WO2021189534A1 - 一种fpc刷锡治具 - Google Patents

一种fpc刷锡治具 Download PDF

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Publication number
WO2021189534A1
WO2021189534A1 PCT/CN2020/083884 CN2020083884W WO2021189534A1 WO 2021189534 A1 WO2021189534 A1 WO 2021189534A1 CN 2020083884 W CN2020083884 W CN 2020083884W WO 2021189534 A1 WO2021189534 A1 WO 2021189534A1
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WIPO (PCT)
Prior art keywords
fpc
supporting
support
orthographic projection
pad
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Ceased
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PCT/CN2020/083884
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English (en)
French (fr)
Inventor
马长进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aac Module Electronic Shuyang Co Ltd
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Holdings Shuyang Co Ltd
Original Assignee
Aac Module Electronic Shuyang Co Ltd
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Holdings Shuyang Co Ltd
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Application filed by Aac Module Electronic Shuyang Co Ltd, AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Holdings Shuyang Co Ltd filed Critical Aac Module Electronic Shuyang Co Ltd
Publication of WO2021189534A1 publication Critical patent/WO2021189534A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the utility model belongs to the technical field of FPC processing, in particular to an FPC tin brushing fixture.
  • Printing solder paste is an important process in the subsequent processing of flexible printed circuit (Flexible Printing Circuit, FPC), and the quality of solder paste printing will affect the subsequent tin-laying and soldering effects.
  • FPC Flexible Printing Circuit
  • the supporting tooling When brushing the FPC, the supporting tooling is usually needed.
  • the tooling is often provided with grooves to avoid the components or reinforcement structure on the FPC surface.
  • the tooling surface When the FPC is brushed to form the solder pads, the tooling surface is often concave. Due to the influence of the tank, the steel mesh cannot be closely attached to the FPC and tooling when brushing tin, and there is a phenomenon that the amount of tin falls too much, and the amount of tin consumption is large and easily affects the performance of the FPC.
  • the technical problem to be solved by the utility model is to provide an FPC tin brushing jig, which aims to solve the problem of excessive tin drop in the printing solder paste of the existing FPC tin brushing jig.
  • an FPC tin brushing fixture for FPC the FPC includes a circuit board and a pad part arranged on the circuit board, the tin brushing treatment
  • the tool includes a supporting tool, the supporting tool includes a bottom surface and a supporting surface for supporting the FPC, the bottom surface is disposed opposite to the supporting surface, and the supporting surface is recessed toward the bottom surface to form at least two avoiding grooves.
  • the avoiding grooves are arranged at intervals, and the orthographic projection of the land portion on the supporting tooling is located between two adjacent avoiding grooves.
  • the supporting tooling further includes a protrusion protruding from the supporting surface and connected to the bonding pad. The part faces and corresponds to the supporting boss that supports the pad part.
  • orthographic projection area of the support boss on the support surface is larger than the orthographic projection area of the pad portion on the support surface.
  • the minimum distance between the orthographic projection of the pad portion on the supporting surface and the adjacent escape groove is less than or equal to 3 mm.
  • the FPC further includes a reinforcing part protrudingly arranged and fixed to the circuit board, and the orthographic projection of the reinforcing part on the bottom surface falls into the avoiding groove.
  • the tin brushing fixture further includes a leaky tin steel mesh that cooperates with the support tooling to clamp the FPC, and the leaky tin steel mesh is provided with a contact pad for abutting the pad part on the support protrusion.
  • the solder leakage opening of the platform is provided with a leaky tin steel mesh that cooperates with the support tooling to clamp the FPC, and the leaky tin steel mesh is provided with a contact pad for abutting the pad part on the support protrusion.
  • the supporting surface supports a plurality of the FPCs, and the plurality of FPCs are arranged in an array on the supporting surface, and the reinforcing part of the single FPC includes first reinforcing parts and A second reinforcing part, the avoiding groove includes a first avoiding groove corresponding to the first reinforcing part, and a second avoiding groove directly opposite to the second reinforcing part, the land part is The orthographic projection on the supporting tooling is located between the first avoiding groove and the second avoiding groove.
  • the first avoiding groove is strip-shaped and corresponding to at least two of the first reinforcing parts, and at least two of the first reinforcing parts are arranged in parallel along the length direction of the first avoiding groove.
  • the second escape groove is strip-shaped and corresponds to at least two of the second reinforcement portions, and at least two of the second reinforcement portions are arranged in parallel along the length direction of the second escape groove.
  • the utility model has the beneficial effect that: the FPC tin brushing jig of the utility model includes a supporting tool, and a supporting boss for supporting the pad portion is provided on the surface of the supporting tool, so that the tin can be brushed When the solder pad is closely attached to the support boss, the solder paste falls evenly from the steel mesh onto the solder pad, which solves the problem that the existing jig is prone to excessive solder paste falling when brushing tin.
  • Fig. 1 is a top structural view of an FPC applicable to the FPC tin brushing jig of the present invention.
  • Figure 2 is a front view of a supporting tool for an FPC tin brushing jig provided by an embodiment of the present invention.
  • Fig. 3 is a cross-sectional view of the supporting tool shown in Fig. 2 along the line A-A.
  • Fig. 4 is a schematic diagram showing the cooperation between the FPC shown in Fig. 1 and the supporting tooling of the FPC brushing jig of the present invention.
  • Fig. 5 is a cross-sectional view of the assembly structure shown in Fig. 4 along the line B-B.
  • Fig. 6 is a structural diagram of a leakage tin steel mesh of an FPC tin brushing jig provided by an embodiment of the present invention.
  • Fig. 7 is a structural diagram of a supporting tool for an FPC joint plate tin brushing jig provided by an embodiment of the present invention.
  • Fig. 8 is a schematic diagram of the cooperation between the solder brushing jig of Fig. 7 and the FPC when the solder brushing in the joint version.
  • the utility model provides an FPC tin brushing fixture, which is applied to the pad printing of FPC.
  • the structure of 1 is shown in FIG. 1, and includes a circuit board 11 and a pad portion 12 provided on the circuit board 11.
  • One or more pad portions 12 can be provided.
  • the tin brushing fixture includes a supporting tool 2, as shown in Figures 2 and 3, the supporting tool 2 includes a bottom surface 21 and a supporting surface 22 for supporting the FPC 1.
  • the bottom surface 21 and the supporting surface 22 are arranged opposite to each other, and the supporting surface 22 is recessed toward the bottom surface 21 At least two avoiding grooves 23 are formed, and the avoiding grooves 23 are spaced apart from each other.
  • the orthographic projection of the pad portion 12 on the supporting tool 2 is located between two adjacent avoiding grooves 23 (FPC layout drawing, the lower pad portion 12 is also Located between two adjacent avoidance grooves 23, please refer to Fig. 7 and Fig. 8), the supporting tool 3 also includes a supporting boss protrudingly arranged on the supporting surface 22 and directly opposite to the land portion 12 and corresponding to the supporting land portion 12 24.
  • the area of the support boss 24 is larger than the orthographic projection area of the pad portion 12 on the support surface 22, so that the entire pad portion 12 can be fully and effectively supported when tinning.
  • the assembly diagram of the FPC placed on the supporting tool 2 is shown in Figure 4.
  • the FPC tin brushing jig of the present invention includes a supporting tool, and a supporting boss for supporting the pad part is arranged on the surface of the supporting tool, so that the pad and the supporting boss can be closely attached when the tin is brushed, and the solder paste Falling evenly from the stencil to the pads solves the problem of excessive solder paste falling when the existing jig is brushed.
  • the FPC soldering jig of the present invention is particularly suitable for the situation where there is reinforcement on the FPC before soldering.
  • the FPC1 also includes a reinforcement projected and fixed to the circuit board 11.
  • the parts 13A and/or 13B, 13A and 13B can be located on the same side of the FPC1 or on different sides of the FPC1.
  • the present invention has a particularly obvious improvement effect for 13A and 13B on different sides of the FPC1.
  • the orthographic projections of the reinforcing parts 13A and 13B on the bottom surface 21 fall into the escape groove 23.
  • the reinforcing part When brushing tin, the reinforcing part is accommodated in the avoiding groove 23, eliminating the step generated by the reinforcing part, and at the same time, the land part 12 is closely attached to the support boss 24, and the solder paste falls evenly from the stencil to the land.
  • the problem of excessive drop of solder paste caused by the step of the reinforcing part is solved.
  • the present invention can significantly improve Yield rate of brushing tin.
  • the tin brushing jig of the present invention also includes a leaking tin steel mesh 3 that cooperates with the supporting tool 2 to clamp the FPC 1. As shown in FIG.
  • the area of the solder leakage opening 31 of the support boss 24 is equivalent to or slightly smaller than the area of the pad portion.
  • the supporting surface 22 of the supporting tool 2 supports multiple FPCs 1, and the multiple FPCs 1 are arranged in an array on the supporting surface 22.
  • the FPC includes a first reinforcement part 13A and a second reinforcement part 13B.
  • the escape groove 23 on the support tool 2 includes a first escape groove 23A corresponding to the first reinforcement part 13A and a second reinforcement part 13B.
  • Figure 8 takes three as an example.
  • the orthographic projection of the land portion 12 on the supporting tool 2 is located between the first escape groove 23A and the second escape groove 23B.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本实用新型提供了一种FPC刷锡治具，用于FPC，FPC包括线路板、以及设置于线路板的焊盘部，所述刷锡治具包括支撑工装，所述支撑工装包括底面以及支撑所述FPC的支撑面，所述底面与所述支撑面相对设置，所述支撑面朝所述底面方向凹陷形成至少两个避让槽，所述避让槽相互间隔设置，所述焊盘部在所述支撑工装上的正投影位于相邻两所述避让槽之间，所述支撑工装还包括凸设于所述支撑面并与所述焊盘部正对并对应支撑所述焊盘部的支撑凸台。本实用新型通过在支撑工装的表面设置用于支撑焊盘部的支撑凸台，从而可以在刷锡时，焊盘与支撑凸台紧密贴合，锡膏从钢网中均匀下落至焊盘上，解决了现有的治具在刷锡时容易产生锡膏下落过量的问题。

Description

一种FPC刷锡治具 技术领域
本实用新型属于FPC加工技术领域，尤其涉及一种FPC刷锡治具。
 背景技术
印刷锡膏是柔性电路板（Flexible Printing Circuit，FPC）的后续加工中的重要工序，锡膏印刷品质会影响到后续的铺锡和焊接效果。
对FPC进行刷锡操作时，通常需要用到支撑用的工装件，工装件往往会设置凹槽以避让FPC表面的元器件或者补强结构，而FPC刷锡形成焊盘时往往受到工装表面凹槽的影响，导致刷锡时钢网不能与FPC及工装紧密贴合，存在锡量下落过多的现象，耗锡量大且容易影响FPC的性能。
因此，现有技术还有待发展。
 技术问题
本实用新型所要解决的技术问题在于提供一种FPC刷锡治具，旨在解决现有的FPC刷锡治具印刷锡膏存在锡量下落过多的的问题。
 技术解决方案
为解决上述技术问题，本实用新型是这样实现的，一种FPC刷锡治具，用于FPC，所述FPC包括线路板、以及设置于所述线路板的焊盘部，所述刷锡治具包括支撑工装，所述支撑工装包括底面以及支撑所述FPC的支撑面，所述底面与所述支撑面相对设置，所述支撑面朝所述底面方向凹陷形成至少两个避让槽，所述避让槽相互间隔设置，所述焊盘部在所述支撑工装上的正投影位于相邻两所述避让槽之间，所述支撑工装还包括凸设于所述支撑面并与所述焊盘部正对并对应支撑所述焊盘部的支撑凸台。
进一步地，所述支撑凸台在所述支撑面上的正投影面积大于所述焊盘部在所述支撑面的正投影面积。
进一步地，所述焊盘部在所述支撑面的正投影与相邻所述避让槽之间的最小距离小于等于3mm。
进一步地，所述FPC还包括凸设并固定于所述线路板的补强部，所述补强部在所述底面的正投影落入所述避让槽内。
进一步地，所述刷锡治具还包括与所述支撑工装配合夹持所述FPC的漏锡钢网， 所述漏锡钢网设有用于将所述焊盘部抵接在所述支撑凸台的漏锡开口部。
进一步地，所述支撑面支撑多个所述FPC，多个所述FPC在所述支撑面上阵列排布，单个所述FPC的所述补强部包括相互间隔设置的第一补强部和第二补强部，所述避让槽包括分别与所述第一补强部对应的第一避让槽、以及与所述第二补强部正对的第二避让槽，所述焊盘部在所述支撑工装上的正投影位于所述第一避让槽与所述第二避让槽之间。
进一步地，所述第一避让槽呈条状且对应至少两个所述第一补强部，至少两个所述第一补强部沿所述第一避让槽的长度方向平行设置。
进一步地，所述第二避让槽呈条状且对应至少两个所述第二补强部，至少两个所述第二补强部沿所述第二避让槽的长度方向平行设置。
 有益效果
本实用新型与现有技术相比，有益效果在于：本实用新型的FPC刷锡治具包括支撑工装，通过在支撑工装的表面设置用于支撑焊盘部的支撑凸台，从而可以在刷锡时，焊盘与支撑凸台紧密贴合，锡膏从钢网中均匀下落至焊盘上，解决了现有的治具在刷锡时容易产生锡膏下落过量的问题。
 附图说明
图1是本实用新型的FPC刷锡治具适用的一种FPC的俯视结构图。
图2本实用新型的实施例提供的一种FPC刷锡治具的支撑工装的主视图。
图3是沿图2所示支撑工装沿 A-A线的剖视图。
图4是图1所示FPC与本实用新型的FPC刷锡治具的支撑工装配合示意图。
图5是图4所示装配结构沿 B-B线的剖视图。
图6是本实用新型实施例提供的一种FPC刷锡治具的漏锡钢网的结构图。
图7是本实用新型的实施例提供的一种FPC联版刷锡治具的支撑工装的结构图。
图8是图7的刷锡治具在联版刷锡时与FPC的配合示意图。
 本发明的实施方式
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
本实用新型提供的一种FPC刷锡治具，应用于FPC的焊盘印刷，FPC 1的结构如图1所示，包括线路板11、以及设置于线路板11上的焊盘部12，焊盘部12可以设置1个或2个以上。刷锡治具包括支撑工装2，如图2、图3所示，支撑工装2包括底面21以及支撑FPC 1的支撑面22，底面21与支撑面22相对设置，支撑面22朝底面21方向凹陷形成至少两个避让槽23，避让槽23相互间隔设置，焊盘部12在支撑工装2上的正投影位于相邻两个避让槽23之间（FPC联版图中，下面一个焊盘部12也是位于相邻两个避让槽23之间，可参考图7、图8），支撑工装3还包括凸设于支撑面22并与焊盘部12正对并对应支撑焊盘部12的支撑凸台24，优选的，支撑凸台24的面积大于焊盘部12在支撑面22的正投影面积，可以使整个焊盘部12在刷锡时得到充分有效的支撑。FPC置于支撑工装2上的组合图如图4所示。
本实用新型的FPC刷锡治具包括支撑工装，通过在支撑工装的表面设置用于支撑焊盘部的支撑凸台，从而可以在刷锡时，焊盘与支撑凸台紧密贴合，锡膏从钢网中均匀下落至焊盘上，解决了现有的治具在刷锡时容易产生锡膏下落过量的问题。
进一步地，本实用新型的FPC刷锡治具尤其适合刷锡前FPC上存在补强的情况，如图1所示和图5所示，FPC1还包括凸设并固定于线路板11的补强部13A和/或13B，13A和13B可以位于FPC1的相同面，也可以位于FPC1的不同面，本实用新型针对13A和13B位于FPC1的不同面，改善效果尤为明显。补强部13A和13B在底面21的正投影落入避让槽23内。刷锡时，补强部收容入避让槽23中，消除了补强部产生的台阶，同时焊盘部12与支撑凸台24紧密贴合，锡膏从钢网中均匀下落至焊盘上，解决了补强部台阶导致锡膏下落过量的问题，特别地，当焊盘部在支撑面22的正投影与相邻避让槽23之间的最小距离小于等于3mm时，本实用新型能够明显提高刷锡的良率。
进一步地，本实用新型的刷锡治具还包括与支撑工装2配合夹持FPC 1的漏锡钢网3，如图6所示，漏锡钢网3设有用于将焊盘部抵接在支撑凸台24的漏锡开口部31，漏锡开口部31的面积与焊盘部面积相当，或略小于焊盘部的面积。
进一步地，针对FPC联版加工，本实用新型的应用如图7和图8所示，支撑工装2的支撑面22支撑多个FPC 1，多个FPC 1在支撑面22上阵列排布，单个FPC包括第一补强部13A和第二补强部13B，支撑工装2上的避让槽23包括分别与第一补强部13A对应的第一避让槽23A、以及与第二补强部13B正对的第二避让槽23B，至少两个第一补强部13A沿第一避让槽23A的长度方向平行设置，至少两个第二补强部13B沿第二避让槽23B的长度方向平行设置，图8以3个为例。焊盘部12在支撑工装2上的正投影位于第一避让槽23A与第二避让槽23B之间。
可以理解的是，上述实施例是示例性的，不能理解为对本实用新型的限制，本领域的普通技术人员在本实用新型的范围内可以对上述实施例进行变化、修改、替换和变型，这些均应包含在本实用新型的保护范围之内。

Claims (8)

  1. 一种FPC刷锡治具，用于FPC，所述FPC包括线路板、以及设置于所述线路板的焊盘部，其特征在于，所述刷锡治具包括支撑工装，所述支撑工装包括底面以及支撑所述FPC的支撑面，所述底面与所述支撑面相对设置，所述支撑面朝所述底面方向凹陷形成至少两个避让槽，所述避让槽相互间隔设置，所述焊盘部在所述支撑工装上的正投影位于相邻两所述避让槽之间，所述支撑工装还包括凸设于所述支撑面并与所述焊盘部正对并对应支撑所述焊盘部的支撑凸台。
  2. 如权利要求1所述的FPC刷锡治具，其特征在于，所述支撑凸台在所述支撑面上的正投影面积大于所述焊盘部在所述支撑面的正投影面积。
  3. 如权利要求1所述的FPC刷锡治具，其特征在于，所述焊盘部在所述支撑面的正投影与相邻所述避让槽之间的最小距离小于等于3mm。
  4. 如权利要求1所述的FPC刷锡治具，其特征在于，所述FPC还包括凸设并固定于所述线路板的补强部，所述补强部在所述底面的正投影落入所述避让槽内。
  5. 如权利要求1所述的FPC刷锡治具，其特征在于，所述刷锡治具还包括与所述支撑工装配合夹持所述FPC的漏锡钢网，所述漏锡钢网设有用于将所述焊盘部抵接在所述支撑凸台的漏锡开口部。
  6. 如权利要求4所述的FPC刷锡治具，其特征在于，所述支撑面支撑多个所述FPC，多个所述FPC在所述支撑面上阵列排布，单个所述FPC的所述补强部包括相互间隔设置的第一补强部和第二补强部，所述避让槽包括分别与所述第一补强部对应的第一避让槽、以及与所述第二补强部正对的第二避让槽，所述焊盘部在所述支撑工装上的正投影位于所述第一避让槽与所述第二避让槽之间。
  7. 如权利要求6所述的FPC刷锡治具，其特征在于，所述第一避让槽呈条状且对应至少两个所述第一补强部，至少两个所述第一补强部沿所述第一避让槽的长度方向平行设置。
  8. 如权利要求7所述的FPC刷锡治具，其特征在于，所述第二避让槽呈条状且对应至少两个所述第二补强部，至少两个所述第二补强部沿所述第二避让槽的长度方向平行设置。
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