WO2021185616A1 - Multi-metal hook-and-loop welding - Google Patents

Multi-metal hook-and-loop welding Download PDF

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Publication number
WO2021185616A1
WO2021185616A1 PCT/EP2021/055800 EP2021055800W WO2021185616A1 WO 2021185616 A1 WO2021185616 A1 WO 2021185616A1 EP 2021055800 W EP2021055800 W EP 2021055800W WO 2021185616 A1 WO2021185616 A1 WO 2021185616A1
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WO
WIPO (PCT)
Prior art keywords
connection
component
nanowires
connecting element
contact
Prior art date
Application number
PCT/EP2021/055800
Other languages
German (de)
French (fr)
Inventor
Olav Birlem
Florian DASSINGER
Sebastian Quednau
Farough ROUSTAIE
Original Assignee
Nanowired Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanowired Gmbh filed Critical Nanowired Gmbh
Priority to KR1020227035140A priority Critical patent/KR20230020386A/en
Priority to EP21711503.9A priority patent/EP4122010A1/en
Priority to JP2022556498A priority patent/JP2023522569A/en
Priority to CN202180021771.7A priority patent/CN115298817A/en
Publication of WO2021185616A1 publication Critical patent/WO2021185616A1/en

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    • H—ELECTRICITY
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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Definitions

  • the present invention relates to a method and a connecting element for connecting a first component to a second component and to an arrangement of two interconnected components, in particular with regard to components from electronics.
  • welding Due to its considerable temperature input of regularly up to 1400 ° C, welding has the disadvantage that, on the one hand, it heats the affected body to a considerable extent, so that there is a risk of igniting flammable materials. There may also be visual changes to the surface of the too connecting bodies come, which can be problematic in particular in the case of pretreated surfaces with paints, foils or coatings. In addition, many materials cannot be welded.
  • Brazing of copper can also cause the components involved in the connection to heat up considerably (in particular above 400 ° C.) due to its considerable thermal energy input. This can cause flammable materials to ignite.
  • Soft soldering of copper can have the disadvantage that, on the one hand, the shear strength of the connection is lower than necessary and, on the other hand, that with soft solders, alternating temperature loads lead to segregation of the metal and thus to embrittlement of the connection. This can lead to the connection failing. Furthermore, soft solders have the disadvantage that they have a significantly higher contact resistance of the connection than, for example, pure copper. Another disadvantage of soft solder connections is their low mechanical fatigue strength, which usually only exists up to around 120 ° C. The corrosion resistance of such a connection to acidic media is also often inadequate.
  • connection there is usually a residual gap between the components. Capillary action can lead to moisture entering the remaining gap and subsequent corrosion. Corrosion can damage the connection. An electrical and / or thermal contact resistance of the connection can also increase. Furthermore, a hole for a screw or rivet can cause leaks in the area of the connection. This can make the use of such a connection more difficult, for example for vessels or pressure systems, in particular by requiring additional sealing means.
  • a method and a connecting element for connecting a first component to a second component as well as an arrangement of two interconnected components are to be provided in which a particularly mechanically stable and particularly good electrically and / or thermally conductive connection between the components is particularly important safe and simple way is formed or is.
  • a method for connecting a first component to a second component comprises: a) providing a connecting element with a respective plurality of nanowires on a first connecting surface on a first side of the connecting element and on a second connecting surface on a second side of the connecting element opposite the first side, the nanowires on the first connecting surface and the Nanowires are formed from different materials on the second connecting surface, b) merging a contact surface of the first component with the first connecting surface of the connecting element, and c) merging a contact surface of the second component with the second connecting surface of the connecting element.
  • the first component and the second component are preferably electronic components such as semiconductor components, computer chips, microprocessors or circuit boards.
  • the first component and / or the second component are preferably at least partially electrically and / or thermally conductive.
  • An electrical and / or thermal conductivity in the sense used here is present in particular with metals such as copper, which are generally referred to as “electrically conductive” or equivalent as “electrically conductive” or “thermally conductive” or “thermally conductive”.
  • materials that are generally considered to be electrically or thermally insulating should not be viewed here as being electrically or thermally conductive.
  • the method described is not restricted to applications in the field of electronics. For example, it is also possible to mount a component such as a sensor (as a first component) on a wall or bracket (as a second component) according to the method described. Using the described method, a mechanically stable and electrically and / or thermally conductive connection can in particular be formed between the first component and the second component.
  • the method described can be used in all areas in which a corresponding connection between two components is required.
  • the method described is not limited to a certain size of the components.
  • the method described is suitable for use in (micro) electronics or for connecting significantly larger components on a macroscopic level.
  • the components can be connected to the connecting element via respective contact surfaces.
  • a contact area is, in particular, a spatially distinctive area of a surface of the respective component.
  • the contact surfaces are distinguished by the formation of the connection. This means that the contact surface does not initially differ from the rest of the surface of the component and only emerges when the connection is formed in such a way that the contact surface is the surface on which the connection is formed. In this case, the contact area is initially only conceptually delimited from the rest of the surface of the component. In the area of the contact surfaces, the nanowires of the connecting element can come into contact with the respective component.
  • the contact surfaces are preferably each simply connected areas of the surface of the respective component.
  • the respective contact surface of the first component and / or of the second component is divided into several subregions of the surface of the respective component that are separate from one another are divided.
  • a contact surface can comprise two or more separate sections of the surface of the respective component.
  • the contact surfaces can be electrically and / or thermally conductive or insulating. It is preferred that the contact surfaces are electrically and / or thermally conductive, so that an electrically and / or thermally conductive connection can be formed.
  • the components are preferably designed to be rigid or have at least one rigid surface on which the respective contact surface is provided. This means in particular that the components (or at least the contact surfaces) are preferably not flexible.
  • a connection can be formed particularly well using the method described. If, for example, one of the components were designed to be flexible, it could be possible that the connection breaks due to stress on the nanowires. Depending on the precise circumstances, the method described can also be used advantageously with flexible components or contact surfaces.
  • connections between the first components and the connecting element are formed via a multiplicity of nanowires.
  • a nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers.
  • a nanowire can, for example, have a circular, oval or polygonal base. In particular, a nanowire can have a hexagonal base area.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials.
  • the ability of the nanowires to form a connection between the connecting element and a component is determined in particular by the material of the Affected nanowires.
  • the connection can have different properties.
  • the mechanical strength and the electrical and / or thermal conductivity of the connection are influenced by the material of the nanowires.
  • the connecting element can also be viewed as an intermediary between the two components to be connected to the extent that two components that are otherwise not or only poorly connectable to one another can be connected to one another via the connecting element.
  • a first connection between the first component and the connec tion element and a second connection between the second component and the connection element can be formed.
  • the first connection and the second connection can be formed better than the direct connection between the first component and the second component.
  • all of the nanowires involved in a connection are formed from the same material.
  • the connecting element is also preferably electrically and / or thermally conductive. If the nanowires on both connection surfaces and the connection element are electrically and / or thermally conductive, the connection between the first component and the second component is electrically and / or thermally conductive throughout.
  • the nanowires preferably have a length in the range from 100 nm [nanometers] to 100 gm [micrometers], in particular in the range from 500 nm to 30 gm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 ⁇ m, in particular in the range from 30 nm to 2 ⁇ m.
  • the term diameter refers to a circular base area, with a comparable definition of a diameter being used for a base area that differs therefrom. It is particularly preferred that all of the nanowires used have the same length and the same diameter.
  • the components are connected to one another indirectly via the connecting element.
  • This has the advantage that nanowires do not have to be provided on any of the components. It is sufficient that the nanowires are present on the connecting element. In particular, it is preferred that no nanowires are provided on the contact surfaces of the components, but only on the connection surfaces of the connecting element. This can make it easier to carry out the method and, in particular, also expand the application range of the method to those components which are not or only poorly accessible to the growth of the nanowires. Furthermore, the growth of the nanowires can take place locally separately from the components. Nevertheless, it is alternatively preferred that a respective multiplicity of nanowires is also provided on the contact surface of the first component and / or on the contact surface of the second component.
  • the connecting element is preferably designed to be flexible. Alternatively, it is preferred that the connecting element is rigid.
  • the connecting element can be designed as a solid metal plate.
  • the connecting element is formed from a plastic.
  • the connecting element can be formed from a polymer, in particular made of polycarbonate, PVC, polyester, polyethylene, polyamide and / or PET.
  • the connecting element can also be formed, for example, from a ceramic material, silicon, aluminum oxide or glass.
  • the connection element can be made of stainless steel, aluminum or non-ferrous metal. It is also preferred that the connecting element is formed from a composite material comprising several of the materials mentioned.
  • a connecting element which has two connecting surfaces. Both connection surfaces each have a large number of nanowires.
  • the first connecting surface is arranged on the first side of the connecting element, the second connecting surface on the second side of the connecting element.
  • the first side and the second side of the connecting element are arranged opposite one another.
  • the first side of the connec tion element is the side of the connection element which faces the first component after the connection has been formed.
  • the second side of the connecting element is the side of the connecting element that faces the second component after the connection has been formed.
  • the connecting element is provided.
  • a connecting element designed as described is created as part of the method.
  • the nanowires can be applied to the connection surfaces as part of the method, in particular by galvanic growth.
  • the provision also includes that a connection Connection element is used on which the nanowires are already present at the connection surfaces.
  • a suitably prepared connecting element can be obtained from a supplier and used for the method described. Obtaining a prepared connecting element in this way is also providing a connecting element in the sense used here.
  • the nanowires are preferably provided on the connection surfaces in such a way that they are essentially perpendicular (preferably perpendicular) to the respective connection surface.
  • the entirety of the nanowires on a connection surface can in particular be referred to as a lawn of nanowires.
  • the nanowires can also be provided in any orientation on the connection surfaces.
  • a connection surface it is also possible for a connection surface to be subdivided into a plurality of subregions (connected to one another or separated from one another), the nanowires being oriented differently in the various subregions. In this way, a particularly stable connection can be realized which, in particular, can also withstand shear forces particularly well.
  • the nanowires it is possible for the nanowires to be designed differently at different points on the connection areas, in particular with regard to their length, diameter, material and density (the density of the nanowires indicating how many nanowires are provided per area).
  • the connecting element can in particular be understood as a mediator of the connection between the first component and the second component.
  • any physical object that is suitable for connecting the components between the contact surfaces of the components can be considered as a connecting element.
  • connection surface is in particular a spatially drawn area of a surface of the connection element on the respective gen side of the fastener.
  • connection surfaces are distinguished by forming the connection. This means that the connection surfaces do not initially differ from the remaining surface of the connection element and only emerge when the connection is formed in such a way that the connection surfaces are the surface on which the connection is formed.
  • the connecting surface is only conceptually delimited from the remaining part of the surface of the connecting element before the connection is formed.
  • a connection surface of a planar connection element can be characterized in that a planar connection to the respective component is formed over a limited area of the connection element (ie over the connection surface).
  • the connecting surface is preferably as large as the corresponding contact surface and in particular preferably has its shape.
  • the contact areas are larger or smaller than the corresponding connection area and / or that the contact areas and the corresponding connection area have different shapes.
  • the connecting surfaces are preferably each simply connected areas of the surface of the connecting element.
  • the first connection surface and / or the second connection surface can be subdivided into a plurality of mutually separate sub-areas of the surface of the connection element.
  • a connecting surface can comprise two or more sections of the surface of the connecting element that are separated from one another.
  • steps b) and c) the contact surfaces are brought together with the connecting surfaces, that is to say moved towards one another.
  • the nanowires on the connection surfaces come into contact with the respective contact surface.
  • the nanowires connect to the corresponding contact surface, whereby the corresponding connection between the components and the connec tion element is formed.
  • connection is formed in that the nanowires, in particular their ends facing the respective contact surface, connect to the contact surface.
  • This connection is formed at the atomic level.
  • the atomic process is similar to that during sintering.
  • the connection obtained can in particular be so tight for gases and / or liquids that corrosion of the connection and / or the interconnected components in the area of the connection can be prevented or at least restricted.
  • the connection formed can be viewed as being fully metallic.
  • the process described can also be referred to as "Velcro welding". This expresses the fact that the connection is obtained by a large number of nanowires and thus by a large number of elongated, hair-like structures and by heating. Due to the large number of nanowires, the flatness and roughness of the contact surfaces can be compensated for.
  • the surface area of the connection ie the area over which forces such as the van der Waals force act at the atomic level
  • the connection can thus be particularly good electrically and / or thermally conductive and / or mechanically stable.
  • the nanowires are formed from an electrically and / or thermally conductive material.
  • the use of copper, silver, nickel and gold is particularly preferred here.
  • the contact surfaces are also preferably formed from an electrically and / or thermally conductive material, in particular with copper, silver, nickel or gold. As described above, the use of copper is not possible, especially for welded joints.
  • an electrical and / or thermal conductivity of the connection can be particularly high.
  • a particularly good thermal conductivity of the connection can, for example, improve the cooling of the components involved in the connection.
  • the use of copper, silver, nickel and gold for the nanowires and / or for the contact surfaces is particularly preferred for this purpose.
  • connection described can also be formed particularly easily and without tools. Only the components to be connected need to be guided to one another. Warming up and exertion of pressure can optionally take place, but are not absolutely necessary.
  • steps a) to c) are preferably carried out in the specified order, in particular one after the other.
  • step a) is carried out preferably before the beginning of steps b) and c).
  • the contact surface of the first component can first be brought together with the first connection surface, that is to say the first component with the connection element (step b)). Subsequently, the connecting element merged with the first component according to step b) can be merged with the second component in such a way that the contact surface of the second component and the second connecting surface are merged (step c)).
  • Steps b) and c) can alternatively be carried out at the same time, overlapping in time, or one after the other. This is possible, for example, in that the connecting element is held between the two components and these are moved towards the connecting element from both sides at the same time.
  • the nanowires on the first connection surface and / or the nanowires on the second connection surface are formed from a respective metal.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are formed from a respective metal.
  • the nanowires on the first connection area are preferably all formed from a first metal.
  • the nanowires on the second connection area are preferably all formed from a second metal.
  • nanowires made of metal In particular with nanowires made of metal, a mechanically stable and electrically and / or thermally conductive connection can be formed.
  • the nanowires on the first connection surface are formed from the material of the contact surface of the first component and / or the nanowires on the second connection surface are formed from the material of the contact surface of the second component.
  • the nanowires on the first connection surface are preferably formed from the material of the contact surface of the first component and the nanowires on the second connection surface are formed from the material of the contact surface of the second component.
  • connection between the nanowires and the respective contact surface can be formed particularly well if the nanowires are made of the same material as the contact surface. This is because the connection is formed at the atomic level. Connections between bodies made of different materials can be made by different lattice structures of the ma- materials are made more difficult. Even a different lattice constant can make the formation of a connection more difficult or have a disadvantageous effect on the properties of a connection that is formed.
  • connection element avoids this problem in the present method.
  • the connection between the nanowires and the connecting element is not made by simply being brought together. Instead, the nanowires are grown onto the connector. This enables a very close bond to be established. It is therefore possible for the connecting element to be formed from a uniform material. Alternatively, it is preferred that the connection surfaces of the connection element are formed from different materials, preferably each from the material of the corresponding nanowires.
  • the first connection surface is preferably formed from a first material which preferably corresponds to the material of the nanowires on the first connection surface.
  • the second connection surface is preferably formed from a second material, which preferably corresponds to the material of the nanowires on the second connection surface.
  • the connecting element is preferably formed from a third material and coated with the first material in the region of the first connecting surface and coated with the second material in the region of the second connecting surface.
  • the connection surfaces are formed by the coatings.
  • the third material is preferably electrically and / or thermally conductive. Alternatively, it is preferred that the third material is electrically and / or thermally insulating. In that case it is preferred that the connection dungsei em ent respective local electrically conductive connections between partial areas of the first connecting surface and partial areas of the second connecting surface.
  • the connecting element can also have several different materials that are arranged in layers, for example.
  • the connecting element can also be referred to as a hybrid tape.
  • the connecting element is formed from the first material and is coated with the second material in the region of the second connecting surface.
  • the connecting element is formed from the second material and is coated with the first material in the region of the first connecting surface.
  • the first construction part is a circuit board, wherein the contact surface of the first component is made of copper.
  • the second component is an electronic component, the contact surface of the second component being formed from silver, nickel and / or gold.
  • electronic components such as MOSFETS or IGBT modules in particular can be attached as a second component with connections made of silver as a contact surface on a circuit board as the first component with copper contacts as a contact surface.
  • step b) and / or step c) are carried out at room temperature.
  • the connection described between the contact surfaces and the connec tion surfaces can be formed at room temperature. It is preferred that the two components are pressed against one another to form the connection.
  • the pressure used here is preferably in the range of 5 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
  • the method further comprises: d) heating at least the contact surfaces to a temperature of at least 90.degree.
  • the contact surfaces are heated to a temperature of at least 90 ° C (as minimum temperature), preferably to a temperature of at least 150 ° C (as minimum temperature).
  • the temperature is preferably 200 ° C.
  • the heating is preferably carried out to a temperature of a maximum of 270 ° C, in particular a maximum of 240 ° C.
  • steps b) and / or c) are carried out at room temperature. This means that the heating takes place only after the connection according to steps b) and c) has been formed. The connection thus formed is strengthened by the heating.
  • the nanowires connect particularly well to the contact surfaces. Accordingly, it is sufficient that only the contact surfaces are heated. In practice, with this kind of heating there is usually no distinction between whether the contact surfaces, the nanowires, the connection element, the first component partially or entirely and / or the second component partially or entirely heated. This is particularly the case when thermally conductive materials are used.
  • the heating according to step d) can in particular take place in that the first component, the second component and the connecting element are heated as a whole, for example in an oven. Alternatively, however, it is also possible to introduce heat locally into the area of the connection, in particular into the area of the contact surfaces.
  • the minimum temperature described is reached once, at least for a short time. It is not necessary to maintain the minimum temperature. However, it is preferred that the temperature to which it is heated in accordance with step d) is held for at least ten seconds, preferably at least 30 seconds. It can thus be ensured that the connection is formed as desired. Keeping the temperature for a longer period of time is generally not harmful.
  • Steps b) and c) as well as step d) can be carried out at least partially in a temporally overlapping manner.
  • preheating can take place before or during steps b) and c), which can be regarded as part of step d).
  • step d) can also begin before step b) or c).
  • step d) is carried out to the extent that the temperature required according to step d) is present at least temporarily even after step b) or c) has been completed.
  • a connection between two components can be obtained without a temperature occurring at the same level as, for example, during welding or brazing.
  • this advantage can be used in that heating is dispensed with to an extent that is not required. In this way, damage to the components, for example, can be avoided. Inflammation of combustible materials can also be excluded due to the low temperatures described. Accordingly, it is particularly preferred that at no point in time of the described method does a temperature of the first component and / or the second component exceed 270 ° C., in particular 240 ° C.
  • the first component and the second component are at least during part of the heating with a pressure of at least 5 MPa, in particular at least 15 MPa, and / or of at most 200 MPa, in particular 70 MPa, on the connecting element pressed. This can in particular take place in that the two components are pressed towards one another while the connecting element is arranged between the two components.
  • the pressure used is preferably in the range of 5 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
  • the pressure is preferably above the specified lower limit at least in a time segment in which the temperature exceeds the lower limit specified for this.
  • the nanowires and the contact surface are exposed to both a corresponding pressure and a corresponding temperature, at least in this time segment.
  • the connection can be formed by the action of pressure and temperature.
  • the first connection surface and the second connection surface are formed opposite one another.
  • the first connection surface and the second connection surface are preferably arranged parallel to one another.
  • the connecting element can be arranged between two components to be connected.
  • the connec tion element (apart from the formation of the connection) only has the effect that the contact surfaces are not directly adjacent to one another, but rather are arranged at a distance from one another by the material thickness of the connecting element in particular. An orientation of the contact surfaces relative to one another remains unaffected by the connecting element.
  • first connection surface and the second connection surface can also be provided, for example, at different points on the respective, in particular planar, surface of the connection element.
  • first component can be connected to the connecting element at a first of these locations and the second component at a second of these locations.
  • the first component and the second component are semiconductor components which are fastened to one another.
  • connection element is formed from an electrically insulating third material, is coated with an electrically conductive first material in the area of the first connection surface and is coated with an electrically conductive second material in the area of the second connection surface.
  • the connection surfaces are formed by the coatings.
  • the first connection surface and the second connection surface are preferably structured in such a way that subregions of the respective connection surfaces that are electrically isolated from one another result.
  • the connecting element preferably has local electrically conductive connections between an upper side and a lower side of the connecting element.
  • a partial area of the first connection surface can be connected in an electrically conductive manner to a partial area of the second connection surface via a local connection. This can be used to make contact with the contacts of the semiconductor components.
  • the subregions can be designed as conductor tracks via which the signals can be distributed.
  • a first DRAM can be connected as a first component to a base of a housing, for example via a simple nanowire connection.
  • a second DRAM can be attached as a second component on the first DRAM.
  • the connecting element located between the DRAMs is preferably dimensioned such that it can also be attached to the bottom of the housing next to the first DRMA.
  • the connecting element is preferably also used for signal distribution, in particular for the second DRAM.
  • contacts of the second DRAM can be connected to subregions of the first connection surface that are electrically isolated from one another.
  • the conductor tracks formed in this way on the top of the connection element can be connected to contacts on the bottom of the housing, optionally via conductor tracks that are electrically isolated from one another on the underside of the connection element.
  • Contacts of the second DRMA can also be connected directly to contacts of the first DRAM via a respective local electrically conductive connection.
  • Further DRAMs can be attached to the second DRAM in an analogous manner. For example, 10 DRAMs can be stacked and contacted.
  • a connecting element for connecting a first component to a second component is presented as a further aspect.
  • the connecting element has a plurality of nanowires in each case on a first connecting surface on a first side of the connecting element and on a second connecting surface on a second side of the connecting element opposite the first side.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are made of different materials.
  • the connecting element is designed like a film.
  • a film-like design is to be understood as meaning that the connecting element has a thickness which is very much smaller than the extent of the connecting element in the other directions.
  • the connecting element has a thickness of at most 5 mm.
  • the thickness of the connecting element is preferably in the range of 0.05 mm and 5 mm [millimeters], in particular in the range of 0.1 mm and 1 mm.
  • the connecting element is designed in the form of a band.
  • the first side and the opposite second side of the connecting element in this embodiment are the two surfaces of the belt which have a considerably larger surface area than all other surfaces (which result from the material strength of the belt).
  • the tape material can be provided as a roll, for example.
  • the nanowires can already be provided on the strip material and protected, for example, by a protective varnish. Before using the connecting element, the protective varnish can be removed and the nanowires exposed. A part of the strip material required in each case can be separated from the roll for use.
  • the connecting element can also be referred to as a “connecting tape” and in particular as a “Velcro welding tape”.
  • the connecting element is at least partially electrically and / or thermally conductive.
  • connection formed can be particularly good electrically and / or thermally conductive.
  • first connection area and the second connection area are electrically insulated from one another.
  • the first connection surface and the second connection surface should in any case be regarded as electrically isolated from one another if an electrical resistance between the first connection surface and the second connection surface is measured to be at least 100 k ⁇ under the following conditions with a four-point measurement: room temperature, humidity 20%, measurement at constant voltage (i.e. not with alternating voltage), measurement with a respective electrode on the first connection surface and on the second connection surface, the electrodes touching the respective connection surface with an area of 1 cm 2.
  • an electrically insulating, but mechanically stable and optionally also thermally conductive connection can be formed between the contact surfaces.
  • a specific electrical resistance of the material of the connecting element in the area between the first connecting surface and the second connecting surface is preferably at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m, at room temperature.
  • the specification described for the specific electrical resistance of the material of the connecting element relates to a measurement at constant voltage.
  • different results can be obtained, which can depend in particular on the frequency of the alternating voltage.
  • the stated value of at least 10 5 ⁇ m, preferably at least 10 8 ⁇ m, relates to the material of the connecting element.
  • the specific resistance of various materials is available in the specialist literature, for example in tables. Reference is made here to such information. If the connecting element is formed continuously from a specific material, the specific resistance of the material of the connecting element to be used here is the value that is indicated in the specialist literature for this specific material. This definition excludes all effects that do not result from the material but, for example, from the shape of the connecting element. If the connecting element is composed of different materials, the specific contradiction of the individual materials is to be determined from the specialist literature and the total specific resistance of the material of the connecting element, i.e. the composition of the materials, is to be determined.
  • the connecting element is formed from a third material and coated with a first material in the area of the first connecting surface and coated with a second material in the area of the second connecting surface, the electrical insulation between the connecting surfaces can be achieved by electrically using the third material is insulating.
  • the first material and the second material can be electrically conductive.
  • metallic nanowires can be grown on connecting surfaces of the same material in each case, with electrical insulation being nevertheless achieved through the third material.
  • the connecting element is formed from a ceramic material in the area between the first connecting surface and the second connecting surface.
  • an arrangement which comprises:
  • a first component which is connected to the connecting element by means of a multiplicity of nanowires via a first connecting surface on a first side of a connecting element
  • a second component which is connected to the connecting element by means of a multiplicity of nanowires via a second connecting surface on a second side of the connecting element opposite the first side.
  • the nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials.
  • FIG. 1 an illustration of a method according to the invention for connecting two components
  • FIG. 2 an illustration of an arrangement according to the invention of two components connected to one another according to the method from FIG. 1,
  • Fig. 3 a first embodiment of the connecting element from the arrangement from Fig. 2, and
  • FIG. 4 a second embodiment of the connecting element from the arrangement from FIG. 2.
  • the reference symbols used relate to FIG first connection surface 7 on a first side 10 of the connection element 6 and on a second connection surface 8 on a second side 11 of the connection element 6 opposite the first side 10, b) merging a contact surface 4 of the first component 2 with the first connection surface 7 of the Connecting element 6, and c) bringing together a contact surface 5 of the second component 3 with the second connecting surface 8 of the connecting element 6.
  • the nanowires 1 are formed from different materials. In the example described here, the nanowires 1 are formed on the first connecting surface 7 from copper, and the nanowires 1 on the second connecting surface 8 are made from silver.
  • the first component 2 is a circuit board and the second component 3 is an electronic component such as a MOSFET or an IGBT module.
  • Steps b) and / or c) are preferably carried out at room temperature.
  • the method can furthermore comprise the following optional step indicated in FIG. 1 by a dashed box: d) heating at least the contact surfaces 4, 5 to a temperature of at least 150.degree.
  • FIG. 2 shows an arrangement 9 which can be obtained with the method from FIG. 1.
  • the arrangement 9 comprises a first component 2, which is connected to the connecting element 6 by means of a multiplicity of nanowires 1 via a first connecting surface 7 on a first side 10 of a connecting element 6.
  • the arrangement 9 further comprises a second component 3, which is connected to the connecting element 6 by means of a plurality of nanowires 1 via a second connecting surface 8 on a second side 11 of the connecting element 6 opposite the first side 10.
  • the first component 2 and the second component 3 have a respective contact surface 4, 5.
  • the nanowires 1 are formed from different materials.
  • the connecting element 6 is formed like a film.
  • a thickness of the connec tion element 6 is at most 5 mm.
  • the thickness of the connecting element 6 can be seen in Fig. 2 as the extension of the connecting element 6 in a vertical direction Rich.
  • 3 shows a first embodiment of the connecting element 6 from the arrangement 9 from FIG. 2.
  • the first connecting surface 7 is formed from a first material 12 which corresponds to the material of the nanowires 1 on the first connecting surface 7.
  • the second connection surface 8 is formed from a second material 13 which corresponds to the material of the nanowires 1 on the second connection surface 8.
  • the connecting element 6 is formed from a third material 14 and coated with the first material 12 in the area of the first connecting surface 7 and coated with the second material 13 in the area of the second connecting surface 8.
  • FIG. 4 shows a second embodiment of the connecting element 6 from the arrangement 9 from FIG. 2.
  • the connecting element 6 is formed from the first material 12 and coated with the second material 13 in the area of the second connecting surface 8.
  • the first connection surface 7 is not formed by a coating, but rather by the side of the first material 12 that is at the bottom in FIG. 4.
  • Connection element first connection surface second connection surface

Abstract

A connection element (6) for connecting a first component (2) to a second component (3) has, on a first connection surface (7) on a first side (10) of the connection element (6) and on a second connection surface (8) on a second side (11) of the connection element (6) opposite the first side (10), respective pluralities of nanowires (1), the nanowires (1) on the first connection surface (7) and the nanowires (1) on the second connection surface (8) being made of different materials. A method for connecting a first component (2) to a second component (3) comprises: a) providing the connection element (6), b) bringing together a contact surface (4) of the first component (2) and the first connection surface (7) of the connection element (6), and c) bringing together a contact surface (5) of the second component (3) and the second connection surface (8) of the connection element (6). The nanowires (1) on the first connection surface (7) can be made of a metal and/or the nanowires (1) on the second connection surface (8) can be made of a metal. The nanowires (1) on the first connection surface (7) can be made of the material of the contact surface (4) of the first component (2) and/or the nanowires (1) on the second connection surface (8) can be made of the material of the contact surface (5) of the second component (3). The first component (2) can be a circuit board, the contact surface (4) of the first component (2) being made of copper. The second component (3) can be an electronic element, the contact surface (5) of the second component (3) being made of silver, nickel and/or gold. The first component (2) and the second component (3) can be semiconductor parts which are fastened on top of each other. It is also possible to attach a component such as a sensor (as the first component (2)) to a wall or mount (as the second component (3)). The method can also comprise a step of d) heating at least the contact surfaces (4, 5) to a temperature of at least 90°C. The heating can be carried out after the connection has been formed according to step b) and c) or, alternatively, steps b) and c) and step d) can be performed at least partly simultaneously. The connection element (6) can be a foil-type connection element.

Description

Multimetall Klettwelding Multimetal Velcro Welding
Die vorliegende Erfindung betrifft ein Verfahren und ein Verbindungselement zum Verbinden eines ersten Bauteils mit einem zweiten Bauteil sowie eine An ordnung von zwei miteinander verbundenen Bauteilen, insbesondere in Bezug auf Bauteile aus der Elektronik. The present invention relates to a method and a connecting element for connecting a first component to a second component and to an arrangement of two interconnected components, in particular with regard to components from electronics.
Bei den verschiedensten Anwendungen gibt es die Anforderung, Körper mitei nander zu verbinden. Beispielsweise können zwei metallische Körper oder zwei Körper aus unterschiedlichen Materialien miteinander zu verbinden sein. Das ist insbesondere in der Elektronik der Fall. Zum Ausbilden derartiger Verbindungen sind aus dem Stand der Technik die unterschiedlichsten Verfahren bekannt. So sind insbesondere Verfahren bekannt, die zum Beispiel elektrische Leiter oder Körper aus Kupfer durch Schweißen, Hart- oder Weich-Löten, Kleben, Ver schrauben, Vernieten oder Verprägen verbinden. Bei derartigen Verfahren werden präparierte Flächen präzise zueinander ausgerichtet und miteinander verbunden. Die zu verbindenden Körper müssen somit längentechnisch in Ihrer Ausdehnung und ihrem Verbindungsort eindeutig geometrisch bestimmt und vorbereitet sein. Weiterhin müssen im Vorfeld die Vorbereitungen zur Herstellung der Verbindung getroffen werden, wie zum Beispiel das Bohren von Löchern oder das Bereitstel len von entsprechenden Verbindungselementen. Die Verbindungstechniken des Verklebens, Verschraubens und Vernietens sind dabei Raumtemperaturprozesse. Schweißen, Weich- und Hartlöten sind hingegen heiße Prozesse, bei denen flüssi ges Metall erzeugt wird, welches sich volumenfüllend und metallisch interagie rend in die Fügestelle einfügt. In the most varied of applications, there is a requirement to connect bodies to one another. For example, two metallic bodies or two bodies made of different materials can be connected to one another. This is particularly the case in electronics. A wide variety of methods are known from the prior art for forming such connections. In particular, methods are known which, for example, connect electrical conductors or bodies made of copper by welding, hard or soft soldering, gluing, screwing, riveting or embossing. In such methods, prepared surfaces are precisely aligned with one another and connected to one another. The bodies to be connected must therefore be clearly geometrically determined and prepared in terms of their length and their connection location. Furthermore, the preparations for making the connection must be made in advance, such as drilling holes or providing appropriate connecting elements. The connection techniques of gluing, screwing and riveting are room temperature processes. Welding, soft and hard soldering, on the other hand, are hot processes in which liquid metal is generated, which fills the volume and integrates metal into the joint.
Verschweißen hat durch seinen erheblichen Temperatureintrag von regelmäßig bis zu 1400°C den Nachteil, dass es zum einen die betroffenen Körper im erheblichen Maße erhitzt, so dass eine Gefahr des Auslösens eines Brandes brennbarer Mate rialien entsteht. Auch kann es zu optischen Veränderungen der Oberfläche der zu verbindenden Körper kommen, was insbesondere bei vorbehandelten Oberflächen mit Lacken, Folien oder Beschichtungen problematisch sein kann. Außerdem sind viele Materialien nicht schweißfähig. Due to its considerable temperature input of regularly up to 1400 ° C, welding has the disadvantage that, on the one hand, it heats the affected body to a considerable extent, so that there is a risk of igniting flammable materials. There may also be visual changes to the surface of the too connecting bodies come, which can be problematic in particular in the case of pretreated surfaces with paints, foils or coatings. In addition, many materials cannot be welded.
Hartlöten beispielsweise von Kupfer kann ebenfalls durch seinen erheblichen thermischen Energieeintrag zur Folge haben, dass sich die an der Verbindung be teiligten Komponenten erheblich (insbesondere über 400°C) erhitzen. Das kann dazu führen, dass entflammbare Materialien entzündet werden. Brazing of copper, for example, can also cause the components involved in the connection to heat up considerably (in particular above 400 ° C.) due to its considerable thermal energy input. This can cause flammable materials to ignite.
Weichlöten beispielsweise von Kupfer kann den Nachteil haben, dass einerseits die Scherfestigkeit der Verbindung geringer als erforderlich ist und andererseits, dass bei Weichloten Temperatur-Wechselbelastungen zur Entmischung des Me talls und damit zu einer Versprödung der Verbindung führen. Das kann zum Ver sagen der Verbindung führen. Weiterhin haben Weichlote den Nachteil, dass sie einen deutlich größeren Übergangswiderstand der Verbindung als beispielswiese reines Kupfer haben. Ein weiterer Nachteil von Weichlotverbindungen besteht in der geringen mechanischen Dauerfestigkeit, die regelmäßig nur bis etwa 120°C besteht. Auch ist die Korrosionsbeständigkeit einer derartigen Verbindung gegen saure Medien oft unzureichend. Soft soldering of copper, for example, can have the disadvantage that, on the one hand, the shear strength of the connection is lower than necessary and, on the other hand, that with soft solders, alternating temperature loads lead to segregation of the metal and thus to embrittlement of the connection. This can lead to the connection failing. Furthermore, soft solders have the disadvantage that they have a significantly higher contact resistance of the connection than, for example, pure copper. Another disadvantage of soft solder connections is their low mechanical fatigue strength, which usually only exists up to around 120 ° C. The corrosion resistance of such a connection to acidic media is also often inadequate.
Beim Verkleben von besonders leitfähigen Komponenten, wie zum Beispiel von Kupferkomponenten, besteht regelmäßig der Nachteil, dass der elektrische Über gangswiderstand durch die Klebung im erheblichen Maße negativ beeinflusst wird. Durch eine Leitklebung können die mechanischen Anforderungen an die mechanische Festigkeit der Verbindung nicht immer erfüllt werden. Auch besteht eine hinreichende mechanische Festigkeit regelmäßig nur bis zu einem Tempera turbereich von nur 120°C. Das kann insbesondere einen Einsatz in warmen oder heißen Umgebungen und/oder eine Verwendung heißer Medien unmöglich ma chen. Beim Verschrauben und Vernieten müssen die Teile besonders präzise aneinan dergefügt werden. Das benötigte Loch und der Aufbau durch die Schraube oder Nietverbindung führt regelmäßig weiterhin zu einer optischen Beeinträchtigung des optischen und mechanischen Erscheinungsbildes der Gesamtkonstruktion. Weiterhin muss konstruktiv sichergestellt werden, dass im Vorfeld bekannt ist, an welcher exakten Stelle die Verbindung erfolgen soll. Das kann die Verwendbar keit von nicht-längendefinierten Bauteilen erschweren oder verhindern. Weiterhin besteht bei einer derartigen Verbindung regelmäßig ein Restspalt zwischen den Bauteilen. Durch Kapillarwirkung kann es zu einem Eintrag von Feuchtigkeit in den Restspalt und nachfolgend zu Korrosion kommen. Durch Korrosion kann die Verbindung beschädigt werden. Auch kann ein elektrischer und/oder thermischer Übergangswiderstand der Verbindung ansteigen. Weiterhin kann ein Loch für eine Schraube oder Niete Undichtigkeiten im Bereich der Verbindung verursa chen. Das kann den Einsatz einer solchen Verbindung beispielsweise für Gefäße oder Drucksysteme erschweren, insbesondere indem zusätzliche Dichtmittel benö tigt werden. When gluing particularly conductive components, such as copper components, there is usually the disadvantage that the electrical transition resistance is negatively influenced to a considerable extent by the gluing. With conductive bonding, the mechanical requirements for the mechanical strength of the connection cannot always be met. There is also sufficient mechanical strength regularly only up to a temperature range of only 120 ° C. In particular, this can make use in warm or hot environments and / or use of hot media impossible. When screwing and riveting, the parts have to be joined together with great precision. The required hole and the structure through the screw or rivet connection regularly leads to an optical impairment of the optical and mechanical appearance of the overall construction. Furthermore, it must be structurally ensured that it is known in advance at which exact point the connection is to be made. This can make it difficult or impossible to use components that are not defined in length. Furthermore, with such a connection there is usually a residual gap between the components. Capillary action can lead to moisture entering the remaining gap and subsequent corrosion. Corrosion can damage the connection. An electrical and / or thermal contact resistance of the connection can also increase. Furthermore, a hole for a screw or rivet can cause leaks in the area of the connection. This can make the use of such a connection more difficult, for example for vessels or pressure systems, in particular by requiring additional sealing means.
Hiervon ausgehend ist es Aufgabe der hier vorliegenden Erfindung, die im Zu sammenhang mit dem Stand der Technik geschilderten technischen Probleme zu lösen bzw. zumindest zu verringern. Es sollen insbesondere ein Verfahren und ein Verbindungselement zum Verbinden eines ersten Bauteils mit einem zweiten Bauteil sowie eine Anordnung von zwei miteinander verbundenen Bauteilen vor gestellt werden, bei denen eine besonders mechanische stabile und besonders gut elektrisch und/oder thermisch leitfähige Verbindung zwischen den Bauteilen auf besonders sichere und einfache Weise ausgebildet wird bzw. ist. Proceeding from this, it is the object of the present invention to solve or at least reduce the technical problems described in connection with the prior art. In particular, a method and a connecting element for connecting a first component to a second component as well as an arrangement of two interconnected components are to be provided in which a particularly mechanically stable and particularly good electrically and / or thermally conductive connection between the components is particularly important safe and simple way is formed or is.
Diese Aufgaben werden gelöst mit einem Verfahren, mit einem Verbindungsele ment und mit einer Anordnung gemäß den Merkmalen der unabhängigen Pa tentansprüche. Weitere vorteilhafte Ausgestaltungen sind in den jeweils abhängig formulierten Patentansprüchen angegeben. Die in den Patentansprüchen einzeln aufgeführten Merkmale sind in beliebiger, technologisch sinnvoller Weise mitei nander kombinierbar und können durch erläuternde Sachverhalte aus der Be schreibung ergänzt werden, wobei weitere Ausführungsvarianten der Erfindung aufgezeigt werden. These objects are achieved with a method, with a connecting element and with an arrangement according to the features of the independent patent claims. Further advantageous refinements are specified in the patent claims, which are formulated as dependently in each case. The in the claims individually listed features can be combined with each other in any technologically sensible manner and can be supplemented by explanatory facts from the description, with further variants of the invention being shown.
Erfindungsgemäß wird ein Verfahren zum Verbinden eines ersten Bauteils mit einem zweiten Bauteil vorgestellt. Das Verfahren umfasst: a) Bereitstellen eines Verbindungselements mit einer jeweiligen Vielzahl von Nanodrähten auf einer ersten Verbindungsfläche an einer ersten Seite des Verbindungselements und auf einer zweiten Verbindungsfläche an einer der ersten Seite gegenüberliegenden zweiten Seite des Verbindungselements, wobei die Nanodrähte auf der ersten Verbindungsfläche und die Nanodrähte auf der zweiten Verbindungsfläche aus unterschiedlichen Materialien gebildet sind, b) Zusammenführen einer Kontaktfläche des ersten Bauteils mit der ersten Ver bindungsfläche des Verbindungselements, und c) Zusammenführen einer Kontaktfläche des zweiten Bauteils mit der zweiten Verbindungsfläche des Verbindungselements. According to the invention, a method for connecting a first component to a second component is presented. The method comprises: a) providing a connecting element with a respective plurality of nanowires on a first connecting surface on a first side of the connecting element and on a second connecting surface on a second side of the connecting element opposite the first side, the nanowires on the first connecting surface and the Nanowires are formed from different materials on the second connecting surface, b) merging a contact surface of the first component with the first connecting surface of the connecting element, and c) merging a contact surface of the second component with the second connecting surface of the connecting element.
Bei dem ersten Bauteil und dem zweiten Bauteil handelt es sich vorzugsweise um elektronische Bauteile wie beispielsweise Halbleiterbauelemente, Computerchips, Mikroprozessoren oder Platinen. Das erste Bauteil und/oder das zweite Bauteil sind vorzugsweise zumindest teilweise elektrisch und/oder thermisch leitfähig. The first component and the second component are preferably electronic components such as semiconductor components, computer chips, microprocessors or circuit boards. The first component and / or the second component are preferably at least partially electrically and / or thermally conductive.
Eine elektrische und/oder thermische Leitfähigkeit im hier verwendeten Sinne liegt insbesondere bei Metallen wie beispielsweise Kupfer vor, die allgemein als „elektrisch leitfähig“ oder gleichbedeutend als „elektrisch leitend“ bzw. „ther misch leitfähig“ oder „thermisch leitend“ bezeichnet werden. Insbesondere sollen allgemein als elektrisch bzw. thermisch isolierend betrachtete Materialien hier nicht als elektrisch bzw. thermisch leitfähig angesehen werden. Das beschriebene Verfahren ist nicht auf Anwendungen im Bereich der Elektronik beschränkt. So ist es beispielsweise auch möglich, ein Bauteil wie einen Sensor (als ein erstes Bauteil) gemäß dem beschriebenen Verfahren an einer Wand oder Halterung (als einem zweiten Bauteil) zu montieren. Durch das beschriebene Ver fahren kann zwischen dem ersten Bauteil und dem zweiten Bauteil insbesondere eine mechanisch stabile sowie elektrisch und/oder thermisch leitfähige Verbin dung ausgebildet werden. Somit kann das beschriebene Verfahren in allen Berei chen angewendet werden, in denen eine entsprechende Verbindung zwischen zwei Bauteilen erforderlich ist. Auch ist das beschriebene Verfahren nicht auf eine be stimmte Größe der Bauteile begrenzt. So eignet sich das beschriebene Verfahren beispielsweise für eine Anwendung im Bereich der (Mikro)elektronik oder zur Verbindung von deutlich größeren Bauteilen auf makroskopischer Ebene. An electrical and / or thermal conductivity in the sense used here is present in particular with metals such as copper, which are generally referred to as “electrically conductive” or equivalent as “electrically conductive” or “thermally conductive” or “thermally conductive”. In particular, materials that are generally considered to be electrically or thermally insulating should not be viewed here as being electrically or thermally conductive. The method described is not restricted to applications in the field of electronics. For example, it is also possible to mount a component such as a sensor (as a first component) on a wall or bracket (as a second component) according to the method described. Using the described method, a mechanically stable and electrically and / or thermally conductive connection can in particular be formed between the first component and the second component. Thus, the method described can be used in all areas in which a corresponding connection between two components is required. The method described is not limited to a certain size of the components. For example, the method described is suitable for use in (micro) electronics or for connecting significantly larger components on a macroscopic level.
Die Bauteile können über jeweilige Kontaktflächen mit dem Verbindungselement verbunden werden. Bei einer Kontaktfläche handelt es sich insbesondere um einen räumlich ausgezeichneten Bereich einer Oberfläche des jeweiligen Bauteils. Ins besondere ist es bevorzugt, dass die Kontaktflächen durch Ausbildung der Ver bindung ausgezeichnet werden. Das bedeutet, dass die Kontaktfläche sich zu nächst nicht von der restlichen Oberfläche des Bauteils unterscheidet und erst durch Ausbilden der Verbindung derart hervortritt, dass die Kontaktfläche die Fläche ist, an der die Verbindung ausgebildet ist. In diesem Fall ist die Kontakt fläche zunächst nur gedanklich vom restlichen Teil der Oberfläche des Bauteils abgegrenzt. Im Bereich der Kontaktflächen können die Nanodrähte des Verbin dungselements mit dem jeweiligen Bauteil in Kontakt gelangen. The components can be connected to the connecting element via respective contact surfaces. A contact area is, in particular, a spatially distinctive area of a surface of the respective component. In particular, it is preferred that the contact surfaces are distinguished by the formation of the connection. This means that the contact surface does not initially differ from the rest of the surface of the component and only emerges when the connection is formed in such a way that the contact surface is the surface on which the connection is formed. In this case, the contact area is initially only conceptually delimited from the rest of the surface of the component. In the area of the contact surfaces, the nanowires of the connecting element can come into contact with the respective component.
Die Kontaktflächen sind vorzugsweise jeweils einfach zusammenhängende Berei che der Oberfläche des jeweiligen Bauteils. Alternativ ist es möglich, dass die jeweilige Kontaktfläche des ersten Bauteils und/oder des zweiten Bauteils in meh rere voneinander getrennte Unterbereiche der Oberfläche des jeweiligen Bauteils unterteilt sind. So kann eine Kontaktfläche zwei oder mehr voneinander getrennte Abschnitte der Oberfläche des jeweiligen Bauteils umfassen. Die Kontaktflächen können elektrisch und/oder thermisch leitfähig oder isolierend sein. Bevorzugt ist, dass die Kontaktflächen elektrisch und/oder thermisch leitfähig sind, so dass eine elektrisch und/oder thermisch leitfähige Verbindung ausgebildet werden kann. The contact surfaces are preferably each simply connected areas of the surface of the respective component. Alternatively, it is possible that the respective contact surface of the first component and / or of the second component is divided into several subregions of the surface of the respective component that are separate from one another are divided. Thus, a contact surface can comprise two or more separate sections of the surface of the respective component. The contact surfaces can be electrically and / or thermally conductive or insulating. It is preferred that the contact surfaces are electrically and / or thermally conductive, so that an electrically and / or thermally conductive connection can be formed.
Vorzugsweise sind die Bauteile starr ausgeführt oder weisen zumindest eine starre Oberfläche auf, an der die jeweilige Kontaktfläche vorgesehen ist. Das bedeutet insbesondere, dass die Bauteile (oder zumindest die Kontaktflächen) vorzugswei se nicht flexibel sind. Mit starren Bauteilen bzw. Kontaktflächen kann eine Ver bindung nach dem beschriebenen Verfahren besonders gut ausgebildet werden. Wäre z.B. eines der Bauteile flexibel ausgeführt, so könnte es möglich sein, dass die Verbindung aufgrund einer Belastung der Nanodrähte bricht. In Abhängigkeit der genauen Umstände kann das beschriebene Verfahren aber auch mit flexiblen Bauteilen bzw. Kontaktflächen vorteilhaft eingesetzt werden. The components are preferably designed to be rigid or have at least one rigid surface on which the respective contact surface is provided. This means in particular that the components (or at least the contact surfaces) are preferably not flexible. With rigid components or contact surfaces, a connection can be formed particularly well using the method described. If, for example, one of the components were designed to be flexible, it could be possible that the connection breaks due to stress on the nanowires. Depending on the precise circumstances, the method described can also be used advantageously with flexible components or contact surfaces.
Die Verbindungen zwischen den ersten Bauteilen und dem Verbindungselement werden bei dem beschriebenen Verfahren über eine Vielzahl von Nanodrähten ausgebildet. In the method described, the connections between the first components and the connecting element are formed via a multiplicity of nanowires.
Unter einem Nanodraht (engl „nanowire“) wird hier jeder materielle Körper ver standen, der eine drahtähnliche Form und eine Größe im Bereich von wenigen Nanometern bis zu wenigen Mikrometern hat. Ein Nanodraht kann z.B. eine kreis förmige, ovale oder mehreckige Grundfläche aufweisen. Insbesondere kann ein Nanodraht eine hexagonale Grundfläche aufweisen. A nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers. A nanowire can, for example, have a circular, oval or polygonal base. In particular, a nanowire can have a hexagonal base area.
Die Nanodrähte auf der ersten Verbindungsfläche und die Nanodrähte auf der zweiten Verbindungsfläche sind aus unterschiedlichen Materialien gebildet. Die Fähigkeit der Nanodrähte zur Ausbildung einer Verbindung zwischen dem Ver bindungselement und einem Bauteil wird insbesondere durch das Material der Nanodrähte beeinflusst. Je nach Material der Nanodrähte kann die Verbindung unterschiedliche Eigenschaften haben. Insbesondere die mechanische Stärke so wie die elektrische und/oder thermische Leitfähigkeit der Verbindung werden durch das Material der Nanodrähte beeinflusst. Dadurch, dass die Nanodrähte auf den beiden Verbindungsflächen aus unterschiedlichen Materialien gebildet sind, können zwei Verbindungen mit unterschiedlichen Eigenschaften ausgebildet wer den. Somit kann das Verbindungselement auch insoweit als Vermittler zwischen den beiden zu verbindenden Bauteilen angesehen werden, als dass zwei ansonsten nicht oder nur schlecht miteinander verbindbare Bauteile über das Verbindungs element miteinander verbunden werden können. Anstelle einer nicht oder nur schlecht ausbildbaren unmittelbaren Verbindung zwischen den beiden Bauteilen können eine erste Verbindung zwischen dem ersten Bauteil und dem Verbin dungselement sowie eine zweite Verbindung zwischen dem zweiten Bauteil und dem Verbindungselement ausgebildet werden. Die erste Verbindung und die zweite Verbindung können bei geeigneter Wahl der Materialien der Nanodrähte und des Verbindungselements besser ausgebildet werden als die unmittelbare Verbindung zwischen dem ersten Bauteil und dem zweiten Bauteil. The nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials. The ability of the nanowires to form a connection between the connecting element and a component is determined in particular by the material of the Affected nanowires. Depending on the material of the nanowires, the connection can have different properties. In particular, the mechanical strength and the electrical and / or thermal conductivity of the connection are influenced by the material of the nanowires. Because the nanowires are formed from different materials on the two connection surfaces, two connections with different properties can be formed. Thus, the connecting element can also be viewed as an intermediary between the two components to be connected to the extent that two components that are otherwise not or only poorly connectable to one another can be connected to one another via the connecting element. Instead of a direct connection between the two components that cannot or only poorly be formed, a first connection between the first component and the connec tion element and a second connection between the second component and the connection element can be formed. With a suitable choice of the materials of the nanowires and the connecting element, the first connection and the second connection can be formed better than the direct connection between the first component and the second component.
Vorzugsweise sind alle an einer Verbindung beteiligten Nanodrähte aus dem glei chen Material gebildet. Das bedeutet, dass vorzugsweise alle Nanodrähte auf der ersten Verbindungsfläche aus einem ersten Material und alle Nanodrähte auf der zweiten Verbindungsfläche aus einem vom ersten Material verschiedenen zweiten Material gebildet sind. Besonders bevorzugt ist es, dass die Nanodrähte vollstän dig aus einem elektrisch und/oder thermisch leitfähigen Material gebildet sind. Somit kann eine elektrisch und/oder thermisch leitfähige Verbindung ausgebildet werden. Auch das Verbindungselement ist vorzugsweise elektrisch und/oder thermisch leitfähig. Sind die Nanodrähte auf beiden Verbindungsflächen und das Verbindungselement elektrisch und/oder thermisch leitfähig, ist die Verbindung zwischen dem ersten Bauteil und dem zweiten Bauteil durchgehend elektrisch und/oder thermisch leitfähig. Bevorzugt weisen die Nanodrähte eine Länge im Bereich von 100 nm [Nanome ter] bis 100 gm [Mikrometer], insbesondere im Bereich von 500 nm bis 30 gm auf. Weiterhin weisen die Nanodrähte bevorzugt einen Durchmesser im Bereich von 10 nm bis 10 gm, insbesondere im Bereich von 30 nm bis 2 gm auf. Dabei bezieht sich der Begriff Durchmesser auf eine kreisförmige Grundfläche, wobei bei einer davon abweichenden Grundfläche eine vergleichbare Definition eines Durchmessers heranzuziehen ist. Es ist besonders bevorzugt, dass alle verwende ten Nanodrähte die gleiche Länge und den gleichen Durchmesser aufweisen. Preferably, all of the nanowires involved in a connection are formed from the same material. This means that preferably all nanowires on the first connection surface are formed from a first material and all nanowires on the second connection surface are formed from a second material different from the first material. It is particularly preferred that the nanowires are formed completely from an electrically and / or thermally conductive material. An electrically and / or thermally conductive connection can thus be formed. The connecting element is also preferably electrically and / or thermally conductive. If the nanowires on both connection surfaces and the connection element are electrically and / or thermally conductive, the connection between the first component and the second component is electrically and / or thermally conductive throughout. The nanowires preferably have a length in the range from 100 nm [nanometers] to 100 gm [micrometers], in particular in the range from 500 nm to 30 gm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 μm, in particular in the range from 30 nm to 2 μm. The term diameter refers to a circular base area, with a comparable definition of a diameter being used for a base area that differs therefrom. It is particularly preferred that all of the nanowires used have the same length and the same diameter.
Bei dem vorliegend beschriebenen Verfahren werden die Bauteile mittelbar über das Verbindungselement miteinander verbunden. Das hat den Vorteil, dass auf keinem der Bauteile Nanodrähte bereitgestellt werden müssen. Es genügt, dass die Nanodrähte auf dem Verbindungselement vorhanden sind. Insbesondere ist es bevorzugt, dass auf den Kontaktflächen der Bauteile keine Nanodrähte bereitge stellt werden, sondern nur auf den Verbindungsflächen des Verbindungselements. Das kann die Durchführung des Verfahrens erleichtern und insbesondere auch den Anwendungsbereich des Verfahrens auf solche Bauteile erweitern, die einem Wachstum der Nanodrähte nicht oder nur schlecht zugänglich sind. Ferner kann das Wachstum der Nanodrähte lokal von den Bauteilen getrennt erfolgen. Gleichwohl ist es alternativ bevorzugt, dass auch auf der Kontaktfläche des ersten Bauteils und/oder auf der Kontaktfläche des zweiten Bauteils eine jeweilige Viel zahl von Nanodrähten bereitgestellt wird. In the method described here, the components are connected to one another indirectly via the connecting element. This has the advantage that nanowires do not have to be provided on any of the components. It is sufficient that the nanowires are present on the connecting element. In particular, it is preferred that no nanowires are provided on the contact surfaces of the components, but only on the connection surfaces of the connecting element. This can make it easier to carry out the method and, in particular, also expand the application range of the method to those components which are not or only poorly accessible to the growth of the nanowires. Furthermore, the growth of the nanowires can take place locally separately from the components. Nevertheless, it is alternatively preferred that a respective multiplicity of nanowires is also provided on the contact surface of the first component and / or on the contact surface of the second component.
Das Verbindungselement ist vorzugsweise flexibel ausgebildet. Alternativ ist es bevorzugt, dass das Verbindungselement starr ausgebildet ist. So kann das Ver bindungselement beispielsweise als ein festes Metallplättchen ausgebildet sein. The connecting element is preferably designed to be flexible. Alternatively, it is preferred that the connecting element is rigid. For example, the connecting element can be designed as a solid metal plate.
Es ist bevorzugt, dass das Verbindungselement aus einem Kunststoff gebildet ist. Beispielsweise kann das Verbindungselement aus einem Polymer gebildet sein, insbesondere aus Polycarbonat, PVC, Polyester, Polyethylen, Polyamid und/oder PET. Auch kann das Verbindungselement beispielsweise aus einem Keramikma terial, Silizium, Aluminiumoxid oder Glas gebildet sein. Weiterhin kann das Ver bindungselement aus Edelstahl, Aluminium oder Buntmetall gebildet sein. Bevor zugt ist auch, dass das Verbindungselement aus einem Komposit-Material umfas send mehrere der genannten Materialien gebildet ist. It is preferred that the connecting element is formed from a plastic. For example, the connecting element can be formed from a polymer, in particular made of polycarbonate, PVC, polyester, polyethylene, polyamide and / or PET. The connecting element can also be formed, for example, from a ceramic material, silicon, aluminum oxide or glass. Furthermore, the connection element can be made of stainless steel, aluminum or non-ferrous metal. It is also preferred that the connecting element is formed from a composite material comprising several of the materials mentioned.
In Schritt a) wird ein Verbindungselement bereitgestellt, das zwei Verbindungs flächen aufweist. Beide Verbindungsflächen weisen jeweils eine Vielzahl von Nanodrähten auf. Die erste Verbindungsfläche ist an der ersten Seite des Verbin dungselements angeordnet, die zweite Verbindungsfläche an der zweiten Seite des Verbindungselements. Die erste Seite und die zweite Seite des Verbindungsele ments sind einander gegenüberliegend angeordnet. Die erste Seite des Verbin dungselements ist die Seite des Verbindungselements, die nach Ausbildung der Verbindung dem ersten Bauteil zugewandt ist. Die zweite Seite des Verbindungs elements ist die Seite des Verbindungselements, die nach Ausbildung der Verbin dung dem zweiten Bauteil zugewandt ist. Die Bauteile können durch das be schriebene Verfahren mithin insoweit verbunden werden, als dass nach Ausbil dung der Verbindung die Kontaktflächen der beiden Bauteile einander gegenüber stehend auf den beiden Seiten des Verbindungselements angeordnet sind. Ein Ab stand zwischen den beiden Kontaktflächen ist dabei nur durch die Dicke des Ver bindungselements und durch den von den Nanodrähten eingenommenen Raum bedingt. In step a) a connecting element is provided which has two connecting surfaces. Both connection surfaces each have a large number of nanowires. The first connecting surface is arranged on the first side of the connecting element, the second connecting surface on the second side of the connecting element. The first side and the second side of the connecting element are arranged opposite one another. The first side of the connec tion element is the side of the connection element which faces the first component after the connection has been formed. The second side of the connecting element is the side of the connecting element that faces the second component after the connection has been formed. The components can therefore be connected by the method described to the extent that, after the connection has been formed, the contact surfaces of the two components are arranged opposite one another on the two sides of the connecting element. A stand between the two contact surfaces is only a result of the thickness of the connecting element and the space occupied by the nanowires.
In Schritt a) des beschriebenen Verfahrens wird das Verbindungselement bereit gestellt. Unter Bereitstellen ist dabei einerseits zu verstehen, dass ein wie be schrieben ausgebildetes Verbindungselement als Teil des Verfahrens geschafften wird. So können insbesondere die Nanodrähte als Teil des Verfahrens auf die Verbindungsflächen aufgebracht werden, insbesondere durch galvanisches Wachstum. Andererseits umfasst das Bereitstellen aber auch, dass ein Verbin- dungselement verwendet wird, auf dem die Nanodrähte bereits an den Verbin dungsflächen vorhanden sind. So kann beispielsweise ein entsprechend vorberei tetes Verbindungselement von einem Zulieferer bezogen und für das beschriebene Verfahren genutzt werden. Auch ein derartiges Beziehen eines vorbereiteten Ver bindungselements ist ein Bereitstellen eines Verbindungselements im hier ver wendeten Sinne. In step a) of the method described, the connecting element is provided. By providing is to be understood on the one hand that a connecting element designed as described is created as part of the method. In particular, the nanowires can be applied to the connection surfaces as part of the method, in particular by galvanic growth. On the other hand, the provision also includes that a connection Connection element is used on which the nanowires are already present at the connection surfaces. For example, a suitably prepared connecting element can be obtained from a supplier and used for the method described. Obtaining a prepared connecting element in this way is also providing a connecting element in the sense used here.
Die Nanodrähte werden vorzugsweise derart auf den Verbindungsflächen bereit gestellt, dass diese im Wesentlichen senkrecht (vorzugsweise senkrecht) auf der jeweiligen Verbindungsfläche stehen. Die Gesamtheit der Nanodrähte auf einer Verbindungsfläche kann insbesondere als ein Rasen von Nanodrähten bezeichnet werden. Die Nanodrähte können aber auch in beliebiger Orientierung auf den Verbindungsflächen bereitgestellt werden. Auch ist es möglich, dass eine Verbin dungsfläche in eine Mehrzahl von (miteinander verbundenen oder voneinander getrennten) Teilbereichen unterteilt ist, wobei die Nanodrähte in den verschiede nen Teilbereichen verschieden orientiert sind. Damit kann eine besonders stabile Verbindung realisiert werden, die insbesondere auch Scherkräften besonders gut standhalten kann. Weiterhin ist es möglich, dass die Nanodrähte an verschiedenen Stellen der Verbindungsflächen verschieden ausgeführt sind, insbesondere hin sichtlich deren Länge, Durchmesser, Material und Dichte (wobei die Dichte der Nanodrähte angibt, wie viele Nanodrähte pro Fläche vorgesehen sind). The nanowires are preferably provided on the connection surfaces in such a way that they are essentially perpendicular (preferably perpendicular) to the respective connection surface. The entirety of the nanowires on a connection surface can in particular be referred to as a lawn of nanowires. However, the nanowires can also be provided in any orientation on the connection surfaces. It is also possible for a connection surface to be subdivided into a plurality of subregions (connected to one another or separated from one another), the nanowires being oriented differently in the various subregions. In this way, a particularly stable connection can be realized which, in particular, can also withstand shear forces particularly well. Furthermore, it is possible for the nanowires to be designed differently at different points on the connection areas, in particular with regard to their length, diameter, material and density (the density of the nanowires indicating how many nanowires are provided per area).
Das Verbindungselement kann insbesondere als ein Mittler der Verbindung zwi schen dem ersten Bauteil und dem zweiten Bauteil aufgefasst werden. Als Ver bindungselement kommt insbesondere jeder körperliche Gegenstand in Betracht, der geeignet ist, zur Verbindung der Bauteile zwischen den Kontaktflächen der Bauteile angeordnet zu werden. The connecting element can in particular be understood as a mediator of the connection between the first component and the second component. In particular, any physical object that is suitable for connecting the components between the contact surfaces of the components can be considered as a connecting element.
Bei einer Verbindungsfläche handelt es sich insbesondere um einen räumlich aus gezeichneten Bereich einer Oberfläche des Verbindungselements an der jeweili- gen Seite des Verbindungselements. Insbesondere ist es bevorzugt, dass die Ver bindungsflächen durch Ausbildung der Verbindung ausgezeichnet werden. Das bedeutet, dass die Verbindungsflächen sich zunächst nicht von der restlichen Oberfläche des Verbindungselements unterscheiden und erst durch Ausbilden der Verbindung derart hervortreten, dass die Verbindungsflächen die Fläche sind, an denen die Verbindung ausgebildet ist. In diesem Fall ist die Verbindungsfläche vor Ausbildung der Verbindung nur gedanklich vom restlichen Teil der Oberflä che des Verbindungselements abgegrenzt. Beispielsweise kann eine Verbindungs fläche eines flächigen Verbindungselements dadurch ausgezeichnet werden, dass über eine begrenzte Fläche des Verbindungselements (d.h. über die Verbindungs fläche) eine flächige Verbindung zu dem jeweiligen Bauteil ausgebildet wird. A connection surface is in particular a spatially drawn area of a surface of the connection element on the respective gen side of the fastener. In particular, it is preferable that the connection surfaces are distinguished by forming the connection. This means that the connection surfaces do not initially differ from the remaining surface of the connection element and only emerge when the connection is formed in such a way that the connection surfaces are the surface on which the connection is formed. In this case, the connecting surface is only conceptually delimited from the remaining part of the surface of the connecting element before the connection is formed. For example, a connection surface of a planar connection element can be characterized in that a planar connection to the respective component is formed over a limited area of the connection element (ie over the connection surface).
Die Verbindungsfläche ist vorzugsweise so groß wie die entsprechende Kontakt fläche und weist insbesondere vorzugsweise deren Form auf. Es ist aber auch möglich, dass die Kontaktflächen größer oder kleiner sind als die entsprechende Verbindungsfläche und/oder dass die die Kontaktflächen und die entsprechende Verbindungsfläche unterschiedliche Formen aufweisen. The connecting surface is preferably as large as the corresponding contact surface and in particular preferably has its shape. However, it is also possible that the contact areas are larger or smaller than the corresponding connection area and / or that the contact areas and the corresponding connection area have different shapes.
Die Verbindungsflächen sind vorzugsweise jeweils einfach zusammenhängende Bereiche der Oberfläche des Verbindungselements. Alternativ ist es möglich, dass die erste Verbindungsfläche und/oder die zweite Verbindungsfläche in mehrere voneinander getrennte Unterbereiche der Oberfläche des Verbindungselements unterteilt sind. So kann eine Verbindungsfläche zwei oder mehr voneinander ge trennte Abschnitte der Oberfläche des Verbindungselements umfassen. The connecting surfaces are preferably each simply connected areas of the surface of the connecting element. Alternatively, it is possible for the first connection surface and / or the second connection surface to be subdivided into a plurality of mutually separate sub-areas of the surface of the connection element. For example, a connecting surface can comprise two or more sections of the surface of the connecting element that are separated from one another.
In den Schritten b) und c) werden die Kontaktflächen mit den Verbindungsflächen zusammengeführt, also aufeinander zu bewegt. Die Nanodrähte auf den Verbin dungsflächen kommen dadurch mit der jeweiligen Kontaktfläche in Kontakt. Da bei verbinden sich die Nanodrähte mit der entsprechenden Kontaktfläche, wodurch die entsprechende Verbindung zwischen den Bauteilen und dem Verbin dungselement ausgebildet wird. In steps b) and c), the contact surfaces are brought together with the connecting surfaces, that is to say moved towards one another. The nanowires on the connection surfaces come into contact with the respective contact surface. The nanowires connect to the corresponding contact surface, whereby the corresponding connection between the components and the connec tion element is formed.
Die Verbindung wird dadurch ausgebildet, dass sich die Nanodrähte, insbesondere deren der jeweiligen Kontaktfläche zugewandten Enden, mit der Kontaktfläche verbinden. Diese Verbindung wird auf atomarer Ebene ausgebildet. Der dabei atomar ablaufende Vorgang ist dem beim Sintern ablaufenden ähnlich. Die erhal tene Verbindung kann insbesondere derart dicht für Gase und/oder Flüssigkeiten sein, dass eine Korrosion der Verbindung und/oder der miteinander verbundenen Bauteile im Bereich der Verbindung verhindert oder zumindest eingeschränkt werden kann. Insbesondere kann die ausgebildete Verbindung als vollmetallisch betrachtet werden. Das beschriebene Verfahren kann auch als „Klett-Welding“ bezeichnet werden. Damit wird zum Ausdruck gebracht, dass die Verbindung durch eine Vielzahl von Nanodrähten und damit durch eine Vielzahl von längli chen, haarähnlichen Strukturen und durch Erwärmen erhalten wird. Durch die Vielzahl der Nanodrähte können Einebenheiten und Rauigkeiten der Kontaktflä chen ausgeglichen werden. The connection is formed in that the nanowires, in particular their ends facing the respective contact surface, connect to the contact surface. This connection is formed at the atomic level. The atomic process is similar to that during sintering. The connection obtained can in particular be so tight for gases and / or liquids that corrosion of the connection and / or the interconnected components in the area of the connection can be prevented or at least restricted. In particular, the connection formed can be viewed as being fully metallic. The process described can also be referred to as "Velcro welding". This expresses the fact that the connection is obtained by a large number of nanowires and thus by a large number of elongated, hair-like structures and by heating. Due to the large number of nanowires, the flatness and roughness of the contact surfaces can be compensated for.
Aufgrund der Größe der Nanodrähte im Nanometer-Bereich ist die Oberfläche der Verbindung (d.h. die Fläche, über die Kräfte wie die Van-der-Waals-Kraft auf atomarer Ebene wirken) besonders groß. Damit kann die Verbindung besonders gut elektrisch und/oder thermisch leitfähig und/oder mechanisch stabil sein. Für eine elektrisch und/oder thermisch besonders gut leitfähige Verbindung ist es be vorzugt, dass die Nanodrähte aus einem elektrisch und/oder thermisch leitfähigen Material gebildet sind. Besonders bevorzugt ist hier die Verwendung von Kupfer, Silber, Nickel und Gold. Auch die Kontaktflächen sind vorzugsweise aus einem elektrisch und/oder thermisch leitfähigen Material gebildet, insbesondere mit Kupfer, Silber, Nickel oder Gold. Wie weiter oben beschrieben, ist die Verwen dung von Kupfer insbesondere bei Schweißverbindungen nicht möglich. Auf grund der großen Oberfläche der durch das beschriebene Verfahren erhaltenen Verbindung kann eine elektrische und/oder thermische Leitfähigkeit der Verbin dung besonders groß sein. Eine besonders gute thermische Leitfähigkeit der Ver bindung kann beispielsweise die Kühlung der an der Verbindung beteiligten Bau teile verbessern. Insbesondere dazu ist die Verwendung von Kupfer, Silber, Ni- ekel und Gold für die Nanodrähte und/oder für die Kontaktflächen bevorzugt. Due to the size of the nanowires in the nanometer range, the surface area of the connection (ie the area over which forces such as the van der Waals force act at the atomic level) is particularly large. The connection can thus be particularly good electrically and / or thermally conductive and / or mechanically stable. For a connection that is particularly good electrically and / or thermally conductive, it is preferred that the nanowires are formed from an electrically and / or thermally conductive material. The use of copper, silver, nickel and gold is particularly preferred here. The contact surfaces are also preferably formed from an electrically and / or thermally conductive material, in particular with copper, silver, nickel or gold. As described above, the use of copper is not possible, especially for welded joints. Due to the large surface area obtained by the method described Connection, an electrical and / or thermal conductivity of the connection can be particularly high. A particularly good thermal conductivity of the connection can, for example, improve the cooling of the components involved in the connection. The use of copper, silver, nickel and gold for the nanowires and / or for the contact surfaces is particularly preferred for this purpose.
Die beschriebene Verbindung kann weiterhin besonders einfach und ohne Werk zeug ausgebildet werden. Es müssen lediglich die zu verbindenden Bauteile anei nander geführt werden. Eine Erwärmung und eine Druckausübung können optio- nal erfolgen, sind aber nicht zwingend erforderlich. The connection described can also be formed particularly easily and without tools. Only the components to be connected need to be guided to one another. Warming up and exertion of pressure can optionally take place, but are not absolutely necessary.
Die Verfahrensschritte a) bis c) werden vorzugsweise in der angegebenen Reihen folge, insbesondere nacheinander durchgeführt. Insbesondere wird Schritt a) vor zugsweise vor Beginn der Schritte b) und c) durchgeführt. Process steps a) to c) are preferably carried out in the specified order, in particular one after the other. In particular, step a) is carried out preferably before the beginning of steps b) and c).
Werden die Schritte b) und c) nacheinander durchgeführt, kann zunächst die Kon taktfläche des ersten Bauteils mit der ersten Verbindungsfläche, also das erste Bauteil mit dem Verbindungselement, zusammengeführt werden (Schritt b)). An schließend kann das gemäß Schritt b) mit dem ersten Bauteil zusammengeführte Verbindungselement derart mit dem zweiten Bauteil zusammengeführt werden, dass die Kontaktfläche des zweiten Bauteils und die zweite Verbindungsfläche zusammengeführt werden (Schritt c)). If steps b) and c) are carried out one after the other, the contact surface of the first component can first be brought together with the first connection surface, that is to say the first component with the connection element (step b)). Subsequently, the connecting element merged with the first component according to step b) can be merged with the second component in such a way that the contact surface of the second component and the second connecting surface are merged (step c)).
Die Schritte b) und c) können alternativ gleichzeig, zeitlich überlappend oder nacheinander durchgeführt werden. Das ist beispielsweise dadurch möglich, dass das Verbindungselement zwischen den beiden Bauteilen gehalten wird und diese gleichzeitig von beiden Seiten auf das Verbindungselement hinbewegt werden. In einer bevorzugten Ausführungsform des Verfahrens sind die Nanodrähte auf der ersten Verbindungsfläche und/oder die Nanodrähte auf der zweiten Verbin dungsfläche aus einem jeweiligen Metall gebildet. Steps b) and c) can alternatively be carried out at the same time, overlapping in time, or one after the other. This is possible, for example, in that the connecting element is held between the two components and these are moved towards the connecting element from both sides at the same time. In a preferred embodiment of the method, the nanowires on the first connection surface and / or the nanowires on the second connection surface are formed from a respective metal.
Bevorzugt ist, dass die Nanodrähte auf der ersten Verbindungsfläche und die Na nodrähte auf der zweiten Verbindungsfläche aus einem jeweiligen Metall gebildet sind. It is preferred that the nanowires on the first connection surface and the nanowires on the second connection surface are formed from a respective metal.
Die Nanodrähte auf der ersten Verbindungsfläche sind vorzugsweise alle aus ei nem ersten Metall gebildet. Die Nanodrähte auf der zweiten Verbindungsfläche sind vorzugsweise alle aus einem zweiten Metall gebildet. The nanowires on the first connection area are preferably all formed from a first metal. The nanowires on the second connection area are preferably all formed from a second metal.
Insbesondere mit Nanodrähten aus Metall kann eine mechanisch stabile sowie elektrisch und/oder thermisch leitfähige Verbindung ausgebildet werden. In particular with nanowires made of metal, a mechanically stable and electrically and / or thermally conductive connection can be formed.
In einer weiteren bevorzugten Ausführungsform sind die Nanodrähte auf der ers ten Verbindungsfläche aus dem Material der Kontaktfläche des ersten Bauteils gebildet und/oder die Nanodrähte auf der zweiten Verbindungsfläche aus dem Material der Kontaktfläche des zweiten Bauteils gebildet. In a further preferred embodiment, the nanowires on the first connection surface are formed from the material of the contact surface of the first component and / or the nanowires on the second connection surface are formed from the material of the contact surface of the second component.
Vorzugsweise sind die Nanodrähte auf der ersten Verbindungsfläche aus dem Material der Kontaktfläche des ersten Bauteils gebildet und die Nanodrähte auf der zweiten Verbindungsfläche aus dem Material der Kontaktfläche des zweiten Bauteils gebildet. The nanowires on the first connection surface are preferably formed from the material of the contact surface of the first component and the nanowires on the second connection surface are formed from the material of the contact surface of the second component.
Die Verbindung zwischen den Nanodrähten und der jeweiligen Kontaktfläche kann besonders gut ausgebildet werden, wenn die Nanodrähte aus dem gleichen Material wie die Kontaktfläche bestehen. Das liegt daran, dass die Verbindung auf atomarer Ebene ausgebildet wird. Verbindungen zwischen Körpern aus unter schiedlichen Materialien können durch unterschiedliche Gitterstrukturen der Ma- terialien erschwert werden. Bereits eine unterschiedliche Gitterkonstante kann die Ausbildung einer Verbindung erschweren beziehungsweise die Eigenschaften einer ausgebildeten Verbindung nachteilig beeinflussen. The connection between the nanowires and the respective contact surface can be formed particularly well if the nanowires are made of the same material as the contact surface. This is because the connection is formed at the atomic level. Connections between bodies made of different materials can be made by different lattice structures of the ma- materials are made more difficult. Even a different lattice constant can make the formation of a connection more difficult or have a disadvantageous effect on the properties of a connection that is formed.
Die beschriebenen Nachteile einer Verbindung zwischen Körpern aus unter schiedlichen Materialien würden sich auch ergeben, wenn das erste Bauteil und das zweite Bauteil unmittelbar über Nanodrähte miteinander verbunden werden sollten. In dem Fall müsste auf atomarer Ebene eine Verbindung zwischen Nano- drähten unterschiedlichen Materials oder zwischen Nanodrähten und Kontaktflä che unterschiedlichen Materials ausgebildet werden. Durch das Verbindungsele ment wird diese Problematik bei dem vorliegenden Verfahren umgangen. Die Verbindung zwischen den Nanodrähten und dem Verbindungselement erfolgt nicht durch bloßes Zueinanderführen. Stattdessen werden die Nanodrähte auf das Verbindungselement gewachsen. Dadurch kann eine sehr enge Bindung ausgebil det werden. Es ist daher möglich, dass das Verbindungselement aus einem ein heitlichen Material gebildet sein. Alternativ ist es bevorzugt, dass die Verbin dungsflächen des Verbindungselements aus verschiedenen Materialien gebildet sind, vorzugsweise jeweils aus dem Material der entsprechenden Nanodrähte. The described disadvantages of a connection between bodies made of different materials would also arise if the first component and the second component were to be connected to one another directly via nanowires. In that case, a connection between nanowires of different materials or between nanowires and contact surfaces of different materials would have to be established at the atomic level. The connection element avoids this problem in the present method. The connection between the nanowires and the connecting element is not made by simply being brought together. Instead, the nanowires are grown onto the connector. This enables a very close bond to be established. It is therefore possible for the connecting element to be formed from a uniform material. Alternatively, it is preferred that the connection surfaces of the connection element are formed from different materials, preferably each from the material of the corresponding nanowires.
Die erste Verbindungsfläche ist vorzugsweise aus einem ersten Material gebildet, das vorzugsweise dem Material der Nanodrähte auf der ersten Verbindungsfläche entspricht. Die zweite Verbindungsfläche ist vorzugsweise aus einem zweiten Material gebildet, das vorzugsweise dem Material der Nanodrähte auf der zweiten Verbindungsfläche entspricht. Das Verbindungselement ist vorzugsweise aus ei nem dritten Material gebildet und im Bereich der ersten Verbindungsfläche mit dem ersten Material beschichtet und im Bereich der zweiten Verbindungsfläche mit dem zweiten Material beschichtet. Durch die Beschichtungen sind die Ver bindungsflächen gebildet. Vorzugsweise ist das dritte Material elektrisch und/oder thermisch leitend. Alternativ ist es bevorzugt, dass das dritte Material elektrisch und/oder thermisch isolierend ist. In dem Fall ist es bevorzugt, dass das Verbin- dungsei em ent jeweilige lokale elektrisch leitende Verbindungen zwischen Teilbe reichen der ersten Verbindungsfläche und Teilbereichen der zweiten Verbin dungsfläche aufweist. The first connection surface is preferably formed from a first material which preferably corresponds to the material of the nanowires on the first connection surface. The second connection surface is preferably formed from a second material, which preferably corresponds to the material of the nanowires on the second connection surface. The connecting element is preferably formed from a third material and coated with the first material in the region of the first connecting surface and coated with the second material in the region of the second connecting surface. The connection surfaces are formed by the coatings. The third material is preferably electrically and / or thermally conductive. Alternatively, it is preferred that the third material is electrically and / or thermally insulating. In that case it is preferred that the connection dungsei em ent respective local electrically conductive connections between partial areas of the first connecting surface and partial areas of the second connecting surface.
Anstelle des dritten Materials kann das Verbindungselement auch mehrere ver schiedene Materialien aufweisen, die beispielsweise in Schichten angeordnet sind. In dem Fall kann das Verbindungselement auch als ein Hybridtape bezeichnet werden. Instead of the third material, the connecting element can also have several different materials that are arranged in layers, for example. In that case, the connecting element can also be referred to as a hybrid tape.
Alternativ ist es bevorzugt, dass das Verbindungselement aus dem ersten Material gebildet ist und im Bereich der zweiten Verbindungsfläche mit dem zweiten Ma terial beschichtet ist. Als weitere Alternative ist es bevorzugt, dass das Verbin dungselement aus dem zweiten Material gebildet ist und im Bereich der ersten Verbindungsfläche mit dem ersten Material beschichtet ist. Alternatively, it is preferred that the connecting element is formed from the first material and is coated with the second material in the region of the second connecting surface. As a further alternative, it is preferred that the connecting element is formed from the second material and is coated with the first material in the region of the first connecting surface.
In einer weiteren bevorzugten Ausführungsform des Verfahrens ist das erste Bau teil eine Platine, wobei die Kontaktfläche des ersten Bauteils aus Kupfer gebildet ist. In a further preferred embodiment of the method, the first construction part is a circuit board, wherein the contact surface of the first component is made of copper.
In einer weiteren bevorzugten Ausführungsform des Verfahrens ist zweite Bauteil eine elektronische Komponente, wobei die Kontaktfläche des zweiten Bauteils aus Silber, Nickel und/oder Gold gebildet ist. In a further preferred embodiment of the method, the second component is an electronic component, the contact surface of the second component being formed from silver, nickel and / or gold.
Mit dem beschriebenen Verfahren können insbesondere elektronische Komponen ten wie MOSFETS oder IGBT-Bausteine als zweites Bauteil mit Anschlüssen aus Silber als Kontaktfläche auf einer Platine als erstes Bauteil mit Kupfer-Kontakten als Kontaktfläche befestigt werden. With the method described, electronic components such as MOSFETS or IGBT modules in particular can be attached as a second component with connections made of silver as a contact surface on a circuit board as the first component with copper contacts as a contact surface.
In einer weiteren bevorzugten Ausführungsform des Verfahrens werden Schritt b) und/oder Schritt c) bei Raumtemperatur durchgeführt. Die beschriebene Verbindung zwischen den Kontaktflächen und den Verbin dungsflächen kann bereits bei Raumtemperatur ausgebildet werden. Dabei ist es bevorzugt, dass die beiden Bauteile zum Ausbilden der Verbindung aneinander gedrückt werden. Vorzugsweise liegt der dabei verwendete Druck im Bereich von 5 MPa und 200 MPa, insbesondere im Bereich von 15 MPa und 70 MPa. Beson ders bevorzugt ist ein Druck von 20 MPa. In a further preferred embodiment of the method, step b) and / or step c) are carried out at room temperature. The connection described between the contact surfaces and the connec tion surfaces can be formed at room temperature. It is preferred that the two components are pressed against one another to form the connection. The pressure used here is preferably in the range of 5 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
Es ist bevorzugt, dass auch nach Abschluss der Schritte b) und c) keine Erwär mung stattfmdet. Dadurch kann eine Beschädigung der Bauteile durch Tempera tureinwirkung verhindert werden. It is preferred that no heating takes place even after steps b) and c) have been completed. This prevents damage to the components from the effects of temperature.
In einer weiteren bevorzugten Ausführungsform umfasst das Verfahren weiterhin: d) Erwärmen zumindest der Kontaktflächen auf eine Temperatur von mindes tens 90°C. In a further preferred embodiment, the method further comprises: d) heating at least the contact surfaces to a temperature of at least 90.degree.
Die Kontaktflächen werden auf eine Temperatur von mindestens 90°C (als Min desttemperatur), vorzugsweise auf eine Temperatur von mindestens 150°C (als Mindesttemperatur) erwärmt. Vorzugsweise liegt die Temperatur bei 200°C. Die Erwärmung erfolgt vorzugsweise auf eine Temperatur von maximal 270°C, insbe sondere von maximal 240°C. Auch bei der vorliegenden Ausführungsform ist es bevorzugt, dass die Schritte b) und/oder c) bei Raumtemperatur durchgeführt werden. Das bedeutet, dass erst nach Ausbilden der Verbindung gemäß der Schrit te b) und c) die Erwärmung stattfmdet. Durch das Erwärmen wird die so gebildete Verbindung verstärkt. The contact surfaces are heated to a temperature of at least 90 ° C (as minimum temperature), preferably to a temperature of at least 150 ° C (as minimum temperature). The temperature is preferably 200 ° C. The heating is preferably carried out to a temperature of a maximum of 270 ° C, in particular a maximum of 240 ° C. In the present embodiment, too, it is preferred that steps b) and / or c) are carried out at room temperature. This means that the heating takes place only after the connection according to steps b) and c) has been formed. The connection thus formed is strengthened by the heating.
Durch die Erwärmung gemäß Schritt d) verbinden sich die Nanodrähte mit den Kontaktflächen besonders gut. Entsprechend genügt es, dass nur die Kontaktflä chen erwärmt werden. Praktisch ist bei einer derartigen Erwärmung regelmäßig nicht zu unterschieden, ob die Kontaktflächen, die Nanodrähte, das Verbindungs- element, das erste Bauteil teilweise oder insgesamt und/oder das zweite Bauteil teilweise oder insgesamt erwärmt werden. Das ist insbesondere der Fall, wenn thermisch leitfähige Materialien verwendet werden. Für die Ausbildung der Ver bindung ist ein (Mit-)Erwärmen von anderen Komponenten als den Kontaktflä- chen nicht erforderlich, aber auch nicht hinderlich. Somit kann das Erwärmen gemäß Schritt d) insbesondere dadurch erfolgen, dass das erste Bauteil, das zweite Bauteil und das Verbindungselement insgesamt erwärmt werden, beispielsweise in einem Ofen. Alternativ ist es aber auch möglich, lokal Wärme in den Bereich der Verbindung, insbesondere in den Bereich der Kontaktflächen einzutragen. As a result of the heating in accordance with step d), the nanowires connect particularly well to the contact surfaces. Accordingly, it is sufficient that only the contact surfaces are heated. In practice, with this kind of heating there is usually no distinction between whether the contact surfaces, the nanowires, the connection element, the first component partially or entirely and / or the second component partially or entirely heated. This is particularly the case when thermally conductive materials are used. For the formation of the connection (co-) heating of components other than the contact surfaces is not necessary, but neither is it a hindrance. Thus, the heating according to step d) can in particular take place in that the first component, the second component and the connecting element are heated as a whole, for example in an oven. Alternatively, however, it is also possible to introduce heat locally into the area of the connection, in particular into the area of the contact surfaces.
Für das Ausbilden der Verbindung kann es ausreichen, dass die beschriebene Mindesttemperatur einmalig zumindest kurzzeitig erreicht wird. Ein Halten der Mindesttemperatur ist nicht erforderlich. Es ist aber bevorzugt, dass die Tempera tur, auf die gemäß Schritt d) erwärmt wird, für mindestens zehn Sekunden, vor- zugsweise mindestens 30 Sekunden gehalten wird. Damit kann sichergegangen werden, dass die Verbindung wie gewünscht ausgebildet wird. Ein längeres Hal ten der Temperatur ist grundsätzlich nicht schädlich. For the formation of the connection, it can be sufficient that the minimum temperature described is reached once, at least for a short time. It is not necessary to maintain the minimum temperature. However, it is preferred that the temperature to which it is heated in accordance with step d) is held for at least ten seconds, preferably at least 30 seconds. It can thus be ensured that the connection is formed as desired. Keeping the temperature for a longer period of time is generally not harmful.
Die Schritte b) und c) sowie der Schritt d) können zumindest teilweise zeitlich überlappend durchgeführt werden. So kann beispielsweise vor oder während der Schritte b) und c) ein Vorwärmen erfolgen, das als Teil von Schritt d) aufgefasst werden kann. Es ist auch möglich, die jeweilige Kontaktfläche des ersten Bauteils und/oder des zweiten Bauteils vor Schritt d) derart zu erwärmen, dass die zum Ausbilden der Verbindung erforderliche Temperatur bereits beim Zusammenfüh- ren gemäß Schritt b) bzw. c) erreicht ist. Insbesondere insoweit kann Schritt d) also auch vor Schritt b) bzw. c) beginnen. In dem Fall wird Schritt d) insoweit durchgeführt, als dass die gemäß Schritt d) erforderliche Temperatur zumindest zeitweise auch nach Abschluss von Schritt b) bzw. c) vorliegt. Mit dem beschriebenen Verfahren kann eine Verbindung zwischen zwei Bauteilen erhalten werden, ohne dass eine Temperatur in einer Höhe wie etwa beim Schweißen oder Hartlöten auftritt. In der vorliegenden Ausführungsform kann dieser Vorteil dadurch ausgenutzt werden, dass auf eine Erwärmung in einem nicht erforderlichen Umfang verzichtet wird. Somit können Schäden beispielswei se an den Bauteilen vermieden werden. Auch kann ein Entflammen von brennba ren Materialien durch die beschriebenen niedrigen Temperaturen ausgeschlossen werden. Es ist entsprechend insbesondere bevorzugt, dass zu keinem Zeitpunkt der beschriebenen Verfahren eine Temperatur des ersten Bauteils und/oder des zweiten Bauteils 270°C, insbesondere 240°C übersteigt. Steps b) and c) as well as step d) can be carried out at least partially in a temporally overlapping manner. For example, preheating can take place before or during steps b) and c), which can be regarded as part of step d). It is also possible to heat the respective contact surface of the first component and / or the second component before step d) in such a way that the temperature required to form the connection is already reached during the joining according to step b) or c). In this respect, in particular, step d) can also begin before step b) or c). In this case, step d) is carried out to the extent that the temperature required according to step d) is present at least temporarily even after step b) or c) has been completed. With the method described, a connection between two components can be obtained without a temperature occurring at the same level as, for example, during welding or brazing. In the present embodiment, this advantage can be used in that heating is dispensed with to an extent that is not required. In this way, damage to the components, for example, can be avoided. Inflammation of combustible materials can also be excluded due to the low temperatures described. Accordingly, it is particularly preferred that at no point in time of the described method does a temperature of the first component and / or the second component exceed 270 ° C., in particular 240 ° C.
In einer weiteren bevorzugten Ausführungsform des Verfahrens werden das erste Bauteil und das zweite Bauteil zumindest während eines Teils der Erwärmung mit einem Druck von mindestens 5 MPa, insbesondere mindestens 15 MPa, und/oder von höchstens 200 MPa, insbesondere von 70 MPa, an das Verbindungselement gedrückt. Das kann insbesondere dadurch erfolgen, dass die beiden Bauteile auf einander zu gedrückt werden, während das Verbindungselement zwischen den beiden Bauteilen angeordnet ist. In a further preferred embodiment of the method, the first component and the second component are at least during part of the heating with a pressure of at least 5 MPa, in particular at least 15 MPa, and / or of at most 200 MPa, in particular 70 MPa, on the connecting element pressed. This can in particular take place in that the two components are pressed towards one another while the connecting element is arranged between the two components.
Vorzugsweise liegt der verwendete Druck im Bereich von 5 MPA und 200 MPa, insbesondere im Bereich von 15 MPa und 70 MPa. Besonders bevorzugt ist ein Druck von 20 MPa. The pressure used is preferably in the range of 5 MPa and 200 MPa, in particular in the range of 15 MPa and 70 MPa. A pressure of 20 MPa is particularly preferred.
Vorzugsweise liegt der Druck oberhalb der angegebenen unteren Grenze zumin dest in einem Zeitabschnitt vor, in dem die Temperatur die dafür genannte untere Grenze überschreitet. Insoweit werden also die Nanodrähte und die Kontaktfläche zumindest in diesem Zeitabschnitt sowohl einem entsprechenden Druck als auch einer entsprechenden Temperatur ausgesetzt. Dadurch kann die Verbindung durch Einwirkung von Druck und Temperatur ausgebildet werden. In einer weiteren bevorzugten Ausführungsform des Verfahrens sind die erste Verbindungsfläche und die zweite Verbindungsfläche einander gegenüberliegend ausgebildet. The pressure is preferably above the specified lower limit at least in a time segment in which the temperature exceeds the lower limit specified for this. In this respect, the nanowires and the contact surface are exposed to both a corresponding pressure and a corresponding temperature, at least in this time segment. As a result, the connection can be formed by the action of pressure and temperature. In a further preferred embodiment of the method, the first connection surface and the second connection surface are formed opposite one another.
Bevorzugt sind die erste Verbindungsfläche und die zweite Verbindungsfläche parallel zueinander angeordnet. The first connection surface and the second connection surface are preferably arranged parallel to one another.
In der vorliegenden Ausführungsform kann das Verbindungselement zwischen zwei zu verbindenden Bauteilen angeordnet werden. Dabei bewirkt das Verbin dungselement (abgesehen von der Ausbildung der Verbindung) lediglich, dass die Kontaktflächen nicht unmittelbar aneinander anliegend, sondern insbesondere um die Materialstärke des Verbindungselements voneinander beabstandet angeordnet werden. Eine Orientierung der Kontaktflächen relativ zueinander bleibt von dem Verbindungselement unbeeinflusst. In the present embodiment, the connecting element can be arranged between two components to be connected. In this case, the connec tion element (apart from the formation of the connection) only has the effect that the contact surfaces are not directly adjacent to one another, but rather are arranged at a distance from one another by the material thickness of the connecting element in particular. An orientation of the contact surfaces relative to one another remains unaffected by the connecting element.
Alternativ können die erste Verbindungsfläche und die zweite Verbindungsfläche beispielsweise auch an verschiedenen Stellen der jeweiligen insbesondere plana ren Oberfläche des Verbindungselements vorgesehen sein. In dem Fall kann das erste Bauteil an einer ersten dieser Stellen und das zweite Bauteil an einer zweiten dieser Stellen mit dem Verbindungselement verbunden werden. Alternatively, the first connection surface and the second connection surface can also be provided, for example, at different points on the respective, in particular planar, surface of the connection element. In that case, the first component can be connected to the connecting element at a first of these locations and the second component at a second of these locations.
In einer weiteren bevorzugten Ausführungsform des Verfahrens sind erste Bauteil und das zweite Bauteil Halbleiterbauelemente, die aufeinander befestigt werden. In a further preferred embodiment of the method, the first component and the second component are semiconductor components which are fastened to one another.
In dieser Ausführungsform ist es bevorzugt, dass das Verbindungselement aus einem elektrisch isolierenden dritten Material gebildet ist, im Bereich der ersten Verbindungsfläche mit einem elektrisch leitenden ersten Material beschichtet ist und im Bereich der zweiten Verbindungsfläche mit einem elektrisch leitenden zweiten Material beschichtet ist. Durch die Beschichtungen sind die Verbindungs flächen gebildet. Die erste Verbindungsfläche und die zweite Verbindungsfläche sind vorzugsweise derart strukturiert, dass sich elektrisch voneinander isolierte Teilbereiche der jeweiligen Verbindungsflächen ergeben. Vorzugsweise weist das Verbindungselement lokale elektrisch leitende Verbindungen zwischen einer Oberseite und einer Unterseite des Verbindungselements auf. So kann ein Teilbe reich der ersten Verbindungsfläche über eine lokale Verbindung mit einem Teil bereich der zweiten Verbindungsfläche elektrisch leitend verbunden sein. Das kann zum Kontaktieren der Kontakte der Halbleiterbauelemente genutzt werden. Die Teilbereiche können als Leiterbahnen ausgebildet sein, über die die Signale verteilt werden können. In this embodiment, it is preferred that the connection element is formed from an electrically insulating third material, is coated with an electrically conductive first material in the area of the first connection surface and is coated with an electrically conductive second material in the area of the second connection surface. The connection surfaces are formed by the coatings. The first connection surface and the second connection surface are preferably structured in such a way that subregions of the respective connection surfaces that are electrically isolated from one another result. The connecting element preferably has local electrically conductive connections between an upper side and a lower side of the connecting element. Thus, a partial area of the first connection surface can be connected in an electrically conductive manner to a partial area of the second connection surface via a local connection. This can be used to make contact with the contacts of the semiconductor components. The subregions can be designed as conductor tracks via which the signals can be distributed.
Mit dem so gebildeten Verbindungselement können Halbleiterbauelemente wie Halbeiterchips, Microcontroller, RAMs oder DRAMs befestigt und gleichzeitig kontaktiert werden. So kann beispielsweise ein erster DRAM als ein erstes Bauteil mit einem Boden eines Gehäuses verbunden werden, beispielsweise über eine einfache Nanodraht-Verbindung. Über das beschriebene Verfahren kann ein zwei ter DRAM als ein zweites Bauteil auf dem ersten DRAM befestigt werden. Das zwischen den DRAMs liegende Verbindungselement ist vorzugsweise so dimen sioniert, dass es auch neben dem ersten DRMA am Boden des Gehäuses befestigt werden kann. Das Verbindungselement dient vorzugsweise auch der Signalvertei lung, insbesondere für den zweiten DRAM. So können Kontakte des zweiten DRAMs an voneinander elektrisch isolierte Teilbereiche der ersten Verbindungs fläche angebunden sein. Durch eine jeweilige lokale elektrisch leitende Verbin dung in dem ansonsten elektrisch isolierenden Verbindungselement können die so gebildeten Leiterbahnen auf der Oberseite des Verbindungselements mit Kontak ten am Boden des Gehäuses verbunden werden, optional über elektrisch vonei nander isolierte Leiterbahnen auf der Unterseite des Verbindungselements. Auch können Kontakte des zweiten DRMAs unmittelbar über eine jeweilige lokale elektrisch leitende Verbindung mit Kontakten des ersten DRAMs verbunden sein. Auf den zweiten DRAM können in analoger Weise weitere DRAMs befestigt werden. So können beispielsweise 10 DRAMs gestapelt und kontaktiert werden. Als ein weiterer Aspekt wird ein Verbindungselement zum Verbinden eines ersten Bauteils mit einem zweiten Bauteil vorgestellt. Das Verbindungselement weist auf einer ersten Verbindungsfläche an einer ersten Seite des Verbindungselements und auf einer zweiten Verbindungsfläche an einer der ersten Seite gegenüberlie genden zweiten Seite des Verbindungselements jeweils eine Vielzahl von Nano- drähten auf. Die Nanodrähte auf der ersten Verbindungsfläche und die Nanodrähte auf der zweiten Verbindungsfläche sind aus unterschiedlichen Materialien gebil det. With the connecting element formed in this way, semiconductor components such as semiconductor chips, microcontrollers, RAMs or DRAMs can be attached and contacted at the same time. For example, a first DRAM can be connected as a first component to a base of a housing, for example via a simple nanowire connection. Using the method described, a second DRAM can be attached as a second component on the first DRAM. The connecting element located between the DRAMs is preferably dimensioned such that it can also be attached to the bottom of the housing next to the first DRMA. The connecting element is preferably also used for signal distribution, in particular for the second DRAM. For example, contacts of the second DRAM can be connected to subregions of the first connection surface that are electrically isolated from one another. Through a respective local electrically conductive connec tion in the otherwise electrically insulating connection element, the conductor tracks formed in this way on the top of the connection element can be connected to contacts on the bottom of the housing, optionally via conductor tracks that are electrically isolated from one another on the underside of the connection element. Contacts of the second DRMA can also be connected directly to contacts of the first DRAM via a respective local electrically conductive connection. Further DRAMs can be attached to the second DRAM in an analogous manner. For example, 10 DRAMs can be stacked and contacted. A connecting element for connecting a first component to a second component is presented as a further aspect. The connecting element has a plurality of nanowires in each case on a first connecting surface on a first side of the connecting element and on a second connecting surface on a second side of the connecting element opposite the first side. The nanowires on the first connection surface and the nanowires on the second connection surface are made of different materials.
Die weiter oben beschriebenen besonderen Vorteile und Ausgestaltungsmerkmale des Verfahrens sind auf das beschriebene Verbindungselement anwendbar und übertragbar, und umgekehrt. The particular advantages and design features of the method described above can be used and transferred to the connecting element described, and vice versa.
In einer bevorzugten Ausführungsform ist das Verbindungselement folienartig ausgebildet. In a preferred embodiment, the connecting element is designed like a film.
Unter einer folienartigen Ausbildung ist zu verstehen, dass das Verbindungsele ment eine Dicke aufweist, die sehr viel kleiner ist als die Ausdehnung des Verbin dungselements in den übrigen Richtungen. In einer bevorzugten Ausführungsform weist das Verbindungselement eine Dicke von höchstens 5 mm auf. Vorzugsweise liegt die Dicke des Verbindungselements im Bereich von 0,05 mm und 5 mm [Millimeter], insbesondere im Bereich von 0,1 mm und 1 mm. A film-like design is to be understood as meaning that the connecting element has a thickness which is very much smaller than the extent of the connecting element in the other directions. In a preferred embodiment, the connecting element has a thickness of at most 5 mm. The thickness of the connecting element is preferably in the range of 0.05 mm and 5 mm [millimeters], in particular in the range of 0.1 mm and 1 mm.
Ferner ist es bevorzugt, dass das Verbindungselement bandförmig ausgebildet ist. Die erste Seite und die dieser gegenüberliegende zweite Seite des Verbindungs elements sind in dieser Ausführungsform die beiden Oberflächen des Bandes, die gegenüber allen anderen Oberflächen (die sich aufgrund der Material stärke des Bandes ergeben) einen erheblich größeren Flächeninhalt aufweisen. Das Bandmaterial kann beispielsweise als eine Rolle bereitgestellt werden. Die Nanodrähte können dabei bereits auf dem Bandmaterial vorgesehen sein und bei spielsweise durch einen Schutzlack geschützt werden. Vor Verwendung des Ver bindungselements können der Schutzlack entfernt und die Nanodrähte so freige legt werden. Ein jeweils benötigter Teil des Bandmaterials kann zur Verwendung von der Rolle abgetrennt werden. Furthermore, it is preferred that the connecting element is designed in the form of a band. The first side and the opposite second side of the connecting element in this embodiment are the two surfaces of the belt which have a considerably larger surface area than all other surfaces (which result from the material strength of the belt). The tape material can be provided as a roll, for example. The nanowires can already be provided on the strip material and protected, for example, by a protective varnish. Before using the connecting element, the protective varnish can be removed and the nanowires exposed. A part of the strip material required in each case can be separated from the roll for use.
In der vorliegenden Ausführungsform kann das Verbindungselement auch als ein „Verbindungstape“ und insbesondere als ein „Klett-Welding-Tape“ bezeichnet werden. In the present embodiment, the connecting element can also be referred to as a “connecting tape” and in particular as a “Velcro welding tape”.
In einer weiteren bevorzugten Ausführungsform ist das Verbindungselement zu mindest teilweise elektrisch und/oder thermisch leitfähig. In a further preferred embodiment, the connecting element is at least partially electrically and / or thermally conductive.
Insbesondere in dieser Ausführungsform kann die ausgebildete Verbindung be sonders gut elektrisch und/oder thermisch leitfähig sein. In this embodiment in particular, the connection formed can be particularly good electrically and / or thermally conductive.
Alternativ ist es bevorzugt, dass das die erste Verbindungsfläche und die zweite Verbindungsfläche voneinander elektrisch isoliert sind. Alternatively, it is preferred that the first connection area and the second connection area are electrically insulated from one another.
Die erste Verbindungsfläche und die zweite Verbindungsfläche sollen jedenfalls dann als elektrisch voneinander isoliert betrachtet werden, wenn ein elektrischer Widerstand zwischen der ersten Verbindungsfläche und der zweiten Verbindungs fläche unter folgenden Bedingungen bei einer Vierpunktmessung zu mindestens 100 kQ gemessen wird: Raumtemperatur, Luftfeuchtigkeit 20%, Messung bei konstanter Spannung (also nicht bei Wechselspannung), Messung mit einer jewei ligen Elektrode auf der ersten Verbindungsfläche und auf der zweiten Verbin dungsfläche, wobei die Elektroden die jeweilige Verbindungsfläche mit einer Flä che von 1 cm2 berühren. Sind die Verbindungsflächen elektrisch voneinander isoliert, kann eine elektrisch isolierende, aber mechanisch stabile und optional auch thermisch leitfähige Ver bindung zwischen den Kontaktflächen ausgebildet werden. Vorzugsweise beträgt ein spezifischer elektrischer Widerstand des Materials des Verbindungselements im Bereich zwischen der ersten Verbindungsfläche und der zweiten Verbindungs fläche bei Raumtemperatur mindestens 105 Qm, vorzugsweise mindestens 108 Qm. The first connection surface and the second connection surface should in any case be regarded as electrically isolated from one another if an electrical resistance between the first connection surface and the second connection surface is measured to be at least 100 kΩ under the following conditions with a four-point measurement: room temperature, humidity 20%, measurement at constant voltage (i.e. not with alternating voltage), measurement with a respective electrode on the first connection surface and on the second connection surface, the electrodes touching the respective connection surface with an area of 1 cm 2. If the connection surfaces are electrically isolated from one another, an electrically insulating, but mechanically stable and optionally also thermally conductive connection can be formed between the contact surfaces. A specific electrical resistance of the material of the connecting element in the area between the first connecting surface and the second connecting surface is preferably at least 10 5 Ωm, preferably at least 10 8 Ωm, at room temperature.
Die beschriebene Angabe für den spezifischen elektrischen Widerstand des Mate rials des Verbindungselements bezieht sich auf eine Messung bei konstanter Spannung. Bei Anlegen einer Wechselspannung können abweichende Ergebnisse erhalten werden, die insbesondere von der Frequenz der Wechsel Spannung abhän- gen können. The specification described for the specific electrical resistance of the material of the connecting element relates to a measurement at constant voltage. When applying an alternating voltage, different results can be obtained, which can depend in particular on the frequency of the alternating voltage.
Der genannte Wert von mindestens 105 Qm, vorzugsweise mindestens 108 Qm, bezieht sich auf das Material des Verbindungselements. Der spezifische Wider stand verschiedenster Materialien ist in der Fachliteratur beispielsweise in Tabel len verfügbar. Auf derartige Angaben wird hier Bezug genommen. Wenn das Verbindungselement durchgehend aus einem bestimmten Material gebildet ist, ist der hier zu verwendende spezifische Widerstand des Materials des Verbindungs element der Wert, der in der Fachliteratur für dieses bestimmte Material angege ben wird. Durch diese Definition bleiben alle Effekte ausgeschlossen, die sich nicht durch das Material, sondern beispielsweise durch die Form des Verbin dungselements ergeben. Ist das Verbindungselement aus verschiedenen Materia lien zusammengesetzt, so ist der spezifische Widersand der einzelnen Materialien aus der Fachliteratur zu ermitteln und der gesamte spezifische Widerstand des Materials des Verbindungselements, also der Zusammensetzung der Materialien, zu ermitteln. Findet sich in der Fachliteratur kein Wert für den spezifischen Wi derstand des verwendeten Materials, kann dieser durch Messung ermittelt werden. Ist das Verbindungselement aus einem dritten Material gebildet und im Bereich der ersten Verbindungsfläche mit einem ersten Material beschichtet und im Be reich der zweiten Verbindungsfläche mit einem zweiten Material beschichtet, kann die elektrische Isolierung zwischen den Verbindungsflächen dadurch er- reicht werden, dass das dritte Material elektrisch isolierend ist. Das erste Material und das zweite Material können in dem Fall elektrisch leitend sein. So können metallische Nanodrähte auf Verbindungsflächen des jeweils gleichen Materials gewachsen werden, wobei durch das dritte Material gleichwohl eine elektrische Isolierung erreicht wird. Bevorzugt ist, dass das Verbindungselement im Bereich zwischen der ersten Verbindungsfläche und der zweiten Verbindungsfläche aus einem Keramikmaterial gebildet ist. The stated value of at least 10 5 μm, preferably at least 10 8 μm, relates to the material of the connecting element. The specific resistance of various materials is available in the specialist literature, for example in tables. Reference is made here to such information. If the connecting element is formed continuously from a specific material, the specific resistance of the material of the connecting element to be used here is the value that is indicated in the specialist literature for this specific material. This definition excludes all effects that do not result from the material but, for example, from the shape of the connecting element. If the connecting element is composed of different materials, the specific contradiction of the individual materials is to be determined from the specialist literature and the total specific resistance of the material of the connecting element, i.e. the composition of the materials, is to be determined. If there is no value in the specialist literature for the specific resistance of the material used, this can be determined by measurement. If the connecting element is formed from a third material and coated with a first material in the area of the first connecting surface and coated with a second material in the area of the second connecting surface, the electrical insulation between the connecting surfaces can be achieved by electrically using the third material is insulating. In this case, the first material and the second material can be electrically conductive. In this way, metallic nanowires can be grown on connecting surfaces of the same material in each case, with electrical insulation being nevertheless achieved through the third material. It is preferred that the connecting element is formed from a ceramic material in the area between the first connecting surface and the second connecting surface.
Als ein weiterer Aspekt wird eine Anordnung vorgestellt, die umfasst: As a further aspect, an arrangement is presented which comprises:
- ein erstes Bauteil, welches vermittels einer Vielzahl von Nanodrähten über eine erste Verbindungsfläche an einer ersten Seite eines Verbindungselements mit dem Verbindungselement verbunden ist, und a first component which is connected to the connecting element by means of a multiplicity of nanowires via a first connecting surface on a first side of a connecting element, and
- ein zweites Bauteil, welches vermittels einer Vielzahl von Nanodrähten über eine zweite Verbindungsfläche an einer der ersten Seite gegenüberliegenden zweiten Seite des Verbindungselements mit dem Verbindungselement verbun- den ist. a second component which is connected to the connecting element by means of a multiplicity of nanowires via a second connecting surface on a second side of the connecting element opposite the first side.
Die Nanodrähte auf der ersten Verbindungsfläche und die Nanodrähte auf der zweiten Verbindungsfläche sind aus unterschiedlichen Materialien gebildet. The nanowires on the first connection surface and the nanowires on the second connection surface are formed from different materials.
Die weiter oben beschriebenen besonderen Vorteile und Ausgestaltungsmerkmale des Verfahrens und des Verbindungselements sind auf die beschriebene Anord nung anwendbar und übertragbar. Vorzugsweise wird die Anordnung durch das beschriebene Verfahren hergestellt. Vorzugsweise ist das Verbindungselement wie beschrieben ausgebildet. Die Erfindung und das technische Umfeld werden nachfolgend anhand der Figuren näher erläutert. Die Figuren zeigen besonders bevorzugte Ausführungs beispiele, auf die die Erfindung jedoch nicht begrenzt ist. Insbesondere ist darauf hinzuweisen, dass die Figuren und insbesondere die dargestellten Größen- Verhältnisse nur schematisch sind. Es zeigen schematisch: The particular advantages and design features of the method and of the connecting element described above can be used and transferred to the arrangement described. The arrangement is preferably produced by the method described. The connecting element is preferably designed as described. The invention and the technical environment are explained in more detail below with reference to the figures. The figures show particularly preferred embodiment examples to which, however, the invention is not limited. In particular, it should be pointed out that the figures and in particular the size relationships shown are only schematic. They show schematically:
Fig. 1: eine Darstellung eines erfindungsgemäßen Verfahrens zum Verbinden zweier Bauteile, Fig. 2: eine Darstellung einer erfindungsgemäßen Anordnung von zwei gemäß dem Verfahren aus Fig. 1 miteinander verbundenen Bauteilen, 1: an illustration of a method according to the invention for connecting two components, FIG. 2: an illustration of an arrangement according to the invention of two components connected to one another according to the method from FIG. 1,
Fig. 3: eine erste Ausführungsform des Verbindungselements aus der Anord nung aus Fig. 2, und Fig. 3: a first embodiment of the connecting element from the arrangement from Fig. 2, and
Fig. 4: eine zweite Ausführungsform des Verbindungselements aus der Anord nung aus Fig. 2. FIG. 4: a second embodiment of the connecting element from the arrangement from FIG. 2.
Fig. 1 zeigt ein Verfahren zum Verbinden eines ersten Bauteils 2 mit einem zwei- ten Bauteil 3. Die verwendeten Bezugszeichen beziehen sich auf Fig. 2. Das Ver fahren umfasst: a) Bereitstellen eines Verbindungselements 6 mit einer jeweiligen Vielzahl von Nanodrähten 1 auf einer ersten Verbindungsfläche 7 an einer ersten Seite 10 des Verbindungselements 6 und auf einer zweiten Verbindungsfläche 8 an ei- ner der ersten Seite 10 gegenüberliegenden zweiten Seite 11 des Verbin dungselements 6, b) Zusammenführen einer Kontaktfläche 4 des ersten Bauteils 2 mit der ersten Verbindungsfläche 7 des Verbindungselements 6, und c) Zusammenführen einer Kontaktfläche 5 des zweiten Bauteils 3 mit der zwei- ten Verbindungsfläche 8 des Verbindungselements 6. Die Nanodrähte 1 sind aus verschiedenen Materialien gebildet. In dem hier be schriebenen Beispiel sind die Nanodrähte 1 auf der ersten Verbindungsfläche 7 aus Kuper gebildet, die Nanodrähte 1 auf der zweiten Verbindungsfläche 8 aus Silber. Das erste Bauteil 2 ist eine Platine und das zweite Bauteil 3 ist eine elekt ronische Komponente wie ein MOSFET oder ein IGBT-Baustein. 1 shows a method for connecting a first component 2 to a second component 3. The reference symbols used relate to FIG first connection surface 7 on a first side 10 of the connection element 6 and on a second connection surface 8 on a second side 11 of the connection element 6 opposite the first side 10, b) merging a contact surface 4 of the first component 2 with the first connection surface 7 of the Connecting element 6, and c) bringing together a contact surface 5 of the second component 3 with the second connecting surface 8 of the connecting element 6. The nanowires 1 are formed from different materials. In the example described here, the nanowires 1 are formed on the first connecting surface 7 from copper, and the nanowires 1 on the second connecting surface 8 are made from silver. The first component 2 is a circuit board and the second component 3 is an electronic component such as a MOSFET or an IGBT module.
Vorzugsweise werden die Schritte b) und/oder c) bei Raumtemperatur durchge führt. Das Verfahren kann weiterhin den folgenden in Fig. 1 durch einen gestri chelten Kasten angedeuteten optionalen Schritt umfassen: d) Erwärmen zumindest der Kontaktflächen 4,5 auf eine Temperatur von min destens 150°C. Steps b) and / or c) are preferably carried out at room temperature. The method can furthermore comprise the following optional step indicated in FIG. 1 by a dashed box: d) heating at least the contact surfaces 4, 5 to a temperature of at least 150.degree.
Fig. 2 zeigt eine Anordnung 9, die mit dem Verfahren aus Fig. 1 erhalten werden kann. Die Anordnung 9 umfasst ein erstes Bauteil 2, welches vermittels einer Vielzahl von Nanodrähten 1 über eine erste Verbindungsfläche 7 an einer ersten Seite 10 eines Verbindungselements 6 mit dem Verbindungselement 6 verbunden ist. Weiterhin umfasst die Anordnung 9 ein zweites Bauteil 3, welches vermittels einer Vielzahl von Nanodrähten 1 über eine zweite Verbindungsfläche 8 an einer der ersten Seite 10 gegenüberliegenden zweiten Seite 11 des Verbindungsele ments 6 mit dem Verbindungselement 6 verbunden ist. Dazu weisen das erste Bauteil 2 und das zweite Bauteil 3 eine jeweilige Kontaktfläche 4,5 auf. FIG. 2 shows an arrangement 9 which can be obtained with the method from FIG. 1. The arrangement 9 comprises a first component 2, which is connected to the connecting element 6 by means of a multiplicity of nanowires 1 via a first connecting surface 7 on a first side 10 of a connecting element 6. The arrangement 9 further comprises a second component 3, which is connected to the connecting element 6 by means of a plurality of nanowires 1 via a second connecting surface 8 on a second side 11 of the connecting element 6 opposite the first side 10. For this purpose, the first component 2 and the second component 3 have a respective contact surface 4, 5.
Die Nanodrähte 1 sind wie zu Fig. 1 beschrieben aus verschiedenen Materialien gebildet. As described in relation to FIG. 1, the nanowires 1 are formed from different materials.
Das Verbindungselement 6 ist folienartig ausgebildet. Eine Dicke des Verbin dungselements 6 beträgt höchstens 5 mm. Die Dicke des Verbindungselements 6 ist in Fig. 2 als Ausdehnung des Verbindungselements 6 in einer vertikalen Rich tung zu erkennen. Fig. 3 zeigt eine erste Ausführungsform des Verbindungselements 6 aus der An ordnung 9 aus Fig. 2. Die erste Verbindungsfläche 7 ist aus einem ersten Material 12 gebildet, welches dem Material der Nanodrähte 1 auf der ersten Verbindungs- fläche 7 entspricht. Die zweite Verbindungsfläche 8 ist aus einem zweiten Materi al 13 gebildet, welches dem Material der Nanodrähte 1 auf der zweiten Verbin dungsfläche 8 entspricht. Das Verbindungselement 6 ist aus einem dritten Materi al 14 gebildet und im Bereich der ersten Verbindungsfläche 7 mit dem ersten Ma terial 12 beschichtet und im Bereich der zweiten Verbindungsfläche 8 mit dem zweiten Material 13 beschichtet. The connecting element 6 is formed like a film. A thickness of the connec tion element 6 is at most 5 mm. The thickness of the connecting element 6 can be seen in Fig. 2 as the extension of the connecting element 6 in a vertical direction Rich. 3 shows a first embodiment of the connecting element 6 from the arrangement 9 from FIG. 2. The first connecting surface 7 is formed from a first material 12 which corresponds to the material of the nanowires 1 on the first connecting surface 7. The second connection surface 8 is formed from a second material 13 which corresponds to the material of the nanowires 1 on the second connection surface 8. The connecting element 6 is formed from a third material 14 and coated with the first material 12 in the area of the first connecting surface 7 and coated with the second material 13 in the area of the second connecting surface 8.
Fig. 4 zeigt eine zweite Ausführungsform des Verbindungselements 6 aus der Anordnung 9 aus Fig. 2. Dabei ist das Verbindungselement 6 aus dem ersten Ma terial 12 gebildet und im Bereich der zweiten Verbindungsfläche 8 mit dem zwei- ten Material 13 beschichtet. Die erste Verbindungsfläche 7 ist nicht durch eine Beschichtung gebildet, sondern durch die in Fig. 4 unten liegende Seite des ersten Materials 12. 4 shows a second embodiment of the connecting element 6 from the arrangement 9 from FIG. 2. The connecting element 6 is formed from the first material 12 and coated with the second material 13 in the area of the second connecting surface 8. The first connection surface 7 is not formed by a coating, but rather by the side of the first material 12 that is at the bottom in FIG. 4.
Bezugszeichenliste
Figure imgf000031_0001
il List of reference symbols
Figure imgf000031_0001
il
Kontaktfläche des ersten BauteilsContact surface of the first component
Kontaktfläche des zweiten BauteilsContact surface of the second component
Verbindungselement erste Verbindungsfläche zweite VerbindungsflächeConnection element first connection surface second connection surface
Anordnung erste Seite zweite Seite erstes Material zweites Material drittes Material Arrangement first side, second side, first material, second material, third material

Claims

Patentansprüche Claims
1. Verfahren zum Verbinden eines ersten Bauteils (2) mit einem zweiten Bauteil1. A method for connecting a first component (2) to a second component
(3), umfassend: a) Bereitstellen eines Verbindungselements (6) mit einer jeweiligen Viel zahl von Nanodrähten (1) auf einer ersten Verbindungsfläche (7) an einer ersten Seite (10) des Verbindungselements (6) und auf einer zweiten Verbindungsfläche (8) an einer der ersten Seite (10) gegenüberliegenden zweiten Seite (11) des Verbindungselements (6), wobei die Nanodrähte (1) auf der ersten Verbindungsfläche (7) und die Nanodrähte (1) auf der zweiten Verbindungsfläche (8) aus unterschiedlichen Materialien gebil det sind, b) Zusammenführen einer Kontaktfläche (4) des ersten Bauteils (2) mit der ersten Verbindungsfläche (7) des Verbindungselements (6), und c) Zusammenführen einer Kontaktfläche (5) des zweiten Bauteils (3) mit der zweiten Verbindungsfläche (8) des Verbindungselements (6). (3), comprising: a) providing a connecting element (6) with a respective multiplicity of nanowires (1) on a first connecting surface (7) on a first side (10) of the connecting element (6) and on a second connecting surface (8) ) on a second side (11) of the connecting element (6) opposite the first side (10), wherein the nanowires (1) on the first connecting surface (7) and the nanowires (1) on the second connecting surface (8) are made of different materials gebil det are, b) merging a contact surface (4) of the first component (2) with the first connecting surface (7) of the connecting element (6), and c) merging a contact surface (5) of the second component (3) with the second connecting surface (8) of the connecting element (6).
2. Verfahren nach Anspruch 1, wobei die Nanodrähte (1) auf der ersten Verbin dungsfläche (7) und/oder die Nanodrähte (1) auf der zweiten Verbindungsflä- che (8) aus einem jeweiligen Metall gebildet sind. 2. The method according to claim 1, wherein the nanowires (1) on the first connection surface (7) and / or the nanowires (1) on the second connection surface (8) are formed from a respective metal.
3. Verfahren nach einem der vorstehenden Ansprüche, wobei die Nanodrähte (1) auf der ersten Verbindungsfläche (7) aus dem Material der Kontaktfläche3. The method according to any one of the preceding claims, wherein the nanowires (1) on the first connecting surface (7) made of the material of the contact surface
(4) des ersten Bauteils (2) gebildet sind und/oder die Nanodrähte (1) auf der zweiten Verbindungsfläche (8) aus dem Material der Kontaktfläche (5) des zweiten Bauteils (3) gebildet sind. (4) of the first component (2) are formed and / or the nanowires (1) on the second connection surface (8) are formed from the material of the contact surface (5) of the second component (3).
4. Verfahren nach einem der vorstehenden Ansprüche, wobei das erste Bauteil4. The method according to any one of the preceding claims, wherein the first component
(2) eine Platine ist, und wobei die Kontaktfläche (4) des ersten Bauteils (2) aus Kupfer gebildet ist. (2) is a circuit board, and wherein the contact surface (4) of the first component (2) is formed from copper.
5. Verfahren nach einem der vorstehenden Ansprüche, wobei das zweite Bauteil (3) eine elektronische Komponente ist, und wobei die Kontaktfläche (5) des zweiten Bauteils (3) aus Silber, Nickel und/oder Gold gebildet ist. 5. The method according to any one of the preceding claims, wherein the second component (3) is an electronic component, and wherein the contact surface (5) of the second component (3) is formed from silver, nickel and / or gold.
6. Verfahren nach einem der vorstehenden Ansprüche, weiterhin umfassend: d) Erwärmen zumindest der Kontaktflächen (4,5) auf eine Temperatur von mindestens 90°C. 6. The method according to any one of the preceding claims, further comprising: d) heating at least the contact surfaces (4, 5) to a temperature of at least 90 ° C.
7. Verfahren nach einem der vorstehenden Ansprüche, wobei das erste Bauteil und das zweite Bauteil Halbleiterbauelemente sind, die aufeinander befestigt werden. 7. The method according to any one of the preceding claims, wherein the first component and the second component are semiconductor components which are attached to one another.
8. Verbindungselement (6) zum Verbinden eines ersten Bauteils (2) mit einem zweiten Bauteil (3), wobei das Verbindungselement (6) auf einer ersten Ver bindungsfläche (7) an einer ersten Seite (10) des Verbindungselements (6) und auf einer zweiten Verbindungsfläche (8) an einer der ersten Seite (10) gegenüberliegenden zweiten Seite (11) des Verbindungselements (6) jeweils eine Vielzahl von Nanodrähten (1) aufweist, und wobei die Nanodrähte (1) auf der ersten Verbindungsfläche (7) und die Nanodrähte (1) auf der zweiten8. Connecting element (6) for connecting a first component (2) to a second component (3), the connecting element (6) on a first connecting surface (7) on a first side (10) of the connecting element (6) and on a second connecting surface (8) on a second side (11) of the connecting element (6) opposite the first side (10) each having a plurality of nanowires (1), and wherein the nanowires (1) on the first connecting surface (7) and the nanowires (1) on the second
Verbindungsfläche (8) aus unterschiedlichen Materialien gebildet sind. Connection surface (8) are formed from different materials.
9. Verbindungselement (6) nach Anspruch 8, wobei das Verbindungselement (6) folienartig ausgebildet ist. 9. Connecting element (6) according to claim 8, wherein the connecting element (6) is formed like a film.
10. Verbindungselement (6) nach Anspruch 8 oder 9, wobei eine Dicke des Ver bindungselements (6) höchstens 5 mm beträgt. 10. Connecting element (6) according to claim 8 or 9, wherein a thickness of the connecting element Ver (6) is at most 5 mm.
11. Anordnung (9), umfassend: 11. Arrangement (9) comprising:
- ein erstes Bauteil (2), welches vermittels einer Vielzahl von Nanodrähten (1) über eine erste Verbindungsfläche (7) an einer ersten Seite (10) eines Verbindungselements (6) mit dem Verbindungselement (6) verbunden ist, und - A first component (2) which is connected to the connecting element (6) by means of a plurality of nanowires (1) via a first connecting surface (7) on a first side (10) of a connecting element (6), and
- ein zweites Bauteil (3), welches vermittels einer Vielzahl von Nanodrähten (1) über eine zweite Verbindungsfläche (8) an einer der ersten Seite (10) gegenüberliegenden zweiten Seite (11) des Verbindungselements (6) mit dem Verbindungselement (6) verbunden ist, wobei die Nanodrähte (1) auf der ersten Verbindungsfläche (7) und die Na- nodrähte (1) auf der zweiten Verbindungsfläche (8) aus unterschiedlichen Materialien gebildet sind. - A second component (3) which is connected to the connecting element (6) by means of a plurality of nanowires (1) via a second connecting surface (8) on a second side (11) of the connecting element (6) opposite the first side (10) is, wherein the nanowires (1) on the first connection surface (7) and the nanowires (1) on the second connection surface (8) are formed from different materials.
PCT/EP2021/055800 2020-03-18 2021-03-08 Multi-metal hook-and-loop welding WO2021185616A1 (en)

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WO2019096770A1 (en) * 2017-11-14 2019-05-23 Nanowired Gmbh C/O Technische Universität Darmstadt Method and connector for connecting two components, and arrangement of two connected components

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WO2023202931A1 (en) 2022-04-21 2023-10-26 Biotronik Se & Co. Kg Energy-reduced and automatable joining by means of nanowiring for contacting electrical and mechanical components of active and monitoring implants

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