WO2021189885A1 - 一种车用发电机励磁模块 - Google Patents
一种车用发电机励磁模块 Download PDFInfo
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- WO2021189885A1 WO2021189885A1 PCT/CN2020/131104 CN2020131104W WO2021189885A1 WO 2021189885 A1 WO2021189885 A1 WO 2021189885A1 CN 2020131104 W CN2020131104 W CN 2020131104W WO 2021189885 A1 WO2021189885 A1 WO 2021189885A1
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- 230000005284 excitation Effects 0.000 title claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 238000003466 welding Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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Classifications
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- H02K11/046—
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K19/00—Synchronous motors or generators
- H02K19/16—Synchronous generators
- H02K19/36—Structural association of synchronous generators with auxiliary electric devices influencing the characteristic of the generator or controlling the generator, e.g. with impedances or switches
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
Definitions
- the invention relates to the technical field of vehicle generator excitation systems, in particular to a vehicle generator excitation module.
- the generator excitation system is the general term for the power supply and its auxiliary equipment that supply the excitation current of the synchronous generator.
- the excitation system is an important part of the generator, and it has a great impact on the safe and stable operation of the power system and the generator itself.
- the main functions of the system are: 1) Adjust the excitation current according to the change of generator load to maintain the terminal voltage as a given value; 2) Control the distribution of reactive power among the generators in parallel operation; 3) Improve the parallel operation of generators Static stability of operation; 4) Improve the transient stability of parallel operation of generators; 5) Demagnetize when there is a fault inside the generator to reduce the degree of failure loss; 6) Implement the maximum generator according to the operating requirements Excitation limit and minimum excitation limit.
- the excitation diode is a common element used for rectification in the excitation circuit.
- the excitation diode in the excitation circuit of the vehicle generator is often made of a structure in which multiple diodes are welded to the same frame.
- the excitation module is made by plastic packaging, which is convenient for installation and improves the working efficiency of the rectifier diode.
- the excitation module of this structure has the following shortcomings:
- the excitation module is limited by the installation space, its volume needs to be kept within a certain range, so the rectifier diode needs to be placed horizontally and welded to the frame, so that the excitation module meets the size requirements, but the diode is placed horizontally.
- the chip is in a position perpendicular to the surface of the frame, and its internal chip size is often restricted to be small, which limits the performance of the excitation module;
- the purpose of the embodiments of the present application is to provide a vehicle generator excitation module, which solves the problems of limited chip size, poor heat dissipation, and low production efficiency in the prior art.
- a vehicle generator excitation module includes a frame and at least one semiconductor unit welded on the frame, the semiconductor unit includes at least one chip and at least one jumper wire, one pole of the chip is welded on the frame, The other pole is welded with the jumper wire, and the end of the jumper wire is welded on the frame.
- the chip is directly welded to the frame, which can make full use of the area of the frame, thereby increasing the maximum area of the chip, and also improving the heat dissipation area of the chip; and it is also possible to design the frame according to the size and shape of the chip. Shape to improve the overall utilization of the frame; the chip is directly welded to the frame, so there is no need to trim and weld the diode, thereby simplifying the production process and improving the production efficiency.
- semiconductor units there are at least three semiconductor units, and the semiconductor units are arranged at intervals.
- the frame is an integrally formed part, and the frame is composed of a polar connecting section one, a polar connecting section two and two polar connecting sections three, the two polar connecting sections and the two polar connecting sections 3.
- the interval is set on one side of the first polarity connection section, and the second polarity connection section is located between the third polarity connection section.
- One end of the second polarity connection section far from the second polarity connection section is connected, the other end of the third polarity connection section is connected to the first polarity connection section, and the other end of the third polarity connection section
- There is a gap between the second polar connecting section and the beneficial effect of this step is that the frame is segmented, which is convenient for subsequent processing and welding.
- one pole of the semiconductor unit is welded to the first polarity connection section, and the other pole is respectively welded to the polarity connection section two or the polarity connection section three.
- the negative electrode of the chip is welded to the first polarity connection section, the positive electrode is welded to the jumper wire, and the end of the jumper wire is welded to the polarity connection section 2 or the polarity connection section 3.
- the beneficial effect of using this step is to weld the negative electrode of the chip to the frame, which can improve the heat dissipation capacity.
- the frame is a galvanized iron plate.
- positioning holes are provided on the first polar connecting section, the second polar connecting section and the third polar connecting section, and the assembling holes are opened on the second polar connecting section and the third polar connecting section.
- the area of the frame can be fully utilized, which facilitates increasing the maximum area of the chip and improves the performance of the excitation module
- the embodiments of the present application facilitate the use of larger-sized chips, and at the same time enable the chips to directly dissipate heat through metal, which has a better heat dissipation effect, thereby improving the stability of the chip;
- the embodiment of the application simplifies the production process, reduces the production cost, and improves the production efficiency by welding the chip and the jumper wire.
- Figure 1 is a schematic diagram of the internal structure of an excitation module in the prior art
- Figure 2 is a schematic diagram of the first structure of the present invention.
- Figure 3 is a schematic diagram of the second structure of the present invention.
- Fig. 4 is a schematic diagram of the three-dimensional structure of the present invention.
- the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
- installed can be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
- the vehicle generator excitation module provided by the embodiment of the present application solves the problems of limited chip size, poor heat dissipation, and low production efficiency in the prior art.
- the general idea of the embodiments of the present application is as follows: directly solder the chip to the frame, so that the chip can make full use of the area of the frame, and can greatly increase the maximum area of the chip carried by the frame, thereby improving the performance of the excitation module;
- the embodiment of the present application discloses a vehicle generator excitation module, which includes a frame 1 and at least one semiconductor unit 2 welded on the frame 1, and the semiconductor unit 2 includes at least one A chip 201 and at least one jumper 202, one pole of the chip 201 is soldered on the frame 1, the other pole is soldered with the jumper 202, and the end of the jumper 202 is soldered on the frame 1;
- the embodiment of the present application changes the assembly form of the existing excitation module, and changes the existing diode assembly to the direct assembly of the chip 201, and the chip 201 is directly welded to the frame 1, so that the chip 201 can make full use of the area of the frame 1, and can greatly increase the frame.
- the chip 201 can dissipate heat through the frame 1, thereby improving the heat dissipation capacity of the chip 201 in many aspects, reducing the failure rate of the chip 201, improving the reliability of the chip 201, and the chip 201 directly Welding to the frame 1 does not need to trim the diodes and then welding, which not only simplifies the production process, improves the production efficiency, but also greatly reduces the processing cost; the welding in the embodiment of the application is a well-known technology in the semiconductor industry, namely Soldering by solder paste is not repeated here.
- the semiconductor units 2 there are at least three semiconductor units 2 and the semiconductor units are arranged at intervals, which can ensure the performance of the excitation module.
- the frame 1 in the embodiment of the present application is an integrally formed part, and the frame 1 includes a polar connecting section 101, a polar connecting section 102, and two polar connecting sections 103.
- the polar connecting section 102 , Two polar connecting sections 103 are arranged at intervals on one side of the polar connecting section 101, and the polar connecting section 102 is located between the polar connecting sections 103, and the polar connecting section three 103.
- One end of the polar connecting section 101 is connected to the end of the polar connecting section 102 away from the polar connecting section 102.
- the other end of the polar connecting section 103 is connected to the polar connecting section 102.
- the first connection section 101 is connected, and there is a gap between the other end of the third connection section 103 and the second connection section 102;
- the frame 1 in the embodiment of the present application is divided into multiple parts, wherein the polar connecting section 101 is directly soldered to one pole of the chip 201, thereby increasing the heat dissipation area, improving the heat dissipation effect, and reducing the failure rate of the chip 201.
- the reliability of the chip 201 is improved.
- the structure of the polarity connection section 101 can be changed. It is only necessary to ensure that the chip has enough soldering area. It can be a long strip, as shown in Figure 2, or it can be attached.
- the shape with protruding parts shown in 3 can also be other shapes; the polar connecting section two 102 and the two polar connecting section three 103 in the embodiment of the present application can not only increase the heat dissipation area, but also facilitate the present invention.
- the application example is assembled with other parts.
- the specific shape and structure can be the workpiece section with assembly holes in Figures 2 and 3, or it can be changed according to customer needs. Only the welding area of the jumper wire and the subsequent assembly area need to be guaranteed. Can.
- the polar connection mode of the frame 1 and the semiconductor unit 2 needs to be ensured that the polarity connection section 102 and the polarity connection section 103 are both connected to the same pole of the semiconductor unit 2, and the polarity connection section 1 101 is connected to the other pole of the semiconductor unit 2.
- the negative pole of the chip 201 is welded to the first polarity connection section 101
- the positive pole is welded to the jumper wire 202
- the end of the jumper wire 202 is welded to the polarity connection section 102 or the second pole.
- Figures 2 and 3 in the embodiment of the present application show the case where the number of semiconductor units 2 is 3, that is, the jumper 202 welded to the middle chip 201 is connected to the polarity connection section 102.
- the chips 201 on the remaining two sides are connected to the polarity connection section 103.
- the polar connecting section 101, the polar connecting section 102 and the polar connecting section 103 are all provided with positioning holes 4, and the poles Both the sex connection section 102 and the polarity connection section 103 are provided with assembling holes 3.
- the positioning holes 4 in the embodiment of the present application are opened on the outside of the welding area of the chip 201, as shown in Figs. 2 and 3, and the assembling holes 3 is opened at the bottom of the second polarity connection section 102 and the third polarity connection section 103 to avoid affecting the stability of the module welding area as much as possible.
- the frame 1 in the embodiment of the present application is a galvanized iron plate, and other materials may also be used.
- the embodiment of the application also needs to add a plastic shell during the processing process.
- the plastic shell wraps the chip 201, the jumper 202, and the positioning hole 4 inside the plastic shell, thereby improving the integrity and compactness of the excitation module.
- the addition of the plastic shell It is an existing process and will not be repeated here.
- the chip 201 is directly welded to the frame 1, so that the chip 01 can make full use of the area of the frame 1, which can greatly increase the maximum area of the chip 201 carried by the frame 1, thereby improving the performance of the excitation module;
- the surface area of the chip 201 can be increased, so that the heat dissipation area of the chip 201 is increased; due to the structure that the chip 201 is directly welded to the frame 1, the chip 201 can dissipate heat through the frame 1, thereby improving in many aspects
- the heat dissipation capacity of the chip 201 reduces the failure rate of the chip 201 and improves the reliability of the chip 201;
- the embodiment of the present application directly solders the chip 201 to the frame 1 without trimming the diode and then soldering, which simplifies the production process and improves the production efficiency on the one hand, and reduces the processing cost on the other hand.
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Abstract
本发明公开一种车用发电机励磁模块，包括一框架和至少一个焊接在框架上的半导体单元，半导体单元包括至少一芯片和至少一跳线，芯片的一极焊接在框架上，另一极焊接有跳线，跳线的末端焊接在框架上，本发明解决了现有技术中存在的芯片尺寸受限、散热差、制作效率低的技术问题。
Description
本发明涉及车用发电机励磁系统技术领域，特别涉及一种车用发电机励磁模块。
发电机励磁系统是供给同步发电机励磁电流的电源及其附属设备的统称，励磁系统是发电机的重要组成部份，它对电力系统及发电机本身的安全稳定运行有很大的影响，励磁系统的主要作用有：1)根据发电机负荷的变化相应的调节励磁电流，以维持机端电压为给定值；2)控制并列运行各发电机间无功功率分配；3)提高发电机并列运行的静态稳定性；4)提高发电机并列运行的暂态稳定性；5)在发电机内部出现故障时，进行灭磁，以减小故障损失程度；6)根据运行要求对发电机实行最大励磁限制及最小励磁限制。
如图1所示，励磁二极管是励磁电路中用来整流的常用原件，车载发电机的励磁电路中的励磁二极管，常常做成多个二极管焊接于同一个框架的结构，并对框架上二极管区域进行塑封制得励磁模块，从而便于安装且提高了整流二极管工作时的工作效率，但是该种结构的励磁模块存在如下缺点：
1、由于励磁模块受到安装空间的限制，其体积需要保持在一定的范围内，故整流二极管需要横置并焊接于框架，从而使得励磁模块满足尺寸要求，但是二极管横置，此时二极管内部的芯片处于垂直框架表面的位置，其内部芯片尺寸往往被限制的较小，从而限制了励磁模块的性能；
2、由于二极管体积受限，导致其内部芯片体积受限，芯片散热面积较小，散热性能不佳，使得励磁模块的可靠性降低、失效率增加；
3、整流二极管在焊接于框架前，需要先将整流二极管两端引脚剪断，再人工将引脚焊接于框架，由于整理二极管引脚有两个，而一个框架需要焊接数个整流二极管，从而导致该种励磁模块制作工序繁琐、制作效率低下、 制作成本较高。
发明内容
本申请实施例的目的是提供一种车用发电机励磁模块，解决现有技术中存在的芯片尺寸受限、散热差、制作效率低的问题。
一种车用发电机励磁模块，包括一框架和至少一个焊接在框架上的半导体单元，所述半导体单元包括至少一芯片和至少一跳线，所述芯片的一极焊接在所述框架上，另一极焊接有所述跳线，所述跳线的末端焊接在所述框架上。
本申请实施例中通过将芯片直接焊接于框架，可以充分利用框架的面积，从而增加芯片的最大面积，也提高了芯片的散热面积；并且还可以根据芯片大小、形状，针对性的设计框架的外形，以提高框架的整体利用率；芯片直接焊接于框架，从而不需要对二极管进行修剪并焊接，从而简化了生产工艺，提高了制作效率。
在上述技术方案的基础上，本申请实施例还可以做如下改进：
进一步地，所述半导体单元至少为三个，且半导体单元间隔设置。
进一步地，所述框架为一体成型件，且框架由极性连接段一、极性连接段二和两个极性连接段三组成，所述极性连接段二、两个极性连接段三间隔设置在极性连接段一的一侧，且所述极性连接段二位于所述极性连接段三之间，所述极性连接段三远离所述极性连接段一的一端均与所述极性连接段二远离所述极性连接段二的一端连接，所述极性连接段三的另一端与所述极性连接段一连接，且所述极性连接段三的另一端与所述极性连接段二之间留有间隙，采用本步的有益效果是将框架进行分段，便于后续的加工和焊接。
进一步地，所述半导体单元的一极焊接在所述极性连接段一上，另一极分别焊接在所述极性连接段二或所述极性连接段三。
进一步地，所述芯片的负极焊接在所述极性连接段一上，正极焊接有所述跳线，所述跳线的末端焊接在所述极性连接段二或所述极性连接段三上，采用本步的有益效果是通过芯片的负极和框架焊接，这样能够提高散热能力。
进一步地，所述框架为镀锌铁板。
进一步地，所述极性连接段一、极性连接段二和极性连接段三上均开设有定位孔，所述极性连接段二和极性连接段三上均开设有装配孔，采用本步的有益效果是便于后续模块的装配和使用。
本申请实施例中提供的一个或者多个技术方案，至少具有如下技术效果或者优点：
1、本申请实施例通过将芯片直接焊接于框架，可以充分利用框架的面积，便于增加芯片的最大面积，提高了励磁模块的性能；
2、本申请实施例便于使用更大尺寸芯片的同时，使芯片通过金属直接散热，散热效果更好，从而提高芯片的稳定性；
3、本申请实施例通过焊接芯片与跳线的方式，简化了生产工艺，降低了生产成本，提高了生产效率。
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中的励磁模块内部结构示意图；
图2为本发明的第一结构示意图；
图3为本发明的第二结构示意图；
图4为本发明的三维结构示意图。
附图标记：
1-框架；2-半导体单元；3-装配孔；4-定位孔；
101-极性连接段一；102-极性连接段二；103-极性连接段三；
201-芯片；202-跳线。
下面将结合附图对本发明技术方案的实施例进行详细的描述。以下实施例仅用于更加清楚地说明本发明的技术方案，因此只作为示例，而不能以此来限制本发明的保护范围。
需要注意的是，除非另有说明，本申请使用的技术术语或者科学术语应当为本发明所属领域技术人员所理解的通常意义。
在本申请的描述中，需要理解的是，术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。在本发明的描述中，“多个”的含义是两个以上，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
本申请实施例提供的一种车用发电机励磁模块，解决现有技术中存在的芯片尺寸受限、散热差、制作效率低的问题。
本申请实施例的总体思路如下：将芯片直接焊接于框架，使得芯片可以充分利用框架的面积，能够大大增加框架承载的芯片的最大面积，从而提高励磁模块的性能；
为了更好的理解上述技术方案，下面将结合说明书附图以及具体实施方式对上述技术方案进行详细说明。
实施例：
如图2、4所示，本申请实施例公开了一种车用发电机励磁模块，包括一框架1和至少一个焊接在所述框架1上的半导体单元2，所述半导体单元2包括至少一芯片201和至少一跳线202，所述芯片201的一极焊接在所述 框架1上，另一极焊接有所述跳线202，所述跳线202的末端焊接在所述框架1上；本申请实施例改变了现有励磁模块的装配形式，将现有的二极管装配改为芯片201直接装配，芯片201直接与框架1焊接，使得芯片201可以充分利用框架1的面积，能够大大增加框架1承载的芯片201的最大面积，同时芯片201能够通过框架1散热，从而多方面的提高了芯片201的散热能力，降低了芯片201的失效率，提高了芯片201的可靠性，而且芯片201直接焊接于框架1，不需要对二极管进行修剪后在焊接，不仅简化了生产工艺、提高了生产效率，而且大大的降低了加工成本；本申请实施例中的焊接为加工半导体行业的公知技术，即通过锡膏进行焊接，此处不再赘述。
具体地，本申请实施例中半导体单元2至少为三个，且半导体单元间隔设置，这样能够确保励磁模块的性能。
其中，本申请实施例中的框架1为一体成型件，且框架1包括极性连接段一101、极性连接段二102和两个极性连接段三103，所述极性连接段二102、两个极性连接段三103间隔设置在极性连接段一101的一侧，且所述极性连接段二102位于所述极性连接段三103之间，所述极性连接段三103远离所述极性连接段一101的一端均与所述极性连接段二102远离所述极性连接段二102的一端连接，所述极性连接段三103的另一端与所述极性连接段一101连接，且所述极性连接段三103的另一端与所述极性连接段二102之间留有间隙；
本申请实施例中的框架1分成多个部分，其中极性连接段一101是直接与芯片201的一极焊接接触，以此增加了散热面积，提高散热效果，降低了芯片201的失效率，提高了芯片201的可靠性，同时极性连接段一101的结构可以进行变换，只需要保证芯片有足够的焊接面积即可，可以是长条型，如图2所示，也可以是附图3所示带有凸出部分的形状，还可以是其他形状；本申请实施例中的极性连接段二102和两个极性连接段三103，既能增加散热面积，同时也能够便于本申请实施例与其他部件装配，具体形状结构可以是附图2、3中的带有装配孔的工件段，也可以根据客户需求进行改变，只需要保证跳线的焊接区域和后续的装配区域即可。
其中，框架1和半导体单元2极性连接方式，需要保证，所述极性连接段二102和所述极性连接段三103均与半导体单元2的同一极连接，所述极 性连接段一101与所述半导体单元2的另一极连接。
具体地，所述芯片201的负极焊接在所述极性连接段一101上，正极焊接有所述跳线202，所述跳线202的末端焊接在所述极性连接段二102或所述极性连接段三103上，本申请实施例中的附图2、3为半导体单元2的数目为3的情况，即中间的芯片201所焊接的跳线202和极性连接段二102连接，剩余两侧的芯片201和极性连接段三103连接。
本申请实施例中的框架1为了便于与后续的工件进行装配，所述极性连接段一101、极性连接段二102和极性连接段三103上均开设有定位孔4，所述极性连接段二102和极性连接段三103上均开设有装配孔3，本申请实施例中的定位孔4是开设在芯片201焊接区域的外侧，如图2、3所示，而装配孔3是开设在所述极性连接段二102和极性连接段三103的底部，尽量避免影响模块焊接区域的稳定性。
具体地，本申请实施例中所述框架1为镀锌铁板，也可以采用其他材质。
本申请实施例在加工过程还需要添加塑封壳，塑封壳将芯片201、跳线202、定位孔4包裹于塑封壳内部，进而提高了该种励磁模块的整体性与致密性，塑封壳的添加为现有工艺，此处不再赘述。
本申请实施例相比较现有技术具有如下优点：
1、本申请实施例将芯片201直接焊接于框架1，使得芯片01可以充分利用框架1的面积，能够大大增加框架1承载的芯片201的最大面积，从而提高励磁模块的性能；
2、本申请实施例由于芯片201表面积能够得到增加，从而芯片201的散热面积得到了提高；由于芯片201直接焊接于框架1的结构，使得芯片201能够通过框架1散热，从而多方面的提高了芯片201的散热能力，降低了芯片201的失效率，提高了芯片201的可靠性；
3、本申请实施例通过将芯片201直接焊接于框架1，不需要对二极管进行修剪后在焊接，一方面简化了生产工艺、提高了生产效率，另一方面降低了加工成本。
本发明的说明书中，说明了大量具体细节。然而，能够理解，本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中，并未详细示 出公知的方法、结构和技术，以便不模糊对本说明书的理解。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围，其均应涵盖在本发明的权利要求和说明书的范围当中。
Claims (7)
- 一种车用发电机励磁模块，其特征在于，包括一框架和至少一个焊接在所述框架上的半导体单元，所述半导体单元包括至少一芯片和至少一跳线，所述芯片的一极焊接在所述框架上，另一极焊接有所述跳线，所述跳线的末端焊接在所述框架上。
- 根据权利要求1所述的一种车用发电机励磁模块，其特征在于，所述半导体单元至少为三个，且半导体单元间隔设置。
- 根据权利要求2所述的一种车用发电机励磁模块，其特征在于，所述框架为一体成型件，且框架由极性连接段一、极性连接段二和两个极性连接段三组成，所述极性连接段二、两个极性连接段三间隔设置在极性连接段一的一侧，且所述极性连接段二位于所述极性连接段三之间，所述极性连接段三远离所述极性连接段一的一端分别与所述极性连接段二远离所述极性连接段一的一端连接，所述极性连接段三的另一端与所述极性连接段一连接，且所述极性连接段三的另一端与所述极性连接段二之间留有间隙。
- 根据权利要求3所述的一种车用发电机励磁模块，其特征在于，所述半导体单元的一极焊接在所述极性连接段一上，另一极分别焊接在所述极性连接段二或所述极性连接段三。
- 根据权利要求3或4所述的一种车用发电机励磁模块，其特征在于，所述芯片的负极焊接在所述极性连接段一上，正极焊接有所述跳线，所述跳线的末端焊接在所述极性连接段二或所述极性连接段三上。
- 根据权利要求5所述的一种车用发电机励磁模块，其特征在于，所述框架为镀锌铁板。
- 根据权利要求6所述的一种车用发电机励磁模块，其特征在于，所述极性连接段一、极性连接段二和极性连接段三上均开设有定位孔，所述极性连接段二和极性连接段三上均开设有装配孔。
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57148597A (en) * | 1981-03-09 | 1982-09-13 | Toshiba Corp | Exciter for generator |
| CN2687947Y (zh) * | 2004-03-20 | 2005-03-23 | 中国北车集团永济电机厂 | 交流发电机的励磁调节器 |
| CN104393806A (zh) * | 2014-12-22 | 2015-03-04 | 株洲南车时代电气股份有限公司 | 一种励磁模块及励磁系统 |
| CN207053424U (zh) * | 2017-07-26 | 2018-02-27 | 浙江汉博汽车传感器有限公司 | 汽车用耐压型电压调节器 |
| CN111245162A (zh) * | 2020-03-26 | 2020-06-05 | 江苏英达富电子科技有限公司 | 一种车用发电机励磁模块 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57148597A (en) * | 1981-03-09 | 1982-09-13 | Toshiba Corp | Exciter for generator |
| CN2687947Y (zh) * | 2004-03-20 | 2005-03-23 | 中国北车集团永济电机厂 | 交流发电机的励磁调节器 |
| CN104393806A (zh) * | 2014-12-22 | 2015-03-04 | 株洲南车时代电气股份有限公司 | 一种励磁模块及励磁系统 |
| CN207053424U (zh) * | 2017-07-26 | 2018-02-27 | 浙江汉博汽车传感器有限公司 | 汽车用耐压型电压调节器 |
| CN111245162A (zh) * | 2020-03-26 | 2020-06-05 | 江苏英达富电子科技有限公司 | 一种车用发电机励磁模块 |
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