WO2021221464A1 - Module de caméra et appareil électronique le comprenant - Google Patents

Module de caméra et appareil électronique le comprenant Download PDF

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Publication number
WO2021221464A1
WO2021221464A1 PCT/KR2021/005385 KR2021005385W WO2021221464A1 WO 2021221464 A1 WO2021221464 A1 WO 2021221464A1 KR 2021005385 W KR2021005385 W KR 2021005385W WO 2021221464 A1 WO2021221464 A1 WO 2021221464A1
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WIPO (PCT)
Prior art keywords
camera
disposed
circuit board
housing
camera assembly
Prior art date
Application number
PCT/KR2021/005385
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English (en)
Korean (ko)
Inventor
허동성
변광석
김만호
정화중
원종훈
이기혁
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021221464A1 publication Critical patent/WO2021221464A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/20—Details of telephonic subscriber devices including a rotatable camera

Definitions

  • Embodiments disclosed in this document relate to a camera module and an electronic device including the same.
  • the electronic device may include one or more camera modules.
  • the camera module may include an auto-focus function for focusing by moving the lens in the optical axis direction.
  • the electronic device may include a function of compensating for shaking of the camera module.
  • the function of compensating for shake may cause the lens to move in a direction other than the optical axis direction to compensate for vibration applied to the camera module.
  • the camera module may support various functions.
  • the camera module may include at least one of a function related to image stabilization and a function related to auto focus.
  • the camera module may be configured to rotate some components of the camera module during a function operation related to image stabilization.
  • the width and/or lengthwise size of the camera module may increase.
  • a guide member eg, a gimbal plate
  • the height direction size of the camera module may increase.
  • the electronic device may include a camera module including an autofocus function for moving a lens in an optical axis direction and/or a function for rotating a lens.
  • a camera module includes: a camera housing; a camera assembly, at least a portion of which is disposed inside the camera housing, and includes a lens and an image sensor; a connection member electrically connected to the image sensor and extending from the camera assembly to the outside of the camera housing; and a pivot structure connecting the camera assembly and the camera housing such that the camera assembly is rotatable relative to the camera housing, wherein the pivot structure is a first structure disposed on the camera assembly and a second structure disposed on the camera housing and supporting the first structure so that the first structure can rotate, wherein any one of the first structure and the second structure faces the other a support protrusion that protrudes, the other includes a support groove in which at least a portion of the support protrusion is rotatably received A hole may be formed.
  • An electronic device includes: a housing; a circuit board disposed inside the housing; and a camera module disposed inside the housing and electrically connected to the circuit board, wherein the camera module includes: a camera housing including a planar area; a camera assembly disposed within the camera housing, the camera assembly including a lens, an image sensor at least partially aligned with an optical axis of the lens, and a first printed circuit board electrically connected to the image sensor; a connection member electrically connected to the first printed circuit board and extending from the camera assembly to the outside of the camera housing; and a pivot structure connecting the camera assembly and the camera housing such that the camera assembly is rotatable relative to the camera housing, wherein the pivot structure is disposed on the camera assembly and includes a support protrusion a first structure including a, and a second structure disposed on the camera housing and including a support groove in which at least a portion of the support protrusion is rotatably received, wherein each of the support protrusion and the support groove includes the A
  • the camera module according to the embodiments disclosed in this document may provide a function related to image stabilization together with a function related to auto focus.
  • the camera module according to the embodiments disclosed in this document may simplify the structure and/or parts of the camera module and reduce the size of the camera module by applying a pivot structure for rotational driving of the camera module.
  • connection member eg, a flexible printed circuit board (FPCB)
  • FPCB flexible printed circuit board
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • FIG. 2 is a block diagram illustrating a camera module according to an embodiment.
  • 3A is a front perspective view of an electronic device according to an exemplary embodiment
  • 3B is a rear perspective view of an electronic device according to an exemplary embodiment
  • 3C is an exploded perspective view of an electronic device according to an exemplary embodiment
  • FIG. 4 is a perspective view of a camera module according to an embodiment.
  • 5A is an exploded perspective view of a camera module according to an embodiment.
  • 5B is an exploded perspective view of a camera module according to an embodiment.
  • FIG. 6 is a diagram illustrating a cross-section of a camera module according to an embodiment.
  • FIG. 7 is a diagram illustrating a pivot structure of a camera module according to an exemplary embodiment.
  • FIG. 8 is a diagram illustrating a pivot structure of a camera module according to an exemplary embodiment.
  • FIG. 9 is a diagram illustrating a cross-section of a camera module according to an exemplary embodiment.
  • FIG. 10 is an exploded perspective view of a camera assembly of a camera module according to an exemplary embodiment.
  • FIG. 11 is a plan view of a camera module according to an exemplary embodiment.
  • FIG. 12 is a diagram illustrating a first rotational driving of a camera module according to an exemplary embodiment.
  • FIG. 13 is a diagram illustrating a second rotational driving of a camera module according to an exemplary embodiment.
  • FIG. 14 is a diagram illustrating a third rotational driving of a camera module according to an exemplary embodiment.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illumina
  • the processor 120 for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 .
  • the volatile memory 132 may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphic processing unit or an image signal processor) that can be operated independently or together with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • a main processor 121 eg, a central processing unit or an application processor
  • an auxiliary processor 123 eg, a graphic processing unit or an image signal processor
  • the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input device 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output device 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.
  • the display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, Alternatively, it may communicate with the external electronic device 104 through a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a computer network eg, a telecommunication network such as a LAN or WAN.
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other.
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified and authenticated.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as a part of the antenna module 197 .
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), inter-integrated circuit (I2C), mobile display digital interface (MDDI), Alternatively, they may be connected to each other through a mobile industry processor interface (MIPI) and exchange signals (eg, commands or data) with each other.
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • I2C inter-integrated circuit
  • MDDI mobile display digital interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 and 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations performed by the electronic device 101 may be performed by one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • FIG. 2 is a block diagram illustrating a camera module according to an embodiment.
  • the camera module 180 includes a lens assembly 210 , a flash 220 , an image sensor 230 , an image stabilizer 240 , a memory 250 (eg, a buffer memory), or an image signal processor. (260).
  • At least one of the components included in the camera module 180 ).
  • One may operate under the control of a control circuit (eg, the processor 120 of FIG. 1 ) of the electronic device (eg, the electronic device 101 of FIG. 1 ).
  • the control circuitry eg, processor 120 in FIG. 1
  • the control circuitry may include a main processor (eg, main processor 121 in FIG. 1 ) and/or a coprocessor (eg, coprocessor 122 in FIG. 1 ) or image signal processor 260).
  • the lens assembly 210 may collect light emitted from a subject, which is an image capturing object.
  • the lens assembly 210 may include one or more lenses.
  • the camera module 180 may include a plurality of lens assemblies 210 .
  • the camera module 180 may form, for example, a dual camera, a 360 degree camera, or a spherical camera.
  • Some of the plurality of lens assemblies 210 may have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may be a different lens assembly. It may have one or more lens properties different from the lens properties of .
  • the lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.
  • the flash 220 may emit light used to enhance light emitted or reflected from the subject.
  • the flash 220 may include one or more light emitting diodes (eg, a red-green-blue (RGB) light-emitting diode (LED), a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp.
  • RGB red-green-blue
  • LED light-emitting diode
  • white LED e.g., a white LED, an infrared LED, or an ultraviolet LED
  • a xenon lamp e.g, a xenon lamp.
  • the image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal.
  • the image sensor 230 may include, for example, one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, and a plurality of images having the same property. sensors, or a plurality of image sensors having other properties.
  • Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.
  • CCD charged coupled device
  • CMOS complementary metal oxide semiconductor
  • the image stabilizer 240 responds to a movement of the camera module 180 or an electronic device including the same (eg, the electronic device 101 of FIG. 1 ) at least one included in the lens assembly 210 .
  • the lens or the image sensor 230 may be moved in a specific direction or an operation characteristic of the image sensor 230 may be controlled (eg, read-out timing adjustment, etc.). Through this, at least a part of the negative effect of the movement on the photographed image may be compensated.
  • the image stabilizer 240 uses a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180 to the camera module 180 or the electronic device ( 101) can be detected.
  • the image stabilizer 240 may be implemented as, for example, an optical image stabilizer.
  • the memory 250 may at least temporarily store at least a portion of the image acquired through the image sensor 230 for the next image processing operation. For example, when image acquisition is delayed according to the shutter or a plurality of images are acquired at high speed, the acquired original image (eg, Bayer-patterned image or high-resolution image) is stored in the memory 250 and , a copy image corresponding thereto (eg, a low-resolution image) may be previewed through a display device (eg, the display device 160 of FIG. 1 ). Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a portion of the original image stored in the memory 250 may be obtained and processed by, for example, the image signal processor 260 .
  • a specified condition eg, a user input or a system command
  • the memory 250 is at least a part of a memory (eg, the memory 130 of FIG. 1 ) of the electronic device (eg, the electronic device 101 of FIG. 1 ) or a separate operation independently therefrom. It may consist of memory.
  • the image signal processor 260 may perform one or more image processing on an image acquired through the image sensor 230 or an image stored in the memory 250 .
  • the one or more image processes may include, for example, depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring), sharpening (sharpening), or softening (softening)
  • the image signal processor 260 may include at least one of the components included in the camera module 180 (eg, an image sensor). 230), for example, exposure time control, readout timing control, etc.
  • the image processed by the image signal processor 260 is stored back in the memory 250 for further processing. or may be provided as an external component of the camera module 180 (eg, the memory 130 of FIG. 1 , the display device 160 , the electronic device 102 , the electronic device 104 , or the server 108 ). .
  • the image signal processor 260 includes at least a part (eg, the coprocessor of FIG. 1 ) of a processor (eg, the processor 120 of FIG. 1 ) of the electronic device (eg, the electronic device 101 of FIG. 1 ). (123)) or a separate processor operating independently of the processor 120 .
  • the image signal processor 260 is configured as a processor separate from the processor 120 , at least one image processed by the image signal processor 260 may be processed by the processor 120 as it is or after additional image processing. Then, it may be displayed through a display device (eg, the display device 160 of FIG. 1 ).
  • the electronic device may include a plurality of camera modules 180 each having different properties (eg, angle of view) or functions.
  • a plurality of camera modules 180 including lenses having different angles of view eg, the lens assembly 210
  • the electronic device 101 may display an electronic device based on a user's selection. It is possible to control to change the angle of view of the camera module 180 performed by the device 101 .
  • at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least the other may be a telephoto camera.
  • the plurality of camera modules 180 may be a front camera, and at least the other may be a rear camera.
  • the plurality of camera modules 180 may include at least one of a wide-angle camera, a telephoto camera, and an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera).
  • the IR camera may be operated as at least a part of a sensor module (eg, the sensor module 176 of FIG. 1 ).
  • the TOF camera may be operated as at least a part of a sensor module (eg, the sensor module 176 of FIG. 1 ) for detecting the distance to the subject.
  • 3A is a front perspective view of an electronic device according to an exemplary embodiment
  • 3B is a rear perspective view of an electronic device according to an exemplary embodiment
  • 3C is an exploded perspective view of an electronic device according to an exemplary embodiment
  • the electronic device 300 includes a first side (or front side) 310A, a second side (or back side) 310B, and a first side (310A) and a second side ( It may include a housing 310 including a side surface 310C surrounding the space between the 310B.
  • the housing 310 may refer to a structure that forms part of the first surface 310A, the second surface 310B, and the side surface 310C of FIG. 1 .
  • the first side 310A may be formed by a substantially transparent front plate 302 (eg, a glass plate comprising various coating layers, or a polymer plate) at least in part.
  • the second surface 310B may be formed by a substantially opaque back plate 311 .
  • the back plate 311 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be
  • the side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or “frame structure”) 318 including a metal and/or a polymer.
  • the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 302 includes two first regions 310D that extend seamlessly from the first surface 310A toward the rear plate 311 by bending the front plate. It may include both ends of the long edge of (302).
  • the rear plate 311 includes two second regions 310E that extend seamlessly by bending from the second surface 310B toward the front plate 302 , the rear plate 311 . It can be included on both ends of the long edge of
  • the front plate 302 (or the back plate 311 ) may include only one of the first regions 310D (or the second regions 310E). In another embodiment, the front plate 302 (or the rear plate 311 ) may not include some of the first regions 310D (or the second regions 310E).
  • the side bezel structure 318 when viewed from the side of the electronic device 300 , is a side side (eg, not including the first regions 310D or the second regions 310E). : has a first thickness (or width) on the short side), and has a second thickness that is thinner than the first thickness on the side side (eg, long side) including the first regions 310D or second regions 310E can
  • the electronic device 300 includes a display 301 , audio modules 303 and 307 (eg, the audio module 170 of FIG. 1 ), and a sensor module (not shown) (eg, the sensor module of FIG. 1 ). 176), camera modules 305 and 312 (eg, the camera module 180 of FIG. 1 ), a key input device 317 (eg, the input device 150 of FIG. 1 ), a light emitting device (not shown) , and a connector hole 308 (eg, the connection terminal 178 of FIG. 1 ).
  • the electronic device 300 may omit at least one of the components (eg, the key input device 317 ) or additionally include another component (eg, a light emitting device (not shown)).
  • the display 301 may be exposed through a substantial portion of the front plate 302 . In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 including the first area 310D of the first surface 310A and the side surface 310C.
  • the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 .
  • the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.
  • the surface (or front plate 302 ) of the housing 310 may include a screen display area formed as the display 301 is visually exposed.
  • the screen display area may include a first surface 310A and side first areas 310D.
  • the screen display areas 310A and 310D may include a sensing area (not shown) configured to obtain the user's biometric information.
  • the meaning of “the screen display regions 310A and 310D includes the sensing region” may be understood to mean that at least a portion of the sensing region may overlap the screen display regions 310A and 310D.
  • the sensing region may display visual information by the display 301 like other regions of the screen display regions 310A and 310D, and may additionally acquire the user's biometric information (eg, fingerprint). can mean
  • the screen display areas 310A and 310D of the display 301 may include areas to which the first camera module 305 (eg, a punch hole camera) may be visually exposed. For example, at least a portion of an edge of the exposed area of the first camera module 305 may be surrounded by the screen display areas 310A and 310D.
  • the first camera module 305 may include a plurality of camera modules (eg, the camera modules 180 of FIG. 1 ).
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.
  • the audio modules 303 , 304 , and 307 may include microphone holes 303 , 304 and a speaker hole 307 .
  • the microphone hole 303 may have a microphone for acquiring an external sound disposed therein.
  • the microphone may include a plurality of microphones to detect the direction of sound.
  • the microphone hole 304 formed in a partial region of the second surface 310B may be disposed adjacent to the camera modules 305 , 312 , and 313 .
  • the microphone hole 304 may acquire a sound when the camera modules 305 , 312 , and 313 are executed, or acquire a sound when other functions are executed.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 .
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole.
  • the electronic device 300 may include a speaker communicating with the speaker hole 307 .
  • the speaker may include a piezo speaker in which the speaker hole 307 is omitted.
  • a sensor module receives an electrical signal or data value corresponding to an internal operating state of the electronic device 300 or an external environmental state.
  • the sensor module may include a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, It may include at least one of a humidity sensor and an illuminance sensor.
  • the camera modules 305 , 312 , and 313 include a first camera module 305 (eg, a punch hole camera) exposed to a first surface 310A of the electronic device 300 , and a second surface thereof. It may include a second camera module 312 exposed as 310B, and/or a flash 313 .
  • the first camera module 305 may be exposed through a portion of the screen display areas 310A and 310D of the display 301 .
  • the first camera module 305 may be exposed as a partial area of the screen display areas 310A and 310D through an opening (not shown) formed in a portion of the display 301 .
  • the second camera module 312 may include a plurality of camera modules (eg, a dual camera or a triple camera). However, the second camera module 312 is not necessarily limited to including a plurality of camera modules and may include one camera module.
  • the first camera module 305 and the second camera module 312 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 (eg, the first regions 310D and/or the second regions 310E).
  • the electronic device 300 may not include some or all of the above-mentioned key input devices 317 , and the non-included key input devices 317 may display soft keys and keys on the display 301 . The same may be implemented in other forms.
  • the key input device may include a sensor module (not shown) that forms a sensing region (not shown) included in the screen display regions 310A and 310D.
  • the connector hole 308 may receive a connector. In one embodiment, the connector hole 308 may be disposed on the side surface 310C of the housing 310 . In some embodiments, the electronic device 300 has a first connector hole 308 and/or an external electronic device that may receive a connector (eg, a USB connector) for transmitting/receiving power and/or data with an external electronic device. It may include a second connector hole (not shown) capable of accommodating a connector (eg, an earphone jack) for transmitting/receiving the device and an audio signal.
  • a connector eg, a USB connector
  • the electronic device 300 may include a light emitting device (not shown).
  • the light emitting device may be disposed on the first surface 310A of the housing 310 .
  • the light emitting device may provide state information of the electronic device 300 in the form of light.
  • the light emitting device may provide a light source that is interlocked with the operation of the first camera module 305 .
  • the light emitting device may include an LED, an IR LED and/or a xenon lamp.
  • the electronic device 300 includes a front plate 320 (eg, a front surface 310A and a first area 310D of FIG. 3A ) and a display 330 (eg, a display 301 of FIG. 3A ). )), a bracket 340 , a battery 349 , a printed circuit board 350 , a support member 360 (eg, a rear case), and a rear plate 380 (eg, the rear surface 310B and the second surface of FIG. 3A ). 2 regions 310E).
  • the electronic device 300 may omit at least one of the components (eg, the support member 360 ) or additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 300 of FIGS. 3A and 3B , and a redundant description will be omitted below.
  • At least a portion of the front plate 320 , the back plate 380 , and the bracket 340 (eg, the frame structure 341 ) includes a housing (eg, the housing 310 of FIGS. 3A and 3B ). can form.
  • the bracket 340 is a frame structure 341 that forms a surface (eg, a part of the side surface 310C in FIG. 1 ) of the electronic device 300 , and the electronic device 300 from the frame structure 341 . ) may include a plate structure 342 extending inwardly.
  • the plate structure 342 may be located inside the electronic device 300 and connected to the frame structure 341 , or may be formed integrally with the frame structure 341 .
  • the plate structure 342 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material.
  • the display 330 may be coupled to one surface and the printed circuit board 350 may be coupled to the back surface.
  • the printed circuit board 350 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 349 may supply power to at least one of the components of the electronic device 300 .
  • battery 349 may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • at least a portion of the battery 349 may be disposed substantially coplanar with the printed circuit board 350 .
  • the battery 349 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300 .
  • the first camera module 305 has a plate structure of the bracket 340 such that the lens is exposed as a partial region of the front plate 320 (eg, the front surface 310A of FIG. 1 ) of the electronic device 300 ). 342 may be disposed.
  • the first camera module 305 may be arranged such that the optical axis of the lens is at least partially aligned with the hole or recess 337 formed in the display 330 .
  • an area where the lens is exposed may be formed on the front plate 320 .
  • the first camera module 305 may include a punch hole camera, at least a portion of which is disposed inside a hole or recess 337 formed on the rear surface of the display 330 .
  • the second camera module 312 is a printed circuit board ( ) such that the lens is exposed to the camera area 384 of the rear plate 380 (eg, the rear surface 310B of FIG. 2 ) of the electronic device 300 . 350).
  • the camera area 384 may be formed on the surface of the rear plate 380 (eg, the rear surface 310B of FIG. 2 ). In an embodiment, the camera area 384 may be formed to be at least partially transparent so that external light is incident to the lens of the second camera module 312 . In an embodiment, at least a portion of the camera area 384 may protrude from the surface of the rear plate 380 to a predetermined height. However, the present invention is not necessarily limited thereto, and the camera area 384 may form substantially the same plane as the surface of the rear plate 380 .
  • FIG. 4 is a perspective view of a camera module according to an embodiment.
  • the camera module 400 (eg, the camera module 180 of FIGS. 1 and 2 ) according to an embodiment includes a camera housing 410 , a camera assembly 420 , and a second printed circuit board. (482).
  • the camera housing 410 may form at least a portion of the exterior of the camera module 400 . At least a portion of the camera assembly 420 may be accommodated in the inner space of the camera housing 410 . In one embodiment, the camera housing 410 is fixed to at least some of the components (eg, the printed circuit board 350 of FIG. 3C ) of the electronic device (eg, the electronic device 300 of FIGS. 3A to 3C ) and It may be arranged inside the electronic device 300 by being/or coupled. For example, the camera housing 410 may be a structure included in the electronic device 300 .
  • the camera housing 410 may include a frame 410 - 2 and a cover 410 - 3 .
  • the frame 410 - 2 and the cover 410 - 3 may form at least a portion of an internal space in which the camera assembly 420 may be disposed.
  • the frame 410 - 2 and the cover 410 - 3 may cover or surround at least a portion of the camera assembly 420 .
  • the cover 410 - 3 may surround at least a portion of the frame 410 - 2 .
  • a portion of the frame 410 - 2 may not be seen because it is covered by the cover 410 - 3 , and the other portion of the frame 410 - 2 is external. can be exposed and shown.
  • the frame 410 - 2 is completely surrounded by the cover 410 - 3 and may not be visible from the outside of the camera module 400 . .
  • the camera housing 410 may include an upper surface 416 through which at least a portion (eg, a lens 431 ) of the camera assembly 420 is exposed to the outside.
  • the upper surface 416 may be formed on at least a portion of the cover 410 - 3 .
  • the upper surface 416 may refer to one surface of the cover 410 - 3 substantially facing the Z-axis direction.
  • a first opening 4161 may be formed in the upper surface 416 .
  • the first opening 4161 may be formed through at least a partial area of the upper surface 416 in a direction parallel to the optical axis L of the lens 431 (eg, the Z-axis direction).
  • at least a portion of the camera assembly 420 may be exposed to the outside of the camera housing 410 through the first opening 4161 .
  • the camera assembly 420 may be accommodated in the camera housing 410 .
  • a portion of the camera assembly 420 may be disposed inside the camera housing 410 .
  • another part of the camera assembly 420 may be exposed to the outside of the camera housing 410 through the first opening 4161 of the camera housing 410 .
  • the camera module 400 when the camera module 400 is viewed from above, at least a portion of the lens 431 may be seen through the first opening 4161 .
  • the camera assembly 420 may be configured to be rotatable relative to the camera housing 410 .
  • the camera assembly 420 rotates within the camera housing 410 so that the optical axis L of the lens 431 has a predetermined angular range with respect to the Z axis (eg, R1 (pitching) or R2 ( yawing)) can be done.
  • the camera assembly 420 rotates (eg, R3 (rolling)) in both directions (eg, clockwise and counterclockwise) about the optical axis L of the lens 431 inside the camera housing 410 . can do.
  • the camera assembly 420 is rotationally driven with respect to the camera housing 410 (eg, the first rotational drive of FIG. 12 , the second rotation of FIG. 13 ) driving and/or the third rotation driving of FIG. 14 ) may be configured, thereby performing a shake correction function.
  • the camera module 400 may perform an optical image stabilization (OIS) function.
  • OIS optical image stabilization
  • the second printed circuit board 482 may be disposed outside the camera housing 410 .
  • the second printed circuit board 482 may be connected to at least a portion of the camera housing 410 outside the camera housing 410 .
  • the second printed circuit board 482 may be electrically connected to the camera assembly 420 disposed inside the camera housing 410 . Also, the second printed circuit board 482 may be electrically connected to a circuit board (eg, the printed circuit board 350 of FIG. 3C ) of the electronic device (eg, the electronic device 300 of FIGS. 3A to 3C ). .
  • a processor eg, the processor 120 of FIG. 1
  • an electronic device eg, the electronic device 101 of FIG. 1
  • various control signals generated from the processor and /or the power signal may be transmitted to the camera assembly 420 through the second printed circuit board 482 .
  • 5A is an exploded perspective view of a camera module according to an embodiment.
  • 5B is an exploded perspective view of a camera module according to an embodiment.
  • the camera module 400 includes a camera housing 410 , a camera assembly 420 , a pivot structure 500 , and a second printed circuit board 482 . and a connecting member 470 .
  • the camera housing 410 may accommodate at least a portion of the camera assembly 420 , the pivot structure 500 , and the connection member 470 therein.
  • the camera housing 410 may include a plate 410 - 1 , a frame 410 - 2 , and a cover 410 - 3 .
  • the plate 410 - 1 , the frame 410 - 2 , and the cover 410 - 3 are coupled to each other so that at least a portion of the camera assembly 420 , the pivot structure 500 , and the connecting member 470 is disposed. space can be created.
  • the plate 410 - 1 forms at least a portion of the lower surface of the camera housing 410 , and may include a planar region 418 facing the first direction.
  • the first direction may mean a direction substantially parallel to the Z-axis.
  • at least a portion of the frame 410 - 2 , the pivot structure 500 , and the camera assembly 420 may be disposed on the planar area 418 of the plate 410 - 1 .
  • one or more fixing members 415 for fixing the frame 410 - 2 may be formed in a portion of the planar area 418 of the plate 410 - 1 .
  • the fixing member 415 may be formed to protrude in a direction (eg, a Z-axis direction) toward the frame 410 - 2 from a corner and/or an edge of the planar area 418 .
  • a fixing groove 419 may be formed in the frame 410 - 2 to correspond to the fixing member 415 .
  • the frame 410 - 2 may be fixed to the plate 410 - 1 through coupling between the fixing member 415 and the fixing groove 419 .
  • the frame 410 - 2 forms at least a portion of a side surface of the camera housing 410 , and may be disposed on a planar area 418 of the plate 410 - 1 .
  • a fixing groove 419 is formed in the frame 410 - 2 , and the fixing member 415 of the plate 410 - 1 is inserted into the fixing groove 419 , so that the plate 410 - 1 is attached to the fixing groove 419 . can be fixed.
  • the frame 410 - 2 may surround at least a portion of the camera assembly 420 in a lateral direction (eg, a direction perpendicular to the optical axis L).
  • the frame 410 - 2 may include a plurality of sidewalls 411 , 412 , 413 , and 414 surrounding the camera assembly 420 .
  • the plurality of sidewalls 411 , 412 , 413 , and 414 may include a first sidewall 411 , a second sidewall 412 , a third sidewall 413 , and a fourth sidewall 414 .
  • the first sidewall 411 and the second sidewall 412 are substantially opposite to each other in the X-axis direction
  • the third sidewall 413 and the fourth sidewall 414 are substantially opposite to each other in the Y-axis direction.
  • the first sidewall 411 and the second sidewall 412 may be connected by the third sidewall 413 and the fourth sidewall 414 , respectively.
  • the first sidewall 411 and the second sidewall 412 may each extend substantially in the Y-axis direction
  • the third sidewall 413 and the fourth sidewall 414 may each extend substantially in the X-axis direction.
  • the cover 410-3 forms at least a portion of the upper surface and/or the side surface of the camera housing 410, and covers at least a portion of the frame 410-2 and the camera assembly 420 or It may be coupled to the frame 410-2 so as to surround it.
  • the cover 410 - 3 may include an upper surface 416 on which the first opening 4161 is formed, and a side surface 417 extending from the edge of the upper surface 416 .
  • the side surface 417 may extend substantially from at least a portion of the edge of the upper surface 416 in the -Z-axis direction.
  • At least some of the plurality of sidewalls 411, 412, 413, 414 of the frame 410-2 is not surrounded by the cover 410-3, It may be exposed to the outside in the side direction of the cover 410 - 3 .
  • a first surface 417 - 1 connecting one end of each of the three surfaces 417 - 3 may be included.
  • a second opening 4171 may be formed in a region facing the first surface 417 - 1 .
  • the first surface 417-1, the second surface 417-2, and the third surface 417-3 of the cover 410-3 are formed on the first sidewall ( 411 ), the third sidewall 413 , and the fourth sidewall 414 may be surrounded, and the second sidewall 412 of the frame 410 - 2 passes the second opening 4171 through the cover 410 - 3 . ) can be exposed to the outside.
  • the shape of the cover 410-3 is not limited to the illustrated embodiment, and in another embodiment (not shown), the second opening 4171 is not formed in the cover 410-3, and the cover ( The 410 - 3 may be formed to surround all of the plurality of sidewalls 411 , 412 , 413 , and 414 of the frame 410 - 2 .
  • the camera assembly 420 may include an assembly case 440 , a lens 431 , a lens barrel 432 , a first printed circuit board 438 , an image sensor 439 , and a holder 450 .
  • the assembly case 440 may accommodate the lens 431 and the lens barrel 432 surrounding the lens 431 therein.
  • the image sensor 439 may be disposed inside the assembly case 440 to face the optical axis L direction.
  • the image sensor 439 may be partially aligned with the optical axis L, and may convert light incident from the lens 431 into an electrical signal.
  • the assembly case 440 may be surrounded by the holder 450 .
  • the first printed circuit board 438 may be disposed under the assembly case 440 or form a lower surface of the assembly case 440 .
  • the first printed circuit board 438 may be attached or coupled to the lower portion of the assembly case 440 .
  • the first printed circuit board 438 may be electrically connected to the image sensor 439 .
  • the image sensor 439 may be electrically connected to one surface (eg, an upper surface) of the first printed circuit board 438 .
  • the pivot structure 500 (eg, the first structure 510 ) may be disposed on a lower surface of the first printed circuit board 438 .
  • the lower surface may mean a surface opposite to the upper surface of the first printed circuit board 438 on which the image sensor 439 is disposed.
  • the connection member 470 may be electrically connected to at least a portion of the first printed circuit board 438 .
  • the holder 450 may surround at least a portion of the assembly case 440 in a lateral direction (eg, a direction perpendicular to the optical axis L).
  • the holder 450 may include a plurality of side surfaces 451 , 452 , 453 , and 454 surrounding the assembly case 440 .
  • the plurality of side surfaces 451 , 452 , 453 , 454 may include a first side surface 451 , a second side surface 452 , a third side surface 453 , and a fourth side surface 454 .
  • the first side surface 451 and the second side surface 452 are substantially opposite to each other in the X-axis direction
  • the third side surface 453 and the fourth side surface 454 are substantially opposite to each other in the Y-axis direction.
  • the first side surface 451 and the second side surface 452 may be connected by the third side surface 453 and the fourth side surface 454 , respectively.
  • the first side surface 451 and the second side surface 452 may each extend substantially in the Y-axis direction
  • the third side surface 453 and the fourth side surface 454 may each substantially extend in the X-axis direction. can be extended to
  • the plurality of sides 451, 452, 453, 454 of the camera assembly 420 may face each of the plurality of sidewalls 411 , 412 , 413 , and 414 of the camera housing 410 (eg, the frame 410 - 2 ).
  • the first sidewall 451 of the holder 450 may face the first sidewall 411 of the frame 410-2.
  • the second side surface 452 of the holder 450 may face the second side wall 412 of the frame 410 - 2 .
  • the third side surface 453 of the holder 450 may face the third side wall 413 of the frame 410 - 2 .
  • the fourth sidewall 454 of the holder 450 may face the fourth sidewall 414 of the frame 410-2.
  • the camera assembly 420 may be relatively rotatably disposed inside the camera housing 410 through the pivot structure 500 .
  • the camera module 400 includes a plurality of rotation driving coils 492-1, 492-2, 492-3 and a plurality of rotation driving coils for rotation of the camera assembly 420 with respect to the camera housing 410 . It may include magnetic materials 493-1, 493-2, and 493-3 for driving rotation.
  • the plurality of rotation driving coils 492-1, 492-2, and 492-3 may be disposed on at least a portion of the camera housing 410, and a plurality of rotation driving magnetic bodies 493-1 and 493 may be provided.
  • -2 and 493 - 3 may be disposed on at least a portion of the camera assembly 420 .
  • the plurality of rotation driving coils 492-1, 492-2, and 492-3 include a second coil 492-1, a third coil 492-2, and a fourth coil 492-3. ) may be included.
  • the plurality of rotation driving coils 492-1, 492-2, and 492-3 may be disposed on the frame 410-2 of the camera housing 410.
  • the second coil 492-1, the third coil 492-2, and the fourth coil 492 are formed on at least some of the plurality of sidewalls 411, 412, 413, and 414 of the frame 410-2. -3) can be arranged.
  • the second coil 492-1 may be disposed on the first sidewall 411 .
  • the second coil 492-1 may be disposed to substantially face the second magnetic body 493-1 disposed on the camera assembly 420 .
  • a second sensor 496 - 2 may be disposed on the first sidewall 411 .
  • the second sensor 496 - 2 may be disposed adjacent to the second magnetic body 493 - 1 to detect the position of the second magnetic body 493 - 1 .
  • the second sensor 496 - 2 may detect the position of the second magnetic body 493 - 1 by measuring a change in the magnetic field formed by the second magnetic body 493 - 1 .
  • the third coil 492 - 2 may be disposed on the third sidewall 413 .
  • the third coil 492 - 2 may be disposed to substantially face the third magnetic body 493 - 2 disposed in the camera assembly 420 .
  • a third sensor 496 - 3 may be disposed on the third sidewall 413 .
  • the third sensor 496 - 3 may be disposed adjacent to the third magnetic body 493 - 2 to detect the position of the third magnetic body 493 - 2 .
  • the third sensor 496 - 3 may detect the position of the third magnetic body 493 - 2 by measuring a change in the magnetic field formed by the third magnetic body 493 - 2 .
  • the fourth coil 492 - 3 may be disposed on the fourth sidewall 414 .
  • the fourth coil 492 - 3 may be disposed to substantially face the fourth magnetic body 493 - 3 disposed in the camera assembly 420 .
  • a fourth sensor (not shown) may be disposed on the fourth sidewall 414 .
  • a fourth sensor (not shown) may be disposed adjacent to the fourth magnetic body 493 - 3 to detect the position of the fourth magnetic body 493 - 3 .
  • the fourth sensor (not shown) may detect the position of the fourth magnetic body 493-3 by measuring a change in the magnetic field formed by the fourth magnetic body 493-3.
  • the camera module 400 may include a camera assembly ( 420) of the rotation angle (eg, movement range) can be detected.
  • the camera module 400 compensates for shake based on the rotation angle confirmed through the second sensor 496-2, the third sensor 496-3, and/or the fourth sensor (not shown). It can perform functions (eg image stabilization functions).
  • the second sensor 496-2, the third sensor 496-3, and/or the fourth sensor (not shown) may include a hall sensor.
  • the plurality of magnetic bodies 493-1, 493-2, and 493-3 for driving rotation include a second magnetic body 493-1, a third magnetic body 493-2, and a fourth magnetic body 493-3. 3) may be included.
  • the plurality of rotation driving magnetic materials 493 - 1 , 493 - 2 , and 493 - 3 may be disposed in the holder 450 of the camera assembly 420 .
  • the second magnetic body 493-1, the third magnetic body 493-2, and the fourth magnetic body 493-3 are formed on at least some of the plurality of side surfaces 451, 452, 453, and 454 of the holder 450. ) can be placed.
  • the second magnetic body 493-1 may be disposed on the first side surface 451 of the holder 450 to substantially face the second coil 492-1.
  • the third magnetic body 493 - 2 may be disposed on the third side surface 453 of the holder 450 to substantially face the third coil 492 - 2 .
  • the fourth magnetic material 493 - 3 may be disposed on the fourth side surface 454 of the holder 450 to substantially face the fourth coil 492 - 3 .
  • the second magnetic body 493-1, the third magnetic body 493-2, and the fourth magnetic body 493-3 include the second sensor 496-2, the third sensor 496-3, and the second magnetic body 493-3. 4 may be disposed adjacent to each of the sensors (not shown).
  • a yoke member 498 for shielding may be disposed on the plurality of side surfaces 451 , 452 , 453 , and 454 of the holder 450 .
  • the yoke member 498 is disposed between the second magnetic material 493-1 and the first side surface 451, between the third magnetic material 493-2 and the third side surface 453, and/or the fourth magnetic material. It may be disposed between 493 - 3 and the fourth side 454 .
  • the yoke member 498 may be formed of a magnetic material, and a magnetic field formed from the second magnetic material 493-1, the third magnetic material 493-2, and the fourth magnetic material 493-3 is assembled. It may be disposed between the assembly case 440 and the plurality of rotation driving magnetic materials 493 - 1 , 493 - 2 , and 493 - 3 to prevent passage through the case 440 .
  • a plurality of rotation driving coils 492-1, 492-2, 492-3 are disposed in the camera housing 410, and a plurality of rotation driving magnetic bodies 493-1, 493-2, 493 - 3 may be disposed in the camera assembly 420 .
  • their positions are not limited to the illustrated embodiment, and in another embodiment (not shown), they may be interchanged.
  • the plurality of rotation driving coils 492-1, 492-2, and 492-3 are disposed in the camera assembly 420 (eg, the holder 450), and the plurality of rotation driving magnetic bodies 493- 1, 493-2, and 493-3 are disposed in the camera housing 410 (eg, the frame 410-2) to face the plurality of rotation driving coils 492-1, 492-2, and 492-3 could be
  • the rotation driving coils 492-1, 492-2, and 492-3 disposed on the holder 450 of the camera assembly 420 include the first printed circuit board 438 of the camera assembly 420. ) can be electrically connected to.
  • the pivot structure 500 may connect the camera assembly 420 and the camera housing 410 such that the camera assembly 420 is relatively rotatable with respect to the camera housing 410 .
  • the pivot structure 500 may be disposed between the camera assembly 420 and the camera housing 410 .
  • the pivot structure 500 may be disposed between the first printed circuit board 438 of the camera assembly 420 and the plate 410 - 1 of the camera housing 410 .
  • the pivot structure 500 may include a first structure 510 , a second structure 520 , and a third structure 530 .
  • the first structure 510 is disposed on the camera assembly 420 (eg, a first printed circuit board 438 ), and the second structure 520 is disposed on the camera housing 410 (eg, a plate 410-1)).
  • the second structure 520 may support the first structure 510 to be relatively rotatable with respect to the second structure 520 .
  • the first structure 510 and the second structure 520 may rotate relatively while in contact with each other.
  • the camera module 400 according to an embodiment rotates the camera assembly 420 with respect to the second structure 520 together with the first structure 510, so that the camera assembly 420 with respect to the camera housing 410 is rotated. Rotation can be implemented.
  • the third structure 530 may constrain the first structure 510 and the second structure 520 not to be separated.
  • the third structure 530 may restrict the separation of the first structure 510 by moving in a substantially Z-axis direction with respect to the second structure 520 .
  • the third structure 530 may be disposed on the plate 410 - 1 of the camera housing 410 or the first printed circuit board 438 of the camera assembly 420 .
  • the pivot structure 500 may be at least partially aligned with the optical axis L of the lens 431 .
  • the pivot structure 500 may be configured such that the optical axis L of the lens 431 substantially penetrates central portions of the first structure 510 , the second structure 520 , and the third structure 530 . It may be disposed between the camera assembly 420 and the camera housing 410 . Details of the structure of the pivot structure 500 will be described below with reference to FIG. 7 .
  • the second printed circuit board 482 may be connected to at least a portion of the plate 410 - 1 .
  • the second printed circuit board 482 may extend from an edge portion of the plate 410 - 1 to substantially face the X-axis direction.
  • the second printed circuit board 482 may be electrically connected to the first printed circuit board 438 through a connection member 470 .
  • the connecting member 470 is for electrically connecting the first printed circuit board 438 and the second printed circuit board 482 , and is connected from the first printed circuit board 438 to the second printed circuit board. may extend towards 482 .
  • one end of the connecting member 470 may be connected to the first printed circuit board 438
  • the other end of the connecting member 470 may be connected to the second printed circuit board 482 .
  • connection member 470 may be implemented using an electrically conductive material to enable electrical connection and/or signal transmission.
  • the connection member 470 may include at least one of a flexible printed circuit board (FPCB), a cable (eg, an RF cable, a data cable, a coaxial cable), and a wire.
  • the connection member 470 may be implemented using an optical communication material (eg, an optical fiber) to enable optical communication through transmission and/or reception of an optical signal. ), the type of the electrically conductive material or the optical communication material to form is not particularly limited, and various materials known in the art may be used.
  • FIG. 6 is a diagram illustrating a cross-section of a camera module according to an embodiment.
  • FIG. 6 is a view illustrating a cross-section A-A' of the camera module shown in FIG. 4 .
  • the camera module 400 may include a camera housing 410 , a camera assembly 420 , a pivot structure 500 , and a connection member 470 .
  • the camera housing 410 may include a plate 410 - 1 , a frame 410 - 2 , and a cover 410 - 3 .
  • the plate 410 - 1 may include a planar region 418 oriented in a first direction (eg, a Z-axis direction).
  • the frame 410 - 2 may be disposed on the planar area 418 of the plate 410 - 1 to surround at least a portion of the camera assembly 420 in the lateral direction.
  • the frame 410-2 includes a plurality of rotation driving coils (eg, the second coil 492-1, the third coil 492-2, and the fourth coil 492 of FIGS. 5A and 5B). -3)) can be arranged.
  • the cover 410 - 3 may cover or wrap at least a portion of the camera assembly 420 and the frame 410 - 2 .
  • the cover 410 - 3 may be coupled to the plate 410 - 1 or the frame 410 - 2 .
  • the camera assembly 420 may include an assembly case 440 , a lens 431 , a lens barrel 432 , a first printed circuit board 438 , and a holder 450 .
  • the lens 431 and the lens barrel 432 may be accommodated in the assembly case 440 .
  • a first printed circuit board 438 may be disposed under the assembly case 440 to form a lower surface of the assembly case 440 .
  • the image sensor 439 may be electrically connected to the upper surface 438 - 1 of the first printed circuit board 438 , and the pivot structure 500 is provided to the lower surface 438 - 2 .
  • Some components eg, the first structure 510) may be disposed.
  • the assembly case 440 may be surrounded by the holder 450 in a direction substantially perpendicular to the optical axis L.
  • the holder 450 includes a plurality of magnetic materials for driving rotation (eg, the second magnetic body 493-1, the third magnetic body 493-2, and the fourth magnetic body 493-3 shown in FIGS. 5A and 5B ). )) can be placed.
  • a plurality of magnetic materials for driving rotation eg, the second magnetic body 493-1, the third magnetic body 493-2, and the fourth magnetic body 493-3 shown in FIGS. 5A and 5B ).
  • the camera assembly 420 may be disposed inside the camera housing 410 .
  • the holder 450 of the camera assembly 420 may be surrounded by the frame 410 - 2 of the camera housing 410 , and the first printed circuit board 438 of the camera assembly 420 may be
  • the plate 410 - 1 of the housing 410 may be disposed to face the plate 410 - 1 in the vertical direction (eg, the optical axis (L) direction or the Z axis direction).
  • the first printed circuit board 438 and the plate 410 - 1 may be spaced apart from each other by a predetermined interval.
  • a pivot structure 500 that rotatably connects the camera assembly 420 to the camera housing 410 may be disposed between the first printed circuit board 438 and the plate 410 - 1 .
  • the gap may be formed by the pivot structure 500 disposed between the first printed circuit board 438 and the plate 410 - 1 . In this case, as the camera assembly 420 rotates with respect to the camera housing 410 , the gap may increase or decrease within a predetermined range.
  • the pivot structure 500 connects the camera assembly 420 and the camera housing 410 , and the pivot structure 500 includes a first structure 510 , a second structure 520 , and a third structure. 530 may be included.
  • the pivot structure 500 may form a rotation center C so that the camera assembly 420 can rotate with respect to the camera housing 410 .
  • the camera assembly 420 is rotated relative to the camera housing 410 with respect to the center of rotation C of the pivot structure 500 (eg, R1 (pitching), R2 (yawing) and/or in FIG. 4 ). or R3 (rolling)).
  • the first structure 510 may be configured to be rotatable with respect to the second structure 520 .
  • the second structure 520 may support at least a portion of the first structure 510 so that the first structure 510 may rotate.
  • the first structure 510 may include a support protrusion 512 that protrudes toward the second structure 520 , and the second structure 520 receives the support protrusion 512 rotatably. It may include a support groove 522 that is. For example, at least a portion of the support protrusion 512 may be accommodated in the support groove 522 , and the support protrusion 512 may freely rotate inside the support groove 522 .
  • the rotation center C of the pivot structure 500 may be formed by coupling and/or contacting the support protrusion 512 and the support groove 522 .
  • the rotation center C may be formed by a predetermined region in which the support protrusion 512 and the support groove 522 contact each other, and the support protrusion 512 is in contact with the support groove 522 .
  • the support protrusion 512 may be formed in a substantially hemispherical shape, and the support groove 522 may be formed in a shape corresponding to the support protrusion 512 .
  • the shapes of the support protrusion 512 and the support groove 522 are not limited to the illustrated embodiment, and may be variously modified in other embodiments (not shown).
  • the first structure 510 may be disposed on the camera assembly 420
  • the second structure 520 may be disposed on the camera housing 410 .
  • the first structure 510 may be disposed on the first printed circuit board 438
  • the second structure 520 may be disposed on the plate 410 - 1 .
  • the first structure 510 and the second structure 520 may be disposed to face each other between the first printed circuit board 438 and the plate 410 - 1 .
  • the first structure 510 may be coupled and/or attached to the lower surface 438 - 2 of the first printed circuit board 438 .
  • the second structure 520 is to be disposed in the upper planar area 418-1 of the plate 410-1 facing the lower surface 438-2 of the first printed circuit board 438.
  • the second structure 520 may be formed integrally with the plate 410 - 1 by extending from the upper planar region 418 - 1 toward the first structure 510 .
  • the present invention is not limited thereto, and in another embodiment, the second structure 520 is not formed integrally with the plate 410 - 1 but may be configured separately.
  • the camera assembly 420 may rotate together with the first structure 510 , and the first structure 510 may be fixed to the camera housing 410 (eg, the plate 410 - 1 ). 2 It can rotate about structure 520 .
  • the camera assembly 420 is rotatably connected to the camera housing 410 using the pivot structure 500 may be implemented.
  • the third structure 530 may constrain the first structure 510 and the second structure 520 not to be separated from each other. In an embodiment, the third structure 530 may maintain a state in which the first structure 510 and the second structure 520 are in contact with each other. For example, the support protrusion 512 may maintain a state accommodated in the support groove 522 by the third structure 530 .
  • the third structure 530 may be disposed to surround at least a portion of the support protrusion 512 and/or the support groove 522 .
  • the support protrusion 512 and the support groove 522 may be positioned in the inner direction of the third structure 530 .
  • the inner direction of the third structure 530 may mean a direction toward the optical axis (L).
  • the third structure 530 may be disposed on the plate 410 - 1 (eg, the upper planar area 418 - 1 ) of the camera housing 410 to face the first structure 510 . . In an embodiment, the third structure 530 may generate a force that pulls the first structure 510 toward the second structure 520 .
  • the third structure 530 may include a magnet, and the first structure 510 may at least partially be a magnetic material (eg, yoke) to allow a magnetic force by the magnet to act. material may be included.
  • the connecting member 470 may pass through at least a portion of the first structure 510 and the second structure 520 to be connected to the first printed circuit board 438 .
  • the connection member 470 may pass through the support protrusion 512 and the support groove 522 in the optical axis (L) direction.
  • L optical axis
  • a part of the connecting member 470 is disposed inside the camera housing 410 to form a first printed circuit board 438 and
  • the other portion of the connecting member 470 may be electrically connected and may be disposed outside the camera housing 410 by penetrating the lower planar area 418 - 2 of the plate 410 - 1 .
  • connection member 470 may at least partially penetrate the rotation center C of the pivot structure 500 .
  • the connecting member 470 passing through the support protrusion 512 and the support groove 522 may be substantially aligned with the optical axis L.
  • the support protrusion 512 may be formed in the first structure 510 , and the support groove 522 may be formed in the second structure 520 .
  • the present invention is not limited thereto, and in another embodiment (eg, refer to FIGS. 8A and 8B ), the support protrusion 512 is formed in the second structure 520 , and the support groove 522 is formed in the second structure 520 . 1 may be formed in the structure 510 .
  • the third structure 530 may be disposed on the camera housing 410 to face the first structure 510 .
  • the present invention is not limited thereto, and in another embodiment (eg, refer to FIGS. 8A and 8C ), the third structure 530 is disposed on the camera assembly 420 to face the second structure 520 . and the second structure 520 may include a magnetic material. Details of the other embodiments will be described below with reference to FIG. 8 .
  • the camera module 400 can simplify the structure of the camera module 400 by applying the pivot structure 500 for rotation of the camera assembly 420 with respect to the camera housing 410 .
  • the size of the camera module 400 in the vertical direction eg, the Z-axis direction
  • the camera module 400 needs to connect the gimbal plate 410 - 1 to the camera assembly 420 and the camera housing 410 to form a rotation axis that is the rotation center of the camera assembly 420 , respectively. Therefore, rotation driving of the camera module 400 for the image stabilization function can be implemented with a simple structure.
  • a connection member 470 (eg, a flexible printed circuit board (FPCB)) for transmitting a signal and/or power is a rotation center of the pivot structure 500 ( By being configured to pass through C), when the camera assembly 420 rotates with respect to the rotation center C, the tension of the connection member 470 acting on the camera assembly 420 can be reduced.
  • the connecting member 470 By arranging the connecting member 470 close to the center of rotation C of the pivot structure 500 to reduce the tension, the connecting member 470 can be configured to have a predetermined length or more to reduce the tension of the connecting member 470 .
  • the size of the camera module 400 in the left-right direction eg, the X-axis and/or the Y-axis direction
  • the tension of the connection member 470 power consumption required for rotational driving of the camera module 400 may be reduced.
  • FIG. 7 is a diagram illustrating a pivot structure of a camera module according to an exemplary embodiment.
  • Fig. 7 (a) is a perspective view of a state in which the pivot structure is coupled
  • Fig. 7 (b) is a cross-sectional view of a state in which the pivot structure is coupled.
  • (b) of FIG. 7 is a cross-sectional view taken along line D-D' shown in (a) of FIG. 7 .
  • the pivot structure 500 of the camera module (eg, the camera module 400 of FIGS. 4 to 6 ) according to an embodiment includes a first structure 510 , a second structure 520 and A third structure 530 may be included.
  • the first structure 510 may be disposed on the first printed circuit board 438 of the camera assembly (eg, the camera assembly 420 of FIGS. 4 to 6 ).
  • the second structure 520 may be disposed on the plate 410 - 1 of the camera housing (eg, the camera housing 410 of FIGS. 4 to 6 ).
  • the second structure 520 may be integrally formed with the plate 410 - 1 .
  • the first structure 510 may include a first base portion 514 , a support protrusion 512 , a first through hole 516 , and a recessed portion 518 .
  • the first base portion 514 of the first structure 510 may be formed at least partially in the form of a plate including a plane.
  • the first base portion 514 includes a first side 514-1 (eg, a lower side) facing the second structure 520 or the third structure 530 and the first side 514 - 1) may include a second surface 514-2 (eg, an upper surface) opposite to the second surface 514-2.
  • the second surface 514 - 2 of the first base portion 514 may be a lower surface 438 - 2)) may be attached to and/or coupled to.
  • the support protrusion 512 may be formed to protrude from at least a portion of the first base portion 514 .
  • the support protrusion 512 may be formed to protrude from a partial region of the first surface 514 - 1 of the first base portion 514 toward the second structure 520 .
  • a partial region of the first surface 514 - 1 from which the support protrusion 512 protrudes may substantially mean a central region of the first base portion 514 .
  • the support protrusion 512 may be accommodated in the support groove 522 included in the second structure 520 .
  • the support protrusion 512 may be formed in a substantially hemispherical shape.
  • the first through hole 516 may be formed in at least a portion of the first structure 510 .
  • the first through hole 516 may be formed through at least a portion of the support protrusion 512 included in the first structure 510 .
  • the first through hole 516 may be at least partially aligned with the second through hole 526 of the second structure 520 .
  • the recessed portion 518 may be recessed in at least a portion of the first base portion 514 .
  • the recessed portion 518 may be such that some areas of the second side 514-2 of the first base portion 514 are compared to other areas of the second side 514-2 of the first side 514 - 2 1) by being depressed in the direction, it can be formed.
  • the connecting member eg, the connecting member 470 of FIGS. 5A to 6
  • the recessed portion 518 may include a first through-hole 516 and a second through-hole 526 from the outside of the lower planar region 418-2 of the base plate 410-1 through which the connecting member 470 is formed. It is possible to provide a space through which the space can be extended toward the first printed circuit board 438 .
  • the second surface 514 - 2 of the first base portion 514 is the first printed circuit board 438 . It may be in contact with the lower surface (eg, the lower surface 438 - 2 of the first printed circuit board 438 of FIG. 6 ).
  • the connecting member 470 may be disposed in a space between the recessed portion 518 and the lower surface 438 - 2 of the first printed circuit board 438 .
  • the recessed portion 518 may be formed to be at least partially continuous with the first through hole 516 so that the connecting member 470 passing through the first through hole 516 may be disposed. .
  • the recessed portion 518 may be formed to overlap the first through hole 516 .
  • the first through hole 516 may penetrate at least a portion of the recessed portion 518 in the Z-axis direction.
  • the fact that the first structure 510 includes the recessed portion 518 is exemplary and not limited thereto.
  • the recessed portion 518 may be omitted, and the second surface 514 - 2 of the first base portion 514 may be formed to be substantially flat.
  • the second structure 520 may include an edge portion 528 , a support groove 522 , and a second through hole 526 .
  • the edge portion 528 may be formed to extend from the upper planar area 418 - 1 of the plate 410 - 1 toward the first structure 510 .
  • the rim portion 528 extends in a direction substantially perpendicular to the side surface 528-1 and the side surface 528-1 extending in a direction substantially perpendicular to the upper planar region 418-1. It may include an upper surface 528-2 that is.
  • the side surface 528 - 1 of the edge portion 528 may be surrounded by a third structure 530
  • the upper surface 528 - 2 of the edge portion 528 may be surrounded by a first structure 510 .
  • the support groove 522 may be recessed in at least a portion of the edge portion 528 .
  • the support groove 522 may be formed when the upper surface 528 - 2 of the edge portion 528 is depressed in the direction of the lower planar area 418 - 2 of the plate 410 - 1 .
  • the support groove 522 may be connected to be inclined downward from the upper surface 528 - 2 of the edge portion 528 .
  • at least a portion of the support protrusion 512 may be rotatably accommodated in the support groove 522 .
  • the support groove 522 may be formed in a shape corresponding to the hemispherical support protrusion 512 .
  • the second through hole 526 may be formed in at least a portion of the second structure 520 .
  • the second through hole 526 may be formed through at least a portion of the support groove 522 included in the second structure 520 .
  • the second through hole 526 may be at least partially aligned with the first through hole 516 of the first structure 510 .
  • the through holes 516 and 526 are substantially collinear with the optical axis (eg, the optical axis L of FIGS. 4-6 ) of the lens (eg, the lens 431 of FIGS. 4-6 ). It may be formed through so as to be positioned on the top.
  • the through-holes 516 and 526 may include a first through-hole 516 formed in the first structure 510 and a second through-hole 526 formed in the second structure 520 . .
  • the first through hole 516 and the second through hole 526 may be at least partially aligned with the optical axis L.
  • the through-holes 516 and 526 may at least partially penetrate the center of rotation of the pivot structure 500 (eg, the center of rotation C of FIG. 6 ).
  • the third structure 530 may be disposed on the upper planar region 418 - 1 of the plate 410 - 1 to face the first structure 510 .
  • the third structure 530 may be disposed in the upper planar region 418 - 1 of the plate 410 - 1 to surround the edge portion 528 of the second structure 520 .
  • the third structure 530 may face the first surface 514 - 1 of the first base portion 514 .
  • the third structure 530 may be disposed to be spaced apart from the first surface 514 - 1 of the first base portion 514 .
  • the third structure 530 may include a first portion 532 and a second portion 534 .
  • the first portion 532 and the second portion 534 may be formed to be separated without being connected to each other.
  • a separation space may be formed between the first part 532 and the second part 534 .
  • the rim portion 528 may be disposed between the first portion 532 and the second portion 534 such that the third structure 530 surrounds the rim portion 528 of the second structure 520 .
  • the third structure 530 may include a first portion 532 and a second portion 534 separated from each other.
  • the present invention is not limited thereto, and in another embodiment (not shown), the third structure 530 may be formed in a disk shape in which an opening region for enclosing the edge portion 528 is formed in the central region.
  • the third structure 530 is separated from the second structure 520 and the first structure 510 is separated from the second structure 520 so that the contact state between the first structure 510 and the second structure 520 can be maintained. / or to prevent it from escaping.
  • the first structure 510 and the second structure 520 may be constrained through an attractive force due to a magnetic force.
  • the third structure 530 may include a magnet to generate a magnetic force
  • the first structure 510 may include a magnetic material so that the attractive force by the magnetic force acts.
  • an attractive force may act between the first structure 510 and the third structure 530 .
  • the third structure 530 may surround at least a portion of the second structure 520 and be spaced apart from the first structure 510 in the -Z axis direction.
  • an external force in the direction of the second structure 520 may be applied to the first structure 510 made of a magnetic material by a magnetic attractive force of a magnet included in the third structure 530 .
  • the first structure 510 and the second structure 520 are limited to be separated in the vertical direction (eg, the Z-axis direction) by the constraint structure using the third structure 530 (eg, a magnet). can be Through this, the support protrusion 512 may rotate inside the support groove 522 , and relative rotation may be implemented between the first structure 510 and the second structure 520 .
  • the illustrated embodiment relates to an example of the pivot structure 500 , and the configuration of the pivot structure 500 is not necessarily limited to the illustrated embodiment.
  • the pivot structure 500 may be variously modified. For example, the position where the support protrusion 512 and the support groove 522 are formed may be changed, and the position where the third structure 530 is disposed may be changed.
  • FIG. 8 is a diagram illustrating a pivot structure of a camera module according to an exemplary embodiment.
  • At least some of the components of the pivot structure according to the embodiment of FIG. 8 are substantially the same as or similar to the components of the pivot structure according to the embodiment of FIGS. 5A to 7 , and thus overlapping descriptions will be omitted.
  • the pivot structure 500 of the camera module (eg, the camera module 400 of FIGS. 4 to 6 ) according to an embodiment includes a first structure 510 , a second structure 520 and A third structure 530 may be included.
  • the first structure 510 is a first printed circuit board (eg, the first printed circuit board of FIGS. 5A-6 ) of the camera assembly (eg, the camera assembly 420 of FIGS. 5A-6 ). 438)), the second structure 520 may be disposed on the plate 410-1 of the camera housing (eg, the camera housing 410 of FIGS. 5A-6), and the third structure ( The 530 may be disposed between the first structure 510 and the second structure 520 .
  • the second structure 520 may support the first structure 510 rotatably with respect to the second structure 520 , and the third structure 530 may be formed with the first structure 510 and the first structure 510 .
  • the second structures 520 may be constrained not to be separated from each other.
  • a support groove 522 may be formed in the first structure 510
  • a support protrusion 512 may be formed in the second structure 520
  • the third structure 530 may be disposed on the first structure 510 .
  • the first structure 510 may include a first base portion 514 .
  • the first base portion 514 may have a first surface 514 - 1 facing the second structure 520 and a second surface 514 - 2 facing the first surface 514 - 1 .
  • a rim portion 528 extending toward the second structure 520 may be formed on the first surface 514 - 1 of the first base portion 514 , and at least of the rim portion 528 .
  • a portion of the first base portion 514 is recessed in the direction of the second surface 514 - 2 , so that the support groove 522 may be formed.
  • the second side 514-2 of the first base portion 514 is a bottom side of the first printed circuit board (eg, the bottom side 438- of the first printed circuit board 438 of FIG. 6 ). 2)) may be in contact with and/or attached to.
  • the second structure 520 may include a second base portion 524 .
  • the second base portion 524 may have a first surface 524-1 facing the first structure 510 and a second surface 524-2 facing the first surface 524-1.
  • a support protrusion 512 that protrudes toward the first structure 510 to be accommodated in the support groove 522 may be formed on the first surface 524 - 1 of the second base portion 524 .
  • the second surface 524 - 2 of the second base portion 524 may contact and/or attach to the upper planar area 418 - 1 of the plate 410 - 1 .
  • the second surface 524 - 2 of the second structure 520 is disposed on the upper planar area 418 - 1 of the plate 410 - 1
  • the first structure 510 is The first surface 514 - 1 of the structure 510 may be disposed to face the first surface 524 - 1 of the second structure 520 .
  • a first through hole 516 is formed in the support groove 522 of the first structure 510
  • a second through hole 526 is formed in the support protrusion 512 of the second structure 520 .
  • a third through hole 418 - 3 aligned with the first through hole 516 and the second through hole 526 may be formed in the plate 410 - 1 .
  • the third through hole 418 - 3 may be formed by vertically penetrating the upper planar area 418 - 1 and the lower planar area 418 - 2 of the plate 410 - 1 .
  • the third structure 530 may be disposed on the first structure 510 to surround the edge portion 528 of the first structure 510 .
  • the third structure 530 may be disposed on the first surface 514 - 1 of the first base portion 514 to face the first surface 524 - 1 of the second base portion 524 .
  • the third structure 530 may be disposed to be spaced apart from the first surface 524 - 1 of the second base portion 524 .
  • a magnetic attraction force may act between the third structure 530 and the second structure 520 .
  • the third structure 530 may include a magnet
  • the second structure 520 may include a magnetic material.
  • the support groove 522 may be formed in the first structure 510
  • the support protrusion 512 may be formed in the second structure 520
  • the third structure 530 may be disposed on the second structure 520 .
  • FIG. 8(b) shows that the third structure 530 is not disposed on the first surface 514-1 of the first structure 510, and the second structure ( There may be a difference in that it is disposed on the first surface 524 - 1 of the 520 .
  • the third structure 530 is to be disposed on the first side 524 - 1 of the second base portion 524 to face the first side 514 - 1 of the first base portion 514 .
  • the third structure 530 may be disposed on the first surface 524 - 1 of the second base portion 524 to surround at least a portion of the support protrusion 512 and/or the support groove 522 .
  • the third structure 530 may be disposed to be spaced apart from the edge portion 528 formed in the first structure 510 .
  • a magnetic attraction force may act between the third structure 530 and the first structure 510 .
  • the third structure 530 may include a magnet
  • the first structure 510 may include a magnetic material.
  • the support protrusion 512 may be formed in the first structure 510 , and the support groove 522 may be formed in the second structure 520 .
  • the third structure 530 may be disposed on the first structure 510 .
  • the support protrusion 512 and the support groove 522 are not formed in the second structure 520 and the first structure 510, respectively,
  • the support protrusion 512 may be formed in the first structure 510 , and the support groove 522 may be formed in the second structure 520 .
  • a support protrusion 512 protruding toward the second structure 520 may be formed on the first surface 514 - 1 of the first base portion 514 .
  • a support groove 522 in which the support protrusion 512 is accommodated may be formed on the first surface 524 - 1 of the second base portion 524 .
  • the third structure 530 is to be disposed on the first side 514 - 1 of the first base portion 514 to face the first side 524 - 1 of the second base portion 524 .
  • the third structure 530 may be disposed on the first surface 514 - 1 of the first base portion 514 to surround at least a portion of the support protrusion 512 and/or the support groove 522 .
  • the third structure 530 may be disposed to be spaced apart from the edge portion 528 formed in the second structure 520 .
  • a magnetic attraction force may act between the third structure 530 and the second structure 520 .
  • the third structure 530 may include a magnet
  • the second structure 520 may include a magnetic material.
  • FIG. 9 is a diagram illustrating a cross-section of a camera module according to an exemplary embodiment.
  • FIG. 9 is a view illustrating a cross section B-B' of the camera module shown in FIG. 4 . At least some of the components of the camera module according to the embodiment of FIG. 9 are substantially the same as or similar to the components of the camera module according to the embodiment of FIGS. 4 to 7 , and thus overlapping descriptions will be omitted.
  • the camera module 400 may include a camera housing 410 , a camera assembly 420 , a pivot structure 500 , and a connection member 470 .
  • the camera assembly 420 may be disposed inside the camera housing 410 .
  • the camera assembly 420 may be rotatably connected to the camera housing 410 through a pivot structure 500 disposed between the first printed circuit board 438 and the plate 410 - 1 .
  • connection member 470 may be electrically connected to the image sensor 439 and may extend from the camera assembly 420 to the outside of the camera housing 410 .
  • the image sensor 439 may be disposed on at least a portion of the first printed circuit board 438 to be electrically connected to the first printed circuit board 438 , and the connecting member 470 may be connected to the first printed circuit board 438 . (438) may be electrically connected.
  • the connection member 470 and the image sensor 439 may be electrically connected through the first printed circuit board 438 .
  • the connecting member 470 passes through the first through hole 516 of the first structure 510 and the second through hole 526 of the second structure 520 to pass through the first printed circuit board 438 . ) may extend toward the outside of the camera housing 410 from one side.
  • the connecting member 470 is disposed inside the first portion 472 , the first through hole 516 , and the second through hole 526 disposed outside the camera housing 410 , the first portion a second portion 474 extending substantially vertically from 472 , and a second portion 474 extending substantially vertically through the first through hole 516 and second through hole 526 , and , a third portion 476 connected to the first printed circuit board 438 .
  • the first portion 472 of the connecting member 470 may be disposed to contact the lower planar region 418 - 2 of the plate 410 - 1 .
  • the first portion 472 extends such that one end is connected to a second printed circuit board (eg, the second printed circuit board 482 of FIGS. 4 to 5B ) disposed outside the camera housing 410 ).
  • a second printed circuit board eg, the second printed circuit board 482 of FIGS. 4 to 5B
  • the second portion 474 of the connecting member 470 may be bent in a direction substantially perpendicular to the first portion 472 to extend into the camera housing 410 .
  • the second portion 474 may be substantially collinear with the optical axis L of the lens 431 .
  • the third portion 476 of the connecting member 470 may be disposed to contact the lower surface 438 - 2 of the first printed circuit board 438 .
  • the third portion 476 may extend in a direction substantially perpendicular to the optical axis L from the second portion 474 such that one end is connected to one side of the first printed circuit board 438 .
  • at least a portion of the third portion 476 is the recessed portion 518 of the first structure 510 (eg, the recessed portion 518 of FIG. 7 ) and the lower portion of the first printed circuit board 438 . It may be disposed between the surfaces 438 - 2 .
  • the third portion 476 may travel through the space between the recessed portion 518 of the first structure 510 and the lower surface 438 - 2 of the first printed circuit board 438 through the optical axis L may extend in a direction substantially perpendicular to the
  • the connecting member 470 may have a first through hole 516 and a second through hole to be connected to the first printed circuit board 438 . It may extend in a direction away from 526 .
  • the connecting member 470 is formed from a portion (eg, the second portion 474) disposed in the through holes 516 and 526. It may not extend in a direction perpendicular to the optical axis L, but may be connected to a partial region of the first printed circuit board 438 positioned above the through holes 516 and 526 .
  • the connection member 470 may be connected to a central region of the lower surface 438 - 2 of the first printed circuit board 438 .
  • FIG. 10 is an exploded perspective view of a camera assembly of a camera module according to an exemplary embodiment.
  • At least some of the components of the camera assembly according to the embodiment of FIG. 10 are substantially the same as or similar to the components of the camera assembly according to the embodiment of FIGS. 4 to 6 , and thus overlapping descriptions will be omitted.
  • the camera assembly 420 may include an assembly case 440 , a first printed circuit board 438 , a lens carrier 430 , and a holder 450 .
  • the assembly case 440 may form an inner space in which the lens carrier 430 is accommodated.
  • the assembly case 440 may include an upper case 442 and a lower case 444 .
  • the upper case 442 and the lower case 444 may be coupled in the vertical direction to form a space for accommodating the lens carrier 430 .
  • at least a portion of the assembly case 440 may be surrounded by the holder 450 .
  • an opening 449 may be formed in the upper surface of the upper case 442 .
  • the opening 449 may be at least partially aligned with the lens 431 (eg, the optical axis L of the lens 431 ). At least a portion of the lens barrel 432 may protrude to the outside of the assembly case 440 through the opening 449 .
  • an image sensor 439 may be disposed inside the lower case 444 .
  • the first printed circuit board 438 may be disposed under the assembly case 440 .
  • the first printed circuit board 438 may be disposed under the lower case 444 to form at least a portion of a lower surface of the assembly case 440 .
  • the first printed circuit board 438 may be attached and/or coupled to the lower portion of the lower case 444 .
  • the first printed circuit board 438 may be electrically connected to the image sensor 439 .
  • at least one circuit pattern may be formed on the first printed circuit board 438
  • the image sensor 439 may be disposed on one surface (eg, an upper surface) of the first printed circuit board 438 . have.
  • the image sensor 439 may be at least partially aligned with the optical axis L of the lens 431 .
  • the first printed circuit board 438 may be disposed under the lower case 444 , such that the image sensor 439 is positioned inside the lower case 444 .
  • the lens carrier 430 may include a lens 431 and a lens barrel 432 . At least a portion of the lens carrier 430 may be disposed inside the assembly case 440 .
  • the lens barrel 432 may include one or more lenses 431 therein. The lens barrel 432 may be formed to surround the lens 431 .
  • the lens carrier 430 in the space between the upper case 442 and the lower case 444 in the vertical direction (eg, L / -L direction) with respect to the optical axis (L) of the lens 431. can move to In the camera module (eg, the camera module 400 of FIGS. 4 to 6 ) according to an embodiment, the lens 431 is aligned in a direction substantially parallel to the optical axis L (eg, the L/-L direction). By moving, the auto focus (AF) function can be performed.
  • the camera module eg, the camera module 400 of FIGS. 4 to 6
  • the lens 431 is aligned in a direction substantially parallel to the optical axis L (eg, the L/-L direction).
  • At least a portion of the camera assembly 420 has a first lens carrier 430 for moving the lens carrier 430 in the vertical direction (eg, L/-L direction) based on the optical axis L of the lens 431 .
  • a coil 494 and a first magnetic body 495 may be disposed.
  • the first magnetic body 495 may be disposed on a side surface of the lens carrier 430 , and the first coil 494 may substantially face the first magnetic body 493 - 1 in the upper case 442 or It may be disposed in the lower case 444 .
  • the first coil 494 and the first magnetic body 495 may electromagnetically interact with each other.
  • the electromagnetic force may be controlled by adjusting the direction and/or strength of the current passing through the first coil 494 , and the Lorentz force caused by the electromagnetic force
  • the lens carrier 430 on which the first magnetic body 495 is disposed may move in the optical axis L direction by using .
  • the positions of the first coil 494 and the first magnetic body 495 are not limited to the illustrated embodiment.
  • the first coil 494 is disposed on the side surface of the lens carrier 430 , and the first magnetic body 495 faces the first coil 494 in the upper case 442 or the lower part. It may be disposed on the case 444 .
  • a first sensor 496 - 1 capable of detecting the position of the first magnetic body 495 may be disposed on at least a portion of the camera assembly 420 .
  • the first sensor 496 - 1 may be disposed in the upper case 442 or the lower case 444 .
  • the first sensor 496 - 1 moves in the vertical direction (eg, L/-L direction) of the lens carrier 430 based on the position of the first magnetic body 495 moving together with the lens carrier 430 . ) can detect movement displacement.
  • the first sensor 496 - 1 may detect the position of the first magnetic body 495 by measuring a change in the magnetic field formed by the first magnetic body 495 .
  • the camera module eg, the camera module 400 of FIGS. 4 to 6
  • the first sensor 496 - 1 may include, for example, a Hall sensor.
  • the processor eg, the processor 120 of FIG. 1
  • the processor includes the first coil ( 494 ), the first magnetic body 495 , and/or the first sensor 496 - 1 may be used to move the lens carrier 430 to provide an autofocus function.
  • the lens 431 is moved together with the lens carrier 430 in the optical axis L direction, so that the distance from the image sensor 439 disposed inside the lower case 444 may vary within a predetermined range.
  • the electronic devices 101 and 300 may adjust the focal length by moving the lens carrier 430 according to the distance of the subject.
  • the camera assembly 420 may include a plurality of balls 434 disposed between the side surface of the lens carrier 430 and the assembly case 440 .
  • the plurality of balls 434 are disposed between the lens carrier 430 and the assembly case 440 (eg, the lower case 444 ) when the lens carrier 430 is moved in the optical axis L direction. It can provide rolling friction force.
  • the plurality of balls 434 are a first plurality of balls 434 - 1 disposed on one side of the first magnetic body 495 , and a second plurality of balls 434 - 2 disposed on the other side of the first magnetic body 495 . ) may be included.
  • each of the plurality of first balls 434 - 1 and the plurality of second balls 434 - 2 may be arranged in the direction of the optical axis L of the lens 431 .
  • the number of balls constituting the plurality of first balls 434 - 1 and the plurality of second balls 434 - 2 may be different.
  • the first plurality of balls 434 - 1 disposed on one side of the first magnetic body 495 are disposed on the other side of the first magnetic body 495 . It may be composed of a relatively small number of balls compared to the second plurality of balls 434 - 2 .
  • the number and/or position of the plurality of balls 434 described above is exemplary and not limited thereto.
  • the camera assembly 420 may include a guide protrusion 435 and a guide rail 446 for guiding the movement of the lens carrier 430 .
  • the guide protrusion 435 may be accommodated in the guide rail 446 .
  • the guide protrusion 435 may protrude from the side surface of the lens carrier 430
  • the guide rail 446 may include an upper case 442 or a lower case 444 to accommodate the guide protrusion 435 .
  • the guide protrusion 435 may guide the lens carrier 430 to move in the optical axis L direction while sliding along the guide rail 446 .
  • the guide rail 446 may extend from the stepped surface 448 formed in the lower case 444 to open in the upper direction (eg, the L direction).
  • the lens carrier 430 moves in the lower direction (eg, -L direction)
  • at least a portion of the guide protrusion 435 is supported in contact with the stepped surface 448 , thereby lowering the lens carrier 430 .
  • FIG. 11 is a plan view of a camera module according to an exemplary embodiment.
  • FIG. 11 is a plan view of a camera module in which a cover of the camera housing is omitted in FIGS. 4 to 6 . At least some of the components of the camera module according to the embodiment of FIG. 11 are substantially the same as or similar to the components of the camera module according to the embodiment of FIGS. 4 to 6 , and thus overlapping descriptions will be omitted.
  • the camera module 400 includes a camera housing 410 , a camera assembly 420 disposed inside the camera housing 410 , and at least a portion of the camera housing 410 .
  • the camera housing 410 may include a plate 410 - 1 and a frame 410 - 2 disposed at an edge of the plate 410 - 1 to surround the camera assembly 420 .
  • the camera assembly 420 may include an assembly case 440 and a holder 450 surrounding the assembly case 440 .
  • the plurality of rotation driving coils 492-1, 492-2, 492-3 may be disposed on the frame 410-2 of the camera housing 410, and a plurality of rotation driving magnetic materials ( 493 - 1 , 493 - 2 , and 493 - 3 may be disposed in the holder 450 of the camera assembly 420 .
  • the third printed circuit board 484 may surround at least a portion of the frame 410 - 2 . In an embodiment, the third printed circuit board 484 may surround at least a portion of the plurality of sidewalls 411 , 412 , 413 , and 414 of the frame 410 - 2 .
  • the third printed circuit board 484 may include a first region 484-1 surrounding at least a portion of the first sidewall 411 of the frame 410-2, and a third portion of the frame 410-2. It may include a second region 484-2 surrounding at least a portion of the sidewall 413 and a third region 484-3 surrounding a portion of the fourth sidewall 414 of the frame 410-2. .
  • the first area 481-1 may be located between the second area 484-2 and the third area 484-3.
  • the second region 484-2 and the third region 484-3 may be disposed to face each other, and the first region 484-1 may include the second region 484-2 and the third region 484-2. Regions 484-3 may be connected.
  • the first region 484-1 may face a direction perpendicular to the second region 484-2 and the third region 484-3.
  • the plurality of rotation driving coils 492-1, 492-2, 492-3 are disposed on at least some of the plurality of sidewalls 411, 412, 413, and 414 of the frame 410-2.
  • the plurality of rotation driving coils 492-1, 492-2, and 492-3 may be electrically connected to the third printed circuit board 484 .
  • the second coil 492-1 may be disposed on the first sidewall 411 of the frame 410-2 to face the first region 484-1 of the third printed circuit board 484.
  • the third coil 492 - 2 may be disposed on the third sidewall 413 of the frame 410 - 2 to face the second region 484 - 2 of the third printed circuit board 484 .
  • the fourth coil 492 - 3 may be disposed on the fourth sidewall 414 of the frame 410 - 2 to face the third region 484 - 3 of the third printed circuit board 484 .
  • the plurality of rotation driving magnetic bodies 493-1, 493-2, and 493-3 is a camera assembly to interact with the plurality of rotation driving coils 492-1, 492-2, 492-3. It may be disposed at 420 .
  • the second magnetic body 493-1 faces the second coil 492-1
  • the third magnetic body 493-2 faces the third coil 492-2
  • the fourth magnetic body ( 493 - 3 may be disposed on at least a portion of the holder 450 to face the fourth coil 492 - 3 .
  • the plurality of rotation driving coils 492-1, 492-2, 492-3 and the plurality of rotation driving magnetic bodies 493-1, 493-2, 493-3 are mutually electromagnetically can work
  • the processor eg, the processor 120 of FIG. 1).
  • the camera assembly 420 in which the fourth magnetic material 493-3 is disposed may be rotated in a predetermined direction (eg, R1 (pitching), R2 (yawing), and/or R3 (rolling).
  • the camera assembly 420 rotates in the X/-X axis direction substantially with respect to the camera housing 410 by the interaction between the second coil 492-1 and the second magnetic body 493-1. (eg R1 (pitching)). In an embodiment, the camera assembly 420 rotates substantially in the Y/-Y axis direction with respect to the camera housing 410 due to the interaction between the third coil 492-2 and the third magnetic body 493-2. (eg R2(yawing)). In one embodiment, the camera assembly 420 is rotated around the optical axis L with respect to the camera housing 410 by the interaction between the fourth coil 492-3 and the fourth magnetic body 493-3. It can be rotated counterclockwise (eg R3 (rolling)).
  • the direction in which the camera assembly 420 rotates by the plurality of rotation driving coils 492-1, 492-2, and 492-3 is not limited to the above description, and in other embodiments, it may be variously modified.
  • the camera module 400 may substantially rotate the camera assembly 420 in the Y/-Y axis direction (eg, R2 (yawing)) using the fourth coil 492 - 3 .
  • the camera assembly 420 may be rotated clockwise/counterclockwise (eg, R3 (rolling)) about the optical axis L by using the three coils 492 - 2 .
  • the camera module 400 includes three rotation driving coils (eg, a second coil 492-1, a third coil 492-2, and a fourth coil 492-3) and The camera assembly 420 is rotated using three magnetic materials for rotation driving corresponding thereto (eg, the second magnetic material 493-1, the third magnetic material 493-2, and the fourth magnetic material 493-3).
  • an image stabilization function of the camera module 400 may be performed (eg, a 3-axis module tilt optical image stabilizer (OIS)).
  • OIS optical image stabilizer
  • the camera module 400 includes a second magnetic body 493-1 and a second magnetic body 493-1 corresponding to the second coil 492-1 and the third coil 492-2. 3
  • the image stabilization function eg, a 2-axis module tilt optical image stabilizer (OIS)
  • a plurality of rotation driving coils 492-1, 492-2, 492-3 and a plurality of rotation driving magnetic bodies 493-1, 493-2, 493 The positions of -3) may be interchanged.
  • the plurality of rotation driving coils 492-1, 492-2, and 492-3 are disposed in the holder 450 of the camera assembly 420, and the plurality of rotation driving magnetic bodies 493-1 and 493 are provided.
  • -2 and 493-3 may be disposed on the frame 410-2 of the camera housing 410 to face the plurality of rotation driving coils 492-1, 492-2, and 492-3.
  • FIG. 12 is a diagram illustrating a first rotational driving of a camera module according to an exemplary embodiment.
  • 13 is a diagram illustrating a second rotational driving of a camera module according to an exemplary embodiment.
  • 14 is a diagram illustrating a third rotational driving of a camera module according to an exemplary embodiment.
  • FIG. 12 is a cross-sectional view taken along line B-B' of the camera module shown in FIG. 4
  • FIG. 13 is a cross-sectional view taken along line A-A' of the camera module shown in FIG. 4
  • FIG. 14 is a plan view of the camera module shown in FIG. 4 .
  • At least some of the components of the camera module according to the exemplary embodiment of FIGS. 12 to 14 are substantially the same as or similar to the components of the camera module according to the exemplary embodiment of FIGS. 4 to 11 , and thus overlapping descriptions will be omitted.
  • a first rotational drive (eg, FIGS. 4 and 11 ) in which the camera assembly 420 is substantially rotated in the X/-X axis direction R1((pitching)), a second rotational drive in which the camera assembly 420 rotates substantially in the Y/-Y axis direction (eg, R2((yawing)) in FIGS. 4 and 11 and the camera assembly 420
  • a third rotation driving eg, R3 ((rolling)) in FIGS. 4 and 11 that rotates in a clockwise (CW)/counterclockwise (CCW) direction about the optical axis L may be performed simultaneously or sequentially, respectively.
  • the camera assembly 420 may be rotated relative to the camera housing 410 by a pivot structure 500 .
  • the support groove 522 of the second structure 520 is fixed to the camera housing 410
  • the support protrusion 512 of the first structure 510 is rotatably accommodated in the support groove 522 .
  • the camera assembly 420 may rotate with respect to the second structure 520 and/or the camera housing 410 together with the first structure 510 .
  • an attractive force is applied to the first structure 510 made of a magnetic material by the third structure 530 including a magnet, so that the first structure 510 is rotatably connected to the second structure 520 . state can be maintained.
  • the camera module 400 has an X/-X axis based on the rotation center C of the pivot structure 500 in a basic state (eg, in FIG. 12A ).
  • a first rotational drive to rotate in the direction may be performed.
  • the camera module 400 uses the second coil 492-1 and the second magnetic body 493-1 to move the camera assembly 420 with respect to the camera housing 410 substantially at X/ ⁇ It can be rotated in the X-axis direction.
  • the camera assembly 420 may rotate relatively inside the camera housing 410 .
  • the second magnetic material 493-1 in an upward direction (eg, in the Z-axis direction) or in a downward direction (eg, in the -Z-axis direction). of external force can be applied.
  • an upward external force is applied to the second magnetic body 493 - 1 , as shown in FIG.
  • the camera assembly 420 is substantially rotated with respect to the rotation center C It can rotate in the X-axis direction. Also, although not shown, when an external force in a downward direction is applied to the second magnetic body 493 - 1 , the camera assembly 420 may substantially rotate in the -X-axis direction with respect to the rotation center C .
  • the optical axis L of the lens 431 may form a predetermined angle a1 with the Z-axis direction.
  • the optical axis L may be spaced apart from the Z-axis direction by a predetermined angle a1 in the X/-X-axis direction by the first rotational driving.
  • the Z-axis may correspond to substantially the same axis as the optical axis L of the lens 431 in a basic state (eg, (a) of FIG. 12 ).
  • the predetermined angle a1 may be greater than or equal to 0 degrees and less than 10 degrees.
  • the Y/-Y axis is based on the rotation center C of the pivot structure 500 in a basic state (eg, FIG. 13A ).
  • a second rotational driving to rotate in the direction may be performed.
  • the camera module 400 uses the third coil 492-2 and the third magnetic body 493-2 to move the camera assembly 420 with respect to the camera housing 410 at substantially Y/ ⁇ It can be rotated in the Y-axis direction.
  • the third magnetic material 493-2 is directed upward (eg, in the Z-axis direction) or downward (eg, in the -Z-axis direction). of external force can be applied.
  • the camera assembly 420 is substantially rotated based on the rotation center C. - It can rotate in the Y-axis direction.
  • the camera assembly 420 may substantially rotate in the Y-axis direction with respect to the rotation center C .
  • the optical axis L of the lens 431 may form a predetermined angle a1 with the Z-axis direction.
  • the optical axis L may be spaced apart from the Z-axis direction by a predetermined angle a1 in the Y/-Y-axis direction by the second rotational driving.
  • the Z-axis may correspond to substantially the same axis as the optical axis L of the lens 431 in a basic state (eg, (a) of FIG. 13 ).
  • the predetermined angle a1 may be greater than or equal to 0 degrees and less than 10 degrees.
  • the camera module 400 is clockwise (CW)/counterclockwise (CCW) about the optical axis (L) in a basic state (eg, in FIG. 14A ). ) can be used for a third rotational drive.
  • the camera module 400 uses the fourth coil 492-3 and the fourth magnetic material 493-3 to move the camera assembly 420 around the optical axis L of the lens 431 . It can be rotated clockwise (CW) or counterclockwise (CCW).
  • an external force in the X-axis direction or the -X-axis direction may be applied to the fourth magnetic body 493-3 according to the direction of the current applied to the fourth coil 492-3.
  • the camera assembly 420 is rotated about the optical axis L as shown in FIG. 14(b). It can rotate by a predetermined angle a2 in the clockwise direction (CCW).
  • the camera assembly 420 moves in a clockwise direction (CW) with respect to the optical axis L at a predetermined angle ( a2) can be rotated.
  • the camera assembly 420 may form a predetermined angle with the X-axis or the Y-axis.
  • a virtual reference line L1 connecting the corners of the assembly case 440 may be defined in the camera assembly 420 , and an angle between the X-axis and the reference line L1 according to the third rotational driving. and an angle between the Y-axis and the reference line may vary.
  • the reference line L1 may form 45 degrees with respect to each of the X and Y axes in a basic state (eg, in FIG. 14A ).
  • the reference line L1 is rotated at an angle other than 45 degrees with respect to each of the X and Y axes (eg, 45-a2 or 45 degrees). +a2) can be formed.
  • the reference line L1 forms an angle of 45-a2 with the X-axis, and an angle of 45+a2 with the Y-axis. It can be formed (eg, (b) of FIG. 14).
  • the reference line L1 forms an angle of 45+a2 with the X-axis and an angle of 45-a2 with the Y-axis. have.
  • connection member 470 passes through the through holes 516 and 526 of the pivot structure 500, and the first printed circuit board ( 438 and the second printed circuit board 482 may be electrically connected.
  • one end of the connecting member 470 may be connected to at least a portion of the first printed circuit board 438 , and a first through hole 516 and a second through hole 526 are formed from the one end. It may pass through and extend toward the outside of the camera housing 410 .
  • the other end of the connection member 470 may be connected to the second printed circuit board 482 .
  • the connecting member 470 extending from the first printed circuit board 438 connects the second printed circuit board 482 with the lower surface of the plate 410 - 1 of the camera housing 410 in contact.
  • the other end of the connecting member 470 may be connected to the lower surface of the second printed circuit board 482 .
  • the first through-hole 516 and the second through-hole 526 are inside A portion of the connecting member 470 disposed on the pole may be at least partially aligned with the optical axis L of the lens 431 .
  • the connecting member 470 may be configured to pass through the center of rotation C of the pivot structure 500 .
  • a lens eg, the lens 431 of FIG. 6
  • an image sensor eg, FIG. It can rotate together with the image sensor 439 of 6.
  • a relative position of the lens 431 and the image sensor 439 for example, a distance between the lens 431 and the image sensor 439 may be maintained.
  • the camera module 400 includes a camera housing 410; a camera assembly 420 at least a portion of which is disposed inside the camera housing 410 and includes a lens 431 and an image sensor 439; a connection member 470 electrically connected to the image sensor 439 and extending from the camera assembly 420 to the outside of the camera housing 410; and a pivot structure (500) connecting the camera assembly (420) and the camera housing (410) so that the camera assembly (420) is relatively rotatable with respect to the camera housing (410).
  • the pivot structure 500 includes a first structure 510 disposed in the camera assembly 420 and a first structure 510 disposed in the camera housing 410 so that the first structure 510 may rotate.
  • a second structure 520 supporting the first structure 510 is included, and any one of the first structure 510 and the second structure 520 includes a support protrusion 512 protruding toward the other. and the other one includes a support groove 522 in which at least a portion of the support protrusion 512 is rotatably accommodated, and each of the support protrusion 512 and the support groove 522 has the connection Through-holes 516 and 526 may be formed to accommodate at least a portion of the member 470 .
  • the through-holes 516 and 526 are formed to pass through substantially parallel to the optical axis L of the lens 431 so as to at least partially communicate with the outside of the camera housing 410 , and the connection The member 470 may extend toward the outside of the camera housing 410 through the through holes 516 and 526 .
  • the through holes 516 and 526 may be configured to be positioned substantially on the same line with the optical axis L of the lens 431 .
  • the through-holes 516 and 526 include a first through-hole 516 formed in at least a portion of the first structure 510 and a first through-hole 516 formed in at least a portion of the second structure 520 .
  • 2 through-holes 526 may be included, and the first through-hole 516 and the second through-hole 526 may be at least partially aligned.
  • the pivot structure 500 restrains the first structure 510 and the second structure 520 so that the support protrusion 512 is prevented from being separated from the support groove 522 .
  • a third structure 530 may be further included.
  • the third structure 530 may be disposed to surround at least a portion of the support protrusion 512 or the support groove 522 .
  • the third structure 530 is disposed between the first structure 510 and the second structure 520 , and at least partially includes a magnet, and the first structure 510 .
  • the second structure 520 may be configured to be constrained to each other using a magnetic force generated by the magnet.
  • the third structure 530 is disposed in the camera housing 410 to face the first structure 510 , or the camera assembly 530 to face the second structure 520 . 420 , and the first structure 510 is disposed between the third structure 530 and the first structure 510 when the third structure 530 is disposed in the camera housing 410 .
  • a magnetic material is included so that a magnetic attractive force acts, and the second structure 520 includes the third structure 530 and the third structure 530 when the third structure 530 is disposed in the camera assembly.
  • a magnetic material may be included so that the magnetic attraction force acts between the two structures 520 .
  • the first structure 510 is a first surface 514-1 facing the second structure 520, and is opposite to the first surface 514-1, and the camera assembly ( It includes a second surface 514 - 2 in contact with 420 , and when the third structure 530 is disposed on the camera assembly 420 , the third structure 530 may include the first structure ( It may be fixed to the first surface 514 - 1 of the 510 .
  • the second structure 520 includes a first surface 524 - 1 facing the first structure 510 , and a second surface 524 facing the first surface 524 - 1 . -2), and when the third structure 530 is disposed on the camera housing 410 , the third structure 530 may include the first surface 524 - 2) can be fixed.
  • the camera housing 410 surrounds at least a portion of a plate 410 - 1 including a planar area 418 , which faces a first direction, and at least a portion of the camera assembly 420 , and the plate 410 - 1) a frame 410-2 disposed on the planar region 418, and a cover 410-3 covering at least a portion of the camera assembly 420 and the frame 410-2, wherein the The second structure 520 may be disposed on one surface of the plate 410 - 1 facing the cover 410 - 3 .
  • the camera assembly 420 includes the camera housing 410 based on the rotation center C of the pivot structure 500 formed by the support protrusion 512 and the support groove 522 . can be rotated about
  • the rotation of the camera assembly 420 is a first rotation driving R1 ( R1 ) in which the optical axis L of the lens 431 rotates to form a predetermined angle a1 with the first direction. pitching), a second rotational driving R2 (yawing), and a third rotational driving R3 (rolling) rotating about the optical axis L of the lens 431 may be included. .
  • the support protrusion 512 may be formed in a substantially hemisphere shape.
  • the plurality of rotation driving magnetic bodies (493-1, 493-2, 493-3) is provided in the camera assembly ( 420) and the camera housing 410 may be disposed on the other one.
  • the camera assembly 420 further includes a first printed circuit board 438 electrically connected to the image sensor 439 and facing the second structure 520 ,
  • the first structure 510 may be disposed on the first printed circuit board 438 to face the second structure 520 .
  • a second printed circuit board 482 disposed outside the camera housing 410; further including, wherein the connecting member 470 passes through the through-holes 516 and 526 and passes through the second printed circuit board 482. It may extend from the first printed circuit board 438 to the second printed circuit board 482 .
  • the electronic device 300 includes a housing 310 ; a circuit board 350 disposed inside the housing 310; and a camera module 400 disposed inside the housing 310 and electrically connected to the circuit board 350 , wherein the camera module 400 includes a camera housing including a planar area 418 ( 410); disposed inside the camera housing 410 and electrically connected to a lens 431 , an image sensor 439 that is at least partially aligned with the optical axis L of the lens 431 , and the image sensor 439 .
  • a camera assembly 420 comprising a first printed circuit board 438 being a connection member 470 electrically connected to the first printed circuit board 438 and extending from the camera assembly 420 to the outside of the camera housing 410; and a pivot structure (500) connecting the camera assembly (420) and the camera housing (410) so that the camera assembly (420) is relatively rotatable with respect to the camera housing (410).
  • the pivot structure 500 is disposed on the camera assembly 420, a first structure 510 including a support protrusion 512, and the camera housing 410, the support protrusion 512 ) includes a second structure 520 including a support groove 522 in which at least a portion is rotatably accommodated, and in each of the support protrusion 512 and the support groove 522 , the connection member 470 .
  • Through-holes 516 and 526 may be formed to pass through at least a portion of the first structure 510 and the second structure 520 in a direction substantially parallel to the optical axis L of the lens 431 .
  • the pivot structure 500 restrains the first structure 510 and the second structure 520 so that the support protrusion 512 is prevented from being separated from the support groove 522 . It further includes a third structure 530 , wherein the third structure 530 surrounds at least a portion of the second structure 520 , and is disposed in the camera housing 410 to face the first structure 510 .
  • the first structure 510 at least partially includes a magnetic material so that an attractive force between the first structure 510 and the third structure 530 acts between the first structure 510 and the third structure 530 .
  • the camera module 400 is disposed outside the camera housing 410 , and a second printed circuit board 482 is electrically connected to the circuit board 350 of the electronic device 300 .
  • the connecting member (470) is the through hole from the first printed circuit board (438) to electrically connect between the first printed circuit board (438) and the second printed circuit board (482) At least a portion of the connecting member 470 that passes through 516 and 526 and extends to the second printed circuit board 482 and is disposed inside the through holes 516 and 526 is the light from the lens 431 . It may be partially aligned with the axis L.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. that one (eg first) component is “coupled” or “connected” to another (eg, second) component with or without the terms “functionally” or “communicatively” When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • the processor eg, the processor 120
  • the device may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory storage medium' is a tangible device and only means that it does not contain a signal (eg, electromagnetic wave). It does not distinguish the case where it is stored as
  • the 'non-transitory storage medium' may include a buffer in which data is temporarily stored.
  • the method according to various embodiments disclosed in this document may be provided by being included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play StoreTM) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a portion of the computer program product eg, a downloadable app
  • a machine-readable storage medium such as a memory of a manufacturer's server, a server of an application store, or a relay server. It may be temporarily stored or temporarily created.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

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Abstract

Un module de caméra selon un mode de réalisation comprend : un boîtier de caméra ; un ensemble caméra disposé à l'intérieur du boîtier de caméra et comprenant un capteur d'image ; un élément de connexion électriquement connecté au capteur d'image et s'étendant de l'ensemble caméra à l'extérieur du boîtier de caméra ; et une structure de pivot pour relier l'ensemble de caméra et le boîtier de caméra de façon à pouvoir tourner l'un par rapport à l'autre. La structure de pivot comprend : une première structure disposée dans l'ensemble caméra ; et une seconde structure disposée dans le boîtier de caméra et supportant de façon rotative la première structure. L'une de la première structure ou de la seconde structure comprend une saillie de support qui fait saillie vers l'autre structure, et l'autre structure comprend une rainure de support dans laquelle une partie de la saillie de support est logée de manière rotative, un trou traversant destiné à recevoir une partie de l'élément de raccordement pouvant être formé dans chacune de la saillie de support et de la rainure de support.
PCT/KR2021/005385 2020-04-28 2021-04-28 Module de caméra et appareil électronique le comprenant WO2021221464A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024045648A1 (fr) * 2022-08-30 2024-03-07 荣耀终端有限公司 Procédé d'assemblage de caméra frontale et structure d'assemblage, et dispositif électronique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117203582A (zh) 2021-04-29 2023-12-08 三星电子株式会社 相机模块及包括相机模块的电子装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150127792A (ko) * 2012-03-30 2015-11-18 엘지이노텍 주식회사 카메라 모듈
KR20160062003A (ko) * 2013-09-25 2016-06-01 니혼 덴산 산쿄 가부시키가이샤 흔들림 보정 기능을 구비한 광학 유닛
KR20170021682A (ko) * 2015-08-18 2017-02-28 엘지이노텍 주식회사 카메라 장치 및 광학기기
KR20170096124A (ko) * 2014-12-24 2017-08-23 미쓰미덴기가부시기가이샤 액추에이터, 카메라 모듈 및 카메라 탑재장치
JP2018169499A (ja) * 2017-03-30 2018-11-01 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150127792A (ko) * 2012-03-30 2015-11-18 엘지이노텍 주식회사 카메라 모듈
KR20160062003A (ko) * 2013-09-25 2016-06-01 니혼 덴산 산쿄 가부시키가이샤 흔들림 보정 기능을 구비한 광학 유닛
KR20170096124A (ko) * 2014-12-24 2017-08-23 미쓰미덴기가부시기가이샤 액추에이터, 카메라 모듈 및 카메라 탑재장치
KR20170021682A (ko) * 2015-08-18 2017-02-28 엘지이노텍 주식회사 카메라 장치 및 광학기기
JP2018169499A (ja) * 2017-03-30 2018-11-01 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024045648A1 (fr) * 2022-08-30 2024-03-07 荣耀终端有限公司 Procédé d'assemblage de caméra frontale et structure d'assemblage, et dispositif électronique

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