is buried.
  • a signal transmission layer 6130 is formed on the side of the second sub-circuit board main body 6300 away from the first sub-circuit board main body 6100.
  • the metal base 6400 and the signal transmission layer 6130 may be electrically connected.
  • the preparation method further includes:
  • a conductive layer 6500 covering the metal base 6400 is formed on the side of the second sub-circuit board 6300 that exposes the metal base 6400, and the conductive layer 6500 is electrically connected to the signal transmission layer 6130 on the same side of the second sub-circuit board 6300, so that the metal base 6400 and The signal transmission layer 6130 is electrically connected, and then the signal transmission layer 6130 and the conductive layer 6500 are patterned to form a conductive pattern (not shown).
  • the embedded circuit board prepared by the manufacturing method in this embodiment has the same or similar structure as the embedded circuit board in any one of the above embodiments, and the specific structure can refer to the above embodiment, which will not be repeated here.
  • FIG. 10 is a schematic flowchart of another embodiment of an embedded circuit board according to the present application.
  • the difference from the above-mentioned embodiment is that in this embodiment, the metal base is buried first, and then the magnetic core is buried.
  • the preparation method includes:
  • the first sub-circuit board main body 8100 has the same structure as the first sub-circuit board main body 6100 in the foregoing embodiment, and will not be repeated here.
  • S220 forming a first accommodating groove 8110 on the first sub-circuit board main body 8100, and placing the metal base 8200 in the first accommodating groove 8110.
  • step S220 specifically includes: protruding the first end 8210 of the metal base 8200 from the first sub-circuit board main body 8100.
  • the second end 8220 of the metal base 8200 is arranged in the first sub-circuit board main body 8100.
  • both ends of the metal base 8200 can also protrude from the surface of the first sub-circuit board main body 8100.
  • a second accommodating groove 8120 is formed on the first sub-circuit board main body 8100, and the magnetic core 8300 is placed in the second accommodating groove 8120.
  • a second accommodating groove 8120 is formed in the first accommodating groove 8110, and when the first end 8210 of the metal base 8200 protrudes first
  • the notch of the second accommodating groove 8120 is specifically disposed in the first sub-circuit board main body 8100.
  • the metal base 8200 in the process of forming the second accommodating groove 8120, is milled, and then the cross section of the metal base 8200 in the thickness direction It is T-shaped.
  • the metal base 8200 in the process of forming the second accommodating groove 8120, is not milled.
  • a second sub-circuit board main body 8400 is formed on the side of the first sub-circuit board main body 8100 where the magnetic core 8300 is exposed to cover the magnetic core 8300.
  • a second sub-circuit board main body 8400 is formed on the first surface 8101 of the first sub-circuit board main body 8100 to cover the magnetic core 8300, and the second sub-circuit board main body 8400 is provided with a through hole corresponding to the metal base 8200 8401, so that the first end 8210 of the metal base 8200 is disposed in the second sub-circuit board main body 8400 and the second sub-circuit board main body 8400 exposes the first end 8210 of the metal base 8200.
  • the second sub-circuit board main body 8400 is formed by a single-sided build-up method.
  • the second sub-circuit board main body 8400 needs to be formed by a double-sided build-up method, which is specifically prepared The process will not be repeated here.
  • a signal transmission layer 8410 is formed on the side of the second sub-circuit board main body 8400 away from the first sub-circuit board main body 8100.
  • the metal base 8200 and the signal transmission layer 8410 may be electrically connected.
  • the preparation method further includes:
  • a conductive layer 8500 covering the metal base 8200 is formed on the side of the second sub-circuit board 8400 where the metal base 8200 is exposed, and the conductive layer 8500 is electrically connected to the signal transmission layer 8410 on the same side of the second sub-circuit board 8400, so that the metal base 8200 and The signal transmission layer 8410 is electrically connected, and then the signal transmission layer 8410 and the conductive layer 8500 are patterned to form a conductive pattern (not shown).
  • the same preparation method can also be used to electrically connect the metal base 8200 and the signal transmission layer 8410 in the first sub-circuit board 8100 to form a wire pattern. , The specific preparation process will not be repeated here.
  • the buried circuit board prepared by the preparation method in this embodiment has the same structure as the buried circuit board in any of the above embodiments, and the specific structure can be referred to the above embodiment, which will not be repeated here.
  • the magnetic core and the metal base are embedded in the circuit board body at the same time, which can reduce the volume of the circuit board and improve the heat dissipation performance of the circuit board.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

Un circuit imprimé intégré (1000) et son procédé de fabrication sont divulgués. Le circuit imprimé intégré (1000) comprend : un corps principal de circuit imprimé (1100) ; et un noyau magnétique (1200) et un substrat métallique (1300) qui sont intégrés dans le corps principal de circuit imprimé (1100). Le circuit imprimé intégré (1000) permet non seulement de réduire la taille du circuit imprimé, mais également d'améliorer les performances de dissipation de chaleur du circuit imprimé.
PCT/CN2020/083827 2020-04-08 2020-04-08 Circuit imprimé intégré et procédé de fabrication associé WO2021203328A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/083827 WO2021203328A1 (fr) 2020-04-08 2020-04-08 Circuit imprimé intégré et procédé de fabrication associé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/083827 WO2021203328A1 (fr) 2020-04-08 2020-04-08 Circuit imprimé intégré et procédé de fabrication associé

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Publication Number Publication Date
WO2021203328A1 true WO2021203328A1 (fr) 2021-10-14

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102933040A (zh) * 2012-10-23 2013-02-13 东莞生益电子有限公司 具有埋入电感器件的pcb板的制作方法
CN106163106A (zh) * 2015-04-07 2016-11-23 深南电路股份有限公司 一种具有电源集成模块的电路板及其加工方法
US20190333674A1 (en) * 2005-09-22 2019-10-31 Radial Electronics, Inc. Embedded high voltage transformer components and methods
CN110415945A (zh) * 2018-04-29 2019-11-05 深南电路股份有限公司 变压器及其制作方法和电磁器件
US20190341182A1 (en) * 2018-04-29 2019-11-07 Shennan Circuits Co., Ltd. Transformer, electromagnetic device and manufacturing method of the transformer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190333674A1 (en) * 2005-09-22 2019-10-31 Radial Electronics, Inc. Embedded high voltage transformer components and methods
CN102933040A (zh) * 2012-10-23 2013-02-13 东莞生益电子有限公司 具有埋入电感器件的pcb板的制作方法
CN106163106A (zh) * 2015-04-07 2016-11-23 深南电路股份有限公司 一种具有电源集成模块的电路板及其加工方法
CN110415945A (zh) * 2018-04-29 2019-11-05 深南电路股份有限公司 变压器及其制作方法和电磁器件
US20190341182A1 (en) * 2018-04-29 2019-11-07 Shennan Circuits Co., Ltd. Transformer, electromagnetic device and manufacturing method of the transformer

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