WO2021189726A1 - Radiateur et unité extérieure de climatiseur - Google Patents

Radiateur et unité extérieure de climatiseur Download PDF

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Publication number
WO2021189726A1
WO2021189726A1 PCT/CN2020/102962 CN2020102962W WO2021189726A1 WO 2021189726 A1 WO2021189726 A1 WO 2021189726A1 CN 2020102962 W CN2020102962 W CN 2020102962W WO 2021189726 A1 WO2021189726 A1 WO 2021189726A1
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WIPO (PCT)
Prior art keywords
pipeline
heat dissipation
plate
heat transfer
heat
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Application number
PCT/CN2020/102962
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English (en)
Chinese (zh)
Inventor
王定远
裴玉哲
王飞
董旭
矫立涛
常利华
王伟锋
牛天新
Original Assignee
青岛海尔空调器有限总公司
青岛海尔智能技术研发有限公司
海尔智家股份有限公司
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Application filed by 青岛海尔空调器有限总公司, 青岛海尔智能技术研发有限公司, 海尔智家股份有限公司 filed Critical 青岛海尔空调器有限总公司
Publication of WO2021189726A1 publication Critical patent/WO2021189726A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/20—Electric components for separate outdoor units
    • F24F1/24—Cooling of electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change

Definitions

  • This application relates to the field of heat dissipation technology, for example, to a radiator and an outdoor unit of an air conditioner.
  • the frequency conversion chip is an important component in the frequency conversion air conditioner.
  • the higher the compressor frequency the more the frequency conversion module generates heat.
  • the chip design is more compact, the density of components continues to increase, and the volume of components tends to be miniaturized. Therefore, the heat dissipation problem of the inverter module seriously affects the reliability of the air conditioner.
  • the heat dissipation of the frequency conversion module of the external unit of the air conditioner generally uses an extruded radiator.
  • the current extruded profile radiator has insufficient heat dissipation capacity for the frequency conversion chip under high temperature cooling conditions, resulting in a large frequency reduction or downtime of the air conditioner , The cooling effect of the environment in high temperature is poor and the capacity is insufficient.
  • the embodiments of the present disclosure provide a radiator and an outdoor unit of an air conditioner to solve the problem of low heat dissipation efficiency of the extruded profile radiator.
  • the radiator includes an inflatable plate temperature equalizing heat dissipation device
  • the inflatable plate temperature equalizing heat dissipation device includes: a low-level plate part with a first pipeline arranged inside; a high-level plate part with an inside arrangement There is a second pipeline; a connecting plate, which connects the low-level plate portion and the high-level plate portion, and is provided with a gas pipeline and a liquid pipeline connecting the first pipeline and the second pipeline, wherein, The first pipeline, the gas pipeline, the second pipeline, the liquid pipeline and the first pipeline are connected in sequence to form a closed heat transfer loop.
  • the heat transfer loop needs to be evacuated and filled with a heat transfer medium.
  • the heat transfer medium is closed One-way circulation of phase change heat transfer can be realized in the heat transfer loop.
  • the outdoor unit of the air conditioner includes the aforementioned radiator.
  • the radiator provided by the embodiment of the present disclosure includes an inflatable plate temperature equalizing heat dissipation device, wherein the inflatable plate temperature equalizing heat dissipation device includes a low-level plate portion, a connecting plate, and a high-level plate portion that are connected in sequence, and the interior is provided with sequentially connected and constituted
  • the first pipeline, the gas pipeline, the second pipeline, the liquid pipeline and the first pipeline of the closed heat transfer loop, and the closed heat transfer loop is used for vacuuming and filling the heat transfer medium.
  • the low-level plate part of the inflatable plate heat dissipation device can be used as the evaporating end to receive heat from the components to be dissipated.
  • the high-level plate part of the expanding plate-type uniform temperature and heat dissipation device can be used as a condensing end to condense and cool the gaseous heat transfer medium in the second pipeline to become a liquid.
  • the pressure difference caused by the difference in the inner diameter of the gas pipeline and the liquid pipeline causes the heat transfer medium to circulate in the pipeline in one direction and flow back into the lower-level plate pipeline through the liquid pipeline for the next heat dissipation cycle.
  • the heat sink provided by the embodiments of the present disclosure adopts a low-level plate to receive the heat from the component to be dissipated, and transfers the heat isothermally to the high-level plate, thereby increasing the effective heat dissipation area, not only using the heat dissipation of the low-level plate, but also
  • the heat dissipation of the high-end board part solves the bottleneck of high heat dissipation power density and high heat dissipation power of the electronic components to be dissipated, and improves the heat dissipation capacity of the electronic components to be dissipated.
  • FIG. 1 is a schematic diagram of a structure of an inflatable plate uniform temperature and heat dissipation device provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic structural diagram of another uniform temperature and heat dissipation device for an inflatable plate provided by an embodiment of the present disclosure
  • Figure 3 is a schematic diagram of a closed heat transfer loop provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a component to be dissipated according to an embodiment of the present disclosure
  • Fig. 6 is a partial structural diagram of an outdoor unit of an air conditioner provided by an embodiment of the present disclosure
  • Fig. 7 is a schematic structural diagram of a fan bracket provided by an embodiment of the present disclosure.
  • the directions or positional relationships indicated by the terms “upper”, “lower”, “inner”, “in”, “outer”, “front”, “rear”, etc. are based on the directions shown in the drawings or Positional relationship. These terms are mainly used to better describe the embodiments of the present disclosure and the embodiments thereof, and are not used to limit that the indicated device, element, or component must have a specific orientation, or be constructed and operated in a specific orientation. In addition, some of the aforementioned terms may be used to indicate other meanings in addition to the orientation or position relationship. For example, the term “shang” may also be used to indicate a certain dependency relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific situations.
  • connection can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or two devices, components, or The internal communication between the components.
  • connection can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or two devices, components, or The internal communication between the components.
  • A/B means: A or B.
  • a and/or B means: A or B, or, A and B.
  • the embodiment of the present disclosure provides a radiator, which includes an inflatable plate temperature equalizing heat dissipation device.
  • the inflatable plate temperature equalizing heat dissipation device includes: a low-level plate portion with a first pipeline arranged inside; a high-level plate portion with a The second pipeline; the connecting plate, which connects the low-order plate portion and the high-order plate portion, and is provided with a gas pipeline and a liquid pipeline connecting the first pipeline and the second pipeline, wherein the first pipeline, the gas The pipeline, the second pipeline, the liquid pipeline and the first pipeline are connected in sequence to form a closed heat transfer circuit.
  • the heat sink provided by the embodiment of the present disclosure includes an inflatable plate temperature equalizing heat dissipation device 1, as shown in FIG.
  • the connecting plate 13 of the plate, the first pipe of the low-level plate, the second pipe of the high-level plate, and the gas and liquid pipes connecting the plates constitute a closed heat transfer circuit, wherein the closed heat transfer circuit
  • the heat loop is used for vacuuming and filling the heat transfer medium.
  • the low-level plate portion 11 in the inflatable plate uniform temperature and heat dissipation device 1 can be used as an evaporating end, and the high-level plate portion 12 can be used as a condensing end.
  • the inflatable plate temperature equalizing heat dissipation device 1 provided by the embodiment of the present disclosure to dissipate heat the low-level plate portion 11 is in direct contact with the part to be dissipated, and the heat-dissipating part can transfer heat to the low-level plate part through contact heat transfer. 11.
  • the heat transfer medium in the first pipeline of the low-order plate portion 11 is heated, the temperature rises, and vaporizes, and enters the second pipeline of the high-order plate portion 12 through the gas pipeline of the connecting plate 13, a gas with a higher temperature
  • the heat transfer medium is condensed and cooled in the high-level plate part, becomes liquid, and flows back into the first pipe of the low-level plate part through the liquid pipeline of the connecting plate, and performs the next heat dissipation cycle.
  • the heat sink provided by the embodiments of the present disclosure adopts a low-level plate to receive the heat from the component to be dissipated, and transfers the heat isothermally to the high-level plate, thereby increasing the effective heat dissipation area, not only using the heat dissipation of the low-level plate, but also
  • the heat dissipation of the high-end board part solves the bottleneck of high heat dissipation power density and high heat dissipation power of the electronic components to be dissipated, and improves the heat dissipation capacity of the electronic components to be dissipated.
  • the inflatable plate temperature equalization and heat dissipation device provided by the embodiment of the present disclosure is step-shaped, which improves the circulating fluidity of the heat transfer medium in the closed heat transfer loop.
  • the low-level plate portion 11, the high-level plate portion 12 and the connecting plate 13 are integrally formed.
  • the closed heat transfer circuit in the inflatable plate temperature equalization and heat dissipation device provided by the embodiments of the present disclosure is used for vacuuming and infusion of heat transfer medium.
  • the integrally formed inflatable plate temperature equalization and heat dissipation device has fewer welding points and reduces the heat transfer medium. The risk of leakage reduces the cost of the radiator, and improves the reliability of the radiator during the packaging, transportation, and working process of the radiator or air conditioner.
  • the closed heat transfer loop is evacuated and filled with a heat transfer medium.
  • the heat transfer medium may be a heat transfer medium that can undergo a phase change, for example, it can be a heat transfer medium that can undergo a phase change between a gaseous state and a liquid state.
  • the liquid working fluid in the first pipeline is heated, and after the temperature rises, it becomes gaseous and enters the second pipeline through the gas pipeline.
  • the gaseous working fluid dissipates heat in the second pipeline. After the temperature decreases, it becomes liquid , It flows back to the first pipeline through the liquid pipeline for the next heat dissipation cycle.
  • the gaseous working medium is beneficial to increase the pressure in the closed heat transfer loop and improve the circulating flow performance of the heat transfer medium in the heat transfer loop.
  • the heat transfer medium is a refrigerant.
  • the communication plate includes a first connection end connected to the low-level board portion and a second connection end connected to the high-level board portion, and the first connection end and the second connection end are arc-shaped.
  • the first connecting end 131 and the second connecting end 132 are arcs with a certain arc, which is beneficial for the gaseous working fluid in the first pipeline to flow into the second pipeline through the gas pipeline in the connecting plate.
  • the connecting plate is S-shaped, and optionally, the connecting plate is S-shaped with a smaller curvature.
  • the inner diameter of the gas pipeline is larger than the inner diameter of the liquid pipeline, or the number of branches of the gas pipeline is more than the number of branches of the liquid pipeline, so as to form an internal pipeline pressure difference.
  • the heat transfer medium in the first pipeline is heated and vaporized, which increases the pressure difference in the closed heat transfer circuit.
  • the gaseous heat transfer medium in the first pipeline preferentially selects the gas pipeline with a larger inner diameter to flow into the second pipeline , And push the liquid heat transfer medium in the second pipeline to flow back to the first pipeline through the liquid pipeline, which improves the unidirectionality of the circulation flow of the heat transfer medium in the closed heat transfer loop, and effectively realizes the heat transfer medium in the closed heat transfer loop.
  • One-way circulation inside the pipeline is one-way circulation inside the pipeline.
  • the second pipeline of the high-level plate portion includes a gas pipeline section directly connected with the gas pipeline and a liquid pipeline section directly connected with the liquid pipeline.
  • the inner diameter of the gas pipeline section is larger than the inner diameter of the liquid pipeline section or the branch of the gas pipeline.
  • the number is more than the number of branches in the liquid pipeline.
  • the closed heat transfer circuit of the inflatable plate uniform temperature and heat dissipation device provided by the embodiment of the present disclosure is arranged on the back.
  • FIG. 3 shows the inflation after inversion.
  • the board temperature is equal to the heat dissipation device.
  • the inner diameter of the gas pipe section 123 directly connected with the gas pipe of the second pipe section is larger than the inner diameter of the liquid pipe section 124 directly connected with the liquid pipe, which improves the unidirectional circulating fluidity of the heat transfer medium in the heat transfer loop.
  • the heat dissipation efficiency of the inflatable plate uniform temperature heat dissipation device is arranged on the back.
  • the liquid pipeline is provided with a plurality of liquid branch pipelines.
  • the liquid pipeline 134 is provided with three liquid branch pipelines. After the liquid working fluid in the second pipeline flows through the liquid pipe section 124, it is split in a plurality of liquid splitting pipelines, which improves the directional heat dissipation effect of the chip to be dissipated.
  • the outdoor unit of the air conditioner is mostly provided with multiple chips to be radiated, for example, there may be 4 chips to be radiated, as shown in FIG. 5.
  • Multiple liquid diversion pipelines divide the heat transfer medium with lower temperature and direct the low temperature heat transfer medium to flow in a directional manner, so that the low temperature heat transfer medium can dissipate heat for multiple chips to be dissipated at the same time, which improves the heat dissipation efficiency and heat dissipation of the chips to be dissipated.
  • Directional heat dissipation effect is achieved.
  • the gas pipeline is provided with a plurality of gas branch pipelines.
  • the gas pipeline 133 is provided with three gas diversion pipelines.
  • the gaseous heat transfer medium in the first pipeline flows into the gas pipe section 123 through a plurality of gas diversion pipelines, and a confluence is performed in the gas pipe section 123.
  • the pressure difference of the heat transfer medium in the closed heat transfer loop is increased, and the unidirectional circulating fluidity of the heat transfer medium in the heat transfer loop is improved.
  • the heat sink provided by the embodiment of the present disclosure further includes an extruded heat dissipation element, wherein the extruded heat dissipation element is connected to the lower part of the low-level plate portion to form an integral combination.
  • Fig. 4 is an exploded view of an inflatable plate heat equalizing and heat dissipating device 1 and an extruded heat dissipating element 2, wherein the extruded heat dissipating element 2 is connected to the lower part of the low-level plate portion 11 of the inflatable plate heat equalizing and heat dissipating device.
  • the low-level plate part is in contact with the element to be dissipated and receives the heat of the element to be dissipated.
  • Part of the heat is dissipated by the extruded heat-dissipating element 2 arranged at the lower part of the low-level plate part, and the other part of the heat is taken away by the heat transfer medium and is blown away.
  • the high-level board part of the board uniform temperature heat dissipation device performs heat dissipation. Therefore, the extruded heat dissipating element 2 provided by the embodiments of the present disclosure can work with the high-level plate portion 12 of the inflatable plate uniform temperature heat dissipation device to dissipate the heat received by the low-level plate portion, thereby improving the heat dissipation efficiency of the heat sink.
  • the extruded heat dissipation element 2 may be a fin type heat sink as shown in FIG. 4.
  • the low-level plate portion and the extruded heat dissipation element are connected by thermally conductive glue or welding.
  • the material of the extruded heat dissipation element is aluminum.
  • the embodiments of the present disclosure also provide an outdoor unit of an air conditioner including the aforementioned radiator.
  • the outdoor unit of the air conditioner provided by the embodiment of the present disclosure further includes a chip to be dissipated.
  • the chip to be dissipated includes a first surface and a second surface opposite to each other; a circuit board connected to the first surface of the chip to be dissipated; The second surface of the chip to be dissipated is connected, wherein the heat conducting plate is arranged on the upper part of the low-level plate portion of the inflation plate.
  • the outdoor unit of the air conditioner provided by the embodiment of the present disclosure further includes a component to be dissipated, and the component to be dissipated includes a chip 31 to be dissipated, a circuit board 32 and a heat conducting plate 33.
  • the component to be dissipated in the embodiment of the present disclosure further includes a heat conducting plate 33.
  • the components to be dissipated include a circuit board 32, a chip 31 to be dissipated, and a heat conduction plate 33 in turn, forming a pre-assembled part similar to a sandwich structure.
  • the mounting method of the component to be dissipated includes: soldering one or more chips 31 to be dissipated on the circuit board 32 , And then connect the circuit board welded with the chip to be dissipated to the heat conducting plate 33.
  • the assembly of the components to be dissipated provided by the embodiments of the present disclosure can be completed on a chip welding assembly line.
  • the assembly line Compared with the assembly line of the outdoor unit of an air conditioner, the assembly line has high precision requirements and improves the bonding of the heat conducting plate 33 and the chip 31 to be dissipated. To this extent, the heat conduction effect of the heat conduction plate 33 is improved.
  • a thermally conductive sheet or silicone grease is arranged between the chip to be dissipated and the heat conducting plate, which improves the efficiency of heat transfer between the chip to be dissipated and the heat conducting plate.
  • four chips to be dissipated are soldered on the circuit board 32, as shown in FIG. 5, which is an exploded view of the components to be dissipated.
  • the material of the heat conducting plate 33 is aluminum.
  • the heat conducting plate 33 includes a heating surface connected to the second surface of the chip to be dissipated, and a heat transfer surface opposite to the heating surface, wherein the heating surface is stepped, as shown in FIG. 5, including a low-level surface and High-level surface, the thickness of the high-level surface is greater than that of the low-level surface.
  • the high-level surface of the heated surface is connected to the second surface of the chip to be dissipated, which improves the effective depth of the screw fixing of the high-level surface and the circuit board 32.
  • the connection stability of the components to be dissipated is improved.
  • the arrangement of the low-level surface increases the area of the heat transfer surface of the heat conduction plate, and improves the heat transfer effect of the heat conduction plate.
  • the low-level plate portion of the inflatable plate uniform temperature and heat dissipation device includes an upper surface and a lower surface, wherein the lower surface is connected to the extruded heat dissipation element 2, and the upper surface is connected to the heat transfer surface of the heat conducting plate 33, as shown in FIG.
  • Figure 6 is an exploded view of a partial structure of the outdoor unit of the air conditioner.
  • the heat conducting plate 33 in the component to be dissipated receives the heat of the chip 31 to be dissipated, and the heat conducting plate 33 is connected to the low-level plate 11 of the inflatable plate uniform temperature and heat dissipation device, and transfers the heat to the low-level plate 11 and the extruded heat dissipation element 2.
  • the heat sink including the inflatable plate heat-dissipating device 1 and the extruded heat-dissipating element 2 is used to simultaneously dissipate the chips 31 to be dissipated in the heat dissipation assembly, which improves the heat dissipation efficiency of the chips 31 to be dissipated.
  • the outdoor unit of the air conditioner further includes a fan and a fan bracket 5, wherein the high-level plate portion 12 of the inflatable plate temperature equalization and heat dissipation device is arranged on the upper part of the fan bracket 5.
  • the inflatable plate uniform temperature and heat dissipation device 1 has a low hardness, and is prone to deformation or even damage during transportation, packaging, and use, resulting in leakage of the heat transfer medium in the heat transfer circuit.
  • the high-level plate portion 12 of the inflatable plate uniform temperature and heat dissipation device provided by the embodiment of the present disclosure is arranged on the upper part of the fan bracket 5. The safety of the uniform temperature heat dissipation device 1 during transportation, packaging, and use improves the service life of the radiator.
  • the high-level plate portion of the inflatable plate temperature equalization and heat dissipation device is provided with a hollow portion 121 penetrating the inflatable plate temperature equalization and heat dissipation device.
  • FIG. 51 The clamping table 52, the second supporting table and the clamping portion 53 for clamping the fan bracket and the casing of the air conditioner outdoor unit, as shown in FIG. 7, wherein the second supporting table is located between the clamping table 52 and the clamping portion 53
  • the second support platform is not shown.
  • the hollow part 121 of the high-level plate of the inflatable plate uniform temperature and heat dissipation device is clamped to the clamping table 52 of the fan bracket, and the inflatable plates on both sides of the hollow part of the high-level plate are respectively arranged on the first support 51 and the second support tower.
  • the embodiment of the present disclosure provides that the first support platform and the second support platform of the fan bracket can support the inflatable plates on both sides of the hollow part of the high-level plate portion, thereby increasing the support area for the high-level plate portion and improving the inflatable plate heat sink Support stability and service life.
  • the inclination angle of the high-level plate portion of the inflatable plate uniform temperature and heat dissipation device is greater than or equal to 3°.
  • the low-level plate portion of the inflatable plate uniform temperature and heat dissipation device is arranged horizontally, and the high-level plate portion is provided with an inclination angle greater than or equal to 3°.
  • the outdoor unit of the air conditioner includes a soundproof board.
  • the high-level board includes a first end close to the soundproof board and a second end far away from the soundproof board.
  • the height of the first end of the high-level plate is higher than the height of the second end, so that the high-level plate forms an inclination angle greater than or equal to 3°, which improves the circulating fluidity of the heat transfer medium in the heat transfer loop.
  • the inclination angle here can be 5°.
  • a spacer may be provided at the first end of the high-level plate portion to form the inclination angle.
  • the second pipeline in the high-level plate section is provided with a gas pipe section 123 and a liquid pipe section 124.
  • the high-level plate section is provided with an inclination angle greater than or equal to 3°” can also be understood to mean that the height of the gas pipe section 123 is higher than
  • the height of the liquid pipe section 124 makes the high-level plate form an inclination angle greater than or equal to 3°, which improves the unidirectional circulating fluidity of the heat transfer medium in the heat transfer loop.
  • the inclination angle here can be 5 °.
  • a gasket may be provided at the gas pipe section 123 of the high-level plate to form an inclination angle.

Abstract

La présente invention concerne un radiateur, comprenant un dispositif de dissipation de chaleur à égalisation de température à plaque d'expansion de soufflage (1), qui comprend : une partie de plaque d'ordre inférieur (11), dont l'intérieur est pourvu d'une première canalisation ; une partie de plaque d'ordre supérieur (12), dont l'intérieur est pourvu d'une deuxième canalisation ; et une plaque de communication (13), qui est reliée à la pièce de plaque d'ordre inférieur (11) et à la pièce de plaque d'ordre supérieur (12). La première canalisation, une canalisation de gaz (133), la deuxième canalisation, une canalisation de liquide (134) et la première canalisation communiquent en séquence pour former une boucle fermée de transfert de chaleur. La boucle est mise sous vide et un milieu de transfert de chaleur est versé à l'intérieur. Le milieu de transfert de chaleur peut réaliser un transfert de chaleur à changement de phase à circulation unidirectionnelle dans la boucle fermée de transfert de chaleur. Le radiateur selon l'invention peut améliorer la capacité de dissipation de chaleur d'un composant électronique pour subir une dissipation de chaleur. L'invention concerne en outre une unité extérieure de climatiseur comprenant le radiateur selon l'invention.
PCT/CN2020/102962 2020-03-23 2020-07-20 Radiateur et unité extérieure de climatiseur WO2021189726A1 (fr)

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CN202010207159.6A CN111351146A (zh) 2020-03-23 2020-03-23 散热器和空调室外机
CN202010207159.6 2020-03-23

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111351146A (zh) * 2020-03-23 2020-06-30 青岛海尔空调器有限总公司 散热器和空调室外机
CN112649184A (zh) * 2020-12-22 2021-04-13 青岛海尔空调电子有限公司 散热器散热能力的测试方法、测试装置和测试盒

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100029908A (ko) * 2008-09-09 2010-03-18 연세대학교 산학협력단 열교환장치, 열전모듈이 구비된 열교환장치 및 이를 이용한공기조화기
CN102155662A (zh) * 2011-04-12 2011-08-17 常州市森奈电子科技有限公司 Led照明灯具散热装置
CN106855741A (zh) * 2016-12-29 2017-06-16 中国航天空气动力技术研究院 一种用于刀片服务器芯片的散热装置和系统
CN107145205A (zh) * 2017-04-19 2017-09-08 北京空间飞行器总体设计部 基于平板环路热管的笔记本电脑散热系统
CN109244051A (zh) * 2018-10-30 2019-01-18 中国航天空气动力技术研究院 一种用于服务器芯片散热的并联式环路热管散热装置
CN111351146A (zh) * 2020-03-23 2020-06-30 青岛海尔空调器有限总公司 散热器和空调室外机
CN111351147A (zh) * 2020-03-23 2020-06-30 青岛海尔空调器有限总公司 散热器和空调室外机

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100029908A (ko) * 2008-09-09 2010-03-18 연세대학교 산학협력단 열교환장치, 열전모듈이 구비된 열교환장치 및 이를 이용한공기조화기
CN102155662A (zh) * 2011-04-12 2011-08-17 常州市森奈电子科技有限公司 Led照明灯具散热装置
CN106855741A (zh) * 2016-12-29 2017-06-16 中国航天空气动力技术研究院 一种用于刀片服务器芯片的散热装置和系统
CN107145205A (zh) * 2017-04-19 2017-09-08 北京空间飞行器总体设计部 基于平板环路热管的笔记本电脑散热系统
CN109244051A (zh) * 2018-10-30 2019-01-18 中国航天空气动力技术研究院 一种用于服务器芯片散热的并联式环路热管散热装置
CN111351146A (zh) * 2020-03-23 2020-06-30 青岛海尔空调器有限总公司 散热器和空调室外机
CN111351147A (zh) * 2020-03-23 2020-06-30 青岛海尔空调器有限总公司 散热器和空调室外机

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