WO2021201640A1 - Dispositif électronique comprenant un module de haut-parleur - Google Patents

Dispositif électronique comprenant un module de haut-parleur Download PDF

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Publication number
WO2021201640A1
WO2021201640A1 PCT/KR2021/004106 KR2021004106W WO2021201640A1 WO 2021201640 A1 WO2021201640 A1 WO 2021201640A1 KR 2021004106 W KR2021004106 W KR 2021004106W WO 2021201640 A1 WO2021201640 A1 WO 2021201640A1
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WO
WIPO (PCT)
Prior art keywords
support member
speaker
disposed
electronic device
base portion
Prior art date
Application number
PCT/KR2021/004106
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English (en)
Korean (ko)
Inventor
김주한
박진우
박영배
윤창식
박은수
이지우
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021201640A1 publication Critical patent/WO2021201640A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/026—Supports for loudspeaker casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2819—Enclosures comprising vibrating or resonating arrangements of the bass reflex type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • Embodiments disclosed in this document relate to an electronic device including a speaker module.
  • the electronic device may include one or more speaker modules. Through this, the electronic device may output sound to the outside.
  • the speaker module may include a speaker (eg, a core speaker or a speaker unit) capable of converting an electrical signal into a sound signal.
  • the electronic device may include an assembly structure capable of fixing the speaker module to the inside of the electronic device.
  • a difference occurs in audio characteristics including sound quality and resonant frequency.
  • the larger the volume of the speaker module the better quality sound can be output. Therefore, in order to implement good quality sound, it is necessary to secure a space in which the audio output output from the speaker body can vibrate.
  • the speaker module is mounted in a miniaturized electronic device such as a mobile communication terminal, there may be a limitation in sufficiently securing the acoustic volume of the speaker module.
  • an object of the present disclosure is to provide an electronic device including an assembly structure of a speaker module capable of securing an acoustic volume of a speaker.
  • An electronic device includes: a housing; a speaker module including a speaker enclosure disposed inside the housing, and a speaker at least a part of which is accommodated inside the speaker enclosure; and a first support member disposed inside the housing to support the speaker module and surrounding at least a portion of the speaker enclosure, wherein the speaker enclosure is at least partially surrounded by the first support member and , a base portion in which an internal space in which the speaker is disposed is formed, a flange portion surrounding at least a portion of a side surface of the base portion and seated on the first support member, and a pad disposed on at least a portion of the side surface of the base portion (pad) may be included.
  • an electronic device includes: a housing including a front plate, a rear plate, and a frame enclosing a space between the front plate and the rear plate; a printed circuit board (PCB) disposed inside the housing; a speaker module disposed inside the housing to be connected to the printed circuit board, the speaker module, a speaker enclosure disposed inside the housing, and at least a part of the speaker enclosure accommodated inside the yoke, , comprising a speaker including a diaphragm and a voice coil; and a first support member disposed between the front plate and the rear plate and surrounding at least a portion of the speaker enclosure, wherein the speaker enclosure is at least partially surrounded by the first support member, A base portion in which an inner space in which the speaker is disposed is formed, a flange portion surrounding at least a portion of a side surface of the base portion and seated on the first support member, and a pad disposed on at least a portion of a side surface of the base portion ), wherein at
  • the electronic device may improve the sound quality of the electronic device by sufficiently securing the acoustic volume of the speaker through the assembly structure of the speaker module.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • FIG. 2 is a front perspective view of an electronic device according to an exemplary embodiment
  • FIG. 3 is a rear perspective view of an electronic device according to an exemplary embodiment
  • FIG. 4 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • FIG. 5 is a perspective view of a speaker module of an electronic device according to an exemplary embodiment
  • FIG. 6 is a cross-sectional view of a speaker module of an electronic device according to an exemplary embodiment.
  • FIG. 7A is a diagram illustrating an assembly structure of a speaker module using a first support member of an electronic device according to an exemplary embodiment.
  • FIG. 7B is a diagram illustrating an assembly structure of a speaker module using a first support member of an electronic device according to an exemplary embodiment.
  • FIG. 8A is a diagram illustrating an assembly structure of a speaker module using a second support member of an electronic device according to an exemplary embodiment.
  • 8B is a diagram illustrating an assembly structure of a speaker module using a second support member of an electronic device according to an exemplary embodiment.
  • FIG. 9 is a diagram illustrating an assembly structure of a speaker module of an electronic device according to an exemplary embodiment.
  • FIG. 10 is a diagram illustrating an assembly structure of a speaker module of an electronic device according to an exemplary embodiment.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illumina
  • the processor 120 for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 .
  • the volatile memory 132 may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphic processing unit or an image signal processor) that can be operated independently or together with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • a main processor 121 eg, a central processing unit or an application processor
  • an auxiliary processor 123 eg, a graphic processing unit or an image signal processor
  • the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input device 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output device 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.
  • the display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, Alternatively, it may communicate with the external electronic device 104 through a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a computer network eg, a telecommunication network such as a LAN or WAN.
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other.
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified and authenticated.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as a part of the antenna module 197 .
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 and 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations performed by the electronic device 101 may be performed by one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • FIG. 2 is a front perspective view of an electronic device according to an exemplary embodiment
  • 3 is a rear perspective view of an electronic device according to an exemplary embodiment
  • the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment has a first surface (or front) 210A, a second surface (or a rear surface). ) 210B, and a housing 210 including a side surface 210C surrounding a space between the first surface 210A and the second surface 210B.
  • the housing 210 may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 1 .
  • the first surface 210A may be formed by a front plate 202 (eg, a glass plate including various coating layers or a polymer plate) at least a portion of which is substantially transparent.
  • the second surface 210B may be formed by the substantially opaque back plate 211 .
  • the back plate 211 may be, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or at least two of the above materials. It can be formed by combination.
  • the side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or “frame structure”) 218 including a metal and/or a polymer.
  • the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 202 includes two first regions 210D that extend seamlessly from the first surface 210A toward the rear plate 211 by bending the front plate. It can include both ends of the long edge (long edge) of (202).
  • the rear plate 211 includes two second regions 210E that are bent from the second surface 210B toward the front plate 202 and extend seamlessly to the rear plate 211 . It can be included on both ends of the long edge of
  • the front plate 202 (or the rear plate 211 ) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, the front plate 202 (or the rear plate 211 ) may not include some of the first regions 210D (or the second regions 210E).
  • the side bezel structure 218 when viewed from the side of the electronic device 200 , is at the side (eg, on the side where the first regions 210D or the second regions 210E) are not included. : has a first thickness (or width) on the short side), and has a second thickness that is thinner than the first thickness on the side side (eg, long side) including the first regions 210D or second regions 210E can
  • the electronic device 200 includes a display 201 , audio modules 203 , 204 , and 207 (eg, the audio module 170 of FIG. 1 ), and a sensor module (not shown) (eg, FIG. 1 ). of the sensor module 176), the camera modules 205 and 212 (eg, the camera module 180 of FIG. 1), the key input device 217 (eg, the input device 150 of FIG. 1), and a connector hole At least one of 208 (eg, the connection terminal 178 of FIG. 1 ) may be included. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 ) or additionally include another component (eg, a light emitting device (not shown)). .
  • the display 201 may be exposed through a substantial portion of the front plate 202 , for example. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 including the first area 210D of the first surface 210A and the side surface 210C.
  • the edge of the display 201 may be formed to be substantially the same as an adjacent outer shape of the front plate 202 .
  • the distance between the outer periphery of the display 201 and the outer periphery of the front plate 202 may be substantially the same.
  • the surface (or front plate 202 ) of the housing 210 may include a screen display area formed as the display 201 is visually exposed.
  • the screen display area may include a first surface 210A and first areas 210D on the side surface.
  • the screen display areas 210A and 210D may include a sensing area (not shown) configured to obtain the user's biometric information.
  • the screen display regions 210A and 210D include the sensing region may be understood to mean that at least a portion of the sensing region may overlap the screen display regions 210A and 210D.
  • the sensing area may display visual information by the display 201 like other areas of the screen display areas 210A and 210D, and additionally obtain user's biometric information (eg, fingerprint). It can mean an area.
  • the screen display areas 210A and 210D of the display 201 may include areas to which the first camera module 205 (eg, a punch hole camera) may be visually exposed.
  • the exposed area of the first camera module 205 may be surrounded by the screen display areas 210A and 210D.
  • the first camera module 205 eg, an under display camera (UDC)
  • UDC under display camera
  • the first camera module 205 may be disposed under the display 201 .
  • at least a portion of the first camera module 205 may be disposed below the screen display areas 210A and 210D of the display 201 .
  • the first camera module 205 may not be visually exposed to the screen display areas 210A and 210D.
  • the first camera module 205 may include a plurality of camera modules (eg, the camera modules 180 of FIG. 1 ).
  • the display 201 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.
  • At least a portion of the key input device 217 may be disposed on the side surface 210C (eg, the first regions 210D and/or the second regions 210E).
  • the audio modules 203 , 204 , and 207 may include microphone holes 203 , 204 and a speaker hole 207 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the microphone hole 204 formed in a partial region of the second surface 210B may be disposed adjacent to the camera modules 205 , 212 , and 213 .
  • the microphone hole 204 may acquire a sound when the camera modules 205 , 212 , and 213 are executed, or acquire a sound when other functions are executed.
  • the speaker hole 207 may include an external speaker hole 207 and a call receiver hole (not shown).
  • the speaker hole 207 and the microphone holes 203 and 204 may be implemented as a single hole, or a speaker may be included without the speaker hole 207 (eg, a piezo speaker).
  • a sensor module (not shown) (eg, the sensor module 176 of FIG. 1 ) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the sensor module may include a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.
  • the camera modules 205 , 212 , and 213 are exposed through the first camera module 205 (eg, a punch hole camera) exposed through the first surface 210A of the electronic device 200 , and the second surface 210B of the electronic device 200 .
  • a second camera module 212 and/or a flash 213 may be included.
  • the first camera module 205 may be exposed through a portion of the screen display areas 210A and 210D of the display 201 .
  • the first camera module 205 may be exposed as a portion of the screen display areas 210A and 210D through an opening (not shown) formed in a portion of the display 201 .
  • the second camera module 212 may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).
  • the second camera module 212 is not necessarily limited to including a plurality of camera modules and may include one camera module.
  • the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .
  • the key input device 217 may be disposed on the side surface 210C of the housing 210 .
  • the electronic device 200 may not include some or all of the key input devices 217 mentioned above and the not included key input devices 217 may be displayed on the display 201 , such as soft keys. It may be implemented in other forms.
  • the key input device may include a sensor module (not shown) that forms a sensing region (not shown) included in the screen display regions 210A and 210D.
  • the connector hole 208 includes a first connector hole 208 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device and audio It may include a second connector hole (not shown) (eg, earphone jack) capable of accommodating a connector for transmitting and receiving a signal.
  • a connector eg, a USB connector
  • second connector hole eg, earphone jack
  • the electronic device 200 may include a light emitting device (not shown).
  • the light emitting device may be disposed, for example, on the first surface 210A of the housing 210 .
  • the light emitting device may provide, for example, state information of the electronic device 200 in the form of light.
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the first camera module 205 .
  • the light emitting element may comprise, for example, an LED, an IR LED and/or a xenon lamp.
  • FIG. 4 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • the electronic device 200 includes a front plate 220 (eg, a front surface 210A and a first area 210D of FIG. 2 ) and a display 230 (eg, the display 201 of FIG. 2 ). )), a side bezel structure 218 (eg, a portion 210C of the side of FIGS. 2 and 3 ), a first support member 240 (eg, a plate structure), a printed circuit board 250 , a battery 259 ), a second support member 260 (eg, a rear case), a rear plate 280 (eg, the rear surface 210B and the second region 210E of FIG. 3 ), and a speaker module 300 .
  • a front plate 220 eg, a front surface 210A and a first area 210D of FIG. 2
  • a display 230 eg, the display 201 of FIG. 2 ).
  • a side bezel structure 218 eg, a portion 210C of the side of FIGS. 2 and
  • the electronic device 200 may omit at least one of the components (eg, the first support member 240 or the second support member 260 ) or additionally include other components. . At least one of the components of the electronic device 200 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.
  • the first support member 240 may be disposed inside the electronic device 200 and connected to the side bezel structure 218 , or may be integrally formed with the side bezel structure 218 .
  • the first support member 240 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 240 may have a display 230 coupled to one surface and a printed circuit board 250 coupled to the other surface.
  • the printed circuit board 250 may be equipped with a processor, memory, and/or interfaces.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 259 is a device for supplying power to at least one component of the electronic device 200 and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 259 may be disposed substantially coplanar with the printed circuit board 250 , for example. The battery 259 may be integrally disposed inside the electronic device 200 , or may be disposed detachably from the electronic device 200 .
  • the first camera module 205 is a side bezel structure 218 so that the lens is exposed as a partial area of the front plate 220 (eg, the front surface 210A of FIG. 2 ) of the electronic device 200 . It may be disposed on the first support member 240 .
  • the first camera module 205 may be arranged such that the optical axis of the lens is at least partially aligned with the hole or recess 237 formed in the display 230 .
  • an area where the lens is exposed may be formed on the front plate 220 .
  • the first camera module 205 may include a hole or a punch hole camera disposed inside the recess 237 formed on the rear surface of the display 230 .
  • the second camera module 212 is a printed circuit board ( 250) can be placed.
  • the camera area 284 may be formed on the surface of the rear plate 280 (eg, the rear surface 210B of FIG. 3 ). In various embodiments, the camera area 284 may be at least partially transparent so that external light is incident to the lens of the second camera module 212 . According to the illustrated embodiment, at least a portion of the camera area 284 may protrude from the surface of the rear plate 280 to a predetermined height. However, the present invention is not limited thereto, and in various embodiments, the camera area 284 may form substantially the same plane as the surface of the rear plate 280 .
  • the speaker module 300 may be electrically connected to the printed circuit board 250 .
  • the speaker module 300 may be supported by the first support member 240 and the second support member 260 .
  • the speaker module 300 may be disposed between the first support member 240 and the second support member 260 .
  • a second opening 263 may be formed in the second support member 260 to surround at least a portion of the speaker module 300 .
  • At least a portion of the front plate 220 , the back plate 280 , and the side bezel structure 218 may form a housing (eg, the housing 210 of FIGS. 2 and 3 ).
  • 5 is a perspective view of a speaker module of an electronic device according to an exemplary embodiment
  • 6 is a cross-sectional view of a speaker module of an electronic device according to an exemplary embodiment.
  • connection member 360 included in the speaker module 300 are formed differently.
  • the speaker module 300 (eg, the sound output device 155 of FIG. 1 ) may include a speaker 310 and a speaker enclosure 350 .
  • the speaker 310 (eg, a speaker unit or a core speaker) is a housing (eg, the housing 210 of FIGS. 2 and 3 ) of an electronic device (eg, the electronic device 200 of FIGS. 2 to 4 ). )) can be placed inside.
  • the speaker 310 may be accommodated in the speaker enclosure 350 disposed inside the housing 210 .
  • the speaker 310 may convert an electrical signal into a sound signal.
  • the speaker 310 may output sound to the outside of the electronic device 200 .
  • the electronic device may include various types of speakers 300 according to audio frequency characteristics (eg, a sound range).
  • the speaker 300 may include a woofer speaker for a low range and/or a tweeter speaker for a high range.
  • a woofer speaker may reproduce a low sound in a range of about 100 Hz to 299 Hz
  • a tweeter speaker may reproduce a high sound in a range of about 3 KHz to 6.9 KHz.
  • the type of the speaker 300 included in the electronic device 200 is not limited to the above-described type, and according to an embodiment, a sub-woofer speaker, a mid-range speaker, etc. (eg a squawker speaker) or a super tweeter speaker.
  • the speaker 310 includes a yoke 311 , a diaphragm 312 (eg, a diaphragm), a voice coil 313 , magnets 314-1 and 314-2, and a plate 315 . , and a protector 316 .
  • the speaker 310 may omit at least one of the above components or further include other components.
  • the speaker 310, the first magnet 314-1 and the second magnet 314-2 are disposed under the yoke 311, the first magnet 314-1 and the second The plate 315 may be disposed under the magnet 314 - 2 .
  • the voice coil 313 may be disposed in a space between the first magnet 314-1 and the second magnet 314-2.
  • the voice coil 313 may vibrate in the vertical direction (eg, the Z-axis direction) as an electrical signal (eg, an audio signal in the form of a sine wave) is applied.
  • the diaphragm 312 may be disposed under the plate 315 .
  • the diaphragm 312 may be disposed to be substantially spaced apart from the plate 315 in the Z-axis direction.
  • the diaphragm 312 may vibrate together by the vibration of the voice coil 313 to generate sound.
  • the diaphragm 312 may include a center diaphragm and a side diaphragm.
  • the diaphragm 312 may be formed of various materials including plastic, metal, fiber, wood, and the like.
  • a protector 316 to protect may be disposed. At least a portion of the protector 316 may be formed with a sound emitting hole for emitting sound to the outside of the speaker module 300 . In various embodiments, the protector 316 may be spaced apart from the diaphragm 312 at a predetermined interval so as not to contact the diaphragm 312 when the diaphragm 312 vibrates.
  • the protector 316 may include a speaker grill (eg, a speaker mesh).
  • the speaker grill may include a hard speaker grill for protection of internal components and/or a soft speaker grill (eg, cover 317 ) for preventing dust from entering.
  • the hard speaker grill may be formed of a metal material, and the soft speaker grill may include a fabric mesh.
  • the speaker 310 may include a cover 317 (eg, a soft speaker grill) disposed on at least a partial area of the protector 316 to cover the sound emission port of the protector 316 .
  • a cover 317 eg, a soft speaker grill
  • the cover 317 may prevent foreign substances from being introduced into the speaker 310 through the sound emission port.
  • the speaker enclosure 350 may at least partially form the exterior of the speaker module 300 .
  • at least a portion of the speaker 310 may be accommodated in the interior of the speaker enclosure 350 (eg, the interior space 328 of the base portion 320 ).
  • the speaker 310 may be completely accommodated in the interior space 328 such that the entirety of the speaker 310 is surrounded by the speaker enclosure 350 .
  • the speaker 310 may have a partially internal space 328 such that a portion of the speaker 310 (eg, the protector 316 or the cover 317 ) may be exposed to the outer surface of the speaker enclosure 350 . ) can be accepted.
  • the speaker enclosure 350 may include a base portion 320 , a flange portion 330 , and a pad 340 .
  • the base portion 320 may fix and/or support the speaker 310 .
  • an inner space 328 may be formed in the base portion 320 so that at least a portion of the speaker 310 is disposed.
  • the base portion 320 includes an upper wall 321 , a lower wall 322 opposite the upper wall 321 , and a plurality of side walls 323 surrounding a space between the upper wall 321 and the lower wall 322 . , 324, 325, 326).
  • the upper wall 321 , the lower wall 322 , and the plurality of side walls 323 , 324 , 325 , 326 form an empty space (eg, an internal space 328 ) inside the base portion 320 .
  • the upper wall 321 and the lower wall 322 may be formed to face each other.
  • the plurality of side walls 323 , 324 , 325 , and 326 may be respectively connected to the upper wall 321 and the lower wall 322 to surround the space between the upper wall 321 and the lower wall 322 .
  • the lower wall 322 may be disposed substantially spaced apart from the upper wall 321 in the Z-axis direction.
  • the plurality of sidewalls 323 , 324 , 325 , 326 extends from at least one of the upper wall 321 and the lower wall 322 toward the other in a direction substantially perpendicular to the upper wall 321 and the lower wall 322 .
  • the plurality of sidewalls 323 , 324 , 325 , and 326 may face a direction substantially perpendicular to the Z-axis (eg, an X/-X-axis direction or a Y/-Y-axis direction).
  • the inner space 328 in which the speaker 310 is accommodated may be formed by the upper wall 321 , the lower wall 322 , and the plurality of side walls 323 , 324 , 325 , 326 .
  • the plurality of sidewalls 323 , 324 , 325 , and 326 include a first sidewall 323 and a second sidewall 324 facing substantially in the Y-axis direction, and a second sidewall 324 facing substantially in the X-axis direction. It may include a third sidewall 325 and a fourth sidewall 326 .
  • the first sidewall 323 and the second sidewall 324 may be connected by a third sidewall 325 and a fourth sidewall 326 , respectively.
  • first sidewall 323 and the second sidewall 324 may each extend substantially in the X-axis direction.
  • third sidewall 325 and the fourth sidewall 326 may each extend substantially in the Y-axis direction.
  • the second sidewall 324 may be disposed to be substantially spaced apart from the first sidewall 323 in the Y-axis direction.
  • the fourth sidewall 326 may be disposed to be substantially spaced apart from the third sidewall 325 in the X-axis direction.
  • the plurality of sidewalls 323 , 324 , 325 , and 326 may be formed with a flange portion 330 extending from the plurality of sidewalls 323 , 324 , 325 , 326 .
  • a flange portion 330 extending from the plurality of sidewalls 323 , 324 , 325 , 326 .
  • the plurality of sidewalls 323 , 324 , 325 , 326 may be surrounded by the flange portion 330 .
  • the flange portion 330 may not be formed in at least a portion of the plurality of sidewalls 323 , 324 , 325 , and 326 (eg, the recessed region 327 ).
  • a pad 340 may be disposed on at least some of the plurality of sidewalls 323 , 324 , 325 , and 326 . In various embodiments, the pad 340 may be disposed on a portion of the first sidewall 323 among the plurality of sidewalls 323 , 324 , 325 , and 326 . In various embodiments, the first sidewall 323 may include a recessed region 327 in which the pad 340 is disposed. For example, in the first sidewall 323 , a recessed region 327 in which a partial region of the first sidewall 323 is depressed toward the second sidewall 324 direction (eg, the Y-axis direction) of the base portion 320 . ) can be formed. For example, the recessed region 327 may be connected stepwise from another region of the first sidewall 323 to the inner space 328 of the base portion 320 .
  • the pad 340 may be disposed on at least a portion of the recessed region 327 formed in the first sidewall 323 .
  • the sidewall on which the pad 340 is disposed among the plurality of sidewalls 323 , 324 , 325 , and 326 is not necessarily limited to the first sidewall 323 .
  • a direction in which the pad 340 is disposed and/or a position in which the recessed region 327 is formed may be variously modified.
  • the top wall 321 , the bottom wall 322 , and the plurality of side walls 323 , 324 , 325 , 326 may form an outer surface of the base portion 320 .
  • the upper wall 321 forms an upper surface of the base portion 320
  • the lower wall 322 forms a lower surface of the base portion 320
  • the plurality of side walls 323 , 324 , 325 , 326 form the base It may form a side surface of the portion 320 .
  • the speaker 310 may be accommodated in the internal space 328 of the base portion 320 .
  • the yoke 311 may be disposed to face the upper wall 321
  • the diaphragm 312 may be disposed to face the lower wall 322 .
  • the speaker 310 has an interior space such that the yoke 311 is disposed substantially in the Z-axis direction from the upper wall 321 , and the diaphragm 312 is disposed in the Z-axis direction substantially from the yoke 311 . (328) may be accommodated.
  • the sound output from the speaker 310 may pass through the lower wall 322 of the base portion 320 to move to the outside of the speaker enclosure 350 .
  • the upper wall 321 of the base part 320 may be spaced apart from the speaker 310 accommodated in the inner space 328 by a predetermined distance d.
  • the yoke 311 may be disposed to be substantially spaced apart from the upper wall 321 by a predetermined distance d in the Z-axis direction.
  • a volume eg, a back volume in which sound can vibrate inside the speaker enclosure 350 .
  • the lower wall 322 of the base portion 320 may include an opening region 3221 such that at least a portion of the speaker 310 is exposed to the outside of the base portion 320 .
  • an opening region 3221 may be formed through at least a portion of the lower wall 322 to be connected to the internal space 328 .
  • some of the components of the speaker 310 may be disposed inside the opening area 3221 .
  • the protector 316 and/or the cover 317 may be exposed to the outside of the base portion 320 through the opening area 3221 .
  • the protector 316 and the cover 317 may be visually seen from the outside of the speaker enclosure 350 .
  • the base portion 320 may be formed in a substantially hexahedral shape.
  • the shape of the base portion 320 is not necessarily limited to the illustrated embodiment, and may be variously modified according to various embodiments.
  • the flange portion 330 may extend from the base portion 320 to surround at least a portion of a side surface of the base portion 320 .
  • the flange portion 330 may extend from the plurality of sidewalls 323 , 324 , 325 , 326 of the base portion 320 in a direction substantially perpendicular to the Z axis.
  • the flange portion 330 may protrude from the plurality of sidewalls 323 , 324 , 325 , and 326 in a direction perpendicular to the plurality of sidewalls 323 , 324 , 325 , 326 .
  • the flange portion 330 may divide the base portion 320 into a first portion 320-1 and a second portion 320-2.
  • a portion of the base portion 320 located on the upper portion of the flange portion 330 is divided into the first portion 320-1, and the base portion 320 located under the flange portion 330 of the
  • the other part may be divided into the second part 320 - 2 .
  • the first portion 320-1 may be formed substantially in the -Z-axis direction with respect to the flange portion 330 .
  • the second portion 320 - 2 may be formed substantially in the Z-axis direction with respect to the flange portion 330 .
  • the ratio of the first portion 320-1 and the second portion 320-2 may be substantially the same or similar.
  • the Z-axis direction length of a portion positioned in the first portion 320-1 is the Z-axis length of the portion positioned in the second portion 320 - 2 . It may be substantially equal to or similar to the axial length.
  • the present invention is not necessarily limited thereto, and according to various embodiments, the ratio of the first part 320 - 1 to the second part 320 - 2 in the base part 320 may be different.
  • flange portion 330 may include at least partially discontinuous portion 332 .
  • the flange portions 330 formed on each of the plurality of sidewalls 323 , 324 , 325 , and 326 may be continuously connected to each other.
  • the flange portion 330 formed on at least one of the plurality of sidewalls 323 , 324 , 325 , 326 (eg, the first sidewall 323 ) may include a discontinuous portion 332 . have.
  • the flange portion 330 formed on the first sidewall 323 is at least partially cut so as not to surround at least a partial region (eg, the recessed region 327 ) of the first sidewall 323 .
  • a partial region eg, the recessed region 327
  • the flange portion 330 does not overlap the recessed area 327 and/or the peripheral area of the recessed area 327 .
  • the flange portion 330 formed on the first sidewall 323 may include a discontinuous portion 332 .
  • the discontinuous portions 332 of the flange portion 330 may be disposed to substantially face each other in the X-axis direction, and a recessed region 327 may be formed between the discontinuous portions 332 .
  • the recessed area 327 may be visible from the outer surface of the speaker enclosure 350 through the discontinuous portion 332 , and the pad 340 may be disposed in the recessed area 327 .
  • the pad 340 is disposed in the recessed region 327 of the base portion 320 , and at least a portion of the flange portion 330 is removed (eg: discontinuous portion 332).
  • the present invention is not necessarily limited thereto, and according to various embodiments, the position of the pad 340 may be variously modified to be disposed in the lateral direction of the speaker enclosure 350 .
  • the pad 340 may be disposed on at least a portion of the flange portion 330 .
  • the flange portion 330 may be formed continuously along the perimeter of the base portion 320 without including the discontinuous portion 332 .
  • at least a portion of the flange portion 330 may have a groove (eg, a recessed region 327 ) in which the pad 340 is disposed, and the pad 340 may be disposed in the groove.
  • the pad 340 may be integrally formed with the flange portion 330 .
  • the flange portion 330 may include a conductive portion formed in at least a portion of the flange portion 330 and a non-conductive portion formed in the other portion.
  • the conductive part may perform a function of the pad 340 for electrical connection of the speaker module 300 .
  • the conductive part applies and/or coats a conductive material to at least a partial region of the side surface of the flange part 330 so that at least a part of the flange part 330 has a lateral direction of the speaker enclosure 350 . It may be configured in a form that forms a conductive region facing.
  • the pad 340 may be disposed on a side surface of the speaker enclosure 350 .
  • the pad 340 is exposed to the outside of the base portion 320 through the side of the base portion 320 , at least of the plurality of sidewalls 323 , 324 , 325 , 326 of the base portion 320 . can be placed in one.
  • the pad 340 may be composed of one or more.
  • the pad 340 may be disposed on the first sidewall 323 .
  • the pad 340 may be disposed in the recessed region 327 formed on the first sidewall 323 .
  • the pad 340 may be disposed in a direction substantially perpendicular to the Z-axis, and the speaker 310 and/or some components of the electronic device 200 (eg, the printed circuit board 250 of FIG. 4 ). ) and a direction substantially perpendicular to the Z axis (eg, a direction of the first sidewall 323 ).
  • the pad 340 may include a conductive material to be electrically connected to the speaker 310 .
  • the pad 340 may include a metal material.
  • the pad 340 may be integrally formed with the connecting member 360 .
  • the connecting member 360 may extend from the inner space 328 of the base portion 320 to the outside of the base portion 320 (eg, the recessed region 327 of the first sidewall 323 ).
  • the pad 340 may be formed of a conductive material exposed to at least a partial region of the connecting member 360 extending to the outside of the base portion 320 .
  • the pad 340 may be electrically connected to the speaker 310 through the connecting member 360 .
  • the connection member 360 may electrically connect the voice coil 313 and the pad 340 .
  • the connecting member 360 may include a wire and/or a flexible printed circuit board (FPCB).
  • FIG. 6A may be a cross-sectional view of the speaker module 300 according to various embodiments in which the connecting member 360 includes a wire.
  • (b) of FIG. 6 may show a cross-sectional view of the speaker module 300 according to various embodiments in which the connection member 360 includes an FPCB.
  • the pad 340 is disposed in the recessed area 327 so that at least a part of it can be seen from the outside of the base part 320 , and the other part is the speaker 310 . It may be disposed in the inner space 328 of the base portion 320 so as to be electrically connected to.
  • the connecting member 360 may be connected to another part of the pad 340 disposed in the inner space 328 .
  • a through hole through which a portion extending from the pad 340 disposed in the recessed region 327 is inserted in the direction of the inner space 328 may be formed in the first sidewall 323 .
  • the pad 340 disposed in the recessed region 327 may extend toward the inner space 328 through the through hole.
  • the pad 340 may be inserted into the first sidewall 323 by molding.
  • the pad 340 is a first portion (not shown) disposed in the recessed region 327 in a direction substantially parallel to the first sidewall 323 , the first portion being inserted into the through hole.
  • a second portion (not shown) extending in a direction perpendicular to the portion (eg, Y-axis direction), and a third portion extending in a direction perpendicular (eg, Z-axis direction) from the second portion (reference numeral) not shown) may be included.
  • the third portion of the pad 340 may be accommodated in the inner space 328 and may be connected to the connecting member 360 .
  • the pad 340 may be disposed in the recessed region 327 so that at least a portion of the pad 340 can be seen from the outside of the base portion 320 .
  • the pad 340 is connected to the connecting member 360 including the FPCB, and the connecting member 360 may extend into the inner space 328 of the base part 320 .
  • a through hole through which a part of the connecting member 360 connected to the pad 340 is inserted in the direction of the inner space 328 may be formed in the first sidewall 323 .
  • the connecting member 360 connected to the pad 340 through the through hole may extend toward the inner space 328 .
  • the FPCB may be formed in a bending structure.
  • 7A is a diagram illustrating an assembly structure of a speaker module using a first support member of an electronic device according to an exemplary embodiment.
  • 7B is a diagram illustrating an assembly structure of a speaker module using a first support member of an electronic device according to an exemplary embodiment.
  • FIGS. 7A and 7B are illustrated by a first support member 240 (eg, the first support member 240 of FIG. 4 ) inside the electronic device 200 (eg, the electronic device 200 of FIG. 4 ). It is a cross-sectional view for explaining a structure in which the speaker module 300 (eg, the speaker module 300 of FIGS. 5 and 6 ) is assembled.
  • the speaker module 300 eg, the speaker module 300 of FIGS. 5 and 6
  • the electronic device 200 includes a speaker module 300 , a front plate 220 , a display 230 , a rear plate 280 , a first support member 240 , and a printed circuit.
  • a substrate 250 may be included.
  • the speaker module 300 includes a speaker enclosure 350 including a base portion 320 , a flange portion 330 , and a pad 340 , and at least a portion of the interior space of the speaker enclosure 350 .
  • a speaker 310 housed in 328 may be included.
  • the speaker module 300 may be disposed inside the electronic device 200 through an assembly structure by the first support member 240 .
  • the front plate 220 may be disposed to face the rear plate 280 .
  • the front plate 220 may be substantially disposed on the rear plate 280 in the Z-axis direction.
  • the front plate 220 and the rear plate 280 may form at least a portion of an outer surface of the electronic device 200 .
  • the front plate 220 forms the front surface of the electronic device 200 (eg, the front surface 210A of FIGS. 2 and 3 )
  • the rear plate 280 forms the rear surface (eg, the front surface 210A of FIGS. 2 and 3 ) of the electronic device 200 .
  • the rear surface 210B of FIGS. 2 and 3) may be formed.
  • the display 230 may be disposed between the front plate 220 and the rear plate 280 .
  • the display 230 may be spaced apart from the rear plate 280 such that the first support member 240 is disposed between the display 230 and the rear plate 280 .
  • the display 230 may be disposed between the front plate 220 and the first support member 240 .
  • at least a portion of the display 230 may be in contact with the front plate 220 and/or the first support member 240 .
  • the first support member 240 may be disposed between the rear plate 280 and the display 230 . In various embodiments, the first support member 240 may support at least a portion of the speaker module 300 and/or at least a portion of the printed circuit board 250 between the rear plate 280 and the display 230 . have.
  • the first support member 240 may be disposed inside the housing (eg, the housing 210 of FIGS. 2 to 3 ) of the electronic device 200 to support the speaker module 300 .
  • the first support member 240 may surround at least a portion of the speaker module 300 . At least a portion of the speaker module 300 may be seated on the first support member 240 .
  • the first support member 240 has a first surface 241 (eg, an upper surface) facing the rear plate 280, and a second surface facing the front plate 220 and the display 230 ( 242) (eg, lower surface).
  • the second surface 242 may face in a direction opposite to the first surface 241 and may contact at least a portion of the display 230 .
  • the first surface 241 may be substantially oriented in the -Z-axis direction
  • the second surface 242 may be substantially oriented in the Z-axis direction.
  • the first side 241 may be spaced apart from the back plate 280 , and at least a portion of the first side 241 includes at least a portion of the speaker enclosure 350 and/or the printed circuit board 250 . At least a portion of each may be disposed.
  • the first support member 240 may include a first opening 243 and a first edge portion 244 .
  • the first opening 243 may be openly formed to surround at least a portion of the base portion 320 of the speaker enclosure 350 .
  • the first opening 243 may be formed to penetrate at least a portion of the first surface 241 and the second surface 242 of the first support member 240 .
  • at least a portion of the base portion 320 may be accommodated in the first opening 243 .
  • the first opening 243 may be formed in a shape corresponding to at least a portion of the base portion 320 accommodated in the first opening 243 .
  • the first opening 243 may extend in a direction substantially parallel to the back plate 280 and/or the front plate 220 (eg, an X-Y plane direction).
  • the first opening 243 may extend substantially in the X-axis direction and/or the Y-axis direction, and is formed in the housing of the electronic device 200 (the housing 210 of FIGS. 2 and 3 ). It may be connected and/or communicated with a speaker hole (eg, an external speaker hole 207 of FIG. 2 or a receiver speaker hole for a call (not shown)). Through this, the sound output from the speaker 310 may move to the outside of the electronic device 200 through the speaker hole.
  • a speaker hole eg, an external speaker hole 207 of FIG. 2 or a receiver speaker hole for a call (not shown)
  • the first opening 243 may be formed by penetrating a partial region of the first support member 240 in the vertical direction (eg, the Z-axis direction), but is not limited thereto. According to various embodiments, the first opening 243 does not completely penetrate the first support member 240 , but at least a portion of the first surface 241 so that at least a portion of the speaker enclosure 350 can be accommodated therein.
  • the region may be formed to be recessed by a predetermined depth in the second surface 242 direction (eg, the Z-axis direction).
  • the first edge portion 244 may support the flange portion 330 of the speaker enclosure 350 .
  • the flange portion 330 may be seated on the first edge portion 244 .
  • the first edge portion 244 may mean a partial area of the first surface 241 surrounding the first opening 243 .
  • the first edge portion 244 may extend from at least a partial region of the first surface 241 toward the rear plate 280 .
  • the first edge portion 244 may protrude by a predetermined height from a portion of the first surface 241 substantially in the -Z-axis direction so as to be connected to the inner wall of the first opening 243 .
  • the height at which the speaker module 300 is seated may be adjusted according to the degree to which the first edge portion 244 protrudes.
  • the distance between the lower wall 322 of the speaker enclosure 350 and the second surface 242 of the first support member 240 may increase or decrease depending on the degree to which the first edge portion 244 protrudes.
  • the first edge portion 244 is shown to protrude from the first surface 241, but is not limited thereto. According to various embodiments of the present disclosure, the first edge portion 244 may be positioned substantially on the same surface as the first surface 241 .
  • the first opening 243 of the first support member 240 may surround at least a portion of the base portion 320 . At least a portion of the flange portion 330 may be seated on the first edge portion 244 of the first support member 240 .
  • the flange portion 330 is seated on the first rim portion 244 , at least a portion of the base portion 320 with respect to the flange portion 330 is received in the first opening 243 . and another portion of the base portion 320 may be exposed to the outside of the first opening 243 .
  • the flange portion 330 may be seated on a seating surface of the first edge portion 244 .
  • the second portion of the base portion 320 eg, the second portion 320 - 2 in FIG. 6
  • the first portion of the base portion 320 eg, the first portion 320-1 of FIG. 6
  • the first portion of the base portion 320 may be disposed outside the first opening 243 .
  • the degree to which the base portion 320 is accommodated in the first opening 243 may be adjusted through a structure in which the flange portion 330 is seated on the first edge portion 244 .
  • the flange portion 330 since the flange portion 330 is seated on the first edge portion 244 , the lower wall 322 of the base portion 320 and the display 230 may be separated from each other.
  • a conduit through which sound can move may be formed through the spaced apart space between the lower wall 322 and the display 230 .
  • the speaker enclosure 350 may be fixed to the first support member 240 through the fixing member 370 .
  • at least a portion of the flange portion 330 and at least a portion of the first edge portion 244 may have insertion holes into which the fixing member 370 can be inserted, respectively.
  • the fixing member 370 may be formed of a screw member to enable screw coupling.
  • screw threads corresponding to each other may be formed in the screw member and the insertion hole to enable screw coupling.
  • the speaker enclosure 350 may be fixed to the first support member 240 using various coupling means.
  • the flange portion 330 may be attached to the first edge portion 244 using an adhesive member (eg, a double-sided tape).
  • an adhesive member eg, a double-sided tape
  • the flange portion 330 may be fixed to the first edge portion 244 .
  • the curable resin may include a thermosetting resin and/or an ultraviolet curable resin.
  • the printed circuit board 250 may be disposed on the first surface 241 of the first support member 240 . In an embodiment, the printed circuit board 250 may be electrically connected to the pad 340 disposed on the side surface of the speaker enclosure 350 .
  • the printed circuit board 250 may be disposed adjacent to a sidewall on which the pad 340 is disposed among the plurality of sidewalls 323 , 324 , 325 , 326 of the speaker enclosure 350 .
  • the pad 340 may be disposed on the first sidewall 323 of the base portion 320 .
  • the printed circuit board 250 may be disposed on the first surface 241 of the first support member 240 to be adjacent to the first sidewall 323 .
  • the pad 340 and the printed circuit board 250 may be connected in a lateral direction (eg, a Y-axis direction) of the speaker enclosure 350 .
  • the printed circuit board 250 may include a plurality of boards. Although not shown, according to various embodiments, the printed circuit board 250 may include a first substrate (not shown) and a second substrate (not shown) stacked in the vertical direction (eg, the Z-axis direction), An interposer (not shown) may be formed between the first substrate and the second substrate. For example, the interposer may be disposed between the first substrate and the second substrate to electrically connect the first substrate and the second substrate. In this case, a shielding space (not shown) may be formed by the first substrate, the second substrate, and the interposer, and at least one electrical element (not shown) may be disposed in the shielding space. In various embodiments, the interposer disposed between the first substrate and the second substrate may include a conductive via (not shown) penetrating at least a portion of the interposer for electrical connection between the first substrate and the second substrate. have.
  • a contact member 380 may be disposed between the printed circuit board 250 and the pad 340 .
  • the printed circuit board 250 and the pad 340 may be electrically connected through the contact member 380 .
  • the contact member 380 may be disposed on one surface of the printed circuit board 250 .
  • the contact member 380 may be disposed on one surface of the printed circuit board 250 facing the back plate 280 so that at least a portion of the contact member 380 can contact the pad 340 .
  • the contact member 380 is a printed circuit so that the speaker module 300 and the printed circuit board 250 can be electrically connected to a lateral direction (eg, a Y-axis direction) of the speaker module 300 .
  • the pad 340 may be in contact with the pad 340 in a direction substantially perpendicular to the one surface of the substrate 250 .
  • the contact member 380 may be elastically deformable to press the pad 340 .
  • the contact member 380 may include an elastically deformable elastic member (eg, C-clip or Pogo-Pin).
  • the contact member 380 may be disposed on the printed circuit board 250 . However, it is not necessarily limited to the illustrated embodiment, and the contact member 380 may be disposed on the pad 340 according to various embodiments. A contact region to which the contact member 380 is electrically connected may be formed in the printed circuit board 250 .
  • the electronic device 200 may further include a shielding member 390 for shielding a magnetic field and magnetic force generated from the speaker 310 .
  • the shielding member 390 may be disposed between the speaker module 300 and the display 230 .
  • the shielding member 390 may be disposed on at least a portion of the second surface 242 of the first support member 240 .
  • the second surface 242 may have a first area 242-1 in contact with the display 230, and a direction (eg, -Z) of the first surface 241 from the first area 242-1. It may include a second region 242 - 2 connected stepwise in the axial direction.
  • the shielding member 390 may be disposed in the second area 242 - 2 .
  • the shielding member 390 may cover the first opening 243 to prevent the magnetic field from passing through the first opening 243 .
  • the shielding member 390 may be spaced apart from the display 230 .
  • the shielding member 390 may include a ferromagnetic metal plate (eg, steel plate cold commercial (SPCC)).
  • SPCC steel plate cold commercial
  • the first support member 240 may further include a first extension portion 245 .
  • FIG. 7B may be a view of an embodiment in which the first support member 240 illustrated in FIG. 7A additionally includes a first extension portion 245 .
  • the first extension portion 245 may be formed inside the first opening 243 to support at least a portion of the lower wall 322 of the base portion 320 .
  • the first extension portion 245 may extend from at least a portion of an inner wall of the first opening 243 in an inward direction of the first opening 243 .
  • the first extension portion 245 may extend from a portion of the inner wall of the first opening 243 adjacent to the shielding member 390 .
  • the speaker enclosure 350 may be supported by the first edge portion 244 and the first extension portion 245 .
  • the flange portion 330 may be seated on the first edge portion 244
  • the lower wall 322 of the base portion 320 may be seated on the first extension portion 245 . Accordingly, the assembly structure of the speaker module 300 by the first support member 240 may be more stably implemented.
  • the first opening 243 may be formed to have different sizes of regions opened by the first extension portion 245 along the Z-axis direction.
  • the width w1 of the upper region 243 - 1 of the first opening 243 may be greater than the width w2 of the lower region 243 - 2 of the first opening 243 .
  • the width w1 of the first opening 243 may be uniformly formed along the Z-axis direction.
  • the electronic device 200 may include an assembly structure of the speaker module 300 through the first support member 240 .
  • the fixing and/or receiving structure of the speaker module 300 may be formed through the first opening 243 and the first edge portion 244 of the first supporting member 240 .
  • the speaker module 300 may include a base portion 320 , at least a portion of which is accommodated in the first opening 243 , and a flange portion 330 mounted on the first edge portion 244 .
  • the electronic device 200 may form a predetermined distance d between the yoke 311 of the speaker 310 and the base portion 320 of the speaker enclosure 350 .
  • the acoustic volume in the direction of the yoke 311 may be secured through the space secured by the gap between the yoke 311 and the upper wall 321 of the base part 320 .
  • the gap (d) it is possible to block the vibration generated when the sound is output from being directly transmitted to the upper wall 321 and/or the rear plate 280 .
  • the electronic device 200 secures the sound volume of the speaker 310 through the assembly structure of the speaker module 300 by the first support member 240 and at the same time secures the rear plate (280) vibration can be prevented.
  • the yoke 311 faces the rear plate 280, and the diaphragm (eg, the diaphragm 312 in FIGS. 5 and 6) is It may be disposed to face the front plate 220 .
  • the yoke 311 faces the front plate 220 (eg, the Z-axis direction), and the diaphragm (eg, in FIGS. 5 and 6 )
  • the diaphragm 312) may be disposed to face the rear plate 280 direction (eg, the -Z-axis direction).
  • 8A is a diagram illustrating an assembly structure of a speaker module using a second support member of an electronic device according to an exemplary embodiment.
  • 8B is a diagram illustrating an assembly structure of a speaker module using a second support member of an electronic device according to an exemplary embodiment.
  • FIGS. 8A and 8B show the speaker module 300 by means of a second support member 260 in addition to and/or in addition to the assembly structure (eg, see FIGS. 7A and 7B ) by the first support member 240 . It is a drawing for explaining this assembled structure.
  • FIGS. 8A and 8B the content overlapping with the content previously described with reference to FIGS. 4 to 7B will be omitted.
  • FIG. 8A is a plan view illustrating an assembly structure of the speaker module 300 by the second support member 260 when the rear surface of the electronic device 200 (the rear surface 210B of FIG. 3 ) is viewed from above.
  • 8B is a cross-sectional view illustrating an assembly structure of the speaker module 300 by the second support member 260 .
  • FIG. 8A may be a view in which the rear plate 280 is omitted.
  • the electronic device 200 includes a speaker module 300 , a front plate 220 , a display 230 , a rear plate 280 , a first support member 240 , and a printed circuit board. 250 , and a second support member 260 .
  • the second support member 260 may be disposed between the rear plate 280 and the first support member 240 . In various embodiments, the second support member 260 may be disposed to at least partially face the first support member 240 , and between the first support member 240 and the rear plate 280 , the speaker module ( 300) may be supported.
  • the second support member 260 may be disposed to be spaced apart from the first support member 240 in the rear plate 280 direction (eg, -Z-axis direction).
  • at least a portion of the speaker module 300 includes the first support member 240 and the second support member 240 so that the speaker module 300 is supported by the first support member 240 and the second support member 260 . It may be disposed between the support members 260 .
  • the first support member 240 may support the speaker module 300 in a direction of the front plate 220 (eg, a downward direction of the speaker module 300 ), and the second support member 260 may The speaker module 300 may be supported in the rear plate 280 direction (eg, in the upper direction of the speaker module 300 ).
  • the second support member 260 may be disposed inside the housing (eg, the housing 210 of FIGS. 2 to 3 ) of the electronic device 200 to support the speaker module 300 .
  • the second support member 260 may surround at least a portion of the speaker module 300 .
  • the second support member 260 may be seated on at least a portion of the speaker module 300 .
  • the second support member 260 has a first surface 261 (eg, a lower surface) facing the first support member 240 , and a second surface 262 facing the back plate 280 ( e.g. top surface).
  • the second surface 262 may face in a direction opposite to the first surface 261 , and may contact at least a portion of the rear plate 280 .
  • the first surface 261 may be substantially oriented in the Z-axis direction
  • the second surface 262 may be substantially oriented in the -Z-axis direction.
  • the second surface 262 of the second support member 260 may be in contact with the rear plate 280 .
  • the present invention is not necessarily limited thereto, and the second surface 262 may be spaced apart from the rear plate 280 according to various embodiments.
  • the second support member 260 may include a second opening 263 and a second edge portion 264 .
  • the second opening 263 may be openly formed to surround at least a portion of the base portion 320 of the speaker enclosure 350 .
  • the second opening 263 may be formed to penetrate at least a portion of the first surface 261 and the second surface 262 of the second support member 260 .
  • at least a portion of the base portion 320 may be accommodated in the second opening 263 .
  • the second opening 263 may be formed in a shape corresponding to at least a portion of the base portion 320 accommodated in the second opening 263 .
  • the second opening 263 may be formed by penetrating a partial region of the second support member 260 in the vertical direction (eg, the Z-axis direction), but is not limited thereto. According to various embodiments, the second opening 263 does not completely penetrate the second support member 260 , but at least a portion of the first surface 261 so that at least a portion of the speaker enclosure 350 can be accommodated therein.
  • the region may be formed to be recessed by a predetermined depth in the second surface 262 direction (eg, the -Z axis direction).
  • the second rim portion 264 may support the flange portion 330 of the speaker enclosure 350 together with the first rim portion 244 .
  • the second edge portion 264 may be seated on the flange portion 330 .
  • the second edge portion 264 may mean a partial area of the first surface 261 surrounding the second opening 263 .
  • the second edge portion 264 may extend from at least a partial area of the first surface 261 toward the first support member 240 .
  • the second edge portion 264 may protrude substantially from a partial region of the first surface 261 by a predetermined height in the Z-axis direction so as to be connected to the inner wall of the second opening 263 .
  • the second edge portion 264 may face the first edge portion 244 .
  • the second edge portion 264 may be in contact with the flange portion 330 .
  • the second edge portion 264 is shown to protrude from the first surface 261 of the second support member 260 , but is not limited thereto. According to various embodiments, the second edge portion 264 may be positioned substantially on the same surface as the first surface 261 .
  • the shape of the speaker enclosure 350 may be variously modified according to the degree to which the first edge part 244 and the second edge part 264 protrude.
  • the first edge portion 244 is positioned at substantially the same height as the first surface (eg, the first surface 241 of FIGS. 7A and 7B ) of the first support member 240
  • the second edge As the portion 264 is positioned at substantially the same height as the first face 261 of the second support member 260 , the thickness (eg, a length in the Z-axis direction) of the flange portion 330 increases, and the flange portion (330) The step between the base portions may be reduced.
  • Other various embodiments may be possible.
  • the second opening 263 of the second support member 260 may surround at least a portion of the base portion 320 .
  • the second edge portion 264 of the second support member 260 may be seated on the flange portion 330 .
  • the base portion 320 has at least a portion received within the first opening 243 of the first support member 240 , and another portion is received within the second opening 263 of the second support member 260 . ) can be accommodated inside.
  • the flange portion 330 may be disposed between the first edge portion 244 of the first support member 240 and the second edge portion 264 of the second support member 260 .
  • the flange portion 330 may be seated on the first edge portion 244
  • the second edge portion 264 may be seated on the flange portion 330 .
  • the second portion of the base portion 320 eg, the second portion 320 - 2 in FIG. 6
  • the first portion of the base portion 320 eg, the first portion 320-1 of FIG. 6
  • the speaker enclosure 350 may be fixed to the first support member 240 and the second support member 260 through the fixing member 370 .
  • insertion holes into which the fixing member 370 can be inserted may be formed in at least a portion of the flange portion 330 , the first edge portion 244 , and the second edge portion 264 , respectively.
  • the fixing member 370 may pass through the insertion hole of the second edge portion 264 and the flange portion 330 , and may be inserted into the insertion hole of the first edge portion 244 .
  • the electronic device 200 may include an assembly structure of the speaker module 300 through the second support member 260 in addition to and/or in addition to the first support member 240 .
  • an assembly structure of the speaker module 300 through the second support member 260 in addition to and/or in addition to the first support member 240 .
  • a structure for fixing and/or receiving the speaker module 300 together with the first support member 240 through the second opening 263 and the second edge portion 264 of the second support member 260 . can form.
  • the speaker enclosure 350 may be disposed through the first opening 243 of the first supporting member 240 and the second opening 263 of the second supporting member 260 . space can be obtained.
  • the speaker module 300 is can strengthen the fixation/coupling force of
  • FIG. 9 is a diagram illustrating an assembly structure of a speaker module of an electronic device according to an exemplary embodiment.
  • FIG. 9 is a view for explaining another embodiment in which the speaker module 300 is fixed in a pressurized manner.
  • the speaker module 300 is fixed to the first support member 240 and/or the second support member 260 using a fixing member (eg, the fixing member 370 of FIGS. 8A and 8B ).
  • a fixing member eg, the fixing member 370 of FIGS. 8A and 8B
  • the speaker module 300 uses the first support member 240 and/or the second support member 260 through a pressing method. ) can be fixed.
  • FIG. 9 the content overlapping with the content previously described with reference to FIGS. 8A and 8B will be omitted.
  • the electronic device 200 includes a speaker module 300 , a front plate 220 , a display 230 , a rear plate 280 , a first support member 240 , and a second support member 260 . ), and a printed circuit board 250 .
  • the second support member 260 may include a second opening 263 , a second edge portion 264 , and a second extension portion 265 .
  • the second opening 263 may be formed to penetrate at least a portion of the first surface 261 and the second surface 262 of the second support member 260 .
  • the second edge portion 264 may extend from at least a partial area of the first surface 261 .
  • the second extension portion 265 may be formed inside the second opening 263 .
  • the second extension portion 265 may extend from at least a portion of an inner wall of the second opening 263 in an inward direction of the second opening 263 .
  • the second extension portion 265 may be formed to be connected to the second surface 262 of the second support member 260 .
  • the second extension portion 265 may contact at least a portion of the upper wall 321 of the base portion 320 .
  • one surface of the second extension portion 265 may press a partial region of the upper wall 321 in a direction toward the first support member 240 .
  • the upper wall 321 of the base portion 320, the first portion 321-1 facing the rear plate 280, and the lower wall 322 direction from the first portion 321-1 may include a second portion 321 - 2 that is connected stepwise (eg, in the Z-axis direction).
  • the second portion 321 - 2 may contact the second extension portion 265 .
  • the second portion 321 - 2 may be substantially pressed in the Z-axis direction by the second extension portion 265 .
  • a fixing member 370 eg, a concave-convex structure
  • the speaker enclosure 350 may be more strongly pressed and/or fixed through the fixing member 370 .
  • the front plate 220 and the rear plate 280 are provided with a side bezel structure (eg, in FIG. 4 ) to form a housing (eg, the housing 210 of FIGS. 2 and 3 ) of the electronic device 200 .
  • the rear plate 280 may press at least a portion of the second support member 260 in a downward direction (eg, in the Z-axis direction). At this time, a predetermined pressure may be transmitted to the upper wall 321 of the base portion 320 in contact with the second support member 260 .
  • the second extension portion 265 substantially presses a portion of the base portion 320 (eg, the second portion 321 - 2 of the upper wall 321 ) in the Z-axis direction, and the second edge portion 264 may press the flange portion 330 substantially in the Z-axis direction.
  • a partial region of the base portion 320 formed to be stepped (eg, the second portion 321-2 of the upper wall 321) using the pressing force by the rear plate 280) It is possible to form a fixing structure of a pressurizing method for pressing and fixing the flange portion 330 at the same time.
  • FIG. 10 is a diagram illustrating an assembly structure of a speaker module of an electronic device according to an exemplary embodiment.
  • some of the components of the electronic device 200 according to the embodiments of FIGS. 2 to 9 are omitted or , or it may be the electronic device 200 ′ according to an embodiment in which a position of some of the components (eg, a front plate or a display) is changed.
  • At least some of the components of the electronic device 200 ′ according to the embodiment of FIG. 10 are the same as or similar to at least some of the components of the electronic device 200 of FIGS. 2 to 9 .
  • overlapping The description will be omitted.
  • the electronic device 200 ′ may include a speaker module 300 , a front plate 220 , a display 230 , a first support member 240 , and a printed circuit board 250 . .
  • the speaker module 300 may include a speaker 310 and a speaker enclosure 350
  • the speaker enclosure 350 may include a base portion 320 and a flange portion 330 .
  • the front plate 220 may be disposed to at least partially face the first support member 240 .
  • the front plate 220 may be disposed substantially in the Z-axis direction from the first support member 240 .
  • the front plate 220 and the first support member 240 may form at least a portion of an outer surface of the electronic device 200 ′.
  • the front plate 220 may form the front (or upper surface) of the electronic device 200 ′, and the first support member 240 may form the rear (or lower surface) of the electronic device 200 ′. can form.
  • the first support member 240 may support the speaker module 300 to be disposed inside the electronic device 200 ′.
  • the display 230 may be disposed between the speaker module 300 and the front plate 220 .
  • at least a portion of the printed circuit board 250 may be disposed on the first support member 240 to be electrically connected to the speaker module 300 .
  • a shielding member 390 may be disposed between the first support member 240 and the speaker module 300 .
  • the shield member 390 may be disposed on the first support member 240 to face the lower wall 322 of the base portion 320 .
  • housing 210 housing 210; a speaker enclosure 350 disposed inside the housing 210, and a speaker 310 (eg, a core speaker or speaker unit) at least a portion of which is accommodated inside the speaker enclosure 350 to the speaker module 300; and a first support member 240 disposed inside the housing 210 to support the speaker module 300 and surrounding at least a portion of the speaker enclosure 350 , wherein the speaker enclosure 350 includes: ) is at least partially surrounded by the first support member 240 , the base part 320 in which the internal space 328 in which the speaker 310 is disposed is formed, the side surface of the base part 320 . It surrounds at least a portion and may include a flange portion 330 seated on the first support member 240 , and a pad 340 disposed on at least a portion of the side surface of the base portion 320 . .
  • the base portion 320 of the speaker enclosure 350 forms a portion of the side surface of the base portion 320 and includes a plurality of sidewalls ( 323 , 324 , 325 , and 326 , and the flange portion 330 may be formed to extend from at least a portion of the plurality of sidewalls 323 , 324 , 325 , and 326 .
  • the pad 340 may be disposed on at least one of the plurality of sidewalls 323 , 324 , 325 , and 326 such that at least a portion is exposed to the side surface of the base portion 320 .
  • the plurality of sidewalls 323 , 324 , 325 , and 326 include a first sidewall 323 on which the pad 340 is disposed, and a second sidewall 324 facing the first sidewall 323 . ), connecting the first sidewall 323 and the second sidewall 324, and including a third sidewall 325 and a fourth sidewall 326 facing each other, wherein the first sidewall 323 includes,
  • a partial area of the first sidewall 323 may include a recessed area 327 that is recessed in the interior space 328 direction, and the pad 340 may be disposed in at least a portion of the recessed area 327 . .
  • the pad 340 may include a conductive material and may be electrically connected to at least a portion of the speaker 310 through a connection member 360 disposed inside the speaker enclosure 350 .
  • connection member 360 may include a wire or a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the base portion 320 includes an upper wall 321 forming a portion of an outer surface of the base portion 320 , and a lower wall 322 opposing the upper wall 321 , the speaker 310, includes a yoke 311 disposed to face the upper wall 321 in the interior space 328, the yoke 311 and the upper wall 321 and a predetermined distance (d) can be spaced apart.
  • the lower wall 322 may include an open area 3221 in which at least a portion of the speaker 310 is exposed to the outside of the speaker enclosure 350 .
  • the first support member 240 has a first opening opened to receive at least a portion of the base portion 320 (eg, the second portion 320 - 2 of the base portion 320 ). 243 , and a first edge portion 244 on which the flange portion 330 is seated, wherein the base portion 320 is at least a portion (eg, a second portion 320 - 2 of the base portion 320 ). )) is accommodated in the first opening 243 , and another part (eg, the first part 320-1 of the base part 320 ) may be exposed to the outside of the first opening 243 . have.
  • the first support member 240 further includes a first extension portion 245 extending from an inner wall of the first opening 243 in an inward direction of the first opening 243, At least a portion of the base portion 320 (eg, the second portion 320 - 2 of the base portion 320) accommodated in the first opening 243 is seated on the first extension portion 245 .
  • a first extension portion 245 extending from an inner wall of the first opening 243 in an inward direction of the first opening 243, At least a portion of the base portion 320 (eg, the second portion 320 - 2 of the base portion 320) accommodated in the first opening 243 is seated on the first extension portion 245 .
  • a fixing member 370 for fixing the speaker enclosure 350 to the first supporting member 240 is further included, wherein the fixing member 370 includes at least a portion of the flange portion 330 . It may pass through and be inserted into at least a portion of the first edge portion 244 .
  • a second support member 260 disposed inside the housing 210 and spaced apart from the first support member 240 to face the first support member 240 is further included.
  • the flange portion 330 is disposed between at least a portion of the first support member 240 and at least a portion of the second support member 260
  • the base portion 320 includes at least a portion (eg, a base portion).
  • the second part 320-2 of the 320) is surrounded by the first support member 240, and the other part (eg, the first part 320-1 of the base part 320) is the second part. 2 may be surrounded by the support member 260 .
  • the first support member 240 includes a first opening 243 in which at least a portion of the base portion 320 is received, and the second support member 260 includes the base portion 320 .
  • the first support member 240 includes a first opening 243 in which at least a portion of the base portion 320 is received
  • the second support member 260 includes the base portion 320 .
  • the first support member 240 includes a first edge portion 244 extending from one surface of the first support member 240 toward the second support member 260
  • the second support member 260 includes a second edge portion 264 extending from one surface of the second support member 260 to face the first edge portion 244
  • the flange portion ( The 330 may be disposed between the first edge portion 244 and the second edge portion 264 .
  • the base portion 320 is opposite to the lower wall 322 disposed inside the first opening 243 , and the lower wall 322 , and is disposed inside the second opening 263 .
  • a second extension portion 265 extending from an inner wall of the second opening 263 in an inward direction of the second opening 263 ; and the second extension portion 265 may press at least a portion of the upper wall 321 in the direction of the first support member 240 .
  • the upper wall 321 of the base portion 320 is stepped in a direction from the first portion 321-1 and the first portion 321-1 toward the lower wall 322 .
  • a second portion 321 - 2 connected thereto, wherein the second portion 321 - 2 is in contact with one surface of the second extension portion 265 so as to be pressed by the second extension portion 265 . can do.
  • the electronic devices 101 and 200 surround a front plate 220 , a rear plate 280 , and a space between the front plate 220 and the rear plate 280 .
  • a housing 210 including a frame (eg, side bezel structure 218); a printed circuit board (PCB) 250 disposed inside the housing 210;
  • a speaker module 300 disposed inside the housing 210 so as to be connected to the printed circuit board 250 , the speaker module 300 is a speaker enclosure disposed inside the housing 210 .
  • Speaker 310 and at least a portion of which is accommodated inside the speaker enclosure 350, and includes a yoke 311, a diaphragm 312 (eg, a diaphragm) and a voice coil 313.
  • first support member (240) disposed between the front plate (220) and the rear plate (280) and surrounding at least a portion of the speaker enclosure (350). At least a portion of the base portion 320 surrounded by the first support member 240 and the inner space 328 in which the speaker 310 is disposed is formed, at least of a side surface of the base portion 320 .
  • the flange portion Reference numeral 330 indicates that at least a portion of the pad 340 is formed discontinuously (eg, a discontinuous portion) corresponding to an area in which the pad 340 is disposed so that at least a portion of the pad 340 is exposed to the side surface of the base portion 320 . (332)), and the pad 340 may be electrically connected to the printed circuit board 250 through a contact member 380 disposed between the printed circuit board 250 and the pad 340.
  • the contact member 380 is disposed on at least one of the pad 340 and the printed circuit board 250 and is an elastic member (eg, C-clip or Pogo-Pin (Pogo-Pin)) may be included.
  • an elastic member eg, C-clip or Pogo-Pin (Pogo-Pin)
  • a second support member 260 disposed between the first support member 240 and the rear plate 280 and spaced apart from the first support member 240 is further included,
  • the flange portion 330 is disposed between the first support member 240 and the second support member 260 , and at least a portion of the first support member 240 includes at least a portion of the base portion 320 .
  • a first opening 243 in which a portion (eg, the second portion 320 - 2 of the base portion 320) is accommodated is formed, and at least a portion of the second support member 260 has the base portion 320
  • a second opening 263 in which the other portion (eg, the first portion 320-1 of the base portion 320) is accommodated may be formed.
  • a screw member for fixing the speaker enclosure 350 to the first support member 240 and the second support member 260
  • the screw A member passes through at least a portion of the flange portion 330 and at least a portion of the second support member 260 , and is inserted into at least a portion of the first support member 240 .
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. that one (eg first) component is “coupled” or “connected” to another (eg, second) component with or without the terms “functionally” or “communicatively” When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • the processor eg, the processor 120
  • the device may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory storage medium' is a tangible device and only means that it does not contain a signal (eg, electromagnetic wave). It does not distinguish the case where it is stored as
  • the 'non-transitory storage medium' may include a buffer in which data is temporarily stored.
  • the method according to various embodiments disclosed in this document may be provided by being included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play StoreTM) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a portion of a computer program product eg, a downloadable app
  • a machine-readable storage medium such as a memory of a manufacturer's server, a server of an application store, or a relay server. It may be temporarily stored or temporarily created.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon un mode de réalisation divulgué dans le présent document comprend : un boîtier ; un module de haut-parleur comportant une enceinte de haut-parleur agencée dans le boîtier, et un haut-parleur dont au moins une partie est logée dans l'enceinte de haut-parleur ; et un premier élément de support qui est agencé dans le boîtier de façon à supporter le module de haut-parleur, et entoure au moins une partie de l'enceinte de haut-parleur, l'enceinte de haut-parleur pouvant comporter : une partie base, dont au moins une partie est entourée par le premier élément de support et qui a un espace interne pour agencer le haut-parleur ; une partie bride qui entoure au moins une partie de la surface latérale de la partie base, et est montée sur la première partie de support ; et un tampon agencé sur au moins une partie de la surface latérale de la partie base. Divers autres modes de réalisation de la présente spécification sont également possibles.
PCT/KR2021/004106 2020-04-03 2021-04-02 Dispositif électronique comprenant un module de haut-parleur WO2021201640A1 (fr)

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KR10-2020-0040702 2020-04-03
KR1020200040702A KR20210123510A (ko) 2020-04-03 2020-04-03 스피커 모듈을 포함하는 전자 장치

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WO2024058424A1 (fr) * 2022-09-16 2024-03-21 삼성전자주식회사 Dispositif électronique comprenant une structure d'isolation de la chaleur émise par le haut-parleur
WO2024101586A1 (fr) * 2022-11-09 2024-05-16 삼성전자주식회사 Dispositif électronique comprenant une structure isolante pour haut-parleur

Citations (5)

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Publication number Priority date Publication date Assignee Title
KR20110090697A (ko) * 2010-02-04 2011-08-10 엘지전자 주식회사 스피커 모듈 및 이를 갖는 휴대 단말기
KR20130040616A (ko) * 2011-10-14 2013-04-24 엘지전자 주식회사 이동 단말기
KR101330111B1 (ko) * 2012-03-30 2013-11-15 주식회사 이엠텍 일체형 스피커
KR20160035851A (ko) * 2014-09-24 2016-04-01 삼성전자주식회사 스피커 장치 및 그것을 갖는 전자 장치
US20190253781A1 (en) * 2016-10-28 2019-08-15 Panasonic Intellectual Property Management Co., Ltd. Bone conduction speaker and bone conduction headphone device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110090697A (ko) * 2010-02-04 2011-08-10 엘지전자 주식회사 스피커 모듈 및 이를 갖는 휴대 단말기
KR20130040616A (ko) * 2011-10-14 2013-04-24 엘지전자 주식회사 이동 단말기
KR101330111B1 (ko) * 2012-03-30 2013-11-15 주식회사 이엠텍 일체형 스피커
KR20160035851A (ko) * 2014-09-24 2016-04-01 삼성전자주식회사 스피커 장치 및 그것을 갖는 전자 장치
US20190253781A1 (en) * 2016-10-28 2019-08-15 Panasonic Intellectual Property Management Co., Ltd. Bone conduction speaker and bone conduction headphone device

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