WO2021198746A1 - Enceinte à gestion thermique intégrée et emi-se améliorée - Google Patents

Enceinte à gestion thermique intégrée et emi-se améliorée Download PDF

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Publication number
WO2021198746A1
WO2021198746A1 PCT/IB2020/053618 IB2020053618W WO2021198746A1 WO 2021198746 A1 WO2021198746 A1 WO 2021198746A1 IB 2020053618 W IB2020053618 W IB 2020053618W WO 2021198746 A1 WO2021198746 A1 WO 2021198746A1
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WO
WIPO (PCT)
Prior art keywords
enclosure
heat sink
overmolding
thermal
bottom plate
Prior art date
Application number
PCT/IB2020/053618
Other languages
English (en)
Inventor
Pedro BERNARDO
Carlos N. BARBOSA
Susana SILVA
Gustavo DIAS
Luís MARTINS
Marco ESTEVES
Carlos Ribeiro
Ricardo Freitas
Filipa CARNEIRO
Nuno GONÇALVES
Marta GOMES
Rita MARQUES
Original Assignee
Bosch Car Multimedia Portugal, S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Car Multimedia Portugal, S.A. filed Critical Bosch Car Multimedia Portugal, S.A.
Publication of WO2021198746A1 publication Critical patent/WO2021198746A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0047—Casings being rigid plastic containers having conductive particles, fibres or mesh embedded therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • Present application discloses an enclosure for electronic component use, being provided with integrated thermal management and improved electromagnetic interference (EMI) / immunity shielding effectiveness (SE), through the use of unique high-performance thermoplastic compounds with tailored properties.
  • EMI electromagnetic interference
  • SE immunity shielding effectiveness
  • thermoplastics lie mainly is the fact that its use promotes weight savings in the final products, being nearly 40% lighter than aluminium for example, being also corrosion resistant.
  • thermoplastic composites is addressing the need for cost-effective and high-throughput parts. This new generation of composites is targeted to replace metals in housings and heat sinks.
  • an enclosure for electronic component use comprising: a bottom plate; at least one overmolding modular plate, physically bonded with said bottom plate through an injection molding process; at least one heat sink; at least one cooling fan, installed on the top of said at least one heat sink; wherein the combination of the heat sink with the cooling fan and the overmolding modular plate with the bottom plate is responsible for assuring the thermal management of the enclosure.
  • the bottom plate, the at least one overmolding modular plate and the at least one heat sink comprise the use of thermoplastic compounds.
  • the at least one cooling fan assures the at least one heat sink cooling by forced air convection means, said at least one cooling fan being positioned in an inclination between 15° and 35° degree angle with relation to the horizontal plane.
  • thermoplastic compounds comprise one of polybutylene terephthalate (PBT) and/or polyamide (PA66).
  • thermoplastic compounds comprise the use conductive fillers, namely, steel and/or carbon and/or graphite and/or alumina.
  • thermoplastic compounds comprise average admissible service temperatures of 85°C, and/or average heat deflection temperatures of 100°C and/or average thermal conductivity of lOW/mK.
  • thermoplastic compounds comprise shielding effectiveness of 60dB with a 2mm thickness in a 100kHz to 5GHz frequency range, or maximum surface resistivity of lOOQcm, or a maximum volume resistivity of lOQcm.
  • Present application further describes a process for injection molding of the bottom plate, comprising the steps of: installation of inserts in specific zones in the mold; heat the overmolding modular plate in a convection oven at a temperature of 140°C; insert the plate inside the mold and close the mold for approximately 30 seconds; after the temperature stabilization, the process of overmolding of the polymeric insert with the metal inserts starts, where the hot channel feeds the system though three injection points; after the injection is completed, the overmolded is cooled through the use of 11 individual water circuits, promoting uniform cooling of the part; after the cooling, 18 air extractors are used to extract the part.
  • the proposed polymeric solution allows to obtain a weight reduction improvement and overcome some shaving issues introduced in the assembly of metal housings, and for that fact, this technology introduces benefits in its development and use. It is disclosed a holistic solution for those type of products, namely enclosures for electronic component use.
  • the total thermoplastic electronic housing here proposed allows to introduce overall benefits in weight reduction, cost reduction and production waste reduction.
  • the proposed solution lays on a solution fully made of high-performance thermoplastic compounds, including thermal dissipation devices. This cost-effective electronic housing design also promotes the use of thermoplastic multifunctional materials to solve EMC and thermal management functions of the system.
  • Present application is related to the integrated design and development of an electronic device housing where main improvements are related to the overall design, operational method, thermal performance and EMI-SE insulating properties of the plastic housing, making it lighter, cheaper, cleaner (in the assembly process), and greener than the metallic solution.
  • the plastic electronic housing is totally made of high-performance thermoplastic compounds with improved electromagnetic interference / immunity shielding effectiveness, with the inclusion of thermal dissipation devices.
  • the design of the housing components is developed with a comprehensive approach, combining advanced thermal and EMI simulations, aiming to establish a tailored behavior in specific areas of interest, combining geometric features with particular behavior of high-performance thermoplastics.
  • Two thermoplastic resins with improved properties for EMI- SE and thermal dissipation are used and applied.
  • a combination of compound resins is used to optimize the combined thermal and shielding behavior.
  • the thermal environment of the complete electronic system is managed with the usage of the thermal passive diffusion associated with the housing design combined with an innovative design with high conductive thermoplastic for a convective heat exchange device.
  • thermoplastic injection molding method based on overmolding and bi-material techniques, allows the productivity increase through cycle time reduction, final part quality uplift and EMI-SE and improve the thermal dissipation behavior.
  • This processing technology is used for the production of all the parts of the electronic housing and the heat exchange device. The requirements of the manufacture process were included in the components integrated design.
  • Thermal management is assured by forced air convection, generated by an optimized fan, and heat conduction through effective conductive materials.
  • the fan promotes the cold air intake into the housing and a quick dispersion of hot air out of the housing. This inverted flow direction optimizes the system thermal performance.
  • the developed system is provided with specific locations where the heat conduction is more significant and efficient, such as the heatsink and the housing areas near the most heat generating components. In these locations, the usage of materials with higher thermal conductivity is an accomplished requirement.
  • the developed heat sink made of polymeric materials allows a significant weight reduction, once the design and phenomena of heat dissipation is optimized through geometric features, interface modelling, and heat transfer analysis between the heat sink and air.
  • the proposed optimized heatsink feature fins with an optimized relation between fins density and thickness as height of fins and base.
  • Thermal conductivity values in the range of the tested materials present significant impact on the heatsink thermal performance.
  • Typical thermal conductivity (TC) values for some polymers are 0.1 to 0.5 and they have been largely explored, 234 for aluminum, 400 for copper and 600 for graphite (all values in W/mK).
  • Thermoplastics and/or thermosets doped with conductive fillers materials have been appointed as the best option for substitute the aluminum in thermal managements.
  • polymeric matrices feature low capacity for electron conduction and phonon transportation within their chemical structure.
  • carbon, mineral and metallic fillers have been incorporated in the disclosed solution.
  • the conductivity of a filled conductive system depends on the relative concentration of filler and matrix, type of polymer, polymer viscosity, polymer crystallinity, dispersion and distribution of the filler and their compatibility with the polymeric matrix.
  • these fillers often exhibit anisotropy both in geometry and thermal conductivities. The thermal conductivities in in-plane/line direction are much higher than that of through-plane/line direction.
  • the targeted components to be developed are the ones that compose the housing (top plate, bottom plate, back plate) and the heat sink. They will share some requirements but in the end they will present some different specifications because the housing's functions are more related to mechanical and electromagnetic protection, whereas the heat sink serves for heat dissipation.
  • thermal specifications Another important aspect related to the thermal specifications is related to the service temperature that the material must withstand, which in the case of the polymers is also much smaller than in the metallic case. Regarding the thermal requirements presented in these standards, it is the "Thermal Shocks Endurance Test" which constitutes the critical condition of the material.
  • the conditions predefined aim to maximum temperature of 85°C and a minimum temperature of -40°C, both applied during lh.
  • the thermal specifications of the material are:
  • thermal conductivity of this material is also of relevant matter.
  • thermal specifications for these materials are:
  • Electromagnetic requirements are considered to be the most critical ones, as it is important that the chassis is produced in a shielding conducting material which represents a barrier to any electric, magnetic or electromagnetic field. Its function is quantitatively defined by the Shielding Effectiveness (SE), which is the ability of the material in attenuating an electromagnetic wave and is usually expressed in dB (decibels).
  • SE Shielding Effectiveness
  • EMC electromagnetic compatibility
  • the attenuation (SE) should be at least 60dB for a thickness of 2mm (which should be approximately the chassis thickness, as it is a typical value for this type of product and material).
  • the frequencies stablished for electronics protection thought the use of the proposed enclosure are within the range of 100kHz to 5GHz.
  • the SE is dependent on the electrical conductivity and the magnetic permeability of the material, and the greatest contribution is given by the electrical conductivity of the material.
  • the electrical conductivity (or surface/volume resistivity, which is more usual in material datasheets) is also of great importance because of the grounding to the Printed Circuit Board (PCB).
  • PCB Printed Circuit Board
  • the mechanical requirements can be ensured by a correct relationship between material properties vs. component geometry. Thermal and EMC requirements are much more challenging considering that the chassis material is being replaced from metal (typically heat and electrical conductive) to plastic (typical thermal and electrical insulation) . In terms of mechanical requirements, the free fall test is considered the critical one. In this specific test, the proposed enclosure is submitted to a fall from a height of lm onto a concrete floor twice in each axis (in normal and reverse direction). The mechanical requirements are always intrinsically linked to thermal ones, since the properties of these materials are strongly thermal-related. Thus, it makes more sense to address them as thermomechanical requirements.
  • the resonance point detection test and the resonance point oscillation test are both of interest.
  • the resonance point detection test determines that the resonance frequency of the chassis must be above 50Hz. This is strongly dependent on the rigidity of the system, which in turn is dependent on the material rigidity and the geometry .
  • Material selection is always a critical aspect in product development. This project aims to change from a metallic material to a polymeric. This is as huge challenge due to the difference in intrinsic properties of those type of materials (e.g. thermal, electrical and mechanical). Material selection procedure is being executed based on previous mentioned requirements, but thermal and electrical specifications impose the need to narrow the search to highly filled materials (with varying types of fillers), which brings us to the final area of requirements, that is processing .
  • thermoplastic materials specifically developed to address similar requirements, however they are not suitable for all metal substitution in terms of their intrinsic characteristics. These materials are typically composed of engineered thermoplastic resin matrices loaded or coated with conductive fillers (steel fibers, carbon fibers, graphite, alumina, etc.). It is necessary, however, to ensure good dispersion and distribution of the fillers in the matrix, since they are responsible for the mechanical strength and for the conductive (thermal or electric) path.
  • conductive fillers steel fibers, carbon fibers, graphite, alumina, etc.
  • thermoplastic compounds are very close to the specifications of the chassis, i.e. they have attenuation values of about 60dB.
  • the solution will also have to encompass geometric (such as thermal issues, for example that can be circumvented by openings in the chassis that force air convection, or mechanical issues that may be complemented by geometric features, ribs, etc.) and technological features to ensure compliance with the
  • the developed process constrained the processing temperature to a maximum of approximately 300°C, in order to reduce the number of polymer families (such as PEEK, PEI, LCP, etc.) which are normally difficult to process and highly expensive.
  • Fig. 1 - illustrates the general overview of the global concept and design of this invention displayed in the frontal view of the enclosure.
  • the main components that constitute the total housing electronics are the top plate (1), cooling fan (2), heat sink (3), main PCB (4), secondary PCB (5) and secondary PCB support plate (6).
  • the development of the proposed enclosure is based on a TPC design (top plate, back plate and bottom plate) with improved properties for EMI-SE and a total plastic heat dissipation system comprising various elements as heat sink and modular plate with high thermal conductivity.
  • Fig. 2 - illustrates the general overview of the global concept and design of this invention displayed in the back view of the enclosure. It is visible the bottom plate (7) and back plate (8) of the enclosure.
  • Fig. 3 - illustrates the exploded view of the enclosure. Referred components: top plate (1), cooling fan (2), heat sink (3), main PCB (4), secondary PCB (5), secondary PCB support plate (6), bottom plate (7), back plate (8) and overmolding modular plate (9).
  • Fig. 4 - illustrates a detailed upper view of the bottom plate (7) with the overmolding modular plate (9).
  • the thermoplastic material for thermal insert (modular plate (9) - with high thermal conductivity) should present chemical compatibility with bottom plate (EMI-SE).
  • Fig. 5 - illustrates a detailed bottom view of the bottom plate (7).
  • Fig. 6 - illustrates a detailed upper view of the developed cooling fan (2) and heat sink (3), where the eat sink is produced with a thermoplastic resin with improved thermal dissipation properties.
  • Fig. 7 - illustrates a detailed side view of the developed cooling fan (2) and heat sink (3). Description of Embodiments
  • Forming plastic is the process of transforming a specified material into a desired shape. Most plastic forming processes use either thermoplastics (soften and melt when heated) or thermoset plastics (harden when heated), usually in the form of pellets, powder, liquid components, or sheets.
  • plastics processes have three main phases: heating (to soften or melt the polymer); shaping/forming (under constraint of some kind); and cooling (so that it retains its shape).
  • PBT based resins feature an improvement in what concerns to mechanical, thermal and electric and EMI-SE insulating properties when compared with its direct metal competitor.
  • the used compounds were polybutylene terephthalate (PBT) and polyamide (PA66) based materials loaded with carbon, mineral and metallic-based fillers, which lead to average thermal conductivity values of lOW/mK. Bi-material and overmolding injection technology is used to perform the part production.
  • the enclosure or Total Plastic Chassis (TPC)
  • TPC Total Plastic Chassis
  • the ventilation grilles have circular geometry holes, once they provide more stable shielding and are easier to produce.
  • the spacing between holes has no influence on the shielding efficiency and this characteristic can be defined according to the constraints of the chassis manufacturing process.
  • the total area of the ventilation grid holes should be maximized up to a 40dB electromagnetic shield (lower limit).
  • a 40dB electromagnetic shield lower limit
  • the base line metallic system has a higher environmental impact, the material production being the main contributor, followed by the usage phase.
  • the TPC enclosure system shows the best environmental performance (in circa of 15%), being, in this case, the use phase the main contributor, followed by the material production.
  • the Fossil depletion, climate change human health and climate change ecosystems impact categories are the most significant environmental burdens of all the systems.
  • thermoplastic with the proposed compounds in the concept design enclosure, enables approximately a 45% weight reduction, when compare with the baseline system, mitigating the GWP (Global Warming Potential) and CED (Cumulative Energy Demand) environmental impacts until the usage phase. This is due to the fact that polymer matrix composites are produced through a more energy intensive process (by unit weight) than steel/aluminum, and the weight reduction doesn't mitigate this energy increase.
  • GWP Global Warming Potential
  • CED Cumulative Energy Demand
  • the heat sink was optimized regarding several geometric features that were modelled and analyzed in terms of total heat transfer rate at the interface between heat sink and air.
  • Optimized heat sink present fins with an optimized relation between fins density and thickness as height of fins and base.
  • the fan mass flow rate has been analyzed by testing several types of more effective fans. Significant differences were achieved for small flow rate, but behind 0.00125 kg/s, the thermal performance increasing is not very significant once it is not linearly dependent on the fan mass flow rate.
  • the fan orientation is installed over the heatsink in an inclination between 15° and 35° degree angle with relation to the horizontal plane.
  • the fan mass flow rate doesn't significantly affect the thermal performance, this proposed positioning helps to improve the temperature minimization.
  • the polymeric chassis reinforced with carbon fibers and carbon thermal fillers have a high potential to substitute the metallic chassis with the benefit of cost and weight reductions and consequently the contribution for the reduction of gas emissions.
  • this item For the production of this item, a mold based on hot channels was used, eliminating the existence of superficial marks on the developed piece.
  • the molding zone is produced by the combination of the bushing, cavity and three different moving elements. Since this component consists of a set of metallic inserts, before the part is produced, the inserts are placed in specific areas in the mold. After the mold is closed, the injection of molten material occurs. Here, the metal inserts are overmolded.
  • the hot channel feeding system present in the production tool is composed of four injection points (valve gates).
  • the location of entry melt was carefully selected in order to promote a filler material balance, ensuring that the melt reaches the ends of the workpiece simultaneously.
  • This balance in the filling of the part is essential to minimize the total warpage and / or deformation, resulting from the thermal expansion and contraction of the material during the injection, pressurization and cooling phases, contributing to the fulfilment of the required dimensional tolerances.
  • the temperature control system selected for the injection mold (11 individual circuits), also promotes uniform cooling of the part, using water as the main coolant.
  • the Back Plate is produced by combining the bushing, cavity and a moving element.
  • This part is produced from two types of feeding system - hot channel and cold channel.
  • the hot channel supply system it consists of a distributor, which maintains the molten material from the injection nozzle to the cold channel supply system.
  • This type of system since it is thermally controlled, allows, for each injection cycle, a reduction in the material used.
  • the cold channel feed system main feeder
  • main feeder the cold channel feed system
  • the entrance of the cast in the impression occurs from three submarine injection attacks. The location of these points ensures that the ends of the part fill simultaneously.
  • a mold based on hot channels was used being produced by the combination of the bushing and the cavity.
  • the hot channel feeding system present in the production tool consists of only one injection gate (valve gate).
  • the casting inlet location was carefully selected, allowing it to reach the ends of the part simultaneously.
  • the number of pins on the surface of the part was carefully selected, in order not only to facilitate the filling of this component, but also to better trap this part to the Bottom Plate. Since the overmolding modular plate is a overmolded piece to the Bottom Plate, it is essential that there is no mark of the injection point, otherwise the pins will not all be at the same level and, consequently, the connection between the two plates is more difficult.
  • the adopted system comprises the use of water circuits, to ensure a constant temperature of the distributor, and resistances to control the temperature of the fixed and moving parts of the mold. To extract the overmolding modular plate, the use of 10 extractors is required .
  • a mold based on hot channels was used being produced through the combination of the bushing, cavity and three distinct mobile elements.
  • This component comprises a polymeric insert (the overmolding modular plate piece) and a set of metallic inserts. Before the piece to be produced, the placing of inserts in specific zones in the mold is processed.
  • the polymeric insert in order to reduce the temperature difference between the overmolding modular plate (room temperature) and the Bottom Plate mold walls, since different cooling rates promote warping, it is essential to heat the polymeric insert in a convection oven (140°C) for a few minutes. After the heating phase, the plate is placed over the mold.
  • the overmolding modular plate piece being made of a polymeric and ferrous material, is attracted by the magnets present in the mold. This feature allows the part to be fixed to the mold and its position remains defined after closing it. Then, the mold remains closed for approximately 30 seconds. After temperature stabilization, the overmolding of the polymeric insert and the metal inserts processes takes place. Here, there is also a mechanical trap between the two plates.
  • the hot channel feeding system present in the production tool consisting of three injection points (valve gates), allows the melt to reach the ends of the part simultaneously. This balance in the part filling is essential to minimize the total warpage and / or deformation.
  • This part is cooled through 11 individual water circuits. The respective circuits and the layouts are responsible for promoting a uniform cooling of the part. Due to the existence of several melt fronts, and to eliminate the air trapped at the top of the injected part, an efficient gas exhaust system was implemented. To extract the component, 18 extractors were used, some of which, in addition to contributing to the extraction itself, have the particularity of molding a set of geometric details in the piece. In this piece it was also machined one set of semicircles with the aim of facilitating the assembly process of various components, involved in the final product.
  • the Heat Sink component is produced by combining the bushing, cavity and a set of molding inserts to reproduce certain geometric details in the piece.
  • This part is produced from two types of feeding system - hot channel and cold channel.
  • the hot channel supply system it consists of a distributor, which maintains the molten material from the injection nozzle to the cold channel supply system. After the melt reaches the cold channel feed system, melt enters the part through a slit. It is this type of attack that allows the creation of a uniform flow front, obtaining complete and properly compacted moldings.
  • the material in this part features high thermal conductivity, and taking into account the height of the vane assembly in the heat sink, it is crucial to promote melt inlet along the width of the workpiece.
  • the material would not be able to reach the opposite end due to early cooling.
  • resistances were used to control the temperature of the fixed and moving parts of the mold. It is important to note that one of the resistors penetrates the interior of the molding inserts in order to facilitate the flow of molten material in the region of the fins. For the extraction, 22 extractors were necessary and, to prevent the trapping of the piece in the mold, 6 compression springs were used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention concerne une enceinte pour utilisation de composant électronique, comprenant une gestion thermique intégrée et une interférence électromagnétique améliorée (EMI)/efficacité de protection contre l'immunité (SE), par l'utilisation de composés thermoplastiques à haute performance uniques ayant des propriétés adaptées.
PCT/IB2020/053618 2020-04-02 2020-04-16 Enceinte à gestion thermique intégrée et emi-se améliorée WO2021198746A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PT116231 2020-04-02
PT11623120 2020-04-02

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WO2021198746A1 true WO2021198746A1 (fr) 2021-10-07

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494651A (en) 1983-04-19 1985-01-22 W. R. Grace & Co., Cryovac Div. Electrically conductive anti-static work station
US20110103021A1 (en) * 2008-03-20 2011-05-05 Robert Hendrik Catharina Janssen Heatsinks of thermally conductive plastic materials
US20110235255A1 (en) * 2008-12-04 2011-09-29 Hewlett-Packard Development Company, L.P. Carbon Laminated Enclosure
US8472203B2 (en) 2007-09-04 2013-06-25 Apple Inc. Assembly of a handheld electronic device
US20190159371A1 (en) * 2017-11-20 2019-05-23 Ticona Llc Electronic Module for Use in an Automotive Vehicle

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494651A (en) 1983-04-19 1985-01-22 W. R. Grace & Co., Cryovac Div. Electrically conductive anti-static work station
US8472203B2 (en) 2007-09-04 2013-06-25 Apple Inc. Assembly of a handheld electronic device
US20110103021A1 (en) * 2008-03-20 2011-05-05 Robert Hendrik Catharina Janssen Heatsinks of thermally conductive plastic materials
US20110235255A1 (en) * 2008-12-04 2011-09-29 Hewlett-Packard Development Company, L.P. Carbon Laminated Enclosure
US20190159371A1 (en) * 2017-11-20 2019-05-23 Ticona Llc Electronic Module for Use in an Automotive Vehicle

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