WO2021190208A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2021190208A1
WO2021190208A1 PCT/CN2021/076915 CN2021076915W WO2021190208A1 WO 2021190208 A1 WO2021190208 A1 WO 2021190208A1 CN 2021076915 W CN2021076915 W CN 2021076915W WO 2021190208 A1 WO2021190208 A1 WO 2021190208A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
temperature sensor
circuit board
functional module
light
Prior art date
Application number
PCT/CN2021/076915
Other languages
English (en)
French (fr)
Inventor
梁源标
段俊杰
Original Assignee
维沃移动通信有限公司
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Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2021190208A1 publication Critical patent/WO2021190208A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
    • G01J5/0025—Living bodies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2219/00—Thermometers with dedicated analog to digital converters

Definitions

  • the present invention relates to the technical field of communication equipment, and in particular to an electronic device.
  • the invention discloses an electronic device, which can solve the current problem of poor convenience in body temperature detection.
  • the present invention is implemented as follows:
  • the present invention discloses an electronic device, including:
  • a housing the housing is provided with an opening
  • a circuit board, the circuit board is arranged in the housing;
  • a temperature sensor the temperature sensor is arranged in the housing, and the temperature sensor is arranged opposite to the opening, and the temperature sensor is electrically connected with the circuit board.
  • the temperature sensor is arranged in the housing, and the temperature sensor is arranged opposite to the opening, and at the same time, the temperature sensor is electrically connected to the circuit board.
  • the object to be detected outside the electronic device can be sensed by the temperature sensor through the opening, so that the electronic device can measure the temperature of the object to be detected outside the electronic device.
  • users generally carry electronic equipment with them.
  • the user When the user needs to take body temperature measurement, the user only needs to use the electronic device to complete the temperature measurement, preventing the user from needing to go to a specific place to take the temperature measurement when the temperature measurement is required. The inconvenience caused will further facilitate the user to measure the body temperature, and finally solve the current problem of poor convenience in body temperature detection.
  • Fig. 1 is a partial schematic diagram of an electronic device disclosed in an embodiment of the present invention
  • FIG. 2 is a partial cross-sectional view of an electronic device disclosed in an embodiment of the present invention.
  • Figure 3 is a partial structural view of an electronic device disclosed in an embodiment of the present invention.
  • FIG. 4 is a structural view of a flexible circuit board disclosed in an embodiment of the present invention.
  • Fig. 5 is a schematic diagram of Fig. 4 from another perspective.
  • an embodiment of the present invention discloses an electronic device.
  • the disclosed electronic device includes a housing 100, a circuit board 200 and a temperature sensor 300.
  • the housing 100 is a basic component of the electronic device, and the housing 100 can provide an installation basis for other components of the electronic device.
  • the housing 100 is provided with an opening 110.
  • the opening 110 may be opened on the frame of the housing 100 or on the back cover of the housing 100.
  • the embodiment of the present invention does not limit the opening 110 in the housing. The specific position on the body 100.
  • the circuit board 200 is arranged in the housing 100.
  • the circuit board 200 can be the main board of the electronic device or the sub-board of the electronic device.
  • the circuit board 200 can also be a circuit board separately electrically connected to the temperature sensor 300 in the electronic device. There is no limitation on this in the embodiment of the present invention.
  • the temperature sensor 300 can detect the temperature of the object to be detected outside the electronic device.
  • the object to be detected can be a human body, an animal or an object.
  • the temperature of the object to be detected is the body temperature of the human body.
  • the temperature of the object to be detected is the body temperature of the animal, and in the case that the object to be detected is not a human body or an animal, the temperature of the object to be detected is the temperature of the object.
  • the body temperature of the human body is 36.5 degrees Celsius
  • the wavelength of the infrared light radiated by the human body is about 6-12um.
  • the temperature sensor 300 can sense the infrared light radiated by the human body to detect the body temperature of the human body. Specifically, the temperature sensor 300 is disposed in the housing 100, and the temperature sensor 300 is disposed opposite to the opening 110, so that infrared light outside the electronic device can pass through the opening 110, so that the temperature sensor 300 can sense the infrared light outside the electronic device. , Thereby causing the temperature sensor 300 to measure the human body temperature corresponding to the infrared light.
  • the electronic device may also include a display screen.
  • the display screen is electrically connected to the circuit board 200, and the temperature sensor 300 is electrically connected to the circuit board 200.
  • the temperature sensor 300 After the temperature sensor 300 senses the infrared light radiated by the human body, the temperature sensor 300 performs digital sampling. Technology, the infrared light is converted into a digital signal, the temperature sensor 300 then transmits the digital signal to the circuit board 200, and the circuit board 200 converts the digital signal into a display signal and transmits it to the display screen, so that the body temperature of the human body is displayed on the display screen , Thus facilitating the user to measure body temperature.
  • the temperature sensor 300 is disposed in the housing 100, and the temperature sensor 300 is disposed opposite to the opening 110, and at the same time, the temperature sensor 300 is electrically connected to the circuit board 200.
  • the object to be detected outside the electronic device can be sensed by the temperature sensor 300 through the opening 110, so that the electronic device can measure the temperature of the object to be detected outside the electronic device.
  • users generally carry electronic equipment with them.
  • the user When the user needs to take body temperature measurement, the user only needs to use the electronic device to complete the temperature measurement, preventing the user from needing to go to a specific place to take the temperature measurement when the temperature measurement is required. The inconvenience caused will further facilitate the user to measure the body temperature, and finally solve the current problem of poor convenience in body temperature detection.
  • the housing 100 is provided with an opening 110 so that the temperature sensor 300 can detect the temperature of the object to be detected outside the electronic device through the opening 110, but the opening of the opening 110 on the housing 100 may cause external impurities (such as dust and Water vapor) enters the inside of the electronic equipment, affecting the reliability and stability of the internal components of the electronic equipment, and ultimately resulting in poor protection of the electronic equipment.
  • the electronic device may further include a first functional module 400, the first functional module 400 may be provided with a light-transmitting area 410, and the first functional module 400 is provided in the housing 100 , And the first functional module 400 covers the opening 110, and the light-transmitting area 410 is disposed opposite to the temperature sensor 300.
  • the first functional module 400 can cover the opening 110 to prevent external impurities from entering the inside of the electronic device, thereby improving the reliability and stability of the internal components of the electronic device, and thereby improving the protection effect of the electronic device.
  • the light-transmitting area 410 does not affect the normal operation of the temperature sensor 300, so that the temperature sensor 300 can normally detect the temperature of the object to be detected outside the electronic device.
  • the first functional module 400 for example, a camera module, a decorative cover, a fingerprint module, a button, etc.
  • the type of the first functional module 400 is not limited in the embodiment of the present invention.
  • the electronic device may further include a first light-transmitting member 500
  • the first functional module 400 may be provided with a through hole
  • the first light-transmitting member 500 is disposed on the first functional module 400
  • the first light-transmitting member 500 covers Through holes to form a light-transmitting area 410.
  • the first light-transmitting member 500 can cover the through hole to prevent external impurities from entering the inside of the electronic device, thereby improving the reliability and stability of the internal components of the electronic device.
  • the formation of the light-transmitting area 410 is relatively simple, and the structure is simple, and it is easy to set up, thereby simplifying the structure of the electronic device and facilitating the design of the designer.
  • the light-transmitting area 410 can also be formed in other ways.
  • the electronic device can also include a second functional module.
  • the second functional module is disposed on the housing 100 and can have a first An assembly gap, the first assembly gap may be covered with the second light-transmitting part, and the temperature sensor 300 is arranged opposite to the second light-transmitting part.
  • the temperature sensor 300 can use the first assembly gap between the second functional module and the housing 100 to detect the temperature of the object to be detected outside the electronic device, avoiding openings in the housing 100, thereby making the appearance of the electronic device
  • the integration is better, and the appearance of the electronic device is improved.
  • the second light-transmitting member can seal the first assembly gap to prevent external impurities from entering the inside of the electronic device, thereby improving the reliability and stability of the internal components of the electronic device, and thereby improving the protection effect of the electronic device.
  • the temperature sensor 300 may not be able to be arranged opposite to the second light-transmitting part.
  • the electronic device may further include a third functional module.
  • the third functional module is disposed on the housing 100 and may have a second assembly gap with the housing 100.
  • the second assembly gap is covered with a third light-transmitting part, a light guide part is arranged in the second assembly gap, and the light guide part has an extension part, and the extension part is arranged opposite to the temperature sensor 300.
  • the temperature sensor 300 can sense the infrared light entering the housing 100 from the second assembly gap through the light guide.
  • the temperature sensor 300 can also detect the infrared light that does not need to be arranged opposite to the third light-transmitting part. The temperature of the object to be detected outside the electronic device.
  • this solution can also avoid opening openings on the housing 100, so that the appearance of the electronic device is better, thereby improving the appearance of the electronic device, and the third light-transmitting member can seal the second assembly gap to prevent External impurities enter the inside of the electronic device, thereby improving the reliability and stability of the internal components of the electronic device, and thereby making the protection effect of the electronic device better.
  • the forming method of the light-transmitting region 410 is not limited.
  • the first light-transmitting member 500 may be a chalcogenide glass lens, because the chalcogenide glass lens has a higher transmittance of infrared light, so that more infrared light can pass through the first light-transmitting member 500 and be heated.
  • the sensor 300 detects, thereby making the temperature value measured by the temperature sensor 300 more accurate.
  • the first light-transmitting member 500 covers the through hole to form the light-transmitting area 410.
  • the side of the first functional module 400 facing away from the temperature sensor 300 may be provided with a first mounting groove 420.
  • the light member 500 is disposed in the first installation groove 420.
  • the first installation groove 420 can provide an installation position for the first light-transmitting member 500 to facilitate the installation of the first light-transmitting member 500 on the first functional module 400.
  • the first mounting groove 420 can limit the first light-transmitting member 500 to prevent the position of the first light-transmitting member 500 from changing when the electronic device shakes or when the electronic device is impacted.
  • the coverage effect of a light-transmitting member 500 on the through hole becomes poor, causing external impurities to enter the inside of the electronic device, so that the protection effect of the electronic device is better.
  • the side of the first functional module 400 facing away from the temperature sensor 300 is the side of the first functional module 400 facing the outside of the electronic device.
  • the side of the first functional module 400 facing the outside may be provided with a second installation groove, the notch of the second installation groove forms a through hole, and the temperature sensor 300 is arranged in the second installation groove.
  • the first light-transmitting member 500 covers the notch of the second mounting groove.
  • the maintenance personnel can take out the temperature sensor 300 without disassembling the housing 100 of the electronic device, which reduces the workload of the maintenance personnel when maintaining or repairing the temperature sensor 300, thereby improving the maintainability of the electronic device.
  • the side of the first functional module 400 facing the outside refers to the side of the first functional module 400 facing the outside of the electronic device.
  • first installation groove 420 or the second installation groove is not limited to only being provided with the temperature sensor 300, that is, the first installation groove 420 or the second installation groove may also be provided with other components, such as a camera, an optical The fingerprint module, the fill light, etc., are not limited in the embodiment of the present invention.
  • the first installation groove 420 or the second installation groove further includes a camera
  • the camera and the temperature sensor 300 are arranged side by side, and both the camera and the temperature sensor 300 are covered by the first light-transmitting member 500, so that Reduce the number of openings in the electronic device, and improve the appearance consistency of the electronic device.
  • the temperature sensor 300 includes a first sensing module
  • the camera includes a second sensing module, wherein the first sensing module may be a ring-shaped device, and the first sensing module is arranged around the second sensing module, so that The second sensor module of the camera is relatively distributed with the central area of the first light-transmitting member 500, so that the electronic device can further have an excellent image acquisition function on the basis of realizing temperature detection.
  • the through hole in the above-mentioned embodiment may have a first side wall, and the first side wall may have a side wall structure arranged obliquely.
  • the inclination angle of the first side wall can be set to be the same as the radiation inclination angle of the light signal emitted by the light-emitting part, so that the detection range of the temperature sensor 300 can be larger.
  • first light-transmitting member 500 may be connected to the first functional module 400 through the first adhesive layer 600, that is, the first light-transmitting member 500 is disposed on the first functional module 400 by bonding.
  • the bonding method is relatively simple and convenient to implement. At the same time, the bonded first light-transmitting member 500 and the first functional module 400 are reliably connected.
  • the surface of the first light-transmitting member 500 away from the temperature sensor 300 is away from the first functional module 400
  • the surface of the temperature sensor 300 is coplanar to prevent the surface of the first functional module 400 facing the outside of the electronic device from being uneven and affecting the user's hand feeling, thereby further improving the appearance integration of the electronic device, so that the appearance of the electronic device is more beautiful, and thereby improving User experience.
  • the surface of the first light-transmitting member 500 that faces away from the temperature sensor 300 is the surface that constitutes the exterior surface of the electronic device.
  • the surface of the first functional module 400 that faces away from the temperature sensor 300 is also the surface that constitutes the exterior surface of the electronic device. surface.
  • the side of the first functional module 400 facing the temperature sensor 300 may be provided with a third mounting groove 430, and the through hole is opened in the bottom of the third mounting groove 430 and penetrates the first function.
  • the module 400 and the temperature sensor 300 are disposed in the third mounting groove 430, so that the thickness of the stack of the first functional module 400 and the temperature sensor 300 is small, so that the thickness of the electronic device can be small, so that the electronic device faces
  • the direction of thinness and lightness is developed to meet users' requirements for thinness and lightness of electronic devices, thereby enhancing the user experience.
  • the temperature sensor 300 can be connected to the first functional module 400 through the second adhesive layer 700, that is to say, the temperature sensor 300 is disposed on the first functional module 400 by means of adhesion. It is simple and convenient to implement. At the same time, the bonded temperature sensor 300 is reliably connected to the first functional module 400.
  • the temperature sensor 300 is electrically connected to the circuit board 200.
  • the electronic device may further include a flexible circuit board 800, and the temperature sensor 300 and the circuit board 200 may be electrically connected through the flexible circuit board 800.
  • the flexible circuit board 800 can be flexibly set according to the specific spatial layout inside the electronic device, thereby reducing the design difficulty of the designer.
  • the flexible circuit board 800 has the advantages of high wiring density, light weight and thin thickness.
  • the flexible circuit board 800 and the circuit board 200 are directly connected by welding.
  • this method is more complicated and inconvenient to operate when the flexible circuit board 800 needs to be replaced due to damage.
  • the flexible circuit board 800 may be electrically connected to the circuit board 200 through a board-to-board connector.
  • the connection of the board-to-board connector is reliable, and the flexible circuit board 800 can be detachably connected to the circuit board 200, so that the replacement operation of the flexible circuit board 800 is simple, and the maintainability of the electronic device is improved.
  • the flexible circuit board 800 has a bending section, which is formed by bending a part of the structure of the flexible circuit board 800, so that the flexible circuit board 800 can be bent. Avoid parts inside electronic equipment.
  • the shape of the flexible circuit board 800 can be flexibly selected according to the specific spatial layout inside the electronic device, so that the flexible circuit board 800 can better avoid the internal components of the electronic device, thereby reducing the difficulty of stacking the internal components of the electronic device.
  • the flexible circuit board 800 may include at least a first flexible section, a second flexible section, and a third flexible section, and the second flexible section is a bending section, and the first flexible section, the second flexible section, and the third flexible section are sequentially Connected, so that the flexible circuit board 800 has a bent structure, so that the flexible circuit board 800 can avoid the internal components of the electronic device.
  • the flexible circuit board 800 when the flexible circuit board 800 is electrically connected to the circuit board 200 through a board-to-board connector, the flexible circuit board 800 can have a longer length, which is convenient for the installer to control the connection or separation of the board-to-board connector and the circuit board 200. It is avoided that the length of the flexible circuit board 800 is short, which causes the board-to-board connector to be pulled by the flexible circuit board 800 and is difficult to connect to or separate from the circuit board 200, thereby improving the mountability of the electronic device.
  • the flexible circuit board 800 may include a main body portion 810 and a first reinforcing plate 820.
  • the first end of the main body portion 810 is electrically connected to the temperature sensor 300, and the second end of the main body portion 810 is electrically connected to the circuit board. 200 is electrically connected, and the surface of the first end away from the temperature sensor 300 is provided with a first reinforcing plate 820.
  • the first reinforcement plate 820 can increase the strength of the temperature sensor 300, so that the temperature sensor 300 has a higher strength.
  • the first reinforcement plate 820 can prevent the position of the temperature sensor 300 from changing This prevents the temperature sensor 300 from colliding with other components inside the electronic device, causing damage to other components inside the electronic device or the temperature sensor 300, thereby improving the reliability of the electronic device.
  • the flexible circuit board 800 may further include a second reinforcing plate 830, and a second reinforcing plate 830 is provided on the surface of the second end away from the circuit board 200.
  • the second reinforcing plate 830 can prevent the connection position of the flexible circuit board 800 and the circuit board 200 from changing, thereby preventing the flexible circuit board 800 from being separated from the circuit board 200, thereby improving the flexible circuit The reliability of the connection between the board 800 and the circuit board 200.
  • the electronic devices disclosed in the embodiments of the present invention may be devices such as smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), and electronic game consoles.
  • the embodiments of the present invention do not limit the specific types of electronic devices.

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Abstract

本发明公开一种电子设备，所公开的电子设备包括：壳体(100)，所述壳体(100)开设有开口(110)；电路板(200)，所述电路板(200)设置于所述壳体(100)内；温度传感器(300)，所述温度传感器(300)设置于所述壳体(100)内，且所述温度传感器(300)与所述开口(110)相对设置，所述温度传感器(300)与所述电路板(200)电连接。

Description

电子设备
交叉引用
本申请要求在2020年03月27日提交中国专利局、申请号为202010233940.0、发明名称为“电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本发明涉及通信设备技术领域，尤其涉及一种电子设备。
背景技术
随着电子设备的快速发展，电子设备的应用越来越广泛，诸如手机、平板电脑等电子设备在人们的工作、生活、娱乐等方面发挥着越来越多的作用。
在目前新冠病毒疫情的环境下，体温检测的需求激增。通常情况下，用户没有随身携带体温探测器的习惯，所以用户难以随时进行体温测量，同时，现有技术中常用的体温探测器便携性较差，导致用户难以随身携带体温探测器，使得用户在需要进行体温测量时，需要专门到特定的场所进行体温测量，体温测量非常不便。
发明内容
本发明公开一种电子设备，能够解决目前体温检测便利性较差的问题。
为解决上述技术问题，本发明是这样实现的：
第一方面，本发明公开一种电子设备，包括：
壳体，所述壳体开设有开口；
电路板，所述电路板设置于所述壳体内；
温度传感器，所述温度传感器设置于所述壳体内，且所述温度传感器与所述开口相对设置，所述温度传感器与所述电路板电连接。
本发明采用的技术方案能够达到以下有益效果：
本发明实施例公开的电子设备中，温度传感器设置于壳体内，且温度传感器与开口相对设置，同时，温度传感器与电路板电连接。电子设备外部的待检测对象能够通过开口被温度传感器感应，从而使得该电子设备能够测量电子设备外部待检测对象的温度。同时，用户一般会随身携带电子设备，在用户需要进行体温测量时，用户仅需使用该电子设备便可以完成体温的测量，防止用户在需要进行体温测量时，需要专门到特定的场所进行体温测量所造成的不便，进而方便用户进行体温的测量，最终解决目前体温检测便利性较差的问题。
附图说明
为了更清楚地说明本发明实施例或背景技术中的技术方案，下面将对实施例或背景技术描述中所需要使用的附图作简单的介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例公开的电子设备的局部示意图；
图2为本发明实施例公开的电子设备的局部剖视图；
图3为本发明实施例公开的电子设备的部分结构视图；
图4为本发明实施例公开的柔性电路板的结构视图；
图5为图4在另一个视角下的示意图。
附图标记说明：
100-壳体、110-开口；
200-电路板；
300-温度传感器；
400-第一功能模组、410-透光区域、420-第一安装槽、430-第三安装槽；
500-第一透光件；
600-第一粘接层；
700-第二粘接层；
800-柔性电路板、810-主体部、820-第一加强板、830-第二加强板。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下结合附图，详细说明本发明各个实施例公开的技术方案。
请参考图1至图5，本发明实施例公开一种电子设备，所公开的电子设备包括壳体100、电路板200和温度传感器300。
其中，壳体100为电子设备的基础构件，壳体100能够为电子设备的其他部件提供安装基础。在本发明实施例中，壳体100开设有开口110，该开口110可以开设于壳体100的边框上，也可以开设在壳体100的后盖上，本发明实施例不限制开口110在壳体100上的具体位置。
电路板200设置于壳体100内，该电路板200可以为电子设备的主板，也可以是电子设备的副板，该电路板200还可以为电子设备中单独与温度传感器300电连接的电路板，本发明实施例中对此不做限制。
温度传感器300可检测电子设备外部的待检测对象的温度，待检测对象可以为人体，动物或物体，在待检测对象为人体的情况下，待检测对象的温度为人体的体温，在待检测对象为动物的情况下，待检测对象的温度为动物的体温，在待检测对象不为人体或动物的情况下，待检测对象的温度为物体的温度。以人体为例，人体的体温在36.5摄氏度，人体通过热辐射出来的红外光的波长在6～12um左右，温度传感器300可以感应到人体辐射的红外光，从而检测量出人体的体温。具体地，温度传感器300设置于壳体100内，且温度传感器300与开口110相对设置，以使电子设备外部的红外光能够通过开口110，从而使得温度传感器300可以感应到电子设备外部的红外光，进 而使得温度传感器300测量出该红外光所对应的人体体温。
进一步地，电子设备还可以包括显示屏，显示屏与电路板200电连接，且温度传感器300与电路板200电连接，在温度传感器300感应到人体辐射的红外光之后，温度传感器300通过数字采样技术，将红外光转换为数字信号，温度传感器300然后将数字信号传递至电路板200，电路板200将数字信号转换为显示信号，并传递至显示屏，从而使得人体的体温在显示屏上显示，进而方便用户进行体温的测量。
本发明实施例公开的电子设备中，温度传感器300设置于壳体100内，且温度传感器300与开口110相对设置，同时，温度传感器300与电路板200电连接。电子设备外部的待检测对象能够通过开口110被温度传感器300感应，从而使得该电子设备能够测量电子设备外部待检测对象的温度。同时，用户一般会随身携带电子设备，在用户需要进行体温测量时，用户仅需使用该电子设备便可以完成体温的测量，防止用户在需要进行体温测量时，需要专门到特定的场所进行体温测量所造成的不便，进而方便用户进行体温的测量，最终解决目前体温检测便利性较差的问题。
如上文所述，壳体100开设有开口110，以使温度传感器300能够通过该开口110检测电子设备外部待检测对象的温度，但是壳体100上开口110的开设会导致外部杂质(例如灰尘和水汽)进入到电子设备内部，影响电子设备内部器件的可靠性与稳定性，最终会导致电子设备的防护效果较差。基于此，在一种可选的实施例中，电子设备还可以包括第一功能模组400，第一功能模组400可以设置有透光区域410，第一功能模组400设置于壳体100，且第一功能模组400覆盖开口110，透光区域410与温度传感器300相对设置。此实施例中，第一功能模组400能够覆盖开口110，防止外部杂质进入到电子设备内部，从而提高电子设备内部器件的可靠性与稳定性，进而使得电子设备的防护效果较好。
需要说明的是，透光区域410不会影响温度传感器300正常工作，进而使得温度传感器300能够正常检测电子设备外部待检测对象的温度。第一功能模组400的种类可以有多种，例如，摄像头模组、装饰盖、指纹模组和按键等，本发明实施例中对第一功能模组400的种类不做限制。
具体地，电子设备还可以包括第一透光件500，第一功能模组400可以开设有通孔，第一透光件500设置于第一功能模组400，且第一透光件500覆盖通孔以形成透光区域410。此种情况下，第一透光件500能够覆盖通孔，防止外部杂质进入到电子设备内部，从而提高电子设备内部器件的可靠性与稳定性。同时，此种透光区域410的形成方式较为简单，且结构简单，易于设置，从而简化电子设备的结构，方便设计人员设计。
当然，透光区域410还可以有其他的形成方式，可选地，电子设备还可以包括第二功能模组，第二功能模组设置于壳体100，且与壳体100之间可以具有第一装配间隙，第一装配间隙可以覆盖有第二透光件，温度传感器300与第二透光件相对设置。该方案中，温度传感器300能够利用第二功能模组 与壳体100之间的第一装配间隙检测电子设备外部待检测对象的温度，避免在壳体100上开设开口，从而使得电子设备的外观一体性较好，进而提高电子设备的外观美观性。同时，第二透光件能够密封该第一装配间隙，防止外部杂质进入到电子设备内部，从而提高电子设备内部器件的可靠性与稳定性，进而使得电子设备的防护效果较好。
由于电子设备内部的部件较多，导致电子设备内部部件堆叠难度较高，因此，温度传感器300并不一定能够设置在与第二透光件相对的设置。基于此，在一种可选的实施例中，电子设备还可以包括第三功能模组，第三功能模组设置于壳体100，且与壳体100之间可以具有第二装配间隙，第二装配间隙覆盖有第三透光件，第二装配间隙内设置有导光件，且导光件具有延伸部，延伸部与温度传感器300相对设置。该方案中，温度传感器300能够通过导光件感应从第二装配间隙进入壳体100内的红外光，此种情况下，温度传感器300无需设置在与第三透光件相对的设置也能检测电子设备外部待检测对象的温度。同时，该方案也能够避免在壳体100上开设开口，从而使得电子设备的外观一体性较好，进而提高电子设备的外观美观性，且第三透光件能够密封该第二装配间隙，防止外部杂质进入到电子设备内部，从而提高电子设备内部器件的可靠性与稳定性，进而使得电子设备的防护效果较好。
需要说明的是，本发明实施例中对透光区域410的形成方式不做限制。第一透光件500的种类可以有多种，例如，玻璃镜片和树脂镜片等。可选地，第一透光件500可以为硫系玻璃镜片，因为硫系玻璃镜片对红外光的透过率较高，从而能够使得红外光较多地透过第一透光件500被温度传感器300检测到，进而使得温度传感器300所测量的温度值较为准确。
如上文所述，第一透光件500覆盖通孔以形成透光区域410。具体地，第一功能模组400背离温度传感器300的一侧可以开设有第一安装槽420，通孔开设于第一安装槽420的槽底，且贯穿第一功能模组400，第一透光件500设置于第一安装槽420。第一安装槽420能够为第一透光件500提供安装位置，方便在第一功能模组400上设置第一透光件500。同时，第一安装槽420能够对第一透光件500起到一定的限位作用，防止在电子设备晃动时或在电子设备受到冲击时，第一透光件500的位置发生变化，导致第一透光件500对通孔的覆盖效果变差，致使外部杂质进入到电子设备内部，从而使得电子设备的防护效果较好。需要说明的是，第一功能模组400背离温度传感器300的一侧为第一功能模组400朝向电子设备外部的一侧。
在一种可选的实施例中，第一功能模组400朝向外部的一侧可以开设有第二安装槽，第二安装槽的槽口形成通孔，温度传感器300设置于第二安装槽的槽底，第一透光件500覆盖第二安装槽的槽口。此方案中，维护人员无需拆卸电子设备的壳体100便可以取出温度传感器300，减少维护人员在维护或检修温度传感器300时的工作量，从而提高电子设备的可维护性。需要说明的是，第一功能模组400朝向外部的一侧是指第一功能模组400朝向电子设备外部的一侧。
当然，第一安装槽420或第二安装槽中并不局限于只设置有温度传感器300，也就是说，第一安装槽420或第二安装槽中还可以设置有其他部件，例如摄像头、光学指纹模组和补光灯等，本发明实施例中对此不做限制。
可选的，在第一安装槽420或第二安装槽中还包括摄像头的情况下，摄像头和温度传感器300并列设置，且摄像头与温度传感器300均被第一透光件500所覆盖，从而可以减少电子设备的开孔数量，提升电子设备的外观一致性。进一步地，温度传感器300包括第一感应模组，摄像头包括第二感应模组，其中，第一感应模组可以为环状器件，且第一感应模组围绕第二感应模组设置，从而可以使得摄像头的第二感应模组与第一透光件500的中心区域相对分布，使得电子设备在可以实现温度检测的基础上，还能够进一步地具有优异的图像采集功能。
此外，需要说明的是，上述实施例中的通孔可以具有第一侧壁，该第一侧壁可以为倾斜设置的侧壁结构，温度传感器300可以具有向外辐射光信号的发光部以及用于接收反射信号的反射部，在这种情况下，第一侧壁的倾角可以设置为与发光部发出的光信号的辐射倾角相同，从而可以使得温度传感器300的检测范围更大。
进一步地，第一透光件500可以通过第一粘接层600与第一功能模组400相连，也就是说，第一透光件500通过粘接的方式设置于第一功能模组400上，粘接的方式较为简单，且方便实施，同时，粘接后的第一透光件500与第一功能模组400连接可靠。
为了进一步提高电子设备的外观一体性，以使电子设备的外观更为美观，在一种可选的实施例中，第一透光件500背离温度传感器300的表面与第一功能模组400背离温度传感器300的表面共面，防止第一功能模组400朝向电子设备外部的表面凹凸不平，影响用户手感，从而进一步提高电子设备的外观一体性，以使电子设备的外观更为美观，进而提升用户的使用体验。需要说明的是，第一透光件500背离温度传感器300的表面为构成电子设备的外观面的表面，当然，第一功能模组400背离温度传感器300的表面也为构成电子设备的外观面的表面。
在一种可选的实施例中，第一功能模组400朝向温度传感器300的一侧可以开设有第三安装槽430，通孔开设于第三安装槽430的槽底，且贯穿第一功能模组400，温度传感器300设置于第三安装槽430内，以使第一功能模组400与温度传感器300的堆叠厚度较小，从而能够使得电子设备的厚度较小，以使电子设备朝着轻薄化的方向发展，满足用户对电子设备轻薄化的要求，进而提升用户的使用体验。
进一步地，温度传感器300可以通过第二粘接层700与第一功能模组400相连，也就是说，温度传感器300通过粘接的方式设置于第一功能模组400上，粘接的方式较为简单，且方便实施，同时，粘接后的温度传感器300与第一功能模组400连接可靠。
在本发明实施例中，温度传感器300与电路板200电连接，可选地，电 子设备还可以包括柔性电路板800，温度传感器300与电路板200可以通过柔性电路板800电连接。柔性电路板800能够根据电子设备内部的具体空间布局灵活设置，从而能够降低设计人员的设计难度。同时，柔性电路板800具有配线密度高、重量轻和厚度薄的优点。
一般情况下，柔性电路板800与电路板200直接焊接相连，但是，此种方式在柔性电路板800因损坏需要更换时操作较为复杂不便。基于此，在一种可选的实施例中，柔性电路板800可以通过板对板连接器与电路板200电连接。板对板连接器的连接可靠，且能够使得柔性电路板800与电路板200可拆卸相连，使得柔性电路板800的更换操作简单，从而提高电子设备的可维护性。
为了使柔性电路板800能够在避让电子设备内部的部件，具体地，柔性电路板800具有弯折段，弯折段由柔性电路板800的部分结构经过折弯形成，以使柔性电路板800能够避让电子设备内部的部件。当然，柔性电路板800的形状可以根据电子设备内部的具体空间布局灵活选择，以使柔性电路板800能够较好地避让电子设备内部的部件，从而降低电子设备内部部件的堆叠难度。
进一步地，柔性电路板800可以至少包括第一柔性段、第二柔性段和第三柔性段，且第二柔性段为折弯段，第一柔性段、第二柔性段和第三柔性段依次相连，从而使得柔性电路板800为弯折结构，以使柔性电路板800能够在避让电子设备内部的部件。同时，在柔性电路板800通过板对板连接器与电路板200电连接的情况下，柔性电路板800能长度较长，方便安装人员操控板对板连接器与电路板200的连接或分离，避免柔性电路板800的长度较短，导致板对板连接器受柔性电路板800的拉扯作用而较难与电路板200的连接或分离，进而提高该电子设备的可安装性。
在一种可选的实施例中，柔性电路板800可以包括主体部810和第一加强板820，主体部810的第一端与温度传感器300电连接，主体部810的第二端与电路板200电连接，第一端背离温度传感器300的表面设置有第一加强板820。第一加强板820能够增强温度传感器300的强度，以使温度传感器300的强度较高，在电子设备晃动时或在电子设备受到冲击时，第一加强板820能够防止温度传感器300的位置发生变化，避免温度传感器300碰撞到电子设备内部的其他部件，导致电子设备内部的其他部件或温度传感器300损坏，进而提高电子设备的可靠性。
为了提高柔性电路板800与电路板200的连接强度，可选地，柔性电路板800还可以包括第二加强板830，第二端背离电路板200的表面设置有第二加强板830。在电子设备晃动时或在电子设备受到冲击时，第二加强板830能够防止柔性电路板800与电路板200的连接位置发生变化，从而避免柔性电路板800与电路板200分离，进而提高柔性电路板800与电路板200的连接可靠性。
本发明实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读 器、可穿戴设备(例如智能手表)、电子游戏机等设备，本发明实施例不限制电子设备的具体种类。
本发明上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本发明的实施例而已，并不用于限制本发明。对于本领域技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。

Claims (12)

  1. 一种电子设备，包括：
    壳体(100)，所述壳体(100)开设有开口(110)；
    电路板(200)，所述电路板(200)设置于所述壳体(100)内；
    温度传感器(300)，所述温度传感器(300)设置于所述壳体(100)内，且所述温度传感器(300)与所述开口(110)相对设置，所述温度传感器(300)与所述电路板(200)电连接。
  2. 根据权利要求1所述的电子设备，其中，所述电子设备还包括第一功能模组(400)，所述第一功能模组(400)设置有透光区域(410)，所述第一功能模组(400)设置于所述壳体(100)，且所述第一功能模组(400)覆盖所述开口(110)，所述透光区域(410)与所述温度传感器(300)相对设置。
  3. 根据权利要求2所述的电子设备，其中，所述电子设备还包括第一透光件(500)，所述第一功能模组(400)开设有通孔，所述第一透光件(500)设置于所述第一功能模组(400)，且所述第一透光件(500)覆盖所述通孔以形成所述透光区域(410)。
  4. 根据权利要求3所述的电子设备，其中，所述第一功能模组(400)背离所述温度传感器(300)的一侧开设有第一安装槽(420)，所述通孔开设于所述第一安装槽(420)的槽底，且贯穿所述第一功能模组(400)，所述第一透光件(500)设置于所述第一安装槽(420)；或者，
    所述第一功能模组(400)朝向外部的一侧开设有第二安装槽，所述第二安装槽的槽口形成所述通孔，所述温度传感器(300)设置于所述第二安装槽的槽底，所述第一透光件(500)覆盖所述第二安装槽的槽口。
  5. 根据权利要求4所述的电子设备，其中，所述第一透光件(500)背离所述温度传感器(300)的表面与所述第一功能模组(400)背离所述温度传感器(300)的表面共面。
  6. 根据权利要求3所述的电子设备，其中，所述第一功能模组(400)朝向所述温度传感器(300)的一侧开设有第三安装槽(430)，所述通孔开设于所述第三安装槽(430)的槽底，且贯穿所述第一功能模组(400)，所述温度传感器(300)设置于所述第三安装槽(430)内。
  7. 根据权利要求1所述的电子设备，其中，所述电子设备还包括柔性电路板(800)，所述温度传感器(300)与所述电路板(200)通过所述柔性电路板(800)电连接。
  8. 根据权利要求7所述的电子设备，其中，所述柔性电路板(800)通过板对板连接器与所述电路板(200)电连接。
  9. 根据权利要求7所述的电子设备，其中，所述柔性电路板(800)包括主体部(810)和第一加强板(820)，所述主体部(810)的第一端与所述温度传感器(300)电连接，所述主体部(810)的第二端与所述电路板(200)电连接，所述第一端背离所述温度传感器(300)的表面设置有所述第一加强板(820)。
  10. 根据权利要求9所述的电子设备，其中，所述柔性电路板(800)还包括第二加强板(830)，所述第二端背离所述电路板(200)的表面设置有所述第二加强板(830)。
  11. 根据权利要求1所述的电子设备，其中，所述电子设备还包括第二功能模组，所述第二功能模组设置于所述壳体(100)，且与所述壳体(100)之间具有第一装配间隙，所述第一装配间隙覆盖有第二透光件，所述温度传感器(300)与所述第二透光件相对设置。
  12. 根据权利要求1所述的电子设备，其中，所述电子设备还包括第三功能模组，所述第三功能模组设置于所述壳体(100)，且与所述壳体(100)之间具有第二装配间隙，所述第二装配间隙覆盖有第三透光件，所述第二装配间隙内设置有导光件，且所述导光件具有延伸部，所述延伸部与所述温度传感器(300)相对设置。
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